Through-via detection device and method for TGV glass substrates
JP2026066982A5Pending Publication Date: 2026-05-25XIANGWEI OPTOELECTRONICS CO LTD +1
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- XIANGWEI OPTOELECTRONICS CO LTD
- Filing Date
- 2026-02-09
- Publication Date
- 2026-05-25
AI Technical Summary
Technical Problem
Conventional methods for detecting through-vias in glass substrates are either damaging, time-consuming, or economically inefficient, particularly when using X-rays, microscopes, or lossless plasticizers.
Method used
A through-via detection device utilizing two depth-of-field cameras and two collimating light sources mounted above and below the glass substrate, with a microcontroller unit to analyze images from different wavelength beams, enabling non-invasive and efficient detection of through-via parameters.
Benefits of technology
The solution provides rapid, cost-effective, and non-damaging detection of through-via parameters, including diameter, roundness, and displacement, without the need for lossless plasticizers.
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Abstract
This invention provides a through-via detection device for TGV glass substrates. [Solution] A first depth-of-field camera and a first sighting light source, installed on a glass substrate, face the upper surface of the glass substrate, while a second depth-of-field camera and a second sighting light source, installed below the glass substrate, face the lower surface of the glass substrate. The first and second sighting light sources emit a first sighting beam and a second sighting beam, respectively, onto the glass substrate, and the wavelength band of the light of the first sighting beam is the same as or different from the wavelength band of the light of the second sighting beam. The first and second depth-of-field cameras are used to acquire a first image and a second image, respectively, and the microcontroller unit of the TGV glass substrate through-via detection device obtains at least one detection result for at least one glass substrate through-via in the glass substrate based on the first and second images.
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