Substrate holding device, substrate processing device, and method for manufacturing articles

Abstract

To provide a substrate holding device that is advantageous in at least one aspect of the performance, quality, productivity, and production cost of the goods. [Solution] A substrate holding device comprising a first substrate holding member and a second substrate holding member, wherein a substrate is held by the upper surface of the first substrate holding member and the upper surface of the second substrate holding member, the wear resistance of the second substrate holding member is higher than that of the first substrate holding member, the second substrate holding member is arranged to fit into a groove provided in the first substrate holding member, and the upper surface of the first substrate holding member and the upper surface of the second substrate holding member are arranged to be on the same plane.

Description

Technical Field

[0001] The present invention relates to a substrate holding device, a substrate processing device, and a method for manufacturing an article.

Background Art

[0002] An exposure apparatus is a device that transfers the pattern of a master (reticle or mask) to a photosensitive substrate (a wafer or a glass plate having a resist layer formed on its surface) through a projection optical system in a lithography process, which is a manufacturing process for semiconductor devices, liquid crystal display devices, etc. The substrate processed by the exposure apparatus is fixed to the upper surface of a substrate holding device called a chuck by vacuum suction or electrostatic force. Since the substrate holding device repeatedly performs operations of fixing and releasing the substrate, the upper surface that comes into contact with the substrate wears out.

[0003] As a method for improving the wear resistance of the substrate holding device, as described in Patent Document 1, the content of coating the upper surface of the substrate holding device with DLC (diamond-like carbon) is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, coating the entire surface of the substrate holding device with DLC (diamond-like carbon) may be disadvantageous in terms of the performance, quality, productivity, production cost, etc. of the article.

[0006] Therefore, an object of the present invention is to provide a substrate holding device that is advantageous from at least one of the viewpoints of the performance, quality, productivity, and production cost of the article. [Means for solving the problem]

[0007] To achieve the above objective, a substrate holding device as one aspect of the present invention comprises a first substrate holding member and a second substrate holding member, wherein the substrate is held between the upper surface of the first substrate holding member and the upper surface of the second substrate holding member, the wear resistance of the second substrate holding member is higher than that of the first substrate holding member, the second substrate holding member is arranged to fit into a groove provided in the first substrate holding member, and the upper surface of the first substrate holding member and the upper surface of the second substrate holding member are arranged to lie on the same plane. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an exposure apparatus that is advantageous in at least one respect of the performance, quality, productivity, and production cost of articles. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of the circuit board holder. [Figure 2] This is a cross-sectional view of the circuit board holder. [Figure 3] This is a schematic diagram showing the first substrate holding member 2 and the second substrate holding member 3 in an exploded state. [Figure 4] This is a schematic diagram of the substrate holder plate 1 with the first protrusion 22 and the second protrusion 32 omitted. [Figure 5] This is a detailed schematic diagram of the first substrate holding member 2 and the second substrate holding member 3. [Figure 6] This is a schematic diagram showing the state of the circuit board 7 when the circuit board holder 1 is lifted by the lift pins 8. [Figure 7] This is a schematic diagram of a substrate holding plate that allows for foil adjustment and replacement of the second substrate holding member 3. [Figure 8] This is a schematic diagram of the substrate holder plate 70 used in the evaluation of the embodiment. [Figure 9] This is a schematic diagram showing the configuration of the exposure apparatus. [Figure 10]This is a flowchart of the manufacturing method for an item. [Modes for carrying out the invention]

[0010] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In each drawing, the same reference numeral is used for identical components, and redundant descriptions are omitted.

[0011] <First Embodiment> Figure 1(a) shows a perspective view of a first example of a substrate holder (substrate holder device) according to this embodiment. The substrate holder 1 in this embodiment is composed of a first substrate holder member 2 and a second substrate holder member 3. The first substrate holder member 2 has a first base portion 21 and a plurality of first protrusions 22 projecting from the first base portion 21. The second substrate holder member 3 has a second base portion 31 and a plurality of second protrusions 32 projecting from the second base portion 31. The region of the first base portion 21 and the plurality of first protrusions 22 is also called the first region, and the region of the second base portion 31 and the plurality of second protrusions 32 is also called the second region.

[0012] One of the two main surfaces (front and back) of the substrate holder plate 1 (the front surface) is the uppermost surface 40. A first projection 22 and a second projection 32 are provided on the uppermost surface 40 side relative to the first base portion 21 and the second base portion 31, respectively, although the first projection 22 and the second projection 32 are optional. On the uppermost surface 40 of the substrate holder plate 1, the second substrate holding member 3 is made of a material with higher wear resistance than the first substrate holding member 2. The uppermost surface 40 is the surface on which the substrate 7 is placed that comes into contact with the surrounding atmosphere of the substrate holder plate 1, and is not necessarily the surface that comes into contact with the substrate 7. The uppermost surface 40 can also function as a substrate holding surface for holding the substrate 7, for example.

[0013] Fig. 1(b) shows a perspective view of placing the substrate 7 on the substrate holding plate 1 of Fig. 1(a). The base 2 and the protrusion 3 provided on the base 2 hold the substrate 7. By supporting the substrate 7 with the protrusion 3, the contact area between the substrate holding plate 1 and the substrate 7 becomes smaller, and damage to the substrate 7 can be suppressed compared to the case where the protrusion 3 is not provided. The substrate 7 placed on the substrate holding plate 1 of the first example is a substrate 7 used in the manufacture of electronic devices. This substrate 7 can form part of an electronic device, but may be removed during the manufacture of the electronic device and not form part of the electronic device. The substrate 7 can be, for example, a glass substrate, a resin substrate, or a sapphire substrate used in the manufacture of an organic EL display, a liquid crystal display, a solar cell panel, etc.

[0014] In the substrate holding plate 1 of this example, a suction hole portion 4 is provided, and the substrate 7 is vacuum-sucked through the suction hole portion 4, but the suction hole portion 4 may be omitted. Further, a lift pin hole portion 5 is provided in the substrate holding plate 1, and the substrate 7 can be transported by the lift pin moving up and down through the lift pin hole portion 5.

[0015] Fig. 1(c) shows a perspective view of the substrate holding plate of the second example according to the present embodiment. Fig. 1(d) shows a perspective view of placing the substrate 7 on the substrate holding plate 1 of Fig. 1(c). The substrate holding plate 1 of the second example is different from Fig. 1(a) in that its outer shape is circular, but other configurations are the same. The substrate 7 placed on the substrate holding plate 1 of the second example can be, for example, a semiconductor substrate such as a Si wafer or a SiC wafer, or an insulator substrate such as a glass wafer, a plastic wafer, or a sapphire.

[0016] The substrate holding plate 1 shown in Figs. 1(a) to (d) can be used in manufacturing apparatuses for various electronic devices. For example, it can be used when holding the substrate 7 in an exposure apparatus that exposes the photoresist applied on the substrate 7. It can be used not only for exposure apparatuses but also for film-forming apparatuses, etching apparatuses, etc.

[0017] FIG. 1(e) is a perspective view of a plurality of substrate holding plates 1 arranged and used as a substrate holder. As shown in FIG. 1(e), a plurality of substrate holding plates 1 can be arranged and used as a substrate holder 111.

[0018] Next, a detailed description of this embodiment will be given with reference to FIG. 2. FIG. 2 is an enlarged cross-sectional view of the range of the circle 10 in FIG. 1(a) or FIG. 1(c). The substrate holding plate 1 of this embodiment has a first substrate holding member 2 and a second substrate holding member 3 as described in FIG. 1(a) or FIG. 1(c). The first substrate holding member 2 has a first base portion 21 and a first protrusion 22 on the first base portion 21, and the second substrate holding member 3 has a second base portion 31 and a second protrusion 32 on the second base portion 31.

[0019] FIG. 3 is a schematic diagram of the first substrate holding member 2 and the second substrate holding member 3 disassembled. In the substrate holding plate 1, the first substrate holding member 2 has a groove 24, and the second substrate holding member 3 is arranged to fit into the groove 24, and the first substrate holding member 2 and the second substrate holding member 3 are arranged on the uppermost surface 40 of the substrate holding plate 1 to be on the same plane. On the uppermost surface 40 of the substrate holding plate 1, the second substrate holding member 3 is made of a member having higher wear resistance than the first substrate holding member 2. Specifically, the uppermost surfaces 40 of the first substrate holding member 2 and the second substrate holding member 3 are each covered with a coating layer 23 and a coating layer 33, and the coating layer 33 is a film having higher wear resistance than the coating layer 23. If the second substrate holding member 3 on the uppermost surface (substrate holding plate) of the substrate holding plate 1 is made of a member having higher wear resistance than the first substrate holding member 2, the coating layer 23 may be omitted. Also, a film such as an adhesion layer or a low-resistance layer may be laminated between the coating layer 23 and the first protrusion 22 and between the coating layer 33 and the second protrusion 32 to form a multilayer structure.

[0020] FIG. 4 is a schematic diagram of the substrate holding plate 1 with the first protrusion 22 and the second protrusion 32 omitted. As shown in FIG. 4, the protrusion 3 can be omitted, but even in that case, on the uppermost surface 40 of the substrate holding plate 1, the second substrate holding member 3 is made of a member having higher wear resistance than the first substrate holding member 2.

[0021] Figure 5(a) is a detailed schematic diagram of the first substrate holding member 2, and Figure 5(b) is a detailed schematic diagram of the second substrate holding member 4.

[0022] The first base 21 will now be described. The first base 21 is composed of three components: component 201, component 202, and component 203. Each of the three components, 201, 202, and 203, is made of the same material as the others. Components 201, 202, and 203, which are made of at least the same material, are called the base material, and the parts made of the same material as the above are also called the base material. Components 201, 202, and 203 are all located on the same plane. The lower surfaces of components 201, 202, and 203 are also all located on the same plane and constitute the back surface 51, which is the opposite side of the uppermost surface 41. Component 202 is located between component 201 and component 203. The material constituting the base material may be ceramics, glass, plastic, metal, etc., but ceramics are particularly preferred. Examples of ceramics include alumina, black alumina, zirconia, silicon carbide, silicon nitride, and cordierite.

[0023] The second base 31 will now be described. The second base 31 is composed of three components: component 301, component 302, and component 303. Each of the three components is made of the same material. Components 301, 302, and 303 that are made of at least the same material are called the base material, and the parts made of the same material as the above are also called the base material. Components 301, 302, and 303 are all located on the same plane. The lower surfaces of components 301, 302, and 303 are also located on the same plane and constitute the back surface 52, which is the opposite side of the uppermost surface 42. Component 302 is located between component 301 and component 303. The material constituting the second base 31 is the same material as that of the first base 21, but it may be different.

[0024] Next, the first projection 22 will be described. The first projection 22 is located on component 202 of the first base 21, and there is no first projection 22 on component 201 or component 203, leaving a space there. The first projection 22 is located between the space above component 201 and the space above component 203, and the space is located between the two first projections 22. The first projection 22 has a component 301 made of the same material as the first base 21, and the uppermost surface 41 of the first projection 22 is covered with a highly wear-resistant coating layer 23, but it does not have to be covered. Component 301 is also a base material.

[0025] Next, the second projection 32 will be described. The second projection 32 is located on component 302 of the second base 31, and there is no second projection 32 on component 301 or component 303, leaving a space there. The second projection 32 is located between the space above component 301 and the space above component 303, and the space exists between the two second projections 32.

[0026] The second projection 32 has a component 301 made of the same material as the second base 31, and the uppermost surface 42 of the second projection 32 is covered with a coating layer 33 that has higher wear resistance than the uppermost surface 41 of the first substrate holding member 2. The component 301 is also a base material.

[0027] The shape and arrangement pitch of the first projection 22 and the second projection 32 are such that they can support the substrate 7, and in this case, they are frustoconical or cylindrical projections. The pitch of the first projection 22 and the second projection 32 is, for example, 1 mm or more and 100 mm or less, and more preferably 1 mm or more and 10 mm or less. The shape and arrangement pitch of the first projection 22 and the second projection 32 may be different. The height of the first projection 22 and the second projection 32 is, for example, 10 μm or more and 1 mm or less, and more preferably 0.1 mm or more and 0.8 mm or less. The heights of the first projection 22 and the second projection 32 may be different as long as they are arranged to lie on the same plane at the top surface 40.

[0028] By roughening the uppermost surfaces 40 of the first protrusion 22 and the second protrusion 32, it is possible to reduce the reflectivity on the surface of the substrate holder plate 1 during exposure processing. This reduces fluctuations in irradiation intensity and suppresses exposure unevenness. The arithmetic mean roughness Ra of the uppermost surfaces of the first protrusion 22 and the second protrusion 32 is, for example, in the range of 0.4 to 10 μm. The arithmetic mean roughness Ra of the uppermost surfaces of the first protrusion 22 and the second protrusion 32 may be different.

[0029] The groove 24 formed in the first substrate holding member 2 will now be described. The depth of the groove 24 relative to the uppermost surface 41 of the first substrate holding member 2 is equal to the combined thickness of the second base portion 31 and the second projection portion 32. Furthermore, the contour of the groove 24 portion of the first substrate holding member 2 when viewed from directly above toward the uppermost surface 41 is equal to the contour of the second plate holding member 3 when viewed from directly above toward the uppermost surface 42.

[0030] The suction port 4 will now be described. The suction port 4 is designed to attract and hold the substrate 7 placed on the first protrusion 22 and the second protrusion 32. The lower opening of the suction port 4 is connected to a vacuum pump (not shown), allowing for the suction and depressurization of the air around the first protrusion 22 and the second protrusion 32. By providing the first protrusion 22 and the second protrusion 32, more air can be drawn in compared to when they are not provided.

[0031] Next, the coating layer 23 and the coating layer 33 will be described. In this embodiment, the coating layer 33 is a film with higher hardness than the coating layer 23, or the coating layer 33 is a film with a lower coefficient of friction than the coating layer 23, or the coating layer 33 is a film with higher hardness and a lower coefficient of friction than the coating layer 23. Wear is a phenomenon in which the surface of one or both materials is worn down when two solid materials rub against each other, and many factors are involved. For example, the load acting on the rubbing surfaces, the surface shape and roughness, the mechanical and chemical properties of the materials, temperature, humidity, lubrication, etc., and many factors have an influence. To improve wear resistance, it is known that increasing hardness or decreasing the coefficient of friction can improve wear resistance. Hardness is a physical property that indicates how well a material can resist external forces, and the higher the hardness, the higher the resistance to wear. The coefficient of friction indicates the magnitude of the frictional force generated when two objects come into contact, and the smaller the coefficient of friction, the smaller the shear stress between the objects, and as a result, wear decreases. Therefore, materials with high hardness and a low coefficient of friction can have high wear resistance. DLC (Diamond-Like Carbon) is a material with high hardness and a low coefficient of friction.

[0032] In this embodiment, an aC:H film (first film) is deposited on the coating layer 23, and a ta-C film (second film) is deposited on the coating layer 33. ta-C has a hydrogen content of 5% or less, a high SP3 bond / (SP2 bond + SP3 bond) ratio of 50% or more, and a carbon skeleton structure similar to the tetrahedral structure of diamond. It is a DLC with a high hardness exceeding 30 GPa and has very high wear resistance. The filtered arc ion plating method for depositing ta-C has a narrow deposition area, so it is used for depositing the second substrate holding member 3, which has a small area. aC:H has a hydrogen content of 5-50%, an SP3 bond / (SP2 bond + SP3 bond) ratio of 50% or less, and a hardness of about 6-16 GPa, which is not as high as ta-C. However, aC:H can be deposited by plasma CVD. Plasma CVD is a method that uses chemical reactions on the substrate surface to form a film by supplying a raw material gas such as CH4 containing carbon atoms into the space on which the substrate is placed. Because it offers advantages in terms of film deposition speed and processing area relative to the size of the apparatus, it is used for film deposition on the first substrate holding member 2, which has a large surface area. The coating layers 23 and 24 are preferably 0.1 μm or thicker from the viewpoint of ensuring wear resistance, and conversely, they are preferably 5 μm or less in thickness to prevent delamination due to film stress. The second substrate holding member 3, on which ta-C is deposited in the coating layer 33, is placed in the groove 24 of the first substrate holding member 2, on which aC:H is deposited in the coating layer 23. By placing the first substrate holding member 2 and the second substrate holding member 3 on the same plane, the wear resistance of the substrate holding members can be efficiently and locally increased.

[0033] Figure 6 is a schematic diagram showing the state of the substrate 7 when the substrate holder 1 is lifted by the lift pins 8 (substrate lifting members). Using Figure 6, we will explain the wear of the substrate holder. When the substrate 7 is held on the lift pins 8, the substrate 7 flexes under its own weight, and a portion of the surface of the substrate holder 1 comes into localized contact with the substrate 7. It was found that wear of the substrate holder 1 progresses particularly locally at this contact point between the substrate holder 1 and the substrate 7. Therefore, by using a substrate holder 1 in which a highly wear-resistant second substrate holder member 3 is in contact with the surface portion of the substrate holder 1 that flexes under its own weight and comes into contact with the substrate 7, the wear resistance of the substrate holder 1 can be increased.

[0034] As described above, in a substrate holder plate comprising a first substrate holder member and a second substrate holder member having higher wear resistance than the first substrate holder member, the first substrate holder member has a groove, and the second substrate holder member is placed in the groove, so that the first substrate holder member and the second substrate holder member are placed on the same plane. This makes it possible to provide a substrate holder plate with improved wear resistance, even for large substrate holder plates, without increasing cost or man-hours.

[0035] As mentioned above, filtered arc ion plating is a known method for depositing ta-C films. Filtered arc ion plating generates a DC arc discharge on the graphite surface, directly ionizing the graphite. A bias voltage is then applied to the ionized graphite to provide irradiation energy and deposit the film. This allows for the formation of a dense film with a very low hydrogen content. However, to prevent graphite clumps of several to tens of millimeters or more generated during the arc discharge from scattering and being incorporated into the film, it is necessary to transport only the plasma to the deposition area using a deflection magnetic field. As a result, the deposition area is narrow and the deposition rate is low, making it difficult to apply to large substrate holders in terms of processing time and cost. However, this embodiment can solve such problems.

[0036] <Second Embodiment> Figure 7 is a schematic diagram of a substrate holding plate that allows for foil adjustment and replacement of the second substrate holding member 3. The second embodiment will be described using Figure 7. Compared to the first embodiment, this embodiment allows for foil adjustment between the first substrate holding member 2 and the second substrate holding member 3, and makes the second substrate holding member 3 detachable from the first substrate holding member 2.

[0037] A foil 9 (material) is inserted between the groove 24 of the first substrate holding member 2 and the bottom surface of the second substrate holding member 3, making it easier to adjust and position the first substrate holding member 2 and the second substrate holding member 3 on the same plane. Furthermore, screw holes are provided in the groove 24 of the first substrate holding member 2 and the second substrate holding member 3, and the second substrate holding member 3 is fastened with a screw 11 (fastening material) so that it can be removed from the first substrate holding member 2. In this embodiment, it is described as foil 9, but it is not limited to this, and other forms of materials may be used.

[0038] Next, the present invention will be described in detail based on examples.

[0039] (1) Evaluation of the amount of wear of the substrate holder due to contact with the substrate Figure 8 is a schematic diagram of the substrate holder 70 used in the evaluation of the embodiment. The method for evaluating the amount of wear of the substrate holder due to contact with the substrate will be explained using Figure 8. The substrate holder 70 has an outer diameter of Φ350 mm, and black alumina was used for the first base 21 and first projection 22 of the first substrate holder member 2, and for the second base 31 and second projection 32 of the second substrate holder member 3. The thicknesses of the first base 21 and the second base 31 are 60 mm and 20 mm, respectively. The shape of the first projection 22 and the second projection 32 is a frustoconical or cylindrical shape with a diameter of 0.8 mm and a height of 0.5 mm. The pitch between adjacent first projections 22 and 2 projections 32 is 20 mm. The suction holes 4 are Φ10 holes, and three are provided at equal intervals on the circumference of the substrate holder 1 with a diameter of Φ250 mm. In the first substrate holding member 2, the portion that forms the groove 24 for positioning the second substrate holding member 3 is as follows on the outermost surface side of the substrate holding plate 70, relative to three straight lines connecting the centers of the three holes in the lift pin hole portion 5. Each of these is a rectangular parallelepiped with dimensions of 100 mm in the radial direction, 30 mm in the direction perpendicular to the radial direction, and 20 mm in the thickness direction, centered at the intersection of the perpendicular bisectors. The amount of wear on the substrate holding plate is evaluated when the substrate holding plate 70 is used to transport a 300 mm wafer 100,000 times.

[0040] (2) Measurement of abrasion resistance A pin-on-disk type abrasion tester is used. A Φ5mm sapphire sphere is used in air, and the test conditions are: load 50kgw, reciprocating linear motion over a width of 5mm, sliding speed: 18mm / sec, and the depth of the sliding mark after 30 minutes is measured with a stylus profiler.

[0041] (3)Hardness A nanointender tester is used. A triangular pyramidal diamond indenter is pressed into the sample surface, and the load (indentation strength) and displacement (indentation depth) are measured. The hardness of a minute region is calculated from the obtained load-displacement curve.

[0042] (4) Coefficient of friction A pin-on-disk type abrasion tester is used. A φ5mm sapphire sphere is used in air, and the test conditions are a load of 50 kgw, reciprocating linear motion over a width of 5 mm, and a sliding speed of 18 mm / sec. The friction force is directly measured with a rotational torque meter and the coefficient of friction is derived.

[0043] (Example 1) In the substrate holder 70 shown in Figure 8, the coating layer 23 is a-C:H deposited by plasma CVD. a-C:H was coated to a thickness of 500 nm on at least the surface of the first protrusion 22. The plasma CVD deposition conditions were argon gas flow rate 50 sccm, toluene gas flow rate 2.5 sccm, pressure 5 Pa, and RF power 300 W. For reference, a film deposited on a 3-inch Si wafer under the same deposition conditions had a hardness of 12 GPa, a friction coefficient of 0.2, and abrasion resistance test results of <1 nm.

[0044] The coating layer 33 is ta-C deposited by FCVA. Ta-C was coated to a thickness of 500 nm on at least the surface of the second protrusion 32. The deposition conditions for ta-C by FCVA were a pressure of 0.03 Pa and an arc current of 35 A, with a carbon target used as the target. For reference, a film deposited on a 3-inch Si wafer under the same deposition conditions had a hardness of 32 GPa, a friction coefficient of 0.1, and a wear resistance test result of 8 nm. The evaluation result for the amount of wear of the substrate holder plate 70 due to contact with the substrate 7 was 10 nm.

[0045] (Comparative Example 1) Comparative Example 1 differs from Example 1 in that the coating layer 33 has a different film composition, with the same a-C:H film as the coating layer 23. The evaluation result for the amount of wear of the substrate holder plate 70 due to contact with the substrate 7 was 100 nm.

[0046] (Example 2) In Example 2, the coating layers 23 and 33 are different from those in Example 1. The coating layer 23 is SiC deposited by DC sputtering. SiC was coated to a thickness of 500 nm on at least the surface of the first protrusion 222. The DC sputtering deposition conditions were argon gas flow rate of 100 sccm, pressure of 5 Pa, and RF power of 500 W. For reference, a film deposited on a 3-inch Si wafer under the same deposition conditions had a hardness of 18 GPa, a friction coefficient of 0.6, and an abrasion resistance test result of 60 nm.

[0047] The coating layer 33 is a-C:H deposited by plasma CVD. It is the same as the coating layer 23 deposited in Example 1. The evaluation result for the amount of wear of the substrate holder plate 70 due to contact with the substrate 7 was 200 nm.

[0048] (Comparative Example 2) Comparative Example 2 differs from Example 2 in that the coating layer 33 is made of a different film, and the same SiC film as the coating layer 23 was used for the coating layer 33. The evaluation of the amount of wear of the substrate holder plate 70 due to contact with the substrate 7 showed that the coating layer 33 was completely gone.

[0049] The results of the evaluation of the wear amount of the substrate holder obtained in each example and comparative example are shown in (Table 1) below.

[0050] [Table 1]

[0051] Reference data for the coatings used in each example and comparative example are shown in (Table 2) below.

[0052] [Table 2]

[0053] (Evaluation of the examples and comparative examples) Example 1 demonstrated higher wear resistance compared to Comparative Example 1, and Example 2 demonstrated higher wear resistance compared to Comparative Example 2. The embodiments described above can be modified as appropriate without departing from the technical concept.

[0054] <Embodiment of manufacturing method for substrate holding device> The above-described substrate holding plate 1 (substrate holding device) is manufactured by the following process. First, a forming process is performed to form a groove 24 in the first substrate holding member 2. Next, a placement process is performed to place the second substrate holding member 3 in the groove 24. The characteristics of the first substrate holding member 2 and the second substrate holding member 3 are as described above. In addition, although not mandatory, an adjustment process may be performed after the placement process to adjust the height of the upper surface of at least one of the first substrate holding member 2 and the second substrate holding member 3 so that the upper surface of the first substrate holding member 2 and the upper surface of the second substrate holding member 3 are on the same plane.

[0055] <Embodiment of an exposure apparatus> Figure 9 shows the configuration of the illumination optical system of an exposure apparatus (substrate processing apparatus). The exposure apparatus 100 has an illumination optical system 102 that illuminates the mask 103 (original plate), which is the surface to be illuminated, with light, and a projection optical system 101 that projects (transfers) an image of the pattern formed on the mask 103 onto a substrate 104 placed on the surface to be illuminated at a position optically conjugate to the mask 103.

[0056] The projection optical system 101 illustrated in Figure 9 is a reflective optical system that reflects light in the order of mirrors M1, M2, M3, M2, M1, and projects the image of the pattern of the mask 103 onto the substrate 104 placed on the surface to be illuminated. The projection optical system 101 shown in Figure 1 is a reflective optical system, which has smaller chromatic aberration of light from the light source compared to a refractive optical system, and is suitable for broadband illumination. The substrate 104 is supported by a movable stage 105. The projection optical system 101 is not limited to a reflective optical system, but may also be a reflective-refracting optical system or a refractive optical system. In addition, although the projection optical system 101 in Figure 9 is a single projection optical system, it may also be a multi-lens optical system with multiple projection optical systems 101 arranged in a row, and it is also possible to implement the present invention individually for each projection optical system. The illumination optical system 102 and the projection optical system 101 are collectively called the exposure unit (processing unit). The stage 105 may be the substrate holding unit described above, or an apparatus including a substrate holding unit.

[0057] <Embodiment for manufacturing an article> The method for manufacturing articles according to embodiments of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. Figure 10 is a flowchart of the method for manufacturing articles according to this embodiment. The method for manufacturing articles according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the above-mentioned exposure apparatus 100 to obtain an exposed substrate (exposure step, step S11). It also includes a step of developing the substrate exposed in this step to obtain a developed substrate (development step, step S12). Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S13). The method for manufacturing articles according to this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the articles.

[0058] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its gist. The scope to which the present invention is applicable may be, for example, substrate holding devices for semiconductor manufacturing equipment (film deposition equipment, sputtering equipment, annealing equipment, inspection equipment, etc.), organic EL deposition equipment, imprint equipment, planarization equipment, and other substrate processing equipment.

[0059] The disclosure herein includes at least the following: a substrate holder, a method for manufacturing a substrate holder, a substrate processing apparatus, an exposure apparatus, and a method for manufacturing an article.

[0060] (Item 1) A substrate holding device comprising a first substrate holding member and a second substrate holding member, wherein the substrate is held by the upper surface of the first substrate holding member and the upper surface of the second substrate holding member, The wear resistance of the second substrate holding member is higher than that of the first substrate holding member. A substrate holding device characterized in that the second substrate holding member is arranged to fit into a groove provided in the first substrate holding member, and the upper surface of the first substrate holding member and the upper surface of the second substrate holding member are on the same plane.

[0061] (Item 2) The substrate holding device according to item 1, characterized in that the hardness of the upper surface of the second substrate holding member is higher than the hardness of the upper surface of the first substrate holding member.

[0062] (Item 3) The substrate holding device according to item 1 or 2, characterized in that the coefficient of friction of the upper surface of the second substrate holding member is smaller than the coefficient of friction of the upper surface of the first substrate holding member.

[0063] (Item 4) The substrate holding device according to any one of items 1 to 3, characterized in that the upper surface of the second substrate holding member has a carbon-containing film.

[0064] (Item 5) The upper surface of the first substrate holding member has a carbon-containing film, The substrate holding device according to item 4, characterized in that the hardness of the upper surface of the second substrate holding member is higher than the hardness of the upper surface of the first substrate holding member.

[0065] (Item 6) The substrate holding device according to item 5, characterized in that the film on the upper surface of the second substrate holding member is a ta-C film.

[0066] (Item 7) The substrate holding device according to item 6, characterized in that the film on the upper surface of the first substrate holding member is an aC:H film.

[0067] (Item 8) A substrate holding plate according to any one of items 1 to 7, characterized in that it further has a member between the groove provided in the first substrate holding member and the second substrate holding member.

[0068] (Item 9) A substrate holding device according to any one of items 1 to 8, further comprising a fastening member for fastening the first substrate holding member and the second substrate holding member.

[0069] (Item 10) The substrate holding device according to any one of items 1 to 9, characterized in that the second substrate holding member is removable from the first substrate holding member.

[0070] (Item 11) A substrate holding device including a first region and a second region, The first region includes a first base and a first plurality of projections protruding from the first base. The second region includes a second base and a plurality of second projections protruding from the second base. In a substrate holding device, The first base and the first plurality of protrusions are provided with a first film containing carbon. The second base and the second plurality of protrusions are provided with a second film containing carbon. A substrate holding device characterized in that the hardness of the second film is higher than the hardness of the first film.

[0071] (Item 12) A method for manufacturing a substrate holding device having a first substrate holding member and a second substrate holding member, wherein the substrate is held by the upper surface of the first substrate holding member and the upper surface of the second substrate holding member, A forming step of forming a groove in the first substrate holding member, The arrangement step involves placing the second substrate holding member in the groove, A method for manufacturing a substrate holding device, characterized by including the following:

[0072] (Item 13) After the arrangement step, an adjustment step is performed to adjust the height of at least one of the upper surfaces of the first substrate holding member and the second substrate holding member so that the upper surface of the first substrate holding member and the upper surface of the second substrate holding member are on the same plane. A method for manufacturing a substrate holding device according to item 12, further comprising the following:

[0073] (Item 14) A substrate holding device described in any one of items 1 to 11, A processing unit for processing a substrate held by the substrate holding device, A substrate processing apparatus having

[0074] (Item 15) An exposure apparatus for transferring the image of the pattern of the original plate onto a substrate, A substrate holding device described in any one of items 1 to 11, An exposure unit for exposing a substrate held by the substrate holding device, An exposure apparatus having the following features.

[0075] (Item 16) An exposure step in which a substrate is exposed using the exposure apparatus described in item 15 to obtain an exposed substrate, The process includes developing the aforementioned photopolymer substrate to obtain a developed substrate, A method for manufacturing an article, characterized by manufacturing an article from the aforementioned developing substrate. [Explanation of Symbols]

[0076] 1 Substrate holding device 2. First substrate holding member 3. Second substrate holding member 24 groove

Claims

1. A substrate holding device comprising a first substrate holding member and a second substrate holding member, wherein the substrate is held by the upper surface of the first substrate holding member and the upper surface of the second substrate holding member, The wear resistance of the second substrate holding member is higher than that of the first substrate holding member. A substrate holding device characterized in that the second substrate holding member is arranged to fit into a groove provided in the first substrate holding member, and the upper surface of the first substrate holding member and the upper surface of the second substrate holding member are arranged to be on the same plane.

2. The substrate holding device according to claim 1, characterized in that the hardness of the upper surface of the second substrate holding member is higher than the hardness of the upper surface of the first substrate holding member.

3. The substrate holding device according to claim 1, characterized in that the coefficient of friction of the upper surface of the second substrate holding member is smaller than the coefficient of friction of the upper surface of the first substrate holding member.

4. The substrate holding device according to claim 1, characterized in that the upper surface of the second substrate holding member has a carbon-containing film.

5. The upper surface of the first substrate holding member has a carbon-containing film, The substrate holding device according to claim 4, characterized in that the hardness of the upper surface of the second substrate holding member is higher than the hardness of the upper surface of the first substrate holding member.

6. The substrate holding device according to claim 5, characterized in that the film on the upper surface of the second substrate holding member is a ta-C film.

7. The substrate holding device according to claim 6, characterized in that the film on the upper surface of the first substrate holding member is an a-C:H film.

8. The substrate holding plate according to claim 1, further comprising a member between the groove provided in the first substrate holding member and the second substrate holding member.

9. The substrate holding device according to claim 1, further comprising a fastening member for fastening the first substrate holding member and the second substrate holding member.

10. The substrate holding device according to claim 1, characterized in that the second substrate holding member is removable from the first substrate holding member.

11. A substrate holding device including a first region and a second region, The first region includes a first base and a first plurality of projections protruding from the first base. The second region includes a second base and a plurality of second protrusions projecting from the second base. In a substrate holding device, The first base and the first plurality of protrusions are provided with a first film containing carbon. The second base and the second plurality of protrusions are provided with a second film containing carbon. A substrate holding device characterized in that the hardness of the second film is higher than the hardness of the first film.

12. A method for manufacturing a substrate holding device having a first substrate holding member and a second substrate holding member, wherein the substrate is held by the upper surface of the first substrate holding member and the upper surface of the second substrate holding member, A forming step of forming a groove in the first substrate holding member, A placement step of placing the second substrate holding member in the groove, A method for manufacturing a substrate holding device, characterized by including the following:

13. After the arrangement step, an adjustment step is performed to adjust the height of at least one of the upper surfaces of the first substrate holding member and the second substrate holding member so that the upper surface of the first substrate holding member and the upper surface of the second substrate holding member are on the same plane. A method for manufacturing a substrate holding device according to claim 12, further comprising the following:

14. A substrate holding device according to any one of claims 1 to 11, A processing unit for processing a substrate held by the substrate holding device, A substrate processing apparatus having

15. An exposure apparatus for transferring the image of the pattern of the original plate onto a substrate, A substrate holding device according to any one of claims 1 to 11, An exposure unit for exposing a substrate held by the substrate holding device, An exposure apparatus having the following features.

16. An exposure step of exposing a substrate using the exposure apparatus described in claim 15 to obtain an exposed substrate, The process includes developing the aforementioned photopolymer substrate to obtain a developed substrate, A method for manufacturing an article, characterized by manufacturing an article from the aforementioned developing substrate.

Images