Imaging device

Abstract

To improve air cooling efficiency while suppressing the ingress of dust, water, and other liquids through air intake. [Solution] The imaging device includes an image sensor, a circuit for processing the output signal of the image sensor, a housing for housing the image sensor and the circuit, a first heat sink provided on the outside of the housing for conducting heat generated by the image sensor, and a second heat sink provided on the outside of the housing for conducting heat generated by the circuit, wherein the housing, together with the first heat sink and the second heat sink, forms a flow path through which air flows from an intake port to an exhaust port.

Description

Technical Field

[0001] The present invention relates to an imaging device.

Background Art

[0002] A full spherical imaging device has a plurality of imaging optical systems each including a wide-angle lens and an imaging sensor that images an image formed by the wide-angle lens. The full spherical imaging device synthesizes the images captured by each imaging optical system to obtain an image within a solid angle of 4π steradians (see, for example, Patent Document 1 below).

[0003] However, in the full spherical imaging device of Patent Document 1, a configuration for dissipating heat from heat sources such as an imaging sensor is not considered.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

[0005] The imaging device disclosed in the present application includes an imaging element, a circuit that processes an output signal of the imaging element, a housing that houses the imaging element and the circuit, a first heat sink provided outside the housing to which heat generated by the imaging element is conducted, and a second heat sink provided outside the housing to which heat generated by the circuit is conducted. The housing forms a flow path through which air flows from an air inlet toward an air outlet together with the first heat sink and the second heat sink.

[0006] The imaging device disclosed in this application comprises a housing having an air intake port and an exhaust port; a heat dissipation structure having a flow path through which air flows between the air intake port and the exhaust port; a plurality of heat sources provided inside the housing and isolated from the flow path; a housing provided inside the housing for sealing and housing the plurality of heat sources; and a plurality of heat dissipation members provided outside the housing inside the housing, through which heat from the plurality of heat sources is conducted, wherein the flow path is formed by the inside of the housing and the housing.

[0007] The imaging device disclosed in this application comprises a housing having an air intake port and an exhaust port, a heat dissipation structure having a flow path through which air flows between the air intake port and the exhaust port, and a plurality of heat sources provided inside the housing, isolated from the flow path. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of the imaging device according to Example 1. [Figure 2] Figure 2 is a plan view or bottom view of the imaging device according to Example 1. [Figure 3] Figure 3 is a cross-sectional view of the imaging device according to Example 1. [Figure 4] Figure 4 is a perspective view showing an example of the arrangement of a cooling fan on a heatsink according to Example 1. [Figure 5] Figure 5 is a side cross-sectional view showing another example of the arrangement of the heat source according to Example 1. [Figure 6] Figure 6 is a plan cross-sectional view of an imaging device showing another configuration example 1 of the heat sink according to Embodiment 1. [Figure 7] Figure 7 is a plan cross-sectional view of an imaging device showing another configuration example 2 of the heat sink according to Example 1. [Figure 8] Figure 8 is a plan cross-sectional view of an imaging device showing another configuration example 3 of the heat sink according to Example 1. [Figure 9] Figure 9 is a plan cross-sectional view of an imaging device showing another configuration example 4 of the heat sink according to Example 1. [Figure 10]Figure 10 is a plan cross-sectional view of an imaging device showing another configuration example 5 of the heat sink according to Example 1. [Figure 11] Figure 11 is an external view of the imaging device according to Example 2. [Figure 12] Figure 12 is an exploded perspective view of the imaging device according to Example 2. [Figure 13] Figure 13 is a cross-sectional view of the imaging device according to Example 2. [Figure 14] Figure 14 is a perspective view showing an example of a cooling device being attached to an imaging device according to Example 2. [Modes for carrying out the invention] [Examples]

[0009] <Appearance of the imaging device> Figure 1 is a perspective view of the imaging device according to Embodiment 1, and Figure 2 is a plan view or bottom view of the imaging device according to Embodiment 1. In Figure 1, (A) is a front perspective view, and (B) is a rear perspective view. The imaging device 100 has a housing 101. A wide-angle lens 102A is provided on the front panel 101A of the housing 101.

[0010] A wide-angle lens 102B is provided on the rear panel 101B of the housing 101. A ventilation opening 103C is provided on the top panel 101C of the housing 101. A ventilation opening 103D is provided on the bottom panel 101D of the housing 101. Slits are formed in the ventilation openings 103C and 103D, and air passes through the gaps between the slits.

[0011] The wide-angle lens 102A is mounted on the housing 101 so as to be exposed from the housing 101. The wide-angle lens 102A receives light from outside the housing 101 and emits it to the image sensor 302A (see Figure 3) located further down the housing. The wide-angle lens 102B is mounted on the housing 101 so as to be exposed from the housing 101 in the opposite direction to the direction in which the wide-angle lens 102A is exposed. The wide-angle lens 102B receives light from outside the housing 101 and emits it to the image sensor 302B (see Figure 3) located further down the housing.

[0012] At least one of the wide-angle lenses 102A and 102B has an angle of view of 180 degrees or more. The imaging device 100 arranges the two image pickup elements 302A and 302B in opposite directions to each other, and arranges the wide-angle lenses 102A and 102B in front of each image pickup element 302A and 302B, so as to image a subject with a solid angle of 4π steradians.

[0013] <Internal structure of imaging device 100> FIG. 3 is a cross-sectional view of the imaging device 100 according to the first embodiment. (A) is a plan cross-sectional view of the imaging device 100, and (B) is a side cross-sectional view of the imaging device 100. The imaging device 100 includes lens barrels 301A and 301B, image pickup elements 302A and 302B, a circuit board 303, a circuit 304, a heat transfer sheet 305, and a heat sink 306 which is an example of a heat dissipation structure. The image pickup elements 302A and 302B and the circuit 304 are heat sources. X is an optical axis common to the wide-angle lenses 102A and 102B. The direction from the back plate 101B to the front plate 101A is defined as +X, and the direction from the front plate 101A to the back plate 101B is defined as -X.

[0014] The lens barrels 301A and 301B respectively hold the wide-angle lenses 102A and 102B at one end exposed to the outside, and hold the image pickup elements 302A and 302B at the other end inside the housing 101.

[0015] The image pickup elements 302A and 302B are respectively arranged behind the wide-angle lenses 102A and 102B, receive the light collected by the wide-angle lenses 102A and 102B, and convert it into an electrical signal.The image pickup element 302A is connected to the heat sink 306 via the heat transfer sheet 305. The image pickup element 302B is connected to the heat sink 306.

[0016] In addition, the image pickup elements 302A and 302B are electrically connected to the circuit 304 via the circuit board 303 by a flexible wiring board (not shown) existing in the internal space 300. Thereby, the image signals from the image pickup elements 302A and 302B can be output to the circuit 304. The internal space 300 is a sealed space inside the imaging device 100 excluding the heat sink 306 and the through hole 306a.

[0017] The imaging elements 302A and 302B may be, for example, solid-state imaging elements of the XY address type (e.g., CMOS (Complementary Metal-Oxide Semiconductor) sensors), or may be solid-state imaging elements of the sequential scanning type (e.g., CCD (Charge Coupled Device)).

[0018] On the light-receiving surfaces of the imaging elements 302A and 302B, a plurality of light-receiving elements (pixels) are arranged in a matrix. Then, a plurality of types of color filters that transmit light of different color components are arranged in a predetermined color arrangement (e.g., Bayer arrangement) for the pixels of the imaging elements 302A and 302B. Therefore, each pixel of the imaging elements 302A and 302B outputs an analog electrical signal corresponding to each color component to the circuit 304 by color separation by the color filter. Note that the heat generation amounts of the imaging elements 302A and 302B may be different as long as they are smaller than the heat generation amount of the circuit 304.

[0019] The imaging elements 302A and 302B each have an AFE (Analog Front End). The AFE is an analog front-end circuit that performs signal processing on the analog electrical signals from the imaging elements 302A and 302B. The AFE sequentially executes gain adjustment of the electrical signal, analog signal processing (correlated double sampling, black level correction, etc.), A / D conversion processing, and digital signal processing (defective pixel correction, etc.) to generate RAW image data and outputs it to the circuit 304.

[0020] Circuit board 303 is a board on which circuit 304 is mounted. Circuit board 303 is positioned between the image sensor 302A and the heat sink 306, along a direction perpendicular to the optical axis X. Circuit board 303 has wiring that electrically connects circuits 304 to each other. Circuit board 303 electrically connects the image sensors 302A, 302B and circuit 304 using a flexible wiring board (not shown). Circuit 304 is a device mounted on circuit board 303 and is connected to the heat sink 306 directly or via a heat transfer pad (not shown). This allows heat generated in circuit 304 to be transferred to the heat sink 306.

[0021] Circuit 304 specifically includes, for example, a processor, memory, and LSIs such as ASICs (Application Specific Integrated Circuits) and FPGAs (Field-Programmable Gate Arrays).

[0022] The processor provides overall control of the imaging device 100. The processor executes programs. The memory stores the programs executed by the processor, pre-prepared data, and data obtained from the execution processes of the processor and LSI.

[0023] The LSI performs specific signal processing, such as image processing and compression / decompression processing, using electrical signals from the image sensors 302A and 302B. This specific signal processing may also be achieved by a processor executing a program stored in memory. For example, the LSI that performs image processing and the processor that executes the image processing program stored in memory are called an image processing chip. Because circuit 304 performs various processes in this way, the amount of heat generated by circuit 304 is greater than that of the image sensors 302A and 302B. The LSI that performs image processing is referred to as an image processing chip.

[0024] The heat transfer sheet 305 is a sheet that is thermally conductive and flexible. The heat transfer sheet 305 is, for example, copper foil or a graphite sheet. One end of the heat transfer sheet 305 is connected to the image sensor 302A directly or via a heat transfer pad (not shown). The other end of the heat transfer sheet 305 is connected to the outer surface of the heat sink 306. In this way, the heat transfer sheet 305 absorbs the heat generated by the image sensor 302A and transfers it to the heat sink 306.

[0025] The heat sink 306 is provided between the circuit 304 and the image sensor 302B. The heat sink 306 is a heat-conductive heat dissipation material such as aluminum. The heat sink 306 is cylindrical, and its through-hole 306a extends in a direction perpendicular to the optical axis X. Specifically, for example, one end of the through-hole 306a communicates with the vent 103D of the bottom plate 101D, and the other end of the through-hole 306a communicates with the vent 103C of the top plate 101C.

[0026] The lower edge 306c of the heatsink 306 contacts the surface of the bottom plate 101D facing the housing 101, covering the vent 103D. Similarly, the upper edge 306b of the heatsink 306 contacts the surface of the top plate 101C facing the housing 101, covering the vent 103C. As a result, the housing 101 is separated into the through-hole 306a and the internal space 300 excluding the heatsink 306 and the through-hole 306a. In other words, the internal space 300 is sealed by the inner wall surface of the housing 101 and the outer wall surface of the heatsink 306, preventing dust, water, and other liquids from entering through the vents 103C, 103D and the through-hole 306a during air cooling.

[0027] The heatsink 306 is fixed to the circuit 304 and the image sensor 302B either directly or via a heat transfer pad (not shown). Therefore, the heatsink 306 can absorb the heat generated by the circuit 304 and the image sensor 302B. Additionally, the heatsink 306 is connected to a heat transfer sheet 305 on its outer surface. This allows the heatsink 306 to absorb the heat generated by the image sensor 302A via the heat transfer sheet 305.

[0028] Suppose that air from outside the housing 101 flows in through the vent 103D of the bottom plate 101D, for example, due to wind direction or the movement of the imaging device 100. As described above, the heat sink 306 absorbs heat from the circuit 304 and the image sensors 302A and 302B, so the incoming air is heated by the heat from the inner wall surface of the heat sink 306, flows in the direction of the thick arrow in (B), and is discharged through the vent 103C.

[0029] As a result, the circuit 304 and image sensors 302A and 302B within the internal space 300 are cooled by the air flowing outside the internal space 300 (through-hole 306a). Therefore, even if dust or liquids such as water flow into the through-hole 306a along with the air, they will not enter the internal space 300. This helps to suppress malfunctions and lens contamination caused by the ingress of dust or liquids such as water.

[0030] Air may flow in through vent 103C and be discharged through vent 103D. Furthermore, the heat sink 306 may be positioned such that the through-holes 306a face perpendicular to both sides of the housing 101.

[0031] <Example of cooling fan placement> Figure 4 is a perspective view showing an example of the arrangement of a cooling fan on a heat sink 306 according to Embodiment 1. In Embodiment 1, the imaging device 100 may be configured without a cooling fan, as shown in Figure 3, or it may be configured with a cooling fan 400, as shown in Figure 4. The cooling fan 400 is positioned in a through-hole 306a of the heat sink 306. The cooling fan 400 is electrically connected to a circuit 304 via a circuit board 303 by wiring (not shown) routed from the inner wall surface of the through-hole 306a, where the cooling fan 400 and the heat sink 306 come into contact, into the interior of the heat sink 306. This allows the imaging device 100 to drive and control the cooling fan 400 from the circuit 304.

[0032] The cooling fan 400 is, for example, an axial fan, which draws in air from one side and exhausts it from the opposite side. In Figure 4, in all of (A) to (C), the axis of rotation of the cooling fan 400 is in the same direction as the through hole 306a, and the cooling fan 400 draws in air from the lower end opening 306e of the heatsink 306 and exhausts it from the upper end opening 306d.

[0033] (A) is a configuration in which the cooling fan 400 is positioned at the upper opening 306d of the heatsink 306. As a result, the cooling fan 400 draws air into the heatsink 306 from the lower opening 306e. The air absorbs heat from the inner wall surface of the through-hole 306a of the heatsink 306. The cooling fan 400 then discharges the air, which has absorbed heat and been warmed, to the outside of the housing 101.

[0034] (B) is a configuration in which the cooling fan 400 is positioned at the lower end opening 306e of the heatsink 306. As a result, the cooling fan 400 draws in air from outside the housing 101 at the lower end opening 306e and brings air into the heatsink 306. The incoming air absorbs heat from the inner wall surface of the through hole 306a as it moves towards the upper end opening 306d and is exhausted outside the housing 101.

[0035] (C) is a configuration in which the cooling fan 400 is positioned inside the through-hole 306a of the heatsink 306. As a result, the cooling fan 400 draws air in from the lower end opening 306e inside the through-hole 306a and discharges it through the upper end opening 306d. The air absorbs heat from the inner wall surface of the through-hole 306a from the lower end opening 306e to the upper end opening 306d.

[0036] In this way, by installing the cooling fan 400, the inside of the chassis 101 can be forcibly air-cooled. Note that the placement of the cooling fan 400 differs in configurations (A) to (C), so one of configurations (A) to (C) is adopted considering the weight balance with other components inside the chassis 101.

[0037] <Other heat source configuration examples> Figure 5 is a side cross-sectional view showing another arrangement example of the heat source according to Embodiment 1. In Figure 5, vent 103D is an intake port and vent 103C is an exhaust port. In Figure 3, the circuit 304 and the image sensor 302B are connected at the same distance from the bottom plate 101D on opposite sides of the heat sink 306. In Figure 5, the circuit 304 and the image sensor 302B are connected at different distances from the bottom plate 101D on opposite sides of the heat sink 306.

[0038] Specifically, the image sensor 302B generates less heat than the circuit 304. Therefore, the image sensor 302B is connected upstream of the airflow from the circuit 304, for example, to the lower end of the heat sink 306 near the vent 103D. On the other hand, the circuit 304 generates more heat than the image sensor 302B. Therefore, the circuit 304 is connected downstream of the airflow from the image sensor 302B, for example, to the upper end of the heat sink 306 near the vent 103C.

[0039] In this configuration, heat sources with relatively low heat generation (image sensors 302A, 302B) are connected to the outer surface of the heat sink 306, which is upstream of the airflow, while heat sources with relatively high heat generation (circuit 304) are connected to the outer surface of the heat sink 306, which is downstream of the airflow. This allows the air that has absorbed heat upstream of the through-hole 306a to flow downstream and sufficiently absorb the heat dissipated from the circuit 304, thereby suppressing the temperature rise of the downstream heat source (circuit 304) due to heat transfer from the downstream air. Therefore, efficient air cooling can be achieved. In addition, in the configuration of Figure 5, a cooling fan 400 may be implemented as shown in Figures 4(A) to (C). This enables rapid air cooling.

[0040] <Other configuration examples for heatsink 306> Next, we will describe other configuration examples for the heatsink 306.

[0041] Figure 6 is a plan cross-sectional view of an imaging device 100 showing another configuration example 1 of the heat sink 306 according to Embodiment 1. The heat sink 306 has shielding members 601 to 603. The shielding members 601 to 603 extend in the direction of penetration of the through hole 306a from the upper end opening 306d to the lower end opening 306e. The shielding members 601 to 603 divide the heat sink 306 into compartments 612, 613, and 623 for each heat source. The shielding members 601 to 603 are made of a material with lower thermal conductivity than the heat sink 306, for example, plastic. This suppresses heat transfer between compartments 612, 613, and 623, making it easier to store heat in units of compartments 612, 613, and 623.

[0042] The positions of shielding members 601 to 603 are determined by the heat sources (circuit 304, image sensors 302A, 302B) connected to sections 612, 613, and 623. Sections connected to heat sources with larger heat generation require larger areas to increase heat storage capacity. Therefore, the positions of shielding members 601 to 603 are determined such that the distance between them increases with increasing heat generation (for example, proportional to the power consumption of the heat source). Here, the distance between shielding members 601 and 602 along the heat sink 306 is D12, the distance between shielding members 601 and 603 is D13, and the distance between shielding members 602 and 603 is D23.

[0043] For example, circuit 304 generates more heat than image sensors 302A and 302B. Therefore, the distance D12 of section 612 to which circuit 304 is connected is longer than the distances D12 and D23 of sections 612 and 613 to which image sensors 302A and 302B are connected. As a result, shielding members 601 to 603 are arranged so that the area of ​​heat sink 306 to which circuit 304 is connected is larger than the area of ​​heat sink 306 to which image sensors 302A and 302B are connected.

[0044] In this way, by providing shielding members 601 to 603 on the heat sink 306 and forming compartments 612, 613, and 623, the exchange of heat between heat sources via the heat sink can be suppressed. For example, this prevents a heat source with a low heat output from being heated by heat from a heat source with a high heat output, and enables efficient air cooling according to the amount of heat generated. In addition, in the configuration of Figure 6, a cooling fan 400 may be implemented as shown in Figures 4(A) to (C). This makes it possible to perform rapid air cooling.

[0045] Figure 7 is a plan cross-sectional view of the imaging device 100 showing another configuration example 2 of the heat sink 306 according to Embodiment 1. Another configuration example 2 is a configuration in which a partition plate 700 is further added to other configuration example 1 in Figure 6. The partition plate 700 is a plate-shaped member that connects the shielding members 601 to 603 and extends in the direction of penetration of the through hole 306a from the upper end opening 306d to the lower end opening 306e. The partition plate 700 is made of a material with lower thermal conductivity than the heat sink 306, such as plastic, similar to the shielding members 601 to 603. The partition plate 700 divides the through hole 306a into three through holes 712, 713, and 723.

[0046] As a result, the air flowing through the through-hole 712 cools the compartment 612 where heat generated from the circuit 304 has been conducted. The air flowing through the through-hole 713 cools the compartment 613 where heat generated from the image sensor 302A has been conducted via the heat transfer sheet 305. The air flowing through the through-hole 723 cools the compartment 623 where heat generated from the image sensor 302B has been conducted.

[0047] In this way, by providing the partition plate 700 inside the heat sink 306, heat exchange between the through holes 712, 713, and 723 can be suppressed, and each section 612, 613, and 623 can be air-cooled independently. In addition, in the configuration of Figure 6, a cooling fan 400 may be installed as shown in Figures 4(A) and (B). This makes it possible to air-cool rapidly.

[0048] Figure 8 is a plan cross-sectional view of the imaging device 100 showing another configuration example 3 of the heat sink 306 according to Embodiment 1. Another configuration example 3 is an example in which the heat sink 306 is recessed in the optical axis X direction. The heat sink 306 has recesses 800A and 800B at the connection points of the circuit 304 and the image sensor 302B. The distance D1 between the recesses 800A and 800B is shorter than the width D2 in the optical axis X direction of the through hole 306a where the recesses 800A and 800B are not formed. Therefore, when air flows into the through hole 306a, the airflow in the space 801 between the recesses 800A and 800B is faster than the airflow in the space 802 of the through hole 306a where the recesses 800A and 800B are not formed, making it easier to absorb heat from the inner wall surfaces of the recesses 800A and 800B. Therefore, the air cooling efficiency in space 801 is improved.

[0049] Furthermore, since the circuit 304 and the image sensor 302B are housed in recesses 800A and 800B on the outside of the heat sink 306, the thickness of the housing 101 in the optical axis X direction is reduced accordingly. Therefore, the imaging device 100 can be miniaturized. In addition, in the configuration of Figure 8, a cooling fan 400 may be mounted as shown in Figures 4(A) to (C). This makes it possible to cool the device rapidly by air.

[0050] Figure 9 is a plan cross-sectional view of the imaging device 100 showing another configuration example 4 of the heat sink 306 according to Embodiment 1. Another configuration example 4 is an example that combines other configuration example 1 (Figure 6) and other configuration example 3 (Figure 8). Similar to other configuration example 1 (Figure 6), shielding members 601 to 603 are provided on the heat sink 306 to form compartments 612, 613, and 623, so that the exchange of heat between heat sources through the heat sink can be suppressed, for example, a heat source with a small heat output will not be heated by heat from a heat source with a large heat output, and efficient air cooling according to the amount of heat output will be possible.

[0051] Furthermore, similar to the other configuration example 3 (Figure 8), the airflow in space 801 is faster than in space 802, thus improving the air cooling efficiency in space 801. Also, since the circuit 304 and the image sensor 302B are housed in recesses 800A and 800B on the outside of the heat sink 306, the thickness of the housing 101 in the optical axis X direction is reduced accordingly. Therefore, the imaging device 100 can be miniaturized. Note that in the configuration of Figure 9, a cooling fan 400 may be implemented as shown in Figures 4(A) to (C). This makes rapid air cooling possible.

[0052] Figure 10 is a plan cross-sectional view of the imaging device 100 showing another configuration example 5 of the heat sink according to Embodiment 1. Another configuration example 5 is an example that combines another configuration example 2 (Figure 7) and another configuration example 3 (Figure 8). Similar to other configuration example 2 (Figure 7), by providing the partition plate 700 inside the heat sink 306, the exchange of heat between the through holes 712, 713, and 723 can be suppressed, and each section 612, 613, and 623 can be air-cooled independently.

[0053] Furthermore, similar to the other configuration example 3 (Figure 8), the airflow in space 801 is faster than in space 802, thus improving the air cooling efficiency in space 801. Also, since the circuit 304 and the image sensor 302B are housed in recesses 800A and 800B on the outside of the heat sink 306, the thickness of the housing 101 in the optical axis X direction is reduced accordingly. Therefore, the imaging device 100 can be miniaturized. Note that in the configuration of Figure 10, a cooling fan 400 may be implemented as shown in Figures 4(A) and (B). This makes rapid air cooling possible.

[0054] Thus, according to Example 1, it is possible to improve the air cooling efficiency within the imaging device 100 while suppressing the ingress of dust and liquids such as water into the space where the circuit 304, image sensors 302A, 302B, etc. are located through air intake. Furthermore, in the imaging device 100, the wide-angle lens 102A, image sensor 302A, circuit 304, heat sink 306, image sensor 302B, and wide-angle lens 102B are arranged on the X-axis in the order of -X direction. An imaging device 100 in which the combination of wide-angle lens 102A and image sensor 302A and the combination of wide-angle lens 102B and image sensor 302B are arranged back to back in opposite directions captures the subject with a solid angle of 4π steradians.

[0055] Therefore, if a new mechanism such as a heat sink 306 is added inside the imaging device 100, the housing 101 needs to be expanded to accommodate the new mechanism. For example, if the housing 101 is lengthened in a direction perpendicular to the optical axis X (for example, towards the bottom plate 101D) without changing the thickness of the housing 101 in the optical axis X direction, the image of the expanded part of the housing 101 will be reflected.

[0056] Therefore, it is preferable to arrange the heat sink 306, circuit 304, and circuit board 303 on the optical axis X and between the image sensors 302A and 302B. By arranging them in this way, reflections of the image on the housing 101 can be suppressed. [Examples]

[0057] Next, Example 2 will be described. The imaging device 100 according to Example 1 has a heat sink 306 with through holes 306a that serve as air passages as a heat dissipation structure, and the through holes 306a are isolated from the internal space 300 of the housing 101 that houses heat sources such as the circuit 304 and image sensors 302A and 302B. In contrast, the imaging device according to Example 2 has a heat dissipation structure in which the circuit 304 and image sensors 302A and 302B, which are heat sources, are housed in a sealed housing case within the imaging device, and the heat generated by the heat sources inside the housing case is dissipated to the outside of the imaging device in the space outside the housing case within the imaging device. The same reference numerals are used for components identical to those in Example 1, and their descriptions are omitted.

[0058] <Appearance of the imaging device 1100> Figure 11 is an external view of the imaging device 1100 according to Embodiment 2. (A) is a perspective view of the imaging device 1100, and (B) is a front view of the imaging device 1100. The imaging device 1100 has a front panel 1101A, a housing case 1101, and a rear panel 1101B that constitute the housing. A wide-angle lens 102A is inserted into the center of the front panel 1101A and is exposed. In addition, ventilation holes 1102 to 1104 are provided on the left, right, and below the wide-angle lens 102A on the front panel 1101A. The front panel 1101A and the rear panel 1101B sandwich the housing case 1101 and form the top surface 1101C, bottom surface 1101D, and side surface 1101E of the imaging device 1100.

[0059] <Internal structure of imaging device 1100> Figure 12 is an exploded perspective view of the imaging device 1100 according to Embodiment 2. Figure 13 is a cross-sectional view of the imaging device 1100 according to Embodiment 2. In Figure 13, (A) is a side cross-sectional view along line AA shown in Figure 11, (B) is a plan cross-sectional view along line BB shown in Figure 11, and (C) is a side cross-sectional view along line CC shown in Figure 11. The housing case 1101 has a box portion 1200A and a lid portion 1200B. The opening 1200A0 of the box portion 1200A is sealed by the lid portion 1200B.

[0060] The box portion 1200A has a holding portion 1200Aa and openings 1200Ab2 to 1200Ab4. The holding portion 1200Aa is, for example, hollow cylindrical in shape and has a through hole 1200Aa1 into which the lens barrel 1201A can be inserted. The holding portion 1200Aa holds the lens barrel 1201A when the lens barrel 1201A is inserted into the through hole 1200Aa1.

[0061] This seals the through-hole 1200Aa1. Therefore, it is possible to image the subject with the image sensor 302A while suppressing the entry of dust, water, or other liquids into the housing case 1101 through the through-hole 1200Aa1. The holding part 1200Aa is inserted into the opening 1105A of the front plate 1101A.

[0062] Openings 1200Ab2 to 1200Ab4 are each positioned opposite the vents 1102 to 1104. Opening 1200Ab2 is sealed by the first heat transfer plate 1212, which will be described later. Opening 1200Ab3 is sealed by the second heat transfer plate 1213. Opening 1200Ab4 is sealed by the fourth heat transfer plate 1215, which will be described later. Therefore, it is possible to dissipate heat from inside the housing case 1101 to the outside of the housing case 1101 while suppressing the entry of dust, water, and other liquids into the housing case 1101 through openings 1200Ab2 to 1200Ab4.

[0063] Heatsinks 1202 to 1204 are housed in the space between the front panel 1101A and the box section 1200A. Heatsink 1202 is positioned between the vent 1102 and opening 1200Ab2 of the front panel 1101A. Heatsink 1203 is positioned between the vent 1103 and opening 1200Ab3 of the front panel 1101A. Heatsink 1204 is positioned between the vent 1104 and opening 1200Ab4 of the front panel 1101A. The front panel 1101A is fixed to the box section 1200A. The rear panel 1101B is also fixed to the box section 1200A.

[0064] Furthermore, in Figure 13(C), a vent 1302, which serves as an exhaust port, is provided near the heat sink 1204. The vent 1302 communicates with the space between the front panel 1101A and the housing case 1101. This creates a flow path F (see Figure 14) through which air flows from the vents 1102-1104 to the vent 1302 via the heat sinks 1202-1204. Therefore, the heat sinks 1202-1204 are cooled by the air flowing in from the vents 1102-1104. The air that has absorbed heat from the heat sinks 1202-1204 is then exhausted through the vent 1302.

[0065] The housing case 1101 houses the image sensors 302A and 302B, the circuit board 303, the circuit 304, the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215. The circuit board 303 electrically connects the image sensors 302A and 302B and the circuit 304 using a flexible wiring board (not shown). This flexible wiring board is also housed in the housing case 1101. The first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215 are, for example, heat-conductive plates such as copper plates.

[0066] The lens barrel 1201A is attached to the image sensor 302A. The lens barrel 1201A is inserted into the through hole 1200Aa1 of the retaining part 1200Aa. As a result, the through hole 1200Aa1 of the lens barrel 1201A is sealed by the image sensor 302A.

[0067] The first heat transfer plate 1212 is positioned parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The first heat transfer plate 1212 is fixed to the image sensor 302A either directly or via a heat transfer pad (not shown). As a result, the first heat transfer plate 1212 absorbs heat from the image sensor 302A. The first heat transfer plate 1212 is also fixed to the back surface of the box portion 1200A, sealing the opening 1200Ab2 of the box portion 1200A. This prevents dust, water, and other liquids from entering the housing case 1101 through the opening 1200Ab2.

[0068] By sealing the opening 1200Ab2, a portion of the first heat transfer plate 1212 is exposed through the opening 1200Ab2. As a result, the first heat transfer plate 1212 conducts heat absorbed from the image sensor 302A to the heat sink 1202 from this exposed surface. In other words, the first heat transfer plate 1212 and the heat sink 1202 become heat transfer members that conduct heat generated by the image sensor 302A inside the housing case 1101 to the outside of the housing case 1101. The heat transfer path R2 extends from the image sensor 302A to the heat sink 1202. Therefore, the heat generated from the image sensor 302A is transferred to the air outside the housing case 1101 via the heat sink 1202, and that air is discharged outside the imaging device 1100 through the vent 1102.

[0069] The second heat transfer plate 1213 is positioned parallel to the optical axis X so as to be perpendicular to the circuit board 303. One end 1213a and the other end 1213b of the second heat transfer plate 1213 are bent so as to be parallel to the circuit board 303. The second heat transfer plate 1213 is fixed to the image sensor 302B either directly or via a heat transfer pad (not shown) at the bent end 1213a. In this way, the second heat transfer plate 1213 absorbs heat from the image sensor 302B. The second heat transfer plate 1213 is also fixed to the back surface of the box portion 1200A at the bent other end 1213b, sealing the opening 1200Ab3 of the box portion 1200A. This prevents dust, water, and other liquids from entering the housing case 1101 through the opening 1200Ab3.

[0070] By sealing the opening 1200Ab3, the other end 1213b of the second heat transfer plate 1213 is exposed from the opening 1200Ab3. As a result, the second heat transfer plate 1213 conducts the heat absorbed from the image sensor 302B to the heat sink 1203 from this exposed other end 1213b. In other words, the second heat transfer plate 1213 and the heat sink 1203 become heat transfer members that conduct the heat generated by the image sensor 302B inside the housing case 1101 to the outside of the housing case 1101. The heat transfer path R3 extends from the image sensor 302B to the heat sink 1203. Therefore, the heat generated from the image sensor 302B is transferred to the air outside the housing case 1101 via the heat sink 1203, and that air is discharged outside the imaging device 1100 through the vent 1103.

[0071] The third heat transfer plate 1214 is positioned parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The third heat transfer plate 1214 connects the image sensor 302B and the second heat transfer plate 1213. The third heat transfer plate 1214 conducts the heat generated by the image sensor 302B to the second heat transfer plate 1213.

[0072] The fourth heat transfer plate 1215 is positioned parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The fourth heat transfer plate 1215 is fixed to the circuit 304 via a heat transfer pad 1303 (see Figure 13). As a result, the fourth heat transfer plate 1215 absorbs the heat generated from the circuit 304. The fourth heat transfer plate 1215 is also fixed to the box portion 1200A, sealing the opening 1200Ab4. This prevents dust, water, and other liquids from entering the housing case 1101 through the opening 1200Ab4.

[0073] By sealing the opening 1200Ab4, the fourth heat transfer plate 1215 is exposed through the opening 1200Ab4. As a result, the fourth heat transfer plate 1215 conducts heat absorbed from the circuit 304 to the heat sink 1204 from its exposed surface. In other words, the fourth heat transfer plate 1215 and the heat sink 1204 become heat transfer members that conduct heat generated in the circuit 304 inside the housing case 1101 to the outside of the housing case 1101. The heat transfer path R4 extends from the circuit 304 to the heat sink 1204. Therefore, the heat generated from the circuit 304 is transferred to the air outside the housing case 1101 via the heat sink 1203, and that air is discharged outside the imaging device 1100 through the vent 1104.

[0074] Furthermore, the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215 do not come into contact with each other. This suppresses the transfer of heat between the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215. In particular, it suppresses the transfer of heat from the circuit 304, which generates a relatively large amount of heat, to the image sensors 302A and 302B, which generate a relatively small amount of heat. This helps to suppress a reduction in air cooling efficiency.

[0075] In Figures 13(A) and (C), the housing case 1101 houses the battery 1300. The battery 1300 supplies power to the circuit 304 and image sensors 302A and 302B via the circuit board 303 through a flexible wiring board (not shown) inside the housing case 1101. The battery 1300 may be rechargeable. In Embodiment 2, the battery 1300 is positioned so as not to overlap with the heat sinks 1202, 1203, and 1204 in the optical axis X direction. This prevents the imaging device 1100 from becoming larger. Also, in Figure 13(A), a screw groove 1301 is provided near the heat sink 1204.

[0076] <Example of Cooling Fan 400 installation> Figure 14 is a perspective view showing an example of the installation of a cooling device on the imaging device 1100 according to Embodiment 2. Figure 14 shows the internal structure of the imaging device 1100 and the cooling device 1400. The cooling device 1400 is detachably attached to the imaging device 1100.

[0077] The cooling device 1400 houses a cooling fan 400 in a housing 1401. The housing 101 is, for example, rectangular in shape and has a detachable mechanism 1403 on one side. The detachable mechanism 1403 has a dial 1403a and a screw (not shown) on its axis of rotation. When the dial 1403a is rotated in one direction, the screw enters the screw groove 1301 shown in Figure 13 and engages with the screw groove 1301. When the dial 1403a is rotated in the other direction, the screw retracts and disengages from the screw groove 1301. The detachable mechanism 1403 is not limited to the engagement / disengagement of a screw and screw groove 1301, but can be detachably attached to the imaging device 1100, such as a latch mechanism.

[0078] Furthermore, an air intake port 1401a is provided on the side of the housing 101 where the attachment / detachment mechanism 1403 is located. The air intake port 1401a communicates with the vent port 1302 when the cooling device 1400 is attached to the imaging device 1100. In addition, an exhaust port 1401b is provided on a side of the housing 101 other than the side where the attachment / detachment mechanism 1403 is located.

[0079] The cooling fan 400 forcibly draws in air that has been heated within the imaging device 1100 through the intake port 1401a by the rotation of the fan, and exhausts it through the exhaust port 1401b. The cooling fan 400 receives power from a power supply (not shown) inside the housing 101 or from the battery 1300 of the imaging device 1100, and the fan is driven to rotate or stopped by pressing the operation button 1404.

[0080] In this way, the cooling device 1400 is detachable from the imaging device 1100. This allows for weight reduction of the imaging device 1100 by detaching the cooling device 1400 when forced air cooling is not required. In other words, when air cooling becomes necessary, the cooling device 1400 can be attached to the imaging device 1100 and the cooling fan 400 can be driven.

[0081] Thus, according to Example 2, it is possible to improve the air cooling efficiency inside the imaging device 1100 while suppressing the ingress of dust and liquids such as water into the space where the circuit 304, image sensors 302A, 302B, etc. are located, through air intake.

[0082] Furthermore, heat sinks 1202 and 1203, which dissipate heat from heat sources with relatively low heat generation (image sensors 302A and 302B), are positioned near vents 1102 and 1103 on the upstream side of the flow path F. Heat sink 1204, which dissipates heat from heat source with relatively high heat generation (circuit 304), is positioned near vent 1302 on the downstream side of the flow path F. As a result, even if the air that has absorbed heat on the upstream side of the flow path F flows downstream, it can sufficiently absorb the heat dissipated from circuit 304 and suppress the temperature rise of the downstream heat source (circuit 304) due to heat transfer from the downstream air. Therefore, efficient air cooling can be achieved.

[0083] Furthermore, by providing the ventilation opening 1104, the heat sink 1204 absorbs heat not only from the air heated by the heat sinks 1202 and 1203, but also from air from outside the imaging device 1100 that is not heated by the heat sinks 1202 and 1203. This improves the cooling efficiency of the circuit 304.

[0084] Furthermore, in the imaging device 1100, the wide-angle lens 102A, image sensor 302A, heat sinks 1202~1204, circuit 304, image sensor 302B, and wide-angle lens 102B are arranged on the X-axis in the direction of -X. The imaging device 1100, which has the combination of wide-angle lens 102A and image sensor 302A and the combination of wide-angle lens 102B and image sensor 302B arranged back-to-back in opposite directions, captures the subject with a solid angle of 4π steradians.

[0085] Therefore, if new mechanisms such as heat sinks 1202 to 1204 are added inside the imaging device 1100, the imaging device 1100 needs to be enlarged to accommodate these new mechanisms. For example, if the imaging device 1100 is lengthened in a direction perpendicular to the optical axis X (for example, towards the bottom plate 101D) without changing the thickness of the imaging device 1100 in the optical axis X direction, the image of the enlarged part of the imaging device 1100 will be reflected.

[0086] Therefore, it is preferable to arrange the heat sinks 1202-1204, circuit 304, and circuit board 303 on the optical axis X and between the image sensors 302A and 302B. By arranging them in this way, reflections of the image from the imaging device 1100 can be suppressed.

[0087] Furthermore, the vents 1102 to 1104 that supply air from outside the imaging device 1100 are consolidated into the front panel 1101A as intake ports. As a result, the front panel 1101A receives airflow and is drawn in, allowing the image sensors 302A, 302B, and circuit 304 on the front panel 1101A side to be air-cooled together.

[0088] For example, when an imaging device 1100 mounted on a moving object (such as a person, bicycle, or car) moves with the object in the +X direction, air flows in from vents 1102 to 1104 into the space between the front panel 1101A and the housing case 1101. The incoming air is then exhausted from vent 1302 without flowing into the housing case 1101. Therefore, it is possible to improve the air cooling efficiency inside the imaging device 1100 while suppressing the ingress of dust and liquids such as water through air intake.

[0089] Furthermore, in Embodiment 2, described using Figures 11 to 14, heat sinks 1202 and 1203 are arranged on either side of the optical axis X. Heat sink 1204 is positioned between heat sinks 1202 and 1203 and the vent 1302. This configuration makes it possible to keep the imaging device 1100 from becoming too large and to perform efficient air cooling.

[0090] In the embodiment 2 described using Figures 11 to 14, heat sinks 1202, 1203, and 1204 are all arranged on one lens barrel 1201A side of the imaging device 1100. However, the configuration is not limited to this, and one or two of heat sinks 1202, 1203, and 1204 may be arranged on the other lens barrel 1201B side.

[0091] For example, in a configuration where the heat sink 1202 is located on the other lens barrel 1201B side, a heat transfer plate 1212 is formed so as to transfer heat to the heat sink 1202 located on the other lens barrel 1201B side, and an air intake is provided in the other lens barrel 1201B, and heat is dissipated by the airflow formed from this air intake toward the exhaust port 1401b. Similarly, in a configuration where the heat sinks 1203 and 1204 are located on the other lens barrel 1201B side, heat transfer plates 1213 and 1214 and an air intake are formed.

[0092] Furthermore, in Embodiment 2 using Figures 11 to 14, the heat sink 1204 is positioned on the opposite side of the battery 1300 with respect to the optical axis X. However, the configuration is not limited to this, and the heat sink 1204 may be positioned on the same side as the battery 1300. In this case, a ventilation opening 1302 is provided on the end face of the housing case 1101 that is opposite to the example in Figures 11 to 14.

[0093] As described above, the imaging devices 100 and 1100 according to Examples 1 and 2 dissipate heat transferred from a sealed heat source inside the imaging device 100 and 1100 to an open area inside the imaging device 100 and 1100, and then dissipates the heat to the outside of the imaging device. Therefore, the heat source is not directly exposed to airflow, improving dustproof and waterproof properties.

[0094] It should be noted that the present invention is not limited to the above, and may be combined in any way. Furthermore, other embodiments that can be conceivable within the scope of the technical idea of ​​the present invention are also included in the scope of the present invention. [Explanation of symbols]

[0095] 100 Imaging device, 101 Housing, 103C, 103D Ventilation holes, 300 Internal space, 302A, 302B Image sensor, 303 Circuit board, 304 Circuit, 305 Heat transfer sheet, 306 Heat sink, 306a Through hole, 400 Cooling fan, 601~603 Shielding member, 1100 Imaging device, 1101 Housing case, 1101A Front panel, 1101B Rear panel, 1102~1104 Ventilation holes, 1200A Box section, 1200Aa Holding section, 1200B Lid section, 1202~1204 Heat sink, 1212~1215 Heat transfer plate, 1300 Battery, 1302 Ventilation holes, 1400 Cooling device

Claims

1. Image sensor and A circuit for signal processing the output signal of the image sensor, A housing that houses the image sensor and the circuit, A first heat sink is provided on the outside of the housing, through which heat generated by the image sensor is conducted, It includes a second heat sink provided on the outside of the housing, through which heat generated in the circuit is conducted, The housing, together with the first heat sink and the second heat sink, forms a flow path through which air flows from the intake port to the exhaust port. Imaging device.

2. The imaging apparatus according to claim 1, The flow path is formed such that air flows from the intake port to the exhaust port, in the order of the first heat sink and the second heat sink. Imaging device.

3. An imaging apparatus according to claim 1 or 2, The first heat sink is provided such that a portion of the first heat sink is exposed to the outside of the housing, and a first electric heating member conducts the heat generated by the image sensor, The second heat sink is provided such that a portion of the second heat sink is exposed to the outside of the housing, and a second electric heating element conducts the heat generated in the circuit, An imaging device having

4. An imaging device according to any one of claims 1 to 3, The housing comprises the image sensor, the circuit, the air intake port, the exhaust port, the first heat sink, and the second heat sink. The first heat sink and the second heat sink are provided on the intake side within the housing. Imaging device.

5. The imaging apparatus according to claim 4, The flow path includes a first flow path that draws in air from the intake port, passes through the first surface of the housing, and exhausts it to the exhaust port, and a second flow path that draws in air from another intake port different from the intake port, passes through the second surface of the housing different from the first surface, and exhausts it to the exhaust port. Imaging device.

6. The imaging apparatus according to claim 5, The housing is an imaging device having the intake port and the other intake port on a specific outer surface of the housing.

7. An imaging device according to any one of claims 4 to 6, A lens is provided on the housing so as to be visible from the housing, which receives light from outside the housing and emits it onto the image sensor, An imaging device having

8. The imaging apparatus according to claim 7, The angle of view of the aforementioned lens is 180 degrees or more. Imaging device.

9. An imaging apparatus according to claim 7 or 8, An imaging device that allows a cooling fan to be positioned off-axis from the optical axis of the lens, which draws in air from the intake port and exhausts it through the flow path to the exhaust port.

10. A housing having an air intake and an exhaust port, A heat dissipation structure having a flow path through which air flows between the intake port and the exhaust port, Multiple heat sources are provided within the housing, isolated from the aforementioned flow path, A housing provided within the aforementioned enclosure, which encloses and houses the plurality of heat sources, The enclosure has a plurality of heat dissipation members provided on the outside of the housing within the housing, through which heat from the plurality of heat sources is conducted, The heat dissipation structure comprises the inside of the housing and the housing, which constitute the flow path. Imaging device.

11. The imaging apparatus according to claim 10, The flow path is formed such that air flows from the intake port, through the plurality of heat dissipation members, toward the exhaust port. Imaging device.

12. An imaging device according to claim 10 or 11, The first electric heating member among the plurality of heat dissipation members is provided with a first heat sink through which heat generated by the image sensor among the plurality of heat sources is conducted, with a portion of the heat sink exposed to the outside of the housing, thereby conducting the heat generated by the image sensor. The second electric heating member among the plurality of heat dissipation members is provided with a second heat sink through which heat generated in the circuit among the plurality of heat sources is conducted, with a portion of the heat sink exposed to the outside of the housing, thereby conducting the heat generated in the circuit. Imaging device.

13. An imaging device according to any one of claims 10 to 12, The plurality of heat dissipation members are provided on the intake port side within the housing. Imaging device.

14. An imaging device according to any one of claims 10 to 13, The housing has other air intake ports, The heat dissipation structure includes a first flow path that draws in air from the intake port, passes through the first surface of the housing, and exhausts it to the exhaust port, and a second flow path that draws in air from another intake port, passes through a second surface of the housing different from the first surface, and exhausts it to the exhaust port, An imaging device having

15. The imaging apparatus according to claim 14, The housing is an imaging device having the intake port and the other intake port on a specific outer surface of the housing.

16. An imaging device according to any one of claims 10 to 15, The aforementioned plurality of heat sources include an image sensor that converts light from outside the housing into an electrical signal, and a signal processing unit that processes the electrical signal. Imaging device.

17. The imaging device according to claim 16, A lens is provided on the housing so as to be visible from the housing, which receives light from outside the housing and emits it onto the image sensor, An imaging device having

18. The imaging apparatus according to claim 17, The angle of view of the aforementioned lens is 180 degrees or more. Imaging device.

19. An imaging apparatus according to claim 17 or 18, A cooling fan can be positioned off-axis from the optical axis of the lens, drawing in air from the intake port and exhausting it through the flow path to the exhaust port. Imaging device.

20. An imaging device according to any one of claims 13 to 15, The plurality of heat sources include a first image sensor that converts light from outside the housing into a first electrical signal, a second image sensor that converts light from outside the housing into a second electrical signal, and a signal processing unit that processes the first electrical signal and the second electrical signal. Imaging device.

21. The imaging apparatus according to claim 20, A first lens is provided in the housing so as to be visible from the housing, and receives light from outside the housing and emits it to the first image sensor, A second lens is provided in the housing so as to be exposed from the housing on the opposite side from the first lens, and receives light from outside the housing and emits it to the second image sensor, An imaging device having

22. The imaging apparatus according to claim 21, An imaging device in which at least one of the first lens and the second lens has a field of view of 180 degrees or more.

23. The imaging apparatus according to claim 21, An imaging device that combines images obtained from the first image sensor and the second image sensor to produce a 360-degree spherical image.

24. An imaging device according to any one of claims 21 to 23, A cooling fan can be positioned off-axis from the optical axes of the first and second lenses, drawing in air from the intake port and exhausting it through the flow path to the exhaust port. Imaging device.

Images