Connection structure, vehicle and power module

Abstract

This provides a connection structure that allows for easy connection of two terminals, each having a laminated structure. [Solution] The connection structure A1 comprises a first terminal 3, a second terminal 7, and a conductive member D1. The first terminal 3 has a lower wiring 32 and an upper wiring 33 laminated together via a first insulating layer 31. The second terminal 7 has an upper wiring 72 and a lower wiring 73 laminated together via a second insulating layer 71. The conductive member D1 makes the lower wiring 32 and the upper wiring 72 electrically connected. The first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. The lower wiring 32 is located on the z1 side of the first direction z with respect to the upper wiring 33. The upper wiring 72 is located on the z2 side of the first direction z with respect to the lower wiring 73. The upper wiring 33 and the lower wiring 73 are in contact with each other.

Description

Technical Field

[0001] The present disclosure relates to a connection structure, a vehicle, and a power module.

Background Art

[0002] Conventionally, power modules including switching elements such as MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and IGBTs (Insulated Gate Bipolar Transistors) are known. Patent Document 1 discloses an example of a conventional power module (semiconductor device). The semiconductor device described in Patent Document 1 includes a plurality of switching elements, two input terminals, an insulating member, and a sealing resin. The plurality of switching elements are covered with the sealing resin. The two input terminals protrude from the sealing resin. A power supply voltage is applied between the two input terminals. The input power supply voltage is converted into, for example, an alternating voltage by the switching operation of the plurality of switching elements. The insulating member is a flat plate. The two input terminals are arranged with the insulating member interposed therebetween and are insulated from each other by the insulating member. In the semiconductor device described in Patent Document 1, the two input terminals are laminated via the insulating member. With this lamination structure, the inductance of the semiconductor device can be reduced.

[0003] Furthermore, Patent Document 1 discloses a configuration that includes a busbar. The busbar is connected to two input terminals. The busbar includes two supply terminals and an insulator. One of the two supply terminals conducts to one of the two input terminals, and the other of the two supply terminals conducts to the other of the two input terminals. The two supply terminals are connected to the two input terminals and also to a DC power supply. The aforementioned power supply voltage is applied from the DC power supply to the two input terminals via the busbar. The two supply terminals are arranged with an insulator in between and are insulated from each other by the insulator. The busbar described in Patent Document 1 has a structure in which the two supply terminals are laminated with an insulator in between. This laminated structure can reduce the inductance in the conduction path from the DC power supply to the semiconductor device (two input terminals). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] International Publication No. WO2020 / 045263 [Overview of the project] [Problems that the invention aims to solve]

[0005] In the configuration described in Patent Document 1, the connection between the terminals of the semiconductor device (two input terminals) and the terminals of the DC power supply (two supply terminals) involves the two supply terminals sandwiching the two input terminals. In this case, the distance between the two supply terminals changes depending on the thickness of the two input terminals, so the busbar design needs to be reviewed in accordance with changes in the specifications of the semiconductor device. Furthermore, in fixing the terminals of the semiconductor device (two input terminals) and the terminals of the DC power supply (two supply terminals), the two supply terminals are individually welded to the two input terminals. In this case, there is a concern that costs will increase due to the introduction of welding equipment. Thus, in the configuration described in Patent Document 1, there was still room for improvement in the connection between the terminals of the semiconductor device (two input terminals) and the terminals of the DC power supply (two supply terminals).

[0006] This disclosure was conceived in view of the above circumstances, and its purpose is to provide a connection structure that allows for easy connection of two terminals, each having a laminated structure. Another purpose of this disclosure is to provide a power module that allows for easy connection of a terminal having a laminated structure to another terminal, which also has a laminated structure. [Means for solving the problem]

[0007] A connection structure provided by a first aspect of the present disclosure comprises a first terminal having a first wiring and a second wiring laminated through a first insulating layer, a second terminal having a third wiring and a fourth wiring laminated through a second insulating layer, and a conductive member for connecting the first wiring and the third wiring, wherein the first terminal and the second terminal overlap when viewed in a first direction, the first wiring is located on one side of the first direction relative to the second wiring, the third wiring is located on the other side of the first direction relative to the fourth wiring, and the second wiring and the fourth wiring are in contact with each other.

[0008] In a preferred embodiment of the connection structure, the power module further comprises a switching element that conducts to the first terminal, and a sealing resin that covers a part of the first terminal and the switching element, wherein the first terminal includes an exposed portion protruding from the sealing resin, the exposed portion overlapping the second terminal when viewed in the first direction, and the first terminal, the switching element, and the sealing resin constitute a power module.

[0009] A vehicle provided by a second aspect of this disclosure comprises a power source and a connection structure provided by the first aspect, wherein the power module is electrically connected to the power source.

[0010] A power module provided by a third aspect of the present disclosure comprises a switching element, a sealing resin covering the switching element, and a terminal having two wires laminated to it via an insulating layer, the terminal including an exposed portion exposed from the sealing resin, the exposed portion having a through hole extending from one of the two wires to the other. [Effects of the Invention]

[0011] The connection structure of this disclosure makes it possible to easily connect two terminals (a first terminal and a second terminal), each having a laminated structure. Furthermore, the power module of this disclosure makes it possible to easily connect one terminal having a laminated structure to another terminal having a laminated structure. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1 is a perspective view showing the connection structure according to the first embodiment. [Figure 2] Figure 2 is a perspective view of Figure 1, viewed from the bottom. [Figure 3] Figure 3 is a plan view showing the connection structure according to the first embodiment. [Figure 4] Figure 4 is a plan view of Figure 3, with the upper wiring and conductive member of the second terminal omitted. [Figure 5] Figure 5 is a plan view of Figure 4 with the second insulating layer omitted. [Figure 6] Figure 6 is a bottom view showing the connection structure according to the first embodiment. [Figure 7] Figure 7 is a bottom view of Figure 6, with the lower wiring and conductive member of the first terminal omitted. [Figure 8] Figure 8 is a bottom view of Figure 7, with the first insulating layer omitted. [Figure 9] Figure 9 is a partially enlarged view showing a side view (right side view) of the connection structure according to the first embodiment. [Figure 10] Figure 10 is a partial cross-sectional view along line XX in Figure 3. [Figure 11] Figure 11 is a cross-sectional view along the line XI-XI in Figure 3. [Figure 12] Figure 12 shows an example of the circuit configuration of the connection structure (power module and snubber circuit) according to the first embodiment. [Figure 13]FIG. 13 is a perspective view showing a configuration example of a power module, with the encapsulating resin omitted. [Figure 14] FIG. 14 is a plan view showing a configuration example of a power module, with the encapsulating resin indicated by phantom lines. [Figure 15] FIG. 15 is a view showing the plan view shown in FIG. 14, in which the encapsulating resin, the upper wiring of the first terminal, one of the pair of output wirings, the plurality of signal wirings, the plurality of signal terminals, and the plurality of connection members are omitted, and the first insulating layer is indicated by phantom lines. [Figure 16] FIG. 16 is a cross-sectional view taken along line XVI-XVI of FIG. 14, with the plurality of connection members omitted. [Figure 17] FIG. 17 is a schematic view showing a vehicle equipped with the connection structure according to the first embodiment. [Figure 18] FIG. 18 is a cross-sectional view showing a connection structure according to a modified example of the first embodiment. [Figure 19] FIG. 19 is a plan view showing a connection structure according to the second embodiment. [Figure 20] FIG. 20 is a bottom view showing a connection structure according to the second embodiment. [Figure 21] FIG. 21 is a cross-sectional view taken along line XXI-XXI of FIG. 19, corresponding to the cross-section of FIG. 10. [Figure 22] FIG. 22 is a plan view showing a connection structure according to the third embodiment. [Figure 23] FIG. 23 is a bottom view showing a connection structure according to the third embodiment. [Figure 24] FIG. 24 is a cross-sectional view taken along line XXIV-XXIV of FIG. 22, corresponding to the cross-section of FIG. 11. [Figure 25] FIG. 25 is a cross-sectional view showing a connection structure according to a modified example of the third embodiment, corresponding to the cross-section of FIG. 24. [Figure 26] FIG. 26 is a cross-sectional view showing a connection structure according to the fourth embodiment, corresponding to the cross-section of FIG. 11. [Figure 27] FIG. 27 is a cross-sectional view showing a connection structure according to a modified example, corresponding to the cross-section of FIG. 10. [Figure 28]Figure 28 is a perspective view showing a modified power module. [Modes for carrying out the invention]

[0013] Preferred embodiments of the connection structures, vehicles, and power modules of the present disclosure will be described below with reference to the drawings. Hereafter, identical or similar components will be denoted by the same reference numerals, and redundant descriptions will be omitted. The terms "first," "second," "third," etc., used in this disclosure are used merely as labels and are not necessarily intended to assign a sequence to the objects.

[0014] In this disclosure, "object A is formed on object B" and "object A is formed on object B" include, unless otherwise specified, "object A is directly formed on object B" and "object A is formed on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" and "object A is located on object B" include, unless otherwise specified, "object A is directly located on object B" and "object A is located on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" includes, unless otherwise specified, "object A is located on object B in contact with object B" and "object A is located on object B with another object interposed between object A and object B." Furthermore, "object A overlaps with object B when viewed from a certain direction" includes, unless otherwise specified, "object A overlaps with all of object B" and "object A overlaps with a part of object B." Also, "object A (or its material) contains material C" includes "object A (or its material) consists of material C" and "the main component of object A (or its material) is material C."

[0015] <First Embodiment> Figures 1 to 12 show a connection structure A1 according to the first embodiment. The connection structure A1 comprises a power module B1, a snubber circuit C1, and a conductive member D1. The connection structure A1 is a structure that connects the power module B1 and the snubber circuit C1 using the conductive member D1.

[0016] For the sake of explanation, we will refer to the mutually orthogonal first direction z, second direction x, and third direction y. The first direction z corresponds to the thickness direction of the connection structure A1. In the following explanation, one side of the first direction z will be referred to as the z1 side, and the other side as the z2 side. The z1 side of the first direction z may be referred to as downward, and the z2 side of the first direction z may be referred to as upward. However, terms such as "up," "down," "upper," "downward," "upper surface," and "lower surface" indicate the relative positional relationship of each component in the first direction z, and do not necessarily define a relationship with the direction of gravity.

[0017] Power module B1 comprises multiple switching elements 1, a sealing resin 2, a first terminal 3, and an output terminal 4. Power module B1 converts the power input to the first terminal 3 and outputs the converted power from the output terminal 4.

[0018] Multiple switching elements 1 are covered with a sealing resin 2. Each of the multiple switching elements 1 is, for example, a MOSFET. In the following explanation, we will assume that each of the multiple switching elements 1 is a MOSFET, but each of the multiple switching elements 1 may be a field-effect transistor including a MISFET (Metal-Insulator-Semiconductor FET), or a bipolar transistor including an IGBT, instead of a MOSFET. In this case, the drain, source, and gate of the MOSFET can be replaced with the corresponding electrodes of the other switching element (for example, when using an IGBT as the switching element 1, the drain, source, and gate correspond to the collector, emitter, and base, respectively).

[0019] As shown in Figure 12, the multiple switching elements 1 include multiple first elements 11 and multiple second elements 12. As shown in Figure 12, the multiple first elements 11 are electrically connected in parallel with each other, and the multiple second elements 12 are electrically connected in parallel with each other. Each first element 11 and each second element 12 is connected in series. In the illustrated example, the power module B1 comprises four first elements 11 and four second elements 12. The number of each first element 11 and second element 12 is not limited to this configuration and can be appropriately changed according to the performance required of the power module B1. In the example shown in Figure 12, the multiple first elements 11 constitute the upper arm circuit of the power module B1, and the multiple second elements 12 constitute the lower arm circuit of the power module B1. Therefore, the power module B1 is configured as, for example, a half-bridge type switching circuit. Note that in examples with a circuit configuration different from that shown in Figure 12, each of the multiple first elements 11 may be a diode instead of a MOSFET. Alternatively, each of the multiple second elements 12 may be a diode instead of a MOSFET.

[0020] The sealing resin 2 covers multiple switching elements 1, a portion of the first terminal 3, and a portion of the output terminal 4. The sealing resin 2 is made of an insulating resin material such as epoxy resin. As shown in Figures 3 to 8, the sealing resin 2 is rectangular when viewed in the first direction z.

[0021] The sealing resin 2 has a resin main surface 21, a resin back surface 22, and a plurality of resin side surfaces 231, 232. The resin main surface 21 and the resin back surface 22 are spaced apart in the first direction z. The resin main surface 21 faces the z2 side in the first direction z, and the resin back surface 22 faces the z1 side in the first direction z. A pair of resin side surfaces 231 are spaced apart in the third direction y. The pair of resin side surfaces 231 face opposite each other in the third direction y. The first terminal 3 protrudes from the resin side surface 231 of the pair of resin side surfaces 231 that faces the y1 side in the third direction y. A pair of resin side surfaces 232 are spaced apart in the second direction x. The pair of resin side surfaces 232 face opposite each other in the second direction x. As shown in Figures 3 to 8, a notch 24 is formed in one of the pair of resin side surfaces 232. As shown in Figures 3 to 8, the output terminal 4 is exposed at the notch 24.

[0022] The first terminal 3 protrudes from the sealing resin 2. As shown in Figure 10, the first terminal 3 includes a portion covered by the sealing resin 2 and an exposed portion 3a protruding from the sealing resin 2. As shown in Figures 6 to 8, the exposed portion 3a overlaps with the second terminal 7 when viewed in the first direction z.

[0023] The first terminal 3 comprises a first insulating layer 31, a lower wiring 32, an upper wiring 33, and a first insulator 34. In the first terminal 3, the lower wiring 32 and the upper wiring 33 are laminated together via the first insulating layer 31. As can be understood from the configuration described in detail later, in this embodiment, the lower wiring 32 is an example of the "first wiring" described in the claims, and the upper wiring 33 is an example of the "second wiring" described in the claims.

[0024] The first insulating layer 31 is sandwiched between the lower wiring 32 and the upper wiring 33 in the first direction z. In the exposed portion 3a, the first insulating layer 31 is rectangular in shape when viewed in the first direction z. The first insulating layer 31 is made of, for example, glass epoxy resin. The first insulating layer 31 may be made of a ceramic other than glass epoxy resin, for example, AlN (aluminum nitride), SiN (silicon nitride), or Al2O3 (aluminum oxide). In the exposed portion 3a, the first insulating layer 31 is larger than each of the lower wiring 32 and the upper wiring 33 when viewed in the first direction z.

[0025] The lower wiring 32 is electrically connected to each drain of the multiple first elements 11. In the first direction z, the lower wiring 32 is positioned further away from the second terminal 7 than the upper wiring 33. The lower wiring 32 is formed on the lower surface of the first insulating layer 31 (the surface facing the z1 side in the first direction z). The lower wiring 32 is located on the z1 side in the first direction z relative to the upper wiring 33. The constituent material of the lower wiring 32 is not limited in any way, but may include copper, for example.

[0026] The upper wiring 33 is conductive to each source of the multiple second elements 12. The upper wiring 33 is formed on the upper surface of the first insulating layer 31 (the surface facing the z2 side in the first direction z). The upper wiring 33 is located on the z2 side in the first direction z relative to the lower wiring 32. The constituent material of the upper wiring 33 is not limited in any way, but may include copper, for example. The thickness of the lower wiring 32 (dimension in the first direction z) and the thickness of the upper wiring 33 (dimension in the first direction z) are, for example, the same, but they may be different.

[0027] The lower wiring 32 and the upper wiring 33 are connected to, for example, an external DC power supply via a snubber circuit C1, and a power supply voltage (DC voltage) is applied. The power supply voltage (DC voltage) applied between the lower wiring 32 and the upper wiring 33 is converted to an AC voltage by the switching operations of the multiple first elements 11 and the multiple second elements 12. In the exposed portion 3a, the lower wiring 32 is a P terminal electrically connected to the positive terminal of the aforementioned DC power supply, and the upper wiring 33 is an N terminal electrically connected to the negative terminal of the aforementioned DC power supply.

[0028] The first terminal 3 has a first through-hole 30 formed therein. The first through-hole 30 penetrates the first terminal 3 in the first direction z. The first through-hole 30 extends from the lower wiring 32 through the first insulating layer 31 to the upper wiring 33. A conductive member D1 is inserted through the first through-hole 30.

[0029] As shown in Figures 10 and 11, the first through-hole 30 has three openings 301, 302, and 303. Opening 301 is formed in the first insulating layer 31. Opening 302 is formed in the lower wiring 32. Opening 303 is formed in the upper wiring 33. In the illustrated example, each of the three openings 301, 302, and 303 is circular when viewed in the first direction z. The central axes of the three openings 301, 302, and 303 overlap each other. The diameters of two openings 301 and 302 are the same, and the diameter of opening 303 is larger than the diameters of the two openings 301 and 302.

[0030] The first insulator 34 insulates the upper wiring 33 from the conductive member D1. The first insulator 34 fills the opening 303. The conductive member D1 penetrates the first insulator 34. As shown in Figure 10, the first insulator 34 has an opening 341 through which the conductive member D1 is inserted. The opening 341 overlaps the opening 302 when viewed in the first direction z.

[0031] The output terminal 4 is exposed from the sealing resin 2. In the illustrated example, the output terminal 4 is exposed in the notch 24, but it may also be configured to protrude from the sealing resin 2, as in this example. The output terminal 4 includes a pair of output wires 41 and 42. In the output terminal 4, the pair of output wires 41 and 42 are laminated via the first insulating layer 31. As shown in Figure 12, the pair of output wires 41 and 42 are conductive to the respective sources of the plurality of first elements 11 and the respective drains of the plurality of second elements 12. The voltages (AC voltages) converted by the switching operations of the plurality of first elements 11 and the plurality of second elements 12 are output from the pair of output wires 41 and 42.

[0032] Figures 13 to 16 show an example of the internal configuration of power module B1. As shown in Figures 13 to 16, power module B1 includes a plurality of switching elements 1, a sealing resin 2, a first terminal 3 and an output terminal 4, as well as a support member 51, a plurality of signal wires 521, a plurality of metal members 522, a plurality of signal terminals 53 and a plurality of connecting members 54. Note that the internal configuration of power module B1 described below is just one example and is not limited to the circuit shown in Figure 12.

[0033] As shown in Figures 15 and 16, the support member 51 comprises a pair of conductive plates 511, 512 and a pair of insulating plates 513, 514.

[0034] The pair of conductive plates 511, 512 are made of a conductive material, which is, for example, copper or a copper alloy. The pair of conductive plates 511, 512 may be a laminate in which layers of copper and layers of molybdenum are alternately stacked in the first direction z. Multiple first elements 11 are mounted on the conductive plate 511. Each drain of the multiple first elements 11 is electrically connected to each other via the conductive plate 511. As shown in Figure 16, the lower wiring 32 is in contact with the conductive plate 511. Multiple second elements 12 are mounted on the conductive plate 512. Each drain of the multiple second elements 12 is electrically connected to each other via the conductive plate 512. As shown in Figure 16, the output wiring 42 is in contact with the conductive plate 512.

[0035] The pair of insulating plates 513 and 514 are each made of an insulating material, which is, for example, Al2O3. Insulating plate 513 supports conductive plate 511, and insulating plate 514 supports conductive plate 512. The lower surfaces of the pair of insulating plates 513 and 514 (the surfaces facing z1 in the first direction z) are exposed in the sealing resin 2 (resin back surface 22).

[0036] Multiple signal lines 521 are formed inside the sealing resin 2 on the upper surface of the first insulating layer 31 (the surface facing the z2 side in the first direction z), as shown in Figures 14 and 16. The multiple signal lines 521 include those that transmit gate signals of multiple first elements 11, those that transmit gate signals of multiple second elements 12, those that transmit source sense signals of multiple first elements 11, and those that transmit source sense signals of multiple second elements 12.

[0037] The multiple metal members 522 extend in the first direction z from the output wiring 41 through the first insulating layer 31 to the output wiring 42, as shown in Figure 16. The multiple metal members 522 provide electrical conductivity to the pair of output wirings 41 and 42, which are arranged with the first insulating layer 31 in between.

[0038] Each of the multiple signal terminals 53 includes a portion covered by the sealing resin 2 and a portion exposed from the sealing resin 2. Each of the multiple signal terminals 53 is electrically connected to one of the multiple signal wirings 521 inside the sealing resin 2. As shown in Figure 12, the multiple signal terminals 53 include those that are electrically connected to the gates of multiple first elements 11, those that are electrically connected to the gate signals of multiple second elements 12, those that are electrically connected to the sources of multiple first elements 11, those that are electrically connected to the sources of multiple second elements 12, and those that are electrically connected to the drains of multiple first elements 11.

[0039] Each of the multiple connecting members 54 provides electrical conductivity between two separate parts. In the illustrated example, each of the multiple connecting members 54 is a bonding wire. As shown in Figure 14, the multiple connecting members 54 include those that connect each source of the multiple first elements 11 to the output wiring 41, those that connect each source of the multiple second elements 12 to the upper wiring 33, and those that connect each gate and each source of the multiple first elements 11 and each gate and each source of the multiple second elements 12 to any of the multiple signal wirings 521.

[0040] The snubber circuit C1 comprises a main body 6 and a second terminal 7. In the example shown in Figure 12, the snubber circuit C1 is connected to an external DC power supply.

[0041] The main body 6 includes, for example, a capacitor 61. In this embodiment, the snubber circuit C1 is configured as a C snubber circuit. In configurations different from this embodiment, the main body 6 may further include a resistor. In this example, the snubber circuit is configured as an RC snubber circuit. Furthermore, the main body 6 may further include a diode in addition to the resistor. In this example, the snubber circuit is configured as an RCD snubber circuit. The capacitor 61 has a pair of electrodes 611 and 612. Electrode 611 is connected to the high-potential terminal of the DC power supply, and electrode 612 is connected to the low-potential terminal of the DC power supply.

[0042] The second terminal 7 protrudes from the main body 6. When viewed in the first direction z, the second terminal 7 overlaps with the first terminal 3. In the illustrated example, the second terminal 7 is located on the z2 side of the first direction z relative to the first terminal 3. The second terminal 7 comprises a second insulating layer 71, an upper wiring 72, a lower wiring 73, and a second insulator 74. In the second terminal 7, the upper wiring 72 and the lower wiring 73 are laminated via the second insulating layer 71. As can be understood from the configuration described in detail later, in this embodiment, the upper wiring 72 is an example of the "third wiring" described in the claims, and the lower wiring 73 is an example of the "fourth wiring" described in the claims.

[0043] The second insulating layer 71 is sandwiched between the upper wiring 72 and the lower wiring 73 in the first direction z. The second insulating layer 71 is made of an insulating material. The second insulating layer 71 may be in the form of a plate or a sheet. The second insulating layer 71 is rectangular when viewed in the first direction z. The second insulating layer 71 is larger than each of the upper wiring 72 and the lower wiring 73 when viewed in the first direction z.

[0044] As shown in Figure 12, the upper wiring 72 is electrically connected to the electrode 611 of the capacitor 61. In the first direction z, the upper wiring 72 is positioned further away from the first terminal 3 than the lower wiring 73. The upper wiring 72 is formed on the upper surface of the second insulating layer 71 (the surface facing the z2 side in the first direction z). The upper wiring 72 is located on the z2 side in the first direction z relative to the lower wiring 73. The upper wiring 72 is electrically connected to the lower wiring 32 via the conductive member D1.

[0045] As shown in Figure 12, the lower wiring 73 is electrically connected to the electrode 612 of the capacitor 61. The lower wiring 73 is formed on the lower surface of the second insulating layer 71 (the surface facing the z1 side in the first direction z). The lower wiring 73 is located on the z1 side in the first direction z relative to the upper wiring 72. The lower surface of the lower wiring 73 (the surface facing the z1 side in the first direction z) is in contact with the upper surface of the upper wiring 33 (the surface facing the z2 side in the first direction z). The thickness of the upper wiring 72 (dimension in the first direction z) and the thickness of the lower wiring 73 (dimension in the first direction z) are, for example, the same, but they may be different.

[0046] The second terminal 7 has a second through-hole 70 formed therein. The second through-hole 70 penetrates the second terminal 7 in the first direction z. The second through-hole 70 extends from the upper wiring 72 through the second insulating layer 71 to the lower wiring 73. A conductive member D1 is inserted through the second through-hole 70.

[0047] As shown in Figures 10 and 11, the second through-hole 70 has three openings 701, 702, and 703. Opening 701 is formed in the second insulating layer 71. Opening 702 is formed in the upper wiring 72. Opening 703 is formed in the lower wiring 73. In the illustrated example, the three openings 701, 702, and 703 are each circular when viewed in the first direction z. The central axes of the three openings 701, 702, and 703 overlap with each other. Also, the central axes of the three openings 701, 702, and 703 overlap with the central axes of the aforementioned three openings 301, 302, and 303. The diameters of the two openings 701 and 702 are the same, and the diameter of opening 703 is larger than the diameters of the two openings 701 and 702.

[0048] The second insulator 74 insulates the lower wiring 73 from the conductive member D1. The second insulator 74 fills the opening 703. The conductive member D1 penetrates the second insulator 74. As shown in Figure 10, the second insulator 74 has an opening 741 through which the conductive member D1 is inserted. The opening 741 overlaps the opening 702 when viewed in the first direction z.

[0049] The conductive member D1 fixes the first terminal 3 and the second terminal 7 while providing electrical connectivity between the lower wiring 32 and the upper wiring 72. The conductive member D1 is inserted through the first through hole 30 of the first terminal 3 and the second through hole 70 of the second terminal 7. The conductive member D1 is a metal fastening member. The constituent material of the conductive member D1 is not limited, but includes, for example, copper, iron, or aluminum. In this embodiment, the conductive member D1 includes a shaft portion 81 and a pair of head portions 82, 83.

[0050] The shaft portion 81 is inserted through the first through hole 30 and the second through hole 70. The shaft portion 81 is cylindrical. The diameters of the two openings 301 and 302 and the two openings 701 and 702 are the same as or slightly larger than the outer diameter of the shaft portion 81 as viewed in the first direction z. Therefore, the shaft portion 81 is in contact with or slightly separated from the inner surfaces of the two openings 301 and 302 and the inner surfaces of the two openings 701 and 702. In contrast, the diameters of opening 303 and 703 are larger than the outer diameter of the shaft portion 81 as viewed in the first direction z.

[0051] The head portion 82 is connected to the shaft portion 81 and is integrally formed with the shaft portion 81. The head portion 82 is in contact with the upper wiring 72 of the second terminal 7. The outer diameter of the head portion 82 is larger than the diameter of the opening 302 and the diameter of the opening 702. In this embodiment, the shaft portion 81 and the head portion 82 are metal bolts, and the shaft portion 81 has male threads cut into it.

[0052] The head 83 is attached to the shaft 81. The head 83 is in contact with the lower wiring 32 of the first terminal 3. The outer diameter of the head 83 is larger than the diameter of the opening 302 and the diameter of the opening 702. In this embodiment, the head 83 is a metal nut, and the head 83 has a female thread that corresponds to the male thread formed on the shaft 81. Therefore, by tightening the head 83, the distance between the pair of heads 82 and 83 is reduced, and the first terminal 3 and the second terminal 7 can be clamped together while the upper wiring 33 of the first terminal 3 and the lower wiring 73 of the second terminal 7 are in close contact.

[0053] In an example different from the configuration described above, the conductive member D1 may have its head 82 in contact with the lower wiring 32 and its head 83 in contact with the upper wiring 72. In other words, the second terminal 7 (lower wiring 32) side may be fastened with a nut.

[0054] Next, a vehicle V equipped with the connection structure A1 will be described based on Figure 17. Vehicle V is, for example, an electric vehicle (EV).

[0055] As shown in Figure 17, the vehicle V is equipped with an on-board charger 91, a battery 92, and a drive system 93. Power is supplied to the on-board charger 91 wirelessly from a power supply facility (not shown) installed outdoors. Alternatively, the means of supplying power from the power supply facility to the on-board charger 91 may be wired. The on-board charger 91 is configured with a boost-type DC-DC converter. The voltage of the power supplied to the on-board charger 91 is boosted by the converter and then supplied to the battery 92. The boosted voltage is, for example, 600V.

[0056] The drive system 93 drives the vehicle V. The drive system 93 includes an inverter 931 and a power source 932. The power module B1 and snubber circuit C1 described above constitute part of the inverter 931. Power stored in the battery 92 is supplied to the inverter 931. The power supplied from the battery 92 to the inverter 931 is DC power. In addition, unlike the power system shown in Figure 17, a boost DC-DC converter may be further provided between the battery 92 and the inverter 931. The inverter 931 converts DC power to AC power. The inverter 931 is conductive to the power source 932. In the inverter 931, the power module B1 is connected to the power source 932 side, and the snubber circuit C1 is connected to the battery 92 side. Therefore, the DC power supplied from the battery 92 is input to the power module B1 via the snubber circuit C1 and converted to AC power in the power module B1. The drive source 932 includes an AC motor and a transmission. When AC power converted by the inverter 931 is supplied to the drive source 932, the AC motor rotates, and this rotation is transmitted to the transmission. The transmission reduces the rotational speed transmitted from the AC motor as appropriate and rotates the drive shaft of the vehicle V. This drives the vehicle V. In driving the vehicle V, it is necessary to freely control the rotational speed of the AC motor based on information such as the amount of fluctuation of the accelerator pedal. Therefore, the power module B1 in the inverter 931 is necessary to output AC power whose frequency is appropriately changed in order to correspond to the required rotational speed of the AC motor.

[0057] The operation and effects of the connection structure A1, the vehicle V equipped with the connection structure A1, and the power module B1 provided by the connection structure A1 according to the first embodiment are as follows.

[0058] The connection structure A1 has the following configuration: Firstly, it includes a conductive member D1 that connects the lower wiring 32 and the upper wiring 72. Secondly, the first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. Thirdly, the upper wiring 33 and the lower wiring 73 are in contact with each other. With this configuration, when the first terminal 3 and the second terminal 7 are superimposed, the lower wiring 32 and the upper wiring 72 are electrically connected, and the upper wiring 33 and the lower wiring 73 are electrically connected. Therefore, the connection structure A1 makes it possible to easily connect the first terminal 3 and the second terminal 7, which are each laminated structures.

[0059] In connection structure A1, the first terminal 3 and the second terminal 7 are fixed together by a conductive member D1. With this configuration, the conductive member D1 allows the lower wiring 32 and the upper wiring 72 to be electrically connected, and also fixes the first terminal 3 and the second terminal 7 together. In other words, connection structure A1 makes it possible to connect the first terminal 3 and the second terminal 7 even more easily.

[0060] In connection structure A1, the first terminal 3 has a first through hole 30, and the second terminal 7 has a second through hole 70. A conductive member D1 is inserted through the first through hole 30 and the second through hole 70. In the conductive member D1 of connection structure A1, the shaft portion 81 and the head portion 82 are metal bolts, and the head portion 83 is a metal nut. With this configuration, by inserting the shaft portion 81 through the first through hole 30 and the second through hole 70, and tightening the head portion 83 (nut) onto the shaft portion 81, a force is generated between the two head portions 82 and 83 that clamps the first terminal 3 and the second terminal 7. Therefore, connection structure A1 can fix the first terminal 3 and the second terminal 7 while providing electrical conductivity between the lower wiring 32 and the upper wiring 72.

[0061] In connection structure A1, the first through hole 30 has three openings 301, 302, and 303. Of these, the opening 303 formed in the upper wiring 33 is larger than the opening 302 formed in the lower wiring 32 when viewed in the first direction z. This configuration makes it possible to separate the upper wiring 33 from the shaft portion 81, thereby insulating the upper wiring 33 from the conductive member D1.

[0062] The connection structure A1 includes a first insulator 34. In connection structure A1, the attachment of the conductive member D1 to fix the first terminal 3 and the second terminal 7 generates a pressing force from the head 83 to the lower wiring 32 in the first direction z towards z2. If the first insulator 34 were not provided, the opening 303 would be a gap. Therefore, as shown in Figures 10 and 11, if the diameter of the head 83 is larger than the diameter of the opening 303, this pressing force may cause the first insulating layer 31 and the lower wiring 32 to bend due to the attachment of the conductive member D1. In contrast, in connection structure A1, since the first insulator 34 fills the opening 303, there is no space for the first insulating layer 31 and the lower wiring 32 to bend. Therefore, even if a pressing force is generated from the head 83 to the lower wiring 32 in the first direction z towards z2, the first insulator 34 can suppress the bending of the first insulating layer 31 and the lower wiring 32. Furthermore, since the deflection of the first insulating layer 31 and the lower wiring 32 can be suppressed, the attachment of the conductive member D1 can be made more secure. In addition, since the first insulator 34 is interposed between the upper wiring 33 and the shaft portion 81, the connection structure A1 can improve the dielectric strength between the upper wiring 33 and the conductive member D1.

[0063] In connection structure A1, the second through-hole 70 has three openings 701, 702, and 703. Of these, the opening 703 formed in the lower wiring 73 is larger than the opening 702 formed in the upper wiring 72 when viewed in the first direction z. This configuration makes it possible to separate the lower wiring 73 from the shaft portion 81, thereby insulating the lower wiring 73 from the conductive member D1.

[0064] The connection structure A1 includes a second insulator 74. In connection structure A1, the attachment of the conductive member D1 to fix the first terminal 3 and the second terminal 7 generates a pressing force from the head 82 to the upper wiring 72 in the first direction z towards z1. If the second insulator 74 were not provided, the opening 703 would be a gap. Therefore, as shown in Figures 10 and 11, if the diameter of the head 82 is larger than the diameter of the opening 703, this pressing force may cause the second insulating layer 71 and the upper wiring 72 to bend due to the attachment of the conductive member D1. In contrast, in connection structure A1, since the second insulator 74 fills the opening 703, there is no space for the second insulating layer 71 and the upper wiring 72 to bend. Therefore, even if a pressing force is generated from the head 82 to the upper wiring 72 in the first direction z towards z1, the second insulator 74 can suppress the bending of the second insulating layer 71 and the upper wiring 72. Furthermore, since the bending of the second insulating layer 71 and the upper wiring 72 can be suppressed, the attachment of the conductive member D1 can be made more secure. In addition, since the second insulator 74 is interposed between the lower wiring 73 and the shaft portion 81, the connection structure A1 can improve the dielectric strength between the lower wiring 73 and the conductive member D1.

[0065] Power module B1 is equipped with a first terminal 3. At the first terminal 3, the lower wiring 32 and the upper wiring 33 are laminated with a first insulating layer 31 in between. The first terminal 3 includes an exposed portion 3a that is exposed from the sealing resin 2, and a first through-hole 30 is formed in the exposed portion 3a, extending from one of the two wirings (lower wiring 32 and upper wiring 33) to the other. With this configuration, the first terminal 3 can be easily connected to the second terminal 7, which is laminated with the upper wiring 72 and lower wiring 73 via a second insulating layer 71. In connection structure A1, the second terminal 7 is a terminal of the snubber circuit C1 and is a busbar that forms the power supply voltage line. In other words, power module B1 can be easily attached to the busbar, which has a laminated structure.

[0066] Other embodiments and variations of the connection structure of the present disclosure are described below. The configurations of the parts in each embodiment and each variation are interchangeable to the extent that no technical inconsistencies arise.

[0067] Figure 18 shows a connection structure A11 according to the first embodiment. The connection structure A11 differs from the connection structure A1 in the configuration of the conductive member D1.

[0068] In the conductive member D1 of the connection structure A11, the shaft portion 81 and the pair of heads 82 and 83 are integrally formed. In this modified example, the conductive member D1 is a rivet. The pair of heads 82 and 83 are formed by crimping.

[0069] Connection structure A11 has the same configuration as connection structure A1. Firstly, it includes a conductive member D1 that connects the lower wiring 32 and the upper wiring 72. Secondly, the first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. Thirdly, the upper wiring 33 and the lower wiring 73 are in contact with each other. Therefore, connection structure A11, like connection structure A11, makes it possible to easily connect the first terminal 3 and the second terminal 7, each of which has a laminate structure. In addition, connection structure A11 has the same effect as connection structure A1 due to its common configuration.

[0070] <Second Embodiment> Figures 19 to 21 show a connection structure A2 according to the second embodiment. Connection structure A2 differs from connection structure A1 in the following respects. Firstly, the first terminal 3 of connection structure A2 does not have a first insulator 34, but has a first protective plate 35. Secondly, the second terminal 7 of connection structure A2 does not have a second insulator 74, but has a second protective plate 75.

[0071] The first protective plate 35 is positioned on the z1 side of the lower wiring 32 in the first direction z. The first protective plate 35 is larger than the opening 303 when viewed in the first direction z. The shape of the first protective plate 35 when viewed in the first direction z is not limited, but in the example shown in Figure 20 it is rectangular. The thickness of the first protective plate 35 (dimension in the first direction z) is, for example, greater than the thickness of the lower wiring 32 (dimension in the first direction z). Unlike this example, the thickness of the first protective plate 35 may be the same as or less than the thickness of the lower wiring 32. The first protective plate 35 contains a conductive material (for example, copper). In this embodiment, as shown in Figure 21, the head 83 is in contact with the first protective plate 35. As shown in Figure 21, the first protective plate 35 has an opening 351 through which the conductive member D1 is inserted. The opening 351 overlaps the opening 302 when viewed in the first direction z.

[0072] The second protective plate 75 is positioned on the z2 side of the upper wiring 72 in the first direction z. The second protective plate 75 is larger than the opening 703 when viewed in the first direction z. The shape of the second protective plate 75 when viewed in the first direction z is not limited, but in the example shown in Figure 19 it is rectangular. The thickness of the second protective plate 75 (dimension in the first direction z) is, for example, greater than the thickness of the upper wiring 72 (dimension in the first direction z). Unlike this example, the thickness of the second protective plate 75 may be the same as or less than the thickness of the upper wiring 72. The second protective plate 75 contains a conductive material (for example, copper). In this embodiment, as shown in Figure 21, the head 82 is in contact with the second protective plate 75. As shown in Figure 21, the second protective plate 75 has an opening 751 through which the conductive member D1 is inserted. The opening 751 overlaps the opening 702 when viewed in the first direction z.

[0073] Connection structure A2 has the same configuration as connection structure A1. Firstly, it includes a conductive member D1 that connects the lower wiring 32 and the upper wiring 72. Secondly, the first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. Thirdly, the upper wiring 33 and the lower wiring 73 are in contact with each other. Therefore, connection structure A2, like connection structure A1, makes it possible to easily connect the first terminal 3 and the second terminal 7, each of which has a laminate structure. In addition, connection structure A2 has the same configuration as connection structure A1 and therefore provides the same effects as connection structure A1.

[0074] The connection structure A2 includes a first protective plate 35. The first protective plate 35 is interposed between the head 83 and the lower wiring 32 and is larger than the opening 303 when viewed in the first direction z. With this configuration, the first protective plate 35 can distribute the pressing force from the head 83 generated by the attachment of the conductive member D1. As a result, the connection structure A2 can suppress the bending of the first insulating layer 31 and the lower wiring 32 without the need for a first insulator 34. Furthermore, since the bending of the first insulating layer 31 and the lower wiring 32 can be suppressed, the attachment of the conductive member D1 can be made more secure.

[0075] The connection structure A2 includes a second protective plate 75. The second protective plate 75 is interposed between the head 82 and the upper wiring 72 and is larger than the opening 703 when viewed in the first direction z. With this configuration, the second protective plate 75 can distribute the pressing force from the head 83 generated by the mounting of the conductive member D1. As a result, the connection structure A2 can suppress the bending of the second insulating layer 71 and the upper wiring 72 without the need for a second insulator 74. Furthermore, since the bending of the second insulating layer 71 and the upper wiring 72 can be suppressed, the mounting of the conductive member D1 can be made more secure.

[0076] In connection structure A2, an example is shown where the first terminal 3 does not have the first insulator 34, but contrary to this example, the first terminal 3 may have the first insulator 34. Similarly, an example is shown where the second terminal 7 does not have the second insulator 74, but contrary to this example, the second terminal 7 may have the second insulator 74.

[0077] <Third Embodiment> Figures 22 to 24 show a connection structure A3 according to the third embodiment. Connection structure A3 differs from connection structure A1 in the following respects: Firstly, the first terminal 3 does not have a first through hole 30. Secondly, the second terminal 7 does not have a second through hole 70. Thirdly, connection structure A3 includes a conductive member D2 instead of a conductive member D1.

[0078] The conductive member D2 is a metal clamping device, and in this embodiment, it is a clip. The conductive member D2 includes a pair of clamping portions 84, 85 and a connecting portion 86.

[0079] As shown in Figure 24, the clamping portion 84 is in contact with the upper wiring 72. The clamping portion 84 presses the upper wiring 72 from the z2 side in the first direction z to the z1 side in the first direction z. As shown in Figure 24, the clamping portion 85 is in contact with the lower wiring 32. The clamping portion 85 presses the lower wiring 32 from the z1 side in the first direction z to the z2 side in the first direction z.

[0080] The connecting portion 86 connects the pair of clamping portions 84 and 85. As shown in Figures 22 to 24, a portion of the connecting portion 86 does not overlap with either the first terminal 3 or the second terminal 7 when viewed in the first direction z, and is spaced apart from the first terminal 3 and the second terminal 7. The pair of clamping portions 84 and 85 are electrically connected via the connecting portion 86.

[0081] Connection structure A3 has the following configuration. Firstly, it includes a conductive member D2 that connects the lower wiring 32 and the upper wiring 72. Secondly, the first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. Thirdly, the upper wiring 33 and the lower wiring 73 are in contact with each other. Therefore, connection structure A3, like connection structures A1 and A2, makes it possible to easily connect the first terminal 3 and the second terminal 7, each of which has a laminate structure. In addition, connection structure A3 has a configuration common to connection structures A1 and A2, and thus achieves the same effects as connection structures A1 and A2.

[0082] In connection structure A3, the conductive member D2 includes a pair of clamping portions 84 and 85. Clamping portion 84 presses the upper wiring 72 from the z2 side in the first direction z to the z1 side in the first direction z, and clamping portion 85 presses the lower wiring 32 from the z1 side in the first direction z to the z2 side in the first direction z. As a result, the first terminal 3 and the second terminal 7 are clamped, and the first terminal 3 and the second terminal 7 can be fixed in place. The conductive member D2 also includes a connecting portion 86 that connects the pair of clamping portions 84 and 85, and the connecting portion 86 does not overlap either the first terminal 3 or the second terminal 7 when viewed in the first direction z, and is spaced apart from the first terminal 3 and the second terminal 7. With this configuration, the lower wiring 32 and the upper wiring 72 can be electrically connected without forming a first through hole 30 in the first terminal 3 or a second through hole 70 in the second terminal 7.

[0083] Figure 25 shows a modified connection structure A31 according to the third embodiment. Connection structure A31 differs from connection structure A3 in the configuration of the conductive member D2.

[0084] The conductive member D2 of the connection structure A31 is, for example, a metal clamping member. As shown in Figure 25, in the conductive member D2 of the connection structure A31, the clamping portion 84 includes a pressing portion 841, a support portion 842, and a movable portion 843. The pressing portion 841, the support portion 842, and the movable portion 843 are electrically connected to each other. The pressing portion 841 is in contact with the upper wiring 72. The pressing portion 841 is connected to and fixed to the movable portion 843. The support portion 842 is connected to the connecting portion 86. The surface of the support portion 842 may be covered with an insulating film. The movable portion 843 can be moved in a first direction z relative to the support portion 842. In accordance with the movement of the movable portion 843 in the first direction z, the pressing portion 841 also moves in the first direction z. The movable part 843 is, for example, threaded with a male screw, and when the movable part 843 is tightened, the pressing part 841 moves to the z1 side in the first direction z. The conductive member D2 of the connection structure A31 can clamp the first terminal 3 and the second terminal 7 with the pair of clamping parts 84 and 85 as the pressing part 841 moves to the z1 side in the first direction z.

[0085] Connection structure A31 has the same configuration as connection structure A3. Firstly, it is equipped with a conductive member D2 that connects the lower wiring 32 and the upper wiring 72. Secondly, the first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. Thirdly, the upper wiring 33 and the lower wiring 73 are in contact with each other. Therefore, connection structure A31, like connection structure A3, makes it possible to easily connect the first terminal 3 and the second terminal 7, each of which has a laminate structure. In addition, connection structure A31 has the same effect as connection structure A3 due to its configuration common to connection structure A3.

[0086] <Fourth Embodiment> Figure 26 shows a connection structure A4 according to the fourth embodiment. Connection structure A4 differs from connection structure A1 in the following respects: Connection structure A4 includes a conductive member D3 and a clamping member E1 instead of a conductive member D1.

[0087] The conductive member D3 is a cylindrical metal body. The conductive member D3 is inserted through the first through hole 30 and the second through hole 70 and is fitted into the two openings 301 and 302 in the first through hole 30 and the two openings 701 and 702 in the second through hole 70.

[0088] In the example shown in Figure 26, the clamping member E1 is configured similarly to the conductive member D2 (clip) of the connection structure A3. Unlike this example, the clamping member E1 may be configured similarly to the conductive member D2 (clamping member) of the connection structure A31. In the example shown in Figure 26, the clamping member E1 is conductive, but it may also be insulating.

[0089] Connection structure A4 has the following configuration. Firstly, it includes a conductive member D3 that connects the lower wiring 32 and the upper wiring 72. Secondly, the first terminal 3 and the second terminal 7 overlap when viewed in the first direction z. Thirdly, the upper wiring 33 and the lower wiring 73 are in contact with each other. Therefore, connection structure A4, like connection structures A1, A2, and A3, makes it possible to easily connect the first terminal 3 and the second terminal 7, each of which has a laminate structure. In addition, connection structure A4 has a configuration common to connection structures A1, A2, and A3, and thus achieves the same effects as connection structures A1, A2, and A3.

[0090] The connection structure A4 includes a clamping member E1. The clamping member E1 clamps the first terminal 3 and the second terminal 7. With this configuration, the first terminal 3 and the second terminal 7 can be fixed by the clamping member E1. Furthermore, as can be understood from this embodiment, in the connection structure of this disclosure, it is not limited whether the member that connects the lower wiring 32 and the upper wiring 72 (conducting member) and the member that fixes the first terminal 3 and the second terminal 7 are the same or different.

[0091] In the above-described first to fourth embodiments (including their modified forms), an example was shown in which the second terminal 7 is superimposed on the first terminal 3. However, conversely, the first terminal 3 may be superimposed on the second terminal 7. Figure 27 shows a connection structure according to such a modified form, in which the first terminal 3 is placed on the second terminal 7 in connection structure A1. In the example shown in Figure 27, the lower wiring 32 and the upper wiring 72 are electrically connected by contact, and the upper wiring 33 and the lower wiring 73 are electrically connected via the conductive member D1. In the example shown in Figure 27, the upper wiring 33 is an example of the "first wiring" described in the claims, the lower wiring 32 is an example of the "second wiring" described in the claims, the lower wiring 73 is an example of the "third wiring" described in the claims, and the upper wiring 72 is an example of the "fourth wiring" described in the claims. Furthermore, in the example shown in Figure 27, the diameter of opening 303 is the same as the diameter of opening 301, and the diameter of opening 302 is larger than the diameters of the two openings 301 and 303. Similarly, in the example shown in Figure 27, the diameter of opening 703 is the same as the diameter of opening 701, and the diameter of opening 702 is larger than the diameters of the two openings 701 and 703. As can be seen from the example shown in Figure 27, the relative positional relationship between the first terminal 3 and the second terminal 7 in the first direction z is not limited in the connection structure of the present disclosure.

[0092] The connection structure of this disclosure is not limited to the case where the power module B1 is connected to the snubber circuit C1, but is also applicable when the power module B1 is directly connected to an external DC power supply. In this example, the DC power supply is provided with a second terminal 7 as a DC voltage supply terminal.

[0093] The connection structure of this disclosure is not limited to the power module B1 described above, but can be appropriately applied to any power module having terminals in which two wires are laminated with an insulating layer. For example, the connection structure of this disclosure can also be adopted in the semiconductor device described in Patent Document 1. Figure 28 shows a power module B2 according to such a modification. As shown in Figure 28, the power module B2 has a first terminal 3 protruding from the sealing resin 2. When the power module B2 is applied to the connection structure A1, a first through hole 30 is formed in the first terminal 3, as shown in Figure 28. On the other hand, when the power module B2 is applied to the connection structure A3, it is not necessary to provide a first through hole 30 in the first terminal 3.

[0094] The connection structures, vehicles, and power modules relating to this disclosure are not limited to the embodiments described above. The specific configurations of each part of the connection structures, vehicles, and power modules relating to this disclosure are subject to various design modifications. For example, the connection structures, vehicles, and power modules relating to this disclosure include embodiments relating to the following appendices. Note 1. A first terminal in which the first wiring and the second wiring are laminated with a first insulating layer, The second terminal, in which the third and fourth wirings are laminated via the second insulating layer, A conductive member that connects the first wiring and the third wiring, Equipped with, The first terminal and the second terminal overlap when viewed in the first direction. The first wiring is located in one of the first directions relative to the second wiring, The third wiring is located in the other direction relative to the fourth wiring, The second wiring and the fourth wiring are connected in contact with each other. Note 2. The connection structure described in Appendix 1, wherein the first terminal and the second terminal are fixed together by the conductive member. Note 3. The first terminal has a first through-hole that extends from the first wiring through the first insulating layer to the second wiring, The second terminal has a second through-hole that extends from the third wiring through the second insulating layer to the fourth wiring, The first through hole and the second through hole overlap when viewed in the first direction, The conductive member is inserted through the first through hole and the second through hole, and is part of the connection structure described in Appendix 1 or Appendix 2. Note 4. The conductive member includes a shaft portion inserted through the first through hole and the second through hole, a first head portion in contact with the first wiring, and a second head portion in contact with the third wiring. The connection structure described in Appendix 3, wherein the first head and the second head are electrically connected via the shaft portion. Note 5. The first through-hole has a first opening formed in the first wiring and a second opening formed in the second wiring. The connection structure according to Appendix 3 or Appendix 4, wherein the second opening is larger than the first opening when viewed in the first direction. Note 6. The first terminal includes a first insulator that insulates the second wiring from the conductive member. The connection structure described in Appendix 5, wherein the first insulator is filled into the second opening. Note 7. The first terminal includes a first protective plate positioned on the opposite side of the second wiring relative to the first wiring in the first direction, The connection structure described in Appendix 5 or Appendix 6, wherein the first protective plate is larger than the second opening when viewed in the first direction. Note 8. The second through-hole has a third opening formed in the third wiring and a fourth opening formed in the fourth wiring. The connection structure according to any one of Appendix 5 to Appendix 7, wherein the fourth opening is larger than the third opening when viewed in the first direction. Note 9. The second terminal is provided with a second insulator that insulates the fourth wiring from the conductive member. The connection structure described in Appendix 8, wherein the second insulator is filled into the fourth opening. Note 10. The second terminal is provided with a second protective plate positioned in the first direction on the side opposite to the fourth wiring relative to the third wiring, The second protective plate is larger than the fourth opening when viewed in the first direction, as described in Appendix 8 or Appendix 9. Note 11. The conductive member includes a pair of clamping portions and a connecting portion that connects the pair of clamping portions. One of the pair of clamping portions presses the first wiring from the one in the first direction to the other in the first direction. The other of the pair of clamping portions presses the third wiring from the other in the first direction to the one in the first direction. The connection structure described in Appendix 1 or Appendix 2, wherein the first terminal and the second terminal are sandwiched between the conductive member. Note 12. The connection structure as described in Appendix 11, wherein a portion of the connecting portion does not overlap with either the first terminal or the second terminal when viewed in the first direction, and is spaced apart from the first terminal and the second terminal. Note 13. A switching element that conducts to the first terminal, The system further comprises a sealing resin covering a part of the first terminal and the switching element, The first terminal includes an exposed portion that protrudes from the sealing resin, The exposed portion overlaps the second terminal when viewed in the first direction. The connection structure described in any one of Appendix 1 to Appendix 12, comprising the first terminal, the switching element, and the sealing resin, constitutes a power module. Note 14. The connection structure described in Appendix 13, wherein the second terminal is part of a snubber circuit that includes at least a capacitor. Note 15. Power source and The connection structure described in Appendix 13 or Appendix 14, The power module is a vehicle that is electrically connected to the drive source. Note 16. Switching element and A sealing resin covering the switching element, A terminal with two wires laminated together via an insulating layer, Equipped with, The terminal includes an exposed portion that is exposed from the sealing resin, The power module has a through-hole formed in the exposed portion, allowing one of the two wires to pass through to the other. [Explanation of symbols]

[0095] A1, A11, A2, A3, A31, A4: Connection structure B1, B2: Power Modules C1: Snubber circuit D1, D2, D3: Conductive members E1: Holding member V: Vehicle 1: Switching element 11: First respect 12: Related to the second 2: Sealing resin 21: Resin main surface 22: Resin back 231,232: Resin side 24: Notch 3: 1st terminal 3a:Exposed part 30: First through hole 301,302,303:Aperture 31: First insulating layer 32: Lower wiring 33: Upper wiring 34: First insulator 341 :Aperture 35: 1st protection plate 351 :Aperture 4: Output terminals 41: Output wiring 42: Output wiring 51: Support member 511, 512: Conductive plate 513, 514: Insulating board 521: Signal Wiring 522: Metal components 53: Signal terminal 54: Connecting member 6: Main body 61: Capacitor 611,612: Electrode 7: 2nd terminal 70: Second through hole 701,702,703:Aperture 71: Second insulating layer 72: Upper wiring 73: Bottom wiring 74: Second insulator 741 :Aperture 75:Second protection plate 751 :Aperture 81: Shaft 82,83:Head 84,85: Holding part 841: Pressing part 842 :Support part 843: Moving part 86:Connection part 91: Vehicle charger 92: Storage battery 93: Drive System 931: Inverter 932: Power source

Claims

1. A first terminal in which the first wiring and the second wiring are laminated with a first insulating layer, A second terminal in which the third and fourth wirings are laminated via a second insulating layer, A conductive member that connects the first wiring and the third wiring, Equipped with, The first terminal and the second terminal overlap when viewed in the first direction. The first wiring is located in one of the first directions relative to the second wiring, The third wiring is located in the other direction relative to the fourth wiring in the first direction, The second wiring and the fourth wiring are connected in contact with each other.

2. The connection structure according to claim 1, wherein the first terminal and the second terminal are fixed by the conductive member.

3. The first terminal has a first through-hole that extends from the first wiring through the first insulating layer to the second wiring, The second terminal has a second through-hole that extends from the third wiring through the second insulating layer to the fourth wiring, The first through hole and the second through hole overlap when viewed in the first direction, The connection structure according to claim 2, wherein the conductive member is inserted through the first through hole and the second through hole.

4. The conductive member includes a shaft portion inserted through the first through hole and the second through hole, a first head portion in contact with the first wiring, and a second head portion in contact with the third wiring. The connection structure according to claim 3, wherein the first head and the second head are electrically connected via the shaft portion.

5. The first through-hole has a first opening formed in the first wiring and a second opening formed in the second wiring. The connection structure according to claim 3, wherein the second opening is larger than the first opening when viewed in the first direction.

6. The first terminal includes a first insulator that insulates the second wiring from the conductive member. The connection structure according to claim 5, wherein the first insulator is filled into the second opening.

7. The first terminal is provided with a first protective plate that is positioned in the first direction on the side opposite to the second wiring relative to the first wiring, The connection structure according to claim 5, wherein the first protective plate is larger than the second opening when viewed in the first direction.

8. The second through-hole has a third opening formed in the third wiring and a fourth opening formed in the fourth wiring. The connection structure according to claim 5, wherein the fourth opening is larger than the third opening when viewed in the first direction.

9. The second terminal is provided with a second insulator that insulates the fourth wiring from the conductive member. The connection structure according to claim 8, wherein the second insulator is filled into the fourth opening.

10. The second terminal is provided with a second protective plate that is positioned in the first direction on the side opposite to the fourth wiring relative to the third wiring, The connection structure according to claim 8, wherein the second protective plate is larger than the fourth opening when viewed in the first direction.

11. The conductive member includes a pair of clamping portions and a connecting portion that connects the pair of clamping portions. One of the pair of clamping portions presses the first wiring from the one in the first direction to the other in the first direction. The other of the pair of clamping portions presses the third wiring from the other in the first direction to the one in the first direction. The connection structure according to claim 2, wherein the first terminal and the second terminal are sandwiched between the conductive member.

12. The connection structure according to claim 11, wherein a part of the connecting portion does not overlap with either the first terminal or the second terminal when viewed in the first direction, and is spaced apart from the first terminal and the second terminal.

13. A switching element that conducts to the first terminal, The system further comprises a sealing resin covering a part of the first terminal and the switching element, The first terminal includes an exposed portion that protrudes from the sealing resin, The exposed portion overlaps the second terminal when viewed in the first direction, The connection structure according to any one of claims 1 to 12, wherein the first terminal, the switching element, and the sealing resin constitute a power module.

14. The connection structure according to claim 13, wherein the second terminal is part of a snubber circuit that includes at least a capacitor.

15. Power source and The connection structure is as described in claim 13, The power module is a vehicle that is electrically connected to the drive source.

16. Switching element and A sealing resin covering the switching element, A terminal in which two wires are laminated with an insulating layer, Equipped with, The terminal includes an exposed portion that is exposed from the sealing resin, The exposed portion of the power module has a through hole formed therein, from one of the two wires to the other.

Images