Indication device

Abstract

When using multiple display panels of a display device as a single screen, the separation of the display. Suppress the feeling. [Solution] A display panel having a display area and a non-display area, and a first surface overlapping the display area A support having a first surface and a second surface that is continuous with the first surface and overlaps with a non-display area, and a display It has two units and a connecting part sandwiched between the two display units, and the two display units It has a foldable housing that supports the two display units, and the two display units support each other. The first surfaces of the bodies face the same direction, and the second surfaces of the supporting bodies face each other, as they are unfolded. A display device placed in the enclosure in the state of the device.

Description

[Technical Field]

[0001] The present invention relates to a display device, an electronic device, or a method for manufacturing the same. In particular, electroluminescence Utilizing the electroluminescence (EL) phenomenon The present invention relates to a display device, electronic device, or a method for manufacturing the same. [Background technology]

[0002] In recent years, display devices have been expected to have applications in a variety of fields, and diversification is required. For example, For display devices used in portable devices, etc., they must be small, thin, and lightweight. These are some of the requirements. On the other hand, it is desirable for display devices to have large screens (wide display area). Occasionally, there is also a demand for reducing the area of ​​the display device other than the display area (so-called narrow bezel design). Yes, they are.

[0003] Furthermore, light-emitting elements (also referred to as EL elements) that utilize the EL phenomenon can be easily made thin and lightweight. Features include the ability to respond quickly to input signals and the ability to be driven using a low-voltage DC power supply. It possesses [certain properties], and its application to display devices is being considered.

[0004] For example, Patent Document 1 describes a configuration in which multiple displays can be opened and closed in a foldable manner. This enables the creation of portable communication devices with large screens, as well as improved miniaturization and weight reduction. It is shown. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2000-184026 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, each display has a non-display area surrounding the display area, as shown in Patent Document 1 In this configuration, a non-display area exists at the junction of the two displays and in its vicinity. The wider the display area, the more a single image displayed using multiple displays can be viewed. To the observer, it may appear as if it has been separated.

[0007] One aspect of the present invention aims to provide a novel display device or electronic device. In one aspect of the present invention, when using multiple display panels as a single screen, the sense of separation of the display One objective is to provide a display device or electronic device in which the following is suppressed. One embodiment aims to provide a compact display device or electronic device. Or, One aspect of the present invention aims to provide a lightweight display device or electronic device. Alternatively, one aspect of the present invention aims to provide a display device or electronic device with a narrow bezel. One aspect of the present invention is to provide a display device or electronic device that is less prone to damage. One of its objectives is to achieve this.

[0008] It should be noted that one aspect of the present invention does not need to solve all of the above-mentioned problems. [Means for solving the problem]

[0009] One aspect of the present invention is a display panel having a display area and a non-display area, and a part that overlaps the display area. A support having a first surface and a second surface that is continuous with the first surface and overlaps with a non-display area. It has two display units and a connecting part sandwiched between the two display units, and the two displays It has a foldable housing that supports the units, and the two display units face the same direction on the first surface of their supports, and the second surfaces of their supports face each other and are arranged on the housing in the unfolded state.

[0010] In the above configuration, the display panel preferably has flexibility.

[0011] In the above configuration, the display area preferably overlaps with the second surface.

[0012] In the above configuration, the two display units preferably contact each other on the second surface side of the supports facing each other and are arranged on the housing in the unfolded state.

[0013] In the above configuration, the two display units are preferably detachably arranged on the housing.

[0014] In the above configuration, the distance between the two display units is preferably variable. For example, at least one of the display units may be movable toward the other display unit.

[0015] In the above configuration, the support preferably has a third surface that faces the second surface and overlaps with the non-display area of the display panel, and further preferably, the third surface overlaps with the display area.

[0016] Also, an electronic device using the display device of each of the above configurations is also an aspect of the present invention.

Effects of the Invention

[0017] In one aspect of the present invention, a novel display device or electronic device can be provided. Or, in one aspect of the present invention, when using a plurality of display panels as one screen, the sense of separation of the display is suppressed. ​ A display device or electronic device can be provided. Alternatively, in one aspect of the present invention, a compact display device or This can provide electronic equipment. Or, in one aspect of the present invention, a lightweight display device or electronic device A device can be provided. Alternatively, in one aspect of the present invention, a display device or electronic device having a narrow bezel can be provided. It can be provided. Or, in one aspect of the present invention, a display device or electronic device that is less prone to damage can be provided. ru. [Brief explanation of the drawing]

[0018] [Figure 1] A diagram showing an example of a display device and display unit. [Figure 2] A diagram showing an example of a display device. [Figure 3] A diagram showing an example of a display device and display unit. [Figure 4] A diagram showing an example of a display device. [Figure 5] A diagram showing an example of a display device. [Figure 6] A diagram showing an example of a housing. [Figure 7] A diagram showing an example of a display panel. [Figure 8] A diagram showing an example of a display panel according to one embodiment of the present invention. [Figure 9] A diagram showing an example of a display panel according to one embodiment of the present invention. [Figure 10] A diagram showing an example of a display panel according to one embodiment of the present invention. [Figure 11] A diagram showing an example of a display panel according to one embodiment of the present invention. [Figure 12] A diagram showing an example of a method for manufacturing a display panel according to one embodiment of the present invention. [Figure 13] A diagram showing an example of a method for manufacturing a display panel according to one embodiment of the present invention. [Modes for carrying out the invention]

[0019] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0020] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0021] Furthermore, the position, size, and scope of each component shown in the drawings, etc., are for ease of understanding. The position, size, and range of the edges may not be shown. Therefore, the disclosed invention is not necessarily However, this is not limited to the location, size, and scope disclosed in drawings, etc.

[0022] (Embodiment 1) A display device according to one aspect of the present invention will be described with reference to Figures 1 to 7.

[0023] <Configuration of a display device according to one aspect of the present invention> A display device according to one aspect of the present invention has two display units and one housing. The panel comprises a display area and a non-display area, and a first surface that overlaps the display area, and The housing comprises a support having a second surface that is continuous with the first surface and overlaps with the non-display area. It is foldable. The housing has a connecting section sandwiched between two display units. The body supports two display units. The two display units are supported by the first surface of each other's supports. With the two supports facing the same direction and the second surfaces of each support facing each other, in the unfolded state of the housing It is arranged. In the display device, the display area of ​​the display panel overlaps with the first surface of the support. However, this is visible to the user of the display device. In one embodiment of the present invention, the first surface of the support This refers to the surface that overlaps with the display area of ​​the display panel without the need for other surfaces of the support. Similarly, this In one embodiment of the invention, the second surface of the support is a display panel without the other surfaces of the support. This refers to the surface that overlaps with the hidden area.

[0024] A display device according to one aspect of the present invention is foldable. Therefore, the user can use the display device. By folding it to make it smaller, the display device can be easily carried. The user can unfold the display device and use the two display units as a single screen to create a large image. The display on the surface can be visually confirmed. Furthermore, in a display device according to one aspect of the present invention, one of the display units There is almost no non-display area between the display area of ​​one display unit and the display area of ​​the other display unit. Because it does not exist (or does not exist at all), two display units are used as a single screen. The sense of separation between the display and the unfolded state is suppressed. Even if this state is repeated, the display panel itself will not deform (it will not be repeatedly bent or stretched). In other words, the display device according to one aspect of the present invention suppresses the reduction in the lifespan of the display panel due to deformation. It is highly reliable.

[0025] First, let's describe an example of a display device configuration.

[0026] Figure 1(A) shows a perspective view of the display device 110 in the process of being unfolded, and Figure 1(B) shows the display device 1 A perspective view of the folded state of item 10 is shown.

[0027] The display device 110 has a housing 103 and two display units 101. The components of T101 may have the same configuration or may have different configurations.

[0028] The casing 103 is foldable. The casing 103 is sandwiched between two display units 101. (Specifically, between the two display units 101, a part of the two display units 101) It has a connecting part 106 (for example, a hinge or hinge) that overlaps with it. The housing 103 has two Supports the display unit 101.

[0029] In Figure 1(A), the housing 103 has a recess, and the display unit 101 is arranged within the recess. An example is shown. The display unit 101 may be bonded to the housing 103, or it may be fixed in a detachable manner. It may be stipulated.

[0030] The display device 110 is foldable. Therefore, the user can fold the display device 110. By folding it down to make it smaller, the display device 110 can be easily carried around. The user deploys the display device 110 and uses the two display units as a single screen. The large screen display can be viewed. Also, the display device 110 can be shown in both its unfolded and folded states. Even if the state is repeated, the display unit 101 itself does not deform. In other words, the display device 110 Furthermore, the reduction in the lifespan of the display unit 101 due to deformation is suppressed, resulting in high reliability.

[0031] Examples of the configuration of the display unit 101 are shown in Figures 1(C) and (D), respectively.

[0032] Figure 1(C) shows a perspective view of the display unit 101a and a view from the direction of arrow A in the perspective view. The plan view and the plan view from the direction of arrow B are shown. Figure 1(D) shows the display unit 101 The perspective view of b, the plan view from the direction of arrow A in the perspective view, and the plan view from the direction of arrow B. A view drawing and a diagram are shown.

[0033] Display units 101a and 101b each have a support 201 and a display panel 203. The display panel 203 has a display area 203a and a non-display area 203b.

[0034] In display units 101a and 101b, the support 20 is visible from the direction of arrow A in the perspective view. The first surface of 1 and the display area 203a overlap and can be seen from the direction of arrow C in the perspective view. The second surface of the support 201 and the non-display area 203b overlap. Furthermore, the display unit 101b Then, the third surface facing the second surface of the support 201 and the non-display area 203b overlap. In the perspective view of Figures 1(C) and (D), the plan view is taken from the direction of arrow B, and the display panel The non-display area 203b in 203 is indicated by a dotted line.

[0035] In the display panel, for example, a non-display area is provided so as to surround the display area. One embodiment of the present invention In this case, as with the display unit 101a, one of the two consecutive surfaces of the support 201 (the first surface) ) overlaps with the display area 203a, and the other side (the second side) overlaps with the non-display area 203b. Support By overlapping the display panels 203 on two or more sides of the body 201, the display can be shown on only one side of the support 201. Compared to the case where the display panels 203 are stacked, the proportion of the area occupied by the display area 203a on the first surface The gap becomes larger, allowing for a narrower bezel for the display unit.

[0036] Furthermore, as in the display unit 101b, the display panel 203 is superimposed on three or more sides of the support 201. Therefore, of the three consecutive faces of the support 201, two separate faces (the second face and the third face) and one non-faced face. The display area 203b overlaps, and the surface sandwiched between the two separate surfaces (the first surface) and the display area 203a By overlapping, the proportion of the area occupied by the display area 203a on the first surface increases, and the display unit The bezel can be made narrower.

[0037] At least one of the display units 101a and 101b is connected to the display unit 101 shown in Figure 1(A). When applied, in the vicinity of the area where the two display units 101 are in contact, one of the display units 10 The display area 203a in unit 1 and the display area 203a in the other display unit 101 There is almost no hidden area between them. Therefore, the two display units 101 are one When used as a screen, it can be a display device that suppresses the sense of separation between displays.

[0038] As shown in Figures 1(C) and (D), the non-display area 203b overlaps with the face opposite the first face. It's okay to do that.

[0039] The non-display area 203b is the surface of the support 201 facing the first surface, or the surface continuous with the first surface. Because it can be superimposed on (the second or third surface mentioned above), one embodiment of the present invention is a display unit. The display panel of the device does not need to have a narrow bezel. For example, a display using an organic EL element. In the case of a panel, the larger the area of ​​the non-display area 203b surrounding the outer edge of the display area 203a, the larger the display area. This is preferable because it increases the distance between the edge of the display panel and the organic EL element. This makes it difficult for impurities such as moisture and oxygen from the outside to penetrate (or reach) the organic EL element. This improves the reliability of the display panel.

[0040] In the display panel shown in Figures 7(A) and 7(B), region 301 is supported in the display panel. Region 303 is a region that overlaps with the first surface of body 201, and in the display panel, support 20 The first face of 1 overlaps with the face opposite to it, or with the face that is continuous with the first face (the second face and the third face mentioned above). This region is defined as [the region]. In Figures 7(A) and (B), the area of ​​the display region 203a is the same. In Figure 7(A), the entire display area 203a is included in the area that overlaps with the first surface. 7(B) has a wide region 303. Therefore, the organic EL element can pass through the edge of the display panel. This is preferable because it makes it difficult for moisture, oxygen, and other impurities from outside the display panel to reach it. The area of ​​the region in which the display panel 203 overlaps with the surface facing the first surface of the support 201 is the Preferably, 10% or more of the area of ​​the surface facing the first surface, more preferably 30% or more, and 5 A percentage of 0% or higher is particularly preferable.

[0041] Furthermore, as shown in Figures 1(C) and (D), the display area 203a is not only the first surface, but also the second It is preferable that it overlaps with surface 2. At least one of the display units 101a and b is When applied to the display unit 101 shown in Figure 1(A), the two display units 101 come into contact. In the vicinity of the region, the display area 203a of one display unit 101 and the other display unit There is almost no non-display area between the display area 203a and the display area 101. Therefore, when using the two display units 101 as a single screen, the sense of separation between the displays is suppressed. It can be used as a display device.

[0042] Furthermore, in the display unit 101b, when the display area 203a overlaps with the third surface, the first surface This is preferable because it increases the proportion of the area occupied by the display area 203a.

[0043] Next, we will describe another example of a display device configuration.

[0044] Figure 2(A) shows a plan view of the display device 120 in its unfolded state, and Figure 2(B) shows the display device 1 Figure 2(C) shows a plan view of the folded state of the 20, and the unfolded state of the display device 120. Figure 2(D) shows a perspective view of the display device 120 in its folded state.

[0045] The display device 120 consists of a housing 103a and two display units (each consisting of a support 201 and a display unit). The present invention includes a panel 203 and a display unit. The distance between the two display units is variable. In one embodiment of a display device, at least one of the two display units is in the horizontal direction of the paper in Figure 2(A). It is movable, and in the display device 120, both of the two display units are in the horizontal direction of the paper in Figure 2(A). This shows an example of movement in the direction.

[0046] In the display device 120, both of the two display units are the display units shown in Figure 3(A). The example shown is for case 101c, but it is not limited to this. For example, in Figures 1(C) and (D) Using the display units 101a, b shown respectively, or the display unit 101d shown in Figure 3(B) It is acceptable. For example, one of the two display units may be display unit 101a and the other may be display unit 101a. It may also be knit 101c. Note that the display unit 101c has a protrusion 205. Other than that, it is the same as display unit 101a, and the configuration of display unit 101d is convex Except for having 205, it is the same as display unit 101b.

[0047] Figure 6(A) shows a perspective view and a plan view of the housing 103a. The housing 103a is foldable. The housing 103a has a connecting portion 106 sandwiched between two display units. 03a has a recess and supports two display units arranged within the recess. Figure 2(A In (D), the display unit is detachably arranged within a recess in the housing 103a. Here is an example.

[0048] In Figure 2(A), the two display units are movable in the horizontal direction of the paper, and the support 201 is Due to the protrusions 205 (claws) that the housing 103a has, the housing 1 The display unit can be fixed to 03a. The positions of the protrusions 205 and 207 are not particularly limited. It is not determined. For example, the protrusion 207 is provided in contact with the bottom or side surface of the recess of the housing 103a. That's all that matters.

[0049] Figures 2(A) to (D) show examples where the two display units are separated, but the display unit By moving at least one of them, the two display units can be brought into contact or close proximity. This will be described in detail using diagrams in the display device 140, which will be described later.

[0050] When displaying information on a display device in its deployed state, it is preferable that the two display units be in contact with each other. Specifically, the two display units are located on the second side of the support 201, which faces each other. It is preferable that they are placed in contact with the unfolded housing 103a. When using the display unit as a single screen, the sense of separation in the display can be suppressed. In a display device in this state, if the two display units each display independently, then the two The position of the display unit is not particularly limited.

[0051] Furthermore, when folding the display device, it is preferable that the two display units remain separated. Therefore, on the side of the display device shown in Figure 2(D) that has the connecting portion 106, the housing 103 Since the display unit is not exposed on the same plane as a, the support 201 and the display panel 203 are not damaged. This can prevent damage from occurring.

[0052] In Figure 2(B), the display unit is positioned inside the display device when the display device is folded. While a configuration has been shown, the present invention is not limited thereto.

[0053] The display device 130 shown in Figure 3(C) has the display unit positioned outside the display device 130. It folds up in this manner. Therefore, even in the folded state, the opposing side of the display device 130 Each of the two screens can independently display information using a single display unit.

[0054] In one embodiment of the present invention, the display unit is arranged either on the outside or inside of the display device. It can also be folded in such a way. In this configuration, the display device can be unfolded to display the user Not only is the display visible through knitting, but the display unit is also positioned outside the display device. The display unit's information can still be viewed even when the display device is folded. Then, by folding the display device so that the display unit is positioned inside the display device, This prevents the display panel from being scratched or damaged when the display device is not in use.

[0055] Furthermore, another example of a display device configuration will be described.

[0056] Figures 4(A) and 5(A) show plan views of the display device 140 in its unfolded state, and Figure 4(B) Figure 5(B) shows a perspective view of the display device 140 in its unfolded state, and Figure 5(C) shows the display device Figures 4(A) and 4(B) show a perspective view of the 140 in its folded state. Figures 5(A) to 5(C) show an example where the two display units are not in contact. Here is an example of what to do.

[0057] The display device 140 consists of a housing 103b and two display units (each consisting of a support 201 and a display unit). (Having panel 203) and has. Here, both of the two display units are shown in Figure This shows the case where the display unit 101c is as shown in 3(A).

[0058] Figure 6(B) shows a perspective view and a plan view of the housing 103b. The housing 103b is foldable. The housing 103b has a connecting portion 106 sandwiched between the two display units. 03b has a groove (recess) and supports two display units arranged within the groove. In Figures 4(A), (B), and 5(A)-(C), a display unit is shown inside the groove of the housing 103b. This shows an example where the net is detachably arranged. The housing 103b is on the first surface of the support 201 This covers a portion (particularly preferably the portion that overlaps with the non-display area of ​​the display panel 203). This is preferable because it makes it difficult to disassemble the display device into the display unit and the housing.

[0059] In Figures 4(A) and 5(A), the two display units are movable in the horizontal direction of the paper, and support The protrusion 205 (claw) on the body 201 and the protrusion 207 (claw) on the housing 103b This allows the display unit to be fixed to the enclosure 103b.

[0060] The display device 140 displays two displays by moving at least one of the two display units. The units can be brought into contact with or near each other.

[0061] When displaying on a display device in its expanded state, as shown in Figures 5(A) and (B), two tables are displayed. The display units are preferably in contact with each other. Specifically, the two display units are opposite each other. It is positioned on the unfolded housing 103b, in contact with the second surface side of the opposing support 201. This is preferable. This allows for the display when using two display units as a single screen. The feeling of separation can be suppressed.

[0062] Furthermore, when folding the display device, it is preferable that the two display units remain separated (Figure 2). (See the perspective view of the display device 120 in (D)). Figure 5(C) shows two display units. When the two are in contact, the housing 103 is on the side of the display device that has the connecting portion 106. Since the display unit is exposed on the same plane as b, the support 201 and the display panel 203 are not damaged. Damage may occur.

[0063] <Materials that can be used in a display device according to one aspect of the present invention> Next, an example of a material that can be used in a display device according to one aspect of the present invention will be described.

[0064] [Enclosure, support] The housing and support can be formed using plastic, metal, alloy, rubber, etc. By using materials such as rubber, it is possible to obtain a lightweight and durable housing or support, which is preferable. It's nice.

[0065] When bonding a display unit to a housing, or when bonding a support to a display panel, various bonding methods are used. Adhesives can be used, such as two-part resins that cure at room temperature, or light-curing resins. Resins such as crystalline resins and thermosetting resins can be used. In addition, sheet-shaped adhesives can be used. You may use it.

[0066] [Display Panel] The display panel is preferably flexible. This is also acceptable. For example, a display panel that has been pre-molded to fit the display device may be used. stomach.

[0067] The display elements of the display panel are not particularly limited and include liquid crystal elements, light-emitting elements (light-emitting diodes, Organic EL elements, inorganic EL elements, plasma tubes, etc., can be used.

[0068] For example, by using organic EL elements, a lightweight and flexible display panel can be constructed. It is preferable because it can be easily achieved.

[0069] Even if the display panel uses an active matrix system, it can also use a passive matrix system. It may also apply.

[0070] If the display panel uses an active matrix system, the display panel has a traction control system. The transistor structure is not limited; a top-gate type transistor may be used, or a bottom-gate type transistor may be used. A gate-type transistor may be used. Alternatively, an n-channel transistor may be used. A p-channel transistor may also be used. Furthermore, the materials used for the transistor may also be... It is not particularly limited. For example, oxide semiconductors such as silicon and In-Ga-Zn metal oxides. A transistor using this in the channel formation region can be applied.

[0071] The display panel may have sensors such as touch sensors.

[0072] It is preferable to use a material with high toughness for the substrate of the display panel. This ensures durability This enables the creation of display panels that are highly impact-resistant and less prone to damage. For example, organic resins and thin panels. By using substrates made of metal or alloy materials, lighter than when using glass substrates. This allows for the creation of a display panel that is less prone to damage.

[0073] Flexible display panels can be manufactured using various manufacturing methods. If the temperature can withstand the above, the elements (display elements, transistors) can be directly placed on the flexible substrate. You can create a color filter, etc.

[0074] As a substrate, a material (such as resin) that is flexible but has high water permeability and low heat resistance must be used. If it is necessary, the substrate cannot be subjected to high temperatures during the manufacturing process, so the manufacturing process is carried out on the substrate. There are limitations on the manufacturing conditions for the element. In such cases, the display panel is placed on a heat-resistant substrate. This technique involves fabricating a portion of the Nel structure and then transferring that structure from the fabricated substrate to a flexible substrate. A flexible display panel can be fabricated on a heat-resistant substrate. Because it is possible to manufacture transistors and other materials, highly reliable transistors and insulating layers with sufficiently low water permeability can be produced. This can be formed. Then, by transposing them onto a flexible substrate, reliability can be increased. A flexible display panel can be manufactured.

[0075] This embodiment can be combined with other embodiments as appropriate.

[0076] (Embodiment 2) In this embodiment, a flexible display that can be used in a display device according to one aspect of the present invention The panel will be explained using Figures 8 to 13. The display panel exemplified in this embodiment is curved When this is done, the minimum value of the radius of curvature in the display panel is 1 mm or more and 150 mm or less, 1 mm or less Up to 100mm or less, 1mm to 50mm, 1mm to 10mm, or 2mm or more It can be 5 mm or less. The display panel of this embodiment has a small radius of curvature (for example The element will not break even when bent by 2mm to 5mm, making it highly reliable. By bending the flannel with a small radius of curvature, the display device according to one aspect of the present invention can be made thinner. This is possible. Also, the light extraction section 224 can have a large radius of curvature (for example, 5 mm to 100 mm). By folding it as shown below, a wide display area can be provided on the side of the display device. The direction in which the display panel is bent does not matter. Also, even if there is only one bending point, it does not matter if there are two bending points. It may be more than one place.

[0077] <Specific Example 1> Figure 8(A) shows a plan view of the display panel, and the section between A1 and A2 shown by the dashed line in Figure 8(A) An example of a view drawing is shown in Figure 8(B).

[0078] The display panel shown in Figure 8(B) consists of a substrate 221, an adhesive layer 223, an insulating layer 225, and multiple traps. LED, conductive layer 157, insulating layer 227, insulating layer 229, multiple light-emitting elements, insulating layer 211 , sealing layer 213, insulating layer 261, coloring layer 259, light-shielding layer 257, insulating layer 255, adhesive layer 2 It has 58 and a substrate 222.

[0079] The conductive layer 157 is electrically connected to the FPC 228 via the connector 215.

[0080] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. Electrode 231 is electrically connected to the source electrode or drain electrode of transistor 240. The end of the lower electrode 231 is covered with an insulating layer 211. The light-emitting element 230 is a top emitter. It has a symmetrical structure. The upper electrode 235 is translucent and transmits light emitted by the EL layer 233. .

[0081] A colored layer 259 is provided in a position that overlaps with the light-emitting element 230, and in a position that overlaps with the insulating layer 211. A light-shielding layer 257 is provided. The colored layer 259 and the light-shielding layer 257 are covered with an insulating layer 261. The space between the light-emitting element 230 and the insulating layer 261 is filled with a sealing layer 213.

[0082] The display panel has multiple transistors in the light extraction unit 224 and the drive circuit unit 226. The transistor 240 is provided on the insulating layer 225. The insulating layer 225 and the substrate 22 1 is bonded together by the adhesive layer 223. Also, the insulating layer 255 and the substrate 222 are bonded together. It is bonded by layer 258. A film with low water permeability is applied to the insulating layer 225 and insulating layer 255. When used, it can suppress the intrusion of impurities such as water into the light-emitting element 230 and transistor 240. This is preferable because it increases the reliability of the display panel.

[0083] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Also, acid Silicon oxide films, silicon oxide-nitride films, aluminum oxide films, etc., may also be used.

[0084] For example, the amount of water vapor transmitted through a low-permeability insulating film is 1 × 10⁻⁶ -5 [g / m 2 ·day] or less Preferably 1 × 10 -6 [g / m 2 ·day] More preferably 1 × 10 -7 [g / m 2 • day] More preferably 1 x 10 -8 [g / m2 ·day] or less .

[0085] In specific example 1, an insulating layer 225, a transistor 240, and a light-emitting element are fabricated on a heat-resistant substrate. A 230 is fabricated, the fabricated substrate is peeled off, and an insulating layer 22 is applied to the substrate 221 using the adhesive layer 223. This shows a display panel that can be fabricated by transposing elements 5, transistor 240, and light-emitting element 230. In addition, in specific example 1, an insulating layer 255 and a colored layer 259 are applied on a heat-resistant fabricated substrate. A light-shielding layer 257 is prepared, the prepared substrate is peeled off, and an adhesive layer 258 is used to create an insulating layer on the substrate 222. This shows a display panel that can be manufactured by transposing the edge layer 255, the colored layer 259, and the light-shielding layer 257. They are doing it.

[0086] When using materials with low heat resistance (such as resin) for the substrate, applying high temperatures to the substrate during the manufacturing process can be dangerous. Because this is not possible, there are limitations on the conditions under which transistors and insulating films can be fabricated on the substrate. When using a highly water-permeable material (such as resin) for the substrate of the display panel, between the substrate and the light-emitting element It is preferable to apply high temperature to form a film with low water permeability. Manufacturing method of this embodiment Therefore, transistors and other components can be fabricated on a highly heat-resistant substrate, and high temperatures can be applied to the signal. It is possible to form highly reliable transistors and insulating films with sufficiently low water permeability. By transferring these components to a substrate with low heat resistance, a highly reliable display panel can be manufactured. As a result, in one aspect of the present invention, a lightweight or thin and highly reliable display panel is provided. It is possible. Details of the manufacturing method will be described later.

[0087] It is preferable to use materials with high toughness for both substrate 221 and substrate 222. This makes it possible to realize a display panel that is highly impact-resistant and less prone to damage. For example, substrate 222 The substrate 221 is made of an organic resin substrate, and the substrate 221 is made of a thin metal material or alloy material. Therefore, compared to cases where a glass substrate is used, the display panel is lighter and less prone to damage. It can be achieved.

[0088] Metal and alloy materials have high thermal conductivity and can easily conduct heat throughout the entire substrate, so display panels This is preferable as it can suppress the localized temperature rise of the material. The thickness of the plate is preferably 10 μm to 200 μm, and 20 μm to 50 μm. It is preferable to do so.

[0089] Furthermore, if a material with high thermal emissivity is used for the substrate 221, the surface temperature of the display panel will increase. This can suppress damage to the display panel and reduce its reliability. For example, the substrate 221 is made of gold A substrate and a layer with high thermal emissivity (for example, metal oxides or ceramic materials can be used) can be used. ) may also be used as a laminated structure.

[0090] <Specific Example 2> Figure 9(A) shows another example of the light extraction unit 224 in a display panel according to one embodiment of the present invention. The display panel in Figure 9(A) is a touch-operable display panel. Note that the following specific details... In this example, the explanation of the configuration similar to that in Specific Example 1 will be omitted.

[0091] The display panel shown in Figure 9(A) consists of a substrate 221, an adhesive layer 223, an insulating layer 225, and multiple traps. LED, insulating layer 227, insulating layer 229, multiple light-emitting elements, insulating layer 211, insulating layer 217 , sealing layer 213, insulating layer 261, coloring layer 259, light-shielding layer 257, multiple light-receiving elements, conductive layer 281, conductive layer 283, insulating layer 291, insulating layer 293, insulating layer 295, insulating layer 255, connection layer 258, and substrate 222.

[0092] In Specific Example 2, an insulating layer 217 is provided on the insulating layer 211. By providing the insulating layer 217, the distance between the substrate 222 and the substrate 221 can be adjusted.

[0093] FIG. 9(A) shows an example in which a light-receiving element is provided between the insulating layer 255 and the sealing layer 213. Display Since the light-receiving element can be arranged overlapping the non-light-emitting region of the panel (for example, a region where transistors or wirings are provided, a region where light-emitting elements are not provided), a touch sensor can be provided on the display panel without reducing the aperture ratio of the pixel (light-emitting element). For the light-receiving element included in the display panel of one aspect of the present invention, for example, a pn-type or pin-type photo

[0094] diode can be used. In the present embodiment, as the light-receiving element, a pin-type photo diode having a p-type semiconductor layer 271, an i-type semiconductor layer 273, and an n-type semiconductor layer 275 is used. The diode is used.

[0095] Note that the i-type semiconductor layer 273 has impurities for imparting p-type and impurities for imparting n-type each at a concentration of 1×10 <00​​​​​​​​​​​ This category includes anything that has been added to it.

[0096] The light-shielding layer 257 is located on the substrate 221 side of the light-receiving element and overlaps with the light-receiving element. The light-shielding layer 257 located between the element and the sealing layer 213 blocks the light emitted by the light-emitting element 230. This can suppress the light from being irradiated onto the light-receiving element.

[0097] Conductive layer 281 and conductive layer 283 are electrically connected to the light-receiving element, respectively. Conductive layer 281 It is preferable to use a conductive layer that transmits light incident on the light-receiving element. The conductive layer 283 is It is preferable to use a conductive layer that blocks the light incident on the light-receiving element.

[0098] When an optical touch sensor is placed between the substrate 222 and the sealing layer 213, the light-emitting element 230 emits light. It is preferable because it is less susceptible to external influences and can improve the signal-to-noise ratio.

[0099] <Specific Example 3> Figure 9(B) shows another example of the light extraction unit 224 in a display panel according to one embodiment of the present invention. The display panel in Figure 9(B) is a touch-operable display panel.

[0100] The display panel shown in Figure 9(B) consists of a substrate 221, an adhesive layer 223, an insulating layer 225, and multiple traps. LED, insulating layer 227, insulating layer 229a, insulating layer 229b, multiple light-emitting elements, insulating layer 2 11. Insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, multiple light-receiving elements, conductor It has an electrical layer 280, a conductive layer 281, an insulating layer 255, an adhesive layer 258, and a substrate 222.

[0101] Figure 9(B) shows an example in which a light-receiving element is located between the insulating layer 225 and the sealing layer 213. By placing the element between the insulating layer 225 and the sealing layer 213, the transistor 240 is formed. Using the same materials and processes as the conductive layer and semiconductor layer, the conductive layer and the photodetector are electrically connected to the photodetector. The photoelectric conversion layer that constitutes the light-receiving element can be fabricated. Therefore, the fabrication process is greatly increased. It is possible to create a touch-operable display panel without any additional steps.

[0102] <Specific Example 4> Figure 10(A) shows another example of a display panel according to one embodiment of the present invention. Display panel in Figure 10(A) This is a touch-operable display panel.

[0103] The display panel shown in Figure 10(A) consists of a substrate 221, an adhesive layer 223, an insulating layer 225, and multiple Lampistor, conductive layer 156, conductive layer 157, insulating layer 227, insulating layer 229, multiple light-emitting elements Child, insulating layer 211, insulating layer 217, sealing layer 213, colored layer 259, light-shielding layer 257, insulating layer 255, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, conductive layer 294, conductive It has an electrolytic layer 296, an adhesive layer 258, and a substrate 222.

[0104] Figure 10(A) shows a capacitive touch sensor between the insulating layer 255 and the sealing layer 213. An example is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0105] The conductive layers 156 and 157 are electrically connected to the FPC 228 via the connector 215. The conductive layers 294 and 296 are electrically connected to the conductive layer 274 via the conductive particles 292. It connects to the FPC228. Therefore, it drives the capacitive touch sensor via the FPC228. It is possible.

[0106] <Specific Example 5> Figure 10(B) shows another example of a display panel according to one embodiment of the present invention. Display panel in Figure 10(B) This is a touch-operable display panel.

[0107] The display panel shown in Figure 10(B) consists of a substrate 221, an adhesive layer 223, an insulating layer 225, and multiple Lampistor, conductive layer 156, conductive layer 157, insulating layer 227, insulating layer 229, multiple light-emitting elements Child, insulating layer 211, insulating layer 217, sealing layer 213, colored layer 259, light-shielding layer 257, insulating layer 255, conductive layer 270, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, contact It has a deposition layer 258 and a substrate 222.

[0108] Figure 10(B) shows a capacitive touch sensor between the insulating layer 255 and the sealing layer 213. An example is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0109] The conductive layer 156 and the conductive layer 157 are electrically connected to the FPC 228a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 228b via the connector 215b. Therefore, the light-emitting element 230 and the transistor 240 are driven via the FPC228a, F Capacitive touch sensors can be driven via the PC228b.

[0110] <Specific Example 6> Figure 11(A) shows another example of the light extraction unit 224 in a display panel according to one embodiment of the present invention. .

[0111] The display panel shown in Figure 11(A) consists of a substrate 222, an adhesive layer 258, an insulating layer 225, and multiple Ranginger, insulating layer 227, conductive layer 237, insulating layer 229a, insulating layer 229b, multiple generators The device comprises an optical element, an insulating layer 211, a sealing layer 213, a colored layer 259, and a substrate 239.

[0112] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. Electrode 231 is connected to the source or drain electrode of transistor 240 via the conductive layer 237. It is electrically connected to the lower electrode 231. The end of the lower electrode 231 is covered with an insulating layer 211. 230 is a bottom emission structure. The lower electrode 231 is translucent, and the EL layer 233 It transmits the light it emits.

[0113] A colored layer 259 is provided in a position that overlaps with the light-emitting element 230, and the light emitted by the light-emitting element 230 The light is then extracted to the substrate 222 side via the colored layer 259. Between the light-emitting element 230 and the substrate 239 It is filled with a sealing layer 213. The substrate 239 is made of the same material as the substrate 221 mentioned above. It can be made.

[0114] <Specific Example 7> Figure 11(B) shows another example of a display panel according to one embodiment of the present invention.

[0115] The display panel shown in Figure 11(B) consists of a substrate 222, an adhesive layer 258, an insulating layer 225, and a conductive layer 3 10a, conductive layer 310b, multiple light-emitting elements, insulating layer 211, conductive layer 212, sealing layer 213 , and has a substrate 239.

[0116] The conductive layers 310a and 310b are external connection electrodes of the display panel, and are electrically connected to FPC and the like. It can be connected via a thermal connection.

[0117] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The ends of the electrode 231 are covered with an insulating layer 211. The light-emitting element 230 is bottom emission It has a conductor structure. The lower electrode 231 is translucent and transmits the light emitted by the EL layer 233. The electrode layer 212 is electrically connected to the lower electrode 231.

[0118] The substrate 222 has a light extraction structure consisting of a hemispherical lens, a microlens array, and a bumpy structure. The resin substrate may have the above-mentioned film, light-diffusing film, etc. The lens or film is bonded to the substrate or to a material with a refractive index similar to that of the lens or film. By bonding with an adhesive, a substrate 222 having a light extraction structure can be formed. ru.

[0119] The conductive layer 212 is not necessarily required, but it does not cause a voltage drop due to the resistance of the lower electrode 231. It is preferable to provide it because it can suppress the electrical effect. Also, for the same purpose, the upper electrode 235 and electrical effect A conductive layer for direct connection is provided on the insulating layer 211, the EL layer 233, or the upper electrode 235, etc. You may leave it.

[0120] The conductive layer 212 is made of copper, titanium, tantalum, tungsten, molybdenum, chromium, and neodymium. Materials selected from scandium, nickel, and aluminum, or compounds mainly composed of these materials. It can be formed using gold material, etc., as a single layer or in layers. The thickness of the conductive layer 212 is For example, it can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less. It is less than or equal to a micrometer (μm).

[0121] A paste (such as silver paste) is used as the material for the conductive layer that electrically connects to the upper electrode 235. As a result, the metal constituting the conductive layer aggregates into granular form. Therefore, the surface of the conductive layer becomes rough. This configuration has many gaps, and for example, even if the conductive layer is formed on the insulating layer 211, the EL layer 233 However, it is difficult to completely cover the conductive layer, and to make an electrical connection between the upper electrode and the conductive layer. This makes it easier and is preferable.

[0122] <Example of materials> Next, materials and the like that can be used in a display panel according to one embodiment of the present invention will be described. The details mentioned earlier in the document can also be taken into consideration.

[0123] Materials used for substrates 221, 222, and 239 include glass, metal, and Examples include plastic resins. The substrate on the display surface side of the display panel is made of a material that transmits visible light. Use this.

[0124] Because organic resins have a lower specific gravity than glass, using organic resin as a substrate means that glass is... This method allows for a lighter display panel compared to other methods, which is preferable.

[0125] Materials that are flexible and transparent to visible light include, for example, materials that are flexible to a certain extent. Thick glass, polyethylene terephthalate (PET), polyethylene naphthalate ( Polyester resins such as PEN, polyacrylonitrile resin, polyimide resin, and polymethyl methyl nitrile resin. Polymethacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) ) Resins, polyamide resins, cycloolefin resins, polystyrene resins, polyamide imide Examples include resins and polyvinyl chloride resins. In particular, using materials with a low coefficient of thermal expansion is important. Preferably, for example, polyamide-imide resin, polyimide resin, PET, etc. are used. This can be done. In addition, substrates made by impregnating glass fibers with organic resin, or by impregnating inorganic fillers with organic resin. It is also possible to use substrates that have been mixed to lower the coefficient of thermal expansion.

[0126] As a substrate, a layer using the above material protects the surface of the display panel from scratches and other damage. A layer (for example, a silicon nitride layer) or a layer of material that can distribute pressure (for example, aramic It may be constructed by laminating with a resin layer, etc. Also, the lifespan of the light-emitting element due to moisture, etc. To suppress the loss of life, etc., it may have an insulating film with low water permeability.

[0127] Of the adhesive layers 223 and 258, the adhesive layer on the display surface side of the display panel contains visible light Use a material that allows light to pass through.

[0128] The adhesive layer can be a two-part mixed resin or other resin that hardens at room temperature, a photocurable resin, or a thermocurable resin. Resins such as epoxy resin, acrylic resin, and silicone resin can be used. Examples include resins such as phenolic resins. Materials with low moisture permeability, such as epoxy resins, are particularly preferred. It seems so.

[0129] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (oxidation This method uses substances that adsorb moisture through chemical adsorption, such as calcium or barium oxide. It is possible to absorb moisture through physical adsorption, such as with zeolite or silica gel. A desiccant may be used. If a desiccant is included, impurities such as moisture may invade the light-emitting element. This is preferable because it can suppress the entry of unwanted signals and improve the reliability of the display panel.

[0130] Furthermore, by mixing a filler with a high refractive index (such as titanium dioxide) into the above resin, a light-emitting element is produced. This is preferable because it can improve the efficiency of light extraction from the child.

[0131] Furthermore, the adhesive layer may have a scattering member that scatters light. For example, the adhesive layer may have: A mixture of the above resin and particles with a different refractive index from the above resin can also be used. These particles are light It functions as a scattering member.

[0132] Preferably, the difference in refractive index between the resin and the particles with different refractive indices is 0.1 or more. A value of 0.3 or higher is more preferable. Specifically, the resins include epoxy resin and acrylic resin. Resins, imide resins, silicones, etc. can be used. Titanium dioxide can also be used as particles. Barium oxide, zeolite, etc., can be used.

[0133] Titanium dioxide and barium oxide particles are preferred because they have a strong light-scattering property. Using light, it is possible to adsorb water contained in resins, etc., thereby improving the reliability of the light-emitting element. It can be done.

[0134] The structure of the transistors in the display panel is not particularly limited. For example, staggered transistors It can be a zista, or an inverse staggered transistor. It can also be a top-gate type. Alternatively, either a bottom-gate type transistor structure may be used. The conductive material is not particularly limited; for example, silicon, germanium, etc. Alternatively, In-Ga-Zn metal oxides, etc., at least one of indium, gallium, and zinc. Oxide semiconductors containing these elements may also be used.

[0135] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors, Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor having the properties of [the semiconductor material] may be used. If a semiconductor having crystalline properties is used, transients may occur. This is preferable because it suppresses the deterioration of the stanic characteristics.

[0136] The light-emitting element of the display panel has a pair of electrodes (lower electrode 231 and upper electrode 235), It has an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes is the anode. One side functions as a functioning electrode, and the other as a cathode.

[0137] The light-emitting element has a top emission structure, a bottom emission structure, and a dual emission structure. Any of the structures is acceptable. The electrode on the side that extracts light uses a conductive film that transmits visible light. It is also preferable to use a conductive film that reflects visible light on the electrode that does not extract light. It seems so.

[0138] Conductive films that transmit visible light include, for example, indium oxide and indium tin oxide (ITO:I). Indium zinc oxide, zinc oxide, and gallium are added. It can be formed using zinc oxide, etc. Also, gold, silver, platinum, magnesium, Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or This refers to metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (for example) For example, titanium nitride and the like can also be used by forming them thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive film. For example, silver and magnesium. Using a laminated film of this alloy and ITO is preferable because it can improve conductivity. Alternatively, graphene or the like may be used.

[0139] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as tetracellulose, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, Lantha Nd, neodymium, or germanium may be added. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used for formation. An alloy containing silver and copper is preferable because it has high heat resistance. Furthermore, oxidation of the aluminum alloy film can be suppressed by laminating a metal film or a metal oxide film in contact with the aluminum alloy film. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. The electrodes may be formed by using, for example, a vapor deposition method or a sputtering method. In addition, they can be formed by using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method. When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected from the anode side and electrons are injected from the cathode side into the EL layer 233. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light. The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 includes a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property). An alloy containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used for formation. An alloy containing silver and copper is preferable because it has high heat resistance. Furthermore, oxidation of the aluminum alloy film can be suppressed by laminating a metal film or a metal oxide film in contact with the aluminum alloy film. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. The electrodes may be formed by using, for example, a vapor deposition method or a sputtering method. In addition, they can be formed by using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method. When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected from the anode side and electrons are injected from the cathode side into the EL layer 233. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light.

[0140] The electrodes may be formed by using, for example, a vapor deposition method or a sputtering method. In addition, they can be formed by using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method. When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected from the anode side and electrons are injected from the cathode side into the EL layer 233. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light. The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 includes a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property).

[0141] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected from the anode side and electrons are injected from the cathode side into the EL layer 233. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light. The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 includes a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property). The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light.

[0142] The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 includes a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property). The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 includes a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property). The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 includes a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property). It may further have layers containing (quality, etc.).

[0143] The EL layer 233 can use either low-molecular-weight compounds or high-molecular-weight compounds, and inorganic It may contain compounds. Each layer constituting the EL layer 233 is deposited by a vapor deposition method (vacuum deposition). It can be formed by methods such as (including) transfer, printing, inkjet, and coating. ru.

[0144] Insulated insulating layers 225 and 255 can be made of inorganic insulating material. In particular, permeable to water Using a low insulating film thickness is preferable because it allows for the realization of a highly reliable display panel.

[0145] The insulating layer 227 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 227 can be a silicon oxide film, a silicon oxide nitride film, a silicon nitride film, or a silicon film. Inorganic insulating films such as silicon oxide films and aluminum oxide films can be used.

[0146] The insulating layer 229, insulating layer 229a, and insulating layer 229b are, respectively, transistors. To reduce surface irregularities caused by various factors, it is preferable to select an insulating film that has a planarization function. For example, using organic materials such as polyimide, acrylic, and benzocyclobutene resins. This is possible. In addition to the above organic materials, low dielectric constant materials (low-k materials), etc., can also be used. This can be achieved. Furthermore, laminated structures using insulating films and inorganic insulating films formed from these materials can be created. That's good too.

[0147] The insulating layer 211 is provided covering the end of the lower electrode 231. In order to ensure good coverage of the formed EL layer 233 and upper electrode 235, an insulating layer 21 It is preferable that the side wall of 1 is an inclined surface formed with a continuous curvature.

[0148] As the material for the insulating layer 211, a resin or an inorganic insulating material can be used. Examples include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. A resin such as silicic acid or phenolic resin can be used. In particular, the insulating layer 211 is easy to produce. Therefore, it is preferable to use a negative-type or positive-type photosensitive resin. .

[0149] The method for forming the insulating layer 211 is not particularly limited, but may include photolithography, sputtering, Vapor deposition, droplet ejection (inkjet, etc.), printing methods (screen printing, offset printing) You can use "etc." etc.

[0150] The insulating layer 217 can be formed using an inorganic insulating material or an organic insulating material, for example. For organic insulating materials, negative-type and positive-type photosensitive resins, non-photosensitive resins, etc., can be used. This can be done. Alternatively, a conductive layer may be formed instead of the insulating layer 217. For example, a metal material It can be formed using [a specific method]. Examples of metallic materials include titanium and aluminum. This is possible. A conductive layer is used instead of the insulating layer 217, and the conductive layer and the upper electrode 235 are electrically connected. By configuring the connections to be precise, the potential drop caused by the resistance of the upper electrode 235 can be suppressed. Furthermore, the insulating layer 217 may have a forward taper shape or a reverse taper shape.

[0151] Insulating layer 276, insulating layer 278, insulating layer 291, insulating layer 293, insulating layer 295 are, respectively They can be formed using inorganic or organic insulating materials. In particular, insulating layer 278 and insulating layer 295 It is preferable to use an insulating layer having a planarizing function in order to reduce surface irregularities caused by the sensor element. It is preferable.

[0152] For the sealing layer 213, resins that cure at room temperature such as two-component mixed resins, photo-curable resins, thermo-curable resins, etc. can be used. For example, PVC (polyvinyl chloride) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the sealing layer 213 and is taken out of the display panel, it is preferable that the sealing layer 213 contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, materials similar to those that can be used for the adhesive layer 258 can be mentioned. For the sealing layer 213, resins that cure at room temperature such as two-component mixed resins, photo-curable resins, thermo-curable resins, etc. can be used. For example, PVC (polyvinyl chloride) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the sealing layer 213 and is taken out of the display panel, it is preferable that the sealing layer 213 contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, materials similar to those that can be used for the adhesive layer 258 can be mentioned. The sealing layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the sealing layer 213 and is taken out of the display panel, it is preferable that the sealing layer 213 contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, materials similar to those that can be used for the adhesive layer 258 can be mentioned. The sealing layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the sealing layer 213 and is taken out of the display panel, it is preferable that the sealing layer 213 contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, materials similar to those that can be used for the adhesive layer 258 can be mentioned. The sealing layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the sealing layer 213 and is taken out of the display panel, it is preferable that the sealing layer 213 contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, materials similar to those that can be used for the adhesive layer 258 can be mentioned. The sealing layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the sealing layer 213 and is taken out of the display panel, it is preferable that the sealing layer 213 contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, materials similar to those that can be used for the adhesive layer 258 can be mentioned.

[0153] The conductive layers 156, 157, 294, and 296 can be formed of the same material and in the same process as the conductive layer constituting the transistor or the light-emitting element, respectively. Also, the conductive layer 280 can be formed of the same material and in the same process as the conductive layer constituting the transistor. The conductive layers 156, 157, 294, and 296 can be formed of the same material and in the same process as the conductive layer constituting the transistor or the light-emitting element, respectively. Also, the conductive layer 280 can be formed of the same material and in the same process as the conductive layer constituting the transistor. The conductive layers 156, 157, 294, and 296 can be formed of the same material and in the same process as the conductive layer constituting the transistor or the light-emitting element, respectively. Also, the conductive layer 280 can be formed of the same material and in the same process as the conductive layer constituting the transistor.

[0154] For example, each of the above conductive layers can be formed as a single layer or by lamination using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, etc. or an alloy material containing these elements. Also, each of the above conductive layers can be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, etc. For example, each of the above conductive layers can be formed as a single layer or by lamination using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, etc. or an alloy material containing these elements. Also, each of the above conductive layers can be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, etc. For example, each of the above conductive layers can be formed as a single layer or by lamination using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, etc. or an alloy material containing these elements. Also, each of the above conductive layers can be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, etc. For example, each of the above conductive layers can be formed as a single layer or by lamination using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, etc. or an alloy material containing these elements. Also, each of the above conductive layers can be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, etc. For example, each of the above conductive layers can be formed as a single layer or by lamination using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, etc. or an alloy material containing these elements. Also, each of the above conductive layers can be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, etc. Zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide A product containing n can be used.

[0155] Furthermore, conductive layer 237, conductive layer 212, conductive layer 310a, and conductive layer 310b are also, respectively, It can be formed using the above-mentioned metal material, alloy material, or conductive metal oxide, etc.

[0156] The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting. It is a conductive layer. For example, indium oxide, ITO, indium zinc oxide, zinc oxide. , zinc oxide with gallium added can be used. Also, conductive layer 270 is conductive layer 2 It can be formed using the same materials and process as 72.

[0157] The conductive particles 292 are particles such as organic resin or silica whose surface is coated with a metallic material. Use the following. Using nickel or gold as the metallic material is preferable because it can reduce contact resistance. Furthermore, particles coated with two or more metal materials in layers, such as nickel coated with gold. It is preferable to use [this].

[0158] The connector 215 is a paste or sheet made by mixing metal particles with a thermosetting resin. Materials exhibiting anisotropic conductivity through thermocompression bonding can be used. These are particles made of two or more metals in a layered structure, such as nickel particles coated with gold. It is preferable to use [this].

[0159] The colored layer 259 is a colored layer that transmits light in a specific wavelength band. For example, the red wavelength band A red (R) color filter that transmits light, and a green (G) filter that transmits light in the green wavelength range. Using color filters, such as a blue (B) color filter that transmits light in the blue wavelength range. Each colored layer can be created using various materials, printing methods, inkjet methods, and photo They are formed at the desired locations using etching methods such as lithography.

[0160] Furthermore, a light-shielding layer 257 is provided between adjacent colored layers 259. This blocks light from diffracting around adjacent light-emitting elements, suppressing color mixing between adjacent pixels. By positioning the edge of the colored layer 259 so as to overlap with the light-shielding layer 257, light leakage is suppressed. The light-shielding layer 257 can be made of a material that shields the light emitted from the light-emitting element. It can be formed using metal materials, resin materials containing pigments or dyes, etc. (See Figure 8) As shown in B), the light-shielding layer 257 is located in areas other than the light extraction section 224, such as the drive circuit section 226. Placing it in the region is preferable because it can suppress unintended light leakage caused by guided light, etc.

[0161] Furthermore, if an insulating layer 261 is provided to cover the colored layer 259 and the light-shielding layer 257, the colored layer 259 and the light-shielding layer will be provided. This is preferable because it suppresses the diffusion of impurities such as pigments contained in layer 257 into the light-emitting element, etc. The insulating layer 261 uses a light-transmitting material, and inorganic insulating materials or organic insulating materials can be used. Yes, it is possible. A low-permeability insulating film may be used for the insulating layer 261. Note that the insulating layer 261 is not necessary. In that case, it is not necessary to provide it.

[0162] <Example of manufacturing method> Next, a method for manufacturing a display panel according to one embodiment of the present invention will be illustrated using Figures 12 and 13. Here, we will explain using the display panel configuration shown in Specific Example 1 (Figure 8(B)) as an example.

[0163] First, a release layer 313 is formed on the fabricated substrate 311, and an insulating layer 225 is formed on the release layer 313. Next, multiple transistors, conductive layer 157, insulating layer 227, insulating layer 225 are placed on the insulating layer 225. A layer 229, multiple light-emitting elements, and an insulating layer 211 are formed. Note that the conductive layer 157 is exposed. In this manner, insulating layers 211, 229, and 227 are open (Figure 12(A)). .

[0164] Furthermore, a release layer 307 is formed on the fabricated substrate 305, and an insulating layer 255 is formed on the release layer 307. Next, a light-shielding layer 257, a colored layer 259, and an insulating layer 261 are formed on the insulating layer 255. (Figure 12(B)).

[0165] The fabricated substrates 311 and 305 are a glass substrate, a quartz substrate, and a sapphire substrate, respectively. A substrate such as an earpiece, ceramic substrate, metal substrate, or organic resin substrate can be used.

[0166] Furthermore, the glass substrate can be, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as barium borosilicate glass can be used. The temperature of the subsequent heat treatment. If the temperature is high, it is best to use a material with a strain point of 730°C or higher. By incorporating it, more practical heat-resistant glass can be obtained. In addition, crystallized glass can be used. It is possible to be there.

[0167] When a glass substrate is used for fabrication, a silicon oxide film and an oxide film are placed between the fabricated substrate and the release layer. When insulating films such as silicon nitride films, silicon nitride films, and silicon oxide nitride films are formed, glass This is preferable because it prevents contamination from the substrate.

[0168] The release layer 313 and the release layer 307 are tungsten, molybdenum, and titanium, respectively. Tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium , elements selected from palladium, osmium, iridium, and silicon, and compounds containing said elements It consists of a gold material or a compound material containing the element, and is a single layer or a laminated layer. The crystalline structure of the layer containing this material may be amorphous, microcrystalline, or polycrystalline.

[0169] The release layer can be formed by sputtering, plasma CVD, coating, printing, or other methods. The coating method includes spin coating, droplet dispensing, and dispensing.

[0170] If the delamination layer has a single-layer structure, it may consist of a tungsten layer, a molybdenum layer, or a mixture of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten oxide or acid. A layer containing nitride, a layer containing molybdenum oxide or nitride, or tungsten A layer containing an oxide or oxidized nitride of a mixture of molybdenum may be formed. A mixture of tungsten and molybdenum is equivalent to, for example, an alloy of tungsten and molybdenum. do.

[0171] Furthermore, the release layer has a laminated structure consisting of a tungsten-containing layer and a tungsten oxide-containing layer. When forming it, a layer containing tungsten is formed, and an insulating film made of oxide is formed on top of it. By forming this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. The formation of this can be utilized. Alternatively, the surface of the tungsten-containing layer can be subjected to thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozonated water and other highly oxidizing solvents A layer containing tungsten oxide may be formed by liquid treatment or other methods. Plasma treatment may also be performed. The processing and heat treatment can be performed using oxygen, nitrogen, nitrous oxide alone, or a mixture of these gases with other gases. This may be carried out under a gaseous atmosphere. The surface condition of the peeled layer is obtained by the plasma treatment or heat treatment described above. By changing this, it is possible to control the adhesion between the delamination layer and the insulating layer that is formed later. ru.

[0172] Each insulating layer is formed using methods such as sputtering, plasma CVD, coating, or printing. It is possible to achieve, for example, by plasma CVD, a film deposition temperature of 250°C to 400°C. By forming it as described below, a dense and extremely low-permeability membrane can be created.

[0173] Subsequently, the surface of the fabricated substrate 305 on which the colored layer 259 etc. is provided, or the light-emitting element of the fabricated substrate 311 A material that will form a sealing layer 213 is applied to the surface on which 230 etc. are provided, and the sealing layer 213 is used to seal the surface The fabricated substrates 311 and 305 are bonded together so that they face each other (Figure 12(C) ))

[0174] Then, the fabricated substrate 311 is peeled off, and the exposed insulating layer 225 and substrate 221 are bonded to the adhesive layer 223 They are bonded together using [a specific method]. Furthermore, the fabricated substrate 305 is peeled off, and the exposed insulating layer 255 and substrate 2 are bonded together. 22 is bonded using the adhesive layer 258. In Figure 13(A), the substrate 222 is bonded to the conductive layer 1 Although the configuration is designed so that it does not overlap with layer 57, the conductive layer 157 and the substrate 222 may overlap.

[0175] Furthermore, various methods can be used as appropriate for the peeling process. For example, as the peeling layer, If a layer containing a metal oxide film is formed on the side in contact with the abscission layer, the metal oxide film is crystallized. It weakens the material, allowing the peelable layer to be removed from the fabricated substrate. Furthermore, it provides a highly heat-resistant fabricated substrate. When an amorphous silicon film containing hydrogen is formed as a release layer between the plate and the layer to be released, the laser light By removing the amorphous silicon film by irradiation or etching, the peeled layer is removed from the fabricated substrate. It can be peeled off. Furthermore, the peeling layer includes a metal oxide film on the side in contact with the layer to be peeled off. This forms a metal oxide film, weakens it through crystallization, and further removes a portion of the peeled layer with a solution or NF3 After being removed by etching with fluoride gases such as BrF3 and ClF3, the weakened gold It can be exfoliated in the oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as the exfoliation layer. Using a film containing hydrogen (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) The delamination layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained within the delamination layer as gases. A method may be used to promote the separation of the layer to be peeled from the substrate. The fabricated substrate is mechanically removed or removed using a solution or fluorine gas such as NF3, BrF3, or ClF3. Methods such as etching can be used for removal. In this case, it is not necessary to provide a stripping layer. stomach.

[0176] Furthermore, by combining multiple of the above peeling methods, the peeling process can be carried out more easily. In other words, irradiation with laser light, etching of the stripping layer with gas or solution, sharp knife or metal After mechanical removal using tools such as a squeegee to make the peeled layer and the layer to be peeled easier to separate, Detachment can also be performed using physical force (such as machinery).

[0177] Furthermore, even if the layer to be peeled off is removed from the fabricated substrate by permeating a liquid into the interface between the peeling layer and the layer to be peeled, That's fine. Additionally, you can apply a liquid such as water while peeling.

[0178] Other peeling methods include, if the peeling layer is formed with tungsten, using ammonia water and peroxide. It is preferable to perform the stripping process while etching the stripping layer with a mixed solution of hydrogen oxide water.

[0179] Furthermore, if peeling is possible at the interface between the fabricated substrate and the peel-off layer, a peel-off layer may not be necessary. For example, glass is used as the fabrication substrate, and polyimide, polyester, and poly are placed in contact with the glass. Forming organic resins such as olefins, polyamides, polycarbonates, and acrylics, and organic resins An insulating film or transistor is formed on top. In this case, by heating the organic resin, It can be peeled off at the interface between the manufactured substrate and the organic resin. Alternatively, a metal can be placed between the manufactured substrate and the organic resin. A layer is created, and by passing an electric current through the metal layer, the metal layer is heated, and the layer peels off at the interface between the metal layer and the organic resin. You may separate.

[0180] Finally, the insulating layer 255 and the sealing layer 213 are opened to expose the conductive layer 157. Figure 13(B)). Note that if the substrate 222 overlaps with the conductive layer 157, the conductive layer 157 To expose the substrate 222 and the adhesive layer 258 are also opened (Figure 13(C)). The methods are not particularly limited, for example, laser ablation, etching, ion beams A puttering method or similar can be used. Alternatively, a sharp blade or the like can be used on the film on the conductive layer 157. You can also make an incision and physically peel off a portion of the membrane.

[0181] Based on the above, a display panel according to one embodiment of the present invention can be manufactured.

[0182] As described above, a display panel according to one aspect of the present invention comprises a substrate 222 and a substrate 221 or a substrate It consists of two circuit boards, board 239 and . Furthermore, even if the configuration includes a touch sensor, 2 It can be constructed with a minimum number of substrates. By minimizing the number of substrates, the light extraction efficiency can be improved. Improvements and enhancements to display clarity become easier.

[0183] This embodiment can be combined with other embodiments as appropriate. [Explanation of Symbols]

[0184] 101 Display Unit 101a Display Unit 101b Display Unit 101c Display Unit 101d Display Unit 103 cabinets 103a Enclosure 103b enclosure 106 Connection section 110 Display device 120 Display device 130 Display device 140 Display device 156 Conductive layer 157 Conductive layer 201 Support 203 Display Panel 203a Display area 203b Hidden area 205 Convex part 207 Convex part 211 Insulating layer 212 Conductive layer 213 Sealing layer 215 Connectors 215a Connector 215b Connector 217 Insulating layer 221 circuit board 222 circuit boards 223 Adhesive layer 224 Light extraction section 225 Insulating layer 226 Drive Circuit Section 227 Insulating layer 228 FPC 228a FPC 228b FPC 229 Insulating layer 229a Insulating layer 229b Insulating layer 230 light-emitting elements 231 Lower electrode 233 EL layer 235 Upper electrode 237 Conductive layer 239 circuit boards 240 transistors 255 Insulating layer 257 Light blocking layer 258 Adhesive layer 259 Colored layer 261 Insulating layer 270 Conductive layer 271 p-type semiconductor layer 272 Conductive layer 273 i-type semiconductor layer 274 Conductive layer 275 n-type semiconductor layer 276 Insulating layer 278 Insulating layer 280 Conductive layer 281 Conductive layer 283 Conductive layer 291 Insulating layer 292 Conductive particles 293 Insulating layer 294 Conductive layer 295 Insulating layer 296 Conductive layer 301 area 303 areas 305 Fabricated substrate 307 Delamination layer 310a conductive layer 310b conductive layer 311 Fabricated substrate 313 Exfoliation layer

Claims

[Claim 1] The present invention comprises two display units, each having a display panel with a display area and a non-display area, a support having a first surface overlapping the display area and a second surface continuous with the first surface and overlapping the non-display area, and a foldable housing that supports the two display units and has a connecting portion sandwiched between the two display units. In the unfolded state of the housing, the two display units are arranged such that the first surfaces of their respective supports face the same direction and the second surfaces of their respective supports face each other.

Images