Holding unit, processing apparatus, and processing method

Abstract

The present invention provides a holding unit that enables the positioning of workpieces, such as semiconductor package substrates, at a desired location on a table without requiring any intervention from the operator. [Solution] A holding unit for holding an object to be processed, comprising a table having a base portion and a holding portion erected from the base portion and capable of holding an object to be processed, and a mounting member having a through hole into which the holding portion can be inserted, wherein the object to be processed is positioned on the holding portion and the mounting member is supported by the base portion by inserting the holding portion into the through hole of the mounting member on which the object to be processed is placed so as to overlap the through hole.

Description

Technical Field

[0001] The present invention relates to a holding unit for holding an object to be processed, a processing apparatus for processing the object to be processed held by the holding unit, and a processing method for processing the object to be processed using the holding unit.

Background Art

[0002] A semiconductor package such as an IC (Integrated Circuit), which is an essential component in various electronic devices such as mobile phones and personal computers, is manufactured through a semiconductor manufacturing process. This semiconductor manufacturing process is roughly divided into a pre-process for forming a plurality of semiconductor devices each including a large number of circuit elements on a wafer, and a post-process for packaging each of the plurality of chips manufactured by processing the wafer.

[0003] In the post-process, for example, each of the plurality of chips is packaged in the following order. First, a plurality of chips are mounted on a lead frame so that each is connected to an external electrode. Next, a semiconductor package substrate is formed by encapsulating the plurality of chips with resin. Next, the semiconductor package substrate is flattened. Next, a plurality of semiconductor packages are formed by dividing the semiconductor package substrate along the boundaries of the plurality of chips.

[0004] The flattening of the semiconductor package substrate is carried out, for example, in a processing apparatus including a table for holding the semiconductor package substrate and a turning unit including a cutting tool (see, for example, Patent Document 1). Specifically, this flattening is carried out by partially removing the resin contained in the semiconductor package substrate held on the table with the cutting tool.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] The loading of semiconductor package substrates onto the table is sometimes performed manually by the processing unit operator. In this case, the operator's work required to position the semiconductor package substrate in the desired location on the table can be complicated.

[0007] In view of this, the object of the present invention is to provide a holding unit that enables the positioning of a workpiece, such as a semiconductor package substrate, at a desired position on a table without bothering an operator, a processing apparatus for processing a workpiece held by this holding unit, and a processing method for processing a workpiece using this holding unit. [Means for solving the problem]

[0008] According to one aspect of the present invention, a holding unit for holding an object to be processed is provided, comprising: a table having a base portion and a holding portion erected from the base portion and capable of holding the object to be processed; and a mounting member having a through hole into which the holding portion can be inserted, wherein the object to be processed is positioned on the holding portion and the mounting member is supported by the base portion by inserting the holding portion into the through hole of the mounting member on which the object to be processed is placed so as to overlap the through hole.

[0009] Furthermore, it is preferable that the length of the through-hole is smaller than the height of the holding portion. It is also preferable that a communication passage for connecting the mounting member supported by the base portion with the suction source is formed in the base portion. Furthermore, it is preferable that the through-hole includes a step at its upper end into which the object to be processed fits when it is placed. It is also preferable that one of the fitting portion or the fitted portion is formed in the base portion or the mounting member, and the other of the fitting portion or the fitted portion is formed in the other of the base portion or the mounting member, and that the fitting portion and the fitted portion fit together when the base portion supports the mounting member. Furthermore, it is preferable that the holding portion has a cylindrical side wall and a plurality of support pins provided inside the side wall, the upper surfaces of which are on the same plane as the upper surface of the side wall, and that a communication passage for connecting the space inside the side wall with the suction source is formed in the base portion. Furthermore, it is preferable that at least a part of the upper surface of the mounting member is inclined.

[0010] According to another aspect of the present invention, a holding unit for holding a plurality of objects to be processed is provided, comprising: a table having a base portion and a plurality of holding portions erected from the base portion, each capable of holding any of the plurality of objects to be processed which are different from each other; and a mounting member having a plurality of through holes into which any of the plurality of holding portions which are different from each other can be inserted, wherein the plurality of objects to be processed are placed on the mounting member so as to cover the plurality of through holes, and the mounting member is supported by the base portion, by inserting the plurality of holding portions into the plurality of through holes of the mounting member so as to cover the plurality of through holes, the plurality of objects to be processed are positioned on the plurality of holding portions, and the mounting member is supported by the base portion.

[0011] According to yet another aspect of the present invention, there is a processing apparatus for processing an object to be processed, comprising: a holding unit for holding the object to be processed; a processing unit for processing the object held by the holding unit; and a liquid supply source for supplying liquid to the object held by the holding unit, wherein the holding unit comprises a table having a base portion and a holding portion erected from the base portion and capable of holding the object to be processed, and a mounting member having a through hole into which the holding portion can be inserted, wherein the object to be processed is positioned on the holding portion and the mounting member is supported by the base portion by inserting the holding portion into the through hole of the mounting member on which the object to be processed is placed so as to overlap the through hole.

[0012] Furthermore, it is preferable that at least a portion of the upper surface of the mounting member is inclined so as not to retain the liquid supplied from the liquid source. It is also preferable that the processing unit is a turning unit including a cutting tool for flattening the workpiece.

[0013] According to yet another aspect of the present invention, a processing method is provided for processing an object to be processed using a holding unit comprising: a table having a base portion and a holding portion erected from the base portion and capable of holding an object to be processed; and a mounting member having a through hole into which the holding portion can be inserted, the processing method comprising: a placement step of placing the object to be processed on the mounting member so as to overlap with the through hole of the mounting member; a support step after the placement step of positioning the object to be processed on the holding portion by inserting the holding portion into the through hole and supporting the mounting member with the base portion; a holding step after the support step of holding the object to be processed on the holding portion and holding the mounting member on the base portion; and a processing step after the holding step of processing the object to be processed held on the holding portion. [Effects of the Invention]

[0014] In this invention, the workpiece is positioned on the holding part by inserting the holding part into the through-hole of the mounting member on which the workpiece is placed so as to overlap the through-hole, and the workpiece is then transported to the table by the mounting member being supported by the base part. This makes it possible to position the workpiece at a desired position on the table without bothering the operator. [Brief explanation of the drawing]

[0015] [Figure 1] Figure 1(A) is a schematic plan view showing an example of an object to be processed, and Figure 1(B) is a schematic cross-sectional view showing the object to be processed shown in Figure 1(A). [Figure 2] Figure 2(A) is a schematic perspective view showing an example of a holding unit for holding an object to be processed, and Figure 2(B) is a schematic enlarged cross-sectional view showing the holding unit shown in Figure 2(A). [Figure 3] Figure 3 is an exploded perspective view schematically showing the components of the holding unit. [Figure 4] Figure 4 is a schematic diagram showing an example of a turning apparatus for flattening a workpiece held by a holding unit. [Figure 5] Figure 5 is a schematic diagram showing some of the components of a turning machine. [Figure 6] Figure 6 is a schematic flowchart illustrating an example of a turning method for flattening a workpiece using a turning machine. [Figure 7] Figure 7(A) is a schematic perspective view showing the mounting step included in an example of a turning method, and Figure 7(B) is a schematic enlarged cross-sectional view showing the workpiece and mounting member after the mounting step. [Figure 8] Figure 8(A) is a schematic perspective view showing the support step included in an example of a turning method, and Figure 8(B) is a schematic enlarged cross-sectional view showing the workpiece and holding unit after the support step. [Figure 9] Figure 9 is a schematic diagram showing the holding step included in an example of a turning method. [Figure 10]FIG. 10(A) is a diagram schematically showing a state of a flattening step included in an example of a turning method, and FIG. 10(B) is a partially enlarged cross-sectional view schematically showing a workpiece and a holding unit 2 after the flattening step. [Figure 11] FIG. 11 is a partially enlarged cross-sectional view schematically showing another example of a mounting member included in the holding unit. [Figure 12] FIG. 12(A) is a partially enlarged cross-sectional view schematically showing another example of the holding unit, and FIG. 12(B) is a partially sectional side view schematically showing a state of unloading a flattened workpiece from the holding unit shown in FIG. 12(A). [Figure 13] FIG. 13 is a flowchart schematically showing another example of a turning method for flattening a workpiece in a turning apparatus. [Figure 14] FIG. 14(A) is a perspective view schematically showing a state of a presser plate mounting step included in another example of the turning method, and FIG. 14(B) is a partially enlarged cross-sectional view schematically showing a workpiece, a mounting member, and a presser plate after the presser plate mounting step. [Figure 15] FIG. 15(A) is a partially enlarged cross-sectional view schematically showing a workpiece, a presser plate, and a holding unit after a support step included in another example of the turning method, and FIG. 15(B) is a partially enlarged cross-sectional view schematically showing a state of a removal step included in another example of the turning method. MODE FOR CARRYING OUT THE INVENTION

[0016] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1(A) is a plan view schematically showing an example of a workpiece, and FIG. 1(B) is a cross-sectional view schematically showing the workpiece shown in FIG. 1(A). The workpiece 11 shown in FIGS. 1(A) and 1(B) is a semiconductor package substrate including a rectangular plate-shaped lead frame portion 13 and a sealing portion (mold portion) 15 provided on the lead frame portion 13.

[0017] Furthermore, multiple external electrodes are provided inside the rectangular tubular portion 13a near the outer circumference of the lead frame portion 13. Multiple chips (not shown) are mounted on the lead frame portion 13, each connected to an external electrode. The sealing portion 15 is provided inside the rectangular tubular portion 13a of the lead frame portion 13 to seal the multiple chips. The sealing portion 15 contains resin and has a curved surface.

[0018] Figure 2(A) is a schematic perspective view showing an example of a holding unit for holding the workpiece 11, and Figure 2(B) is a schematic enlarged cross-sectional view showing the holding unit shown in Figure 2(A). Figure 3 is an exploded perspective view showing the components of the holding unit shown in Figures 2(A) and 2(B). The holding unit 2 shown in Figures 2(A), 2(B), and 3 comprises a table 4 and a mounting member 6 that can be attached to and removed from the table 4.

[0019] Table 4 includes a disc-shaped base portion 8 and four holding portions 10, each erected from the base portion 8. Two cylindrical fitting portions 12 are formed on the upper surface of the base portion 8. Furthermore, the base portion 8 has two connecting passages 14a that open in areas of its upper surface that do not overlap with any of the four holding portions 10, and at least four connecting passages 14b that open in areas of its upper surface that each overlap with any of the four holding portions 10.

[0020] Each retaining part 10 has a rectangular tubular side wall 16 and a plurality of support pins 18 provided inside the side wall 16. In addition, at least one of at least four connecting passages 14b is open inside the side wall 16 of each retaining part 10. At least four connecting passages 14b are in communication with each other.

[0021] In plan view, the outer circumference of the side wall 16 is rectangular, smaller than the outer circumference of the workpiece 11. That is, in plan view, the length and width of the outer circumference of the side wall 16 are smaller than the length and width of the outer circumference of the workpiece 11. In addition, each support pin 18 has a cylindrical shape, and its upper surface lies on the same plane as the upper surface of the side wall 16.

[0022] In plan view, the mounting member 6 has a disc shape with an outer diameter equal to that of the table 4 (specifically, its base portion 8). Furthermore, two cylindrical fitting portions 20 are formed on the lower surface of the mounting member 6. The two fitting portions 20 have shapes corresponding to the two fitting portions 12 formed on the base portion 8, that is, shapes that allow the two fitting portions 12 to fit into each other.

[0023] Furthermore, the mounting member 6 has four rectangular tubular through holes 22 formed therein. The four through holes 22 are positioned directly above the four holding parts 10 when the two fitting parts 12 are positioned directly above the two fitted parts 20, respectively. In addition, the length of each through hole 22 (specifically, the length along the thickness direction of the mounting member 6) is smaller than the height of the holding part 10 (specifically, the distance between the upper surface of the base part 8 along the thickness direction of the table 4 and the upper surfaces of the side walls 16 and the multiple support pins 18).

[0024] In addition, each through-hole 22 includes a step 22a at its upper end. The inner circumference of the upper step and the outer circumference of the lower step of this step 22a are rectangular in shape, in a plan view, and are the same size as or slightly larger than the outer circumference of the workpiece 11. Furthermore, the outer circumference of the portion of each through-hole 22 below the step 22a is rectangular in shape, in a plan view, and is the same size as or slightly larger than the outer circumference of the side wall 16 of the holding portion 10, but smaller than the outer circumference of the workpiece 11.

[0025] Therefore, when the object to be processed 11 is placed on the mounting member 6 so as to overlap with one of the four through holes 22, the object to be processed 11 is fitted into the step 22a, that is, the rectangular tubular portion 13a of the object to be processed 11 is supported on the lower step 22a. Furthermore, when the mounting member 6 is attached to the table 4 so as to fit the two fitting portions 12 formed on the base portion 8 into the two fitted portions 20 formed on the mounting member 6, the holding portion 10 is inserted into each through hole 22 and the mounting member 6 is supported by the base portion 8.

[0026] Figure 4 is a schematic diagram showing an example of a turning apparatus (processing device) for flattening a workpiece 11 held by a holding unit 2. In Figure 4, the directions indicated by arrow X (X direction, forward direction) and arrow Y (Y direction, left direction) are mutually orthogonal directions on the horizontal plane. Also, the direction indicated by arrow Z (Z direction, upward direction) is perpendicular to the X direction and the Y direction, respectively.

[0027] The turning apparatus 24 shown in Figure 4 has a table base 26 on which a holding unit 2 is mounted. The table base 26 also has a communication passage (not shown) that communicates with communication passages 14a and 14b formed in the base portion 8 of the table 4 of the holding unit 2. The communication passage formed in the table base 26 is connected to a suction source 30a via a valve 28a and to an air supply source 30b via a valve 28b.

[0028] The suction source 30a includes, for example, an ejector. The air supply source 30b includes, for example, a tank for storing high-pressure air, a filter for removing foreign matter mixed in with the air supplied from the tank, and a regulator for adjusting the pressure of the air supplied from the tank.

[0029] When valve 28a is opened and the suction source 30a is activated, the communication passages 14a and 14b become negatively pressurized, and a suction force acts on the space near the upper surface of the base portion 8 and the space inside the side wall 16 of the holding portion 10. Conversely, when valve 28a is closed and the operation of the suction source 30a is stopped, and then valve 28b is opened and the air supply source 30b is activated, the communication passages 14a and 14b return to normal pressure and the suction force disappears.

[0030] Furthermore, an X-direction movement mechanism 32 is connected to the underside of the table base 26. This X-direction movement mechanism 32 includes, for example, a ball screw whose nut is connected to the table base 26 and extends along the X-direction, and a motor connected to one end of the screw shaft of the ball screw. When this X-direction movement mechanism 32 (specifically, its motor) is operated, the table base 26 moves along the X-direction.

[0031] A support structure 34 is provided behind the table base 26. A recess 34a extending along the Z direction is formed on the front surface of this support structure 34. A support shaft 36 is inserted into this recess 34a, and a Z-direction movement mechanism (not shown) is provided inside it.

[0032] This Z-direction movement mechanism includes, for example, a ball screw whose nut is connected to the rear end of the support shaft 36 and which extends along the Z-direction, and a motor connected to one end of the screw shaft of the ball screw. When this Z-direction movement mechanism (specifically, the motor) is operated, the support shaft 36 moves along the Z-direction.

[0033] Furthermore, a turning unit (processing unit) 38 is provided at the front end of the support shaft 36. This turning unit 38 has a spindle housing 40 fixed to the front end of the support shaft 36, and a spindle 42 extending along the Z direction is partially housed in this spindle housing 40 in a rotatable manner. A motor (not shown) connected to the upper end (base end) of the spindle is also housed in the spindle housing 40, and when this motor is operated, the spindle 42 rotates with a straight line along the Z direction as its axis of rotation.

[0034] Furthermore, the spindle 42 protrudes downward through a through hole formed in the bottom of the spindle housing 40, and a disc-shaped mount 44 is provided at its lower end (tip). A cutting tool 46 for turning the workpiece 11 held by the holding unit 2 is attached to the portion of the mount 44 near its outer circumference.

[0035] Figure 5 shows the mount 44, etc. This mount 44 includes a base portion 48 in which a channel 48a communicating with a channel 42a formed in the spindle 42 is formed in the center, and a bottomed cylindrical hanging portion 50 that hangs down surrounding the channel 48a. The hanging portion 50 also has a plurality of through holes 50a that extend in a direction perpendicular to the Z direction and communicate with the channel 48a formed in the base portion 48.

[0036] Furthermore, the multiple through-holes 50a formed in the hanging portion 50 communicate with a liquid supply source 52, such as a pump that supplies liquids like water, via the flow channels 48a formed in the base portion 48 and the flow channels 42a formed in the spindle 42. When this liquid supply source 52 is operated, liquid is supplied radially to the space below the mount 44 through the flow channels 42a, 48a and the multiple through-holes 50a.

[0037] Figure 6 is a schematic flowchart illustrating an example of a turning method (processing method) for flattening a workpiece 11 in a turning machine 24. In this method, first, the workpiece 11 is placed on the mounting member 6 so that it overlaps with the through hole 22 of the mounting member 6 (mounting step S1). Figure 7(A) is a schematic perspective view showing the state of mounting step S1, and Figure 7(B) is a schematic enlarged cross-sectional view showing the workpiece 11 and mounting member 6 after mounting step S1.

[0038] Specifically, in the placement step S1, the four objects to be processed 11 are placed on the placement member 6 such that the sealed portion 15 of each object 11 is fitted into the stepped portion 22a of the four through holes 22 of the placement member 6, which has been removed from the table 4. By fitting the objects to be processed 11 into the stepped portion 22a in this way, it is possible to suppress the movement of the objects to be processed 11 when the placement member 6 is reattached to the table 4.

[0039] Following the placement step S1, the workpiece 11 is positioned on the holding part 10 by inserting the holding part 10 of the table 4 into the through hole 22, and the placement member 6 is supported by the base part 8 (support step S2). Figure 8(A) is a schematic perspective view showing the support step S2, and Figure 8(B) is a schematic enlarged cross-sectional view showing the workpiece 11 and the holding unit 2 after the support step S2.

[0040] Specifically, in the support step S2, the holding portion 10 is inserted into each of the four through holes 22, and the two fitting portions 12 formed on the base portion 8 are fitted into the two receiving portions 20 formed on the mounting member 6. As a result, the four objects to be processed 11 are transferred from the mounting member 6 to the four holding portions 10 and positioned on them, while the mounting member 6 is supported by the base portion 8.

[0041] Following the support step S2, the workpiece 11 is held on the holding part 10 and the mounting member 6 is held on the base part 8 (holding step S3). Figure 9 is a schematic diagram showing the holding step S3.

[0042] Specifically, in the holding step S3, the valve 28a is opened and the suction source 30a is activated. As a result, suction force acts on the four objects to be processed 11 through at least four connecting passages 14b, and suction force acts on the mounting member 6 through two connecting passages 14a formed in the base portion 8. Consequently, the objects to be processed 11 are held on the holding portion 10 and the mounting member 6 is held on the base portion 8.

[0043] After the holding step S3, the workpiece 11 held on the holding unit 10 is flattened (flattening step (processing step) S4). Figure 10(A) is a schematic diagram showing the flattening step S4, and Figure 10(B) is a schematic partially enlarged cross-sectional view showing the workpiece 11 and the holding unit 2 after the flattening step S4.

[0044] Specifically, in the flattening step S4, first, the X-direction movement mechanism 32 is operated so that the table base 26 is sufficiently separated from the turning unit 38 in a plan view. Next, the Z-direction movement mechanism, which is located inside the recess 34a formed in the support structure 34, is operated so that the lower end of the cutting tool 46 is positioned at a height equal to the finished thickness of the workpiece 11 above the upper surface of each holding part 10.

[0045] Next, the motor housed in the spindle housing 40 is operated so that the cutting tool 46 rotates around the rotation axis of the spindle 42, and the liquid supply source 52 is operated so that liquid is supplied radially toward the space below the mount 44, while the X-direction movement mechanism 32 is operated so that each holding part 10 passes under the turning unit 38 (see Figure 10(A)). As a result, the upper part of the sealing part 15 of the workpiece 11 is removed by the cutting tool 46 while liquid is supplied to it, forming a flat surface 15a on the sealing part 15.

[0046] In the embodiment described above, the workpiece 11 is positioned on the holding part 10 by inserting the holding part 10 into the through hole 22 of the mounting member 6 on which the workpiece 11 is placed so as to overlap with the through hole 22, and the workpiece 11 is transported to the table 4 by the mounting member 6 being supported by the base part 8. This makes it possible to position the workpiece 11 at a desired position on the table 4 without bothering the operator of the turning machine 24.

[0047] The embodiments described above are merely one aspect of the present invention, and the present invention is not limited to the embodiments described above. For example, in the holding unit of the present invention, the table may have n holding parts (where n is a natural number other than 4), and the mounting member may have n through holes. Furthermore, in the holding unit of the present invention, the length of the through holes may be greater than or equal to the height of the holding parts, and the through holes may not include a step at the upper end.

[0048] Furthermore, in the holding unit of the present invention, a fitting portion may be formed on the base portion of the table and a fitting portion may be formed on the mounting member. Alternatively, in the holding unit of the present invention, neither a fitting portion nor a fitting portion may be formed on either the base portion of the table or the mounting member.

[0049] Furthermore, in the holding unit of the present invention, the mounting member may include an upper surface that is at least partially inclined. Figure 11 is a schematic partially enlarged cross-sectional view showing an example of such a mounting member. The mounting member 54 shown in Figure 11 has the same structure as the mounting member 6 described above, except that its upper surface 54a is inclined such that it becomes lower as it moves away from the step 56a of the through hole 56. When the holding unit is equipped with a mounting member 54, it is preferable in that, for example, the probability of the liquid supplied to the sealing portion 15 in the flattening step S4 described above remaining on the mounting member 6 can be reduced.

[0050] Furthermore, the holding unit of the present invention may be provided with a push-up mechanism to facilitate the removal of the flattened workpiece 11. Figure 12(A) is a schematic partially enlarged cross-sectional view showing an example of a holding unit equipped with such a push-up mechanism, and Figure 12(B) is a schematic partially cross-sectional side view showing the removal of the flattened workpiece 11 from the holding unit shown in Figure 12(A).

[0051] The holding unit 58 shown in Figure 12(A) has the same structure as the holding unit 2 described above, except that an air cylinder (pushing mechanism) 66 is provided in the base portion 62 of the table 60 in the part that overlaps with the step 64a when the mounting member 64 is attached, and a through hole is formed in the mounting member 64 into which the rod 66a of the air cylinder 66 is inserted. In this holding unit 58, the flattened workpiece 11 can be held on the holding unit 68 by utilizing the suction force acting in the space inside the side wall 68a of the holding unit 68 by creating a negative pressure in the communication passage 62a formed in the base portion 62.

[0052] Then, when unloading the flattened workpiece 11 from the holding unit 58, the air cylinder 66 is operated to return the communication passage 62a formed in the base portion 62 to atmospheric pressure before raising the rod 66a (see Figure 12(B)). This separates the workpiece 11 from the holding portion 68, making it easier to unload.

[0053] Furthermore, in the apparatus of the present invention, the internal pressure of the communication passage 14a and the communication passage 14b, which open in a region formed in the base portion 8 of the table 4 of the holding unit 2, may be independently adjustable. For example, in the apparatus of the present invention, a first communication passage that can communicate with one of the communication passages 14a and a second communication passage that can communicate with the communication passage 14b may be formed in the table base 26, and the first and second communication passages may be able to communicate with separate suction sources and air supply sources. Moreover, in the apparatus of the present invention, the valve 28b may be used as an atmospheric release valve without providing an air supply source 30b.

[0054] Furthermore, the processing apparatus of the present invention is not limited to a turning apparatus, but may also be a cutting apparatus or a laser processing apparatus, etc. That is, the processing apparatus of the present invention may, as a processing unit, replace the turning unit 38 with a cutting unit including a cutting blade for cutting the workpiece 11, or a laser processing unit for emitting a laser beam that modifies the material of the workpiece 11 or causes ablation in the workpiece 11.

[0055] Furthermore, in the processing method of the present invention, a retaining plate may be used to facilitate the holding of the workpiece 11 which has a large warp. Figure 13 is a schematic flowchart showing an example of a turning method in which the workpiece 11 is flattened in a turning device 24 while using a retaining plate.

[0056] In this method, the pressing plate is placed on the workpiece 11 after performing the placement step S1 described above (pressing plate placement step S5). Figure 14(A) is a schematic perspective view showing the pressing plate placement step S5, and Figure 14(B) is a schematic enlarged cross-sectional view showing the workpiece 11, the placement member 6, and the pressing plate after the pressing plate placement step S5.

[0057] In this pressing plate placement step S5, a pressing plate 70 is used that, in a plan view, corresponds to the rectangular tubular portion 13a of the lead frame portion 13 of the workpiece 11 (i.e., is rectangular tubular). Specifically, in the pressing plate placement step S5, the pressing plate 70 is placed on the rectangular tubular portion 13a of the lead frame portion 13 of each workpiece 11 so that the sealing portion 15 of each workpiece 11 is surrounded by the pressing plate 70.

[0058] After the pressing plate placement step S5, the workpiece 11 and the pressing plate 70 are positioned on the holding part 10 by inserting the holding part 10 of the table 4 into the through hole 22, and the mounting member 6 is supported by the base part 8 (support step S2'). Figure 15(A) is a schematic enlarged cross-sectional view showing the workpiece 11, the pressing plate 70, and the holding unit 2 after the support step S2'.

[0059] This support step S2' is performed in the same manner as the support step S2 described above. As a result, the four workpieces 11 and the four pressing plates 70 are transferred from the mounting member 6 to the four holding parts 10 and positioned thereon, while the mounting member 6 is supported by the base part 8. In addition, since the pressing plates 70 are placed on the rectangular tubular portion 13a of the lead frame part 13 of each workpiece 11, it becomes difficult for a gap to form between the lead frame part 13 and the holding part 10.

[0060] After the support step S2', the holding step S3 described above is performed, and then the retaining plate 70 is removed from the workpiece 11 (removal step S6). Figure 15(B) is a schematic enlarged cross-sectional view showing the removal step S6. This removal step S6 is performed, for example, by the operator of the turning machine 24 manually transporting the retaining plate 70.

[0061] After the removal step S6, the flattening step S4 described above is performed to complete the turning method shown in Figure 13. In this method, the holding step S3 is performed in a state in which a gap is less likely to form between the lead frame portion 13 of the workpiece 11 and the holding portion 10 of the table 4. Therefore, even if the workpiece 11 has a large warp, it becomes easier to hold the workpiece 11 on the holding portion 10.

[0062] Note that the clamping plate used in the turning method shown in Figure 13 is not limited to the clamping plate 70. For example, in this method, a single clamping plate having a structure in which four clamping plates 70 are integrated may be used.

[0063] The single pressing plate includes, for example, a disc-shaped base portion that has the same outer diameter as the mounting member 6 in a plan view, and four pressing portions that have the same shape as the pressing plate 70 and are provided on the lower surface side of the base portion. Each pressing portion is provided so as to overlap with the rectangular tubular portion 13a of the lead frame portion 13 of any of the four workpieces 11 when the single pressing plate is placed on the mounting member 6 on which the four workpieces 11 are each placed so as to overlap with the four through holes 22.

[0064] Furthermore, each pressing portion is provided such that, for example, its height (specifically, the distance between the lower surface of the base portion along the thickness direction of the one pressing plate and the lower surface of each pressing portion) is greater than the height of the workpiece 11 (specifically, the distance between the lower surface of the lead frame portion 13 and the upper end of the sealing portion 15). Alternatively, the one pressing plate may have four through holes formed therein such that, in a plan view, their outer circumferences overlap with the inner circumferences of the four pressing portions.

[0065] Furthermore, in the turning method shown in Figure 13, a pressing plate may be used that includes not only the rectangular tubular portion 13a of the lead frame portion 13 of the workpiece 11 but also the portion that is placed on the sealing portion 15. In other words, in this method, the holding step S3 described above may be performed with both the lead frame portion 13 and the sealing portion 15 pressed down from above.

[0066] Furthermore, the processing method of the present invention is not limited to a turning method, and may also be a cutting method that cuts the workpiece 11 using a cutting blade, or a laser processing method that modifies the material of the workpiece 11 or causes ablation in the workpiece 11 using a laser beam, etc. In other words, the processing method of the present invention may include a cutting step or a laser processing step, etc., instead of the planarization step S4 as a processing step.

[0067] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of Symbols]

[0068] 2: Holding unit 4: Table 6: Mounting member 8: Base section 10: Holding part 11: Items to be processed 12: Fitting part 13: Lead frame section (13a: Rectangular tubular section) 14a, 14b: Communication path 15: Sealing portion (molded portion) (15a: flat surface) 16: Side wall 18: Support pin 20: Fitting part 22: Through hole (22a: Step) 24: Turning machine (processing device) 26: Table base 28a, 28b: Valve 30a: Suction source 30b: Air supply source 32:X direction movement mechanism 34: Support structure (34a: Recess) 36: Support shaft 38: Turning Unit 40: Spindle housing 42: Spindle (42a: Flow channel) 44: Mount 46: Cutting Tools 48: Base section (48a: Flow channel) 50: Drooping part (50a: Channel) 52:Liquid source 54: Mounting member (54a: Top surface) 56: Through hole (56a: Step) 58: Holding Unit 60: Table 62: Base section (62a: Connecting passage) 64: Mounting member (64a: Step) 66: Air cylinder (pushing mechanism) (66a: rod) 68: Holding part (68a: side wall) 70: Pressing plate

Claims

1. A holding unit for holding an object to be processed, A table having a base and a holding part that is erected from the base and capable of holding the object to be processed, It comprises a mounting member having a through hole into which the holding portion can be inserted, A holding unit in which the object to be processed is placed on a mounting member on which the object to be processed is placed so as to overlap the through hole, thereby positioning the object to be processed on the holding part and supporting the mounting member on the base.

2. The holding unit according to claim 1, wherein the length of the through hole is less than the height of the holding portion.

3. The holding unit according to claim 1, wherein a communication passage for connecting the mounting member supported by the base portion with a suction source is formed in the base portion.

4. The holding unit according to claim 1, wherein the through hole includes a step at its upper end into which the object to be processed fits when the object to be processed is placed.

5. One of the fitting portion or the fitted portion is formed on one of the base portion or the mounting member, and the other of the fitting portion or the fitted portion is formed on the other of the base portion or the mounting member. The holding unit according to claim 1, wherein the fitting portion and the fitted portion engage when the base portion supports the mounting member.

6. The retaining portion has a cylindrical side wall and a plurality of support pins provided inside the side wall, each of which has an upper surface that lies on the same plane as the upper surface of the side wall. The holding unit according to claim 1, wherein a communication passage for connecting the space inside the side wall with a suction source is formed in the base portion.

7. The holding unit according to claim 1, wherein at least a portion of the upper surface of the mounting member is inclined.

8. A holding unit for holding multiple objects to be processed, A table having a base and a plurality of holding parts erected from the base, each capable of holding one of the plurality of different objects to be processed, A mounting member having multiple through holes formed in each of the multiple holding parts, each of which is different from the others, into which any of the multiple holding parts can be inserted, A holding unit in which the multiple objects to be processed are placed on a mounting member on which the multiple objects to be processed are placed so as to cover the multiple through holes, and the multiple holding parts are inserted into the multiple through holes of the mounting member, thereby positioning the multiple objects to be processed on the multiple holding parts and supporting the mounting member on the base.

9. Apparatus for processing a workpiece, A holding unit for holding the object to be processed, A processing unit for processing the object to be processed held by the holding unit, The unit comprises a liquid supply source for supplying liquid to the object to be processed held by the holding unit, The holding unit is, A table having a base and a holding part that is erected from the base and capable of holding the object to be processed, It comprises a mounting member having a through hole into which the holding portion can be inserted, A processing apparatus in which the object to be processed is placed on a mounting member on which the object to be processed is placed so as to overlap the through hole, thereby positioning the object to be processed on the mounting member and supporting the mounting member on the base.

10. The apparatus according to claim 9, wherein at least a portion of the upper surface of the mounting member is inclined so as not to retain the liquid supplied from the liquid supply source.

11. The processing apparatus according to claim 9 or 10, wherein the processing unit is a turning unit that includes a cutting tool for flattening the workpiece.

12. A processing method for processing an object to be processed, comprising a holding unit comprising a table having a base portion and a holding portion erected from the base portion and capable of holding an object to be processed, and a mounting member having a through hole into which the holding portion can be inserted, A placement step of placing the object to be processed on the mounting member so as to overlap with the through hole of the mounting member, A support step is performed after the placement step, in which the object to be processed is positioned on the holding part by inserting the holding part into the through hole and the placement member is supported by the base part, Following the support step, a holding step is performed in which the object to be processed is held on the holding portion and the mounting member is held on the base portion, Following the holding step, a processing step is performed on the object to be processed that is held on the holding part. A processing method comprising:

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