Processing apparatus, preparation method, and article manufacturing method

Abstract

This provides a favorable technology for ensuring positive pressure relative to the external environment throughout the entire circulation path. [Solution] The processing apparatus, which is placed in a predetermined environment, comprises a processing chamber for processing a material, a blower, a first flow path for sending gas from the blower to the processing chamber, a second flow path for returning gas from the processing chamber to the blower, a pressure gauge for detecting the differential pressure of the second flow path with respect to the pressure of the predetermined environment, and an adjustment unit for performing adjustments to maintain the differential pressure at a positive value.

Description

Technical Field

[0001] The present invention relates to a processing apparatus, an adjustment method, and an article manufacturing method.

Background Art

[0002] Patent Document 1 describes a chamber device having a chamber room and a machine room. Dry air is supplied to the chamber room through a supply duct, and the atmosphere in the chamber room is introduced into the machine room through an exhaust duct. The atmosphere exhausted from the machine room through the exhaust duct is exhausted from the machine room through an air adjustment damper and an exhaust fan. A pressure sensor is provided in the chamber room, and the controller controls the air adjustment damper and the exhaust fan on the exhaust side so that the pressure in the chamber room detected by the pressure sensor maintains a positive pressure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the chamber device described in Patent Document 1, the pressure in the chamber room is maintained at a positive pressure as described above. In such a device, when air is circulated in a circulation path including the chamber room, a region having a negative pressure with respect to the external space may be formed on the downstream side of the exhaust duct. In this case, there is a possibility that air may enter the circulation system from the external space.

[0005] An object of the present invention is to provide an advantageous technique for ensuring a positive pressure with respect to the external space throughout the circulation path.

Means for Solving the Problems

[0006] One aspect of the present invention relates to a processing apparatus placed in a predetermined environment, the processing apparatus comprising: a processing chamber for processing a material; a blower; a first flow path for supplying gas from the blower to the processing chamber; a second flow path for returning gas from the processing chamber to the blower; a pressure gauge for detecting the differential pressure of the second flow path with respect to the pressure of the predetermined environment; and an adjustment unit for performing adjustments to maintain the differential pressure at a positive value. [Effects of the Invention]

[0007] The present invention aims to provide an advantageous technique for ensuring that the entire circulation path is under positive pressure relative to the external space. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing an example of the configuration of the main body of the processing unit. [Figure 2] A diagram showing an example configuration of the processing apparatus according to the first embodiment. [Figure 3] A diagram showing an example configuration of the processing apparatus according to the second embodiment. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] The following describes an exemplary embodiment of a processing apparatus placed in a predetermined environment. The processing apparatus may include a processing chamber for processing a material, a blower, a first flow path for supplying gas from the blower to the processing chamber, a second flow path for returning gas from the processing chamber to the blower, and a pressure gauge for detecting the differential pressure of the second flow path with respect to the pressure of the predetermined environment. The processing apparatus may also include an adjustment unit for maintaining the differential pressure at a positive value. An adjustment method for adjusting the processing apparatus may include a detection step for detecting the differential pressure of the second flow path with respect to the pressure of the predetermined environment, and an adjustment step for maintaining the differential pressure at a positive value. A processing unit for processing the material is placed in the processing chamber. The processing unit may be, for example, the main body of one of the following devices: an inkjet device, an exposure device, an imprint device, a planarizing device, a bonding device, a film-forming device, an etching device, a coating device, a developing device, etc.

[0011] Hereinafter, with reference to Figures 1 and 2, an example will be described in which the processing apparatus is configured as an inkjet apparatus 1 and the main body MB of the inkjet apparatus 1 is placed in the processing chamber 201. In this specification and the accompanying drawings, as shown in Figure 1, the orientation of the processing chamber 201 is indicated in an XYZ coordinate system in which the plane parallel to the plane on which the substrate 2, as the material to be processed, is placed is the XY plane. The main body MB placed in the processing chamber 201 applies ink 4, which is the liquid material of the functional element, to the substrate 2 to form a pattern. There are no particular limitations on the components of the ink.

[0012] The main body MB may include a substrate transport stage 3 that holds and moves the substrate 2. The substrate 2 may be appropriately selected from various substrates such as glass substrates or plastic substrates, depending on the product to be manufactured. The substrate 2 is typically a plate-shaped component, but is not limited to a specific shape as long as it can function as a substrate 2. For example, the substrate 2 may be a circular substrate.

[0013] The substrate 2 is a component for forming a display device and may have a pixel array area 9 and alignment marks 10. Multiple pixels, which are the targets for ink 4 ejection, are arranged in the pixel array area 9. The alignment marks 10 are used to measure the position of the substrate 2. The main body MB may also include an ejection head 5 having multiple nozzles for ejecting ink 4 toward the substrate 2.

[0014] The main unit MB may also include a camera 7, a height sensor 8, and a control unit 6. The control unit 6 controls the substrate transport stage 3, the ejection head 5, the camera 7, and the height sensor 8. The control unit 6 may also be configured to control other components of the inkjet device 1. For example, the control unit 6 uses the camera 7 to detect the position of the alignment marks 10, thereby measuring the position of the substrate 2. The control unit 6 also controls the drive mechanism of the substrate transport stage 3 and the ejection head 5 so that the substrate transport stage 3 is scanned in the Y direction relative to the ejection head 5 and ejects ink 4 from the ejection head 5 toward the pixel array area 9 on the substrate 2. In addition, to improve the accuracy of ink application positioning, the control unit 6 may use the height sensor 8 to measure the height of the substrate 2 and control the distance between the ejection head 5 and the substrate 2 based on this result. The control unit 6 may be composed of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program installed, or a combination of all or part of these.

[0015] A first embodiment of the air conditioning system for the inkjet apparatus 1 as a processing apparatus will be described below with reference to Figure 2. The air conditioning system may include an air conditioner 206 having a blower 219, a supply channel (first channel) 202, and a return channel (second channel) 203. The air conditioning system may also include a purifier 216. The purifier 216 may include, for example, a refiner 209 and a dehumidifier 204. The purifier 216 may be located in a channel that returns gas from the supply channel 202 to a position upstream of the pressure gauge 205 in the return channel 203. In addition to the blower 219, the air conditioner 206 may also include a temperature controller 207 and a filter 208. The blower 219, which constitutes part of the air conditioner 206, may be configured to send gas returning from the processing chamber 201 via the return channel 203 to the temperature controller 207. The temperature controller 207 may include, for example, a cooler and a heater. The temperature controller 207 controls the temperature of the gas to the temperature control accuracy required by the processing chamber 201. The temperature control accuracy is, for example, 23 ± 0.1°C or 23 ± 0.01°C. The temperature-controlled gas can be sent to the filter 208. The filter 208 removes, for example, particles contained in the gas. As the filter 208, for example, a HEPA filter or a ULPA filter may be selected depending on the cleanliness required by the processing chamber 201. A chemical filter such as activated carbon may be provided to remove chemical substances such as ink generated inside the processing chamber 201. Note that the temperature controller 207 and the filter 208 are optional components. A portion of the gas that has passed through the filter 208 can be sent to the purifier 216 through a bypass channel.

[0016] The dehumidifier 204 removes moisture from the gas, thereby sending the low-humidity gas to the purifier 209. The purifier 209 purifies the gas by removing oxygen, thereby reducing its oxygen concentration, and returns it to the blower 219. By using the dehumidifier 204 and the purifier 209, for example, high-purity N2 can be purified. An inert gas such as Ar may be used as the circulating gas. Note that the purifier 209 and the dehumidifier 204 are optional components. For example, if the ink used in the processing chamber 201 may come into contact with oxygen, the purifier 209 is unnecessary, and if the environment in which the inkjet device 1 is located is a dehumidified environment, the dehumidifier 204 is unnecessary.

[0017] The blower 219 supplies gas to the processing chamber 201 via the supply channel 202. When supplying dry air or inert gas to the processing chamber 201, it is desirable to circulate the dry air or inert gas between the processing chamber 201 and the air conditioner 206 from the standpoint of equipment size and cost. For example, if the target moisture or oxygen concentration is low, circulating the gas to gradually reduce the concentration can reduce the load on the dehumidifier / purifier, and this method is advantageous in reducing the size and cost of the dehumidifier / purifier.

[0018] Here, we will explain the challenges in the inkjet device 1. Many organic EL materials change their material properties when exposed to moisture, oxygen, etc., so coating them in a dry air or inert gas atmosphere is required. If there is a gap between the inkjet device 1 and the external environment, air from the outside may enter, potentially increasing the moisture and oxygen concentrations. Therefore, it is desirable for the inkjet device 1 to have a nearly sealed configuration and maintain positive pressure relative to the external environment.

[0019] In order to improve the airtightness of the inkjet device 1, if a caulking material, an adhesive, etc. are used for the purpose of filling the gaps between parts, it may lead to an increase in cost and an increase in the number of assembly man-hours. In particular, for panels that need to be detached for maintenance, etc., it is desirable to fix them using a gasket such as rubber. If many bolts are used for fastening to improve airtightness, the maintenance man-hours will increase. And when the bolts are fastened, if the panel is deformed, gaps will occur, so it is necessary to prepare a panel with a sufficient thickness. Then, the panel weight increases, leading to deterioration of maintainability and at the same time an increase in cost.

[0020] As described above, improving airtightness generally has an inverse relationship with the device cost and the number of assembly man-hours, so it is important to design appropriately considering the device specifications, cost, maintainability, etc. Also, by making the inside of the device positive pressure with respect to the external environment, the inflow of air from the gaps can be reduced. However, if the processing chamber and the air conditioner are made positive pressure more than necessary, there is a concern that the pressure resistance will be increased more than necessary, which may lead to an increase in cost and a decrease in maintainability, so a method of adjusting to an appropriate positive pressure value is required.

[0021] Next, the details of the air conditioning system illustrated in Figure 2 will be described. The supply flow path 202 is the gas flow path from the air conditioner 206 to the processing chamber 201, and the supply flow path 202 may contain a temperature controller 207, a filter 208, supply ducts 210 (210a-c), flow control valves 211 (211a-c), etc. Gas is supplied from the air conditioner 206 to the processing chamber 201 through the supply duct 210. The supply duct 210 is preferably made of a material that is impermeable to moisture and oxygen, and may be made of metal such as stainless steel or aluminum. Furthermore, the supply duct 210 is preferably made of an insulating material in order to reduce temperature fluctuations of the gas conditioned by the temperature controller 207. For example, glass wool may be placed around the metal duct. In addition, the inner and outer surfaces of the insulating material constituting the duct may be covered with a metal film. The flow control valves 211a, b, and c adjust the flow rate through the supply ducts 210a, b, and c, respectively. The flow control valves 211a, b, and c may be, for example, butterfly valves.

[0022] The return passage 203 is a gas passage from the processing chamber 201 to the air conditioner 206, and may include return ducts 221 (221a-d), flow control valves 212 (211a-d), etc. The gas is returned from the processing chamber 201 to the air conditioner 206 through the return duct 221. The return duct 221, like the supply duct 210, is preferably made of a material that is impermeable to moisture and oxygen, and may be made of a metal such as stainless steel or aluminum. The flow control valves 212a, b, c, and d adjust the flow rate of the gas flowing through the return ducts 221a, b, c, and d, respectively. The gas that has passed through the return ducts 221a, b, c, and d merges with other gases in the air conditioner 206 and is drawn into the blower 219.

[0023] The processing chamber 201, the blower 219, the supply channel 202, and the return channel 203 constitute a circulation path 225 for circulating gas. The purifier 216 can operate to purify the gas circulating in the circulation path 225. The purifier 216 can reduce the amount of moisture in the gas circulating in the circulation path 225. Alternatively, the purifier 216 can reduce the amount of oxygen in the gas circulating in the circulation path 225.

[0024] The pressure gauge 205 detects the differential pressure (Pr - Pe) between the pressure (Pr) in the return channel 203 and the pressure (Pe) of the predetermined environment where the inkjet device 1 is installed. For example, the pressure gauge 205 detects the differential pressure (Pr - Pe) between the pressure (Pr) at a predetermined position in the return channel 203 and the pressure (Pe) of the predetermined environment where the inkjet device 1 is installed. The predetermined position is preferably a position between the blower 219 and the return duct 221. The pressure gauge 205 may be constituted by a differential pressure gauge, and each of the two spaces for detecting the differential pressure and the differential pressure gauge can be connected by a pressure guiding pipe. The adjustment unit 230 functions so that the differential pressure detected by the pressure gauge 205 maintains a positive target value. The positive target value can follow the design specifications.

[0025] The dehumidifier 204 can supply the gas that has undergone dehumidification treatment to a position upstream of the pressure gauge 205 in the return channel 203. The adjustment unit 230 may include a flow rate adjustment valve 213, and the flow rate adjustment valve 213 can adjust the flow rate of the gas supplied from the gas supply unit 220 to a position upstream of the pressure gauge 205 in the return channel 203. The flow rate adjustment valve 213 is connected to the control unit 6 and can be controlled by the control unit 6.

[0026] The flow control valve 214 adjusts the flow rate of gas from the filter 208 to the dehumidifier 204. The flow control valves 215a and 215b adjust the flow rate of gas from the dehumidifier 204 to the purifier 209. Because water has a stronger tendency to be released from materials than oxygen, the water concentration in the gas does not decrease as easily as the oxygen concentration. The dehumidifier 204 is often required to have a higher processing capacity than the purifier 209, that is, to process a larger volume of gas. Therefore, it is advisable to use the flow control valves 215a and 215b to process a portion of the gas processed by the dehumidifier 204 in the purifier 209.

[0027] The processing chamber 201 may have an exhaust port 217 for discharging gas from the processing chamber 201 or the inkjet device 1. The adjustment unit 230 may include a pressure regulating valve 218 provided in the exhaust port 217. The pressure regulating valve 218 may be connected to and controlled by the control unit 6.

[0028] The gas supply unit 220 is connected to a gas such as dry air or an inert gas at a position upstream of the pressure gauge 205 in the return flow path 203. In the case of dry air, the gas supply unit 220 may use the dry air provided by the building facilities where the inkjet device 1 is installed, or a dryer may be added to this dry air line to further reduce the moisture concentration. Alternatively, the gas supply unit 220 may be a desiccant dehumidifier that uses a dehumidifying rotor formed from a honeycomb body impregnated with a desiccant to continuously and efficiently remove moisture from the atmosphere. The specific components constituting the gas supply unit 220 can be selected according to the required dry air flow rate and moisture concentration. When the gas supply unit 220 supplies an inert gas, existing facilities may be used as the gas supply unit 220, or a gas cylinder filled with inert gas may be used. If the inert gas is nitrogen, a nitrogen generator using the PSA method or hollow fiber membrane method, or a combination of these with a catalyst or chemisorption type purification device, may be used.

[0029] The blower 219 is a power source for circulating gas between the air conditioner 206 and the processing chamber 201 via the supply channel 202 and the return channel 203. Therefore, the pressure is lowest near the suction port of the blower 219 and highest near the discharge port of the blower 219. If the pressure value near the suction port of the blower 219 is positive relative to the external environment in which the inkjet device 1 is installed (i.e., the differential pressure detected by the pressure gauge 205 is positive), then the supply channel 202, the processing chamber 201, and the return channel 203 will all be at positive pressure. Therefore, by adjusting the pressure in the circulation path 225 based on the output of the pressure gauge 205 located near the suction port of the blower 219, positive pressure can be reliably and efficiently formed. In contrast to this configuration, if the pressure is adjusted based on the pressure of the processing chamber 201, even if the processing chamber 201 is at positive pressure, the area near the suction side of the blower 219 may be at negative pressure, and air may flow in from the external environment. Alternatively, adjusting the processing chamber 201 to a positive pressure beyond what is necessary would require excessive strength from the processing chamber 201 to ensure pressure resistance, potentially leading to increased costs, reduced maintainability, or even gas leakage.

[0030] Pressure adjustment in the circulation path 225 can be achieved by adjusting the opening degree of the pressure regulating valve 218. The gas supply unit 220 maintains the inkjet device 1 at positive pressure by supplying gas to the circulation path 225 at a flow rate equal to the sum of the flow rate of gas leaking from the inkjet device 1 through the gaps in the inkjet device 1 and the flow rate of gas discharged from the exhaust port 217.

[0031] In the case of inert gas, from a safety standpoint, it is unacceptable for a large amount of gas to leak from the inkjet device 1. On the other hand, in the case of dry air, it may be acceptable for a small amount of gas to leak. Therefore, in the case of dry air where a small amount of leakage is acceptable, the airtightness can be relaxed to reduce costs, and the amount of gas supplied by the gas supply unit 220 can be appropriately increased to provide a low-cost environment with a low moisture concentration. Placing the pressure gauge 205 near the suction port of the blower 219 is advantageous for appropriately adjusting the amount of gas supplied by the flow control valve 213 to maintain positive pressure in the inkjet device 1. Alternatively, the flow rate of the gas discharged through the exhaust port 217 may be appropriately adjusted by the pressure control valve 218. In this example, the exhaust port 217 and the pressure control valve 218 are provided in the processing chamber 201, but are not limited to this, and may be provided on the air conditioner 206 side.

[0032] The supply duct 210 may have a configuration in which the inner and outer surfaces of the insulating material are covered with a metal film. In this case, the gas, whose temperature is controlled by the temperature controller 207, is supplied to the processing chamber 201 with reduced thermal influence from the external environment. Therefore, the processing chamber 201 can be temperature controlled with high precision. When a configuration is adopted in which the purifier 216 is introduced to the suction side of the blower 219, the gas is agitated within the blower 219, so the moisture and oxygen concentrations in the gas in the supply ducts 210a, b, and c become approximately uniform.

[0033] A second embodiment of the air conditioning system for the inkjet apparatus 1 as a processing apparatus will be described below with reference to Figure 3. Matters not mentioned below may follow the first embodiment. In the second embodiment, the air conditioner 206 is positioned close to the return port of the processing chamber 201. Therefore, the return flow path 203 is shorter than the supply flow path 202. It is preferable that the airtightness of the return duct 221 is higher than that of the supply duct 210. A purifier 216 or dehumidifier 204 may be placed in the flow path that carries gas from the processing chamber 201 to the blower 219 or air conditioner 206. In the second embodiment, dry air is assumed as the gas, and the purifier 209 for removing oxygen is omitted, but a purifier 209 may be provided. The gas supply unit 220 is connected to the processing chamber 201 without going through the supply flow path 202 and the return flow path 203. Furthermore, the exhaust port 217 may be positioned to discharge organic gases generated in the processing chamber 201, as illustrated in Figure 1(a), more specifically, to discharge from areas within the processing chamber 201 where the concentration of organic gases such as ink is high. The pressure regulating valve 218 of the exhaust port 217 may be connected to and controlled by the control unit 6.

[0034] The gas supply unit 220 is connected to the processing chamber 201 and supplies gas to the processing chamber 201 without going through the supply channel 202 and the return channel 203. This allows moisture and other substances in the processing chamber 201 to be quickly and effectively removed from the processing chamber 201. Alternatively, the gas supply unit 220 can also supply gas to mechanical parts such as pneumatic actuators and air bearings of air-floating stages that may be placed in the processing chamber 201, thereby maintaining the inkjet device 1 at positive pressure in conjunction with the driving of the mechanical parts.

[0035] The following describes, in part, the method for adjusting the flow rates of the supply ducts 210a, b, and c in the first and second embodiments. The blower 219 transports gas from the suction side to the discharge side, creating a positive pressure difference on the discharge side relative to the suction side, thereby circulating the gas through the circulation path 225. When the suction side is adjusted to positive pressure, the pressure on the discharge side increases by the amount of the pressure difference. Therefore, if the output of the blower 219 is excessively high, the pressure on the discharge side will increase accordingly, requiring the processing chamber 201 to have corresponding pressure resistance, which could lead to increased costs, reduced maintainability, or gas leakage due to deformation. In other words, the output (discharge pressure) of the blower 219 is adjusted while minimizing the pressure loss that occurs when the gas circulates through the circulation path 225 as much as possible. As a result, it becomes possible to maintain positive pressure at all parts of the circulation path 225 while reducing the differential pressure of the processing chamber 201 relative to the external environment.

[0036] Here, a more specific adjustment method will be explained with an example. First, all flow control valves 212 in the return duct 221 are fully opened. Furthermore, in the supply ducts 210a, b, and c, the flow control valve 211 corresponding to the supply duct with the highest pressure loss when a preset flow rate is applied is fully opened or nearly opened. While maintaining this, the flow control valves corresponding to the other two supply ducts and the output (rotation speed) of the blower 219 are adjusted so that a predetermined flow rate of gas flows through each of the three supply ducts. Furthermore, the flow control valve (any of 212a to 212d) corresponding to the return duct with the highest pressure loss when a preset flow rate is applied is fully opened or nearly opened. While maintaining this state, the flow control valves corresponding to the other three return ducts and the output (rotation speed) of the blower 219 are adjusted so that a predetermined flow rate of gas flows through each of the four return ducts. This adjustment minimizes the pressure loss of the entire circulating air conditioning system and allows the blower output to be kept to the minimum necessary. Furthermore, if high pressure loss is clearly identifiable in the design of supply or return ducts, flow control valves do not need to be installed in those lines.

[0037] As the ejection head 5 ejects ink onto the substrate, mist floats around the ejection head 5. Furthermore, because ink components evaporate from the nozzles of the ejection head 5, the concentration of organic gases around the ejection head 5 becomes relatively high. As illustrated in Figure 1(a), by providing an exhaust port 217 near the ejection head 5, organic gases can be efficiently discharged from the inkjet device 1. Alternatively, the exhaust port 217 may be placed in another location within the inkjet device 1 where the organic gas concentration is high, instead of near the ejection head 5.

[0038] The control unit 6 can adjust the pressure regulating valve 218 of the exhaust port 217 so that the inkjet device 1 reaches the target positive pressure value, based on the output of the pressure gauge 205. If the maintenance panel is opened and closed during maintenance in the processing chamber 201, it may be necessary to adjust the pressure of the inkjet device 1 again after maintenance. The control unit 6 can quickly start up the device by automatically adjusting the pressure. In addition, even if the supply flow rate of the gas supply unit 220 changes, the control unit 6 can maintain a constant pressure value in the processing chamber 201 by adjusting the pressure regulating valve 218 according to the output of the pressure gauge 205.

[0039] Arranging the air conditioner 206, including the blower 219, such that the return channel 203 is shorter than the supply channel 202 means that the conductance of the return channel 203 is greater than that of the supply channel 202. Such a configuration is advantageous for reducing the pressure loss in the return channel 203. Therefore, the risk of the pressure in the processing chamber 201 rising excessively near the suction side of the blower 219, which is adjusted to a positive pressure based on the differential pressure detected by the pressure gauge 205, can be reduced. To reduce the pressure loss in the return channel, the number of return ducts 221 may be increased or the diameter may be increased relative to the supply duct 210.

[0040] Because the internal pressure of the return duct 221 is lower than that of the supply duct 210, air can easily enter from the outside. Therefore, it is preferable to make the airtightness of the return duct 221 higher than that of the supply duct 210, thereby reducing the intrusion of air from the outside.

[0041] The following describes a method for manufacturing articles using the above-described processing apparatus. The method for manufacturing articles may include a first processing step of processing a component using the processing apparatus, and a second processing step of further processing the component that has undergone the first processing step to obtain an article. The first processing step may be, for example, a process of applying a liquid (ink) onto a substrate using an inkjet device, or a process of exposing a substrate using an exposure device, or a process of forming a pattern on a substrate using an imprint device. Alternatively, the first processing step may include, for example, a process of forming a planarization film on a substrate using a planarization device, a process of joining two components using a bonding device, a process of forming a film on a substrate using a film deposition device, or a process of etching a substrate or layer using an etching device. Alternatively, the first processing step may include, for example, a process of applying a film material such as a resist to a substrate, or a process of developing an exposed substrate.

[0042] The following describes, as an example of a method for manufacturing articles, a method for manufacturing displays such as organic light-emitting diodes (OLEDs). This manufacturing method may include a coating step (first processing step) in which a liquid (ink) is applied to a substrate using the inkjet apparatus 1 described above, and a processing step (second processing step) in which the substrate that has undergone the coating step is further processed to obtain a display. The coating step may include a step of applying a liquid organic material to the substrate. This manufacturing method may include a plurality of coating steps, and an organic layer including a light-emitting layer may be formed through these plurality of coating steps. This manufacturing method may include, as the second processing step, a step of vacuum drying and firing of the liquid applied in the coating step. This manufacturing method may include, as the second processing step, a step of forming a lower electrode before the coating step, and a step of forming an upper electrode after the coating step.

[0043] This specification and accompanying drawings include the following disclosures: (Item 1) A processing device to be placed in a predetermined environment, A processing chamber for processing materials, A blower and A first flow path for supplying gas from the blower to the processing chamber, A second flow path for returning gas from the processing chamber to the blower, A pressure gauge for detecting the differential pressure of the second flow path relative to the pressure of the predetermined environment, An adjustment unit for performing adjustments to maintain the differential pressure at a positive value, A processing apparatus characterized by comprising: (Item 2) The system further comprises the processing chamber, the blower, and a purifier for purifying the gas circulating through a circulation path including the first and second flow paths. The apparatus according to item 1, characterized in that (Item 3) The purifier reduces the amount of moisture in the gas circulating through the circulation path. The apparatus according to item 2, characterized in that (Item 4) The purifier reduces the amount of water and oxygen in the gas circulating through the circulation path. The apparatus according to item 2, characterized in that (Item 5) The aforementioned blower is configured as part of an air conditioner. The second flow path has a duct connecting the air conditioner and the processing chamber, and the pressure gauge is positioned between the duct and the blower. The processing apparatus according to any one of items 1 to 4, characterized in that (Item 6) The apparatus has an exhaust port for discharging gas to the outside of the apparatus, The adjustment unit includes a gas supply unit that supplies gas to a circulation path including the processing chamber, the blower, the first flow path and the second flow path, and a pressure regulating valve provided at the exhaust port. The processing apparatus according to any one of items 1 to 5, characterized in that (Item 7) The gas supply unit is connected to a position upstream of the pressure gauge in the second flow path. The apparatus according to item 6, characterized in that (Item 8) The gas supply unit is connected to the processing chamber. The apparatus according to item 6, characterized in that (Item 9) The gas supply unit supplies gas at a flow rate equal to the sum of the flow rate of gas leaking from the processing device and the flow rate of gas discharged from the exhaust port. The apparatus according to item 7 or 8, characterized by the following: (Item 10) The apparatus according to any one of items 6 to 9, characterized in that the exhaust port is arranged to discharge organic gas generated in the processing chamber. (Item 11) The purifier is positioned in a flow path that returns the gas from the first flow path to a position upstream of the pressure gauge in the second flow path. The processing apparatus according to any one of items 2 to 4, characterized in that (Item 12) The purification device is positioned in a flow path that carries gas from the treatment chamber to the blower. The processing apparatus according to any one of items 2 to 4, characterized in that (Item 13) The second flow path has a smaller pressure loss than the first flow path. The processing apparatus according to any one of items 1 to 12, characterized in that (Item 14) The conductance of the second channel is greater than the conductance of the first channel. The processing apparatus according to any one of items 1 to 12, characterized in that (Item 15) The second channel is shorter than the first channel. The processing apparatus according to any one of items 1 to 12, characterized in that (Item 16) The first flow path further comprises a filter arranged in the first flow path. The processing apparatus according to any one of items 1 to 15, characterized in that (Item 17) The second channel has higher airtightness than the first channel. The processing apparatus according to any one of items 1 to 16, characterized in that (Item 18) The first flow path has a duct made of an insulating material, and the inner and outer surfaces of the insulating material are covered with a metal film. The processing apparatus according to any one of items 1 to 17, characterized in that (Item 19) The adjustment unit adjusts the pressure regulating valve so that the differential pressure becomes a positive target value. The apparatus according to any one of items 6 to 10, characterized in that (Item 20) An adjustment method for adjusting an apparatus that is arranged in a predetermined environment, comprising a processing chamber for processing materials, a blower, a first flow path for supplying gas from the blower to the processing chamber, and a second flow path for returning gas from the processing chamber to the blower, A detection step for detecting the pressure difference in the second flow path relative to the pressure of the predetermined environment, An adjustment step is performed to maintain the differential pressure at a positive value, A method of adjustment characterized by including the following. (Item 21) A first processing step involves processing the material using the processing apparatus described in any one of items 1 to 19, A second processing step involves further processing the member that has undergone the first processing step to obtain an article, A method of adjustment characterized by including the following. (others) The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0044] 1: Inkjet device (processing device), 201: Processing chamber, 202: Supply channel (first channel), 203: Return channel (second channel), 205: Pressure gauge, 216: Purifier, 218: Pressure regulating valve, 219: Blower, 220: Gas supply unit, 225: Circulation path, 230: Adjustment unit

Claims

1. A processing device to be placed in a predetermined environment, A processing chamber for processing materials, A blower and A first flow path for supplying gas from the blower to the processing chamber, A second flow path for returning gas from the processing chamber to the blower, A pressure gauge for detecting the differential pressure of the second flow path relative to the pressure of the predetermined environment, An adjustment unit for performing adjustments to maintain the differential pressure at a positive value, A processing apparatus characterized by comprising:

2. The system further comprises the processing chamber, the blower, and a purifier for purifying the gas circulating through the circulation path including the first and second flow paths. The apparatus according to claim 1.

3. The purifier reduces the amount of moisture in the gas circulating through the circulation path. The apparatus according to feature 2.

4. The purifier reduces the amount of water and oxygen in the gas circulating through the circulation path. The apparatus according to feature 2.

5. The aforementioned blower is configured as part of an air conditioner. The second flow path has a duct connecting the air conditioner and the processing chamber, and the pressure gauge is positioned between the duct and the blower. The apparatus according to claim 1.

6. The apparatus has an exhaust port for discharging gas to the outside of the apparatus, The adjustment unit includes a gas supply unit that supplies gas to a circulation path including the processing chamber, the blower, the first flow path and the second flow path, and a pressure regulating valve provided at the exhaust port. The apparatus according to claim 1.

7. The gas supply unit is connected to a position upstream of the pressure gauge in the second flow path. The apparatus according to claim 6.

8. The gas supply unit is connected to the processing chamber. The apparatus according to claim 6.

9. The gas supply unit supplies gas at a flow rate equal to the sum of the flow rate of gas leaking from the processing device and the flow rate of gas discharged from the exhaust port. The apparatus according to feature 7.

10. The apparatus according to claim 6, characterized in that the exhaust port is arranged to discharge organic gas generated in the processing chamber.

11. The purifier is positioned in a flow path that returns the gas from the first flow path to a position upstream of the pressure gauge in the second flow path. The apparatus according to feature 2.

12. The purification device is positioned in a flow path that carries gas from the treatment chamber to the blower. The apparatus according to feature 2.

13. The second flow path has a smaller pressure loss than the first flow path. The apparatus according to any one of claims 1 to 12, characterized in that

14. The conductance of the second channel is greater than the conductance of the first channel. The apparatus according to any one of claims 1 to 12.

15. The second channel is shorter than the first channel. The apparatus according to any one of claims 1 to 12.

16. The system further comprises a filter arranged in the first flow path, The apparatus according to any one of claims 1 to 12.

17. The second channel has higher airtightness than the first channel. The apparatus according to any one of claims 1 to 12.

18. The first flow path has a duct made of an insulating material, and the inner and outer surfaces of the insulating material are covered with a metal film. The apparatus according to any one of claims 1 to 12, characterized in that

19. The adjustment unit adjusts the pressure regulating valve so that the differential pressure becomes a positive target value. The apparatus according to any one of claims 6 to 10.

20. A method for adjusting an apparatus comprising a processing chamber for processing materials, a blower, a first flow path for supplying gas from the blower to the processing chamber, and a second flow path for returning gas from the processing chamber to the blower, wherein the apparatus is arranged in a predetermined environment, A detection step for detecting the pressure difference in the second flow path relative to the pressure of the predetermined environment, An adjustment step is performed to maintain the differential pressure at a positive value, A method of adjustment characterized by including the following.

21. A first processing step of processing a member using the processing apparatus described in any one of claims 1 to 12, A second processing step involves further processing the member that has undergone the first processing step to obtain an article, A method for manufacturing articles, characterized by including the following:

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