Laminates and display devices

Abstract

The present invention provides a laminate comprising a resin layer containing a light scattering agent on a substrate layer, wherein the occurrence of defects in the resin layer is suppressed, and a display device including the laminate. [Solution] A laminate is provided that includes a base layer and a resin layer disposed on at least one of its surfaces, wherein the resin layer contains a light scattering agent (A), and when the contact angle of the base layer with respect to diiodomethane is θs (°) and the contact angle of the resin layer with respect to diiodomethane is θr (°), the following equation: |θs-θr|≦21 is satisfied, and a display device including the same is provided.

Description

[Technical Field]

[0001] The present invention relates to a laminate comprising a resin layer and a display device including the laminate. [Background technology]

[0002] Patent Document 1 describes forming a wavelength conversion film on a substrate by steps of forming a coating film of a curable resin composition containing quantum dots on a substrate, irradiating the coating film with radiation, developing the irradiated coating film, and exposing the developed coating film to light, and using this to construct a light-emitting display element or the like. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2016-065178 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] While light scattering properties can be imparted to a resin layer formed by incorporating a light scattering agent into a resist composition, such as the curable resin composition described in Patent Document 1, our studies have revealed that defects are particularly likely to occur in the resin layer when it contains a light scattering agent. Defects refer to areas where the resin layer is absent on the substrate layer and the surface of the substrate layer is exposed, or areas in the resin layer that are relatively extremely thin.

[0005] The object of the present invention is to provide a laminate comprising a resin layer containing a light scattering agent on a substrate layer, wherein the occurrence of defects in the resin layer is suppressed, and a display device including the laminate. [Means for solving the problem]

[0006] The present invention provides the following laminate and display device. [1] comprising a base layer and a resin layer disposed on at least one surface of the base layer, The resin layer contains a light scattering agent (A), When the contact angle of the substrate layer with respect to diiodomethane is θs(°) and the contact angle of the resin layer with respect to diiodomethane is θr(°), the following formula: |θs-θr|≦21 A laminate that satisfies the requirements. [2] The following formula: 0.1 ≤ |θs - θr| The laminate described in [1], which further satisfies the following conditions. [3] The laminate according to [1] or [2], wherein the contact angle θs is 60° or less. [4] The laminate according to any one of [1] to [3], further comprising a quantum dot (B) in the resin layer. [5] The laminate according to any one of [1] to [4], wherein the resin layer is a cured product layer of a resin composition comprising a resin (C), a photopolymerizable compound (D), and a photopolymerization initiator (E). [6] The laminate according to any one of [1] to [5], wherein the light scattering agent (A) comprises TiO2 particles. [7] A display device comprising a laminate as described in any of [1] to [6]. [Effects of the Invention]

[0007] A laminate comprising a resin layer containing a light scattering agent on a substrate layer, wherein the occurrence of defects in the resin layer is suppressed, and a display device including the laminate can be provided. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic cross-sectional view showing an example of the layer structure of a laminate according to the present invention. [Modes for carrying out the invention]

[0009] <Laminate> [1] Laminate structure and contact angle difference Δθ The laminate according to the present invention (hereinafter also simply referred to as "laminated") comprises a base layer and a resin layer disposed on at least one surface of the base layer and containing a light scattering agent (A). In the laminate, there is usually no interposed layer between the base layer and the resin layer, and the resin layer is usually laminated directly onto the base layer.

[0010] Figure 1 is a schematic cross-sectional view showing an example of the layer structure of a laminate. The laminate 1 shown in Figure 1 includes a base layer 10 and a resin layer 20 disposed on one of its surfaces. The resin layer 20 is directly laminated on the base layer 10. The resin layer 20 contains a light scattering agent (A). The light scattering agent (A) is usually dispersed in the resin layer 20. The resin layer 20 may be disposed on both sides of the base layer 10.

[0011] The resin layer 20 may further contain quantum dots (B). In this case, the resin layer 20 can emit light of a different wavelength from the irradiated light by ultraviolet or visible light. Therefore, the resin layer 20 containing quantum dots (B) can be used as a wavelength conversion film. The wavelength of the emitted light can be selected by selecting the components and particle size of the quantum dots (B). If the resin layer 20 contains quantum dots (B), the quantum dots (B) are typically dispersed within the resin layer 20.

[0012] The resin layer 20 does not necessarily contain quantum dots (B). In this case, the resin layer 20 has the function of scattering and emitting light of the same wavelength as the irradiated light without wavelength conversion of the irradiated light. In this case, since defects are less likely to occur in the resin layer 20 of the laminate according to the present invention, variations in the intensity of scattered light at the light emission surface are less likely to occur.

[0013] The resin layer 20 may be formed over the entire surface of the base layer 10, as shown in Figure 1, or it may be formed on a part of the surface of the base layer. When it is formed on a part of the surface of the base layer, for example, the resin layer 20 may be formed in a pattern. The case where a resin layer is formed on a part of the surface of the base material layer here does not refer to a defective part that occurs contrary to intention, but is the case where a resin layer is intentionally (in design) formed on a part of the surface of the base material layer.

[0014] In the laminate according to the present invention, when the contact angle of the base material layer with respect to iodomethane is θs (°) and the contact angle of the resin layer with respect to iodomethane is θr (°), the following formula: |θs - θr| ≤ 21 is satisfied.

[0015] By satisfying the above formula, repulsion of the resin layer on the surface of the base material layer is less likely to occur, and the adhesion of the resin layer to the base material layer is enhanced. Therefore, a laminate with few defective parts in the resin layer can be obtained. Hereinafter, the left side |θs - θr| of the above formula is also denoted as "Δθ" (contact angle difference). From the viewpoint of suppressing defective parts, Δθ is preferably 20° or less, more preferably 19.3° or less (for example, 15° or less, 10° or less, or 5° or less).

[0016] On the other hand, Δθ is usually 0.1° or more. From the viewpoint of the developability of the resin layer, Δθ is preferably 0.2° or more, more preferably 0.3° or more, and even more preferably 0.4° or more.

[0017] θs is usually 15° or more and 75° or less. From the viewpoint of suppressing defective parts, it is preferably 20° or more and 70° or less, more preferably 25° or more and 60° or less, even more preferably 30° or more and 60° or less, still more preferably 30° or more and 50° or less, and particularly preferably 30° or more and 45° or less. θr is usually 20° or more and 70° or less. From the viewpoint of suppressing defective parts, it is preferably 30° or more and 60° or less, more preferably 40° or more and 58° or less, and may be 50° or less.

[0018] In this specification, the contact angle θs of the substrate layer with respect to diiodomethane refers to the contact angle of the surface on the substrate layer where the resin layer is located with respect to diiodomethane. When a resin layer is located on the substrate layer, the resin layer may be peeled off without changing its surface properties by thickening treatment using plasma or chemical treatment, and the contact angle θs may be taken from the peeled surface. Alternatively, the contact angle θr of the resin layer with respect to diiodomethane may be taken from the contact angle of the outer surface (the surface opposite to the substrate layer) of the resin layer located on the substrate layer. The contact angles with diiodomethane between the surface on which the resin layer is placed in the substrate layer and the surface opposite it are usually the same, either when the pretreatment described later is not performed on these surfaces or when the same pretreatment is performed on these surfaces. The contact angles with diiodomethane between the outer surface of the resin layer (the surface opposite to the substrate layer) and the surface opposite it are usually the same. The contact angles θs and θr are values ​​at 25°C. The contact angles θs and θr are measured according to the measurement method described in the Examples section below.

[0019] In the laminate according to the present invention, from the viewpoint of suppressing defects, when the surface tension of the base layer is σs (mN / m) and the surface tension of the resin layer is σr (mN / m), the following formula is used: |σs-σr|≦11.0 It is preferable that the following conditions are met. Hereafter, the left-hand side of the above equation |σs-σr| will also be written as "Δσ" (surface tension difference). From the viewpoint of suppressing defects, Δσ is more preferably 10.8 mN / m or less (for example, 10.5 mN / m or less, 10.0 mN / m or less, 9.5 mN / m or less, or 9.0 mN / m or less).

[0020] On the other hand, Δσ is usually 0.1 mN / m or more, and from the viewpoint of the developability of the resin layer, Δσ is preferably 0.2 mN / m or more, more preferably 0.5 mN / m or more, and even more preferably 1.0 mN / m or more.

[0021] σs is typically between 10 mN / m and 60 mN / m, preferably between 15 mN / m and 55 mN / m, more preferably between 20 mN / m and 50 mN / m, and even more preferably between 30 mN / m and 50 mN / m, from the viewpoint of suppressing defects. σr is typically 15 mN / m or more and 50 mN / m or less, preferably 20 mN / m or more and 45 mN / m or less, more preferably 25 mN / m or more and 40 mN / m or less, and even more preferably 30 mN / m or more and 40 mN / m or less, from the viewpoint of suppressing defects.

[0022] In this specification, the surface tension σs of the substrate layer refers to the surface tension of the surface on which the resin layer is arranged within the substrate layer. When a resin layer is arranged within the substrate layer, the resin layer may be peeled off without changing its surface properties by thickening treatment using plasma or chemical treatment, and the surface tension σs may be measured at the peeled surface. Alternatively, the surface tension σr of the resin layer is defined as the surface tension of the outer surface (the surface opposite to the substrate layer) of the resin layer arranged on the substrate layer. The surface tension of the surface on which the resin layer is placed in the base layer and the surface opposite it are usually the same, either when the pretreatment described later is not performed on these surfaces or when the same pretreatment is performed on these surfaces. The surface tension of the outer surface of the resin layer (the surface opposite to the base layer) and the surface opposite it are usually the same.

[0023] The surface tensions σs and σr are values ​​obtained at 25°C. The surface tensions σs and σr can be measured according to the following procedure. (1) In an environment of 25°C, drop 1.0 μL of water onto the surface of the substrate layer (when measuring surface tension σs) or the resin layer (when measuring surface tension σr), and measure the contact angle θ1 of the coating film with respect to water using a contact angle measuring device with the θ / 2 method. (2) In an environment of 25 °C, 1.0 μL of a drop of diiodomethane is dropped onto the surface of the base material layer (when measuring the surface tension σs) or the resin layer (when measuring the surface tension σr), and using a contact angle measuring device, the contact angle θ2 of the coating film with respect to diiodomethane is measured by the θ / 2 method. (3) The following formula: (1 + cosθ)γ p , L = 2[(γ S d γ L d ) 1 / 2 + (γ S p γ L p ) 1 / 2 ) Substitute θ1 obtained in (1) above into θ (the contact angle of the solid with respect to the liquid) in the Young - Owens equation represented by the above formula, and substitute the known values of 21.8 (mN / m) and 51.0 (mN / m) for water into γ L d (the dispersive force component of the surface tension of the liquid), γ <​​​​​​​​​​​​​​​​​​​​​​​​​​​​​Defects in the resin layer can be evaluated by, for example, the following method: Place the laminate on a black board so that the substrate layer side is in contact with the black board. Shine fluorescent light from above onto the laminate and acquire an image of the laminate as seen from the resin layer side. In this case, defective areas in the resin layer will appear black because the resin layer is either absent on the substrate layer or the resin layer is extremely thin relative to it. On the other hand, good areas without defects are clearly different from black and will exhibit colors such as white, green, or red, depending on the type of light scattering agent or quantum dots present in the resin layer. Defects can be evaluated by calculating the area percentage of areas exhibiting colors other than black (white, green, red, etc.) when the sum of the areas exhibiting black and areas exhibiting colors other than black is taken as 100%, using image processing software. The higher the area percentage, the fewer defects there are. The phrase "the resin layer is relatively extremely thin" means that the thickness of the resin layer is extremely thin compared to the average thickness of the entire resin layer, and this thickness is, for example, 10% or less of the average thickness.

[0025] The laminate according to the present invention preferably has an area ratio of 50% or more, more preferably 60% or more, even more preferably 70% or more, still more preferably 80% or more, particularly preferably 90% or more, most preferably 95% or more, and may even be 100%.

[0026] [2] Resin composition The resin layer of the laminate can be formed from a resin composition. For example, the resin layer can be formed by a method that includes the steps of applying the resin composition to a substrate layer and, if necessary, a drying step.

[0027] The resin composition comprises a light scattering agent (A) and a resin (C). Preferably, the resin composition is a curable resin composition further comprising a photopolymerizable compound (D) and a photopolymerization initiator (E) in addition to the light scattering agent (A) and the resin (C). The resin layer is preferably a cured product layer formed from a curable resin composition. The resin layer, which is the cured product layer, can be formed by a method that includes the steps of applying the curable resin composition to a substrate layer, a drying step which is performed as needed, and curing by the action of light and, if necessary, further by the action of heat. The cured layer may be formed over the entire surface of the substrate layer, or it may be formed as a cured pattern on a part of the substrate layer. In this specification, a cured pattern is one aspect of the cured layer, and refers to a cured layer formed in a pattern.

[0028] [2-1] Light scattering agent (A) The resin composition contains one or more light scattering agents (A). The resin layer formed from the resin composition has the light scattering agents (A) dispersed in it and can exhibit light scattering properties. By including the light scattering agent (A) in the resin layer, it is possible to control the light transmittance and viewing angle characteristics of the resin layer (wavelength conversion film, etc.), or to improve the light emission intensity when the resin layer is used as a bank or when the resin layer contains quantum dots (B). In this specification, "emitted light intensity" refers to the intensity of light emitted from the resin layer, and may be measured as luminance. For example, "emitted light intensity" may include both the intensity of light emitted from the side of the resin layer opposite the light source to the opposing main surface of the resin layer (for example, light emitted from the light source of a backlight unit into the resin layer and emitted towards the display), and the intensity of light extracted when fluorescence (internal emission) emitted by quantum dots (B) inside the resin layer due to excitation light from the light source is extracted from the resin layer to one side of the opposing main surface of the resin layer (for example, the display side when the display is positioned above the resin layer in a backlight unit).

[0029] Examples of the light scattering agent (A) include inorganic particles such as metal or metal oxide particles and glass particles. Since it is preferable that there is no absorption due to coloring and it has only a scattering effect, it is preferably metal oxide particles. Examples of the metal oxide include TiO2, SiO2, BaTiO3, ZnO, etc. Since it efficiently scatters light, it is preferably TiO2 particles. Generally, since the above inorganic particles are difficult to disperse in a solvent as they are, a dispersant described later is usually used. However, since the specific gravity is large, it is likely to settle in the resin composition and may be unevenly dispersed in the resin layer, so defects are likely to occur in the resin layer on the base material layer. Further, the contact angle of the resin layer with respect to the solvent can also be changed depending on the dispersion state of the light scattering agent (A) in the resin layer.

[0030] The particle diameter of the light scattering agent (A) is, for example, about 0.03 μm or more and 20 μm or less. From the viewpoint of enhancing the light scattering ability and the dispersibility in the resin composition, it is preferably 0.05 μm or more and 1 μm or less, and more preferably 0.05 μm or more and 0.5 μm or less.

[0031] As the light scattering agent (A), a light scattering agent previously dispersed in a part or all of the solvent (F) described later using a dispersant may be used. Commercially available products can be used as the dispersant. Examples of commercially available products include DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000, 2001, 2020, 2025, 2050, 2070, 2095, 2150, 2155 manufactured by BYK Chemie Japan Co., Ltd.; ANTI-TERRA-U, U100, 203, 204, 250,; BYK-P104, P104S, P105, 2S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS; Bykumen, etc. SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 76500, etc., manufactured by Lubrizol Japan; BASF EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc. Examples include Ajisper PA111, PB711, PB821, PB822, and PB824, all manufactured by Ajinomoto Fine Techno Co., Ltd.

[0032] The content of the light scattering agent (A) in the resin composition is, for example, 0.001% by mass or more and 50% by mass or less, relative to the total amount of solids in the resin composition. From the viewpoint of developingability of the layer formed from the resin composition, the output light intensity (brightness) when the resin layer is a wavelength conversion film, and improving the dispersibility of the light scattering agent (A), it is preferably 1% by mass or more and 30% by mass or less, more preferably 2% by mass or more and 10% by mass or less. In this specification, the total amount of solids refers to the sum of the components contained in the resin composition, excluding the solvent (F) described later. The content of each component in the solids of the resin composition can be measured by known analytical means such as liquid chromatography or gas chromatography. The content of each component in the solids of the resin composition may also be calculated from the formulation at the time of preparation of the resin composition.

[0033] The content of the light scattering agent (A) in the resin layer is, for example, 0.001% by mass or more and 50% by mass or less relative to the total amount of the resin layer. From the viewpoint of developingability of the resin layer, the output light intensity when the resin layer is a wavelength conversion film, and improving the dispersibility of the light scattering agent (A), it is preferably 1% by mass or more and 30% by mass or less, and more preferably 2% by mass or more and 10% by mass or less. According to the present invention, even though the resin layer contains a light scattering agent (A), it is possible to reduce defects in the resin layer on the substrate layer and obtain a laminate with good emitted light characteristics.

[0034] [2-2] Quantum dots (B) The resin composition may contain one or more quantum dots (B). A resin layer formed from a resin composition containing quantum dots (B) can emit light of a different wavelength from the irradiated light when irradiated with ultraviolet or visible light. Therefore, a resin layer containing quantum dots (B) can be used as a wavelength conversion film.

[0035] Quantum dots (B) are semiconductor nanoparticles with a particle size of 1 nm to 100 nm, which utilize the band gap of the semiconductor to absorb ultraviolet or visible light and emit light. Quantum dots (B) include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, C dZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZn Examples include compounds of group 12 elements and group 16 elements such as SeTe and HgZnSTe; compounds of group 13 elements and group 15 elements such as GaN, GaP, GaAs, AlN, AlP, AlAs, InN, InP, InAs, GaNP, GaNAs, GaPAs, AlNP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GaInNP, GaInNAs, GaInPAs, InAlNP, InAlNAs, InAlPAs; and compounds of group 14 elements and group 16 elements such as PdS and PbSe.

[0036] If the quantum dot (B) contains S or Se, quantum dots surface-modified with metal oxides or organic materials may be used. Using surface-modified quantum dots prevents the extraction of S or Se by reactive components contained in or potentially contained in the resin composition.

[0037] The quantum dot (B) may also form a core-shell structure by combining the above compounds. Examples of such combinations include nanoparticles in which the core is CdSe and the shell is ZnS.

[0038] Since the energy state of a quantum dot (B) depends on its size, it is possible to freely select the emission wavelength by changing the particle size. For example, in the case of quantum dots composed solely of CdSe, the peak wavelengths of the fluorescence spectrum when the particle sizes are 2.3 nm, 3.0 nm, 3.8 nm, and 4.6 nm are 528 nm, 570 nm, 592 nm, and 637 nm, respectively. Furthermore, the light emitted from quantum dots (B) has a narrow spectral width, and by combining it with light having such a steep peak, the displayable color gamut can be expanded in a display device that includes a resin layer formed from a resin composition. In addition, quantum dots (B) have high responsiveness and can efficiently utilize the light emitted from the light source.

[0039] The resin composition may contain only one type of quantum dot that emits light of a specific wavelength when emitted from a light source, or it may contain a combination of two or more types of quantum dots that emit light of different wavelengths. Examples of the light of a specific wavelength include red light, green light, and blue light.

[0040] When the resin composition contains quantum dots (B), the content of quantum dots (B) in the resin composition is, for example, 1% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and more preferably 10% by mass or more and 40% by mass or less, based on the total amount of solids in the resin composition. When the resin layer contains quantum dots (B), the content of quantum dots (B) in the resin layer is, for example, 1% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and more preferably 10% by mass or more and 40% by mass or less, relative to the total amount of the resin layer.

[0041] [2-3]Organic ligand When a resin composition contains quantum dots (B), the semiconductor particles, which are quantum dots (B), may exist in the resin composition with organic ligands coordinated to them. Hereinafter, semiconductor particles with organic ligands coordinated to them will also be referred to as ligand-containing semiconductor particles. The ligands that coordinate to the semiconductor particles can be, for example, organic compounds having polar groups that exhibit coordinating ability to semiconductor particles. The organic ligands may be organic ligands added due to synthetic constraints of the ligand-containing semiconductor particles or for stabilization. For example, in Japanese Patent Publication No. 2015-529698, ligand-containing semiconductor particles contain hexanoic acid as an organic ligand from the viewpoint of particle size control, and the organic ligand is substituted with DDSA (dodecenyl succinic acid) for stabilization after synthesis. Organic ligands can, for example, coordinate to the surface of semiconductor particles. The resin composition may contain one or more organic ligands.

[0042] The polar group is preferably at least one group selected from the group consisting of, for example, a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2). The polar group selected from this group may be advantageous in improving coordination to semiconductor particles. High coordination can contribute to improving color uniformity of the resin layer (wavelength conversion film, etc.) and / or improving the patternability of the resin composition. In particular, from the viewpoint of obtaining a resin layer (wavelength conversion film, etc.) with superior emitted light characteristics, it is more preferable that the polar group is at least one group selected from the group consisting of a thiol group and a carboxyl group. The organic ligand may have one or more polar groups.

[0043] Organic ligands are, for example, given by the following formula (X): X A -R X (X) It can be an organic compound represented by the formula, where X A The above polar group is R X This is a monovalent hydrocarbon group which may contain heteroatoms (such as N, O, S, halogen atoms, etc.). The hydrocarbon group may have one or more unsaturated bonds, such as carbon-carbon double bonds. The hydrocarbon group may have a linear, branched, or cyclic structure. The number of carbon atoms in the hydrocarbon group is, for example, 1 to 40, or 1 to 30. The methylene group contained in the hydrocarbon group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc.

[0044] base R X It may contain a polar group. A specific example of the polar group is polar group X. A The above description relating to this is cited.

[0045] polar group ASpecific examples of organic ligands having a carboxyl group include formic acid, acetic acid, propionic acid, as well as saturated or unsaturated fatty acids. Specific examples of saturated or unsaturated fatty acids include saturated fatty acids such as butyric acid, pentanoic acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecyl acid, palmitic acid, margaric acid, stearic acid, arachidic acid, behenic acid, and lignoceric acid; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, eicosenoic acid, erucic acid, and nervonic acid; and polyunsaturated fatty acids such as linoleic acid, alpha-linolenic acid, gamma-linolenic acid, stearic acid, dihomo-gamma-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, and adrenaline (docosatetraenoic acid).

[0046] polar group A Specific examples of organic ligands having a thiol group or an amino group include the polar group X exemplified above. A This includes organic ligands in which the carboxyl group of an organic ligand having a carboxyl group is replaced by a thiol group or an amino group.

[0047] Examples of preferred organic ligands represented by the above formula (X) include compound (J-1) and compound (J-2).

[0048] [Compound (J-1)] Compound (J-1) is a compound having a first functional group and a second functional group. The first functional group is a carboxyl group (-COOH), and the second functional group is either a carboxyl group or a thiol group (-SH). Because compound (J-1) has a carboxyl group and / or a thiol group, it can act as a ligand to coordinate to quantum dot (B). The resin composition may contain only one compound (J-1) or two or more compounds.

[0049] By incorporating compound (J-1) into a resin composition, the development speed of the resin composition can be made sufficiently fast, and the light emission intensity of the resin layer (wavelength conversion film, etc.) formed from the resin composition can be increased. This is thought to be because both the carboxyl group and the thiol group of compound (J-1) can impart high developability to the resin composition with an alkaline developer, and can coordinate well with the quantum dots (B) to improve the dispersibility of the quantum dots (B) in the resin composition. In particular, the carboxyl group has a greater effect in improving developability with an alkaline developer, and the thiol group has a greater effect in improving the dispersibility of the quantum dots (B).

[0050] Increasing the development speed of the resin composition can also contribute to increasing the light intensity emitted from the resin layer (such as a wavelength conversion film). This is thought to be because it suppresses the penetration of water into the resin layer during the development process.

[0051] An example of compound (J-1) is the compound represented by the following formula (J-1a). Compound (J-1) may also be the acid anhydride of the compound represented by formula (J-1a).

[0052] [ka] [In the formula, R B R represents a divalent hydrocarbon group. B If present, they may be the same or different. The hydrocarbon group may have one or more substituents. If there are multiple substituents, they may be the same or different, and they may be bonded to each other, forming a ring with the atom to which each substituent is bonded. The -CH2- contained in the hydrocarbon group may be replaced by at least one of -O-, -S-, -SO2-, -CO-, and -NH-. p represents an integer between 1 and 10.

[0053] R BExamples of divalent hydrocarbon groups represented by this formula include chain hydrocarbon groups, alicyclic hydrocarbon groups, and aromatic hydrocarbon groups.

[0054] Examples of chain-like hydrocarbon groups include linear or branched alkanediyl groups, the number of carbon atoms being typically 1 to 50, preferably 1 to 20, and more preferably 1 to 10.

[0055] Examples of alicyclic hydrocarbon groups include monocyclic or polycyclic cycloalkanediyl groups, which typically have 3 to 50 carbon atoms, preferably 3 to 20, and more preferably 3 to 10.

[0056] Examples of aromatic hydrocarbon groups include monocyclic or polycyclic arenediyl groups, which typically have 6 to 20 carbon atoms.

[0057] Examples of substituents that the above hydrocarbon group may have include alkyl groups having 1 to 50 carbon atoms, cycloalkyl groups having 3 to 50 carbon atoms, aryl groups having 6 to 20 carbon atoms, carboxyl groups, amino groups, halogen atoms, and the like. The substituents that the hydrocarbon group may have are preferably a carboxyl group, an amino group, or a halogen atom.

[0058] When the -CH2- contained in the above hydrocarbon group is replaced by at least one of -O-, -CO-, and -NH-, the -CH2- is preferably replaced by at least one of -CO- and -NH-, and more preferably by -NH-. p is preferably 1 or 2.

[0059] Examples of compounds represented by formula (J-1a) include those represented by the following formulas (1-1) to (1-9).

[0060] [ka]

[0061] Specific examples of compounds represented by formula (J-1a), listed by their chemical names, include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutanoic acid, 4-mercaptobutanoic acid, mercaptosuccinic acid, mercaptostearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2,3,5,6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetyl-L-cysteine, 3-methoxybutyl 3-mercaptopropionate, and 3-mercapto-2-methylpropionic acid. Among these, 3-mercaptopropionic acid and mercaptosuccinic acid are preferred.

[0062] Another example of compound (J-1) is a polycarboxylic acid compound, preferably a compound (J-1b) in which the -SH in formula (J-1a) is replaced with a carboxyl group (-COOH).

[0063] Examples of compounds (J-1b) include the following: Succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanediic acid, tetradecanediic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, dodecafluoroseveric acid, 3-ethyl-3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenodioic acid, sebaciic acid, hexadecafluorosebacic acid, acetylenedicarboxylic acid, trans-aconitic acid, 1,3-adamantanedicarboxylic acid, bicyclo[2.2.2]octane-1,4-dicarboxylic acid, cis-4-silicon Chlohexene-1,2-dicarboxylic acid, 1,1-cyclopropanedicarboxylic acid, 1,1-cyclobutanedicarboxylic acid, cis- or trans-1,3-cyclohexanedicarboxylic acid, cis- or trans-1,4-cyclohexanedicarboxylic acid, 1,1-cyclopentanediacetic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid, 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, tetrafluoroiso Phthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethylterephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1'-ferrocenedicarboxylic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 2,5-franzicarboxylic acid, benzophenone-2,4'-dicarboxylic acid monohydrate, benzophenone-4,4'-dicarboxylic acid, 2,3-pyrazinedicarboxylic acid, 2,3-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-Pyridinedicarboxylic acid, 2,5-Pyridinedicarboxylic acid, 2,6-Pyridinedicarboxylic acid, 3,4-Pyridinedicarboxylic acid, Pyrazole-3,5-dicarboxylic acid monohydrate, 4,4'-Stilbenedicarboxylic acid, Anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, Cheridonic acid monohydrate, Azobenzene-4,4'-dicarboxylic acid, Azobenzene-3,3'-dicarboxylic acid, Chlorendic acid, 1H-Imidazole-4,5-dicarboxylic acid, 2,2-Bis(4-carboxyphenyl)hexafluoropropane, 1,10-Bis(4-carboxyphenoxy)decane, dipropylmalonic acid, dithiodiglycolic acid, 3,3'-dithiodipropionic acid, 4,4'-dithiodibutanoic acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl sulfone, ethylene glycol bis(4-carboxyphenyl) ether, 3,4-ethylenedioxythiophene-2,5-dicarboxylic acid, 4,4'-isopropylidenediphenoxyacetic acid, 1,3-acetonedicarboxylic acid, methylenedisalicylic acid, 5,5'-thiodisalicylic acid, tris(2-carboxyethyl)isocyanurate, tetrafluorosuccinic acid, α,α,α',α'-tetramethyl-1,3-benzenedipropionic acid, 1,3,5-benzenetricarboxylic acid, etc.

[0064] From the viewpoint of increasing the development speed of the resin composition and increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.), the molecular weight of compound (J-1) is preferably 3000 or less, more preferably 2000 or less, even more preferably 1000 or less, still more preferably 800 or less, and particularly preferably 500 or less. The molecular weight of compound (J-1) is usually 100 or more.

[0065] The above molecular weight may be either a number-average molecular weight or a weight-average molecular weight. In this case, the number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight, respectively, measured on a standard polystyrene basis by gel permeation chromatography (GPC).

[0066] In the resin composition, it is preferable that at least some of the molecules of compound (J-1) are coordinated to the quantum dot (B), and all or almost all of the molecules may be coordinated to the quantum dot (B). That is, the resin composition preferably contains compound (J-1) that is coordinated to the quantum dot (B), but it may also contain compound (J-1) that is not coordinated to the quantum dot (B) along with compound (J-1) that is coordinated to the quantum dot (B). Including compound (J-1) coordinated to quantum dot (B) can be advantageous from the viewpoint of increasing the development speed of the resin composition and increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.). Compound (J-1) can usually coordinate to quantum dot (B) via a first functional group and / or a second functional group. Compound (J-1) can coordinate, for example, to the surface of quantum dot (B).

[0067] When the resin composition contains quantum dots (B) and compound (J-1), the content ratio of compound (J-1) to quantum dots (B) in the resin composition is preferably 0.001 or more and 1 or less by mass, more preferably 0.01 or more and 0.5 or less, and even more preferably 0.02 or more and 0.1 or less. Having this content ratio within this range can be advantageous from the viewpoint of increasing the development speed of the resin composition and increasing the light emission intensity of the resin layer (wavelength conversion film, etc.).

[0068] When the resin composition contains compound (J-1), the content of compound (J-1) in the resin composition is preferably 0.1% to 20% by mass, more preferably 0.1% to 10% by mass, even more preferably 0.2% to 8% by mass, even more preferably 0.2% to 5% by mass, and particularly preferably 0.5% to 4% by mass, relative to the total amount of solids in the resin composition, from the viewpoint of increasing the development speed of the resin composition and increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.).

[0069] [Compound (J-2)] Compound (J-2) is a compound different from compound (J-1), containing a polyalkylene glycol structure and having polar groups at its molecular ends. Preferably, the molecular end is the end of the longest carbon chain in compound (J-2) (the carbon atoms in the carbon chain may be replaced by other atoms such as oxygen atoms). The resin composition may contain only one compound (J-2) or two or more compounds. Compounds containing a polyalkylene glycol structure and having the above-mentioned first and second functional groups shall be classified as compound (J-1).

[0070] From the viewpoint of increasing the development speed of the resin composition and increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.), the resin composition may contain compound (J-1) or compound (J-2), or may contain both compound (J-1) and compound (J-2).

[0071] The polyalkylene glycol structure is defined by the following formula:

[0072] [ka]

[0073] This refers to a structure represented by (n is an integer greater than or equal to 2). In the formula, R C This is an alkylene group, such as an ethylene group or a propylene group. A specific example of compound (J-2) is a polyalkylene glycol compound represented by the following formula (J-2a).

[0074] [ka]

[0075] In formula (J-2a), X is a polar group, Y is a monovalent group, and Z C is a divalent or trivalent base. n is an integer greater than or equal to 2. m is 1 or 2. R C This is an alkylene group.

[0076] In the resin composition, it is preferable that at least some of the molecules of compound (J-2) are coordinated to the quantum dot (B), and all or almost all of the molecules may be coordinated to the quantum dot (B). That is, the resin composition preferably contains compound (J-2) that is coordinated to the quantum dot (B), but it may also contain compound (J-2) that is not coordinated to the quantum dot (B) along with compound (J-2) that is coordinated to the quantum dot (B). The inclusion of compound (J-2) coordinating to quantum dot (B) may be advantageous from the viewpoint of increasing the development speed of the resin composition and increasing the light emission intensity of the resin layer (wavelength conversion film, etc.). Compound (J-2a) can usually coordinate to quantum dot (B) via polar group X. If group Y contains a polar group, compound (J-2a) can also coordinate to quantum dot (B) via the polar group of group Y, or via the polar groups of polar group X and group Y. Compound (J-2) can coordinate, for example, to the surface of quantum dot (B).

[0077] The polar group X is preferably at least one group selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2). The polar group selected from this group may be advantageous in improving coordination to the quantum dot (B). In particular, from the viewpoint of increasing the light emission intensity of the resin layer (wavelength conversion film, etc.), the polar group X is more preferably at least one group selected from the group consisting of a thiol group and a carboxyl group.

[0078] Group Y is a monovalent group. Group Y is not particularly limited and can be any monovalent hydrocarbon group which may have substituents (N, O, S, halogen atoms, etc.). The -CH2- contained in the hydrocarbon group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc.

[0079] The number of carbon atoms in the hydrocarbon group is, for example, 1 to 12. The hydrocarbon group may have unsaturated bonds. Examples of group Y include alkyl groups having 1 to 12 carbon atoms and having a linear, branched, or cyclic structure; and alkoxy groups having 1 to 12 carbon atoms and having a linear, branched, or cyclic structure. The number of carbon atoms in the alkyl and alkoxy groups is preferably 1 to 8, more preferably 1 to 6, and even more preferably 1 to 4. The -CH2- contained in the alkyl and alkoxy groups may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. In particular, group Y is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms, and more preferably a linear alkoxy group having 1 to 4 carbon atoms.

[0080] Group Y may contain a polar group. The polar group may be at least one group selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2). However, as described above, compounds containing a polyalkylene glycol structure and having the above-mentioned first and second functional groups belong to compound (J-1). The polar group is preferably located at the terminal end of group Y.

[0081] Base Z C It is a divalent or trivalent group. Group Z C Examples include divalent or trivalent hydrocarbon groups, which are not particularly limited and may contain heteroatoms (such as N, O, S, or halogen atoms). The number of carbon atoms in the hydrocarbon group is, for example, 1 to 24. The hydrocarbon group may have unsaturated bonds.

[0082] The divalent group Z CExamples include alkylene groups having 1 to 24 carbon atoms and having a linear, branched, or cyclic structure; and alkenylene groups having 1 to 24 carbon atoms and having a linear, branched, or cyclic structure. The number of carbon atoms in the alkyl and alkenylene groups is preferably 1 to 12, more preferably 1 to 8, and even more preferably 1 to 4. The -CH2- contained in the alkyl and alkenylene groups may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. The group Z is a trivalent group. C An example of this is the divalent group Z mentioned above. C We can give an example of a group obtained by removing one hydrogen atom from the same group.

[0083] Base Z C The group Z may have a branched structure. C In a branch chain separate from the branch chain containing the polyalkylene glycol structure shown in formula (J-2a) above, the branch chain may have a polyalkylene glycol structure separate from the polyalkylene glycol structure shown in formula (J-2a) above.

[0084] In particular, Base Z C It is preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and more preferably a linear alkylene group having 1 to 4 carbon atoms.

[0085] R C The group is an alkylene group, preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and more preferably a linear alkylene group having 1 to 4 carbon atoms.

[0086] In formula (J-2a), n is an integer greater than or equal to 2, preferably between 2 and 540, more preferably between 2 and 120, and even more preferably between 2 and 60.

[0087] The molecular weight of compound (J-2) may be, for example, 150 to 10,000, but from the viewpoint of increasing the development speed of the resin composition and increasing the light emission intensity of the resin layer (wavelength conversion film, etc.), it is preferably 150 to 5,000, and more preferably 150 to 4,000.

[0088] The above molecular weight may be either the number-average molecular weight or the weight-average molecular weight. In this case, the number-average molecular weight and the weight-average molecular weight are the number-average molecular weight and the weight-average molecular weight, respectively, measured by GPC on a standard polystyrene basis.

[0089] When the resin composition contains quantum dots (B) and compound (J-2), the content ratio of compound (J-2) to quantum dots (B) in the resin composition is preferably 0.001 to 2 by mass, more preferably 0.01 to 1.5, and even more preferably 0.1 to 1. Having this content ratio within this range can be advantageous from the viewpoint of increasing the development speed of the resin composition and increasing the light emission intensity of the resin layer (wavelength conversion film, etc.).

[0090] When the resin composition contains compound (J-2), the content of compound (J-2) in the resin composition is preferably 0.1% to 40% by mass, more preferably 0.1% to 20% by mass, even more preferably 1% to 15% by mass, and still more preferably 2% to 10% by mass, relative to the total amount of solids in the resin composition, from the viewpoint of increasing the development speed of the resin composition and increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.).

[0091] When the resin composition contains compound (J-1) and compound (J-2), the content ratio of compound (J-2) to compound (J-1) in the resin composition is preferably 1 to 50 by mass, more preferably 5 to 40, and even more preferably 10 to 25. Having this content ratio within this range can be advantageous from the viewpoint of increasing the development speed of the resin composition and increasing the light emission intensity of the resin layer (wavelength conversion film, etc.).

[0092] The resin composition may further contain a compound other than compound (J-1) and compound (J-2), which has coordinating ability for quantum dots (B), compound (J-3). Examples of compound (J-3) include organic acids, organic amine compounds, and thiol compounds. Compound (J-3) may also be a silicone oil modified with carboxyl groups and amino groups or thiol groups, and by including such compound (J-3) in the resin composition, the properties of the resin layer (such as surface properties like contact angle θr and surface tension σr) can be adjusted.

[0093] When the resin composition contains quantum dots (B) and compound (J-3), the content ratio of compound (J-3) to quantum dots (B) in the resin composition is preferably 0.001 to 2 by mass, more preferably 0.01 to 1.5, and even more preferably 0.1 to 1. Having this content ratio within this range can be advantageous from the viewpoint of increasing the development speed of the resin composition and increasing the light emission intensity of the resin layer (wavelength conversion film, etc.).

[0094] When the resin composition contains compound (J-3), the content of compound (J-3) in the resin composition is preferably 0.1% to 40% by mass, more preferably 0.1% to 20% by mass, even more preferably 0.2% to 15% by mass, and still more preferably 0.2% to 10% by mass, relative to the total amount of solids in the resin composition, from the viewpoint of increasing the development speed of the resin composition and increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.).

[0095] Note that compound (J-3) does not include light scattering agents (A), resins (C), photopolymerizable compounds (D), photopolymerization initiators (E), photopolymerization initiator aids (E1), solvents (F), antioxidants (G), and leveling agents (H).

[0096] The resin composition may contain organic ligands even if it does not contain quantum dots (B). By including organic ligands in the resin composition, the properties of the resin layer (such as surface properties like contact angle θr and surface tension σr) can be adjusted.

[0097] [2-4]Resin (C) The resin composition contains one or more resins (C). Examples of resins (C) include the following resins [K1] to [K4]. Resin [K1]; a copolymer of at least one (a) selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides (hereinafter also referred to as "(a)") and a monomer (c) copolymerizable with (a) (however different from (a)) (hereinafter also referred to as "(c)"); Resin [K2]; a resin obtained by reacting a copolymer of (a) and (c) with monomer (b) (hereinafter also referred to as "(b)") having a cyclic ether structure with 2 to 4 carbon atoms and an ethylenically unsaturated bond; Resin [K3]; a resin obtained by reacting (a) with a copolymer of (b) and (c); Resin [K4]; A resin obtained by reacting (a) with a copolymer of (b) and (c), and then reacting it with a carboxylic acid anhydride.

[0098] (a) For example, unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, and o-, m-, p-vinylbenzoic acid; Unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, and 1,4-cyclohexenedicarboxylic acid; Bicyclounsaturated compounds containing carboxyl groups, such as methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, and 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene; Unsaturated dicarboxylic acid anhydrides such as maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, and 5,6-dicarboxybicyclo[2.2.1]hepto-2-ene anhydride; Unsaturated mono(meth)acryloyloxyalkyl) esters of divalent or higher polyvalent carboxylic acids such as mono(2-(meth)acryloyloxyethyl) succinate and mono(2-(meth)acryloyloxyethyl) phthalate; Unsaturated (meth)acrylates that contain both a hydroxyl group and a carboxyl group in the same molecule, such as α-(hydroxymethyl)(meth)acrylic acid. These are some examples. Of these, (meth)acrylic acid, maleic anhydride, etc. are preferred in terms of copolymerization reactivity and the solubility of the resulting resin (C) in alkaline aqueous solutions. In this specification, (meth)acrylic acid means acrylic acid and / or methacrylic acid. The same applies to "(meth)acryloyl," "(meth)acrylate," etc.

[0099] (b) is a monomer having, for example, a cyclic ether structure with 2 to 4 carbon atoms (for example, at least one selected from the group consisting of an oxirane ring, an oxetane ring, and a tetrahydrofuran ring) and an ethylenically unsaturated bond. Preferably, (b) is a monomer having a cyclic ether structure with 2 to 4 carbon atoms and a (meth)acryloyloxy group.

[0100] (b) includes, for example, glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, β-ethylglycidyl (meth)acrylate, glycidyl vinyl ether, o-vinylbenzylglycidyl ether, m-vinylbenzylglycidyl ether, p-vinylbenzylglycidyl ether, α-methyl-o-vinylbenzylglycidyl ether, α-methyl-m-vinylbenzylglycidyl ether, α-methyl-p-vinylbenzylglycidyl ether, 2,3-bis(glycidyloxymethyl) sty Monomers having an oxirane ring and an ethylenically unsaturated bond, such as lene, 2,4-bis(glycidyloxymethyl)styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxymethyl)styrene, 2,3,4-tris(glycidyloxymethyl)styrene, 2,3,5-tris(glycidyloxymethyl)styrene, 2,3,6-tris(glycidyloxymethyl)styrene, 3,4,5-tris(glycidyloxymethyl)styrene, and 2,4,6-tris(glycidyloxymethyl)styrene; Monomers having an oxetane ring and an ethylenically unsaturated bond, such as 3-methyl-3-methacryloyloxymethyl oxetane, 3-methyl-3-acryloyloxymethyl oxetane, 3-ethyl-3-acryloyloxymethyl oxetane, 3-methyl-3-methacryloyloxyethyl oxetane, 3-methyl-3-acryloyloxyethyl oxetane, 3-ethyl-3-methacryloyloxyethyl oxetane, and 3-ethyl-3-acryloyloxyethyl oxetane; Monomers having a tetrahydrofuran ring and an ethylenically unsaturated bond, such as tetrahydrofurfuryl acrylate (e.g., Viscoat V#150, manufactured by Osaka Organic Chemical Industry Co., Ltd.) and tetrahydrofurfuryl methacrylate. These are some examples. Because the reactivity during the production of resins [K2] to [K4] is high and unreacted (b) is unlikely to remain, a monomer having an oxirane ring and an ethylenically unsaturated bond is preferred for (b).

[0101] (c) For example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 2,6 ] Decane-8-yl(meth)acrylate (in the relevant technical field, it is commonly called "dicyclopentanyl(meth)acrylate". It is also sometimes called "tricyclodecyl(meth)acrylate"), tricyclo[5.2.1.0 2,6 (Meth)acrylic acid esters such as decen-8-yl (meth)acrylate (commonly known as "dicyclopentenyl (meth)acrylate" in the relevant technical field), dicyclopentanyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, allyl (meth)acrylate, propargyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, benzyl (meth)acrylate, etc. Hydroxy group-containing (meth)acrylic acid esters such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; Diethyl maleate, diethyl fumarate, diethyl itaconate, and other dicarboxylic acid diesters; Bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybi Cyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene To-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2 Bicyclounsaturated compounds such as -ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, and 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene; Dicarbonylimide derivatives such as N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimide benzoate, N-succinimidyl-4-maleimide butyrate, N-succinimidyl-6-maleimide caproate, N-succinimidyl-3-maleimide propionate, and N-(9-acridinyl)maleimide; Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene isoprene, 2,3-dimethyl-1,3-butadiene These are some examples. Of these, styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, and bicyclo[2.2.1]hept-2-ene are preferred in terms of copolymerization reactivity and the heat resistance of resin (C).

[0102] In resin [K1], the ratio of constituent units derived from each is, out of all constituent units that make up resin [K1], (a) Constituent units derived from (a): 2 mol% to 60 mol% (c) Constituent units derived from (a): 40 mol% to 98 mol% It is preferable that this be the case. (a) Constituent units derived from (a); 10 mol% to 50 mol% (c) Constituent units derived from (c); 50 mol% to 90 mol% It is preferable that it be so. When the ratio of constituent units of resin [K1] falls within the above range, the resin composition tends to exhibit excellent storage stability, developability, and solvent resistance of the resulting resin layer.

[0103] The resin [K1] can be manufactured, for example, by referring to the method described in the literature "Experimental Methods for Polymer Synthesis" (by Takayuki Otsu, published by Kagaku Dojin Co., Ltd., 1st edition, 1st printing, March 1, 1972) and the cited literature.

[0104] Specifically, one method involves placing predetermined amounts of (a) and (c), a polymerization initiator, and a solvent into a reaction vessel, creating a deoxygenated atmosphere by, for example, replacing oxygen with nitrogen, and then heating and maintaining the temperature while stirring. The polymerization initiators and solvents used herein are not particularly limited, and those commonly used in the field may be used. For example, examples of polymerization initiators include azo compounds (2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), etc.) and organic peroxides (benzoyl peroxide, etc.), and the solvent can be any solvent that dissolves each monomer. Examples of solvents (F) that may be included in the resin composition include the solvents described later.

[0105] The resulting copolymer may be used as is after the reaction, as a concentrated or diluted solution, or as a solid (powder) obtained by methods such as reprecipitation. If solvent (F), described later, is used as the solvent during polymerization, the solution after the reaction can be used directly in the preparation of the resin composition, thereby simplifying the manufacturing process of the resin composition.

[0106] The resin [K2] can be produced by adding a cyclic ether having 2 to 4 carbon atoms from (b) to a carboxylic acid and / or carboxylic acid anhydride from (a) to a copolymer of (a) and (c). First, a copolymer of (a) and (c) is produced in the same manner as described for the production of resin [K1]. In this case, it is preferable that the ratio of constituent units derived from each is the same as the ratio described for resin [K1].

[0107] Next, a portion of the carboxylic acid and / or carboxylic acid anhydride derived from (a) in the copolymer is reacted with a cyclic ether having 2 to 4 carbon atoms that (b) possesses. Following the production of the copolymer of (a) and (c), the atmosphere inside the flask is replaced from nitrogen to air, and the resin [K2] can be produced by reacting (b), a reaction catalyst for the reaction between a carboxylic acid or carboxylic acid anhydride and a cyclic ether (e.g., organophosphorus compounds, metal complexes, amine compounds, etc.) and a polymerization inhibitor (e.g., hydroquinone, etc.) at a temperature of 60°C to 130°C for 1 to 10 hours.

[0108] The amount of (b) used is preferably 5 moles to 80 moles, and more preferably 10 moles to 75 moles, per 100 moles of (a). By keeping it within this range, a good balance tends to be achieved between the storage stability of the resin composition, the developability of the resulting resin layer, and the solvent resistance, heat resistance, and mechanical strength of the resin layer.

[0109] Examples of organophosphorus compounds used as reaction catalysts include triphenylphosphine. Examples of amine compounds used as reaction catalysts include aliphatic tertiary amine compounds or aliphatic quaternary ammonium salt compounds, and specific examples include tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, and tetrabutylammonium chloride. From the viewpoint of the developability of the resin layer and the emission light intensity of the wavelength conversion film when the resin layer is a wavelength conversion film described later, the reaction catalyst is preferably an organophosphorus compound.

[0110] The amount of reaction catalyst used is preferably 0.001 parts by mass or more and 5 parts by mass or less, based on 100 parts by mass of the total amount of (a), (b), and (c). The amount of polymerization inhibitor used is preferably 0.001 parts by mass or more and 5 parts by mass or less, based on 100 parts by mass of the total amount of (a), (b), and (c).

[0111] The reaction conditions, such as the preparation method, reaction temperature, and time, can be adjusted as appropriate, taking into account the manufacturing equipment and the amount of heat generated by polymerization. Similarly, the preparation method and reaction temperature can be adjusted as appropriate, taking into account the manufacturing equipment and the amount of heat generated by polymerization.

[0112] As a first step, resin [K3] is produced in the same manner as the production method for resin [K1] described above to obtain a copolymer of (b) and (c). As described above, the obtained copolymer may be used as is after the reaction, or a concentrated or diluted solution may be used, or it may be used after being extracted as a solid (powder) by methods such as reprecipitation.

[0113] The ratios of the constituent units derived from (b) and (c) are, in relation to the total number of moles of all constituent units constituting the copolymer, respectively: (b) Constituent units derived from (b); 5 mol% to 95 mol% (c) Constituent units derived from (c); 5 mol% to 95 mol% Preferably, the constituent units derived from (b); 10 mol% or more and 90 mol% or less (c) Constituent units derived from (c); 10 mol% to 90 mol% It is preferable that it be so.

[0114] Resin [K3] can be obtained by reacting a cyclic ether derived from (b) in a copolymer of (b) and (c) with a carboxylic acid or carboxylic acid anhydride from (a) under the same conditions as for the production of resin [K2]. The amount of (a) used to react with the copolymer is preferably 5 moles to 80 moles per 100 moles of (b).

[0115] Resin [K4] is a resin obtained by further reacting resin [K3] with a carboxylic acid anhydride. The hydroxyl group generated by the reaction of a cyclic ether with a carboxylic acid or carboxylic acid anhydride is reacted with the carboxylic acid anhydride. Examples of carboxylic acid anhydrides include maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, and 5,6-dicarboxybicyclo[2.2.1]hepto-2-ene anhydride. The amount of carboxylic acid anhydride used is preferably 0.5 moles or more and 1 mole or less per mole of (a) used.

[0116] Examples of resins [K1], [K2], [K3], and [K4] include resins [K1] such as benzyl (meth)acrylate / (meth)acrylic acid copolymer and styrene / (meth)acrylic acid copolymer; Examples of resins include resins obtained by adding glycidyl (meth)acrylate to a benzyl (meth)acrylate / (meth)acrylic acid copolymer, resins obtained by adding glycidyl (meth)acrylate to a tricyclodecyl (meth)acrylate / styrene / (meth)acrylic acid copolymer, and resins obtained by adding glycidyl (meth)acrylate to a tricyclodecyl (meth)acrylate / benzyl (meth)acrylate / (meth)acrylic acid copolymer [K2]; resins obtained by reacting (meth)acrylic acid with a tricyclodecyl (meth)acrylate / glycidyl (meth)acrylate copolymer, and resins obtained by reacting (meth)acrylic acid with a tricyclodecyl (meth)acrylate / styrene / glycidyl (meth)acrylate copolymer [K3]; and resins obtained by reacting tetrahydrophthalic anhydride with a resin obtained by reacting (meth)acrylic acid with a tricyclodecyl (meth)acrylate / glycidyl (meth)acrylate copolymer [K4]. In particular, resin (C) preferably includes at least one selected from the group consisting of resin [K2], resin [K3], and resin [K4].

[0117] Further examples of resin (C) include the alkali-soluble resin described in Japanese Patent Publication No. 2018-123274.

[0118] The resin (C) may include one or more selected from the group consisting of the above-mentioned resins [K1], [K2], [K3], [K4] and the alkali-soluble resin described in Japanese Patent Publication No. 2018-123274.

[0119] Further examples of resin (C) include polyalkylene glycol compounds. Examples of polyalkylene glycol compounds include polyethylene glycol and polypropylene glycol. Polyalkylene glycol compounds are advantageous in improving the dispersibility of quantum dots (B) in the resin composition when the resin composition further contains quantum dots (B).

[0120] The resin (C) preferably has a weight-average molecular weight equivalent to standard polystyrene, as measured by GPC, of ​​9000 or less. Having the above weight-average molecular weight of resin (C) improves the development speed of the resin layer, and when the resin layer is a wavelength conversion film, it tends to produce a wavelength conversion film with high emitted light intensity. The weight-average molecular weight of resin (C) on a standard polystyrene basis is, for example, 1000 to 9000, preferably 2000 to 8500, and more preferably 3000 to 8500, from the viewpoint of the development speed of the resin layer and the emitted light intensity of the wavelength conversion film. The weight-average molecular weight of resin (C) on a standard polystyrene basis is measured according to the measurement method described in the Examples section below. To achieve the weight-average molecular weight of resin (C) within the above range, the selection of raw materials, the preparation method, and reaction conditions such as reaction temperature and time can be appropriately combined and adjusted.

[0121] The molecular weight distribution [weight-average molecular weight (Mw) / number-average molecular weight (Mn)] of the resin (C) measured by GPC is, for example, 1.0 or more and 6.0 or less, and preferably 1.2 or more and 4.0 or less from the viewpoint of the developability of the resin layer.

[0122] The acid value of resin (C) is preferably 90 mg KOH / g or more and 150 mg KOH / g or less, based on the solid content. If the acid value is less than 90 mg KOH / g, the solubility of the resin layer in the alkaline developer will be low, which may leave residue on the substrate. If the acid value exceeds 150 mg KOH / g, there is a high possibility of the resin layer peeling off after development.

[0123] The acid value of resin (C) is preferably 95 mg KOH / g or more and 140 mg KOH / g or less, and more preferably 100 mg KOH / g or more and 130 mg KOH / g or less, from the viewpoint of the developability of the resin layer.

[0124] The acid value is measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of resin (C), and can be determined, for example, by titration using an aqueous potassium hydroxide solution. The acid value of resin (C) is measured according to the measurement method described in the Examples section below.

[0125] Resin (C) may include resins having a double bond equivalent of, for example, 300 g / eq to 2000 g / eq, preferably 500 g / eq to 1500 g / eq. Including a resin in resin (C) having a double bond equivalent of 300 g / eq to 2000 g / eq tends to make it easier to prevent quenching during the process of manufacturing the cured pattern. If resin (C) includes a resin with a double bond equivalent exceeding 2000 g / eq, resin (C) tends to have a reduced ability to effectively protect quantum dots (B). If resin (C) includes a resin with a double bond equivalent of less than 300 g / eq, the cured pattern tends to peel off easily without dissolving during development. Examples of resins having a double bond equivalent of 300 g / eq or more and 2000 g / eq or less include (meth)acrylic resins. Resin (C) is preferably a (meth)acrylic resin.

[0126] When the resin composition contains a light scattering agent (A) but does not contain quantum dots (B), the content of resin (C) in the resin composition is, for example, 5% by mass or more and 80% by mass or less, preferably 10% by mass or more and 70% by mass or less, and more preferably 15% by mass or more and 65% by mass or less, based on the total amount of solids in the resin composition. When the content of resin (C) is within the above range, the light scattering agent (A) tends to disperse more easily, and the emitted light intensity tends to be maintained at a high level during the process of manufacturing the cured pattern.

[0127] When the resin composition contains a light scattering agent (A) and quantum dots (B), the content of resin (C) in the resin composition is, for example, 5% by mass or more and 80% by mass or less, preferably 10% by mass or more and 65% by mass or less, and more preferably 15% by mass or more and 45% by mass or less, based on the total amount of solids in the resin composition. When the content of resin (C) is within the above range, the light scattering agent (A) and quantum dots (B) tend to disperse easily, and the emitted light intensity tends to be maintained at a high level during the process of manufacturing the cured pattern described later.

[0128] In a resin composition that further contains a photopolymerizable compound (D) described later along with a light scattering agent (A), and does not contain quantum dots (B), the mass ratio (solid content ratio) of the resin (C) to the photopolymerizable compound (D) is, for example, 1 or more, and preferably 1.5 to 3.5 from the viewpoint of the developability of the resin layer.

[0129] When the resin composition contains a light scattering agent (A), quantum dots (B), and a photopolymerizable compound (D), the mass ratio (solid content ratio) of the resin (C) to the photopolymerizable compound (D) is, for example, 1 or more, and preferably 2.5 to 5.5 from the viewpoint of the developability of the resin layer.

[0130] Furthermore, the higher the content of polar groups in resin (C), the higher the contact angle θr of the resin layer with respect to diiodomethane tends to be. Examples of polar groups include carboxyl groups, hydroxyl groups, and amino groups.

[0131] [2-5] Photopolymerizable compound (D) The resin composition may contain one or more photopolymerizable compounds (D). A resin composition further containing a photopolymerizable compound (D) and a photopolymerization initiator (E) described later exhibits curability. The photopolymerizable compound (D) is a compound that can be polymerized by active radicals, acids, etc., generated from the photopolymerization initiator (E) described later. Examples include compounds having an ethylenically unsaturated bond, and is preferably a (meth)acrylic acid ester compound.

[0132] In particular, the photopolymerizable compound (D) is preferably a polymerizable compound having three or more ethylenically unsaturated bonds. Examples of such polymerizable compounds include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, and tri Examples include (2-(meth)acryloyloxyethyl) isocyanurate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, and caprolactone-modified dipentaerythritol hexa(meth)acrylate. The weight-average molecular weight of the photopolymerizable compound (D) is preferably 150 to 2900, more preferably 250 to 1500.

[0133] When the resin composition contains a photopolymerizable compound (D), the content of the photopolymerizable compound (D) in the resin composition is preferably 7% to 60% by mass, more preferably 10% to 45% by mass, and even more preferably 13% to 30% by mass, based on the total amount of solids in the resin composition. When the content of the photopolymerizable compound (D) is within the above range, the residual film rate of the cured pattern and the chemical resistance of the cured pattern tend to improve.

[0134] [2-6] Photopolymerization initiator (E) When a resin composition contains a photopolymerizable compound (D), the resin composition usually further contains one or more photopolymerization initiators (E). A photopolymerization initiator (E) is a compound that can initiate polymerization by generating active radicals, acids, etc., upon the action of light or heat. The photopolymerization initiator (E) preferably includes an oxime compound having a first molecular structure represented by the following formula (1). Hereinafter, the oxime compound will also be referred to as "oxime compound (1)".

[0135] [ka]

[0136] Including an oxime compound (1) as a photopolymerization initiator (E) can be advantageous from the viewpoint of increasing the light intensity emitted from the resin layer (wavelength conversion film, etc.). One reason for this effect is presumed to be that, due to the unique molecular structure of the oxime compound (1), the absorption wavelength of the oxime compound (1) changes significantly before and after cleavage (decomposition) of the oxime compound (1), which is necessary for the oxime compound (1) to initiate photopolymerization. Therefore, the oxime compound (1) has a high photoradical polymerization initiation ability.

[0137] In formula (1), R 1 R 11 , OR 11 COR 11 , SR 11 CONR 12 R 13 Alternatively, it represents CN. R 11 , R 12 and R 13 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 11 , R 12 or R 13 The hydrogen atom of the group represented by OR 21 COR 21 , SR 21 , NR 22 Ra 23, CONR 22 R 23 , -NR 22 , -OR 23 , -N(COR 22 )-OCOR 23 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, a halogen atom, or COOR 21 may be substituted. R 21 R 22 and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 21 R 22 or R 23 The hydrogen atom of the group represented by may be substituted with CN, a halogen atom, a hydroxy group, or a carboxy group. R 11 R 12 R 13 R 21 R 22 or R 23 When the group represented by has an alkylene moiety, the alkylene moiety may be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO-. R 24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 11 R 12 R 13 R 21 R 22 or R 23 When the group represented by has an alkyl moiety, the alkyl moiety may be branched or cyclic, and also, R12 and R 13 and R 22 and R 23 They may also come together to form a ring. * indicates a bond with a second molecular structure, which is a molecular structure other than the first molecular structure possessed by oxime compound (1).

[0138] R in equation (1) 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 Examples of alkyl groups having 1 to 20 carbon atoms represented by include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, isopentyl group, tert-pentyl group, hexyl group, heptyl group, octyl group, isooctyl group, 2-ethylhexyl group, tert-octyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group, tetradecyl group, hexadecyl group, octadecyl group, eicosyl group, cyclopentyl group, cyclohexyl group, cyclohexylmethyl group, and cyclohexylethyl group.

[0139] R in equation (1) 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 Examples of aryl groups having 6 to 30 carbon atoms represented by include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthryl, phenanthryl, phenyl, biphenylyl, naphthyl, and anthryl groups substituted with one or more of the above alkyl groups.

[0140] R in equation (1) 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24Examples of aralkyl groups with 7 to 30 carbon atoms represented by this formula include the benzyl group, α-methylbenzyl group, α,α-dimethylbenzyl group, and phenylethyl group.

[0141] R in equation (1) 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 Examples of heterocyclic groups having 2 to 20 carbon atoms represented by include pyridyl, pyrimidyl, furyl, thienyl, tetrahydrofuryl, dioxolanyl, benzoxazole-2-yl, tetrahydropyranyl, pyrrolidyl, imidazolidyl, pyrazolidyl, thiazolidyl, isothiazolidyl, oxazolidyl, isoxazolidyl, piperidyl, piperadyl, and morpholinyl groups, and are preferably 5 to 7-membered heterocyclic groups.

[0142] R in equation (1) 12 and R 13 and R 22 and R 23 The statement that they may each come together to form a ring means that R 12 and R 13 and R 22 and R 23 This means that each atom may form a ring with the nitrogen, carbon, or oxygen atoms it connects to. Ra in equation (1) 12 and Ra 13 and Ra 22 and Ra 23 Examples of rings that can be formed by these rings together include cyclopentane rings, cyclohexane rings, cyclopentene rings, benzene rings, piperidine rings, morpholine rings, lactone rings, lactam rings, and the like, and are preferably 5- to 7-membered rings.

[0143] R in equation (1) 11 , R 12 , R 13 , R 21 , R 22 and R 23Examples of halogen atoms that may be present as substituents include fluorine, chlorine, bromine, and iodine atoms.

[0144] R in equation (1) 1 Preferably R 11 The alkyl group is more preferably a C1-C20 alkyl group, even more preferably a C1-C10 alkyl group, and still more preferably a C1-C6 alkyl group.

[0145] An example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (2) below. The second molecular structure refers to any molecular structural portion of the oxime compound (1) other than the first molecular structure described above. In formula (2), the bond represented by "*" is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (2), the benzene ring with "-*" in formula (2) and the carbonyl group with "-*" in formula (1) are directly bonded.

[0146] [ka]

[0147] In formula (2), R 2 and R 3 Each of them is independent of R 11 , OR 11 , SR 11 COR 11 CONR 12 R 13 , NR 12 COR 11 OCOR 11 COOR 11 SCOR 11 OCSR 11 COSR 11 , CSOR 11 , represents CN or halogen atoms. R 2 When multiple instances exist, they may be the same or different. R 3When multiple instances exist, they may be the same or different. R 11 , R 12 and R 13 This expresses the same meaning as above. s and t each independently represent integers between 0 and 4. L is a sulfur atom, CR 31 R 32 , CO or NR 33 It represents. R 31 , R 32 and R 33 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms. R 31 , R 32 or R 33 When the group represented by has an alkyl moiety, the alkyl moiety may be branched or cyclic, R 31 , R 32 and R 33 Each of these rings may independently form a ring with either of the adjacent benzene rings. R 4 is a hydroxyl group, a carboxyl group or the following formula (2-1)

[0148] [ka] (In formula (2-1), L 1 -O-, -S-, -NR 22 -, -NR 22 These represent CO-, -SO2-, -CS-, -OCO-, or -COO-. R 22 This expresses the same meaning as above. L 2 This represents a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, a group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, or a group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms. L 2When the group represented by has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 22 -, -NR 22 COO-, -OCONR 22 -, -SCO-, -COS-, -OCS-, or -CSO- may be interrupted 1 to 5 times, and the alkylene portion may be branched or cyclic. R 4a is OR 41 , SR 41 CONR 42 R 43 , NR 42 COR 43 OCOR 41 COOR 41 SCOR 41 OCSR 41 COSR 41 , CSOR 41 , represents CN or halogen atoms. R 4a When multiple instances exist, they may be the same or different. R 41 , R 42 and R 43 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms, R 41 , R 42 and R 43 When the group represented by has an alkyl moiety, the alkyl moiety may be branched or cyclic, R 42 and R 43 They may also form a ring together. v represents an integer between 1 and 3. It represents a base that is expressed as [this]. * indicates the bonding site with the first molecular structure of oxime compound (1).

[0149] R in equation (2) 11 , R 12 , R 13 , R 21 , R 22 , R 23 , R 24 , R31 , R 32 and R 33 , and R in formula (2-1) above 22 , R 41 , R 42 and R 43 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, and aralkyl groups with 7 to 30 carbon atoms represented by R in formula (1) are shown in formula (1). 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 This is similar to the example regarding [the other topic].

[0150] R in equation (2) 11 , R 12 , R 13 , R 21 , R 22 , R 23 , R 24 , and R in formula (2-1) above 22 An example of a heterocyclic group with 2 to 20 carbon atoms represented by is R in formula (1). 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 This is similar to the example regarding [the other topic].

[0151] R in equation (2) 31 , R 32 and R 33 Each of these may independently form a ring together with either of the adjacent benzene rings, R 31 , R 32 and R 33 This means that each of them may independently form a ring with the nitrogen atom it connects to, either of the adjacent benzene rings. R in equation (2) 31 , R 32 and R 33 An example of a ring that can be formed by Ra in formula (1) is Ra 12 and Ra 13 and Ra22 and Ra 23 This is similar to the example of a ring that can be formed by these elements together.

[0152] In the above equation (2-1), L 2 This represents a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0153] Examples of alkylene groups obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms include, when v is 1, the methylene group, ethylene group, propylene group, methylethylene group, butylene group, 1-methylpropylene group, 2-methylpropylene group, 1,2-dimethylpropylene group, 1,3-dimethylpropylene group, 1-methylbutylene group, 2-methylbutylene group, 3-methylbutylene group, 4-methylbutylene group, 2,4-dimethylbutylene group, 1,3-dimethylbutylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, dodecylene group, tridecylene group, tetradecylene group, pentadecylene group, ethane-1,1-diyl group, propane-2,2-diyl group, and other alkylene groups.

[0154] Examples of arylene groups obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms include, when v is 1, 1,2-phenylene, 1,3-phenylene, 1,4-phenylene, 2,6-naphthylene, 1,4-naphthylene, 2,5-dimethyl-1,4-phenylene, diphenylmethane-4,4'-diyl, 2,2-diphenylpropane-4,4'-diyl, diphenylsulfide-4,4'-diyl, and diphenylsulfone-4,4'-diyl.

[0155] Examples of groups obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms include, for example, the group represented by formula (a) and the group represented by formula (b) below when v is 1.

[0156] [ka] [In formulas (a) and (b), L 3 and L 5 This represents an alkylene group with 1 to 10 carbon atoms, L 4 and L 6 This represents a single bond or an alkylene group having 1 to 10 carbon atoms.

[0157] Examples of alkylene groups having 1 to 10 carbon atoms include methylene, ethylene, propylene, methylethylene, butylene, 1-methylpropylene, 2-methylpropylene, 1,2-dimethylpropylene, 1,3-dimethylpropylene, 1-methylbutylene, 2-methylbutylene, 3-methylbutylene, 4-methylbutylene, 2,4-dimethylbutylene, 1,3-dimethylbutylene, pentylene, hexylene, heptylene, octylene, nonylene, and desilene groups.

[0158] Examples of divalent heterocyclic groups obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms include, when v is 1, divalent heterocyclic groups such as 2,5-pyridinediyl group, 2,6-pyridinediyl group, 2,5-pyrimidinediyl group, 2,5-thiophenediyl group, 3,4-tetrahydrofranziyl group, 2,5-tetrahydrofranziyl group, 2,5-franziyl group, 3,4-thiazolediyl group, 2,5-benzofranziyl group, 2,5-benzothiophenediyl group, N-methylindole-2,5-diyl group, 2,5-benzothiazolediyl group, and 2,5-benzoxazolediyl group.

[0159] R in equation (2) 2 and R 3 , and R in formula (2-1) above 4a Examples of halogen atoms represented by include fluorine, chlorine, bromine, and iodine.

[0160] From the viewpoint of solubility in solvent (F) and / or development speed of the resin composition, a preferred example of the structure represented by formula (2) is the structure represented by the following formula (2a).

[0161] [ka] [In formula (2a), L' is a sulfur atom or NR 50 Represents R 50 R represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms. 2 , R 3 , R 4 , s and t have the same meaning as above.

[0162] From the same viewpoint as above, another preferred example of the structure represented by formula (2) is the structure represented by formula (2b) below.

[0163] [ka] [In formula (2b), R 44 is a hydroxyl group, a carboxyl group or the following formula (2-2)

[0164] [ka] (In formula (2-2), L 11 represents -O- or *-OCO-, where * is L 12 This represents a bonding with L 12 R represents an alkylene group having 1 to 20 carbon atoms, and the alkylene group may be interrupted by 1 to 3 -O- atoms. 44a is OR 55 Or COOR 55 Represents R 55 (This represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.) [This represents the base represented by ]

[0165] R 44 Preferably, the group is represented by formula (2-2). In this case, it is advantageous in terms of the solubility of the oxime compound (1) in solvent (F) and the development rate of the resin composition.

[0166] L 12The number of carbon atoms in the alkylene group represented by is preferably 1 to 10, and more preferably 1 to 4. R 44a This is preferably a hydroxyl group or a carboxyl group, and more preferably a hydroxyl group.

[0167] The method for producing the oxime compound (1) having the second molecular structure represented by formula (2) is not particularly limited, but it can be produced, for example, by the method described in Japanese Patent Application Publication No. 2011-132215.

[0168] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (3) below. In formula (3), the bond represented by "*" is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (3), the benzene ring with "-*" in formula (3) and the carbonyl group with "-*" in formula (1) are directly bonded.

[0169] [ka]

[0170] In formula (3), R 5 This represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 5 If the group represented by has an alkyl portion, the alkyl portion may be branched or cyclic. R 5 The hydrogen atom of the group represented by R 21 , OR 21 COR 21 , SR 21 , NR 22 R 23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR23 , NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 , CSOR 21 , hydroxyl group, nitro group, CN, halogen atom, or COOR 21 It may be replaced with . R 21 , R 22 and R 23 This expresses the same meaning as above. R 21 , R 22 or R 23 The hydrogen atoms of the group represented by may be substituted with CN, halogen atoms, hydroxyl groups, or carboxyl groups. R 21 , R 22 and R 23 When the group represented by has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- may be interrupted 1 to 5 times. R 24 This expresses the same meaning as above. R 21 , R 22 and R 23 When the group represented by has an alkyl moiety, the alkyl moiety may be branched, cyclic, or R 22 and R 23 They may be together forming a ring. R 6 , R 7 , R 8 and R 9 Each of them is independent of R 61 , OR 61, SR 61 COR 62 CONR 63 R 64 , NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 , CSOR 61 This represents a hydroxyl group, a nitro group, CN, or a halogen atom. R 61 , R 62 , R 63 , R 64 and R 65 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 , R 62 , R 63 , R 64 or R 65 The hydrogen atom of the group represented by OR 21 COR 21 , SR 21 , NR 22 Ra 23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 , CN, halogen atom, or COOR 21 It may be replaced with . R 6 and R 7 , R 7 and R 8 and R 8 and R 9 They may also come together to form a ring. * indicates the bonding site with the first molecular structure of oxime compound (1).

[0171] R in equation (3) 5 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms represented by R in formula (1) are shown in formula (1). 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 This is similar to the example regarding [the other topic].

[0172] R in equation (3) 22 and R 23 The statement that they may be together forming a ring means that R 22 and R 23 This means that together with the nitrogen, carbon, or oxygen atoms they connect to form a ring. R in equation (3) 22 and R 23 An example of a ring that can be formed by these together is Ra in equation (1). 12 and Ra 13 and Ra 22 and Ra 23 This is similar to the example of a ring that can be formed by these elements together.

[0173] R in equation (3) 6 , R 7 , R 8 and R 9 A halogen atom represented by R 5 , R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of halogen atoms that may substitute for a hydrogen atom include fluorine, chlorine, bromine, and iodine.

[0174] From the viewpoint of solubility in solvent (F) and / or development rate of the resin composition, in one preferred form, R 5 This is a group represented by the following formula (3-1).

[0175] [ka] [In formula (3-1), Z represents a group obtained by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, a group obtained by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms, or a group obtained by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms.] If the group represented by Z has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- may be interrupted 1 to 5 times, and the alkylene portion may be branched or cyclic. R 21 , R 22 and R 24 This expresses the same meaning as above.

[0176] In formula (3-1), Z is preferably a methylene group, an ethylene group, or a phenylene group, from the same viewpoint as described above. R in equation (3-1) 21 and R 22 From the same viewpoint as above, it is preferably an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, and more preferably a methyl group, an ethyl group, or a phenyl group.

[0177] From the same viewpoint as above, in another preferred form, R 7 This is a nitro group.

[0178] The method for producing the oxime compound (1) having the second molecular structure represented by formula (3) is not particularly limited, but it can be produced, for example, by the method described in Japanese Patent Application Publication No. 2000-80068 and Japanese Patent Application Publication No. 2011-178776.

[0179] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (4) below. In formula (4), the bond represented by "*" is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (4), the benzene ring with "-*" in formula (4) and the carbonyl group with "-*" in formula (1) are directly bonded.

[0180] [ka]

[0181] In formula (4), R 71 This represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 71 If the group represented by has an alkyl portion, the alkyl portion may be branched or cyclic. R 71 The hydrogen atom of the group represented by R 21 , OR 21 COR 21 , SR 21 , NR 22 R 23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21)-R 22 SCOR 21 OCSR 21 COSR 21 , CSOR 21 , hydroxyl group, nitro group, CN, halogen atom, or COOR 21 It may be replaced with . R 21 , R 22 and R 23 This expresses the same meaning as above. R 21 , R 22 or R 23 The hydrogen atoms of the group represented by may be substituted with CN, halogen atoms, hydroxyl groups, or carboxyl groups. R 21 , R 22 and R 23 When the group represented by has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- may be interrupted 1 to 5 times. R 24 This expresses the same meaning as above. R 21 , R 22 and R 23 When the group represented by has an alkyl moiety, the alkyl moiety may be branched, cyclic, or R 22 and R 23 They may be together forming a ring. R 72 , R 73 and 3 R 74 Each of them is independent of R 61 , OR 61 , SR 61 COR 62 CONR 63 R 64 , NR 65 COR 61 OCOR 61 COOR 62 SCOR 61OCSR 61 COSR 62 , CSOR 61 This represents a hydroxyl group, a nitro group, CN, or a halogen atom. R 61 , R 62 , R 63 , R 64 and R 65 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 , R 62 , R 63 , R 64 or R 65 The hydrogen atom of the group represented by OR 21 COR 21 , SR 21 , NR 22 Ra 23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 , CN, halogen atom, or COOR 21 It may be replaced with . R 72 and R 73 and two R 74 They may also come together to form a ring. * indicates the bonding site with the first molecular structure of oxime compound (1).

[0182] R in equation (4) 71 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms represented by R in formula (1) are shown in formula (1). 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 This is similar to the example regarding [the other topic].

[0183] R in equation (4) 22 and R 23 The statement that they may be together forming a ring means that R 22 and R 23 This means that together with the nitrogen, carbon, or oxygen atoms they connect to form a ring. R in equation (4) 22 and R 23 An example of a ring that can be formed by these together is Ra in equation (1). 12 and Ra 13 and Ra 22 and Ra 23 This is similar to the example of a ring that can be formed by these elements together.

[0184] R in equation (4) 72 , R 73 and R 74 A halogen atom represented by R 71 , R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of halogen atoms that may substitute for a hydrogen atom include fluorine, chlorine, bromine, and iodine.

[0185] The method for producing the oxime compound (1) having the second molecular structure represented by formula (4) is not particularly limited, but it can be produced, for example, by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0186] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (5) below. In formula (5), the bond represented by "*" is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (5), the pyrrole ring with "-*" in formula (5) and the carbonyl group with "-*" in formula (1) are directly bonded.

[0187] [ka]

[0188] In formula (5), R 81 This represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 81 If the group represented by has an alkyl portion, the alkyl portion may be branched or cyclic. R 81 The hydrogen atom of the group represented by R 21 , OR 21 COR 21 , SR 21 , NR 22 R 23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 , CSOR 21 , hydroxyl group, nitro group, CN, halogen atom, or COOR 21 It may be replaced with . R 21 , R 22 and R 23 This expresses the same meaning as above. R 21 , R 22 or R 23 The hydrogen atoms of the group represented by may be substituted with CN, halogen atoms, hydroxyl groups, or carboxyl groups. R 21 , R 22 and R 23 When the group represented by has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- may be interrupted 1 to 5 times. R 24 This expresses the same meaning as above. R 21 , R 22 and R 23 When the group represented by has an alkyl moiety, the alkyl moiety may be branched, cyclic, or R 22 and R 23 They may be together forming a ring. R 82 , R 83 , R 84 , R 85 and R 86 Each of them is independent of R 61 , OR 61 , SR 61 COR 62 CONR 63 R 64 , NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 , CSOR 61 This represents a hydroxyl group, a nitro group, CN, or a halogen atom. R 61 , R62 , R 63 , R 64 and R 65 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 , R 62 , R 63 , R 64 or R 65 The hydrogen atom of the group represented by OR 21 COR 21 , SR 21 , NR 22 Ra 23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 , CN, halogen atom, or COOR 21 It may be replaced with . R 83 and R 84 , R 84 and R 85 and R 85 and R 86 They may also come together to form a ring. * indicates the bonding site with the first molecular structure of oxime compound (1).

[0189] R in equation (5) 81 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms represented by R in formula (1) are shown in formula (1). 11 , R12 , R 13 , R 21 , R 22 , R 23 and R 24 This is similar to the example regarding [the other topic].

[0190] R in equation (5) 22 and R 23 The statement that they may be together forming a ring means that R 22 and R 23 This means that together with the nitrogen, carbon, or oxygen atoms they connect to form a ring. R in equation (5) 22 and R 23 An example of a ring that can be formed by these together is Ra in equation (1). 12 and Ra 13 and Ra 22 and Ra 23 This is similar to the example of a ring that can be formed by these elements together.

[0191] R in equation (5) 82 , R 83 , R 84 , R 85 and R 86 A halogen atom represented by R 81 , R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of halogen atoms that may substitute for a hydrogen atom include fluorine, chlorine, bromine, and iodine.

[0192] The method for producing the oxime compound (1) having the second molecular structure represented by formula (5) is not particularly limited, but it can be produced, for example, by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0193] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (6) below. In formula (6), the bond represented by "*" is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (6), the benzene ring with "-*" in formula (6) and the carbonyl group with "-*" in formula (1) are directly bonded.

[0194] [ka]

[0195] In equation (6), four R 91 , R 92 , R 93 , R 94 , R 95 , R 96 and R 97 Each of them is independent of R 61 , OR 61 , SR 61 COR 62 CONR 63 R 64 , NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 , CSOR 61 This represents a hydroxyl group, a nitro group, CN, or a halogen atom. R 61 , R 62 , R 63 , R 64 and R 65 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 , R 62 , R 63 , R 64 or R 65 The hydrogen atom of the group represented by OR 21 COR 21 , SR 21 , NR 22 Ra23 CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 , CN, halogen atom, or COOR 21 It may be replaced with . R 21 , R 22 and R 23 This expresses the same meaning as above. R 92 and R 93 , R 94 and R 95 , R 95 and R 96 and R 96 and R 97 They may also come together to form a ring. * indicates the bonding site with the first molecular structure of oxime compound (1).

[0196] R in equation (6) 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms represented by R in formula (1) are shown in formula (1). 11 , R 12 , R 13 , R 21 , R 22 and R 23 This is similar to the example regarding [the other topic].

[0197] R in equation (6) 22 and R 23 The statement that they may be together forming a ring means that R 22 and R 23This means that together with the nitrogen, carbon, or oxygen atoms they connect to form a ring. R in equation (6) 22 and R 23 An example of a ring that can be formed by these together is Ra in equation (1). 12 and Ra 13 and Ra 22 and Ra 23 This is similar to the example of a ring that can be formed by these elements together.

[0198] R in equation (6) 91 , R 92 , R 93 , R 94 , R 95 , R 96 and R 97 A halogen atom represented by R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 and R 65 Examples of halogen atoms that may substitute for a hydrogen atom include fluorine, chlorine, bromine, and iodine.

[0199] The method for producing the oxime compound (1) having the second molecular structure represented by formula (6) is not particularly limited, but it can be produced, for example, by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0200] The photopolymerization initiator (E) preferably comprises an oxime compound (1). However, the photopolymerization initiator (E) may further comprise other photopolymerization initiators other than the oxime compound (1), or it may not comprise the oxime compound (1) at all, and may comprise only other photopolymerization initiators other than the oxime compound (1). Other photopolymerization initiators include oxime compounds other than oxime compound (1), biimidazole compounds, triazine compounds, and acylphosphine compounds.

[0201] Other oxime compounds besides oxime compound (1) include oxime compounds having the substructure represented by the following formula (d1). * represents a bond.

[0202] [ka]

[0203] Examples of oxime compounds having a substructure represented by formula (d1) include N-benzoyloxy-1-(4-phenylsulfanylphenyl)butan-1-one-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)octan-1-one-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropane-1-one-2-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethane-1-imine, and N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl Examples include compounds described in Japanese Patent Publication No. 2011-132215, International Publication Nos. 2008 / 78678, 2008 / 78686, and 2012 / 132558. Commercial products such as Irgacure OXE01, OXE02 (both from BASF), and N-1919 (from ADEKA) may also be used.

[0204] In particular, the oxime compound having the substructure represented by formula (d1) is preferably at least one selected from the group consisting of N-benzoyloxy-1-(4-phenylsulfanylphenyl)butan-1-one-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)octan-1-one-2-imine, and N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropane-1-one-2-imine, with N-benzoyloxy-1-(4-phenylsulfanylphenyl)octan-1-one-2-imine being more preferred.

[0205] Examples of biimidazole compounds include the compound represented by formula (d5).

[0206] [ka] [In formula (d5), R E ~R J This represents an aryl group having 6 to 10 carbon atoms, which may have substituents.

[0207] Examples of aryl groups having 6 to 10 carbon atoms include phenyl, toluyl, xylyl, ethylphenyl, and naphthyl groups, with phenyl being preferred. Examples of substituents include halogen atoms and alkoxy groups having 1 to 4 carbon atoms. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms, with chlorine atoms being preferred. Examples of alkoxy groups having 1 to 4 carbon atoms include methoxy groups, ethoxy groups, propoxy groups, and butoxy groups, with methoxy groups being preferred.

[0208] Examples of biimidazole compounds include 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (see, for example, Japanese Patent Publication No. 06-75372, Japanese Patent Publication No. 06-75373, etc.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyph Examples include phenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(dialkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole (see, for example, Japanese Patent Publication No. 48-38403, Japanese Patent Application Publication No. 62-174204, etc.), and imidazole compounds in which the phenyl group at the 4,4',5,5'-position is substituted with a carboalkoxy group (see, for example, Japanese Patent Application Publication No. 7-10913, etc.). Among these, compounds represented by the following formula or mixtures thereof are preferred.

[0209] [ka]

[0210] Examples of triazine compounds include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, and 2,4-bis(trichloromethyl)-6-[ Examples include 2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-dielamino-2-methylphenyl)ethenyl]-1,3,5-triazine, and 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5-triazine. Among these, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine is preferred.

[0211] Examples of acylphosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide.

[0212] Other photopolymerization initiators besides oxime compound (1) may be used individually or in combination of two or more photopolymerization initiators. When using two or more photopolymerization initiators in combination, they may be combined with other photopolymerization initiators other than oxime compound (1) mentioned above, biimidazole compounds, triazine compounds, and acylphosphine compounds.

[0213] Other photopolymerization initiators include, for example, benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as benzophenone, o-benzoyl methyl benzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, and 4,4'-bis(diethylamino)benzophenone; quinone compounds such as 9,10-phenanthrenequinone, 2-ethylanthraquinone, and camphorquinone; and 10-butyl-2-chloroacridone, benzyl, methyl phenylglyoxylate, and titanocene compounds.

[0214] When the resin composition contains a photopolymerization initiator (E), the content of the photopolymerization initiator (E) in the resin composition is preferably 0.1 parts by mass or more and 300 parts by mass or less, and more preferably 0.1 parts by mass or more and 200 parts by mass or less, per 100 parts by mass of the photopolymerizable compound (D). Furthermore, the content of the photopolymerization initiator (E) in the resin composition is preferably 0.1 parts by mass or more and 30 parts by mass or less, and more preferably 1 part by mass or more and 20 parts by mass or less, per 100 parts by mass of the total amount of resin (C) and photopolymerizable compound (D). When the content of the photopolymerization initiator (E) is within the above range, the resin composition tends to become more sensitive and the exposure time tends to be shortened, and thus the productivity of the cured layer of the resin composition tends to improve.

[0215] From the viewpoint of increasing the light emission intensity of the resin layer (wavelength conversion film, etc.), the content of the oxime compound (1) in the photopolymerization initiator (E) is preferably 30% to 100% by mass, more preferably 50% to 100% by mass, even more preferably 80% to 100% by mass, even more preferably 90% to 100% by mass, particularly preferably 95% to 100% by mass, and most preferably 100% by mass, based on the total amount of the photopolymerization initiator (E).

[0216] [2-7] Photopolymerization initiator (E1) The resin composition may further contain one or more photopolymerization initiators (E1) along with a photopolymerization initiator (E). The photopolymerization initiator (E1) is a compound or sensitizer used to promote the polymerization of a photopolymerizable compound (D) initiated by the photopolymerization initiator (E). Examples of photopolymerization initiators (E1) include amine compounds, alkoxyanthracene compounds, thioxanthone compounds, and carboxylic acid compounds.

[0217] Examples of amine compounds include triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N,N-dimethylparatoluidine, 4,4'-bis(dimethylamino)benzophenone (commonly known as Michla's ketone), 4,4'-bis(diethylamino)benzophenone, and 4,4'-bis(ethylmethylamino)benzophenone, with 4,4'-bis(diethylamino)benzophenone being preferred. Commercially available products such as EAB-F (manufactured by Hodogaya Chemical Co., Ltd.) may also be used.

[0218] Examples of alkoxyanthracene compounds include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, and 2-ethyl-9,10-dibutoxyanthracene.

[0219] Examples of thioxanthone compounds include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, and 1-chloro-4-propoxythioxanthone.

[0220] Examples of carboxylic acid compounds include phenylsulfanylacetic acid, methylphenylsulfanylacetic acid, ethylphenylsulfanylacetic acid, methylethylphenylsulfanylacetic acid, dimethylphenylsulfanylacetic acid, methoxyphenylsulfanylacetic acid, dimethoxyphenylsulfanylacetic acid, chlorophenylsulfanylacetic acid, dichlorophenylsulfanylacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, and naphthoxyacetic acid.

[0221] When the resin composition contains a photopolymerization initiator (E1), the content of the photopolymerization initiator (E1) in the resin composition is preferably 0.1 parts by mass or more and 300 parts by mass or less, and more preferably 0.1 parts by mass or more and 200 parts by mass or less, per 100 parts by mass of the photopolymerizable compound (D). Furthermore, the content of the photopolymerization initiator (E1) in the resin composition is preferably 0.1 parts by mass or more and 30 parts by mass or less, and more preferably 1 part by mass or more and 20 parts by mass or less, per 100 parts by mass of the total amount of resin (C) and photopolymerizable compound (D). When the content of the photopolymerization initiator (E1) is within the above range, the sensitivity of the resin composition can be further increased.

[0222] [2-8] Solvent (F) The resin composition may contain one or more solvents (F). The solvent (F) is not particularly limited as long as it dissolves the resin (C), and solvents commonly used in the art may be used. Examples include ester solvents (solvents containing -COO- but not -O- in the molecule), ether solvents (solvents containing -O- but not -COO- in the molecule), ether ester solvents (solvents containing both -COO- and -O- in the molecule), ketone solvents (solvents containing both -CO- and -COO- in the molecule), alcohol solvents (solvents containing OH in the molecule but not -O-, -CO-, and COO- in the molecule), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxides, and the like. If the resin composition further contains a photopolymerizable compound (D) and a photopolymerization initiator (E), the solvent (F) is preferably one that dissolves the photopolymerizable compound (D) and the photopolymerization initiator (E).

[0223] Examples of ester solvents include methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutanoate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, isopropyl butyrate, ethyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate (cyclohexyl acetate, cyclohexyl acetate), and γ-butyrolactone.

[0224] Examples of ether solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenethole, and methylanisole.

[0225] Examples of ether ester solvents include methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, 2-ethoxypropionate Examples include ethyl xy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, and diethylene glycol monobutyl ether acetate.

[0226] Examples of ketone solvents include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, and isophorone.

[0227] Examples of alcoholic solvents include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerin.

[0228] Examples of aromatic hydrocarbon solvents include benzene, toluene, xylene, and mesitylene.

[0229] Examples of amide solvents include N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0230] The solvent (F) is preferably propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone, cyclohexanol acetate, toluene, or a mixture of two or more of these, and more preferably contains propylene glycol monomethyl ether acetate.

[0231] When solvent (F) contains propylene glycol monomethyl ether acetate, the content of propylene glycol monomethyl ether acetate in solvent (F) is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, and may be 60% by mass or more, 70% by mass or more, 80% by mass or more, or 90% by mass or more.

[0232] Solvent (F) is a component of the resin composition other than the solids, and includes, for example, solvents contained in light scattering agents (A), quantum dots (B), resins (C), etc. The solvent (F) content in the resin composition is the ratio of the total mass of all solvents contained in the composition to the total amount of the composition, and is, for example, 40% by mass or more and 95% by mass or less, preferably 55% by mass or more and 90% by mass or less, relative to the total amount of the resin composition. In other words, the solid content of the resin composition is preferably 5% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 45% by mass or less. When the solvent (F) content is within the above range, the flatness of the resin layer is better and it tends to be easier to form a resin layer with an appropriate film thickness.

[0233] [2-9] Antioxidant (G) The resin composition may further contain one or more antioxidants (G). The antioxidant (G) is not particularly limited as long as it is an antioxidant commonly used in industry, and can be phenolic antioxidants, phosphorus-based antioxidants, phosphorus / phenol complex antioxidants, sulfur-based antioxidants, etc.

[0234] A phosphorus / phenol complex antioxidant can be a compound having one or more phosphorus atoms and one or more phenol structures in its molecule. In particular, from the viewpoint of the developability of the resin layer (wavelength conversion film, etc.) and the intensity of emitted light, it is preferable that the antioxidant (G) includes a phosphorus / phenol complex antioxidant.

[0235] Examples of phenolic antioxidants include Irganox® 1010 (Irganox 1010: pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF Ltd.), Irganox 1076 (Irganox 1076: octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF Ltd.), Irganox 1330 (Irganox 1330: 3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(mesitylene-2,4,6-triyl)tri-p-cresol, manufactured by BASF Ltd.), and Irganox 3114 (Irganox 3114: 1,3,5-Tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Ltd.), 3790 (Irganox 3790: 1,3,5-Tris((4-tert-butyl-3-hydroxy-2,6-xylyl)methyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Ltd.), 1035 (Irganox 1035: Thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF Ltd.), 1135 (Irganox 1135: 3,5-bis(1,1-dimethylethyl)-4-hydroxy-C7-C9 side-chain alkyl ester of benzenepropanoic acid, manufactured by BASF Ltd.), 1520L (Irganox 1520L: 4,6-bis(octylthiomethyl)-o-cresol, manufactured by BASF Ltd.), 3125 (Irganox 3125, manufactured by BASF Ltd.), 565 (Irganox 565: 2,4-bis(n-octylthio)-6-(4-hydroxy-3',5'-di-tert-butylanilino)-1,3,5-triazine, manufactured by BASF Ltd.), Adekastab (registered trademark) AO-80 (Adekastab) AO-80:3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5) Examples include undecane (manufactured by ADEKA Corporation), Sumirizer® BHT, GA-80, and GS (all manufactured by Sumitomo Chemical Co., Ltd.), Cyanox® 1790 (manufactured by Cytech Co., Ltd.), and vitamin E (manufactured by Eisai Co., Ltd.).

[0236] Examples of phosphorus-based antioxidants include Irgafos® 168 (Irgafos 168: tris(2,4-di-tert-butylphenyl) phosphite, manufactured by BASF Ltd.), Irgafos® 12 (Irgafos® 12: tris[2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphin-6-yl]oxy]ethyl]amine, manufactured by BASF Ltd.), Irgafos® 38 (Irgafos® 38: bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl) ethyl ester phosphorous acid, manufactured by BASF Ltd.), Adekastab® 329K, Adekastab® PEP36, Adekastab® PEP-8 (all manufactured by ADEKA Corporation), and Sandstab. Examples include P-EPQ (manufactured by Clariant), Weston® 618, Weston® 619G (both manufactured by GE), and Ultranox 626 (manufactured by GE).

[0237] Examples of phosphorus / phenol complex antioxidants include Sumirizer® GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenz[d,f][1.3.2]dioxaphosfepine) (manufactured by Sumitomo Chemical Co., Ltd.).

[0238] Examples of sulfur-based antioxidants include dialkylthiodipropionate compounds such as dilauryl thiodipropionate, dimyristil, or distearyl, and β-alkylmercaptopropionate ester compounds of polyols such as tetrakis[methylene(3-dodecylthio)propionate]methane.

[0239] When the resin composition contains an antioxidant (G), the content of the antioxidant (G) in the resin composition is, for example, 1 part by mass or more and 50 parts by mass or less per 100 parts by mass of resin (C), preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 7 parts by mass or more and 30 parts by mass or less, and even more preferably 11 parts by mass or more and 25 parts by mass or less, from the viewpoint of heat resistance of the resin layer, etc.

[0240] [2-10] Leveling agent (H) The resin composition may further contain one or more leveling agents (H). The contact angle of the resin layer with respect to the solvent can be adjusted by controlling the type of leveling agent (H), the amount added, and the dispersion state in the resin layer. Examples of leveling agents (H) include silicone-based surfactants, fluorine-based surfactants, and silicone-based surfactants containing fluorine atoms. These may have polymerizable groups in their side chains. From the viewpoint of the developability of the resin layer (wavelength conversion film, etc.) and the intensity of emitted light, the leveling agent (H) is preferably a fluorine-based surfactant.

[0241] Examples of silicone-based surfactants include surfactants that have siloxane bonds in their molecules. Specifically, examples include Toray Silicone DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400 (product name: manufactured by Toray Dow Corning Co., Ltd.), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452, and TSF4460 (manufactured by Momentive Performance Materials Japan LLC).

[0242] Examples of fluorine-based surfactants include surfactants having fluorocarbon chains in their molecules. Specifically, these include Florard® FC430 and FC431 (manufactured by Sumitomo 3M Co., Ltd.), Megafac® F142D, F171, F172, F173, F177, F183, F554, F575, R30, and RS-718-K (manufactured by DIC Corporation), F-Top® EF301, EF303, EF351, and EF352 (manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), Surflon® S381, S382, SC101, and SC105 (manufactured by Asahi Glass Co., Ltd.), and E5844 (manufactured by Daikin Fine Chemical Laboratories, Inc.).

[0243] Examples of silicone-based surfactants containing fluorine atoms include surfactants having siloxane bonds and fluorocarbon chains in their molecules. Specifically, examples include Megafac® R08, BL20, F475, F477, and F443 (manufactured by DIC Corporation).

[0244] When the resin composition contains a leveling agent (H), the content of the leveling agent (H) in the resin composition is, for example, 0.001% by mass or more and 1.0% by mass or less, preferably 0.005% by mass or more and 0.75% by mass or less, more preferably 0.01% by mass or more and 0.5% by mass or less, and even more preferably 0.05% by mass or more and 0.5% by mass or less, relative to the total amount of the resin composition. When the content of the leveling agent (H) is within the above range, the flatness of the resin layer can be improved.

[0245] The resin composition may further contain additives known in the art, such as polymerization inhibitors, fillers, other polymer compounds, adhesion promoters, light stabilizers, and chain transfer agents, as needed.

[0246] [3] Method for producing resin composition The resin composition can be produced by a method comprising the steps of mixing a light scattering agent (A) and a resin (C), and other components used as needed. The method for producing the resin composition may further include the step of preparing the resin (C).

[0247] [4] Method for manufacturing the resin layer The resin layer can be formed from a resin composition. For example, the resin layer can be formed by a method comprising the steps of applying the resin composition to a substrate layer and, if necessary, a drying step. The resin composition is preferably a curable resin composition further comprising a light scattering agent (A) and a resin (C), as well as a photopolymerizable compound (D) and a photopolymerization initiator (E). The resin layer is preferably a cured product layer formed from a curable resin composition. The resin layer, which is the cured product layer, can be formed by a method that includes the steps of applying the curable resin composition to a substrate layer, a drying step which is performed as needed, and curing by the action of light and, if necessary, further by the action of heat.

[0248] The cured layer may be formed over the entire surface of the substrate layer, or it may be formed as a cured pattern on a part of the substrate layer. Methods for forming a cured layer on a portion of a substrate layer include photolithography, inkjet printing, and other printing methods. Among these, photolithography is preferred. Photolithography is a method in which a curable resin composition is applied to a substrate layer, dried to form a composition layer, and then exposed to light through a photomask to develop the composition layer. One method for forming a cured layer over the entire surface of a substrate layer is to apply a curable resin composition to the substrate layer, dry it to form a composition layer, and then heat and / or expose the entire composition layer to light.

[0249] The formation of cured patterns by photolithography can be carried out using known or conventional equipment and conditions. For example, it can be done as follows: First, a curable resin composition is applied to a substrate, and volatile components such as solvents are removed by heat drying (pre-baking) and / or vacuum drying to obtain a composition layer. Application methods include spin coating, slit coating, and slit-and-spin coating.

[0250] When performing heat drying, the temperature is preferably between 30°C and 120°C, and more preferably between 50°C and 110°C. The heating time is preferably between 10 seconds and 60 minutes, and more preferably between 30 seconds and 30 minutes. When performing vacuum drying, it is preferable to do so under a pressure of 50 Pa to 150 Pa and at a temperature range of 20°C to 25°C.

[0251] The thickness of the composition layer is not particularly limited and can be appropriately selected according to the desired thickness of the cured pattern. For example, it is 1 μm or more and 20 μm or less, preferably 3 μm or more and 18 μm or less, more preferably 5 μm or more and 14 μm or less, and even more preferably 7 μm or more and 12 μm or less.

[0252] Next, the composition layer is exposed through a photomask to form the desired cured pattern. The shape of the pattern on the photomask is not particularly limited. As the light source used for exposure, a light source that generates light with a wavelength of 250 nm to 450 nm is preferred. For example, from this wavelength of light, light around 436 nm, 408 nm, or 365 nm may be selectively extracted using a bandpass filter, depending on the absorption wavelength of the photopolymerization initiator (E). Specific examples of light sources include mercury lamps, light-emitting diodes, metal halide lamps, halogen lamps, etc.

[0253] It is preferable to use an exposure apparatus such as a mask aligner and a stepper, as this allows for uniform irradiation of the entire exposure surface with parallel light rays and enables precise alignment between the photomask and the substrate on which the composition layer is formed. The exposed composition layer hardens as a result of polymerization of the photopolymerizable compound (D) contained in the composition layer.

[0254] By developing the exposed composition layer in contact with a developer, the unexposed parts of the composition layer are dissolved and removed by the developer, thereby obtaining a cured pattern. Examples of developers include aqueous solutions of alkaline compounds such as potassium hydroxide, sodium bicarbonate, sodium carbonate, and tetramethylammonium hydroxide, or organic solvents. The concentration of the alkaline compound in the aqueous solution is preferably 0.01% by mass or more and 10% by mass or less, and more preferably 0.03% by mass or more and 5% by mass or less. Examples of organic solvents include those similar to solvent (F) described above. The developer may also contain a surfactant. The development method can be any of the following: paddle method, dipping method, or spray method. Furthermore, the substrate may be tilted to any angle during development.

[0255] It is preferable to further heat (post-bake) the cured pattern obtained by development. The heating temperature is preferably 150°C to 250°C, and more preferably 160°C to 235°C. The heating time is preferably 1 minute to 120 minutes, and more preferably 10 minutes to 60 minutes. By heating after development, polymerization of unreacted photopolymerizable compounds (D) and the like contained in the cured pattern can be promoted, thereby obtaining a cured pattern with superior chemical resistance.

[0256] [5] Base material layer Examples of substrate layers include glass substrates, film substrates, and silicon wafer substrates. Examples of resins that make up the film substrate include polyolefin resins such as chain polyolefin resins (polyethylene resins, polypropylene resins, etc.) and cyclic polyolefin resins (norbornene resins, etc.); cellulose resins such as triacetylcellulose and diacetylcellulose; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyvinyl alcohol resins; polycarbonate resins; (meth)acrylic resins such as methyl methacrylate resins; polystyrene resins; polyvinyl chloride resins; acrylonitrile-butadiene-styrene resins; acrylonitrile-styrene resins; polyvinyl acetate resins; polyvinylidene chloride resins; polyamide resins; polyacetal resins; modified polyphenylene ether resins; polysulfone resins; polyethersulfone resins; polyetherketone resins; polyphenylene sulfide resins; polyphenylene oxide resins; polyarylate resins; polyamide-imide resins; and polyimide resins, among other thermoplastic resins.

[0257] Furthermore, the substrate layer may be a laminated substrate or a laminated film, and may also be a glass substrate or film substrate having a functional layer such as a hard coat layer or a primer layer.

[0258] The substrate layer may be pre-treated to adjust the contact angle of the substrate layer surface. Examples of pre-treatment include solvent cleaning with alcohol or acetone, acid treatment, alkali treatment, plasma treatment, and corona treatment. By selecting an appropriate pre-treatment for the substrate layer on which the resin layer is to be laminated, it is possible to prevent the occurrence of defects in the resin layer and improve the adhesion of the resin layer to the substrate layer compared to an untreated substrate layer.

[0259] The thickness of the substrate layer is typically 5 μm to 300 μm, preferably 20 μm to 200 μm.

[0260] <Display device> As described above, the resin layer 20 containing quantum dots (B) has the function of converting the wavelength of irradiated light, and therefore can be used as a color conversion layer (wavelength conversion film) for a display device. Examples of such display devices include those described in Japanese Patent Publication No. 2006-309219, Japanese Patent Publication No. 2006-310303, Japanese Patent Publication No. 2013-15812, Japanese Patent Publication No. 2009-251129, Japanese Patent Publication No. 2014-2363, etc. Specifically, examples of display devices include liquid crystal displays, organic EL displays, or inorganic EL displays. [Examples]

[0261] The present invention will be described in more detail below with reference to examples. In the examples, "%" and "parts" refer to mass%, and parts, respectively, unless otherwise specified.

[0262] [Measurement of the contact angle θs (25°C) of the substrate layer with respect to diiodomethane] Under conditions of 25°C, 1.0 μL of diiodomethane was dropped onto the surface of the substrate layer where the resin layer is located, and the contact angle of the substrate layer with respect to the diiodomethane was measured using the θ / 2 method with a contact angle measuring device (Kyowa Interface Science Co., Ltd., DM700).

[0263] [Measurement of the contact angle θr (25°C) of the resin layer with respect to diiodomethane] Under conditions of 25°C, 1.0 μL of diiodomethane was dropped onto the outer surface of the resin layer (the surface opposite to the substrate layer) of the obtained laminate, and the contact angle of the resin layer with respect to the diiodomethane was measured using the θ / 2 method with a contact angle measuring device (Kyowa Interface Science Co., Ltd., DM700).

[0264] [Evaluation of defects in the resin layer on the substrate layer] A laminate was placed on a black board with the substrate layer side in contact with the black board. Fluorescent light was shone onto the laminate from above, and an image (photograph) was obtained from the resin layer side of the laminate. In this case, defective areas of the resin layer appeared black because either the resin layer was absent on the substrate layer or the resin layer was extremely thin relative to it. On the other hand, good areas without defects exhibited a color distinctly different from black. The area percentage of areas exhibiting colors other than black was calculated using image processing software (ImageJ) when the sum of areas exhibiting black and areas exhibiting colors other than black was set to 100%, and the defect-free areas of the resin layer were evaluated according to the evaluation criteria below. A: The above area ratio is 80% or more B: The above area ratio is 50% or more but less than 80% C: The above area ratio is less than 50%

[0265] [Weight-average molecular weight of resin (converted to standard polystyrene)] The weight-average molecular weight (Mw) of the resin was measured using the GPC method under the following conditions. Device; K2479 (manufactured by Shimadzu Corporation) Column; SHIMADZU Shim-pack GPC-80M Column temperature: 40°C Solvent; tetrahydrofuran Flow rate; 1.0mL / min Detector; RI Calibration standard materials: TSK STANDARD POLYSTYRENE F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation)

[0266] [Acid value of resins] 3 g of the resin solution was accurately weighed and dissolved in a mixed solvent of 90 g of acetone and 10 g of water. The acid value of the resin solution was measured using an automatic titrator (Hiranuma Sangyo Co., Ltd., product name: COM-555) with a 0.1 N KOH aqueous solution as the titrant. The acid value per gram of solids (AV) was then determined from the acid value of the solution and the solids content of the solution.

[0267] [Solid content of resin solution] Approximately 1 g of the resin solution was weighed into an aluminum cup, dried at 180°C for 1 hour, and then its mass was measured. The solid content (mass %) of the resin solution was calculated from the amount of mass loss.

[0268] (Manufacturing Example 1: Preparation of Resin (C-1) Solution) In a flask equipped with a stirrer, a reflux condenser with a thermometer, a dropping funnel, and a nitrogen inlet tube, 110 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA") were added, and the mixture was stirred while purging with nitrogen, and the temperature was raised to 80°C. A solution prepared by dissolving 25 parts dicyclopentanyl methacrylate, 26 parts methyl methacrylate, 16 parts methacrylic acid, and 11 parts 2,2'-azobis(2,4-dimethylvaleronitrile) in 110 parts of PGMEA was added dropwise to the flask from the dropping funnel, and the mixture was stirred at 80°C for 3 hours. Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and 0.8 parts of triphenylphosphine were added to the flask and heated to 110°C, stirring for 8 hours to react the carboxylic acid with the epoxy groups in the polymer and introduce polymerizable unsaturated bonds. Then, 17 parts of 1,2,3,6-tetrahydrophthalic anhydride were added and the reaction was continued for 3 hours to introduce carboxylic acid groups into the side chains. The reaction mixture was cooled to room temperature to obtain resin (C-1) solution. Resin (C-1) had a weight-average molecular weight of 7600 on a standard polystyrene basis, a molecular weight distribution of 2.1, and an acid value of 100 mgKOH / g. The solid content in the resin (C-1) solution was 40% by mass.

[0269] (Manufacturing Example 2: Preparation of Resin (C-2) Solution) A resin (C-2) solution was obtained in the same manner as in Production Example 1, except that the amount of 2,2'-azobis(2,4-dimethylvaleronitrile) used was 14 parts. Resin (C-2) had a weight-average molecular weight of 5200 on a standard polystyrene basis, a molecular weight distribution of 2.2, and an acid value of 100 mgKOH / g. The solid content in the resin (C-2) solution was 40% by mass.

[0270] (Manufacturing Example 3: Preparation of a dispersion of light scattering agent (A-1)) To 70 parts of titanium dioxide nanoparticles, 3 parts of DISPERBYK21116 (manufactured by BIC Chemie Japan) and PGMEA were added to a total volume of 100 parts. The mixture was then stirred in a paint shaker until thoroughly dispersed to obtain a dispersion of the light scattering agent (A-1) (solid content 73%).

[0271] (Manufacturing Example 4: Preparation of a dispersion of quantum dots (B-1)) A toluene dispersion of InP / ZnSeS quantum dots coordinated with oleic acid as a ligand was prepared. The dispersion was subjected to vacuum distillation to remove toluene. 70 parts of cyclohexyl acetate were added to 30 parts of solids to obtain a dispersion of quantum dots (B-1) (30% solids).

[0272] (Production Example 5: Preparation of quantum dot dispersion containing organic ligand (X-1) and organic ligand (X-2)) A predetermined amount of organic ligand (X-1) was added to the dispersion of quantum dots (B-1) obtained in Production Example 4, and the mixture was stirred at 80°C for 2 hours to obtain a quantum dot dispersion containing organic ligand (X-1) and organic ligand (X-2). The organic ligand (X-2) refers to the oleic acid present in the InP / ZnSeS quantum dot to which the oleic acid used in the above production example 4 is coordinated.

[0273] (Manufacturing Examples 6-11: Preparation of Resin Compositions 6-11) For production examples 6, 7, 8, 10, and 11, a curable resin composition was prepared by mixing predetermined amounts of the resin (C-1) solution or resin (C-2) solution obtained in production examples 1 and 2, a dispersion of the light scattering agent (A-1) obtained in production example 3, and other components shown in Table 1. For Production Example 9, a curable resin composition was prepared by mixing predetermined amounts of the resin (C-1) solution obtained in Production Example 1, the light scattering agent (A-1) dispersion obtained in Production Example 3, the quantum dot dispersion obtained in Production Example 5, and other components shown in Table 1.

[0274] The content of each component in the resin composition, determined from the amount added, is shown in Table 1. In Table 1, the content of components other than solvent (F) is expressed in terms of solid content (unit: parts by mass). The unit of content of solvent (F) is parts by mass. For example, quantum dots (B-1) are blended as a dispersion of quantum dots (B-1) in the preparation of the resin composition, but the content shown in Table 1 is the amount of quantum dots (B-1) themselves contained in the solution. Solvent (F) in Table 1 includes solvents contained in the dispersion or solution used in the preparation of the resin composition.

[0275] The content of organic ligand (X-2) in the resin composition shown in Table 1 was calculated by measuring the concentration of organic ligand (X-2) in the dispersion of quantum dots (B-1) obtained in Production Example 4 according to the method described in [a] below.

[0276] [a] Measurement of the concentration of the organic ligand (X-2) After removing the solvent by vacuum drying the dispersion of quantum dots (B-1) at 150°C, the weight change of the remaining solid was measured from 50°C to 550°C at a heating rate of 5°C / min using a thermogravimetric analyzer "TGDTA6200". The weight change from 50°C to 500°C was taken as the weight of organic ligand (X-2), and the concentration of organic ligand (X-2) in the quantum dot (B-1) dispersion was calculated.

[0277] [Table 1]

[0278] The details of the abbreviations for the components shown in Table 1 are as follows: [1] Organic ligand (X-1): 3-mercaptopropionic acid (manufactured by Tokyo Chemical Industry Co., Ltd., solids content 100%) [2] Organic ligand (X-2): Oleic acid [3] Organic ligand (X-3): Carboxylated silicone oil (Shin-Etsu Chemical Co., Ltd. "X-22-3701E") [4] Photopolymerizable compound (D-1): M-510 (polybasic modified acrylate, manufactured by Toagosei Co., Ltd., solids content 100%) [5] Photopolymerizable compound (D-2): A-9550 (dipentaerythritol polyacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., solids content 100%) [6] Photopolymerization initiator (E-1): A compound represented by the following formula. Produced by the method described in Japanese Patent Publication No. 2011-132215 (100% solids).

[0279] [ka]

[0280] [7] Solvent (F-1): PGMEA (Propylene glycol monomethyl ether acetate) [8] Solvent (F-2): Cyclohexyl acetate [9] Antioxidant (G-1): Sumilizer-GP (phosphorus / phenol complex antioxidant, manufactured by Sumitomo Chemical Co., Ltd., solids content 100%)

[10] Leveling agent (H-1): F-554 (Fluorine-based leveling agent, manufactured by DIC Corporation, solid content 100%)

[0281] <Examples 1-8, Comparative Example 1, Reference Example 1> On the substrate layers shown in Table 2, the resin compositions shown in Table 2 were applied by spin coating to a thickness of 10 μm, and then pre-baked at 100°C for 3 minutes to form a curable composition layer. The substrate layers with this curable composition layer were then exposed to an air atmosphere at 80 mJ / cm² using an exposure machine (TME-150RSK; manufactured by Topcon Corporation). 2 By irradiating with light at an exposure level (based on 365 nm), developing the material, and then post-baking at 100°C for 60 minutes, a laminate consisting of a substrate layer and a resin layer (cured material layer) was obtained.

[0282] Of the substrate layers shown in Table 2, No. 1 was a glass plate (Eagle XG; manufactured by Corning), which was wiped with Bencot (manufactured by Asahi Kasei Corporation) impregnated with acetone (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), and then dried with an air gun. Nos. 2 to 4 were (meth)acrylic resin films with an acrylic hard coat layer, cyclic polyolefin resin films with an acrylic hard coat layer, and (meth)acrylic resin films with an acrylic hard coat layer, respectively, with the resin composition applied to the hard coat layer side. Furthermore, No. 5 is a glass plate (Eagle XG; manufactured by Corning) that has been surface-activated by atmospheric pressure plasma treatment.

[0283] The measurement results of the contact angles θs and θr, the contact angle difference Δθ(|θs-θr|), and the evaluation results of defects in the resin layer on the substrate layer are shown in Table 2 (see "Defect Evaluation" in Table 2). The numbers in parentheses in "Defect Evaluation" in Table 2 are the area ratio (%) values ​​mentioned above.

[0284] [Table 2] [Explanation of Symbols]

[0285] 1 laminate, 10 base layers, 20 resin layers.

Claims

1. It includes a base layer and a resin layer disposed on at least one surface of the base layer, The resin layer contains a light scattering agent (A), When the contact angle of the substrate layer with respect to diiodomethane is θs (°) and the contact angle of the resin layer with respect to diiodomethane is θr (°), the following formula: |θs - θr| ≤ 21 A laminate that satisfies the requirements.

2. The following formula: 0.1≦|θs−θr| The laminate according to claim 1, further satisfying the condition.

3. The laminate according to claim 1 or 2, wherein the contact angle θs is 60° or less.

4. The laminate according to any one of claims 1 to 3, wherein the resin layer further comprises quantum dots (B).

5. The laminate according to any one of claims 1 to 4, wherein the resin layer is a cured product layer of a resin composition comprising a resin (C), a photopolymerizable compound (D), and a photopolymerization initiator (E).

6. The light scattering agent (A) is TiO ２ A laminate according to any one of claims 1 to 5, comprising the particles.

7. A display device comprising a laminate according to any one of claims 1 to 6.

Images