Electronic components
Capacitors between electrodes in miniaturized components improve isolation by adjusting capacitance through conductor arrangement and area, addressing capacitance and reverse current issues.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TDK CORP
- Filing Date
- 2024-11-05
- Publication Date
- 2026-05-19
AI Technical Summary
When electronic components are miniaturized, the short distance between main and sub-lines leads to capacitance formation and reverse current loops, reducing isolation.
Incorporating capacitors between electrodes and adjusting their capacitance by varying conductor arrangements and areas to improve isolation, with optional resistors and different capacitors for further adjustment.
Enhances isolation in miniaturized components by reducing loss and improving capacitance adjustment.
Smart Images
Figure 2026081501000001_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to electronic components.
Background Art
[0002] Patent Document 1 discloses an electronic component including a laminate made of a dielectric, a set of input / output terminals, detection terminals, and termination terminals provided on the lower surface of the laminate, a main line provided in the laminate, and a sub-line coupled to the main line, a first attenuator and a second attenuator disposed on the upper surface of the laminate, wherein the ends of the main line are respectively connected to one of the input / output terminals, one end of the sub-line is connected to the first attenuator and the other end is connected to the second attenuator, the first attenuator is connected to the detection terminal via a first inductor provided inside the laminate, and the second attenuator is connected to the termination terminal via a second inductor provided inside the laminate.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] When an electronic component is miniaturized, the distance between the main line and the sub-line provided in the element body (laminate) becomes short, resulting in the formation of capacitance or the generation of reverse current due to loops, thereby reducing isolation.
[0005] An object of this disclosure is to provide an electronic component capable of improving isolation.
Means for Solving the Problems
[0006] (1) An electronic component relating to one aspect of the present disclosure comprises a body having a mounting surface and a main surface facing each other, a first electrode, a second electrode, a third electrode and a fourth electrode arranged on the mounting surface, a first line electrically connecting the first electrode and the second electrode, a second line electrically connecting the third electrode and the fourth electrode and magnetically coupling with the first line, and a capacitor provided between the first electrode and the third electrode and between the second electrode and the fourth electrode.
[0007] An electronic component relating to one aspect of this disclosure includes a capacitor provided between the first electrode and the third electrode, and between the second electrode and the fourth electrode, at least one of these locations. In this way, the electronic component can achieve high isolation even when the distance between the first line (main line) and the second line (sub-line) is short, by providing a capacitor between the first electrode and the third electrode and / or between the second electrode and the fourth electrode to form capacitance. Therefore, the electronic component can improve isolation.
[0008] (2) In the electronic component described in (1) above, the capacitor may be composed of multiple conductors arranged at the same height in the direction opposite to the mounting surface and the main surface. In this configuration, the capacitance of the capacitor can be easily adjusted. This configuration is particularly effective for forming minute capacitances in the capacitor.
[0009] (3) In the electronic component described in (2) above, the plurality of conductors include at least a first conductor, a second conductor, and a third conductor, and the second conductor may be positioned between the first conductor and the third conductor when viewed from the opposite direction. In this configuration, the capacitance of the capacitor can be adjusted by adjusting the area between adjacent conductors.
[0010] (4) In any one of the electronic components described in (1) to (3) above, a first capacitor is provided between the first electrode and the third electrode, and a second capacitor is provided between the second electrode and the fourth electrode, and the capacitances of the first capacitor and the second capacitor may be different. In this way, by providing two capacitors, a first capacitor and a second capacitor, with different capacitances, the capacitance of the capacitors in the electronic component can be easily adjusted.
[0011] (5) Any one of the electronic components described in (1) to (4) above may include a ground electrode located on the mounting surface and connected to ground, and a resistor provided in the electrical path between the ground electrode and the second line.
[0012] (6) In any one of the electronic components described in (5) above, a first capacitor is provided between the first electrode and the third electrode, a second capacitor is provided between the second electrode and the fourth electrode, and the resistor may be positioned closer to the multiple conductors constituting the second capacitor than to the multiple conductors constituting the first capacitor.
[0013] (7) Any one of the electronic components described in (1) to (6) above may include a third capacitor and a fourth capacitor provided in the electrical path between the third electrode and the fourth electrode, including the second line.
[0014] (8) The electronic component in (7) above may include a first resistor electrically connected in series with the third capacitor and a second resistor electrically connected in parallel with the fourth capacitor.
[0015] (9) In the electronic component described in (7) or (8) above, the capacitor is composed of a plurality of conductors arranged at the same height in the direction opposite to the mounting surface and the main surface, and the area of the region in which the plurality of conductors are arranged may be larger than the area of the conductors that constitute the third capacitor and the fourth capacitor, respectively.
[0016] (10) In the electronic component of (2) above, the plurality of conductors may be directly connected to any one of the conductors connected in the direction facing the mounting surface and the main surface at each of the first electrode, the second electrode, the third electrode, and the fourth electrode. In this configuration, compared with the case where the plurality of conductors are connected via other conductors (such as bus bars), the loss can be reduced.
Effect of the Invention
[0017] According to the present disclosure, improvement in isolation can be achieved.
Brief Description of the Drawings
[0018] [Figure 1] FIG. 1 is a perspective view showing an electronic component according to an embodiment. [Figure 2] FIGS. 2(a), 2(b), 2(c), 2(d), 2(e), 2(f), 2(g), 2(h), and 2(i) are diagrams showing a conductor layer. [Figure 3] FIG. 3 is a diagram showing a conductor pattern provided in the second conductor layer. [Figure 4] FIG. 4 is a diagram showing a conductor pattern provided in the fifth conductor layer. [Figure 5] FIG. 5 is an equivalent circuit diagram of the electronic component shown in FIG. 1. [Figure 6] FIG. 6 is a diagram showing a conductor pattern provided in the electronic component shown in FIG. 1. [Figure 7] FIG. 7 is a graph showing the relationship between the frequency band and the coupling. [Figure 8] FIG. 8 is a graph showing the relationship between the frequency band and the directivity. [Figure 9] FIG. 9 is a diagram showing a conductor pattern provided in an electronic component according to another embodiment. [Figure 10] FIGS. 10(a), 10(b), 10(c), 10(d), 10(e), 10(f), 10(g), 10(h), and 10(i) are diagrams showing a conductor layer. [Figure 11]FIG. 11 is a diagram showing a conductor pattern included in an electronic component according to another embodiment. [Figure 12] FIGS. 12(a), 12(b), 12(c), 12(d), 12(e), 12(f), 12(g), 12(h) and 12(i) are diagrams showing conductor layers. Embodiments for Carrying Out the Invention
[0019] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.
[0020] FIG. 1 is a perspective view of an electronic component according to an embodiment. The electronic component 1 shown in FIG. 1 is, for example, a directional coupler. As shown in FIG. 1, the electronic component 1 includes a substrate 2, an insulator (body) 3, a first terminal electrode (first electrode) 4, a second terminal electrode (ground electrode) 5, a third terminal electrode (second electrode) 6, a fourth terminal electrode (third electrode) 7, a fifth terminal electrode 8, and a sixth terminal electrode (fourth electrode) 9 disposed on the insulator 3.
[0021] The substrate 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corner portions and the ridge line portions are chamfered, and a rectangular parallelepiped shape in which the corner portions and the ridge line portions are rounded. The substrate 2 has, as its outer surface, a pair of end faces 2a and 2b facing each other, a pair of main faces 2c and 2d facing each other, and a pair of side faces 2e and 2f facing each other.
[0022] The opposing direction in which the pair of end faces 2a and 2b face each other is the first direction D1. The opposing direction in which the pair of main faces 2c and 2d face each other is the second direction D2. The opposing direction in which the pair of side faces 2e and 2f face each other is the third direction D3. In the present embodiment, the first direction D1 is the longitudinal direction of the substrate 2. The second direction D2 is the height direction of the substrate 2 and is orthogonal to the first direction D1. The third direction D3 is the width direction of the substrate 2 and is orthogonal to the first direction D1 and the second direction D2.
[0023] A pair of end faces 2a and 2b extend in a second direction D2 to connect a pair of main faces 2c and 2d. The pair of end faces 2a and 2b also extend in a third direction D3. A pair of side surfaces 2e and 2f extend in a second direction D2 to connect a pair of main faces 2c and 2d. The pair of side surfaces 2e and 2f also extend in a first direction D1.
[0024] Substrate 2 is formed from a material that is chemically and thermally stable, generates little stress, and maintains surface smoothness. While not particularly limited, this material can include silicon single crystal, alumina, sapphire, aluminum nitride, MgO single crystal, SrTiO3 single crystal, surface silicon oxide, glass, quartz, ferrite, and others.
[0025] The insulator 3 has a rectangular parallelepiped shape. The insulator 3 has a pair of opposing end faces 3a, 3b, a pair of opposing main faces 3c, 3d, and a pair of opposing side faces 3e, 3f as its outer surface. The pair of end faces 3a, 3b face each other in the first direction D1. The pair of main faces 3c, 3d face each other in the second direction D2. The pair of side faces 3e, 3f face each other in the third direction D3. In the electronic component 1, the main face 3c constitutes the mounting surface that faces electronic equipment and the like.
[0026] A pair of end faces 3a and 3b extend in a second direction D2 to connect a pair of main faces 3c and 3d. The pair of end faces 3a and 3b also extend in a third direction D3. A pair of side faces 3e and 3f extend in a second direction D2 to connect a pair of main faces 3c and 3d. The pair of side faces 3e and 3f also extend in a first direction D1. The dimension of the insulator 3 in the first direction D1 is equivalent to the dimension of the substrate 2 in the first direction D1. The dimension of the insulator 3 in the third direction D3 is equivalent to the dimension of the substrate 2 in the third direction D3.
[0027] In this embodiment, "equivalent" means not only being equal, but also including slight differences or manufacturing tolerances within a predetermined range. For example, if multiple values fall within ±5% of the average of those multiple values, then those multiple values are defined as equivalent.
[0028] The insulator 3 is constructed by laminating multiple insulating layers (not shown). The insulating layers are made of organic insulating materials such as polyimide. The insulating layers are laminated in the second direction D2. That is, the second direction D2 is the lamination direction. In the actual insulator 3, the multiple insulating layers are integrated to such an extent that the boundaries between the layers are not visible.
[0029] The substrate 2 and the insulator 3 are integrally formed. The substrate 2 and the insulator 3 are arranged so that their main surfaces 2c and 3d face each other. A planarization layer 19 is placed between the substrate 2 and the insulator 3. The planarization layer 19 is placed between the main surface 2c of the substrate 2 and the main surface 3d of the insulator 3. Alumina, silicon oxide, and the like can be used as the planarization layer 19.
[0030] The first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 are arranged on the main surface 3c of the insulator 3. In this embodiment, the first terminal electrode 4 is an input terminal. The third terminal electrode 6 is an output terminal. The first terminal electrode 4 is a coupling terminal (detection electrode). The second terminal electrode 5 and the third terminal electrode 6 are termination terminals.
[0031] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 have a roughly rectangular shape in plan view. The rectangular shape includes shapes where the corners and edges are chamfered, and shapes where the corners and edges are rounded. The first terminal electrode 4, the third terminal electrode 6, the fourth terminal electrode 7, and the sixth terminal electrode 9 have one corner that is rounded (curved).
[0032] The first terminal electrode 4 is positioned near end face 3a and near side surface 3e. The second terminal electrode 5 is positioned between end face 3a and end face 3b and near side surface 3e. The third terminal electrode 6 is positioned near end face 3b and near side surface 3e. The fourth terminal electrode 7 is positioned near end face 3a and near side surface 3f. The fifth terminal electrode 8 is positioned between end face 3a and end face 3b and near side surface 3f. The sixth terminal electrode 9 is positioned near end face 3b and near side surface 3f.
[0033] The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are spaced apart in the first direction D1. The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are spaced apart in the first direction D1. The first terminal electrode 4 and the fourth terminal electrode 7 are spaced apart in the third direction D3. The second terminal electrode 5 and the fifth terminal electrode 8 are spaced apart in the third direction D3. The third terminal electrode 6 and the sixth terminal electrode 9 are spaced apart in the third direction D3. The spacing between each terminal electrode may be appropriately selected according to the specifications required for the electronic component 1.
[0034] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 can be formed from a suitable conductor (for example, gold, nickel, copper, silver, etc.).
[0035] Figures 2(a), 2(b), 2(c), 2(d), 2(e), 2(f), 2(g), 2(h), and 2(i) show the conductive layers. Figures 2(a), 2(b), 2(c), 2(d), 2(e), 2(f), 2(g), 2(h), and 2(i) show the conductive pattern viewed from the second direction D2.
[0036] As shown in Figures 2(a), 2(b), 2(c), 2(d), 2(e), 2(f), 2(g), 2(h), and 2(i), the electronic component 1 comprises a first conductor layer 10, a second conductor layer 11, a third conductor layer 12, a fourth conductor layer 13, a fifth conductor layer 14, a sixth conductor layer 15, a seventh conductor layer 16, an eighth conductor layer 17, and a terminal layer 18. The first conductor layer 10, the second conductor layer 11, the third conductor layer 12, the fourth conductor layer 13, the fifth conductor layer 14, the sixth conductor layer 15, the seventh conductor layer 16, the eighth conductor layer 17, and the terminal layer 18 are arranged in different layers in the second direction D2.
[0037] As shown in Figure 2(a), the first conductor layer 10 has a resistance pattern 21 and a resistance pattern 22. The resistance patterns 21 and 22 can be formed from a suitable conductor (for example, nickel, chromium, aluminum, etc.).
[0038] As shown in Figure 2(b), the second conductor layer 11 has conductor patterns 23, 24, 25, 26, and 27. Conductor patterns 23, 24, 25, 26, and 27 can be formed from a suitable conductor (for example, copper).
[0039] Figure 3 shows the conductor pattern provided by the second conductor layer 11. As shown in Figures 2(b) and 3, the conductor pattern 23 has a first pattern section 23A, a second pattern section 23B, a third pattern section 23C, a fourth pattern section 23D, and a fifth pattern section 23E.
[0040] The first pattern portion 23A is positioned near the end face 3a and near the side surface 3e. The second pattern portion 23B is positioned between the conductor pattern 25 (first pattern portion 25A) and the conductor pattern 26 in the first direction D1, and near the side surface 3e. The second pattern portion 23B has a rectangular shape.
[0041] The third pattern section 23C electrically connects the first pattern section 23A and the second pattern section 23B. The third pattern section 23C has a first portion 23Ca, a second portion 23Cb, and a third portion 23Cc. The first portion 23Ca extends along the third direction D3. One end of the first portion 23Ca (the end on the side surface 3e) is connected to the first pattern section 23A. The other end of the first portion 23Ca (the end on the side surface 3f) is connected to one end of the third portion 23Cc (the end on the end face 3a).
[0042] The second portion 23Cb extends along the third direction D3. One end of the second portion 23Cb (the end on the side surface 3e) is connected to the second pattern portion 23B. The other end of the second portion 23Cb (the end on the side surface 3f) is connected to the other end of the third portion 23Cc (the end on the end face 3b). The third portion 23Cc connects the first portion 23Ca and the second portion 23Cb. The third portion 23Cc has a portion that extends along the first direction D1. The third portion 23Cc is arranged side by side (in close proximity) with the third pattern portion 24C (described later) of the conductor pattern 27 in the third direction D3.
[0043] The fourth pattern section 23D has a spiral shape. One end of the fourth pattern section 23D is connected to the third pattern section 23C (second section 23Cb). The fifth pattern section 23E extends along the third direction D3. One end of the fifth pattern section 23E (the end on the side surface 3e) is connected to the first pattern section 23A. The fifth pattern section 23E is directly connected to the first pattern section 23A. In other words, the fifth pattern section 23E is connected to the first pattern section 23A without the need for other components (such as busbar patterns).
[0044] The conductor pattern 24 has a first pattern section 24A, a second pattern section 24B, a third pattern section 24C, a fourth pattern section 24D, a fifth pattern section 24E, a sixth pattern section 24F, and a seventh pattern section 24G.
[0045] The first pattern section 24A is positioned near the end face 3a and near the side surface 3f. The second pattern section 24B is positioned near the end face 3b and near the side surface 3f. The third pattern section 24C connects the first pattern section 24A and the second pattern section 24B. The third pattern section 24C has a portion that extends along the first direction D1. This portion of the third pattern section 24C extends parallel to the third portion 23Cc of the third pattern section 23C of the conductor pattern 23.
[0046] The fourth pattern section 24D extends along the third direction D3. One end of the fourth pattern section 24D (the end on the side 3f) is connected to the first pattern section 24A. The fourth pattern section 24D is directly connected to the first pattern section 24A. That is, the fourth pattern section 24D is connected to the first pattern section 24A without the use of other members (such as busbar patterns). The fifth pattern section 24E extends along the third direction D3. One end of the fifth pattern section 24E (the end on the side 3f) is connected to the first pattern section 24A. The fifth pattern section 24E is directly connected to the first pattern section 24A. That is, the fifth pattern section 24E is connected to the first pattern section 24A without the use of other members (such as busbar patterns). The fourth pattern section 24D and the fifth pattern section 24E are spaced apart in the first direction D1. The lengths of the fourth pattern section 24D and the fifth pattern section 24E are equivalent in the third direction D3.
[0047] The fifth pattern portion 23E of the conductor pattern 23 is positioned between the fourth pattern portion 24D and the fifth pattern portion 24E of the conductor pattern 24. That is, the fifth pattern portion 23E is positioned between the fourth pattern portion 24D and the fifth pattern portion 24E. The fourth pattern portion 24D, the fifth pattern portion 23E, and the fifth pattern portion 24E are arranged in this order from the end face 3a side of the insulator 3 in the first direction D1.
[0048] A portion of the fifth pattern section 23E overlaps with portions of the fourth pattern section 24D and the fifth pattern section 24E, respectively, when viewed from the first direction D1. In this embodiment, the distance between the fifth pattern section 23E and the fourth pattern section 24D in the first direction D1 is equal to the distance between the fifth pattern section 23E and the fifth pattern section 24E in the first direction D1. In this embodiment, the widths of the fifth pattern section 23E, the fourth pattern section 24D, and the fifth pattern section 24E (widths in the first direction D1) are equal.
[0049] The sixth pattern section 24F extends along the third direction D3. One end of the sixth pattern section 24F (the end on the side 3f) is connected to the second pattern section 24B. The sixth pattern section 24F is directly connected to the second pattern section 24B. That is, the sixth pattern section 24F is connected to the second pattern section 24B without the need for other components (such as busbar patterns). The seventh pattern section 24G extends along the third direction D3. One end of the seventh pattern section 24G (the end on the side 3f) is connected to the second pattern section 24B. The seventh pattern section 24G is directly connected to the second pattern section 24B. That is, the seventh pattern section 24G is connected to the second pattern section 24B without the need for other components (such as busbar patterns). The sixth pattern section 24F and the seventh pattern section 24G are spaced apart in the first direction D1. The lengths of the sixth pattern section 24F and the seventh pattern section 24G are equivalent in the third direction D3.
[0050] The conductor pattern 25 has a first pattern section 25A, a second pattern section 25B, and a third pattern section 25C. The first pattern section 25A is positioned closer to the end face 3b and closer to the side surface 3f.
[0051] The second pattern section 25B extends along the third direction D3. One end of the second pattern section 25B (the end on the side 3e) is connected to the first pattern section 25A. The second pattern section 25B is directly connected to the first pattern section 25A. That is, the second pattern section 25B is connected to the first pattern section 25A without the need for other components (such as busbar patterns). The third pattern section 25C extends along the third direction D3. One end of the third pattern section 25C (the end on the side 3e) is connected to the first pattern section 25A. The third pattern section 25C is directly connected to the first pattern section 25A. That is, the third pattern section 25C is connected to the first pattern section 25A without the need for other components (such as busbar patterns).
[0052] The seventh pattern portion 24G of the conductor pattern 24 is positioned between the second pattern portion 25B and the third pattern portion 25C of the conductor pattern 25. That is, the seventh pattern portion 24G is positioned between the second pattern portion 25B and the third pattern portion 25C. The second pattern portion 25B of the conductor pattern 25 is positioned between the sixth pattern portion 24F and the seventh pattern portion 24G of the conductor pattern 24. That is, the second pattern portion 25B is positioned between the sixth pattern portion 24F and the seventh pattern portion 24G. The sixth pattern portion 24F, the second pattern portion 25B, the seventh pattern portion 24G, and the third pattern portion 25C are arranged in this order from the end face 3b side of the insulator 3 in the first direction D1.
[0053] Parts of the sixth pattern section 24F, the seventh pattern section 24G, the second pattern section 25B, and the third pattern section 25C overlap when viewed from the first direction D1. In this embodiment, the distance in the first direction D1 between the sixth pattern section 24F and the second pattern section 25B, the distance in the first direction D1 between the second pattern section 25B and the seventh pattern section 24G, and the distance in the first direction D1 between the seventh pattern section 24G and the third pattern section 25C are equivalent. In this embodiment, the widths (widths in the first direction D1) of the sixth pattern section 24F, the seventh pattern section 24G, the second pattern section 25B, and the third pattern section 25C are equivalent.
[0054] Conductor pattern 26 is located at the center in the first direction D1 and near the side surface 3e. Conductor pattern 27 is located at the center in the first direction D1 and near the side surface 3f. Conductor pattern 28 is located in the region formed (enclosed) by the first pattern portion 23A and the third pattern portion 23C (first portion 23Ca) of conductor pattern 23, and the first pattern portion 24A and the fifth pattern portion 24E of conductor pattern 24. Conductor pattern 28 has a rectangular shape. Conductor pattern 28 extends along the third direction D3.
[0055] As shown in Figure 2(c), the third conductor layer 12 has a capacitor pattern 29, a capacitor pattern 30, and a capacitor pattern 31. The capacitor pattern 29 is positioned opposite the conductor pattern 28 of the second conductor layer 11 in the second direction D2. The capacitor pattern 31 is positioned opposite the second pattern portion 23B of the conductor pattern 23 of the second conductor layer 11.
[0056] As shown in Figure 2(d), the fourth conductor layer 13 includes via conductor 32, via conductor 33, via conductor 34, via conductor 35, via conductor 36, via conductor 37, via conductor 38, via conductor 39, via conductor 40, via conductor 41, via conductor 42, via conductor 43, and via conductor 45.
[0057] Via conductor 32 electrically connects the first pattern portion 23A of the conductor pattern 23 of the second conductor layer 11 to the conductor pattern 46 (described later) of the fifth conductor layer 14. Via conductor 33 electrically connects the conductor pattern 26 of the second conductor layer 11 to the conductor pattern 47 (described later) of the fifth conductor layer 14. Via conductor 34 electrically connects the first pattern portion 23A of the conductor pattern 23 of the second conductor layer 11 to the conductor pattern 46 (described later) of the fifth conductor layer 14.
[0058] Via conductor 35 electrically connects the first pattern portion 24A of the conductor pattern 24 of the second conductor layer 11 to the conductor pattern 50 (described later) of the fifth conductor layer 14. Via conductor 36 electrically connects the conductor pattern 27 of the second conductor layer 11 to the conductor pattern 51 (described later) of the fifth conductor layer 14. Via conductor 37 electrically connects the second pattern portion 24B of the conductor pattern 24 of the second conductor layer 11 to the conductor pattern 52 (described later) of the fifth conductor layer 14.
[0059] Via conductor 38 electrically connects the capacitor pattern 29 of the third conductor layer 12 to the conductor pattern 49 (described later) of the fifth conductor layer 14. Via conductor 39 electrically connects the conductor pattern 28 of the second conductor layer 11 to the conductor pattern 53 (described later) of the fifth conductor layer 14. Via conductor 40 electrically connects the resistor pattern 22 of the first conductor layer 10 to the conductor pattern 47 (described later) of the fifth conductor layer 14. Via conductor 41 electrically connects the resistor pattern 22 of the second conductor layer 11 to the conductor pattern 48 (described later) of the fifth conductor layer 14.
[0060] Via conductor 42 electrically connects the second pattern portion 23B of the conductor pattern 23 of the second conductor layer 11 to the conductor pattern 48 (described later) of the fifth conductor layer 14. Via conductor 43 electrically connects the fourth pattern portion 23D of the conductor pattern 23 of the second conductor layer 11 to the conductor pattern 49 (described later) of the fifth conductor layer 14. Via conductor 44 electrically connects the resistance pattern 21 of the first conductor layer 10 to the conductor pattern 49 (described later) of the fifth conductor layer 14. Via conductor 45 electrically connects the resistance pattern 21 of the first conductor layer 10 to the conductor pattern 54 (described later) of the fifth conductor layer 14.
[0061] Figure 4 shows the conductor pattern of the fifth conductor layer 14. As shown in Figures 2(e) and 4, the fifth conductor layer 14 has conductor pattern 46, conductor pattern 47, conductor pattern 48, conductor pattern 49, conductor pattern 50, conductor pattern 51, and conductor pattern 52.
[0062] Conductor pattern 46 is positioned near the end face 3a and near the side surface 3e. Conductor pattern 47 is positioned at the center in the first direction D1 and near the side surface 3e. Conductor pattern 48 is positioned between conductor pattern 47 and conductor pattern 49 in the first direction D1. Conductor pattern 48 has a first pattern portion 48A and a second pattern portion 48B.
[0063] The conductor pattern 49 has a first pattern section 49A, a second pattern section 49B, a third pattern section 49C, and a fourth pattern section 49D. The first pattern section 49A is positioned closer to the end face 3b and closer to the side surface 3e.
[0064] The second pattern section 49B has a first section 49Ba, a second section 49Bb, and a third section 49Bc. The first section 49Ba extends along the third direction D3. One end of the first section 49Ba (the end on the side 3e) is connected to the first pattern section 49A. The other end of the first section 49Ba (the end on the side 3f) is connected to the third section 49Bc. The second section 49Bb extends along the third direction D3. One end of the second section 49Bb (the end on the side 3e) is connected to the third pattern section 49C. The other end of the second section 49Bb (the end on the side 3f) is connected to the third section 49Bc. The third section 49Bc connects the first section 49Ba and the second section 49Bb. The third section 49Bc has a portion that extends along the first direction D1. The third portion 49Bc is positioned opposite the third pattern portion 24C of the conductor pattern 24 of the second conductor layer 11 in the second direction D2.
[0065] The third pattern section 49C has a spiral shape. One end of the third pattern section 49C is connected to the second pattern section 49B (second part 49Bb). The fourth pattern section 49D is connected to the second pattern section 49B (second part 49Bb).
[0066] Conductor pattern 50 is positioned near end face 3a and near side face 3f. Conductor pattern 51 is positioned at the center in the first direction D1 and near side face 3f. Conductor pattern 52 is positioned near end face 3b and near side face 3f. Conductor pattern 53 is positioned near end face 3a. Conductor pattern 54 is positioned near end face 3b.
[0067] As shown in Figure 2(f), the sixth conductor layer 15 includes via conductor 55, via conductor 56, via conductor 57, via conductor 58, via conductor 59, via conductor 60, via conductor 61, and via conductor 62.
[0068] Via conductor 55 electrically connects the conductor pattern 46 of the fifth conductor layer 14 to the conductor pattern 63 (described later) of the seventh conductor layer 16. Via conductor 55 electrically connects the conductor pattern 47 of the fifth conductor layer 14 to the ground pattern 68 (described later) of the seventh conductor layer 16. Via conductor 57 electrically connects the conductor pattern 49 of the fifth conductor layer 14 to the conductor pattern 64 (described later) of the seventh conductor layer 16.
[0069] Via conductor 58 electrically connects the conductor pattern 50 of the fifth conductor layer 14 to the conductor pattern 65 (described later) of the seventh conductor layer 16. Via conductor 59 electrically connects the conductor pattern 51 of the fifth conductor layer 14 to the conductor pattern 66 (described later) of the seventh conductor layer 16. Via conductor 60 electrically connects the conductor pattern 52 of the fifth conductor layer 14 to the conductor pattern 67 (described later) of the seventh conductor layer 16. Via conductor 61 electrically connects the conductor pattern 53 of the fifth conductor layer 14 to the ground pattern 68 (described later) of the seventh conductor layer 16. Via conductor 62 electrically connects the conductor pattern 54 of the fifth conductor layer 14 to the ground pattern 68 (described later) of the seventh conductor layer 16.
[0070] As shown in Figure 2(g), the seventh conductor layer 16 has a conductor pattern 63, a conductor pattern 64, a conductor pattern 65, a conductor pattern 66, a conductor pattern 67, and a ground pattern 68.
[0071] Conductor pattern 63 is positioned near end face 3a and near side surface 3e. Conductor pattern 64 is positioned near end face 3b and near side surface 3e. Conductor pattern 65 is positioned near end face 3a and near side surface 3f. Conductor pattern 66 is positioned at the center in the first direction D1 and near side surface 3f. Conductor pattern 67 is positioned near end face 3b and near side surface 3f.
[0072] As shown in Figure 2(h), the eighth conductor layer 17 includes via conductor 69, via conductor 70, via conductor 71, via conductor 72, via conductor 73, and via conductor 74.
[0073] Via conductor 69 electrically connects the conductor pattern 63 of the seventh conductor layer 16 to the first terminal electrode 4 of the terminal layer 18. Via conductor 70 electrically connects the ground pattern 68 of the seventh conductor layer 16 to the second terminal electrode 5 of the terminal layer 18. Via conductor 71 electrically connects the conductor pattern 64 of the seventh conductor layer 16 to the third terminal electrode 6 of the terminal layer 18.
[0074] Via conductor 72 electrically connects the conductor pattern 65 of the seventh conductor layer 16 to the fourth terminal electrode 7 of the terminal layer 18. Via conductor 73 electrically connects the conductor pattern 66 of the seventh conductor layer 16 to the fifth terminal electrode 8 of the terminal layer 18. Via conductor 74 electrically connects the conductor pattern 67 of the seventh conductor layer 16 to the sixth terminal electrode 9 of the terminal layer 18.
[0075] As shown in Figure 2(i), the terminal layer 18 has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, and a sixth terminal electrode 9.
[0076] Figure 5 shows the equivalent circuit of electronic component 1. As shown in Figure 5, electronic component 1 comprises a first port P1, a second port P2, a third port P3, a fourth port P4, ground Gnd1, ground Gnd2, a first line S11, a second line S21, a first line S12, a second line S22, an inductor L1, a capacitor (first capacitor) C1, a capacitor (second capacitor) C2, a capacitor (third capacitor) C3, a capacitor (fourth capacitor) C4, a resistor (first resistor) R1, and a resistor (second resistor) R2.
[0077] The first port P1 is a coupling port. The first port P1 is composed of the first terminal electrode 4. The second port P2 is an input port. The second port P2 is composed of the fourth terminal electrode 7. The third port P3 is a termination port. The third port P3 is composed of the third terminal electrode 6. The fourth port P4 is an output port. The fourth port P4 is composed of the sixth terminal electrode 9. Ground Gnd1 and Ground Gnd2 are composed of the fifth terminal electrode 8.
[0078] The first line S11 and the first line S12 are composed of the third pattern portion 23C (third part 23Cc) of the conductor pattern 23. The second line S21 is composed of the third pattern portion 24C of the conductor pattern 24. The second line S22 is composed of the second pattern portion 49B (third part 49Bc) of the conductor pattern 49. The first line S11 and the second line S21 are magnetically coupled. The first line S12 and the second line S22 are magnetically coupled.
[0079] The inductor L1 is composed of the fourth pattern portion 23D of the conductor pattern 23 and the third pattern portion 49C of the conductor pattern 49.
[0080] Capacitor C1 is connected between the first port P1 and the second port P2. Capacitor C1 is composed of the fifth pattern portion 23E of the conductor pattern 23 of the second conductor layer 11, and the fourth pattern portion 24D and the fifth pattern portion 24E of the conductor pattern 24 of the second conductor layer 11. In other words, capacitor C1 is composed of multiple conductors arranged in the same layer (height position).
[0081] Capacitor C2 is connected between the third port P3 and the fourth port P4. Capacitor C2 is composed of the sixth pattern section 24F and the seventh pattern section 24G of the conductor pattern 24 of the second conductor layer 11, and the second pattern section 24B and the third pattern section 24C of the conductor pattern 25 of the second conductor layer 11. In other words, capacitor C2 is composed of multiple conductors arranged in the same layer (height position).
[0082] The capacitances of capacitor C1 and capacitor C2 are different. In this embodiment, the capacitance of capacitor C1 is smaller than the capacitance of capacitor C2. In other words, the capacitance of capacitor C2 is larger than the capacitance of capacitor C1. The capacitance of capacitor C1 is, for example, 0.06 pF. The capacitance of capacitor C2 is, for example, 0.09 pF.
[0083] As shown in Figure 3, the areas of the fifth pattern section 23E, the fourth pattern section 24D, and the fifth pattern section 24E constituting capacitor C1 are smaller than the areas of the sixth pattern section 24F, the seventh pattern section 24G, the second pattern section 24B, and the third pattern section 24C constituting capacitor C2. In other words, the areas of the sixth pattern section 24F, the seventh pattern section 24G, the second pattern section 24B, and the third pattern section 24C constituting capacitor C2 are larger than the areas of the fifth pattern section 23E, the fourth pattern section 24D, and the fifth pattern section 24E constituting capacitor C1.
[0084] Capacitor C3 is composed of a conductor pattern 28 and a capacitor pattern 29. Capacitor C4 is composed of the second pattern portion 23B of the conductor pattern 23 and a capacitor pattern 31.
[0085] Resistor R1 is formed by resistor pattern 22. Resistor R2 is formed by resistor pattern 21.
[0086] Figure 6 shows the conductor patterns of the electronic component 1 shown in Figure 1. In Figure 6, the conductor patterns are shown superimposed. As shown in Figure 6, resistors R1 (resistor pattern 21) and R2 (resistor pattern 22) are positioned closer to the sixth pattern section 24F, seventh pattern section 24G, second pattern section 24B, and third pattern section 24C that constitute capacitor C2 than to the fifth pattern section 23E, fourth pattern section 24D, and fifth pattern section 24E that constitute capacitor C1. The shortest distance between resistor patterns 21 and 22 and the sixth pattern section 24F, seventh pattern section 24G, second pattern section 24B, and third pattern section 24C is longer than the shortest distance between resistor patterns 21 and 22 and the fifth pattern section 23E, fourth pattern section 24D, and fifth pattern section 24E.
[0087] The area of region A1 where capacitor C1 is located is larger than the area of the conductor pattern 28 and capacitor pattern 29 that constitute capacitor C3, and the area of the second pattern portion 23B of the conductor pattern 23 and the capacitor pattern 31 that constitute capacitor C4. The area of region A2 where capacitor C2 is located is larger than the area of the conductor pattern 28 and capacitor pattern 29 that constitute capacitor C3, and the area of the second pattern portion 23B of the conductor pattern 23 and the capacitor pattern 31 that constitute capacitor C4.
[0088] As shown in Figure 5, capacitor C3 and resistor R1 are electrically connected in series. Capacitor C4 and resistor R2 are electrically connected in parallel. Resistor R1, capacitor C3, inductor L1, and capacitor C4 are electrically connected in series.
[0089] As described above, in the electronic component 1 according to this embodiment, a capacitor C1 is provided between the first terminal electrode 4 and the fourth terminal electrode 7, and a capacitor C2 is provided between the third terminal electrode 6 and the sixth terminal electrode 9. In this way, the electronic component 1 provides a capacitor C1 between the first terminal electrode 4 and the fourth terminal electrode 7, and a capacitor C2 between the third terminal electrode 6 and the sixth terminal electrode 9 to form capacitance, thereby enabling high isolation even when the distance between the first transmission lines S11, S12 and the second transmission lines S21, S22 is shortened. Therefore, the electronic component 1 can achieve improved isolation.
[0090] Figure 7 is a graph showing the relationship between frequency band and coupling. In Figure 7, the horizontal axis represents frequency band [MHz], and the vertical axis represents coupling [dB]. In Figure 5, the results for electronic component 1 are shown by a solid line, and the results for electronic components without capacitors C1 and C2 are shown by a dashed line. As shown in Figure 7, it was confirmed that in electronic component 1, the coupling characteristics improved as a result of improved isolation due to the provision of capacitors C1 and C2.
[0091] Figure 8 is a graph showing the relationship between frequency band and directivity. In Figure 7, the horizontal axis represents frequency band [MHz] and the vertical axis represents directivity [dB]. In Figure 5, the results for electronic component 1 are shown with a solid line, and the results for electronic components without capacitors C1 and C2 are shown with a dashed line. As shown in Figure 8, it was confirmed that in electronic component 1, the directivity characteristics improved as a result of improved isolation due to the provision of capacitors C1 and C2.
[0092] In the electronic component 1 according to this embodiment, capacitor C1 is composed of the fifth pattern portion 23E of the conductor pattern 23 of the second conductor layer 11 and the fourth pattern portion 24D and the fifth pattern portion 24E of the conductor pattern 24 of the second conductor layer 11. That is, capacitor C1 is composed of multiple conductors arranged in the same layer (height position). Capacitor C2 is composed of the sixth pattern portion 24F and the seventh pattern portion 24G of the conductor pattern 24 of the second conductor layer 11 and the second pattern portion 24B and the third pattern portion 24C of the conductor pattern 25 of the second conductor layer 11. That is, capacitor C2 is composed of multiple conductors arranged in the same layer (height position).
[0093] Thus, in electronic component 1, capacitors C1 and C2 are each composed of multiple conductors arranged in the same layer (height), allowing for easy adjustment of the capacitances of capacitors C1 and C2. This configuration is particularly effective for creating minute capacitances in capacitors C1 and C2.
[0094] (3) In the electronic component described in (2) above, the plurality of conductors include at least a first conductor, a second conductor, and a third conductor, and the second conductor may be positioned between the first conductor and the third conductor when viewed from the opposite direction. In this configuration, the capacitance of the capacitor can be adjusted by adjusting the area between adjacent conductors.
[0095] In the electronic component 1 according to this embodiment, the fifth pattern section 23E is directly connected to the first pattern section 23A. The fourth pattern section 24D is directly connected to the first pattern section 24A. The fifth pattern section 24E is directly connected to the first pattern section 24A. The sixth pattern section 24F is directly connected to the second pattern section 24B. The seventh pattern section 24G is directly connected to the second pattern section 24B. The second pattern section 25B is directly connected to the first pattern section 25A. The third pattern section 25C is directly connected to the first pattern section 25A. In this way, the patterns (conductors) that constitute capacitors C1 and C2 are directly connected to other patterns. As a result, the electronic component 1 can reduce losses compared to when the conductors are connected via other conductors. Furthermore, the electronic component 1 can be miniaturized.
[0096] While embodiments of this disclosure have been described above, this disclosure is not necessarily limited to the embodiments described above, and various modifications are possible without departing from its essence.
[0097] In the above embodiment, an example was described in which the electronic component 1 is a directional coupler. However, the electronic component is not limited to a directional coupler and may be a filter or the like.
[0098] In the above embodiment, a configuration in which the fifth pattern section 23E, the fourth pattern section 24D, the fifth pattern section 24E, the sixth pattern section 24F, the seventh pattern section 24G, and the third pattern section 25C are linear was described as an example. However, the patterns (conductors) constituting capacitor C1 and capacitor C2 are not limited to being linear, but may be curved or otherwise.
[0099] In the above embodiment, a configuration in which capacitor C1 is composed of multiple conductors arranged in the same layer (height) was described as an example. However, the conductors constituting capacitor C1 may be arranged in different layers. The same applies to capacitor C2.
[0100] In the above embodiment, an example was shown in which electronic component 1 comprises capacitor C1 and capacitor C2. However, as shown in Figures 9 and 10(a), 10(b), 10(c), 10(d), 10(e), 10(f), 10(g), 10(h), and 10(i), electronic component 1A may comprise only capacitor C1. Also, as shown in Figures 11 and 12(a), 12(b), 12(c), 12(d), 12(e), 12(f), 12(g), 12(h), and 12(i), electronic component 1B may comprise only capacitor C2. [Explanation of Symbols]
[0101] 1, 1A, 1B... Electronic components, 3... Insulator (base material), 3c, 3d... Main surface, 4... First terminal electrode (first electrode), 6... Third terminal electrode (second electrode), 7... Fourth terminal electrode (third electrode), 9... Sixth terminal electrode (fourth electrode), A1, A2... Region, C1... Capacitor (first capacitor), C2... Capacitor (second capacitor), C3... Capacitor (third capacitor), C4... Capacitor (fourth capacitor), R1... Resistor (first resistor), R2... Resistor (second resistor), S11, S12... First transmission line, S21, S22... Second transmission line.
Claims
1. A base body having an implementation surface and a main surface facing each other, The first electrode, second electrode, third electrode, and fourth electrode are arranged on the aforementioned mounting surface, A first line electrically connecting the first electrode and the second electrode, The third electrode and the fourth electrode are electrically connected, and the second line is magnetically coupled to the first line, An electronic component comprising a capacitor provided between the first electrode and the third electrode, and at least one of the two electrodes between the second electrode and the fourth electrode.
2. The electronic component according to claim 1, wherein the capacitor is composed of a plurality of conductors arranged at the same height in the direction opposite to the mounting surface and the main surface.
3. The plurality of conductors include at least a first conductor, a second conductor and a third conductor, The electronic component according to claim 2, wherein, when viewed from the opposite direction, the second conductor is arranged between the first conductor and the third conductor.
4. A first capacitor is provided between the first electrode and the third electrode. A second capacitor is provided between the second electrode and the fourth electrode. The electronic component according to claim 1 or 2, wherein the capacitance of the first capacitor and the capacitance of the second capacitor are different.
5. A ground electrode is placed on the aforementioned mounting surface and connected to the ground, The electronic component according to claim 2, further comprising a resistor provided in the electrical path between the ground electrode and the second line.
6. A first capacitor is provided between the first electrode and the third electrode. A second capacitor is provided between the second electrode and the fourth electrode. The electronic component according to claim 5, wherein the resistor is positioned closer to the plurality of conductors constituting the second capacitor than to the plurality of conductors constituting the first capacitor.
7. The electronic component according to claim 1 or 2, further comprising a third capacitor and a fourth capacitor provided in an electrical path between the third electrode and the fourth electrode, including the second line.
8. A first resistor electrically connected in series with the third capacitor, The electronic component according to claim 7, further comprising a second resistor electrically connected in parallel to the fourth capacitor.
9. The capacitor is composed of a plurality of conductors arranged at the same height in the direction opposite to the mounting surface and the main surface. The electronic component according to claim 7, wherein the area of the region where the plurality of conductors are arranged is larger than the area of the conductors constituting the third capacitor and the fourth capacitor, respectively.
10. The electronic component according to claim 2, wherein each of the plurality of conductors is directly connected to any of the conductors connected in the direction opposite to the mounting surface and the main surface at the first electrode, the second electrode, the third electrode and the fourth electrode.