Electronic component module

Abstract

In electronic component modules, this suppresses signal interference between components mounted on a circuit board. [Solution] The electronic component module includes a rigid substrate on which a plurality of electronic components are mounted, a plurality of electronic components mounted on the rigid substrate, and a bendable flexible substrate mounted on the rigid substrate, wherein the flexible substrate is mounted on the rigid substrate through the plurality of electronic components, and the flexible substrate includes wiring for transmitting signals and a first ground layer, the first ground layer being electrically connected to a reference potential of the rigid substrate.

Description

Technical Field

[0001] The present disclosure relates to an electronic component module.

Background Art

[0002] An electronic component module includes a substrate with wiring on its surface and a plurality of electronic components mounted on the surface of the substrate. Further, the electronic component module disclosed in Patent Document 1 includes a circuit board and an electrical element arranged so as to straddle the electronic components mounted on the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The electronic component module disclosed in Patent Document 1 has room for improvement with respect to suppressing signal interference between components mounted on a circuit board.

[0005] The present disclosure has been made in view of the above, and an object thereof is to provide an electronic component module capable of suppressing signal interference between components mounted on a circuit board.

Means for Solving the Problems

[0006] The electronic component module of the present disclosure includes a rigid substrate on which a plurality of electronic components are mounted, a plurality of electronic components mounted on the rigid substrate, and a bendable flexible substrate mounted on the rigid substrate, wherein the flexible substrate is mounted on the rigid substrate in a plan view with respect to one main surface of the rigid substrate, passing between the plurality of electronic components mounted on the rigid substrate, and the flexible substrate includes wiring for transmitting signals and a first ground layer, the first ground layer being electrically connected to a reference potential of the rigid substrate. [Effects of the Invention]

[0007] According to this disclosure, signal interference between components mounted on a circuit board can be suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing an electronic component module of the first embodiment. [Figure 2] Figure 2 is a perspective view showing the configuration of the multilayer wiring board before the flexible circuit board is mounted in Figure 1. [Figure 3] Figure 3 shows the configuration of the flexible substrate in the first embodiment. [Figure 4] Figure 4 is a magnified view of a portion of the flexible substrate shown in Figure 3. [Figure 5] Figure 5 shows a flexible circuit board in a folded state along the folding line. [Figure 6] Figure 6 shows a cross-section of a portion of the flexible substrate shown in Figure 5. [Figure 7] Figure 7 illustrates the structure of the short section of the flexible substrate shown in Figure 5. [Figure 8] Figure 8 illustrates the structure of the short section of the flexible substrate shown in Figure 5. [Figure 9] Figure 9 shows the main components of a flexible substrate used in the electronic component module of the second embodiment. [Figure 10]FIG. 10 is a diagram showing the configuration of the main part of the flexible substrate used in the electronic component module of the second embodiment. [Figure 11] FIG. 11 is a diagram showing the configuration of the main part of the flexible substrate used in the electronic component module of the second embodiment. [Figure 12] FIG. 12 is a diagram showing a first example of a structure in which surface-mounted components are mounted using the flexible substrate according to the second embodiment. [Figure 13] FIG. 13 is a diagram showing a cross section of a part of the flexible substrate of FIG. 12. [Figure 14] FIG. 14 is a diagram showing a second example of a structure in which surface-mounted components are mounted using the flexible substrate according to the second embodiment. [Figure 15] FIG. 15 is a diagram showing a cross section of a part of the flexible substrate of FIG. 14. [Figure 16] FIG. 16 is a cross-sectional view showing the configuration of the flexible substrate according to a modified example of the second embodiment. [Figure 17] FIG. 17 is a diagram showing the configuration of the main part of the flexible substrate used in the electronic component module of the third embodiment. [Figure 18] FIG. 18 is a diagram showing the flexible substrate in a state of being bent along each bending line. [Figure 19] FIG. 19 is a perspective view showing the electronic component module of the third embodiment. [Figure 20] FIG. 20 is a diagram showing a state in which the electronic component module is filled with resin. [Figure 21] FIG. 21 is a diagram showing the configuration of the main part of the flexible substrate used in the electronic component module of the fourth embodiment. [Figure 22] FIG. 22 is a diagram showing the flexible substrate in a state of being bent along each bending line. [Figure 23] FIG. 23 is a perspective view showing a configuration example of the ground substrate. [Figure 24] FIG. 24 is a diagram showing a state in which a flexible substrate and a ground substrate are provided on a multilayer wiring board. [Figure 25]FIG. 25 is a diagram showing a state in which the resin is filled in the state shown in FIG. 24. [Figure 26] FIG. 26 is a diagram showing an example of a connection substrate.

Embodiments of the Invention

[0009] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In the description of each of the following embodiments, the same or equivalent components as those in other embodiments are denoted by the same reference numerals, and the description thereof is simplified or omitted. The present invention is not limited by each embodiment. In addition, the components of each embodiment include those that can be easily replaced by those skilled in the art or those that are substantially the same. The configurations described below can be combined as appropriate. Omissions, substitutions, or changes in the configuration can be made without departing from the gist of the invention. In the following embodiments after the second embodiment, the description of matters common to the first embodiment will be omitted as appropriate, and only the differences will be described. In particular, the same operational effects due to the same configurations will not be sequentially mentioned for each embodiment.

[0010] (First Embodiment) (Configuration) FIG. 1 is a perspective view showing an electronic component module 100 according to the first embodiment. In FIG. 1, the electronic component module 100 includes a multilayer wiring board 101 and a flexible board 1. The multilayer wiring board 101 is a rigid board that cannot be bent. The flexible board 1 is a board that can be bent.

[0011] In Figure 1, the direction from the back to the front of the multilayer wiring board 101 is defined as the X-axis direction, the direction from the left to the right of the multilayer wiring board 101 is defined as the Y-axis direction, and the direction from the bottom to the top of the multilayer wiring board 101 is defined as the Z-axis direction. The Z-axis direction is the thickness direction of the multilayer wiring board 101. In the figures referenced in the following explanation, the direction from the back to the front of the multilayer wiring board 101 may be referred to as the positive direction or positive side of the X-axis, the direction from the front to the back of the multilayer wiring board 101 as the negative direction or negative side of the X-axis, the direction from the left to the right of the multilayer wiring board 101 as the positive direction or positive side of the Y-axis, the direction from the right to the left of the multilayer wiring board 101 as the negative direction or negative side of the Y-axis, the direction from the bottom to the top of the multilayer wiring board 101 as the positive direction or positive side of the Z-axis, and the direction from the top to the bottom of the multilayer wiring board 101 as the negative direction or negative side of the Z-axis.

[0012] As shown in Figure 1, signal lines S1 to S5 for transmitting signals are provided on the surface of the multilayer wiring board 101. Although not shown, the multilayer wiring board 101 also has a wiring layer inside the board.

[0013] As shown in Figure 1, one main surface of the multilayer wiring board 101 is mounted with the following electronic components: a control IC (Integrated Circuit) 40, a power amplifier IC 41, an antenna switch 42, and a low-noise amplifier IC 43. Additionally, other electronic components 20-1 to 20-12 are mounted on the same main surface of the multilayer wiring board 101. In other words, the multilayer wiring board 101 is a rigid board on which multiple electronic components are mounted.

[0014] Control IC 40 receives the RF signal output from an RFIC (Radio Frequency Integrated Circuit) (not shown) as indicated by arrow Y1. Control IC 40 outputs a control signal to signal line S1. Signal line S1 is connected to the flexible circuit board 1. Control IC 40 also outputs an RF signal to signal line S2. Signal line S2 is connected to power amplifier IC 41. The output signal from power amplifier IC 41 is output to signal line S3.

[0015] The antenna switch 42 inputs and outputs RF signals to and from an antenna (not shown), as indicated by arrow Y2. Signal lines S4 and S5 are connected to the antenna switch 42. Signal line S4 is connected to the low-noise amplifier IC 43. Signal line S5 is connected to the flexible circuit board 1.

[0016] Power amplifier IC 41 outputs an RF signal from an antenna (not shown) via signal line S3 and antenna switch 42. Low-noise amplifier IC 43 receives an RF signal from an antenna (not shown) via antenna switch 42 and signal line S4. Low-noise amplifier IC 43 outputs an RF signal to an RF IC (not shown) as indicated by arrow Y2.

[0017] Electronic components 20-1 to 20-12 include, for example, filter circuits, resistors, and capacitors. Electronic components 20-1 to 20-12 are mounted on the surface of the multilayer wiring board 101.

[0018] The flexible circuit board 1 is mounted on one main surface of the multilayer wiring board 101. The flexible circuit board 1 comprises a long section 1L and short sections 1S1 and 1S2. One end of the flexible circuit board 1, the short section 1S1, and the other end of the flexible circuit board 1, the short section 1S2, are connected to different positions on the multilayer wiring board 101. The flexible circuit board 1 electrically connects signal lines S1 and S5 of the multilayer wiring board 101. The structure of the flexible circuit board 1 will be described later.

[0019] (Multilayer wiring board) Figure 2 is a perspective view showing the configuration of the multilayer wiring board 101 before the flexible substrate 1 is mounted in Figure 1. Referring to Figure 2, electrodes P1 to P6 for mounting the flexible substrate 1 are provided on the surface of the multilayer wiring board 101. Electrodes P1 to P3 are electrodes for connecting the short portion 1S1 (see Figure 1) of the flexible substrate 1. Electrodes P4 to P6 are electrodes for connecting the short portion 1S2 (see Figure 1) of the flexible substrate 1.

[0020] If the flexible circuit board 1 shown in Figure 1 is not provided, electromagnetic waves may leak from the power amplifier IC 41 and antenna switch 42, as indicated by the dashed arrows Y11, Y12, and Y13 in Figure 2, affecting other circuits. Hereafter, this effect will be referred to as "signal interference".

[0021] (Flexible circuit board) Figure 3 shows the configuration of the flexible substrate 1 in the first embodiment. As shown in Figure 3, the flexible substrate 1 has thickness in the X-axis direction and includes a long portion 1L extending in the Y-axis direction and short portions 1S1 and 1S2 extending in the Z-axis direction. The short portion 1S1 is connected to one end of the long portion 1L. The short portion 1S2 is connected to the other end of the long portion 1L.

[0022] The flexible circuit board 1 has multiple wirings 11, 12, and 13. Wirings 11, 12, and 13 are for transmitting signals. When the flexible circuit board 1 is mounted on the multilayer wiring board 101, wirings 11, 12, and 13 each transmit different signals. Wirings 11, 12, and 13 transmit signals from the short section 1S1 through the long section 1L to the short section 1S2. Because signals are transmitted by the flexible circuit board 1, the number of signal lines passing through the inside of the multilayer wiring board 101 can be reduced.

[0023] Furthermore, the flexible substrate 1 has predetermined bending lines L1, L2, L3, and L4. Bending line L1 is provided at the boundary between the long section 1L and the short section 1S1. Bending line L2 is provided at the boundary between the long section 1L and the short section 1S2.

[0024] Figure 4 is a magnified view of a portion of the flexible substrate 1 shown in Figure 3. Figure 4 is a diagram showing the structure of the long portion 1L of the flexible substrate 1. Figure 4 is a view of the long portion 1L of the flexible substrate 1 in Figure 3, viewed from the negative direction of the X-axis.

[0025] As shown in Figure 4, the flexible substrate 1 includes wirings 11, 12, and 13 and a coverlay 15a that covers them. The wirings 11, 12, and 13 are formed, for example, from copper foil. The wirings 11, 12, and 13 are covered by the coverlay 15a in a manner that prevents them from intersecting. Therefore, the wirings 11, 12, and 13 are not electrically conductive to each other.

[0026] Figure 5 shows the flexible substrate 1 in a folded state along folding lines L1, L2, L3, and L4. The flexible substrate 1 shown in Figure 3 is folded as follows to obtain the state of the flexible substrate 1 in Figure 5. Specifically, at folding line L1 in Figure 3, the long portion 1L and the short portion 1S1 are folded at approximately 90 degrees. Also, at folding line L2 in Figure 3, the long portion 1L and the short portion 1S2 are folded at approximately 90 degrees. Furthermore, at folding line L3 in Figure 3, the portion of the long portion 1L connected to the short portion 1S1 and the remaining portion are folded at approximately 90 degrees. Finally, at folding line L4 in Figure 3, the portion of the long portion 1L connected to the short portion 1S2 and the remaining portion are folded at approximately 90 degrees. By folding along folding lines L1, L2, L3, and L4 as described above, the flexible substrate 1 in the state shown in Figure 5 is obtained. The bent flexible circuit board 1 is mounted onto the multilayer wiring board 101.

[0027] In the flexible substrate 1 shown in Figure 5, the portion that is bent to extend away from the multilayer wiring board 101 is the elongated portion 1L. The elongated portion 1L is erected from one main surface of the multilayer wiring board 101 by being bent along a predetermined bending line. The elongated portion 1L corresponds to the erected portion in this disclosure.

[0028] In the flexible substrate 1 shown in Figure 5, the portions that are bent to conform to the multilayer wiring board 101 are the short portions 1S1 and 1S2. The short portions 1S1 and 1S2 are connected to one main surface of the multilayer wiring board 101. The short portions 1S1 and 1S2 correspond to the connection portions of this disclosure.

[0029] Figure 6 shows a cross-section of a portion of the flexible substrate 1 shown in Figure 5. Figure 6 shows a cross-section of the portion along line a-a' in Figure 5, viewed from the positive direction of the Y-axis.

[0030] Referring to Figure 6, the flexible substrate 1 includes a base film 10, a ground layer 14, wirings 11, 12 and 13, and coverlays 15a and 15b. The ground layer 14 is formed on one main surface of the base film 10, and the wirings 11, 12 and 13 are formed on the other main surface. Because of the presence of the base film 10, the ground layer 14 does not make electrical contact with the wirings 11, 12 and 13. The ground layer 14 is electrically connected to a reference potential of the multilayer wiring substrate 101. The reference potential is, for example, the ground potential. The ground layer 14 corresponds to the first ground layer of this disclosure.

[0031] The ground layer 14 is formed, for example, from copper foil. The wirings 11, 12, and 13 are formed, for example, from copper foil. In Figure 6, gaps are drawn between each of the wirings 11, 12, and 13 for illustrative purposes. These gaps do not actually exist. The wirings 11, 12, and 13 are covered by the coverlay 15b in a manner that prevents them from intersecting each other. Therefore, the wirings 11, 12, and 13 are not electrically conductive to each other.

[0032] Figures 7 and 8 illustrate the structure of the short portion 1S2 of the flexible substrate 1 shown in Figure 5. Figure 7 is a view of the short portion 1S2 in Figure 5 from the negative Z-axis direction. Figure 8 is a cross-section of the portion along the line b-b' in Figure 5, viewed from the Y-axis direction.

[0033] In Figures 7 and 8, wirings 11, 12, and 13 are provided on the negative Z-axis side of the base film 10. Figure 8 shows a cross-section along the line b-b' in Figure 5, so wiring 12 is depicted, while wirings 11 and 13 are not. Solder plating 120 is provided on the negative Z-axis side of a portion of wiring 12. Similarly, solder plating 110 is provided on the negative Z-axis side of a portion of wiring 11, and solder plating 130 is provided on the negative Z-axis side of a portion of wiring 13.

[0034] The portion of wiring 12 that is not solder-plated 120 is covered by coverlay 15b. Similarly, the portion of wiring 11 that is not solder-plated 110, and the portion of wiring 13 that is not solder-plated 130 are covered by coverlay 15b. In Figure 8, a gap is depicted between wiring 11 and wiring 12 for illustrative purposes. This gap does not actually exist.

[0035] In Figure 8, a ground layer 14 is provided on the positive Z-axis side of the base film 10. The positive Z-axis side of the ground layer 14 is covered by a coverlay 15a.

[0036] Returning to Figure 1, and focusing on the flexible substrate 1, multiple components are mounted on one main surface of the multilayer wiring board 101. In a plan view of the main surface of the multilayer wiring board 101, the flexible substrate 1 is mounted on the multilayer wiring board 101, passing between the multiple components mounted on the multilayer wiring board 101, and electrically connects signal line S1 and signal line S5. That is, the flexible substrate 1 electrically connects two electrodes at separate locations on one main surface of the multilayer wiring board 101. In other words, the flexible substrate 1 has two short sections 1S1 and 1S2 corresponding to two connection points, and the short sections 1S1 and 1S2 are connected to separate positions on one main surface of the multilayer wiring board 101, respectively. At this time, the flexible substrate 1 is provided such that the side surface of its long section 1L is aligned with one main surface of the multilayer wiring board 101. The flexible substrate 1 is mounted so as to avoid the components on one main surface of the multilayer wiring board 101 and pass through areas where no components are provided. The flexible substrate 1 has a ground layer 14, which enables electromagnetic shielding and suppresses signal interference.

[0037] (effect) According to the first embodiment described above, by providing a flexible substrate 1 having a ground layer between components, an electromagnetic shielding function can be realized and signal interference can be suppressed.

[0038] (Second Embodiment) (composition) Figures 9, 10, and 11 show the main components of the flexible substrate 1a used in the electronic component module of the second embodiment. Figure 10 shows a cross-section of the portion along the line b-b' in Figure 9, viewed from the Y-axis direction. Figure 11 shows the short portion 1S2 of the flexible substrate 1a viewed from the negative Z-axis direction.

[0039] The difference between the flexible substrate 1a shown in Figures 9 to 11 and the flexible substrate 1 of the first embodiment described with reference to Figures 3 to 8 is the arrangement of the ground layer 14. Referring to Figure 9, the wirings 11, 12, and 13 are exposed on the positive side of the Z-axis of the short portion 1S2. A ground layer 14 is provided on the negative side of the Z-axis of the wirings 11, 12, and 13.

[0040] Referring to Figure 10, in the short section 1S2, wiring 12 is provided on the positive Z-axis side of the base film 10. The portions of wiring 11, wiring 12, and wiring 13 (see Figure 9) that are not solder-plated are covered by the coverlay 15a. Solder plating 120 is provided on the positive Z-axis side of wiring 12. A gap is depicted between wiring 12 and wiring 11 for drawing purposes. This gap does not actually exist.

[0041] A ground layer 14 is provided on the negative Z-axis side of the base film 10. Solder plating 140 is provided on the negative Z-axis side of the ground layer 14. Referring to Figure 11, solder plating 140 is provided on the negative Z-axis side of the short section 1S2, and a coverlay 15b is provided on the negative X-axis side of the solder plating 140. The solder plating 140 electrically connects the ground layer 14 to the ground electrode on the surface of the multilayer wiring board 101. The short section 1S1 (not shown) on the opposite side of the flexible substrate 1a has the same structure as the short section 1S2.

[0042] Figure 12 shows a first example of a structure in which surface mount devices (SMDs) are mounted using a flexible substrate 1a according to the second embodiment. Figure 12 shows an example in which electronic components 20 are connected to the wiring 13 shown in Figure 9. The multilayer wiring substrate 101a in this example has land patterns 30.

[0043] When a land pattern 30 is provided on a multilayer wiring board 101a, an electronic component 20, which is a surface-mount component, is provided on the flexible substrate 1a so as to bridge the land pattern 30 and the wiring 13. In this case, one electrode (not shown) of the electronic component 20 is connected to the wiring 13, and the other electrodes (not shown) of the electronic component 20 are connected to the land pattern 30. In other words, a portion of the wiring 13 is provided in a short section 1S2, and the electronic component 20 is connected to the wiring 13 provided in the short section 1S2.

[0044] Figure 13 shows a cross-section of a portion of the flexible substrate 1a shown in Figure 12. Figure 13 shows a cross-section of the portion along the line c-c' in Figure 12, viewed from the positive X-axis direction.

[0045] Referring to Figures 12 and 13, the short portion 1S2 of the flexible substrate 1a is connected to the multilayer wiring board 101a by solder plating 140. Electronic components 20 are connected to the wiring 13 of the short portion 1S2 by solder plating 163. The electronic components 20 are connected to the land pattern 30 of the flexible substrate 1a by soldering using solder plating 160. Even if the positions of the wiring 11, 12, and 13 and the position of the ground layer 14 are reversed compared to the first embodiment, the flexible substrate 1a has a ground layer 14, which enables the function of electromagnetic shielding and suppresses signal interference.

[0046] Figure 14 shows a second example of a structure for mounting surface mount components using a flexible substrate 1a according to the second embodiment. The multilayer wiring board 101b in this example has a recess 200. The recess 200 is a portion recessed in the negative Z-axis direction from the position of the land pattern 30 of the multilayer wiring board 101b. The short portion 1S2 is provided in the recess 200. A ground layer 170 is provided between the short portion 1S2 and the bottom of the recess 200.

[0047] Figure 15 shows a cross-section of a portion of the flexible substrate 1a shown in Figure 14. Figure 14 shows a cross-section of the portion along the line d-d' in Figure 12, viewed from the positive X-axis direction. A ground layer 170 is provided to align the Z-axis position of the land pattern 30 with the Z-axis position of the wiring 13. That is, the ground layer 170 is provided to adjust the Z-axis height between the land pattern 30 and the wiring 13.

[0048] Referring to Figures 14 and 15, the ground layer 14 of the short section 1S2 of the flexible substrate 1a is connected to the ground layer 170 of the multilayer wiring board 101a by solder plating 140. In the short section 1S2, solder plating 161 is provided on the wiring 11, solder plating 162 on the wiring 12, and solder plating 163 on the wiring 13.

[0049] The wiring 13 of the short section 1S2 is connected to the electronic component 20 by solder plating 163. The electronic component 20 is connected to the land pattern 30 of the flexible substrate 1a by solder plating 160.

[0050] Even if the positions of the wiring 11, 12, and 13 and the position of the ground layer 14 are reversed compared to the first embodiment, the presence of the ground layer 14 in the flexible substrate 1a enables the function of electromagnetic shielding and suppresses signal interference.

[0051] (Modified version of the second embodiment) Incidentally, in the flexible substrate 1a shown in Figures 9 to 11, a ground layer 14 is provided on one side of the base film 10. The ground layer 14 may also be provided on both sides of the base film.

[0052] Figure 16 is a cross-sectional view showing the configuration of the flexible substrate 1a' according to a modified example of the second embodiment. Figure 16 is a cross-sectional view of the portion of the flexible substrate 1a' corresponding to the line b-b' in Figure 9, viewed from the positive direction of the Y-axis.

[0053] As shown in Figure 16, the flexible substrate 1a' includes three base films 10a, 10b, and 10c, ground layers 14a, 14b, wiring 11, 12a, 12b, and 12c, coverlays 15a and 15b, and via holes 18. Ground layer 14a corresponds to the first ground layer of this disclosure. Ground layer 14b corresponds to the second ground layer of this disclosure.

[0054] The base films 10a, 10b, and 10c and the wirings 12a, 12b, and 12c are stacked alternately in the Z-axis direction. Via holes 18 are formed by passing through the wirings 12a, 12b, and 12c. Therefore, the wirings 12a, 12b, and 12c are electrically connected by the via holes 18. Solder plating 140a is provided on the negative Z-axis side of the wiring 12c.

[0055] A ground layer 14b and a coverlay 15b are provided on the positive Z-axis side of the base film 10a. A ground layer 14a and a coverlay 15a are provided on the negative Z-axis side of the base film 10c. Solder plating 140 is provided on the negative Z-axis side of the ground layer 14a, and a coverlay 15a is provided on the negative X-axis side of the solder plating 140. The solder plating 140 electrically connects the ground layer 14a to the ground electrode (not shown) on the surface of the multilayer wiring board. Note that a gap is drawn between wiring 12b and wiring 11 for drawing purposes. This gap does not actually exist.

[0056] In the configuration shown in Figure 16, focusing on wirings 12a and 12b, a ground layer 14b is provided on the positive side of their Z-axis, and a ground layer 14a is provided on the negative side of their Z-axis. Wirings 12a and 12b are placed between ground layers 14a and 14b, resulting in a configuration where wirings 12a and 12b are sandwiched between ground layers 14a and 14b. This enables the electromagnetic shielding function of ground layers 14a and 14b, suppressing signal interference to other circuits when wirings 12a and 12b transmit high-frequency signals.

[0057] (effect) According to the second embodiment and its modified form described above, by providing a flexible substrate having a ground layer 14 between components, an electromagnetic shielding function can be realized and signal interference can be suppressed.

[0058] (Third embodiment) (composition) Figure 17 shows the configuration of the main part of the flexible substrate 1b used in the electronic component module of the third embodiment. The difference between the flexible substrate 1b shown in Figure 17 and the flexible substrate 1 shown in Figure 3 is that an electrode plate 141 is provided at one end of the elongated portion 1L, an electrode plate 142 is provided at the other end, and a ground wire 14c is provided.

[0059] One end of the ground wire 14c is connected to the short section 1S1. At branching point B1, the ground wire 14c is branched and electrically connected to the electrode plate 141. The other end of the ground wire 14c is connected to the short section 1S2. Furthermore, at branching point B2, the ground wire 14c is branched and electrically connected to the electrode plate 142.

[0060] The flexible substrate 1b has folding lines L1, L2, L3, and L4, similar to the flexible substrate 1 shown in Figure 3. Similar to the flexible substrate 1 shown in Figure 3, the flexible substrate 1b is obtained in the state shown in Figure 18 by folding it along each of the folding lines L1, L2, L3, and L4. Figure 18 shows the flexible substrate 1b in the folded state along each of the folding lines L1, L2, L3, and L4. By mounting the folded flexible substrate 1b onto the multilayer wiring board 101 described with reference to Figure 2, the electronic component module 100a shown in Figure 19 is obtained.

[0061] Figure 19 is a perspective view showing an electronic component module 100a of the third embodiment. Referring to Figure 19, the electrode plates 141 and 142 of the flexible substrate 1b extend in the positive Z-axis direction. Figure 20 shows the electronic component module 100a filled with resin 102. Figure 20 shows the state in which resin 102 is filled on the upper side of the multilayer wiring board 101 of the electronic component module 100a, i.e., in the positive Z-axis direction. The resin 102 is an insulating material. By filling with resin 102, the position of the flexible substrate 1b can be fixed. At this time, because the resin 102 is filled, the parts of the flexible substrate 1b other than the edges of the electrode plates and the multilayer wiring board 101a are sealed by the insulating material resin 102.

[0062] As shown in Figure 20, when the resin 102 is filled, the tip 141T of electrode plate 141 in the positive Z-axis direction and the tip 142T of electrode plate 142 in the positive Z-axis direction are exposed and not covered by the resin 102. After filling with resin 102, the amount of exposure of the tips 141T and 142T can be adjusted by polishing the surface of the resin 102 in the Z-axis direction as needed to make it flat. Furthermore, a metal layer (not shown) may be provided on the surface of the resin 102 in the Z-axis direction to electrically connect the metal layer to the tips 141T and 142T. This metal layer can be formed by sputtering or vapor deposition. By applying a ground potential to this metal layer, a ground potential is applied to the ends of the electrode plates, i.e., the tips 141T and 142T. The flexible substrate 1b with a ground potential provides an electromagnetic shielding function and can suppress signal interference.

[0063] (effect) According to the third embodiment described above, in the electronic component module 100a, by providing a flexible substrate 1b having a ground layer between the components, an electromagnetic shielding function can be realized and signal interference can be suppressed.

[0064] (Fourth Embodiment) (composition) Figure 21 shows the configuration of the main part of a flexible substrate 1c used in an electronic component module of the fourth embodiment. The difference between the flexible substrate 1c shown in Figure 21 and the flexible substrate 1 shown in Figure 3 is that it has wirings 11d1 and 11d2 instead of wiring 11 shown in Figure 3. One end of wiring 11d1 is connected to a short section 1S1. The other end of wiring 11d1 is electrically connected to an electrode plate 141. One end of wiring 11d2 is connected to a short section 1S2. The other end of wiring 11d2 is electrically connected to an electrode plate 142. Electrode plates 141 and 142 correspond to the first electrode plates of this disclosure.

[0065] Flexible substrate 1b has folding lines L1, L2, L3, and L4, similar to flexible substrate 1 shown in Figure 3. Similar to flexible substrate 1 shown in Figure 3, flexible substrate 1c is obtained by folding along each folding line L1, L2, L3, and L4, as shown in Figure 22. Figure 22 shows flexible substrate 1c in the folded state along each folding line L1, L2, L3, and L4. The folded flexible substrate 1c is mounted on the multilayer wiring board 101, as described with reference to Figure 2.

[0066] Furthermore, in this embodiment, a ground substrate 2 shown in Figure 23 is used together with the bent flexible substrate 1c. Figure 23 is a perspective view showing an example of the configuration of the ground substrate. The ground substrate 2 shown in Figure 23 is provided so as to surround the bent flexible substrate 1c. The ground substrate 2 has electrode plates 21, 22, 23 and 24 and elongated portions 25, 26, 27 and 28. The electrode plates 21, 22, 23 and 24 correspond to the second electrode plates of this disclosure.

[0067] The ground board 2 has a rectangular shape when viewed from the positive Z-axis direction. Electrode plates 21, 22, 23, and 24 are provided at positions corresponding to the four corners of the rectangular shape of the ground board 2. An elongated section 25 is provided between electrode plate 21 and electrode plate 22. An elongated section 26 is provided between electrode plate 22 and electrode plate 23. An elongated section 27 is provided between electrode plate 23 and electrode plate 24. An elongated section 28 is provided between electrode plate 24 and electrode plate 21.

[0068] By placing the bent flexible substrate 1c shown in Figure 22 and the ground substrate 2 shown in Figure 23 on the multilayer wiring board 101 shown in Figure 2, the state shown in Figure 24 is achieved. Figure 24 shows the state in which the flexible substrate 1c and the ground substrate 2 are placed on the multilayer wiring board 101. The flexible substrate 1c and the ground substrate 2 are placed on the surface of the multilayer wiring board 101 in the positive direction of the Z axis. The flexible substrate 1c and the ground substrate 2 are connected to electrodes or pads on the surface of the multilayer wiring board 101 by soldering. In the state shown in Figure 24, the positions of the flexible substrate 1c and the ground substrate 2 can be further fixed by filling with resin.

[0069] Figure 25 shows the state after filling with resin 102 in the state shown in Figure 24. As shown in Figure 25, in the state after filling with resin 102, the tip 141T of electrode plate 141 in the positive Z-axis direction, the tip 142T of electrode plate 142 in the positive Z-axis direction, the tip 21T of electrode plate 21 in the positive Z-axis direction, the tip 22T of electrode plate 22 in the positive Z-axis direction, the tip 23T of electrode plate 23 in the positive Z-axis direction, and the tip 24T of electrode plate 24 in the positive Z-axis direction are exposed and not covered by resin 102. After filling with resin 102, the amount of exposure of the tips 141T, 142T, 21T, 22T, 23T, and 24T can be adjusted by polishing the surface of the resin 102 in the Z-axis direction as needed to make it flat.

[0070] Furthermore, additional boards may be added to electrically connect tips 141T and 142T, and tips 21T, 22T, 23T, and 24T. Figure 26 shows an example of a connection board 103. Figure 26 shows an example of a connection board 103 for electrically connecting each tip in Figure 25. The connection board 103 corresponds to the connection board of the present disclosure.

[0071] In Figure 26, electrodes 51, 52, 53, and 54 and wiring 61, 62, 63, and 64 are provided on the lower surface of the connecting substrate 103 in the figure, i.e., the negative side of the Z-axis. Electrodes 51, 52, 53, and 54 are provided at positions corresponding to tips 21T, 22T, 23T, and 24T (see Figure 25). Therefore, electrode 51 of the connecting substrate 103 is connected to tip 21T (see Figure 25). Electrode 52 of the connecting substrate 103 is connected to tip 22T (see Figure 25). Electrode 53 of the connecting substrate 103 is connected to tip 23T (see Figure 25). Electrode 54 of the connecting substrate 103 is connected to tip 24T (see Figure 25). Wiring 61 electrically connects electrode 51 and electrode 52. Wiring 62 electrically connects electrode 52 and electrode 53. Wiring 63 electrically connects electrode 53 and electrode 54. Wiring 64 electrically connects electrode 54 and electrode 51.

[0072] Furthermore, electrodes 55, 56, and wiring 57 are provided on the lower surface of the connecting board 103 in the figure. Electrodes 55 and 56 are positioned to correspond to the tips 141T and 142T (see Figure 25). Therefore, electrode 55 of the connecting board 103 is connected to tip 141T (see Figure 25). Electrode 56 of the connecting board 103 is connected to tip 142T (see Figure 25). Wiring 57 electrically connects electrodes 55 and 56. In other words, the ends of each electrode plate are connected to the electrodes at their corresponding positions.

[0073] The connecting substrate 103 shown in Figure 26 is placed on the upper surface of the resin 102 in Figure 25, i.e., the positive side of the Z-axis, to electrically connect the tips 21T, 22T, 23T, 24T, 141T, and 142T to the electrodes 51, 52, 53, 54, 55, and 56. At this time, the connecting substrate 103 covers the flexible substrate 1c and the ground substrate 2. Therefore, the wiring 57 that transmits high-frequency signals can be covered with electrodes at ground potential. This realizes the function of electromagnetic shielding and suppresses signal interference.

[0074] (effect) According to the fourth embodiment described above, in an electronic component module, by providing a flexible substrate having a ground layer between components and covering the components with a substrate having a ground layer, an electromagnetic shielding function can be realized and signal interference can be suppressed. [Explanation of Symbols]

[0075] 1, 1a, 1a', 1b, 1c Flexible substrate 1L, 25, 26, 27, 28 long part 1S1, 1S2 Short section 2 Ground board 10, 10a, 10b, 10c base film Wiring for 11, 11d1, 11d2, 12, 12a~12c, 13, 57, 61~64 14, 14a, 14b, 170 Ground layer 14c Ground Line 15a, 15b Coverlay 18 Beer Hall 20, 20-1~20-12 Electronic Components 21~24, 141, 142 electrode plate 21T, 22T, 23T, 24T, 141T, 142T (advanced) 30 Land Pattern 40 Control ICs 41 Power Amplifier IC 42 Antenna switch 43 Low-noise amplifier ICs 51~56, P1, P2, P3, P4, P5, P6 electrode 100, 100a Electronic Component Module 101, 101a, 101b multilayer wiring board 102 Resin 103 Connection board 110, 120, 130, 140, 140a, 160, 161~163 Solder plating 200 recess L1, L2, L3, L4 fold lines S1, S2, S3, S4, S5 signal line

Claims

1. A rigid circuit board on which multiple electronic components are mounted, Multiple electronic components mounted on the rigid substrate, A flexible substrate that can be bent is mounted on the rigid substrate, Includes, The flexible substrate is mounted on the rigid substrate, passing through the plurality of electronic components mounted on the rigid substrate in a plan view with respect to one main surface of the rigid substrate. The flexible substrate includes wiring for transmitting signals and a first ground layer. The first ground layer is electrically connected to the reference potential of the rigid substrate. Electronic component module.

2. The flexible substrate includes a connecting portion connected to one main surface of the rigid substrate and an erecting portion that is erected from one main surface of the rigid substrate by being bent, The flexible substrate, in its bent state, is mounted on the rigid substrate. The electronic component module according to claim 1.

3. The flexible substrate has two of the aforementioned connection parts, The two aforementioned connecting parts are connected to separate locations on one main surface of the rigid substrate. The electronic component module according to claim 2.

4. The flexible substrate includes a base film, The aforementioned wiring is provided on one main surface side of the base film, The first ground layer is provided on the other main surface side of the base film. The electronic component module according to claim 1 or claim 2.

5. The flexible substrate further includes a second ground layer, The wiring is provided between the first ground layer and the second ground layer. The electronic component module according to claim 1 or claim 2.

6. A portion of the aforementioned wiring is provided at the connection point, Surface mount components are connected to the wiring provided in the connection portion. The electronic component module according to claim 2.

7. A recess is provided on one main surface of the rigid substrate, The connecting portion is provided in the recess. The electronic component module according to claim 6.

8. The flexible substrate includes an electrode plate electrically connected to the first ground layer, The electrode plate is erected from one main surface of the rigid substrate, The portion of the flexible substrate other than the end of the electrode plate and the rigid substrate are sealed with an insulating member. A reference potential is applied to the end of the electrode plate. The electronic component module according to claim 2.

9. The flexible substrate includes a first electrode plate that is electrically connected to the wiring, moreover, A ground board is provided so as to surround the flexible substrate, A connecting substrate covering the flexible substrate and the ground substrate, Includes, The ground substrate includes a second electrode plate, The first electrode plate and the second electrode plate are erected from one main surface of the rigid substrate. The portion of the flexible substrate other than the end of the first electrode plate, the portion of the ground substrate other than the end of the second electrode plate, and the rigid substrate are sealed by an insulating member. The connecting substrate has electrodes provided at positions corresponding to the ends of the first electrode plate and the ends of the second electrode plate, respectively. The ends of the first electrode plate and the ends of the second electrode plate are connected to the electrodes at their respective positions. The electronic component module according to claim 2.

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