Electronic devices

Abstract

The objective is to provide an electronic device that can suppress a decline in reliability. [Solution] The electronic device A10 comprises a first electronic component 1A having an electrode 11, a first wiring section 4A that conducts to the electrode 11, and a joint section 3A that joins the electrode 11 and the first wiring section 4A. The first wiring section 4A has a first surface 491 and a second surface 492, each facing one direction in the thickness direction z. The joint section 3A overlaps the first surface 491 when viewed in the thickness direction z. The second surface 492 is located one direction in the thickness direction z relative to the first surface 491. The second surface 492 is positioned at least on a portion of the periphery of the first surface 491 when viewed in the thickness direction z.

Description

Technical Field

[0001] The present disclosure relates to an electronic device.

Background Art

[0002] Conventionally, an electronic device including a plurality of electronic components has been known. For example, Patent Document 1 discloses an example of a conventional electronic device. The electronic device (semiconductor device) described in Patent Document 1 includes an insulating layer, a wiring layer, a plurality of bonding layers, and a plurality of electronic components. The wiring layer is disposed on the insulating layer. The wiring layer constitutes the position of a conduction path between the plurality of electronic components and the semiconductor device described in Patent Document 1. Each of the plurality of electronic components is either a passive element such as a resistor, a capacitor, and an inductor, or a diode. The plurality of electronic components are surface-mounted and chip-type. Each of the plurality of electronic components has an electrode. In each electronic component, the electrode is bonded to the wiring layer via a bonding layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a configuration in which an electronic component is bonded to a wiring layer via a bonding layer as in the above-described electronic device (semiconductor device), a defect in the bonding layer causes a decrease in the bonding strength between the electronic component and the wiring layer and a decrease in the electrical conductivity between the electronic component and the wiring layer. Such a decrease in the bonding strength and the electrical conductivity reduces the reliability of the electronic device.

[0005] The present disclosure has been conceived in view of the above circumstances, and an object thereof is to provide an electronic device capable of suppressing a decrease in reliability.

Means for Solving the Problems

[0006] The electronic device provided by this disclosure comprises a first electronic component having a first electrode, a first wiring portion that conducts to the first electrode, and a first joining portion that joins the first electrode and the first wiring portion, wherein the first wiring portion has a first surface and a second surface, each facing one side in the thickness direction of the first wiring portion, the first joining portion overlaps the first surface when viewed in the thickness direction, the second surface is located one side of the thickness direction relative to the first surface, and is positioned on at least a portion of the periphery of the first surface when viewed in the thickness direction. [Effects of the Invention]

[0007] According to the electronic device of this disclosure, a decrease in reliability can be suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a plan view showing an electronic device according to the first embodiment. [Figure 2] Figure 2 is a plan view of Figure 1, with the sealing resin indicated by dashed lines. [Figure 3] Figure 3 is a plan view of Figure 2, but with the sealing resin omitted and multiple electronic components indicated by dashed lines. [Figure 4] Figure 4 is a magnified view of the main part of the plan view in Figure 3, with a portion enlarged and multiple joints indicated by dashed lines. [Figure 5] Figure 5 is a bottom view showing an electronic device according to the first embodiment. [Figure 6] Figure 6 is a front view showing an electronic device according to the first embodiment. [Figure 7] Figure 7 is a left side view showing an electronic device according to the first embodiment. [Figure 8] Figure 8 is a cross-sectional view along the line VIII-VIII in Figure 2. [Figure 9] Figure 9 is an enlarged cross-sectional view of a key part, which is a magnified portion of Figure 8. [Figure 10]Figure 10 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 11] Figure 11 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 12] Figure 12 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 13] Figure 13 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 14] Figure 14 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 15] Figure 15 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 16] Figure 16 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 17] Figure 17 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 18] Figure 18 is a cross-sectional view showing one step in the manufacturing method of an electronic device according to the first embodiment, and corresponds to the cross-section in Figure 8. [Figure 19] Figure 19 is an enlarged plan view of the main part of an electronic device according to a first modified example of the first embodiment. [Figure 20] Figure 20 is an enlarged plan view of the main part of an electronic device according to a second modified example of the first embodiment. [Figure 21] Figure 21 is an enlarged plan view of the main part of an electronic device according to a third modified example of the first embodiment. [Figure 22] Figure 22 is an enlarged plan view of a key part showing another configuration example of an electronic device according to a third modified example of the first embodiment. [Figure 23] Figure 23 is an enlarged plan view of the main part of an electronic device according to the second embodiment, and corresponds to Figure 4. [Figure 24] FIG. 24 is an enlarged cross-sectional view of a main part showing an electronic device according to the second embodiment, corresponding to FIG. 9. [Figure 25] FIG. 25 is an enlarged cross-sectional view of a main part showing an electronic device according to a modified example of the second embodiment, corresponding to FIG. 9. [Figure 26] FIG. 第26 is an enlarged plan view of a main part showing an electronic device according to the third embodiment, corresponding to FIG. 4. [Figure 27] FIG. 27 is a cross-sectional view showing an electronic device according to the third embodiment, corresponding to FIG. 8. [Figure 28] FIG. 28 is an enlarged cross-sectional view of a main part showing an electronic device according to the fourth embodiment, corresponding to FIG. 9. [Figure 29] FIG. 29 is an enlarged plan view of a main part showing another configuration example of the electronic device of the present disclosure, corresponding to FIG. 4. [Figure 30] FIG. 30 is a plan view showing another configuration example of the electronic device of the present disclosure, with the sealing resin shown by an imaginary line.

Embodiments for Carrying Out the Invention

[0009] Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Hereinafter, the same or similar components will be denoted by the same reference numerals, and duplicate descriptions will be omitted. The terms "first", "second", "third", etc. in the present disclosure are merely used as labels and are not necessarily intended to assign an order to their objects.

[0010] In this disclosure, "object A is formed on object B" and "object A is formed on object B" include, unless otherwise specified, "object A is directly formed on object B" and "object A is formed on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" and "object A is located on object B" include, unless otherwise specified, "object A is directly located on object B" and "object A is located on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" includes, unless otherwise specified, "object A is located on object B in contact with object B" and "object A is located on object B with another object interposed between object A and object B." Furthermore, "object A overlaps with object B when viewed in a certain direction" includes, unless otherwise specified, "object A overlaps with all of object B" and "object A overlaps with a part of object B." Also, "object A (or its material) contains material C" includes "object A (or its material) consists of material C" and "the main component of object A (or its material) is material C." Furthermore, "a surface A faces a certain direction B (one or the other)" is not limited to cases where the angle of surface A with respect to direction B is 90°, but also includes cases where surface A is inclined with respect to direction B. Furthermore, "object A is perpendicular to object B (or a certain direction B)" is not limited to cases where the angle of object A with respect to object B (or a certain direction B) is exactly 90°, but also includes cases where the angle is approximately 90° (for example, within the range of error caused by manufacturing variations), unless otherwise specified. Furthermore, unless otherwise specified, the statement "object A is parallel to object B (in a certain direction B)" is not limited to the case where object A is strictly parallel to object B (in a certain direction B), but also includes the case where object A is approximately parallel (for example, within the range of error caused by manufacturing variations).

[0011] Figures 1 to 9 show an electronic device A10 according to the first embodiment. The electronic device A10 comprises a plurality of electronic components 1, a support member 2, a plurality of joints 3, a plurality of wiring parts 4, a plurality of terminals 5, and a sealing resin 6. The electronic device A10 is surface-mounted on circuit boards of electrical products and electric vehicles, etc. The electronic device A10 is a leadless package type. The plan view shape of the electronic device A10 is, for example, rectangular.

[0012] For the sake of explanation, the thickness direction of electronic device A10 will be referred to as the "thickness direction z". In the following explanation, one direction in the thickness direction z may be referred to as "up" and the other as "down". Note that terms such as "up", "down", "upper direction", "downward", "upper surface", and "lower surface" indicate the relative positional relationship of each component in the thickness direction z, and do not necessarily define a relationship with the direction of gravity. Also, "planar view" refers to the view in the thickness direction z. The direction perpendicular to the thickness direction z is called the "first direction x". The direction perpendicular to both the thickness direction z and the first direction x is called the "second direction y".

[0013] Each of the multiple electronic components 1 is supported by a support member 2, as shown in Figures 2 and 8. Each of the multiple electronic components 1 is an SMD (Surface Mount Device). Each of the multiple electronic components 1 is, for example, a resistor, capacitor, inductor, or diode. The multiple electronic components 1 are functional elements of the electronic device A10. In the electronic device A10, the multiple electronic components 1 include a first electronic component 1A and a second electronic component 1B. In other words, the electronic device A10 comprises a first electronic component 1A and a second electronic component 1B. Note that in the electronic device A10, the number of multiple electronic components 1 is not limited to two; it may be one or three or more.

[0014] Each of the multiple electronic components 1 (first electronic component 1A and second electronic component 1B) has a pair of electrodes 11 and 12. In each electronic component 1 (each of the first electronic component 1A and second electronic component 1B), the pair of electrodes 11 and 12 are arranged on both sides of the first direction x. In each electronic component 1 (each of the first electronic component 1A and second electronic component 1B), electrode 11 is located at one end of the first direction x, and electrode 12 is located at the other end of the first direction x.

[0015] As shown in Figures 2 and 8, the support member 2 supports a plurality of electronic components 1. The support member 2 includes, for example, a resin material. This resin material is, for example, the same as the sealing resin 6, but may be different from the sealing resin 6. The support member 2 may also contain fillers such as silica mixed into the aforementioned resin material. The support member 2 may also be made of a single-crystal intrinsic semiconductor (for example, silicon (Si)), glass, or ceramic, instead of a resin material. The planar shape of the support member 2 is, for example, rectangular, as shown in Figures 2 to 4. The thickness of the support member 2 (dimension along the thickness direction z) is not limited, but is, for example, 30 μm or more and 300 μm or less. The support member 2 has a mounting surface 21, a back surface 22, and a plurality of side surfaces 23.

[0016] As shown in Figures 6 to 9, the mounting surface 21 and the back surface 22 are spaced apart in the thickness direction z. The mounting surface 21 and the back surface 22 face opposite each other. The mounting surface 21 is the upper surface of the support member 2, and the back surface 22 is the lower surface of the support member 2. The mounting surface 21 faces multiple electronic components 1. The back surface 22 faces the circuit board when the electronic device A10 is mounted on the circuit board. In this embodiment, the mounting surface 21 is covered with sealing resin 6, and the back surface 22 is exposed from the sealing resin 6. As shown in Figures 6 to 8, each of the multiple side surfaces 23 is sandwiched between the mounting surface 21 and the back surface 22. The upper end of each side surface 23 in the thickness direction z connects to the mounting surface 21, and the lower end of each side surface 23 in the thickness direction z connects to the back surface 22. Each side surface 23 is flat and perpendicular to the mounting surface 21 and the back surface 22, respectively. In this embodiment, the multiple sides 23 include those facing one side of the first direction x, those facing the other side of the first direction x, those facing one side of the second direction y, and those facing the other side of the second direction y.

[0017] Each of the multiple joints 3 connects one of the multiple wiring sections 4 to one of the multiple electronic components 1. The multiple electronic components 1 are electrically connected to the multiple wiring sections 4 via the multiple joints 3. Each of the multiple joints 3 is a conductive bonding material. The multiple joints 3 are, for example, solder. The solder contains an alloy containing tin (Sn) (for example, a Sn-silver (Ag) alloy) and also contains flux. Note that the composition of each of the multiple joints 3 is not limited to this example. Each of the multiple joints 3 may be a sintered metal or a conductive paste material instead of solder.

[0018] In this embodiment, as shown in Figures 3, 6, and 8, the multiple joints 3 include four joints 3A to 3D. Therefore, the electronic device A10 has four joints 3A to 3D. Joint 3A connects the electrode 11 of the first electronic component 1A to one of the multiple wiring sections 4, making them electrically connected. Joint 3B connects the electrode 12 of the first electronic component 1A to one of the multiple wiring sections 4, making them electrically connected. Joint 3C connects the electrode 11 of the second electronic component 1B to one of the multiple wiring sections 4, making them electrically connected. Joint 3D connects the electrode 12 of the second electronic component 1B to one of the multiple wiring sections 4, making them electrically connected.

[0019] As can be seen from Figures 8 and 9, each of the multiple joints 3 (multiple joints 3A to 3D) includes an intervening portion 31 and a fillet portion 32. In each joint 3, the intervening portion 31 and the fillet portion 32 are connected to each other and formed integrally. The intervening portion 31 is interposed between one of the electrodes 11, 12 of the multiple electronic components 1 and one of the multiple wiring portions 4. The thickness of the intervening portion 31 (dimension in the thickness direction z) is not limited, but for example, it is 5 μm or more and 50 μm or less. The fillet portion 32 is in contact with the side surface of one of the electrodes 11, 12 of the multiple electronic components 1. In the illustrated example, the side surface of the fillet portion 32 is an inclined surface with respect to the xy plane perpendicular to the thickness direction z, but it may be convex or concave.

[0020] The multiple wiring sections 4 are conductors arranged inside the electronic device A10. The multiple wiring sections 4 are spaced apart from each other. The multiple wiring sections 4 electrically connect the multiple electronic components 1 and the multiple terminals 5. Each of the multiple wiring sections 4 is formed on the mounting surface 21 of the support member 2. In the illustrated example, the multiple wiring sections 4 are arranged along the first direction x.

[0021] In this embodiment, the plurality of wiring sections 4 include a first wiring section 4A, a second wiring section 4B, and a third wiring section 4C, as shown in Figures 2 to 6 and Figure 8. Therefore, the electronic device A10 comprises a first wiring section 4A, a second wiring section 4B, and a third wiring section 4C. The number of plurality of wiring sections 4 in the electronic device of this disclosure is not limited in any way. The first wiring section 4A, the second wiring section 4B, and the third wiring section 4C are arranged along a first direction x. The second wiring section 4B is located on the other side of the first direction x relative to the first wiring section 4A, and the third wiring section 4C is located on one side of the first direction x relative to the first wiring section 4A. The first electronic component 1A is arranged across the first wiring section 4A and the second wiring section 4B. The second electronic component 1B is arranged across the first wiring section 4A and the third wiring section 4C.

[0022] As shown in Figure 8, each of the multiple wiring sections 4 (first wiring section 4A, second wiring section 4B, and third wiring section 4C) includes a main body 41 and at least one projection 42. In the illustrated example, the first wiring section 4A includes two projections 42, and the second wiring section 4B and third wiring section 4C each include one projection 42. The main body 41 and at least one projection 42 described below are common to each wiring section 4 (each of the first wiring section 4A, second wiring section 4B, and third wiring section 4C) unless otherwise specified. For ease of understanding, one of the two projections 42 formed on the first wiring section 4A is referred to as projection 421A, and the other of the two projections 42 on the first wiring section 4A is referred to as projection 421B. Furthermore, the projection 42 of the second wiring section 4B is referred to as projection 422, and the projection 42 of the third wiring section 4C is referred to as projection 423.

[0023] The main body 41 is in contact with the mounting surface 21. As shown in Figure 9, the main body 41 has, for example, a seed layer 401 and a plating layer 402. The seed layer 401 is formed on the mounting surface 21. The seed layer 401 contains, for example, titanium (Ti). The plating layer 402 is laminated on the seed layer 401. The plating layer 402 contains, for example, copper (Cu). In contrast to this configuration, the main body 41 may be a single layer made of a conductor. The thickness of the main body 41 (dimension z in the thickness direction) is not limited in any way, but is, for example, 10 μm or more and 100 μm or less.

[0024] The projection 42 protrudes upward in the thickness direction z from the main body 41. As shown in Figure 9, the projection 42 is formed on the upper surface (the surface facing upward in the thickness direction z) of the main body 41. The projection 42 contains the same material as, for example, the plating layer 402 of the main body 41. Therefore, in this embodiment, the projection 42 contains Cu. Unlike this example, the projection 42 may be configured to contain a different metallic material than the plating layer 402. In this embodiment, as shown in Figure 4, the projection 42 is rectangular in shape in plan view. As shown in Figure 4, in plan view, the joint 3A is surrounded by the projection 421A. In plan view, the joint 3B is surrounded by the projection 422. In plan view, the joint 3C is surrounded by the projection 423. In plan view, the joint 3D is surrounded by the projection 421B. The thickness of the projection 42 (dimension in the thickness direction z) is not limited in any way, but for example, it is 5 μm or more and 30 μm or less. The thickness of the projection 42 may be appropriately changed based on the thickness of the intervening portion 31 of each joint 3, provided that the thickness of the intervening portion 31 does not exceed the thickness of the projection 42.

[0025] As shown in Figures 4 and 8, the multiple wiring sections 4 configured as described above have a first surface 491, a second surface 492, a third surface 493, a fourth surface 494, a fifth surface 495, a sixth surface 496, a seventh surface 497, and an eighth surface 498. In this embodiment, the first wiring section 4A has a first surface 491, a second surface 492, a fifth surface 495, and a sixth surface 496, the second wiring section 4B has a third surface 493 and a fourth surface 494, and the third wiring section 4C has a seventh surface 497 and an eighth surface 498. For ease of understanding, in Figure 4, the first surface 491, the third surface 493, the fifth surface 495, and the seventh surface 497 are indicated by dots.

[0026] The first surface 491 is a part of the upper surface (the surface facing upward in the thickness direction z) of the first wiring section 4A. As shown in Figure 4, the first surface 491 is the portion of the upper surface of the first wiring section 4A that is demarcated by the projection 421A. The joint 3A overlaps the first surface 491 when viewed in the thickness direction z. In this embodiment, the joint 3A is in contact with the first surface 491. In the illustrated example, the first surface 491 is rectangular when viewed in the thickness direction z. The first surface 491 is flat. The first surface 491 is positioned in an xy plane perpendicular to the thickness direction z. This xy plane is called the "first virtual plane". As shown in Figure 4, the periphery of the first surface 491 when viewed in the thickness direction z has a first edge 491a, a pair of second edges 491b, and a third edge 491c.

[0027] As shown in Figure 4, the first edge 491a is located in one direction x relative to the electrode 11 of the first electronic component 1A when viewed in the thickness direction z. The first edge 491a extends in the second direction y when viewed in the thickness direction z.

[0028] As shown in Figure 4, each of the pair of second edges 491b extends in the first direction x when viewed in the thickness direction z. The pair of second edges 491b are spaced apart in the second direction y when viewed in the thickness direction z. In this embodiment, the pair of second edges 491b are parallel to each other when viewed in the thickness direction z. Each of the pair of second edges 491b connects to the first edge 491a.

[0029] As shown in Figure 4, the third edge 491c extends in the second direction y when viewed in the thickness direction z. The third edge 491c connects to each of the pair of second edges 491b. In this embodiment, the third edge 491c is parallel to the first edge 491a when viewed in the thickness direction z. The third edge 491c is located in the other direction x relative to the first edge 491a. The third edge 491c overlaps the first electronic component 1A when viewed in the thickness direction z.

[0030] The second surface 492 is the top surface (the surface facing upward in the thickness direction z) of the projection 421A. In this embodiment, since the plan view shape of the projection 421A is a rectangular annular shape, the plan view shape of the second surface 492 is also a rectangular annular shape. As shown in Figures 8 and 9, the second surface 492 is located one side (above) of the first surface 491 in the thickness direction z. As shown in Figure 4, the second surface 492 is located on at least a part of the periphery of the first surface 491 when viewed in the thickness direction z, and in this embodiment, it is located on the entire periphery of the first surface 491. Therefore, when viewed in the thickness direction z, the first surface 491 is surrounded by the second surface 492. The second surface 492 is flat. The second surface 492 is located on an xy-plane perpendicular to the thickness direction z, and is on an xy-plane different from the first virtual plane. This xy-plane is called the "second virtual plane". The second surface 492 has a first part 492a, a pair of second parts 492b, and a third part 492c.

[0031] As shown in Figure 4, the first part 492a is formed along the first edge 491a. The first part 492a is a strip-shaped structure that extends in the second direction y when viewed in the thickness direction z.

[0032] As shown in Figure 4, the pair of second parts 492b are formed individually along the pair of second edges 491b. Each of the pair of second parts 492b is a strip extending in the first direction x when viewed in the thickness direction z. In this embodiment, the pair of second parts 492b are parallel to each other in plan view.

[0033] As shown in Figure 4, the third portion 492c is formed along the third end edge 491c. In a plan view, the third portion 492c is a strip extending in the second direction y. In this embodiment, the third portion 492c is parallel to the first portion 492a in a plan view.

[0034] The third surface 493 is part of the upper surface (the surface facing upward in the thickness direction z) of the second wiring section 4B. As shown in Figure 4, the third surface 493 is the portion of the upper surface of the second wiring section 4B that is demarcated by the projection 422. The joint 3B overlaps the third surface 493 when viewed in the thickness direction z. In this embodiment, the joint 3B is in contact with the third surface 493. In the illustrated example, the third surface 493 is rectangular when viewed in the thickness direction z. The third surface 493 is flat. As shown in Figure 4, the periphery of the third surface 493 when viewed in the thickness direction z has a fourth edge 493a, a pair of fifth edges 493b, and a sixth edge 493c.

[0035] As shown in Figure 4, the fourth edge 493a is located in the other direction x of the electrode 12 of the first electronic component 1A when viewed in the thickness direction z. The fourth edge 493a extends in the second direction y when viewed in the thickness direction z.

[0036] As shown in Figure 4, each of the pair of fifth edges 493b extends in the first direction x when viewed in the thickness direction z. The pair of fifth edges 493b are spaced apart in the second direction y when viewed in the thickness direction z. In this embodiment, the pair of second edges 491b are parallel to each other when viewed in the thickness direction z. Each of the pair of fifth edges 493b connects to the fourth edge 493a.

[0037] As shown in Figure 4, the sixth edge 493c extends in the second direction y when viewed in the thickness direction z. The sixth edge 493c connects to each of the pair of fifth edges 493b. In this embodiment, the sixth edge 493c is parallel to the fourth edge 493a when viewed in the thickness direction z. The sixth edge 493c is located in one of the first directions x relative to the fourth edge 493a. The sixth edge 493c overlaps the first electronic component 1A when viewed in the thickness direction z.

[0038] The fourth surface 494 is the top surface (the surface facing upward in the thickness direction z) of the projection 422. In this embodiment, since the plan view shape of the projection 422 is rectangular annular, the plan view shape of the fourth surface 494 is also rectangular annular. As shown in Figure 8, the fourth surface 494 is located one side (above) of the third surface 493 in the thickness direction z. As shown in Figure 4, the fourth surface 494 is located on at least a part of the periphery of the third surface 493 when viewed in the thickness direction z, and in this embodiment, it is located on the entire periphery of the third surface 493. Therefore, when viewed in the thickness direction z, the third surface 493 is surrounded by the fourth surface 494. The fourth surface 494 is flat. As shown in Figure 4, the fourth surface 494 has a fourth part 494a, a pair of fifth parts 494b, and a sixth part 494c.

[0039] As shown in Figure 4, the fourth section 494a is formed along the fourth end edge 493a. The fourth section 494a is a strip-shaped section that extends in the second direction y when viewed in the thickness direction z.

[0040] As shown in Figure 4, the pair of fifth sections 494b are formed individually along the pair of fifth edges 493b. Each of the pair of fifth sections 494b is a strip extending in the first direction x in plan view. In this embodiment, the pair of fifth sections 494b are parallel to each other in plan view.

[0041] As shown in Figure 4, the sixth section 494c is formed along the sixth edge 493c. In plan view, the sixth section 494c is a strip extending in the second direction y. In this embodiment, in plan view, the sixth section 494c is parallel to the fourth section 494a.

[0042] The fifth surface 495 is part of the upper surface (the surface facing upward in the thickness direction z) of the first wiring section 4A. As shown in Figure 4, the fifth surface 495 is the portion of the upper surface of the first wiring section 4A that is demarcated by the projection 421B. The joint 3D overlaps the fifth surface 495 when viewed in the thickness direction z. In this embodiment, the joint 3D is in contact with the fifth surface 495. In the illustrated example, the fifth surface 495 is rectangular in plan view. The fifth surface 495 is flat. The fifth surface 495, together with the first surface 491, is arranged on the aforementioned first virtual plane. The fifth surface 495 is flat. The fifth surface 495, together with the first surface 491, is arranged on the aforementioned first virtual plane. Unlike this configuration, the fifth surface 495 may be arranged on an xy plane different from the first virtual plane. In other words, the first surface 491 and the fifth surface 495 do not have to overlap when viewed in the first direction x. As shown in Figure 4, the periphery of the fifth surface 495 when viewed in the thickness direction z has a seventh edge 495a, a pair of eighth edges 495b, and a ninth edge 495c.

[0043] As shown in Figure 4, the seventh edge 495a is located in the other direction x of the electrode 12 of the second electronic component 1B when viewed in the thickness direction z. In plan view, the seventh edge 495a extends in the second direction y.

[0044] As shown in Figure 4, each of the pair of eighth edges 495b extends in the first direction x in a plan view. The pair of eighth edges 495b are spaced apart in the second direction y in a plan view. In this embodiment, the pair of eighth edges 495b are parallel to each other when viewed in the thickness direction z. Each of the pair of eighth edges 495b connects to the seventh edge 495a.

[0045] As shown in Figure 4, the ninth edge 495c extends in the second direction y in a plan view. The ninth edge 495c connects to each of the pair of eighth edges 495b. In this embodiment, the ninth edge 495c is parallel to the seventh edge 495a when viewed in the thickness direction z. The ninth edge 495c is located in one of the first directions x relative to the seventh edge 495a. The ninth edge 495c overlaps the second electronic component 1B when viewed in the thickness direction z.

[0046] The sixth surface 496 is the top surface (the surface facing upward in the thickness direction z) of the projection 421B. In this embodiment, since the plan view shape of the projection 421B is rectangular annular, the plan view shape of the sixth surface 496 is also rectangular annular. As shown in Figures 8 and 9, the sixth surface 496 is located one side (above) of the fifth surface 495 in the thickness direction z. As shown in Figure 4, the sixth surface 496 is located on at least a part of the periphery of the fifth surface 495 when viewed in the thickness direction z, and in this embodiment, it is located on the entire periphery of the fifth surface 495. Therefore, when viewed in the thickness direction z, the fifth surface 495 is surrounded by the sixth surface 496. The sixth surface 496 is flat. The sixth surface 496, together with the second surface 492, is located on the second virtual plane described above. In contrast to this configuration, the sixth surface 496 may be located on an xy plane different from the second virtual plane. In other words, the second surface 492 and the sixth surface 496 do not have to overlap when viewed in the first direction x. The sixth surface 496 is separate from the second surface 492. As shown in Figure 4, the sixth surface 496 has a seventh section 496a, a pair of eighth sections 496b, and a ninth section 496c.

[0047] As shown in Figure 4, the seventh section 496a is formed along the seventh edge 495a. In a plan view, the seventh section 496a is a band extending in the second direction y.

[0048] As shown in Figure 4, the pair of eighth sections 496b are formed individually along the pair of eighth edges 495b. Each of the pair of eighth sections 496b is a strip extending in the first direction x in a plan view. In this embodiment, the pair of eighth sections 496b are parallel to each other in a plan view.

[0049] As shown in Figure 4, the ninth section 496c is formed along the ninth edge 495c. In plan view, the ninth section 496c is a strip extending in the second direction y. In this embodiment, the ninth section 496c is parallel to the seventh section 496a in plan view.

[0050] The seventh surface 497 is part of the upper surface (the surface facing upward in the thickness direction z) of the third wiring section 4C. As shown in Figure 4, the seventh surface 497 is the portion of the upper surface of the third wiring section 4C that is demarcated by the projection 423. The joint 3C overlaps the seventh surface 497 when viewed in the thickness direction z. In this embodiment, the joint 3C is in contact with the seventh surface 497. In the illustrated example, the seventh surface 497 is rectangular when viewed in the thickness direction z. The seventh surface 497 is flat. As shown in Figure 4, the periphery of the seventh surface 497 when viewed in the thickness direction z has a tenth edge 497a, a pair of eleventh edges 497b, and a twelfth edge 497c.

[0051] As shown in Figure 4, the tenth edge 497a is located in one direction (x) relative to the electrode 11 of the second electronic component 1B when viewed in the thickness direction (z). The tenth edge 497a extends in the second direction (y) when viewed in the thickness direction (z).

[0052] As shown in Figure 4, each of the pair of 11th edges 497b extends in the first direction x when viewed in the thickness direction z. The pair of 11th edges 497b are spaced apart in the second direction y when viewed in the thickness direction z. In this embodiment, the pair of 11th edges 497b are parallel to each other when viewed in the thickness direction z. Each of the pair of 11th edges 497b connects to the 12th edge 497c.

[0053] As shown in Figure 4, the twelfth edge 497c extends in the second direction y when viewed in the thickness direction z. The twelfth edge 497c connects to each of the pair of eleventh edges 497b. In this embodiment, the twelfth edge 497c is parallel to the tenth edge 497a when viewed in the thickness direction z. The twelfth edge 497c is located in the other direction x relative to the tenth edge 497a. The twelfth edge 497c overlaps the second electronic component 1B when viewed in the thickness direction z.

[0054] The eighth surface 498 is the top surface (the surface facing upward in the thickness direction z) of the projection 423. In this embodiment, since the plan view shape of the projection 423 is rectangular annular, the plan view shape of the eighth surface 498 is also rectangular annular. As shown in Figure 8, the eighth surface 498 is located one side (above) of the seventh surface 497 in the thickness direction z. As shown in Figure 4, the eighth surface 498 is located on at least a part of the periphery of the seventh surface 497 when viewed in the thickness direction z, and in this embodiment, it is located on the entire periphery of the seventh surface 497. Therefore, when viewed in the thickness direction z, the seventh surface 497 is surrounded by the eighth surface 498. The eighth surface 498 is flat. The eighth surface 498 has a tenth part 498a, a pair of eleventh parts 498b, and a twelfth part 498c.

[0055] As shown in Figure 4, the tenth section 498a is formed along the tenth edge 497a. The tenth section 498a is a strip-shaped section that extends in the second direction y when viewed in the thickness direction z.

[0056] As shown in Figure 4, the pair of 11th sections 498b are formed individually along the pair of 11th edges 497b. Each of the pair of 11th sections 498b is a strip extending in the first direction x in plan view. In this embodiment, the pair of 11th sections 498b are parallel to each other in plan view.

[0057] As shown in Figure 4, the 12th section 498c is formed along the 12th edge 497c. In plan view, the 12th section 498c is a strip extending in the second direction y. In this embodiment, in plan view, the 12th section 498c is parallel to the 10th section 498a.

[0058] Each of the multiple terminals 5 is electrically connected to one of the multiple wiring sections 4 and is a conductor exposed to the outside of the electronic device A10. Each of the multiple terminals 5 becomes a terminal when the electronic device A10 is mounted on a circuit board. As shown in Figures 6 and 8, each of the multiple terminals 5 penetrates the support member 2 in the thickness direction z. In the illustrated example, the electronic device A10 has two terminals 5. As shown in Figure 8, one of the two terminals 5 is in contact with the second wiring section 4B, and the other of the two terminals 5 is in contact with the third wiring section 4C. Unlike this example, the electronic device A10 may further have a terminal 5 that is in contact with the first wiring section 4A.

[0059] Each of the multiple terminals 5 includes a columnar portion 51 and an external electrode portion 52, as shown in Figures 6 and 8. The columnar portion 51 and external electrode portion 52 described below are common to each terminal 5 unless otherwise specified.

[0060] As shown in Figure 8, the columnar portion 51 penetrates the support member 2 in the thickness direction z. The columnar portion 51 includes, for example, a metal material. The metal material is not limited in any way, but for example, Cu. The plan view shape of the columnar portion 51 is not limited in any way, but in the illustrated example it is rectangular. The upper surface of the columnar portion 51 (the surface facing upward in the thickness direction z) is flush with, for example, the mounting surface 21 of the support member 2. This upper surface of the columnar portion 51 is in contact with one of the plurality of wiring portions 4. Note that some of the plurality of terminals 5 may have a columnar portion 51 whose upper surface is not in contact with any of the plurality of wiring portions 4. Such terminals 5 are dummy terminals. The lower surface of the columnar portion 51 (the surface facing downward in the thickness direction z) is exposed from the support member 2. This lower surface of the columnar portion 51 is flush with, for example, the back surface 22 of the support member 2. In this embodiment, the side surface of the columnar portion 51 (the surface facing the first direction x or the second direction y) of all terminals 5 is covered by the support member 2. However, unlike this example, some terminals 5 may have exposed side surfaces of the columnar portion 51.

[0061] As shown in Figure 8, the external electrode portion 52 contacts the portion of the columnar portion 51 that is exposed from the back surface 22 of the support member 2. As shown in Figures 6 to 8, the external electrode portion 52 protrudes from the back surface 22. The external electrode portion 52 is formed by electroless plating. The external electrode portion 52 is composed of multiple metal layers stacked in the order of Ni layer, palladium (Pd) layer, and gold (Au) layer from the side in contact with the columnar portion 51. The external electrode portion 52 can also be composed of multiple metal layers stacked in the order of Ni layer, Au layer from the side in contact with the columnar portion 51, or multiple metal layers stacked in the order of Cu layer, Ag layer, and Sn layer. The material and formation method of the external electrode portion 52 are not limited to these examples.

[0062] The sealing resin 6 is a synthetic resin, for example, primarily composed of black epoxy resin. The sealing resin 6 may contain fillers such as silica mixed into the epoxy resin. As shown in Figures 1, 2, and 5-8, the sealing resin 6 covers a plurality of electronic components 1, a plurality of joints 3, and a plurality of wiring parts 4. Also, as shown in Figures 6-8, the sealing resin 6 covers a portion of the support member 2. The sealing resin 6 is formed on the mounting surface 21. The sealing resin 6 is rectangular in shape when viewed from above. The thickness of the sealing resin 6 (dimension along the thickness direction z) is not limited, but is for example 300 μm or more and 1200 μm or less. As shown in Figures 1, 2, and 6-8, the sealing resin 6 has a main resin surface 61, a resin back surface 62, and a plurality of resin side surfaces 63.

[0063] As shown in Figures 6 to 8, the resin main surface 61 and the resin back surface 62 are spaced apart in the thickness direction z. The resin main surface 61 and the resin back surface 62 face opposite each other in the thickness direction z. The resin main surface 61 faces the same direction as the mounting surface 21 in the thickness direction z, and the resin back surface 62 faces the same direction as the back surface 22 in the thickness direction z. The resin back surface 62 is in contact with the mounting surface 21. The resin back surface 62 has irregularities according to the shape of the multiple wiring sections 4. As shown in Figures 1, 2 and 6 to 8, each of the multiple resin side surfaces 63 is sandwiched between the resin main surface 61 and the resin back surface 62 in the thickness direction z, and is connected to them. The multiple resin side surfaces 63 are flush with one of the corresponding side surfaces 23.

[0064] Next, an example of a manufacturing method for the electronic device A10 will be described with reference to Figures 10 to 18. Figures 10 to 18 are cross-sectional views showing one step in the manufacturing method of the electronic device A10. These cross-sectional views correspond to the cross-section shown in Figure 8.

[0065] First, as shown in Figure 10, a support substrate 80 is prepared, and a plurality of columnar portions 51 are formed on the support substrate 80. The support substrate 80 includes, for example, a single-crystal intrinsic semiconductor material. The semiconductor material is, for example, Si. In the step of preparing the support substrate 80, for example, a silicon wafer is prepared as the support substrate 80. The support substrate 80 has a main substrate surface 80a and a back surface 80b that face opposite each other in the thickness direction z. The plurality of columnar portions 51 are formed by, for example, the following steps. First, a seed layer is formed on the main substrate surface 80a. The seed layer is formed by, for example, a sputtering method. Then, a resist is patterned on the seed layer, and a plurality of columnar portions 51 are formed by electroplating. After that, the resist layer and the unnecessary seed layer are removed. Through these steps, a plurality of columnar portions 51 are formed on the main substrate surface 80a of the support substrate 80.

[0066] Next, as shown in Figure 11, a support member 2 (resin layer) is formed on the main surface 80a of the support substrate 80, covering the multiple columnar portions 51. The support member 2 (resin layer) is formed, for example, by molding. The support member 2 (resin layer) is, for example, a synthetic resin mainly composed of black epoxy resin. The support member 2 (resin layer) may be made of other insulating resin materials instead of the aforementioned synthetic resin. The support member 2 (resin layer) has a mounting surface 21 and a back surface 22 that face opposite each other in the thickness direction z. The mounting surface 21 faces the same direction as the main surface 80a of the substrate, and the back surface 22 faces the main surface 80a of the substrate.

[0067] Next, as shown in Figure 12, the support member 2 (resin layer) is ground. The grinding of the support member 2 is performed from the mounting surface 21 downward in the thickness direction z until the columnar portion 51 is exposed. The method of grinding is not particularly limited. Alternatively, the support member 2 may be reduced in height by a method other than grinding.

[0068] Next, as shown in Figure 13, a plurality of wiring sections 4 are formed. The plurality of wiring sections 4 are formed by, for example, the following steps. First, a seed layer 401 is formed on the mounting surface 21 and each columnar section 51. The seed layer 401 is formed by, for example, a sputtering method. For example, a Ti layer and a Cu layer are stacked in order as the seed layer 401. Next, a resist is patterned on the seed layer 401 and a plating layer 402 is formed by electroplating. For example, the plating layer 402 contains Cu. Next, a resist is patterned on the plating layer 402 and a plurality of protrusions 42 (a plurality of protrusions 421A, 421B, 422, 423) are formed by electroplating. After that, the resist and unnecessary seed layers 401 (seed layers 401 exposed from the plating layer 402) are removed. Through these steps, a plurality of wiring sections 4 (first wiring section 4A, second wiring section 4B, and third wiring section 4C) are formed.

[0069] Next, as shown in Figure 14, multiple joints 3 are formed. In the process of forming multiple joints 3, for example, solder paste for each joint 3 is formed on multiple wiring sections 4 by screen printing. At this time, joints 3 (corresponding joints 3A, 3B, 3C, 3D) are formed in the areas demarcated by the respective protrusions 421A, 421B, 422, 423. When multiple joints 3 are printed, the thickness of each joint 3 (dimension in the thickness direction z) is approximately 100 μm. This thickness of joint 3 corresponds to the thickness of the metal mask used in screen printing. The area where each joint 3 is printed is smaller than the joint 3 in the solidified state in a later process, in a plan view.

[0070] Next, as shown in Figure 15, multiple electronic components 1 are mounted, and then the multiple electronic components 1 are joined together. As shown in Figure 15, in the process of mounting multiple electronic components 1, the electrode 11 of the first electronic component 1A and the joint 3A are placed in correspondence with each other, the electrode 12 of the first electronic component 1A and the joint 3B are placed in correspondence with each other, the electrode 11 of the second electronic component 1B and the joint 3C are placed in correspondence with each other, and the electrode 12 of the second electronic component 1B and the joint 3D are placed in correspondence with each other. After that, reflow is performed with each electronic component 1 (first electronic component 1A and second electronic component 1B) in place. The heat from this reflow melts each joint 3A to 3D, making each joint 3A to 3D more fluid than when they were in a paste-like state. Next, the molten joints 3A to 3D are cooled. As a result, each joint 3A to 3D solidifies, and each electronic component 1 (first electronic component 1A and second electronic component 1B) is joined together. Intervening portions 31 and fillet portions 32 are formed in each of the joint portions 3A to 3D that are formed.

[0071] Next, as shown in Figure 16, a sealing resin 6 is formed. The sealing resin 6 is formed above the support member 2 so as to cover the multiple electronic components 1 and the multiple wiring sections 4. The sealing resin 6 is formed, for example, by mold molding. The sealing resin 6 is, for example, a synthetic resin mainly composed of black epoxy resin. The sealing resin 6 may be made of other insulating resin materials instead of the aforementioned synthetic resin. The sealing resin 6 has a resin main surface 61 facing one side in the thickness direction z. In order to reduce the height of the sealing resin 6, the sealing resin 6 may be ground downward in the thickness direction z from the resin main surface 61 to the extent that each electronic component 1 is not exposed.

[0072] Next, as shown in Figure 17, the support substrate 80 is removed. In removing the support substrate 80, for example, in the state shown in Figure 16, the support substrate 80 is ground from the back surface 80b side of the substrate. This grinding is performed on the support substrate 80 from the back surface 80b side of the substrate. In the illustrated example, this grinding is continued even after the removal of the support substrate 80 to reduce the height of the support member 2 and the columnar portion 51. This height reduction is optional.

[0073] Next, as shown in Figure 18, an external electrode portion 52 is formed. The external electrode portion 52 is formed on the top surface of the columnar portion 51 that is exposed from the back surface 22. The external electrode portion 52 is formed, for example, by electroless plating. In this electroless plating, a Ni layer, a Pd layer, and an Au layer are stacked in that order from the side in contact with the columnar portion 51. This forms a plurality of terminals 5, each including a columnar portion 51 and an external electrode portion 52.

[0074] Subsequently, the sealing resin 6 is cut along the cutting line CL shown in Figure 18 to separate it into individual pieces. The sealing resin 6 is cut, for example, by cutting using a dicing blade.

[0075] Through the above steps, the electronic device A10 shown in Figures 1 to 9 is manufactured. However, the manufacturing method of the electronic device A10 is not limited to the examples described above. For example, if the support member 2 contains a single-crystal intrinsic semiconductor (e.g., Si), it is manufactured as follows: Grooves are formed in the support substrate 80 (silicon wafer) by etching or the like. Next, a plurality of columnar portions 51 are formed in the grooves. Then, a plurality of wiring portions 4 are formed without forming the support member 2 (resin layer). Furthermore, after the formation of the sealing resin 6, instead of removing the support substrate 80, it is ground until the plurality of columnar portions 51 formed in the grooves are exposed. By changing the process in this way, an electronic device A10 in which the support member 2 is made of a semiconductor material is manufactured.

[0076] The operation and effects of electronic device A10 are as follows:

[0077] The electronic device A10 comprises a first electronic component 1A, a first wiring section 4A, and a joint section 3A. The first wiring section 4A has a first surface 491 and a second surface 492. The second surface 492 is located one side (above) the first surface 491 in the thickness direction z. The second surface 492 is located on at least a portion of the periphery of the first surface 491 when viewed in the thickness direction z. The joint section 3A overlaps the first surface 491 when viewed in the thickness direction z, and joins the electrode 11 of the first electronic component 1A to the first wiring section 4A. With this configuration, in the first wiring section 4A, at least a portion of the periphery of the first surface 491 on which the joint section 3A is formed (the portion having the second surface 492) protrudes one side (above) in the thickness direction z. In other words, a step is created between the first surface 491 and the second surface 492. This protruding portion (the portion having the second surface 492) blocks the outflow of the joint 3A, thereby ensuring an appropriate thickness (dimension in the thickness direction z) of the joint 3A. As a result, the electronic device A10 can suppress insufficient thickness of the joint 3A, thereby suppressing a decrease in joint strength and electrical conductivity between the electrode 11 of the first electronic component 1A and the first wiring portion 4A. In other words, the electronic device A10 can suppress a decrease in reliability.

[0078] In the electronic device A10, the first wiring section 4A includes a main body 41 having a first surface 491 and a projection 421A having a second surface 492. The projection 421A protrudes from the main body 41 in one direction (upwards) in the thickness direction z. With this configuration, the second surface 492 can be positioned above the first surface 491 in one direction (upwards) in the thickness direction z.

[0079] In the electronic device A10, the electrode 11 of the first electronic component 1A is located at one end of the first electronic component 1A in the first direction x. The periphery of the first surface 491 has a first edge 491a that is located in the first direction x relative to the electrode 11 of the first electronic component 1A when viewed in the thickness direction z, and extends in the second direction y. The second surface 492 has a first portion 492a formed along the first edge 491a. This configuration makes it possible to suppress the outflow of the joint 3A toward one side of the first direction x (i.e., outward toward the first electronic component 1A). When the joint 3A is formed, the heat of reflow temporarily increases the fluidity of the joint 3A compared to when it is pasted. At this time, the joint 3A expands due to the weight of the first electronic component 1A. The expansion of this joint 3A is more likely to spread in one direction x (outside the first electronic component 1A) than in the other direction x (inside the first electronic component 1A). Therefore, the presence of the first portion 492a on the second surface 492 can suppress the outflow of the joint 3A.

[0080] In the electronic device A10, the second surface 492 is formed along the entire periphery of the first surface 491. In this configuration, outflow of the joint 3A can be suppressed in both the first direction x and the second direction y, so the electronic device A10 is a preferred structure for suppressing insufficient thickness of the joint 3A. In other words, the electronic device A10 is a preferred structure for suppressing a decrease in reliability.

[0081] In the electronic device A10, the second wiring section 4B has a third surface 493 and a fourth surface 494. The fourth surface 494 is located one side (above) the third surface 493 in the thickness direction z. The fourth surface 494 is located on at least a portion of the periphery of the third surface 493 when viewed in the thickness direction z. The joint 3B overlaps the third surface 493 when viewed in the thickness direction z, and joins the electrode 12 of the first electronic component 1A to the first wiring section 4A. With this configuration, a step is created between the third surface 493 and the fourth surface 494, similar to the joint 3A, which can block the outflow of the joint 3B, thus ensuring an appropriate thickness (dimension in the thickness direction z) of the joint 3B. As a result, the electronic device A10 can suppress insufficient thickness of the joint 3B, thereby suppressing a decrease in bonding strength and electrical conductivity between the electrode 12 of the first electronic component 1A and the second wiring section 4B. In other words, the electronic device A10 can suppress a decrease in reliability. In particular, in the electronic device A10, the fourth surface 494 is formed along the entire periphery of the third surface 493. With this configuration, outflow of the joint 3B can be suppressed in both the first direction x and the second direction y, so the electronic device A10 is a preferred structure for suppressing insufficient thickness of the joint 3B. In other words, the electronic device A10 is a preferred structure for suppressing a decrease in reliability. Furthermore, in the electronic device A10, insufficient thickness of both joints 3A and 3B can be suppressed, so the first electronic component 1A can not be joined in an inclined position.

[0082] In the electronic device A10, the first wiring section 4A has a fifth surface 495 and a sixth surface 496. The sixth surface 496 is located one side (above) the fifth surface 495 in the thickness direction z. The sixth surface 496 is positioned on at least a portion of the periphery of the fifth surface 495 when viewed in the thickness direction z. The joint 3D overlaps the fifth surface 495 when viewed in the thickness direction z, and joins the electrode 12 of the second electronic component 1B to the first wiring section 4A. With this configuration, a step is created between the fifth surface 495 and the sixth surface 496, similar to the joints 3A and 3B, which can block the outflow of the joint 3D, thus ensuring an appropriate thickness (dimension in the thickness direction z) of the joint 3D. As a result, the electronic device A10 can suppress insufficient thickness of the junction 3D, thereby suppressing a decrease in the bonding strength and electrical conductivity between the electrode 12 of the second electronic component 1B and the first wiring section 4A. In other words, the electronic device A10 can suppress a decrease in reliability. In particular, in the electronic device A10, the sixth surface 496 is formed along the entire periphery of the fifth surface 495. In this configuration, outflow of the junction 3D can be suppressed in both the first direction x and the second direction y, so the electronic device A10 is a preferred structure for suppressing insufficient thickness of the junction 3D. In other words, the electronic device A10 is a preferred structure for suppressing a decrease in reliability.

[0083] In the electronic device A10, both the electrode 11 of the first electronic component 1A and the electrode 12 of the second electronic component 1B are joined to the first wiring section 4A. In this configuration, two joints 3A and 3D are located on the first wiring section 4A, and if each joint 3A and 3D flows out, the two joints 3A and 3D become one. Such integration promotes the flow out of each joint 3A and 3D. In other words, in a configuration where two joints 3A and 3D are located on a common first wiring section 4A, each joint 3A and 3D is more likely to be thinner than each joint 3B and 3C. Therefore, placing the second surface 492 and the sixth surface 496 between the two joints 3A and 3D is preferable in suppressing the thickness deficiency of each joint 3A and 3D. In other words, the electronic device A10 has a preferable structure in suppressing a decrease in reliability.

[0084] In the electronic device A10, the third wiring section 4C has a seventh surface 497 and an eighth surface 498. The eighth surface 498 is located one side (above) of the seventh surface 497 in the thickness direction z. The eighth surface 498 is located on at least a portion of the periphery of the seventh surface 497 when viewed in the thickness direction z. The joint 3C overlaps the seventh surface 497 when viewed in the thickness direction z, and joins the electrode 11 of the second electronic component 1B to the third wiring section 4C. With this configuration, a step is created between the seventh surface 497 and the eighth surface 498, similar to each joint 3A, 3B, and 3D, which can prevent the outflow of the joint 3C, thus ensuring an appropriate thickness (dimension in the thickness direction z) of the joint 3C. As a result, the electronic device A10 can suppress insufficient thickness of the joint 3C, thereby suppressing a decrease in bonding strength and electrical conductivity between the electrode 11 of the second electronic component 1B and the third wiring portion 4C. In other words, the electronic device A10 can suppress a decrease in reliability. In particular, in the electronic device A10, the eighth surface 498 is formed along the entire periphery of the seventh surface 497. In this configuration, outflow of the joint 3C can be suppressed in both the first direction x and the second direction y, so the electronic device A10 is a preferred structure for suppressing insufficient thickness of the joint 3C. In other words, the electronic device A10 is a preferred structure for suppressing a decrease in reliability. Furthermore, in the electronic device A10, insufficient thickness of both joints 3C and 3D can be suppressed, so the second electronic component 1B can be bonded in an inclined position.

[0085] In the electronic device A10, the thickness (dimension in the thickness direction z) of each protrusion 42 (each of the multiple protrusions 421A, 421B, 422, and 423) is between 3 μm and 30 μm. This configuration allows for the suppression of outflow from each joint 3 (each of the multiple joints 3A to 3D).

[0086] Other embodiments and modifications of the electronic device of this disclosure are described below. The configurations of the parts in each embodiment and each modification are interchangeable to the extent that no technical inconsistencies arise.

[0087] Figure 19 shows an electronic device A11 according to a first modification of the first embodiment. Compared to electronic device A10, electronic device A11 differs in the formation range of the second surface 492, the fourth surface 494, the sixth surface 496, and the eighth surface 498.

[0088] In electronic device A11, the second surface 492 does not have either the pair of second parts 492b and third parts 492c, but only has the first part 492a. The fourth surface 494 does not have either the pair of fifth parts 494b and sixth parts 494c, but only has the fourth part 494a. The sixth surface 496 does not have either the pair of eighth parts 496b and ninth parts 496c, but only has the seventh part 496a. The eighth surface 498 does not have either the pair of eleventh parts 498b and twelfth parts 498c, but only has the tenth part 498a. Therefore, in electronic device A11, as shown in Figure 19, the multiple protrusions 421A, 421B, 422, and 423 are each strip-shaped, extending in the second direction y when viewed in the thickness direction z.

[0089] Figure 20 shows an electronic device A12 according to a second modification of the first embodiment. Compared with the electronic devices A10 and A11, the formation range of the second surface 492, the fourth surface 494, the sixth surface 496, and the eighth surface 498 of the electronic device A12 is different.

[0090] In electronic device A13, the second surface 492 does not have a third part 492c, but has a first part 492a and a pair of second parts 492b. The fourth surface 494 does not have a sixth part 494c, but has a fourth part 494a and a pair of fifth parts 494b. The sixth surface 496 does not have a ninth part 496c, but has a seventh part 496a and a pair of eighth parts 496b. The eighth surface 498 does not have a twelfth part 498c, but has a tenth part 498a and a pair of eleventh parts 498b. Therefore, in electronic device A13, as shown in Figure 20, the multiple protrusions 421A, 421B, 422, and 423 each have a rectangular annular shape with one side open when viewed in the thickness direction z.

[0091] In addition, in an example different from the above-mentioned electronic devices A11 and A12, the second surface 492 may be configured as follows. In the example where the first surface 491 is rectangular when viewed in the thickness direction z, the second surface 492 only needs to have one or more of the following: a first part 492a, a pair of second parts 492b, and a third part 492c. In this case, considering the direction in which the joint 3A is likely to flow out, one or more of the following should be provided: a first part 492a, a pair of second parts 492b, and a third part 492c. The same applies to each of the fourth surface 494, sixth surface 496, and eighth surface 498.

[0092] Figure 21 shows an electronic device A13 according to a third modification of the first embodiment. Electronic device A13 differs from electronic device A10 in the following respect: the two protrusions 421A and 421B are connected to each other.

[0093] In the electronic device A13, the first wiring section 4A further includes a projection 421C. As shown in Figure 21, the projection 421C is sandwiched between two projections 421A and 421B and connected to each of them. In this configuration, the two projections 421A and 421B are connected to each other via the projection 421C. Furthermore, in the electronic device A13, the second surface 492 and the sixth surface 496 are connected to each other via the upper surface (the surface facing upward in the thickness direction z) of the projection 421C.

[0094] In addition, while the example of electronic device A13 shows the addition of the protrusion 421C to electronic device A10, the protrusion 421C may also be added to each of the electronic devices A11 and A12. For example, Figure 22 shows an example of adding the protrusion 421C to electronic device A11.

[0095] In each electronic device A11 to A13, similar to electronic device A10, the first wiring section 4A has a first surface 491 and a second surface 492, thus suppressing insufficient thickness of the joint 3A. Also, in each electronic device A11 to A13, similar to electronic device A10, the second wiring section 4B has a third surface 493 and a fourth surface 494, thus suppressing insufficient thickness of the joint 3B. Also, in each electronic device A11 to A13, similar to electronic device A10, the first wiring section 4A has a fifth surface 495 and a sixth surface 496, thus suppressing insufficient thickness of the joint 3D. Also, in each electronic device A11 to A13, similar to electronic device A10, the third wiring section 4C has a seventh surface 497 and an eighth surface 498, thus suppressing insufficient thickness of the joint 3C. Therefore, each electronic device A11 to A13, similar to electronic device A10, can suppress a decrease in reliability. Furthermore, each of the electronic devices A11 to A13 has a configuration common to that of electronic device A10 and therefore produces the same effect as electronic device A10.

[0096] Figures 23 and 24 show an electronic device A20 according to a second embodiment. Electronic device A20 differs from electronic device A10 in the following respect: Electronic device A20 comprises a plurality of plating layers 71A to 71D.

[0097] Each of the multiple plating layers 71A to 71D contains a metallic material that has higher wettability to each joint 3 than, for example, the surface layer (i.e., plating layer 402) of the main body portion 41 of each wiring portion 4. This metallic material is, for example, Ni. As shown in Figure 24, each of the plating layers 71A to 71D is formed on the plating layer 402 of the main body portion 41.

[0098] The plating layer 71A is interposed between the first surface 491 and the joint 3A. Viewed in the thickness direction z, the periphery of the plating layer 71A is contained within the region demarcated by the second surface 492. This region corresponds to substantially the entirety of the first surface 491. In other words, the plating layer 71A is smaller than the region demarcated by the second surface 492 (i.e., the first surface 491) when viewed in the thickness direction z. Unlike this example, the plating layer 71A may be formed over the entire region demarcated by the second surface 492 (i.e., the first surface 491) when viewed in the thickness direction z. In the illustrated example, the joint 3A is formed outside the plating layer 71A when viewed in the thickness direction z, but the entirety of the joint 3A may be formed on the plating layer 71A.

[0099] The plating layer 71B is interposed between the third surface 493 and the joint 3B. Viewed in the thickness direction z, the periphery of the plating layer 71B is contained within the region demarcated by the fourth surface 494. This region corresponds to substantially the entirety of the fourth surface 494. In other words, the plating layer 71B is smaller than the region demarcated by the fourth surface 494 (i.e., the third surface 493) when viewed in the thickness direction z. Unlike this example, the plating layer 71B may be formed over the entire region demarcated by the fourth surface 494 (i.e., the third surface 493) when viewed in the thickness direction z. In the illustrated example, the joint 3B is formed outside the plating layer 71B when viewed in the thickness direction z, but the entirety of the joint 3B may be formed on the plating layer 71B.

[0100] The plating layer 71C is interposed between the fifth surface 495 and the joint 3D. Viewed in the thickness direction z, the periphery of the plating layer 71C is contained within the region demarcated by the sixth surface 496. This region corresponds to substantially the entirety of the fifth surface 495. In other words, the plating layer 71C is smaller than the region demarcated by the sixth surface 496 (i.e., the fifth surface 495) when viewed in the thickness direction z. Unlike this example, the plating layer 71C may be formed over the entire region demarcated by the sixth surface 496 (i.e., the fifth surface 495) when viewed in the thickness direction z. In the illustrated example, the joint 3D is formed outside the plating layer 71C when viewed in the thickness direction z, but the entirety of the joint 3D may be formed on the plating layer 71C.

[0101] The plating layer 71D is interposed between the seventh surface 497 and the joint 3C. Viewed in the thickness direction z, the periphery of the plating layer 71D is contained within the region demarcated by the eighth surface 498. This region corresponds to substantially the entirety of the seventh surface 497. In other words, the plating layer 71D is smaller than the region demarcated by the eighth surface 498 (i.e., the seventh surface 497) when viewed in the thickness direction z. Unlike this example, the plating layer 71D may be formed over the entire region demarcated by the eighth surface 498 (i.e., the seventh surface 497) when viewed in the thickness direction z. In the illustrated example, the joint 3C is formed outside the plating layer 71D when viewed in the thickness direction z, but the entirety of the joint 3C may be formed on the plating layer 71D.

[0102] In electronic device A20, similar to electronic device A10, the first wiring section 4A has a first surface 491 and a second surface 492, thus suppressing insufficient thickness of the joint 3A. Also, in electronic device A20, similar to electronic device A10, the second wiring section 4B has a third surface 493 and a fourth surface 494, thus suppressing insufficient thickness of the joint 3B. Also, in electronic device A20, similar to electronic device A10, the first wiring section 4A has a fifth surface 495 and a sixth surface 496, thus suppressing insufficient thickness of the joint 3D. Also, in electronic device A20, similar to electronic device A10, the third wiring section 4C has a seventh surface 497 and an eighth surface 498, thus suppressing insufficient thickness of the joint 3C. Therefore, electronic device A20, similar to electronic device A10, can suppress a decrease in reliability. Furthermore, electronic device A20 has a configuration common to the other electronic devices A10 to A13, and therefore achieves the same effects as these electronic devices A10 to A13.

[0103] Electronic device A20 includes a plating layer 71A interposed between the first surface 491 and the joint 3A. In this configuration, during the formation of the joint 3A (during reflow), a force is generated at the joint 3A that remains on the plating layer 71A without flowing out from it. This residual force is generated, for example, by the surface tension of the joint 3A, which has increased fluidity due to reflow. Therefore, electronic device A20 can suppress the outflow of the joint 3A with the plating layer 71A, and also with the protrusion 421A. In other words, electronic device A20 can suppress the outflow of the joint 3A even more than electronic device A10. The same applies to the other plating layers 71B to 71D. In other words, electronic device A20 can suppress the outflow of each joint 3B to 3D even more than electronic device A10.

[0104] Figure 25 shows an electronic device A21 according to a modified example of the second embodiment. Electronic device A21 differs from electronic device A20 in the following respects: Firstly, a plating layer 71 is formed on the entire upper surface (the surface facing upward in the thickness direction z) of each main body portion 41. Secondly, each projection 42 is formed on the corresponding plating layer 71.

[0105] Similar to electronic device A20, electronic device A21 has a first wiring section 4A with a first surface 491 and a second surface 492, thereby suppressing insufficient thickness at the joint 3A. Also, similar to electronic device A20, electronic device A21 has a second wiring section 4B with a third surface 493 and a fourth surface 494, thereby suppressing insufficient thickness at the joint 3B. Also, similar to electronic device A20, electronic device A21 has a first wiring section 4A with a fifth surface 495 and a sixth surface 496, thereby suppressing insufficient thickness at the joint 3D. Also, similar to electronic device A20, electronic device A21 has a third wiring section 4C with a seventh surface 497 and an eighth surface 498, thereby suppressing insufficient thickness at the joint 3C. Therefore, electronic device A21, like electronic device A20, can suppress a decrease in reliability. Furthermore, electronic device A21 has a configuration common to electronic device A20 and therefore achieves the same effects as electronic device A20. For example, electronic device A21 can further suppress the outflow of each joint 3A to 3D by the plating layer 71.

[0106] Figures 26 and 27 show an electronic device A30 according to a third embodiment. Electronic device A30 differs from electronic device A10 in the configuration of each wiring section 4. Specifically, each wiring section 4 of electronic device A30 (the first wiring section 4A, the second wiring section 4B, and the third wiring section 4C) includes a wiring layer 43 and a metal layer 44.

[0107] The wiring layer 43 is the same as the main body 41. That is, the wiring layer 43 has a structure in which a seed layer 401 and a plating layer 402 are laminated. In the multiple wiring sections 4, each joint 3 (each joint 3A to 3D) is in contact with the wiring layer 43.

[0108] The metal layer 44 is laminated on one side (above) in the thickness direction z relative to the wiring layer 43. In each wiring section 4 (the first wiring section 4A, the second wiring section 4B, and the third wiring section 4C), the metal layer 44 exposes a portion of the upper surface (the surface facing upward in the thickness direction z) of the wiring layer 43. The metal layer 44 contains a different metal material than, for example, the plating layer 402. This metal material is, for example, Ni. However, the metal layer 44 may also be made of the same metal material as, for example, the plating layer 402.

[0109] As shown in Figures 26 and 27, in the electronic device A30, the first surface 491 and the fifth surface 495 are the upper surfaces of the wiring layer 43 of the first wiring section 4A that are exposed from the metal layer 44 of the first wiring section 4A. The second surface 492 and the sixth surface 496 are the upper surfaces of the metal layer 44 of the first wiring section 4A. As shown in Figure 26, the second surface 492 and the sixth surface 496 are connected to each other.

[0110] As shown in Figures 26 and 27, in the electronic device A30, the third surface 493 is the portion of the upper surface of the wiring layer 43 of the second wiring section 4B that is exposed from the metal layer 44 of the second wiring section 4B. The fourth surface 494 is the upper surface of the metal layer 44 of the second wiring section 4B.

[0111] As shown in Figures 26 and 27, in the electronic device A30, the seventh surface 497 is the portion of the upper surface of the wiring layer 43 of the third wiring section 4C that is exposed from the metal layer 44 of the third wiring section 4C. The eighth surface 498 is the upper surface of the metal layer 44 of the third wiring section 4C.

[0112] In electronic device A30, as with other electronic devices A10 and A20, the first wiring section 4A has a first surface 491 and a second surface 492, thus suppressing insufficient thickness at the joint 3A. Also, in electronic device A30, as with other electronic devices A10 and A20, the second wiring section 4B has a third surface 493 and a fourth surface 494, thus suppressing insufficient thickness at the joint 3B. Also, in electronic device A30, as with other electronic devices A10 and A20, the first wiring section 4A has a fifth surface 495 and a sixth surface 496, thus suppressing insufficient thickness at the joint 3D. Also, in electronic device A30, as with other electronic devices A10 and A20, the third wiring section 4C has a seventh surface 497 and an eighth surface 498, thus suppressing insufficient thickness at the joint 3C. Therefore, electronic device A30, as with other electronic devices A10 and A20, can suppress a decrease in reliability. Furthermore, electronic device A30 has a configuration common to the other electronic devices A10 and A20, and therefore achieves the same effects as these devices.

[0113] Figure 28 shows an electronic device A40 according to the fourth embodiment. Electronic device A40 differs from electronic device A10 in the following respects. First, none of the multiple wiring sections 4 (first wiring section 4A, second wiring section 4B, and third wiring section 4C) include a protrusion 42. Second, the main body section 41 has a recess 45.

[0114] In each wiring section 4 (the first wiring section 4A, the second wiring section 4B, and the third wiring section 4C), the recess 45 is recessed from the upper surface (the surface facing upward in the thickness direction z) of the main body section 41. Parts of each of the multiple joint sections 3A to 3D are housed in the corresponding recesses 45 formed in the first wiring section 4A, the second wiring section 4B, and the third wiring section 4C.

[0115] In the electronic device A40, the first surface 491, the third surface 493, the fifth surface 495, and the seventh surface 497 each correspond to the bottom surfaces of the recesses 45 of any of the multiple wiring sections 4. Also, the second surface 492, the fourth surface 494, the sixth surface 496, and the seventh surface 497 each correspond to the top surfaces of the main body 41 of any of the multiple wiring sections 4. For example, as shown in Figure 28, of the two recesses 45 formed in the first wiring section 4A, one bottom surface is the first surface 491 and the other bottom surface is the fifth surface 495. Also, the top surfaces of the protrusions 42 of the first wiring section 4A are the second surface 492 and the sixth surface 496.

[0116] In electronic device A40, as with other electronic devices A10, A20, and A30, the first wiring section 4A has a first surface 491 and a second surface 492, thus suppressing insufficient thickness of the joint 3A. Also, in electronic device A40, as with other electronic devices A10, A20, and A30, the second wiring section 4B has a third surface 493 and a fourth surface 494, thus suppressing insufficient thickness of the joint 3B. Also, in electronic device A40, as with other electronic devices A10, A20, and A30, the first wiring section 4A has a fifth surface 495 and a sixth surface 496, thus suppressing insufficient thickness of the joint 3D. Also, in electronic device A40, as with other electronic devices A10, A20, and A30, the third wiring section 4C has a seventh surface 497 and an eighth surface 498, thus suppressing insufficient thickness of the joint 3C. Therefore, like the other electronic devices A10, A20, and A30, electronic device A40 can suppress the degradation of reliability. In addition, electronic device A40 has a configuration common to the other electronic devices A10, A20, and A30, and thus achieves the same effects as these devices.

[0117] In the first to fourth embodiments described above (including their variations), examples were shown in which multiple wiring sections 4 have all sets of the first surface 491 and second surface 492, third surface 493 and fourth surface 494, fifth surface 495 and sixth surface 496, seventh surface 497 and eighth surface 498. However, the electronic device of this disclosure only needs to have one or more of these sets. Depending on the degree of leakage from the multiple joints 3, the first surface 491 and second surface 492, or the third surface 493 and fourth surface 494, or the fifth surface 495 and sixth surface 496, or the seventh surface 497 and eighth surface 498 may be formed on the multiple wiring sections 4. For example, Figure 29 shows an electronic device having two sets: the first surface 491 and second surface 492, and the fifth surface 495 and sixth surface 496. As mentioned above, both the electrode 11 of the first electronic component 1A and the electrode 12 of the second electronic component 1B are joined to the first wiring section 4A. In this configuration, each joint section 3A and 3D is more likely to be thinner than the other joint sections 3B and 3C. Therefore, in the example shown in Figure 29, steps (steps between the first surface 491 and the second surface 492, and steps between the fifth surface 495 and the sixth surface 496) are provided only in the first wiring section 4A. In this way, steps may be provided in each wiring section 4, taking into consideration the degree of leakage at each joint section 3.

[0118] In the first to fourth embodiments described above (including their modified forms), an example was shown in which there are two electronic components 1. However, in the electronic device of this disclosure, there may be one electronic component 1 or three or more.

[0119] In examples different from the first to fourth embodiments described above (including their variations), the electronic device may include a semiconductor element in addition to at least one electronic component 1. Figure 30 shows an electronic device further comprising a semiconductor element 19. The semiconductor element 19 is, for example, an integrated circuit such as an LSI. Unlike this example, the semiconductor element 19 may be a voltage control element such as an LDO (Low Drop Out), an amplification element such as an operational amplifier, or a discrete element such as a transistor and a diode. In the example shown in Figure 30, the semiconductor element 19 is flip-chip mounted. Therefore, the electronic devices of this disclosure are not limited to those comprising only electronic components, but also include configurations further comprising semiconductor elements.

[0120] The electronic devices relating to this disclosure are not limited to the embodiments described above. The specific configuration of each part of the electronic devices relating to this disclosure can be modified in various ways. For example, the electronic devices relating to this disclosure include embodiments relating to the following appendices. Note 1. A first electronic component having a first electrode, A first wiring section that is electrically connected to the first electrode, A first joint that connects the first electrode and the first wiring portion, Equipped with, The first wiring portion has a first surface and a second surface, each facing one direction in the thickness direction of the first wiring portion. The first joint overlaps the first surface when viewed in the thickness direction, An electronic device wherein the second surface is located on one side of the thickness direction relative to the first surface and is positioned on at least a portion of the periphery of the first surface when viewed in the thickness direction. Note 2. The first wiring portion includes a main body having the first surface and a projection having the second surface, The projection is the electronic device described in Appendix 1, which protrudes from the main body in one direction in the thickness direction. Note 3. The main body portion has a first plating layer, The aforementioned projection comprises the same material as the first plating layer, as described in Appendix 2 of the electronic device. Note 4. The present invention further comprises a second plating layer interposed between the first surface and the first joint, The electronic device according to Appendix 2 or Appendix 3, wherein, viewed in the thickness direction, the periphery of the second plating layer is contained within a region demarcated by the second surface. Note 5. The electronic device according to Appendix 1, wherein the first wiring portion includes a wiring layer having a first surface and a metal layer formed on the wiring layer and having a second surface. Note 6. The electronic device according to any one of Appendix 1 to Appendix 5, wherein the first electrode is located at one end of the first electronic component in a first direction perpendicular to the thickness direction. Note 7. The periphery of the first surface is located on one side of the first direction relative to the first electrode when viewed in the thickness direction, and has a first end edge extending in a second direction perpendicular to the thickness direction and the first direction. The electronic device according to Appendix 6, wherein the second surface has a first portion formed along the first edge. Note 8. The periphery of the first surface has a pair of second end edges, each extending in the first direction. The pair of second edges are spaced apart in the second direction and connected to the first edge. The second surface each has a pair of second parts connected to the first part, The electronic device as described in Appendix 7, wherein the pair of second parts are each individually formed along each of the pair of second edges. Note 9. The electronic device as described in Appendix 8, wherein the second surface is formed along the entire periphery of the first surface. Note 10. A second wiring section spaced apart from the first wiring section, The present invention further comprises a second joint for joining the first electronic component to the second wiring section, The first electronic component has a second electrode located at the other end in the first direction, The second joint connects the second electrode and the second wiring section. The second wiring portion has a third surface and a fourth surface, each facing one of the thickness directions, The second joint is in contact with the third surface, The electronic device according to any one of appendices 6 to 9, wherein the fourth surface is located on one side of the thickness direction relative to the third surface and is positioned on at least a portion of the periphery of the third surface when viewed in the thickness direction. Note 11. A second electronic component having a third electrode, The electronic device according to any one of the appendices 1 to 10, further comprising a third joint that connects the third electrode and the first wiring portion. Note 12. The first wiring section has a fifth surface and a sixth surface, each facing one of the thickness directions, The third joint is in contact with the fifth surface, The electronic device according to Appendix 11, wherein the sixth surface is located on one side of the thickness direction relative to the fifth surface and is positioned on at least a portion of the periphery of the fifth surface when viewed in the thickness direction. Note 13. The second surface and the sixth surface are the electronic device described in Appendix 12, which is positioned between the first joint and the third joint. Note 14. The first surface and the fifth surface are arranged in a first virtual plane perpendicular to the thickness direction, The electronic device described in Appendix 13, wherein the second surface and the sixth surface are arranged in a second virtual plane perpendicular to the thickness direction. Note 15. The second and sixth surfaces are connected to each other, as described in Appendix 13. Note 16. The electronic device described in Appendix 14 or Appendix 15, wherein the second surface and the sixth surface are separated from each other. Note 17. The first joint includes solder, as described in any of Appendix 1 to Appendix 16. [Explanation of Symbols]

[0121] A10,A11,A12,A13,A20,A21,A30,A40:Electronic equipment 1: Electronic components 1A: First Electronic Component 1B: Second Electronic Component 11,12: Electrode 19: Semiconductor devices 2: Support member 21: Mounting surface 22: Back side 23: Side view 3,3A,3B,3C,3D:Joint part 31: Interposition part 32: Fillet section 4:Wiring section 4A: First wiring section 4B: 2nd wiring section 4C: 3rd wiring section 41: Main body 401: Seed Layer 402: Plating layer 42,421A,421B,422,423:Protrusion 43: Wiring layer 44: Metal layer 45: Recess 491: 1st page 491a: First edge 491b: Second edge 491c: Third edge 492: 2nd side 492a: Part 1 492b: Part 2 492c: Part 3 493: 3rd page 493a: 4th edge 493b: Fifth edge 493c: Sixth edge 494:Side 4 494a: Part 4 494b: Part 5 494c: Part 6 495:Side 5 495a: Seventh edge 495b: Eighth edge 495c: 9th edge 496:Side 6 496a :Part 7 496b: Part 8 496c: Part 9 497:Side 7 497a: 10th edge 497b: 11th edge 497c: 12th edge 498:Side 8 498a: Part 10 498b: Part 11 498c: Part 12 5: Terminals 51: Columnar part 52:External electrode part 6: Sealing resin 61: Resin main surface 62: Resin back 63: Resin side 71, 71A, 71B, 71C, 71D: Plating layer 80: Support substrate 80a: Main surface of the substrate 80b: Back of the circuit board

Claims

1. A first electronic component having a first electrode, A first wiring section that is electrically connected to the first electrode, A first joint that connects the first electrode and the first wiring portion, Equipped with, The first wiring portion has a first surface and a second surface, each facing one direction in the thickness direction of the first wiring portion. The first joint overlaps the first surface when viewed in the thickness direction, An electronic device wherein the second surface is located on one side of the thickness direction relative to the first surface, and is positioned on at least a portion of the periphery of the first surface when viewed in the thickness direction.

2. The first wiring portion includes a main body having the first surface and a projection having the second surface, The electronic device according to claim 1, wherein the projection protrudes from the main body in one direction in the thickness direction.

3. The main body portion has a first plating layer, The electronic device according to claim 2, wherein the projection comprises the same material as the first plating layer.

4. The present invention further comprises a second plating layer interposed between the first surface and the first joint, The electronic device according to claim 3, wherein, viewed in the thickness direction, the periphery of the second plating layer is contained within a region defined by the second surface.

5. The electronic device according to claim 1, wherein the first wiring portion includes a wiring layer having a first surface and a metal layer formed on the wiring layer and having a second surface.

6. The electronic device according to claim 1, wherein the first electrode is located at one end of the first electronic component in a first direction perpendicular to the thickness direction.

7. The periphery of the first surface is located on one side of the first direction relative to the first electrode when viewed in the thickness direction, and has a first end edge extending in a second direction perpendicular to the thickness direction and the first direction. The electronic device according to claim 6, wherein the second surface has a first portion formed along the first edge.

8. The periphery of the first surface has a pair of second end edges, each extending in the first direction. The pair of second edges are spaced apart in the second direction and connected to the first edge. The second surface each has a pair of second parts connected to the first part, The electronic device according to claim 7, wherein the pair of second parts are each individually formed along each of the pair of second edges.

9. The electronic device according to claim 8, wherein the second surface is formed along the entire periphery of the first surface.

10. A second wiring section spaced apart from the first wiring section, The device further comprises a second joint for joining the first electronic component to the second wiring section, The first electronic component has a second electrode located at the other end in the first direction, The second joint connects the second electrode and the second wiring portion. The second wiring portion has a third surface and a fourth surface, each facing one of the thickness directions, The second joint is in contact with the third surface, The electronic device according to any one of claims 6 to 9, wherein the fourth surface is located on one side of the thickness direction relative to the third surface and is arranged on at least a portion of the periphery of the third surface when viewed in the thickness direction.

11. A second electronic component having a third electrode, The electronic device according to claim 1, further comprising a third joint that connects the third electrode and the first wiring portion.

12. The first wiring section has a fifth surface and a sixth surface, each facing one of the thickness directions, The third joint is in contact with the fifth surface, The electronic device according to claim 11, wherein the sixth surface is located on one side of the thickness direction relative to the fifth surface and is arranged on at least a portion of the periphery of the fifth surface when viewed in the thickness direction.

13. The electronic device according to claim 12, wherein the second surface and the sixth surface are arranged between the first joint and the third joint.

14. The first surface and the fifth surface are arranged in a first virtual plane perpendicular to the thickness direction, The electronic device according to claim 13, wherein the second surface and the sixth surface are arranged on a second virtual plane perpendicular to the thickness direction.

15. The electronic device according to claim 13, wherein the second surface and the sixth surface are connected to each other.

16. The electronic device according to claim 14 or claim 15, wherein the second surface and the sixth surface are separated from each other.

17. The electronic device according to claim 1, wherein the first joint includes solder.

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