Composition, cured body, display device, and method for manufacturing the display device

Abstract

The present invention provides a composition with improved balance between coatability and curability, and a cured body, a display device, and a method for manufacturing the display device using the said composition. [Solution] A composition comprising a cationic polymerizable compound (A), a cationic polymerization initiator (B), and a curing retarder (X), wherein the curing retarder (X) comprises an amino acid derivative (X1), and the amino acid derivative (X1) has an amide group and an ester group.

Description

[Technical Field]

[0001] The present invention relates to a composition, a cured body, a display device, and a method for manufacturing a display device. [Background technology]

[0002] In recent years, research has been progressing on organic photodevices using organic thin-film elements such as organic electroluminescent (OLED) display elements and organic thin-film solar cell elements. Organic thin-film elements can be easily fabricated by methods such as vacuum deposition and solution coating, resulting in excellent productivity.

[0003] An organic electroluminescent display element has a thin-film structure in which an organic light-emitting material layer is sandwiched between a pair of opposing electrodes. When electrons are injected into this organic light-emitting material layer from one electrode and holes are injected from the other electrode, the electrons and holes combine within the organic light-emitting material layer, causing self-illumination. Compared to liquid crystal display elements that require a backlight, organic electroluminescent display elements have the advantages of better visibility, the ability to be made thinner, and the ability to be driven by low DC voltage. However, such organic electroluminescent display elements have a problem in that their luminescence properties deteriorate rapidly and their lifespan is shortened when the organic light-emitting material layer or electrodes are exposed to the outside air. Therefore, in order to improve the stability and durability of organic electroluminescent display elements, sealing technology that protects the organic light-emitting material layer and electrodes from moisture and oxygen in the atmosphere has become essential.

[0004] Examples of technologies relating to encapsulants for such organic electroluminescent elements include those described in Patent Documents 1 and 2.

[0005] Patent Document 1 describes an organic electroluminescent display element encapsulant that contains a cationic polymerizable compound having a hydrogenated bisphenol skeleton and a thermal cationic polymerization initiator having a cationic part represented by a specific chemical formula, wherein the content of the thermal cationic polymerization initiator having a cationic part represented by a specific chemical formula is less than 0.1 parts by weight per 100 parts by weight of the cationic polymerizable compound, and that this encapsulant exhibits excellent low-temperature curability, storage stability, and flatness of the cured film.

[0006] Patent Document 2 describes a composition comprising (A) a cationic polymerizable compound, (B) a photocationic polymerization initiator, and (C) one or more phosphoric acid compounds selected from the group consisting of phosphoric acid esters and phosphorous acid esters, wherein (A) the cationic polymerizable compound contains (A-1) an alicyclic compound having an epoxy group and (A-2) an aromatic compound having an epoxy group, and (A-2) the aromatic compound having an epoxy group contains (A-2-1) a bisphenol A type epoxy resin and (A-2-2) a bisphenol F type epoxy resin, and the ratio A1 / A2 (mass ratio) of the content A1 of (A-2-1) the bisphenol A type epoxy resin to the content A2 of (A-2-2) the bisphenol F type epoxy resin is 0.2 to 5, which exhibits little increase in viscosity after light irradiation, is suitable for use as a encapsulant for organic electroluminescent elements, and is less likely to degrade organic electroluminescent elements. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2016-051602 [Patent Document 2] International Publication No. 2020 / 171186 [Overview of the project] [Problems that the invention aims to solve]

[0008] The present invention provides a composition with improved balance of curability and coatability, a cured body using the composition, a display device, and a method for manufacturing the display device.

Means for Solving the Problems

[0009] The inventors of the present invention have intensively studied to achieve the above problems. As a result, they have found that by blending a curing retarder having a specific chemical structure, the balance of curability and coatability of the composition can be improved, and thus the present invention has been completed.

[0010] According to the present invention, there are provided the following composition, cured body, display device, and method for manufacturing the display device.

[0011] [1] A composition comprising a cationic polymerizable compound (A), a cationic polymerization initiator (B), and a curing retarder (X), where the curing retarder (X) contains an amino acid derivative (X1), and the amino acid derivative (X1) has an amide group and an ester group, the composition. [2] The composition according to [1] above, wherein the amino acid derivative (X1) contains an aspartic acid derivative. [3] The composition according to [1] or [2] above, wherein the amino acid derivative (X1) contains a compound represented by the following general formula (1).

Chemical formula

[10] The composition according to any one of [1] to [9] above, wherein the cationic polymerization initiator (B) contains an onium salt compound.

[11] The composition according to any one of [1] to

[10] above, wherein the cationic polymerization initiator (B) contains an ammonium salt compound.

[12] The composition according to any one of [1] to

[11] above, wherein the content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A).

[13] The composition according to any one of [1] to

[12] above, wherein, when viscosity measurement is performed according to the <measurement condition 1> below, the viscosity increase initiation temperature at which the viscosity change per unit time becomes 100 mPa·s / second is 45°C or higher and 95°C or lower. <Measurement Condition 1> Device: Rheometer Temperature: After being held at 25°C for 380 seconds, it rises at a rate of 2°C per minute. Geometry (top): 8mm diameter, aluminum parallel plate Plate (bottom): 38mm diameter, alkali-free glass plate Shear rate: 1 min -1 Gap: 0.05mm Sample amount: 20 mg Atmosphere: Nitrogen flow

[14] The composition according to any one of the above [1] to

[13] , wherein when the viscosity at 20 seconds after the start of the viscosity measurement is V0, and the viscosity at ((the viscosity increase starting temperature)-10)°C is V1, V1 / V0 is 3 or less.

[15] The composition according to

[14] above, wherein V0 is 0.01 mPa·s or more and 1000 mPa·s or less.

[16] The composition according to

[14] above, wherein V1 is 0.01 mPa·s or more and 500 mPa·s or less.

[17] The composition according to any one of [1] to

[16] above, wherein the exothermic onset temperature in differential scanning calorimetry under the following <measurement condition 2> is 50°C or higher. <Measurement Conditions 2> Equipment: Differential scanning calorimetry Temperature: Rise from 0°C to 150°C at a rate of 2°C per minute. Sample amount: 5 mg Atmosphere: Nitrogen flow

[18] The composition according to any one of [1] to

[17] above, wherein the composition is used to encapsulate a light-emitting diode element.

[19] The composition according to

[18] above, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

[20] A cured body obtained by curing any of the compositions described in [1] to

[19] above. [twenty one] A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer formed by the cured body described in

[20] above, located between the light-emitting diode element and the substrate. [twenty two] The display device according to

[21] , wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED. [twenty three] The display device according to

[21] or

[22] , wherein the substrate includes a color filter. [twenty four] A step of applying the composition described in any of [1] to

[19] above to at least one of the first substrate and the second substrate, The process includes a step of bonding the first substrate and the second substrate together via the coated composition to obtain a laminate, A method for manufacturing a display device, wherein the first substrate includes a light-emitting diode element. [twenty five] A method for manufacturing a display device according to

[24] , further comprising the step of curing the composition by heating the laminate.

[26] A method for manufacturing a display device according to

[24] or

[25] , wherein the step of irradiating the composition applied to the substrate with ultraviolet light to cure the composition is also included.

[27] A method for manufacturing a display device according to any one of

[24] to

[26] above, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

[28] A method for manufacturing a display device according to any one of the above

[24] to

[27] , wherein the substrate includes a color filter. [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a composition with an improved balance of curability and coatability, and a cured body using the composition, a display device, and a method for manufacturing the display device. [Modes for carrying out the invention]

[0013] 1. Composition The composition of this embodiment comprises a cationic polymerizable compound (A), a cationic polymerization initiator (B), and a curing retarder (X), wherein the curing retarder (X) comprises an amino acid derivative (X1), and the amino acid derivative (X1) has an amide group and an ester group.

[0014] The composition of this embodiment contains a curing retarder having a specific chemical structure. This improves the balance between the applicability and curing properties of the composition of this embodiment. The reason for this is not clear, but the following reasons are possible. The composition of this embodiment contains a curing retarder having a specific chemical structure, and the action of this curing retarder provides a delay between the start of heating and the start of viscosity increase. In other words, a certain amount of time is ensured during which the composition maintains a viscosity that allows it to spread evenly. Therefore, it is believed that the composition will spread evenly (i.e., the coatability will be improved). Furthermore, it is believed that the curing rate of the composition is brought within an appropriate range by the action of a curing retarder having a specific chemical structure, thereby maintaining its curability. This is thought to improve the balance between coatability and curing properties.

[0015] The inventors of this invention investigated compositions to be applied to uneven substrates, such as color filters and substrates with light-emitting diode elements (TFT substrates), and found that uneven application is a problem on such uneven substrates. However, it became clear that improving the coatability to eliminate uneven application compromises the curability of the composition. In other words, it became clear that there is a trade-off relationship between coatability and curability. Therefore, the inventors conducted studies to resolve this trade-off relationship. As a result, the inventors found that by incorporating a curing retarder having a specific chemical structure into the composition, the trade-off relationship between coatability and curability is resolved, and the balance between coatability and curability performance is improved.

[0016] In the composition of this embodiment, the action of a curing retarder having a specific chemical structure ensures that the composition maintains a viscosity sufficient for wetting and spreading for a certain period of time, allowing the composition to flow appropriately into recesses. In other words, the situation where the composition hardens before it can flow into the recesses is prevented. This makes it possible to apply the composition evenly to uneven substrates. Furthermore, the action of the curing retarder having a specific chemical structure keeps the curing rate of the composition within an appropriate range, thereby maintaining its curability.

[0017] 1.1. Physical properties of the composition The physical properties of the composition of this embodiment will be described below.

[0018] When viscosity measurements are performed according to the following <Measurement Condition 1>, the viscosity increase start temperature at which the viscosity change per unit time of the composition of this embodiment reaches 100 mPa·s / second is preferably 45°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, even more preferably 60°C or higher, even more preferably 65°C or higher, even more preferably 70°C or higher, even more preferably 75°C or higher, and even more preferably 80°C or higher, and from the viewpoint of further improving the curability of the composition, it is preferably 95°C or lower, more preferably 90°C or lower, even more preferably 85°C or lower, even more preferably 80°C or lower, and even more preferably 75°C or lower. <Measurement Condition 1> Device: Rheometer Temperature: After being held at 25°C for 380 seconds, it rises at a rate of 2°C per minute. Geometry (top): 8mm diameter, aluminum parallel plate Plate (bottom): 38mm diameter, alkali-free glass plate Shear rate: 1 min -1 Gap: 0.05mm Sample amount: 20 mg Atmosphere: Nitrogen flow

[0019] In the viscosity measurement described above, let V0 be the viscosity 20 seconds after the start of measurement, and let V1 be the viscosity at ((the viscosity increase start temperature)-10)°C. Then, from the viewpoint of further improving coatability, V1 / V0 is preferably 3 or less, more preferably 2 or less, even more preferably 1 or less, even more preferably 0.9 or less, even more preferably 0.8 or less, and even more preferably 0.7 or less. From the viewpoint of further improving curability, it is preferably 0.1 or more, more preferably 0.3 or more, even more preferably 0.4 or more, and even more preferably 0.5 or more.

[0020] From the viewpoint of further improving coatability, V0 is preferably 0.01 mPa·s or more, more preferably 0.1 mPa·s or more, even more preferably 1 mPa·s or more, even more preferably 10 mPa·s or more, even more preferably 100 mPa·s or more, even more preferably 150 mPa·s or more, even more preferably 200 mPa·s or more, even more preferably 250 mPa·s or more, and even more preferably 280 mPa·s or more. Furthermore, from the viewpoint of further improving coatability, V0 is preferably 1000 mPa·s or less, more preferably 900 mPa·s or less, even more preferably 800 mPa·s or less, even more preferably 700 mPa·s or less, even more preferably 600 mPa·s or less, and even more preferably 550 mPa·s or less.

[0021] From the viewpoint of further improving coatability, V1 is preferably 0.01 mPa·s or more, more preferably 0.1 mPa·s or more, even more preferably 1 mPa·s or more, even more preferably 10 mPa·s or more, even more preferably 100 mPa·s or more, and even more preferably 150 mPa·s or more. Furthermore, from the viewpoint of further improving coatability, it is preferably 500 mPa·s or less, more preferably 480 mPa·s or less, even more preferably 460 mPa·s or less, and even more preferably 440 mPa·s or less.

[0022] The exothermic onset temperature of the composition of this embodiment in differential scanning calorimetry under the following <Measurement Condition 2> is preferably 50°C or higher, more preferably 55°C or higher, and even more preferably 58°C or higher, from the viewpoint of further improving coatability, and for example, 150°C or lower, preferably 120°C or lower, more preferably 110°C or lower, even more preferably 100°C or lower, even more preferably 95°C or lower, and even more preferably 90°C or lower, from the viewpoint of further improving curability.

[0023] <Measurement Conditions 2> Equipment: Differential scanning calorimetry Temperature: Rise from 0°C to 150°C at a rate of 2°C per minute. Sample amount: 5 mg Atmosphere: Nitrogen flow

[0024] The exothermic onset temperature can be determined from the DSC curve obtained by the above-mentioned <Measurement Condition 2>. Specifically, the exothermic onset temperature can be defined as the intersection point of the baseline of the DSC curve before the onset of exothermic onset and the tangent line to the point where the change in heat generation is at its maximum after the onset of exothermic onset.

[0025] The liquid specific gravity of the composition of this embodiment at a 25°C atmosphere is preferably 1.10 or higher, more preferably 1.12 or higher, even more preferably 1.15 or higher, even more preferably 1.20 or higher, and preferably 4 or lower, more preferably 3.0 or lower, even more preferably 2.5 or lower, even more preferably 2.0 or lower, and even more preferably 1.5 or lower, from the viewpoint of further improving coatability. The liquid specific gravity of the composition of this embodiment is the value measured using a 5 mL Gay-Lussac type specific gravity bottle in accordance with JIS-K-0061 8.2.2. The type and content of each component of the composition of this embodiment may be appropriately adjusted so that the liquid specific gravity falls within the above range.

[0026] The static surface tension of the composition of this embodiment, as determined by the pendant drop method, is preferably 50 mN / m or less, more preferably 40 mN / m or less, and even more preferably 35 mN / m or less, from the viewpoint of further improving coatability. The lower limit of the static surface tension is not particularly limited, but may be, for example, 10 mN / m or more, 20 mN / m or more, or 25 mN / m or more. The pendant drop method is a method of calculating the surface tension from the shape of a hanging droplet (pendant drop) formed by pushing a liquid out from the tip of a tube.

[0027] 1.2. Components contained in the composition The following describes each component contained in the composition of this embodiment.

[0028] 1.2.1. (A) Component: Cationic polymerizable compound Component (A) is a compound that is cationically polymerizable, or can be described as a compound having a cationically polymerizable group. Examples of cationically polymerizable groups include cyclic ether groups such as epoxy groups (oxirane rings) and oxetane groups (oxetane rings); and cationically polymerizable vinyl groups. It is preferable that component (A) contains an epoxy group. In other words, component (A) preferably comprises one or more selected from the group consisting of epoxy compounds, oxetane compounds, and cationic polymerizable vinyl compounds, and more preferably comprises an epoxy compound. Examples of epoxy compounds include alicyclic compounds having an epoxy group (A1) (alicyclic epoxy compound), aromatic compounds having an epoxy group (A2) (aromatic epoxy compound), and glycidyl ether compounds (A3).

[0029] Component (A) may be a compound having one cationic polymerizable group, or it may be a compound having two or more cationic polymerizable groups. Component (A) preferably has two or more cationic polymerizable groups, and more preferably has two cationic polymerizable groups.

[0030] Component (A) preferably comprises one or more compounds selected from the group consisting of an alicyclic compound having an epoxy group (A1), an aromatic compound having an epoxy group (A2), and a glycidyl ether compound (A3), from the viewpoint of further improving the coatability and further improving the balance of adhesiveness and transparency of the resulting cured product, and more preferably comprises an alicyclic compound having an epoxy group (A1), an aromatic compound having an epoxy group (A2), and a glycidyl ether compound (A3).

[0031] Component (A) preferably contains a bromine atom from the viewpoint of further improving its applicability. Here, Component (A) containing a bromine atom means containing a bromine atom-containing compound.

[0032] Component (A) is preferably thermopolymerizable.

[0033] 1.2.1.1.(A1) Component: Alicyclic compound having an epoxy group Component (A1) is a compound having an epoxy group and an alicyclic group. Component (A1) may be a compound having one epoxy group, or it may be a compound having two or more epoxy groups. Component (A1) preferably has two or more epoxy groups, more preferably has two epoxy groups. Component (A1) may be a compound that does not have an aromatic ring. Component (A1) can be used alone or in combination of two or more.

[0034] Component (A1) may be, for example, a compound obtained by epoxidizing a compound having a cycloalkene ring, or a derivative thereof. Examples of cycloalkene rings include cyclohexene rings, cyclopentene rings, and pinene rings. Epoxidation can be carried out, for example, using an oxidizing agent. Examples of oxidizing agents include hydrogen peroxide and peracids. Examples of such (A1) components include one or more selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylalkyl (meth)acrylate (e.g., 3,4-epoxycyclohexylmethyl (meth)acrylate, etc.), and (3,3',4,4'-diepoxy)bicyclohexyl.

[0035] Component (A1) may be, for example, a compound obtained by hydrogenating a compound having an epoxy group and an aromatic ring, or a derivative thereof. Examples of compounds having an epoxy group and an aromatic ring include bisphenol A type epoxy resin and bisphenol F type epoxy resin. Examples of such a (A1) component include hydrogenated bisphenol A type epoxy resin and hydrogenated bisphenol F type epoxy resin.

[0036] Component (A1) is preferably a compound having a 1,2-epoxycyclohexane structure. As a compound having a 1,2-epoxycyclohexane structure, for example, a compound represented by formula (A1-1) is preferred.

[0037] [ka]

[0038] In formula (A1-1), X represents a single bond or a linking group (a divalent group having one or more atoms).

[0039] When X is a single bond, the compound represented by formula (A1-1) is (3,3',4,4'-diepoxy)bicyclohexyl.

[0040] The linking group may be, for example, a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group formed by linking multiple such groups. X is preferably a linking group. The linking group is preferably a group having an ester bond, and more preferably a group linking an ester bond and a divalent hydrocarbon group. An example of a compound having a group with an ester bond as a linking group is 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (molecular weight 252).

[0041] The divalent hydrocarbon group is preferably an alkanediyl group, and more preferably an alkanediyl group having 1 to 3 carbon atoms.

[0042] The compound represented by formula (A1-1) is preferably 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0043] The molecular weight of component (A1) is preferably 450 or less, more preferably 400 or less, even more preferably 300 or less, and even more preferably 280 or less, from the viewpoint of further improving the applicability and storage stability. Furthermore, the molecular weight of component (A1) may be, for example, 100 or more, 150 or more, or 200 or more.

[0044] If component (A1) has a molecular weight distribution, the number-average molecular weight of component (A1) is preferably within the above range. In this specification, the number-average molecular weight is the polystyrene-converted value measured by gel permeation chromatography (GPC) under the following measurement conditions. • Solvent (mobile phase): THF • Degassing device: ERMA ERC-3310 • Pump: PU-980 manufactured by JASCO Corporation ·Flow rate: 1.0ml / min • Autosampler: Tosoh Corporation AS-8020 • Column oven: Hitachi L-5030 ·Set temperature: 40℃ • Column configuration: Two Tosoh TSKguardcolumnMP (×L) 6.0mm ID × 4.0cm columns, and two Tosoh TSK-GELMULTIPORE HXL-M 7.8mm ID × 30.0cm columns, for a total of four columns. • Detector: RI Hitachi L-3350 • Data processing: SIC480 data station

[0045] From the viewpoint of further improving coatability and improving durability, the content of component (A1) in the composition of this embodiment is preferably 10 parts by mass or more, more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 35 parts by mass or more, and preferably 90 parts by mass or less, more preferably 85 parts by mass or less, even more preferably 80 parts by mass or less, even more preferably 75 parts by mass or less, even more preferably 70 parts by mass or less, even more preferably 65 parts by mass or less, and even more preferably 60 parts by mass or less, when the total amount of component (A) in the composition of this embodiment is 100 parts by mass or more.

[0046] 1.2.1.2.(A2) Component: Aromatic compound having an epoxy group Component (A2) is a compound having an epoxy group and an aromatic ring. Component (A2) may be a compound having one epoxy group, or it may be a compound having two or more epoxy groups. Component (A2) preferably has two or more epoxy groups, and more preferably has two epoxy groups. Component (A2) may be a compound that does not have an alicyclic group. Component (A2) can be used alone or in combination of two or more.

[0047] Component (A2) can be a monomer, oligomer, or polymer, and examples include one or more selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, novolac phenol type epoxy resin, cresol novolac type epoxy resin, and modified products thereof. Furthermore, component (A2) can be one or more selected from the group consisting of halophenyl glycidyl ethers such as bromophenyl glycidyl ether and dibromophenyl glycidyl ether; bromine atom-containing epoxy resins such as brominated bisphenol A type epoxy resin, brominated bisphenol F type novolac type epoxy resin, and brominated phenol novolac type epoxy resin; and bromine atom-containing aromatic epoxy compounds. Halophenyl glycidyl ether is preferred as the bromine atom-containing aromatic epoxy compound. Dibromophenyl glycidyl ether is preferred as the halophenyl glycidyl ether.

[0048] Component (A2) preferably comprises one or more compounds selected from the group consisting of compounds having a bisphenol structure (e.g., bisphenol A structure, bisphenol F structure, bisphenol S structure, etc.) and bromine atom-containing aromatic epoxy compounds, more preferably comprising one or more compounds selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and halophenyl glycidyl ether, even more preferably comprising one or more compounds selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and dibromophenyl glycidyl ether, and even more preferably comprising at least one compound selected from the group consisting of bisphenol F type epoxy resin and dibromophenyl glycidyl ether.

[0049] (A2) The molecular weight of component (A2) is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, and preferably 5000 or less, more preferably 1000 or less, even more preferably 700 or less, and even more preferably 450 or less, from the viewpoint of further improving the applicability and improving storage stability.

[0050] If component (A2) has a molecular weight distribution, it is preferable that the number-average molecular weight of component (A2) is within the above range. In this specification, the number-average molecular weight refers to the polystyrene-converted value measured by gel permeation chromatography (GPC) under the measurement conditions described above.

[0051] From the viewpoint of improving the balance of coating properties and durability, the content of component (A2) in the composition of this embodiment is preferably 10 parts by mass or more, more preferably 15 parts by mass or more, even more preferably 20 parts by mass or more, even more preferably 25 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 35 parts by mass or more, even more preferably 40 parts by mass or more, and preferably 90 parts by mass or less, more preferably 85 parts by mass or less, even more preferably 82 parts by mass or less, even more preferably 70 parts by mass or less, and even more preferably 65 parts by mass or less.

[0052] 1.2.1.3.(A3) Component: Glycidyl ether compound Component (A3) is a compound having a glycidyl ether group. Component (A3) may be a compound having one epoxy group, or it may be a compound having two or more epoxy groups. Component (A3) preferably has two or more epoxy groups, and more preferably has two epoxy groups. Component (A3) may be a compound that does not have an alicyclic group or an aromatic ring. Component (A3) can be used alone or in combination of two or more. Component (A3) preferably excludes components (A1) and (A2).

[0053] (A3) Component is preferably a diglycidyl ether compound. The diglycidyl ether compound preferably includes one or more selected from the group consisting of: diglycidyl ethers of alkylene glycols such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diglycidyl ether; polyglycidyl ethers of polyhydric alcohols such as glycerin or di or triglycidyl ethers of its alkylene oxide adducts; and diglycidyl ethers of polyalkylene glycols such as polyethylene glycol or its alkylene oxide adduct, and polyalkylene glycols such as polypropylene glycol or its alkylene oxide adduct. Preferably, it includes diglycidyl ethers of alkylene glycols. The diglycidyl ether of alkylene glycol preferably includes one or more selected from the group consisting of diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol, and more preferably includes one or more selected from the group consisting of diglycidyl ether of 1,6-hexanediol and diglycidyl ether of neopentyl glycol. Examples of alkylene glycols include ethylene glycol, propylene glycol, 1,6-hexanediol, and neopentyl glycol. Examples of polyalkylene glycols include polyethylene glycol or its alkylene oxide adducts, and polypropylene glycol or its alkylene oxide adducts. Examples of alkylene oxides include ethylene oxide and propylene oxide.

[0054] From the viewpoint of further improving the balance of coating properties and durability, the content of component (A3) in the composition of this embodiment is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 1 part by mass or more, even more preferably 1.5 parts by mass or more, and preferably 20 parts by mass or less, more preferably 15 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 5 parts by mass or less, and even more preferably 3 parts by mass or less.

[0055] The total content of components (A1), (A2), and (A3) in the composition of this embodiment is preferably 60 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 80 parts by mass or more, even more preferably 95 parts by mass or more, even more preferably 98 parts by mass or more, and for example, 100 parts by mass or less, when the total amount of component (A) in the composition of this embodiment is 100 parts by mass.

[0056] 1.2.2.(B) Component: Cationic polymerization initiator Component (B) comprises one or more selected from the group consisting of a photocatalytic polymerization initiator that can be activated by light to initiate the cationic polymerization of component (A), and a thermal cationic polymerization initiator that can be activated by heat to initiate the cationic polymerization of component (A). From the viewpoint of further improving the balance of coatability and curability performance, it preferably includes a thermal cationic polymerization initiator.

[0057] Examples of commercially available thermal cationic polymerization initiators include ADEKA-Opton CP-66, ADEKA-Opton CP-77 (manufactured by ADEKA Corporation), San-Aid SI-60L, San-Aid SI-80L, San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the CI series (manufactured by Nippon Soda Co., Ltd.).

[0058] Component (B) preferably contains an onium salt compound, more preferably one or more selected from the group consisting of sulfonium salt compounds, phosphonium salt compounds, iodonium salt compounds, and ammonium salts, even more preferably an ammonium salt compound, even more preferably a quaternary ammonium salt compound, and even more preferably one or more selected from the group consisting of quaternary ammonium salt of boric acid, quaternary ammonium salt of hexafluoroantimonate, and quaternary ammonium salt of trifluoromethanesulfonic acid.

[0059] Component (B) may be used in a state where it is dissolved in a solvent beforehand in order to facilitate mixing with other components such as component (A). The solvent is not particularly limited, but examples include carbonates such as propylene carbonate, ethylene carbonate, 1,2-butylene carbonate, dimethyl carbonate, and diethyl carbonate.

[0060] The content of component (B) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, even more preferably 0.5 parts by mass or more, and even more preferably 0.8 parts by mass or more, per 100 parts by mass of component (A), from the viewpoint of further improving curability, from the viewpoint of suppressing deterioration of the object to which the composition is applied, and from the viewpoint of improving the durability of the cured product obtained from the composition, preferably 10 parts by mass or less, more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, and even more preferably 2.5 parts by mass or less.

[0061] 1.2.3.(X) Component: Curing retarder Component (X) is an agent that can delay the curing of the composition of this embodiment.

[0062] Component (X) contains an amino acid derivative (X1).

[0063] Component (X) may contain a curing retarder other than the amino acid derivative (X1). Component (X) is a curing retarder other than the amino acid derivative (X1), and from the viewpoint of further improving the balance between coatability and curability performance and improving storage stability, it includes one or more selected from the group consisting of, for example, ether compounds (X2), thioether compounds (X3), metal complex compounds (X4), and nitroxyl radical compounds (X5), preferably containing an ether compound (X2).

[0064] The content of component (X) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, even more preferably 0.5 parts by mass or more, and even more preferably 1.0 part by mass or more, with respect to 100 parts by mass of component (A), from the viewpoint of further improving the balance between coatability and curability and improving storage stability, and preferably 10 parts by mass or less, more preferably 5 parts by mass or less, even more preferably 2 parts by mass or less, and even more preferably 1.5 parts by mass or less, from the viewpoint of further improving the balance between coatability and curability.

[0065] 1.2.3.1.(X1) Component: Amino acid derivative Component (X1) has an amide group and an ester group within its molecule.

[0066] Component (X1) preferably contains an aspartic acid derivative, and more preferably contains a compound represented by the following general formula (1), from the viewpoint of further improving the balance of coatability and curability performance and improving storage stability. The compound represented by the following general formula (1) can be synthesized, for example, by referring to the method described in Japanese Patent Publication No. 3379997.

[0067]

Chem.

[0068] In general formula (1), R 1 and R 2 are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a substituted alkyl group having 1 to 20 carbon atoms, an aryl group, and a substituted aryl group, and are preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, still more preferably an alkyl group having 1 to 6 carbon atoms, still more preferably an alkyl group having 2 to 4 carbon atoms, and still more preferably an isobutyl group. Also, R 1 and R 2 are preferably one or two selected from the group consisting of an alkyl group having a branched structure and a substituted alkyl group having a branched structure, and more preferably an alkyl group having a branched structure.

[0069] In general formula (1), R 3 are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a substituted alkyl group having 1 to 20 carbon atoms, an aryl group, and a substituted aryl group, and are preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 2 to 16 carbon atoms, still more preferably an alkyl group having 4 to 14 carbon atoms, still more preferably an alkyl group having 6 to 12 carbon atoms, still more preferably an alkyl group having 8 to 10 carbon atoms, and still more preferably an alkyl group having 10 carbon atoms.

[0070] In general formula (1), R 4Each of these is independently one or more selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a substituted alkyl group having 1 to 20 carbon atoms, an aryl group, and a substituted aryl group, preferably one or more selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 20 carbon atoms, more preferably one or more selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 10 carbon atoms, even more preferably one or more selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 6 carbon atoms, even more preferably one or more selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms, even more preferably one or more selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 2 carbon atoms, even more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.

[0071] In general formula (1), m is an integer between 1 and 20, preferably between 1 and 16, more preferably between 1 and 12, even more preferably between 1 and 10, even more preferably between 1 and 8, even more preferably between 1 and 6, even more preferably between 1 and 4, even more preferably between 1 and 3, and even more preferably 3.

[0072] In general formula (1), n ​​is an integer between 1 and 20, preferably between 1 and 16, more preferably between 1 and 12, even more preferably between 1 and 10, even more preferably between 1 and 8, even more preferably between 1 and 6, even more preferably between 1 and 4, even more preferably between 1 and 2, and even more preferably 2.

[0073] The molecular weight of component (X1) is preferably 130 or more, more preferably 150 or more, even more preferably 200 or more, even more preferably 250 or more, even more preferably 300 or more, even more preferably 350 or more, even more preferably 400 or more, and even more preferably 450 or more, and even more preferably 1000 or less, more preferably 900 or less, even more preferably 850 or less, even more preferably 800 or less, even more preferably 750 or less, even more preferably 700 or less, even more preferably 650 or less, and even more preferably 600 or less.

[0074] The content of component (X1) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.02 parts by mass or more, even more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, and even more preferably 0.15 parts by mass or more, with respect to 100 parts by mass of component (A), from the viewpoint of further improving the balance of coating and curing properties and improving storage stability, and preferably 5 parts by mass or less, more preferably 2 parts by mass or less, even more preferably 1 part by mass or less, even more preferably 0.8 parts by mass or less, even more preferably 0.5 parts by mass or less, and even more preferably 0.3 parts by mass or less, from the viewpoint of further improving the balance of coating and curing properties.

[0075] 1.2.3.2.(X2) Component: Ether compound Component (X2) is a compound containing an ether bond. Component (X2) may be a linear ether or a cyclic ether. Examples of linear ethers include polyalkylene oxides such as polyethylene glycol, polypropylene glycol, and polyoxytetramethylene glycol. Examples of polyalkylene oxides include polyoxyethylene-dimethyl ether. Examples of cyclic ethers include crown ethers. Examples of crown ethers include 18-crown-6-ether and 15-crown-5-ether.

[0076] The (X2) component is preferably a cyclic ether, more preferably a crown ether, and even more preferably an 18-crown-6-ether, from the viewpoint of further improving the balance of curability and coatability performance.

[0077] When the composition of this embodiment contains component (X2), the content of component (X2) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, even more preferably 0.5 parts by mass or more, and even more preferably 0.8 parts by mass or more, with respect to 100 parts by mass of component (A), from the viewpoint of further improving the balance of coating and curing properties and further improving storage stability, and preferably 10 parts by mass or less, more preferably 5 parts by mass or less, even more preferably 2 parts by mass or less, even more preferably 1.5 parts by mass or less, and even more preferably 1.2 parts by mass or less, from the viewpoint of further improving the balance of coating and curing properties.

[0078] 1.2.3.3.(X3) Component: Thioether compound Component (X3) is a compound having a thioether bond. Component (X3) may be a linear thioether or a cyclic thioether. Examples of linear thioethers include diethyl thioether, isobutyl sulfide, and dithiaoctanediol. Examples of cyclic thioethers include 1,3-dithiane, 1,3,5-trithiane, 1,4,7-trithiacyclononane, and 1,4,8,11-tetrathiacyclotetradecane.

[0079] 1.2.3.4.(X4) Component: Metal complex compound Component (X4) is a metal complex that functions as a curing retarder. Examples of component (X4) include metal acetylacetonates.

[0080] Examples of metal acetylacetonates include aluminum, titanium, zinc, zirconium, or copper acetylacetonates. Of these, aluminum or zinc acetylacetonates are preferred, and aluminum acetylacetonates are more preferred.

[0081] 1.2.3.5.(X5) Ingredient: Nitroxy radical compound Component (X5) is a compound having a nitrooxide group. (X5) components include, for example, 2,2,6,6-tetramethyl-1-piperidinyloxy (hereinafter referred to as TEMPO) or its derivatives such as 4-benzooxyloxy-TEMPO, 4-methoxy-TEMPO, 4-carboxyl-4-amino-TEMPO, 4-chloro-TEMPO, 4-hydroxyruymine-TEMPO, 4-hydroxy-TEMPO, 4-oxo-TEMPO, etc.; 4-amino-TEMPO, 2,2,5,5-tetramethyl-1-pyrrolidinyloxy (hereinafter referred to as PROXYL) or its derivatives such as 3-carboxyl-PROXYL, 3-carbamoyl-PROXYL, 2,2-dimethyl-4,5-cyclohexyl-PROXYL, 3-oxo-PROXYL, 3-hydroxyruymine-P Examples include ROXYL, 3-aminomethyl-PROXYL, 3-methoxy-PROXYL, 3-t-butyl-PROXYL, 3-maleimide-PROXYL, 3,4-di-t-butyl-PROXYL, 3-carboxylic-2,2,5,5-tetramethyl-1-PROXYL, etc.; dialkylnitroxide radicals or their derivatives such as di-t-butylnitroxide and t-butyl-t-amylnitroxide; diarylnitroxide radicals or their derivatives such as diphenylnitroxide; 4,4-dimethyl-1-oxazolidinyloxy (hereinafter referred to as DOXYL) or its derivatives such as 2-di-t-butyl-DOXYL, 5-decane-DOXYL, and 2-cyclohexane-DOXYL; and others.

[0082] The total content of components (A), (B), and (X) in the composition of this embodiment is preferably 60 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 80 parts by mass or more, even more preferably 90 parts by mass or more, even more preferably 95 parts by mass or more, even more preferably 98 parts by mass or more, and for example, 100 parts by mass or less, when the total amount of the composition of this embodiment is 100 parts by mass, from the viewpoint of further improving the balance of coating properties and curing properties.

[0083] The composition of this embodiment may further contain other components besides components (A), (B), and (X).

[0084] Other components include, for example, photosensitizers, silane coupling agents, antioxidants, inorganic fillers, resin particles, metal deactivators, fillers, stabilizers, neutralizing agents, lubricants, and antibacterial agents.

[0085] The method for producing the composition of this embodiment is not particularly limited as long as the above components are sufficiently mixed. The method for mixing each component is not particularly limited, but examples include a stirring method that utilizes the stirring force associated with the rotation of a propeller, and a method that utilizes a conventional disperser such as a planetary agitator that rotates and revolves. These mixing methods are preferred because they are low-cost and allow for stable mixing.

[0086] The composition of this embodiment can be cured by a curing method corresponding to its composition.

[0087] For example, in the case of a thermosetting composition, it can be cured by heating. From the viewpoint of further improving curability, the heating temperature of the composition is preferably 45°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, even more preferably 60°C or higher, even more preferably 65°C or higher, even more preferably 70°C or higher, even more preferably 75°C or higher, even more preferably 80°C or higher, and even more preferably 85°C or higher. From the viewpoint of preventing deterioration, it is, for example, 200°C or lower, preferably 150°C or lower, more preferably 120°C or lower, even more preferably 110°C or lower, even more preferably 105°C or lower, even more preferably 100°C or lower, and even more preferably 95°C or lower.

[0088] For example, if it is a light-curing composition, it can be cured by light irradiation. The light source used for irradiation is not particularly limited and includes, for example, halogen lamps, metal halide lamps, high-power metal halide lamps (containing indium, etc.), low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, xenon excimer lamps, xenon flash lamps, LEDs, etc. Each of the above light sources has a different emission wavelength and energy distribution. Therefore, the light source can be appropriately selected depending on the reaction wavelength of the photocationic polymerization initiator. Natural light (sunlight) can also be used as a reaction initiation light source. Irradiation methods may include direct irradiation, focused irradiation using reflectors, or focused irradiation using fibers. Irradiation using low-wavelength cut filters, heat-cut filters, cold mirrors, etc., is also possible.

[0089] The amount of light irradiation is not particularly limited and may be adjusted as appropriate depending on the thickness of the coating film of the composition. For example, the amount of light irradiation may be 50 mJ / cm². 2 More than 20000mJ / cm 2 The following may be true, preferably 100 mJ / cm² 2 More than 10000mJ / cm 2 The following applies:

[0090] The use of the composition of this embodiment is not particularly limited, but because the composition of this embodiment has a good balance of coatability and curability, it is preferably used for encapsulating light-emitting diode elements. Furthermore, the light-emitting diode element preferably includes an organic electroluminescent display element or a micro-LED.

[0091] Furthermore, the composition of this embodiment may be cured into a predetermined shape (for example, a film, a sheet, etc.) to form a cured sealing layer having a predetermined shape. In this case, for example, when assembling a display device, the light-emitting diode element can be sealed by placing the cured sealing layer on the light-emitting diode element.

[0092] 2.Cured body The cured body of this embodiment is obtained by curing the composition of this embodiment.

[0093] Since the composition of this embodiment has a good balance of coatability and curability, the cured body obtained by curing the composition of this embodiment can be suitably used as a cured encapsulation layer (particularly a cured encapsulation layer for light-emitting diode elements).

[0094] The conditions for obtaining the cured product of this embodiment are not particularly limited, and the above-described conditions can be applied as conditions for curing the composition of this embodiment.

[0095] 3.Display device The display device of this embodiment comprises a light-emitting diode element, a substrate, and a cured sealing layer formed by the cured body located between the light-emitting diode element and the substrate.

[0096] The light-emitting diode element in the display device of this embodiment preferably includes an organic electroluminescent display element or a microLED, and more preferably includes a microLED.

[0097] The substrate of the display device of this embodiment includes, for example, one or more selected from the group consisting of a color filter, a glass substrate, a silicon substrate, and a plastic substrate, and preferably includes a color filter.

[0098] 4. Method for manufacturing a display device The method for manufacturing the display device of this embodiment includes the steps of applying the above composition to at least one of a first substrate and a second substrate, and bonding the first substrate and the second substrate together via the applied composition to obtain a laminate, wherein the first substrate includes a light-emitting diode element.

[0099] The method for manufacturing the display device of this embodiment further includes a step of curing the composition by heating the laminate, preferably. The heating temperature in this step is preferably 45°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, even more preferably 60°C or higher, even more preferably 65°C or higher, even more preferably 70°C or higher, even more preferably 75°C or higher, even more preferably 80°C or higher, and even more preferably 85°C or higher, and from the viewpoint of preventing deterioration, for example, 200°C or lower, preferably 150°C or lower, more preferably 120°C or lower, even more preferably 110°C or lower, even more preferably 105°C or lower, even more preferably 100°C or lower, and even more preferably 95°C or lower.

[0100] From the viewpoint of further improving the balance between coatability and curability, the manufacturing method of the display device of this embodiment preferably does not include a step of irradiating the composition applied to the substrate with ultraviolet light to cure the composition.

[0101] The light-emitting diode element of this embodiment preferably includes an organic electroluminescent display element or a microLED, and more preferably includes a microLED.

[0102] The substrate of this embodiment includes, for example, one or more selected from the group consisting of color filters, glass substrates, silicon substrates, and plastic substrates, and preferably includes a color filter.

[0103] In the method for manufacturing the display device of this embodiment, examples of methods for applying the composition of this embodiment to a substrate include coating film formation methods such as solution coating and spray coating, as well as flash deposition and inkjet methods. Among these, the inkjet method is preferred from the viewpoint of further improving productivity. The film thickness of the composition applied to the substrate is, for example, 1 μm to 15 μm, preferably 3 μm to 10 μm. By forming a film of 1 μm or more and curing it, sufficient sealing ability can be easily obtained as a cured sealing layer. Furthermore, a film thickness of 15 μm or less leads to miniaturization of the display device and reduction of manufacturing costs.

[0104] Although embodiments of the present invention have been described above, these are merely examples, and various other configurations can be adopted. Furthermore, the present invention is not limited to the embodiments described above, and modifications, improvements, etc., within the scope that can achieve the objectives of the present invention are included in the present invention. [Examples]

[0105] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, the examples were tested at 23°C and 50% relative humidity.

[0106] <Preparation of Composition> The components shown in Table 1 were mixed in the compositional ratios (parts by mass) listed in Table 1 to prepare the compositions for the examples and comparative examples.

[0107] Each component shown in Table 1 has the following meaning:

[0108] (A) Component: Cationic polymerizable compound (A1) Component: Alicyclic compound having an epoxy group (a1-1) 3',4'-Epoxycyclohexylmethyl-3,4-Epoxycyclohexanecarboxylate (Daicel Chemicals, "Celoxide 2021P") (A2) Component: Aromatic compound having an epoxy group (a2-1) Bisphenol F type epoxy resin (molecular weight: 320 to 340, manufactured by Mitsubishi Chemical Corporation, "jER806") (a2-2) Dibromophenyl glycidyl ether (molecular weight 308, manufactured by Nippon Kayaku Co., Ltd., "BR-250H") (a2-3) Bisphenol A type epoxy resin (molecular weight: 360 to 390, manufactured by Mitsubishi Chemical Corporation, "jER828")

[0109] (B) Component: Cationic polymerization initiator (b-1) Quaternary ammonium salt of boric acid (King Industries "CXC-1821") (b-2) Quaternary ammonium salt of hexafluoroantimonic acid (King Industries "CXC-1612") (b-3) Triarylsulfonium salt hexafluoroantimonate (ADEKA SP-170)

[0110] (X) Component: Curing retarder (X1) Ingredient: Amino acid derivative (x1-1) Aspartic acid derivative (In the above general formula (1), R 1 and R 2 is an isobutyl group, R 3 is an alkyl group having 10 carbon atoms, and R 4 (A compound in which the atom is a hydrogen atom, m is 3, and n is 2) Aspartic acid derivative (x1-1) was synthesized with reference to the method described in Japanese Patent Publication No. 3379997. Specifically, in a reaction vessel at 75°C, 115 parts by mass of 3-decyloxypropylamine were added dropwise to 120 parts by mass of di-i-butyl maleate over 2.5 hours. The resulting mixture was stirred at 125°C for 3 hours, and then acylated with 38.1 parts by mass of succinic anhydride at 110°C for 1 hour to synthesize the derivative. (X2) component: ether compound (x2-1)18-Crown-6-ether (Crown Ether O-18, manufactured by Tokyo Chemical Industry Co., Ltd.) (X5) Component: Nitroxy radical compound (x5-1) Tenpol (Tokyo Chemical Industries, Ltd. "4-Hydroxy-2,2,6,6-tetramethylpiperidine 1-Oxyl Free Radical")

[0111] <Viscosity increase onset temperature, V0 and V1> Viscosity measurements were performed on the compositions of the examples and comparative examples according to the following <Measurement Condition 1>, and the temperature at which the viscosity change per unit time reached 100 mPa·s / second was defined as the viscosity increase onset temperature. The results are shown in Table 1. Furthermore, the viscosity 20 seconds after the start of measurement was defined as V0, and the viscosity at ((the temperature at which viscosity increase began)-10)°C was defined as V1. These results are also shown in Table 1.

[0112] <Measurement Condition 1> Equipment: Rheometer (manufactured by Anton Paar, product name "MCR301") Temperature: The temperature was maintained at 25°C for 380 seconds from the start of measurement, and then increased at a rate of 2°C per minute. Geometry (top): 8mm diameter, aluminum parallel plate Plate (bottom): 38mm diameter, alkali-free glass plate Shear rate: 1 min -1 Gap: 0.05mm Sample amount: 20 mg Atmosphere: Nitrogen flow

[0113] <Temperature at which fever begins> For the compositions of the examples and comparative examples, the exothermic onset temperature was measured using differential scanning calorimetry under the following <Measurement Condition 2>. The results are shown in Table 1. <Measurement Conditions 2> Equipment: Differential scanning calorimetry (Hitachi High-Tech Science Corporation "DSC6220") Temperature: Rise from 0°C to 150°C at a rate of 2°C per minute. Sample amount: 5 mg Atmosphere: Nitrogen flow

[0114] <Applicability> (Examples 1-3 and Comparative Examples 1-2) 25 μL of the composition was dropped onto a 50 mm square color filter, and the filter was placed on a hot plate at 60°C (or 90°C) with the side containing the composition facing upwards. Next, alkali-free glass, which had been preheated to 60°C (or 90°C) on a hot plate, was layered onto the surface on which the composition had been dropped. A 1 kg weight was then placed on top of it, and it was left to stand for 5 minutes. After standing for 5 minutes, the area over which the composition had spread was calculated using image calculation software. The results are shown in Table 1. (Comparative Example 3) 25 μL of the composition was dropped onto a 50 mm square color filter, and UV light at 600 mJ / cm² was applied to the surface where the composition was dropped using a high-pressure mercury lamp. 2 Irradiated it. Next, the container was placed on a hot plate at 60°C (or 90°C) with the side containing the dropped composition facing upwards. Next, alkali-free glass, which had been preheated to 60°C (or 90°C) on a hot plate, was layered onto the surface on which the composition had been dropped. A 1 kg weight was then placed on top of it, and it was left to stand for 5 minutes. After standing for 5 minutes, the area over which the composition had spread was calculated using image calculation software. The results are shown in Table 1.

[0115] <Curability> (Examples 1-3 and Comparative Examples 1-2) 25 μL of the composition was dropped onto a 50 mm square color filter, and the filter was placed on a 90°C hot plate with the side containing the composition facing upwards. Next, alkali-free glass, which had been preheated to 90°C on a hot plate, was layered onto the surface where the composition had been dropped. A 1kg weight was then placed on top of it, and the spread of the composition was visually confirmed. The time taken for the composition to stop moving and for the upper and lower substrates to become fixed and immobile was determined and defined as the curing time. The results are shown in Table 1. (Comparative Example 3) 25 μL of the composition was dropped onto a 50 mm square color filter, and UV light at 600 mJ / cm² was applied to the surface where the composition was dropped using a high-pressure mercury lamp. 2 Irradiated it. Next, the sample was placed on a 90°C hot plate with the side containing the dropped composition facing upwards. Next, alkali-free glass, which had been preheated to 90°C on a hot plate, was layered onto the surface where the composition had been dropped. A 1kg weight was then placed on top of it, and the spread of the composition was visually confirmed. The time taken for the composition to stop moving and for the upper and lower substrates to become fixed and immobile was determined and defined as the curing time. The results are shown in Table 1.

[0116] <Viscosity> The compositions of the examples and comparative examples, prepared within one hour, were measured using a B-type viscometer "HB DV3T" (cone plate used: CPA-40Z) manufactured by Eiko Seiki Co., Ltd., under conditions of 25°C and 50 rpm, and the resulting viscosity was V a0 Furthermore, the compositions of the examples and comparative examples were stored at room temperature (30°C) for one week, and then their viscosity was measured under the same conditions. The resulting viscosity was then defined as V. a1 The viscosity increase rate was calculated using the following formula. The results are shown in Table 1. Viscosity increase rate (unit: %) = (V a1 / V a0 ) × 100 - 100

[0117] [Table 1]

[0118] As shown in Table 1, Examples 1-3 had a larger wetting area and superior coatability compared to Comparative Examples 1 and 3. Furthermore, unlike Comparative Example 2, where curing was extremely slow and the curing time could not be measured, all of the Examples cured within a certain time. These findings indicate that the compositions of this embodiment exhibit an excellent balance of coatability and curability.

[0119] Furthermore, Examples 1-3 showed a smaller viscosity increase compared to Comparative Example 1. In other words, their storage stability was improved.

Claims

1. A composition comprising a cationic polymerizable compound (A), a cationic polymerization initiator (B), and a curing retarder (X), The curing retarder (X) comprises an amino acid derivative (X1), A composition wherein the amino acid derivative (X1) has an amide group and an ester group.

2. The composition according to claim 1, wherein the amino acid derivative (X1) includes an aspartic acid derivative.

3. The composition according to claim 1 or 2, wherein the amino acid derivative (X1) comprises a compound represented by the following general formula (1). 【Chemistry 1】 In general formula (1), R １ and R ２ Each of these is independently one or more selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a substituted alkyl group having 1 to 20 carbon atoms, an aryl group, and a substituted aryl group. R ３ Each of these is independently one or more selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a substituted alkyl group having 1 to 20 carbon atoms, an aryl group, and a substituted aryl group. R ４ Each of these is independently one or more selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a substituted alkyl group having 1 to 20 carbon atoms, an aryl group, and a substituted aryl group. m is an integer between 1 and 20, n is an integer between 1 and 20 (inclusive).

4. The composition according to claim 1 or 2, wherein the molecular weight of the amino acid derivative (X1) is 130 or more and 1000 or less.

5. The composition according to claim 1 or 2, wherein the content of the curing retarder (X) is 0.01 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A).

6. The composition according to claim 1 or 2, wherein the cationic polymerizable compound (A) contains an epoxy group.

7. The composition according to claim 6, wherein the cationic polymerizable compound (A) comprises one or more selected from the group consisting of an alicyclic compound having an epoxy group (A1), an aromatic compound having an epoxy group (A2), and a glycidyl ether compound (A3).

8. The composition according to claim 1 or 2, wherein the cationic polymerizable compound (A) contains a bromine atom.

9. The composition according to claim 1 or 2, wherein the cationic polymerization initiator (B) comprises a thermal cationic polymerization initiator.

10. The composition according to claim 1 or 2, wherein the cationic polymerization initiator (B) comprises an onium salt compound.

11. The composition according to claim 1 or 2, wherein the cationic polymerization initiator (B) comprises an ammonium salt compound.

12. The composition according to claim 1 or 2, wherein the content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A).

13. The composition according to claim 1 or 2, wherein, when viscosity measurement is performed according to the following <Measurement Condition 1>, the viscosity increase initiation temperature at which the viscosity change per unit time becomes 100 mPa·s / second is 45°C or higher and 95°C or lower. <Measurement Condition 1> Device: Rheometer Temperature: After being held at 25°C for 380 seconds, it rises at a rate of 2°C per minute. Geometry (top): 8mm diameter, aluminum parallel plate Plate (bottom): 38mm diameter, alkali-free glass plate Shear rate: 1 min －１ Gap: 0.05 mm Sample amount: 20 mg Atmosphere: Nitrogen flow

14. Let the viscosity 20 seconds after the start of measurement in the viscosity measurement be V ０ and the viscosity at ((the viscosity increase start temperature) - 10)°C be V １ . When １ V ０ / V is 3 or less, the composition according to claim 13

15. The aforementioned V ０ The composition according to claim 14, wherein the pressure is 0.01 mPa·s or more and 1000 mPa·s or less.

16. The aforementioned V １ The composition according to claim 14, wherein the pressure is 0.01 mPa·s or more and 500 mPa·s or less.

17. The composition according to claim 1 or 2, wherein the exothermic onset temperature in differential scanning calorimetry under the following <Measurement Condition 2> is 50°C or higher. <Measurement Condition 2> Equipment: Differential scanning calorimetry Temperature: Rise from 0°C to 150°C at a rate of 2°C per minute. Sample amount: 5 mg Atmosphere: Nitrogen flow

18. The composition according to claim 1 or 2, wherein the composition is used to encapsulate a light-emitting diode element.

19. The composition according to claim 18, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

20. A cured body obtained by curing the composition according to claim 1 or 2.

21. A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer formed by the cured body according to claim 20, positioned between the light-emitting diode element and the substrate.

22. The display device according to claim 21, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

23. The display device according to claim 21, wherein the substrate includes a color filter.

24. A step of applying the composition according to claim 1 or 2 to at least one of the first substrate and the second substrate, The process includes a step of bonding the first substrate and the second substrate together via the coated composition to obtain a laminate, A method for manufacturing a display device, wherein the first substrate includes a light-emitting diode element.

25. A method for manufacturing a display device according to claim 24, further comprising the step of curing the composition by heating the laminate.

26. A method for manufacturing a display device according to claim 24, wherein the method does not include a step of irradiating the composition applied to the substrate with ultraviolet light in order to cure the composition.

27. The method for manufacturing a display device according to claim 24, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

28. The method for manufacturing a display device according to claim 24, wherein the substrate includes a color filter.

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