Chip holding device
The chip holding device employs vacuum suction with independent air paths and a suppression structure to prevent pressure changes, addressing misalignment and particle issues, ensuring stable chip handling.
JP2026084321APending Publication Date: 2026-05-21TORAY ENG CO LTD
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TORAY ENG CO LTD
- Filing Date
- 2024-11-11
- Publication Date
- 2026-05-21
AI Technical Summary
Technical Problem
Chip holding devices using magnetic attraction methods face issues with attachment misalignment and particle generation due to collisions, while vacuum suction methods require multiple air paths that can lead to pressure changes and air leakage, causing malfunctions.
Method used
A chip holding device that uses vacuum suction to attach chips, featuring independent air paths and a suppression structure to prevent pressure changes, including radial and axial paths to isolate air flow and prevent eccentricity and air leakage.
Benefits of technology
The device effectively suppresses malfunctions caused by unexpected pressure changes, reducing attachment misalignment and particle generation, enhancing operational stability.
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Smart Images
Figure 2026084321000001_ABST
Abstract
This suppresses malfunctions caused by unexpected pressure changes in the air path. [Solution] A tip holding device 1 that holds a tip 11 so that it can rotate around an axis while the tip 11 is vacuum-adsorbed using a collet 4, comprising: a holder 2 including a rotating shaft 21 that rotates around the axis and a fixing part 22 that fixes the rotating shaft 21 to a housing H1; an attachment 3 that is detachably attached to the rotating shaft 21; and a collet 4 provided on the attachment 3, wherein the holder 2 includes a first air path 5 through which gas for vacuum-adsorbing the attachment 3 to the rotating shaft 21 passes; a second air path 6 through which at least one of gas for vacuum-adsorbing the tip 11 to the collet 4 and gas for releasing the vacuum adsorption between the collet 4 and the tip 11 passes; and a suppression structure 7 that suppresses pressure changes in the other air path due to pressure changes in one of the first air path 5 and the second air path 6.
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