Coating apparatus and coating method

Abstract

The objective is to provide a coating apparatus and coating method that can evaluate the condition of a film substrate at low cost. [Solution] The coating apparatus of the embodiment comprises a transport mechanism, a projection unit, an imaging unit, a control unit, and a coating unit. The transport mechanism transports the film substrate in a first direction. The projection unit projects an evaluation pattern onto the film substrate. The imaging unit photographs the evaluation pattern projected onto the film substrate. The control unit evaluates the state of the film substrate based on the imaging results from the imaging unit. The coating unit is located downstream of the projection unit and the imaging unit in the first direction and coats the surface of the film substrate with pattern material.

Description

Technical Field

[0001] Embodiments of the present invention relate to a coating apparatus and a coating method.

Background Art

[0002] A coating apparatus applies a pattern material to a film substrate to form a pattern. There is a need for a coating apparatus and a coating method that can evaluate the state of the film substrate on which the pattern material is applied at a low cost.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The problem to be solved by the present invention is to provide a coating apparatus and a coating method capable of evaluating the state of a film substrate at a low cost.

Means for Solving the Problems

[0005] The coating apparatus according to Aspect 1 of the embodiment includes a transport mechanism, a projection unit, a photographing unit, a control unit, and a coating unit. The transport mechanism transports the film substrate in a first direction. The projection unit projects an evaluation pattern onto the film substrate. The photographing unit photographs the evaluation pattern projected onto the film substrate. The control unit evaluates the state of the film substrate based on the photographing result of the photographing unit. The coating unit is disposed on the downstream side in the first direction of the projection unit and the photographing unit, and applies a pattern material to the surface of the film substrate.

[0006] The coating apparatus according to Aspect 2 is based on the coating apparatus according to Aspect 1. When the control unit detects deformation of the film substrate, the control unit controls the operation of the coating unit to apply the pattern material so that the pattern has a predetermined shape in a state where the deformation of the film substrate is corrected.

[0007] The coating apparatus of Embodiment 3 is based on the coating apparatus described in Embodiment 1 or 2. The evaluation pattern is a grid pattern.

[0008] The coating apparatus of Embodiment 4 is based on the coating apparatus described in any one of Embodiments 1 to 3. The film substrate is formed in a continuous, long length. The transport mechanism includes a feeding section and a winding section. The feeding section is located upstream of the projection section and the imaging section in the first direction and feeds the film substrate from the roll of film substrate. The winding section is located downstream of the coating section in the first direction and winds the film substrate onto the roll of film substrate.

[0009] The coating apparatus of Embodiment 5 is based on the coating apparatus described in any one of Embodiments 1 to 3. The film substrate is divided into sheets. The transport mechanism transports the trays on which the film substrates are placed in a transport line in a first direction.

[0010] The coating apparatus of embodiment 6 is based on the coating apparatus described in any one of embodiments 1 to 5. The coating apparatus further includes a foreign matter removal unit. The foreign matter removal unit is positioned between the projection unit and the imaging unit and the coating unit in a first direction and removes foreign matter from the surface of the film substrate. When the control unit detects foreign matter, it drives the foreign matter removal unit to remove the foreign matter.

[0011] The coating apparatus of Embodiment 7 is based on the coating apparatus described in Embodiment 6. The foreign matter removal unit removes static electricity from the area of ​​the film substrate where foreign matter is present, and then removes the foreign matter by blowing air onto it.

[0012] The coating apparatus of embodiment 8 is based on the coating apparatus described in embodiment 4. The control unit detects foreign matter on the surface of the film substrate and, when it determines that the foreign matter cannot be removed from the film substrate, does not apply the pattern material to the pattern formation area where the foreign matter is present.

[0013] The coating apparatus of embodiment 9 is based on the coating apparatus described in embodiment 5. The coating apparatus further includes a tray removal unit. The tray removal unit is positioned between the projection unit and the imaging unit and the coating unit in a first direction and removes trays from the transport line. The control unit detects foreign matter on the surface of the film substrate and, when it determines that the foreign matter cannot be removed from the film substrate, drives the tray removal unit to remove the tray containing the foreign matter from the transport line. [Brief explanation of the drawing]

[0014] [Figure 1] A schematic diagram of the coating apparatus according to the first embodiment. [Figure 2] A perspective view showing an example of the bending deformation of a film substrate. [Figure 3] A plan view showing an example of a grid pattern projected onto a film substrate. [Figure 4] A plan view showing the first example of the operation of the coating apparatus. [Figure 5] A plan view showing a second example of the operation of the coating apparatus. [Figure 6] A plan view showing an example of a grid pattern projected onto a foreign object. [Figure 7] An explanatory diagram of the coating apparatus according to the second embodiment. [Modes for carrying out the invention]

[0015] The coating apparatus and coating method of the embodiment will be described below with reference to the drawings. (First Embodiment) Figure 1 is a schematic diagram of the coating apparatus 10 of the first embodiment. The coating apparatus 10 of the first embodiment is an apparatus that forms a pattern P by coating a pattern material Pm onto a continuous, long film substrate 1. The film substrate 1 is formed in a film shape from a resin material or the like. The film substrate 1 is formed in a continuous, long length.

[0016] In this application, the X-direction, Y-direction, and Z-direction of the orthogonal coordinate system are defined as follows. The X-direction (first direction) is the conveyance direction of the film substrate 1 in the coating apparatus 10. The +X side is the downstream side in the conveyance direction, and the -X side is the upstream side in the conveyance direction. The Y-direction is the width direction of the film substrate 1 being conveyed. The Z-direction is the thickness direction of the film substrate 1 being conveyed.

[0017] The coating apparatus 10 includes a conveyance mechanism 20, a projection unit 12, a photographing unit 13, a coating unit 15, and a control unit 18. The conveyance mechanism 20 conveys the film substrate 1 in the X-direction along a conveyance line 21 extending in the X-direction. The conveyance mechanism 20 includes a pay-out unit 22 and a take-up unit 23. The pay-out unit 22 is disposed on the -X side of the projection unit 12 and the photographing unit 13. The pay-out unit 22 pays out the film substrate 1 from a roll body of the film substrate 1. The take-up unit 23 is disposed on the +X side of the coating unit 15. The take-up unit 23 winds up the film substrate 1 onto a roll body of the film substrate 1. The coating apparatus 可以在塗布部15和巻取り部23之间具有干燥部。干燥部用于干燥在塗布部15中涂覆在フィルム基板1表面上的图案材料。干燥方法包括吹气干燥(如气体吹扫)、在烤箱中进行的烘焙干燥、在真空环境中进行的真空干燥等。

[0018] The conveyance mechanism 20 may have a guide roller (not shown) between the pay-out unit 22 and the take-up unit 23 of the film substrate 1. The rotation axis of the guide roller is parallel to the Y-direction. A plurality of guide rollers are arranged at intervals in the X-direction. The guide roller abuts on the surface of the -Z side of the film substrate 1 and supports the film substrate 1. The guide roller rotates passively as the film substrate 1 moves in the X-direction.

[0019] The conveyance mechanism 20 may have a support plate (not shown) between the pay-out unit 22 and the take-up unit 23 of the film substrate 1. The support plate abuts on substantially the entire surface of the -Z side of the film substrate 1 and supports the film substrate 1.

[0020] The coating device 10 has an evaluation region R1 and a coating region R2 of the film substrate 1 between the feeding portion 22 and the winding portion 23 of the film substrate 1. The evaluation region R1 is a region for evaluating the state of the film substrate 1. The coating region R2 is a region for coating the pattern material Pm on the film substrate 1. The evaluation region R1 is arranged on the -X side, and the coating region R2 is arranged on the +X side.

[0021] The projection unit 12 and the imaging unit 13 are arranged on the +Z side of the evaluation region R1. The projection unit 12 projects an evaluation pattern onto the film substrate 1 in the evaluation region R1. The light of the evaluation pattern is light with a wavelength reflected by the surface of the film substrate 1 and is light with a wavelength different from the color of the film substrate 1 itself. The evaluation pattern in the first embodiment is a grid pattern L.

[0022] The imaging unit 13 captures the evaluation pattern projected onto the film substrate 1 in the evaluation region R1. The imaging unit 13 transmits the captured image to the control unit 18. The imaging unit 13 is a camera. The number of pixels of a camera that can be used at an appropriate cost is about 4000×5000 pix. In this case, the resolution is about 7 to 10 μm and has a resolution of 2 pixels or more. In this case, it is desirable that the line width of the grid pattern L projected by the projection unit 12 be 14 μm or more and the line interval of the grid pattern be 14 μm or more. In addition, in order to accurately detect the distortion period of the grid pattern L, it is desirable that the line interval of the grid pattern be 70 μm or more.

[0023] The coating unit 15 is positioned on the +Z side of the coating region R2. The coating unit 15 is positioned on the +X side of the projection unit 12 and the imaging unit 13. The coating unit 15 applies a pattern material Pm to the surface of the film substrate 1 to form a pattern P. The coating unit 15 is used to form, for example, an electrode pattern P for a solar cell. As the pattern material Pm, examples of device forming materials that can be fabricated by coating include metal pastes made from metal particles such as silver, copper, and aluminum, or precursor solutions for perovskite solar cells. In the case of metal pastes, glass frit and organic solvents may be further included. In the case of precursor solutions for perovskite solar cells, a coating solution containing a perovskite structure precursor compound and an organic solvent capable of dissolving this precursor compound is applied to the substrate to form a coating film. It is preferable to perform a prior surface treatment on the substrate to be coated in order to obtain high wettability to the coating solution. Specifically, this can be done by UV-ozone treatment or plasma treatment. The solvents used in the coating solution include, for example, N,N-dimethylformamide (DMF), γ-butyrolactone, and dimethyl sulfoxide (DMSO). The solvent is not restricted as long as it can dissolve the material, and it may be mixed. The perovskite structure can be formed by applying a single coating solution in which all the raw materials that form the perovskite structure are dissolved in one solution. Alternatively, multiple raw materials that form the perovskite structure may be prepared as multiple solutions, or multiple coating solutions, and applied sequentially. The coating solution may further contain additives. The coating solution containing the perovskite structure precursor may be applied two or more times.

[0024] The coating unit 15 is, for example, an inkjet head. The inkjet head has a plurality of nozzles arranged in the X and Y directions. The inkjet head dispenses droplets of pattern material Pm from the plurality of nozzles to coat the pattern material Pm. The inkjet head is movable in at least the Z direction. The coating unit 15 may also be a slit die.

[0025] The control unit 18 is a microcomputer equipped with a processor such as a CPU or GPU. The control unit 18 has the function of controlling the operation of each part of the coating apparatus 10. The functions of the control unit 18 are realized, for example, by the execution of a program by the processor such as the CPU. In addition, some or all of the functions of the control unit 18 may be realized by hardware such as an LSI (Large Scale Integration), ASIC (Application Specific Integrated Circuit), or FPGA (Field-Programmable Gate Array), or by the cooperation of software and hardware.

[0026] The control unit 18 receives the image captured by the imaging unit 13. Based on the imaging results from the imaging unit 13, the control unit 18 evaluates the condition of the film substrate. The condition of the film substrate to be evaluated includes deformation of the film substrate and adhesion of foreign matter to the film substrate. Deformation of the film substrate includes bending of the film substrate 1 in the Z direction and elongation in the X direction.

[0027] Figure 2 is a perspective view showing an example of the bending deformation of the film substrate 1. The bending deformation of the film substrate 1 is exaggerated in Figure 2. Figure 3 is a plan view showing an example of a grid pattern L projected onto the film substrate 1. The projection unit 12 projects the grid pattern L onto the film substrate 1 which has been deformed as shown in Figure 2. At this time, the imaging unit 13 captures an image of the grid pattern L displayed as shown in Figure 3.

[0028] In Figures 2 and 3, the regions on the +X and +Y sides are designated as the first region a, and the regions on the -X and +Y sides are designated as the second region b. Furthermore, the regions on the -X and -Y sides are designated as the third region c, and the regions on the +X and -Y sides are designated as the fourth region d. The reference area is defined as the area of ​​a unit section of the grid pattern L when the grid pattern L is projected onto a flat film substrate 1 and photographed. A unit section of the grid pattern L is the smallest section enclosed by lines extending in the X direction and lines extending in the Y direction of the grid pattern L.

[0029] In the second region b, as shown in Figure 2, the film substrate 1 is bent to the +Z side, so the area of ​​the unit section of the grid pattern L is larger than the reference area, as shown in Figure 3. In the third region c, as shown in Figure 2, the film substrate 1 is bent to the -Z side, so the area of ​​the unit section of the grid pattern L is smaller than the reference area, as shown in Figure 3. Between the first region a and the fourth region d, as shown in Figure 2, the film substrate 1 is bent to the +Z side, so the area of ​​the unit section of the grid pattern L is smaller than the reference area, as shown in Figure 3. The relationship between the bending of the film substrate 1 in the Z direction and the change in the area of ​​the unit section of the grid pattern L is due to perspective.

[0030] The control unit 18 acquires an image of the grid pattern L from the imaging unit 13. The control unit 18 detects the amount of deflection of the film substrate 1 in the Z direction based on the area of ​​the unit section of the grid pattern L. The relationship between the area of ​​the unit section of the grid pattern L and the amount of deflection of the film substrate 1 in the Z direction is recorded in advance in a table. This table is stored in advance in the memory area of ​​the control unit 18. The control unit 18 detects the amount of deflection of the film substrate 1 in the Z direction by referring to this table.

[0031] Furthermore, the position of the intersection of the grid pattern L when the grid pattern L is projected onto a flat film substrate 1 is defined as the reference position. The position of the intersection of the grid pattern L when the grid pattern L is projected onto a film substrate 1 that is bent in the Z direction is defined as the deformed position. Due to perspective, the deformed position is separated from the reference position. The control unit 18 calculates the separation direction and separation distance between the reference position and the deformed position for each intersection. The control unit 18 may also detect the bending direction and amount of bending at each intersection based on the calculated separation direction and separation distance.

[0032] The control unit 18 controls the operation of the coating unit 15 based on the evaluation result of the state of the film substrate 1 to coat the surface of the film substrate 1 with pattern material Pm. When the control unit 18 detects deformation of the film substrate 1, it corrects the coating conditions of the coating unit 15 so that the pattern P takes on a predetermined shape when the deformation of the film substrate 1 is corrected, and then coats the pattern material Pm. The coating conditions include the coating position and coating timing. For example, in a part of the film substrate 1 that is bent by a height D1 in the +Z direction, the coating unit 15 is moved by a height D1 in the +Z direction and the pattern material Pm is coated. In the case of slit die coating, the only coating condition is the coating timing.

[0033] Figure 4 is a plan view showing a first example of the operation of the coating apparatus 10. In this first example, the grid pattern L shown on the left side of Figure 4 is displayed in the evaluation region R1. The control unit 18 detects the amount of deflection of the film substrate 1 in the Z direction based on the grid pattern L.

[0034] The control unit 18 drives the transport mechanism 20 to transport the film substrate 1 from the evaluation area R1 to the coating area R2. The support state of the film substrate 1 in the coating area R2 is set to be the same as in the evaluation area R1. Based on the detection result of the amount of deflection of the film substrate 1 in the Z direction, the control unit 18 corrects the coating conditions of the coating unit 15. As shown in the center of Figure 4, the coating unit 15 applies the pattern material Pm to form a pattern P.

[0035] The film substrate 1 on which pattern P is formed is cut at predetermined positions in the X and Y directions. The individual pieces of film substrate 1 are combined with other components to form a product. In the finished product, the deformation of the film substrate 1 is corrected. That is, the curvature of the film substrate 1 is corrected and it becomes flat. In this state, the pattern P on the film substrate 1 has a predetermined shape, as shown on the right side of Figure 4. In this way, the pattern material Pm is applied in the coating area R2 so that the pattern P has a predetermined shape when the deformation of the film substrate 1 is corrected.

[0036] Figure 5 is a plan view showing a second example of the operation of the coating apparatus 10. In the second example, the grid pattern L shown on the left side of Figure 5 is displayed in the evaluation area R1. In the second example, the film substrate 1 in the evaluation area R1 is stretched in the X direction. In this case, the width of the film substrate 1 in the Y direction becomes smaller compared to when it is not stretched. The grid pattern L that is displayed at the edge in the Y direction when the film substrate 1 is not stretched is no longer displayed when it is stretched. Therefore, the control unit 18 detects the amount of shrinkage in the Y direction and the amount of stretching in the X direction of the film substrate 1 based on the number of grid patterns displayed side by side in the Y direction.

[0037] Furthermore, when the film substrate 1 is stretched in the X direction, the thickness of the film substrate 1 in the Z direction becomes smaller compared to when it is not stretched. Therefore, the control unit 18 may detect the amount of stretching in the X direction and the amount of shrinkage in the Y direction by measuring the thickness of the film substrate 1 in the Z direction. The thickness of the film substrate 1 in the Z direction can be measured by the principle of spectral ellipsometry. In this case, a reflector is brought into contact with the -Z side surface of the film substrate 1, and observation light is incident on the +Z side surface of the film substrate 1. The light emitted from the +Z side of the film substrate 1 is polarized according to the thickness of the film substrate 1. The control unit 18 measures the thickness of the film substrate 1 in the Z direction by evaluating this polarization. The measurement of the thickness of the film substrate 1 by the principle of spectral ellipsometry may be performed on the -X side of the evaluation region R1.

[0038] The control unit 18 drives the transport mechanism 20 to transport the film substrate 1 from the evaluation area R1 to the coating area R2. The amount of elongation of the film substrate 1 in the X direction in the coating area R2 is the same as in the evaluation area R1. The control unit 18 controls the operation of the coating unit 15 to apply the pattern material Pm so that the pattern P takes on a predetermined shape when the deformation of the film substrate 1 is corrected. The control unit 18 discharges the pattern material Pm from an appropriate nozzle according to the amount of elongation in the X direction and shrinkage in the Y direction of the film substrate 1. This forms the pattern P shown in the center of Figure 5.

[0039] The film substrate 1 is cut at predetermined positions in the X and Y directions to form the final product. In the final product state, the elongation in the X direction and contraction in the Y direction of the film substrate 1 are corrected. In this state, the pattern P on the film substrate 1 has a predetermined shape, as shown on the right side of Figure 5. Thus, the pattern material Pm is applied in the coating area R2 so that the pattern P has a predetermined shape with the deformation of the film substrate 1 corrected.

[0040] Figure 6 is a plan view showing an example of a grid pattern projected onto foreign matter B. Foreign matter B may adhere to the surface of the film substrate 1. Foreign matter B is, for example, dust or patterning dust. The projection unit 12 projects the grid pattern L onto the film substrate 1 to which foreign matter B is attached. The imaging unit 13 captures an image of the grid pattern L displayed as shown in Figure 6.

[0041] As mentioned above, when the film substrate 1 is deflected in the Z direction, there are both parts where the area of ​​the unit section of the grid pattern L is larger than the reference area and parts where it is smaller than the reference area. In contrast, when foreign matter B is attached, there are only parts where the area of ​​the unit section of the grid pattern L is larger than the reference area. The control unit 18 acquires an image of the grid pattern L from the imaging unit 13. Based on the presence or absence of parts where the area of ​​the unit section of the grid pattern L is larger than the reference area and parts where it is smaller than the reference area, the control unit 18 detects the attachment of foreign matter B to the film substrate 1.

[0042] If the film substrate 1 experiences deflection in the Z direction, the grid pattern L will periodically become distorted. In contrast, if foreign matter B is present, the distortion of the grid pattern L will occur locally. The control unit 18 calculates the distortion by taking the second derivative of the signal intensity changes in the X and Y directions of the grid pattern L. The second derivative of the grid pattern L indicates the steepness of the distortion of the grid pattern L. Based on the calculation results, if it is determined that the distortion of the grid pattern L is localized, the presence of foreign matter B on the film substrate 1 may be detected.

[0043] When the film substrate 1 is deflected in the Z direction, the grid pattern L changes continuously. In contrast, when foreign matter B is attached, the grid pattern L changes discontinuously. Therefore, the control unit 18 may detect the attachment of foreign matter B to the film substrate 1 based on the results of machine learning of the grid pattern L when foreign matter B is attached.

[0044] As shown in Figure 1, the coating apparatus 10 has a foreign matter removal section 30 between the evaluation area R1 and the coating area R2. The foreign matter removal section 30 removes foreign matter adhering to the surface of the film substrate 1. The foreign matter removal section 30 includes a static eliminator and a blower (neither of which are shown). The static eliminator eliminates static electricity in the area of ​​the film substrate 1 where foreign matter is present. The static eliminator is, for example, an ionizer that irradiates the film substrate 1 with counterions to the charge. The blower blows air onto the foreign matter, blowing it away and removing it. The foreign matter removal section 30 may also remove foreign matter B using a wiper, brush, or a micro-adhesive sheet. The foreign matter removal section 30 may also remove foreign matter B by applying ultrasonic vibration to the film substrate 1.

[0045] The control unit 18 drives the transport mechanism 20 to move the film substrate 1 in the evaluation area R1 to the foreign matter removal unit 30. The control unit 18 drives the foreign matter removal unit 30 to remove foreign matter adhering to the surface of the film substrate 1. The control unit 18 drives the transport mechanism 20 to transport the film substrate 1 to the coating area R2. The control unit 18 drives the coating unit 15 to coat the pattern material Pm. As a result, a pattern P is accurately formed on the film substrate 1 from which the foreign matter B has been removed.

[0046] When the control unit 18 detects the presence of foreign matter B on the film substrate 1, it determines whether the foreign matter B is of a size that can be removed. If the size of the foreign matter B exceeds a preset threshold, the control unit 18 determines that it is impossible to remove the foreign matter B. When the control unit 18 determines that it is not possible to remove the foreign matter B from the film substrate 1, it does not apply the pattern material Pm to the pattern formation area of ​​the pattern P where the foreign matter B is present. This helps to suppress the generation of defective products. Conversely, the control unit 18 applies the pattern material Pm to the pattern formation area of ​​the pattern P where no foreign matter B is present. This helps to improve the yield of the film substrate 1.

[0047] As detailed above, the coating apparatus 10 of the embodiment includes a transport mechanism 20, a projection unit 12, an imaging unit 13, a control unit 18, and a coating unit 15. The transport mechanism 20 transports the film substrate 1 in the X direction. The projection unit 12 projects an evaluation pattern onto the film substrate 1. The imaging unit 13 photographs the evaluation pattern projected onto the film substrate 1. The control unit 18 evaluates the state of the film substrate 1 based on the imaging results from the imaging unit 13. The coating unit 15 is located on the +X side of the projection unit 12 and the imaging unit 13, and applies a pattern material Pm to the surface of the film substrate 1 to form a pattern P.

[0048] The condition of the film substrate 1 can be evaluated by projecting an evaluation pattern onto it. Since there is no need to pre-print the evaluation pattern on the film substrate 1, the condition of the film substrate 1 can be evaluated at low cost.

[0049] When the control unit 18 detects deformation of the film substrate 1, it controls the operation of the coating unit 15 to apply the pattern material Pm so that the pattern P takes on a predetermined shape when the deformation of the film substrate 1 is corrected. This allows for the precise formation of pattern P.

[0050] The evaluation pattern is grid pattern L. The condition of the film substrate 1 can be accurately evaluated based on the area and number of units in the grid pattern L.

[0051] The film substrate 1 is formed in a continuous, long length. The transport mechanism 20 includes a feeding unit 22 and a winding unit 23. The feeding unit 22 is located on the -X side of the projection unit 12 and the imaging unit 13, and feeds the film substrate 1 from the roll of film substrate 1. The winding unit 23 is located on the +X side of the coating unit 15, and winds the film substrate 1 onto the roll of film substrate 1. By evaluating the state of a continuous, long film substrate 1, the pattern P can be formed with high precision.

[0052] The coating apparatus 10 further includes a foreign matter removal unit 30. The foreign matter removal unit 30 is positioned between the projection unit 12 and the imaging unit 13 and the coating unit 15 in the X direction and removes foreign matter B from the surface of the film substrate 1. When the control unit 18 detects foreign matter B, it drives the foreign matter removal unit 30 to remove the foreign matter B. This allows for the precise formation of the pattern P on the film substrate 1 from which the foreign matter B has been removed.

[0053] The foreign matter removal unit 30 removes static electricity from the area of ​​the film substrate 1 where the foreign matter B is present, and then removes the foreign matter B by blowing air onto it. This allows for the proper removal of foreign matter B adhering to the film substrate 1.

[0054] The control unit 18 detects foreign matter B on the surface of the film substrate 1, and when it determines that the foreign matter B cannot be removed from the film substrate 1, it does not apply the pattern material Pm to the pattern formation area P where the foreign matter B is present. In areas where foreign matter B is present, pattern P cannot be formed accurately. By not applying pattern material Pm to these areas, the occurrence of defective products can be suppressed.

[0055] (Second Embodiment) Figure 7 is an explanatory diagram of the coating apparatus of the second embodiment. The coating apparatus 10 of the second embodiment differs from the first embodiment in that it targets film substrates 5 divided into single sheets. Descriptions of the second embodiment that are the same as the first embodiment may be omitted.

[0056] As shown on the left side of Figure 7, the film substrate 5, divided into individual sheets, is placed on the tray T. The film substrate 5 is temporarily fixed to the tray T with a weak adhesive. The film substrate 5 can be peeled off the tray T by irradiation of the weak adhesive with ultraviolet light or by heating. The transport mechanism 20 shown in Figure 1 transports trays T on which film substrates 5 are placed in a line 21 in the X direction.

[0057] The film substrate 5 may be temporarily fixed to the tray T while stretched in the X or Y direction. The projection unit 12 projects an evaluation pattern onto the film substrate 5 in the evaluation area R1. The evaluation pattern is a frame pattern F that corresponds to the contour of the film substrate 5 when it is positioned in a predetermined location and not stretched, as shown in the center of Figure 7. The imaging unit 13 captures images of the film substrate 5 and the projected frame pattern F. The control unit 18 receives the images captured by the imaging unit 13.

[0058] The control unit 18 checks the corners of the film substrate 5 and the frame pattern F. The control unit 18 checks at least three of the four corners of both. As shown on the right side of Figure 7, the control unit 18 determines the direction and amount of misalignment of the corners of both. This allows the control unit 18 to detect the positional displacement of the film substrate 5. The control unit 18 also detects the direction and amount of expansion and contraction of the film substrate 5.

[0059] The control unit 18 drives the transport mechanism 20 to transport the film substrate 5 in the evaluation area R1 to the coating area R2. The control unit 18 controls the coating section 15 to apply the pattern material Pm so that the pattern P takes on a predetermined shape when the deformation of the film substrate 5 is corrected. The control unit 18 discharges the pattern material Pm from an appropriate nozzle according to the misalignment, expansion / contraction direction, and amount of expansion / contraction of the film substrate 5.

[0060] After the pattern P is formed, the film substrate 5 is peeled off from the tray T. In the peeled state, the expansion and contraction of the film substrate 5 is corrected. In this state, the pattern P is in a predetermined shape. In this way, the pattern material Pm is applied in the coating area R2 so that the pattern P is in a predetermined shape with the deformation of the film substrate 5 corrected.

[0061] The control unit 18, similar to the first embodiment, drives the foreign matter removal unit 30 shown in Figure 1 to remove the foreign matter B adhering to the film substrate 5. The coating apparatus 10 of the second embodiment has a tray removal unit 35 in addition to the foreign matter removal unit 30. The tray removal unit 35 is located between the evaluation area R1 and the coating area R2. The tray removal unit 35 removes a specific tray from the transport line 21.

[0062] The control unit 18 determines, similar to the first embodiment, whether the foreign matter B is of a size that can be removed. When the control unit 18 determines that the foreign matter B cannot be removed from the film substrate 5, it drives the tray removal unit 35 to remove the tray T containing the foreign matter B from the transport line 21. This suppresses the generation of defective products. The control unit 18 leaves the other trays T on the transport line 21 and applies the pattern material Pm to the film substrate 5. This suppresses the shutdown of the coating apparatus 10, thereby improving the productivity of the coating apparatus 10.

[0063] As detailed above, the film substrate 5 of the second embodiment is divided into single sheets. The transport mechanism 20 transports the trays T on which the film substrates 5 are placed in the transport line 21 in the X direction. By evaluating the state of the film substrate 5, which is divided into individual sheets, the pattern P can be formed with high precision.

[0064] The coating apparatus 10 further includes a tray removal unit 35. The tray removal unit 35 is positioned between the projection unit 12 and the imaging unit 13 and the coating unit 15 in the X direction and removes the tray T from the transport line 21. The control unit 18 detects foreign matter B on the surface of the film substrate 5 and, when it determines that the foreign matter B cannot be removed from the film substrate 5, drives the tray removal unit 35 to remove the tray T containing the foreign matter B from the transport line 21. The pattern P cannot be accurately formed on the film substrate 5 where foreign matter B is present. By removing the tray T on which this film substrate 5 is placed from the transport line 21, the occurrence of defective products can be suppressed.

[0065] In the embodiment described above, the projection unit 12 projects an evaluation pattern onto the film substrate. In addition to the evaluation pattern, the projection unit 12 may also project position information and ID information of the film substrate. The imaging unit 13 captures the position information and ID information in addition to the evaluation pattern projected onto the film substrate. This makes it possible to retrospectively obtain the position information and ID information of the film substrate whose condition has been evaluated.

[0066] In the embodiment described above, the control unit 18 evaluates the state of the film substrate based on the image capture results of the projected evaluation pattern. Alternatively, the state of the film substrate can also be measured using methods such as the active stereo light section method, the active stereo light slit projection method, the illuminance difference stereo method, and the interferometry method. The active stereo light section method uses a device that projects light and an optical camera for measurement. The active stereo light slit projection method projects slit light onto an object, and the rate of light change is captured by a camera for measurement. The illuminance difference stereo method is a method of measurement that uses images captured while shining multiple lights onto the object to be inspected and switching between the lights. The interferometry method uses interference fringes created for each optical path difference of 1 / 2 wavelength when the reflected light from the measurement surface and the reflected light from the reference surface interfere. With these methods, it is not necessary to pre-print evaluation patterns, etc., on the film substrate 1. Therefore, the state of the film substrate 1 can be evaluated at low cost.

[0067] According to at least one embodiment described above, the system includes a projection unit 12 that projects an evaluation pattern onto the film substrate 1, an imaging unit 13 that photographs the evaluation pattern projected onto the film substrate 1, and a control unit 18 that evaluates the state of the film substrate 1 based on the imaging results from the imaging unit 13. This allows for low-cost evaluation of the state of the film substrate 1.

[0068] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims and their equivalents. [Explanation of Symbols]

[0069] B...Foreign matter, F...Frame pattern (evaluation pattern), L...Grid pattern (evaluation pattern), P...Pattern, Pm...Pattern material, T...Tray, 1,5...Film substrate, 10...Coating device, 12...Projection unit, 13...Photography unit, 15...Coating unit, 18...Control unit, 20...Transportation mechanism, 21...Transportation line, 22...Feeding unit, 23...Winding unit, 30...Foreign matter removal unit, 35...Tray removal unit.

Claims

1. A transport mechanism for transporting a film substrate in a first direction, A projection unit that projects an evaluation pattern onto the film substrate, A camera unit for capturing the evaluation pattern projected onto the film substrate, A control unit that evaluates the state of the film substrate based on the imaging results of the imaging unit, The projection unit and the imaging unit are located downstream in the first direction, and include a coating unit that applies a pattern material to the surface of the film substrate to form a pattern, Coating device.

2. When the control unit detects deformation of the film substrate, it controls the operation of the coating unit to apply the pattern material so that the pattern takes on a predetermined shape when the deformation of the film substrate is corrected. The coating apparatus according to claim 1.

3. The aforementioned evaluation pattern is a grid pattern. The coating apparatus according to claim 1 or 2.

4. The aforementioned film substrate is formed in a continuous, elongated manner. The aforementioned transport mechanism is A feeding unit is positioned upstream of the projection unit and the imaging unit in the first direction, and feeds the film substrate from the roll body of the film substrate, The coating portion is located downstream in the first direction and includes a winding portion for winding the film substrate onto the roll body of the film substrate, The coating apparatus according to claim 1 or 2.

5. The aforementioned film substrate is divided into sheets, The transport mechanism transports trays on which the film substrates are placed in a line in a first direction. The coating apparatus according to claim 1 or 2.

6. The device further comprises a foreign matter removal unit, which is positioned between the projection unit and the imaging unit and the coating unit in the first direction, and which removes foreign matter from the surface of the film substrate. When the control unit detects the foreign object, it drives the foreign object removal unit to remove the foreign object. The coating apparatus according to claim 1 or 2.

7. The foreign matter removal unit removes static electricity from the area of ​​the film substrate where the foreign matter is present, and then removes the foreign matter by blowing air onto it. The coating apparatus according to claim 6.

8. The control unit detects foreign matter on the surface of the film substrate and, when it determines that the foreign matter cannot be removed from the film substrate, it refrains from applying the pattern material to the pattern formation region where the foreign matter is present. The coating apparatus according to claim 4.

9. The system further includes a tray removal unit, which is positioned between the projection unit and the imaging unit and the coating unit in the first direction, and removes the tray from the transport line. The control unit detects foreign matter on the surface of the film substrate, and when it determines that the foreign matter cannot be removed from the film substrate, it drives the tray removal unit to remove the tray containing the foreign matter from the transport line. The coating apparatus according to claim 5.

10. A step of transporting the film substrate in a first direction, The steps include projecting an evaluation pattern onto the film substrate, The steps include taking a photograph of the evaluation pattern projected onto the film substrate, A step of evaluating the state of the film substrate based on the results of the evaluation pattern, The process includes the step of applying a pattern material to the surface of the film substrate to form a pattern based on the evaluation result of the state of the film substrate, Application method.

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