Substrate processing equipment

Abstract

The present invention provides a substrate processing apparatus that allows for the cleaning of substrates using a cleaning tool and the replacement of the cleaning tool, while also improving the flexibility of the layout of multiple components. [Solution] The brush device 50 is detachable from the brush holder 111. The brush holder 111 is moved by a moving device. The brush of the brush device 50 is pressed against the upper surface of the substrate W held by the substrate holder 10, and the substrate W is cleaned. Inside the substrate cleaning device 1, with one brush device 50 attached to the brush holder 111, the other brush devices 50 are stored in the brush storage device 230. After the old brush device 50 is removed, the brush holder 111 is moved to the brush storage device 230 by the moving device. The other brush device 50 is attached to the brush holder 111. The moving device includes an arm rotation drive unit 141 and an arm movement drive unit 142 that move the brush holder 111 in two different directions.

Description

Technical Field

[0006]

[0001] The present invention relates to a substrate processing apparatus that cleans a substrate by bringing a cleaning tool into contact with the substrate.

Background Art

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates.

[0003] As an example of a substrate processing apparatus, Patent Document 1 describes a substrate processing apparatus that cleans a substrate using a brush. The substrate processing apparatus includes a holding and rotating unit, a brush, a brush holding unit, an arm, a lifting mechanism, and a turning drive unit. The holding and rotating unit rotates the substrate around a vertical axis while holding the substrate in a horizontal posture. The brush holding unit is provided at the tip of the arm and detachably holds the brush.

[0004] The arm moves up and down by the lifting mechanism and the turning drive unit and rotates around a vertical axis. With the brush attached to the brush holding unit, the brush is slid on the substrate as the arm moves. Thereby, the substrate is cleaned.

[0005] <00000!8>The brush used for cleaning becomes contaminated or worn depending on its usage state. A brush in an excessive contamination state or worn state cannot clean the substrate properly. Therefore, the above-described substrate processing apparatus further includes a brush recovery unit and a brush attachment unit as a configuration for replacing the brush held by the brush holding unit.

[0006] <000002!]]When replacing the brush, the used brush is recovered from the brush holding unit by the brush recovery unit. Thereafter, in the brush attachment unit, an unused brush stored in advance is attached to the brush holding unit.

Prior Art Documents

[0007] [Patent Document 1] Japanese Patent Publication No. 2024-119352 [Overview of the project] [Problems that the invention aims to solve]

[0008] The substrate processing apparatus described in Patent Document 1 further includes, in addition to the above-mentioned components, a standby pod for housing brushes when not in use. In this substrate processing apparatus, the holding and rotating part, brush retrieval part, brush mounting part, and standby pod must be arranged in a plan view along the path of the brush holding part that moves with the rotation of the arm. Such limitations on the layout of the multiple components make it difficult to miniaturize the substrate processing apparatus, or limit the expansion of the functionality of the substrate processing apparatus.

[0009] The object of the present invention is to provide a substrate processing apparatus that allows for the cleaning of substrates using a cleaning tool and the replacement of the cleaning tool, and that offers improved flexibility in the layout of multiple components. [Means for solving the problem]

[0010] A substrate processing apparatus according to one aspect of the present invention includes: a substrate holding section for holding a substrate; a first cleaning tool and a second cleaning tool, each having a first connection section; a first cleaning tool holding section having a first connection section that can be attached to or detached from the first connection sections of the first and second cleaning tools; a first cleaning tool storage section provided outside the substrate holding section for temporarily storing the second cleaning tool; a first holding section moving device for moving the first cleaning tool holding section; and a device for controlling the first holding section moving device while the first cleaning tool holding section is holding the first cleaning tool. The system includes a control unit that controls the first holding unit moving device to connect the first connection portion of the first cleaning tool holding unit to the first connected portion of the second cleaning tool temporarily stored in the first cleaning tool storage unit, after the first cleaning tool used to clean the substrate has been removed from the first cleaning tool holding unit, wherein the first holding unit moving device includes a first drive unit and a second drive unit that move the first cleaning tool holding unit in a first and second direction, respectively, which are different from each other. [Effects of the Invention]

[0011] According to the present invention, in a substrate processing apparatus that allows for the cleaning of substrates with a cleaning tool and the replacement of the cleaning tool, the degree of freedom in the layout of multiple components is improved. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention. [Figure 2] This figure illustrates the state of the substrate in the substrate cleaning apparatus shown in Figure 1 before the brush cleaning process. [Figure 3] This figure illustrates the basic operation of the substrate cleaning apparatus shown in Figure 1 during the brush cleaning process of a substrate. [Figure 4] Figure 1 is a diagram illustrating the basic operation during the replacement process of the brush device in the substrate cleaning apparatus. [Figure 5]It is a diagram for explaining the basic operation during the replacement process of the brush device in the substrate cleaning apparatus of FIG. 1. [Figure 6] It is an external perspective view of the brush device. [Figure 7] It is a longitudinal sectional view of the brush device of FIG. 6. [Figure 8] It is an external perspective view of the brush device connection part. [Figure 9] It is a longitudinal sectional view of the brush device connection part of FIG. 8. [Figure 10] It is an external perspective view for explaining the operation when the brush device is held by the brush device connection part. [Figure 11] It is a longitudinal sectional view showing the state where the brush device connection part holds the brush device. [Figure 12] It is a sectional view taken along line A-A of FIG. 11. [Figure 13] It is a diagram for explaining the operation when removing the brush device held by the brush device connection part. [Figure 14] It is a block diagram showing the configuration of the control system of the substrate cleaning apparatus of FIG. 1. [Figure 15] It is a schematic plan view showing an example of a substrate processing apparatus including the substrate cleaning apparatus of FIG. 1. [Figure 16] It is a schematic plan view of a substrate cleaning apparatus according to another embodiment. [Figure 17] It is a block diagram showing the configuration of the control system of the substrate cleaning apparatus of FIG. 16. [Figure 18] It is a schematic plan view of a substrate cleaning apparatus according to still another embodiment.

Embodiments for Carrying Out the Invention

[0013] Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device, an organic EL (Electro Luminescence) display device, etc., a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like.

[0014] In the present embodiment, the substrate has a circular shape in plan view except for the notch formation portion. The substrate also has a front surface which is a circuit formation surface and a back surface which is the surface opposite to the circuit formation surface. In the following description, regardless of the front and back surfaces of the substrate, the upper surface of the two surfaces of the substrate is referred to as the upper surface of the substrate.

[0015] The substrate processing apparatus described below is a substrate cleaning apparatus that performs a cleaning process using a brush (hereinafter referred to as a brush cleaning process) on a substrate to be processed. During the brush cleaning process, a predetermined cleaning liquid is supplied to the upper surface of the substrate while the brush is pressed against the upper surface of the substrate. In the substrate cleaning apparatus described below, when the brush used for cleaning the substrate becomes contaminated or worn and an appropriate cleaning force cannot be obtained, a brush replacement process is performed.

[0016] 1. Overall Configuration of Substrate Cleaning Apparatus FIG. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. In FIG. 1 and predetermined figures after FIG. 2, arrows indicating the X direction, Y direction, and Z direction that are orthogonal to each other are attached to clarify the positional relationship. The X direction and Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction (vertical direction).

[0017] Furthermore, in the X direction, when distinguishing between the direction the arrow is pointing and its opposite direction, the direction the arrow is pointing is called the +X direction, and its opposite direction is called the -X direction. Similarly, in the Y direction, when distinguishing between the direction the arrow is pointing and its opposite direction, the direction the arrow is pointing is called the +Y direction, and its opposite direction is called the -Y direction. Similarly, in the Z direction, when distinguishing between the direction the arrow is pointing and its opposite direction, the direction the arrow is pointing is called the +Z direction, and its opposite direction is called the -Z direction.

[0018] As shown in Figure 1, the substrate cleaning apparatus 1 has a configuration in which multiple components are housed in a single chamber CH, and includes a substrate holding device 10, a cup device 20, a liquid supply device 310, a gas supply device 320, and a spray device 330. The substrate cleaning apparatus 1 also includes multiple brush devices 50, a brush arm device 100, a standby pod 210, a brush disposal unit 220, a brush storage device 230, a storage state detection unit 240, a brush shape detection unit 250, and a control unit 900.

[0019] Chamber CH has four side walls, a ceiling, and a floor (bottom). One of the side walls of Chamber CH has a transport opening (not shown) for transporting substrates between the inside and outside of Chamber CH. In the following description, when distinguishing the four side walls of Chamber CH, the side walls located in the -X, +X, -Y, and +Y directions relative to the center of Chamber CH in a plan view will be referred to as the first side wall SW1, the second side wall SW2, the third side wall SW3, and the fourth side wall SW4, respectively.

[0020] A substrate holding device 10 is provided approximately in the center of the floor surface of the chamber CH. The substrate holding device 10 comprises a spin base 11, a plurality of holding pins 12, a substrate holding drive unit 13 (Figure 14), and a substrate rotation drive unit 14 (Figure 14). The substrate rotation drive unit 14 is, for example, a motor, and is fixed to the floor surface of the chamber CH with its rotation axis facing upward. A disc-shaped spin base 11 is attached to the upper end of its rotation axis.

[0021] The spin base 11 has an outer diameter larger than the substrate W to be processed. Multiple retaining pins 12 are provided on the upper peripheral edge of the spin base 11. Each of the multiple retaining pins 12 has a contact portion. Each retaining pin 12 is configured to transition between a holding state in which the contact portion contacts the outer peripheral edge of the substrate W, and a release state in which the contact portion is separated from the substrate W, when the substrate W is placed on the spin base 11. The substrate holding drive unit 13 includes, for example, a magnet, and uses the magnetic force of the magnet to switch each retaining pin 12 between the holding state and the release state. The substrate W is held on the spin base 11 by the multiple retaining pins 12 in the holding state contacting multiple portions of the outer peripheral edge of the substrate W.

[0022] The cup device 20 includes a cup body 21 and a cup lifting drive unit 22. The cup body 21 has a substantially cylindrical shape and is provided to surround the spin base 11 in a plan view and extend in the Z direction. The cup body 21 is also provided to be movable in the Z direction.

[0023] The cup lifting drive unit 22 includes an actuator such as a motor or air cylinder, and moves the cup body 21 between a predetermined upper cup position and a lower cup position. The upper cup position is a height position (position in the Z direction) where the upper end of the cup body 21 is above the substrate W held by the substrate holding device 10. The lower cup position is a height position where the upper end of the cup body 21 is below the substrate W held by the substrate holding device 10.

[0024] The liquid supply device 310 includes a rotating shaft 311, an arm 312, a liquid nozzle 313, a liquid drive unit 314, and a liquid supply system 315 (Figure 14). The rotating shaft 311 is located near one of the four corners of the chamber CH (in this example, the corner between the first side wall SW1 and the third side wall SW3). The rotating shaft 311 extends in the Z direction and is supported by the liquid drive unit 314 so as to be movable and rotatable in the Z direction. The arm 312 is provided so as to extend a certain distance horizontally from the upper end of the rotating shaft 311.

[0025] The liquid drive unit 314 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating shaft 311 and rotates the rotating shaft 311. When the rotating shaft 311 rotates, the arm 312 rotates around the rotating shaft 311, as shown by the thick dashed arrow a1 in Figure 1. A liquid nozzle 313 is attached to the tip of the arm 312.

[0026] The liquid nozzle 313 is positioned such that the arm 312 is held at a predetermined height and, in a plan view, the tip of the arm 312 faces the rotation center SC of the spin base 11, with the discharge port facing the rotation center SC of the spin base 11.

[0027] A liquid supply system 315 (Figure 14) is connected to the liquid nozzle 313. During the brush cleaning process of the substrate W, which will be described later, the liquid drive unit 314 rotates the rotation shaft 311 so that the discharge port of the liquid nozzle 313 faces the upper surface of the substrate W held by the substrate holding device 10. In this state, the liquid supply system 315 supplies cleaning liquid to the liquid nozzle 313. As a result, cleaning liquid is discharged from the liquid nozzle 313 onto the substrate W. In this embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the liquid nozzle 313.

[0028] The gas supply device 320 includes a rotating shaft 321, an arm 322, a gas nozzle 323, a gas drive unit 324, and a gas supply system 325 (Figure 14). The rotating shaft 321 is located near one of the four corners of the chamber CH (in this example, the corner between the first side wall SW1 and the third side wall SW3). The rotating shaft 321 extends in the Z direction and is supported by the gas drive unit 324 so as to be movable and rotatable in the Z direction. The arm 322 is provided so as to extend a certain distance horizontally from the upper end of the rotating shaft 321.

[0029] The gas drive unit 324 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating shaft 321 and rotates the rotating shaft 321. When the rotating shaft 321 rotates, the arm 322 rotates around the rotating shaft 321, as shown by the thick dashed arrow a2 in Figure 1. A gas nozzle 323 is attached to the tip of the arm 322.

[0030] The gas nozzle 323 is positioned such that the arm 322 is held at a predetermined height and, in a plan view, the tip of the arm 322 faces the rotation center SC of the spin base 11, with the nozzle facing the rotation center SC of the spin base 11.

[0031] A gas supply system 325 (Figure 14) is connected to the gas nozzle 323. When drying a wet substrate W, the gas drive unit 324 rotates the rotation shaft 321 so that the nozzle of the gas nozzle 323 faces the upper surface of the substrate W held by the substrate holding device 10. In this state, the gas supply system 325 supplies gas to the gas nozzle 323. As a result, gas is injected from the gas nozzle 323 onto the substrate W. In this embodiment, an inert gas such as nitrogen or argon is used as the gas supplied to the gas nozzle 323.

[0032] The spray device 330 includes a rotating shaft 331, an arm 332, a spray nozzle 333, a spray drive unit 334, and a fluid supply system 335 (Figure 14). The rotating shaft 331 is located near one of the four corners of the chamber CH (in this example, the corner between the second side wall SW2 and the third side wall SW3). The rotating shaft 331 extends in the Z direction and is supported by the spray drive unit 334 so as to be movable and rotatable in the Z direction. The arm 332 is provided so as to extend a certain distance horizontally from the upper end of the rotating shaft 331.

[0033] The spray drive unit 334 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating shaft 331 and rotates the rotating shaft 331. When the rotating shaft 331 rotates, the arm 332 rotates around the rotating shaft 331, as shown by the thick dashed arrow a3 in Figure 1. A spray nozzle 333 is attached to the tip of the arm 332.

[0034] The spray nozzle 333 is positioned such that the arm 332 is held at a predetermined height and, in a plan view, the tip of the arm 332 faces the rotation center SC of the spin base 11, with the nozzle facing the rotation center SC of the spin base 11.

[0035] A fluid supply system 335 (Figure 14) is connected to the spray nozzle 333. During the spray cleaning process of the substrate W, which will be described later, the spray drive unit 334 rotates the rotation shaft 331 so that the nozzle of the spray nozzle 333 faces the upper surface of the substrate W held by the substrate holding device 10. In this state, the fluid supply system 335 supplies cleaning liquid and gas to the spray nozzle 333.

[0036] In the spray nozzle 333, the cleaning liquid and gas supplied from the fluid supply system 335 are mixed. As a result, a mixed fluid of cleaning liquid droplets and gas is sprayed from the nozzle of the spray nozzle 333 onto the substrate W. The spray nozzle 333 is moved in an arc shape while spraying the mixed fluid on the upper surface of the substrate W, which is held and rotated by the substrate holding device 10. This allows the entire upper surface of the substrate W to be cleaned. In this embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the spray nozzle 333, and an inert gas such as nitrogen or argon is used as the gas supplied to the spray nozzle 333.

[0037] The brush arm device 100 includes a brush arm 110, a rotating shaft 120, a guide rail 130, and an arm support portion 140. Within the chamber CH, the guide rail 130 is provided so as to be adjacent to the substrate holding device 10 in the Y direction. The guide rail 130 extends in the X direction.

[0038] The arm support portion 140 is provided on the guide rail 130. The arm support portion 140 is movable in the X direction along the guide rail 130. The rotating shaft 120 extends in the Z direction and is supported by the arm support portion 140 so as to be movable and rotatable in the Z direction. The brush arm 110 is provided so as to extend a certain distance horizontally from the upper end of the rotating shaft 120.

[0039] The arm support section 140 incorporates an arm rotation drive section 141, an arm movement drive section 142, and an arm lifting drive section 143. The arm rotation drive section 141 is, for example, a pulse motor, which rotates the rotation axis 120 around its central axis based on the control of the control section 900, which will be described later. When the rotation axis 120 rotates, the brush arm 110 rotates around the rotation axis 120, as shown by the thick dashed arrow a4 in Figure 1.

[0040] The arm rotation drive unit 141 incorporates an encoder that outputs a signal corresponding to the rotation angle of the rotation axis 120. The brush arm device 100 is also provided with an origin detection sensor as a component attached to the arm rotation drive unit 141, for detecting the origin position of the rotation angle of the rotation axis 120. The origin detection sensor is a photoelectric sensor that turns on or off when the brush arm 110 is in a specific orientation (the orientation of the brush arm 110 when viewed from above), and turns off or on when the brush arm 110 is in any other orientation.

[0041] The arm movement drive unit 142 is, for example, a pulse motor, and moves the arm support unit 140 in the X direction based on the control of the control unit 900, which will be described later (see the thick dashed arrow a5 in Figure 1). The arm movement drive unit 142 has a built-in encoder that outputs a signal corresponding to the position of the arm support unit 140 in the X direction. The brush arm device 100 is also provided with an origin detection sensor as a component attached to the arm movement drive unit 142 for detecting the origin position of the arm support unit 140 in the X direction. The origin detection sensor is, for example, a photoelectric sensor that turns on or off when the arm support unit 140 is at a specific position in the X direction, and turns off or on when the arm support unit 140 is at any other position in the X direction.

[0042] The arm lifting drive unit 143 is, for example, a pulse motor, which moves the rotation axis 120 in the Z direction based on the control of the control unit 900, which will be described later. This causes the brush arm 110 to move up and down. The arm lifting drive unit 143 has a built-in encoder that outputs a signal corresponding to the height position (position in the Z direction) of the brush arm 110. The brush arm device 100 is also provided with an origin detection sensor as a component attached to the arm lifting drive unit 143 for detecting the origin position of the brush arm 110 in the Z direction. The origin detection sensor is, for example, a photoelectric sensor that turns on or off when the brush arm 110 is at a specific position in the Z direction, and turns off or on when the brush arm 110 is at any other position in the Z direction.

[0043] The tip of the brush arm 110 is configured as a brush holder 111, capable of holding and detaching (attaching) the brush device 50 used for cleaning the substrate W. Details of the brush device 50 will be described later.

[0044] The brush arm 110 incorporates a pressing rotation drive unit 112. The pressing rotation drive unit 112 includes, for example, multiple actuators such as an air cylinder and a motor. Based on the control of the control unit 900, which will be described later, the pressing rotation drive unit 112 applies a pressing force downward (in the -Z direction) to the brush device 50 held by the brush holder 111. The pressing rotation drive unit 112 also rotates (rotates) the brush device 50 held by the brush holder 111 around an axis in the Z direction, based on the control of the control unit 900, which will be described later.

[0045] Here, in the substrate cleaning apparatus 1 shown in Figure 1, a line passing through the rotation center SC of the spin base 11 and extending in the X direction in a plan view is defined as a virtual line L1. Furthermore, a line perpendicular to the virtual line L1 in a plan view, extending in the Y direction and located between the substrate holding device 10 and the first side wall SW1 is defined as a virtual line L2.

[0046] In this case, the brush holding section 111 is positioned on a virtual straight line L1 with the brush arm 110 extending from the arm support section 140 in the -Y direction. In addition, between the substrate holding device 10 and the first side wall SW1 in the X direction, the standby pod 210, the brush disposal section 220, and the brush storage device 230 are arranged in this order toward the +Y direction on a virtual straight line L2.

[0047] More specifically, the standby pod 210 is positioned between the substrate holding device 10 and the first side wall SW1 so as to coincide with a virtual straight line L1 in a plan view. The brush disposal unit 220 is positioned adjacent to the standby pod 210, in the +Y direction of the standby pod 210. Furthermore, the brush storage device 230 is positioned adjacent to the brush disposal unit 220, in the +Y direction of the brush disposal unit 220.

[0048] The standby pod 210 is configured to house and clean the brush device 50, which is held in the brush holder 111, in a clean state. The brush disposal unit 220 has a removal structure 61 (Figure 13), which will be described later, for removing the brush device 50 held in the brush holder 111, and is configured to house the removed brush device 50. The brush storage device 230 is configured to store multiple unused brush devices 50.

[0049] Here, the brush storage device 230 includes a storage tank capable of accommodating multiple (e.g., four) brush devices 50. The brush storage device 230 also includes a liquid flow system 239 (Figure 13) that supplies new processing liquid to the storage tank while discharging the processing liquid from the storage tank, while a certain amount of processing liquid is stored in the storage tank. The brush devices 50 have a cleaning surface for cleaning the substrate W. The processing liquid supplied to the storage tank is used to wet the cleaning surface of the unused brush devices 50 stored in the storage tank. The processing liquid stored in the storage tank may be a cleaning liquid used for cleaning the substrate W. In this embodiment, the processing liquid stored in the storage tank is pure water.

[0050] The storage state detection unit 240 is positioned near the brush storage device 230. The storage state detection unit 240 includes, for example, one or more photoelectric sensors or CCD (charge-coupled device) cameras, and detects the number of brush devices 50 stored in the brush storage device 230. The storage state detection unit 240 also detects the position of the one or more brush devices 50 stored in the brush storage device 230 when at least one brush device 50 is stored in the brush storage device 230.

[0051] The brush shape detection unit 250 is located near the standby pod 210, the brush disposal unit 220, and the brush storage device 230. The brush shape detection unit 250 includes, for example, one or more photoelectric sensors or detection devices such as a CCD camera. The brush shape detection unit 250 detects the shape of the brush 51 (Figure 6) of the brush device 50 held in the brush holding unit 111 during the brush replacement process described later. The control unit 900 controls the operation of each part of the substrate cleaning device 1. Details of the control unit 900 will be described later.

[0052] As shown by the hatched arrows in Figure 1, in the substrate cleaning apparatus 1, the standby position P1 is set at a position that overlaps with the standby pod 210 in a plan view. The removal position P2 is set at a position that overlaps with the brush disposal section 220 in a plan view. The mounting position P3 is set at a position that overlaps with the brush storage device 230 in a plan view. In a plan view, the standby position P1, the removal position P2, and the mounting position P3 are aligned on a virtual straight line L2.

[0053] 2. Various basic operations in the substrate cleaning device 1 (a) Figure 2 is a diagram illustrating the state of the substrate W in the substrate cleaning apparatus 1 shown in Figure 1 before the brush cleaning process. In Figure 2, the upper part shows a schematic plan view of the substrate cleaning apparatus 1, and the lower part shows a schematic side view of the substrate cleaning apparatus 1 as seen in the +X direction.

[0054] In the upper plan view of Figure 2, the brush arm 110 is shown with a dashed line to facilitate understanding of the positional relationships between each component. In the lower side view of Figure 2, the standby pod 210, brush disposal unit 220, and brush storage device 230 are also shown with dashed lines.

[0055] Before the brush cleaning process begins, the brush holder 111, which holds the brush device 50, is positioned at a standby position P1 in a plan view. At this time, the brush arm 110 is supported by the arm support 140 so as to extend in the Y direction. The brush device 50 is housed in a standby pod 210. The height position (position in the Z direction) of the brush arm 110 when in this standby state is called the standby height h01.

[0056] Furthermore, if no substrate W is loaded into the substrate cleaning device 1, the cup body 21 is in the lower position. In the standby state shown in Figure 2, it is assumed that four brush devices 50 are stored in the brush storage device 230.

[0057] (b) Figure 3 is a diagram illustrating the basic operation of the substrate cleaning apparatus 1 in Figure 1 during the brush cleaning process of the substrate W. In Figure 3, similar to the example in Figure 2, a schematic plan view of the substrate cleaning apparatus 1 is shown in the upper section, and a schematic side view of the substrate cleaning apparatus 1 is shown in the lower section. In the upper plan view of Figure 3, the brush arm 110 is shown by a dashed line. In the lower side view of Figure 3, the standby pod 210, brush disposal unit 220, and brush storage device 230 are shown by dashed lines.

[0058] When the brush cleaning process of the substrate W is started, the substrate W is brought into the substrate cleaning apparatus 1 and held by the substrate holding device 10 and rotated at a predetermined rotational speed. The cup body 21 is also held in the cup-up position. Furthermore, cleaning liquid is discharged from the liquid nozzle 313 of the liquid supply device 310 shown in Figure 1 toward the rotating substrate W.

[0059] In this state, the arm movement drive unit 142 and the arm lifting drive unit 143 in Figure 1 operate, causing the brush arm 110 to move in the Z and X directions. As a result, the brush device 50 held in the brush holder 111 is lifted from the standby pod 210 and moved to a position on the upper surface of the substrate W. Furthermore, the brush device 50 rotates while being pressed against the upper surface of the rotating substrate W with a predetermined pressing force by the pressing rotation drive unit 112 in Figure 1. In this state, as shown by the thick solid arrows a11 and a12 in Figure 3, the brush device 50 moves in the X direction along the virtual straight line L1 in a plan view. In this way, the upper surface of the substrate W is cleaned.

[0060] When the brush device 50 moves from inside the standby pod 210 onto the substrate W, the brush arm 110 temporarily rises to a predetermined height. This height of the brush arm 110 is called the movement height h02. The height of the brush arm 110 when the brush device 50 is pressed against the upper surface of the substrate W is called the cleaning height h03. The movement height h02 is higher than the standby height h01 and the cleaning height h03.

[0061] Once the top surface of the substrate W is cleaned, the brush device 50 is returned to its initial position. That is, as shown in the example in Figure 2, the brush holder 111 moves to the standby position P1, and the brush device 50 is housed in the standby pod 210. Also, the discharge of cleaning liquid by the liquid nozzle 313 stops, and the rotation of the substrate W by the substrate holder 10 stops. Furthermore, the cup body 21 moves from the upper cup position to the lower cup position. This completes the brush cleaning process of the substrate W.

[0062] In the example shown in Figure 3, the brush device 50 moves back and forth between the outer edge of the substrate W and the rotation center SC of the spin base 11. However, the substrate W may also be cleaned by moving along a virtual straight line L1 from one end to the other. Alternatively, the brush device 50 may clean the substrate W by moving only once between the outer edge of the substrate W and the rotation center SC of the spin base 11.

[0063] (c) As described above, in the substrate cleaning apparatus 1 according to this embodiment, a process of replacing the brush used to clean the substrate W is performed. Here, the brush device 50 has a configuration in which the brush 51 (Figure 6) and a plurality of components attached to the brush 51 are assembled integrally. Therefore, in this substrate cleaning apparatus 1, as a process of replacing the brush 51, a used brush device 50 (old brush device 50) held in the brush holding part 111 is replaced with an unused brush device 50 (new brush device 50).

[0064] Figures 4 and 5 are diagrams illustrating the basic operation during the replacement process of the brush device 50 in the substrate cleaning apparatus 1 shown in Figure 1. In Figures 4 and 5, similar to the examples in Figures 2 and 3, a schematic plan view of the substrate cleaning apparatus 1 is shown in the upper section, and a schematic side view of the substrate cleaning apparatus 1 is shown in the lower section. In the upper plan view of Figures 4 and 5, the brush arm 110 is indicated by a dashed line. In the lower side view of Figures 4 and 5, the standby pod 210, brush disposal unit 220, and brush storage device 230 are indicated by dashed lines.

[0065] In the initial state before the replacement process of the brush device 50, as shown in Figure 2, the brush holder 111 that holds the used brush device 50 is located in the standby position P1. The brush device 50 is housed in the standby pod 210. The cup body 21 is in the cup-lower position. Furthermore, in this example, four unused brush devices 50 are stored in the brush storage device 230.

[0066] When the replacement process for the brush device 50 is initiated, the arm rotation drive unit 141, arm movement drive unit 142, and arm lifting drive unit 143 shown in Figure 1 are activated. As a result, the brush arm 110 rotates around the rotation axis 120. The brush arm 110 is also moved in the Z and X directions.

[0067] As a result, the brush device 50 held in the brush holder 111 is lifted out of the standby pod 210. The brush holder 111 also moves in the +Y direction at a movement height h02 and reaches the removal position P2.

[0068] At the removal position P2, the brush arm 110 moves in the -Z direction. At this point, the brush device 50, which will be described later, is removed in the brush disposal section 220. This removes the used brush device 50 from the brush holder 111. The removed brush device 50 is then housed in the brush disposal section 220.

[0069] Next, the brush holder 111, which is not holding the brush device 50, rises again to the movement height h02 and moves from the removal position P2 to the mounting position P3, as shown in Figure 5.

[0070] Here, the storage status of the brush device 50 in the brush storage device 230 can be detected by the storage status detection unit 240 in Figure 1. Therefore, at the start of the brush device 50 replacement process, the position of the brush device 50 to be replaced is known in advance in the brush storage device 230.

[0071] Therefore, at mounting position P3, the horizontal position of the brush holder 111 is adjusted so that, in a plan view, it overlaps with one brush device 50 stored in the brush storage device 230 (positioning of the brush holder 111). In this state, the brush arm 110 moves in the -Z direction. As a result, one unused brush device 50 stored in the brush storage device 230 is held by the brush holder 111. The height position of the brush arm 110 at this time is called the mounting height h04. The mounting height h04 is lower than the movement height h02 and the cleaning height h03, and higher than the standby height h01. Note that the mounting height h04 may be at the same height as the standby height h01, or it may be lower than the standby height h01.

[0072] Subsequently, the brush device 50 held by the brush holder 111 is lifted out of the brush storage device 230. The brush holder 111 then rises to a movement height h02 and moves to a standby position P1. Furthermore, the brush holder 111 moves in the -Z direction at the standby position P1. As a result, the unused brush device 50 held by the brush holder 111 is housed in the standby pod 210. In this way, the replacement process for the brush device 50 is completed.

[0073] (d) During the replacement process of the brush device 50, the shape of the brush 51 of an unused brush device 50 is detected by the brush shape detection unit 250 while it is moving from the brush storage device 230 to the standby pod 210.

[0074] The substrate cleaning apparatus 1 according to this embodiment has a defined three-dimensional coordinate system. In addition, the substrate cleaning apparatus 1 has pre-set coordinate information (hereinafter referred to as brush path information) of the path that the brush holding unit 111 should move during the brush cleaning process of the substrate W. If there is variation in the shape of the brush 51 of the brush device 50, even if the brush holding unit 111 moves based on the pre-set coordinate information, it may not be possible to clean the desired part of the substrate W. Therefore, in this embodiment, the pre-set brush path information is modified based on the detection result of the brush shape detection unit 250.

[0075] (e) As described above, the substrate cleaning apparatus 1 in Figure 1 includes a spray device 330. Therefore, in the substrate cleaning apparatus 1, it is possible to perform a cleaning process of the substrate W using the spray device 330 (hereinafter referred to as the spray cleaning process) before the brush cleaning process of the substrate W. In addition, the substrate cleaning apparatus 1 in Figure 1 includes a gas supply device 320. Therefore, in the substrate cleaning apparatus 1, it is possible to supply gas to the upper surface of the rotating substrate W after the brush cleaning process or the spray cleaning process. This makes it possible to accelerate the drying of the substrate W after the brush cleaning process or the spray cleaning process.

[0076] 3. Configuration of the brush device 50 Figure 6 is an external perspective view of the brush device 50, and Figure 7 is a longitudinal cross-sectional view of the brush device 50 shown in Figure 6. As shown in Figure 6, the brush device 50 includes a brush 51, a brush support 52, and a connected column 56. The brush support 52 has a substantially cylindrical shape and has a brush mounting portion 53 at its lower end.

[0077] The brush 51 is formed from, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge with abrasive particles dispersed in it, and has a circular cleaning surface 51S (Figure 7) that can contact the upper surface of the substrate W. As shown in Figure 7, the brush 51 is attached to the brush mounting portion 53 of the brush support 52 such that the cleaning surface 51S faces downward. The brush mounting portion 53 has an annular supported surface 53S that surrounds a part of the brush 51 and is located a small distance above the cleaning surface 51S when the brush 51 is attached.

[0078] As shown in Figure 6, a recess 54 is formed in the center of the upper end of the brush support 52. In addition, an annular flange portion 55 is formed on the upper end of the brush support 52 so as to protrude outward by a certain distance around the entire circumference of the brush support 52.

[0079] The recess 54 has a flat bottom surface 54S. A screw hole is formed in the center of the bottom surface 54S. The connected column 56 is a rod-shaped member with a circular cross-section, and a first groove 56a and a second groove 56b are formed in its upper half. In addition, a male screw corresponding to the screw hole in the bottom surface 54S is formed in the lower half of the connected column 56. The lower half of the connected column 56 is attached to the screw hole in the bottom surface 54S. As a result, the upper half of the connected column 56 is fixed to the brush support 52 with the upper half protruding upward from the bottom surface 54S of the recess 54.

[0080] The upper end of the connected column 56 is formed in a hemispherical shape. The first groove 56a and the second groove 56b are formed at positions that are a common distance apart from the upper end of the connected column 56 in the axial direction. Furthermore, the first groove 56a and the second groove 56b are formed at different positions in the circumferential direction of the connected column 56.

[0081] In Figure 6, a diagram showing the outer surface of the upper half of the connected column 56 unfolded in the circumferential direction is shown within a dashed-dotted callout. In this unfolded diagram, the circumferential angular positions of the connected column 56, relative to the central axis, are marked at 90° intervals from 0° to 360°. As shown in this unfolded diagram, the circumferential angular range in which the second groove 56b is formed (approximately 160°) is wider than the circumferential angular range in which the first groove 56a is formed (approximately 45°).

[0082] Each of the first groove 56a and the second groove 56b is formed such that it can accommodate a portion of the steel ball 490 (Figure 9), which will be described later, but cannot accommodate the entire steel ball 490. Furthermore, the second groove 56b allows the steel ball 490 to move circumferentially within a certain angular range while a portion of the steel ball 490 is accommodated within it.

[0083] 4. Configuration of the brush holding section 111 The brush holder 111 in Figure 1 includes a brush device connection portion that extends in the Z direction (downward) at the tip of the brush arm 110. Figure 8 is an external perspective view of the brush device connection portion, and Figure 9 is a longitudinal cross-sectional view of the brush device connection portion 400 in Figure 8. As shown in Figure 8, the brush device connection portion 400 includes a shaft member 410, a connecting body portion 420, and a casing 440. Furthermore, as shown in Figure 9, the brush device connection portion 400 further includes a pressing member 431, a spring 432, and a plurality (three in this example) of steel balls 490.

[0084] The connecting body 420 has a configuration in which a first cylindrical portion 421 and a second cylindrical portion 422, having different inner and outer diameters, are connected in the axial direction. The first cylindrical portion 421 and the second cylindrical portion 422 are arranged from top to bottom in that order. The inner diameter of the first cylindrical portion 421 is slightly larger than the outer diameter of the connected column 56 of the brush device 50. Also, the inner diameter of the second cylindrical portion 422 is larger than the inner diameter of the first cylindrical portion 421, and the outer diameter of the second cylindrical portion 422 is larger than the outer diameter of the first cylindrical portion 421.

[0085] The shaft member 410 is held at the tip of the brush arm 110 by the pressing rotation drive unit 112 shown in Figure 1 so as to be rotatable around the axis of the shaft member 410. The lower end of the shaft member 410 is inserted into the first cylindrical portion 421 from above and connected to the upper end portion and its vicinity of the first cylindrical portion 421. In this way, the connecting body portion 420 is supported by the shaft member 410.

[0086] Near the lower end of the first cylindrical portion 421, a number of through holes (three in this example) are formed, arranged at equal angular intervals in the circumferential direction. The openings of each through hole formed on the inner circumferential surface of the first cylindrical portion 421 are called inner openings 421h. The openings of each through hole formed on the outer circumferential surface of the first cylindrical portion 421 are called outer openings 421i. Both the inner openings 421h and the outer openings 421i are circular in shape.

[0087] A portion of the steel ball 490 is housed inside each through-hole. The thickness of the first cylindrical portion 421 is smaller than the diameter of the steel ball 490. Also, the inner diameter of the inner opening 421h is smaller than the diameter of the steel ball 490. On the other hand, the inner diameter of the outer opening 421i is larger than the diameter of the steel ball 490. With this configuration, a portion of the steel ball 490 is housed in the through-hole of the first cylindrical portion 421, while the remaining portion is located at least one of the outside and inside of the first cylindrical portion 421.

[0088] A cylindrical pressing member 431 is fitted into the first cylindrical portion 421, having an inner diameter slightly larger than the outer diameter of the first cylindrical portion 421 and an outer diameter smaller than the outer diameter of the second cylindrical portion 422. The lower half of the inner circumferential surface of the pressing member 431 is inclined with respect to the axial direction of the pressing member 431 such that the inner diameter gradually increases downwards. The inclined inner circumferential surface of the pressing member 431 acts as a spherical pressing surface 431T and contacts a portion of the three steel balls 490 that protrude outward from the three through holes of the first cylindrical portion 421.

[0089] The pressing member 431 has an annular pressed surface 431S facing upward. A spring 432 is provided on the pressed surface 431S. In this example, the spring 432 is a coil spring and surrounds the first cylindrical portion 421. A casing 440 is provided around the first cylindrical portion 421 so as to cover the pressing member 431 and the spring 432. The casing 440 is attached to the connecting body portion 420 so as to compress the spring 432 from above toward the pressed surface 431S of the pressing member 431. As a result, a pressing force acts from the spring 432 toward the pressing member 431 toward the second cylindrical portion 422.

[0090] As described above, the ball pressing surface 431T of the pressing member 431 contacts a portion of the three steel balls 490 that protrude outward from the three through holes of the first cylindrical portion 421. Therefore, the pressing force applied to the pressing member 431 by the spring 432 acts to press each of the three steel balls 490 toward the axis of the first cylindrical portion 421. In other words, the pressing force along the axis of the first cylindrical portion 421 is converted into a pressing force that presses the three steel balls 490 toward the axis of the first cylindrical portion 421.

[0091] As a result, as shown in the upper part of the dashed-dotted speech bubble in Figure 9, if no force acts on each steel ball 490 from inside the first cylindrical portion 421, a portion of the steel ball 490 protrudes from the inner opening 421h into the interior of the first cylindrical portion 421. On the other hand, as shown in the lower part of the speech bubble in Figure 9, consider the case where a force acts on each steel ball 490 from inside the first cylindrical portion 421 toward the outside of the first cylindrical portion 421. In this case, as indicated by the white arrow, if the force from inside the first cylindrical portion 421 toward the outside of the first cylindrical portion 421 exceeds the force that pushes the steel ball 490 toward the inside of the first cylindrical portion 421 due to the elastic force of the spring 432, the steel ball 490 is pushed out of the internal space of the first cylindrical portion 421.

[0092] 5. Holding and removing the brush device 50 by the brush device connection part 400 Figure 10 is an external perspective view illustrating the operation when the brush device 50 is held by the brush device connection part 400. As shown in the upper part of Figure 10, when the brush device 50 is held by the brush device connection part 400, the second cylindrical part 422 of the brush device connection part 400 is pushed into the recess 54 of the brush device 50 in Figure 6. As a result, the brush device 50 is held by the brush device connection part 400, as shown in the lower part of Figure 10.

[0093] During this pushing motion, the connected column 56 of the brush device 50 is inserted into the first cylindrical portion 421 of the brush device connection portion 400. At this time, inside the first cylindrical portion 421, the portions of the three steel balls 490 protruding into the first cylindrical portion 421 are gradually pushed outward by the upper end of the connected column 56. Subsequently, the connected column 56 enters the first cylindrical portion 421 further, and the lower end of the second cylindrical portion 422 comes into contact with the bottom surface 54S of the recess 54 of the brush device 50. In this state, parts of the three steel balls 490 fit into the first groove 56a and the second groove 56b of the connected column 56.

[0094] Figure 11 is a longitudinal cross-sectional view showing the state in which the brush device connection part 400 holds the brush device 50, and Figure 12 is a cross-sectional view taken along line AA of Figure 11. As shown in Figures 11 and 12, each steel ball 490 of the brush device connection part 400 is partially fitted into either the first groove 56a or the second groove 56b of the column 56 to which the brush device 50 is connected. As a result, with the brush device 50 held by the brush device connection part 400, an engagement force acting between them is exerted due to the elastic force of the spring 432 (Figure 9) built into the brush device connection part 400.

[0095] Figure 13 is a diagram illustrating the operation of removing the brush device 50 held in the brush device connection part 400. In order to remove the brush device 50 from the brush device connection part 400, a removal structure 61 is required. The removal structure 61 is provided in the brush disposal part 220 in Figure 1, as described above.

[0096] An example of a removable structure 61 is shown in a plan view in the upper part of Figure 13. The removable structure 61 in this example is manufactured by processing a plate-shaped member into a predetermined shape and bending a part of it, and has a base portion 62 and a pair of protruding pieces 63. The base portion 62 is formed to extend in one direction. The pair of protruding pieces 63 protrude from both ends of the base portion 62 toward one side of the base portion 62. A semicircular recess 64 is formed in the portion of the base portion 62 located between the pair of protruding pieces 63. In the brush waste section 220 of Figure 1, the removable structure 61 is arranged such that the base portion 62 and the pair of protruding pieces 63 are parallel or substantially parallel to the horizontal plane, and in a plan view, the pair of protruding pieces 63 face in the +X direction.

[0097] When removing the brush device 50 from the brush device connection part 400, the brush device 50 is positioned below the brush waste part 60. More specifically, as shown in the middle section of Figure 13, the flange portion 55 of the brush device 50 is positioned below the base portion 62 of the removal structure 61. The brush device connection part 400 is also positioned within the recess 64 of the removal structure 61.

[0098] Subsequently, as shown in the lower part of Figure 13, the brush device connection part 400 is pulled upward with a force greater than a certain amount. At this time, inside the first cylindrical part 421 of the brush device connection part 400, the first cylindrical part 421 and the connected column 56 move relative to each other against the engagement force acting between the three steel balls 490 and the first groove 56a and second groove 56b of the connected column 56. As a result, the brush device 50 is removed from the brush device connection part 400.

[0099] 6. Control system for substrate cleaning device 1 The control system of the substrate cleaning apparatus 1 will be described along with the configuration of the control unit 900 in Figure 1. Figure 14 is a block diagram showing the configuration of the control system of the substrate cleaning apparatus 1 in Figure 1. As shown in Figure 14, the control unit 900 includes a CPU (Central Processing Unit) 901, RAM (Random Access Memory) 902, ROM (Read-Only Memory) 903, and a storage device 904. The RAM 902 is used as the working area for the CPU 901. The ROM 903 stores the system program. The storage device 904 includes a storage medium such as a hard disk or semiconductor memory and stores a substrate cleaning program for performing brush cleaning and spray cleaning on the substrate W, a replacement processing program for replacing the brush device 50, and the like. Furthermore, the storage device 904 stores the above-mentioned brush path information.

[0100] The circuit board cleaning program and replacement processing program may be provided stored on a recording medium such as a CD-ROM 909 and installed in ROM 903 or storage device 904. Alternatively, the circuit board cleaning program and replacement processing program may be distributed via a communication network from a server outside the circuit board cleaning device 1 and installed in ROM 903 or storage device 904.

[0101] The CPU 901 executes a board cleaning program and a replacement processing program, thereby controlling the operation of each part of the board cleaning device 1. Specifically, the control unit 900 controls the board holding drive unit 13. As a result, the control unit 900 changes the state of multiple holding pins 12 from an open state to a held state, thereby holding the board W being brought into the board cleaning device 1 in the board holding device 10. The control unit 900 also changes the state of multiple holding pins 12 from a held state to a released state in order to remove the board W from the board cleaning device 1. Furthermore, the control unit 900 controls the board rotation drive unit 14. As a result, the control unit 900 rotates the board W held by the board holding device 10 at a preset speed.

[0102] Furthermore, the control unit 900 controls the cup lifting drive unit 22. As a result, the control unit 900 moves the cup body 21 shown in Figure 1 between the upper cup position and the lower cup position during the brush cleaning process of the substrate W and the spray cleaning process of the substrate W.

[0103] Furthermore, the control unit 900 controls the liquid drive unit 314 and the liquid supply system 315. As a result, when the brush cleaning process of the substrate W is performed, the control unit 900 directs the tip of the arm 312 in Figure 1 toward the substrate W and supplies cleaning fluid to the liquid nozzle 313. Conversely, when the brush cleaning process of the substrate W is not performed, the control unit 900 directs the tip of the arm 312 toward the space to the side (-X direction) of the substrate holding device 10 and stops supplying cleaning fluid to the liquid nozzle 313.

[0104] Furthermore, the control unit 900 controls the gas drive unit 324 and the gas supply system 325. As a result, when drying of the substrate W is performed, the control unit 900 directs the tip of the arm 322 in Figure 1 toward the substrate W and supplies gas to the gas nozzle 323. Conversely, when drying of the substrate W is not performed, the control unit 900 directs the tip of the arm 322 toward the space to the side (-Y direction) of the substrate holding device 10 and stops supplying gas to the gas nozzle 323.

[0105] Furthermore, the control unit 900 controls the spray drive unit 334 and the fluid supply system 335. As a result, when spray cleaning of the substrate W is performed, the control unit 900 moves the tip of the arm 332 shown in Figure 1 over the substrate W and supplies cleaning liquid and gas to the spray nozzle 333. When spray cleaning of the substrate W is not performed, the control unit 900 directs the tip of the arm 332 into the space to the side (+X direction) of the substrate holding device 10 and stops the supply of cleaning liquid and gas to the spray nozzle 333.

[0106] Furthermore, the control unit 900 controls the pressing rotation drive unit 112. As a result, the control unit 900 presses the brush device 50 against the upper surface of the substrate W with a preset pressing force during the brush cleaning process of the substrate W. The control unit 900 also rotates the brush device 50 during the brush cleaning process of the substrate W.

[0107] Furthermore, the control unit 900 controls the arm rotation drive unit 141. Specifically, the control unit 900 rotates the rotation axis 120 based on the output of the encoder of the arm rotation drive unit 141 and the origin detection sensor attached to the arm rotation drive unit 141. This changes the posture of the brush arm 110.

[0108] Furthermore, the control unit 900 controls the arm movement drive unit 142. Specifically, the control unit 900 moves the arm support unit 140 in the X direction based on the output of the encoder of the arm movement drive unit 142 and the origin detection sensor associated with the arm movement drive unit 142. As a result, the position of the brush arm 110 in the X direction is changed.

[0109] Furthermore, the control unit 900 controls the arm lifting drive unit 143. Specifically, the control unit 900 moves the rotation axis 120 in the Z direction based on the output of the encoder of the arm lifting drive unit 143 and the origin detection sensor attached to the arm lifting drive unit 143. This changes the height position of the brush arm 110.

[0110] The arm rotation drive unit 141, the arm movement drive unit 142, and the arm lifting drive unit 143 are controlled, for example, during the brush cleaning process of the substrate W, based on brush path information in addition to the outputs of the various encoders and origin detection sensors mentioned above. As a result, the brush device 50 moves within the chamber CH according to the path indicated by the brush path information, and the substrate W is cleaned.

[0111] Furthermore, the control unit 900 controls the liquid flow system 239. As a result, the control unit 900 adjusts the amount of processing liquid supplied to the storage tank and the amount of processing liquid discharged from the storage tank so that a predetermined amount of processing liquid is maintained in the storage tank of the brush storage device 230.

[0112] Furthermore, the control unit 900 obtains the number of brush devices 50 stored in the storage state detection unit 240 based on the output of the storage state detection unit 240. In addition, the control unit 900 obtains the location of the brush device 50 in the storage tank of the storage state detection unit 240. Then, the control unit 900 determines the location of the brush device 50 that should be replaced in the next brush 51 replacement process. In other words, the control unit 900 sets the location of the brush device 50 that should be newly held in the brush holding unit 111 during the next brush 51 replacement process.

[0113] Furthermore, during the brush replacement process, the control unit 900 acquires the shape of the brush 51 of the replaced brush device 50 based on the output of the brush shape detection unit 250. The control unit 900 also appropriately modifies the brush path information stored in the storage device 904 based on the acquired shape.

[0114] As shown in Figure 14, the substrate cleaning apparatus 1 further includes an operating unit 600. The operating unit 600 has a keyboard and a pointing device and is configured to be operable by a user. By operating the operating unit 600, the user can give commands to the control unit 900, for example, to perform brush cleaning and to perform spray cleaning. The user can also give commands to the control unit 900 to perform replacement of the brush device 50. Furthermore, by operating the operating unit 600, the user can provide brush path information to the control unit 900.

[0115] The control unit 900 receives various commands or information from the operation unit 600. The control unit 900 also controls each part of the substrate cleaning device 1 according to the received commands or specifications.

[0116] 7. Effects (a) In the substrate cleaning apparatus 1 described above, the brush holding portion 111 of the brush arm device 100 holds the brush device 50 by connecting the brush device connection portion 400 to the connected column 56 of the brush device 50. During the brush cleaning process of the substrate W, with one brush device 50 held by the brush holding portion 111, the brush holding portion 111 is moved so that the brush 51 comes into contact with the substrate W held by the substrate holding device 10. As a result, the substrate W is cleaned. At this time, other brush devices 50 are temporarily stored in the brush storage device 230.

[0117] When one brush device 50 becomes contaminated or deteriorated to the extent that it needs to be replaced, the brush device 50 is removed from the brush holder 111. The brush holder 111 is then moved to the brush storage device 230, and the brush device connection portion 400 of the brush holder 111 is connected to the connected column 56 of the other brush device 50 stored in the brush storage device 230. In this way, the brush device 50 held in the brush holder 111 is replaced with another brush device 50.

[0118] The brush arm 110 moves and rotates within the chamber CH by the arm rotation drive unit 141 and the arm movement drive unit 142. As a result, the brush holder 111 can move in two different directions in a plan view. In this case, the range of movement of the brush holder 111 in a plan view is expanded compared to when the brush arm device 100 includes only one of the arm rotation drive unit 141 and the arm movement drive unit 142. This improves the flexibility of the layout of the substrate holder 10, the standby pod 210, the brush disposal unit 220, and the brush storage device 230.

[0119] Therefore, the standby pod 210, brush disposal unit 220, and brush storage device 230 can be arranged in a desired portion within the chamber CH. In other words, the arrangement of the substrate holding device 10, standby pod 210, brush disposal unit 220, and brush storage device 230 within the chamber CH can be determined according to objectives such as miniaturization of the substrate cleaning device 1 or improvement of throughput.

[0120] In the example shown in Figure 1, the standby pod 210, the brush disposal unit 220, and the brush storage device 230 are aligned on a virtual straight line L2 between the substrate holding device 10 and the first side wall SW1 in the Y direction, thereby enabling miniaturization of the chamber CH in the Y direction.

[0121] Furthermore, in this case, multiple components for the brush cleaning process by the brush device 50 can be compactly arranged in the substrate cleaning device 1, making it possible to add additional functions to the substrate cleaning device 1 while suppressing an increase in the size of the substrate cleaning device 1.

[0122] (b) In the substrate cleaning apparatus 1 described above, the brush storage device 230 and the brush disposal unit 220 are adjacent to each other. This makes it possible to shorten the time required from when one brush device 50 held by the brush holding unit 111 is removed in the brush disposal unit 220 until the brush holding unit 111 holds another brush device 50. In other words, it is possible to shorten the time required to replace the brush device 50 with the brush holding unit 111.

[0123] (c) In the substrate cleaning apparatus 1 described above, the brush holding portion 111 of the brush arm 110 rotates around the rotation axis 120 by the arm rotation drive unit 141. The brush holding portion 111 also moves in the X direction by the arm movement drive unit 142. That is, the brush holding portion 111 is movable in two different directions within the horizontal plane.

[0124] Here, a configuration for moving the brush holder 111 linearly in one direction within a horizontal plane, as shown by the guide rail 130 in Figure 1, tends to require a large amount of space within the horizontal plane. In contrast, a configuration for rotating the brush holder 111 within a horizontal plane, as shown by the rotation axis 120 in Figure 1, tends to reduce the amount of space required within the horizontal plane.

[0125] In the substrate cleaning apparatus 1 shown in Figure 1, a rotating shaft 120 and an arm rotation drive unit 141 are provided for moving the brush holding unit 111 in a horizontal plane. This enables miniaturization of the configuration for moving the brush holding unit 111 in a horizontal plane.

[0126] 8. Substrate processing apparatus equipped with substrate cleaning device 1 Figure 15 is a schematic plan view showing an example of a substrate processing apparatus equipped with the substrate cleaning apparatus 1 shown in Figure 1. As shown in Figure 15, the substrate processing apparatus 800 in this example has an indexer block 801 and a processing block 802. The indexer block 801 and the processing block 802 are arranged adjacent to each other.

[0127] The indexer block 801 includes multiple (four in this example) carrier mounting tables 810 and transport units 820. The multiple carrier mounting tables 810 are connected to the transport units 820 and are arranged in a row with some space between them. A carrier C that holds multiple substrates W is placed on each carrier mounting table 810.

[0128] The transport unit 820 is equipped with an indexer robot 831 and a control device 832. The indexer robot 831 includes a plurality (e.g., four) of hands and is configured to hold and transport the substrate W. The control device 832 includes a CPU and memory or a microcomputer and controls each component within the substrate processing apparatus 800.

[0129] The processing block 802 includes cleaning units 841, 842 and a transport unit 843. The cleaning units 841, 843, and 842 are arranged adjacent to the transport unit 820 and in that order. In each cleaning unit 841, 842, multiple (for example, four) substrate cleaning devices 1 are stacked vertically. These substrate cleaning devices 1 are the substrate cleaning devices 1 shown in Figure 1. That is, in the substrate processing apparatus 800 of Figure 15, the substrate cleaning device 1 of Figure 1 is provided as one processing unit constituting the substrate processing apparatus 800.

[0130] The transport unit 843 is equipped with a main robot 844. The main robot 844 includes multiple (for example, four) hands and is configured to hold and transport the substrate W.

[0131] Between the indexer block 801 and the processing block 802, multiple substrate mounting sections PASS are stacked vertically to facilitate the transfer of the substrate W between the indexer robot 831 and the main robot 844.

[0132] In the substrate processing apparatus 800, the indexer robot 831 takes an unprocessed substrate W from one of the carriers C placed on the carrier mounting stage 810. The indexer robot 831 then places the unprocessed substrate W onto one of the substrate mounting sections PASS. Furthermore, the indexer robot 831 receives the processed substrate W placed on one of the substrate mounting sections PASS and places it into an empty carrier C.

[0133] The main robot 844 receives multiple unprocessed substrates W placed on multiple substrate placement sections PASS. The main robot 844 then transports the multiple unprocessed substrates W to multiple substrate cleaning devices 1 in the cleaning sections 841 and 842. Furthermore, the main robot 844 unloads the multiple processed substrates W from the multiple substrate cleaning devices 1. Finally, the main robot 844 places the processed substrates W onto one of the multiple substrate placement sections PASS.

[0134] Each substrate cleaning device 1 in the cleaning units 841 and 842 is equipped with an arm rotation drive unit 141, an arm movement drive unit 142, and an arm lifting drive unit 143 to move the brush holding unit 111 within the chamber CH. This expands the range in which the brush holding unit 111 can be moved within the chamber CH. In this case, a standby pod 210, a brush disposal unit 220, and a brush storage device 230 can be placed in a desired location within the chamber CH. Therefore, it becomes possible to miniaturize the substrate cleaning device 1 and the substrate processing device 800. Alternatively, it becomes possible to add additional functions to each substrate cleaning device 1 while suppressing its size increase.

[0135] 9. Other Embodiments (a) Figure 16 is a schematic plan view of a substrate cleaning apparatus according to another embodiment. The differences between the substrate cleaning apparatus 1X in Figure 16 and the substrate cleaning apparatus 1 in Figure 1 will be explained. As shown in Figure 16, the substrate cleaning apparatus 1X in this example further includes a brush arm device 100X, a standby pod 210X, a brush disposal unit 220X, a brush storage device 230X, a storage state detection unit 240X, and a brush shape detection unit 250X, in addition to the configuration of the substrate cleaning apparatus 1 in Figure 1. These components (100X, 210X, 220X, 230X, 240X, 250X) are provided in a chamber CH.

[0136] The brush arm device 100X has basically the same configuration as the brush arm device 100. The arm support portion 140 of the brush arm device 100X is mounted on the guide rail 130 and supports the rotation axis 120 so as to be movable in the Z direction. The arm support portion 140 incorporates an arm rotation drive unit 141, an arm movement drive unit 142, and an arm lifting drive unit 143.

[0137] In the brush arm device 100X, the arm rotation drive unit 141 rotates the rotation axis 120 based on the control of the control unit 900. As a result, the brush arm 110, which is mounted on the rotation axis 120, rotates about the rotation axis 120 (see the thick dashed arrow a6 in Figure 16). In addition, in the brush arm device 100X, the arm movement drive unit 142 moves the arm support unit 140 in the X direction based on the control of the control unit 900 (see the thick dashed arrow a5 in Figure 16). Furthermore, in the brush arm device 100X, the arm lifting drive unit 143 moves the rotation axis 120 in the Z direction based on the control of the control unit 900.

[0138] The brush arm 110 of the brush arm device 100X has a built-in pressing rotation drive unit 112, similar to the brush arm 110 of the brush arm device 100. The brush holding unit 111 of the brush arm device 100X is configured to hold and detach the brush device 50X. Here, the brush of the brush device 50X may be the same as or different from the brush 51 of the brush device 50 in Figure 1. If the brush 51 of the brush device 50X in this example is different from the brush 51 of the brush device 50 in Figure 1, for example, one brush 51 may be a sponge and the other brush 51 may be a sponge with abrasive particles dispersed in it.

[0139] The standby pod 210X, brush disposal unit 220X, and brush storage device 230X correspond to the brush arm device 100X and have the same configuration as the standby pod 210, brush disposal unit 220, and brush storage device 230 shown in Figure 1.

[0140] Here, in the substrate cleaning apparatus 1 of Figure 16, virtual lines L1 and L2 are defined in the same way as in the substrate cleaning apparatus 1 of Figure 1. Furthermore, in the substrate cleaning apparatus 1 of Figure 16, a line that is perpendicular to the virtual line L1 in a plan view, extends in the Y direction, and is located between the substrate holding device 10 and the second side wall SW2 is defined as the virtual line L3.

[0141] The standby pod 210X, brush disposal unit 220X, and brush storage device 230X are positioned symmetrically to the standby pod 210, brush disposal unit 220, and brush storage device 230 with respect to a vertical plane that includes the rotation center SC of the spin base 11 and is perpendicular to the virtual straight line L1. As a result, between the substrate holding device 10 and the second side wall SW2 in the X direction, the standby pod 210X, brush disposal unit 220X, and brush storage device 230X are arranged in this order toward the +Y direction on the virtual straight line L3.

[0142] With this configuration, in the standby pod 210X, when the brush device 50X held by the brush arm device 100X is in standby mode, the brush device 50X is housed and cleaned. In the brush disposal section 220X, when the brush device 50X is being replaced, the brush device 50X is removed from the brush arm device 100X. Furthermore, in the brush storage device 230X, one or more unused brush devices 50X are stored in the storage tank.

[0143] In this example, as indicated by the hatched arrows in Figure 16, the standby position P4 is set at a location that overlaps with the standby pod 210X in a plan view. The removal position P5 is set at a location that overlaps with the brush disposal section 220X in a plan view. The mounting position P6 is set at a location that overlaps with the brush storage device 230X in a plan view.

[0144] Therefore, the brush holding portion 111 of the brush arm device 100X moves between a position on the substrate W held by the substrate holding device 10 and a standby position P4, and moves in the Z direction, thereby performing the brush cleaning process of the substrate W by the brush device 50X. In addition, the brush holding portion 111 of the brush arm device 100X moves between the standby position P4, the removal position P5, and the mounting position P6, and moves in the Z direction, thereby performing the replacement process of the brush device 50X.

[0145] Figure 17 is a block diagram showing the configuration of the control system for the substrate cleaning apparatus 1X shown in Figure 16. The difference between the control system in Figure 17 and the control system in Figure 14 is that the control unit 900 controls the components (112, 112, 141, 141, 142, 142, 143, 143, 239, 239, 240, 240X, 250, 250X) corresponding to the two types of brush devices 50 and 50X, respectively.

[0146] In the substrate cleaning apparatus 1X shown in Figure 16, as described above, two brush arm devices 100 and 100X, corresponding to two types of brush devices 50 and 50X, are provided within a single chamber CH. This allows for two types of brush cleaning processes using the two types of brush devices 50 and 50X to be performed within a single chamber CH.

[0147] Furthermore, each brush arm device 100, 100X includes an arm rotation drive unit 141 and an arm movement drive unit 142. In this case, the movable range of each brush holding unit 111 is expanded in a plan view. As a result, it becomes possible to arrange multiple components (210, 220, 230) corresponding to the brush device 50, as well as multiple components (210X, 220X, 230X) corresponding to the brush device 50X, on virtual straight lines L2, L3 aligned in the X direction with the substrate holding device 10 in between.

[0148] As a result, it is possible to suppress the increase in size of the substrate cleaning device 1 while providing two types of cleaning functions using brushes and a brush replacement function in a single substrate cleaning device 1.

[0149] (b) In the substrate cleaning apparatus 1 according to the above embodiment, the brush holding portion 111 is configured to be movable in the X direction and in the rotational direction about the rotation axis 120, but the present invention is not limited thereto. In the present invention, it is sufficient for the brush holding portion 111 to move in two directions that are different from each other in a plan view. In this case, the two directions do not have to be the X direction and the rotational direction about the rotation axis 120.

[0150] Figure 18 is a schematic plan view of a substrate cleaning apparatus according to yet another embodiment. The substrate cleaning apparatus 1Y in Figure 18 includes a brush arm apparatus 100Y in place of the brush arm apparatus 100 in Figure 1. The brush arm apparatus 100Y includes an arm support portion 140Y, a shaft member 120Y, and a brush arm 110Y.

[0151] The arm support portion 140Y is provided so as to be movable in the X direction on the guide rail 130. The shaft member 120Y is supported by the arm support portion 140Y so as to extend in the Z direction, be immobile and movable in the Z direction. The brush arm 110Y is provided so as to extend in the -Y direction from the upper end of the shaft member 120Y. The tip of the brush arm 110Y is configured as a brush holding portion 111 so as to be able to hold and remove the brush device 50.

[0152] Here, a portion of the brush arm 110Y is configured to extend and retract in the Y direction. The arm support section 140Y also houses an arm movement drive unit 142, an arm lifting drive unit 143, and an arm extension / retraction drive unit 144. The arm movement drive unit 142 and the arm lifting drive unit 143 housed in the arm support section 140Y have the same configuration and operation as the arm movement drive unit 142 and the arm lifting drive unit 143 housed in the arm support section 140 in Figure 1.

[0153] The arm extension / retraction drive unit 144 includes an actuator such as a motor or air cylinder, and extends and retracts the brush arm 110. That is, the arm extension / retraction drive unit 144 moves the brush holding portion 111 of the brush arm 110Y in the Y direction based on the control of the control unit 900 (see the thick dashed arrow a7 in Figure 18).

[0154] As described above, in the substrate cleaning apparatus 1Y of Figure 18, the brush holding unit 111 moves in the chamber CH in different X and Y directions by the arm movement drive unit 142 and the arm extension / retraction drive unit 144. This improves the degree of freedom in the layout of the substrate holding device 10, standby pod 210, brush disposal unit 220, and brush storage device 230 within the chamber CH.

[0155] In addition to the example in Figure 18 above, the two directions in which the brush holder 111 moves in a plan view may be one rotational direction around one vertical axis and another rotational direction around the other vertical axis. For example, the brush arm device 100 may have a configuration in which the arm support 140 rotates around one rotational axis extending in the Z direction, and the brush arm 110 rotates around another rotational axis supported by the arm support 140. In other words, the brush arm device 100 may have a configuration such as a multi-joint arm having two rotational axes at the joint.

[0156] (c) The substrate cleaning apparatus 1 according to the above embodiment does not necessarily have to be provided with a gas supply device 320. Also, the substrate cleaning apparatus 1 does not necessarily have to be provided with a spray device 330. In these cases, the configuration of the substrate cleaning apparatus 1 is simplified.

[0157] (d) The substrate cleaning apparatus 1 according to the above embodiment includes a liquid supply device 310, a gas supply device 320, a spray device 330, and a brush arm device 100. Thus, the substrate cleaning apparatus 1 can perform cleaning of the substrate W using only the liquid supply device 310. It can also perform spray cleaning of the substrate W using only the spray device 330. Furthermore, it can perform brush cleaning of the substrate W using both the liquid supply device 310 and the brush arm device 100.

[0158] Therefore, depending on the type of substrate W or the purpose of cleaning the substrate W, brush cleaning is not necessarily required in the substrate cleaning apparatus 1. For example, in the substrate cleaning apparatus 1, only spray cleaning by the spray device 330 may be performed. Alternatively, only cleaning by the liquid supply device 310 may be performed. Thus, the method of cleaning the substrate W in the substrate cleaning apparatus 1 does not necessarily have to include brush cleaning.

[0159] (e) In the substrate cleaning apparatus 1 according to the above embodiment, the substrate holding device 10 has a so-called mechanical chuck configuration in which a plurality of holding pins 12 contact the outer peripheral edge of the substrate W to hold the substrate W, but the present invention is not limited thereto. The substrate holding device 10 may also have a suction configuration in which the central part of the lower surface of the substrate W is held by suction.

[0160] 10. Correspondence between each part of the embodiment and each component of the claim The following describes examples of the correspondence between each component of the claim and each component of the embodiment. Various other elements having the configuration or function described in the claim can also be used as each component of the claim.

[0161] In the above embodiment, the substrate holding device 10 is an example of a substrate holding part, the connected column 56 of the brush device 50 is an example of a first connected part, the multiple brush devices 50 are examples of a first cleaning tool and a second cleaning tool, the brush device connection part 400 of the brush arm device 100 is an example of a first connection part, and the brush holding part 111 of the brush arm device 100 is an example of a first cleaning tool holding part.

[0162] Furthermore, the brush storage device 230 is an example of the first cleaning tool storage unit, the arm rotation drive unit 141, arm movement drive unit 142, and arm lifting drive unit 143 of the brush arm device 100, and the arm movement drive unit 142, arm lifting drive unit 143, and arm extension drive unit 144 of the brush arm device 100Y are examples of the first holding unit moving device, the control unit 900 is an example of the control unit, the direction of the thick dashed-dotted arrow a5 (X direction) in Figures 1 and 18 are examples of the first and third directions, the direction of the thick dashed-dotted arrow a4 in Figure 1 and the direction of the thick dashed-dotted arrow a7 (Y direction) in Figure 18 are examples of the second direction, and the direction of the thick dashed-dotted arrow a5 (X direction) in Figure 16 is an example of the third direction.

[0163] Furthermore, the arm movement drive unit 142 of the brush arm device 100 and the brush arm device 100Y is an example of a first drive unit, the arm rotation drive unit 141 of the brush arm device 100 and the arm extension / retraction drive unit 144 of the brush arm device 100Y are examples of a second drive unit, and the substrate cleaning device 1 and the substrate processing device 800 are examples of substrate processing devices.

[0164] Furthermore, virtual line L1 is an example of a first virtual line, the central axis of the rotation axis 120 is an example of an axis that intersects in the first direction, the standby pod 210 is an example of a standby pod, the brush disposal unit 220 is an example of a removal unit, virtual line L2 is an example of a second virtual line, the connected column 56 of the brush device 50X is an example of a second connected part, the multiple brush devices 50X are examples of a third cleaning tool and a fourth cleaning tool, the brush device connection part 400 of the brush arm device 100X is an example of a second connection part, and the brush holding part 111 of the brush arm device 100X is an example of a second cleaning tool holding part.

[0165] Furthermore, the brush storage device 230X is an example of a second cleaning tool holding unit, the arm rotation drive unit 141, arm movement drive unit 142, and arm lifting drive unit 143 of the brush arm device 100X are examples of a second holding unit moving device, the direction of the thick dashed arrow a6 in Figure 16 is an example of a fourth direction, the arm movement drive unit 142 of the brush arm device 100X is an example of a third drive unit, the arm rotation drive unit 141 of the brush arm device 100X is an example of a fourth drive unit, the virtual line L2 is an example of a second virtual line, and the virtual line L3 is an example of a third virtual line.

[0166] 11. Summary of Embodiments (Paragraph 1) The substrate processing apparatus relating to Paragraph 1 is: A substrate holding section that holds the substrate, A first cleaning tool and a second cleaning tool, each having a first connected portion, A first cleaning tool holder having a first connecting portion that is detachable from the first connected portion of the first cleaning tool and the second cleaning tool, A first cleaning tool storage section is provided outside the substrate holding section for temporarily storing the second cleaning tool, A first holding part moving device for moving the first cleaning tool holding part, The device comprises a control unit which controls the first holding unit moving device while the first cleaning tool holding unit is holding the first cleaning tool, thereby cleaning the substrate held by the substrate holding unit, and after the first cleaning tool used to clean the substrate is removed from the first cleaning tool holding unit, controls the first holding unit moving device to connect the first connection part of the first cleaning tool holding unit to the first connection part of the second cleaning tool temporarily stored in the first cleaning tool storage unit, The first holding part moving device includes a first drive unit and a second drive unit that move the first cleaning tool holding part in a first direction and a second direction, respectively, which are different from each other.

[0167] In the substrate processing apparatus, the first cleaning tool holder holds the first cleaning tool and the second cleaning tool by connecting the first connecting part to the first connected part. With the first cleaning tool held in the first cleaning tool holder, the first cleaning tool holder is moved so that the cleaning surface of the first cleaning tool contacts the substrate held by the substrate holder. As a result, the substrate is cleaned. At this time, the second cleaning tool is temporarily stored in the first cleaning tool storage part.

[0168] When the first cleaning tool becomes contaminated or deteriorated to the extent that it needs to be replaced, the first cleaning tool is removed from the first cleaning tool holder. The first cleaning tool holder is then moved to the first cleaning tool storage unit, and the first connection part of the first cleaning tool holder is connected to the first connected part of the second cleaning tool stored in the first cleaning tool storage unit. In this way, the cleaning tool held in the first cleaning tool holder is replaced with a new cleaning tool.

[0169] The first holding unit moving device includes a first drive unit and a second drive unit. In this case, the movable range of the first cleaning tool holder in a plane parallel to the first and second directions is expanded compared to the case where the first holding unit moving device includes only one of the first and second drive units. This improves the degree of freedom in the layout of the multiple components, including the substrate holder and the first cleaning tool storage unit.

[0170] (Paragraph 2) In the substrate processing apparatus relating to Paragraph 1, The first direction is the direction along the first imaginary line that extends in a straight line in a plan view, The second direction may be a direction of rotation around an axis that intersects the first direction.

[0171] Here, the orientation of the first cleaning tool holder and the first cleaning tool in a plane parallel to the first and second directions is referred to as the posture. In this case, the first drive unit can move the first cleaning tool holder parallel to the first imaginary line while maintaining the posture of the first cleaning tool holder and the first cleaning tool, with the first cleaning tool holder holding the first cleaning tool. Furthermore, the second drive unit can rotate the first cleaning tool holder around an axis intersecting the first direction, with the first cleaning tool holder holding the first cleaning tool. At this time, the posture of the first cleaning tool holder and the first cleaning tool changes with rotation.

[0172] (Paragraph 3) In the substrate processing apparatus relating to Paragraph 1 or Paragraph 2, The substrate processing apparatus is The system further includes a standby pod provided outside the substrate holding portion and configured to accommodate the first cleaning tool and the second cleaning tool held in the first cleaning tool holding portion, The first holding unit moving device may further move the first cleaning tool holding unit to the standby pod.

[0173] In this case, the first cleaning tool or the second cleaning tool held in the first cleaning tool holding section can be housed in the standby pod. Furthermore, since the first holding section moving device includes the first drive section and the second drive section, it is not necessary to arrange the substrate holding section, the first cleaning tool storage section, and the standby pod so that they are aligned in one direction.

[0174] (Article 4) In a substrate processing apparatus relating to any one of paragraphs 1 to 3, The substrate processing apparatus is The substrate holding portion is provided outside the substrate holding portion and further includes a removal portion for removing the first cleaning tool and the second cleaning tool, which are held in the first cleaning tool holding portion, from the first cleaning tool holding portion. The first retaining part moving device may further move the first cleaning tool retaining part to the removal part.

[0175] In this case, the removal unit allows the first cleaning tool or the second cleaning tool held in the first cleaning tool holding unit to be removed from the first cleaning tool holding unit. Furthermore, since the first holding unit moving device includes the first drive unit and the second drive unit, it is not necessary to arrange the substrate holding unit, the first cleaning tool storage unit, and the removal unit in a unidirectional alignment.

[0176] (Paragraph 5) In the substrate processing apparatus relating to Paragraph 4, The first cleaning tool storage section and the removal section may be arranged so as to be adjacent to each other in a plan view.

[0177] In this case, since the first cleaning tool storage section and the removal section are adjacent to each other, the time required for the operation from removing the first cleaning tool held in the first cleaning tool holder section to connecting the first connection section of the first cleaning tool holder section to the first connection section of the second cleaning tool can be shortened. In other words, the time required for replacing cleaning tools with the first cleaning tool holder section can be shortened.

[0178] (Paragraph 6) In a substrate processing apparatus relating to Paragraph 1 or Paragraph 2, The system further includes a standby pod provided outside the substrate holding portion and configured to accommodate the first cleaning tool and the second cleaning tool held in the first cleaning tool holding portion, The first holding unit moving device further moves the first cleaning tool holding unit to the standby pod, The substrate holding portion overlaps the first imaginary line in a plan view, The first cleaning tool storage unit, the standby pod, and the removal unit overlap with a second imaginary line that intersects the first imaginary line in a plan view. At least a portion of the first cleaning tool storage unit, the standby pod, and the removal unit may overlap the first dashed line in a plan view.

[0179] In a plan view, the size of the substrate is larger than that of the cleaning tool. The substrate holder occupies a large amount of horizontal space relative to the first cleaning tool storage section, standby pod, and removal section, in order to hold the substrate.

[0180] According to the above configuration, the first cleaning tool storage unit, standby pod, and removal unit are compactly arranged on one side of the substrate holding unit in a plan view. Therefore, miniaturization of the substrate processing device is achieved.

[0181] (Paragraph 7) In a substrate processing apparatus relating to Paragraph 1 or Paragraph 2, The substrate processing apparatus is A third cleaning tool and a fourth cleaning tool, each having a second connected portion, A second cleaning tool holder having a second connecting portion that is detachable from the second connected portion of the third cleaning tool and the fourth cleaning tool, A second cleaning tool storage section is provided outside the substrate holding section for temporarily storing the fourth cleaning tool, The system further comprises a second holding part moving device for moving the second cleaning tool holding part, The control unit cleans the substrate held by the substrate holder by controlling the second holder moving device while the second cleaning tool holder is holding the third cleaning tool, and after the third cleaning tool used to clean the substrate is removed from the second cleaning tool holder, the control unit controls the second holder moving device to connect the second connection part of the second cleaning tool holder to the second connection part of the fourth cleaning tool which is temporarily stored in the second cleaning tool storage unit. The second holding portion moving device may include a third drive unit and a fourth drive unit that move the second cleaning tool holding portion in a third and a fourth direction, respectively, which are different from each other.

[0182] In this case, the second cleaning tool holder holds the third and fourth cleaning tools by connecting the second connecting part to the second connected part. With the third cleaning tool held by the second cleaning tool holder, the second cleaning tool holder is moved so that the cleaning surface of the third cleaning tool contacts the substrate held by the substrate holder. As a result, the substrate is cleaned. At this time, the fourth cleaning tool is temporarily stored in the second cleaning tool storage part.

[0183] When the third cleaning tool becomes contaminated or deteriorated to the extent that it needs to be replaced, the third cleaning tool is removed from the second cleaning tool holder. The second cleaning tool holder is then moved to the second cleaning tool storage unit, and the second connection of the second cleaning tool holder is connected to the second connection of the fourth cleaning tool stored in the second cleaning tool storage unit. In this way, the cleaning tool held in the second cleaning tool holder is replaced with a new cleaning tool.

[0184] The second holding unit moving device includes a third drive unit and a fourth drive unit. In this case, the movable range of the second cleaning tool holder in the plane parallel to the third and fourth directions is expanded compared to the case where the second holding unit moving device includes only one of the third and fourth drive units. This improves the degree of freedom in the layout of the multiple components, including the substrate holder and the second cleaning tool storage unit.

[0185] (Paragraph 8) In the substrate processing apparatus relating to Paragraph 7, The third direction is the same as the first direction. The substrate holding portion overlaps the first imaginary line in a plan view, The first cleaning tool storage section overlaps with a second imaginary line that intersects the first imaginary line in a plan view. The second cleaning tool storage section overlaps with a third imaginary line that intersects the first imaginary line and is parallel to the second imaginary line in a plan view. The substrate holding portion may be located between the second virtual line and the third virtual line in a plan view.

[0186] In a plan view, the size of the substrate is larger than that of the cleaning tool. The substrate holder occupies a larger horizontal space than the first and second cleaning tool storage sections, where the cleaning tools are stored, in order to hold the substrate.

[0187] According to the above configuration, the first cleaning tool storage section and its associated components are compactly arranged on one side of the substrate holding section in a plan view. Furthermore, the second cleaning tool storage section and its associated components are compactly arranged on the other side of the substrate holding section. Therefore, it becomes possible to provide two types of cleaning functions and a brush replacement function in a single substrate processing device while suppressing an increase in the overall size of the substrate processing device. [Explanation of symbols]

[0188] 1…Substrate cleaning device, 1X…Substrate cleaning device, 1Y…Substrate cleaning device, 10…Substrate holding device, 11…Spin base, 12…Holding pin, 13…Substrate holding drive unit, 14…Substrate rotation drive unit, 20…Cup device, 21…Cup body, 22…Cup lifting drive unit, 50, 50X…Brush device, 51…Brush, 51S…Cleaning surface, 52…Brush support, 53…Brush mounting part, 53S…Supported surface, 54…Recess, 54S…Bottom surface, 55…Flange part, 56…Connected column, 56a…First groove part, 56b…Second groove part, 60…Brush disposal part, 61…Removable structure, 62…Base part, 63…Protrusion 110, 100X, 100Y… Brush arm device, 110, 110Y… Brush arm, 111… Brush holding part, 112… Press rotation drive part, 120… Rotating shaft, 120Y… Shaft member, 130… Guide rail, 140, 140Y… Arm support part, 141… Arm rotation drive part, 142… Arm movement drive part, 143… Arm lifting drive part, 144… Arm extension drive part, 210, 210X… Standby pod, 220, 220X… Brush disposal part, 230, 230X… Brush storage device, 239… Liquid flow system, 240, 240X… Storage state detection part, 250, 250X… Brush shape detection unit, 310… Liquid supply device, 311, 321, 331… Rotating shaft, 312, 322, 332… Arm, 313… Liquid nozzle, 314… Liquid drive unit, 315… Liquid supply system, 320… Gas supply device, 323… Gas nozzle, 324… Gas drive unit, 325… Gas supply system, 330… Spray device, 333… Spray nozzle, 334… Spray drive unit, 335… Fluid supply system, 400… Brush device connection unit, 410… Shaft member, 420… Connection body unit, 421… First cylindrical part, 421h… Inner opening, 421i… Outer opening, 422… Second cylindrical part, 431… Pressing member, 431S… Pressed surface, 431T…Ball pressing surface, 432…Spring, 440…Casing, 490…Steel ball, 600…Operating unit, 800…Substrate processing unit, 801…Indexer block, 802…Processing block, 810…Carrier mounting table, 820, 843…Transporting unit, 831…Indexer robot, 832…Control device, 841, 842…Cleaning unit, 844…Main robot, 900…Control unit, 901…CPU, 902…RAM, 903…ROM, 904…Storage device, 909…CD-ROM, C…Carrier, CH…Chamber, L1, L2, L3…Virtual line, P1, P4…Standby position, P2,P5…Removal position, P3, P6…Mounting position, PASS…Substrate mounting area, SC…Rotation center, SW1…First side wall, SW2…Second side wall, SW3…Third side wall, SW4…Fourth side wall, W…Substrate, h01…Standby height, h02…Movement height, h03…Cleaning height, h04…Mounting height,

Claims

1. A substrate holding section that holds the substrate, A first cleaning tool and a second cleaning tool, each having a first connected portion, A first cleaning tool holder having a first connecting portion that is detachable from the first connected portion of the first cleaning tool and the second cleaning tool, A first cleaning tool storage section is provided outside the substrate holding section for temporarily storing the second cleaning tool, A first holding part moving device for moving the first cleaning tool holding part, The system includes a control unit which controls the first holding unit moving device while the first cleaning tool holding unit is holding the first cleaning tool, thereby cleaning the substrate held by the substrate holding unit, and after the first cleaning tool used to clean the substrate is removed from the first cleaning tool holding unit, controls the first holding unit moving device to connect the first connection part of the first cleaning tool holding unit to the first connection part of the second cleaning tool temporarily stored in the first cleaning tool storage unit, The substrate processing apparatus includes a first drive unit and a second drive unit that move the first cleaning tool holder in a first and second direction, respectively, which are different from each other.

2. The first direction is the direction along the first imaginary line that extends in a straight line in a plan view, The substrate processing apparatus according to claim 1, wherein the second direction is a direction of rotation around an axis intersecting the first direction.

3. The system further includes a standby pod provided outside the substrate holding portion and configured to accommodate the first cleaning tool and the second cleaning tool held in the first cleaning tool holding portion, The substrate processing apparatus according to claim 1 or 2, wherein the first holding unit moving device further moves the first cleaning tool holding unit to the standby pod.

4. The substrate holding portion is provided outside the substrate holding portion and further includes a removal portion for removing the first cleaning tool and the second cleaning tool, which are held in the first cleaning tool holding portion, from the first cleaning tool holding portion. The substrate processing apparatus according to claim 1 or 2, wherein the first holding portion moving device further moves the first cleaning tool holding portion to the removal portion.

5. The substrate processing apparatus according to claim 4, wherein the first cleaning tool storage section and the removal section are arranged to be adjacent to each other in a plan view.

6. The system further includes a standby pod provided outside the substrate holding portion and configured to accommodate the first cleaning tool and the second cleaning tool held in the first cleaning tool holding portion, The first holding unit moving device further moves the first cleaning tool holding unit to the standby pod, The substrate holding portion overlaps the first imaginary line in a plan view, The first cleaning tool storage unit, the standby pod, and the removal unit overlap with a second imaginary line that intersects the first imaginary line in a plan view. The substrate processing apparatus according to claim 1 or 2, wherein at least a portion of the first cleaning tool storage unit, the standby pod, and the removal unit overlaps with the first dashed line in a plan view.

7. A third cleaning tool and a fourth cleaning tool, each having a second connected portion, A second cleaning tool holder having a second connecting portion that is detachable from the second connected portion of the third cleaning tool and the fourth cleaning tool, A second cleaning tool storage section is provided outside the substrate holding section for temporarily storing the fourth cleaning tool, The system further comprises a second holding part moving device for moving the second cleaning tool holding part, The control unit controls the second holding unit moving device while the second cleaning tool holding unit is holding the third cleaning tool, thereby cleaning the substrate held by the substrate holding unit, and after the third cleaning tool used to clean the substrate is removed from the second cleaning tool holding unit, the control unit controls the second holding unit moving device to connect the second connection part of the second cleaning tool holding unit to the second connection part of the fourth cleaning tool temporarily stored in the second cleaning tool storage unit. The substrate processing apparatus according to claim 1, wherein the second holding portion moving device includes a third drive unit and a fourth drive unit that move the second cleaning tool holding portion in a third and a fourth direction, respectively, which are different from each other.

8. The third direction is the same as the first direction. The substrate holding portion overlaps the first imaginary line in a plan view, The first cleaning tool storage section overlaps with a second imaginary line that intersects the first imaginary line in a plan view. The second cleaning tool storage section overlaps with a third imaginary line that intersects the first imaginary line and is parallel to the second imaginary line in a plan view. The substrate holding portion is located between the second virtual line and the third virtual line in a plan view, as described in claim 7.

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