Cutting apparatus and cutting method for workpieces

Abstract

The present invention provides a cutting apparatus capable of suppressing the deterioration of workpiece processing quality caused by the spindle being positioned at an angle. [Solution] The cutting apparatus for cutting a workpiece comprises a chuck table having holding surfaces parallel to a first direction and a second direction perpendicular to the first direction, a spindle rotatable around a straight line parallel to the holding surface as its axis of rotation and capable of mounting a cutting blade at its tip, a data acquisition unit for acquiring data used to determine the misalignment angle between the straight line parallel to the second direction and the axis of rotation, and a controller. The controller includes a memory for storing a cutting program including a threshold for the misalignment angle and standard operation instructions, and a processor for determining the misalignment angle using the data and, if the misalignment angle exceeds the threshold, for moving the chuck table and the spindle relative to each other according to a corrected operation instruction, which is an instruction corrected from the standard operation instruction according to the misalignment angle.

Description

Technical Field

[0001] The present invention relates to a cutting device for cutting a workpiece and a cutting method for a workpiece to be cut by the cutting device.

Background Art

[0002] Semiconductor packages such as ICs (Integrated Circuits), which are essential components in various electronic devices such as mobile phones and personal computers, are manufactured through semiconductor manufacturing processes. This semiconductor manufacturing process is roughly divided into a pre-process of forming a plurality of devices each including a large number of circuit elements on one surface side of a wafer, and a post-process of packaging each of the plurality of chips manufactured from this wafer.

[0003] In the semiconductor manufacturing process, various processes are performed on the wafer as a workpiece. For example, in the pre-process, the outer peripheral edge of the wafer is chamfered prior to the formation of a plurality of devices in order to suppress damage to the wafer. Also, in the post-process, for example, after grinding the other surface side of the wafer to reduce the height of the chips, a plurality of chips are manufactured by removing a portion located at the boundary of the plurality of devices in the wafer.

[0004] <00000​​​​​​​​​​​​​​​[Overview of the project] [Problems that the invention aims to solve]

[0006] The removal of a desired portion of a wafer (for example, a portion along the boundary of multiple devices or one or all of the outer edge) is carried out, for example, by cutting the wafer in a cutting apparatus. This cutting apparatus generally comprises a chuck table having a holding surface and a spindle that is rotatable about a straight line parallel to the holding surface as an axis of rotation and can be fitted with an annular cutting blade at its tip.

[0007] Furthermore, cutting devices are often equipped with three movement mechanisms (X-direction movement mechanism, Y-direction movement mechanism, and Z-direction movement mechanism) for relatively moving the chuck table and spindle in a first direction (X-direction) and a second direction (Y-direction) that are parallel to and perpendicular to the holding surface, and in a third direction (Z-direction) that is perpendicular to each of the first and second directions. In addition, cutting devices may be equipped with a rotation mechanism for rotating the chuck table with a rotation axis that passes through the center of the holding surface and is parallel to the third direction.

[0008] In the cutting apparatus, a desired portion of the wafer is cut by moving the chuck table and the spindle relative to each other along at least one of the first, second, and third directions, and / or by rotating the chuck table, so that the cutting blade, which rotates together with the spindle, comes into contact with the wafer held on the holding surface of the chuck table.

[0009] In such cutting devices, the spindle is generally positioned so that its axis of rotation is parallel to a straight line parallel to the second direction. However, if there is a defect when assembling the spindle to the cutting device, the axis of rotation of the spindle may become tilted from the second direction. In this case, the processing quality of the wafer in the cutting device may deteriorate.

[0010] In view of this, the object of the present invention is to provide a cutting apparatus and a cutting method for a workpiece that can suppress deterioration of the processing quality of a workpiece such as a wafer caused by the spindle being arranged such that its rotation axis is tilted from a second direction. [Means for solving the problem]

[0011] According to one aspect of the present invention, a cutting apparatus for cutting a workpiece comprises: a chuck table having holding surfaces parallel to a first direction and a second direction perpendicular to the first direction; a spindle rotatable about a straight line parallel to the holding surface as a rotation axis and capable of mounting an annular cutting blade at its tip; a data acquisition unit for acquiring data used to determine the misalignment angle between the straight line parallel to the second direction and the rotation axis; and a controller for controlling the operation of the chuck table, the spindle, and the data acquisition unit, wherein the controller has a threshold for the misalignment angle and a state where the misalignment angle is 0°. A cutting apparatus is provided, comprising: a cutting program including a standard operation instruction which is an instruction for moving the chuck table and the spindle relatively so that a desired portion of the workpiece held on the holding surface is cut by the cutting blade which rotates around the axis of rotation; a memory for storing the program; and a processor for using the data to determine the misalignment angle and, if the determined misalignment angle exceeds a threshold, for moving the chuck table and the spindle relatively according to a corrected operation instruction which is an instruction corrected from the standard operation instruction according to the misalignment angle.

[0012] Preferably, the data acquisition unit is a camera for imaging a groove formed in a test cutting member by causing the cutting blade, which rotates about the axis of rotation, to cut into the test cutting member along a third direction perpendicular to the holding surface, the data being a signal indicating an image containing the groove, and the processor determining the angle between a straight line in the image along the direction in which the groove extends and a straight line along the first direction as the displacement angle.

[0013] According to another aspect of the present invention, a cutting apparatus comprising: a chuck table having holding surfaces parallel to a first direction and a second direction perpendicular to the first direction; a spindle rotatable about a straight line parallel to the holding surface as an axis of rotation and capable of mounting an annular cutting blade at its tip; and a data acquisition unit for acquiring data used to determine the misalignment angle between the straight line parallel to the second direction and the axis of rotation, wherein a cutting method for cutting a workpiece comprises: a grasping step of determining the misalignment angle using the data; and a cutting step of cutting a desired portion of the workpiece held on the holding surface by the cutting blade rotating about the axis of rotation after performing the grasping step. The cutting step is provided, in which, if the displacement angle grasped in the grasping step is less than or equal to a threshold, the chuck table and the spindle are moved relative to each other according to a standard operation instruction, which is an instruction to move the chuck table and the spindle relative to each other so that the desired portion of the workpiece held on the holding surface is cut by the cutting blade rotating around the axis of rotation when the displacement angle is 0°, and if the displacement angle grasped in the grasping step is greater than the threshold, the chuck table and the spindle are moved relative to each other according to a corrected operation instruction, which is an instruction corrected from the standard operation instruction according to the displacement angle.

[0014] For example, the workpiece is a wafer in which a plurality of devices are arranged in a matrix, and each of the standard operation instruction and the compensatory operation instruction is an instruction for cutting the wafer along the boundary of the plurality of devices, the standard operation instruction includes a standard feed instruction for moving the chuck table and the spindle relative to each other along the first direction, and the compensatory operation instruction includes an orientation instruction for rotating the chuck table so that the axis of rotation and a linear first division line included in the boundary are parallel, and a compensatory feed instruction for moving the chuck table and the spindle relative to each other along a direction parallel to a second division line that is included in the boundary and perpendicular to the first division line, after the chuck table has been rotated according to the orientation instruction.

[0015] Alternatively, the workpiece is a wafer with a chamfered outer edge, and each of the standard operation instruction and the compensatory operation instruction is an instruction for cutting the wafer to remove at least a portion of the outer edge, the standard operation instruction includes a standard alignment instruction for moving the chuck table and the spindle relative to each other such that the lower end of the cutting blade is located directly above the outer edge, and the angle between the line segment connecting the center of the holding surface and the lower end of the cutting blade, and a straight line passing through the center of the holding surface and parallel to the second direction, as viewed from a third direction perpendicular to the holding surface, is a desired angle, the compensatory operation instruction may include a compensatory alignment instruction for moving the chuck table and the spindle relative to each other such that the lower end of the cutting blade is located directly above the outer edge, and the angle between the line segment connecting the center of the holding surface and the lower end of the cutting blade, and the axis of rotation, as viewed from the third direction, is a desired angle. [Effects of the Invention]

[0016] In this invention, when the misalignment angle between a straight line parallel to the second direction and the axis of rotation exceeds a threshold, the chuck table and the spindle are moved relative to each other according to a corrected operation instruction, which is an instruction corrected from the standard operation instruction according to the misalignment angle. This makes it possible to suppress the deterioration of the machining quality of the workpiece caused by the spindle being positioned so that its axis of rotation is tilted from the second direction. [Brief explanation of the drawing]

[0017] [Figure 1] Figure 1(A) is a schematic top view showing an example of a workpiece, and Figure 1(B) is a schematic front view showing the workpiece shown in Figure 1(A). [Figure 2] Figure 2 is a schematic perspective view showing an example of a cutting apparatus for cutting a workpiece. [Figure 3] Figures 3(A) and 3(B) are schematic top views illustrating examples of components of a cutting unit that are exposed and not housed within a housing. [Figure 4] Figure 4 is a schematic block diagram showing an example of the hardware that makes up the controller. [Figure 5] Figure 5 is a flowchart illustrating an example of a workpiece cutting method used in a cutting machine. [Figure 6] Figure 6(A) is a schematic top view showing the formation of a test cutting groove in a test cutting member when the misalignment angle between a line parallel to the Y direction and the rotation axis of the spindle is 0°, and Figure 6(B) is a schematic top view showing the test cutting groove formed in the test cutting member in this state. [Figure 7] Figure 7(A) is a schematic top view showing the formation of a test cutting groove in a test cutting member when the misalignment angle between a line parallel to the Y direction and the rotation axis of the spindle exceeds a threshold, and Figure 7(B) is a schematic top view showing the test cutting groove formed in the test cutting member in this state. [Figure 8]FIG. 8 is a flowchart schematically showing the operation of the processor when relatively moving the chuck table and the spindle according to the cutting program. [Figure 9] FIG. 9 is a top view schematically showing the state of the standard operation steps carried out to remove the portion along the boundaries of a plurality of devices in the workpiece. [Figure 10] FIG. 10(A) is a top view schematically showing the state of the standard operation steps carried out to remove one side of the outer peripheral end portion of the workpiece, and FIG. 10(B) is a front view schematically showing the workpiece after these standard operation steps. [Figure 11] FIG. 11 is a top view schematically showing the state of the correction operation steps carried out to remove the portion along the boundaries of a plurality of devices in the workpiece. [Figure 12] FIGS. 12(A) is a top view schematically showing the state of the correction operation steps carried out to remove one side of the outer peripheral end portion of the workpiece, and FIG. 12(B) is a front view schematically showing the workpiece after these correction operation steps. [Figure 13] FIG. 13(A) is a top view schematically showing another example of the state of the standard operation steps carried out to remove one side of the outer peripheral end portion of the workpiece, and FIG. 13(B) is a front view schematically showing the workpiece after these standard operation steps. [Figure 14] FIG. 14(A) is a top view schematically showing the state of the correction operation steps carried out to remove one side of the outer peripheral end portion of the workpiece, and FIG. 14(B) is a front view schematically showing the workpiece after these correction operation steps.

DETAILED DESCRIPTION OF THE INVENTION

[0018] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1(A) is a top view schematically showing an example of a workpiece, and FIG. 1(B) is a front view schematically showing the workpiece shown in FIG. 1(A).

[0019] The workpiece 11 shown in Figures 1(A) and 1(B) has one generally parallel surface 11a and the other surface 11b, and is, for example, a wafer made of silicon (Si). Multiple devices 13 are provided on the one surface 11a side of this workpiece 11.

[0020] Each device 13 includes, for example, a semiconductor element for constituting an IC, semiconductor memory, or CMOS (Complementary Metal Oxide Semiconductor) image sensor. Furthermore, multiple devices 13 are arranged in a matrix configuration.

[0021] In other words, the boundaries of the multiple devices 13 extend in a grid pattern. The linearly extending portion of these boundaries is also called the division line. Furthermore, the outer edges of the workpiece 11 are chamfered. In other words, the side surface 11c of the workpiece 11 is curved so as to be convex outwards.

[0022] There are no restrictions on the material, shape, structure, or size of the workpiece 11. The workpiece 11 may be, for example, a wafer made of a semiconductor other than silicon (e.g., silicon carbide (SiC) or gallium nitride (GaN)). Similarly, there are no restrictions on the type, quantity, shape, structure, size, or arrangement of the multiple devices 13.

[0023] Furthermore, the workpiece 11 may be integrated with the ring frame via a tape containing an adhesive layer attached to the other surface 11b. Alternatively, the workpiece 11 may be integrated with the ring frame via a sheet without an adhesive layer that is heat-pressed to the other surface 11b.

[0024] Figure 2 is a schematic perspective view showing an example of a cutting apparatus for cutting a workpiece 11. The directions indicated by arrow X (X direction or first direction) and arrow Y (Y direction or second direction) in Figure 2 are mutually orthogonal directions on the horizontal plane. The direction indicated by arrow Z (Z direction or third direction) is a direction perpendicular to the X direction and the Y direction, respectively (vertical direction).

[0025] The cutting apparatus 2 shown in Figure 2 includes a base 4 that supports each component. A recess 4a extending along the X direction is formed on the upper surface of the base 4. Inside the recess 4a, a flat table cover 6 and a bellows-shaped dustproof and waterproof cover 8 that expands and contracts as the table cover 6 moves are provided.

[0026] Furthermore, a chuck table 10 is provided above the central portion of the table cover 6. This chuck table 10 has a disc-shaped frame 10a made of ceramics or the like. The frame 10a has a disc-shaped bottom wall and cylindrical side walls that rise from the outer peripheral end of the bottom wall.

[0027] Furthermore, a disc-shaped porous plate 10b, for example, made of porous ceramics, is fixed to the recess defined by the bottom wall and side wall of the frame 10a. This porous plate 10b has a diameter that is approximately equal to the inner diameter of the side wall of the frame 10a.

[0028] Furthermore, the porous plate 10b communicates with a suction source for the chuck table, such as an ejector, located inside the recess 4a, via a channel formed in the bottom wall of the frame 10a. The upper surfaces of the side walls of the frame 10a and the upper surface of the porous plate 10b are parallel to the X and Y directions, respectively, and function as holding surfaces for the chuck table 10.

[0029] Specifically, when a workpiece 11, either as a standalone piece or integrated with a ring frame via a dicing tape, is brought into the cutting device 2, the workpiece 11 or dicing tape covers the porous plate 10b, and the workpiece 11 is placed on the chuck table 10 such that the center of the workpiece 11 aligns with the center of the holding surface.

[0030] Then, when the suction source for the chuck table, which is in communication with the porous plate 10b, is activated in this state, a suction force is applied to the workpiece 11 directly or indirectly. As a result, the workpiece 11 is held on the holding surface of the chuck table 10.

[0031] Furthermore, a sub-chuck table 12 is provided above the corners of the table cover 6. This sub-chuck table 12 has a rectangular plate-shaped frame 12a made of ceramics or the like. The frame 12a has a rectangular plate-shaped bottom wall and rectangular tubular side walls that rise from the outer periphery of the bottom wall.

[0032] Furthermore, a rectangular porous plate 12b, for example, made of porous ceramics, is fixed to the recess defined by the bottom wall and side wall of the frame 12a. This porous plate 12b has an outer circumference that is approximately the same shape as the inner circumference of the side wall of the frame 12a.

[0033] Furthermore, the porous plate 12b communicates with a suction source (not shown) for the sub-chuck table, such as an ejector, located inside the recess 4a, via a channel formed in the bottom wall of the frame 12a. The upper surfaces of the side walls of the frame 12a and the upper surface of the porous plate 12b are parallel to the X and Y directions, respectively, and function as holding surfaces for the sub-chuck table 12.

[0034] Specifically, for example, when a rectangular plate-shaped test cutting member made of silicon (not shown in Figure 2) is brought into the cutting device 2, the test cutting member is placed on the sub-chuck table 12 so as to cover the porous plate 12b.

[0035] Then, when the suction source for the sub-chuck table, which is in communication with the porous plate 12b, is activated in this state, a suction force is applied to the test cutting member. As a result, the test cutting member is held on the holding surface of the sub-chuck table 12.

[0036] Furthermore, the chuck table 10 and the sub-chuck table 12 are connected to an X-direction movement mechanism (not shown) provided inside the recess 4a. This X-direction movement mechanism includes, for example, a ball screw and a motor for rotating the screw shaft of the ball screw.

[0037] When this X-direction movement mechanism is activated, the chuck table 10 and the sub-chuck table 12 move along the X-direction. Furthermore, as this movement occurs, the table cover 6 moves along the X-direction and the dustproof and waterproof cover 8 expands and contracts.

[0038] Furthermore, the chuck table 10 is connected to a rotating mechanism (not shown) located inside the recess 4a. This rotating mechanism includes, for example, a shaft, a pulley connected to the shaft, and a motor for rotating the pulley.

[0039] When this rotation mechanism is activated, the chuck table 10 rotates with a rotation axis that passes through the center of its holding surface and is aligned with the Z direction. Furthermore, if a workpiece 11 is held on the holding surface of the chuck table 10, the workpiece 11 will also rotate along with the rotation of the chuck table 10.

[0040] A support structure 14 is provided in the region of the upper surface of the base 4 located in the Y direction when viewed from the recess 4a. This support structure 14 has an upright portion 14a that is erected from the upper surface of the base 4, and an arm portion 14b that extends from the upper part of the upright portion 14a in the opposite direction to the Y direction so as to span the recess 4a.

[0041] A Y-direction movement mechanism 16 is provided on one side of the arm portion 14b. This Y-direction movement mechanism 16 has a pair of guide rails 18 that are fixed to one side of the arm portion 14b and extend along the Y direction. A movable plate 20 is connected to the surface side of the pair of guide rails 18 in a manner that allows it to slide along the pair of guide rails 18.

[0042] Furthermore, a screw shaft 22 extending along the Y direction is positioned between the pair of guide rails 18. A motor (not shown) for rotating the screw shaft 22 is connected to one end of this screw shaft 22.

[0043] Furthermore, a nut (not shown) is provided on the surface of the screw shaft 22, where a helical groove is formed, to accommodate a number of balls that roll on the surface of the rotating screw shaft 22, thus forming a ball screw. That is, when the screw shaft 22 rotates, the number of balls circulate within the nut, causing the nut to move along the Y direction.

[0044] Furthermore, this nut is fixed to the back side of the movable plate 20. Therefore, by rotating the screw shaft 22 with a motor connected to one end of the screw shaft 22, the movable plate 20 moves along the Y direction together with the nut.

[0045] A Z-direction movement mechanism 24 is provided on the surface side of the movable plate 20. This Z-direction movement mechanism 24 has a pair of guide rails 26 that are fixed to the surface of the movable plate 20 and extend along the Z direction. A movable plate 28 is connected to the surface side of the pair of guide rails 26 in a manner that allows it to slide along the pair of guide rails 26.

[0046] Furthermore, a screw shaft 30 extending along the Z direction is positioned between the pair of guide rails 26. A motor 32 for rotating the screw shaft 30 is connected to the upper end of this screw shaft 30.

[0047] Furthermore, a nut (not shown) is provided on the surface of the screw shaft 30, where a helical groove is formed, to accommodate a number of balls that roll on the surface of the rotating screw shaft 30, thus forming a ball screw. That is, when the screw shaft 30 rotates, the number of balls circulate within the nut, causing the nut to move along the Z direction.

[0048] Furthermore, this nut is fixed to the back side of the movable plate 28. Therefore, when the screw shaft 30 is rotated by the motor 32, the movable plate 28 moves along the Z direction together with the nut.

[0049] A cylindrical housing 34 is fixed to the lower part of the movable plate 28. The cutting unit 36 ​​is partially housed in the housing 34. Some components of the cutting unit 36 ​​are not housed in the housing 34 and are exposed on the chuck table 10 side.

[0050] Figures 3(A) and 3(B) are schematic top views showing examples of components of the cutting unit 36 ​​that are exposed and not housed in the housing 34. The components of the cutting unit 36 ​​shown in Figures 3(A) and 3(B) are concentric structures centered on a straight line parallel to the holding surface of the chuck table 10.

[0051] Specifically, Figure 3(A) is a schematic top view showing a cutting unit 36 ​​that includes a thin cutting blade used when cutting a workpiece 11 along the boundaries of multiple devices 13. Figure 3(B) is a schematic top view showing the components of the cutting unit 36 ​​that includes a thick cutting blade used when cutting one side 11a of the outer peripheral edge of the workpiece 11 or the entire surface.

[0052] The cutting unit 36 ​​has a spindle 38 that extends along the Y direction and whose tip protrudes from the housing 34. The spindle 38 is supported by the housing 34 in such a manner that it can rotate about a straight line parallel to the holding surface of the chuck table 10 as the axis of rotation.

[0053] A thin cutting blade 40a or a thick cutting blade 40b is attached to the tip of the spindle 38. These cutting blades 40a and 40b have an annular cutting edge containing a binder made of metal, ceramics, or resin, and abrasive grains made of diamond or the like dispersed in the binder.

[0054] Furthermore, the base end of the spindle 38 is connected to a motor (not shown) housed in the housing 34. When this motor is operated, the cutting blades 40a and 40b rotate together with the spindle 38, with a rotation axis that is a straight line parallel to the holding surface of the chuck table 10.

[0055] Furthermore, while the cutting blades 40a and 40b are rotating, the X-direction movement mechanism, Y-direction movement mechanism 16, Z-direction movement mechanism 24, and rotation mechanism are operated to bring the cutting blades 40a and 40b into contact with the workpiece 11 held on the holding surface of the chuck table 10 or the test cutting member held on the holding surface of the sub-chuck table 12, thereby cutting the workpiece 11 or the test cutting member.

[0056] As shown in Figure 2, a camera (data acquisition unit) 42 capable of imaging the holding surface side of the chuck table 10 and the holding surface side of the sub-chuck table 12 is also fixed to the lower part of the movable plate 28.

[0057] This camera 42 includes, for example, a light source such as an LED (Light Emitting Diode), an objective lens located in the X direction when viewed from the cutting blades 40a and 40b in a plan view, and an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0058] The camera 42 then images the grooves (test cutting grooves) formed in the test cutting member held on the holding surface of the sub-chuck table 12 by, for example, cutting the test cutting member along the Z direction with the cutting blades 40a and 40b that rotate together with the spindle 38. Once this imaging is complete, a signal indicating the image containing the test cutting grooves (test cutting image) is transmitted from the camera 42 to the controller of the cutting device 2.

[0059] Figure 4 is a schematic block diagram showing an example of the hardware that constitutes this controller. The controller 44 shown in Figure 4 is provided to control the operation of the components of the cutting machine 2 described above, and includes a processor 44a and memory 44b.

[0060] The processor 44a is composed of, for example, a CPU (Central Processing Unit). The memory 44b is composed of, for example, volatile memory such as DRAM (Dynamic Random Access Memory) or SRAM (Static Random Access Memory), and non-volatile memory such as SSD (Solid State Drive) (NAND flash memory) or HDD (Hard Disk Drive) (magnetic storage device).

[0061] The processor 44a reads various programs stored in the memory 44b and controls the components of the cutting device 2. In addition to various programs, the memory 44b can also store data used when these programs are executed by the processor 196a (for example, a signal indicating a test cutting image transmitted from the camera 42 to the controller 44, and a threshold value for the deviation angle between a straight line parallel to the Y direction and the rotation axis of the spindle 38, which will be described later).

[0062] The various programs include a program for forming a test cutting groove in a test cutting member held on the holding surface of the sub-chuck table 12 and then imaging the test cutting groove (test cutting program), and a program for cutting a desired portion of the workpiece 11 held on the holding surface of the chuck table 10 (for example, a portion along the boundary of a plurality of devices 13, or one side 11a of the outer peripheral end, or the whole of it) (cutting program).

[0063] Specifically, the test cutting program includes instructions for moving the sub-chuck table 12 and the spindle 38 relative to each other. The cutting program also includes instructions (standard operation instructions) for moving the chuck table 10 and the spindle 38 relative to each other when the axis of rotation of the spindle 38 is parallel to the Y direction (i.e., the misalignment angle between the line parallel to the Y direction and the axis of rotation of the spindle 38 is 0°).

[0064] Furthermore, after executing the test cutting program, the processor 44a uses the signal indicating the test cutting image transmitted from the camera 42 to the controller 44 to determine the misalignment angle between a line parallel to the Y direction and the rotation axis of the spindle 38. Specifically, the processor 44a determines the misalignment angle as the angle formed by a line along the direction in which the test cutting groove extends and a line along the X direction in the test cutting image.

[0065] Furthermore, before executing the cutting program, the processor 44a refers to the detected misalignment angle to determine whether or not correction of the standard operation instructions is necessary. Specifically, the processor 44a determines that correction of the standard operation instructions is unnecessary if the detected misalignment angle is less than or equal to a threshold of misalignment angles pre-stored in memory 44b, and determines that correction of the standard operation instructions is necessary if it exceeds the threshold. Specific examples of standard operation instructions and corrected operation instructions (corrected operation instructions) will be described later.

[0066] Figure 5 is a schematic flowchart illustrating an example of a workpiece cutting method used by the cutting device 2 to cut the workpiece 11. In this method, first, the misalignment angle between a straight line parallel to the Y direction and the rotation axis of the spindle 38 is determined (determination step S1). Specifically, in this determination step S1, the processor 44a reads a test cutting program stored in memory 44b, controls the components of the cutting device 2, and then determines the misalignment angle.

[0067] Figure 6(A) is a schematic top view showing the formation of a test cutting groove in a test cutting member when the displacement angle is 0°, and Figure 6(B) is a schematic top view showing the test cutting groove formed in the test cutting member in this state.

[0068] Furthermore, Figure 7(A) is a schematic top view showing the formation of a test cutting groove in a test cutting member when the displacement angle exceeds a threshold, and Figure 7(B) is a schematic top view showing the test cutting groove formed in the test cutting member in this state.

[0069] Although Figures 6(A) and 7(A) show the formation of a test cutting groove using a thin cutting blade 40a, this test cutting groove may also be formed using a thicker cutting blade 40b.

[0070] In grasping step S1, first, the lower ends of the cutting blades 40a and 40b are positioned directly above the test cutting member 21 held on the holding surface of the sub-chuck table 12 (see Figures 6(A) and 7(A)). That is, the processor 44a operates the X-direction movement mechanism, Y-direction movement mechanism 16, and / or Z-direction movement mechanism 24 to move the sub-chuck table 12 along the X-direction and / or the spindle 38 along the Y-direction and / or Z-direction until the lower ends of the test cutting member 21 and the cutting blades 40a and 40b overlap in a plan view.

[0071] Next, the cutting blades 40a and 40b are rotated around the rotation axis of the spindle 38. That is, the processor 44a operates the motor housed in the housing 34.

[0072] Next, while the cutting blades 40a and 40b are still rotating, the cutting blades 40a and 40b are lowered until their lower ends are below the upper surface of the test cutting member 21 and above the upper surface of the sub-chuck table 12. That is, the processor 44a operates the Z-direction movement mechanism 24 so that the cutting blades 40a and 40b are lowered together with the spindle 38 until they reach that position.

[0073] As a result, test cutting grooves 21a and 21b are formed in the test cutting member 21 (see Figures 6(B) and 7(B)). Note that the angle between the straight line Lg along the direction in which the test cutting groove 21a extends and the straight line Lx along the X direction shown in Figure 6(B) is 0°. Also, the angle between the straight line Lg along the direction in which the test cutting groove 21b extends and the straight line Lx along the X direction shown in Figure 7(B) is the angle θ that exceeds the threshold of the displacement angle stored in memory 44b.

[0074] Next, the rotation of the cutting blades 40a and 40b is stopped, and the cutting blades 40a and 40b are raised so as to move them away from the test cutting member 21. That is, the processor 44a stops the operation of the motor housed in the housing 34 and switches the operation of the Z-direction movement mechanism 24.

[0075] Next, the camera 42 is positioned directly above the test cutting grooves 21a and 21b. That is, the processor 44a operates the X-direction movement mechanism described above to move the sub-chuck table 12 along the X-direction.

[0076] Next, the test cutting grooves 21a and 21b are imaged. That is, the processor 44a operates the camera 42. This completes the execution of the test cutting program by the processor 44a.

[0077] Then, once the camera 42 has finished capturing the image, a signal indicating the test cut image is transmitted from the camera 42 to the controller 44. When this signal is received by the controller 44, the processor 44a determines the angle of misalignment between a straight line parallel to the Y direction and the rotation axis of the spindle 38.

[0078] For example, if the test cutting image indicated by this signal includes the test cutting groove 21a shown in Figure 6(B), the 0° angle between the line Lg and the line Lx is recognized by the processor 44a as the relevant misalignment angle. On the other hand, if the test cutting image indicated by this signal includes the test cutting groove 21b shown in Figure 7(B), the angle θ between the line Lg and the line Lx is recognized by the processor 44a as the relevant misalignment angle.

[0079] After performing the grasping step S1, the cutting blades 40a and 40b, which rotate around the rotation axis of the spindle 38, cut a desired portion of the workpiece 11 held on the holding surface of the chuck table 10 (cutting step S2). Specifically, in this cutting step S2, the processor 44a reads the cutting program stored in the memory 44b and controls the components of the cutting device 2.

[0080] In the cutting program, the instructions for moving the chuck table 10 and the spindle 38 relative to each other change depending on the magnitude of the misalignment angle grasped in the grasping step S1. Figure 8 is a flowchart schematically showing the operation of the processor 44a when moving the chuck table 10 and the spindle 38 relative to each other according to the cutting program.

[0081] In the cutting step S2, first, the displacement angle grasped in the grasping step S1 is compared with the displacement angle threshold stored in memory 44b (comparison step S21). If this displacement angle is less than or equal to the threshold (comparison step S21: YES), the chuck table 10 and the spindle 38 are moved relative to each other according to the standard operation instruction (standard operation step S22).

[0082] Figure 9 is a schematic top view showing a standard operation step S22 performed to remove portions of the workpiece 11 along the boundaries of multiple devices 13.

[0083] In this standard operation step S22, first, the straight line Ly along the Y direction is made parallel to the first division line L1 which is included in the boundary of the multiple devices 13. That is, the processor 44a operates the above-mentioned rotation mechanism in accordance with the orientation instruction included in the standard operation instruction so that the chuck table 10 is rotated until the angle between the straight line Ly and the first division line L1 becomes 0°.

[0084] Furthermore, when loading the workpiece 11 into the cutting device 2, if the workpiece 11 is held on the holding surface of the chuck table 10 so that the straight line Ly and the first planned division line L1 are parallel, then the standard operation instructions do not need to include an orientation instruction.

[0085] Next, in a plan view, the second division line L2 is positioned perpendicular to the first division line L1 in the X direction as seen from the cutting blade 40a. That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the alignment instructions included in the standard operation instructions, so as to move the chuck table 10 along the X direction and / or move the spindle 38 along the Y direction until the cutting blade 40a and the second division line L2 are aligned in the X direction.

[0086] Next, the lower end of the cutting blade 40a is positioned at approximately the same height as the other surface 11b of the workpiece 11. That is, the processor 44a operates the Z-axis movement mechanism 24 according to the height adjustment instruction included in the standard operation instruction so that the spindle 38 is lowered until the lower end of the cutting blade 40a is positioned at this height.

[0087] Next, the cutting blade 40a is rotated around the rotation axis A of the spindle 38. That is, the processor 44a operates the motor housed in the housing 34 according to the spindle rotation instruction included in the standard operation instruction.

[0088] Next, while the cutting blade 40a is still rotating, the workpiece 11 is moved so that, in a plan view, the lower end of the cutting blade 40a passes through the second planned division line L2 (see Figure 9). That is, the processor 44a operates the above-mentioned X-direction movement mechanism according to the standard machining feed instruction included in the standard operation instruction, so that the chuck table 10 is moved along the X-direction until the cutting blade 40a is positioned in the X-direction as viewed from the workpiece 11.

[0089] As a result, the portion of the workpiece 11 that overlaps with the second planned division line L2 is cut. Furthermore, in the standard operation step S22, the same operation is repeated until all portions of the workpiece 11 along the boundaries of the multiple devices 13 are cut.

[0090] Figure 10(A) is a schematic top view showing the standard operation step S22 performed to remove one side 11a of the outer edge of the workpiece 11, and Figure 10(B) is a schematic front view showing the workpiece 11 after this standard operation step S22.

[0091] In this standard operation step S22, first, the lower end E of the cutting blade 40b is positioned directly above a point on the outer circumference of the workpiece 11 that is located in the Y direction when viewed from the center C of the holding surface of the chuck table 10 in a plan view (see Figure 10(A)). That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the standard alignment instructions included in the standard operation instructions, so that the chuck table 10 is moved along the X direction and / or the spindle 38 is moved along the Y direction until the angle between the line segment S connecting the center C and the lower end E and the straight line Ly passing through the center C in a plan view is 0°.

[0092] Next, the cutting blade 40b is rotated around the rotation axis A of the spindle 38. That is, the processor 44a operates the motor housed in the housing 34 according to the spindle rotation instruction included in the standard operation instruction.

[0093] Next, while the cutting blade 40b is still rotating, the cutting blade 40b is lowered until its lower end is below one surface 11a of the workpiece 11 and above the other surface 11b. That is, the processor 44a operates the Z-axis movement mechanism 24 according to the height adjustment instruction included in the standard operation instruction so that the cutting blade 40b is lowered together with the spindle 38 until it reaches that position.

[0094] Next, while the cutting blade 40b is still rotating, the workpiece 11 is rotated at least once. That is, the processor 44a operates the rotation mechanism according to the chuck table rotation instruction included in the standard operation instruction so that the chuck table 10 is rotated at least once.

[0095] As a result, one side 11a of the outer edge of the workpiece 11 is cut, forming a step 15 that includes an annular bottom surface 15a that is generally parallel to the one side 11a and the other side 11b, and a cylindrical side surface 15b that is erected from the inner circumference of the bottom surface 15a (see Figure 10(B)).

[0096] On the other hand, if the misalignment angle grasped in grasping step S1 exceeds the threshold angle θ of the misalignment angles stored in memory 44b (comparison step S21: NO), the chuck table 10 and the spindle 38 are moved relative to each other according to the correction operation instruction (correction operation step S23).

[0097] Figure 11 is a schematic top view showing the correction operation step S23 performed to remove portions of the workpiece 11 along the boundaries of multiple devices 13.

[0098] In this correction operation step S23, first, the rotation axis A of the spindle 38 is made parallel to the first division line L1. That is, the processor 44a operates the above-mentioned rotation mechanism according to the orientation instruction included in the correction operation instruction so that the chuck table 10 is rotated until the angle between the straight line Ly along the Y direction and the first division line L1 becomes angle θ.

[0099] Next, the second planned division line L2 is positioned in a direction perpendicular to the rotation axis A of the spindle 38 when viewed from the cutting blade 40a in a plan view. That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the alignment instructions included in the correction operation instructions so that the chuck table 10 is moved along the X-direction and / or the spindle 38 is moved along the Y-direction until the cutting blade 40a and the second planned division line L2 are aligned in a direction perpendicular to the rotation axis A of the spindle 38.

[0100] Next, the processor 44a sequentially operates the Z-direction movement mechanism 24 and the motor housed in the housing 34 according to the height adjustment instructions and spindle rotation instructions which are included in common to the standard operation instructions and compensation operation instructions performed to remove portions of the workpiece 11 along the boundaries of multiple devices 13.

[0101] Next, while the cutting blade 40a is still rotating, the workpiece 11 is moved so that, in a plan view, the lower end of the cutting blade 40a passes through the second planned division line L2 (see Figure 11). That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the correction machining feed instructions included in the correction operation instructions so that the chuck table 10 is moved along the X-direction and the spindle 38 is moved along the Y-direction until the cutting blade 40a is positioned perpendicular to the rotation axis A of the spindle 38 as viewed from the workpiece 11.

[0102] As a result, the portion of the workpiece 11 that overlaps with the second planned division line L2 is cut. Furthermore, in the compensation operation step S23, the same operation is repeated until all portions of the workpiece 11 along the boundaries of the multiple devices 13 are cut.

[0103] Figure 12(A) is a schematic top view showing the correction operation step S23 performed to remove one side 11a of the outer edge of the workpiece 11, and Figure 12(B) is a schematic front view showing the workpiece 11 after this correction operation step S23.

[0104] In this correction operation step S23, first, the lower end E of the cutting blade 40b is positioned directly above a point on the outer circumference of the workpiece 11 that, in a plan view, is located parallel to the rotation axis A of the spindle 38 when viewed from the center C of the holding surface of the chuck table 10 (see Figure 12(A)). That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the correction alignment instructions included in the correction operation instructions, so that the angle between the line segment S connecting the center C and the lower end E and the rotation axis A of the spindle 38 in a plan view becomes 0°, in other words, the angle between the line segment S or rotation axis A and the straight line Ly along the Y direction becomes angle θ, so that the chuck table 10 is moved along the X direction and / or the spindle 38 is moved along the Y direction.

[0105] Next, in accordance with the spindle rotation instruction, height adjustment instruction, and chuck table rotation instruction, which are included in common to the standard operation instruction and compensation operation instruction performed to remove one side 11a of the outer edge of the workpiece 11, the processor 44a sequentially operates the motor, the Z-direction movement mechanism 24, and the above-mentioned rotation mechanism housed in the housing 34.

[0106] As a result, one side 11a of the outer peripheral end of the workpiece 11 is cut, forming a step 15 that includes an annular bottom surface 15a that is generally parallel to the one side 11a and the other side 11b, and a cylindrical side surface 15b that is erected from the inner circumference of the bottom surface 15a (see Figure 12(B)).

[0107] In the embodiment described above, when the misalignment angle between the straight line Ly parallel to the Y direction and the rotation axis A of the spindle 38 exceeds a threshold, the chuck table 10 and the spindle 38 are moved relative to each other according to a corrected operation instruction, which is an instruction corrected from the standard operation instruction according to the misalignment angle. This makes it possible to suppress the deterioration of the machining quality of the workpiece 11 caused by the spindle 38 being positioned such that its rotation axis A is tilted from the straight line Ly parallel to the Y direction.

[0108] It should be noted that the embodiments described above are only one aspect of the present invention, and the present invention is not limited to the embodiments described above. For example, in the cutting apparatus of the present invention, it is sufficient that the chuck table 10 and sub-chuck table 12 and the spindle 38 are relatively movable along the X, Y, and Z directions, respectively, and there are no limitations on the moving mechanism for this purpose.

[0109] Specifically, in the cutting apparatus of the present invention, an X-direction movement mechanism is provided in place of or in addition to the above-mentioned X-direction movement mechanism for moving the spindle 38 along the X direction, a Y-direction movement mechanism is provided in place of or in addition to the Y-direction movement mechanism 16 for moving the chuck table 10 and sub-chuck table 12 along the Y direction, and / or a Z-direction movement mechanism is provided in place of or in addition to the Z-direction movement mechanism 24 for moving the chuck table 10 and sub-chuck table 12 along the Z direction.

[0110] Furthermore, in the cutting apparatus of the present invention, it is sufficient that the deviation angle between the straight line along the Y direction and the spindle 38 can be determined, and the data used for determination is not limited to signals showing test cutting images, and the data acquisition unit for acquiring this data is not limited to the camera 42.

[0111] For example, in the cutting apparatus of the present invention, a laser displacement meter may be provided in place of or in addition to the camera 42. In this cutting apparatus, for example, the laser displacement meter measures the orientation of the side surfaces (planes parallel to the Z direction) of the cutting blades 40a and 40b in a plan view, and the signal indicating this is transmitted to the controller 44 as data used to determine the displacement angle. In this case, the processor 44a determines the displacement angle as the angle formed by the straight line along the side surfaces of the cutting blades 40a and 40b and the straight line along the X direction.

[0112] Furthermore, in the cutting apparatus of the present invention, a table showing the correspondence between the deviation angle between a straight line along the Y direction and the spindle 38 and a correction operation instruction may be pre-stored in the memory 44b. Specifically, this table contains multiple sets of data, each of which is linked to a specific value or numerical range of the deviation angle that does not overlap with each other, and to one of a plurality of different correction operation instructions.

[0113] When the controller 44, which includes such memory 44b, receives data used to determine the misalignment angle (for example, a signal indicating a test cutting image transmitted from the camera 42 to the controller 44, or a signal indicating the orientation of the sides of the cutting blades 40a, 40b), the processor 44a determines the misalignment angle and selects a set of data corresponding to that misalignment angle from among multiple sets of data contained in the table stored in memory 44b. In this case, the processor 44a controls the operation of the components of the cutting device according to the correction operation instructions contained in the selected set of data.

[0114] Furthermore, in the workpiece cutting method of the present invention, cutting step S2 may be performed so as to form a step with a different shape from the step 15. For example, in the workpiece cutting method of the present invention, cutting step S2 may be performed so as to form a step that includes a curved side surface.

[0115] Figure 13(A) is a schematic top view showing the standard operation step S22 included in the cutting step S2, and Figure 13(B) is a schematic front view showing the workpiece 11 after the standard operation step S22.

[0116] In this standard operation step S22, first, the lower end E of the cutting blade 40b is positioned directly above a point on the outer circumference of the workpiece 11 that, in a plan view, is offset by an angle α from the Y direction when viewed from the center C of the holding surface of the chuck table 10 (see Figure 13(A)). That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the standard alignment instructions included in the standard operation instructions, so that the chuck table 10 is moved along the X direction and / or the spindle 38 is moved along the Y direction until the angle between the line segment S connecting the center C and the lower end E and the straight line Ly passing through the center C parallel to the Y direction is an angle α in a plan view.

[0117] Next, the processor 44a sequentially operates the motor, the Z-direction movement mechanism 24, and the aforementioned rotation mechanism housed in the housing 34, according to the spindle rotation instruction, height adjustment instruction, and chuck table rotation instruction included in the standard operation instruction.

[0118] As a result, one side 11a of the outer peripheral end of the workpiece 11 is cut, forming a step 17 that includes an annular bottom surface 17a that is generally parallel to the one side 11a and the other side 11b, and a side surface 17b that is erected from the inner circumference of the bottom surface 17a (see Figure 13(B)).

[0119] Furthermore, the side surface 17b of this step 17 is curved such that, in a plan view, its upper end is smaller than its lower end. Also, the inner circumference of the bottom surface 17a of the step 17 is a concentric circle of one surface 11a of the workpiece 11, with a diameter larger than the diameter of one surface 11a of the workpiece 11, in a plan view.

[0120] Figure 14(A) is a schematic top view showing the compensation operation step S23 included in the cutting step S2, and Figure 14(B) is a schematic front view showing the workpiece 11 after the compensation operation step S23.

[0121] In this correction operation step S23, first, the lower end E of the cutting blade 40b is positioned directly above the outer peripheral end of the workpiece 11 such that, in a plan view, the center C of the holding surface of the chuck table 10 is positioned in a direction shifted by an angle α from the direction parallel to the rotation axis A of the spindle 38 (see Figure 14(A)). That is, the processor 44a operates the X-direction movement mechanism and the Y-direction movement mechanism 16 according to the correction alignment instructions included in the correction operation instructions, so that the chuck table 10 is moved along the X-direction and / or the spindle 38 is moved along the Y-direction until the angle between the line segment S connecting the center C and the lower end E and the rotation axis A of the spindle 38 becomes an angle α in a plan view.

[0122] Next, in accordance with the spindle rotation instruction, height adjustment instruction, and chuck table rotation instruction included in the correction operation instruction, the processor 44a sequentially operates the motor, the Z-direction movement mechanism 24, and the above-mentioned rotation mechanism housed in the housing 34.

[0123] As a result, one side 11a of the outer peripheral end of the workpiece 11 is cut, forming a step 17 that includes an annular bottom surface 17a that is generally parallel to the one side 11a and the other side 11b, and a side surface 17b that is erected from the inner circumference of the bottom surface 17a (see Figure 14(B)).

[0124] The workpiece 11 having the step 17 shown in Figures 13(B) and 14(B) is preferable to the workpiece 11 having the step 15 shown in Figures 10(B) and 12(B) in that subsequent processing of the workpiece 11 is easier.

[0125] For example, when wet etching is performed on the areas near the steps 15 and 17 of both workpieces 11, less etching solution will remain on the bottom surface 17a than on the bottom surface 15a. Therefore, excessive erosion by the etching solution can be suppressed in the workpiece 11 where the step 17 is formed.

[0126] Furthermore, when polishing the portion of the workpiece 11 near the step 17, the boundary between the bottom surface 17a and the side surface 17b is easier to polish than the boundary between the bottom surface 15a and the side surface 15b. Therefore, in workpieces 11 where the step 17 is formed, polishing the portion near the step 17 becomes easier.

[0127] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0128] 2:Cutting device 4: Base (4a: Recess) 6: Table cover 8: Dustproof and waterproof cover 10: Chuck table (10a: frame, 10b: porous plate) 11: Workpiece (11a: one side, 11b: other side, 11c: side) 12: Sub-chuck table (12a: frame, 12b: porous plate) 13: Device 14: Support structure (14a: standing part, 14b: arm part) 15: Step (15a: bottom, 15b: side) 16:Y direction movement mechanism 17: Step (17a: bottom surface, 17b: side surface) 18: Guide rail 20: Mobile Plate 21: Test cutting material 22: Screw shaft 24:Z direction movement mechanism 26: Guide rail 28: Mobile Plate 30: Screw shaft 32: Motor 34: Housing 36: Cutting Unit 38: Spindle 40a: Cutting blade (thin cutting blade) 40b: Cutting blade (thick cutting blade) 42: Camera (data acquisition unit) 44: Controller (44a: Processor, 44b: Memory)

Claims

1. A cutting device for cutting a workpiece, A chuck table having holding surfaces parallel to a first direction and a second direction perpendicular to the first direction, A spindle that can rotate with respect to a straight line parallel to the holding surface as its axis of rotation and to which an annular cutting blade can be attached at its tip, A data acquisition unit for acquiring data used to determine the displacement angle between a straight line parallel to the second direction and the axis of rotation, The system comprises a controller for controlling the operation of the chuck table, the spindle, and the data acquisition unit, The controller is, A memory for storing a threshold for the misalignment angle, and a cutting program which includes a standard operation instruction that is an instruction to move the chuck table and the spindle relative to each other so that a desired portion of the workpiece held on the holding surface is cut by the cutting blade rotating around the axis of rotation when the misalignment angle is 0°. A cutting apparatus comprising: a processor that uses the data to determine the misalignment angle, and, if the determined misalignment angle exceeds a threshold, moves the chuck table and the spindle relative to each other according to a corrected operation instruction, which is an instruction corrected from the standard operation instruction according to the misalignment angle.

2. The data acquisition unit is a camera for imaging grooves formed in a test cutting member by causing the cutting blade, which rotates around the rotation axis, to cut into the test cutting member along a third direction perpendicular to the holding surface. The data is a signal indicating an image containing the groove, The cutting apparatus according to claim 1, wherein the processor determines the angle between a straight line in the direction in which the groove extends and a straight line in the first direction in the image as the displacement angle.

3. A cutting apparatus comprising: a chuck table having holding surfaces parallel to a first direction and a second direction perpendicular to the first direction; a spindle rotatable about a straight line parallel to the holding surface as its axis of rotation and capable of mounting an annular cutting blade at its tip; and a data acquisition unit for acquiring data used to determine the angle of misalignment between the straight line parallel to the second direction and the axis of rotation, wherein a cutting method for cutting a workpiece is provided, A step of determining the displacement angle using the data, The process includes, after performing the grasping step, a cutting step of cutting a desired portion of the workpiece held on the holding surface by the cutting blade, which rotates around the axis of rotation, In the cutting step, If the displacement angle grasped in the grasping step is less than or equal to a threshold, the chuck table and the spindle are moved relative to each other according to a standard operation instruction, which is an instruction to move the chuck table and the spindle relative to each other so that the desired portion of the workpiece held on the holding surface is cut by the cutting blade rotating around the axis of rotation when the displacement angle is 0°. A method for cutting a workpiece, wherein, if the displacement angle grasped in the grasping step exceeds the threshold, the chuck table and the spindle are moved relative to each other according to a corrective operation instruction, which is an instruction corrected from the standard operation instruction according to the displacement angle.

4. The workpiece is a wafer in which multiple devices are arranged in a matrix. Each of the standard operation instruction and the correction operation instruction is an instruction for cutting the wafer along the boundaries of the multiple devices, The standard operation instruction includes a standard machining feed instruction for moving the chuck table and the spindle relative to each other along the first direction, The correction operation instruction is, An orientation instruction to rotate the chuck table so that the axis of rotation and the linear first division line included in the boundary are parallel, A method for cutting a workpiece according to claim 3, further comprising: a compensatory machining feed instruction for moving the chuck table and the spindle relative to each other along a direction parallel to a second division line that is included in the boundary and perpendicular to the first division line, after rotating the chuck table in accordance with the orientation instruction.

5. The workpiece is a wafer with chamfered outer edges. The standard operation instruction and the correction operation instruction are instructions for cutting the wafer to remove at least a portion of the outer edge, The standard operation instruction includes a standard alignment instruction for moving the chuck table and the spindle relative to each other such that the lower end of the cutting blade is positioned directly above the outer peripheral end, and the angle between the line segment connecting the center of the holding surface and the lower end of the cutting blade, and a straight line parallel to the second direction passing through the center of the holding surface, as viewed from a third direction perpendicular to the holding surface, is set to a desired angle. The cutting method for a workpiece according to claim 3, wherein the correction operation instruction includes a correction alignment instruction for moving the chuck table and the spindle relative to each other such that the lower end of the cutting blade is positioned directly above the outer peripheral end, and the angle between the line segment connecting the center of the holding surface and the lower end of the cutting blade and the axis of rotation, as viewed from the third direction, becomes the desired angle.

Images