Inspection system and inspection method

Abstract

This invention provides an inspection system and inspection method that are advantageous for reliably performing the classification and recall of electronic components based on inspections. [Solution] The inspection system comprises a transport unit for transporting multiple electronic components W, an imaging unit for acquiring an image Mc of an imaging region Rc, an image analysis unit for analyzing the image Mc, and an inspection device for inspecting electronic components W classified as inspection targets. The image Mc includes an inspection image region Mt, which is an image of the imaging inspection region Rt within the imaging region Rc, and a peripheral image region Ms, which is an image of the imaging peripheral region Rs within the imaging region Rc. The image analysis unit determines, as a result of its analysis, that the inspection image region Mt contains an image of a single electronic component W, and that the peripheral image region Ms does not contain an image of the electronic component W, and classifies the single electronic component W as an inspection target.

Description

Technical Field

[0001] The present disclosure relates to an inspection system and an inspection method for inspecting electronic components.

Background Art

[0002] In the apparatus disclosed in Patent Document 1, an instantaneous image of a component placed on a disk and conveyed is captured by a camera, the appearance of the component is inspected based on the image signal obtained by the imaging, and the component is sorted based on the inspection result.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When imaging an electronic component on a rotating disk as in the apparatus of Patent Document 1, it is necessary that the electronic component is properly positioned on a predetermined arc-shaped conveyance line on the disk. That is, for an electronic component at a position deviated from the conveyance line, imaging cannot be properly performed, and as a result, appearance inspection based on the captured image cannot be properly performed.

[0005] Further, when an electronic component at a position deviated from the conveyance line (a component outside the conveyance line) is located near an electronic component properly positioned on the conveyance line (a component on the conveyance line), when air-blowing the component on the conveyance line toward the collection box, the component outside the conveyance line may also be air-blown together. In this case, although the component outside the conveyance line has not been properly subjected to appearance inspection, it will be classified and collected in the same collection box as the component on the conveyance line that has been properly subjected to appearance inspection.

[0006] In particular, if a component on the conveyor line is determined to be a good product through visual inspection, and a component outside the conveyor line should ideally be determined to be a defective product through visual inspection, the defective component outside the conveyor line will be sorted and collected together with the component on the conveyor line into a collection box for good products. Similarly, if a component on the conveyor line is determined to be a defective product through visual inspection, and a component outside the conveyor line should ideally be determined to be a good product through visual inspection, the good component outside the conveyor line will be sorted and collected together with the component on the conveyor line into a collection box for defective products.

[0007] Furthermore, if foreign objects other than electronic components (such as fragments of electronic components) are present near the components on the conveyor line, these foreign objects will be blown away by air blow along with the components on the conveyor line and collected in the same collection box as the components on the conveyor line. In particular, if the components on the conveyor line are determined to be good products through visual inspection, the foreign objects will be collected together with the components on the conveyor line in the collection box for good products.

[0008] This disclosure provides a technology that is advantageous for reliably performing inspection-based classification and retrieval of electronic components. [Means for solving the problem]

[0009] One aspect of the present disclosure relates to an inspection system comprising: a transport unit for transporting a plurality of electronic components; an imaging unit for acquiring an image of an imaging area; an image analysis unit for analyzing the image; and an inspection device for inspecting electronic components classified as objects to be inspected, wherein the image includes an inspection image area, which is an image of an imaging inspection area within the imaging area, and a peripheral image area, which is an image of the imaging peripheral area within the imaging area, and the image analysis unit classifies a single electronic component as an object to be inspected if, as a result of the analysis, it is determined that an image of a single electronic component is included in the inspection image area and an image of an electronic component is not included in the peripheral image area.

[0010] The image analysis unit analyzes the captured image to determine the presence or absence of electronic components and foreign objects in the imaging area. If the analysis determines that the inspection image area contains an image of a single electronic component but no images of foreign objects, and that the surrounding image area does not contain images of electronic components or foreign objects, then the single electronic component may be classified as an inspection target.

[0011] The image analysis unit may determine whether or not an image of a single electronic component is included in the inspection image area, and only if it is determined that an image of a single electronic component is included in the inspection image area, it may also determine whether or not an image of an electronic component is included in the surrounding image area.

[0012] The image analysis unit may determine whether the inspection image area contains an image of a single electronic component and does not contain an image of a foreign object, and only if it is determined that the inspection image area contains an image of a single electronic component and does not contain an image of a foreign object, it may also determine whether the surrounding image area contains an image of an electronic component and an image of a foreign object.

[0013] The inspection system may include an inspection target discharge device that discharges electronic components classified as inspection targets according to the inspection results, and a re-inspection target discharge device that discharges electronic components not classified as inspection targets.

[0014] The inspection device may determine whether an electronic component classified as an inspection target is good or bad based on the results of the analysis of the captured image of the electronic component classified as an inspection target.

[0015] Another aspect of this disclosure relates to an inspection method comprising the steps of transporting a plurality of electronic components, acquiring an image of an imaging area, analyzing the image, and inspecting electronic components classified as objects to be inspected, wherein the image includes an inspection image area which is an image of an imaging inspection area within the imaging area, and a peripheral image area which is an image of an imaging peripheral area within the imaging area, and if, as a result of the analysis, it is determined that an image of a single electronic component is included in the inspection image area and an image of an electronic component is not included in the peripheral image area, then the single electronic component is classified as an object to be inspected. [Effects of the Invention]

[0016] According to the present disclosure, it is advantageous for reliably performing classification and recovery of electronic components based on inspection.

Brief Description of the Drawings

[0017] [Figure 1] FIG. 1 is a top view showing an example of an inspection system. [Figure 2] FIG. 2 is a cross-sectional view of the inspection system shown in FIG. 1 (see cross-section line II-II in FIG. 1). [Figure 3] FIG. 3 is a diagram showing an example of an imaging image (imaging area). [Figure 4] FIG. 4 is a diagram showing another example of an imaging image (imaging area). [Figure 5] FIG. 5 is a flowchart showing an example of a method for inspecting a workpiece.

Modes for Carrying Out the Invention

[0018] Exemplary descriptions will be given for typical embodiments of the present disclosure technology with reference to the drawings.

[0019] In the following description, unless otherwise specified, the terms “upstream” and “downstream” are based on the conveyance of electronic components (workpiece W described later).

[0020] FIG. 1 is a top view showing an example of an inspection system 10. FIG. 2 is a cross-sectional view of the inspection system 10 shown in FIG. 1 (see cross-section line II-II in FIG. 1).

[0021] The inspection system 10 shown in FIGS. 1 and 2 inspects a plurality of workpieces W and classifies and recovers each of the plurality of workpieces W based on inspection results. The inspection system 10 of the present embodiment classifies each workpiece W into non-defective products, defective products, and re-inspection products based on inspection results using a workpiece inspection unit 15, and recovers them into recovery boxes assigned to non-defective products, defective products, and re-inspection products, respectively.

[0022] In this embodiment, the workpiece W is an electronic component, and for example, a diced semiconductor chip (e.g., a multilayer ceramic capacitor (MLCC)) may be used as the workpiece W. The characteristics, shape, size, and other properties of the workpiece W are not limited; for example, the workpiece W may contain a magnetic material, and the shape of the workpiece W may be a rectangular parallelepiped.

[0023] The inspection system 10 shown in Figure 1 comprises a transport table (transport section) 11, a work supply section 13, a supply sensor 14, a work inspection unit 15, an observation device outside the transport line 17, a first removal device 20, a first storage section 25, a removal sensor 27, a second removal device 30, a second storage section 35, a third removal device 40, a guide unit 41, a third storage section 45, and a final retrieval unit 50.

[0024] The transport table 11 receives a sequential supply of multiple workpieces W from the workpiece supply unit 13 and transports the workpieces W. The transport table 11 shown in Figure 1 has a disc shape (specifically, an annular shape) with a horizontal upper surface (transport surface) and rotates around a central axis (vertical axis). In this example, the transport table 11 rotates continuously without intermittent stops, but it may rotate intermittently. The transport table 11 in this embodiment is made of a material that can transmit visible light (for example, a transparent glass material). This makes it possible to image workpieces W on the transport table 11 or devices located above the transport table 11 through the transport table 11 by an imaging device located below the transport table 11.

[0025] Workpieces W on the transport table 11 are transported along the transport line 12 as the transport table 11 rotates. That is, a portion of the upper surface of the transport table 11 on which multiple workpieces W are placed forms an arc-shaped transport line 12. The transport line 12 represents the ideal transport trajectory for each workpiece W transported by the transport table 11 and is predetermined according to the position on the upper surface of the transport table 11 where the workpieces W from the workpiece supply unit 13 are placed. In the example shown in Figure 1, the transport line 12 is a line that extends along the rotation direction of the transport table 11 (circumferential direction of the transport table 11) from the position where the workpieces W are placed on the transport table 11 by the workpiece supply unit 13 to the final recovery unit 50 described later, and is configured as a linear region equidistant from the central axis (rotation axis) of the transport table 11.

[0026] In the inspection system 10 shown in Figure 1, the work supply unit 13, work inspection unit 15, off-line observation device 17, first extraction device 20, extraction sensor 27, second extraction device 30, third extraction device 40, and final recovery unit 50 are arranged along the transport line 12 in this order from upstream to downstream. Note that these devices may be arranged in a different order (e.g., a different configuration) than the example shown in Figure 1. For example, the first extraction device 20, second extraction device 30, and third extraction device 40 may be arranged in any order from upstream to downstream with respect to the transport line 12. As an example, the second extraction device 30, first extraction device 20, and third extraction device 40 may be arranged in this order from upstream to downstream along the transport line 12 between the off-line observation device 17 and the final recovery unit 50. In this case, the extraction sensor 27 may be located between the second extraction device 30 and the first extraction device 20 in the direction along the transport line 12, and may observe the workpiece W on the transport line 12 to confirm whether the workpiece W (defective product) to be recovered has been properly collected into the second storage unit 35 by the second extraction device 30.

[0027] The work supply unit 13 sequentially supplies workpieces W to the transport table 11 so that the workpieces W are placed in the area of ​​the transport line 12 on the upper surface (transport surface) of the transport table 11. The work supply unit 13 can have any configuration and can supply multiple workpieces W to the transport table 11 in any way. The work supply unit 13 may be configured as a linear feeder that provides multiple workpieces W supplied from a parts feeder (not shown) in a line and places them on the transport table 11 one by one, or it may be vibrated to gradually move the workpieces W toward the upper surface of the transport table 11.

[0028] Multiple workpieces W supplied from the workpiece supply unit 13 to the transport table 11 are transported by the transport table 11 in a line arranged in an arc shape along the transport line 12. The spacing between adjacent workpieces W along the transport line 12 can be adjusted under the control of the control unit 60 by controlling the supply rate of workpieces W from the workpiece supply unit 13 to the transport table 11 (number of workpieces supplied per unit time) or by controlling the transport speed of the transport table 11. The size of the spacing between adjacent workpieces W along the transport line 12 is not limited and may be 1.0 mm or more, or less than 1.0 mm.

[0029] The supply sensor 14 detects workpieces W in the transport line 12 and can have any sensor configuration, such as an optical sensor. In this embodiment, the area of ​​the transport line 12 immediately downstream of the workpiece supply point of workpieces W by the workpiece supply unit 13 is designated as the detection area for the supply sensor 14, so that workpieces W immediately after being supplied from the workpiece supply unit 13 to the transport table 11 can be detected. The supply sensor 14 can not only detect the presence or absence of workpieces W in the detection area of ​​the transport line 12, but can also detect the spacing between workpieces W on the transport line 12. Furthermore, the supply sensor 14 can also detect the size of each workpiece W in the direction of extension of the transport line 12, and based on the size information obtained by this detection, it is possible to determine whether the object detected by the supply sensor 14 is a workpiece W or a foreign object that is larger or smaller than the workpiece W (for example, a fragment of a workpiece W).

[0030] The work inspection unit 15 inspects workpieces W located on the transport line 12 on the upper surface of the transport table 11, but does not inspect workpieces W located in areas outside the transport line 12. In other words, under the control of the control unit 60, the work inspection unit 15 performs inspection processing on workpieces W that are determined to be located on the transport line 12 based on the detection results of the supply sensor 14, while not performing inspection processing on workpieces W that are not determined to be located on the transport line 12.

[0031] The inspection content performed by the work inspection unit 15 is not limited. In the example shown in Figure 1, multiple (six) work inspection units 15 are provided, but all of the multiple work inspection units 15 may perform inspections with different content, or two or more work inspection units 15 may perform inspections with the same content. The number of work inspection units 15 is also not limited, and only one work inspection unit 15 may be provided.

[0032] The work inspection unit 15 of this embodiment includes at least one imaging unit 15A. The imaging unit 15A includes an imaging device (camera) that acquires an image of the imaging area (see Figures 3 and 4 described later). At least a portion of the imaging area by the imaging unit 15A is formed by a portion of the upper surface of the transport table 11 that constitutes the transport line 12.

[0033] In the example shown in Figure 1, all six work inspection units 15 include an imaging device, and each work inspection unit 15 can acquire images of the top, bottom, left, right, front, and rear sides of the workpiece W being inspected. The top, bottom, left, right, and front / back of the workpiece W is determined based on the direction in which the workpiece W is transported by the transport table 11. If the transport table 11 (particularly the part that constitutes the transport line 12) is transparent, the imaging device of the work inspection unit 15 can image the workpiece W (e.g., the bottom and / or sides) on the transport line 12 (transport table 11) via the transport table 11. The sides of the workpiece W may be imaged by the imaging device via a reflector such as a mirror (not shown).

[0034] In this embodiment, the imaging unit 15A that images the above-mentioned imaging area is composed of a work inspection unit 15 for acquiring an image of the upper surface of the workpiece W to be inspected. In the example shown in Figure 1, it is composed of the work inspection unit 15 located at the uppermost position among a plurality of work inspection units 15. The imaging unit 15A, described later, which acquires an image for determining whether the workpiece W should be classified as an inspection target or a non-inspection target, is composed of a work inspection unit 15 in this embodiment for acquiring an image for determining whether the workpiece W should be classified as a good product or a defective product. In other words, the image for determining whether the workpiece W should be classified as a good product or a defective product (i.e., an image of the upper surface of the workpiece W) is also used as the image for determining whether the workpiece W should be classified as an inspection target or a non-inspection target.

[0035] Based on the images of the workpiece W acquired by the imaging device of the workpiece inspection unit 15, the workpiece W is inspected, and as a result of the inspection, the workpiece W to be inspected is classified as good or defective. This inspection and classification of workpiece W based on the images is performed by the image analysis unit 61 analyzing (image processing) the images, and the results of the analysis are considered by the inspection device 62. In this example, workpiece W in which abnormalities such as scratches or dirt are detected in one or more of the six images acquired by the imaging devices of the six workpiece inspection units 15 is classified as defective, and workpiece W in which no such abnormalities are detected is classified as good.

[0036] In the example shown in Figure 1, the control unit 60, the image analysis unit 61, and the inspection device 62 are configured as a common, integrated device (e.g., a computer). However, two or more of the control unit 60, the image analysis unit 61, and the inspection device 62 may be configured as separate devices and may be connected to each other via wired and / or wireless connections to enable the transmission and reception of information (data).

[0037] The transport line observation device 17 observes the upper surface (transport surface) of the transport table 11 that is outside the transport line 12. Specifically, the transport line observation device 17 observes whether a workpiece W is located outside the transport line 12 and includes, for example, an imaging device. In the example shown in Figure 1, the location outside the transport line 12 includes both positions outward and inward from the transport line 12. The transport line observation device 17 is located downstream of the workpiece supply unit 13 with respect to the transport line 12, and in particular, in the example shown in Figure 1, it is located downstream of the workpiece inspection unit 15 with respect to the transport line 12 and upstream of the extraction devices 20, 30, and 40. In this embodiment, the image analysis unit 61 determines, based on the observation results from the transport line observation device 17, whether or not there are other workpieces W in the vicinity of the workpiece W on the transport line 12, or in a location outside the transport line 12.

[0038] The first retrieval device 20 is a device for retrieving workpieces W from the transport table 11 that have been determined to be good products based on inspection by the workpiece inspection unit 15 (including the imaging unit 15A), and for which it has been determined that there are no other workpieces W nearby at a location outside the transport line 12 based on observation results by the transport line observation device 17. The first retrieval device 20 is located downstream of the workpiece inspection unit 15 and the transport line observation device 17 with respect to the transport line 12.

[0039] The first extraction device 20 in this embodiment is configured as an air blow device capable of ejecting air (gas), and selectively blows air onto the workpieces W (good products) to be recovered, thereby selectively blowing the workpieces W towards the first storage section 25. The first extraction device 20 is installed radially inward from the upper surface of the transport table 11 relative to the transport line 12, and the first storage section 25 is installed radially outward from the upper surface of the transport table 11 relative to the transport line 12 (transport table 11). By ejecting air radially outward from the first extraction device 20, the workpieces W (good products) to be recovered are blown towards the first storage section 25. On the other hand, workpieces W that are not classified as to be recovered are not selectively blown with air by the first extraction device 20 and are not blown towards the first storage section 25, but are instead transported further downstream along the transport line 12 by the transport table 11.

[0040] Furthermore, a workpiece W that is determined to be free of other workpieces W in the vicinity of a location outside the transport line 12 means a workpiece W that, even if air from the first removal device 20 is blown onto it, will not cause other workpieces W located outside the transport line 12 to be collected in the first storage unit 25 by that air. In other words, a workpiece W that is determined to be free of other workpieces W in the vicinity of a location outside the transport line 12 means a workpiece W that can be removed from the transport table 11 without involving other workpieces W located outside the transport line 12. As a more specific example, "no other workpieces W in the vicinity of a workpiece W outside the transport line 12" means that there are no workpieces W located within 15 mm of the workpiece W in the location outside the transport line 12.

[0041] The first storage section 25 is provided as a collection box (good product box) in which workpieces W that have been classified as good products are stored. As shown in Figure 2, the first storage section 25 in this example has a workpiece path 25a that opens toward the upper surface (conveying surface) of the conveying table 11, and a workpiece storage section 25b that is connected to the workpiece path 25a and located below the workpiece path 25a. Workpieces W (good products) that have been blown away from the conveying table 11 by the first extraction device 20 are stored in the workpiece storage section 25b via the workpiece path 25a.

[0042] The extraction sensor 27 observes the workpieces W (good products) on the transport line 12 to confirm whether the workpieces W to be retrieved (good products) have been properly retrieved into the first storage unit 25 by the first extraction device 20. The extraction sensor 27 in this example has an imaging device that is located between the first extraction device 20 and the second extraction device 30 with respect to the transport line 12 and images a confirmation area including the transport line 12, and analyzes the images acquired by the imaging device. Based on the results of this analysis, the extraction sensor 27 confirms that the workpieces W that should be extracted by the first extraction device 20 have been extracted, and that the workpieces W that should not be extracted by the first extraction device 20 have not been extracted. The images acquired by the extraction sensor 27 and the confirmation results are transmitted to the control unit 60.

[0043] In this example, the retrieval sensor 27 confirms that the workpiece W determined to be an inspection target and a good product has been retrieved by the first retrieval device 20 and the first storage unit 25, and that workpiece W that received other determinations has not been retrieved by the first retrieval device 20 and the first storage unit 25. However, such confirmation may also be performed by other devices (e.g., the control unit 60, the image analysis unit 61, or the inspection device 62). By providing the retrieval sensor 27 in this way, it is possible to guarantee that the workpiece W determined to be an inspection target and a good product has been properly retrieved into the first storage unit 25.

[0044] The second retrieval device 30 is a device for retrieving workpieces W from the transport table 11 that have been determined to be defective by the inspection device 62 based on inspection by the workpiece inspection unit 15 (including the imaging unit 15A), and for which the transport line observation device 17 has determined that there are no other workpieces W nearby at a location outside the transport line 12. The second retrieval device 30 is located downstream of the workpiece inspection unit 15 and the transport line observation device 17 with respect to the transport line 12, and in this example, it is located downstream of the first retrieval device 20 with respect to the transport line 12.

[0045] In this embodiment, the second extraction device 30 is configured as an air blow device and selectively blows air onto the workpieces W (defective products) to be recovered, thereby selectively blowing the workpieces W towards the second storage section 35. The second extraction device 30 is installed radially inward from the upper surface of the transport table 11 relative to the transport line 12, and the second storage section 35 is installed radially outward from the upper surface of the transport table 11 relative to the transport line 12 (transport table 11). By ejecting air radially outward from the second extraction device 30, the workpieces W (defective ratio) to be recovered are blown towards the second storage section 35. On the other hand, workpieces W that are not classified as workpieces to be recovered are not selectively blown with air by the second extraction device 30 and are not blown towards the second storage section 35, but are instead transported further downstream along the transport line 12 by the transport table 11.

[0046] The second storage section 35 is provided as a collection box (defective product box) in which workpieces W that have been classified as defective products are stored. In this example, the second storage section 35 is configured in the same way as the first storage section 25 shown in Figure 2.

[0047] In the inspection system 10 shown in Figure 1, only one first extraction device 20 and one second extraction device 30 are provided, but multiple first extraction devices 20 and multiple first extraction devices 20 may be provided. When multiple first extraction devices 20 are provided, one common first storage section 25 may be assigned to two or more first extraction devices 20, or separate first storage sections 25 may be assigned to each. Similarly, when multiple second extraction devices 30 are provided, one common second storage section 35 may be assigned to two or more second extraction devices 30, or separate second storage sections 35 may be assigned to each.

[0048] The third retrieval device 40 is a device for retrieving workpieces W from the transport table 11 that were not collected in the first storage section 25 and the second storage section 35. In this example, it is located downstream of the first retrieval device 20 and the second retrieval device 30 with respect to the transport line 12. The third retrieval device 40 in this embodiment is configured as an air blow device and continuously blows air while the workpieces W are being transported by the transport table 11. The third retrieval device 40 is installed radially inward from the upper surface of the transport table 11 relative to the transport line 12, and the third storage section 45 is installed radially outward from the upper surface of the transport table 11 relative to the transport line 12 (transport table 11). By blowing air radially outward from the third retrieval device 40, workpieces W and foreign matter remaining on the upper surface of the transport table 11 are blown towards the third storage section 45. In this manner, all of the workpieces W that were not collected in the first storage section 25 and the second storage section 35 are blown away by the third retrieval device 40 and collected in the third storage section 45, regardless of whether they are located on the transport line 12 or not.

[0049] The guide unit 41 physically guides workpieces W located inside the position from which they can be blown away by the third removal device 40, with respect to the radial direction of the transport table 11, to a position upstream of the third removal device 40 with respect to the transport line 12, where they can be blown away by the third removal device 40. As a result, workpieces W located inside the position from which they can be blown away by the third removal device 40 on the transport table 11 are also collected in the third storage section 45.

[0050] The third storage section 45 is provided as a collection box (re-inspection box) for workpieces W that were not collected in the first storage section 25 and the second storage section 35, and workpieces W that are not classified as items to be inspected are collected in the third storage section 45. In this example, the third storage section 45 is configured in the same way as the first storage section 25 shown in Figure 2. For example, workpieces W located off the transport line 12 are not classified as items to be inspected and are discharged from the transport table 11 to the third storage section 45 as items to be inspected by the third removal device 40. Also, workpieces W located on the transport line 12 but with other workpieces W and / or foreign objects nearby are not classified as items to be inspected and are discharged from the transport table 11 to the third storage section 45 as items to be inspected by the third removal device 40, regardless of whether or not they have been classified as good or defective by the workpiece inspection unit 15.

[0051] The final retrieval unit 50 retrieves the workpieces W remaining on the transport table 11. The final retrieval unit 50 is located downstream of the first extraction device 20, the second extraction device 30, and the third extraction device 40 with respect to the transport line 12, and is installed at the furthest downstream position of the transport line 12. The final retrieval unit 50 is a device for retrieving workpieces W that remain on the upper surface of the transport table 11 for any reason. For example, if the workpieces W contain magnetic material, the final retrieval unit 50 may use magnetic force to retrieve the remaining workpieces W.

[0052] In the inspection system 10 of this embodiment, it is further determined whether or not to classify the workpiece W as an inspection target based on the results of the analysis of the captured image acquired by the imaging unit 15A.

[0053] Figure 3 shows an example of an acquired image Mc (imaging region Rc). Figure 4 shows another example of an acquired image Mc (imaging region Rc).

[0054] As described above, the captured image Mc acquired by the imaging unit 15A includes an inspection image area Mt, which is an image of the imaging inspection area Rt within the imaging area Rc, and a peripheral image area Ms, which is an image of the imaging peripheral area Rs within the imaging area Rc. The imaging area Rc is the entire area captured by the imaging unit 15A. The imaging inspection area Rt constitutes a suitable position for placing the workpiece W, while the imaging peripheral area Rs adjacent to the imaging inspection area Rt constitutes an unsuitable position for placing the workpiece W. Therefore, the entire imaging inspection area Rt corresponds to the transport line 12 (see Figure 1), while the entire imaging peripheral area Rs corresponds to an area outside the transport line 12.

[0055] The image analysis unit 61 (see Figure 1) analyzes the captured image Mc to determine whether or not an image of the workpiece W is present in the inspection image area Mt and the surrounding image area Ms. Whether the detected object in the imaging inspection area Rt is the workpiece W or the foreign object F may be determined, for example, based on the detection result of the supply sensor 14.

[0056] The image analysis unit 61 then determines, based on its analysis of the captured image Mc, that the inspection image region Mt contains an image of a single workpiece W, and that the surrounding image region Ms does not contain an image of the workpiece W (see Figure 3), and classifies that single workpiece W as an inspection target. On the other hand, if the analysis of the captured image Mc determines, for example, that "the inspection image region Mt contains images of multiple workpiece W" or that "the surrounding image region Ms contains images of workpiece W" (see Figure 4), the image analysis unit 61 classifies the workpiece W captured in the captured image Mc as non-inspection targets.

[0057] In particular, the image analysis unit 61 of this embodiment analyzes the captured image Mc to determine the presence or absence of not only the workpiece W but also the foreign object F in the imaging region Rc. If the image analysis unit 61 determines, as a result of the analysis, that the inspection image region Mt contains an image of a single workpiece W but does not contain an image of the foreign object F, and that the surrounding image region Ms does not contain an image of the workpiece W or an image of the foreign object F (see Figure 3), then the single workpiece W is classified as an inspection target. On the other hand, in addition to the cases described above, "when the inspection image region Mt contains images of multiple workpiece W" and "when the surrounding image region Ms contains images of workpiece W", the image analysis unit 61 also classifies the workpiece W captured in the captured image Mc as a non-inspection target if, for example, "the inspection image region Mt contains an image of the foreign object F" or "the surrounding image region Ms contains an image of the foreign object F" (see Figure 4).

[0058] The method of analyzing the captured image Mc by the image analysis unit 61 (image processing method) is not limited, but typically, the captured image Mc can be analyzed based on image brightness and image size (range size). That is, the image analysis unit 61 can determine the presence or absence of a detected object (i.e., workpiece W and foreign object F) in the captured image Mc based on the brightness value and size (range size) of the constituent pixels of the captured image Mc. For example, if the captured image Mc contains an image where the range (size) of constituent pixels showing a brightness value greater than a predetermined determination brightness value is larger than a predetermined determination range (determination size), the image analysis unit 61 may recognize that image as an image of a detected object. The image analysis unit 61 can also determine whether the detected object is workpiece W or foreign object F based on the size of the image of the detected object in the captured image Mc.

[0059] Furthermore, the image analysis unit 61 can perform image analysis on the inspection image region Mt and the surrounding image region Ms within the captured image Mc in any manner it chooses. For example, when analyzing the presence or absence of a workpiece W without analyzing the presence or absence of a foreign object F in the captured image Mc, the image analysis unit 61 may first determine whether the inspection image region Mt contains an image of a single workpiece W, and only if it is determined that the inspection image region Mt contains an image of a single workpiece W (i.e., the inspection image region Mt contains only an image of one workpiece W and does not contain images of multiple workpieces W), it may then determine whether the surrounding image region Ms contains an image of a workpiece W. Alternatively, when analyzing the presence or absence of a workpiece W and a foreign object F in the captured image Mc, the image analysis unit 61 may first determine whether the inspection image region Mt contains an image of a single workpiece W and does not contain an image of a foreign object F, and only if it is determined that the inspection image region Mt contains an image of a single workpiece W and does not contain an image of a foreign object F, it may then determine whether the surrounding image region Ms contains an image of a workpiece W and an image of a foreign object F.

[0060] Based on the analysis of the captured image Mc described above, the workpieces W classified as items to be inspected are discharged from the transport table 11 by the first extraction device 20 or the second extraction device 30 according to the results of the inspection regarding the classification of good or defective products, and are collected in the first storage section (good product box) 25 or the second storage section (defective product box) 35. On the other hand, workpieces W that are not classified as items to be inspected based on the analysis of the captured image Mc (i.e., workpieces W classified as not to be inspected) are discharged from the transport table 11 by the third extraction device 40 and are collected in the third storage section 45. In this way, the first extraction device 20 and the second extraction device 30 function as "inspection target discharge devices that discharge electronic components classified as items to be inspected from the transport table 11 according to the results of the inspection," and the third extraction device 40 functions as "re-inspection target discharge device that discharges electronic components not classified as items to be inspected from the transport table 11."

[0061] Regarding "workpieces W that are not classified as targets for inspection (i.e., workpieces W classified as non-inspection targets)," inspection by the workpiece inspection unit 15 may or may not be performed. However, even if inspection is performed, regardless of the inspection result, the workpieces are discharged to the third storage unit 45 by the third removal device 40. For example, regarding a workpiece W that is properly positioned in the imaging inspection area Rt, inspection by the workpiece inspection unit 15 may be performed even if other workpieces W or foreign objects F are present in the imaging area Rc (imaging inspection area Rt and / or surrounding imaging area Rs). In this case, "workpieces W that are properly positioned in the imaging inspection area Rt" become "workpieces W that are not classified as targets for inspection (workpieces W classified as non-inspection targets)" regardless of the inspection result, and are collected in the third storage unit 45. Therefore, "workpieces W that are not classified as targets for inspection (workpieces W classified as non-inspection targets)" may include both workpieces W that have been inspected by the workpiece inspection unit 15 and classified as good products, and workpieces W that have been classified as defective products.

[0062] Next, an example of a method for inspecting the workpiece W performed by the inspection system 10 described above will be explained. The inspection method described below is performed by the appropriate operation of the components of the inspection system 10 under the control of the control unit 60. That is, data related to various information is transmitted from each unit to the control unit 60, control signals based on the various information are transmitted from the control unit 60 to each unit, and each unit is driven based on the control signals from the control unit 60, thereby appropriately performing the workpiece W inspection method described below by the inspection system 10.

[0063] Figure 5 is a flowchart showing an example of a method for inspecting workpiece W.

[0064] Multiple workpieces (electronic components) W are sequentially supplied from the workpiece supply unit 13 onto the transport table 11 (S1 in Figure 5), and transported along the transport line 12 by the transport table 11. The control unit 60 determines whether the workpieces W supplied to the transport table 11 are located on the transport line 12 based on the detection result from the supply sensor 14 (S2).

[0065] If the determination results in the workpiece W not being located on the transport line 12 (N in S2), the workpiece W is discharged into the third storage unit (re-inspection box) 45 by the third removal device 40 (S10). On the other hand, if the determination results in the workpiece W being located on the transport line 12 (Y in S2), the imaging unit 15A takes an image at the timing when the workpiece W is placed in the imaging area Rc (see Figures 3 and 4) of the imaging unit 15A, and an image Mc of the workpiece W is acquired (S3).

[0066] The captured image Mc obtained in this manner is analyzed by the image analysis unit 61, and based on the analysis results, the image analysis unit 61 determines whether or not the inspection image region Mt of the captured image Mc contains only an image of a single workpiece W (S4).

[0067] If the determination does not result in the inspection image area Mt containing only an image of a single workpiece W (N in S4), the workpiece W is discharged into the third storage unit (re-inspection box) 45 by the third removal device 40 (S10). On the other hand, if the determination does result in the inspection image area Mt containing only an image of a single workpiece W (Y in S4), the image analysis unit 61 determines whether or not the peripheral image area Ms of the captured image Mc contains images of both the workpiece W and the foreign object F (S5).

[0068] If the determination does not find that the peripheral image area Ms does not contain images of the workpiece W and foreign object F (N in S5), the workpiece W is discharged into the third storage unit (re-inspection box) 45 by the third removal device 40 (S10). On the other hand, if the peripheral image area Ms does not contain images of the workpiece W and foreign object F (Y in S5), the workpiece W is classified as an inspection target and inspected by the workpiece inspection unit 15 (S6). In this way, workpieces W classified as inspection targets based on the results of the various determinations described above (see S2, S4 and S5) are inspected using the workpiece inspection unit 15.

[0069] Based on the results of the inspection, a determination is made as to whether the workpiece W is a good product or not (S7). Workpieces W determined to be good products (Y in S7) are discharged into the first storage section (good product box) 25 by the first extraction device 20 (S8), and workpieces W determined to be defective products (N in S7) are discharged into the second storage section (defective product box) 35 by the second extraction device 30 (S9).

[0070] The above-described series of processes are performed for all workpieces W supplied from the workpiece supply unit 13 to the transport table 11, so that each workpiece W is collected in the corresponding storage unit among the first storage unit 25, the second storage unit 35, and the third storage unit 45.

[0071] As described above, the inspection system 10 of this embodiment includes a transport table 11 for transporting multiple workpieces W, an imaging unit 15A for acquiring an image Mc of an imaging region Rc, an image analysis unit 61 for analyzing the image Mc, and an inspection device 62 for inspecting workpieces W classified as inspection targets. The image Mc includes an inspection image region Mt, which is an image of the imaging inspection region Rt within the imaging region Rc, and a peripheral image region Ms, which is an image of the imaging peripheral region Rs within the imaging region Rc. If the image analysis unit 61 determines, as a result of the analysis, that the inspection image region Mt contains an image of a single workpiece W, and that the peripheral image region Ms does not contain an image of a workpiece W, then the single workpiece W is classified as an inspection target.

[0072] The inspection method performed by the inspection system 10 includes the steps of transporting multiple workpieces W, acquiring an image Mc of the imaging region Rc, analyzing the image Mc, and inspecting the workpieces W that are classified as targets for inspection. The image Mc includes an inspection image region Mt, which is an image of the imaging inspection region Rt within the imaging region Rc, and a peripheral image region Ms, which is an image of the imaging peripheral region Rs within the imaging region Rc. If the analysis determines that the inspection image region Mt contains an image of a single workpiece W, and the peripheral image region Ms does not contain an image of a workpiece W, then the single workpiece W is classified as a target for inspection.

[0073] This allows for classifying workpieces W that are not nearby on the transport table 11 as targets for inspection, while preventing workpieces W that are nearby from being classified as targets for inspection. In this way, since no other workpieces W are present near workpieces W classified as targets for inspection on the transport table 11, it is possible to prevent non-inspection workpieces W from being unintentionally collected in the same storage unit as the inspection target workpieces W when collecting the inspection target workpieces W into the first storage unit 25 (good product box) or the second storage unit 35 (defective product box). As a result, the classification and collection of workpieces W based on inspection can be performed with high reliability.

[0074] Furthermore, the image analysis unit 61 analyzes the captured image Mc to determine the presence or absence of workpiece W and foreign object F in the imaging region Rc. If the analysis determines that the inspection image region Mt contains an image of a single workpiece W but does not contain an image of foreign object F, and the surrounding image region Ms does not contain an image of workpiece W or foreign object F, then the single workpiece W can be classified as an inspection target.

[0075] This allows for classifying workpieces W that do not have other workpieces W and / or foreign objects F nearby on the transport table 11 as inspection targets, while preventing workpieces W that do have other workpieces W and / or foreign objects F nearby from being classified as inspection targets. In this way, since no other workpieces W and / or foreign objects F are present near the workpieces W classified as inspection targets on the transport table 11, it is possible to prevent non-inspection workpieces W and / or foreign objects F from being unintentionally collected in the same storage unit as the inspection target workpieces W when the inspection target workpieces W are collected in the first storage unit 25 (good product box) or the second storage unit 35 (defective product box).

[0076] Furthermore, the image analysis unit 61 determines whether or not an image of a single workpiece W is included in the inspection image area Mt, and only if it is determined that an image of a single workpiece W is included in the inspection image area Mt, it can determine whether or not an image of the workpiece W is included in the surrounding image area Ms.

[0077] This allows for the omission of image analysis of the surrounding image region Ms if it is not determined that "the inspection image region Mt contains an image of a single workpiece W," thereby effectively reducing the load required for the analysis of the captured image Mc.

[0078] Furthermore, the image analysis unit 61 determines whether the inspection image area Mt contains an image of a single workpiece W and does not contain an image of a foreign object F. Only if it is determined that the inspection image area Mt contains an image of a single workpiece W and does not contain an image of a foreign object F can it determine whether the surrounding image area Ms contains an image of both the workpiece W and the foreign object F.

[0079] As a result, if it is not determined that "the inspection image region Mt contains an image of a single workpiece W and does not contain an image of a foreign object F," it is possible to omit the image analysis of the surrounding image region Ms, thereby effectively reducing the load required for the analysis of the captured image Mc.

[0080] The inspection system 10 also includes a first extraction device 20 and a second extraction device 30 (inspection target extraction device) that discharge workpieces W classified as inspection targets according to the inspection results, and a third extraction device 40 (re-inspection target extraction device) that discharges workpieces W that are not classified as inspection targets.

[0081] This allows for the separation and discharge of workpieces W that are classified as subject to inspection from workpieces W that are not classified as subject to inspection. Furthermore, from the viewpoint of simplifying the control configuration of the third extraction device (re-inspection subject discharge device) 40, it is preferable that the third extraction device 40 be provided downstream of the first extraction device 20 and the second extraction device 30 (inspection subject discharge device).

[0082] Furthermore, the inspection device 62 can determine whether a workpiece W is good or bad based on the results of the analysis of the captured image Mc of the workpiece W classified as an inspection target.

[0083] This allows for efficient assessment of the quality of workpiece W.

[0084] [Differentiation] The imaging unit 15A (see Figure 1), which acquires "images for determining whether workpiece W should be classified as an inspection target or a non-inspection target," is configured in the above embodiment as a work inspection unit 15 that acquires "images for determining whether workpiece W should be classified as a good product or a defective product." However, it may be provided separately from the work inspection unit 15. In this case, by providing the imaging unit 15A upstream of the work inspection unit 15, it is possible to skip inspection (imaging, etc.) by the work inspection unit 15 for workpiece W that are classified as non-inspection targets based on the analysis results of the images acquired by the imaging unit 15A.

[0085] Furthermore, the external observation device 17 and the final retrieval unit 50 do not need to be installed. When the imaging area Rc by the imaging unit 15A covers the entire radial surface of the upper surface (transport surface) of the transport table 11, it is possible to appropriately classify the workpiece W on the transport table 11 into either an inspection target or a non-inspection target based on the analysis results of the imaging image Mc acquired by the imaging unit 15A.

[0086] It should be noted that the embodiments and modifications disclosed herein are illustrative in all respects and should not be construed restrictively. The embodiments and modifications described above may be omitted, substituted, and modified in various ways without departing from the scope and spirit of the appended claims. For example, the embodiments and modifications described above may be combined in whole or in part, and other embodiments may be combined with the embodiments or modifications described above. Furthermore, the effects described herein are illustrative, and other effects may result.

[0087] The technical categories that embody the above-described technical concept are not limited. For example, the above-described technical concept may be embodied by a computer program that causes a computer to execute one or more steps included in a method for manufacturing or using the above-described device. Alternatively, the above-described technical concept may be embodied by a computer-readable, non-transitory recording medium on which such a computer program is recorded. [Explanation of Symbols]

[0088] 10 Inspection system, 11 Transport table, 12 Transport line, 13 Work supply unit, 14 Supply sensor, 15 Work inspection unit, 15A Imaging unit, 17 External transport line observation device, 20 First extraction device, 25 First storage unit, 25a Work path, 25b Work storage unit, 27 Extraction sensor, 30 Second extraction device, 35 Second storage unit, 40 Third extraction device, 41 Guide unit, 45 Third storage unit, 50 Final retrieval unit, 60 Control unit, 61 Image analysis unit, 62 Inspection device, F Foreign object, Mc Acquired image, Ms Peripheral image area, Mt Inspection image area, Rc Acquired area, Rs Acquired peripheral area, Rt Acquired inspection area, W Work

Claims

1. A transport unit that transports multiple electronic components, An imaging unit that acquires an image of the imaging area, An image analysis unit that performs analysis of the captured image, The system includes an inspection device that performs inspections on electronic components classified as targets for inspection, The captured image includes an inspection image region which is an image of the imaging inspection region within the imaging region, and a peripheral image region which is an image of the imaging peripheral region within the imaging region. If the image analysis unit determines, as a result of the analysis, that the inspection image area contains an image of a single electronic component and that the surrounding image area does not contain an image of an electronic component, it classifies the single electronic component as an inspection target. Inspection system.

2. The aforementioned image analysis unit, By analyzing the captured image, the presence or absence of electronic components and foreign objects in the imaged area is determined. If, as a result of the analysis, it is determined that the inspection image region contains an image of a single electronic component and does not contain an image of a foreign object, and that the surrounding image region does not contain an image of an electronic component or a foreign object, then the single electronic component is classified as an inspection target. The inspection system according to claim 1.

3. The aforementioned image analysis unit, Determine whether or not the inspection image region contains an image of a single electronic component. Only when it is determined that the inspection image region contains an image of a single electronic component, it is determined whether or not the surrounding image region contains an image of an electronic component. The inspection system according to claim 1.

4. The aforementioned image analysis unit, The inspection image region is used to determine whether or not it contains an image of a single electronic component and no image of a foreign object. Only when it is determined that the inspection image region contains an image of a single electronic component and does not contain an image of a foreign object, it is determined whether or not the surrounding image region contains an image of an electronic component and an image of a foreign object. The inspection system according to claim 2.

5. An inspection target discharge device that discharges electronic components classified as inspection targets according to the results of the inspection, A re-inspection target discharge device that discharges electronic components that are not classified as subject to inspection, The inspection system according to claim 1 or 2, comprising:

6. The inspection device determines whether an electronic component classified as an inspection target is good or bad based on the results of the analysis of the captured image of the electronic component classified as an inspection target. The inspection system according to claim 1 or 2.

7. The process of transporting multiple electronic components, The process of acquiring an image of the imaging area, The process of analyzing the captured image, This includes a process of inspecting electronic components classified as targets for inspection, The captured image includes an inspection image region which is an image of the imaging inspection region within the imaging region, and a peripheral image region which is an image of the imaging peripheral region within the imaging region. If, as a result of the analysis, it is determined that the inspection image region contains an image of a single electronic component, and the surrounding image region does not contain an image of an electronic component, then the single electronic component is classified as an inspection target. Testing method.

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