A system for performing fluid analysis

Abstract

We provide a system for performing fluid dynamics analysis. [Solution] In some embodiments, the system includes a support structure. In some embodiments, the system includes a sensing die positioned on the support structure. In some embodiments, the system may include a fluid guide. In some embodiments, the fluid guide is supported by the sensing die in a first position and by the support structure in a second and third position. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more characteristics of the fluid in the flow path.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to systems for performing fluid analysis.

Background Art

[0002] The applicant recognizes many technical problems and difficulties associated with performing fluid analysis. Through the efforts, ingenuity, and innovation exerted, the applicant has solved problems related to fluid analysis by developing the solutions embodied in the present disclosure described in detail below.

Summary of the Invention

[0003] Various embodiments described herein relate to systems for performing fluid analysis.

[0004] According to one aspect of the present disclosure, a system is provided. In some embodiments, the system includes a support structure. In some embodiments, the system includes a sensing die disposed on the support structure. In some embodiments, the system includes a fluid guide. In some embodiments, the fluid guide is supported by the sensing die at a first position and by the support structure at a second position and a third position. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more properties of the fluid within the flow path.

[0005] In some embodiments, the support structure comprises a printed circuit board (PCB).

[0006] In some embodiments, the flow path includes a bottom surface.

[0007] In some embodiments, the bottom surface is at the same height as the sensing portion of the sensing die.

[0008] In some embodiments, at least a portion of the upper surface of the encapsulating material is at the same height as the sensing portion of the sensing die.

[0009] In some embodiments, in the first position, the bottom surface of the fluid guide wall is positioned on the support portion of the upper surface of the sensing die.

[0010] In some embodiments, the fluid guide defines the access area.

[0011] In some embodiments, the access area is separated from the flow path by at least a fluid guide wall.

[0012] In some embodiments, the access region is separated from the flow path by at least a sealing material.

[0013] In some embodiments, the system includes an encasing material placed on a support structure.

[0014] In some embodiments, the encapsulating material is positioned on a support structure such that it is in contact with at least one side wall of the fluid guide and sensing die.

[0015] In some embodiments, at the second position, the first support projection of the fluid guide is located on the upper surface of the support structure, and at the third position, the second support projection of the fluid guide is located on the upper surface of the support structure.

[0016] In some embodiments, the first and second support projections are located on the bottom surface of the fluid guide.

[0017] In some embodiments, at least a portion of the bottom surface of the fluid guide is separated from the upper surface of the support structure by a gap.

[0018] In some embodiments, the flow path is configured to receive fluid through the inlet portion of the fluid guide and discharge fluid through the outlet portion of the fluid guide.

[0019] In some embodiments, the support structure includes one or more electrical connectors and a fluid analysis circuit.

[0020] In some embodiments, one or more electrical connectors connect the sensing die to the fluid analysis circuit.

[0021] In some embodiments, one or more characteristics include flow rate.

[0022] In some embodiments, one or more properties include thermal conductivity or viscosity.

[0023] According to another aspect of this disclosure, a system is provided.

[0024] In some embodiments, the system includes a support structure. In some embodiments, the system includes a sensing die positioned on the support structure. In some embodiments, the system includes a fluid guide. In some embodiments, the fluid guide is supported by the sensing die in a first position and by the support structure in a second and third position. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more properties of the fluid in the flow path. In some embodiments, the system includes a housing surrounding the central portion of the support structure, the sensing die, and the fluid guide.

[0025] In some embodiments, the fluid guide includes an inlet portion and an outlet portion.

[0026] In some embodiments, the inlet and / or outlet portions protrude outward from the housing.

[0027] According to another aspect of the present disclosure, a manufacturing method is provided. In some embodiments, the manufacturing method includes providing a support structure. In some embodiments, the manufacturing method includes placing a sensing die on the support structure. In some embodiments, the manufacturing method includes placing a fluid guide on the support structure and the sensing die. In some embodiments, the fluid guide is placed on the support structure and the sensing die such that the fluid guide is supported by the sensing die at a first position and by the support structure at a second position and a third position. In some embodiments, the fluid guide defines a flow path configured to receive a fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more properties of the fluid within the flow path.

[0028] In some embodiments, the manufacturing method includes placing an encapsulant on the support structure.

[0029] In some embodiments, the encapsulant is placed on the support structure such that the encapsulant contacts at least one sidewall of the fluid guide and the sensing die.

[0030] The above summary is provided for the purpose of summarizing some exemplary embodiments in order to provide a basic understanding of some aspects of the present disclosure. Thus, it is understood that the above embodiments are merely examples and should not be construed in any way as narrowing the scope or spirit of the present disclosure. It will be understood that the scope of the present disclosure encompasses many potential embodiments in addition to those summarized herein. Some of these will be further described below.

Brief Description of the Drawings

[0031] Next, reference is made to the accompanying drawings. The components illustrated in the figures may or may not be present in the specific embodiments described herein. Some embodiments may include fewer (or more) components than those shown in the figures according to the exemplary embodiments of the present disclosure. [Figure 1] This is a perspective view of a system according to one or more embodiments of the present disclosure. [Figure 2] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 3] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 4] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 5] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 6] This is a partial cross-sectional view of a system according to one or more embodiments of the present disclosure. [Figure 7] This is a perspective view of a sensing die according to one or more embodiments of the present disclosure. [Figure 8] This is a partial oblique top view of an exemplary system according to one or more embodiments of the present disclosure. [Figure 9] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 10] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 11] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 12] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 13] This is a partial cross-sectional view of a system according to one or more embodiments of the present disclosure. [Figure 14] This is a partial perspective view of a system according to one or more embodiments of the present disclosure. [Figure 15] This is a flowchart illustrating an exemplary method according to one or more embodiments of the present disclosure. [Modes for carrying out the invention]

[0032] Exemplary embodiments are described below in more detail with reference to the accompanying drawings, but only a few embodiments are shown, not all embodiments of the disclosure. In fact, embodiments of the disclosure may be embodied in many different forms and should not be construed as being limited to the embodiments described herein, but rather these embodiments are provided so that the disclosure satisfies applicable legal requirements. Similar figures refer to similar elements throughout.

[0033] overview The exemplary embodiments disclosed herein address technical issues related to systems for performing fluid analysis. As will be understood by those skilled in the art, there are numerous exemplary scenarios in which a system for performing fluid analysis is desirable.

[0034] In many applications, it is desirable to perform fluid analysis. For example, it may be desirable to perform fluid analysis on a fluid to measure one or more properties of the fluid, such as its flow rate. In many applications, it is desirable to perform fluid analysis on a flowing fluid. For example, it may be desirable to perform fluid analysis on a fluid flowing through a tube. In this way, fluid analysis can be performed without interrupting one or more processes that depend on the flowing fluid. In many applications, it is desirable to perform fluid analysis using a system constructed using a repeatable method. For example, it may be desirable to perform fluid analysis using a system that is at least partially constructed using plastic molding. In this way, a large number of similar systems can be quickly constructed and used for fluid analysis in a large number of applications.

[0035] Exemplary solutions for systems performing fluid analysis include using sensors to measure one or more properties of the fluid. However, such exemplary solutions are inaccurate, inefficient, and inconsistent. For example, such exemplary solutions are inaccurate because they are prone to sensor drift. In this regard, for example, such exemplary solutions are prone to sensor drift because they cannot form a stable flow path close to the sensors measuring one or more properties of the fluid. As a result, such exemplary solutions cannot obtain stable measurements of one or more properties of the fluid over time. As another example, such exemplary solutions are inefficient because they cannot perform fluid analysis while the fluid is moving. As a result, in such exemplary solutions, one or more processes that depend on the fluid flow must be interrupted in order to perform fluid analysis on the fluid. As yet another example, such exemplary solutions are inconsistent because they are not designed to tolerate dimensional variations in the system introduced through the construction process (e.g., dimensional variations in the plastic components of a system introduced in a plastic molding construction process). As a result, such exemplary solutions often fail prematurely and / or must be reconfigured before use because they cannot tolerate dimensional variations in the system introduced through the construction process. Therefore, there is a need for a system that can perform fluid analysis in an accurate, efficient, and consistent manner.

[0036] Accordingly, exemplary systems and related methods are provided herein to address these and / or other problems related to systems for performing fluid analysis. For example, one embodiment of the present disclosure, described in more detail below, includes a system including a support structure. In some embodiments, the system includes a sensing die disposed on the support structure. In some embodiments, the system includes a fluid guide. In some embodiments, the fluid guide is supported by the sensing die at a first position and by the support structure at a second and a third position. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more properties of the fluid in the flow path. Thus, the exemplary systems and related methods provided herein enable the performance of fluid analysis in an accurate, efficient, and consistent manner.

[0037] Exemplary System Embodiments of the disclosure herein include a system 102 for performing fluid analysis. It should be readily understood that embodiments of the system 102 described herein may be configured in a variety of additional and alternative ways, in addition to those expressly described herein.

[0038] Referring to Figures 1 to 14, a system 102 for performing fluid analysis is shown. In this regard, for example, system 102 may be configured to perform analysis of gases, liquids, etc. In some embodiments, performing fluid analysis involves system 102 being configured to measure one or more properties of a fluid. In some embodiments, one or more properties of a fluid include the fluid flow rate. In this regard, for example, system 102 may be configured to measure the fluid flow rate. In some embodiments, one or more properties of a fluid include the fluid's thermal conductivity. In this regard, for example, system 102 may be configured to measure the fluid's thermal conductivity. In some embodiments, one or more properties of a fluid include the fluid's viscosity. In this regard, for example, system 102 may be configured to measure the fluid's viscosity. In some embodiments, by measuring the fluid's flow rate, thermal conductivity, and / or viscosity, system 102 is configured to identify a fluid (e.g., the type of fluid in which the fluid is located).

[0039] In some embodiments, the system 102 includes a support structure 114. In some embodiments, the support structure 114 is any structure that can support any structure, device, etc. configured to facilitate the measurement of one or more properties of the fluid guide 106, the sensing die 116, the encapsulating material 134, and / or the fluid. For example, the support structure 114 may include a printed circuit board (PCB). In some embodiments, the support structure 114 includes one or more of the following: plastic, metal, composite material, insulating material, conductive material, etc. In some embodiments, the support structure 114 includes one or more surfaces. For example, the support structure 114 may include an upper surface 158.

[0040] In some embodiments, the support structure 114 includes a fluid analysis circuit 126. In some embodiments, the fluid analysis circuit 126 includes an application-specific integrated circuit. In some embodiments, the fluid analysis circuit 126 is configured to facilitate fluid analysis. For example, the fluid analysis circuit 126 may be configured to facilitate the measurement of fluid flow rate, fluid thermal conductivity, and / or fluid viscosity. As another example, the fluid analysis circuit 126 may be configured to identify a fluid based on the measured fluid flow rate, measured thermal conductivity, and / or measured viscosity. In some embodiments, the support structure 114 includes one or more electrical connectors 124. In some embodiments, one or more electrical connectors 124 include one or more wires, traces (e.g., conductive traces), etc. In some embodiments, one or more of the one or more electrical connectors 124 are connected to the fluid analysis circuit 126.

[0041] In some embodiments, the system 102 includes a sensing die 116. In some embodiments, the sensing die 116 is any shape suitable for facilitating fluid analysis. For example, the sensing die 116 may be a right-angle prism (e.g., a cube), a cylinder, a sphere, and / or any other suitable shape. In some embodiments, the sensing die 116 includes one or more side walls 120. For example, if the sensing die 116 is a rectangular parallelepiped, the one or more side walls 120 may include four side walls.

[0042] In some embodiments, the sensing die 116 includes a bottom surface 122. In some embodiments, the sensing die 116 is positioned on a support structure 114. In this regard, in some embodiments, the bottom surface 122 of the sensing die 116 is anchored, fixed, attached to, supported by and / or in contact with the upper surface 158 of the support structure 114. For example, the bottom surface 122 of the sensing die 116 may be anchored to the upper surface 158 of the support structure 114 via adhesive, screws, fasteners, etc.

[0043] In some embodiments, the sensing die 116 includes an upper surface 118. In some embodiments, the upper surface 118 of the sensing die 116 includes a sensing portion 132. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid as the fluid flows across the sensing portion 132. For example, the sensing portion 132 may be configured to measure the flow rate of a fluid as the fluid flows across the sensing portion 132.

[0044] In some embodiments, the upper surface 118 of the sensing die 116 includes a connection portion 128. In some embodiments, the connection portion 128 is connected to one or more of one or more electrical connectors 124. In this regard, in some embodiments, one or more of the one or more electrical connectors 124 connect the sensing die 116 to a fluid analysis circuit 126. For example, one or more measurements from the sensing portion 132 of the sensing die 116 may be provided to the fluid analysis circuit 126 via the connection portion 128 and / or one or more of the one or more electrical connectors 124.

[0045] In some embodiments, the upper surface 118 of the sensing die 116 includes a support portion 130. In some embodiments, the support portion 130 is configured to at least partially support one or more other components of the system 102. In some embodiments, the support portion 130 is located between a connecting portion 128 and a sensing portion 132 on the upper surface 118 of the sensing die 116. In this regard, for example, the connecting portion 128 may be located in the upper portion of the upper surface 118, the support portion 130 may be located in the central portion of the upper surface 118, and the sensing portion 132 may be located in the lower portion of the upper surface 118.

[0046] In some embodiments, the system 102 includes a fluid guide 106. In some embodiments, the fluid guide 106 includes one or more of the following materials: plastic, metal, composite material, and / or any other suitable material to facilitate the measurement of one or more properties of the fluid. For example, the fluid guide 106 may be a molded plastic. In some embodiments, the fluid guide 106 includes a central portion 162. In some embodiments, the fluid guide 106 includes an inlet portion 110. In some embodiments, the fluid guide 106 is configured to receive fluid through the inlet portion 110. For example, the inlet portion 110 may include an opening to which the fluid guide 106 is configured to receive fluid. In some embodiments, the fluid guide 106 includes an outlet portion 112. In some embodiments, the fluid guide 106 is configured to discharge fluid through the outlet portion 112. For example, the outlet portion 112 may include an opening to which the fluid guide 106 is configured to discharge fluid.

[0047] In some embodiments, the inlet portion 110 is configured to connect to one or more tubes that supply fluid to the system 102 through the inlet portion 110. In some embodiments, the outlet portion 112 is configured to connect to one or more tubes that receive fluid discharged by the system 102 through the outlet portion 112. While the inlet portion 110 is described herein as being configured to receive fluid and the outlet portion 112 as being configured to discharge fluid, it will be understood by those skilled in the art to which this disclosure pertains that the inlet portion 110 may be configured to discharge fluid and the outlet portion 112 may be configured to receive fluid.

[0048] In some embodiments, the fluid guide 106 defines a flow path 136. In some embodiments, the flow path 136 is a portion of the fluid guide 106 through which a fluid can flow. For example, the flow path 136 may be a chamber through which a fluid can flow. In some embodiments, the fluid may flow through the flow path 136 from an inlet portion 110 to an outlet portion 112. In some embodiments, the flow path 136 includes a bottom surface 138.

[0049] In some embodiments, the fluid guide 106 defines an access area 140. In some embodiments, the access area 140 is a part of the fluid guide 106 through which at least a portion of the sensing die 116 can be accessed. For example, the access area 140 may be a part of the fluid guide 106 through which a connection portion 128 of the sensing die 116 can be accessed. In some embodiments, the fluid guide 106 includes a cover 108. In some embodiments, the cover 108 allows access to the flow path 136 and / or the access area 140 during the construction of the system 102. For example, the cover 108 may allow access to the flow path 136 and / or the access area 140 during the construction of the system 102 in order to place the sealing material 134 on the support structure 114. Additionally or alternatively, the cover 108 may seal the flow path 136 and / or the access area 140. For example, after the sealing material 134 is placed on the support structure 114, the cover 108 may be used to seal the flow path 136 and / or access area 140.

[0050] In some embodiments, the fluid guide 106 includes a wall 142. In some embodiments, the access area 140 is separated from the flow path 136 by at least the wall 142 of the fluid guide 106. For example, the wall 142 can at least partially separate the flow path 136 from the access area 140. In some embodiments, the wall 142 includes a bottom surface 152.

[0051] In some embodiments, the fluid guide 106 is supported by the sensing die 116. In some embodiments, the fluid guide 106 is supported by the sensing die 116 in a first position 144. In some embodiments, in the first position 144, the bottom surface 152 of the wall 142 is positioned on a support portion 130 of the upper surface 118 of the sensing die 116. In this regard, in some embodiments, the bottom surface 152 of the wall 142 of the fluid guide 106 is anchored, fixed, attached to, supported by and / or in contact with the support portion 130 of the upper surface 118 of the sensing die 116. For example, the bottom surface 152 of the wall 142 of the fluid guide 106 can be anchored to the support portion 130 of the upper surface 118 of the sensing die 116 via adhesive, screws, fasteners, etc.

[0052] In some embodiments, the fluid guide 106 includes a first support projection 154. In some embodiments, the fluid guide 106 includes a second support projection 156. In some embodiments, the first support projection 154 and / or the second support projection 156 are located on the bottom surface 160 of the fluid guide 106 and extend outward from the bottom surface 160 of the fluid guide 106. In this regard, for example, the fluid guide 106 may be formed (e.g., molded) such that the bottom surface 160 of the fluid guide 106 includes a first support projection 154 and / or the second support projection 156 extending outward from the bottom surface 160 of the fluid guide 106.

[0053] In some embodiments, the fluid guide 106 is supported by a support structure 114. In some embodiments, the fluid guide 106 is supported by the support structure 114 at a second position 146. In some embodiments, at the second position 146, the first support projection 154 is positioned on the upper surface 158 of the support structure 114. In this regard, in some embodiments, the first support projection 154 is anchored, fixed, attached to, supported by, and / or in contact with the upper surface 158 of the support structure 114. For example, the first support projection 154 may be anchored to the upper surface 158 of the support structure 114 via adhesive, screws, fasteners, etc.

[0054] Additionally or alternatively, the fluid guide 106 is supported by the support structure 114 at a third position 148. In some embodiments, at the third position 148, a second support projection 156 is positioned on the upper surface 158 of the support structure 114. In this regard, in some embodiments, the second support projection 156 is anchored, fixed, attached to, supported by, and / or in contact with the upper surface 158 of the support structure 114. For example, the second support projection 156 may be anchored to the upper surface 158 of the support structure 114 via adhesive, screws, fasteners, etc. In other words, for example, the fluid guide 106 may be supported at a first position 144, a second position 146, and / or a third position 148.

[0055] In some embodiments, at least a portion of the bottom surface 160 of the fluid guide 106 is separated from the upper surface 158 of the support structure 114 by a gap 150. In this regard, in some embodiments, one or more structural variations in the fluid guide 106 may be explained by the gap 150. In other words, for example, the fluid guide 106 may be constructed using a process (e.g., plastic molding) that introduces slight variations in the dimensions of the fluid guide 106 compared to the design dimensions of the fluid guide 106. Thus, in some embodiments, by supporting the fluid guide 106 at a first position 144, a second position 146, and / or a third position 148 to ensure that there is a gap 150 between at least a portion of the bottom surface 160 of the fluid guide 106 and the upper surface 158 of the support structure 114, the system 102 can tolerate slight variations in the dimensions of the fluid guide 106 compared to the design dimensions of the fluid guide 106 (e.g., still used to perform fluid analysis).

[0056] In some embodiments, the system 102 includes a encapsulant 134. In some embodiments, the encapsulant 134 is placed on a support structure 114. For example, the encapsulant 134 may be placed on the upper surface 158 of the support structure 114. In some embodiments, the encapsulant 134 occupies the space between one or more side walls 120 of the sensing die 116 and the fluid guide 106. In this regard, in some embodiments, the encapsulant 134 is in contact with one or more of the side walls 120 of the sensing die 116 and the fluid guide 106.

[0057] In some embodiments, the encapsulant 134 has a thickness (t) equal to the distance between at least one of the one or more sidewalls 120 and the fluid guide 106. For example, the encapsulant 134 may have a thickness (t) of 0.15 mm to 0.30 mm. In this regard, in some embodiments, the distance between at least one of the one or more sidewalls 120 and the fluid guide 106 may be 0.15 mm to 0.30 mm. For example, the fluid guide 106 may be constructed (e.g., molded) such that when the fluid guide 106 is placed on the support structure 114 and the sensing die 116, the distance between at least one of the one or more sidewalls 120 and the fluid guide 106 is 0.15 mm to 0.30 mm. In some embodiments, the encapsulant 134 has a height (h2). In some embodiments, the height (h2) of the encapsulant 134 is approximately equal to the height (h1) of the sensing die 116.

[0058] In some embodiments, at least a portion of the upper surface 164 of the encapsulant 134 is at the same height as the upper surface 118 of the sensing die 116. For example, a portion of the upper surface 164 of the encapsulant 134 adjacent to the sensing portion 132 may be at the same height as the upper surface 118 of the sensing die 116. Additionally or alternatively, the bottom surface 138 of the flow path 136 is at the same height as the upper surface 118 of the sensing die 116. Additionally or alternatively, at least a portion of the upper surface 164 of the encapsulant 134 is at the same height as the bottom surface 138 of the flow path 136. In other words, for example, the fluid guide 106, the sensing die 116, and the encapsulant 134 may be configured such that at least a portion of the upper surface 164 of the encapsulant 134, the upper surface 118 of the sensing die 116, and the bottom surface 138 of the flow path 136 are at the same height as each other. In this regard, in some embodiments, the fluid can flow over a continuous horizontal plane as it flows over the bottom surface 138 of the flow path 136, then over the upper surface 164 of the sealing material 134, and then over the upper surface 118 of the sensing die 116. In some embodiments, by ensuring that the fluid can flow over a continuous horizontal plane as it approaches the sensing portion 132 of the sensing die 116, the system 102 can obtain more accurate measurements of one or more properties of the fluid (e.g., flow rate) and / or avoid sensor drift over time (e.g., measurement drift).

[0059] In some embodiments, the access area 140 is separated from the flow path 136 by at least the sealing material 134. In this regard, in some embodiments, the access area 140 and the flow path 136 may be isolated from each other by the sealing material 134 and / or the walls 142 of the fluid guide 106. In some embodiments, isolating the access area 140 and the flow path 136 from each other can prevent the fluid flowing through the flow path 136 from entering the access area 140.

[0060] In some embodiments, the encapsulant 134 is placed on the upper surface 158 of the support structure 114 in liquid form via the access region 140. In this regard, for example, the encapsulant 134 can penetrate into the channel 136 and surround the sensing die 116 from all sides. In some embodiments, the encapsulant 134 may harden after surrounding the sensing die 116. In some embodiments, the encapsulant 134 is any material suitable for separating the access region 140 and the channel 136 from each other, and / or any material suitable for ensuring that the bottom surface 138 of the channel 136, at least a portion of the upper surface 164 of the encapsulant 134, and the upper surface 118 of the sensing die 116 are at the same height as each other. For example, the encapsulant 134 may be a low-viscosity encapsulant such as silicone, epoxy, or urethane. In some embodiments, the encapsulant 134 may be cured by heat (e.g., heat higher than room temperature), room temperature air, visible light, ultraviolet (UV) light, and / or moisture.

[0061] In some embodiments, the encapsulant 134 covers the connection portion 128 of the sensing die 116. In this regard, for example, the encapsulant 134 can protect the connection portion 128 of the sensing die 116 from corrosion and / or other damage. In some embodiments, the system 102 does not include the encapsulant 134. In this regard, for example, if the system 102 does not include the encapsulant 134, a gap (e.g., an air gap) may exist in the space between one or more side walls 120 of the sensing die 116 and the fluid guide 106.

[0062] In some embodiments, the system 102 includes a housing 104. In some embodiments, the housing 104 surrounds a support structure 114. Additionally or alternatively, the housing 104 surrounds a sensing die 116. Additionally or alternatively, the housing 104 surrounds the central portion 162 of the fluid guide 106. In other words, for example, the support structure 114, the sensing die 116, and / or the central portion 162 of the fluid guide 106 may be enclosed within the housing 104. In some embodiments, the fluid guide 106 includes one or more of plastic, metal, and composite materials and / or surrounds the support structure 114, the sensing die 116, and the central portion 162 of the fluid guide 106. In some embodiments, an inlet portion 110 and / or an outlet portion 112 project outward from the housing 104. For example, the inlet portion 110 may protrude outward from the first side of the housing 104, and the outlet portion 112 may protrude outward from the second side of the housing 104.

[0063] Exemplary Method Next, referring to Figure 15, a flowchart providing an exemplary method 1500 is shown. In some embodiments, method 1500 is a manufacturing method. For example, method 1500 may be a method for manufacturing system 102 and / or one or more components of system 102.

[0064] As shown in block 1510, method 1500 may include providing a support structure. As described above, in some embodiments, the support structure 114 is any structure that can support any structure, device, etc. configured to facilitate the measurement of one or more properties of the fluid guide 106, the sensing die 116, the encapsulant 134, and / or fluid. For example, the support structure 114 may include a printed circuit board (PCB). In some embodiments, the support structure 114 includes one or more of the following: plastic, metal, composite material, insulating material, conductive material, etc. In some embodiments, the support structure 114 includes one or more surfaces. For example, the support structure 114 may include an upper surface 158.

[0065] In some embodiments, the support structure 114 includes a fluid analysis circuit 126. In some embodiments, the fluid analysis circuit 126 includes an application-specific integrated circuit. In some embodiments, the fluid analysis circuit 126 is configured to facilitate fluid analysis. For example, the fluid analysis circuit 126 may be configured to facilitate the measurement of fluid flow rate, fluid thermal conductivity, and / or fluid viscosity. As another example, the fluid analysis circuit 126 may be configured to identify a fluid based on the measured fluid flow rate, measured thermal conductivity, and / or measured viscosity. In some embodiments, the support structure 114 includes one or more electrical connectors 124. In some embodiments, one or more electrical connectors 124 include one or more wires, traces (e.g., conductive traces), etc. In some embodiments, one or more of the one or more electrical connectors 124 are connected to the fluid analysis circuit 126.

[0066] As shown in block 1520, method 1500 may include arranging a sensing die on a support structure. As described above, in some embodiments, the sensing die 116 is any shape suitable for facilitating fluid analysis. For example, the sensing die 116 may be a right-angle prism (e.g., a cube), a cylinder, a sphere, and / or any other suitable shape. In some embodiments, the sensing die 116 includes one or more side walls 120. For example, if the sensing die 116 is a right-angle prism, the one or more side walls 120 may include four side walls.

[0067] In some embodiments, the sensing die 116 includes a bottom surface 122. In some embodiments, the sensing die 116 is positioned on a support structure 114. In this regard, in some embodiments, the bottom surface 122 of the sensing die 116 is anchored, fixed, attached to, supported by and / or in contact with the upper surface 158 of the support structure 114. For example, the bottom surface 122 of the sensing die 116 may be anchored to the upper surface 158 of the support structure 114 via adhesive, screws, fasteners, etc.

[0068] In some embodiments, the sensing die 116 includes an upper surface 118. In some embodiments, the upper surface 118 of the sensing die 116 includes a sensing portion 132. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid as the fluid flows across the sensing portion 132. For example, the sensing portion 132 may be configured to measure the flow rate of a fluid as the fluid flows across the sensing portion 132.

[0069] In some embodiments, the upper surface 118 of the sensing die 116 includes a connection portion 128. In some embodiments, the connection portion 128 is connected to one or more of one or more electrical connectors 124. In this regard, in some embodiments, one or more of the one or more electrical connectors 124 connect the sensing die 116 to a fluid analysis circuit 126. For example, one or more measurements from the sensing portion 132 of the sensing die 116 may be provided to the fluid analysis circuit 126 via the connection portion 128 and / or one or more of the one or more electrical connectors 124.

[0070] In some embodiments, the upper surface 118 of the sensing die 116 includes a support portion 130. In some embodiments, the support portion 130 is configured to at least partially support one or more other components of the system 102. In some embodiments, the support portion 130 is located between a connecting portion 128 and a sensing portion 132 on the upper surface 118 of the sensing die 116. In this regard, for example, the connecting portion 128 may be located in the upper portion of the upper surface 118, the support portion 130 may be located in the central portion of the upper surface 118, and the sensing portion 132 may be located in the lower portion of the upper surface 118.

[0071] As shown in block 1530, method 1500 may include arranging a fluid guide on a support structure and a sensing die. As described above, in some embodiments, the fluid guide 106 includes one or more of the following materials: plastic, metal, composite material, and / or any other suitable material to facilitate the measurement of one or more properties of the fluid. For example, the fluid guide 106 may be a molded plastic. In some embodiments, the fluid guide 106 includes a central portion 162. In some embodiments, the fluid guide 106 includes an inlet portion 110. In some embodiments, the fluid guide 106 is configured to receive fluid through the inlet portion 110. For example, the inlet portion 110 may include an opening through which the fluid guide 106 is configured to allow the fluid to pass and receive. In some embodiments, the fluid guide 106 includes an outlet portion 112. In some embodiments, the fluid guide 106 is configured to discharge fluid through the outlet portion 112. For example, the outlet portion 112 may include an opening through which the fluid guide 106 is configured to allow the fluid to pass and discharge.

[0072] In some embodiments, the inlet portion 110 is configured to connect to one or more tubes that supply fluid to the system 102 through the inlet portion 110. In some embodiments, the outlet portion 112 is configured to connect to one or more tubes that receive fluid discharged by the system 102 through the outlet portion 112. While the inlet portion 110 is described herein as being configured to receive fluid and the outlet portion 112 as being configured to discharge fluid, it will be understood by those skilled in the art to which this disclosure pertains that the inlet portion 110 may be configured to discharge fluid and the outlet portion 112 may be configured to receive fluid.

[0073] In some embodiments, the fluid guide 106 defines a flow path 136. In some embodiments, the flow path 136 is a portion of the fluid guide 106 through which fluid can flow. For example, the flow path 136 may be a chamber through which fluid flows. In some embodiments, the fluid may flow through the flow path 136 from the inlet portion 110 to the outlet portion 112. In some embodiments, the flow path 136 includes a bottom surface 138.

[0074] In some embodiments, the fluid guide 106 defines an access area 140. In some embodiments, the access area 140 is a part of the fluid guide 106 through which at least a portion of the sensing die 116 can be accessed. For example, the access area 140 may be a part of the fluid guide 106 through which a connection portion 128 of the sensing die 116 can be accessed. In some embodiments, the fluid guide 106 includes a cover 108. In some embodiments, the cover 108 allows access to the flow path 136 and / or the access area 140 during the construction of the system 102. For example, the cover 108 may allow access to the flow path 136 and / or the access area 140 during the construction of the system 102 in order to place the encapsulant 134 on the support structure 114. Additionally or alternatively, the cover 108 may seal the flow path 136 and / or the access area 140. For example, after the encapsulant 134 has been placed on the support structure 114, the cover may be used to seal the flow path 136 and / or the access area 140.

[0075] In some embodiments, the fluid guide 106 includes a wall 142. In some embodiments, the access area 140 is separated from the flow path 136 by at least the wall 142 of the fluid guide 106. For example, the wall 142 can at least partially separate the flow path 136 from the access area 140. In some embodiments, the wall 142 includes a bottom surface 152.

[0076] In some embodiments, the fluid guide 106 is supported by the sensing die 116. In some embodiments, the fluid guide 106 is supported by the sensing die 116 in a first position 144. In some embodiments, in the first position 144, the bottom surface 152 of the wall 142 is positioned on a support portion 130 of the upper surface 118 of the sensing die 116. In this regard, in some embodiments, the bottom surface 152 of the wall 142 of the fluid guide 106 is anchored, fixed, attached to, supported by and / or in contact with the support portion 130 of the upper surface 118 of the sensing die 116. For example, the bottom surface 152 of the wall 142 of the fluid guide 106 can be anchored to the support portion 130 of the upper surface 118 of the sensing die 116 via adhesive, screws, fasteners, etc.

[0077] In some embodiments, the fluid guide 106 includes a first support projection 154. In some embodiments, the fluid guide 106 includes a second support projection 156. In some embodiments, the first support projection 154 and / or the second support projection 156 are located on the bottom surface 160 of the fluid guide 106 and extend outward from the bottom surface 160 of the fluid guide 106. In this regard, for example, the fluid guide 106 may be formed (e.g., molded) such that the bottom surface 160 of the fluid guide 106 includes a first support projection 154 and / or the second support projection 156 extending outward from the bottom surface 160 of the fluid guide 106.

[0078] In some embodiments, the fluid guide 106 is supported by a support structure 114. In some embodiments, the fluid guide 106 is supported by the support structure 114 at a second position 146. In some embodiments, at the second position 146, the first support projection 154 is positioned on the upper surface 158 of the support structure 114. In this regard, in some embodiments, the first support projection 154 is anchored, fixed, attached to, supported by, and / or in contact with the upper surface 158 of the support structure 114. For example, the first support projection 154 may be anchored to the upper surface 158 of the support structure 114 via adhesive, screws, fasteners, etc.

[0079] Additionally or alternatively, the fluid guide 106 is supported by the support structure 114 at a third position 148. In some embodiments, at the third position 148, a second support projection 156 is positioned on the upper surface 158 of the support structure 114. In this regard, in some embodiments, the second support projection 156 is anchored, fixed, attached to, supported by, and / or in contact with the upper surface 158 of the support structure 114. For example, the second support projection 156 may be anchored to the upper surface 158 of the support structure 114 via adhesive, screws, fasteners, etc. In other words, for example, the fluid guide 106 may be supported at a first position 144, a second position 146, and / or a third position 148.

[0080] In some embodiments, at least a portion of the bottom surface 160 of the fluid guide 106 is separated from the upper surface 158 of the support structure 114 by a gap 150. In this regard, in some embodiments, one or more structural variations in the fluid guide 106 may be explained by the gap 150. In other words, for example, the fluid guide 106 may be constructed using a process (e.g., plastic molding) that introduces slight variations in the dimensions of the fluid guide 106 compared to the design dimensions of the fluid guide 106. Thus, in some embodiments, by supporting the fluid guide 106 at a first position 144, a second position 146, and / or a third position 148 to ensure that there is a gap 150 between at least a portion of the bottom surface 160 of the fluid guide 106 and the upper surface 158 of the support structure 114, the system 102 can tolerate slight variations in the dimensions of the fluid guide 106 compared to the design dimensions of the fluid guide 106 (e.g., still used to perform fluid analysis).

[0081] As shown in block 1540, method 1500 may include arranging an encapsulant on a support structure. As described above, in some embodiments, the encapsulant 134 is arranged on the support structure 114. For example, the encapsulant 134 may be arranged on the upper surface 158 of the support structure 114. In some embodiments, the encapsulant 134 occupies the space between one or more side walls 120 of the sensing die 116 and the fluid guide 106. In this regard, in some embodiments, the encapsulant 134 is in contact with one or more of the one or more side walls 120 of the sensing die 116 and the fluid guide 106.

[0082] In some embodiments, the encapsulant 134 has a thickness (t) equal to the distance between at least one of the one or more sidewalls 120 and the fluid guide 106. For example, the encapsulant 134 may have a thickness (t) of 0.15 mm to 0.30 mm. In this regard, in some embodiments, the distance between at least one of the one or more sidewalls 120 and the fluid guide 106 may be 0.15 mm to 0.30 mm. For example, the fluid guide 106 may be constructed (e.g., molded) such that when the fluid guide 106 is placed on the support structure 114 and the sensing die 116, the distance between at least one of the one or more sidewalls 120 and the fluid guide 106 is 0.15 mm to 0.30 mm. In some embodiments, the encapsulant 134 has a height (h2). In some embodiments, the height (h2) of the encapsulant 134 is approximately equal to the height (h1) of the sensing die 116.

[0083] In some embodiments, at least a portion of the upper surface 164 of the encapsulant 134 is at the same height as the upper surface 118 of the sensing die 116. For example, a portion of the upper surface 164 of the encapsulant 134 adjacent to the sensing portion 132 may be at the same height as the upper surface 118 of the sensing die 116. Additionally or alternatively, the bottom surface 138 of the flow path 136 is at the same height as the upper surface 118 of the sensing die 116. Additionally or alternatively, at least a portion of the upper surface 164 of the encapsulant 134 is at the same height as the bottom surface 138 of the flow path 136. In other words, for example, the fluid guide 106, the sensing die 116, and the encapsulant 134 may be configured such that at least a portion of the upper surface 164 of the encapsulant 134, the upper surface 118 of the sensing die 116, and the bottom surface 138 of the flow path 136 are at the same height as each other. In this regard, in some embodiments, the fluid can flow over a continuous horizontal plane as it flows over the bottom surface 138 of the flow path 136, then over the upper surface 164 of the sealing material 134, and then over the upper surface 118 of the sensing die 116. In some embodiments, by ensuring that the fluid can flow over a continuous horizontal plane as it approaches the sensing portion 132 of the sensing die 116, the system 102 can obtain more accurate measurements of one or more properties of the fluid (e.g., flow rate) and / or avoid sensor drift over time (e.g., measurement drift).

[0084] In some embodiments, the access area 140 is separated from the flow path 136 by at least the sealing material 134. In this regard, in some embodiments, the access area 140 and the flow path 136 may be isolated from each other by the sealing material 134 and / or the walls 142 of the fluid guide 106. In some embodiments, isolating the access area 140 and the flow path 136 from each other can prevent the fluid flowing through the flow path 136 from entering the access area 140.

[0085] In some embodiments, the encapsulant 134 is placed on the upper surface 158 of the support structure 114 in liquid form via the access region 140. In this regard, for example, the encapsulant 134 can penetrate into the channel 136 and surround the sensing die 116 from all sides. In some embodiments, the encapsulant 134 may harden after surrounding the sensing die 116. In some embodiments, the encapsulant 134 is any material suitable for isolating the access region 140 and the channel 136 from each other, and / or any material suitable for ensuring that the bottom surface 138 of the channel 136, at least a portion of the upper surface 164 of the encapsulant 134, and the upper surface 118 of the sensing die 116 are at the same height as each other. For example, the encapsulant 134 may be a low-viscosity encapsulant such as silicone, epoxy, or urethane. In some embodiments, the encapsulant 134 may be cured by heat (e.g., heat higher than room temperature), room temperature air, visible light, ultraviolet (UV) light, and / or moisture.

[0086] In some embodiments, the encapsulant 134 covers the connection portion 128 of the sensing die 116. In this regard, for example, the encapsulant 134 can protect the connection portion 128 of the sensing die 116 from corrosion and / or other damage. In some embodiments, the system 102 does not include the encapsulant 134. In this regard, for example, if the system 102 does not include the encapsulant 134, a gap (e.g., an air gap) may exist in the space between one or more side walls 120 of the sensing die 116 and the fluid guide 106.

[0087] Many modifications and other embodiments of the invention described herein will be conceived by those skilled in the art who are interested in these inventions and who benefit from the teachings presented in the foregoing description and the associated drawings. While the drawings show only certain components of the fluid guides and systems described herein, it will be understood that various other components may be used in conjunction with the systems. Therefore, it should be understood that the invention is not limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. Furthermore, the steps in the methods described above do not necessarily have to be performed in the order depicted in the appended drawings, and in some cases, one or more of the depicted steps may be performed substantially simultaneously, or additional steps may be included. Certain terms are used herein, but these are used in a general and descriptive sense only and not for limiting purposes.

[0088] While various embodiments based on the principles disclosed herein have been shown and described above, modifications thereof can be made by those skilled in the art without departing from the spirit and teachings of this disclosure. The embodiments described herein are merely representative and not intended to be limiting. Many variations, combinations, and modifications are possible and within the scope of this disclosure. Alternative embodiments (may be multiple) resulting from combining, integrating, and / or omitting features of the embodiments are also within the scope of this disclosure. Thus, the scope of protection is not limited by the description set forth above.

[0089] In addition, the section headings used herein are provided to be consistent with the proposals of 37C.FR1.77 or to give a constituent implication. These headings are not intended to limit or characterize the invention as described in any claim that may be issued pursuant to this disclosure.

[0090] The use of broader terms such as “comprises,” “includes,” and “having” should be understood as providing support for narrower terms such as “consisting of,” “consisting essentially of,” and “comprised substantially of.” The use of terms such as “optionally,” “may,” “might,” and “possibly” with respect to any element of an embodiment means that the element is either not required or is required alternatively, and both options are within the scope of the embodiment. Furthermore, references to embodiments are provided for illustrative purposes only and are not intended to be exclusive.

Claims

1. It is a system, Support structure and, A sensing die arranged on the support structure, A fluid guide system comprising: a fluid guide, the fluid guide being supported by the sensing die in a first position and by the support structure in a second and third position, the fluid guide defining a flow path configured to receive fluid, and the sensing die comprising a sensing portion configured to measure one or more properties of the fluid in the flow path.

2. The system according to claim 1, wherein the support structure comprises a printed circuit board (PCB).

3. The system according to claim 1, wherein the flow path has a bottom surface, and the bottom surface is at the same height as the sensing portion of the sensing die.

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