Electronic equipment for camera modules, method for manufacturing the same, and camera module
A translucent substrate with a flip-chip image sensor and innovative manufacturing methods reduce camera module dimensions, enabling thinner portable devices by allowing light transmission and preventing contamination.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- PAC TECH PACKAGING TECH
- Filing Date
- 2025-04-11
- Publication Date
- 2026-06-03
Smart Images
Figure 2026091221000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an electronic device for a camera module and a method for manufacturing the electronic device. The present disclosure further relates to a camera module including the electronic device.
Background Art
[0002] Almost all portable devices such as smartphones and tablets are recently equipped with at least one camera module. Designers are trying to make the portable devices thinner. However, the possibility of thinning depends, in particular, on the dimensions of the camera module attached to the portable device.
Summary of the Invention
[0003] An object of the present disclosure is to provide a technique that enables reduction in the dimensions of a camera module.
[0004] This object is solved by the electronic device, the method for manufacturing the electronic device, and the camera module according to the independent claims. Preferred embodiments are the subject matter of the dependent claims.
[0005] The electronic device according to this disclosure is used in a camera module having a housing that forms a light-entry aperture. The electronic device comprises a substrate having a first surface positioned within the housing so as to face the light-entry aperture, and a second surface opposite to the first surface, and an image sensor having a photosensitive portion, designed as a flip chip, and mounted on the second surface. The flip chip is a die whose contacts, such as contact pads, are connected to contacts, such as contact pads, of another circuit, i.e., the substrate, by a contact material, such as solder. That is, when mounted, the contacts of the flip chip, i.e., the image sensor, are oriented toward the contacts of the substrate. The substrate is formed to be translucent, at least in the area of the photosensitive portion of the image sensor. Translucency means that at least a sufficient portion of the light incident into the housing can pass through the substrate from the first surface to the second surface so that the image sensor can capture incident light. The electronic device enables thinning and avoids bonding the image sensor to the substrate by using wire bonds.
[0006] According to one embodiment, the substrate can have an opening within the photosensitive area of the image sensor. The substrate can be made of ceramic or organic material. Therefore, the substrate can be easily formed.
[0007] According to one embodiment, the substrate may have a stepped portion on a second surface around the opening. An image sensor can be mounted on the stepped portion. Therefore, the electronic device, and consequently the camera module, can be made even thinner.
[0008] In one embodiment, the light-transmitting element can cover the opening from a first surface. Alternatively, the light-transmitting element can be fitted into the opening. In this way, the opening can be covered and sealed. Furthermore, the light-transmitting element can have light filtering properties. Therefore, light incident into the housing can be filtered before it is captured by the image sensor.
[0009] According to an alternative embodiment, the substrate can be formed from a light-transmitting material. Therefore, the substrate can allow light to pass through. In this way, it is not necessary to form an opening within the substrate.
[0010] According to one embodiment, the light-transmitting material can have light-filtering properties. Therefore, light incident on the housing is filtered as it passes through the substrate.
[0011] According to one embodiment, the substrate may have a recess on a second surface. An image sensor can be mounted in the recess. In this way, the substrate, which is made of a translucent material, can be made even thinner. Furthermore, the path of light passing through the substrate is reduced.
[0012] According to one embodiment, the sealing portion can be placed between the substrate and the image sensor. The sealing portion can be formed around the entire circumference of the image sensor. The sealing portion can be formed around the contact point between the substrate and the image sensor. The sealing portion can be made of solder or any other suitable sealing material, such as rubber or silicone. This embodiment is preferably combined with an embodiment having a substrate or light-transmitting element made of a light-transmitting material. In this way, stray light and dust can be prevented from entering the image sensor.
[0013] In one embodiment, the substrate may be provided with through holes corresponding to the contacts of an image sensor. The contacts may be formed by contact pads. The through holes may be filled with a contact material. The contact material may be solder. In particular, the contact material is introduced into the through holes by applying a solder body. The solder body may be a solder ball. More specifically, the solder body may be sprayed into the through holes. In this way, an image sensor designed as a flip chip can be mounted on the substrate without using a reflow oven.
[0014] The camera module according to this disclosure comprises a housing that forms a light-entry aperture. At least one lens, or a lens barrel supporting at least one lens, can be mounted in the light-entry aperture. The camera module further comprises electronic equipment arranged within the housing according to one of the above embodiments. Since the electronic equipment can be made thinner, a thin camera module can be achieved. Furthermore, the camera module can also achieve the effects of the embodiments described above.
[0015] A method for manufacturing electronic equipment for a camera module having a housing forming a light-entry aperture according to the present disclosure includes the steps of: providing a substrate having a first surface positioned within the housing so as to face the light-entry aperture, and a second surface opposite to the first surface; providing an image sensor having a photosensitive portion and designed as a flip-chip; and mounting the image sensor to the second surface. The substrate is formed to be translucent at least in the area of the photosensitive portion of the image sensor. Electronic equipment achieved using this method enables miniaturization and avoids bonding the image sensor to the substrate by the use of wire bonds.
[0016] In one embodiment, the substrate may be provided with through holes corresponding to the contacts of the image sensor, particularly the contact pads. The step of mounting the image sensor may then include applying, particularly injecting, a solder body, particularly solder balls, to the through holes from a first surface. In this way, an image sensor designed as a flip chip can be mounted to the substrate without using a reflow oven.
[0017] The present disclosure will be described below with reference to the drawings. Identical or corresponding elements are denoted by the same reference numeral. [Brief explanation of the drawing]
[0018] [Figure 1] This figure schematically shows a cross-sectional view of a camera module equipped with electronic equipment according to one embodiment. [Figure 2]This figure schematically shows a cross-sectional view of an electronic device according to another embodiment. [Figure 3] This figure schematically shows a cross-sectional view of an electronic device according to a further embodiment. [Figure 4] This figure schematically shows a cross-sectional view of an electronic device according to yet another embodiment. [Figure 5] This figure schematically shows a cross-sectional view of an electronic device according to an additional embodiment. [Figure 6] Figure 5 shows a schematic cross-sectional view of an electronic device along the dashed line. [Figure 7] This figure schematically shows a cross-sectional view of an electronic device according to a further embodiment. [Modes for carrying out the invention]
[0019] Figure 1 schematically shows a cross-sectional view of a camera module 1 having a housing 2 that forms a light-entry aperture 4. A lens barrel 6 supporting at least one lens 8 can be attached to the light-entry aperture 4. Light 10 can enter the interior of the housing 2 through the lens 8 supported by the lens barrel 6, and thus through the light-entry aperture 4.
[0020] An electronic device 12 according to one embodiment is arranged inside a housing 2. The electronic device 12 comprises a substrate 14 and an image sensor 16. The substrate 14 has a first surface 18 that is positioned inside the housing 2 so as to face the light incident aperture 4 and, consequently, the lens barrel 6 that supports the lens 8. The substrate 14 also has a second surface 20 opposite to the first surface 18. That is, the second surface 20 faces away from the light incident aperture 4. The image sensor 16 comprises a photosensitive portion, which is the part of the image sensor 16 in which the photodiode is located. Furthermore, the image sensor 16 is designed as a flip chip. A flip chip is a die whose contacts are connected by a contact material, such as solder, to the contacts of another circuit, namely the contacts of the substrate 14. That is, when mounted, the contacts of the image sensor 16 are oriented toward the contacts of the substrate 14.
[0021] As shown in FIG. 1, the image sensor 16 is attached to the second surface 20 of the substrate 14. The substrate 14 and the image sensor 16 include correspondingly arranged contact pads 22 and 24 as contacts. The contact pads 22 and 24 are joined by using a contact material, such as solder 26. As understood from FIG. 1, the photosensitive portion and the contact pad 24 are arranged on the same surface of the image sensor 16.
[0022] In order to allow the light 10 incident on the housing 2 to pass through to the photosensitive portion of the image sensor 16, the substrate 14 includes an opening 28 that extends at least over the region of the photosensitive portion of the image sensor 16.
[0023] As shown in FIG. 1, the light-transmissive element 30 can be fitted into the opening 28. Alternatively, the light-transmissive element 30 can be arranged on the first surface 18 so as to cover the opening 28. The light-transmissive element 30 can be made of glass. Further, the light-transmissive element 30 can have light filtering properties.
[0024] The electronic device 12 can arrange the image sensor 16 flatly on the substrate 14 so as to make the entire camera module 1 thinner. Further, wire bonding of the image sensor to the substrate can be avoided.
[0025] FIG. 2 schematically shows a cross-sectional view of the electronic device 12 according to another embodiment. The electronic device 12 in FIG. 2 is different from the electronic device 12 in FIG. 1 in that a stepped portion 32 is formed on the second surface 20 around the opening 28. The contact pad 22 of the substrate 14 is arranged on the stepped portion 32 and joined to the contact pad 24 of the image sensor 16 by using solder 26. In this way, a flatter electronic device 12 and camera module 1 can be achieved. Although not shown in FIG. 2, the light-transmissive element 30 can be fitted into the opening 28 or attached to the first surface 18.
[0026] Figure 3 schematically shows a cross-sectional view of an electronic device 12 according to a further embodiment. The electronic device 12 in Figure 3 differs from the electronic device 12 in Figure 1 in that the substrate 14 is formed of a light-transmitting material such as glass. Therefore, the substrate 14 does not need to form an opening 28. In addition, the light-transmitting material can have light filtering properties. Therefore, the light 10 that passes through the substrate is filtered before reaching the image sensor 16.
[0027] Figure 4 schematically shows a cross-sectional view of the electronic device 12 according to yet another embodiment. The electronic device 12 in Figure 4 differs from the electronic device 12 in Figure 3 in that a recess 34 is formed on the second surface 20. The contact pad 22 of the substrate 14 is placed in the recess 34 and is joined to the contact pad 24 of the image sensor 16 by using solder 26. In this way, a flatter electronic device 12 and camera module 1 can be achieved.
[0028] Figure 5 schematically shows a cross-sectional view of an electronic device 12 according to an additional embodiment. The electronic device 12 in Figure 5 differs from the electronic device 12 in Figure 4 in that the sealing portion 40 is located between the substrate 14 and the image sensor 16. The sealing portion 40 is formed around the contacts, i.e., the contacts between the contact pads 22 and 24 and the solder 26. The sealing portion 40 can be made of solder and formed on the contact stripes 36 and 38 formed around the entire circumference of the image sensor 16.
[0029] Figure 6 schematically shows a cross-sectional view of the electronic device 12 along the dashed line shown in Figure 5. As can be seen from Figure 6, the sealing portion 40, and consequently the contact stripes 36 and 38, are formed around the entire circumference of the image sensor 16. By forming the sealing portion 40, it is possible to prevent stray light and dust from entering the photosensitive portion of the image sensor 16. Since the photosensitive portion of the image sensor 16 faces the substrate 14 made of a light-transmitting material, the image sensor 16 is hermetically sealed. Nevertheless, the contact stripes 36 and 38 and the sealing portion 40 can also be formed in the electronic devices shown in Figures 1 to 3. Hermetically sealed can also be achieved in combination with an embodiment having a light-transmitting element 30, for example, as shown in Figure 1.
[0030] Figure 7 schematically shows a cross-sectional view of an electronic device 12 according to a further embodiment. The electronic device 12 of Figure 7 differs from the electronic device 12 of Figure 3 in that the substrate 14 has through holes 44 in the area of the contacts of the image sensor 16, i.e., the contact pads 24. The contact pads 24 then contact leads on the first surface 18 of the substrate 14, which are filled with a contact material, particularly solder, through holes 44. More specifically, the through holes 44 can be filled by applying solder to them. For example, a spray tool 44 can be used to spray a solder ball 46, an example of solder, into the through holes 44. In this way, the image sensor 16 can be mounted to the substrate 14 without the need to use a reflow oven. The through holes 44 formed in the substrate 14 and filled with solder can be combined with the embodiments of the electronic device 12 shown in Figures 1, 2, 4, and 5. [Explanation of Symbols]
[0031] 1...Camera module, 2...Housing, 4...Light entry aperture, 6...Lens barrel, 8...Lens, 10...Light, 12...Electronic device, 14...Substrate, 16...Image sensor, 18...First surface, 20...Second surface, 22...Contact pad, 24...Contact pad, 26...Solder, 28...Opening, 30...Translucent element, 32...Stepped portion, 34...Recess, 36...Contact stripe, 38...Contact stripe, 40...Sealing portion, 42...Through hole, 44...Solder spraying tool, 46...Solder body.
Claims
1. An electronic device (12) for a camera module (1) having a housing (2) that forms a light incident aperture (4), A substrate (14) having a first surface (18) positioned within the housing (2) so as to face the light incident aperture (4), and a second surface (20) opposite to the first surface (18), An image sensor (16) having a photosensitive portion, designed as a flip chip, and mounted on the second surface (20), Equipped with, Electronic device (12), wherein the substrate (14) is formed to be light-transmitting in at least the region of the photosensitive portion of the image sensor (16).
2. The electronic device (12) according to claim 1, wherein the substrate (14) has an opening (28) within the region of the photosensitive portion of the image sensor (16).
3. The substrate (14) has a stepped portion (32) on the second surface (20) around the opening (28), The electronic device (12) according to claim 2, wherein the image sensor (16) is attached to the stepped portion (32).
4. The light-transmitting element (30) is further provided. The light-transmitting element (30) covers the opening (28) from the first surface (18) or is fitted into the opening (28), as described in claim 2 or 3, for the electronic device (12).
5. The electronic device (12) according to claim 1, wherein the substrate (14) is made of a light-transmitting material.
6. The electronic device (12) according to claim 5, wherein the light-transmitting material has light-filtering properties.
7. The substrate (14) has a recess (34) on the second surface (20), The electronic device (12) according to claim 5 or 6, wherein the image sensor (16) is mounted in the recess (34).
8. A sealing portion (40) is disposed between the substrate (14) and the image sensor (16) and is formed around the entire circumference of the image sensor (16). The electronic device (12) according to any one of claims 1 to 3, 5 and 6, further comprising:
9. The substrate (14) is provided with through holes (44) corresponding to the contacts of the image sensor (16), The electronic device (12) according to any one of claims 1 to 3, 5 and 6, wherein the through hole (44) is filled with a contact material.
10. Camera module (1), A housing (2) that forms a light incidence aperture (4), An electronic device (12) according to any one of claims 1 to 3, 5 and 6, disposed within the housing (2), A camera module (1) is provided with the following features.
11. A method for manufacturing electronic equipment (12) for a camera module (1) having a housing (2) that forms a light incident aperture (4), The steps include providing a substrate (14) having a first surface (18) positioned within the housing (2) so as to face the light incident aperture (4), and a second surface (20) opposite to the first surface (18), The steps include providing an image sensor (16) having a photosensitive portion and designed as a flip chip, The steps include attaching the image sensor (16) to the second surface (20), Includes, A method wherein the substrate (14) is formed to be light-transmitting in at least the region of the photosensitive portion of the image sensor (16).
12. The substrate (14) is provided with through holes (44) corresponding to the contacts of the image sensor (16), The method according to claim 11, wherein the step of mounting the image sensor (16) includes the step of applying solder from the first surface (18) into the through hole (44).