Bio-based epoxy molding compositions for electronic devices

Abstract

This invention provides an EMC (electrochemical compound) that reduces the environmental impact of EMC manufacturing and disposal by replacing conventional EMC with environmentally friendly materials, while maintaining or improving the thermal and mechanical properties of EMCs that have significant environmental impacts, partly due to the manufacturing process and materials used in production. [Solution] Bio-based EMC consists of more than 90 percent bio-based and / or biodegradable materials, such as basalt fillers, bio-based epoxy resins, bio-based release agents, and bio-based stress modifiers. Bio-based EMC is a sustainable alternative to conventional EMC, offering enhanced mechanical strength, enhanced thermal stability and performance, and enhanced chemical resistance compared to conventional EMC.

Description

[Technical Field]

[0001] Epoxy molding composition EMC (Electromagnetic Computation) is a crucial part of most semiconductor packages. Typically, EMC is used to encapsulate and protect various electronic components within semiconductor packages, such as integrated circuits, transistors, and diodes. For example, EMC provides a protective layer that shields these electronic components from environmental factors such as moisture, dust, and chemicals, which helps prevent corrosion and damage. EMC also provides mechanical support and stability for various electronic components, as well as electrical insulation and thermal conductivity.

[0002] However, conventional EMCs have significant environmental impacts, partly due to the manufacturing process and materials used in their production. For example, conventional EMCs are manufactured using non-renewable resources such as petroleum-based resins and silica fillers. The extraction and processing of silica is energy-intensive, which can result in considerable carbon emissions.

[0003] Therefore, it would be beneficial to reduce the environmental impact of EMC manufacturing and disposal by replacing conventional EMC with environmentally friendly materials while maintaining or improving the thermal and mechanical properties of EMC. [Overview of the project]

[0004] This application relates to bio-based epoxy molding for electronic devices such as semiconductor packages. composition This explains EMC (Electromagnetic Compatibility). While semiconductor packages are specifically mentioned, bio-based EMC can be used across several different industries and in several different applications.

[0005] Unlike conventional EMCs, which are largely composed of non-renewable, non-natural materials such as petroleum-based resins and silica fillers, the bio-based EMCs of this disclosure are made primarily from naturally occurring materials. In fact, in some embodiments, the bio-based EMCs described herein are composed of more than 90 percent (90%) bio-based and / or biodegradable materials.

[0006] For example, instead of using silica fillers like those used in conventional EMC, the bio-based EMC of this disclosure uses natural fillers made from naturally occurring materials. In one example, the natural filler is basalt powder. In another example, instead of using non-bio-based epoxy resins such as bisphenol A (used in conventional EMC), the bio-based EMC of this disclosure uses bio-based epoxy resins (e.g., plant-derived epoxy resins with 28% carbon). In addition, unlike conventional EMC which uses silicon-based compounds and synthetic waxes as release agents, the bio-based EMC of this disclosure uses biodegradable waxes and other biodegradable materials.

[0007] These bio-based materials not only provide a sustainable alternative to conventional EMC, but also do not impair the mechanical strength and thermal stability of bio-based EMC, which are typically required in high-performance applications.

[0008] Therefore, the examples of the present disclosure relate to epoxy molding for electronic devices. composition (EMC) is described below. In one example, EMC consists of a bio-based filler material having a first weight percentage in the range of 60 to 90 weight percent of the total material composition of EMC. EMC also includes a bio-based epoxy resin having a second weight percentage in the range of 1 to 30 weight percent of the total material composition of EMC.

[0009] This disclosure also describes EMC for electronic devices. In this example, the EMC includes a bio-based filler having a first weight percentage in the range of 60 to 90 weight percent of the total material composition of the EMC. The EMC also includes an epoxy resin having a second weight percentage in the range of 1 to 30 weight percent of the total material composition of the EMC.

[0010] Further examples describe electronic devices having a substrate and a semiconductor die that is communicatively coupled to the substrate. A bio-based EMC encapsulates the semiconductor die. In one example, the bio-based EMC consists of at least 90 weight percent of bio-based material.

[0011] This summary is provided in a simplified form to introduce the selection of concepts further described below in modes for carrying out the invention. This summary is not intended to identify the main or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. [Brief explanation of the drawing]

[0012] Non-exclusive and non-exclusive examples are illustrated with reference to the following diagram. [Figure 1] This figure shows a semiconductor package having a bio-based epoxy molding composition (EMC) as an example. [Figure 2] This table contains four exemplary compositions for bio-based EMC, as an example. [Figure 3] This table contains the properties of four exemplary compositions of bio-based EMC, as an example. [Figure 4] A method for preparing a bio-based EMC powder that can be used to prepare a bio-based EMC as an example is shown. [Figure 5] This document describes a method for creating a bio-based EMC (Electromagnetic Computation) as an example. [Modes for carrying out the invention]

[0013] The following detailed description refers to the accompanying drawings, which form part of this specification, and which illustrate specific embodiments or examples. These embodiments may be combined, used in other embodiments, or modified structurally without departing from the disclosure. The following detailed description should not be construed as restrictive, and the scope of this disclosure is defined by the accompanying claims and their equivalents.

[0014] Epoxy molding composition EMC (Electromagnetic Computation) is present in most, though not all, semiconductor packages and / or electronic devices. Typically, EMC encapsulates and protects various electronic components within a semiconductor package. For example, EMC encapsulates integrated circuits, transistors, diodes, and other electronic components within a semiconductor package to provide protection from environmental factors. EMC also provides mechanical support, electrical insulation, and thermal conductivity.

[0015] However, conventional EMCs have significant negative impacts on the environment. For example, conventional EMCs are manufactured using non-renewable resources such as petroleum-based resins and silica fillers. The extraction and processing of silica is energy-intensive, which can result in considerable carbon emissions.

[0016] To address the above, this application describes EMC for electronic devices, such as semiconductor packages. The EMC described herein is mainly made from naturally occurring materials and / or bio-based materials. In fact, as will be described in more detail below, the EMC of this disclosure consists of at least 90 percent (90%) bio-based and / or biodegradable materials.

[0017] For example, the EMC of the present disclosure uses renewable and / or bio-based materials such as bio-based epoxy resins, basalt powder, and environmentally friendly additives. These bio-based materials provide a sustainable alternative to traditional petroleum-based components used in conventional EMCs and do not compromise the mechanical strength and / or thermal stability required for high-performance applications.

[0018] The EMC described herein has many environmental advantages. For example, including basalt powder as a filler instead of silica powder reduces CO2 emissions. Additionally, by using bio-based materials such as plant-derived epoxy resins and biodegradable additives, the environmental footprint of the EMC is significantly reduced compared to conventional EMCs. Moreover, the use of renewable resources helps reduce greenhouse gas emissions and supports sustainable manufacturing practices.

[0019] In addition to the environmental impact, the EMC described herein has other technical advantages including, but not limited to, improved mechanical strength, improved thermal stability, and performance compared to conventional EMCs. For example, the combination of bio-based epoxy resin and basalt powder significantly improves the mechanical strength of the EMC compared to conventional EMCs because the basalt powder contributes to high tensile and compressive strengths.

[0020] Furthermore, the EMC described herein exhibits excellent thermal stability that enables the EMC to function well in high-temperature environments. For example, basalt powder improves heat resistance while the bio-based resin provides consistent thermal behavior. The EMC described herein also has better thermal conductivity and a better coefficient of thermal expansion (CTE) compared to conventional EMCs.

[0021] In addition, while the examples described herein are directed to EMCs for semiconductor packages, the bio-based EMCs described herein are suitable for other implementations including, but not limited to, encapsulation of electronic components, use in the automotive industry, and use in the field of renewable energy. For example, the EMCs described herein may be used in the automotive industry to manufacture or produce lightweight composite panels, which reduce vehicle weight and improve fuel efficiency. In other examples, the bio-based EMCs can be used in the field of renewable energy. For example, the EMC can be used in solar panel encapsulation to shield or protect the solar panel from environmental damage, which improves the efficiency and lifespan of the panel.

[0022] These and other examples are shown and described in more detail with respect to FIGS. 1-5.

[0023] FIG. 1 shows a semiconductor package 100 having a bio-based EMC 110 according to an example. The bio-based EMC 110 is shown as part of the semiconductor package 100, but the bio-based EMC 110 (also referred to as EMC 110) can be used in other industries and / or applications.

[0024] In this example, the semiconductor package 100 includes a substrate 120. An integrated circuit or semiconductor die 130 is electrically coupled to the substrate 120, for example, using one or more bond wires 140. In one example, the semiconductor die 130 is a NAND memory die, but this is not essential.

[0025] The EMC 110 encapsulates the semiconductor die 130, bond wires 140, and other electronic components (not shown) of the semiconductor package 100. In this example, the semiconductor package 100 is electrically coupled to a printed circuit board (PCB) 150 using one or more connection mechanisms 160 (e.g., solder balls). Although solder balls are shown and described, the semiconductor package 100 may be electrically and / or communicatively coupled to the PCB 150 using other connection mechanisms 160.

[0026] For example, EMC 110 is mainly composed of natural fillers, such as basalt powder fillers. Although basalt powder is specifically mentioned, other natural fillers can be used.

[0027] Basalt originates from volcanic rock, a naturally abundant resource. Furthermore, the production of basalt powder requires less energy and produces fewer CO2 emissions compared to the production of silica powder. As a result, manufacturing EMC using basalt powder has a lower environmental impact.

[0028] Furthermore, basalt powder is more environmentally friendly than silica powder in terms of waste generation. Basalt powder is also naturally resistant to moisture and decomposition, which results in a longer product lifecycle. In addition, basalt powder-based EMC can be recycled more easily than EMC using conventional materials.

[0029] In one example, basalt powder as a filler constitutes approximately 60 wt% to approximately 90 wt% of the total weight of the composition of EMC 110. Approximate expressions used herein and throughout the claims may be applied to modify any quantitative expression that may vary acceptablely without altering the underlying function of the expression. Thus, values ​​modified by one or more terms such as “about,” “approximately,” and “substantially” are not limited to the specified exact value. In at least some examples, approximate expressions may correspond to the precision of the instrument used to measure the value. Herein, and throughout this specification and the claims, limitations on ranges may be combined and / or interchangeable, such ranges may be specified and include all subranges contained therein unless the context or language indicates otherwise. “Approximately” and / or “substantially,” when applied to a specific value of a range, may apply to both values ​​and, unless otherwise dependent on the precision of the instrument used to measure the value, may indicate + / - 10% of the stated value(s).

[0030] In another example, basalt powder as a filler constitutes approximately 70 wt% to 85 wt% of the total weight of the EMC 110 composition. While a specific range is given, the basalt powder filler can be less than 60 wt% or more than 90 wt%.

[0031] As discussed earlier, basalt powder as a filler offers various advantages when used in composite materials compared to conventional fillers such as silica. For example, basalt powder provides enhanced mechanical strength, superior thermal stability, and improved thermal conductivity compared to silica. Basalt powder also offers good chemical resistance, is environmentally friendly, and contributes to dimensional stability under temperature fluctuations. Basalt powder is also fire-resistant and corrosion-resistant, and is relatively lightweight.

[0032] EMC 110 is also composed of bio-based epoxy resin. For example, EMC The amount of bio-based epoxy resin in EMC 110 ranges from approximately 1 wt% to approximately 30 wt%, based on the total weight of the composition containing EMC 110. In another example, the amount of bio-based epoxy resin in EMC 110 ranges from approximately 5 wt% to approximately 25 wt%, based on the total weight of the composition containing EMC 110.

[0033] For example, the biobase can be any biobase resin. For instance, EMC 110 contains an epoxy resin with approximately 28 percent (28%) of plant-derived carbon. While a specific percentage is given, the percentage of plant-derived carbon may be higher or lower than 28%. For example, the biobase epoxy resin used in EMC 110 is bisphenol A diglycidyl ether (2,2'-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bisoxirane). While bisphenol A diglycidyl ether is specifically mentioned, other biobase epoxy resins may be used. For example, bisphenol A diglycidyl ether is used in EMC 110 because this particular biobase epoxy has a lower environmental impact than the standard bisphenol A epoxy used in conventional EMCs.

[0034] EMC 110 also contains a hardener (or curing agent). In one example, the hardener used in EMC 110 is isophorone diamine. Although isophorone diamine is specifically mentioned, other hardeners may be used. In one example, the amount of hardener in the composition containing EMC 110 is in the range of approximately 1 wt% to approximately 10 wt%. In another example, the amount of hardener in the composition is in the range of approximately 1 wt% to approximately 6 wt%.

[0035] In one example, EMC 110 also consists of a flame retardant. Any suitable flame retardant can be used in EMC 110, but to further reduce the environmental impact of EMC 110, environmentally friendly flame retardants, such as non-halogen flame retardants with low toxicity and low smoke properties, may be selected and used. In one example, the amount of flame retardant in the composition is in the range of approximately 0 wt% to approximately 5 wt%. In another example, the amount of flame retardant in the composition is in the range of approximately 0 wt% to approximately 3 wt%. Although specific ranges are given, other ranges may be used.

[0036] In one example, wax is used as a release agent in a composition containing EMC 110. Any type of wax / release agent can be used, but using environmentally friendly or biodegradable wax can further reduce the environmental impact of EMC 110. In one example, biodegradable wax does not contain microplastics like conventional waxes (e.g., polyethylene wax, polypropylene wax, silica-coated wax).

[0037] In one example, the amount of wax / release agent in a composition containing EMC 110 is in the range of approximately 0 wt% to approximately 5 wt%. In another example, the amount of wax / release agent in a composition is in the range of approximately 0.1 wt% to approximately 2 wt%. A specific range is given, but other ranges may be used.

[0038] The composition of EMC 110 may also include ion scavengers. For example, ion scavengers are used in EMC 110 to ensure better electrical insulation, prevent ion migration, enhance moisture resistance, and improve the chemical stability of the enclosed electronic components. All of these factors significantly improve the reliability and performance of various electronic devices using EMC 110.

[0039] In one example, the amount of ion scavenger in a composition containing EMC 110 is in the range of approximately 0 wt% to approximately 3 wt%. In another example, the amount of ion scavenger in a composition is in the range of approximately 0.1 wt% to approximately 1 wt%. Although a specific range is given, other ranges may be used.

[0040] In one example, EMC 110 also consists of biodegradable stress modifiers or absorbers. Stress modifiers are used within EMC 110 to alleviate mechanical stress arising from three-dimensional changes, thereby preventing cracking and delamination within the epoxy and electronic components encapsulated within EMC 110. Stress modifiers also assist in thermal cycling performance, improve adhesion, prevent warping and deformation, and increase the overall reliability and lifespan of electronic devices. The stress modifier in 110 is epoxidized soybean oil or another biodegradable material.

[0041] In one example, the amount of stress modifier / absorbent in a composition containing EMC 110 is in the range of approximately 0 wt% to approximately 3 wt%. In another example, the amount of stress modifier / absorbent in a composition is in the range of approximately 0.1 wt% to approximately 1 wt%. While specific ranges are given, other ranges may be used.

[0042] In one example, EMC 110 also contains a coupling agent. The coupling agent improves the compatibility between the bio-based epoxy resin and the basalt powder, resulting in a more uniform and robust EMC 110. For example, the coupling agent prevents aggregation and ensures a more homogeneous material. In one example, the coupling agent is a silane coupling agent such as aminoethylaminopropyltrimethoxysilane.

[0043] In one example, the amount of coupling agent in a composition containing EMC 110 is in the range of approximately 0 wt% to approximately 5 wt%. In another example, the amount of coupling agent in a composition is in the range of approximately 0.1 wt% to approximately 3 wt%. Although a specific range is given, other ranges may be used.

[0044] Figure 2 is Table 200, which contains four exemplary compositions for bio-based EMC in one example. In one example, each of the four exemplary compositions may be used to prepare EMC 110 shown and described with respect to Figure 1. In one example, each of composition 1 255, composition 2 260, composition 3 265, and composition 4 270 is prepared using various materials 205 shown in Table 200 and described with respect to Figure 1. While specific compositions are shown and described, other compositions may be prepared and used for EMC 110.

[0045] In one example, as shown in Table 200, composition 1255 contains 21.58 wt% epoxy resin 210, 5.17 wt% curing agent 215, 70 wt% filler (e.g., basalt powder) 220, 1 wt% release agent 225, no coupling agent 230, 0.25 wt% ion scavenging agent 235, 1 wt% flame retardant 240, and 1 wt% stress modifier 245, with a total wt% of 250 equal to 100.

[0046] In another example, composition 2260 contains 13.47 wt% epoxy resin 210, 3.28 wt% curing agent 215, 80 wt% filler 220, 1 wt% release agent 225, no coupling agent 230, 0.25 wt% ion scavenging agent 235, 1 wt% flame retardant 240, and 1 wt% stress modifier 245, with a total wt% of 250 equal to 100.

[0047] Another composition for EMC is shown as composition 3 265. In this example, composition 3 265 comprises 9.48 wt% epoxy resin 210, 2.27 wt% curing agent 215, 85 wt% filler 220, 1 wt% release agent 225, no coupling agent 230, 0.25 wt% ion scavenging agent 235, 1 wt% flame retardant 240, and 1 wt% stress modifier 245, with a total wt% of 250 equal to 100.

[0048] In yet another example, composition 4270 contains 9.48 wt% epoxy resin 210, 2.27 wt% curing agent 215, 85 wt% filler 220, 1 wt% release agent 225, 0.5 wt% coupling agent 230, 0.25 wt% ion scavenging agent 235, 0.75 wt% flame retardant 240, and 0.75 wt% stress modifier 245, with a total wt% of 250 equal to 100.

[0049] As discussed earlier, the composition, along with the relevant weight percentages of various materials 205, is for illustrative purposes only.

[0050] In addition to various environmental advantages, the EMCs described herein have similar, and in some cases better, physical, mechanical, and thermal properties compared to conventional EMCs. Some of these properties are described in more detail below.

[0051] The coefficient of thermal expansion (CTE) is a property that indicates the degree to which a material expands when heated. In one example, two CTE values ​​(e.g., CTE1 and CTE2) were determined for various EMC compositions described herein.

[0052] For example, EMC CTE1 and CTE2 were determined using a thermomechanical analyzer with the following test conditions: The EMC sample was heated from 25°C to 280°C at a rate of 10°C / min, with a load of 0.1 Newtons (N).

[0053] CTE1 was calculated in the temperature range of 25°C to 100°C, and CTE2 was calculated in the temperature range of 140°C to 260°C. Using these test conditions, CTE1 is in the range of approximately parts per 10 million degrees Celsius (ppm / °C) to approximately 40 ppm / °C. In another example, CTE1 is in the range of approximately 12 ppm / °C to approximately 30 ppm / °C.

[0054] In addition, CTE2 ranges from approximately 20 ppm / °C to approximately 110 ppm / °C. In another example, CTE2 ranges from approximately 25 ppm / °C to approximately 100 ppm / °C. Specific ranges are given, but these are for illustrative purposes only.

[0055] Another property related to EMC described herein is thermal conductivity. Thermal conductivity is an essential property of EMC and relates to the ability of EMC to effectively and efficiently dissipate the heat generated by active components (e.g., processors, transistors, power elements) enclosed by EMC. Heat dissipation prevents overheating, which can lead to performance problems and / or premature failure of components.

[0056] The thermal conductivity of EMC described herein was tested using samples with a thickness of 8 millimeters (8 mm). In one example, the thermal conductivity of EMC ranges from approximately 0.1 watts / meter / kelvin (W / m·K) to approximately 3 W / m·K. In another example, the thermal conductivity of EMC ranges from 0.2 W / m·K to approximately 2 W / m·K.

[0057] The viscosity of the EMC was also tested. Viscosity helps ensure proper molding and filling, processing efficiency, void reduction, thermal performance, stress management, consistency, and equipment compatibility. Proper control and optimization of viscosity are crucial for achieving high-quality and reliable encapsulation of electronic components.

[0058] In one example, the viscosity of EMC was measured using parallel plates with a diameter of 25 mm and a geometric shape of 1 mm. In addition, the measurements were performed at temperatures ranging from 175°C to 190°C. As a result, the viscosity of EMC described herein ranges from approximately 2 Pascal seconds (Pa·s) to approximately 20 Pa·s. In another example, the viscosity of EMC ranges from approximately 4 Pa·s to approximately 10 Pa·s, although other ranges may be used.

[0059] The flexural modulus of the EMC described herein was also tested. High modulus materials have greater resistance to deformation under stress compared to low modulus materials. Therefore, the higher the modulus, the more structurally stable the EMC is. For example, during assembly and manufacturing processes, enclosed electronic devices may be subjected to various mechanical forces. EMC with an optimal flexural modulus ensures that the electronic device can withstand these forces without deformation or failure.

[0060] The flexural modulus of EMC described herein was tested using a three-point bending test, in which a force was applied to the midpoint of a rectangular section of EMC that was freely supported at either end. The thickness, width, and length of the rectangular section of EMC were as follows: 4 mm × 10 mm × 80 mm. In addition, the test was performed at a crosshead speed of 1 mm / min and a test temperature of 25°C. Based on these test conditions, the flexural modulus of EMC is in the range of approximately 5 gigapascals (GPa) to 35 GPa. In another example, the flexural modulus of EMC is in the range of approximately 7 GPa to approximately 25 GPa, although other ranges may be used.

[0061] Specific gravity is a measure of the density of a substance compared to the density of a reference substance. In this example, the specific gravity of EMC in this disclosure was measured in air and distilled water at a test temperature of 25°C. The weight of the EMC sample pieces was maintained in the range of 2 grams (g) to 4 g. Based on these test conditions, the specific gravity of EMC is in the range of approximately 1 gram / cubic centimeter (g / cm³) to approximately 3 g / cm³. In another example, the specific gravity of EMC is in the range of approximately 1.7 g / cm³ to approximately 2.5 g / cm³.

[0062] The glass transition temperature (Tg) is the temperature at which an amorphous or semi-crystalline material transitions from a hard state to a softer, more flexible, or rubbery state, and vice versa. Understanding this temperature is essential for determining the operating temperature range of an EMC (Electromagnetic Computing).

[0063] Therefore, the Tg of the EMC in this disclosure was tested using a test temperature range of 30°C to 260°C at a heating rate of 10°C / min. The weight of the EMC ranged from 5 mg to 20 mg. In addition, two runs (e.g., heating-cooling-heating) were performed during the test. Based on this test procedure, the EMC has Tg values ​​in the range of approximately 80°C to approximately 160°C. In another example, the EMC has Tg values ​​of approximately 130°C and approximately 150°C.

[0064] Another property of EMC described herein is its gelation point. The gelation point helps determine the optimal molding time and curing cycle of the EMC. The gelation point of the EMC was determined using the following test conditions: The test temperature was set to 190°C, and the powder sample was placed on a rheometer plate. Under these conditions, the gelation point of the EMC described herein is in the range of approximately 42 seconds to approximately 180 seconds. In another example, the gelation time is in the range of 60 seconds to 120 seconds, although other ranges may be used.

[0065] Figure 3 is Table 300, which contains the properties of four exemplary compositions of bio-based EMC as an example. In an example, each of the four exemplary compositions shown in Table 300 is similar to the four exemplary compositions shown and described with respect to Figure 2. For example, composition 1 255 in Figure 2, which consists of various materials shown and described with respect to Figure 2, has the measured property 305 of composition 1 355 shown and described with respect to Figure 3. Similarly, composition 2 260 in Figure 2 has the measured property 305 of composition 2 360. While certain properties are shown and described, other properties may also be apparent.

[0066] As shown in Figure 3, composition 1355 contains approximately 1.8 g / cm³ of saturation. 3 ~Approximately 2.0 g / cm³ 3 Composition 1 355 has a specific gravity in the range of 310 and a thermal conductivity in the range of approximately 0.21 W / m·K to approximately 0.36 W / m·K. Composition 1 355 also has a flexural modulus of 320 in the range of approximately 9.0 Gpa to approximately 13.0 Gpa, a CTE1 of 325 in the range of approximately 27.6 ppm / ℃, a CTE2 of 330 in the range of 99.4 ppm / ℃, and a glass transition temperature of 335 in the range of approximately 130℃ to approximately 150℃. In one example, composition 1 355 has a viscosity of 340 in the range of approximately 3.0 Pa·s to approximately 3.5 Pa·s at 190℃ and a gelation point of 345 in the range of approximately 60 sec to approximately 130 sec at 190℃.

[0067] In another example, composition 2360 contains approximately 1.8 g / cm³. 3 Approximately 2.1 g / cm³ 3Composition 2 360 has a specific gravity in the range of 310 and a thermal conductivity in the range of approximately 0.72 W / m·K to approximately 0.89 W / m·K. Composition 2 360 also has a flexural modulus in the range of approximately 17.0 Gpa to approximately 19.0 Gpa, a CTE1 of approximately 26.2 ppm / ℃ to 325, a CTE2 of 45.3 ppm / ℃ to 330, and a glass transition temperature in the range of approximately 130℃ to approximately 150℃ to 335. In one example, composition 2 360 has a viscosity in the range of approximately 5.1 Pa·s to approximately 5.5 Pa·s at 190℃ and a gelation point in the range of approximately 60 sec to approximately 130 sec to 345 at 190℃.

[0068] As shown in Table 300, composition 3365 contains approximately 1.9 g / cm³ of saturation. 3 Approximately 2.1 g / cm³ 3 Composition 365 has a specific gravity in the range of 310 and a thermal conductivity in the range of approximately 0.90 W / m·K to approximately 0.91 W / m·K. Composition 365 also has a flexural modulus in the range of approximately 19.0 Gpa to approximately 21.1 Gpa, a CTE1 of approximately 15.4 ppm / ℃ to 325, a CTE2 of 26.4 ppm / ℃ to 330, and a glass transition temperature in the range of approximately 130℃ to approximately 150℃ to 335. In one example, composition 365 has a viscosity in the range of approximately 7.0 Pa·s to approximately 7.6 Pa·s at 190℃ and a gelation point in the range of approximately 60 sec to approximately 130 sec to 345 at 190℃.

[0069] In this example, composition 4370 is approximately 2.0 g / cm³. 3 Approximately 2.2 g / cm³ 3Composition 4 370 has a specific gravity in the range of 310 and a thermal conductivity in the range of approximately 0.96 W / m·K to approximately 1.1 W / m·K. Composition 4 370 also has a flexural modulus of 320 in the range of approximately 19.1 Gpa to approximately 26.0 Gpa, a CTE1 of 325 in the range of approximately 15.1 ppm / ℃, a CTE2 of 330 in the range of 24.0 ppm / ℃, and a glass transition temperature of 335 in the range of approximately 130℃ to approximately 150℃. In one example, composition 4 370 has a viscosity of 340 in the range of approximately 9.0 Pa·s to approximately 9.5 Pa·s at 190℃ and a gelation point of 345 in the range of approximately 60 sec to approximately 130 sec at 190℃.

[0070] Figure 4 shows a method 400 for preparing a bio-based EMC powder that may be used to prepare a bio-based EMC in one example. In this example, the materials used to prepare the EMC powder are materials 205 in Table 200, shown and described with respect to Figure 2.

[0071] In one example, Method 400 begins by drying various materials (e.g., additives and fillers) used to produce the EMC powder (410). The materials are dried for a duration and / or temperature that is at least partially based on the thermal properties of the material to avoid any moisture absorption. For example, any fillers, release agents, coupling agents, ion scavengers, flame retardants, and / or stress modifiers are dried using any suitable drying apparatus and / or technique. For example, basalt powder may be dried at 100°C for 3 hours, biodegradable wax may be dried at 100°C for 1 hour, ion scavengers may be dried at 100°C for 1 hour, and flame retardants may be dried at 100°C for 1 hour. Specific temperatures and times are discussed, but these are for illustrative purposes only.

[0072] Depending on the material to be dried, the individual components are weighed and then mixed (420). In one example, the weights of the various materials are at least partially based on a desired weight percentage of the material(s) and / or at least partially based on a desired EMC property. In addition, for the mixing process, the material is divided into a first subset of material and a second subset of material. For example, the first subset of material includes epoxy resin, curing agent, coupling agent, and stress modifier.

[0073] Once the first subset of materials is weighed, it is mixed together to form the first mixture. In one example, the first subset of materials is mixed in a high-speed centrifugal mixer at a rotational speed (RPM) ranging from approximately 300 to approximately 1000 RPM. In another example, the first subset of materials is mixed for a duration ranging from approximately 100 to approximately 500 seconds. For example, the first subset of materials may be mixed at 300 RPM for 100 seconds, at 500 RPM for 300 seconds, and / or at 1000 RPM for 500 seconds. In addition, the vacuum pressure is set to approximately 2 kilopascals (kPa). Although specific values ​​are given, other values ​​may be used when mixing the first subset of materials.

[0074] Once the second subset of materials is weighed, it is mixed together to form a second mixture. In one example, the second subset of materials includes a filler (e.g., basalt powder), a flame retardant, a release agent (e.g., wax), and an ion scavenger. In one example, the second subset of materials is mixed using a high-speed centrifugal mixer in the range of approximately 700 RPM to approximately 1500 RPM.

[0075] In one example, the second subset of materials is mixed for a duration ranging from approximately 300 to 500 seconds. For example, the second subset of materials may be mixed for 300 seconds at 700 RPM, 500 seconds at 1000 RPM, and / or 500 seconds at 1500 RPM. In addition, the vacuum pressure is set to approximately 2 kPa. Although a specific value is given, other values ​​may be used when mixing the second subset of materials. In one example, degassing is also performed during the mixing of the first and second subsets of materials to remove trapped air and / or volatile gases that may cause defects (e.g., voids or bubbles) in the final material.

[0076] In response to the mixing of a first subset of materials and then a second subset of materials, the first and second mixtures are mixed together to form an EMC composition. In one example, the first and second mixtures are mixed simultaneously at a rotation speed ranging from approximately 100 RPM to approximately 1500 RPM for a duration ranging from approximately 100 seconds to approximately 500 seconds. For example, the first and second mixtures are mixed at 100 RPM for 100 seconds, at 300 RPM for 300 seconds, at 1000 RPM for 500 seconds, and / or at 1500 RPM for 500 seconds. In addition, the vacuum pressure is set to approximately 2 kPa. Although specific values ​​are given, other values ​​may be used when mixing the first and second mixtures. In one example, degassing is also performed during the mixing of the various mixtures.

[0077] Method 400 also includes heating and extruding the composition (430). For example, in response to a first mixture and a second mixture being mixed together to form an EMC composition, the EMC composition is supplied to a three-dimensional (3D) composer, where it is subjected to heat and pressure. The 3D composer, along with the high temperature and high pressure, helps to ensure that the filler is well integrated and that the composition is extruded as a filament.

[0078] Once the composition is extruded, it is cooled and pelletized (440). For example, the composition is rapidly cooled and then cut into small pellets (e.g., using a shredder). The pellets are then ground into EMC powder (450), which is then used to produce the bio-based EMC of the present disclosure.

[0079] Figure 5 shows a method 500 for preparing a bio-based EMC as an example. In one example, method 500 can be used to prepare EMC 110 as shown and described in relation to Figure 1. In addition, method 500 may use EMC powder prepared using various operations of method 400 as shown and described in relation to Figure 4.

[0080] In one example, method 500 begins by drying a bio-based EMC powder (510). The EMC powder is dried for a duration and / or temperature that is at least partially based on the thermal properties of the bio-based EMC powder. For example, the EMC powder may be dried at a temperature of 80°C to 100°C for 1 to 2 hours.

[0081] Once the bio-based EMC powder is dried, it is compressed (for example, using hot press compression) (520). In one example, the EMC powder is subjected to hot press compression at a temperature of approximately 190°C for a duration ranging from approximately 3 minutes to approximately 15 minutes.

[0082] Next, the EMC powder is compressed into bio-based EMC (530), and then prepared for the characterization described above. The bio-based EMC is then cured (540). In one example, the bio-based EMC is cured at a temperature of approximately 190°C for a duration ranging from approximately 2 to approximately 7 hours.

[0083] Based on the above, an example of the present disclosure is epoxy molding for electronic devices. composition(EMC) comprising a bio-based filler having a first weight percentage in the range of 60 weight percent to 90 weight percent of the total material composition of the EMC, and a bio-based epoxy resin having a second weight percentage in the range of 1 weight percent to 30 weight percent of the total material composition of the EMC, epoxy molding composition is described. In one example, the bio-based filler is basalt powder. In one example, the EMC also includes a bio-based stress regulator having 3 weight percent or less of the total material composition of the EMC. In one example, the EMC also includes one or more of a curing agent, a mold release agent, a coupling agent, an ion scavenger, and a flame retardant. In one example, the EMC has a specific gravity in the range of 1 gram / cubic centimeter (g / cm 3 ) to 3 g / cm 3 . In one example, the EMC has a thermal conductivity in the range of 0.1 watt / meter / kelvin (W / m·K) to 3 W / m·K. In one example, the EMC has a flexural modulus in the range of 5 gigapascals (GPa) to 35 GPa. In one example, the EMC has a first coefficient of thermal expansion (CTE) in the range of 10 parts per million per degree Celsius (ppm / ℃) to 40 ppm / ℃ and a second CTE in the range of 20 ppm / ℃ to 110 ppm / ℃. In one example, the EMC has a glass transition temperature in the range of 80 degrees Celsius (℃) to 160℃. In one example, the EMC has a viscosity in the range of 2 pascal seconds (Pa·s) to 20 Pa·s at a temperature of 190 degrees Celsius (℃). In one example, the EMC has a gel point in the range of 42 seconds to 180 seconds at a temperature of 190 degrees Celsius (℃).

[0084] The example also relates to epoxy molding for electronic devices composition (EMC) comprising a bio-based filler means having a first weight percentage in the range of 60 weight percent to 90 weight percent of the total material composition of the EMC, and an epoxy resin means having a second weight percentage in the range of 1 weight percent to 30 weight percent of the total material composition of the EMC, epoxy molding compositionThe following describes the following: In one example, the bio-based filling means is basalt powder. In one example, the epoxy resin means is a bio-based epoxy resin. In one example, the EMC also includes a bio-based stress modification means having 3 weight percent or less of the total material composition of the EMC. In one example, the EMC also includes one or more of the curing means, release means, coupling means, ion trapping means, and flame retardant means. In one example, the EMC has a thermal conductivity in the range of 0.1 watts / meter / kelvin (W / m·K) to 3 watts / m·K. In one example, the EMC has a flexural modulus in the range of 5 gigapascals (GPa) to 35 gPa.

[0085] Another example is an electronic device comprising a substrate, a semiconductor die communicatively coupled to the substrate, and a bio-based epoxy molding that encloses the semiconductor die. composition This describes an electronic device that includes (EMC), wherein the bio-based EMC consists of at least 90 weight percent of bio-based material. In one example, the bio-based EMC includes basalt powder.

[0086] The descriptions and examples of one or more aspects provided in this disclosure are not intended in any way to limit or restrict the scope of this disclosure. The aspects, examples, and details provided in this disclosure are considered sufficient to convey proprietary rights and enable others to create and use the best form of the claimed disclosure.

[0087] The claimed disclosure should not be construed as being limited to any aspects, examples, or details provided herein. Various features (both structural and methodological), whether shown and described together or separately, are intended to be selectively rearranged, included, or omitted to produce embodiments having a particular set of features. While the description and examples of this application have been provided, those skilled in the art may envision variations, modifications, and alternative embodiments that fall within the spirit of a broader aspect of the general inventive concept embodied herein, without departing from the broader scope of the claimed disclosure.

[0088] Aspects of the present disclosure are described above with reference to schematic flowcharts and / or schematic block diagrams of methods, apparatus, systems, and computer program products according to embodiments of the present disclosure. Each block in the schematic flowcharts and / or schematic block diagrams, and combinations of blocks within the schematic flowcharts and / or schematic block diagrams, will be understood to be implementable by computer program instructions. These computer program instructions may be provided to a computer processor or other programmable data processing device to produce a machine such that instructions executed via the processor or other programmable data processing device produce means for performing functions and / or operations specified in one or more blocks of the schematic flowcharts and / or schematic block diagrams. In addition, aspects of the flowcharts and / or flowcharts are intended to be combined and / or executed in any order.

[0089] References to elements in this specification using designations such as "First," "Second," etc., generally do not limit the number or order of those elements. Rather, these designations can be used as a way to distinguish two or more elements or examples of elements. Thus, references to the First and Second elements do not mean that only two elements may be used, or that the First element precedes the Second element. In addition, unless otherwise specified, a set of elements may include one or more elements.

[0090] As used in the description or claims, terms of the form "at least one of A, B, or C" or "A, B, C, or any combination thereof" mean "A, B, or C, or any combination of these elements." For example, this term may include A or B, or C, or A and B, or A and C, or A and B and C, or 2A, or 2B, or 2C, or 2A and B, etc. As an additional example, "at least one of A, B, or C" is intended to include A, B, C, AB, AC, BC, and ABC, as well as multiples of the same member. Similarly, "at least one of A, B, and C" is intended to include A, B, C, AB, AC, BC, and ABC, as well as multiples of the same member.

[0091] Similarly, as used herein, the phrase “and / or” referring to a list of linked items refers to any combination of items. For example, “A and / or B” is intended to include A alone, B alone, or A and B together. As another example, “A, B, and / or C” is intended to include A alone, B alone, C alone, a combination of A and B, a combination of A and C, a combination of B and C, or a combination of A, B, and C.

Claims

1. Epoxy molding compounds (EMCs) for electronic devices, A bio-based filler material having a first weight percentage in the range of 60 to 90 weight percent of the total material composition of the EMC, An epoxy molding compound comprising a bio-based epoxy resin having a second weight percentage in the range of 1 weight percent to 30 weight percent of the total material composition of the EMC.

2. The EMC according to claim 1, wherein the bio-based filling material is basalt powder.

3. The EMC according to claim 1, further comprising a bio-based stress modifier having 3% by weight or less of the total material composition of the EMC.

4. The EMC according to claim 1, further comprising one or more of a curing agent, a release agent, a coupling agent, an ion scavenger, and a flame retardant.

5. The aforementioned EMC is 1 gram / cubic centimeter (g / cm³). ３ ) ~3 g / cm ３ The EMC according to claim 1, having a specific gravity within the range of [specify range].

6. The EMC according to claim 1, wherein the EMC has a thermal conductivity in the range of 0.1 watts / meter / kelvin (W / m·K) to 3 W / m·K.

7. The EMC according to claim 1, wherein the EMC has a flexural modulus in the range of 5 gigapascals (GPa) to 35 GPa.

8. The EMC according to claim 1, wherein the EMC has a first coefficient of thermal expansion (CTE) in the range of parts per million / degree Celsius (ppm / °C) to 40 ppm / °C, and a second CTE in the range of 20 ppm / °C to 110 ppm / °C.

9. The EMC according to claim 1, wherein the EMC has a glass transition temperature in the range of 80 degrees Celsius (°C) to 160 degrees Celsius.

10. The EMC according to claim 1, wherein the EMC has a viscosity in the range of 2 Pascal seconds (Pa·s) to 20 Pa·s at a temperature of 190 degrees Celsius (°C).

11. The EMC according to claim 1, wherein the EMC has a gelation point in the range of 42 seconds to 180 seconds at a temperature of 190 degrees Celsius (°C).

12. Epoxy molding compounds (EMCs) for electronic devices, A bio-based filling means having a first weight percentage in the range of 60 to 90 weight percent of the total material composition of the EMC, An epoxy molding compound comprising an epoxy resin means having a second weight percentage in the range of 1 weight percent to 30 weight percent of the total material composition of the EMC.

13. The EMC according to claim 12, wherein the bio-based filling means is basalt powder.

14. The EMC according to claim 12, wherein the epoxy resin means is a bio-based epoxy resin.

15. The EMC according to claim 12, further comprising a bio-based stress modifier having 3 weight percent or less of the total material composition of the EMC.

16. The EMC according to claim 12, further comprising one or more of the curing means, release means, coupling means, ion capturing means, and flame retardant means.

17. The EMC according to claim 12, wherein the EMC has a thermal conductivity in the range of 0.1 watts / meter / kelvin (W / m·K) to 3 W / m·K.

18. The EMC according to claim 12, wherein the EMC has a flexural modulus in the range of 5 gigapascals (GPa) to 35 GPa.

19. It is an electronic device, circuit board and A semiconductor die, which is communicatively coupled to the aforementioned substrate, An electronic device comprising a bio-based epoxy molding compound (EMC) for encapsulating the semiconductor die, wherein the bio-based EMC is composed of at least 90 weight percent of a bio-based material.

20. The bio-based EMC is the electronic device according to claim 19, comprising basalt powder.

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