Indication device

Abstract

The present invention provides a display device that can improve touch sensitivity at the edges of the screen. [Solution] A display device according to one or more embodiments of this specification includes a display panel including a plurality of pixel driving circuits, a touch panel configured on the display panel, and touch auxiliary lines configured on the display panel or touch panel. The touch panel includes first to n (n is a natural number of 4 or more) touch driving lines, and first to m (m is a natural number of 4 or more) touch sensing lines configured to form mutual capacitance with adjacent touch driving lines among the first to n touch driving lines. The touch auxiliary lines are spaced apart from each end of the first to n touch driving lines and are configured to form mutual capacitance with at least a portion of the first to m touch sensing lines.

Description

Technical Field

[0001] This specification relates to a display device.

Background Art

[0002] Display devices are applied to various electronic devices such as televisions, mobile phones, notebook computers, and tablets.

[0003] Display devices include an organic light emitting display device (Organic Light Emitting Display apparatus) that outputs light by itself, a liquid crystal display device (Liquid Crystal Display apparatus) that requires a separate light source, and the like.

[0004] In recent years, display devices including light emitting devices (Light Emitting Device) have attracted attention as next-generation display devices. Since the light emitting device is made of an inorganic substance instead of an organic substance, it has a faster lighting speed, excellent luminous efficiency, and can display images with high brightness compared to liquid crystal display devices and organic light emitting display devices.

[0005] Electronic devices that use a display device as a display screen provide a touch screen type user interface for the convenience of user input. Display devices capable of touch interface processing have been developed to provide more diverse functions. For example, display devices with a touch panel that can perform touch sensing not only by finger touch but also by a touch pen (or a stylus pen) are widely used.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The inventors of this specification recognized that touch sensitivity (or touch performance) decreases at the edge portion of a screen in a display device including a mutual-capacitance type touch electrode layer, and conducted various studies and experiments to improve touch sensitivity at the edge portion of the screen. Through various studies and experiments, the inventors of this specification invented a new display device that can improve touch sensitivity at the edge portion of the screen.

[0007] This specification aims to provide a display device that can improve touch sensitivity at the edges of the screen.

[0008] This specification aims to provide a display device with a simplified structure and low power consumption.

[0009] The problems described herein are not limited to those mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0010] A display device according to one or more embodiments of this specification includes a display panel including a plurality of pixel driving circuits, a touch panel configured on the display panel, and touch auxiliary lines configured on the display panel or touch panel. The touch panel includes first to n (n is a natural number of 4 or more) touch driving lines, and first to m (m is a natural number of 4 or more) touch sensing lines configured to form mutual capacitance with adjacent touch driving lines among the first to n touch driving lines. The touch auxiliary lines are spaced apart from each end of the first to n touch driving lines and are configured to form mutual capacitance with at least some of the first to m touch sensing lines.

[0011] Specific details relating to various forms of this specification other than the means of solving the problems mentioned above are included in the following description and drawings.

[0012] A display device according to one or more embodiments of this specification can improve touch sensitivity at the edges of the screen.

[0013] The display devices according to one or more embodiments of this specification can reduce power consumption, thereby achieving environmental, social, and governance benefits.

[0014] According to one or more embodiments of this specification, instead of directly forming pixel circuits on the substrate to drive light-emitting elements configured in each of a plurality of subpixels, the structure of the display device can be simplified by mounting a pixel driving circuit (or pixel driving integrated circuit) in which the pixel circuits are integrated onto the substrate, which may enable highly efficient and low-power operation of the display device.

[0015] The effects described herein are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims. [Brief explanation of the drawing]

[0016] [Figure 1] This is an exploded perspective view showing a display device according to the embodiments described herein. [Figure 2] This is a plan view of a display device according to an embodiment of this specification. [Figure 3] This is an enlarged view of a display device according to the embodiments described herein. [Figure 4] This figure shows the circuit structure according to the examples described herein. [Figure 5] This is a plan view of a display device according to an embodiment of this specification. [Figure 6] This is a plan view of a display device according to an embodiment of this specification. [Figure 7] This is a plan view of a display device according to an embodiment of this specification. [Figure 8] Figure 2 shows a cross-sectional view along the line I-I'. [Figure 9]Cross-sectional view of the first light-emitting element according to an embodiment of the present specification. [Figure 10] Diagram showing the driving timing of the display panel and the touch panel according to an embodiment of the present specification. [Figure 11] Planar view showing the electrode structure of the touch panel according to an embodiment of the present specification. [Figure 12] Enlarged view of "A" shown in FIG. 11. [Figure 13] Cross-sectional view of line II-II' shown in FIG. 12. [Figure 14] Diagram showing the output signal of the touch drive circuit according to an embodiment of the present specification. [Figure 15] Diagram showing the capacitance formed in the edge sensing lines of the touch panel shown in FIGS. 11 and 12. [Figure 16] Diagram showing the capacitance formed in the intermediate sensing lines of the touch panel shown in FIGS. 11 and 12. [Figure 17] Diagram showing the output signal of the touch drive circuit according to another embodiment of the present specification. [Figure 18] Diagram showing the touch panel of the display device according to another embodiment of the present specification. [Figure 19] Diagram showing the second electrode and the touch panel in the display device according to another embodiment of the present specification. [Figure 20] Enlarged view of "B" shown in FIG. 19. [Figure 21] Cross-sectional view of line III-III' shown in FIG. 20. [Figure 22] Diagram showing the touch panel of the display device according to another embodiment of the present specification. [Figure 23] Diagram showing the device to which the display device according to the embodiment of the present specification is applied. [Figure 24] Diagram showing the device to which the display device according to the embodiment of the present specification is applied. [Figure 25] Diagram showing the device to which the display device according to the embodiment of the present specification is applied. [Figure 26]This figure shows an apparatus to which the display device according to the embodiments of this specification is applied. [Modes for carrying out the invention]

[0017] The advantages and features of this specification, and how they are achieved, will become clearer with reference to one embodiment described in detail below, along with the accompanying figures. However, this specification is not limited to the embodiments disclosed below, and can be realized in a variety of different forms. This embodiment is provided merely to complete the disclosure of this specification and to fully inform those who are ordinary skill in the art to which this specification belongs of the scope of the invention.

[0018] For the purpose of illustrating the embodiments described herein, the shapes, sizes, areas, ratios, angles, numbers, etc., shown in the figures are illustrative and not limiting to what is shown in the figures. Throughout this specification, the same reference numeral refers to the same component. In the description herein, if it is determined that a specific description of the relevant prior art would unnecessarily obscure the gist of this specification, such detailed description will be omitted. When using "includes," "has," "becomes," etc., as referred to herein, other parts may be added unless "only" is used. When a component is expressed singularly, it includes cases where it includes multiple components unless otherwise explicitly stated.

[0019] In interpreting the constituent elements, even if there is no separate explicit description, it shall be interpreted as including a margin of error.

[0020] When describing the relative positions of two parts, for example, using phrases like "on top of," "above," "below," or "next to," one or more other parts can be located between the two parts, unless "immediately" or "directly" is used.

[0021] When describing temporal relationships, for example, when describing sequential relationships using phrases like "after," "following," "next," or "before," it can include non-continuous events unless "immediately" or "directly" is used.

[0022] The terms "first," "second," etc., are used to describe various components, but these components are not limited to these terms. These terms are used simply to distinguish one component from others. Therefore, the first component mentioned below may also be the second component within the technical concepts of this specification.

[0023] In describing the components of this specification, terms such as 1st, 2nd, A, B, (a), (b), etc., may be used. Such terms are used to distinguish a component from other components, and the terms do not limit the nature, order, sequence, or number of the component.

[0024] Where one component is described as “connecting,” “joining,” “connecting,” “contacting,” or “adhering” to another component, it should be understood that the component may directly connect, join, connect, contact, or adhere to the other component, but that other components may also “intersect” between each component that can indirectly connect, join, connect, contact, or adhere, unless otherwise explicitly stated.

[0025] Where a component or layer is described as "in contact" or "superimposed" on another component or layer, it should be understood that the component may be in direct contact with or superimposed on the other component or layer, but that one or more other components or layers may be interposed between each component or layer that may be indirectly in contact with or superimposed on, unless otherwise explicitly stated.

[0026] The term "at least one" should be understood to include all possible combinations of one or more related items. For example, "at least one of items 1, 2, and 3" can mean not just each of items 1, 2, or 3 individually, but all possible combinations of two or more items from items 1, 2, and 3.

[0027] The "first direction," "second direction," "third direction," "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted solely as geometric relationships where they are perpendicular to each other, but can have broader directions within the scope in which the configuration of this specification can function.

[0028] Each of the features of the many examples described herein can be partially or entirely combined or combined with one another, enabling a variety of technically diverse interoperability and drive, and each embodiment can be implemented independently of the others or together in a related manner.

[0029] The embodiments of this specification will be described in detail below with reference to the attached figures. Furthermore, for the sake of convenience of explanation, the scales, dimensions, sizes, and thicknesses of the components shown in the figures are not limited to those shown in the figures, as they may have different scales, dimensions, sizes, and thicknesses than those in reality.

[0030] Figure 1 is an exploded perspective view showing a display device according to the embodiments described herein.

[0031] Referring to Figure 1, the display device 1000 according to the embodiment of this specification may include a display panel 100, a touch panel 200, and a touch assist line 400.

[0032] The display panel 100 can be configured to display information, videos, and / or images provided to the user on the screen. For example, the display panel 100 may be a light-emitting display panel that includes a plurality of pixels having light-emitting elements.

[0033] The touch panel 200 can be positioned (or configured) to overlap the display panel 100 vertically. The touch panel 200 can be configured to sense user touch on the display panel 100. For example, the touch panel 200 can be configured to sense user touch via a stylus or finger.

[0034] A touch panel 200 according to one embodiment of this specification may include a touch electrode layer configured such that first to n (where n is a natural number greater than or equal to 4) touch drive lines (or a plurality of first touch lines) and first to m (where m is a natural number greater than or equal to 4) touch sensing lines (or a plurality of second touch lines) intersect. For example, the touch panel 200 may be configured to sense changes in the mutual capacitance between the touch drive lines and the touch sensing lines due to user touch. For example, the touch panel 200 (or touch electrode layer) may include an electrode structure corresponding to a mutual capacitance scheme.

[0035] The touch assist line 400 can be configured to improve touch sensitivity (or touch performance) at the edges of the screen. For example, the touch assist line 400 can be placed (or configured) on the display panel 100 or the touch panel 200.

[0036] A touch assist line 400 according to one embodiment of this specification may be positioned (or configured) to be spaced apart from each end of the first to nth touch drive lines and to form mutual capacitance with at least a portion of the first to mth touch sensing lines. For example, the touch assist line 400 may be positioned (or configured) to increase or add capacitance to the first and mth touch sensing lines among the first to mth touch sensing lines that are positioned (or configured) at the edge of the screen. For example, the touch assist line 400 may be positioned (or configured) to increase the overall capacitance of each of the first and mth touch sensing lines. This increases (or reinforces) the capacitance between each of the first and mth touch sensing lines positioned at the edge of the screen and the touch assist line 400, thereby improving touch sensitivity (or touch performance) at the edge of the screen.

[0037] The display device 1000 according to the embodiments of this specification may further include a cover member 120, a support substrate 190, and a drive circuit unit 300.

[0038] The cover member 120 can be placed (or configured) on the display panel 100. The cover member 120 may be a member for protecting the display panel 100. The cover member 120 may be made of a transparent material. For example, the cover member 120 may be a cover window or cover glass.

[0039] The support substrate 190 can be positioned (or configured) on the back of the display panel 100. The support substrate 190 can be configured to reinforce the rigidity of the display panel 100. For example, the support substrate 190 can be made of a plastic or metallic material. The support substrate 190 can be a backplate.

[0040] A portion of the display panel 100 can be bent to wrap around the side of the support substrate 190 and positioned on the back of the support substrate 190.

[0041] The drive circuit unit (or display drive circuit unit) 300 can be configured to be electrically connected to the display panel 100. The drive circuit unit can be configured to generate signals necessary to display (or materialize) an image on the screen of the display panel 100 and to supply these signals to the display panel 100. The drive circuit unit 300 may include a flexible circuit board 310 and a printed circuit board 330.

[0042] The flexible circuit board 310 and the printed circuit board 330 can be positioned below the display panel 100. The flexible circuit board 310 and the printed circuit board 330 can be positioned at least at one end of the display panel 100. One side of the flexible circuit board 310 can be attached to the display panel 100, and the other side can be attached to the printed circuit board 330. The flexible circuit board 310 may be a flexible film.

[0043] The flexible circuit board 310 and the printed circuit board 330 can be placed on the back of the support board 190. The support board 190 can be placed between the display panel 100 and the printed circuit board 330.

[0044] The printed circuit board 330 may, but is not limited to, include at least one hole 331. An internal component that senses ambient light, temperature, etc., which can be provided to multiple sensors, may be placed in the area corresponding to at least one hole 331. For example, the internal component may, but is not limited to, an ambient light sensor or a temperature sensor. For example, the hole 331 may, but is not limited to, a transparent hole.

[0045] The drive circuit unit 300 can be electrically connected to the touch panel 200. The drive circuit unit 300 can be electrically connected to the first to nth touch drive lines, the first to mth touch sensing lines, and the touch auxiliary line 400. The drive circuit unit 300 can be configured to supply touch drive signals to each of the first to nth touch drive lines and to supply auxiliary drive signals synchronized with the touch drive signals to the touch auxiliary line 400. The drive circuit unit 300 can be configured to sense the capacitance changes of each of the first to mth touch sensing lines, generate touch coordinate data corresponding to the user's touch position, and provide it to the host control unit.

[0046] The display device 1000 according to the embodiments of this specification may further include a polarizing layer 180 and an adhesive layer 185.

[0047] The polarizing layer 180 can be placed on the display panel 100. The polarizing layer 180 can be placed (or interposed) between the display panel 100 and the cover member 120. For example, the polarizing layer 180 can be placed on the touch panel 200. The polarizing layer 180 can be placed (or interposed) between the touch panel 200 and the cover member 120. The polarizing layer 180 can be configured to prevent or reduce light generated from an external light source from entering the inside of the display panel 100 and affecting the light-emitting elements, etc.

[0048] The adhesive layer 185 can adhere the cover member 120 to the display panel 100. The adhesive layer 185 is positioned (or interposed) between the polarizing layer 180 and the cover member 120, allowing the cover member 120 to adhere to the polarizing layer 180. The adhesive layer 185 may include optically cleared adhesive, optically cleared resin, or pressure-sensitive adhesive.

[0049] The touch panel 200 according to other embodiments of this specification may be interposed or positioned between the display panel 100 and the cover member 120. For example, the touch panel 200 may be interposed or positioned between the cover member 120 and the polarizing layer 180. The touch panel 200 may be connected to or attached to the back surface of the cover member 120 by a transparent adhesive member.

[0050] Figure 2 is a plan view of a display device according to an embodiment of this specification. Figure 3 is an enlarged view of a display device according to an embodiment of this specification.

[0051] Referring to Figures 2 and 3, the display device 1000 may include a display panel 100, a flexible circuit board 310, and a printed circuit board 330.

[0052] The display panel 100 may include a substrate 110. The substrate 110 may be a member that supports other components of the display device 1000. The substrate 110 may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. The substrate 110 may also be made of a flexible material. For example, the substrate 110 may be made of a flexible plastic material such as polyimide, but is not limited to this.

[0053] The display panel 100 may include a display area (AA) and a non-display area (NA). The display panel 100 may include a display area (AA) and a non-display area (NA). The display area (AA) and non-display area (NA) may be described not only in relation to the substrate 110, but also in relation to the entire display device 1000.

[0054] The display area (AA) may be the area (or screen) on which the image is displayed. The display area (AA) may contain multiple pixels (PX). Each of the multiple pixels (PX) may consist of multiple subpixels. For example, each of the multiple pixels (PX) may contain multiple subpixels. Each of the multiple subpixels may contain multiple light-emitting elements. The multiple light-emitting elements may be configured differently depending on the type of display device 1000. For example, if the display device 1000 is an inorganic light-emitting display device, the light-emitting elements may be LEDs (light-emitting diodes), micro-LEDs (micro light-emitting diodes), or mini-LEDs (mini light-emitting diodes).

[0055] The display area (AA) can be configured in various shapes depending on the design of the display device 1000. For example, the display area (AA) can be configured in a rectangular shape with rounded corners, but is not limited to this. As another example, the display area (AA) can be configured in a rectangular or circular shape with right-angled corners, but is not limited to this.

[0056] Referring to Figure 3, multiple pixel driver circuits (PDs) can be arranged in the display area (AA). These multiple pixel driver circuits (PDs) may be circuits for driving multiple sub-pixel light-emitting elements. Each of these multiple pixel driver circuits (PDs) may include multiple transistors, including a drive transistor, and storage capacitors, and can supply control signals, power, and drive current to the multiple sub-pixel light-emitting elements to control the light-emitting operation of the multiple elements. For example, each of these multiple pixel driver circuits (PDs) may be electrically connected to power supply wiring and signal wiring for controlling the on / off and / or light-emitting time of the light-emitting elements, which are arranged (or configured) in the display area (AA). For example, each of these multiple pixel driver circuits (PDs) may be a single, minute semiconductor packaging element containing multiple transistors and storage capacitors, as a microchip, pixel driver chip, or chipset. Each of these multiple pixel driver circuits (PDs) may be, but is not limited to, a drive driver manufactured on a semiconductor substrate using a MOSFET (metal oxide silicon field-effect transistor) manufacturing process. A drive driver may include multiple pixel driver circuits (PDs) and drive multiple sub-pixels.

[0057] The non-display area (NA) may be an area surrounding the display area (AA). The non-display area (NA) may be an area where no image is displayed. The non-display area (NA) may include various wiring and drive circuits for driving multiple pixels (PX) arranged (or configured) in the display area (AA). For example, various wiring and drive circuits can be mounted in the non-display area (NA), and pads (PADs) to which integrated circuits and printed circuit boards are connected can be placed, but are not limited to these.

[0058] According to one embodiment of this specification, the drive circuit may include a drive integrated circuit (or display drive circuit) 311. For example, the drive circuit may be a data drive circuit and / or a gate drive circuit, but is not limited thereto. Wiring may be provided in the non-display area (NA) to supply control signals for controlling the drive circuit. For example, the control signals may include, but are not limited to, various timing signals, including a clock signal, an input data enable signal, and a synchronization signal. For example, the control signals may be received via a pad section (PAD). For example, link wiring (LL) for transmitting signals may be provided in the non-display area (NA). For example, the pad section (PAD) may be electrically connected to the drive circuit of the drive circuit section 300.

[0059] According to one embodiment of this specification, the non-display area (NA) may include a first non-display area (NA1), a bendable area (BA), and a second non-display area (NA2). For example, the first non-display area (NA1) may be an area surrounding at least a portion of the display area (AA). The bendable area (BA) is an area extending from at least one of the multiple sides of the first non-display area (NA1) and may be a bendable area. The second non-display area (NA2) is an area extending from the bendable area (BA) and may have a pad portion (PAD) placed thereon. For example, the bendable area (BA) may be in a bent state, and the remaining area of ​​the substrate 110 excluding the bendable area (BA) may be in a flat state. In this case, the bending of the bendable area (BA) may cause the second non-display area (NA2) to be located on the back of the display area (AA), but is not limited thereto.

[0060] According to one embodiment of this specification, a plurality of link wirings (LL) can be arranged in the non-display area (NA). The plurality of link wirings (LL) may be wiring that transmits various signals from one or more flexible circuit boards (or flexible films) 310 and printed circuit boards 330 to the display area (AA). The plurality of link wirings (LL) extend from a plurality of pad electrodes (PE) in the second non-display area (NA2) toward the bending area (BA) and the first non-display area (NA1), and can be electrically connected to a plurality of drive wirings (VL) in the display area (AA). Multiple pixel drive circuits (PDs) can be driven by receiving signals from one or more flexible circuit boards (or flexible films) 310 and printed circuit boards 330 via the drive wirings (VL) in the display area (AA) and the link wirings (LL) in the non-display area (NA).

[0061] According to one embodiment of this specification, the multiple drive lines (VL), together with the multiple link lines (LL), may be wiring for transmitting signals output from the flexible circuit board 310 and the printed circuit board 330 to the multiple pixel drive circuits (PD). The multiple drive lines (VL) may be arranged in the display area (AA) and electrically connected to each of the multiple pixel drive circuits (PD). The multiple drive lines (VL) may extend from the display area (AA) toward the non-display area (NA) and be electrically connected to the multiple link lines (LL). Thus, signals output from the flexible circuit board 310 and the printed circuit board 330 can be transmitted to each of the multiple pixel drive circuits (PD) via the multiple link lines (LL) and the multiple drive lines (VL).

[0062] According to one embodiment of this specification, when the bending region (BA) bends, a portion of the multiple link wiring (LL) may also bend. Stress can concentrate on the portion of the bent link wiring (LL), potentially causing cracks to form in the link wiring (LL). Therefore, the multiple link wiring (LL) can be made of a highly flexible conductive material to reduce cracking when the bending region (BA) is bent. For example, the multiple link wiring (LL) can be made of a highly flexible conductive material such as gold (Au), silver (Ag), or aluminum (Al), but is not limited to these. Alternatively, the multiple link wiring (LL) can be made of one of the various conductive materials used in the display region (AA). The multiple link wiring (LL) can be made of a multilayer structure containing various conductive materials. For example, the multiple link wiring (LL) can be made of a triple layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti), but is not limited to these.

[0063] Multiple link wirings (LLs) can be configured in various shapes to reduce stress. At least a portion of the multiple link wirings (LLs) arranged on a bending region (BA) can extend in the same direction as the extension of the bending region (BA), or in a different direction to reduce stress. For example, if the bending region (BA) extends in one direction from a first non-displaying region (NA1) to a second non-displaying region (NA2), at least a portion of the link wirings (LLs) arranged on the bending region (BA) can extend in a direction inclined from that direction. As another example, at least a portion of the multiple link wirings (LLs) can be configured in various shapes. For example, at least a portion of the multiple link wirings (LLs) arranged on a bending region (BA) may be a shape in which conductive patterns having at least one of the following shapes are repeatedly arranged: diamond, rhombus, trapezoidal, triangular, sawtooth, sinusoidal, circular, and omega (Ω) shapes. Therefore, in order to minimize the stress concentrated in the multiple link wirings (LLs) and the resulting cracks, the shape of the multiple link wirings (LLs) can be, but is not limited to, the shapes described above.

[0064] In one embodiment of this specification, the width of a second non-display area (NA2) where multiple pad electrodes (PE) are arranged may be wider than the width of a bent area (BA) where only multiple link wirings (LL) are arranged. Similarly, the width of a display area (AA) where multiple subpixels are arranged may be wider than the width of a bent area (BA) where only multiple link wirings (LL) are arranged. In the figure, the width of the bent area (BA) is shown to be narrower than the width of other areas of the substrate 110, but the shape of the substrate 110 including the bent area (BA) is illustrative and not limited thereto.

[0065] A pad section (PAD) containing multiple pad electrodes (PE) can be arranged in the second non-display area (NA2). One or more flexible circuit boards 310 can be attached to or bonded to the pad section (PAD). The multiple pad electrodes (PE) of the pad section (PAD) are electrically connected to one or more flexible circuit boards 310, and can transmit various signals (or power) received from the printed circuit board 330 and the flexible circuit boards 310 to multiple pixel driving circuits (PD) in the display area (AA).

[0066] The flexible circuit board 310 may be a film on which various components are arranged on a flexible base film. For example, the flexible circuit board 310 may have a drive integrated circuit 311 which includes one or more gate driver integrated circuits and data driver integrated circuits, but is not limited to this. The drive integrated circuit 311 may be a component which processes data and drive signals for displaying an image. The drive integrated circuit 311 may have a drive integrated circuit 311 which can be arranged by methods such as chip-on-glass, chip-on-film, or tape carrier package, depending on the mounting method. The flexible circuit board 310 may have a drive integrated circuit 310 which can be attached to or bonded to a plurality of pad electrodes (PE) via a conductive adhesive layer, but is not limited to this.

[0067] The printed circuit board 330 may be a component that is electrically connected to one or more flexible circuit boards 310 and supplies signals to the drive integrated circuit 311. The printed circuit board 330 is located on one side of the flexible circuit board 310 and can be electrically connected to the flexible circuit board 310. The printed circuit board 330 can further contain circuit components such as memory and various passive circuit elements for supplying various signals to the drive integrated circuit 311.

[0068] The drive circuit 300 according to the embodiments of this specification may further include a timing controller 350 and a power management integrated circuit 370.

[0069] The timing controller 350 can be mounted on the printed circuit board 330. The timing controller 350 receives video data and timing synchronization signals from the host control unit, converts the video data into pixel data and provides it to the drive integrated circuit 311, and can control the drive timing of the drive integrated circuit 311 and each of the multiple pixel drive circuits (PDs) based on the timing synchronization signals. For example, the timing controller 350 can be built into the drive integrated circuit 311 or mounted (or configured) inside the drive integrated circuit 311.

[0070] The power management integrated circuit (or power drive unit or power generation circuit) 370 can be configured to generate and output various power supplies necessary for driving the display device 1000. For example, the power management integrated circuit 370 can be configured to generate and output a power supply voltage, reference voltage, cathode-on voltage, cathode-off voltage, etc., based on the input power supply and under the control of the timing controller 350. For example, the drive voltage may be a voltage for driving a drive circuit or integrated circuit, the reference voltage may be a voltage for adjusting (or determining) the brightness (or luminance) of the image or light emitted from the light-emitting element displayed in the display area (AA), the cathode-on voltage may be a voltage for turning on (or emitting light) the light-emitting element, and the cathode-off voltage may be a voltage for turning off the light-emitting element. For example, the cathode-on voltage may be a first common voltage or a first low-potential power supply voltage, and the cathode-off voltage may be a second common voltage or a second low-potential power supply voltage, but is not limited thereto.

[0071] The drive circuit section 300 according to the embodiments of this specification may further include a touch drive circuit (or touch integrated circuit) 390.

[0072] The touch drive circuit 390 can be configured to electrically connect to the first to nth touch drive lines, the first to mth touch sensing lines, and the touch auxiliary line 400 of the touch panel 200. The touch drive circuit 390 can, but is not limited to, supplying touch drive signals to the first to nth touch drive lines and auxiliary drive signals to the touch auxiliary line 400 in response to touch synchronization signals supplied from the timing controller 350, generating touch raw data corresponding to the capacitance changes of each of the first to mth touch sensing lines, and providing the generated touch raw data to the timing controller 350 or the host control unit. For example, the touch drive circuit 390 can also be configured to generate touch coordinate data based on the touch raw data and provide it to the host control unit. For example, the touch drive circuit 390 can be integrated into or built into the drive integrated circuit 311.

[0073] The timing controller 350 can be configured to control the voltage output from the power management integrated circuit 370 based on user touch information provided by the touch drive circuit 390 or the host control unit. For example, when a user adjusts the brightness (or luminance) of the display device 1000 screen via the touch panel 200 or button operation, the timing controller 350 can be configured to provide the power management integrated circuit 370 with reference voltage data and cathode-off voltage data (or second common voltage data) based on screen brightness data corresponding to the screen brightness set by the user. The power management integrated circuit 370 can be configured to generate and output the reference voltage and cathode-off voltage based on the reference voltage data and cathode-off voltage data provided by the timing controller 350, respectively.

[0074] Figure 4 shows the circuit structure according to the embodiments described herein. Figure 4 shows one microdriver included in each of the multiple pixel driving circuits shown in Figure 3.

[0075] Figure 4 illustrates, but is not limited to, a single light-emitting element (ED) being connected to a microdriver (MD). For example, eight light-emitting elements (EDs) can be connected to one microdriver (MD). For example, eight light-emitting elements (EDs) on different lines (or horizontal lines or low lines) can be connected to one microdriver (MD). As another example, sixteen light-emitting elements (EDs) can be connected to one microdriver (MD), or thirty-two or sixty-four light-emitting elements (EDs) can be connected to one microdriver (MD) simultaneously (or commonly). For example, a light-emitting element (ED) may be a micro-light-emitting element, a micro-light-emitting diode, or a micro-light-emitting diode chip. For example, a light-emitting element (ED) can have a scale of 1 μm to 100 μm, but is not limited to this.

[0076] A single microdriver (MD) can be configured to apply a drive current (or data current) to a light-emitting element (ED) based on a scan signal (or reference voltage) and an illumination signal. A single microdriver (MD) according to one embodiment of this specification may include, but is not limited to, a drive transistor (TDR) and an illumination transistor (TEM).

[0077] According to one embodiment of this specification, a high-potential power supply voltage (VDD) is applied to the first electrode of a drive transistor (TDR), the first electrode of a light-emitting transistor (TEM) is connected to the second electrode of the drive transistor (TDR), and a scan signal (SC) can be applied to the gate electrode of the drive transistor (TDR). The scan signal (SC) applied to the gate electrode of the drive transistor (TDR) is a DC power supply, and a fixed reference voltage (Vref) can be applied for each frame, but is not limited to this. For example, the reference voltage (Vref) can be changed for each frame or more. For example, the reference voltage (Vref) can be adjusted (or varied) according to the brightness of the screen by user operation (or setting).

[0078] According to one embodiment of this specification, the second electrode of a drive transistor (TDR) is connected to the first electrode of a light-emitting transistor (TEM), a light-emitting element (ED) is connected to the second electrode of the light-emitting transistor (TEM), and a light-emitting signal (EM) can be applied to the gate electrode of the light-emitting transistor (TEM). The light-emitting signal (EM) applied to the gate electrode of the light-emitting transistor (TEM) may be, but is not limited to, a pulse width modulation signal that varies from frame to frame. For example, the light-emitting signal (EM) may include a duty-on interval that turns on the light-emitting transistor (TEM) and a duty-off interval that turns off the light-emitting transistor (TEM). For example, the duty-on interval of the light-emitting signal (EM) can be set (or adjusted) by the grayscale corresponding to the pixel data.

[0079] The first electrode of the light-emitting element (ED) is connected to the second electrode of the light-emitting transistor (TEM), and the second electrode of the light-emitting element (ED) can be connected to a low-potential power supply line. For example, the first electrode of the light-emitting element (ED) may be the anode electrode or anode terminal, and the second electrode of the light-emitting element (ED) may be the cathode electrode or cathode terminal, but is not limited to these. For example, the voltage applied from the light-emitting transistor (TEM) to the first electrode of the light-emitting element (ED) may be the anode voltage. For example, the voltage applied to the low-potential power supply line may be the cathode voltage (Vce). For example, the voltage applied to the low-potential power supply line may be the cathode-on voltage or the cathode-off voltage. For example, one or more of the cathode-on voltage and cathode-off voltage can be variable (or adjusted). For example, one or more of the cathode-on voltage and cathode-off voltage can be adjusted (or varied) according to the screen brightness by user operation (or setting). For example, one or more of the cathode-on voltage and cathode-off voltage can be varied (or adjusted) according to a reference voltage (Vref).

[0080] The driver transistor (TDR) and the light-emitting transistor (TEM) can each be either an n-type or p-type transistor.

[0081] In a single microdriver (MD), the drive transistor (TDR) can be turned on by a scan signal (SC) applied from the pixel driver circuit (PD), and the light-emitting transistor (TEM) can be turned on by a light-emitting signal (EM) applied from the pixel driver circuit (PD). This allows the light-emitting element (ED) to emit light when a drive current is applied to the light-emitting element (ED) via the drive transistor (TDR) and the light-emitting transistor (TEM) by a high-potential power supply voltage (VDD) applied to the first electrode of the drive transistor (TDR). For example, the light-emitting element (ED) can emit light when a cathode-on voltage is applied to a low-potential power supply line and remain non-emitting when a cathode-off voltage is applied to the low-potential power supply line.

[0082] Figure 5 is a plan view of a display device according to an embodiment of this specification. For example, Figure 5 is an enlarged view of a display area containing multiple pixels. For example, Figure 6 is an enlarged view of a display area containing one pixel. For example, Figure 7 is an enlarged view of a display area containing multiple pixels.

[0083] Figures 5 and 6 show, but are not limited to, multiple signal lines (TL), multiple communication lines (NL), multiple first electrodes (CE1), multiple banks (BNK), and multiple light-emitting elements (ED). Figure 7 is an enlarged view in which, for convenience, multiple second electrodes (CE2) are additionally arranged, and for convenience, the area overlapping with the second electrodes (CE2) is shown with a dotted line.

[0084] Referring to Figures 5 to 7, multiple pixels (PX) consisting of multiple subpixels can be arranged in the display area (AA). Each of the multiple subpixels includes a light-emitting element (ED) and can emit light independently. The multiple subpixels can be arranged in a matrix configuration, consisting of multiple rows and multiple columns, but are not limited to this arrangement.

[0085] Multiple pixels (PX) can include a first subpixel (SP1), a second subpixel (SP2), and a third subpixel (SP3). For example, multiple pixels (PX) (or subpixels) can include a first subpixel (SP1), a second subpixel (SP2), and a third subpixel (SP3) arranged along a row direction (or first direction (X)). For example, one of the first subpixel (SP1), second subpixel (SP2), and third subpixel (SP3) could be a red subpixel, another a green subpixel, and the rest blue subpixels. The types of multiple subpixels are illustrative and not limited to these.

[0086] Each of multiple pixels (PX) may contain one or more first subpixels (SP1), one or more second subpixels (SP2), and one or more third subpixels (SP3). For example, a single pixel (PX) may contain a pair of first subpixels (SP1), a pair of second subpixels (SP2), and a pair of third subpixels (SP3).

[0087] A pair of first subpixels (SP1) can consist of a 1-1 subpixel (SP1a) and a 1-2 subpixel (SP1b). A pair of second subpixels (SP2) can consist of a 2-1 subpixel (SP2a) and a 2-2 subpixel (SP2b). A pair of third subpixels (SP3) can consist of a 3-1 subpixel (SP3a) and a 3-2 subpixel (SP3b). For example, a single pixel (PX) may include, but is not limited to, a 1-1 subpixel (SP1a), a 1-2 subpixel (SP1b), a 2-1 subpixel (SP2a), a 2-2 subpixel (SP2b), a 3-1 subpixel (SP3a), and a 3-2 subpixel (SP3b).

[0088] Multiple subpixels that make up a single pixel (PX) can be arranged in various ways. For example, in a single pixel (PX), a pair of first subpixels (SP1) can be arranged in the same column, a pair of second subpixels (SP2) can be arranged in the same column, and a pair of third subpixels (SP3) can be arranged in the same column. The first subpixels (SP1), second subpixels (SP2), and third subpixels (SP3) can be arranged in the same row. The number and arrangement of multiple subpixels that make up a single pixel (PX) are illustrative and not limited thereto.

[0089] Multiple signal lines (TLs) can be arranged in the region between multiple subpixels. Multiple signal lines (TLs) can be extended in the column direction (or second direction (Y)) between multiple subpixels. Multiple signal lines (TLs) may be lines that transmit anode voltages from a pixel driver circuit (PD in Figure 3) (or microdriver (MD)) to multiple subpixels. For example, multiple signal lines (TLs) can be electrically connected to multiple pixel driver circuits (PD in Figure 3) and the first electrodes (CE1) of multiple subpixels. The anode voltage output from the pixel driver circuit (PD in Figure 3) can be transmitted to the first electrodes (CE1) of multiple subpixels via the multiple signal lines (TLs). For example, the first electrode (CE1) may be an electrode electrically connected to the anode electrode (134 in Figure 9) of a light-emitting element (ED). Therefore, the anode voltage from the signal lines (TLs) can be transmitted to the anode electrode (134 in Figure 9) of the light-emitting element (ED) via the first electrode (CE1). For example, the first electrode (CE1) may be a connecting electrode, a connecting electrode pattern, or a connecting pattern.

[0090] Therefore, instead of forming multiple transistors and storage capacitors for each of the multiple subpixels, the structure of the display device 1000 can be simplified by using a pixel driving circuit (PD in Figure 3) that integrates multiple pixel circuits. Furthermore, by integrating the circuits that were previously located in each of the multiple subpixels into a single pixel driving circuit (PD in Figure 3), highly efficient, low-power driving may become possible.

[0091] Multiple signal lines (TLs) may include a first signal line (TL1), a second signal line (TL2), a third signal line (TL3), a fourth signal line (TL4), a fifth signal line (TL5), and a fifth signal line (TL5). Each of the first signal line (TL1) and the second signal line (TL2) can be electrically connected to each of a pair of first subpixels (SP1). Each of the third signal line (TL3) and the fourth signal line (TL4) can be electrically connected to each of a pair of second subpixels (SP2). Each of the fifth signal line (TL5) and the sixth signal line (TL6) can be electrically connected to each of a pair of third subpixels (SP3).

[0092] A first signal line (TL1) can be placed on one side of a pair of first subpixels (SP1), and a second signal line (TL2) can be placed on the other side of the pair of first subpixels (SP1). The first signal line (TL1) can be electrically connected to the first electrode (CE1) of one of the first subpixels (SP1) of the pair, for example, the 1-1 subpixel (SP1a). The second signal line (TL2) can be electrically connected to the first electrode (CE1) of the remaining first subpixel (SP1) of the pair, for example, the 1-2 subpixel (SP1b).

[0093] A third signal line (TL3) can be placed on one side of a pair of second subpixels (SP2), and a fourth signal line (TL4) can be placed on the other side of the pair of second subpixels (SP2). For example, the third signal line (TL3) can be placed adjacent to the second signal line (TL2). The third signal line (TL3) can be electrically connected to the first electrode (CE1) of one of the second subpixels (SP2) of the pair, for example, the 2-1 subpixel (SP2a). The fourth signal line (TL4) can be electrically connected to the first electrode (CE1) of the remaining second subpixel (SP2) of the pair, for example, the 2-2 subpixel (SP2b).

[0094] A fifth signal line (TL5) can be placed on one side of a pair of third subpixels (SP3), and a sixth signal line (TL6) can be placed on the other side of the pair of third subpixels (SP3). For example, the fifth signal line (TL5) can be placed adjacent to the fourth signal line (TL4). The sixth signal line (TL6) can be placed adjacent to the first signal line (TL1) connected to an adjacent pixel (PX). The fifth signal line (TL5) can be electrically connected to the first electrode (CE1) of one of the third subpixels (SP3) of the pair, for example, the 3-1 subpixel (SP3a). The sixth signal line (TL6) can be electrically connected to the first electrode (CE1) of the remaining third subpixel (SP3) of the pair, for example, the 3-2 subpixel (SP3b).

[0095] Multiple signal lines (TLs) can consist of conductive materials. For example, multiple signal lines (TLs) can consist of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), and indium gallium zinc oxide (IGZO), but are not limited to these. As another example, multiple signal lines (TLs) can consist of a multilayer structure of conductive materials. For example, multiple signal lines (TLs) can consist of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but are not limited to these.

[0096] Multiple communication lines (NL) can be arranged in the region between multiple pixels (PX). Multiple communication lines (NL) can be arranged extending in the row direction in the region between multiple pixels (PX). Multiple communication lines (NL) can be arranged in the region between multiple second electrodes (CE2) and can not overlap with the multiple second electrodes (CE2). For example, multiple communication lines (NL) may be used for short-range communication such as NFC (near-field communication). Multiple communication lines (NL) can function as antennas. For example, multiple communication lines (NL) may be multiple linkage lines, etc.

[0097] According to one embodiment of this specification, a bank (BNK) can be arranged in each of a plurality of subpixels. The plurality of banks (BNK) may be a structure on which a plurality of light-emitting elements (EDs) are attached. The plurality of banks (BNK) may guide the position of the plurality of light-emitting elements (EDs) in a transfer process for transferring the plurality of light-emitting elements (EDs). In the transfer process for the plurality of light-emitting elements (EDs), the plurality of light-emitting elements (EDs) may be transferred onto the plurality of banks (BNK). The entire area of ​​the light-emitting elements (EDs) may overlap with the bank (BNK). For example, in planar terms, the overall size of the light-emitting elements (EDs) may be smaller than the bank (BNK). For example, the plurality of banks (BNK) may be a bank pattern, a structure, or a protruding pattern, etc., but are not limited to these.

[0098] The banks (BNK) of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) can be arranged spaced apart from each other along the row direction (or second direction (Y)). The banks (BNK) of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) can be configured to be separated from each other. This makes it easy to identify the banks (BNK) of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) to which different types of light-emitting elements (EDs) are transferred during the process of transferring light-emitting elements to subpixels, thereby preventing or minimizing transfer defects during the light-emitting element transfer process.

[0099] According to one embodiment of this specification, the banks (BNK) of the 1-1 subpixel (SP1a) and the banks (BNK) of the 1-2 subpixel (SP1b) can be connected to each other, or separated or formed apart from each other. For example, taking into consideration the design of the transfer process requirements, the banks (BNK) of the 1-1 subpixel (SP1a) and the banks (BNK) of the 1-2 subpixel (SP1b) in which the same type of light-emitting element (ED) is arranged can be connected to each other, or separated or formed apart from each other. Similarly, the banks (BNK) of the 2-1 subpixel (SP2a) and the banks (BNK) of the 2-2 subpixel (SP2b) can be connected to each other, or separated or formed apart from each other. The banks (BNK) of the 3-1 subpixel (SP3a) and the banks (BNK) of the 3-2 subpixel (SP3b) can be connected to each other, or separated or formed apart from each other. Therefore, the banks (BNK) of a pair of first subpixels (SP1), a pair of second subpixels (SP2), and a pair of third subpixels (SP3) can be formed in a variety of ways, and are not limited to these.

[0100] According to one embodiment of this specification, the multiple banks (BNKs) may consist of an organic insulating material. For example, the multiple banks (BNKs) may consist of a single or multiple layers of the organic insulating material. The multiple banks (BNKs) may consist of, but are not limited to, photoresists, polyimides, or acrylic materials.

[0101] A first electrode (CE1) can be placed in each of the multiple subpixels. The first electrode (CE1) can be placed on the bank (BNK) while overlapping with the bank (BNK). The first electrode (CE1) can be electrically connected to one of the multiple signal lines (TL). At least a portion of the first electrode (CE1) can extend outside the bank (BNK) and be electrically connected to the signal line (TL) closest to the first electrode (CE1). A portion of the first electrode (CE1) may overlap with the bank (BNK), while the remainder of the first electrode (CE1) may not overlap with the bank (BNK).

[0102] According to one embodiment of this specification, a portion of the first electrode (CE1) of the first-first subpixel (SP1a) can extend to one side region of the first-first subpixel (SP1a) and be electrically connected to the first signal line (TL1), a portion of the first electrode (CE1) of the first-second subpixel (SP1b) can extend to the other side region of the first-second subpixel (SP1b) and be electrically connected to the second signal line (TL2), a portion of the first electrode (CE1) of the second-first subpixel (SP2a) can extend to one side region of the second-first subpixel (SP2a) and be electrically connected to the third signal line (TL3), and a portion of the first electrode (CE1) of the second-second subpixel (SP2b) can extend to the other side region of the second-second subpixel (SP2b) and be electrically connected to the fourth signal line (TL4). A portion of the first electrode (CE1) of the third-first subpixel (SP3a) can extend to one side of the third-first subpixel (SP3a) and be electrically connected to the fifth signal line (TL5), and a portion of the first electrode (CE1) of the third-second subpixel (SP3b) can extend to the other side of the third-second subpixel (SP3b) and be electrically connected to the sixth signal line (TL6).

[0103] The first electrode (CE1) can be electrically connected to the anode electrode (or anode terminal) (134 in Figure 9) of the light-emitting element (ED). The anode voltage from the pixel driver circuit (PD in Figure 3) can be transmitted to the light-emitting element (ED) via the signal wiring (TL) and the first electrode (CE1) in sequence. The pixel driver circuit (PD in Figure 3) can, but is not limited to, apply the same voltage (or anode voltage) to the first electrode (CE1) in each of the multiple subpixels. For example, the pixel driver circuit (PD in Figure 3) can apply different voltages to the first electrode (CE1) of each of the multiple subpixels depending on the image displayed on the corresponding subpixel. For example, different voltages can be applied to the first electrode (CE1) of each of the multiple subpixels. Thus, the first electrode (CE1) can, but is not limited to, a pixel electrode.

[0104] The first electrode (CE1) can be made of a conductive material. For example, the first electrode (CE1) can be integrally formed with a plurality of signal lines (TLs). For example, the first electrode (CE1) can be made of the same conductive material as the plurality of signal lines (TLs), but is not limited thereto. In the embodiments described herein, the first electrode (CE1) can be made of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), and indium gallium zinc oxide (IGZO), but is not limited thereto. In another embodiment described herein, the first electrode (CE1) can consist of a multilayer structure of conductive materials. For example, multiple first electrodes (CE1) may consist of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but are not limited to this.

[0105] Multiple light-emitting elements (EDs) can be arranged on the first electrode (CE1) so as to overlap with the bank (BNK) and the first electrode (CE1). The entire area of ​​the multiple light-emitting elements (EDs) can overlap with the bank (BNK) and the first electrode (CE1). Multiple light-emitting elements (EDs) can be in contact with the first electrode (CE1) so as to overlap with the bank (BNK) and the first electrode (CE1).

[0106] Multiple light-emitting elements (EDs) can be arranged on a first electrode (CE1) and electrically connected to the first electrode (CE1). Therefore, the light-emitting elements (EDs) can emit light when an anode voltage is applied from a pixel drive circuit (PD) via the signal wiring (TL) and the first electrode (CE1).

[0107] The multiple light-emitting elements (EDs) may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150.

[0108] The first light-emitting element 130 can be placed in the first subpixel (SP1). The second light-emitting element 140 can be placed in the second subpixel (SP2). The third light-emitting element 150 can be placed in the third subpixel (SP3). For example, one of the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, another may be a green light-emitting element, and the rest may be blue light-emitting elements, but this is not limited to this. This allows for the combination of red, green, and blue light emitted from multiple light-emitting elements (EDs) to realize various colors of light, including white. The types of multiple light-emitting elements (EDs) are illustrative and not limited to these.

[0109] The first light-emitting element 130 may include a first-first light-emitting element 130a located in the first-first subpixel (SP1a) and a first-second light-emitting element 130b located in the first-second subpixel (SP1b). The second light-emitting element 140 may include a second-first light-emitting element 140a located in the second-first subpixel (SP2a) and a second-second light-emitting element 140b located in the second-second subpixel (SP2b). The third light-emitting element 150 may include a third-first light-emitting element 150a located in the third-first subpixel (SP3a) and a third-second light-emitting element 150b located in the third-second subpixel (SP3b).

[0110] A second electrode (CE2) can be placed in each of the multiple subpixels. The second electrode (CE2) can be placed on the light-emitting element (ED). The second electrode (CE2) can be electrically connected to a pixel drive circuit (PD in Figure 3) via multiple contact electrodes (CCE). The second electrode (CE2) can be electrically connected to the cathode electrode (or cathode terminal) (135 in Figure 9) of the light-emitting element (ED), and can transmit the cathode voltage (or low-potential power supply voltage) from the pixel drive circuit (PD in Figure 3) to the light-emitting element (ED).

[0111] According to one embodiment of this specification, the cathode voltage (or common electrode voltage) applied to each of the second electrodes (CE2) of a plurality of subpixels may be the same. For example, the cathode voltage can be applied in common to each of the second electrodes (CE2) of a plurality of subpixels and to the cathode electrode of the light-emitting element (ED) (135 in Figure 9). Therefore, the second electrode (CE2) may be, but is not limited to, a common electrode, a common electrode pattern, a common cathode electrode, a common cathode electrode pattern, a common divided electrode, or a common divided electrode pattern.

[0112] According to other embodiments of this specification, the cathode voltage applied to the second electrode (CE2) of each of the multiple subpixels can be changed by a reference voltage (Vref in Figure 4). For example, the cathode voltage can be adjusted (or varied) according to the brightness of the screen according to user operation (or setting).

[0113] A second electrode (CE2) according to one embodiment of this specification may have a size corresponding to one row (or horizontal line). For example, a second electrode (CE2) may have a width corresponding to one row and may extend along the row direction (or first direction (X)). For example, a second electrode (CE2) may be commonly connected to light-emitting elements (EDs) in each of a plurality of pixels (PX) arranged along the row direction. For example, a second electrode (CE2) may be commonly connected to the cathode electrodes (135 in Figure 9) of light-emitting elements (EDs) in each of 16 pixels (PX) arranged along the row direction, but is not limited thereto. For example, a second electrode (CE2) may be commonly connected to the cathode electrodes (135 in Figure 9) of 96 light-emitting elements (EDs) arranged along the row direction, but is not limited thereto. For example, a second electrode (CE2) may be commonly connected to the cathode electrodes (135 in Figure 9) of 192 light-emitting elements (EDs) in one row, but is not limited thereto.

[0114] According to other embodiments of this specification, some of the second electrodes (CE2) of each of a plurality of subpixels may be arranged separately from each other. For example, the second electrode (CE2) connected to the pixel (PX) of the nth row and the second electrode (CE2) connected to the pixel (PX) of the (n+1)th row may be arranged separately from each other. In embodiments of this specification, a plurality of second electrodes (CE2) may be arranged separately from each other with a plurality of communication lines (NL) extending in the row direction in between. Thus, the number of a plurality of subpixels may be greater than the number of a plurality of second electrodes (CE2).

[0115] Multiple second electrodes (CE2) can be made of a transparent conductive material, but are not limited to that. Multiple second electrodes (CE2) are made of a transparent conductive material, and the light emitted from the light-emitting element (ED) can be directed towards the top of the second electrodes (CE2). For example, the second electrodes (CE2) can be made of conductive materials such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but are not limited to that.

[0116] Multiple contact electrodes (CCEs) can be arranged on the substrate 110. For example, multiple contact electrodes (CCEs) can be arranged at a distance from multiple banks (BNKs) and multiple signal lines (TLs). Each of the multiple second electrodes (CE2) can be superimposed on at least one contact electrode (CCE). For example, one second electrode (CE2) can be superimposed on multiple contact electrodes (CCEs).

[0117] Multiple contact electrodes (CCEs) can be electrically connected to multiple second electrodes (CE2). The multiple contact electrodes (CCEs) can be positioned between the substrate 110 and the multiple second electrodes (CE2) and configured to transmit cathode voltage from the pixel driving circuit (PD in Figure 3) to the second electrodes (CE2) via a low-potential power supply line.

[0118] According to one embodiment of this specification, when the light-emitting element (ED) is composed of a microlight-emitting diode chip, a display panel 100 can be manufactured by forming multiple microlight-emitting diode chips on a wafer and transferring the microlight-emitting diode chips to a substrate 110. Various defects may occur during the process of transferring multiple light-emitting elements (EDs) of a fine size from the wafer to the substrate 110. For example, in some subpixels, a defect may occur where the light-emitting element (ED) is not transferred, and in other subpixels, a defect may occur where the light-emitting element (ED) is transferred shifted from its designated position due to alignment errors. In addition, even if the transfer process proceeds normally, the transferred light-emitting element (ED) itself may be defective. Therefore, considering the defects that occur in the transfer process of multiple light-emitting elements (EDs), multiple light-emitting elements (EDs) of the same type can be transferred to a single subpixel. After performing a lighting test on the multiple light-emitting elements (EDs), only the one light-emitting element (ED) that is ultimately judged to be normal can be used.

[0119] According to one embodiment of this specification, a first-first light-emitting element 130a and a first-second light-emitting element 130b are transferred together to a single pixel (PX), and they can be inspected for defects. In one embodiment of this specification, if both the first-first light-emitting element 130a and the first-second light-emitting element 130b are determined to be normal, only the first-first light-emitting element 130a can be used, and the first-second light-emitting element 130b can be left unused. In another embodiment of this specification, if only the first-second light-emitting element 130b is determined to be normal, the first-first light-emitting element 130a can be left unused, and only the first-second light-emitting element 130b can be used. Therefore, even if multiple light-emitting elements (EDs) of the same type are transferred to a single pixel (PX), ultimately only one light-emitting element (ED) can be used.

[0120] According to one embodiment of this specification, one of a pair of light-emitting elements (EDs) may be a primary light-emitting element (ED), and the remaining element may be a redundant light-emitting element (ED). The redundant light-emitting element (ED) may be an extra light-emitting element (ED) that is transferred in preparation for a failure of the primary light-emitting element (ED). If the primary light-emitting element (ED) is faulty, the redundant light-emitting element (ED) can be used in its place. Therefore, by transferring both the primary light-emitting element (ED) and the redundant light-emitting element (ED) together to a single pixel (PX), the degradation of display quality due to failures of the primary light-emitting element (ED) and the redundant light-emitting element (ED) can be minimized. For example, the first-first light-emitting element 130a, the second-first light-emitting element 140a, and the third-first light-emitting element 150a transferred to a single pixel (PX) may be used as the primary light-emitting element (ED), and the first-second light-emitting element 130b, the second-second light-emitting element 140b, and the third-second light-emitting element 150b may be used as the redundant light-emitting element (ED).

[0121] Figure 8 is a cross-sectional view along the line I-I' shown in Figure 2. Figure 9 is a cross-sectional view of the first light-emitting element according to an embodiment of this specification. For example, Figure 8 is a cross-sectional view of the display area (AA), first non-display area (NA), bending area (BA), and second non-display area (NA2) along the line I-I' shown in Figure 2, and Figure 9 is a cross-sectional view of a portion of the display area (AA).

[0122] Referring to Figure 8, the buffer layer 111 can be placed in the remaining area of ​​the substrate 110, excluding the bending region (BA). The buffer layer 111 may include a first buffer layer 111a and a second buffer layer 111b.

[0123] The first buffer layer 111a and the second buffer layer 111b can be placed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2). The first buffer layer 111a and the second buffer layer 111b can reduce the penetration of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b can be made of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b can be made of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but are not limited thereto.

[0124] According to one embodiment of this specification, a portion of the first buffer layer 111a and the second buffer layer 111b on the bending region (BA) can be removed. The upper surface of the substrate 110 located in the bending region (BA) can be exposed without being covered by the first buffer layer 111a and the second buffer layer 111b. Since a portion of the first buffer layer 111a and the second buffer layer 111b, which are made of inorganic insulating material, are removed from the bending region (BA), cracks that occur in the first buffer layer 111a and the second buffer layer 111b when the bending region (BA) is bent can be prevented or minimized.

[0125] Multiple alignment keys (MKs) can be placed between the first buffer layer 111a and the second buffer layer 111b. These alignment keys (MKs) can be configured to identify (or align) the positions of the pixel drive circuits (PDs) during the manufacturing process of the display panel 100. For example, the alignment keys (MKs) can be configured to align the positions of the pixel drive circuits (PDs) transferred onto the adhesive layer 112. For example, the alignment keys (MKs) can be omitted, but are not limited to this.

[0126] An adhesive layer 112 can be placed on the second buffer layer 111b. The adhesive layer 112 can be placed in the display area (AA), the first non-display area (NA1), the bending area (BA), and the second non-display area (NA2). For example, at least a portion of the adhesive layer 112 can be removed in the non-display areas (NA1, NA2) including the bending area (BA). The adhesive layer 112 can be composed of, but is not limited to, one of the following: adhesive polymer, epoxy resin, UV-curable resin, polyimide-based, acrylate-based, urethane-based, and polydimethylsiloxane (PDMS).

[0127] In the display area (AA), a pixel driver circuit (PD) can be placed on the adhesive layer 112. The pixel driver circuit (PD) can be supported by the buffer layer 111. If the pixel driver circuit (PD) is embodied as a driver (or a driver integrated circuit or driver chip), the driver can be mounted on the adhesive layer 112 by a transfer process, but is not limited to this.

[0128] A protective layer 113 can be placed on the adhesive layer 112 and the pixel drive circuit (PD). The protective layer 113 may include a first protective layer 113a and a second protective layer 113b. For example, the first protective layer 113a and the second protective layer 113b can be placed on the adhesive layer 112 and the pixel drive circuit (PD). The first protective layer 113a and the second protective layer 113b can be placed to surround the sides of the pixel drive circuit (PD), but are not limited to this. For example, the second protective layer 113b can be placed to cover at least a portion of the top surface of the pixel drive circuit (PD). For example, at least one of the first protective layer 113a and the second protective layer 113b placed on the bending region (BA) can be omitted. For example, the first protective layer 113a may be distributed throughout the display area (AA) and the non-display area (NA), while the second protective layer 113b may be distributed partially in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2), and not in the bending area (BA). For example, a portion of the second protective layer 113b (or the first protective layer 113a) in the bending area (BA) may be removed, but is not limited to this.

[0129] The first protective layer 113a and the second protective layer 113b may, but are not limited to, organic insulating materials. For example, the first protective layer 113a and the second protective layer 113b may, but are not limited to, photoresist, polyimide, or photoacrylic-based materials. For example, the first protective layer 113a and the second protective layer 113b may, but are not limited to, an overcoat layer, an insulating layer, or an organic insulating layer.

[0130] According to one embodiment of this specification, a wiring layer (or pixel wiring layer) can be placed on the protective layer 113. For example, the wiring layer can be configured to surround and cover a pixel drive circuit (PD). The wiring layer may include a plurality of first connecting wirings 121.

[0131] Multiple first connecting wires 121 can be arranged on the protective layer 113. For example, in the display area (AA), multiple first connecting wires 121 can be arranged on the second protective layer 113b. Multiple first connecting wires 121 may be wiring (or intermediate wiring or jumping wiring) configured to electrically connect the pixel driver circuit (PD) to other components and / or wiring of other layers. For example, the pixel driver circuit (PD) can be electrically connected to multiple signal wirings (TL) and multiple contact electrodes (CCE), etc., via multiple first connecting wires 121.

[0132] The multiple first connection wirings 121 may include, but are not limited to, first-first connection wirings 121a, first-second connection wirings 121b, first-third connection wirings 121c, and first-fourth connection wirings 121d. For example, the multiple first-first connection wirings 121a may be arranged on the second protective layer 113b. The multiple first-first connection wirings 121a may be configured to be electrically connected to a pixel drive circuit (PD). The multiple first-first connection wirings 121a may be configured to transmit the voltage output from the pixel drive circuit (PD) to the first electrode (CE1) or the second electrode (CE2).

[0133] A third protective layer 114 can be placed on the second protective layer 113b. The third protective layer 114 can be placed entirely in the display area (AA) and the non-display area (NA). In the bending area (BA), the third protective layer 114 can cover or overlap the sides of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 can be made of an organic insulating material. For example, the third protective layer 114 can be made of photoresist, polyimide, or photoacrylic material, but is not limited to these. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 can be made of the same material, but is not limited to these.

[0134] Multiple first-to-second coupling wires 121b can be arranged on the third protective layer 114. These multiple first-to-second coupling wires 121b can be connected to the pixel driver circuit (PD) via a first-to-first coupling wire 121a or directly to the pixel driver circuit (PD). For example, some of the first-to-second coupling wires 121b can be directly connected to the pixel driver circuit (PD) via contact holes in the third protective layer 114. Other parts of the first-to-second coupling wires 121b can be electrically connected to the first-to-first coupling wire 121a via contact holes in the third protective layer 114. However, the invention is not limited thereto. In one embodiment of this invention, a voltage output from the pixel driver circuit (PD) can be transmitted to a first electrode (CE1) or a second electrode (CE2) via coupling wires different from the multiple first-to-second coupling wires 121b.

[0135] The display device 1000 according to the embodiments of this specification may further include an insulating layer 115 in the wiring layer. The insulating layer 115 can be configured to electrically insulate and cover the plurality of first connecting wires 121. For example, the insulating layer 115 may include a plurality of insulating layers 115a, 115b, 115c, or may include first to third insulating layers 115a, 115b, 115c.

[0136] According to one embodiment of this specification, a first insulating layer 115a can be placed on a plurality of first-to-second connecting wirings 121b. The first insulating layer 115a can be placed entirely over the display area (AA) and the non-display area (NA), but is not limited thereto. The first insulating layer 115a can be composed of an organic insulating material, but is not limited thereto. For example, the first insulating layer 115a can be composed of a photoresist, polyimide, or photoacrylic material, but is not limited thereto.

[0137] Multiple first to third connecting wires 121c can be arranged on the first insulating layer 115a. The first to third connecting wires 121c can be electrically connected to multiple first to second connecting wires 121b. For example, the first to third connecting wires 121c can be electrically connected to the first to second connecting wires 121b via contact holes in the first insulating layer 115a.

[0138] A second insulating layer 115b can be placed on multiple first to third interconnected wirings 121c. The second insulating layer 115b can be placed in the remaining areas excluding the bending region (BA), but is not limited to these. The second insulating layer 115b can be placed in the display region (AA), the first non-display region (NA1), and the second non-display region (NA2), but is not limited to these. At least a portion of the second insulating layer 115b placed in the bending region (BA) can be removed. The second insulating layer 115b can be made of an organic insulating material, but is not limited to this. For example, the second insulating layer 115b can be made of a photoresist, polyimide, or photoacrylic material, but is not limited to these.

[0139] Multiple first- to fourth connecting wires 121d can be arranged on the second insulating layer 115b. Multiple first- to fourth connecting wires 121d can be electrically connected to multiple first- to third connecting wires 121c. For example, the first- to fourth connecting wires 121d can be electrically connected to the first- to third connecting wires 121c via contact holes in the second insulating layer 115b.

[0140] The first-to-fourth connecting wiring 121d can be connected to the contact electrode (CCE) via the contact hole in the third insulating layer 115c, thereby electrically connecting the contact electrode (CCE) and the pixel drive circuit (PD) via the first connecting wiring 121. For example, the contact electrode (CCE) connected to the second electrode (CE2) can be electrically connected to the pixel drive circuit (PD) via the first-to-fourth connecting wiring 121d, the first-to-third connecting wiring 121c, the first-to-second connecting wiring 121b, and the first-to-first connecting wiring 121a.

[0141] The first to fourth connecting wirings 121d can be directly connected to the signal wiring (TL) via contact holes provided in the third insulating layer 115c, or they can be electrically connected to the signal wiring (TL) via other additional wiring or electrodes, thereby enabling the signal wiring (TL) and the pixel driving circuit (PD) to be electrically connected by the first connecting wiring 121.

[0142] Multiple second connecting wires 122 can be arranged on the protective layer 113 in the non-display area (NA). For example, multiple second connecting wires 122 can be arranged on the second protective layer 113b in the non-display area (NA). The multiple second connecting wires 122 may be wires for transmitting signals transmitted from the flexible circuit board (310 in Figure 2) and the printed circuit board (330 in Figure 2) via the pad portion (PAD in Figure 2) to the pixel driving circuit (PD) of the display area (AA).

[0143] According to one embodiment of this specification, a plurality of second connecting wires 122 are electrically connected to a plurality of pad electrodes (PEs) and can receive signals from a flexible circuit board (310 in Figure 2) and a printed circuit board (330 in Figure 2).

[0144] According to one embodiment of this specification, a plurality of second connecting wires 122 can be configured to extend from the pad portion (PAD in Figure 2) toward the display area (AA) and transmit signals to the wiring of the display area (AA). In this case, the plurality of second connecting wires 122 can function as link wires (LL in Figure 3).

[0145] The multiple second connecting wires 122 may include a second-first connecting wire 122a, a second-second connecting wire 122b, a second-third connecting wire 122c, and a second-fourth connecting wire 122d.

[0146] Multiple second-first connecting wires 122a can be arranged on the protective layer 113. For example, multiple second-first connecting wires 122a can be arranged on the second protective layer 113b. Multiple second-first connecting wires 122a can extend from the second non-display area (NA2) to the bending area (BA) and the first non-display area (NA1). Multiple second-first connecting wires 122a can be configured to transmit signals transmitted from the flexible circuit board (310 in Figure 2) and the printed circuit board (330 in Figure 2) via the pad portion (PAD in Figure 2) to the pixel driving circuit (PD) of the display area (AA).

[0147] According to one embodiment of this specification, the second-first coupling wire 122a can also be electrically coupled to the pad electrodes (PE) and the pixel driver circuit (PD). For example, the second-first coupling wire 122a can extend into the display area (AA) and be directly coupled to the pixel driver circuit (PD) within the display area (AA), or it can be electrically coupled to the pixel driver circuit (PD) via other additional wiring or electrodes. Furthermore, the second-first coupling wire 122a can be electrically coupled to the pad electrodes (PE) in the second non-display area (NA2) via the second-second coupling wire 122b, the second-third coupling wire 122c, and the second-fourth coupling wire 122d. Thus, the pixel driver circuit (PD) and the pad electrodes (PE) can also be electrically coupled by the second coupling wire 122.

[0148] Multiple 2-2 connecting wires 122b can be placed on the third protective layer 114. Multiple 2-2 connecting wires 122b can be placed in the second non-display area (NA2). The 2-2 connecting wires 122b can be electrically connected to the 2-1 connecting wires 122a via contact holes in the third protective layer 114. Therefore, signals from the flexible circuit board (310 in Figure 2) and the printed circuit board (330 in Figure 2) can be transmitted to the 2-1 connecting wires 122a via the 2-2 connecting wires 122b.

[0149] Second- and third connecting wires 122c can be placed on the first insulating layer 115a. Multiple second- and third connecting wires 122c can be placed in the second non-display area (NA2). The second- and third connecting wires 122c can be electrically connected to the second- and second-second connecting wires 122b via contact holes in the first insulating layer 115a. Therefore, signals from the flexible circuit board (310 in Figure 2) and the printed circuit board (330 in Figure 2) can be transmitted to the second- and first-second connecting wires 122a via the second- and third connecting wires 122c and the second- and second-second connecting wires 122b.

[0150] Second-to-fourth connecting wires 122d can be placed on the second insulating layer 115b. Multiple second-to-fourth connecting wires 122d can be placed in the second non-display area (NA2). The second-to-fourth connecting wires 122d can be electrically connected to the second-to-third connecting wires 122c via contact holes in the second insulating layer 115b. The second-to-fourth connecting wires 122d can be electrically connected to the pad electrodes (PE) via contact holes in the third insulating layer 115c.

[0151] According to one embodiment of this specification, signals from a flexible circuit board (310 in Figure 2) and a printed circuit board (330 in Figure 2) can be transmitted to a second-first connection wiring 122a via second-fourth connection wiring 122d, second-third connection wiring 122c, and second-second connection wiring 122b. For example, the second-second connection wiring 122a can be extended to a display area (AA) via a bending region (BA) and electrically connected to a pixel drive circuit (PD) in the display area (AA). Thus, a pad electrode (PE) provided in a second non-display area (NA2) can be electrically connected to a pixel drive circuit (PD) provided in the display area (AA) via second-fourth connection wiring 122d, second-third connection wiring 122c, second-second connection wiring 122b, and a second-first connection wiring 122a provided in the bending region (BA).

[0152] The multiple first connecting wires 121 and the multiple second connecting wires 122 can be formed from any one of the conductive materials with excellent flexibility or from various conductive materials used in the display area (AA). In one embodiment of this specification, the second connecting wire 122, which is partially located in the bending area (BA), may be made of a conductive material with excellent flexibility, such as gold (Au), silver (Ag), or aluminum (Al). In other embodiments of this specification, the multiple first connecting wires 121 and the multiple second connecting wires 122 may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys of silver (Ag) and magnesium (Mg), or alloys thereof.

[0153] A third insulating layer 115c can be placed on multiple first connecting wires 121 and multiple second connecting wires 122. The first insulating layer 115c can be placed in the remaining areas excluding the bending region (BA), but is not limited thereto. The third insulating layer 115c can be placed in the display region (AA), the first non-display region (NA1), and the second non-display region (NA2). At least a portion of the third insulating layer 115c in the bending region (BA) can be removed. The third insulating layer 115c can be composed of an organic insulating material, but is not limited thereto. For example, the third insulating layer 115c can be composed of a photoresist, polyimide, or photoacrylic material, but is not limited thereto.

[0154] In the display area (AA), multiple banks (BNK) can be arranged on the third insulating layer 115c. Multiple banks (BNK) can be arranged so as to overlap each of multiple subpixels. Multiple banks (BNK) may not be arranged in the first non-display area (NA1), the second non-display area (NA2), and the bending area (BA). One or more light-emitting elements (ED) of the same type can be arranged on top of each of the multiple banks (BNK).

[0155] In the display area (AA), multiple signal lines (TLs) can be placed on the third insulating layer 115c. Multiple signal lines (TLs) can be placed in the area between multiple banks (BNKs). For example, multiple signal lines (TLs) can be placed adjacent to any one of the multiple banks (BNKs). Each of the multiple signal lines (TLs) can be electrically connected to a first linkage line 121, for example, the first to fourth linkage lines 121d.

[0156] In the display area (AA), multiple contact electrodes (CCEs) can be arranged on the third insulating layer 115c. The multiple contact electrodes (CCEs) can supply cathode voltage from the pixel driving circuit (PD) to the second electrode (CE2). Each of the multiple contact electrodes (CCEs) can be electrically connected to the first connecting wiring 121, for example, the first to fourth connecting wirings 121d.

[0157] A first electrode (CE1) can be placed on the bank (BNK). For example, the first electrode (CE1) can be placed extending from an adjacent signal line (TL) toward the top of the bank (BNK). The first electrode (CE1) can be placed on the top surface and the side surface of the bank (BNK). For example, the first electrode (CE1) can be placed extending from a signal line (TL) on the third insulating layer 115c toward the side surface and the top surface of the bank (BNK). The first electrode (CE1) may be a contact electrode. The first electrode (CE1) can be formed integrally with the signal line (TL).

[0158] Referring to Figure 9, the first electrode (CE1) can be composed of multiple conductive layers. For example, the first electrode (CE1) may include, but is not limited to, a first conductive layer (CE1a), a second conductive layer (CE1b), a third conductive layer (CE1c), and a fourth conductive layer (CE1d).

[0159] The first conductive layer (CE1a) can be placed on a bank (BNK). The second conductive layer (CE1b) can be placed on the first conductive layer (CE1a). The third conductive layer (CE1c) can be placed on the second conductive layer (CE1b). The fourth conductive layer (CE1d) can be placed on the third conductive layer (CE1c). For example, each of the first conductive layer (CE1a), the second conductive layer (CE1b), the third conductive layer (CE1c), and the fourth conductive layer (CE1d) can be made of titanium (Ti), molybdenum (Mo), aluminum (Al), or titanium (Ti) and indium tin oxide, but is not limited thereto.

[0160] According to one embodiment of this specification, among the plurality of conductive layers constituting the first electrode (CE1), some conductive layers with good reflectivity can be composed of alignment keys and / or reflectors for aligning the light-emitting element (ED). Among the plurality of conductive layers constituting the first electrode (CE1), the second conductive layer (CE1b) may include a reflective material. For example, the second conductive layer (CE1b) may include, but is not limited to, aluminum (Al). Therefore, the second conductive layer (CE1b) may be composed of a reflector. Furthermore, the high reflectivity of the second conductive layer (CE1b) makes it easy to identify in the manufacturing process, so that the position or transfer position of the light-emitting element (ED) can be aligned with respect to the second conductive layer (CE1b).

[0161] According to one embodiment of this specification, in order to configure the second conductive layer (CE1b) as a reflector, the third conductive layer (CE1c) and the fourth conductive layer (CE1d) covering the second conductive layer (CE1b) can be partially removed or etched. For example, portions of the third conductive layer (CE1c) and the fourth conductive layer (CE1d) placed on a bank (BNK) can be removed or etched, thereby exposing the upper surface of the second conductive layer (CE1b). For example, the central and edge portions (or end portions) of the third conductive layer (CE1c) and the fourth conductive layer (CE1d) where the solder pattern (SDP) is placed can not be removed, and the remaining portions can be removed. For example, the edge portions (or end portions) and central portions of the third conductive layer (CE1c), which is made of titanium (Ti), and the fourth conductive layer (CE1d), which is made of indium tin oxide, may not be removed or etched. This makes it possible to prevent or minimize corrosion of other conductive layers constituting the first electrode (CE1) by the etching solution (e.g., TMAH (tetramethyl ammonium hydroxide) solution) used in the masking (or patterning) process of the first electrode (CE1).

[0162] According to one embodiment of this specification, the first conductive layer (CE1a) and the third conductive layer (CE1c) may include titanium (Ti) or molybdenum (Mo). The second conductive layer (CE1b) may include aluminum (Al). The fourth conductive layer (CE1d) may include a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) which has good adhesion to solder patterns (SDP) and is corrosion-resistant and acid-resistant. However, it is not limited thereto.

[0163] The first conductive layer (CE1a), the second conductive layer (CE1b), the third conductive layer (CE1c), and the fourth conductive layer (CE1d) can be deposited in sequence and then patterned by photolithography and etching processes, but are not limited to these methods.

[0164] As can be seen from Figures 8 and 9, according to one embodiment of this specification, the signal wiring (TL), contact electrode (CCE), and pad electrode (PE), which are arranged on the same layer as the first electrode (CE1), can be made of a multilayer structure of conductive material, but are not limited thereto. For example, the signal wiring (TL), contact electrode (CCE), and pad electrode (PE) can be made of a multilayer structure of indium tin oxide / titanium (Ti) / aluminum (Al) / titanium (Ti), but are not limited thereto.

[0165] In each of the multiple subpixels, a solder pattern (SDP) can be placed on the first electrode (CE1). The solder pattern (SDP) can be used to bond an emitting element (ED) to the first electrode (CE1). The first electrode (CE1) and the emitting element (ED) can be electrically connected via eutectic bonding using the solder pattern (SDP), but are not limited to this. For example, if the solder pattern (SDP) is made of indium (In) and the anode electrode 134 of the emitting element (ED) is made of gold (Au), the solder pattern (SDP) and the anode electrode 134 can be bonded by applying heat and pressure during the transfer process of the emitting element (ED). The emitting element (ED) can be bonded to the solder pattern (SDP) and the first electrode (CE1) via eutectic bonding without the need for a separate adhesive. For example, the solder pattern (SDP) can be made of indium (In), tin (Sn), or alloys thereof, but are not limited to these. For example, a solder pattern (SDP) could be, but is not limited to, a contact pattern, bonding pad, or joint pad.

[0166] According to one embodiment of this specification, a passivation layer 116 can be placed on the wiring layer. For example, the passivation layer 116 can be configured to cover the wiring layer in a display area (AA). For example, the passivation layer 116 can be placed on a plurality of signal lines (TL), a plurality of first electrodes (CE1), a plurality of contact electrodes (CCE), and a third insulating layer 115c. For example, the passivation layer 116 can be placed in a display area (AA), a first non-display area (NA1), and a second non-display area (NA2). At least a portion of the passivation layer 116 placed in the bending area BA can be removed. A portion of the passivation layer 116 covering a plurality of pad electrodes (PE) in the second non-display area (NA2) can be removed. A portion of the passivation layer 116 covering a plurality of contact electrodes (CCE) in the display area (AA) can be removed. A passivation layer 116 covering a solder pattern (SDP) in the display area (AA) can be removed. The passivation layer 116 can cover the first electrode (CE1). The passivation layer 116 can cover a portion of the upper surface of the exposed second conductive layer (CE1b).

[0167] The passivation layer 116 is positioned to cover the remaining areas while exposing at least a portion of the multiple pad electrodes (PEs), multiple contact electrodes (CCEs), and solder patterns (SDPs), thereby reducing the penetration of moisture or impurities into the light-emitting element (ED). For example, the passivation layer 116 may consist of a single or multiple layer of silicon oxide (SiOx) or silicon nitride (SiNx). For example, the passivation layer 116 may be a protective layer, an insulating layer, or an inorganic insulating layer, etc. For example, the passivation layer 116 may include holes for exposing the solder patterns (SDPs) and holes for exposing the contact electrodes (CCEs).

[0168] In each of the multiple subpixels, light-emitting elements (EDs) can be placed on the solder pattern (SDP). A first light-emitting element 130 can be placed in the first subpixel (SP1). A second light-emitting element 140 can be placed in the second subpixel SP2. A third light-emitting element 150 can be placed in the third subpixel SP3.

[0169] Light-emitting elements (EDs) can be formed on a silicon wafer by methods such as metal-organic chemical vapor deposition, chemical vapor deposition, plasma-enhanced chemical vapor deposition, molecular beam epitaxy, hydrogen vapor phase epitaxy, or sputtering, but are not limited to these methods.

[0170] Referring to Figure 9, the first light-emitting element 130 may include, but is not limited to, an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and a sealing film 136. For example, the sealing film 136 may not be included in the first light-emitting element 130.

[0171] The first semiconductor layer 131 can be placed on a solder pattern (SDP). The second semiconductor layer 133 can be placed on the first semiconductor layer 131.

[0172] According to one embodiment of this specification, one of the first semiconductor layer 131 and the second semiconductor layer 133 can be embodied in a compound semiconductor such as a III-V or II-VI group semiconductor, and can be doped with impurities (or dopants). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be a semiconductor layer doped with an n-type impurity, and the other may be a semiconductor layer doped with a p-type impurity, but is not limited thereto. For example, one or more of the first semiconductor layer 131 and the second semiconductor layer 133 may be layers doped with n-type or p-type impurities in materials such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum indium gallium nitride (AlInGaN), aluminum indium nitride (AlInN), aluminum gallium nitride (AlGaN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs). For example, the n-type impurities may be silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn). For example, p-type impurities may include, but are not limited to, magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be).

[0173] According to one embodiment of this specification, the first semiconductor layer 131 and the second semiconductor layer 133 may be, but are not limited to, a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities, but are not limited to these.

[0174] The active layer 132 can be positioned (or interposed) between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 can emit light by receiving holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 can be composed of one of the following: a single well structure, a multiple well structure, a single quantum well structure, a multi-quantum well structure, a quantum dot structure, and a quantum beam structure. For example, the active layer 132 can be composed of indium gallium nitride (InGaN) or gallium nitride (GaN), etc.

[0175] According to other embodiments of this specification, the active layer 132 may include a multi-quantum well structure having a well layer and a barrier layer with a band gap higher than that of the well layer. For example, the active layer 132 may, but is not limited to, include an indium gallium nitride (InGaN) layer as the well layer and an aluminum gallium nitride (AlGaN) layer as the barrier layer.

[0176] The anode electrode 134 can be positioned (or interposed) between the first semiconductor layer 131 and the solder pattern (SDP). For example, the anode electrode 134 can be configured to electrically connect the first semiconductor layer 131 and the first electrode (CE1). The anode voltage output from the pixel drive circuit (PD) can be applied to the first semiconductor layer 131 via the signal wiring (TL), the first electrode (CE1), and the anode electrode 134. For example, the anode electrode 134 can be made of a conductive material capable of eutectic bonding with the solder pattern (SDP), but is not limited to this. For example, the anode electrode 134 can be made of, but is not limited to, gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), and copper (Cu) or alloys thereof.

[0177] The cathode electrode 135 can be placed on the second semiconductor layer 133. For example, the cathode electrode 135 can be configured to electrically connect the second semiconductor layer 133 and the second electrode (CE2). The cathode voltage output from the pixel drive circuit (PD) can be applied to the second semiconductor layer 133 via the contact electrode (CCE), the second electrode (CE2), and the cathode electrode 135. The cathode electrode 135 can be made of a transparent conductive material so that light emitted from the light-emitting element (ED) can be directed towards the top of the light-emitting element (ED), but is not limited thereto. For example, the cathode electrode 135 can be made of a material such as indium tin oxide, indium zinc oxide, or indium gallium zinc oxide, but is not limited thereto.

[0178] The encapsulation film 136 can be placed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the encapsulation film 136 can surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0179] The encapsulation film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the encapsulation film 136 can be placed on the side surfaces of the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133.

[0180] The sealing film 136 can be placed on at least a portion of the anode electrode 134 and the cathode electrode 135, for example, on the edge portion (or end portion or one side) of the anode electrode 134 and the edge portion (or end portion or one side) of the cathode electrode 135. At least a portion of the anode electrode 134 can be exposed without being covered by the sealing film 136 to connect the anode electrode 134 to the solder pattern (SDP). For example, at least a portion of the cathode electrode 135 can be exposed without being covered by the sealing film 136 to connect the cathode electrode 135 to the second electrode (CE2). For example, the sealing film 136 can be made of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited to these.

[0181] According to other embodiments of this specification, the encapsulation film 136 may have a structure in which a reflective material is dispersed in a resin layer, but the embodiments of this specification are not limited thereto. For example, the encapsulation film 136 can be made of reflectors of various structures, but is not limited thereto. Light emitted from the active layer 132 can be reflected upward by the encapsulation film 136 to improve light extraction efficiency. For example, the encapsulation film 136 may be a reflective layer, but is not limited thereto.

[0182] In the embodiments described herein, the light-emitting element (ED) has been described in a vertical structure, but is not limited thereto. For example, the light-emitting element (ED) may have a lateral structure or a flip-chip structure.

[0183] The first light-emitting element 130 has been described with reference to Figure 9, but the second light-emitting element 140 and the third light-emitting element 150 can have substantially the same structure as the first light-emitting element 130. For example, the second light-emitting element 140 and the third light-emitting element 150 include substantially the same configuration as the first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and sealing film 136 of the first light-emitting element 130, so a redundant explanation of these will be omitted.

[0184] As can be seen from Figures 8 and 9, the display device 1000 according to one embodiment of this specification may further include optical layers (or light diffusing layers) 117a, 117b, and 117c.

[0185] The optical layers 117a, 117b, and 117c can be configured to surround multiple light-emitting elements (EDs) in the display area (AA). For example, the optical layers 117a, 117b, and 117c can be configured to cover multiple light-emitting elements (EDs) in the display area (AA). For example, the optical layers 117a and 117b can be configured on the insulating layer 115 to surround each side of the multiple light-emitting elements (EDs) and the sides of the multiple banks (BNKs).

[0186] According to embodiments of this specification, a first optical layer 117a can be arranged in a display area (AA) to surround a plurality of light-emitting elements (EDs). For example, the first optical layer 117a can be arranged to cover the sides of a plurality of light-emitting elements (EDs) and the sides of a plurality of banks (BNKs) in the region of a plurality of subpixels. For example, the first optical layer 117a can cover a portion of the passivation layer 116. For example, the first optical layer 117a can cover the space between the second electrode (CE2), a portion of the passivation layer 116, and the plurality of light-emitting elements (EDs). The first optical layer 117a can be arranged or cover the space between a plurality of light-emitting elements (EDs) contained in a single pixel (PX), and between a plurality of banks (BNKs). The first optical layer 117a can extend along the row direction of the display area (AA), and a plurality of first optical layers 117a can be spaced apart along the column direction (or second direction (Y)) of the display area (AA). The first optical layer 117a can be positioned between the insulating layer 115 and the second electrode (CE2) so as to surround each side of the multiple light-emitting elements (EDs) and multiple banks (BNKs). For example, the first optical layer 117a can be positioned between the passivation layer 116 and the second electrode (CE2) so as to surround the sides of the light-emitting elements (EDs) and banks (BNKs), but is not limited thereto. For example, the first optical layer 117a may be a diffusion layer or a sidewall diffusion layer, but is not limited thereto.

[0187] The first optical layer 117a may, but is not limited to, include an organic insulating material in which fine particles 117ap are dispersed. For example, the first optical layer 117a may, but is not limited to, a siloxane in which fine metal particles 117ap, such as titanium dioxide (TiO2) particles, are dispersed. Light from multiple light-emitting elements (EDs) is scattered by the fine particles 117ap dispersed in the first optical layer 117a and can be emitted to the outside of the display panel 100. This allows the first optical layer 117a to improve the extraction efficiency of light emitted from multiple light-emitting elements (EDs).

[0188] According to the embodiments herein, the first optical layer 117a may be located in each of a plurality of pixels (PX), or it may be located together in some of the pixels (PX) located in the same row of the display area (AA), but is not limited thereto. For example, the first optical layer 117a may be located in each of a plurality of pixels (PX), or one first optical layer 117a may be located so as to be shared by a plurality of pixels (PX). In other embodiments herein, each of a plurality of subpixels may separately include the first optical layer 117a, but is not limited thereto.

[0189] According to embodiments of this specification, a second optical layer 117b can be placed on the passivation layer 116 in the display area (AA). For example, the second optical layer 117b can be placed so as to surround the side of the first optical layer 117a. For example, the second optical layer 117b can be in contact with the side surface of the first optical layer 117a. For example, the second optical layer 117b can be placed in a region (or non-emitting region) between multiple pixels (PX), but is not limited thereto. For example, the second optical layer 117b can be a diffuse layer, a diffuse layer window, or a window diffuse layer, etc.

[0190] The second optical layer 117b may, but is not limited to, an organic insulating material. The second optical layer 117b may, but is not limited to, the same material as the first optical layer 117a. For example, the first optical layer 117a may contain fine particles, while the second optical layer 117b may not contain fine particles. The second optical layer 117b may, but is not limited to, a siloxane.

[0191] According to one embodiment of this specification, the thickness of the first optical layer 117a may be thinner than the thickness of the second optical layer 117b, but is not limited thereto. For example, the upper surface of the second optical layer 117b may be a flat surface, and the upper surface of the first optical layer 117a may be a concave curved surface. As a result, when viewed in plan, the region where the first optical layer 117a is located may include a recess that is recessed inward from the upper surface of the second optical layer 117b.

[0192] According to one embodiment of this specification, a second electrode (CE2) can be placed on the first optical layer 117a and the second optical layer 117b. For example, the second electrode (CE2) can be electrically connected to a plurality of contact electrodes (CCE) via a contact hole in the second optical layer 117b. For example, the second electrode (CE2) can be placed on a plurality of light-emitting elements (EDs). For example, the second electrode (CE2) may include, but is not limited to, a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). For example, the second electrode (CE2) can be in contact with or directly in contact with the cathode electrode 135. For example, the second electrode (CE2) can be superimposed on the entirety of the first optical layer 117a or on a portion of the second optical layer 117b. For example, the second electrode (CE2) can be electrically connected to the contact electrodes (CCE) via the second optical layer 117b. For example, the second electrode (CE2) can be electrically connected to the contact electrode (CCE) via a contact hole formed in the second optical layer 117b.

[0193] The second electrode (CE2) can be continuously extended along the row direction (or first direction (X)) of the substrate 110. This allows the second electrode (CE2) to be commonly connected to multiple light-emitting elements (EDs) located in each of multiple pixels (PX) arranged along the row direction (or first direction (X)) of the substrate 110.

[0194] According to one embodiment of this specification, the second electrode (CE2) can be continuously extended over the first optical layer 117a, the second optical layer 117b, and the light-emitting element (ED). The region on which the first optical layer 117a is located may include a recess that is recessed inward from the upper surface of the second optical layer 117b. This allows the first portion of the second electrode (CE2) located on the first optical layer 117a to be positioned along the recess, so that it can be positioned lower than the second portion of the second electrode (CE2) located on the second optical layer 117b. For example, the thickness of the first optical layer 117a may decrease from the second optical layer 117b towards the center of the first optical layer 117a due to the electrical connection (or contact) between each of the first to third light-emitting elements 130, 140, and 150 and the second electrode (CE2).

[0195] A third optical layer 117c can be placed on the second electrode (CE2). The third optical layer 117c can be placed on the second electrode (CE2) so as to overlap with the multiple light-emitting elements (EDs) and the first optical layer 117a. For example, the third optical layer 117c can be placed so as not to overlap with the second optical layer 117b. Since the third optical layer 117c is placed on top of the second electrode (CE2) and the multiple light-emitting elements (EDs), it can improve unevenness that may occur in some of the multiple light-emitting elements (EDs). For example, when transferring multiple light-emitting elements (EDs) onto the substrate 110 of the display panel 100, areas where the spacing between the multiple light-emitting elements (EDs) is not uniform may occur due to process deviations, etc. If the spacing between the multiple light-emitting elements (EDs) is uneven, the light-emitting areas of each of the multiple light-emitting elements (EDs) may be formed unevenly, and this may be visible to the user as unevenness (mura). As a result, by adding a third optical layer 117c that uniformly diffuses light on top of the multiple light-emitting elements (EDs), it is possible to reduce or prevent the light emitted from some of the light-emitting elements (EDs) from appearing uneven. Therefore, since the light emitted from the multiple light-emitting elements (EDs) is uniformly diffused by the third optical layer 117c and extracted to the outside of the display panel 100, the brightness uniformity of the display device can be improved.

[0196] The third optical layer 117c may, but is not limited to, an organic insulating material in which fine particles 117cp are dispersed. For example, the third optical layer 117c may, but is not limited to, a siloxane in which fine metal particles 117cp, such as titanium dioxide (TiO2) particles, are dispersed. For example, the third optical layer 117c may, but is not limited to, the same material as the first optical layer 117a. For example, the third optical layer 117c may, but is not limited to, a diffusion layer or an upper diffusion layer.

[0197] According to one embodiment of this specification, light from multiple light-emitting elements (EDs) can be scattered by fine particles 117cp dispersed in the third optical layer 117c and emitted to the outside of the display panel 100. The third optical layer 117c uniformly mixes (or diffuses) the light emitted from the multiple light-emitting elements (EDs), further improving the brightness uniformity of the display device. Furthermore, the light extraction efficiency of the display device can be improved by the light scattered by the fine particles 117cp, allowing the display device to be driven with low power.

[0198] In the display area (AA), a black matrix (BM) can be placed on the second electrode (CE2), the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c.

[0199] The black matrix (BM) can be configured to include multiple openings (or light-transmitting areas) that overlap with each of the multiple light-emitting elements (EDs). For example, the black matrix (BM) can be formed (or configured) to cover the remaining display area excluding the areas that overlap with each of the multiple light-emitting elements (EDs). For example, the black matrix (BM) can fill the contact holes of the second optical layer 117b. Since the black matrix (BM) is configured to cover the display area (AA), it can reduce the mixing of light and external light reflection of multiple subpixels. For example, since the black matrix (BM) is also placed in the contact holes connecting the second electrode (CE2) and the contact electrode (CCE), it can prevent light leakage between multiple adjacent subpixels. For example, the black matrix (BM) can be made of an opaque material, but is not limited thereto. For example, the black matrix (BM) can be an organic insulating material to which a black pigment or black dye has been added, but is not limited thereto.

[0200] Referring to Figure 8, the display device 1000 according to one embodiment of this specification may further include a cover layer 118.

[0201] The cover layer 118 can be configured to cover the display area (AA). The cover layer 118 can be configured to cover the second electrode (or common electrode) (CE2) placed (or configured) in the display area (AA). For example, the cover layer 118 can be placed on the black matrix (BM) in the display area (AA). For example, the black matrix (BM) can be placed (or interposed) between the cover layer 118 and the optical layers 117a, 117b, and 117c.

[0202] The cover layer 118 can be configured to protect multiple light-emitting elements (EDs). For example, a configuration (or layer) between the substrate 110 and the cover layer 118 can be protected by the substrate 110 and the cover layer 118. For example, the cover layer 118 can be made of an organic or inorganic insulating material. For example, the cover layer 118 can be made of photoresist, polyimide, photoacrylic, etc., but is not limited to these. For example, the cover layer 118 can be an overcoat layer, a protective layer, or an insulating layer, etc., but is not limited to these.

[0203] According to one embodiment of this specification, a touch panel 200 can be placed (or configured) on the cover layer 118. A polarizing layer 180 can be placed on the touch panel 200 via a first adhesive layer 181. A cover member 120 can be placed on the polarizing layer 180 via a second adhesive layer 185.

[0204] According to other embodiments of this specification, the touch panel 200 may be positioned (or interposed) between the polarizing layer 180 and the cover member 120, but is not limited thereto. For example, the touch panel 200 may also be connected (or attached) to the back surface of the cover member 120.

[0205] According to other embodiments of this specification, a touch panel 200 can be directly formed (or configured) on the cover layer 118. For example, the touch panel 200 includes a touch electrode layer, which can be directly formed (or configured) on the upper surface of the cover layer 118. A polarizing layer 180 can be placed on the touch electrode layer of the touch panel 200 via a first adhesive layer 181. For example, the first adhesive layer 181 and the second adhesive layer 185 may include, but are not limited to, an optically cleared adhesive, an optically cleared resin, or a pressure-sensitive adhesive.

[0206] According to one embodiment of this specification, in the second non-display area (NA2), a plurality of pad electrodes (PEs) can be arranged on the third insulating layer 115c. For example, at least a portion of the plurality of pad electrodes (PEs) can be exposed without being covered by the passivation layer 116. For example, the plurality of pad electrodes PEs can be electrically connected to the second to fourth connecting wirings 122d via contact holes in the third insulating layer 115c.

[0207] An adhesive film (ACF) can be placed on multiple pad electrodes (PE). The adhesive film (ACF) may be, but is not limited to, an adhesive layer in which conductive balls are dispersed in an insulating material. When heat and / or pressure is applied to the adhesive film (ACF), the conductive balls can electrically connect in the heated and / or pressured portion and thus possess conductive properties. The adhesive film (ACF) can be placed between multiple pad electrodes (PE) and a flexible circuit board (or flexible film) 310 to adhere or bond the flexible circuit board (or flexible film) 310 to the multiple pad electrodes (PE). For example, the adhesive film (ACF) may be, but is not limited to, a conductive adhesive member, a conductive adhesive film, or an anisotropic conductive film.

[0208] A flexible circuit board 310 can be placed on an adhesive film (ACF). The flexible circuit board 310 can be electrically connected to a plurality of pad electrodes (PE) via the adhesive film (ACF). Therefore, signals output from the flexible circuit board 310 and the printed circuit board 330 can be transmitted to the pixel driving circuit (PD) in the display area (AA) via the wiring layer. For example, a signal output from the printed circuit board 330 can be transmitted to the pixel driving circuit (PD) in the display area AA via the flexible circuit board 310, the plurality of pad electrodes (PE), the second-to-fourth connecting wiring 122d, the second-to-third connecting wiring 122c, the second-to-second connecting wiring 122b, and the second-to-first connecting wiring 122a.

[0209] Figure 10 shows the drive timing of the display panel and touch panel according to the embodiments described herein.

[0210] Referring to Figure 10, the display device according to the embodiment of this specification can be driven by a display period (Display_Tn) and a touch period (Touch_Tn). The display period (Display_Tn) is the period during which an image is displayed on the display panel 100, and the touch period (Touch_Tn) may be the period during which a touch is sensed via the touch panel 200. For example, the display period (Display_Tn) and the touch period (Touch_Tn) may be the same. That is, the display panel 100 and the touch panel 200 can be driven simultaneously. This allows the display device to display an image on the screen via the display panel 100 while simultaneously sensing user touches via the touch panel 200.

[0211] Figure 11 is a plan view showing the electrode structure of a touch panel according to one embodiment of this specification. Figure 12 is an enlarged view of "A" shown in Figure 11. Figure 13 is a cross-sectional view of the line II-II' shown in Figure 12.

[0212] Referring to Figures 11 to 13, a touch panel 200 according to one embodiment of this specification may include first to nth touch drive lines (TX1 to TXn) and first to mth touch sensing lines (RX1 to RXm).

[0213] The first to nth touch drive lines (TX1 to TXn) can be touch drive lines for sensing user touch. For example, the first to nth touch drive lines TX1 to TXn can be multiple first touch lines.

[0214] The first to nth touch drive lines (TX1 to TXn) can be parallel to the first direction (X) and spaced apart from each other along the second direction (Y). For example, each of the first to nth touch drive lines (TX1 to TXn) can be positioned (or configured) to overlap with one row (or horizontal line) of the display panel, or with one or more second electrodes (CE2).

[0215] Each of the first to nth touch drive lines (TX1 to TXn) in one embodiment may include first to ith (where i is a natural number greater than or equal to 4) touch drive electrodes (TDE1 to TDEi) and a plurality of bridge electrodes (BE).

[0216] The first touch drive electrode (TDE1) can be positioned on one side (or end) of each of the first to nth touch drive lines (TX1 to TXn), and the ith touch drive electrode (TDEi) can be positioned on the other side (or end) of each of the first to nth touch drive lines (TX1 to TXn). The first touch drive electrode (TDE1) can be positioned (or configured) on the first edge portion (e.g., the left edge portion) of the touch panel 200, and the ith touch drive electrode (TDEi) can be positioned (or configured) on the second edge portion (e.g., the right edge portion) opposite to the first edge portion of the touch panel 200. The second to i-1th touch drive electrodes (TDE2 to TDEi-1) can be positioned (or configured) such that there is a constant gap between the first touch drive electrode (TDE1) and the ith touch drive electrode (TDEi) along the first direction (X). As a result, each of the first and i-touch driving electrodes (TDE1, TDEi) can be an edge driving electrode, and each of the second to i-1 touch driving electrodes (TDE2 to TDEi-1) can be an intermediate driving electrode.

[0217] Some of the first to i-th touch drive electrodes (TDE1 to TDEi) may have different sizes depending on the electrode arrangement structure (or position). For example, each of the first and i-th touch drive electrodes (TDE1, TDEi) may be smaller in size than each of the second to i-1th touch drive electrodes (TDE2 to TDEi-1).

[0218] Some of the first to i-th touch drive electrodes (TDE1 to TDEi) may have different shapes and sizes depending on the electrode arrangement structure (or position). For example, each of the first and i-th touch drive electrodes (TDE1, TDEi) may have a different shape from the second to i-1th touch drive electrodes (TDE2 to TDEi-1) and be smaller in size than each of the second to i-1st touch drive electrodes (TDE2 to TDEi-1).

[0219] According to one embodiment, each of the second to i-1 touch drive electrodes (TDE2 to TDEi-1) may have a square or rhombic shape. Each of the first and i-touch drive electrodes (TDE1, TDEi) may have a triangular shape, but is not limited thereto. For example, each of the first and i-touch drive electrodes (TDE1, TDEi) may have a triangular shape that is half the size of each of the second to i-1 touch drive electrodes (TDE2 to TDEi-1), but is not limited thereto.

[0220] In other embodiments, when each of the first and i-th touch driving electrodes (TDE1, TDEi) is smaller in size than each of the second to i-1-th touch driving electrodes (TDE2 to TDEi-1), each of the first and i-th touch driving electrodes (TDE1, TDEi) can have the same shape as each of the second to i-1-th touch driving electrodes (TDE2 to TDEi-1) or a different shape. For example, each of the second to i-1-th touch driving electrodes (TDE2 to TDEi-1) can have a square or rhombic shape, and each of the first and i-th touch driving electrodes (TDE1, TDEi) can have a triangular or square (or pentagonal) shape that is smaller in size than each of the second to i-1-th touch driving electrodes (TDE2 to TDEi-1).

[0221] Multiple bridge electrodes (BEs) can be arranged (or configured) to connect the first to i-th touch drive electrodes (TDE1 to TDEi). Multiple bridge electrodes (BEs) can be arranged (or configured) on a different layer from the first to i-th touch drive electrodes (TDE1 to TDEi). Multiple bridge electrodes (BEs) can be arranged (or configured) to electrically connect to two adjacent touch drive electrodes of the first to i-th touch drive electrodes (TDE1 to TDEi) along a first direction (X). For example, the touch drive electrodes (TDE1 to TDEi) and bridge electrodes (BEs) can be arranged (or configured) alternately and repeatedly along the first direction (X) so as to be electrically connected to each other. In this way, the first to i-th touch drive electrodes (TDE1 to TDEi) and the multiple bridge electrodes (BEs) can constitute a single touch drive line (TX1 to TXn) by being electrically connected to each other via the multiple bridge electrodes (BEs).

[0222] The first to mth touch sensing lines (RX1 to RXm) may be touch sensing lines for sensing user touch. For example, the first to mth touch sensing lines RX1 to RXm may be multiple second touch lines.

[0223] Each of the first to m-th touch sensing lines (RX1 to RXm) can be configured to form mutual capacitance with an adjacent touch drive line (TX1 to TXn) from the first to n-th touch drive lines (TX1 to TXn). The first to m-th touch sensing lines (RX1 to RXm) can be parallel to the second direction (Y) and spaced apart from each other along the first direction (X). For example, each of the first to m-th touch sensing lines (RX1 to RXm) can be positioned (or configured) to intersect with the first to n-th touch drive lines (TX1 to TXn). For example, the first touch sensing line (RX1) can be positioned (or configured) on the first edge portion of the touch panel 200, and the m-th touch sensing line (RXm) can be positioned (or configured) on the second edge portion of the touch panel 200. For example, the first and m touch sensing lines (RX1, RXm) may be edge sensing lines, and the second to m-1 touch sensing lines (RX2, RXm-1) may be intermediate sensing lines.

[0224] Each of the first to m touch sensing lines (RX1 to RXm) according to one embodiment may include first to j (where j is a natural number greater than or equal to 4) touch sensing electrodes (TSE1 to TSEj) and a plurality of electrode coupling lines (ECL).

[0225] The first touch sensing electrode (TSE1) can be positioned on one side (or end) of each of the first to m touch sensing lines (RX1 to RXm), and the jth touch sensing electrode (TSEj) can be positioned on the other side (other end) of each of the first to m touch sensing lines (RX1 to RXm). The first touch sensing electrode (TSE1) can be positioned (or configured) on the third edge portion (e.g., the upper edge portion) of the touch panel 200, and the jth touch sensing electrode (TSEj) can be positioned (or configured) on the fourth edge portion (e.g., the lower edge portion) opposite to the third edge portion of the touch panel 200. The second to j-1 touch sensing electrodes (TSE2 to TSEj-1) can be positioned (or configured) such that there is a constant gap between the first touch sensing electrode (TSE1) and the jth touch sensing electrode (TSEj) along the second direction (Y). As a result, each of the first and j-th touch sensing electrodes (TSE1, TSEj) is an edge sensing electrode, and each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1) can be an intermediate sensing electrode.

[0226] Some of the first to j-th touch sensing electrodes (TSE1 to TSEj) may have different sizes depending on the electrode arrangement structure (or position). For example, each of the first and j-th touch sensing electrodes (TSE1, TSEj) may be smaller in size than each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1).

[0227] Some of the first to j-th touch sensing electrodes (TSE1 to TSEj) may have different shapes and sizes depending on the electrode arrangement structure (or position). For example, each of the first and j-th touch sensing electrodes (TSE1, TSEj) may have a different shape from the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1) and may be smaller in size than each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1).

[0228] According to one embodiment, each of the second to j-1 touch sensing electrodes (TSE2 to TSEj-1) may have a square or rhombic shape. Each of the first and j touch sensing electrodes (TSE1, TSEj) may have a triangular shape, but is not limited thereto. For example, each of the first and j touch sensing electrodes (TSE1, TSEj) may have a triangular shape that is half the size of each of the second to j-1 touch sensing electrodes (TSE2 to TSEj-1), but is not limited thereto.

[0229] In other embodiments, when each of the first and j-th touch sensing electrodes (TSE1, TSEj) is smaller in size than each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1), each of the first and j-th touch sensing electrodes (TSE1, TSEj) can have the same shape as each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1) or a different shape. For example, each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1) can have a square or rhombic shape, and each of the first and j-th touch sensing electrodes (TSE1, TSEj) can have a triangular or square (or pentagonal) shape that is smaller in size than each of the second to j-1-th touch sensing electrodes (TSE2 to TSEj-1).

[0230] The first to jth touch sensing electrodes (TSE1 to TSEj) can be positioned (or configured) between the first to ith touch driving electrodes (TDE1 to TDEi). This allows the touch driving electrodes (TDE1 to TDEi) and the touch sensing electrodes (TSE1 to TSEj) to be positioned (or configured) alternately along the first direction (X) and the second direction (Y).

[0231] Multiple electrode coupling lines (ECLs) can be arranged (or configured) to connect the first to jth touch sensing electrodes (TSE1 to TSEj). Multiple electrode coupling lines (ECLs) can be arranged (or configured) on the same layer as the first to jth touch sensing electrodes (TSE1 to TSEj). Multiple electrode coupling lines (ECLs) can be arranged (or configured) to be electrically connected to two adjacent touch sensing electrodes of the first to jth touch sensing electrodes (TSE1 to TSEj) along the second direction Y. For example, j touch sensing electrodes (TSE1 to TSEj) and j-1 electrode coupling lines (ECLs) can be arranged (or configured) alternately and repeatedly along the second direction (Y) to electrically connect them to each other. As a result, the first to jth touch sensing electrodes (TSE1 to TSEj) are electrically connected to each other via multiple electrode coupling lines (ECLs), so that the first to jth touch sensing electrodes (TSE1 to TSEj) and the multiple electrode coupling lines (ECLs) can constitute a single touch sensing line RX1 to RXm. For example, each of the multiple electrode coupling lines (ECLs) may be an extension (or extension line) or protrusion (or protrusion line) of the first to jth touch sensing electrodes (TSE1 to TSEj).

[0232] Referring to Figure 13, a touch panel 200 according to one embodiment of this specification may include a touch electrode layer 210 and a passivation layer 230.

[0233] The touch electrode layer 210 can be formed (or configured) directly on the cover layer 118 of the display panel, but is not limited to this. For example, a touch buffer layer can be placed (or interposed) between the touch electrode layer 210 and the cover layer 118. In this case, the touch electrode layer 210 can be formed (or configured) directly on the touch buffer layer covering the cover layer 118.

[0234] A touch panel 200 or touch electrode layer 210 according to one embodiment may include a first touch electrode layer, a touch insulating layer 213, and a second touch electrode layer.

[0235] The first touch electrode layer can be formed (or configured) on the cover layer 118 (or touch buffer layer). The touch insulating layer 213 can be formed (or configured) to cover the first touch electrode layer. The touch insulating layer 213 can be made of an inorganic insulating material or an organic insulating material. The second touch electrode layer can be formed (or configured) on the touch insulating layer 213.

[0236] Each of the first to nth touch drive electrodes (TDE1 to TDEi) of the first to nth touch drive lines (TX1 to TXn) can be formed (or configured) in either the first touch electrode layer or the second touch electrode layer. Each of the multiple bridge electrodes (BE) of the first to nth touch drive lines (TX1 to TXn) can be formed (or configured) in a different layer from the first to ith touch drive electrodes (TDE1 to TDEi) among the first touch electrode layer and the second touch electrode layer. For example, each of the multiple bridge electrodes (BE) of the first to nth touch drive lines (TX1 to TXn) can be configured to be electrically connected to two adjacent touch drive electrodes of the first to ith touch drive electrodes (TDE1 to TDEi) via via holes (VH) provided in the touch insulating layer 213.

[0237] Each of the first to m touch sensing lines (RX1 to RXm), the first to j touch sensing electrodes (TSE1 to TSEj), and the multiple electrode connecting wires (ECL) can be formed (or configured) on the same layer as the first to i touch driving electrodes (TDE1 to TDEi).

[0238] According to one embodiment, each of the multiple bridge electrodes (BE) of the first to nth touch drive lines (TX1 to TXn) can be formed (or configured) in the first touch electrode layer, and each of the first to ith touch drive electrodes (TDE1 to TDEi) and the first to mth touch sensing lines (RX1 to RXm) of the first to nth touch drive lines (TX1 to TXn) can be formed (or configured) in the second touch electrode layer, but is not limited thereto. For example, each of the multiple bridge electrodes (BE) of the first to nth touch drive lines (TX1 to TXn) can be formed (or configured) in the second touch electrode layer, and each of the first to ith touch drive electrodes (TDE1 to TDEi) and the first to mth touch sensing lines (RX1 to RXm) of the first to nth touch drive lines (TX1 to TXn) can be formed (or configured) in the first touch electrode layer.

[0239] According to one embodiment, the first to nth touch drive lines (TX1 to TXn) and the first to mth touch sensing lines (RX1 to RXm) can be made of a transparent conductive material or of the same material as the multiple second electrodes (CE2).

[0240] The passivation layer 230 can be formed (or configured) to cover the touch electrode layer 210. The passivation layer 230 can be made of an organic insulating material. The passivation layer 230 can be a touch protective layer. The passivation layer 230 can be connected (or bonded) to the back surface of the polarizing layer 180 by a first adhesive layer 181. For example, the polarizing layer 180 can be attached to the upper surface of the passivation layer 230 via the first adhesive layer 181.

[0241] According to other embodiments of this specification, each of the first to nth touch drive lines (TX1 to TXn) and each of the first to mth touch sensing lines (RX1 to RXm) may include a mesh structure. In order to minimize (or prevent) the reduction in light transmittance by the touch panel 200 (or touch electrode layer 210), each of the first to nth touch drive lines (TX1 to TXn) and each of the first to mth touch sensing lines (RX1 to RXm) may include a mesh structure having mesh lines (ML).

[0242] The mesh lines (ML) can be formed (or configured) to have a constant (or fine) line width (W1). The mesh lines (ML) may overlap with a black matrix (BM) and may have a line width (W1) narrower than the line width (W2) of the black matrix (BM). For example, some of the mesh lines (ML) that overlap with a black matrix (BMa) placed between multiple light-emitting elements 130, 140, 150 may have a line width (W1) narrower than the line width (W2) of the black matrix (BMa). This minimizes (or prevents) the reduction in light transmittance caused by the mesh lines (ML) (or touch electrode layer 210) because some of the mesh lines (ML) do not overlap with the openings that overlap with each of the multiple light-emitting elements (ED) (or multiple first to third light-emitting elements 130, 140, 150).

[0243] According to one embodiment, the mesh line (ML) may include a plurality of first mesh lines parallel to a first direction (X), and a plurality of second mesh lines parallel to a second direction (Y) and intersecting the first mesh lines. The plurality of first mesh lines and the plurality of second mesh lines may be formed (or configured) in the same layer. The line width (W1) of each of the plurality of first mesh lines and the plurality of second mesh lines may be smaller than the line width (W2) of the black matrix (BMa).

[0244] Mesh lines (ML) having a line width (W1) narrower than the line width (W2) of the black matrix (BMa) do not affect light transmittance and can therefore be composed of highly conductive metallic materials. For example, mesh lines (ML) can be composed of, but are not limited to, gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), alloys of silver (Ag) and magnesium (Mg), or alloys thereof.

[0245] In the description with reference to Figure 13, the touch electrode layer 210, which includes the first to nth touch drive lines (TX1 to TXn) and the first to mth touch sensing lines (RX1 to RXm), is described as being formed (or configured) directly on the upper surface of the cover layer 118, but is not limited thereto. For example, a touch panel 200 according to other embodiments of this specification may include a first transparent film, a touch electrode layer 210 formed (or configured) on the first transparent film, which includes the first to nth touch drive lines (TX1 to TXn) and the first to mth touch sensing lines (RX1 to RXm), and a second transparent film covering the touch electrode layer 210. Such a touch panel 200 including the first transparent film, the touch electrode layer 210, and the second transparent film can be attached to the upper surface of the cover layer 118 via an adhesive layer. For example, the first transparent film of the touch panel 200 can be attached to the cover layer 118 by an adhesive layer. The polarizing layer 180 can be attached to the first transparent film of the touch panel 200 via the first adhesive layer 181.

[0246] Referring to Figures 11 to 13, the touch assist line 400 can be formed (or configured) on the touch panel 200 (or touch electrode layer 210). The touch assist line 400 can be configured to be spaced apart from each end of the first to nth touch drive lines (TX1 to TXn) and to form mutual capacitance (Cm_edge) with at least a portion of the first to mth touch sensing lines (RX1 to RXm). The touch assist line 400 can be formed (or configured) on the touch panel 200 (or touch electrode layer 210) parallel to the first to mth touch sensing lines (RX1 to RXm).

[0247] The touch assist line 400 can be positioned (or configured) to increase the overall capacitance of the first and m-th touch sensing lines (RX1, RXm) positioned (or configured) at the edge of the screen among the first to m-th touch sensing lines (RX1 to RXm). This increases (or reinforces) the capacitance between each of the first and m-th touch sensing lines (RX1, RXm) positioned (or configured) at the edge of the screen and the touch assist line 400, thereby improving touch sensitivity (or touch performance) at the edge of the screen and preventing or minimizing unevenness in touch sensitivity (or touch performance).

[0248] The touch assist line 400 can be formed (or configured) on the touch panel 200 (or touch electrode layer 210) so as to be spaced apart from each end (TXe) of the first and i-th touch drive electrodes (TDE1, TDEi) that constitute (or form) each of the first to n-th touch drive lines (TX1 to TXn). For example, the touch assist line 400 can be arranged (or configured) on the same layer as the first and m-th touch sensing lines (RX1, RXm), or can be configured on the same layer as a plurality of bridge electrodes BE.

[0249] The touch assist line 400 can be formed (or configured) to compensate for the deviation between the capacitance (or first capacitance) (Cm1) of the edge sensing line (or edge sensing electrode) (RX1, RXm) and the capacitance (or second capacitance) (Cm2) of the intermediate sensing line (or intermediate sensing electrode) (RX2~RXm-1). For example, the assist line 400 can form a mutual capacitance (Cm_edge) with the edge sensing line (RX1, RXm). For convenience of explanation, the mutual capacitance (or assist capacitance) formed between the touch assist line 400 and the edge sensing line (RX1, RXm) will be referred to as edge capacitance (Cm_edge) below.

[0250] The edge capacitance (Cm_edge) formed between the touch assist line 400 and the edge sensing lines (RX1, RXm) can be formed in parallel with the first capacitance (Cm1) to increase the first capacitance (Cm1). For example, the touch assist line 400 can be formed (or configured) such that the edge capacitance (Cm_edge) corresponds to the deviation between the first capacitance (Cm1) and the second capacitance (Cm2).

[0251] For example, in the first to nth touch drive lines (TX1 to TXn), the size of the first touch drive electrode (TDE1) and the size of the second touch drive electrode (TDE2) are different, so the first capacitance (Cm1) formed on the first touch sensing line (RX1) (or the mth touch sensing line (RXm)) may be different from the second capacitance (Cm2) formed on the second touch sensing line (RX2).

[0252] For example, the first capacitance (Cm1) formed on the first touch sensing line (RX1) may be the sum of the first-to-first capacitance (C11) between the first touch sensing electrode (TSE1) and the first touch driving electrode (TDE1), the first-to-second capacitance (C12) between the first touch sensing electrode (TSE1) and the second touch driving electrode (TDE2), the first-to-third capacitance (C13) between the second touch sensing electrode (TSE2) and the first touch driving electrode (TDE1), and the first-to-fourth capacitance (C14) between the second touch sensing electrode (TSE2) and the second touch driving electrode (TDE2) (Cm1 = C11 + C12 + C13 + C14).

[0253] For example, the second capacitance (Cm2) formed on the second touch sensing line (RX2) may be the sum of the second-first capacitance (C21) between the first touch sensing electrode (TSE1) and the second touch driving electrode (TDE2), the second-second capacitance (C22) between the first touch sensing electrode (TSE1) and the third touch driving electrode (TDE3), the second-third capacitance (C23) between the second touch sensing electrode (TSE2) and the second touch driving electrode (TDE2), and the second-fourth capacitance (C24) between the second touch sensing electrode (TSE2) and the third touch driving electrode (TDE3) (Cm2 = C21 + C22C + C23 + C24).

[0254] For example, if the touch assist line 400 is not provided, the first touch drive electrode (TDE1), which has a triangular (or square) shape, is smaller in size than the second and third touch drive electrodes (TDE2, TDE3), which have a rhombus (or square) shape, so the first capacitance (Cm1) may be smaller than the second capacitance (Cm2).

[0255] As in one embodiment of this specification, when a touch assist line 400 is arranged, an edge capacitance (Cm_edge) is formed in parallel with the first capacitance (Cm1) between the touch assist line 400 and the first touch sensing line (RX1) (or the mth touch sensing line (RXm)). As a result, the edge capacitance (Cm_edge) formed by the touch assist line 400 is added to the first capacitance (Cm1), so that the total capacitance (Cm1+Cm_edge) formed on the first touch sensing line (RX1) can be the same as or similar to the second capacitance (Cm2) formed on the second touch sensing line (RX2).

[0256] The touch assist line 400 according to one embodiment of this specification may include a first touch assist line 410 and a second touch assist line 420.

[0257] The first touch auxiliary line 410 can be positioned (or configured) on the first edge portion of the touch panel 200 adjacent to or parallel to each of the first touch drive electrodes (TDE1) of the first to nth touch drive lines (TX1 to TXn). For example, the first touch auxiliary line 410 can be positioned (or configured) on the first edge portion of the touch panel 200 parallel to the second direction (Y). The first touch auxiliary line 410 may be adjacent to or parallel to each of the first touch drive electrodes (TDE1) that constitute each of the first to nth touch drive lines (TX1 to TXn).

[0258] The first touch auxiliary line 410 can be configured to form an edge capacitance (Cm_edge) with the first touch sensing line (RX1). For example, the first touch auxiliary line 410 can form an edge capacitance (Cm_edge) with each of the first to jth touch sensing electrodes (TSE1 to TSEj) of the first touch sensing line (RX1). For example, the first touch auxiliary line 410 can form an edge capacitance (Cm_edge) in common with the first to jth touch sensing electrodes (TSE1 to TSEj) of the first touch sensing line (RX1). As a result, the mutual capacitance between the first touch sensing line (RX1) and the first to nth touch driving lines (TX1 to TXn) can be increased by forming an edge capacitance (Cm_edge) between the first touch auxiliary line 410 and the first touch sensing line (RX1). Therefore, the first touch auxiliary line 410 can improve the touch sensitivity (or touch performance) at the first edge portion of the touch panel 200.

[0259] The second touch auxiliary line 420 can be configured to form an edge capacitance (Cm_edge) with the m-th touch sensing line (RXm). For example, the second touch auxiliary line 420 can form an edge capacitance (Cm_edge) with each of the first to j-th touch sensing electrodes (TSE1 to TSEj) of the m-th touch sensing line (RXm). For example, the second touch auxiliary line 420 can form an edge capacitance (Cm_edge) in common with the first to j-th touch sensing electrodes (TSE1 to TSEj) of the m-th touch sensing line (RXm). As a result, the formation of an edge capacitance (Cm_edge) between the second touch auxiliary line 420 and the m-th touch sensing line (RXm) can increase the mutual capacitance between the m-th touch sensing line (RXm) and the first to n-th touch driving lines (TX1 to TXn). Therefore, the second touch auxiliary line 420 can improve the touch sensitivity (or touch performance) at the second edge portion of the touch panel 200.

[0260] Figure 14 shows the output signal of a touch drive circuit according to one embodiment of this specification.

[0261] Referring to Figures 11, 12, and 14, a touch drive circuit 390 according to one embodiment of this specification can be electrically connected to the first to nth touch drive lines (TX1 to TXn), the first to mth touch sensing lines (RX1 to RXm), and the touch auxiliary line 400 of the touch panel 200. The touch drive circuit 390 can be configured to supply touch drive signals (TDS) to each of the first to nth touch drive lines (TX1 to TXn) based on a touch synchronization signal (Tsync), and to supply auxiliary drive signals (ADS) synchronized with the touch drive signals (TDS) to the touch auxiliary line 400.

[0262] The touch drive circuit 390 according to one embodiment of this specification may include a touch drive unit 391.

[0263] The touch drive unit 391 can be configured to sequentially supply touch drive signals (TDS) to each of the first to nth touch drive lines (TX1 to TXn) based on a touch synchronization signal (Tsync), and to supply auxiliary drive signals (ADS) synchronized with the touch drive signals (TDS) to the touch auxiliary line 400. For example, the touch drive unit 391 can generate touch drive signals (TDS) and auxiliary drive signals (ADS) having one or more pulse signals (PS) via a pulse width modulation scheme, sequentially supply touch drive signals (TDS) to each of the first to nth touch drive lines (TX1 to TXn) based on a touch synchronization signal (Tsync), and repeatedly supply auxiliary drive signals (ADS) synchronized with each of the touch drive signals (TDS) supplied sequentially to each of the first to nth touch drive lines (TX1 to TXn) to the touch auxiliary line 400.

[0264] Each of the touch drive signal (TDS) and auxiliary drive signal (ADS) may include one or more pulse signals (PS) having the same phase and pulse width. In one embodiment, each of the touch drive signal (TDS) and auxiliary drive signal (ADS) may include, but is not limited to, one or more pulse signals (PS) having the same phase, the same voltage level (VL1) (or amplitude), and the same pulse width. For example, the phase, voltage level (VL1) (or amplitude), and pulse width of each of the one or more pulse signals (PS) of the touch drive signal (TDS) and the one or more pulse signals (PS) of the auxiliary drive signal (ADS) may be, but is not limited to, the same as each other. For example, if the total capacitance (Cm1 + Cm_edge) formed on the edge sensing lines (RX1, RXm) is the same as or similar to the second capacitance (Cm2) formed on the intermediate sensing lines (RX2 ~ RXm-1), the touch drive circuit 390 (or touch drive unit 391) can be configured to simultaneously output one or more pulse signals (PS) of touch drive signals (TDS) and one or more pulse signals (PS) of auxiliary drive signals (ADS), each having the same phase, voltage level (VL1) (or amplitude), and pulse width.

[0265] The touch drive circuit 390 according to one embodiment of this specification can be incorporated into the drive integrated circuit 311 or implemented (or configured) inside the drive integrated circuit 311. For example, the touch drive unit 391 can be incorporated into the power management integrated circuit 370 or implemented (or configured) inside the power management integrated circuit 370.

[0266] Figure 15 shows the capacitance formed on the edge sensing line of the touch panel shown in Figures 11 and 12. Figure 16 shows the capacitance formed on the intermediate sensing line of the touch panel shown in Figures 11 and 12.

[0267] Referring to Figures 15 and 16, when a touch drive signal (TDS) is applied to the touch drive lines (TX1 to TXn), and an auxiliary drive signal (ADS) synchronized with the touch drive signal (TDS) is applied to the touch auxiliary line 400, an edge capacitance (Cm_edge) is formed between the edge sensing lines (RX1, RXm) and the touch auxiliary line 400, and a first capacitance (Cm1) can be formed between the touch drive lines (TX1 to TXn) and the edge sensing lines (RX1, RXm). Simultaneously, a second capacitance (Cm2) can be formed between the touch drive lines (TX1 to TXn) and the intermediate sensing lines (RX2 to RXm-1). As a result, the total capacitance (Cm1 + Cm_edge) formed on the edge sensing lines (RX1, RXm) may be the same as or similar to the second capacitance (Cm2) formed on the intermediate sensing lines (RX2 to RXm-1) by the edge capacitance (Cm_edge) formed by the touch auxiliary line 400. For example, the total capacitance (Cm1 + Cm_edge) formed on each of the first and m-th touch sensing lines (RX1, RXm) may be the same as or similar to the second capacitance (Cm2) formed on each of the second to m-1 touch sensing lines (RX2 to RXm-1) by the edge capacitance (Cm_edge) formed by the touch auxiliary line 400.

[0268] Figure 17 shows the output signals of a touch drive circuit according to another embodiment of this specification. For example, Figure 17 shows a modified auxiliary drive signal from the output signals of the touch drive circuit described with reference to Figures 11, 12, and 14. Therefore, in the following description, only the auxiliary drive signal will be described, and redundant explanations may be omitted or simplified. Accordingly, the explanations for Figures 11, 12, and 14 may be included in the explanation of Figure 17.

[0269] Referring to Figures 11, 12, and 17, according to other embodiments of this specification, each of the touch drive signal (TDS) and auxiliary drive signal (ADS) may include one or more pulse signals (PS) having the same phase and pulse width. The one or more pulse signals (PS) of the touch drive signal (TDS) and the one or more pulse signals (PS) of the auxiliary drive signal (ADS) may have different voltage levels (or amplitudes). For example, the voltage level (VL2) (or amplitude) of one or more pulse signals (PS) of the auxiliary drive signal (ADS) may be higher than the voltage level (VL1) (or amplitude) of one or more pulse signals (PS) of the touch drive signal (TDS). For example, if the total capacitance (Cm1 + Cm_edge) formed on the edge sensing lines (RX1, RXm) is smaller than the second capacitance (Cm2) formed on the intermediate sensing lines (RX2 to RXm-1), the touch drive circuit 390 (or touch drive unit 391) can be configured to simultaneously output one or more pulse signals (PS) of touch drive signals (TDS) and one or more pulse signals (PS) of auxiliary drive signals (ADS) having the same phase and pulse width but different voltage levels (VL1, VL2) (or amplitude).

[0270] According to other embodiments of this specification, the total capacitance (Cm1 + Cm_edge) formed on the edge sensing lines (RX1, RXm) may be the same as or similar to the second capacitance (Cm2) formed on the intermediate sensing lines (RX2 to RXm-1) by the edge capacitance (Cm_edge) formed by the voltage level (VL2) (or amplitude) of the touch auxiliary line 400 and the auxiliary drive signal (ADS). For example, the total capacitance (Cm1 + Cm_edge) formed on each of the first and m touch sensing lines (RX1, RXm) may be the same as or similar to the second capacitance (Cm2) formed on each of the second to m-1 touch sensing lines (RX2 to RXm-1) by the edge capacitance (Cm_edge) formed by the voltage level (VL2) (or amplitude) of the touch auxiliary line 400 and the auxiliary drive signal (ADS).

[0271] Figure 18 shows a touch panel of a display device according to another embodiment of this specification. For example, Figure 18 is a modification of the touch guide lines described with reference to Figures 11 to 17. Therefore, the following description will only describe the touch guide lines, and redundant explanations may be omitted or simplified. Accordingly, the explanations for Figures 11 to 17 may be included in the description of Figure 18.

[0272] Referring to Figure 18, in a display device according to another embodiment of this specification, the touch assist line 400 can be formed to be spaced apart from each end of the first to nth touch drive lines (TX1 to TXn) and each end of the first to mth touch sensing lines (RX1 to RXm), and to form mutual capacitance with each of the first to mth touch sensing lines (RX1 to RXm).

[0273] The touch assist line 400 can be spaced apart from each of the first and i-touch drive electrodes (TDE1, TEn) of each of the first to n-th touch drive lines (TX1 to TXn), and spaced apart from each of the first and j-touch sensing electrodes (TSE1, TSEj) of each of the first to m-th touch sensing lines (RX1 to RXm). Thus, the touch assist line 400 can be configured to form mutual capacitance with each of the first to j-th touch sensing electrodes (TSE1 to TSEj) of each of the first and m-th touch sensing lines (RX1, RXm), and can be configured to form mutual capacitance with each of the first and j-th touch sensing electrodes (TSE1, TSEj) of each of the first to m-th touch sensing lines (RX1 to RXm). For example, the touch assist line 400, as described with reference to Figures 11 to 17, is configured to further form mutual capacitance with each of the first and jth touch sensing electrodes (TSE1, TSEj) of the first to mth touch sensing lines (RX1 to RXm).

[0274] The touch assist line 400 may be positioned along the edge of the touch panel 200, or it may include a ring shape formed on the edge of the touch panel 200. For example, the touch assist line 400 may include a ring shape that overlaps with the edge of the touch panel 200. For example, the touch assist line 400 may include first to fourth touch assist lines 410, 420, 430, and 440.

[0275] The first touch assist line 410 is configured to improve the touch sensitivity (or touch performance) at the first edge portion of the touch panel 200. This is substantially the same as the first touch assist line 410 described with reference to Figures 11 to 17, so a redundant explanation will be omitted.

[0276] The second touch assist line 420 is configured to improve the touch sensitivity (or touch performance) at the second edge portion of the touch panel 200. This is substantially the same as the second touch assist line 420 described with reference to Figures 11 to 17, so a redundant explanation will be omitted.

[0277] The third touch auxiliary line 430 can be configured on the third edge portion of the touch panel 200 so as to be connected to one end of the first touch auxiliary line 410 and one end of the second auxiliary line 420. For example, the third touch auxiliary line 430 can be configured on the third edge portion of the touch panel 200 parallel to each of the first touch sensing electrodes (TSE1) of the first to m touch sensing lines (RX1 to RXm).

[0278] The third touch assist line 430 can be configured to form an edge capacitance with each of the first to mth touch sensing lines (RX1 to RXm). For example, the third touch assist line 430 can form an edge capacitance with the first touch sensing electrode (TSE1) of each of the first to mth touch sensing lines (RX1 to RXm). For example, the third touch assist line 430 can commonly form an edge capacitance with the first touch sensing electrode (TSE1) of each of the first to mth touch sensing lines (RX1 to RXm). Thereby, an edge capacitance is formed between each of the first to mth touch sensing lines (RX1 to RXm) and the third touch assist line 430, so that the mutual capacitance between each of the first to mth touch sensing lines (RX1 to RXm) and the first to nth touch drive lines (TX1 to TXn) can be increased. Therefore, the third touch assist line 430 can improve the touch sensitivity (or touch performance) at the third edge portion of the touch panel 200.

[0279] The fourth touch assist line 440 can be configured at the fourth edge portion of the touch panel 200 so as to be connected to the other end of the first touch assist line 410 and the other end of the second assist line 420. For example, the fourth touch assist line 440 can be configured at the fourth edge portion of the touch panel 200 in parallel with the jth touch sensing electrode (TSEj) of each of the first to mth touch sensing lines (RX1 to RXm).

[0280] The fourth touch assist line 440 can be configured to form an edge capacitance with each of the first to mth touch sensing lines (RX1 to RXm). For example, the fourth touch assist line 440 can form an edge capacitance with each jth touch sensing electrode (TSEj) of the first to mth touch sensing lines (RX1 to RXm). For example, the fourth touch assist line 440 can commonly form an edge capacitance with each jth touch sensing electrode (TSEj) of the first to mth touch sensing lines (RX1 to RXm). Thereby, by forming an edge capacitance between each of the first to mth touch sensing lines (RX1 to RXm) and the fourth touch assist line 440, the mutual capacitance between each of the first to mth touch sensing lines (RX1 to RXm) and the first to nth touch drive lines (TX1 to TXn) can be increased. Therefore, the fourth touch assist line 440 can improve the touch sensitivity (or touch performance) at the fourth edge portion of the touch panel 200.

[0281] The touch assist line 400 including the first to fourth touch assist lines 410, 420, 430, 440 can receive an assist drive signal supplied from a touch drive circuit (or a touch drive unit). The assist drive signal can be synchronized with the touch drive signals sequentially applied to the first to nth touch drive lines (TX1 to TXn). Since the touch drive circuit (or the touch drive unit) is substantially the same as the touch drive circuit (or the touch drive unit) described with reference to FIGS. 14 to 17 except that it applies an assist drive signal to the touch assist line 400 including the first to fourth touch assist lines 410, 420, 430, 440, a redundant description thereof will be omitted. Further, since the assist drive signal is substantially the same as the assist drive signal described with reference to FIGS. 14 to 17, a redundant description thereof will be omitted.

[0282] According to other embodiments of this specification, by arranging (or configuring) the touch assist line 400 in a ring shape along the edge portion of the touch panel 200, the capacitance of each of the first to m touch sensing lines (RX1 to RXm) is increased (or reinforced), thereby further improving the touch sensitivity (or touch performance) at the edge portion of the screen and preventing or minimizing unevenness in touch sensitivity (or touch performance).

[0283] Figure 19 shows a second electrode and a touch panel in a display device according to another embodiment of this specification. Figure 20 is an enlarged view of "B" shown in Figure 19. Figure 21 is a cross-sectional view of line III-III' shown in Figure 20. For example, Figures 19 to 21 are modifications of the touch assist lines described with reference to Figures 11 to 17. Therefore, in the following description, only the touch assist lines will be described, and redundant explanations can be omitted or simplified. Accordingly, the description of the touch panel described with reference to Figures 11 to 17 may be included in the description of Figures 19 to 21.

[0284] Referring to Figures 19 to 21, in other embodiments of the Specified Display Device, the touch assist line 400 may be configured to improve touch sensitivity (or touch performance) at the edges of the screen. For example, the touch assist line 400 may be placed (or configured) on the display panel. The touch assist line 400 may be placed (or configured) beneath the touch panel 200. The touch assist line 400 may be placed (or configured) on a metal layer beneath the touch panel 200.

[0285] The touch assist line 400 can be positioned (or configured) to increase the overall capacitance of the first and m touch sensing lines (RX1, RXm) among the first to m touch sensing lines (RX1 to RXm) that are positioned (or configured) at the edge of the screen. The touch assist line 400 can be formed (or configured) on the display panel so as to be spaced away from each end (TXe) of the first and i touch driving electrodes (TDE1, TDEi) that constitute (or form) each of the first to n touch driving lines (TX1 to TXn).

[0286] In one embodiment, the touch assist line 400 can be made of the same material as the second electrode (or common electrode) (CE2), or formed (or configured) in the same layer as the second electrode (CE2). For example, the touch assist line 400 can be made of the electrode material (or metallic material) of the second electrode (CE2) deposited (or formed) on the edge portion of the display panel. For example, the electrode material (or metallic material) of the second electrode (CE2) deposited (or formed) on the edge portion of the display panel can be used as the touch assist line 400 by remaining on the edge portion of the display panel without being patterned (or removed) during the patterning (or removal) process of the second electrode (CE2). Thus, the touch assist line 400 can be formed (or configured) together with the second electrode (CE2).

[0287] In one embodiment, the touch assist line 400 can be formed (or configured) on the optical layer to correspond to the edge portion of the display panel. For example, the touch assist line 400 can be positioned (or interposed) between the optical layer 117b and the black matrix (BM) to correspond to the edge portion of the display panel. The touch assist line 400 may, but is not limited to, be covered by the black matrix (BM). For example, a portion of the black matrix (BM) at the edge portion of the display panel may further include an opening hole (or exposed hole) (BMh) that overlaps with the touch assist line 400. For example, the opening hole (BMh) of the black matrix (BM) may have the same shape as the touch assist line 400. The line width of the opening hole of the black matrix (BM) may be the same as or wider than the line width of the touch assist line 400. The opening hole (BMh) of the black matrix (BM) may be covered by a cover layer 118. For example, the cover layer 118 may fill the opening hole (BMh) of the black matrix (BM).

[0288] The touch assist line 400 according to other embodiments of this specification may include a first touch assist line 410 and a second touch assist line 420.

[0289] The first touch auxiliary line 410 can improve the touch sensitivity (or touch performance) at the first edge portion of the touch panel 200. The first touch auxiliary line 410 can be formed (or configured) together with the second electrode (CE2) at the first edge portion of the display panel using the same material as the second electrode (CE2). The first touch auxiliary line 410 can be positioned (or interposed) between the optical layer 117b and the black matrix (BM) to correspond to the first edge portion of the display panel. The first touch auxiliary line 410 can be configured to form edge capacitance with the first touch sensing line (RX1). For example, the first touch auxiliary line 410 can form edge capacitance with each of the first to jth touch sensing electrodes (TSE1 to TSEj) of the first touch sensing line (RX1). Such a first touch auxiliary line 410 is substantially identical to the first touch auxiliary line 410 described with reference to Figures 11 to 17, except that it is formed (or configured) together with the second electrode (CE2), so a redundant explanation is omitted. The description of the first touch auxiliary line 410 described with reference to Figures 11 to 17 may be included in the description of the first touch auxiliary line 410 shown in Figures 19 to 21.

[0290] The second touch auxiliary line 420 can improve the touch sensitivity (or touch performance) at the second edge portion of the touch panel 200. The second touch auxiliary line 420 can be formed (or configured) together with the second electrode (CE2) at the second edge portion of the display panel using the same material as the second electrode (CE2). The second touch auxiliary line 420 can be positioned (or interposed) between the optical layer 117b and the black matrix (BM) to correspond to the second edge portion of the display panel. The second touch auxiliary line 420 can be configured to form edge capacitance with the m-th touch sensing line (RXm). For example, the second touch auxiliary line 420 can form edge capacitance with each of the first to j-th touch sensing electrodes (TSE1 to TSEj) of the m-th touch sensing line (RXm). Such a second touch auxiliary line 420 is substantially identical to the second touch auxiliary line 420 described with reference to Figures 11 to 17, except that it is formed (or configured) together with the second electrode (CE2), so a redundant explanation is omitted. The description of the second touch auxiliary line 420 described with reference to Figures 11 to 17 may be included in the description of the second touch auxiliary line 420 shown in Figures 19 to 21.

[0291] In other embodiments of this specification, the display device includes a touch assist line 400 formed (or configured) on the edge portion of the display panel together with the second electrode (CE2) using the same material as the second electrode (CE2). This increases (or complements) the capacitance of each of the first to m touch sensing lines (RX1 to RXm), thereby improving touch sensitivity (or touch performance) at the edge portion of the screen and preventing or minimizing non-uniformity of touch sensitivity (or touch performance).

[0292] Figure 22 shows a touch panel of a display device according to another embodiment of this specification. For example, Figure 22 is a modification of the touch guide lines described with reference to Figures 19 to 21. Therefore, only the touch guide lines will be described in the following description, and redundant explanations may be omitted or simplified. Accordingly, the explanations for Figures 19 to 21 may be included in the explanation of Figure 22.

[0293] Referring to Figure 22, in a display device according to another embodiment of this specification, the touch assist line 400 may include first to fourth touch assist lines 410, 420, 430, and 440. For example, the touch assist line 400 may include a ring shape containing the first to fourth touch assist lines 410, 420, 430, and 440.

[0294] Since the first touch assist line 410 and the second touch assist line 420 are substantially identical to the first touch assist line 410 and the second touch assist line 420 described with reference to Figures 19 to 21, redundant explanations will be omitted.

[0295] The third touch assist line 430 can improve the touch sensitivity (or touch performance) at the third edge portion of the touch panel 200. The third touch assist line 430 can be configured at the third edge portion of the display panel so as to be connected to one end of the first touch assist line 410 and one end of the second assist line 420. Such a third touch assist line 430 is substantially identical to the first touch assist line 410 described with reference to Figures 19 to 21, except that it is formed (or configured) at the third edge portion of the display panel together with the second electrode (CE2), so a redundant explanation of it will be omitted.

[0296] The fourth touch auxiliary line 440 can improve the touch sensitivity (or touch performance) at the fourth edge portion of the touch panel 200. The fourth touch auxiliary line 440 can be configured at the fourth edge portion of the display panel so as to connect to the other end of the first touch auxiliary line 410 and the other end of the second auxiliary line 420. Such a fourth touch auxiliary line 440 is substantially identical to the first touch auxiliary line 410 described with reference to Figures 19 to 21, except that it is formed (or configured) at the fourth edge portion of the display panel together with the second electrode (CE2), so a redundant explanation of it will be omitted.

[0297] Display devices according to other embodiments of this specification include a touch assist line 400 formed (or configured) in a ring shape along the edge portion of the display panel together with the second electrode (CE2) using the same material as the second electrode (CE2). This increases (or complements) the capacitance of each of the first to m touch sensing lines (RX1 to RXm), thereby improving touch sensitivity (or touch performance) at the edge portion of the screen and preventing or minimizing non-uniformity of touch sensitivity (or touch performance).

[0298] Figures 23 to 26 show devices to which the display devices according to the embodiments of this specification are applied.

[0299] Referring to Figures 23 to 26, the display devices according to the embodiments herein can be applied to or included in a variety of devices or electronic devices. For example, a variety of electronic devices may include, but are not limited to, a wearable device 1100 as shown in Figure 23, a mobile device 1200 as shown in Figure 24, a notebook 1300 as shown in Figure 25, and a monitor or television 1400 as shown in Figure 26.

[0300] Each of the wearable device 1100, mobile device 1200, notebook 1300, and monitor or television 1400 may include a case portion 1005, 1010, 1015, 1020, and a display device 1000 according to the embodiments of this specification described above.

[0301] For example, the display device according to the embodiments of the present specification can be applied to mobile devices, video phones, smart watches, watch phones, wearable apparatuses, foldable apparatuses, rollable apparatuses, bendable apparatuses, flexible apparatuses, curved apparatuses, sliding apparatuses, variable apparatuses, electronic notebooks, e-books, PMPs (portable multimedia players), PDAs (personal digital assistants), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigations, vehicle navigations, vehicle display devices, theater display devices, TVs, wallpaper devices, signage devices, game devices, notebook PCs, monitors, cameras, camcorders, and household electrical appliances, etc.

[0302] The present specification described above is not limited to the aforementioned embodiments and the attached drawings, and it will be apparent to those having ordinary knowledge in the technical field to which the present specification pertains that various substitutions, modifications, and changes are possible without departing from the technical idea of the present specification. Therefore, the scope of the present specification is indicated by the claims described below, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included within the scope of the present specification.

Description of Reference Numerals

[0303] 100: Display panel 110: Substrate 116: Passivation layer 117a, 117b, 117c: optical layer 118: Cover layer 120: Cover component 121: 1st connection wiring 122:Second connection wiring 130: First light-emitting element 140: Second light-emitting element 150: Third light-emitting element 200: Touch panel 300: Drive circuit section 390: Touch drive circuit 391: Touch drive unit 400: Touch Assist Line

Claims

1. Display panel including multiple pixel driving circuits, A touch panel configured on the aforementioned display panel, and Includes touch assist lines configured on the display panel or touch panel, The aforementioned touch panel The 1st to the nth (where n is a natural number greater than or equal to 4) touch drive lines, and It includes first to m (where m is a natural number of 4 or more) touch sensing lines configured to form mutual capacitance with adjacent touch driving lines among the first to n touch driving lines, A display device wherein the touch assist line is separated from each end of the first to nth touch drive lines and is configured to form mutual capacitance with at least a portion of the first to mth touch sensing lines.

2. Each of the first to nth touch drive lines is The first to i (where i is a natural number greater than or equal to 4) touch-driven electrodes, and It includes a plurality of bridge electrodes configured to connect the first to i-touch drive electrodes, In one of the first to nth touch drive lines, each of the first and i-th touch drive electrodes is smaller in size than each of the second to i-1st touch drive electrodes. The display device according to claim 1, wherein the touch assist line is spaced apart from each end of the first and i-touch drive electrodes of each of the first to n-th touch drive lines.

3. In one of the first to nth touch drive lines, each of the second to i-1st touch drive electrodes has a square or rhombic shape. In one of the first to nth touch drive lines, each of the first and i-th touch drive electrodes has the same shape as each of the second to i-1st touch drive electrodes, or has a different shape. The display device according to claim 2, wherein the touch assistance line is configured parallel to the first to m-th touch sensing lines.

4. The aforementioned touch assist line, A first touch auxiliary line configured to be adjacent to each of the first touch drive electrodes of the first to nth touch drive lines, and The display device according to claim 3, further comprising a second touch auxiliary line configured to be adjacent to each of the i-touch drive electrodes of the first to n-th touch drive lines.

5. The display device according to claim 2, wherein the touch assist line is configured to be spaced apart from each end of the first to nth touch drive lines and each end of the first to mth touch sensing lines, and to form mutual capacitance with each of the first to mth touch sensing lines.

6. Each of the first to m touch sensing lines is The first to jth (where j is a natural number greater than or equal to 4) touch sensing electrodes, and It includes a plurality of electrode connecting wires configured to connect the first to j touch sensing electrodes, In one of the first to m touch sensing lines, each of the first and j touch sensing electrodes is smaller in size than each of the second to j-1 touch sensing electrodes. The display device according to claim 2, wherein the touch assist line is spaced apart from the respective ends of the first and j touch sensing electrodes of each of the first to m touch sensing lines.

7. In one of the first to m-th touch sensing lines, each of the second to j-1-th touch sensing electrodes has a square or rhombic shape. In one of the first to m touch sensing lines, each of the first and j touch sensing electrodes has the same shape as each of the second to j-1 touch sensing electrodes, or has a different shape. The display device according to claim 6, wherein the touch assist line includes a ring shape that overlaps with the edge portion of the touch panel.

8. The aforementioned touch panel First touch electrode layer, A touch insulating layer covering the first touch electrode layer, and The touch insulating layer includes a second touch electrode layer, The first to i-touch driving electrodes are configured in either the first touch electrode layer or the second touch electrode layer. The plurality of bridge electrodes are configured in layers different from the first to i-th touch drive electrodes among the first touch electrode layer and the second touch electrode layer, Each of the plurality of bridge electrodes is configured to be electrically connected to two adjacent touch drive electrodes among the first to i-th touch drive electrodes via via holes provided in the touch insulating layer. The display device according to claim 6, wherein the first to j-th touch sensing electrodes and the plurality of electrode connecting wirings are configured on the same layer as the first to i-th touch driving electrodes.

9. The display device according to claim 2, wherein the touch assist line is configured in the same layer as the first to m-th touch sensing lines, or is configured in the same layer as the plurality of bridge electrodes.

10. The system further includes touch drive circuits electrically connected to the first to nth touch drive lines, the first to mth touch sensing lines, and the touch assist lines. The display device according to any one of claims 1 to 7, wherein the touch drive circuit is configured to supply a touch drive signal to each of the first to nth touch drive lines and to supply an auxiliary drive signal synchronized with the touch drive signal to the touch auxiliary line.

11. The display device according to claim 10, wherein each of the touch drive signal and the auxiliary drive signal includes one or more pulse signals having the same phase, the same pulse width, and the same voltage level.

12. Each of the touch drive signal and the auxiliary drive signal includes one or more pulse signals having the same phase and the same pulse width. The display device according to claim 10, wherein the one or more pulse signals of the touch drive signal and the one or more pulse signals of the auxiliary drive signal have different voltage levels from each other.

13. The aforementioned display panel, A substrate including a display area and a non-display area, The plurality of pixel driving circuits located in the display area on the substrate, An insulating layer covering the plurality of pixel driving circuits, Multiple light-emitting elements electrically connected to each of the multiple pixel driving circuits, A common electrode electrically connected to the plurality of light-emitting elements, and The display device according to any one of claims 1 to 7, comprising a cover layer covering the common electrode.

14. The display device according to claim 13, wherein the touch assist line is configured in the same layer as the first to m touch sensing lines, or is made of the same material as the common electrode.

15. The aforementioned touch panel A touch electrode layer is provided on the cover layer of the display panel, and includes the first to nth touch drive lines and the first to mth touch sensing lines, The display device according to claim 13, further comprising a passivation layer covering the touch electrode layer.

16. The display device according to claim 15, wherein the touch assist line is configured in the same layer as the first to m touch sensing lines, or in the same layer as the common electrode.

17. The display panel further includes a black matrix having a plurality of openings superimposed on each of the plurality of light-emitting elements, Each of the first to nth touch drive lines and each of the first to mth touch sensing lines includes a mesh structure having mesh lines. The display device according to claim 13, wherein the mesh lines overlap with the black matrix and have a line width narrower than the line width of the black matrix.

18. The aforementioned display panel, Multiple banks in the aforementioned insulating layer, Multiple connecting electrodes arranged in the multiple banks and electrically connected to the corresponding pixel driving circuit among the multiple pixel driving circuits, The plurality of bonding pads are further included on the plurality of connecting electrodes, Each of the plurality of light-emitting elements is A first electrode electrically connected to the corresponding bonding pad among the plurality of bonding pads, and The display device according to claim 13, further comprising a second electrode electrically connected to the common electrode.

19. The display device according to claim 18, wherein the display panel further includes an optical layer configured on the insulating layer so as to surround the side surface of at least one of the plurality of light-emitting elements and the side surface of at least one of the plurality of banks.

20. The optical layer is Between the common electrode and the insulating layer, a first optical layer surrounds the sides of the plurality of light-emitting elements and the plurality of banks. A second optical layer surrounding the side of the first optical layer, and The display device according to claim 19, further comprising the plurality of light-emitting elements and a third optical layer disposed on the common electrode so as to overlap with the first optical layer.

Images