Resin composition and cured product thereof

The resin composition with benzoxazine and biscitraconimide compounds enhances the glass transition temperature and moldability of cured products, addressing the low performance of benzoxazines with terminal unsaturated hydrocarbon groups in printed circuit boards.

JP2026093090AActive Publication Date: 2026-06-08DKS CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DKS CO LTD
Filing Date
2024-11-27
Publication Date
2026-06-08

AI Technical Summary

Technical Problem

Benzoxazines with terminal unsaturated hydrocarbon groups do not achieve the required high glass transition temperature in cured products, particularly when used as printed circuit board materials.

Method used

A resin composition containing specific compounds represented by general formulas (1) and (2), comprising benzoxazine and biscitraconimide, which react thermally to enhance the glass transition temperature through ring-opening polymerization and crosslinking.

Benefits of technology

The resin composition improves the glass transition temperature and moldability of the cured product, while maintaining low water absorption and solvent solubility, making it suitable for printed circuit boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

To improve the glass transition temperature of a cured product in a resin composition containing benzoxazine having terminal unsaturated hydrocarbon groups. [Solution] The resin composition according to the embodiment contains compounds of formula (1) and formula (2). JPEG2026093090000032.jpg74167
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Description

[Technical Field]

[0001] Embodiments of the present invention relate to a resin composition containing benzoxazine and biscitraconimide, and a cured product thereof. [Background technology]

[0002] Benzoxazines are compounds containing a benzoxazine ring formed by the condensation reaction of phenols, amines, and formaldehyde. Benzoxazines are thermosetting monomers that harden when heated, as the benzoxazine ring undergoes ring-opening polymerization.

[0003] For example, Patent Document 1 discloses a benzoxazine having two benzoxazine rings in one molecule, obtained by the condensation reaction of phenol, 4,4'-diaminodiphenylmethane, and paraformaldehyde. Patent Document 2 discloses a benzoxazine having benzoxazine rings at the 3 and 4' positions of the diphenyl ether group, obtained by the condensation reaction of phenol, 3,4'-diaminodiphenyl ether, and formaldehyde.

[0004] On the other hand, it is known that biscitraconimide is used as a printed circuit board material, for example. Biscitraconimide does not heat-cur on its own, but it is known that it can be heat-cured by adding a crosslinking agent (curing agent).

[0005] For example, Patent Document 3 describes that a resin material containing a maleimide compound having a skeleton derived from a dimer amine may have benzoxazine added as a curing agent, and that the maleimide compound may also be a citraconimide compound. Patent Document 4 describes that a lithography film-forming material containing a polycitraconimide compound may contain benzoxazine as a crosslinking agent. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Patent No. 4647398 [Patent Document 2] Japanese Patent Publication No. 2018-184533 [Patent Document 3] International Publication No. 2020 / 045408 [Patent Document 4] International Publication No. 2020 / 004316 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Some benzoxazines have allyl groups at their molecular ends. While these terminally unsaturated hydrocarbon groups do not react through the thermal ring-opening polymerization of benzoxazine, they can react with other polymerizable monomers. When using benzoxazines with such terminally unsaturated hydrocarbon groups, for example, as printed circuit board materials, a high glass transition temperature of the cured product is required.

[0008] Embodiments of the present invention aim to improve the glass transition temperature of a cured product in a resin composition containing benzoxazine having terminal unsaturated hydrocarbon groups. [Means for solving the problem]

[0009] The present invention includes embodiments shown below. [1] A compound represented by the following general formula (1) and a compound represented by the following general formula (2) are included, [ka] In formula (1), R 1 R represents a divalent hydrocarbon group having 1 to 100 carbon atoms, which may contain heteroatoms. 2 and R 3 Each of these independently represents an alkanediyl group with 1 to 10 carbon atoms, and R 4 and R 5 Each of these independently represents a hydrogen atom or a methyl group, R 6 and R7 each independently represents a methyl group or an ethyl group, p and q each independently represent an integer from 0 to 2, [Chemical formula] In formula (2), R 8 represents a divalent hydrocarbon group having 1 to 100 carbon atoms which may contain a heteroatom, a resin composition.

[0010] [2] The R in the formula (1) 1 is a divalent aromatic ring-containing hydrocarbon group having 6 to 50 carbon atoms which may contain a heteroatom, the resin composition according to [1]. [3] The compound represented by the formula (1) is represented by the following general formula (1A), [Chemical formula] In formula (1A), R 11 represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, or -O-, R 12 and R <000001十二>each independently represents a methyl group or an ethyl group, s and t each independently represent an integer from 0 to 4, R 2 and R 3 each independently represents an alkanediyl group having 1 to 10 carbon atoms, R 4 and R 5 each independently represents a hydrogen atom or a methyl group, R 6 and R 7 each independently represents a methyl group or an ethyl group, p and q each independently represent an integer from 0 to 2, the resin composition according to [1].

[0011] [4] The R in the formula (2) 8 is a divalent aromatic ring-containing hydrocarbon group having 6 to 50 carbon atoms which may contain a heteroatom, the resin composition according to any one of [1] to [3]. [5] The compound represented by the formula (2) is represented by the following general formula (2A), [Chemical formula] In formula (2A), R It should be noted that there may be some inaccuracies in the original text's line breaks and formatting. The translation attempts to maintain the overall structure and content as accurately as possible while adhering to the translation rules. If there are any specific issues or further clarifications needed regarding the translation, please feel free to ask. Also, the "十二" in the tag <000001十二> seems to be an error. It should probably be 13 for a more meaningful translation.21 R represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, -O-, or a group represented by the following formula (21A), 22 and R 23 Each of these independently represents either a methyl group or an ethyl group, and each of u and v independently represents an integer from 0 to 4. [ka] In formula (21A), R 24 and R 25 The resin composition according to any one of the items [1] to [3], wherein each of the following independently represents -CH2-, -CH(CH3)-, -C(CH3)2-, or -O-.

[0012] [6] A resin composition according to any one of [1] to [5], used as a printed circuit board material. [7] A cured product obtained by curing any one of the resin compositions described in [1] to [6]. [Effects of the Invention]

[0013] According to embodiments of the present invention, the glass transition temperature of a cured product can be improved in a resin composition containing benzoxazine having terminally unsaturated hydrocarbon groups. [Modes for carrying out the invention]

[0014] The resin composition according to this embodiment contains a compound represented by the following general formula (1) (hereinafter referred to as compound (1)). Compound (1) is a compound composed of one molecule of diamine, two molecules of phenols, and four molecules of formaldehyde, and has two benzoxazine rings in its molecule. [ka]

[0015] In equation (1), R 1 R represents a divalent hydrocarbon group having 1 to 100 carbon atoms, which may contain heteroatoms. 1The number of carbon atoms in the hydrocarbon group is preferably 2 to 70, more preferably 3 to 50, more preferably 5 to 30, and even more preferably 6 to 20. Examples of heteroatoms include oxygen atoms, nitrogen atoms, sulfur atoms, fluorine atoms, silicon atoms, etc., and oxygen atoms are preferred, but R 1 It is preferable that it does not contain heteroatoms.

[0016] R 1 The hydrocarbon group preferably contains an aromatic ring (i.e., is an aromatic ring-containing hydrocarbon group), more preferably contains a benzene ring, and even more preferably contains two or three benzene rings. Therefore, R 1 The number of carbon atoms in the hydrocarbon group is more preferably 6 to 50, more preferably 12 to 30, and even more preferably 12 to 20.

[0017] In equation (1), R 2 and R 3 Each of these independently represents an alkanediyl group (also called an alkylene group) having 1 to 10 carbon atoms. The alkanediyl group may be a straight chain or a branched chain. Preferably, R 2 and R 3 Each of these is independently an alkanediyl group having 1 to 5 carbon atoms, more preferably an alkanediyl group having 1 to 3 carbon atoms, more preferably an ethylene group (-CH2CH2-) or a methylene group (-CH2-), and even more preferably a methylene group. In formula (1), R 4 and R 5 Each of these independently represents a hydrogen atom or a methyl group, and more preferably a hydrogen atom. H2C=CR 4 R 2 - and H2C=CR 5 R 3 The unsaturated hydrocarbon group represented by - has an allyl group (H2C=CH-CH2-) or a methallyl group (H2C=C(CH3)-CH2-) at its terminal end, CR 4 or CR 5 It is preferable that the carbon adjacent to it is a methylene group.

[0018] In equation (1), R 6 and R 7 Each independently represents a methyl group or an ethyl group, more preferably a methyl group. In formula (1), p and q each independently represent an integer from 0 to 2, more preferably independently 0 or 1, and even more preferably 0.

[0019] In equation (1), H2C = CR 4 R 2 - and H2C=CR 5 R 3 - represents an unsaturated hydrocarbon group and R 6 and R 7 For substituents represented by , their bonding positions to the benzene ring are preferably set as follows: One unsaturated hydrocarbon group and 0 to 2 substituents are bonded to the benzene ring, provided that at least one of the ortho or para positions relative to the oxygen atom bonded to the benzene ring is unsubstituted (i.e., a hydrogen atom). Preferably, the unsaturated hydrocarbon group is bonded to the ortho position relative to the oxygen atom.

[0020] Compound (1) is more preferably represented by the following general formula (1A). [ka]

[0021] In equation (1A), R 11 R represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, or -O-. 11 R is preferably a single bond, -CH2-, or -O-, and more preferably a single bond or -CH2-. 11 The binding site is Ph-R 11 - A group represented by Ph (where Ph is substituent R) 12 or R 13 This shows a benzene ring which may have a benzene ring. The preferred bonding position of the benzoxazine ring to the benzene ring is the 4,4', 3,4', or 3,3' position.

[0022] In equation (1A), R 12 and R 13 Each independently represents either a methyl group or an ethyl group, and more preferably a methyl group. 12 and R 13 If multiple instances of each exist within a single molecule, they may be identical or different. s and t each independently represent integers from 0 to 4, more preferably from 0 to 2, and even more preferably 0 or 1.

[0023] In equation (1A), R 2 , R 3 , R 4 , R 5 , R 6 , R 7 p and q are R in equation (1), respectively. 2 , R 3 , R 4 , R 5 , R 6 , R 7 , is the same as p and q.

[0024] In one embodiment, compound (1) is preferably represented by the following general formula (1B). [ka] In equation (1B), R 11 , R 12 , R 13 , R 2 , R 3 , R 4 , R 5 s and t are R in equation (1A), respectively. 11 , R 12 , R 13 , R 2 , R 3 , R 4 , R 5 , is the same as s and t.

[0025] In one embodiment, compound (1) may be a compound represented by the following general formula (1C). [ka] In formula (1C), R 2 , R 3 , R 4 and R 5 are the same as R 2 , R 3 , R 4 and R 5 in formula (1A), respectively.

[0026] In one embodiment, the compound (1) may be a compound represented by the following general formula (1D).

Chemical formula

[0029] Examples of solvents include organic solvents capable of dissolving benzoxazine, such as toluene, xylene, cumene, monochlorobenzene, methyl ethyl ketone, ethyl acetate, butyl acetate, chloroform, dichloromethane, THF, dioxane, and dimethylformamide. These may be used individually or in combination of two or more.

[0030] Regarding the ratio of phenols, diamines, and formaldehyde, since the target product represented by formula (1) is obtained by reacting 2 moles of phenols and 4 moles of formaldehyde with 1 mole of diamine, the amount of charge can be set based on this. For example, it is preferable to charge 2.0 to 2.5 moles of phenols per mole of diamine, more preferably 2.0 to 2.2 moles, and even more preferably 2.0 to 2.1 moles. It is preferable to charge 3.9 to 5.0 moles of formaldehyde per mole of diamine, more preferably 4.0 to 4.5 moles, and even more preferably 4.0 to 4.3 moles.

[0031] The reaction products obtained by the condensation reaction described above typically include compound (1) as the main product, as well as by-products such as a one-ring open compound in which one of the two benzoxazine rings of compound (1) is not closed, and polymers (including oligomers) of compound (1). The resin composition according to this embodiment may contain compound (1) and a by-product corresponding to compound (1) as benzoxazine. That is, compound (1) and the by-product (as an optional component) corresponding to compound (1) are collectively referred to as benzoxazine, and the resin composition according to this embodiment contains this benzoxazine. The proportion of compound (1) in the benzoxazine is not particularly limited, but is preferably 40% or more, more preferably 45% or more, and even more preferably 50% or more. There is no particular upper limit, but the proportion of compound (1) is usually 80% or less, and may be 70% or less. Here, the proportion of compound (1) is the ratio of peak areas obtained by GPC analysis.

[0032] The resin composition according to this embodiment contains a compound represented by the following general formula (2) (hereinafter referred to as compound (2)). Compound (2) is a biscitraconimide having two citraconimide groups. [ka]

[0033] In equation (2), R 8 R represents a divalent hydrocarbon group having 1 to 100 carbon atoms, which may contain heteroatoms. 8 The number of carbon atoms in the hydrocarbon group is preferably 2 to 70, more preferably 3 to 50, more preferably 5 to 30, and even more preferably 6 to 20. Examples of heteroatoms include oxygen atoms, nitrogen atoms, sulfur atoms, fluorine atoms, silicon atoms, etc., and oxygen atoms are preferred, but R 8 It is preferable that it does not contain heteroatoms.

[0034] R 8The hydrocarbon group preferably contains an aromatic ring (i.e., is an aromatic ring-containing hydrocarbon group), more preferably contains a benzene ring, and even more preferably contains two or three benzene rings. Therefore, R 8 The number of carbon atoms in the hydrocarbon group is more preferably 6 to 50, more preferably 12 to 30, and even more preferably 12 to 20.

[0035] Compound (2) is more preferably represented by the following general formula (2A). [ka]

[0036] In equation (2A), R 21 represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, -O-, or a group represented by the following formula (21A). [ka] In equation (21A), R 24 and R 25 Each of these independently represents -CH2-, -CH(CH3)-, -C(CH3)2-, or -O-.

[0037] In equation (2A), R 21 R is preferably a single bond, -CH2-, -O-, or a group represented by formula (21A), more preferably a single bond or -CH2-. 21 The binding site is Ph-R 21 - A group represented by Ph (where Ph is substituent R) 22 or R 23 The benzene ring may have a benzene ring. The preferred bond position of the citraconimide group to the benzene ring is the 4,4', 3,4', or 3,3' position.

[0038] In equation (21A), R 24 and R 25Preferably, each is independently -CH2-, -CH(CH3)-, or -C(CH3)2-, and more preferably -C(CH3)2-. R relative to the benzene ring 24 and R 25 The bonding position is preferably the meta or para position, and more preferably the meta position.

[0039] In equation (2A), R 22 and R 23 Each independently represents either a methyl group or an ethyl group, and more preferably a methyl group. 22 and R 23 If multiple of each are present in a single molecule, they may be the same or different. u and v each independently represent integers from 0 to 4, more preferably integers from 0 to 2, and even more preferably 0 or 1.

[0040] In one embodiment, compound (2) is preferably represented by the following general formula (2B). [ka] In equation (2B), R 21 , R 22 , R 23 u and v are R in equation (2A), respectively. 21 , R 22 , R 23 u and v are the same.

[0041] The method for producing compound (2) is not particularly limited, and for example, it can be obtained by dehydration condensation reaction of citraconic anhydride and a diamine.

[0042] The resin composition according to this embodiment is a thermosetting resin composition comprising compound (1) and compound (2). Specifically, compound (1) has a benzoxazine ring and therefore hardens (thermospheric curing) by thermal ring-opening polymerization as a monomer. Also, compound (1) has H2C=CR 4 R 2 - and H2C=CR 5 R 3The unsaturated hydrocarbon group represented by - reacts with the citraconimide of compound (2), causing compound (2) to thermally cure together with compound (1). Therefore, the cured product of the resin composition according to the embodiment is expected to have an improved glass transition temperature compared to when compound (1) is cured alone. Furthermore, in the resin composition according to the embodiment, compound (2), which is biscitraconimide, has higher solvent solubility than its similar substance, bismaleimide. In addition, the resin composition according to the embodiment has high reactivity in the curing reaction and excellent moldability of the cured product. Moreover, the resin composition according to the embodiment has a low water absorption rate and excellent low water absorption properties.

[0043] In the resin composition according to the embodiment, the mixing ratio of compound (1) and compound (2) is not particularly limited, but in one embodiment it may be set as follows. Since compound (1) is usually produced together with by-products such as ring-opened products and polymers as described above, it is preferable to set the mixing ratio with compound (2) as a benzoxazine containing these by-products. That is, the mass ratio of benzoxazine (BZO) consisting of compound (1) and its by-products to biscitraconimide (CI) of compound (2), i.e., the mass ratio of BZO to CI, BZO / CI, is preferably 0.35 to 4.0, more preferably 0.4 to 3.0, and more preferably 0.8 to 2.0. By having a BZO / CI of 4.0 or less, the effect of improving the glass transition temperature of the cured product can be enhanced. By having a BZO / CI of 0.35 or more, the moldability of the cured product can be improved.

[0044] The resin composition according to the embodiment may consist only of the benzoxazine (BZO) containing compound (1) and biscitraconimide (CI) of compound (2), or it may contain, for example, other thermosetting resins and / or thermoplastic resins along with BZO and CI. The resin composition may also contain various known additives such as solvents, catalysts, crosslinking agents, curing accelerators, colorants, radical polymerization initiators, leveling agents, flame retardants, antioxidants, and inorganic fillers.

[0045] In the resin composition, the total amount of benzoxazine (BZO) and biscitraconimide (CI), excluding the solvent, is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. In one embodiment, the resin composition is a resin solution containing a solvent. In this case, the solvent content in the resin composition is not particularly limited and may be, for example, 30 to 70% by mass or 40 to 60% by mass.

[0046] Examples of solvents included in the resin composition are organic solvents capable of dissolving benzoxazine and biscitraconimide, such as toluene, xylene, cumene, monochlorobenzene, methyl ethyl ketone, ethyl acetate, butyl acetate, chloroform, dichloromethane, THF, dioxane, and dimethylformamide. These may be used individually or in combination of two or more. Aromatic hydrocarbon solvents and ketone solvents are preferred as solvents. Furthermore, non-halogen solvents with a boiling point of 150°C or lower are preferred from the viewpoint of ease of removal of the solvent by evaporation during curing.

[0047] Examples of catalysts included in the resin composition include imidazole-based catalysts such as 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, and 1,2-dimethylimidazole, and organophosphorus-based catalysts such as triphenylphosphine and tributylphosphine.

[0048] The cured product according to this embodiment is obtained by curing the above resin composition, which is usually cured by heating. The curing conditions are not particularly limited, and for example, heating may be performed at 150°C to 250°C for 30 to 180 minutes. If the resin composition contains a solvent, the solvent may be evaporated by heating, and then the temperature may be further increased to perform thermal curing.

[0049] The resin composition according to this embodiment can be used in a variety of applications, such as electrical insulating materials and matrix resins for composite materials.

[0050] In one embodiment, the resin composition is preferably used as a printed circuit board material. That is, the printed circuit board material according to one embodiment includes a resin composition containing compound (1) and compound (2). Using this printed circuit board material, printed circuit boards such as printed wiring boards and printed circuit boards according to one embodiment can be manufactured.

[0051] Examples of printed circuit board materials include rigid printed circuit board materials for manufacturing single-sided boards, double-sided boards, multilayer boards, and build-up boards, as well as flexible printed circuit board materials for manufacturing film-like or sheet-like flexible printed circuit boards. [Examples]

[0052] The present invention will be described in more detail below based on examples and comparative examples, but it is not limited thereto.

[0053] <Measurement and Evaluation Methods> [Purity of the main product in benzoxazine] For BZO-4 in Synthesis Examples 1-2 and Comparative Synthesis Examples 3-4, the reaction product was dissolved in THF to a concentration of approximately 0.2 mg / ml. GPC measurements were performed using gel permeation chromatography (GPC) (Prominence, Shimadzu Corporation) with four columns (Shodex GPC columns KF-601, KF-602, KF-603, KF-604, manufactured by Resonaq Corporation) lined up with polystyrene gel as the packing material. The measurement conditions were a column oven temperature of 40°C and a flow rate of 0.6 ml / min, and a differential refractive index detector (Shodex RI-504, manufactured by Resonaq Corporation) was used. From the obtained chromatograms, peaks originating from the solvent (toluene) were removed, and the purity of the main product was calculated as a ratio (%) of the peak areas.

[0054] [Solubility] Each component was mixed according to the formulations shown in Tables 1 and 2 (units are in grams). The mixture that dissolved uniformly at room temperature was designated as "A," the mixture that dissolved uniformly after heating to 50°C was designated as "B," and the mixture that still contained insoluble matter even after heating to 50°C was designated as "C."

[0055] [Moldability] For the examples and comparative examples whose solubility evaluation was A or B, the resin compositions prepared with the formulations (g) shown in Table 1 or Table 2 were placed in aluminum cups with an upper diameter of 60 mm, a lower diameter of 54 mm, and a depth of 16 mm, and heated on a hot plate at 120°C for 1 hour to remove the solvent. The hot plate was then heated to 250°C for 1 hour to perform thermal curing, and a flat plate was produced by allowing it to cool to room temperature. Plates with significant appearance defects, such as bubbles, cracks, and curing defects, were classified as "B," while those with minor or no such appearance defects were classified as "A."

[0056] [Glass transition temperature (Tg)] For the examples and comparative examples where the solubility evaluation above was A or B, the resin composition prepared with the formulation (g) shown in Table 1 or Table 2 was placed in an aluminum cup with an upper diameter of 60 mm, a lower diameter of 54 mm, and a depth of 16 mm, and the solvent was removed by distillation by heating on a hot plate at 120°C for 1 hour. The hot plate was then heated to 250°C for 1 hour to perform thermosetting, and a flat plate was produced by allowing it to cool to room temperature. For those where the moldability evaluation above was A, a test piece with a width of 5 mm, a thickness of approximately 1 mm, and a length of 30 mm was prepared from the obtained flat plate. Next, the glass transition temperature was measured using a dynamic viscoelasticity measuring device: Rheogel-E4000 (manufactured by UBM Co., Ltd.). For the test piece, the temperature at which the loss tangent (tanδ), measured under conditions of tensile sine wave, dynamic strain of 5 μm, frequency of 1 Hz, and heating rate of 3°C / min, took its maximum value was determined as the glass transition temperature.

[0057] [Water absorption rate] Test specimens similar to those used for measuring the glass transition temperature in Examples 1-11 and Comparative Example 5 were prepared, and the percentage increase in mass (%) before and after immersion in water at 25°C for 24 hours was measured and calculated as the 25°C water absorption rate. Similarly, the percentage increase in mass (%) before and after immersion in water at 40°C for 24 hours was measured and calculated as the 40°C water absorption rate.

[0058] <Synthesis Example 1> In a 5 L reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 521.0 g of 4,4'-diaminodiphenylmethane, 705.2 g of 2-allylphenol, and 1569.3 g of toluene were added and dissolved at 75°C. Next, 343.1 g of 92% by mass paraformaldehyde was added in five portions, and the reaction mixture was heated to remove the water produced by the dehydration condensation reaction. The reaction mixture was further heated to 105-110°C and the reaction was continued for 6 hours. After the reaction mixture was cooled to room temperature, 301.7 g of toluene was added to dilute it. 784.6 g of 10% by mass sodium hydroxide aqueous solution was added, stirred for 15 minutes, and allowed to stand to separate and remove the aqueous layer. This procedure was repeated twice. Furthermore, 627.7 g of water and 156.9 g of isopropyl alcohol (IPA) were added to the resulting organic layer, stirred for 15 minutes, and allowed to stand to separate and remove the aqueous layer. This procedure was repeated five times. The water and IPA in the obtained organic layer were removed by vacuum distillation using a rotary evaporator to obtain a toluene solution (BZO1) containing the reaction product at a concentration of 49.8% by mass. The obtained reaction product was a benzoxazine containing the compound represented by the following formula as the main product, and the purity of the main product by GPC analysis was 56.2%. [ka]

[0059] <Synthesis Example 2> In a 5 L reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 436.9 g of 4,4'-diamino-2,2'-dimethylbiphenyl, 552.0 g of 2-allylphenol, and 1257.6 g of toluene were added and dissolved at 75°C. Next, 268.7 g of 92% by mass paraformaldehyde was added in five portions, and the reaction mixture was heated to remove the water produced by the dehydration condensation reaction. The reaction mixture was further heated to 105-110°C and the reaction was continued for 6 hours. After the reaction mixture was cooled to room temperature, 168.4 g of toluene was added to dilute it. 503.0 g of 10% by mass aqueous sodium hydroxide solution and 125.8 g of IPA were added, and the mixture was stirred for 15 minutes. After standing, the aqueous layer was separated and removed twice, and the resulting organic layer was diluted with 179.2 g of toluene. 503.0 g of water and 125.8 g of IPA were added, and the mixture was stirred for 15 minutes. This process of separating and removing the aqueous layer was repeated five times. The water and IPA from the resulting organic layer were removed by vacuum distillation to obtain a toluene solution (BZO2) containing the reaction product at a concentration of 51.4% by mass. The resulting reaction product was a benzoxazine with the compound represented by the following formula as the main product, and the purity of the main product by GPC analysis was 61.7%. [ka]

[0060] <Synthesis Example 3> In a 500 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 149.2 g of anhydrous citraconic acid and 845.5 g of toluene were added and mixed. A solution of 120.0 g of 4,4'-diaminodiphenylmethane dissolved in 360.0 g of N-methylpyrrolidone (NMP) was added dropwise, and the mixture was reacted for 30 minutes. After adding 11.5 g of p-toluenesulfonic acid monohydrate to the reaction mixture, the reaction was heated and continued at 105-110°C for 4 hours while distilling off the water produced by the dehydration condensation reaction, and then the reaction mixture was cooled to 85°C. 360.0 g of water was added, and the mixture was stirred at 75-85°C. This process of separating and removing the aqueous layer was repeated three times, and the resulting organic layer was concentrated in a rotary evaporator to a solution of approximately 50% by mass. This solution was poured into 4678 g of IPA, and the precipitated solid was collected and vacuum-dried at 60°C to obtain citraconimide (CI1) represented by the following formula. [ka]

[0061] <Synthesis Example 4> In a 500 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 17.9 g of anhydrous citraconic acid and 47.7 g of toluene were added and mixed. A solution of 25.0 g of 1,3-bis[2-(4-aminophenyl)-2-propyl]benzene dissolved in 100.0 g of toluene and 12.0 g of NMP was added dropwise and the mixture was reacted for 30 minutes. After adding 1.4 g of p-toluenesulfonic acid monohydrate to the reaction mixture, the reaction was heated and continued at 105-110°C for 3 hours while distilling off the water produced by the dehydration condensation reaction, and the reaction mixture was cooled to 100°C. After adding 75.0 g of water and stirring at 75-85°C, the mixture was allowed to stand and the aqueous layer was separated and removed three times. The resulting organic layer was concentrated in a rotary evaporator to obtain a toluene solution (Cl2) containing biscitraconimide, represented by the following formula, at a concentration of 35.5% by mass. [ka]

[0062] <Synthesis Example 5> In a 500 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 20.0 g of 4,4'-diamino-2,2'-dimethylbiphenyl, 142.1 g of toluene, and 7.8 g of NMP were added and mixed. 23.2 g of anhydrous citraconic acid was added dropwise, and the mixture was allowed to react for 30 minutes. 1.8 g of p-toluenesulfonic acid monohydrate was added to the reaction mixture, and the reaction was continued at 105-110°C for 4 hours while the water produced by the dehydration condensation reaction was removed from the system by distillation. 54.3 g of NMP was added to the reaction mixture, and the reaction was continued for another hour. The reaction mixture was then cooled to 100°C. 60.0 g of water was added, and the mixture was stirred at 75-85°C. The aqueous layer was separated and removed three times. The resulting organic layer was then concentrated in a rotary evaporator to a solution of approximately 40%. This solution was poured into 754 g of IPA, and the precipitated solid was collected and vacuum-dried at 60°C to obtain biscitraconimide (CI3), represented by the following formula. [ka]

[0063] <Comparative Synthesis Example 1> In a 500 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 15.7 g of maleic anhydride and 62.8 g of toluene were added and mixed. A solution of 25.0 g of 1,3-bis[2-(4-aminophenyl)-2-propyl]benzene dissolved in 100.0 g of toluene and 7.0 g of NMP was added dropwise and the mixture was allowed to react for 30 minutes. After adding 1.4 g of p-toluenesulfonic acid monohydrate to the reaction mixture, the reaction was heated and continued at 105-110°C for 4 hours while distilling off the water produced by the dehydration condensation reaction, and the reaction mixture was cooled to 100°C. 75.0 g of water was added and stirred at 75-85°C, and the aqueous layer was separated and removed three times. The resulting organic layer was then concentrated in a rotary evaporator to a solution of approximately 50%. This solution was poured into 366 g of IPA, and the precipitated solid was collected and vacuum-dried at 60°C to obtain bismaleimide (MI2) represented by the following formula. [ka]

[0064] <Comparative Synthesis Example 2> In a 500 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 20.3 g of maleic anhydride and 140.9 g of toluene were added and mixed. A solution of 20.0 g of 4,4'-diamino-2,2'-dimethylbiphenyl dissolved in 60.0 g of NMP was added dropwise and the mixture was allowed to react for 30 minutes. After adding 1.8 g of p-toluenesulfonic acid monohydrate to the reaction mixture, the reaction was heated and continued at 105-110°C for 4 hours while distilling off the water produced by the dehydration condensation reaction, and then the reaction mixture was cooled to 100°C. 60.0 g of water was added and stirred at 75-85°C, and the aqueous layer was separated and removed three times. The resulting organic layer was then concentrated in a rotary evaporator to a solution of approximately 60%. This solution was poured into 702 g of IPA, and the precipitated solid was collected and vacuum-dried at 60°C to obtain bismaleimide (MI3) represented by the following formula. [ka]

[0065] <Comparative Synthesis Example 3> In a 500 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 79.3 g of 4,4'-diaminodiphenylmethane, 75.3 g of phenol, and 206.8 g of toluene were added and dissolved at 75°C. Next, 52.2 g of 92% by mass of paraformaldehyde was added in five portions. The reaction solution was heated to 105°C over approximately 3 hours, and after the water produced by the dehydration condensation reaction was removed from the system, the reaction solution was cooled to room temperature. This reaction solution was poured into 1034 g of IPA, the precipitated solid was collected, and the reaction product (BZO3) was obtained by vacuum drying at 50°C. The obtained reaction product was a benzoxazine containing the compound represented by the following formula as the main product, and the purity of the main product by GPC analysis was 44.1%. [ka]

[0066] <Comparative Synthesis Example 4> In a 300 mL reactor equipped with a condenser, a Dean-Stark apparatus, and a stirrer, 21.2 g of 4,4'-diamino-2,2'-dimethylbiphenyl, 18.8 g of phenol, and 53.0 g of toluene were added and dissolved at 75°C. Next, 13.0 g of 92% by mass of paraformaldehyde was added in five portions, and the reaction mixture was heated to remove the water produced by the dehydration condensation reaction. The reaction mixture was further heated to 105-110°C and the reaction was continued for 4 hours, after which it was cooled to room temperature. This reaction mixture was poured into 530 g of methanol, the precipitated solid was collected, and the reaction product (BZO4) was obtained by vacuum drying at 40°C. The obtained reaction product was a benzoxazine containing the compound represented by the following formula as the main product, and the purity of the main product by GPC analysis was 45.1%. [ka]

[0067] <Examples 1-6 and Comparative Examples 1-5> Resin compositions for Examples 1-6 and Comparative Examples 1-5 were prepared according to the formulations (parts by mass) shown in Table 1 below, and their solubility, moldability, glass transition temperature (Tg), and water absorption rate were evaluated or measured. In the table, "BZO / CI" refers to the mass ratio of benzoxazine (BZO) to biscitraconimide (CI), except for Comparative Examples 2-4, where it refers to the mass ratio of benzoxazine (BZO) to maleimide (MI).

[0068] [Table 1]

[0069] As shown in Table 1, the resin compositions of Examples 1 to 6, which used allyl group-containing benzoxazine BZO1 in combination with biscitraconimide, showed a significantly improved glass transition temperature of the cured product compared to the resin composition of Comparative Example 1, which used allyl group-containing benzoxazine BZO1 alone. Furthermore, while Comparative Examples 2 to 4, which used bismaleimide, a similar substance, instead of biscitraconimide, exhibited poor solvent solubility, Examples 1 to 6, which used biscitraconimide in combination, showed better solvent solubility and superior moldability compared to Comparative Examples 2 to 4. In addition, Comparative Example 5, which used benzoxazine BZO3 without an allyl group, had a higher water absorption rate in the cured product compared to Examples 1 to 6, indicating poor water absorption.

[0070] <Examples 7-11 and Comparative Examples 6-11> Resin compositions for Examples 7-11 and Comparative Examples 6-11 were prepared according to the formulations (parts by mass) shown in Table 2 below, and their solubility, moldability, glass transition temperature (Tg), and water absorption rate were evaluated or measured. In the table, "BZO / CI" represents the mass ratio of benzoxazine (BZO) to biscitraconimide (CI), except for Comparative Examples 7-8, where it represents the mass ratio of benzoxazine (BZO) to maleimide (MI).

[0071] [Table 2]

[0072] As shown in Table 2, the resin compositions of Examples 7-11, which used allyl group-containing benzoxazine BZO2 in combination with biscitraconimide, showed a significantly improved glass transition temperature of the cured product compared to the resin composition of Comparative Example 6, which used allyl group-containing benzoxazine BZO2 alone. Furthermore, while Comparative Examples 7 and 8, which used bismaleimide, a similar substance, instead of biscitraconimide, exhibited poor solvent solubility, Examples 7-11, which used biscitraconimide in combination, showed better solvent solubility and superior moldability compared to Comparative Examples 7 and 8. In addition, the resin compositions of Comparative Examples 9-11, which used other allyl group-containing compounds (allyl 1,2) or benzoxazine BZO4 without an allyl group instead of allyl group-containing benzoxazine, showed poor moldability, resulting in unsatisfactory cured plates and the inability to obtain test specimens for measuring the glass transition temperature.

[0073] Furthermore, the various numerical ranges described in this specification can be any combination of their upper and lower limits, and all such combinations are described herein as preferred numerical ranges. Also, the description of a numerical range as "X~Y" means X or greater and Y or less.

[0074] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their omissions, substitutions, and modifications are included in the scope and spirit of the invention, as well as in the claims and their equivalents. [Industrial applicability]

[0075] The resin composition according to this embodiment can be used, for example, in printed circuit board materials, semiconductor encapsulating resins, matrix resins for composite materials, paints, adhesives, and the like.

Claims

1. The compound comprises a compound represented by the following general formula (1) and a compound represented by the following general formula (2), 【Chemistry 1】 In formula (1), R 1 R represents a divalent hydrocarbon group having 1 to 100 carbon atoms, which may contain heteroatoms. 2 and R 3 Each of these independently represents an alkanediyl group having 1 to 10 carbon atoms, R 4 and R 5 Each of these independently represents a hydrogen atom or a methyl group, R 6 and R 7 Each of these independently represents either a methyl group or an ethyl group, and each of p and q independently represents an integer between 0 and 2. 【Chemistry 2】 In formula (2), R 8 This represents a divalent hydrocarbon group having 1 to 100 carbon atoms, which may contain heteroatoms. Resin composition.

2. R in the formula (1) 1 The resin composition according to claim 1, wherein is a divalent aromatic ring-containing hydrocarbon group having 6 to 50 carbon atoms which may contain a hetero atom.

3. The compound represented by formula (1) above is represented by the following general formula (1A), 【Transformation 3】 In formula (1A), R 11 This is a single bond, -CH 2 -, -CH(CH 3 )-,-C(CH 3 ) 2 - or -O- represents R 12 and R 13 Each independently represents a methyl group or an ethyl group, and s and t each independently represent an integer from 0 to 4, R 2 and R 3 Each of these independently represents an alkanediyl group having 1 to 10 carbon atoms, R 4 and R 5 Each of these independently represents a hydrogen atom or a methyl group, R 6 and R 7 The resin composition according to claim 1, wherein each of the following independently represents a methyl group or an ethyl group, and p and q each independently represent an integer from 0 to 2.

4. R in formula (2) 8 The resin composition according to claim 1, wherein is a divalent aromatic ring-containing hydrocarbon group having 6 to 50 carbon atoms, which may contain heteroatoms.

5. The compound represented by formula (2) above is represented by the following general formula (2A), 【Chemistry 4】 In formula (2A), R 21 This is a single bond, -CH 2 -, -CH(CH 3 )-,-C(CH 3 ) 2 -, -O-, or a group represented by the following formula (21A), R 22 and R 23 Each of these independently represents a methyl group or an ethyl group, and each of u and v independently represents an integer from 0 to 4. 【Transformation 5】 In formula (21A), R 24 and R 25 Each is independently -CH 2 -, -CH(CH 3 )-,-C(CH 3 ) 2 The resin composition according to claim 1, which represents - or -O-.

6. A resin composition according to any one of claims 1 to 5, used as a printed circuit board material.

7. A cured product obtained by curing the resin composition according to any one of claims 1 to 5.