Flexible substrate, liquid injection head, and liquid injection recording device

Abstract

To provide flexible circuit boards and the like that can reduce manufacturing costs while improving reliability. [Solution] A flexible substrate according to one embodiment of the present disclosure is a flexible substrate for transmitting electrical signals to be applied to a liquid spray head having a plurality of nozzles, and comprises a terminal portion having one or more electrode terminals that are arranged in the edge region of the substrate surface and are electrically connected to other members. The electrode terminals are arranged within the edge region, spaced apart from the outer shape of the substrate surface via a non-electrode region.

Description

Technical Field

[0001] The present disclosure relates to a flexible substrate, a liquid ejection head, and a liquid ejection recording apparatus.

Background Art

[0002] Liquid ejection recording apparatuses provided with liquid ejection heads are used in various fields, and various types of liquid ejection heads have been developed (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such liquid ejection heads, generally, it is required to reduce manufacturing costs and improve reliability. It is desirable to provide a flexible substrate, a liquid ejection head, and a liquid ejection recording apparatus capable of improving reliability while reducing manufacturing costs.

Means for Solving the Problems

[0005] A flexible substrate according to an embodiment of the present disclosure is a flexible substrate that transmits an electrical signal applied to a liquid ejection head having a plurality of nozzles, and includes a terminal portion having one or more electrode terminals that are arranged in an end region of a substrate surface and are portions electrically connected to other members. The electrode terminals are spaced apart from an outer shape position of the substrate surface via a non-electrode region within the end region.

[0006] A liquid injection head according to one embodiment of the present disclosure comprises a flexible substrate according to the above embodiment of the present disclosure, and an injection unit having a plurality of nozzles that eject liquid based on electrical signals transmitted from the flexible substrate.

[0007] A liquid injection recording device according to one embodiment of the present disclosure is equipped with a liquid injection head according to the above embodiment of the present disclosure. [Effects of the Invention]

[0008] According to one embodiment of the present disclosure, a flexible substrate, a liquid injection head, and a liquid injection recording device make it possible to reduce manufacturing costs while improving reliability. [Brief explanation of the drawing]

[0009] [Figure 1] This is a block diagram showing a schematic configuration example of a liquid injection device according to one embodiment of the present disclosure. [Figure 2] Figure 1 is a schematic perspective view showing an example of the liquid injection head configuration. [Figure 3] Figure 2 is a schematic cross-sectional view showing an example of the configuration of a liquid injection head. [Figure 4] Figures 2 and 3 are schematic plan views illustrating an example of the general configuration of the flexible substrate. [Figure 5] Figure 4 is a schematic cross-sectional view showing an example of the general configuration of the flexible substrate. [Figure 6] This is a schematic plan view that shows a magnified portion of the area shown in Figure 4. [Figure 7] This is a schematic plan view showing an example of the configuration of a flexible substrate related to a comparative example. [Figure 8] This is a schematic plan view illustrating a general configuration example of a flexible substrate related to a modified example. [Figure 9] Figure 8 is a schematic cross-sectional view showing an example of the general configuration of the flexible substrate. [Modes for carrying out the invention]

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. The description will be in the following order. 1. Embodiment (Example where the tip position of the reinforcement pattern is inward from the tip position of the electrode terminal) 2. Modified example (an example where the tip position of the reinforcement pattern is the same as the tip position of the electrode terminal) 3. Other variations

[0011] <1. Embodiment> [Outline configuration of Printer 5] Figure 1 is a block diagram illustrating a schematic configuration example of a printer 5 as a liquid jet recording device according to one embodiment of the present disclosure. Figure 2 is a schematic perspective view illustrating a schematic configuration example of the inkjet head 1 as a liquid jet head shown in Figure 1. Figure 3 is a schematic cross-sectional view (YZ cross-sectional view) illustrating a configuration example of the inkjet head 1 shown in Figure 2. In the drawings used in this specification, the scale of each component has been appropriately changed to make each component recognizable.

[0012] Printer 5 is an inkjet printer that uses ink 9 (described later) to record (print) images, characters, etc., onto a recording medium (for example, recording paper P shown in Figure 1). As shown in Figure 1, printer 5 is equipped with an inkjet head 1, a print control unit 2, and an ink tank 3.

[0013] Furthermore, the inkjet head 1 corresponds to one specific example of the "liquid jet head" in this disclosure, and the printer 5 corresponds to one specific example of the "liquid jet recording device" in this disclosure. In addition, the ink 9 corresponds to one specific example of the "liquid" in this disclosure.

[0014] (A. Printing Control Unit 2) The printing control unit 2 supplies various types of information (data) to the inkjet head 1. Specifically, as shown in FIG. 1, the printing control unit 2 supplies a printing control signal Sc to the inside of the inkjet head 1 (such as the drive device 41 described later). This printing control signal Sc includes, for example, image data, ejection timing signals, and the power supply voltage for operating the inkjet head 1.

[0015] (B. Ink Tank 3) The ink tank 3 is a tank that houses the ink 9 inside. The ink 9 in this ink tank 3 is supplied to the inside of the inkjet head 1 (the ejection unit 11 described later) via the ink supply pipe 30, as shown in FIG. 1. Such an ink supply pipe 30 is composed of, for example, a flexible hose having flexibility.

[0016] (C. Inkjet Head 1) The inkjet head 1 is a head that ejects (discharges) droplet-like ink 9 onto the recording paper P from a plurality of nozzle holes Hn described later, as shown by the dashed arrows in FIG. 1, to perform recording of images, characters, etc. As shown in FIGS. 2 and 3, for example, this inkjet head 1 includes one ejection unit 11, one I / F (interface) board 12, four flexible boards 13a, 13b, 13c, 13d, and two cooling units 141, 142.

[0017] (C-1. I / F Board 12) As shown in FIGS. 2 and 3, the I / F board 12 includes two connectors 10, four connectors 120a, 120b, 120c, 120d, and a circuit arrangement area 121.

[0018] As shown in Figure 2, connector 10 is the part (connector part) that receives the aforementioned print control signal Sc supplied from the print control unit 2 to the inkjet head 1 (each flexible substrate 13a, 13b, 13c, 13d, which will be described later). Connectors 120a, 120b, 120c, and 120d are parts (connector parts) that electrically connect the I / F board 12 to the flexible substrates 13a, 13b, 13c, and 13d, respectively.

[0019] The circuit layout area 121 is an area on the I / F board 12 where various circuits are arranged. Note that other areas on the I / F board 12 may also be provided with such circuit layout areas.

[0020] (C-2. Injection part 11) As shown in Figure 1, the injection unit 11 has a plurality of nozzle holes Hn, and is the part that ejects ink 9 from these nozzle holes Hn. Such ejection of ink 9 is performed according to a drive signal Sd (drive voltage Vd) transmitted from a drive device 41, which will be described later, on each of the flexible substrates 13a, 13b, 13c, and 13d (see Figure 1). Note that this drive signal Sd and the aforementioned print control signal Sc correspond to specific examples of "electrical signals" in this disclosure.

[0021] As shown in Figure 1, such an injection unit 11 is configured to include an actuator plate 111 and a nozzle plate 112.

[0022] (Nozzle plate 112) The nozzle plate 112 is a plate made of a film material such as polyimide or a metal material, and as shown in Figure 1, it has the above-mentioned plurality of nozzle holes Hn. These nozzle holes Hn are formed in a row at predetermined intervals and are, for example, circular in shape. Each of these nozzle holes Hn corresponds to a specific example of a "nozzle" in this disclosure.

[0023] In the example of the injection unit 11 shown in Figure 2, the multiple nozzle holes Hn within the nozzle plate 112 are arranged along the column direction (X-axis direction), forming multiple nozzle rows (four nozzle rows). These four nozzle rows are arranged side by side along a direction perpendicular to the column direction (Y-axis direction).

[0024] (Actuator plate 111) The actuator plate 111 is a plate made of a piezoelectric material such as PZT (lead zirconate titanate). This actuator plate 111 is provided with a plurality of channels (pressure chambers). These channels are for applying pressure to the ink 9 and are arranged in a line parallel to each other at predetermined intervals. Each channel is defined by a drive wall (not shown) made of piezoelectric material, and in cross-sectional view it is a concave groove.

[0025] Such channels contain ejection channels for ejecting ink 9 and dummy channels (non-ejection channels) that do not eject ink 9. In other words, the ejection channels are filled with ink 9, while the dummy channels are not. The filling of each ejection channel with ink 9 is carried out, for example, through a common channel that communicates with all such ejection channels. Furthermore, each ejection channel communicates individually with a nozzle hole Hn in the nozzle plate 112, while each dummy channel does not communicate with a nozzle hole Hn. These ejection channels and dummy channels are arranged alternately along the aforementioned column direction (X-axis direction).

[0026] Furthermore, drive electrodes are provided on the opposing inner surfaces of the drive wall described above. These drive electrodes include a common electrode (shared electrode) provided on the inner surface facing the discharge channel and an active electrode (individual electrode) provided on the inner surface facing the dummy channel. These drive electrodes are electrically connected to the drive device 41, which will be described later, via the flexible substrates 13a, 13b, 13c, and 13d. As a result, the drive voltage Vd (drive signal Sd) described above is applied from the drive device 41 to each drive electrode via the flexible substrates 13a, 13b, 13c, and 13d (see Figure 1).

[0027] (C-3. ​​Flexible substrates 13a, 13b, 13c, 13d) As shown in Figures 2 and 3, the flexible substrates 13a, 13b, 13c, and 13d are substrates that electrically connect the I / F substrate 12 and the injection unit 11. Each of these flexible substrates 13a, 13b, 13c, and 13d individually controls the ink 9 injection operation for each of the four rows of nozzles on the nozzle plate 112. Furthermore, as indicated by the symbols P1a, P1b, P1c, and P1d in Figure 3, each flexible substrate 13a, 13b, 13c, and 13d is bent near the point where it connects to the injection unit 11 (near the crimping electrode section 433). The crimping electrode section 433 and the injection unit 11 are electrically connected to each other by, for example, thermocompression bonding using an ACF (Anisotropic Conductive Film). Alternatively, for example, another flexible substrate having only wiring may be further bonded to the flexible substrates 13a, 13b, 13c, and 13d using ACF crimping, and this other flexible substrate may be bonded to the injection unit 11 using ACF crimping.

[0028] Each of these flexible substrates 13a, 13b, 13c, and 13d (on the wiring layer on the surface S1 side, described later) has one or more drive devices 41 individually mounted on it (see Figure 3). Each of these drive devices 41 is a device that outputs a drive signal Sd (drive voltage Vd) for ejecting ink 9 from the nozzle holes Hn in the corresponding nozzle row of the ejection unit 11. Therefore, such drive signals Sd are transmitted from each flexible substrate 13a, 13b, 13c, and 13d to the ejection unit 11. Each of these drive devices 41 is, for example, composed of an ASIC (Application Specific Integrated Circuit).

[0029] Furthermore, each of these drive devices 41 is cooled by the cooling units 141 and 142 described above. Specifically, as shown in Figure 3, the cooling unit 141 is fixedly positioned between the drive devices 41 on the flexible substrates 13a and 13b, and each drive device 41 is cooled by pressing the cooling unit 141 against them. Similarly, the cooling unit 142 is fixedly positioned between the drive devices 41 on the flexible substrates 13c and 13d, and each drive device 41 is cooled by pressing the cooling unit 142 against them. Note that these cooling units 141 and 142 can be configured using various types of cooling mechanisms.

[0030] [Detailed configuration of flexible substrates 13a, 13b, 13c, and 13d] Next, with reference to Figures 1 to 3, as well as Figures 4 to 6, we will explain the detailed configuration examples of the flexible substrates 13a, 13b, 13c, and 13d mentioned above.

[0031] Figure 4 is a schematic plan view (ZX plan view) of the general configuration example of the flexible substrates 13a to 13d (hereinafter collectively referred to as flexible substrate 13 as appropriate) shown in Figures 2 and 3. Figure 5 is a schematic cross-sectional view (YZ cross-sectional view) of the general configuration example of the flexible substrate 13 shown in Figure 4. Figure 6 is a schematic plan view (ZX plan view) of a magnified portion of a part of Figure 4 (near the area indicated by the symbol P2).

[0032] First, this flexible substrate 13 is a double-sided substrate with a multi-layer structure including a surface S1 and a back surface S2. Specifically, this flexible substrate 13 has a multi-layer structure (two-layer structure) of wiring layers, with a first wiring layer on the surface S1 side and a second wiring layer on the back surface S2 side, facing each other along a direction (Y-axis direction) perpendicular to the substrate surface (Z-X plane).

[0033] Here, the surface S1 and back surface S2 described above correspond to specific examples of the "first surface" and "second surface" in this disclosure, respectively. The wiring layers in the flexible substrate 13 may also have a structure of three or more layers, including, for example, the first and second wiring layers described above.

[0034] Furthermore, as shown in Figures 4 to 6, the flexible substrate 13 includes a base material 130, one or more drive devices 41 (in this example, multiple drive devices 41), a wiring pattern 42, a terminal portion 131, and a reinforcing pattern 132. The base material 130 is made of, for example, polyimide (PI) with copper foil formed on it.

[0035] As mentioned above, the drive device 41 is arranged on the substrate surface (surface S1) of the flexible substrate 13. In the example shown in Figure 4, multiple drive devices 41 are arranged side by side along the X-axis on the substrate surface of the flexible substrate 13.

[0036] As shown in Figure 4, the wiring pattern 42 is a pattern of various wires that are electrically connected to the drive device 41. This wiring pattern 42 includes, for example, signal wiring patterns corresponding to the wiring of various signals, power wiring patterns corresponding to the wiring of various power supplies, and ground wiring patterns corresponding to the wiring of ground.

[0037] The terminal portion 131 is located on the substrate surface of the flexible substrate 13 at the end region on the crimp electrode portion 433 side (injection portion 11 side) or at the end region on the I / F substrate 12 side (see Figure 4). This terminal portion 131 includes one or more electrode terminals T (in this example, multiple electrode terminals T) for electrically connecting the flexible substrate 13 to the crimp electrode portion 433 (injection portion 11) or the I / F substrate 12. In other words, this terminal portion 131 is the part that is electrically connected to the injection portion 11 (other component) via the crimp electrode portion 433 by thermocompression bonding using the ACF described above, or the part that is inserted into the connectors 120a to 120d on the I / F substrate 12, which is another component. Note that the flexible substrate 13 and the I / F substrate 12 may not be electrically connected using such connectors 120a to 120d, but rather, for example, by thermocompression bonding using the ACF described above.

[0038] As shown in Figures 4 and 5, the electrode terminal T is arranged on the surface S1 of the substrate surface of the flexible substrate 13. Furthermore, as shown in Figure 5, the electrode terminal T has a multilayer structure (a two-layer structure in this example) comprising an electrode layer 61 arranged on the substrate surface (surface S1) and a plating layer 62 covering the surface of the electrode layer 61. The electrode layer 61 is made of a conductive material such as copper (Cu). The plating layer 62 is made of a single-layer or multilayer structure using a conductive material such as gold (Au), nickel (Ni), or palladium (Pd). Specifically, for example, the plating layer 62 is made of a single-layer structure of gold or a multilayer structure of gold and nickel or palladium.

[0039] In this embodiment, as shown in Figures 4 and 5, the electrode terminals T within the terminal portion 131 are spaced apart from the outer shape position Pe on the substrate surface via a non-electrode region An. This non-electrode region An is an area within the terminal portion 131 where no electrode terminals T are located, and is positioned along the X-axis between the outer shape position Pe of the flexible substrate 13 and the tip position Pt on the outer shape position Pe side of the electrode terminal T (see Figures 4 and 5). Furthermore, the width Wn of this non-electrode region An (the distance in the Z-axis direction from the outer shape position Pe to the tip position Pt) is, for example, four times or more the thickness d0 of the base material 130 in the flexible substrate 13 (for example, the thickness of PI) (see Figure 5).

[0040] As shown in Figure 5, the reinforcing pattern 132 is positioned on the back surface S2 of the flexible substrate 13 and is a pattern that suppresses deformation in the thickness direction (Y-axis direction) of the electrode terminals T. Specifically, the reinforcing pattern 132 suppresses deformation in the thickness direction of the electrode terminals T during, for example, the manufacturing of the flexible substrate 13 (such as when cutting the outer shape of the substrate using a mold).

[0041] In the example shown in Figure 4, the reinforcement pattern 132 is a pattern individually arranged to correspond to each electrode terminal T. In this embodiment, the tip position P13 on the outer shape position Pe side of the reinforcement pattern 132 is located on the opposite side (inside) from the outer shape position Pe, relative to the tip position Pt on the outer shape position Pe side of the electrode terminal T (see Figures 4 and 5). Also, as shown in Figure 6, the arrangement area on the back surface S2 of the reinforcement pattern 132 is wider than the overlapping area Ao in a plan view between it and the arrangement area on the surface S1 of the electrode terminal T. However, for example, the arrangement area on the back surface S2 of the reinforcement pattern 132 may be equal to the overlapping area Ao in a plan view between it and the arrangement area on the surface S1 of the electrode terminal T. In other words, the area S13 of the arrangement area of ​​the reinforcement pattern 132 is greater than or equal to the area So of this overlapping area Ao (area S13 ≥ area So).

[0042] [Action and function / effect] (A. Basic operation of Printer 5) In this printer 5, the recording operation (printing operation) of images, characters, etc., onto the recording medium (recording paper P, etc.) is performed using the ink ejection operation of ink 9 by the inkjet head 1 as described below. Specifically, in the inkjet head 1 of this embodiment, the ink ejection operation of ink 9 using shear mode is performed as follows.

[0043] First, each drive device 41 on each flexible substrate 13 (13a, 13b, 13c, 13d) applies a drive voltage Vd (drive signal Sd) to the aforementioned drive electrodes (common electrode and active electrode) in the actuator plate 111 in the injection section 11. Specifically, each drive device 41 applies a drive voltage Vd to each drive electrode located on a pair of drive walls that define the aforementioned discharge channel. As a result, these pairs of drive walls deform so that they protrude toward the dummy channel adjacent to their discharge channel.

[0044] At this time, the drive wall bends in a V-shape around its midpoint in the depth direction. This bending deformation of the drive wall causes the ejection channel to deform as if it were expanding. In this way, the volume of the ejection channel increases due to the bending deformation caused by the piezoelectric thickness sliding effect of the pair of drive walls. As a result of this increase in the volume of the ejection channel, the ink 9 is guided into the ejection channel.

[0045] Next, the ink 9, which has been guided into the ejection channel in this manner, propagates inside the ejection channel as a pressure wave. At the moment when this pressure wave reaches (or near the moment) the nozzle hole Hn of the nozzle plate 112, the drive voltage Vd applied to the drive electrode becomes 0 V. As a result, the drive wall recovers from the bent deformation state described above, and the volume of the ejection channel, which had increased, returns to its original size.

[0046] In this way, as the volume of the ejection channel returns to its original state, the pressure inside the ejection channel increases, and the ink 9 inside the ejection channel is pressurized. As a result, droplet-shaped ink 9 is ejected to the outside (towards the recording paper P) through the nozzle hole Hn (see Figure 1). In this way, the ink ejection operation (discharge operation) of the ink 9 in the inkjet head 1 is performed, and as a result, the recording operation of images, characters, etc. is performed on the recording paper P.

[0047] (B. Function and effect of inkjet head 1) Next, the operation and effects of the inkjet head 1 of this embodiment will be described in detail, in comparison with the comparative example.

[0048] (B-1. Comparative example) First, the electrical circuit boards used in conventional inkjet heads are electrically connected to each other using connector connections or the aforementioned ACF connections. Flexible circuit boards are sometimes used for these electrical circuit boards due to the degree of freedom in arrangement and shape, and at least the connection points of the electrical circuit boards to be connected are provided with electrode terminals for transmitting various electrical signals. Furthermore, considering workability and design flexibility, these electrode terminals are often placed in the edge region of the board, and to ensure connection reliability, the electrode terminal structure often uses a Cu pattern with gold plating (multilayer structure). In addition, when mass-producing flexible circuit boards, manufacturing methods that use molds to cut the outer shape of the board are increasingly being adopted.

[0049] Here, Figure 7 schematically shows a plan view (ZX plan view) of a conventional flexible substrate (flexible substrate 103) relating to a comparative example. In the flexible substrate 103 of the comparative example shown in Figure 7, unlike the flexible substrate 13 of the embodiment described above (see Figures 4 and 5), the electrode terminal T within the terminal portion 131 is arranged to extend to the outer shape position Pe on the substrate surface. In other words, in this flexible substrate 103, unlike the flexible substrate 13, the outer shape position Pe of the flexible substrate 103 and the tip position Pt on the outer shape position Pe side of the electrode terminal T coincide with each other (are aligned with each other) along the Z axis.

[0050] However, in a flexible substrate 103 with this configuration, cracks are prone to occur at the electrode terminals T due to stress applied during manufacturing (such as when cutting the outer shape of the substrate using the mold described above). Furthermore, in this flexible substrate 103, corrosion may occur at the electrode terminals T due to contamination of the cracked area, for example, for the following reasons.

[0051] Specifically, firstly, in the case of the multilayer electrode terminal T described above, cracks often occur only in the surface plating layer, so electrical conductivity in the Cu pattern is ensured, and malfunctions are unlikely to occur. However, even in that case, if a substance that corrodes the Cu pattern adheres to the cracked area during the manufacturing or storage of the flexible substrate 103, the internal Cu pattern may corrode. Furthermore, when used with an inkjet head, ink adhesion or the ink atmosphere can contaminate the electrode terminals through the cracks, increasing the risk of corrosion. In that case, even if the electrode terminal does not break, there is a risk that poor contact at the electrode terminal may occur due to corrosive substances, making it impossible to ensure print quality.

[0052] Thus, in the comparative example flexible substrate 103, the yield during manufacturing decreases and connection failures at the electrode terminals T increase, making it difficult to improve reliability while reducing manufacturing costs.

[0053] (B-2. Action / Effect) In contrast, the inkjet head 1 of this embodiment has the following configuration of the flexible substrate 13, which provides, for example, the following actions and effects.

[0054] Specifically, in the flexible substrate 13 of this embodiment, the electrode terminals T are spaced apart from the outer shape position Pe of the substrate surface via a non-electrode region An, within the edge region of the substrate surface where the terminal portion 131 is located. This reduces, for example, the occurrence of cracks at the electrode terminals T due to stress applied during the manufacturing of the flexible substrate 13 (such as when cutting the outer shape of the substrate using a mold), and the occurrence of corrosion of the electrode terminals T due to contamination at the cracked portion. Therefore, the yield during the manufacturing of the flexible substrate 13 is improved, and connection failures at the electrode terminals T are reduced. As a result, in this embodiment, it is possible to improve reliability while reducing manufacturing costs compared to the comparative examples described above.

[0055] Furthermore, in this embodiment, since the electrode terminals T are arranged on the surface S1 of the substrate and the reinforcing pattern 132 is arranged on the back surface S2 of the substrate, the following occurs. That is, by providing such a reinforcing pattern 132, deformation in the thickness direction (Y-axis direction) of the electrode terminals T is suppressed, making it possible to further improve the reliability of the flexible substrate 13.

[0056] Furthermore, in this embodiment, the tip position P13 on the outer shape position Pe side of the reinforcing pattern 132 is located on the opposite side (inside) from the outer shape position Pe, with reference to the tip position Pt on the outer shape position Pe side of the electrode terminal T. This results in the following: The reinforcing pattern 132 suppresses deformation in the thickness direction of the electrode terminal T, while making it easier to confirm the position of the electrode terminal T when making an electrical connection between the flexible substrate 13 and the I / F substrate 12 (making it easier to use as a marker when making an electrical connection). As a result, the reliability of the flexible substrate 13 can be easily improved.

[0057] In addition, in this embodiment, the area S13 of the arrangement region S2 on the back surface of the reinforcing pattern 132 is greater than or equal to the area So of the superimposed region Ao in a plan view between it and the arrangement region S1 on the front surface of the electrode terminal T (area S13 ≥ area So), which results in the following: In other words, the deformation suppression effect of the reinforcing pattern 132 in the thickness direction of the electrode terminal T is more easily exerted, making it possible to further improve the reliability of the flexible substrate 13.

[0058] <2. Variant> Next, a modified example of the above embodiment will be described. In the following, components identical to those in the embodiment will be denoted by the same reference numerals, and their descriptions will be omitted as appropriate.

[0059] Figure 8 shows a schematic plan view (ZX plan view) of a modified example of the flexible substrate (flexible substrate 13A). Figure 9 shows a schematic cross-sectional view (YZ cross-sectional view) of the same flexible substrate 13A shown in Figure 8.

[0060] This modified flexible substrate 13A corresponds to the flexible substrate 13 (Figures 4 and 5) described in the embodiment, with a change in the tip position P13 on the outer shape position Pe side of the reinforcing pattern 132, and the other configurations are basically the same.

[0061] Specifically, in the flexible substrate 13, as described above, the tip position P13 on the outer shape position Pe side of the reinforcing pattern 132 was located on the opposite side (inside) from the outer shape position Pe, with reference to the tip position Pt on the outer shape position Pe side of the electrode terminal T. In contrast, in the flexible substrate 13A, as shown in Figures 8 and 9, the tip position P13 on the outer shape position Pe side of the reinforcing pattern 132 is at the same position as the tip position Pt on the outer shape position Pe side of the electrode terminal T. In other words, in this flexible substrate 13A, the tip position P13 on the reinforcing pattern 132 and the tip position Pt on the electrode terminal T coincide with each other (are aligned with each other) along the Z-axis direction.

[0062] In addition, in this flexible substrate 13A, similar to the flexible substrate 13, the placement area on the back surface S2 of the reinforcement pattern 132 is wider than the superimposed area Ao in a plan view between it and the placement area on the front surface S1 of the electrode terminal T (area S13 > area So).

[0063] Even in this modified configuration, it is possible to obtain the same effects through essentially the same operation as the embodiment.

[0064] <3. Other variations> Although the present disclosure has been described above with reference to embodiments and modifications, the present disclosure is not limited to these embodiments, and various modifications are possible.

[0065] For example, in the above embodiments, specific examples of the configuration (shape, arrangement, number, etc.) of each component in the printer and inkjet head were given and explained, but the configuration is not limited to those described in the above embodiments, and other shapes, arrangements, numbers, etc., may be used. Also, the values, ranges, and magnitude relationships of the various parameters described in the above embodiments are not limited to those described in the above embodiments, and other values, ranges, and magnitude relationships may be used.

[0066] Specifically, for example, in the above embodiments, examples of configurations (shape, arrangement, number, etc.) of flexible substrates, drive devices, and various wiring patterns were described in detail, but these configuration examples are not limited to those described in the above embodiments. For example, in the above embodiments, an example was described in which multiple drive substrates are provided in the inkjet head, but this is not limited to this example, and for example, only one drive substrate may be provided in the inkjet head. Also, in the above embodiments, the shape (layer structure), arrangement, number, etc. of electrode terminals were described in detail, but this is not limited to this example, and for example, the electrode terminals may have a single-layer structure, or may be in other arrangement positions. Furthermore, in the above embodiments, an example was described in which a reinforcing pattern is arranged on the flexible substrate, but for example, no such reinforcing pattern may be arranged on the flexible substrate. The shape, arrangement, number, etc. of the reinforcing pattern are also not limited to the examples given in the above embodiments. Furthermore, although the above embodiments describe an example in which multiple drive devices are provided on the drive board, the invention is not limited to this example. For example, only one drive device may be provided on the drive board, or there may be no drive devices on the drive board. Moreover, although the above embodiments describe the drive device as rectangular, the invention is not limited to this example. For example, it may be square.

[0067] Furthermore, various types of inkjet head structures can be applied. For example, a so-called side-chute type inkjet head may be used, which ejects ink 9 from the center of the extending direction of each ejection channel in the actuator plate 111. Alternatively, a so-called edge-chute type inkjet head may be used, which ejects ink 9 along the extending direction of each ejection channel. Moreover, the printer system is not limited to the systems described in the above embodiments, and various systems such as MEMS (Micro Electro Mechanical Systems) can be applied.

[0068] Furthermore, this disclosure can be applied to either a circulating inkjet head, which circulates the ink 9 between the ink tank and the inkjet head, or a non-circulating inkjet head, which does not circulate the ink 9.

[0069] Furthermore, the series of processes described in the above embodiments may be performed by hardware (circuits) or by software (programs). If performed by software, the software consists of a group of programs that cause the computer to execute each function. Each program may, for example, be pre-installed in the computer or installed on the computer from a network or recording medium.

[0070] Furthermore, while the above embodiments described a printer 5 (inkjet printer) as a specific example of the "liquid jet recording device" in this disclosure, the invention is not limited to this example, and the disclosure can be applied to other devices besides inkjet printers. In other words, the "liquid jet head" (inkjet head) of this disclosure may be applied to other devices besides inkjet printers. Specifically, for example, the "liquid jet head" of this disclosure may be applied to devices such as facsimile machines and on-demand printing machines.

[0071] In addition, the various examples described so far may be applied in any combination.

[0072] Furthermore, the effects described herein are merely illustrative and not limiting, and other effects may also occur.

[0073] Furthermore, this disclosure can also take the following form. (1) A flexible substrate for transmitting electrical signals, applicable to a liquid injection head having multiple nozzles, It includes a terminal section having one or more electrode terminals that are located in the edge region of the substrate surface and are electrically connected to other components, The electrode terminals are positioned within the end region, spaced apart from the outer shape of the substrate surface via a non-electrode region. Flexible circuit board. (2) The electrode terminals are An electrode layer disposed on the substrate surface, A plating layer covering the electrode layer, It is composed of including The flexible circuit board described in (1) above. (3) The width of the non-electrode region, which corresponds to the distance from the external position to the electrode terminal, is four times or more the thickness of the substrate in the flexible substrate. A flexible substrate as described in (1) or (2) above. (4) The electrode terminals are arranged on the first surface of the substrate surface, On the substrate surface, a reinforcing pattern is arranged on the second surface facing the first surface to suppress deformation in the thickness direction of the electrode terminal. A flexible substrate as described in any of (1) to (3) above. (5) The tip of the reinforcing pattern on the outer shape side is located at the same position as the tip of the electrode terminal on the outer shape side, or on the inside, opposite to the outer shape side. The flexible circuit board described in (4) above. (6) The area of ​​the arrangement region on the second surface in the reinforcement pattern is greater than or equal to the area of ​​the overlapping region in a plan view between it and the arrangement region on the first surface of the electrode terminal. A flexible substrate as described in (4) or (5) above. (7) The system further comprises one or more drive devices, which are disposed on the substrate surface and generate a drive signal, which is an electrical signal for ejecting liquid from the nozzle. A flexible substrate as described in any of (1) through (6) above. (8) A flexible substrate as described in any of (1) to (7) above, A spray unit having a plurality of nozzles that sprays the liquid based on the electrical signal transmitted from the flexible substrate, A liquid spray head equipped with a liquid spray head. (9) Equipped with the liquid spray head described in (8) above Liquid injection recording device. [Explanation of symbols]

[0074] 1...Inkjet head, 10...Connector, 11...Ink jetting unit, 111...Actuator plate, 112...Nozzle plate, 12...I / F substrate, 120a,120b,120c,120d...Connector, 121...Circuit layout area, 13,13a,13b,13c,13d,13A...Flexible substrate, 130...Base material, 131...Terminal section, 132...Reinforcement pattern, 141,142...Cooling unit, 2...Printing control unit, 3...Ink Tank, 30... Ink supply pipe, 41... Drive device, 42... Wiring pattern, 433... Crimp electrode, 5... Printer, 61... Electrode layer, 62... Plating layer, 9... Ink, P... Recording paper, Hn... Nozzle hole, Sc... Print control signal, Sd... Drive signal, Vd... Drive voltage, S1... Front surface, S2... Back surface, T... Electrode terminal, An... Non-electrode area, Ao... Overlay area, Wn... Width, d0... Thickness, So, S13... Area, Pe... Outer shape position, Pt, P13... Tip position.

Claims

1. A flexible substrate for transmitting electrical signals, applicable to a liquid injection head having multiple nozzles, It includes a terminal section having one or more electrode terminals that are located in the edge region of the substrate surface and are electrically connected to other components, The electrode terminals are positioned within the end region, spaced apart from the outer shape of the substrate surface via a non-electrode region. Flexible circuit board.

2. The electrode terminals are An electrode layer disposed on the substrate surface, A plating layer covering the electrode layer, It is composed of including The flexible substrate according to claim 1.

3. The width of the non-electrode region, which corresponds to the distance from the external position to the electrode terminal, is four times or more the thickness of the substrate in the flexible substrate. A flexible substrate according to claim 1 or claim 2.

4. The electrode terminals are arranged on the first surface of the substrate surface, On the substrate surface, a reinforcing pattern is arranged on the second surface facing the first surface to suppress deformation in the thickness direction of the electrode terminal. A flexible substrate according to claim 1 or claim 2.

5. The tip of the reinforcing pattern on the outer shape side is located at the same position as the tip of the electrode terminal on the outer shape side, or on the inside, opposite to the outer shape side. The flexible substrate according to claim 4.

6. The area of ​​the arrangement region on the second surface in the reinforcement pattern is greater than or equal to the area of ​​the overlapping region in a plan view between it and the arrangement region on the first surface of the electrode terminal. The flexible substrate according to claim 4.

7. The system further comprises one or more drive devices, which are arranged on the substrate surface and generate a drive signal, which is an electrical signal for ejecting liquid from the nozzle. A flexible substrate according to claim 1 or claim 2.

8. A flexible substrate according to claim 1 or claim 2, A spray unit having a plurality of nozzles that sprays the liquid based on the electrical signal transmitted from the flexible substrate, A liquid spray head equipped with a liquid spray head.

9. The liquid spray head is provided as described in claim 8. Liquid injection recording device.

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