Curable resin compositions, dry films, cured products, and printed circuit boards

Abstract

To provide a curable resin composition that exhibits excellent resolution in thick films even when filled with spherical inorganic particles, and also has excellent resistance to thermal cycling and long-term heat resistance of the cured product. [Solution] The curable resin composition of the present invention is an alkali-developable curable resin composition containing (A) an alkali-soluble resin, (B) a thermosetting component, (C) a photopolymerization initiator, (D) organic particles, and (E) inorganic particles, wherein the content of (E) inorganic particles is 20% by volume or more relative to the total solid content of the curable resin composition, the (E) inorganic particles include (E-1) first inorganic particles, the average primary particle diameter of the (E-1) first inorganic particles is 40 nm or more and 400 nm or less, and the content of the (E-1) first inorganic particles is 20% by volume or more and 90% by volume or less relative to the total solid content of the (E) inorganic particles.

Claims

1. An alkali-developable curable resin composition comprising (A) an alkali-soluble resin, (B) a thermosetting component, (C) a photopolymerization initiator, (D) organic particles, and (E) inorganic particles, The content of the inorganic particles (E) is 20% by volume or more relative to the total solid content of the curable resin composition. The (E) inorganic particles include (E-1) the first inorganic particles, The average primary particle diameter of the first inorganic particle (E-1) is 40 nm or more and 400 nm or less. A curable resin composition characterized in that the content of the first inorganic particles (E-1) is 20% by volume or more and 90% by volume or less relative to the total solid content of the inorganic particles (E).

2. The curable resin composition according to claim 1, wherein the content of the (E-1) first inorganic particles is 10% by volume or more with respect to the total solid content of the curable resin composition.

3. The (E) inorganic particles further include (E-2) second inorganic particles other than the (E-1) first inorganic particles, The curable resin composition according to claim 1, wherein the average primary particle diameter of the second inorganic particles (E-2) is greater than 400 nm and less than or equal to 1500 nm.

4. The curable resin composition according to claim 3, wherein the content of the (E-2) second inorganic particles is 30% by volume or less with respect to the total solid content of the curable resin composition.

5. The curable resin composition according to claim 1, wherein the (D) organic particles include core-shell type rubber particles.

6. The curable resin composition according to claim 1, wherein the content of the (D) organic particles is 0.5% by mass or more and 15% by mass or less with respect to the total solid content of the curable resin composition.

7. A dry film characterized by having a resin layer obtained by applying and drying a curable resin composition according to any one of claims 1 to 6 onto a film.

8. A cured product characterized by being obtained by curing a curable resin composition according to any one of claims 1 to 6.

9. A cured product characterized by being obtained by curing the resin layer of the dry film described in claim 7.

Images