Method and system for temperature control of a substrate

Abstract

This invention provides a method for controlling the temperature of a substrate support assembly. [Solution] A first direct current (DC) power is supplied to a heating element embedded in a zone of a substrate support assembly contained within a processing chamber. The voltage across the heating element is measured. Similarly, the current flowing through the heating element is measured. The temperature of the zone of the substrate support assembly is determined based on the voltage across the heating element and the current flowing through the heating element. The temperature difference between the determined zone temperature and the target temperature of the zone is determined. A second DC power to be supplied to the heating element to achieve the target temperature is determined, at least in part, based on the temperature difference. The second DC power is supplied to the heating element to correct the zone temperature to the target temperature.

Claims

1. To supply a first direct current (DC) power to a heating element embedded in a zone of a substrate support assembly contained within a processing chamber, To measure the voltage applied to the heating element and the current passing through the heating element. Based on the voltage applied to the heating element and the current passing through the heating element, the temperature of the zone of the substrate support assembly is determined. To identify the temperature difference between the identified temperature of the zone and the target temperature of the zone, Based at least partially on the temperature difference, a second DC power to be supplied to the heating element to achieve the target temperature, and A method comprising supplying the second DC power to the heating element in order to adjust the temperature of the zone to the target temperature.

2. The method according to claim 1, further comprising receiving an instruction that the operating conditions of a process performed in the processing chamber should be modified from a first process setting to a second process setting, wherein the specification of the second DC power is further specified at least in part based on the second process setting.

3. The method according to claim 2, wherein the heating element provides a path to ground for a radio frequency (RF) electrode, the power setting of the RF electrode causes a change in the temperature of the zone, and the operating conditions include RF power supplied to the RF electrode.

4. The method according to claim 1, further comprising using an AC-DC rectifier to convert AC power to DC power.

5. Identifying the temperature of the aforementioned zone is Using the voltage applied to the heating element and the current flowing through the heating element, the temperature of the heating element is calculated, and The method according to claim 1, comprising specifying the temperature for the zone corresponding to the temperature of the heating element.

6. Further including identifying the temperature of the zone, Using the voltage applied to the heating element and the current passing through the heating element, the resistance of the heating element is calculated, and The method according to claim 1, wherein the resistance is input into at least one of a function or reference table that associates the resistance of the heating element with a temperature value.

7. Identifying at least one of one or more current process settings of a process recipe or one or more future process settings of the said process recipe, and The method according to claim 1, further comprising inputting the specified temperature of the zone and at least one of the one or more current process settings or the one or more future process settings into a model that associates the process settings and the current temperature with a power setting, wherein the model outputs power to be supplied to the heating element in order to achieve the target temperature.

8. Using a temperature sensor, measure the temperature of the zone. Comparing the identified temperature of the zone with the measured temperature of the zone, Based on the above comparison, the difference between the measured temperature and the identified temperature is identified, and The method according to claim 1, further comprising determining whether the difference deviates from a predicted difference.

9. A DC power supply operably coupled to a heating element embedded within a zone of a substrate support assembly contained within a processing chamber, and The heating element and the DC power supply are operably coupled to a controller, and the controller is The DC power supply is configured to supply the first DC power to the heating element. To measure the voltage applied to the heating element and the current passing through the heating element. Based on the voltage applied to the heating element and the current passing through the heating element, the temperature of the zone of the substrate support assembly is determined. To identify the temperature difference between the identified temperature of the zone and the target temperature of the zone, Based at least partially on the temperature difference, a second DC power to be supplied to the heating element to achieve the target temperature, and An apparatus that causes the DC power supply to supply the second DC power to the heating element in order to adjust the temperature of the zone to the target temperature.

10. The controller further, The apparatus according to claim 9, wherein the operating conditions of a process performed in the processing chamber are to receive instructions that the operating conditions should be modified from a first process setting to a second process setting, and the specification of the second DC power is further specified at least in part based on the second process setting.

11. The apparatus according to claim 10, wherein the heating element provides a path to ground for a radio frequency (RF) electrode, the power setting of the RF electrode causes a change in the temperature of the zone, and the operating conditions include RF power supplied to the RF electrode.

12. To determine the temperature of the zone, the controller, Using the voltage applied to the heating element and the current flowing through the heating element, the temperature of the heating element is calculated, and The apparatus according to claim 9, which performs the task of determining the temperature of the zone corresponding to the temperature of the heating element.

13. To further specify the temperature of the zone, the controller, Using the voltage applied to the heating element and the current passing through the heating element, the resistance of the heating element is calculated, and The apparatus according to claim 9, wherein the resistor is input into at least one of a function or reference table that associates the resistance of the heating element with a temperature value.

14. The controller further, Identifying at least one of one or more current process settings of a process recipe or one or more future process settings of the said process recipe, and The apparatus according to claim 9, wherein the apparatus performs inputting the identified temperature of the zone and at least one of the one or more current process settings or the one or more future process settings into a model that associates the process settings and the current temperature with a power setting, the model outputs power to be supplied to the heating element in order to achieve the target temperature.

15. The apparatus according to claim 9, wherein the DC power supply includes an AC power supply connected to a rectifier, the rectifier receives AC power from the AC power supply and outputs the first DC power and the second DC power to the heating element.

16. A processing chamber comprising a substrate support assembly, wherein the substrate support assembly comprises one or more heating elements embedded within each zone of the substrate support assembly, A DC power supply configured to supply direct current (DC) power to each heating element, and Each heating element, the DC power supply, and a controller operably coupled to the system controller are provided, and the controller is The DC power supply is used to supply a first DC power to one of the one or more heating elements, wherein the heating element is embedded in a corresponding zone of the substrate support assembly. To measure the voltage applied to the heating element and the current passing through the heating element. To determine the temperature difference between the specified temperature of the zone of the substrate support assembly and the temperature of the corresponding zone, Based on the identified temperature of the corresponding zone, determine the target temperature of the corresponding zone. Based at least partially on the temperature difference, a second DC power to be supplied to the heating element to achieve the target temperature, and An electronic device manufacturing system that causes the DC power supply to supply the second DC power to the heating element in order to adjust the temperature of the corresponding zone to the target temperature.

17. The temperature controller further, The electronic device manufacturing system according to claim 16, wherein the operating conditions of a process performed in the processing chamber are to receive instructions that the operating conditions should be modified from a first process setting to a second process setting, and the specification of the second DC power is further specified at least in part based on the second process setting.

18. The electronic device manufacturing system according to claim 17, wherein the heating element provides a path to ground for a radio frequency (RF) electrode, the power setting of the RF electrode causes a change in the temperature of the zone, and the operating conditions include RF power supplied to the RF electrode.

19. The DC power supply includes an AC-DC rectifier, and the temperature controller further includes, The electronic device manufacturing system according to claim 16, wherein, in response to the DC power supply receiving AC power from an AC power supply, the AC-DC rectifier is used to convert the AC power to DC power.

20. To determine the temperature of the corresponding zone, the controller: Using the voltage applied to the heating element and the current flowing through the heating element, the temperature of the heating element is calculated, and The electronic device manufacturing system according to claim 16, further comprising determining the temperature of the zone corresponding to the temperature of the heating element.

Images