Multilayer electronic components

Abstract

The objective is to provide a multilayer electronic component that improves reliability, suppresses crack formation, and enhances resistance to deformation due to electrostriction. [Solution] A stacked electronic component 100 according to one embodiment of the present invention includes a main body 110 which includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first, second, third and fourth surfaces and facing each other in a third direction, a protrusion 141 arranged on the first and second surfaces, and external electrodes 131 and 132 arranged on the third and fourth surfaces, wherein when the width of the main body in the third direction is W and the width of the protrusion in the third direction is W1, W1 / W is 0.5 or more and 0.85 or less.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] MLCCs used in high-voltage environments are called high-voltage MLCCs, and their rated voltage is 100V or higher. Because high-voltage MLCCs have a significantly higher rated voltage than general-purpose MLCCs, they are subjected to relatively higher voltages in high-temperature accelerated evaluation and humidity resistance reliability evaluation compared to general-purpose MLCCs.

[0004] When a voltage is applied to an MLCC, the electrostrictive phenomenon of the dielectric, which is an inherent property of ferroelectric ceramic materials, causes repeated expansion and contraction of the volume. This can lead to cracks forming between the internal electrodes and the dielectric due to insufficient adhesion, potentially reducing reliability.

[0005] Generally, MLCCs are driven while maintaining their shape by using the volume expansion within the capacitance-forming section as resistance to the deformation of the cover section placed on top of the capacitance-forming section. However, in high-voltage MLCCs, the expansion / contraction rate increases due to the high applied voltage, and the force that holds them in place by the cover section alone may be insufficient. Therefore, there is a need to develop MLCCs that can suppress volume expansion due to electrostriction and increase resistance to deformation due to electrostriction. [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the several objectives of the present invention is to provide a multilayer electronic component with improved reliability.

[0007] One of the several objectives of the present invention is to provide a multilayer electronic component in which crack formation is suppressed.

[0008] One of the several objectives of the present invention is to provide a multilayer electronic component with improved resistance to deformation due to electrostriction.

[0009] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0010] A stacked electronic component according to one embodiment of the present invention includes a body that includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, a first surface and a second surface facing the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing the second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing the third direction, a protrusion disposed on the first surface and the second surface, and an external electrode disposed on the third surface and the fourth surface, wherein when the width of the body in the third direction is W and the width of the protrusion in the third direction is W1, W1 / W may be 0.5 or more and 0.85 or less. [Effects of the Invention]

[0011] One of the various effects of the present invention is that by arranging protrusions on the first and second surfaces of the main body, the resistance to deformation due to electrostriction of the laminated electronic component can be improved.

[0012] However, the diverse yet beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0013] [Figure 1] It schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 2] It schematically shows a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 3] It schematically shows a cross-sectional view taken along the line II-II' of FIG. 1. [Figure 4] It schematically shows the main body and the protruding part disassembled. [Figure 5] It is a graph showing the area of the protruding part by W1 / W. [Figure 6] It is a graph showing the load (Stress) by W1 / W. [Figure 7] It is a graph showing the displacement by W1 / W.

Mode for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0015] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. In addition, for components having the same function within the scope of the same idea, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part says that a certain component "includes", this means that other components can be further included, not excluding other components, unless otherwise stated.

[0016] In drawings, the X direction can be defined as the first direction, the lamination direction, or the thickness T direction; the Y direction as the second direction or the length L direction; and the Z direction as the third direction or the width W direction.

[0017] Multilayer electronic components Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention, Figure 2 schematically shows a cross-sectional view along the line I-I' in Figure 1, Figure 3 schematically shows a cross-sectional view along the line II-II' in Figure 1, and Figure 4 schematically shows the main body and protruding parts disassembled.

[0018] The following describes in detail a multilayer electronic component 100 according to one embodiment of the present invention with reference to Figures 1 to 4. While a multilayer ceramic capacitor (MLCC) will be described as an example of a multilayer electronic component, the present invention is not limited to this and can be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0019] A stacked electronic component 100 according to one embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer in a first direction, and a body 110 including a first surface 1 and a second surface 2 facing the first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first, second, third, and fourth surfaces and facing the third direction, and protrusions 141, 142 arranged on the first and second surfaces, and external electrodes 131, 132 arranged on the third and fourth surfaces, wherein when the width of the body in the third direction is W and the width of the protrusions in the third direction is W1, W1 / W may be 0.5 or more and 0.85 or less.

[0020] When a voltage is applied to an MLCC, the electrostrictive phenomenon of the dielectric, which is an inherent property of ferroelectric ceramic materials, causes repeated expansion and contraction of the volume. This can lead to cracks forming between the internal electrodes and the dielectric due to insufficient adhesion, potentially reducing reliability.

[0021] To suppress volume expansion within the capacitance forming section due to electrostriction, a cover is placed on the capacitance forming section. However, the force required to fix the cover in place may be insufficient due to its resistance to deformation. Therefore, in this invention, protrusions 141 and 142 are placed on the first surface 1 and second surface 2 of the main body to suppress volume expansion due to electrostriction and increase resistance to deformation due to electrostriction.

[0022] The following describes each component included in the stacked electronic component 100 according to one embodiment of the present invention.

[0023] The main body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0024] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedron-shaped.

[0025] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0026] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third, fourth, and fifth surfaces and / or the corners connecting the second surface with the third, fourth, and fifth surfaces may have a shape that is contracted toward the center of the body 110 in the first direction when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 may have a shape that is contracted toward the center of the body 110 in the first direction when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third, fourth, fifth, and sixth faces, and / or the corners connecting the second face with the third, fourth, fifth, and sixth faces.

[0027] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth surface 5 and sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces, and the portions connecting the second surface with the fifth and sixth surfaces, do not need to have a contracted form.

[0028] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular limit to the number of dielectric layers stacked, and it can be determined considering the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0029] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, as the ceramic powder, a barium titanate (BaTiO3)-based powder can be used. As a more specific example, the ceramic powder can be one or more of BaTiO3, (Ba ,

[0031] , Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0030] The average thickness td of the dielectric layer 111 does not need to be particularly limited. For example, in the case of a high-voltage MLCC, the average thickness td of the dielectric layer may be 3 to 20 μm. However, it is not limited to this, and the average thickness td of the dielectric layer 111 can be arbitrarily set according to the desired characteristics and applications.

[0031] Here, the average thickness td of the dielectric layer 111 means the size in the first direction of the dielectric layer 111 disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The 30 points at equal intervals can be specified in the capacitance forming portion Ac described later. Also, by extending the measurement of such an average value to 10 dielectric layers 111 and measuring the average value, the average thickness of the dielectric layer 111 can be further generalized.

[0032] The main body 110 may include a capacitance forming section Ac in which a dielectric layer 111 and internal electrodes 121 and 122 are alternately arranged in a first direction, and cover sections 112 and 113 located above and below the capacitance forming section in the first direction.

[0033] The capacitance-forming section Ac is located inside the main body 110 and can form capacitance by including a first internal electrode 121 and a second internal electrode 122 that are arranged to face each other with the dielectric layer 111 in between.

[0034] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between.

[0035] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume forming portion Ac in the first direction.

[0036] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0037] The upper cover portion 112 and the lower cover portion 113 described above do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0038] In other words, the upper cover portion 112 and the lower cover portion 113 can include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0039] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more reliably suppress the electrostrictive phenomenon, the thickness tc of the cover portions 112 and 113 may be 200 to 350 μm.

[0040] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0041] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0042] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 may be located on both end surfaces in the width direction of the ceramic main body 110.

[0043] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0044] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0045] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0046] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0047] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 180 to 350 μm.

[0048] The average width of the margin portions 114 and 115 can represent the average size MW1 in the third direction of the region where the internal electrode is separated from the fifth surface and the average size MW2 in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0049] Therefore, in one embodiment, the average sizes MW1 and MW2 in the third direction of the region where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can be 180 to 600 μm, respectively.

[0050] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0051] The first internal electrode 121 is exposed via the third surface 3, separated from the fourth surface 4, and the second internal electrode 122 can be exposed via the fourth surface 4, separated from the third surface 3. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0052] In other words, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Furthermore, the first internal electrode 121 and the second internal electrode 122 can be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0053] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0054] The method for forming the internal electrodes 121 and 122 is not particularly limited. For example, the internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal onto a ceramic green sheet and firing it. The method for applying the conductive paste for internal electrodes can be screen printing or gravure printing, but the present invention is not limited thereto.

[0055] As another example, the internal electrodes 121 and 122 can also be formed using sputtering, vacuum deposition, and / or chemical vapor deposition.

[0056] The average thickness te of the internal electrodes does not need to be particularly limited. In this case, the thickness of internal electrodes 121 and 122 can refer to the size of internal electrodes 121 and 122 in the first direction. For example, the average thickness te of internal electrodes 121 and 122 may be 0.8 to 1.2 μm.

[0057] Here, the average thickness te of the internal electrodes can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode 121, 122 can be measured at multiple points, for example, 30 points equally spaced in the second direction, and the average value can be measured. The 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes 121, 122 and measuring the average value, the average thickness of the internal electrodes 121, 122 can be further generalized.

[0058] Protrusions 141 and 142 may be arranged on the first surface 1 and the second surface 2 of the main body 110.

[0059] When a voltage is applied to an MLCC, the volume repeatedly expands and contracts due to the electrostrictive phenomenon of the dielectric, which is an inherent property of ferroelectric ceramic materials. Volume expansion and contraction occur in the dielectric layer located in the region where the internal electrodes overlap. At this time, the external electrodes located on the third and fourth surfaces of the main body act as clamps that fix both ends of the main body in the longitudinal direction, and electrostrictive loads are concentrated on the first surface 1 and second surface 2 of the main body, which are opposite to the stacking direction (first direction, Z direction) of the internal electrodes 121, 122 and the dielectric layer 111. In the case of a typical MLCC structure where only cover parts are placed on the upper and lower parts in the first direction of the capacitance forming part Ac, there is little resistance that can suppress deformation due to electrostriction, so the first surface 1 and second surface 2 of the main body can become a free-expanding structure.

[0060] According to one embodiment of the present invention, since the protrusions 141 and 142 are arranged on the first surface 1 and second surface 2 of the main body, resistance is generated in the opposite direction to the direction in which electrostrictive deformation occurs, thereby suppressing deformation due to electrostriction. As a result, it is possible to prevent cracks from occurring between the internal electrodes and the dielectric layer, improve the withstand voltage, and reduce the failure rate.

[0061] Furthermore, the protrusions 141 and 142 can increase the moisture penetration pathways and improve moisture resistance reliability.

[0062] According to one embodiment of the present invention, when the width of the main body 110 in the third direction is W and the width of the protruding portion in the third direction is W1, W1 / W may be 0.5 or more and 0.85 or less. This effectively suppresses electrostrictive stress, prevents cracks from occurring between the internal electrode and the dielectric layer, and improves the dielectric strength.

[0063] If W1 / W is less than 0.5, the electrostrictive stress suppression effect by the protruding portion may be insufficient.

[0064] If W1 / W exceeds 0.85, the electrostrictive stress suppression effect may decrease sharply or the chip size may increase. Therefore, it is preferable that W1 / W be 0.85 or less, and in order to further improve the stress suppression effect, W1 / W may be 0.75 or less. In one embodiment, W1 / W may be 0.5 or more and 0.75 or less.

[0065] In one embodiment, when the length of the main body 110 in the second direction is L and the length of the protrusions 141 and 142 in the second direction is L1, L1 / L may be 0.5 or more and 0.8 or less.

[0066] If L1 / L is less than 0.5, the electrostrictive stress suppression effect by the protrusion may be insufficient, and if it exceeds 0.8, the band portion of the external electrode may become shorter or the chip size may increase.

[0067] The length L of the main body may be the length in the second direction from the extension line E3 of the third face to the extension line E4 of the fourth face. The thickness T of the main body 110 may be the thickness in the first direction from the extension line E1 of the first face to the extension line E2 of the second face. The width W of the main body 110 may be the width in the third direction from the extension line E5 of the fifth face to the extension line E6 of the sixth face.

[0068] Hereinafter, the protrusion 141 disposed on the second surface will be described as the center. However, since the protrusion 142 disposed on the first surface is symmetric with respect to the X direction to the protrusion 141 disposed on the second surface, the same applies to the protrusion 142 disposed on the first surface.

[0069] In one embodiment, when the average thickness in the first direction of the protrusion 141 disposed on the second surface of the main body 110 is T1, T1 may be 10 μm or more. If T1 is less than 10 μm, the electrostriction stress suppression effect by the protrusion may be insufficient.

[0070] The average thickness T1 of the protrusion 141 in the first direction can be a value obtained by averaging the thicknesses in the first direction measured at any 10 points of the protrusion in the cross-sections in the first direction and the second direction.

[0071] In one embodiment, the protrusions 141, 142 and the dielectric layer 111 can contain the same main components. By including the same main components in the protrusions 141, 142 and the dielectric layer 111, the bonding force between the main body and the protrusions can be improved, and at the same time, it can be manufactured by sintering.

[0072] The main components contained in the protrusions 141, 142 and the dielectric layer 111 are BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3(0 < y < 1), and may be one or more of them. Here, the main component can mean that the content of the main component among all components is 90 wt% or more.

[0073] However, it is not limited thereto, and the protrusions 141, 142 can be formed using a material having electrically insulating properties.

[0074] The method for forming the protrusions 141 and 142 is not particularly limited. Referring to Figure 4, which shows the main body and protrusions disassembled, the protrusions 141 and 142 can be formed by stacking multiple dielectric sheets on the cover portions 112 and 113 that satisfy the width and length of the protrusions.

[0075] External electrodes 131 and 132 can be arranged on the third and fourth surfaces. The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are arranged on the third surface 3 and fourth surface 4 of the main body 110, respectively, and are connected to a first internal electrode 121 and a second internal electrode 122, respectively. The first external electrode and the second external electrode may also extend and be arranged on parts of the first and second surfaces.

[0076] Furthermore, the external electrodes 131 and 132 may be arranged to cover both end faces of the margin portions 114 and 115 in the second direction.

[0077] On the other hand, although this embodiment describes a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0078] Referring to Figure 2, the external electrodes 131 and 132 include a first external electrode 131 and a second external electrode 132, the first external electrode including a first connection portion P1a located on the third surface and a first band portion P1b extending from the first connection portion to a part of the first and second surfaces, and the second external electrode including a second connection portion P2a located on the fourth surface and a second band portion P2b extending from the second connection portion to a part of the first and second surfaces.

[0079] In one embodiment, when the maximum thickness in the first direction of the first band portion P1b arranged on the second surface is Tb1, the maximum thickness in the first direction of the second band portion arranged on the second surface is Tb2, and the average thickness in the first direction of the protrusion 141 arranged on the second surface is T1, then T1 ≤ Tb1 and T1 ≤ Tb2 can be satisfied.

[0080] If T1 is thicker than Tb1 and / or Tb2, the chip size may increase.

[0081] Tb1 may be the thickness in the first direction from the extension line E2 of the second surface to the highest point in the first direction of the first band portion P1b, and Tb2 may be the thickness in the first direction from the extension line E2 of the second surface to the highest point in the first direction of the second band portion P2b.

[0082] In one embodiment, when the length of the first band portion P1b arranged on the second surface in the second direction is BL1, the length of the second band portion P2b arranged on the second surface in the second direction is BL2, the length of the protrusion 141 arranged on the second surface in the second direction is L1, and the length of the main body 110 in the second direction is L, then L = L1 + BL1 + BL2 can be satisfied. That is, the end of the band portion P1b of the first external electrode can abut against one end of the protrusion 141 in the second direction, and the end of the band portion P2b of the second external electrode can abut against the other end of the protrusion 141 in the second direction.

[0083] BL1 may be the length in the second direction from the extension line E3 of the third surface to the end of the first band portion P1b located on the second surface, and BL2 may be the length in the second direction from the extension line E4 of the fourth surface to the end of the second band portion P2b located on the second surface.

[0084] In one embodiment, the external electrodes 131 and 132 include electrode layers 131a and 132a arranged to be in contact with the main body 110, and plating layers 131b and 132b arranged on the electrode layers, wherein the electrode layers 131a and 132a may be arranged to be in direct contact with both end faces of the protrusions 141 and 142 in the second direction.

[0085] In one embodiment, the electrode layers 131a and 132a can be arranged to cover a portion of the protrusions 141 and 142. That is, the electrode layers 131a and 132a can cover a portion of the upper surface in the first direction of the protrusion 141 which is positioned on the second surface, and a portion of the lower surface in the first direction of the protrusion 142 which is positioned on the first surface.

[0086] In one embodiment, when the width in the third direction from the fifth surface of the main body 110 to the protrusions 141 and 142 is Ws1, and the width in the third direction from the sixth surface of the main body 110 to the protrusions 141 and 142 is Ws2, the conditions Ws1 ≥ 0.075W and Ws2 ≥ 0.075W can be satisfied.

[0087] If Ws1 < 0.075W and / or Ws2 < 0.075W, the electrostrictive stress suppression effect may decrease sharply, or the chip size may increase.

[0088] More preferably, in order to further improve the stress suppression effect, W, Ws1, and Ws2 can satisfy Ws1 ≥ 0.125W and Ws2 ≥ 0.125W.

[0089] On the other hand, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc., and may also have a multilayer structure.

[0090] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a placed on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0091] To give a more specific example for electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin. The conductive metal contained in electrode layers 131a and 132a can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0092] In one embodiment, the external electrodes 131 and 132 may be in contact with the internal electrodes 121 and 122 and may include electrode layers 131a and 132a containing Cu and glass, and plating layers 131b and 132b disposed on the electrode layers.

[0093] Furthermore, the electrode layers 131a and 132a may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. In one embodiment, the electrode layers 131a and 132a may be in contact with the internal electrodes 121 and 122 and may include a base electrode layer containing Cu and glass, and a conductive resin layer disposed on the base electrode layer and containing a conductive metal and resin.

[0094] Furthermore, the electrode layers 131a and 132a may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0095] The plating layers 131b and 132b play a role in improving mounting characteristics. The types of plating layers 131b and 132b are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0096] To give a more specific example for the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or may be in a form in which Sn plating layers, Ni plating layers and Si plating layers are sequentially formed. Furthermore, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0097] There is no particular limit to the size of the stacked electronic component 100.

[0098] However, in medium-to-high voltage environments, volume expansion and contraction due to electrostriction become larger, so the electrostriction suppression effect of the protrusions of the present invention may become more pronounced in stacked electronic components 100 having a size of 3216 (length × width, 3.2 mm × 1.6 mm) or larger.

[0099] Therefore, the maximum size of the stacked electronic component 100 in the second direction can be 3.2 mm or more, and the maximum size in the third direction can be 1.6 mm or more.

[0100] In one embodiment, the rated voltage of the stacked electronic component 100 may be 100V or higher. Since the electrostrictive stress increases further under high voltages of 100V or higher, the electrostrictive stress suppression effect of the protrusion of the present invention may become more effective.

[0101] (Examples) To confirm the electrostriction suppression effect depending on the width of the protrusion, sample chips with protrusion widths were prepared.

[0102] Figures 5 to 7 show the area of ​​the protrusion, load (stress), and displacement of each sample chip according to its W1 / W (width of the protrusion / width of the main body).

[0103] Referring to Figures 2 and 3, the sample chip was manufactured with a body length L of 3 mm, a body thickness T of 4 mm, a protrusion length L1 of 2 mm, and an average protrusion thickness T1 of 0.1 mm.

[0104] In Figure 6, the load (stress) represents the magnitude of the force generated by electrostriction when a voltage of 1V is applied to the sample chip, and was measured based on Hooke's law.

[0105] In Figure 7, displacement refers to the degree of deformation caused by electrostriction and was measured based on Hooke's law.

[0106] Referring to Figure 5, since the length L1 and average thickness T1 of the protrusion are the same for each sample chip, it can be confirmed that the area of ​​the protrusion increases linearly as W1 / W (width of the protrusion / width of the main body) increases.

[0107] Referring to Figure 6, the load (stress) is 22.5 N / m when no protrusions are present. 2 It was measured that, if a protrusion is placed, the load (stress) is 20.0 N / m, except when W1 / W is 0.95. 2 The following can be confirmed. In particular, when W1 / W presented in this invention satisfies the condition of 0.5 to 0.85, the load (stress) is 18.0 N / m 2 The following results show a significant reduction compared to the case without protrusions. While the load (stress) decreases as the W1 / W of the protrusion increases, the chip size may increase in the case of W1 / W, and there is a section where the load (stress) increases sharply when W1 / W is 0.95. Therefore, it is preferable that W1 / W be between 0.5 and 0.85. Furthermore, the load (stress) is 18.0 N / m. 2 To reliably control the value below a certain level, it is more preferable that W1 / W is between 0.5 and 0.75.

[0108] Referring to Figure 7, it can be seen that in the case of displacement, as W1 / W (width of the protrusion / width of the main body) increases, it decreases almost linearly.

[0109] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0110] Furthermore, the expression "one embodiment" as used in this invention does not mean that each embodiment is the same as another, but is provided to emphasize and describe the unique and distinct features of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, as long as there is no description in the other embodiment that contradicts or is contrary to that matter.

[0111] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates a different meaning. [Explanation of symbols]

[0112] 100: Stacked Electronic Components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Electrode layer 131b, 132b: Plating layer 141, 142: Protrusions

Claims

1. A body comprising a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, including a first and second surface facing the first direction, a third and fourth surface connected to the first and second surfaces and facing the second direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing the third direction, The protrusions arranged on the first surface and the second surface, Includes external electrodes arranged on the third and fourth surfaces, A stacked electronic component in which, when the width of the main body in the third direction is W and the width of the protruding portion in the third direction is W1, W1 / W is 0.5 or more and 0.85 or less.

2. The stacked electronic component according to claim 1, wherein W1 / W is 0.5 or more and 0.75 or less.

3. The stacked electronic component according to claim 1, wherein when the length of the main body in the second direction is L and the length of the protruding portion in the second direction is L1, L1 / L is 0.5 or more and 0.8 or less.

4. When T1 is the average thickness of the protrusions arranged on the second surface in the first direction, The stacked electronic component according to claim 1, wherein T1 is 10 μm or more.

5. The protruding portion and the dielectric layer contain the same main component, and the main component is BaTiO ３ , (Ba １－ｘ Ca ｘ )TiO ３ (0 < x < 1), Ba(Ti １－ｙ Ca ｙ )O ３ (0 < y < 1), (Ba １－ｘ Ca ｘ )(Ti １－ｙ Zr ｙ )O ３ (0 < x < 1, 0 < y < 1) and Ba(Ti １－ｙ Zr ｙ )O ３ (0 < y < 1), the multilayer electronic component according to claim 1, which is one or more of them.

6. The external electrode includes a first external electrode and a second external electrode. The first external electrode includes a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a part of the first and second surfaces. The stacked electronic component according to claim 1, wherein the second external electrode includes a second connecting portion arranged on the fourth surface and a second band portion extending from the second connecting portion to a part of the first and second surfaces.

7. The laminated electronic component according to claim 6, wherein T1 ≤ Tb1 and T1 ≤ Tb2 are satisfied when Tb1 is the maximum thickness in the first direction of the first band portion arranged on the second surface, Tb2 is the maximum thickness in the first direction of the second band portion arranged on the second surface, and T1 is the average thickness in the first direction of the protrusions arranged on the second surface.

8. When the length of the first band portion arranged on the second surface in the second direction is BL1, the length of the second band portion arranged on the second surface in the second direction is BL2, the length of the protrusion arranged on the second surface in the second direction is L1, and the length of the main body in the second direction is L, A stacked electronic component according to claim 6, satisfying L = L1 + BL1 + BL2.

9. The external electrode includes an electrode layer positioned in contact with the main body and a plating layer positioned on the electrode layer. The laminated electronic component according to claim 1, wherein the electrode layer is arranged to be in direct contact with both end faces in the second direction of the protrusion.

10. The laminated electronic component according to claim 9, wherein the electrode layer is arranged to cover a portion of the protruding portion.

11. The electrode layer comprises a conductive metal and glass, as described in claim 9.

12. When the width in the third direction from the fifth surface to the protrusion is Ws1, and the width in the third direction from the sixth surface to the protrusion is Ws2, A stacked electronic component according to any one of claims 1 to 11, satisfying Ws1 ≥ 0.075W and Ws2 ≥ 0.075W.

13. The stacked electronic component according to claim 12, wherein W, Ws1, and Ws2 satisfy Ws1 ≥ 0.125W and Ws2 ≥ 0.125W.

14. The stacked electronic component according to any one of claims 1 to 11, wherein the main body includes a capacitance forming section in which the dielectric layer and internal electrodes are alternately arranged in a first direction, and cover sections disposed above and below the capacitance forming section in the first direction.

15. The stacked electronic component according to any one of claims 1 to 11, wherein the rated voltage of the stacked electronic component is 100V or more.

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