Multilayer electronic components

Abstract

This technology effectively dissipates heat generated within multilayer electronic components, thereby improving their reliability. [Solution] A stacked electronic component 100 according to one embodiment of the present disclosure includes a dielectric layer and internal electrodes arranged alternately with respect to the dielectric layer in a first direction X, and includes a body 110 having a first surface 1 and a second surface 2 facing the first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing the second direction Y, a fifth surface 5 and a sixth surface 6 connected to the first, second, third and fourth surfaces and facing the third direction Z, and external electrodes 131 and 132 arranged on the third and fourth surfaces, wherein the internal electrodes are arranged apart from the fifth and sixth surfaces with a margin portion in between, and through holes 116 that penetrate the first and second surfaces and have an internal void.

Description

[Technical Field]

[0001] This disclosure relates to a stacked electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones to charge or discharge electricity. Due to their advantages of being small, yet guaranteeing high capacitance and being easy to mount, MLCCs are used as components in a wide range of electronic devices.

[0003] Recently, with the miniaturization and increased capacitance of MLCCs, the heat generation problem in MLCCs has become a significant issue. When voltage is applied to an MLCC, heat is generated inside the MLCC, and this heat adversely affects the electrical characteristics and lifespan of the MLCC. Therefore, research is needed on new structures to effectively dissipate the heat generated inside the MLCC. [Overview of the project] [Problems that the invention aims to solve]

[0004] One of the various purposes of this disclosure is to improve the reliability of multilayer electronic components by effectively dissipating the heat generated inside them.

[0005] However, the purpose of this disclosure is not limited to what is described above, and this will become clearer in the course of describing specific embodiments of this disclosure. [Means for solving the problem]

[0006] A stacked electronic component according to one embodiment of the present disclosure includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, and comprises a body having first and second faces facing the first direction, third and fourth faces connected to the first and second faces and facing the second direction, fifth and sixth faces connected to the first, second, third and fourth faces and facing the third direction, and external electrodes arranged on the third and fourth faces, wherein the internal electrodes are arranged apart from the fifth and sixth faces with a margin in between, and through holes that penetrate the first and second faces and have an internal void can be arranged in the margin. [Effects of the Invention]

[0007] One of the various effects of this disclosure is that it can effectively dissipate the heat generated inside the multilayer electronic component, thereby improving the reliability of the multilayer electronic component. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic perspective view showing a stacked electronic component according to one embodiment of the present disclosure. [Figure 2] This is a schematic cross-sectional view showing a section along the line I-I' in Figure 1. [Figure 3] This is a schematic cross-sectional view showing a section along the line II-II' in Figure 1. [Figure 4a] This is a schematic enlarged view of the K1 region in Figure 3. [Figure 4b] This is a schematic enlarged view of the K1 region in Figure 3. [Figure 5] This is a schematic cross-sectional view showing a section along the line III-III' in Figure 1. [Figure 6] This is a cross-sectional view showing a stacked electronic component according to one embodiment of the present disclosure mounted on a printed circuit board. [Figure 7] This is a schematic cross-sectional view of a stacked electronic component according to another embodiment of the present disclosure, and corresponds to Figure 5. [Figure 8]A cross-sectional view schematically showing a stacked electronic component according to another embodiment of the present disclosure, which corresponds to FIG. 5. [Figure 9] A perspective view schematically showing a method for manufacturing a stacked electronic component according to an embodiment of the present disclosure.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present disclosure can be modified into several other forms, and the scope of the present disclosure is not limited to the embodiments described below. Also, the embodiments of the present disclosure are provided to more fully explain the present disclosure to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged, reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0010] In addition, parts not related to the explanation are omitted in the drawings for the purpose of clearly explaining the present disclosure, and the size and thickness of each illustrated configuration are arbitrarily shown for convenience of explanation, so the present disclosure is not necessarily limited by the illustration. Also, components having the same function within the scope of the same idea are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless there is a particularly contrary description.

[0011] In the drawings, the first direction X can be defined as the thickness (T) direction, the second direction Y as the length (L) direction, and the third direction Z as the width (W) direction.

[0012] Stacked electronic component Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure; Figure 2 is a schematic cross-sectional view showing a section along line I-I' in Figure 1; Figure 3 is a schematic cross-sectional view showing a section along line II-II' in Figure 1; Figures 4a and 4b are schematic enlarged views showing region K1 in Figure 3; Figure 5 is a schematic cross-sectional view showing a section along line III-III' in Figure 1; and Figure 6 is a cross-sectional view showing a stacked electronic component according to one embodiment of the present disclosure mounted on a printed circuit board.

[0013] Hereinafter, with reference to Figures 1 to 6, a multilayer electronic component 100 according to one embodiment of the present disclosure will be described in detail. While a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present disclosure is not limited to this and can be applied to a variety of multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0014] The size of the stacked electronic component 100 is not particularly limited, but the maximum length of the stacked electronic component 100 in the second direction is 0.1 mm to 6.0 mm, the maximum width of the stacked electronic component 100 in the third direction is 0.1 mm to 5.0 mm, and the maximum thickness of the stacked electronic component 100 in the first direction may be 0.05 mm to 3.5 mm.

[0015] The stacked electronic component 100 may include a main body 110 and external electrodes 131 and 132.

[0016] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process and the polishing process on the corners of the main body 110, the main body 110 may not be a perfectly straight hexahedron, but it can be substantially hexahedral.

[0017] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction, which are connected to the first surface 1 and the second surface 2, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction, which are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4.

[0018] The main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

[0019] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 can be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), and can contain one or more of them.

[0020] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0021] The internal electrodes 121 and 122 may include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in a first direction with the dielectric layer 111 in between. The first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having opposite polarities, can be arranged to face each other with the dielectric layer 111 in between.

[0022] The first internal electrode 121 is positioned at a distance from the fourth surface 4, the fifth surface 5, and the sixth surface 6, and can be connected to the first external electrode 131 at the third surface 3. The second internal electrode 122 is positioned at a distance from the third surface 3, the fifth surface 5, and the sixth surface 6, and can be connected to the second external electrode 132 at the fourth surface 4.

[0023] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably may include Ni, but is not limited thereto.

[0024] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0025] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the average thickness of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thickness at multiple points on one dielectric layer 111, for example, five points equally spaced in the second direction, and then calculating the average value. Similarly, the average thickness te of one internal electrode 121 or 122 can be measured by measuring the thickness at multiple points on one internal electrode 121 or 122, for example, five points equally spaced in the second direction, and then calculating the average value. The five equally spaced points can be specified in the capacitance forming section Ac. On the other hand, if such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average value is measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0026] The main body 110 may include a capacitance forming section Ac which includes a dielectric layer 111 and internal electrodes 121, 122 to form a capacitance, and cover sections 112, 113 which are arranged on both sides of the capacitance forming section Ac facing the first direction.

[0027] The average thickness tc of the cover portions 112 and 113 is not particularly limited. The average thickness tc of the cover portions 112 and 113 may be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0028] The average thickness tc of the cover portions 112 and 113 can mean the average thickness of the cover portions 112 and 113 in the first direction, and can be the average value of the thickness in the first direction measured at five equally spaced points in the cross-section of the main body 110 in the first and second directions.

[0029] The main body 110 may include margin portions 114 and 115 arranged on both sides of the capacitance forming portion Ac facing the third direction and on both sides of the cover portions 112 and 113 facing the third direction. That is, the internal electrodes 121 and 122 may be arranged spaced apart from the fifth surface 5 and the sixth surface 6, with the margin portions 114 and 115 in between.

[0030] The margin portions 114 and 115 may include a first margin portion 114 positioned between the internal electrodes 121 and 122 and the fifth surface 5, and a second margin portion 115 positioned between the internal electrodes 121 and 122 and the sixth surface 6. That is, the capacitance forming portion Ac may be positioned between the first margin portion 114 and the second margin portion 115.

[0031] The cover portions 112, 113 and the margin portions 114, 115 can have a configuration similar to the dielectric layer 111, except that they do not include the internal electrodes 121, 122. That is, the cover portions 112, 113 and the margin portions 114, 115 can represent regions where the internal electrodes 121, 122 are not located. The cover portions 112, 113 can constitute the outer region of the main body 110 in a first direction, and the margin portions 114, 115 can constitute the outer region of the main body 110 in a third direction.

[0032] The sizes of the margin portions 114 and 115 are not particularly limited, however the width of the volume-forming portion Ac may be greater than the width of the first margin portion 114 and the width of the second margin portion 115. Here, the width of the volume-forming portion Ac can mean the width of the volume-forming portion Ac in the third direction, and the widths of the margin portions 114 and 115 can mean the width of the margin portions 114 and 115 in the third direction.

[0033] The average width of the margin portions 114 and 115 may be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average width of the margin portions 114 and 115 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average width of the margin portions 114 and 115 refers to the average width of the first margin portion 114 and the second margin portion 115, respectively.

[0034] The average width of the margin portions 114 and 115 can represent the width of the margin portions 114 and 115 in the third direction, and can be the average value of the thickness in the third direction measured at five equally spaced points in the cross-section of the main body 110 in the first and third directions.

[0035] External electrodes 131 and 132 can be arranged on the third surface 3 and the fourth surface 4. The external electrodes 131 and 132 may include a first external electrode 131 arranged on the third surface 3 and extending over parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and a second external electrode 132 arranged on the fourth surface 4 and extending over parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0036] The type and form of the external electrodes 131 and 132 are not particularly limited and can have a multilayer structure. For example, the external electrodes 131 and 132 may include base electrode layers 131a and 132a that come into contact with the internal electrodes 121 and 122, and plating layers 131b and 132b placed on the base electrode layers 131a and 132a.

[0037] The base electrode layers 131a and 132a may be fired electrode layers containing metal and glass. The metal contained in the base electrode layers 131a and 132a may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing these. The glass contained in the base electrode layers 131a and 132a may include, for example, one or more oxides of Ba, Ca, Zn, Al, B, and Si.

[0038] On the other hand, while the base electrode layers 131a and 132a may consist only of fired electrode layers, the disclosure is not limited thereto, and the base electrode layers 131a and 132a may include a fired electrode layer containing metal and glass, and a resin electrode layer disposed on the fired electrode layer containing metal particles and resin.

[0039] The metal particles contained in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or alloys containing these. The resin contained in the resin electrode layer may include, for example, one or more of epoxy resin, acrylic resin, and ethylcellulose.

[0040] The plating layers 131b and 132b may include, for example, Ni, Sn, Pd, and / or alloys containing these, and may be formed from multiple layers. The plating layers 131b and 132b may be, for example, a Ni plating layer or a Sn plating layer, or a Ni plating layer and a Sn plating layer may be formed sequentially. The plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0041] The drawing illustrates a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, but it is not limited to this, and the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0042] According to one embodiment of the present disclosure, through holes 116 and 117 can be arranged in the margin portions 114 and 115, penetrating the first surface 1 and the second surface 2 and having an internal void. For example, the main body 110 may include through holes 116 and 117 arranged in the region between the internal electrodes 121 and 122 and the fifth or sixth surface 5 and 6, penetrating the first surface 1 and the second surface 2 and having an internal void. The through holes 116 and 117 can function as heat dissipation sections that release heat generated in the capacitance forming section Ac.

[0043] The through holes 116 and 117 may include a first through hole 116 located between the internal electrodes 121 and 122 and the fifth surface 5, and a second through hole 117 located between the internal electrodes 121 and 122 and the sixth surface 6. The through holes 116 and 117 may include, for example, a first through hole 116 located in the first margin portion 114 and a second through hole 117 located in the second margin portion 115. The through holes 116 and 117 may include, for example, a first through hole 116 located in the region between the internal electrodes 121 and 122 and the fifth surface 5, and a second through hole 117 located in the region between the internal electrodes 121 and 122 and the sixth surface 6.

[0044] Referring to Figure 6, the multilayer electronic component 100 can be mounted on a printed circuit board 200. The external electrodes 131 and 132 of the multilayer electronic component 100 can be connected to pads 210 and 220 located on one side of the printed circuit board 200 via solder 310 and 320. On the other hand, when current flows through the internal conductors of the printed circuit board 200, heat may be generated in the printed circuit board 200. This may cause a temperature difference between the air on the upper side and the air on the lower side of the multilayer electronic component 100. The air on the upper side of the multilayer electronic component 100 may be hotter than the air on the lower side, and such a temperature difference may cause convection of the air. In this case, the through holes 116 and 117 form a heat dissipation channel HP, which can effectively release the heat generated inside the multilayer electronic component 100 due to the convection phenomenon. To induce the convection phenomenon, the through holes 116 and 117 may have openings that extend in a first direction to allow air to flow through them. Furthermore, the first or second surface 1, 2 may be a mounting surface for the stacked electronic component 100.

[0045] The number of through-holes 116 and 117 is not particularly limited, but multiple first through-holes 116 and multiple second through-holes 117 may be provided in order to effectively dissipate the heat generated inside the stacked electronic component 100. Multiple first through-holes 116 may be arranged spaced apart from each other in a second direction, and multiple second through-holes 117 may be arranged spaced apart from each other in a second direction.

[0046] For example, the number of first through-holes 116 and second through-holes 117 can be 2 or more, 5 or more, 10 or more, 50 or more, or 100 or more, respectively. There is no particular upper limit on the number of first through-holes 116 and second through-holes 117, and they can be appropriately selected considering the length of the main body 110 in the second direction and the width of the first through-holes 116 and second through-holes 117.

[0047] The through holes 116 and 117 only need to be located in the region between the internal electrodes 121 and 122 and the fifth or sixth surface 5 and 6, and the specific positions of the through holes 116 and 117 are not limited. However, if the through holes 116 and 117 penetrate a part of the capacitance forming portion Ac, moisture from the outside can easily penetrate into the inside of the capacitance forming portion Ac through the through holes 116 and 117, which may consequently reduce the moisture resistance reliability of the stacked electronic component 100. Therefore, it is preferable that the through holes 116 and 117 be located away from the capacitance forming portion Ac.

[0048] The size and shape of the through holes 116 and 117 are not particularly limited. The through holes 116 and 117 may have a columnar shape. The columnar shape can mean, for example, a long rod-like shape or bar-like shape with an aspect ratio greater than 1, such as a cylindrical shape or a polygonal prism shape. The through holes 116 and 117 may have a columnar shape with a constant width, for example.

[0049] In one embodiment, when the width of the through holes 116 and 117 is W1 and the width of the margin portions 114 and 115 is W2, the condition 0.2 ≤ W1 / W2 ≤ 0.4 can be satisfied. If W1 / W2 is less than 0.2, the heat dissipation effect of this disclosure may not be sufficient, and if W1 / W2 exceeds 0.4, there is a risk of providing an excessive pathway for moisture to penetrate from the outside. The above W1 can mean the width of the through holes 116 and 117 in the third direction, and the above W2 can mean, for example, the width of the margin portions 114 and 115 in the third direction.

[0050] On the one hand, heat generated inside the multilayer electronic component 100 may mainly be generated in the capacitance forming portion Ac. Therefore, the closer the through holes 116 and 117 are to the capacitance forming portion Ac, the more effectively the heat generated inside the multilayer electronic component 100 can be released. However, the closer the through holes 116 and 117 are to the capacitance forming portion Ac, the easier it may be for moisture from the outside to penetrate into the inside of the capacitance forming portion Ac through the through holes 116 and 117. Therefore, the positions of the through holes 116 and 117 can vary depending on the characteristics and models of the desired multilayer electronic component 100.

[0051] Referring to FIGS. 3 and 4a, in one embodiment, the distance W3 in the third direction between the through holes 116 and 117 and the internal electrodes 121 and 122 can be smaller than the distance W4 in the third direction between the through holes 116 and 117 and the surface among the fifth surface 5 and the sixth surface 6 that is closer to the through holes 116 and 117. W4 can mean, for example, the distance in the third direction between the first through hole 116 and the fifth surface 5, or the distance in the third direction between the second through hole 117 and the sixth surface 6. When W3 < W4 is satisfied, the through holes 116 and 117 can effectively release the heat generated in the capacitance forming portion Ac. For example, in the case of the multilayer electronic component 100 that is mounted on an electrical component and a high voltage is applied, since internal heat generation may occur particularly more, the through holes 116 and 117 can be arranged so as to satisfy W3 < W4.

[0052] Referring to FIGS. 3 and 4b, in one embodiment, W4 < W3 can be satisfied. In this case, since the through holes 116 and 117 are arranged sufficiently separated from the capacitance forming portion Ac, the phenomenon of moisture from the outside penetrating into the inside of the capacitance forming portion Ac can be suppressed. For example, in the case of the small-sized multilayer electronic component 100 used for IT, since it is more vulnerable to the penetration of moisture from the outside, the through holes 116 and 117 can be arranged so as to satisfy W4 < W3.

[0053] However, the present disclosure is not limited thereto, and the multilayer electronic component 100 mounted on the electrical component and to which a high voltage is applied can also satisfy W4 < W3, and the small-sized multilayer electronic component 100 used for IT can also satisfy W3 < W4.

[0054] The above W1, W2, W3, and W4 can be measured, for example, from an image obtained by photographing the regions of the margin portions 114 and 115 with a scanning electron microscope (SEM) after exposing cross-sections of the multilayer electronic component 100 in the first direction and the third direction passing through the centers of the through-holes 116 and 117.

[0055] FIG. 7 is a cross-sectional view schematically showing a multilayer electronic component 100a according to another embodiment of the present disclosure, and is a drawing corresponding to FIG. 5. FIG. 8 is a cross-sectional view schematically showing a multilayer electronic component 100b according to another embodiment of the present disclosure, and is a drawing corresponding to FIG. 5.

[0056] Hereinafter, referring to FIGS. 7 and 8, the multilayer electronic components 100a and 100b according to another embodiment of the present disclosure will be described. For configurations that are the same as or similar to the configuration of the multilayer electronic component 100 described in FIGS. 1 to 6, the same or similar reference numerals will be used, and redundant descriptions will be omitted.

[0057] Referring to FIG. 7, the main body 110a of the multilayer electronic component 100a can include through-holes 116a disposed in the margin portion 114. On the other hand, when the width of the through-hole 116a measured on the first surface 1 is R1 and the width of the through-hole 116a measured on the second surface 2 is R2, R2 may be larger than R1. For example, the width of the through-hole 116a can have a shape that gradually decreases from the second surface 2 toward the first surface 1. For example, the through-hole 116a can have an inverted taper shape in which the width expands from the upper surface to the lower surface of the main body 110a.

[0058] If the second surface 2 is the mounting surface, convection may occur inside the through-hole 116a in the direction from the second surface 2 toward the first surface 1. In this case, if R1 becomes narrower than R2, the velocity of the fluid inside the through-hole 116a can become faster as it approaches the first surface 1, thereby allowing the heat generated inside the stacked electronic component 100a to be released more effectively.

[0059] Referring to Figure 8, the body 110b of the stacked electronic component 100b may include through holes 116b located in the margin portion 114. A coating layer 118 containing an organic compound may be placed on the side wall of the through hole 116b.

[0060] The through-hole 116b can serve the function of releasing heat generated inside the stacked electronic component 100b, but the through-hole 116b may be vulnerable to the penetration of moisture from the outside. By being placed on the side wall of the through-hole 116b, the coating layer 118 can serve the role of preventing moisture from the outside from penetrating into the inside of the main body 110b.

[0061] The organic compound contained in the coating layer 118 may include, for example, an organosilicon compound. The organosilicon compound may include, for example, a repeating unit derived from an alkoxysilane represented by the following chemical formula 1. The repeating unit derived from an alkoxysilane may mean a repeating unit having a structure obtained by hydrolysis and dehydration condensation reactions of an alkoxysilane. [Chemical formula 1] R-Si(OR')3 (where R is a C1-C20 alkyl group and R' is a C1-C6 alkyl group)

[0062] On the other hand, Figure 8 shows a structure in which the coating layer 118 is arranged only on the side wall of the through hole 116b, but the disclosure is not limited thereto. For example, the coating layer 118 may be arranged to cover at least a portion of the outer surface of the main body 110b, or to cover at least a portion of the outer surface of the external electrodes 131 and 132.

[0063] FIG. 9 is a perspective view schematically showing a method of manufacturing a multilayer electronic component according to an embodiment of the present disclosure. Hereinafter, an example of a method of forming the multilayer electronic component 100 will be described with reference to FIG. 9. However, the method of manufacturing the multilayer electronic component 100 is not limited thereto.

[0064] First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may include, for example, one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≦ 0.5, 0 < y ≦ 0.5). The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the synthesis method of the ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present disclosure is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied and dried on a carrier film to prepare a ceramic green sheet.

[0065] Next, an internal electrode pattern is formed by printing a conductive paste for an internal electrode containing metal powder, binder, organic solvent, etc. at a predetermined thickness on the ceramic green sheet using a screen printing method or a gravure printing method.

[0066] After this, the ceramic green sheet with the printed internal electrode pattern is peeled off the carrier film, and then a predetermined number of layers of ceramic green sheets with the printed internal electrode pattern are laminated and pressed together to form a ceramic laminate 400. A predetermined number of ceramic green sheets without the printed internal electrode pattern may be laminated on the upper and lower parts of the ceramic laminate to form a cover portion after firing.

[0067] The ceramic laminate 400 can be fixed on a vacuum stage 500, which can be moved horizontally in a direction D1. A punching jig 600 can be placed on top of the ceramic laminate 400. The punching jig 600 may include a holder 610 and a plurality of punching fins 620 coupled to the holder 610. The punching jig 600 can be moved vertically in a direction D2 to form through holes 416, 417 in the ceramic laminate 400.

[0068] Subsequently, the ceramic laminate 400 can be cut along a plurality of first and second cutting lines that have been set to have a predetermined chip size. The first and second cutting lines are perpendicular to each other, and one of the first and second cutting lines may be located between the first through hole 416 and the second through hole 417. Next, the cut chips can be fired to form the main body 110. The firing can be carried out, for example, in a 1.0% H2 / 99.0% N2~3.5% H2 / 96.5% N2 (H2O / H2 / N2) atmosphere at a temperature of 1000°C to 1400°C for 1 to 3 hours.

[0069] Next, external electrodes 131 and 132 are formed. For example, if the base electrode layers 131a and 132a include a fired electrode layer, the main body 110 can be dipped in a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then the conductive paste for external electrodes can be fired at a temperature of 500°C to 900°C to form a fired electrode layer.

[0070] For example, if the base electrode layers 131a and 132a include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0071] Furthermore, electroplating and / or electroless plating may be performed to form plating layers 131b and 132b on the underlying electrode layers 131a and 132a.

[0072] The stacked electronic component 100a can be manufactured, for example, by changing the shape of the punched fins 620 to a conical shape.

[0073] The multilayer electronic component 100b can be manufactured, for example, by immersing a main body 110b, which has plating layers 131b and 132b formed on it, in an organic coating solution and then drying it to form a coating layer 118. The organic coating solution may contain an alkoxysilane represented by R-Si(OR')3 (where R is a C1-C20 alkyl group and R' is a C1-C6 alkyl group) and a solvent such as an alcohol. The drying temperature is not particularly limited, but may be, for example, 100°C to 200°C.

[0074] This disclosure is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​this disclosure as described in the claims, various forms of substitution, modification, and alteration are possible by a person with ordinary skill in the art, and these also fall within the scope of this disclosure.

[0075] Furthermore, the expression "one embodiment" does not mean that each embodiment is identical to the others, but is provided to highlight and explain the unique and distinct characteristics of each embodiment. However, the above-presented embodiments do not preclude their implementation in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or inconsists with that matter.

[0076] In this disclosure, the term "connected" includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, the term "electrically connected" includes both physically connected and non-connected cases. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component. [Explanation of Symbols]

[0077] 100, 100a, 100b Stacked Electronic Components 110, 110a, 110b main unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 116, 116a, 116b, 117 through hole 121, 122 Internal electrode 131, 132 External electrode 131a, 132a Base electrode layer 131b, 132b Plating layer

Claims

1. A body comprising a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, having first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing the third direction, Includes external electrodes arranged on the third and fourth surfaces, The internal electrodes are arranged to be separated from the fifth and sixth surfaces by a margin portion. A stacked electronic component in which through holes are provided in the margin portion, penetrating the first surface and the second surface and having an internal gap.

2. The stacked electronic component according to claim 1, wherein the through-hole includes a first through-hole disposed between the internal electrode and the fifth surface, and a second through-hole disposed between the internal electrode and the sixth surface.

3. The stacked electronic component according to claim 2, wherein the first through-hole and the second through-hole are each arranged in multiple quantities.

4. The plurality of first through holes are arranged to be spaced apart from each other in the second direction, The stacked electronic component according to claim 3, wherein the plurality of second through holes are arranged to be spaced apart from each other in the second direction.

5. When the width of the through hole is W1 and the width of the margin portion is W2, The stacked electronic component according to claim 1, wherein W1 and W2 satisfy 0.2 ≤ W1 / W2 ≤ 0.

4.

6. When W3 is the distance in the third direction between the through hole and the internal electrode, and W4 is the distance in the third direction between the through hole and the fifth and sixth surfaces that are closer to the through hole, The stacked electronic component according to claim 1, wherein W3 and W4 satisfy W3 < W4.

7. When W3 is the distance in the third direction between the through hole and the internal electrode, and W4 is the distance in the third direction between the through hole and the fifth and sixth surfaces that are closer to the through hole, The stacked electronic component according to claim 1, wherein W3 and W4 satisfy W4 < W3.

8. The margin portion includes a first margin portion disposed between the internal electrode and the fifth surface, and a second margin portion disposed between the internal electrode and the sixth surface. The main body is positioned between the first margin portion and the second margin portion and includes a capacitance forming portion which includes the dielectric layer and internal electrodes. The stacked electronic component according to claim 1, wherein the through-hole is arranged at a distance from the capacitance forming portion.

9. The margin portion includes a first margin portion disposed between the internal electrode and the fifth surface, and a second margin portion disposed between the internal electrode and the sixth surface. The main body is positioned between the first margin portion and the second margin portion and includes a capacitance forming portion which includes the dielectric layer and internal electrodes. The stacked electronic component according to claim 1, wherein the width of the capacitance forming portion is greater than the width of the first margin portion and the width of the second margin portion.

10. The stacked electronic component according to any one of claims 1 to 9, wherein the through hole has a columnar shape.

11. A stacked electronic component according to any one of claims 1 to 9, wherein when the width of the through hole measured on the first surface is R1 and the width of the through hole measured on the second surface is R2, R2 is greater than R1.

12. The stacked electronic component according to any one of claims 1 to 9, wherein the width of the through hole gradually decreases from the second surface toward the first surface.

13. A laminated electronic component according to any one of claims 1 to 9, wherein a coating layer containing an organic compound is disposed on the side wall of the through hole.

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