A PCBA mainboard for a wireless charger
By adopting a double-sided design and thermal conductive structure on the wireless charger PCBA motherboard, the problem of heat dissipation difficulty is solved, achieving a more efficient heat dissipation effect, extending component life and improving device stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HAIDONG ELECTRONICS CO LTD
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-10
AI Technical Summary
The double-sided design of the PCBA motherboard of the wireless charger makes heat dissipation difficult, and the heat is difficult to dissipate effectively, which limits the design of heat dissipation channels and component placement.
The PCBA motherboard with a double-sided design has a layer of thermal grease applied to the surfaces of the main chip module, driver module, power device module and communication chip, and is equipped with T-shaped thermal pads and thermal conductive layers. There are gaps between the thermal pads, and the thermal conductive layers have through holes and round holes to promote air convection and heat dissipation.
It improves the heat dissipation performance of wireless chargers, extends the lifespan of components, and enhances the stability and reliability of devices.
Smart Images
Figure CN224481516U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCBA motherboard technology, and in particular to a PCBA motherboard for a wireless charger. Background Technology
[0002] The PCBA (Printed Circuit Board Assembly) motherboard is the core component of a wireless charger, responsible for implementing its various functions. Wireless charger PCBA motherboards are often double-sided. This design offers advantages in integration and functionality, but it also presents challenges in heat dissipation. Wireless chargers are typically small, and the internal space is very limited to accommodate the double-sided PCBA motherboard and other necessary components. This restricts the design of heat dissipation channels, making it difficult to dissipate heat effectively. Within this limited space, the placement of cooling components such as cooling fans and heat sinks becomes difficult, further exacerbating the heat dissipation problem. Utility Model Content
[0003] The purpose of this invention is to at least solve one of the aforementioned technical defects.
[0004] Therefore, one objective of this utility model is to provide a PCBA motherboard for a wireless charger to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.
[0005] To achieve the above objectives, one embodiment of the present invention provides a PCBA motherboard for a wireless charger, including a board body, a main chip module, a driver module, a power device module, a communication chip, and positioning holes. The main chip module, the driver module, the power device module, and the communication chip are mounted on the board body.
[0006] Positioning holes are provided at both ends of the plate. An input module is installed on the bottom of the plate, and an output module is installed on the bottom of the plate. The output module is connected to the charging coil.
[0007] The main chip module, driver module, power device module, and communication chip are covered with a layer of silicone grease. A thermal pad is attached to the top surface of the silicone grease layer. The thermal pad is supported and has a "T" shaped cross-section.
[0008] A thermally conductive layer is fixedly connected to the top of the thermal pad, and a number of through holes are formed on the thermally conductive layer.
[0009] Several circular holes are formed in a portion of the heat-conducting layer.
[0010] Preferably, of any of the above solutions, the board body is double-sided, and the main chip module is model FS32K142H.
[0011] The above technical solution is adopted: This board is the PCBA mainboard of a wireless charger. In this board, the output module is connected to the charging coil via a cable. The input module is connected to the power supply.
[0012] In this board, the main chip module is the control center of the wireless charger, responsible for controlling the entire wireless charging process, including detecting charging devices and adjusting charging power. The driver module drives the wireless charging coil for wireless charging and is typically used in conjunction with the main chip module. The power device module is responsible for converting the input voltage to a voltage suitable for wireless charging and controlling the wireless charging power.
[0013] The input module receives external power input and performs preliminary processing and filtering. The output module transmits the processed power to the wireless charging coil to charge devices such as mobile phones.
[0014] Preferably, in any of the above schemes, the main chip module is connected to the driver module and the power device module via pins, and the communication chip is connected to the main chip module via pins.
[0015] Preferably, in any of the above schemes, the output terminal of the input module is connected to the main chip module, and the output terminal of the main chip module is connected to the output module.
[0016] The above technical solution is adopted: This board adopts a double-sided design, with the top side handling current and the bottom side inputting and outputting current, to prevent heat from concentrating on one side. This board is installed by screws, and there are gaps at the top and bottom to promote natural air convection and facilitate heat dissipation.
[0017] Meanwhile, thermal paste, or silicone grease, is applied to the top surface of the current processing modules that generate a lot of heat, namely the main chip module, driver module, power device module, and communication chip. Then, a T-shaped elevated thermal pad is designed with gaps between the thermal pads to allow air circulation, further improving the heat dissipation effect. The large heat dissipation surface allows the thermal pad to conduct heat to the upper thermal layer and then dissipate it away. During the heat conduction process, the presence of several circular holes in certain areas greatly increases the heat dissipation area, allowing the heat to be dissipated to the surrounding environment more quickly. This effectively improves the heat dissipation performance of the PCBA of this wireless charger. This design not only extends the lifespan of the motherboard and various electronic components, but also improves the overall stability and reliability of the wireless charger.
[0018] The through-hole design prevents heat from being covered or compressed, facilitating the upward flow of heat from the modules on the board.
[0019] Preferably, in any of the above embodiments, there is a gap between the thermal pads, and the thermal pads and thermal layer are made of epoxy resin.
[0020] Preferably, in any of the above solutions, the height of the thermal pad is 1-1.5 cm, and the gap below the through hole corresponds to the main chip module, driver module, power device module, and communication chip.
[0021] Preferably, in any of the above schemes, the circular holes are arranged in a linear array on the rear half of the heat-conducting layer.
[0022] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:
[0023] This PCBA motherboard for wireless chargers uses a combination of thermal grease layer, thermal pad, thermal layer, through holes, and round holes. The board adopts a double-sided design, with the top side handling current and the bottom side handling input and output current, preventing heat from concentrating on one side. The board is mounted with screws, and there are gaps on both the top and bottom to promote natural air convection and facilitate heat dissipation.
[0024] Meanwhile, thermal paste, or silicone grease, is applied to the top surface of the current processing modules that generate a lot of heat, namely the main chip module, driver module, power device module, and communication chip. Then, a T-shaped elevated thermal pad is designed with gaps between the thermal pads to allow air circulation, further improving the heat dissipation effect. The large heat dissipation surface allows the thermal pad to conduct heat to the upper thermal layer and then dissipate it away. During the heat conduction process, the presence of several circular holes in certain areas greatly increases the heat dissipation area, allowing the heat to be dissipated to the surrounding environment more quickly. This effectively improves the heat dissipation performance of the PCBA of this wireless charger. This design not only extends the lifespan of the motherboard and various electronic components, but also improves the overall stability and reliability of the wireless charger.
[0025] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0026] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0027] Figure 1 This is a first-view structural schematic diagram of the present invention;
[0028] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;
[0029] Figure 3 This is a structural schematic diagram of the present invention from a third-view perspective.
[0030] In the diagram: 1-Board body, 2-Main chip module, 3-Driver module, 4-Power device module, 5-Communication chip, 6-Positioning hole, 7-Input module, 8-Output module, 9-Silicone grease layer, 10-Thermal pad, 11-Thermal layer, 12-Through hole, 13-Round hole. Detailed Implementation
[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] like Figure 1-3 As shown, the PCBA motherboard for wireless charger includes a board body 1, a main chip module 2, a driver module 3, a power device module 4, a communication chip 5, and a positioning hole 6. The main chip module 2 is mounted on the top of the board body 1, the driver module 3 is mounted on the top of the board body 1, the power device module 4 is mounted on the top of the board body 1, and the communication chip 5 is mounted on the top of the board body 1.
[0034] Positioning holes 6 are provided at both ends of the board body 1. An input module 7 is installed on the bottom of the board body 1, and an output module 8 is installed on the bottom of the board body 1. The output module 8 is connected to the charging coil.
[0035] The main chip module 2, driver module 3, power device module 4, and communication chip 5 are covered with a silicone grease layer 9. A thermal pad 10 is attached to the top surface of the silicone grease layer 9. The thermal pad 10 is supported and has a "T" shaped cross-section.
[0036] A thermally conductive layer 11 is fixedly connected to the top of the thermally conductive pad 10, and a number of through holes 12 are provided on the thermally conductive layer 11.
[0037] Several circular holes 13 are formed on a portion of the heat-conducting layer 11.
[0038] Example 1: Board 1 is double-sided, and the main chip module 2 is model FS32K142H. This board is the PCBA mainboard of a wireless charger. In this board, the output module 8 is connected to the charging coil via a cable. The input module 7 is connected to the power supply. The main chip module 2 is connected to the driver module 3 and the power device module 4 via pins, and the communication chip 5 is connected to the main chip module 2 via pins.
[0039] Example 2: The output terminal of input module 7 is connected to main chip module 2, and the output terminal of main chip module 2 is connected to output module 8. This board adopts a double-sided design, with the top side handling current and the bottom side handling input and output current, preventing heat from concentrating on one side. There are gaps between the thermal pads 10, and the thermal pads 10 and thermal layer 11 are made of epoxy resin. The height of the thermal pads 10 is 1-1.5 cm, and the gaps below the through holes 12 correspond to those between the main chip module 2, driver module 3, power device module 4, and communication chip 5. Circular holes 13 are linearly arrayed on the rear half of the thermal layer 11.
[0040] The working principle of this utility model is as follows:
[0041] In this board, output module 8 is connected to the charging coil via a cable. Input module 7 is connected to the power supply.
[0042] In this board, the main chip module 2 is the control center of the wireless charger, responsible for controlling the entire wireless charging process, including detecting the charging device and adjusting the charging power. The driver module 3 drives the wireless charging coil for wireless charging and is typically used in conjunction with the main chip module 2. The power device module 4 is responsible for converting the input voltage to a voltage suitable for wireless charging and controlling the wireless charging power.
[0043] Input module 7 is responsible for receiving external power input and performing preliminary processing and filtering. Output module 8 is responsible for transmitting the processed electrical energy to the wireless charging coil to charge mobile phones and other devices.
[0044] Compared with the prior art, the present invention has the following advantages:
[0045] The PCBA motherboard for wireless chargers features a double-sided design with a combination of a thermal grease layer 9, a thermal pad 10, a thermal layer 11, a through hole 12, and a round hole 13. The top side handles current, while the bottom side handles input and output current, preventing heat from concentrating on one side. The board is mounted with screws, and there are gaps on both the top and bottom sides to promote natural air convection and facilitate heat dissipation.
[0046] Meanwhile, thermally conductive adhesive, i.e., silicone grease layer 9, is applied to the top surface of the current processing modules with high heat generation, namely the main chip module 2, driver module 3, power device module 4, and communication chip 5. Then, a T-shaped elevated thermal pad 10 is designed. The thermal pads 10 have gaps between them, which also allow air circulation, further improving the heat dissipation effect. The heat dissipation surface is large. Then, the thermal pads 10 conduct heat to the upper thermal conductive layer 11 and conduct it away. During the heat conduction process, due to the presence of several round holes 13 in some areas, the heat dissipation area is greatly increased, allowing the heat to be dissipated to the surrounding environment more quickly. This can effectively improve the heat dissipation performance of the PCBA of this wireless charger. This design not only extends the service life of the motherboard and various electronic components, but also improves the overall stability and reliability of the wireless charger.
Claims
1. A PCBA motherboard for a wireless charger, characterized in that, The device includes a board body (1), a main chip module (2), a driver module (3), a power device module (4), a communication chip (5), and a positioning hole (6). The main chip module (2), the driver module (3), the power device module (4), and the communication chip (5) are mounted on the board body (1). Positioning holes (6) are provided at both ends of the plate (1), an input module (7) is installed on the bottom of the plate (1), and an output module (8) is installed on the bottom of the plate (1). The output module (8) is connected to the charging coil. The main chip module (2), driver module (3), power device module (4), and communication chip (5) are covered with a silicone grease layer (9). A thermal pad (10) is attached to the top surface of the silicone grease layer (9). The thermal pad (10) is supported and has a "T" shaped cross section. The top of the thermal pad (10) is fixedly connected to a thermal conductive layer (11), and the thermal conductive layer (11) has a plurality of through holes (12). The heat-conducting layer (11) has several circular holes (13) in a local area.
2. The PCBA motherboard for a wireless charger as described in claim 1, characterized in that: The board (1) is double-sided, and the main chip module (2) is model FS32K142H.
3. A PCBA motherboard for a wireless charger as described in claim 2, characterized in that: The main chip module (2) is connected to the driver module (3) and the power device module (4) via pins, and the communication chip (5) is connected to the main chip module (2) via pins.
4. A PCBA motherboard for a wireless charger as described in claim 3, characterized in that: The output terminal of the input module (7) is connected to the main chip module (2), and the output terminal of the main chip module (2) is connected to the output module (8).
5. A PCBA motherboard for a wireless charger as described in claim 4, characterized in that: The thermal pads (10) have gaps between them, and the thermal pads (10) and the thermal layer (11) are made of epoxy resin.
6. A PCBA motherboard for a wireless charger as described in claim 5, characterized in that: The height of the thermal pad (10) is 1-1.5 cm, and the gap between the main chip module (2), driver module (3), power device module (4), and communication chip (5) is below the through hole (12).
7. A PCBA motherboard for a wireless charger as described in claim 6, characterized in that: The circular holes (13) are linearly arrayed on the rear half of the heat-conducting layer (11).