Conductive powder particles, electronic component, and method for manufacturing electronic component

Abstract

The present disclosure provides electrically conductive powder particles, electronic components, and methods of manufacturing electronic components. The electronic component includes a main body including a plurality of dielectric layers and a plurality of internal electrodes stacked with respective dielectric layers interposed between the internal electrodes, and an external electrode disposed on the main body and connected to respective internal electrodes. The internal electrode includes a particle including Ni and Sn, and a graphene layer disposed at a boundary of the particle. A ratio of a Sn content to a total content of Ni and Sn is Sn / (Ni+Sn), and Sn / (Ni+Sn) of a first region inside the particle at a first distance from the boundary between the particle and the graphene layer is A1, Sn / (Ni+Sn) of a second region inside the particle at a second distance from the boundary between the particle and the graphene layer is A2, the second distance is smaller than the first distance, and A1 is smaller than A2.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0152613, filed on November 16, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to conductive powder particles, electronic components, and methods for manufacturing electronic components. Background Technology

[0003] Multilayer capacitors, such as multilayer ceramic capacitors (MLCCs), consist of multiple dielectric layers arranged alternately and multiple internal electrodes, with the dielectric layers situated between the internal electrodes. Sn can be used as an additive to improve the characteristics of these internal electrodes. Adding Sn to the internal electrodes can improve reliability (e.g., high-temperature load life). However, when Sn diffuses from the internal electrodes into the dielectric layers, a decrease in capacitance may occur. Summary of the Invention

[0004] An exemplary embodiment provides an electronic component with improved reliability.

[0005] An exemplary embodiment provides conductive powder particles for manufacturing internal electrodes of electronic components.

[0006] An exemplary embodiment provides a method for manufacturing electronic components with improved reliability using conductive powder particles.

[0007] The technical problems addressed in this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the following description other technical problems not mentioned herein.

[0008] According to one aspect of this disclosure, an electronic component includes: a body comprising a plurality of stacked dielectric layers and a plurality of internal electrodes, with corresponding dielectric layers intermediate between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the internal electrodes. The internal electrodes comprise particles containing Ni and Sn and a graphene layer disposed at the boundary of the particles. The ratio of Sn content to the total content of Ni and Sn is Sn / (Ni+Sn), and the Sn / (Ni+Sn) of a first region located within the particles at a first distance from the boundary between the particles and the graphene layer is A1, and the Sn / (Ni+Sn) of a second region located within the particles at a second distance from the boundary between the particles and the graphene layer is A2, the second distance being smaller than the first distance, and A1 being smaller than A2.

[0009] According to one aspect of this disclosure, an electronic component includes: a body comprising a plurality of stacked dielectric layers and a plurality of internal electrodes, with a corresponding dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the internal electrodes. The ratio of Sn content to the total Ni and Sn content is Sn / (Ni+Sn), Sn / (Ni+Sn) at a point where the thickness of one of the internal electrodes is 5 / 10 is A3, and Sn / (Ni+Sn) at a point where the thickness of the one of the internal electrodes is 9 / 10 or 1 / 10 is A4, ABS is a function of absolute value, and satisfies 0 ≤ ABS(A4-A3) / A4 ≤ 10%.

[0010] According to one aspect of this disclosure, a conductive powder particle for an internal electrode comprises: metal powder particles; a coating formed around at least a portion of the surface of the metal powder particles and comprising Sn; and graphene formed around at least a portion of the surface of the coating.

[0011] According to one aspect of this disclosure, a method for manufacturing an electronic component includes: forming an unsintered body comprising a plurality of unsintered dielectric layers and a plurality of unsintered internal electrodes, the plurality of unsintered internal electrodes being formed by coating the unsintered dielectric layers with a conductive paste comprising Ni, Sn, and graphene; and sintering the unsintered body to form a sintered body, wherein the conductive paste comprises conductive powder particles comprising Ni-containing metal powder particles, a coating, and graphene, the coating being formed around at least a portion of the surface of the metal powder particles and comprising Sn, and the graphene being formed around at least a portion of the surface of the coating.

[0012] Specific details of other exemplary embodiments are included in the detailed description and the accompanying drawings. Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which:

[0014] Figure 1 This is a perspective view showing an electronic component according to an exemplary embodiment of the present disclosure;

[0015] Figure 2 It is shown Figure 1 An exploded 3D view of the electronic components;

[0016] Figure 3 It is shown Figure 1 An exploded perspective view of the main body of the electronic component shown;

[0017] Figure 4 It is along Figure 1 A cross-sectional view taken from line IV-IV;

[0018] Figure 5 It is shown in detail Figure 4 Enlarged cross-sectional view of region Q1;

[0019] Figure 6 It is shown in detail Figure 5 The cross-sectional view of the particles and graphene layer shown;

[0020] Figure 7 It is shown Figure 4 A cross-sectional view of the features in region Q1;

[0021] Figure 8 It is shown in detail Figure 4 Enlarged cross-sectional view of region Q2;

[0022] Figure 9 This is a cross-sectional view illustrating region Q1 of an electronic component according to another exemplary embodiment of this disclosure;

[0023] Figure 10 It is shown in detail Figure 9 The cross-sectional view of the particles and graphene layer shown;

[0024] Figures 11 to 13 This is a cross-sectional view showing conductive powder particles for an internal electrode according to some exemplary embodiments of the present disclosure;

[0025] Figure 14 It is shown Figure 12 A diagram illustrating a method for manufacturing conductive powder particles for an internal electrode.

[0026] Figure 15 It is shown Figure 14 Conceptual diagram of the operation of S601;

[0027] Figure 16 This is a flowchart illustrating a method for manufacturing an electronic component according to some exemplary embodiments of the present disclosure; and

[0028] Figure 17 It is shown Figure 16 The diagram illustrates the operation of the S620. Detailed Implementation

[0029] The advantages and features of the invention, as well as methods of carrying out the invention, are described more fully below with reference to the accompanying drawings, in which embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough and will fully convey to those skilled in the art the scope of the invention, which is defined by the claims. Throughout this specification, the same reference numerals denote the same elements.

[0030] What will be understood is that when an element or layer is referred to as being "on" or "above" another element or layer, that element or layer may be directly on or above that other element or layer, or there may be intermediate elements or intermediate layers. In contrast, when an element or layer is referred to as being "directly on" or "directly above," there are no intermediate elements or intermediate layers.

[0031] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein to describe the relationship of an element or feature as shown in the figures to other elements or features. It will be understood that, in addition to the orientation depicted in the figures, the spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would then be positioned “above” other elements or features. Thus, the example term “below” can encompass both above and below orientations. The device may be otherwise positioned, and the spatial relative descriptive terms used herein will be interpreted accordingly.

[0032] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, components, and / or parts, the elements, components, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, or part from another element, component, or part. Therefore, the first element, first component, or first part discussed below may be referred to as the second element, second component, or second part.

[0033] In the following description, various exemplary embodiments of this disclosure will be described with reference to the accompanying drawings.

[0034] Figure 1 This is a perspective view showing an electronic component according to an exemplary embodiment of the present disclosure. Figure 2 It is shown Figure 1 An exploded 3D view of the electronic components. Figure 3 It is shown Figure 1 An exploded perspective view of the main body of the electronic component shown. Figure 4 It is along Figure 1 The cross-sectional view taken from line IV-IV.

[0035] First, refer to Figure 1 , Figure 2 and Figure 4 The electronic component 100 according to an exemplary embodiment of the present disclosure includes a body (or ceramic body) 110, a first external electrode 161, and a second external electrode 162.

[0036] The body 110 may have, for example, a hexahedral shape. Specifically, the body 110 may include six surfaces M1, M2, F1, F2, C1, and C2, such as... Figure 2 As shown. The first surface M1 and the second surface M2 face each other in the third direction T (or in the thickness direction of the body 110). When the electronic component 100 is mounted on a substrate (or board), the first surface M1 or the second surface M2 can be a surface mounted on the substrate (i.e., a mounting surface). The third surface F1 and the fourth surface F2 face each other in the second direction W (or in the width direction of the body 110). The third surface F1 and the fourth surface F2 are connected to the first surface M1 and the second surface M2. The fifth surface C1 and the sixth surface C2 face each other in the first direction L (or in the length direction of the body 110). The fifth surface C1 and the sixth surface C2 are connected to the first surface M1, the second surface M2, the third surface F1, and the fourth surface F2.

[0037] like Figure 3 As shown, the main body 110 includes a plurality of dielectric layers 111, a plurality of first internal electrodes 121, and a plurality of second internal electrodes 122. Specifically, the plurality of dielectric layers 111 are stacked, and the first internal electrodes 121 and the second internal electrodes 122 are alternately disposed, with the dielectric layer 111 located between the first internal electrodes 121 and the second internal electrodes 122.

[0038] Multiple dielectric layers 111 are in a sintered state, and adjacent dielectric layers 111 can become a single unit, making the boundaries between them difficult to distinguish.

[0039] Here, dielectric layer 111 may comprise a ceramic material having a high dielectric constant, and may comprise, for example, barium titanate (BaTiO3)-based powder particles or strontium titanate (SrTiO3)-based powder particles, but is not limited thereto. In other words, any material that can achieve sufficient capacitance can be used. Furthermore, in addition to ceramic powder particles, the materials used for dielectric layer 111 may optionally include ceramic additives, organic solvents, plasticizers, binders (e.g., organic binders), dispersants, etc. Ceramic additives may include transition metal oxides or carbides, rare earth elements, magnesium (Mg) or aluminum (Al), but examples of ceramic additives are not limited thereto.

[0040] Multiple first internal electrodes 121 and multiple second internal electrodes 122 are stacked on a third direction T (or in the thickness direction of the body 110), and the stacked area is related to the formation of the capacitance of the capacitor.

[0041] The first internal electrode 121 and the second internal electrode 122 have nickel (Ni) as the main component and may include the following additives.

[0042] As an additive, at least one material selected from the group consisting of Li, Na, and K can be used to increase the conductivity of the internal electrodes 121 and 122 by reducing the formation of nickel oxide (NiO). Additionally, to improve the reliability of the internal electrodes 121 and 122, at least one material selected from the group consisting of Sn, Cu, Ag, Pt, Rh, Ir, Ru, Os, In, Ga, Zn, Bi, and Pb can be used. Furthermore, at least one material selected from the group consisting of Ba, Mg, Dy, and Ti can be used to homogenize the interfacial composition of the internal electrodes 121 and 122.

[0043] Furthermore, the internal electrodes 121 and 122 may also include graphene. Graphene helps ensure the target capacitance by improving the connectivity of the internal electrodes 121 and 122, and can also improve the conductivity of the internal electrodes 121 and 122.

[0044] like Figure 4 As shown, a plurality of first inner electrodes 121 are exposed on (or in contact with or extending from) a fifth surface C1 and are electrically connected to a first outer electrode 161. A plurality of second inner electrodes 122 are exposed on (or in contact with or extending from) a sixth surface C2 and are electrically connected to a second outer electrode 162. When a voltage is applied to the first outer electrode 161 and the second outer electrode 162, charge accumulates between the first inner electrodes 121 and the second inner electrode 122, which face each other.

[0045] The main body 110 may further include a lower cover layer 113, which is located below the lowermost inner electrode among the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122. Additionally, the main body 110 may also include an upper cover layer 112, which is located above the uppermost inner electrode among the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122. The lower cover layer 113 and the upper cover layer 112 are sintered together with the plurality of dielectric layers 111 and can be integrally formed, making their boundaries difficult to distinguish.

[0046] The lower capping layer 113 and the upper capping layer 112 can be formed by stacking a single dielectric layer or two or more dielectric layers in a third direction T (e.g., in the thickness direction of the body 110). The lower capping layer 113 and the upper capping layer 112 are used to prevent physical / chemical stress from damaging the first inner electrode 121 and the second inner electrode 122. In addition, to eliminate mounting orientation, the thickness TL of the lower capping layer 113 and the thickness TH of the upper capping layer 112 may be equal, but are not limited thereto. The lower capping layer 113 and / or the upper capping layer 112 may have the same material and construction as the dielectric layer 111, but are not limited thereto.

[0047] The shape and size of the body 110, the number of stacked dielectric layers 111, the number of stacked first inner electrodes 121 and second inner electrodes 122, and the thickness TL of the lower cover layer 113 and the thickness TH of the upper cover layer 112 can vary according to the design and are not limited to the shape and size of the body, the number of stacked dielectric layers, the number of stacked first inner electrodes and second inner electrodes, and the thickness of the lower cover layer and the thickness of the upper cover layer shown.

[0048] Return to reference Figure 1 and Figure 2 The first external electrode 161 includes a first connecting portion 161a, a first mounting portion 161b, and a first side portion 161c. The first connecting portion 161a is disposed on the fifth surface C1 of the body 110 and connected to a plurality of first internal electrodes 121 exposed on the fifth surface C1. The first mounting portion 161b extends from the first connecting portion 161a to the first surface M1 and the second surface M2 of the body 110. The first side portion 161c extends from the first connecting portion 161a to the third surface F1 and the fourth surface F2 of the body 110. In other words, the first mounting portion 161b may be parallel to the first internal electrodes 121, and the first side portion 161c may be perpendicular to the first internal electrodes 121.

[0049] The first mounting portion 161b disposed on the first surface M1 of the main body 110 and the first mounting portion 161b disposed on the second surface M2 of the main body 110 can be symmetrical to each other in a third direction T based on the main body 110. For example, the length of the first mounting portion 161b disposed on the first surface M1 of the main body 110 along the first direction L (or the second direction W) is equal to the length of the first mounting portion 161b disposed on the second surface M2 of the main body 110 along the first direction L (or the second direction W).

[0050] Similarly, the first side portion 161c provided on the third surface F1 of the body 110 and the first side portion 161c provided on the fourth surface F2 of the body 110 are symmetrical about each other in the second direction W based on the body 110. That is, the length of the first side portion 161c provided on the third surface F1 of the body 110 along the first direction L (or the third direction T) is equal to the length of the first side portion 161c provided on the fourth surface F2 of the body 110 along the first direction L (or the third direction T).

[0051] Similarly, the second external electrode 162 includes a second connecting portion 162a, a second mounting portion 162b, and a second side portion 162c. The second connecting portion 162a is disposed on the sixth surface C2 of the body 110 and connected to a plurality of second internal electrodes 122 exposed on the sixth surface C2. The second mounting portion 162b extends from the second connecting portion 162a to the first surface M1 and the second surface M2 of the body 110. The second side portion 162c extends from the second connecting portion 162a to the third surface F1 and the fourth surface F2 of the body 110. In other words, the second mounting portion 162b may be parallel to the second internal electrodes 122, and the second side portion 162c may be perpendicular to the second internal electrodes 122.

[0052] The second mounting portion 162b disposed on the first surface M1 and the second mounting portion 162b disposed on the second surface M2 of the main body 110 are symmetrical to each other in the third direction T based on the main body 110. The second side portion 162c disposed on the third surface F1 and the second side portion 162c disposed on the fourth surface F2 of the main body 110 are symmetrical to each other in the second direction W based on the main body 110.

[0053] As described above, the first mounting portion 161b / second mounting portion 162b formed on the first surface M1 of the body 110 and the first mounting portion 161b / second mounting portion 162b formed on the second surface M2 of the body 110 are symmetrical to each other, and the thickness TL of the lower cover layer 113 and the thickness TH of the upper cover layer 112 can be formed to be equal. Therefore, when the electronic component 100 is mounted on the substrate, mounting orientation can be eliminated. That is, the electronic component 100 can be mounted such that the first surface M1 of the body 110 faces the substrate or the second surface M2 of the body 110 faces the substrate.

[0054] Furthermore, the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c of the first external electrode 161 are formed by the same process (or a single process). Therefore, the thicknesses of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c can be substantially equal. Here, the thicknesses of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c refer to average thicknesses. The expression "equal thicknesses" is interpreted not only to mean that the thicknesses are completely identical, but also to mean that there may be slight differences in thickness due to process errors.

[0055] The first connecting portion 161a and the first side portion 161c are integrally connected. That is, the first connecting portion 161a and the first side portion 161c can be directly connected without a separate medium. Similarly, the first connecting portion 161a and the first mounting portion 161b are integrally connected, and the first side portion 161c and the first mounting portion 161b are also integrally connected. That is, at least two of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c can be integrally connected. Optionally, at least two of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c are in direct contact with each other.

[0056] Similarly, the thickness of each of the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c of the second external electrode 162 may be substantially equal. Furthermore, at least two of the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c may be integrally connected. Optionally, at least two of the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c may be in direct contact with each other.

[0057] Furthermore, one side of the main body 110 is disposed in the first internal space IS1, and the other side of the main body 110 is disposed in the second internal space IS2.

[0058] The first external electrode 161 defines a first internal space IS1. The first internal space IS1 is defined by a first connecting portion 161a and a first mounting portion 161b and a first side portion 161c that bend from the first connecting portion 161a. The space surrounded by the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c is the first internal space IS1. Specifically, the first connecting portion 161a has a rectangular shape, and the first mounting portion 161b and the first side portion 161c can be bent perpendicularly from each side of the rectangular first connecting portion 161a and extend toward the second external electrode 162.

[0059] The second external electrode 162 defines a second internal space IS2. The second internal space IS2 is defined by a second connecting portion 162a, a second mounting portion 162b that bends from the second connecting portion 162a, and a second side portion 162c. The space surrounded by the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c is the second internal space IS2. Specifically, the second connecting portion 162a has a rectangular shape, and the second mounting portion 162b and the second side portion 162c can be bent vertically from each side of the rectangular second connecting portion 162a and extend toward the first external electrode 161.

[0060] In addition, the first external electrode 161 and the second external electrode 162 can be symmetrical based on the central portion of the main body 110.

[0061] For example, the first mounting portion 161b of the first external electrode 161 disposed on the first surface M1 of the main body 110 and the second mounting portion 162b of the second external electrode 162 disposed on the first surface M1 of the main body 110 are symmetrical about the main body 110 in the first direction L. Furthermore, the first side portion 161c of the first external electrode 161 disposed on the third surface F1 of the main body 110 and the second side portion 162c of the second external electrode 162 disposed on the third surface F1 of the main body 110 are symmetrical about the main body 110 in the first direction L. Additionally, the first connecting portion 161a of the first external electrode 161 disposed on the fifth surface C1 of the main body 110 and the second connecting portion 162a of the second external electrode 162 disposed on the sixth surface C2 of the main body 110 are symmetrical about the main body 110 in the first direction L.

[0062] Here, refer to Figure 4 The first external electrode 161 may include a first electrode layer 131 and a first plating layer 151 stacked in sequence.

[0063] The first electrode layer 131 may include a conductive metal, such as at least one of copper (Cu), nickel (Ni), gold (Au), silver (Ag), platinum (Pt), and palladium (Pd), or an alloy thereof, but is not limited thereto. Additionally, the first electrode layer 131 may include glass as an auxiliary material. The conductive metal ensures sheet sealing and electrical connection with the inner electrode, and the glass fills the empty spaces as the metal sinters and shrinks, while simultaneously providing bonding force between the first outer electrode 161 and the body 110.

[0064] The first plating layer 151 may be a stacked nickel (Ni) / tin (Sn) plating layer or a stacked nickel (Ni) / gold (Au) plating layer, but is not limited thereto. When the electronic component 100 is mounted on the substrate, the first plating layer 151 improves the contact with the solder.

[0065] The second external electrode 162 may also include a second electrode layer 132 and a second plating layer 152 stacked sequentially. The second electrode layer 132 may be formed using substantially the same material and structure as the first electrode layer 131, and the second plating layer 152 may be formed using substantially the same material and structure as the first plating layer 151.

[0066] In the following text, reference will be made to Figures 5 to 8 The structure / shape of the second inner electrode 122 is described in detail. Although not described separately, the structure / shape of the first inner electrode 121 is substantially the same as that of the second inner electrode 122.

[0067] Figure 5 It is shown in detail Figure 4 Enlarged cross-sectional view of region Q1. Figure 6 It is shown in detail Figure 5 The diagram shows a cross-sectional view of the particles and graphene layer. Figure 7 It is shown Figure 4 A cross-sectional view of the features in region Q1.

[0068] First, refer to Figure 5 and Figure 6 The second inner electrode 122 is disposed between the corresponding dielectric layers 111a and 111b. The second inner electrode 122 includes a plurality of particles 210 and a graphene layer 220 formed at the boundaries E1 and E2 of the particles 210.

[0069] Specifically, particle 210 contains Ni and Sn. Ni is the main component of the second internal electrode 122, and Sn can improve the reliability of the second internal electrode 122 (i.e., high-temperature load life).

[0070] Particle 210 includes a core region 211 and an edge region 212. The core region 211 may mainly contain Ni, and the edge region 212 may mainly contain Ni-Sn alloy.

[0071] The Sn content (i.e., number of atoms) in the core region 211 and the Sn content (i.e., number of atoms) in the edge region 212 can be different from each other. That is, the Sn content in the core region 211 can be less than the Sn content in the edge region 212. Sn has the property of diffusing at high temperatures, but Sn is blocked by the graphene layer 220 formed at the boundaries E1 and E2 of the particle 210, so that Sn cannot diffuse out of the particle 210 and can be bound in the particle 210. Therefore, the Sn content in the edge region 212 near the boundaries E1 and E2 between the particle 210 and the graphene layer 220 increases.

[0072] Specifically, assume the ratio of Sn content to the total content of Ni and Sn (i.e., the ratio of the number of atoms) is Sn / (Ni+Sn). The Sn / (Ni+Sn) ratio in a first region R1 located at a first distance L1 from the boundary (e.g., E1) between particle 210 and graphene layer 220 within particle 210 is A1, and the Sn / (Ni+Sn) ratio in a second region R2 located at a second distance L2 from the boundary (e.g., E1) within particle 210 is A2. Here, A1 is less than A2 when the second distance L2 is less than the first distance L1. The "distance" in the first distance L1 and the second distance L2 refers to the shortest distance from the central portion of each region in R1 and R2 to the nearest boundary.

[0073] As shown in the figure, the first region R1 may not include the edge region 212, and the second region R2 may be selected to include at least a portion of the edge region 212.

[0074] Optionally, the first region R1 may be selected to include or be close to the centroid of particle 210, and the second region R2 may be selected to be spaced apart from the first region R1 and close to the boundary between particle 210 and graphene layer 220 (e.g., E1).

[0075] Alternatively, assuming line segment L0 connects the first boundary E1 and the second boundary E2 that face each other, a first region R1 and a second region R2 are selected on line segment L0, and the first region R1 and the second region R2 do not overlap with each other. "Selecting the first region R1 and the second region R2 on line segment L0" means selecting the first region R1 and the second region R2 to each include a portion of line segment L0.

[0076] Furthermore, the second region R2 must be chosen to be closer to the first boundary E1 than the first region R1. That is, when the distance from the first boundary E1 to the first region R1 is the first distance L1, the distance from the first boundary E1 to the second region R2 is the second distance L2, and the length of line segment L0 is La, then L2 is satisfied. <L1≤La / 2。

[0077] For example, a first region R1 and a second region R2 are selected from each of at least five particles 210. Quantitative analysis of Ni and Sn can be performed on the selected at least five first regions R1 to obtain at least five Sn / (Ni+Sn) values, and A1 can be obtained by calculating the average of the at least five Sn / (Ni+Sn) values. Similarly, quantitative analysis of Ni and Sn can be performed on the selected at least five second regions R2 to obtain at least five Sn / (Ni+Sn) values, and A2 can be obtained by calculating the average of the at least five Sn / (Ni+Sn) values.

[0078] In the accompanying drawings, for ease of description, the core region 211 and the edge region 212 of particle 210 are shown as clearly distinguishable from each other, but the boundary between the core region 211 and the edge region 212 may not be easily distinguishable. For example, near the boundary between the core region 211 and the edge region 212, the Sn content may gradually increase in the direction toward the graphene layer 220.

[0079] In addition, such as Figure 5 As shown, the graphene layer 220b can be disposed between adjacent particles 210, and adjacent particles 210 can be separated / distinguished from each other by the graphene layer 220b.

[0080] The graphene layer 220a located on the outer surface of the second inner electrode 122 facing the dielectric layers 111a and 111b improves the connectivity of the second inner electrode 122, thus helping to ensure the target capacitance. The graphene layer 220a also helps improve the flatness of the second inner electrode 122. The graphene layer 220a confines Sn within the particles 210, preventing Sn from diffusing into the dielectric layers 111a and 111b. Therefore, the graphene layer 220a prevents capacitance reduction caused by Sn diffusion into the dielectric layers 111a and 111b.

[0081] Reference Figure 7 Sn / (Ni+Sn) at a point 5 / 10 of the thickness of the second inner electrode 122 (e.g., a point in a region where height H1 is 5 / 10 of the thickness of the second inner electrode 122, based on the boundary surface between the second inner electrode 122 and the dielectric layer 111b) is A3, and Sn / (Ni+Sn) at a point 9 / 10 of the thickness of the second inner electrode 122 (e.g., a point in a region where height H2 is 9 / 10 of the thickness of the second inner electrode 122, based on the boundary surface between the second inner electrode 122 and the dielectric layer 111b) or at a point 1 / 10 of the thickness of the second inner electrode 122 (e.g., a point in a region where height H3 is 1 / 10 of the thickness of the second inner electrode 122, based on the boundary surface between the second inner electrode 122 and the dielectric layer 111b) is A4. Furthermore, the function ABS(x) is a function that calculates the absolute value of x. Here, 0 ≤ ABS(A4-A3) / A4 ≤ 10% is satisfied.

[0082] For example, five spaced-apart portions are selected from plane D1 at a height H1 that is 5 / 10 of the thickness of the second inner electrode 122. Quantitative analysis of Ni and Sn in the selected five portions is performed to calculate five Sn / (Ni+Sn) values, and A3 is calculated by obtaining the average of the five Sn / (Ni+Sn) values. Similarly, five spaced-apart portions are selected from plane D2 at a height H2 that is 9 / 10 of the thickness of the second inner electrode 122 or from plane D3 at a height H3 that is 1 / 10 of the thickness of the second inner electrode 122. Quantitative analysis of Ni and Sn in the selected five portions is performed to calculate five Sn / (Ni+Sn) values, and A4 is calculated by obtaining the average of the five Sn / (Ni+Sn) values. The five portions selected from plane D1 and the five portions selected from plane D2 or plane D3 may be stacked on top of each other in a third direction T (or in the thickness direction of the body 110).

[0083] As described above, Sn improves the reliability of the second inner electrode 122 (i.e., high-temperature load life), but Sn diffusion into dielectric layers 111a and 111b reduces the dielectric constant of dielectric layers 111a and 111b, thus reducing capacitance. In some exemplary embodiments of this disclosure, a graphene layer 220 can be used to control Sn diffusion into dielectric layers 111a and 111b. In particular, when 0 ≤ ABS(A4-A3) / A4 ≤ 10%, the movement (or diffusion) of Sn, used as an additive in the second inner electrode 122, can be suppressed within a sufficiently controllable range, thus preventing a significant decrease in the dielectric constant of dielectric layer 111. ABS(A4-A3) / A4 = 0 indicates that A3 and A4 are the same. In other words, the Sn / (Ni+Sn) at height H1, which is 5 / 10 of the thickness of the second inner electrode 122, is the same as the Sn / (Ni+Sn) at height H2 or height H3, which is 1 / 10 or 9 / 10 of the thickness of the second inner electrode 122. This means that the movement (or diffusion) of Sn used in the second inner electrode 122 is essentially suppressed.

[0084] Return to reference Figure 6 Graphene sheet 229 may be located inside particle 210. (See later...) Figure 17 Described, Figure 6 The particles 210 shown can be formed by sintering and agglomerating multiple conductive powder particles 11 for the internal electrode. The conductive powder particles 11 may include Ni-containing metal powder particles, a Sn-containing coating formed on the surface of the metal powder particles, and graphene formed on the surface of the coating. During the agglomeration process, the graphene located on the surface of the conductive powder particles 11 may be retained in the particles 210.

[0085] Furthermore, the Ni-Sn alloy 228, which is in direct contact with the graphene sheet 229, can also be located inside the particle 210. Since a portion of the Sn-containing coating of the conductive powder particle 11 reacts with Ni to form a Ni-Sn alloy, the Ni-Sn alloy 228 can be retained and in direct contact with the graphene sheet 229.

[0086] Figure 8 It is shown in detail Figure 4 Enlarged cross-sectional view of region Q2.

[0087] Reference Figure 8 The first inner electrode 121 contacts the first outer electrode 161 (i.e., the first electrode layer 131) through the fifth surface C1 of the body 110. Specifically, the graphene layer 220 is formed on the upper surface (e.g., the surface in contact with the dielectric layer 111c), the lower surface (e.g., the surface in contact with the dielectric layer 111d), and the side surface of the first inner electrode 121.

[0088] This construction reduces radial cracking at the contact area between the first inner electrode 121 and the first outer electrode 161. This is because the Ni in the first inner electrode 121 is not exposed to the outside, thus reducing NiO formation. Since NiO has a larger volume than Ni, it is more prone to radial cracking. Therefore, radial cracking can be reduced by preventing NiO formation.

[0089] In addition, it prevents the Cu constituting the first external electrode 161 from diffusing into the first internal electrode 121.

[0090] Additionally, the graphene layer 220 of the first inner electrode 121 located on the fifth surface C1 of the body 110 protrudes by a length K from the dielectric layer 111c or 111d in order to contact the first outer electrode 161.

[0091] The manufacturing process of the electronic component includes a polishing process. The polishing process rounds the sharp outer surface of the body 110, allowing the body 110 to be properly connected to the external electrodes 161 and 162. Because the graphene layer 220 is stronger than the dielectric layers 111c or 111d, less of the graphene layer 220 can be polished during the polishing process compared to the dielectric layers 111c or 111d. Therefore, the graphene layer 220 can protrude from the dielectric layers 111c or 111d.

[0092] Because the graphene layer 220 protrudes, the contact area between the first inner electrode 121 and the first outer electrode 161 is increased. Therefore, the contact resistance between the first inner electrode 121 and the first outer electrode 161 can be reduced.

[0093] Figure 9 This is a cross-sectional view illustrating region Q1 of an electronic component according to another exemplary embodiment of this disclosure. Figure 10 It is shown in detail Figure 9 The image shows a cross-sectional view of the particles and graphene layer. For clarity, the main descriptions are based on the references. Figures 1 to 8 The differences in the described electronic components.

[0094] Reference Figure 9 and Figure 10 The second inner electrode 122 is disposed between the corresponding dielectric layers 111a and 111b. The second inner electrode 122 includes a plurality of particles 210 and a graphene layer 220 formed at the boundaries E1 and E2 of the particles 210.

[0095] Specifically, in addition to Ni and Sn, particle 210 also includes at least one material X selected from the group consisting of Li, Na, and K. Material X prevents the formation of NiO on the second inner electrode 122 and can form oxides containing Ni and X. Since NiO has insulating properties, it may increase the resistance of the second inner electrode 122 and cause a decrease in capacitance. In contrast, oxides containing Ni and X (e.g., Li) x Ni 1-x O) is conductive, so the oxide can prevent the capacitance of the second internal electrode 122 from decreasing.

[0096] Since Li, Na, and K share common properties that will be described below, Li will be used to describe them.

[0097] Particle 210 includes a core region 211 and an edge region 212. The core region 211 may mainly contain Ni, and the edge region 212 may mainly contain Li. x Ni 1-x O, Ni-Sn alloys, etc.

[0098] The Sn content (i.e., number of atoms) in the core region 211 and the Sn content (i.e., number of atoms) in the edge region 212 can be different from each other. Sn has the property of diffusing at high temperatures, but Sn is blocked by the graphene layer 220 formed at the boundaries E1 and E2 of the particle 210, so Sn cannot diffuse out of the particle 210 and can be bound in the particle 210.

[0099] Assume the ratio of Sn content to the total content of Ni, Sn, and X (i.e., the ratio of atomic numbers) is Sn / (Ni+Sn+X). The Sn / (Ni+Sn+X) in the third region R3 located at a third distance L3 from the boundary between particle 210 and graphene layer 220 (e.g., E1) is B1, and the Sn / (Ni+Sn+X) in the fourth region R4 located at a fourth distance L4 from the boundary between particle 210 and graphene layer 220 (e.g., E1) is B2. Here, when the fourth distance L4 is less than the third distance L3, B1 is less than B2.

[0100] Suppose line segment L0 connects the first boundary E1 and the second boundary E2 that are facing each other. On line segment L0, select a third region R3 and a fourth region R4, such that the third region R3 and the fourth region R4 do not overlap. When the distance from the first boundary E1 to the third region R3 is the third distance L3, the distance from the first boundary E1 to the fourth region R4 is the fourth distance L4, and the length of line segment L0 is La, then L4 is satisfied. <L3≤La / 2。

[0101] For example, a third region R3 and a fourth region R4 are selected from each of at least five particles 210. Quantitative analysis of Ni, Sn, and X can be performed on the selected at least five third regions R3 to obtain at least five Sn / (Ni+Sn+X) values, and B1 can be obtained by calculating the average of the at least five Sn / (Ni+Sn+X) values. Furthermore, quantitative analysis of Ni and Sn is performed on the selected at least five fourth regions R4 to obtain at least five Sn / (Ni+Sn+X) values, and B2 can be obtained by calculating the average of the at least five Sn / (Ni+Sn+X) values.

[0102] Additionally, similar to the reference above Figure 7 In the described scenario, when Sn / (Ni+Sn+X) is B3 at a point 5 / 10 of the thickness of the second inner electrode 122 (e.g., a point in a region with a height of 5 / 10 of the thickness of the second inner electrode 122, based on the boundary surface between the second inner electrode 122 and the dielectric layer 111b), and Sn / (Ni+Sn+X) is B4 at a point 9 / 10 or 1 / 10 of the thickness of the second inner electrode 122 (e.g., a point in a region with a height of 9 / 10 or 1 / 10 of the thickness of the second inner electrode 122, based on the boundary surface between the second inner electrode 122 and the dielectric layer 111b), and ABS is a function of calculating absolute values, 0 ≤ ABS(B4-B3) / B4 ≤ 10%.

[0103] In addition, Figure 10 In this process, graphene sheet 229 may be located inside particle 210. As will be described later, Figure 10 The particles 210 shown can be accompanied by multiple conductive powder particles for the internal electrode ( Figure 12 12 or Figure 1313) Formed by agglomeration through sintering. The conductive powder particles 12 or 13 may include: Ni-containing metal powder particles; a first coating formed on the surface of the metal powder particles and comprising at least one material X selected from the group consisting of Li, Na, and K; a second coating formed on the surface of the metal powder particles or the first coating and comprising Sn; and graphene formed on the surface of the first coating or the second coating. During the agglomeration process, the graphene located on the surface of the conductive powder particles 12 or 13 may be retained in the particles 210.

[0104] Additionally, the materials in direct contact with the graphene sheet 229 include oxides containing Ni and X (e.g., Li). x Ni 1-x Layer 227 of the O and Ni-Sn alloy may be located inside the particles 210. During the agglomeration process, a portion of the Sn-containing coating of the conductive powder particles 12 or 13 reacts with Ni to form a Ni-Sn alloy, and Li reacts with Ni and is oxidized to form Li. x Ni 1-x O allows layer 227 to be retained and in direct contact with graphene sheet 229.

[0105] In the following text, reference will be made to Figures 11 to 13 Describes the conductive powder particles used to form the internal electrode. Figures 11 to 13 This is a cross-sectional view showing conductive powder particles for an internal electrode according to some exemplary embodiments of the present disclosure.

[0106] Reference Figure 11 The conductive powder particles 11 for the internal electrode according to exemplary embodiments of the present disclosure may include: Ni-containing metal powder particles 20; a coating 30 formed on the surface of the metal powder particles 20 and containing Sn; and graphene 40 formed on the surface of the coating 30.

[0107] Reference Figure 12 According to another exemplary embodiment of the present disclosure, the conductive powder particles 12 for the internal electrode may include: Ni-containing metal powder particles 20; a second coating 25 including at least one material X selected from the group consisting of Li, Na and K; a first coating 30 formed on the surface of the second coating 25 and containing Sn; and graphene 40 formed on the surface of the first coating 30.

[0108] Li, Na, and K improve the conductivity of the internal electrodes 121 and 122 by reducing the formation of nickel oxide (NiO). The second coating 25 may include, for example, at least one selected from the group consisting of lithium carbonate (Li₂CO₃), sodium carbonate (Na₂CO₃), and potassium carbonate (K₂CO₃). For example, based on 100 mol% of metal powder particles (Ni), lithium carbonate (Li₂CO₃) may be from 0.1 mol% to 20 mol%. Based on 100 wt% of metal powder particles (Ni), graphene 40 may be from 0.1 wt% to 1 wt%.

[0109] Volatile Li may diffuse into dielectric layer 111. Li acts as a low-temperature sintering agent in the dielectric layer, which leads to compositional inhomogeneity (particle growth). Conductive powder particles 12, according to another exemplary embodiment of this disclosure, coat Li in close proximity (or contact) with metal powder particles (Ni), allowing Li and Ni to react rapidly with each other, thereby reducing Li diffusion and generating Li2. x Ni 1-x O. Li, which is conductive x Ni 1-x O can prevent the capacitance of internal electrodes 121 and 122 from decreasing.

[0110] Reference Figure 13 According to another exemplary embodiment of the present disclosure, the conductive powder particles 13 for the internal electrode may include: Ni-containing metal powder particles 20; a first coating 30 formed on the surface of the metal powder particles 20 and containing Sn; a second coating 25 formed on the surface of the first coating 30 and containing at least one material X selected from the group consisting of Li, Na and K; and graphene 40 formed on the surface of the second coating 25.

[0111] Additionally, although not shown separately, conductive powder particles comprising metal powder particles, a coating, and graphene may also be used, wherein the coating is formed on the surface of the metal powder particles and comprises material X, and graphene is formed on the surface of the coating.

[0112] Figure 14 It shows the manufacturing process. Figure 12 A diagram illustrating a method for using conductive powder particles for an internal electrode. Figure 15 It is shown Figure 14 Conceptual diagram of the operation S601.

[0113] First, refer to Figure 14 A second coating 25 is formed on the surface of Ni-containing metal powder particles 20 (operation S601), the second coating 25 comprising at least one material X selected from the group consisting of Li, Na and K.

[0114] For example, methods for coating Li2CO3 on the surface of metal powder particles 20 include precipitation, atomic layer deposition (ALD), barrel sputtering, liquid coating, etc., but are not limited to these.

[0115] Here, we will refer to Figure 15 This describes a method for coating Li₂CO₃ (or Na₂CO₃) using a precipitation method. A beaker 510 is filled with deionized water (DIW) 520, and Ni powder particles and Li₂CO₃ (or Na₂CO₃) are placed at the bottom of beaker 510 (see 540). For example, DIW can be 400 g, Ni powder particles can be 24 g, and Li₂CO₃ can be 1.6 g. A stirrer 530 is then rotated at a predetermined speed to prevent the Ni powder particles from precipitating. Additionally, the stirrer 530 is rotated and heated (e.g., 70°C to 90°C) to gradually evaporate the DIW 520. After the DIW 520 is completely removed, the powder particles remaining at the bottom of beaker 510 are recovered.

[0116] Return to reference Figure 14 A first coating 30 containing Sn is formed on the surface of the second coating 25 (operation S602). The method for forming the first coating 30 may be, for example, atomic layer deposition (ALD) using a Sn source or a mixing method using Sn powder particles, but is not limited thereto.

[0117] Subsequently, graphene 40 is formed on the surface of the first coating 30 (operation S603). For example, graphene 40 and the first coating 30 can be π-bonded by chemical methods, or graphene 40 and the first coating 30 can be bonded to each other by physical methods based on van der Waals forces.

[0118] Figure 16 This is a flowchart illustrating a method for manufacturing electronic components according to some exemplary embodiments of the present disclosure. Figure 17 It is shown Figure 16 The diagram illustrates the operation of the S620.

[0119] Reference Figure 16 This forms the unsintered main body (operation S610).

[0120] Specifically, multiple ceramic green sheets are prepared, and conductive paste is applied to each ceramic green sheet using a printing method such as screen printing or gravure printing.

[0121] Regarding conductive paste, the above reference can be used. Figures 11 to 13 The conductive powder particles 11, 12, and 13 used for the internal electrode are described. For example, Figure 11 The conductive powder particles 11 are used to form Figure 5 The internal electrode. In order to form Figure 9 The internal electrode can be used Figure 12 Conductive powder particles 12 or Figure 13 13. Conductive powder particles.

[0122] Optionally, different types of conductive powder particles can be mixed and used. For example, they can be used together. Figure 11 Conductive powder particles 11 coated with Sn and conductive powder particles coated with material X (instead of Sn) (i.e., conductive powder particles including a coating and graphene, wherein the coating is formed on the surface of the metal powder particles and includes material X, and graphene is formed on the surface of the coating).

[0123] Next, multiple ceramic green sheets are stacked and pressed in the stacking direction to press the stacked ceramic green sheets and the conductive paste for the internal electrode together.

[0124] Subsequently, the compacted stack is cut for each region corresponding to the body of a multilayer capacitor, thereby completing the unsintered body. The completed unsintered body includes multiple unsintered dielectric layers and multiple unsintered internal electrodes on the unsintered dielectric layers, the multiple unsintered internal electrodes being formed using a conductive paste comprising Ni, Sn and graphene.

[0125] Subsequently, the unsintered body is heat-treated to burn off the binder and then sintered in a reducing atmosphere to obtain the sintered body 110 (operation S620).

[0126] For example, refer to Figure 17 During sintering, multiple conductive powder particles 11 agglomerate together. Specifically, graphene is formed within the conductive powder particles 11 through π-bonding or van der Waals force bonding (e.g., Figure 14 Graphene 40 may be formed not completely around the surface of the conductive powder particles 11, and may not be formed on a portion of the surface of the conductive powder particles 11. During sintering, Ni and Sn can move through some spaces where graphene 40 is not formed. Through the moving Ni and Sn, adjacent conductive powder particles 11 begin to agglomerate with each other. As a result, multiple conductive powder particles 11 (e.g., ...) Figure 17 Five conductive powder particles 11 can form a particle 210. In addition, a graphene layer 220 is formed on the surface of particle 210.

[0127] As described above, particle 210 may include a core region 211 primarily comprising Ni and an edge region 212 formed on the core region 211 and comprising a Ni-Sn alloy. Additionally, graphene sheets 229 may be located inside particle 210. During the agglomeration process, graphene (…) located on the surface of the conductive powder particle 11… Figure 1440) can be retained in particle 210. Ni-Sn alloy 228, which is in direct contact with graphene sheet 229, can be positioned inside particle 210.

[0128] Return to reference Figure 16 External electrodes are formed on the two end surfaces of the body 110 (operation S630). The external electrodes may include an electrode layer formed using copper paste containing glass and a Ni / Sn plating layer on the electrode layer.

[0129] As described above, the internal electrode of the electronic component according to some exemplary embodiments of this disclosure includes particles comprising Ni and Sn and a graphene layer formed at the boundaries between the particles. The graphene layer helps ensure the target capacitance by improving the connectivity of the internal electrode. Furthermore, the graphene layer prevents Sn from diffusing into the dielectric layer by confining Sn within the particles. Therefore, capacitance reduction due to Sn diffusion into the dielectric layer can be prevented.

[0130] Although exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and changes may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. An electronic component, comprising: A main body, comprising a plurality of stacked dielectric layers and a plurality of internal electrodes, and corresponding dielectric layers are interposed between the plurality of internal electrodes; And External electrodes, disposed on the main body and connected to the internal electrodes, wherein the internal electrodes comprise particles containing Ni and Sn and graphene layers disposed at the boundaries of the particles, The ratio of the Sn content to the total content of Ni and Sn is Sn / (Ni + Sn), and The Sn / (Ni + Sn) of the first region located at a first distance from the boundary between the particle and the graphene layer inside the particle is A1, and the Sn / (Ni + Sn) of the second region located at a second distance from the boundary between the particle and the graphene layer inside the particle is A2, the second distance is less than the first distance, and A1 is less than A2.

2. The electronic component according to claim 1, wherein The boundary between the particle and the graphene layer comprises a first boundary and a second boundary facing each other, and The first region and the second region are selected from the line segment connecting the first boundary and the second boundary, and the first region and the second region do not overlap with each other.

3. The electronic component according to claim 2, wherein L2 < L1 ≤ La / 2, where L1 is the first distance from the first boundary to the first region, L2 is the second distance from the first boundary to the second region, and La is the length of the line segment.

4. The electronic component according to claim 1, wherein The particle further comprises at least one material X selected from the group consisting of Li, Na, and K, and The ratio of the Si content to the total content of Ni, Sn, and X is Sn / (Ni + Sn + X), and The Sn / (Ni + Sn + X) of the third region located at a third distance from the boundary between the particle and the graphene layer inside the particle is B1, and the Sn / (Ni + Sn + X) of the fourth region located at a fourth distance from the boundary between the particle and the graphene layer inside the particle is B2, the fourth distance is less than the third distance, and B1 is less than B2.

5. The electronic component according to claim 1, wherein, The particle further comprises graphene sheets, and the graphene sheets are located in the particle and spaced apart from the boundary of the particle.

6. The electronic component according to claim 5, wherein, The particle further comprises a Ni - Sn alloy in direct contact with the graphene sheets.

7. The electronic component according to claim 5, wherein, The particle further comprises at least one material X selected from the group consisting of Li, Na, and K, and the particle further comprises an oxide containing Ni and X in direct contact with the graphene sheets.

8. The electronic component according to any one of claims 1-7, wherein, At least one of the internal electrodes contacts one of the external electrodes through a surface of the main body, and the graphene layer of the at least one of the internal electrodes protrudes from the surface of the main body relative to the plurality of dielectric layers and contacts one of the external electrodes.

9. The electronic component according to any one of claims 1-7, wherein, 0 ≤ ABS(A4-A3) / A4 ≤ 10%, where A3 is Sn / (Ni+Sn) at a point where the thickness of an inner electrode is 5 / 10, A4 is Sn / (Ni+Sn) at a point where the thickness of an inner electrode is 9 / 10 or 1 / 10, and ABS is a function for calculating the absolute value.

10. An electronic component, comprising: The main body includes multiple stacked dielectric layers and multiple internal electrodes, with the corresponding dielectric layers located between the multiple internal electrodes; as well as An external electrode is disposed on the main body and connected to the internal electrode. Wherein, the ratio of Sn content to the total content of Ni and Sn is Sn / (Ni+Sn), Sn / (Ni+Sn) at a point where the thickness of one of the inner electrodes is 5 / 10 is A3, Sn / (Ni+Sn) at a point where the thickness of one of the inner electrodes is 9 / 10 or 1 / 10 is A4, ABS is a function for calculating absolute value, and satisfies 0≤ABS(A4-A3) / A4≤10%.

11. The electronic component according to claim 10, wherein, One of the internal electrodes comprises particles containing Ni and Sn and a graphene layer disposed at the boundary of the particles.

12. The electronic component according to claim 11, wherein, The particles also include at least one material X selected from the group consisting of Li, Na, and K, and The ratio of Sn content to the total content of Ni, Sn, and X is Sn / (Ni+Sn+X). Sn / (Ni+Sn+X) at a point where the thickness of one of the inner electrodes is 5 / 10 is B3, and Sn / (Ni+Sn+X) at a point where the thickness of one of the inner electrodes is 9 / 10 or 1 / 10 is B4. ABS is a function used to calculate the absolute value and satisfies 0≤ABS(B4-B3) / B4≤10%.

13. A conductive powder particle for an internal electrode, the conductive powder particle comprising: Metal powder particles; A coating, surrounding at least a portion of the surface of the metal powder particles and comprising Sn; and Graphene, surrounding at least a portion of the surface of the coating.

14. The conductive powder particles according to claim 13, wherein, The coating also includes at least one selected from the group consisting of Li, Na and K.

15. The conductive powder particles according to claim 14, wherein, The coating further includes an additional coating that surrounds at least a portion of the surface of the metal powder particles, is located between the metal powder particles and the coating, and includes at least one selected from the group consisting of lithium carbonate, sodium carbonate and potassium carbonate.

16. The conductive powder particles according to claim 14, wherein, The coating further includes an additional coating that surrounds at least a portion of the surface of the coating, is located between the coating and the graphene, and includes at least one selected from the group consisting of lithium carbonate, sodium carbonate, and potassium carbonate.

17. A method for manufacturing an electronic component, the method comprising: An unsintered body is formed, the unsintered body comprising a plurality of unsintered dielectric layers and a plurality of unsintered internal electrodes, the plurality of unsintered internal electrodes being formed by coating the unsintered dielectric layers with a conductive paste comprising Ni, Sn, and graphene; and The unsintered body is sintered to form a sintered body. The conductive paste comprises conductive powder particles, the conductive powder particles comprising Ni-containing metal powder particles, a coating, and graphene, the coating being formed around at least a portion of the surface of the metal powder particles and containing Sn, and the graphene being formed around at least a portion of the surface of the coating.

18. The method according to claim 17, wherein, The coating of the conductive powder particles further includes at least one selected from the group consisting of Li, Na, and K.

19. The method according to claim 18, wherein, The coating further includes an additional coating formed around at least a portion of the surface of the metal powder particles, located between the metal powder particles and the coating, and comprising at least one selected from the group consisting of lithium carbonate, sodium carbonate and potassium carbonate.

20. The method of claim 17, wherein, The conductive paste further includes second conductive powder particles, the second conductive powder particles comprising second metal powder particles containing Ni, a second coating and second graphene, the second coating being formed on the surface of the second metal powder particles and comprising at least one selected from the group consisting of Li, Na and K, and the second graphene being formed on the surface of the second coating.

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