Circuit board connection structure, encoder, and actuator

Abstract

This disclosure aims to reduce the external force applied to chip components placed between substrates by using components used as a circuit. [Solution] The substrate connection structure includes a first substrate having one surface in the thickness direction as the first surface and the other surface as the second surface, and a second substrate having one surface in the thickness direction as the third surface and the other surface as the fourth surface, with a plurality of chip components arranged on the outer edge of the fourth surface, and a first integrated circuit module arranged adjacent to the inner portion of the plurality of chip components on the fourth surface, and the first surface and the fourth surface facing each other and connected to the first substrate, with the package of the first integrated circuit module in contact with the first surface or the fourth surface.

Description

【Technical Field】 【0001】 The present disclosure relates to a substrate connection structure, an encoder, and an actuator. 【Background Art】 【0002】 Patent Document 1 discloses a circuit board that can narrow the interval between substrates, reduce the thickness, shorten the manufacturing process, and reduce costs by connecting a plurality of substrates via circuit elements. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Laid-Open No. 06-164096 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 [[ID=�5]]By the way, in the technology of Patent Document 1, in order to stabilize the positional relationship between substrates, spacers that are not used as circuits are arranged between the substrates. This spacer also serves to reduce the external force applied to other electronic components arranged between the substrates. However, with the miniaturization of the circuit board, there may be no place to arrange components that are not used as circuits between the substrates. 【0005】 Therefore, an object of the present disclosure is to reduce the external force applied to chip components arranged between substrates by using components used as circuits. 【Means for Solving the Problems】 【0006】 The substrate connection structure of the first embodiment includes a first substrate having one surface in the thickness direction as a first surface and the other surface as a second surface, and a second substrate having one surface in the thickness direction as a third surface and the other surface as a fourth surface, wherein a plurality of chip components are arranged on the outer edge of the fourth surface, and a first integrated circuit module is arranged adjacent to the inner portion of the plurality of chip components on the fourth surface, and the first surface and the fourth surface are facing each other and connected to the first substrate, with the package of the first integrated circuit module in contact with the first surface or the fourth surface. 【0007】 According to the first embodiment of the substrate connection structure, the external force applied to chip components placed between substrates can be reduced by using the package of the first integrated circuit module, which is a component used as a circuit. 【0008】 The substrate connection structure of the second embodiment is the substrate connection structure of the first embodiment, wherein the dimension in the thickness direction of the first integrated circuit module arranged on the fourth surface is greater than the dimension in the thickness direction of the chip component. 【0009】 According to the substrate connection structure of the second embodiment, by having only the package of the first integrated circuit module contact the first or fourth surface, external force can be transmitted to the package without applying external force to the chip components. 【0010】 A third embodiment of the substrate connection structure is a substrate connection structure according to the first or second embodiment, wherein the first integrated circuit module is located in the central portion of the fourth surface, and the plurality of chip components are located adjacent to the periphery of the first integrated circuit module. 【0011】 According to the third embodiment of the substrate connection structure, the second substrate can be miniaturized compared to the case where the first integrated circuit module and multiple chip components are arranged on different sides of the second substrate. 【0012】 The fourth embodiment of the substrate connection structure is a substrate connection structure according to any of the first to third embodiments, wherein the plurality of chip components are connected to the first surface and the fourth surface, respectively, and the first substrate and the second substrate are electrically connected via the plurality of chip components. 【0013】 According to the substrate connection structure of the fourth embodiment, multiple chip components can be shared between substrates. 【0014】 A fifth embodiment of the substrate connection structure is a substrate connection structure according to any of the first to fourth embodiments, wherein the first substrate is connected to the second substrate with the first surface and the fourth surface facing each other, and the first substrate has protruding portions that protrude from both sides in the width direction of the second substrate. 【0015】 According to the fifth embodiment of the substrate connection structure, when the first substrate is cut from a single substrate after being connected to the second substrate during the manufacturing process, damage to the second substrate by the cutting tool can be suppressed. 【0016】 The sixth embodiment of the substrate connection structure is the same as the fifth embodiment, wherein the plurality of chip components are arranged on the outer edge of the fourth surface, avoiding two parallel edge portions of the second substrate along a predetermined direction. 【0017】 According to the sixth embodiment of the substrate connection structure, by connecting the first substrate and the second substrate with parallel edge portions adjacent to the protrusions, it is possible to suppress damage to the chip components by the cutting tool when cutting the connection portion between the tips of the protrusions during the manufacturing process. 【0018】 The seventh embodiment of the substrate connection structure is the fifth or sixth embodiment of the substrate connection structure, wherein the connector is arranged on the second surface, avoiding the protruding portion. 【0019】 According to the seventh embodiment of the substrate connection structure, when the first substrate is cut from a single substrate after the connector has been placed, damage to the connector by the cutting tool can be suppressed. 【0020】 The encoder according to the eighth aspect includes the substrate connection structure according to any one of the first to seventh aspects, a second integrated circuit module disposed on the third surface and having a magnetic sensor, and a magnet disposed at a position facing the second integrated circuit module. 【0021】 According to the encoder of the eighth aspect, by including the substrate connection structure, it is possible to miniaturize as compared with the case where the first integrated circuit module and a plurality of chip components are not disposed between substrates. 【0022】 The actuator according to the ninth aspect includes the encoder according to the eighth aspect. 【0023】 According to the actuator of the ninth aspect, by including the substrate connection structure, it is possible to miniaturize as compared with the case where the first integrated circuit module and a plurality of chip components are not disposed between substrates. 【Advantages of the Invention】 【0024】 According to the present disclosure, by using components used as a circuit, it is possible to reduce an external force applied to chip components disposed between substrates. 【Brief Description of the Drawings】 【0025】 [Figure 1] It is a perspective view (A) of an actuator according to the present embodiment, and a cross-sectional view taken along line A-A in (A) (B). [Figure 2] It is an exploded perspective view of an encoder according to the present embodiment. [Figure 3] It is a plan view of a state where a connector substrate and a sensor substrate according to the present embodiment are connected, as viewed from the sensor substrate side. [Figure 4] It is a perspective view of a substrate connection structure according to the present embodiment. 【Modes for Carrying Out the Invention】 【0026】 Hereinafter, embodiments of a substrate connection structure, an encoder, and an actuator of the present disclosure will be described with reference to the drawings. 【0027】 Figure 1(A) is a perspective view of the actuator 10 according to this embodiment, and Figure 1(B) is a cross-sectional view of AA in Figure 1(A). In the following description of Figure 1, "front side" refers to the side of the actuator 10 toward the tip fitting 14, which will be described later, and "rear side" refers to the side toward the encoder 20, which will be described later. 【0028】 As shown in Figure 1(A), the actuator 10 is equipped with a housing 12 that accommodates various components such as the encoder 20. A tip fitting 14 attached to a rod 46 (see Figure 1(B)), which will be described later, is exposed on the front side of the housing 12. 【0029】 As shown in Figure 1(B), the housing 12 contains an encoder 20, a motor 30, a coupling 40, a ball screw shaft 42, a ball screw nut 44, and a rod 46. 【0030】 The encoder 20 is attached to the motor 30. The encoder 20 detects the rotational position of the motor 30 and outputs the detected position as a feedback position signal to a control device (not shown). 【0031】 Motor 30 is controlled by a control device and is the drive source for moving rod 46. Motor 30 is, for example, a brushless DC motor. Motor 30 also has an output shaft 32. The rear end of the output shaft 32 is connected to the encoder 20. The front end of the output shaft 32 is connected to a ball screw shaft 42 via a coupling 40. 【0032】 The ball screw shaft 42 is rotatably supported within the housing 12 by bearings. Together with the ball screw nut 44, the ball screw shaft 42 constitutes a mechanical component for converting the rotational motion of the motor 30 into axial translational motion. 【0033】 The rod 46 is connected to the ball screw shaft 42 via a ball screw nut 44. A tip fitting 14 is attached to the front side of the rod 46. 【0034】 In actuator 10, as the motor 30 rotates, the ball screw shaft 42 rotates, causing the ball screw nut 44 to move axially. As a result, in actuator 10, the rod 46, which is connected to the ball screw shaft 42 via the ball screw nut 44, and the end fitting 14 attached to the rod 46, move axially together with the ball screw nut 44. 【0035】 Figure 2 is an exploded perspective view of the encoder 20 according to this embodiment. In the following figure, arrow W indicates the width direction, arrow D indicates the depth direction, and arrow H indicates the height direction. The depth direction is an example of the "thickness direction" in this disclosure. 【0036】 As shown in Figure 2, the encoder 20 includes a connector board 50, a connector 70, a sensor board 60, a communication IC 80, a chip capacitor 90, a sensor IC 100, a magnet 110, and a magnet hub 120. 【0037】 The connector board 50 has a roughly regular octagonal shape when viewed from the depth direction. Hereinafter, of the two surfaces of the roughly regular octagonal shape of the connector board 50, the surface in the depth direction to which the communication IC 80 and chip capacitor 90 are connected will be referred to as the inner surface 54, and the other surface in the depth direction to which the connector 70 is connected will be referred to as the outer surface 52. The connector board 50 is an example of the "first board" in this disclosure, the inner surface 54 is an example of the "first surface" in this disclosure, and the outer surface 52 is an example of the "second surface" in this disclosure. 【0038】 The connector 70 connects the connector board 50 to external electronic equipment, or the connector board 50 to another board. The connector 70 has terminals 72 soldered to connection positions 58 on its outer surface 52. In this way, the connector 70 is positioned on the connector board 50 along the height direction of the outer surface 52. 【0039】 The sensor substrate 60 has a roughly regular octagonal shape when viewed from the depth direction. Hereinafter, of the two surfaces of the roughly regular octagonal shape of the sensor substrate 60, the surface in the depth direction to which the sensor IC 100 is connected will be referred to as the outer surface 64, and the other surface in the depth direction to which the communication IC 80 and chip capacitor 90 are connected will be referred to as the inner surface 62. The sensor substrate 60 is an example of the "second substrate" of this disclosure, the outer surface 64 is an example of the "third surface" of this disclosure, and the inner surface 62 is an example of the "fourth surface" of this disclosure. 【0040】 In the configuration shown in Figure 2, the height of both the connector board 50 and the sensor board 60 is approximately the same, while the width of the connector board 50 is greater than that of the sensor board 60. Therefore, when the two boards are connected by aligning the center of the inner surface 54 of the connector board 50 with the center of the inner surface 62 of the sensor board 60 while maintaining this configuration, both ends of the connector board 50 in the width direction protrude from both sides of the sensor board 60 in the width direction. Hereinafter, in the above case, the ends of the connector board 50 in the width direction that protrude from both sides of the sensor board 60 in the width direction will be referred to as "protruding parts 56". 【0041】 The communication IC 80 is an IC that manages communication between the encoder 20 and external electronic equipment. Here, a terminal 84 is provided on the part of the communication IC 80 that faces the sensor board 60. The terminal 84 is housed in a package 82, which is a case made of an insulator such as resin. The package 82 has a rectangular parallelepiped shape. When viewed from the depth direction, the rectangular parallelepiped is approximately square. The terminal 84 of the communication IC 80 is soldered to a connection position 68 provided in the central part of the inner surface 62. As a result, the communication IC 80 is positioned in the central part of the inner surface 62, adjacent to a plurality of chip capacitors 90. In addition, the approximately square surface of the package 82 abuts against the inner surface 54 when the connector board 50 and the sensor board 60 are connected with the inner surface 54 and inner surface 62 facing each other. The communication IC 80 is an example of the "first integrated circuit module" of this disclosure, and the package 82 is an example of the "package" of this disclosure. 【0042】 Multiple chip capacitors 90 (e.g., 6) are provided. Here, the terminals (not shown) of the chip capacitors 90 are soldered to a connecting electrode 66 provided on the outer edge of the inner surface 62 and to another connecting electrode (not shown) provided on the inner surface 54 at a position corresponding to the connecting electrode 66. As a result, multiple chip capacitors 90 are arranged on the outer edge of the inner surface 62, and the communication IC 80 is arranged adjacent to the inner portion of the multiple chip capacitors 90 on the inner surface 62. The chip capacitors 90 are an example of a "chip component" in this disclosure. 【0043】 The sensor IC 100 is an IC that has a magnetic sensor and detects the magnetic properties of the magnet 110. Here, a terminal 102 is provided on the part of the sensor IC 100 that faces the sensor substrate 60. The terminal 102 is housed in a package 104, which is a case made of an insulator such as resin. The terminal 102 of the sensor IC 100 is soldered to a connection position (not shown) provided in the central part of the outer surface 64. The sensor IC 100 is an example of the "second integrated circuit module" of this disclosure. 【0044】 The magnet 110 is a cylindrical magnet positioned in the encoder 20 opposite the sensor IC 100. 【0045】 The magnet hub 120 is a component in the encoder 20 that houses the magnet 110. In the actuator 10 according to this embodiment, the magnet hub 120 is connected to the rear side of the output shaft 32 (see Figure 1(B)). 【0046】 Figure 3 is a plan view from the sensor board 60 side showing the connector board 50 and the sensor board 60 connected according to this embodiment. 【0047】 As shown in Figure 3, when the connector board 50 and the sensor board 60 are connected and the outer surface 64 side of the sensor board 60 is viewed from above, protrusions 56 protrude from both sides in the width direction of the sensor board 60, from the 3 o'clock and 9 o'clock directions in Figure 3. 【0048】 Here, the six chip capacitors 90 are positioned on the outer edge of the inner surface 62 (see Figure 2) of the sensor substrate 60, avoiding two parallel edge portions of the sensor substrate 60, namely edge portions 65A and 65B, which are aligned in the height direction as a predetermined direction. As a result, by connecting the connector substrate 50 and the sensor substrate 60 with edge portions 65A and 65B facing adjacent to the protrusion 56, the six chip capacitors 90 can be positioned while avoiding the protrusion 56. 【0049】 Figure 4 is a perspective view of the substrate connection structure 15 according to this embodiment. The substrate connection structure 15 shows the state in which the connector substrate 50 and the sensor substrate 60 are connected. 【0050】 As shown in Figure 4, in the board connection structure 15, the communication IC 80 and the chip capacitor 90 are sandwiched between the inner surface 54 and the inner surface 62. The package 82 of the communication IC 80, which is sandwiched between the inner surface 54 and the inner surface 62, is in contact with the inner surface 54. Here, with the communication IC 80 and the chip capacitor 90 positioned on the inner surface 62, the depth dimension of the communication IC 80 is greater than the depth dimension of the chip capacitor 90. Therefore, in the board connection structure 15, only the package 82 is in contact with the inner surface 54, and the chip capacitor 90 is not in contact with it. 【0051】 As described above, in the substrate connection structure 15 according to this embodiment, with the inner surface 54 and inner surface 62 facing each other and the connector substrate 50 and sensor substrate 60 connected, the package 82 of the communication IC 80 comes into contact with the inner surface 54. As a result, with the substrate connection structure 15, the package 82 of the communication IC 80, which is a component used in the circuit, can be used to reduce the external force applied to the chip capacitor 90 placed between the substrates. 【0052】 Furthermore, in the substrate connection structure 15 according to this embodiment, when the communication IC 80 is positioned on the inner surface 62, the depth dimension of the communication IC 80 is greater than the depth dimension of the chip capacitor 90. As a result, with the substrate connection structure 15, only the package 82 is in contact with the inner surface 54, and external force can be transmitted to the package 82 without applying external force to the chip capacitor 90. 【0053】 Furthermore, in the substrate connection structure 15 according to this embodiment, the communication IC 80 is located in the central part of the inner surface 62. The multiple chip capacitors 90 are arranged adjacent to the communication IC 80. As a result, the substrate connection structure 15 allows for a smaller sensor substrate 60 compared to the case where the communication IC 80 and the multiple chip capacitors 90 are arranged on different surfaces of the sensor substrate 60. 【0054】 Furthermore, in the substrate connection structure 15 according to this embodiment, the multiple chip capacitors 90 are connected to the inner surface 54 and the inner surface 62, respectively. The connector substrate 50 and the sensor substrate 60 are electrically connected via the multiple chip capacitors 90. As a result, the substrate connection structure 15 allows the multiple chip capacitors 90 to be shared between the substrates. 【0055】 Furthermore, in the substrate connection structure 15 according to this embodiment, the connector substrate 50 has protruding portions 56 that protrude from both sides in the width direction of the sensor substrate 60 when connected to the sensor substrate 60 with its inner surface 54 and inner surface 62 facing each other. The following is assumed as the manufacturing process for the substrate connection structure 15. First, a large substrate on which a plurality of connector substrates 50 are formed is prepared. Next, the sensor substrate 60, on which the communication IC 80 and chip capacitor 90 are arranged, is connected to each connector substrate 50 on the large substrate. After that, the connection portion between the tips of the protruding portions 56 of each connector substrate 50 is cut with a cutting tool to cut each connector substrate 50 out of the large substrate. With the substrate connection structure 15, when cutting the connector substrate 50 out of the large substrate after it has been connected to the sensor substrate 60 in the above manufacturing process, damage to the sensor substrate 60 by the cutting tool can be suppressed. 【0056】 Furthermore, in the substrate connection structure 15 according to this embodiment, the multiple chip capacitors 90 are arranged on the outer edge of the inner surface 62, avoiding the two parallel edge portions 65A and 65B of the sensor substrate 60, which are aligned in the height direction. As a result, with the substrate connection structure 15, the connector substrate 50 and the sensor substrate 60 are connected with the edges 65A and 65B facing adjacent to the protrusions 56, thereby preventing damage to the chip capacitors 90 by the cutting tool when cutting the connection portion between the tips of the protrusions 56 during the manufacturing process. 【0057】 Furthermore, in the substrate connection structure 15 according to this embodiment, the connector 70 is positioned on the outer surface 52 so as to avoid the protruding portion 56. As a result, with the substrate connection structure 15, when the connector substrate 50 is cut out from the large substrate after the connector 70 has been positioned, damage to the connector 70 by the cutting tool can be suppressed. 【0058】 Furthermore, the encoder 20 according to this embodiment includes the above-mentioned substrate connection structure 15, a sensor IC 100 having a magnetic sensor arranged on the outer surface 64, and a magnet 110 positioned opposite the sensor IC 100. The above-mentioned substrate connection structure 15 is miniaturized compared to a case where the communication IC 80 and chip capacitors 90 are not arranged between the substrates by arranging the communication IC 80 and a plurality of chip capacitors 90 between the connector substrate 50 and the sensor substrate 60. In addition, the above-mentioned substrate connection structure 15 arranges multiple components in a narrow space by arranging the communication IC 80 and a plurality of chip capacitors 90 adjacent to each other on the inner surface 62. Therefore, this embodiment makes it possible to miniaturize the encoder 20 and the actuator 10 including the encoder 20 by including the above-mentioned substrate connection structure 15. 【0059】 (others) In the above embodiment, the chip capacitor 90 is used as an example of the "chip component" of the present disclosure, but the invention is not limited thereto. For example, chip resistors and chip coils (chip inductors) may be used in the above board connection structure 15 as examples of the "chip component" of the present disclosure. 【0060】 In the above embodiment, the communication IC 80 and chip capacitor 90 are connected to the sensor board 60 first in the board connection structure 15, but this is not limited to this. For example, the communication IC 80 and chip capacitor 90 may be connected to the inner surface 54 of the connector board 50 first, and then the sensor board 60 may be connected. In other words, in the board connection structure 15, the surface to which the package 82 of the communication IC 80 makes contact is not limited to the inner surface 54, but may also be the inner surface 62. [Explanation of symbols] 【0061】 10 Actuators 15. Circuit board connection structure 20 encoders 50 Connector board (first board) 52 External surface (2nd surface) 54. Inner self (First side) 56 Protrusion 60 Sensor board (second board) 62. Inner Self (Fourth Side) 64 External surface (3rd surface) 65A Edge (edge ​​portion) 65B Edge (edge ​​portion) 70 connectors 80. Communication IC (First Integrated Circuit Module) 82 packages 90 Chip Capacitors (Chip Components) 100 Sensor ICs (Second Integrated Circuit Module) 110 Magnets

Claims

[Claim 1] A first substrate having one side in the thickness direction as the first surface and the other side as the second surface, The surface on one side in the thickness direction is designated as the third surface, and the surface on the other side as the fourth surface. A plurality of chip components are arranged on the outer edge of the fourth surface, and a first integrated circuit module is arranged adjacent to the inner portion of the plurality of chip components on the fourth surface. With the first surface and the fourth surface facing each other and connected to the first substrate, the package of the first integrated circuit module abuts against the first surface or the fourth surface of the second substrate. A substrate connection structure including a board connection structure. [Claim 2] The dimension of the first integrated circuit module arranged on the fourth surface in the thickness direction is greater than the dimension of the chip component in the thickness direction. The substrate connection structure according to claim 1. [Claim 3] The first integrated circuit module is located in the central portion of the fourth surface, The plurality of chip components are arranged adjacent to the first integrated circuit module. The substrate connection structure according to claim 1. [Claim 4] The plurality of chip components are connected to the first surface and the fourth surface, respectively. The first substrate and the second substrate are electrically connected via the plurality of chip components. The substrate connection structure according to claim 1. [Claim 5] The first substrate, when connected to the second substrate with its first and fourth surfaces facing each other, has protruding portions that protrude from both sides of the second substrate in the width direction. The substrate connection structure according to claim 1. [Claim 6] The plurality of chip components are arranged on the outer edge of the fourth surface, avoiding two parallel edge portions of the second substrate along a predetermined direction. The substrate connection structure according to claim 5. [Claim 7] On the second surface, the connector is arranged to avoid the protruding portion. The substrate connection structure according to claim 5. [Claim 8] A substrate connection structure according to any one of claims 1 to 7, A second integrated circuit module having a magnetic sensor is arranged on the third surface, A magnet positioned opposite the second integrated circuit module, An encoder that includes this. [Claim 9] An actuator comprising the encoder described in claim 8.

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