Composite electronic components

Abstract

We provide highly reliable composite electronic components. [Solution] The composite electronic component 100 includes an array in which two or more bodies, each containing a dielectric layer 111 and internal electrodes 121, 122, are arranged in a first direction X; a first external electrode 131 disposed on one face of the two or more bodies in a second direction Y perpendicular to the first direction; and a second external electrode 132 disposed on the other face of the two or more bodies in the second direction. The first external electrode includes a first inner band portion 131bi extending between two adjacent bodies and a first outer band portion 131bo disposed on the outermost edge in the first direction; the second external electrode includes a second inner band portion 132bi extending between two adjacent bodies and a second outer band portion 132bo disposed on the outermost edge in the first direction; and an insulating joint portion 140 connecting adjacent bodies is disposed in a portion between the first inner band portion and the second inner band portion facing each other in the second direction.

Description

[Technical Field]

[0001] This invention relates to a composite electronic component. [Background technology]

[0002] Multi-layer ceramic capacitors (MLCCs) are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and play a role in charging or discharging electricity.

[0003] For high efficiency and high-density integration, multiple chip-type capacitors are sometimes joined together and used in a stack configuration. Conventionally, epoxy-based adhesives and Cu-Sn alloys were used to join multiple chip-type capacitors. Referring to Figure 10, which shows a conventional stack configuration, the external electrodes of adjacent chips were joined using epoxy-based adhesives or Cu-Sn alloys 41 and 42 to form the stack. However, in the conventional stack configuration, cracks could occur at the joint due to vibrations during use or external shocks. In addition, electrical conductivity may decrease, and the equivalent series resistance (ESR) may increase. [Overview of the project] [Problems that the invention aims to solve]

[0004] One of the several objectives of the present invention is to provide a highly reliable composite electronic component.

[0005] One of the several objectives of the present invention is to provide a composite electronic component with high crack resistance.

[0006] One of several objectives of the present invention is to provide composite electronic components with low equivalent series resistance (ESR).

[0007] One of the several objectives of the present invention is to provide a composite electronic component with excellent heat dissipation characteristics.

[0008] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A composite electronic component according to one embodiment of the present invention includes an array in which two or more bodies, including a dielectric layer and internal electrodes, are arranged in a first direction; a first external electrode disposed on one surface of the two or more bodies in a second direction perpendicular to the first direction; and a second external electrode disposed on the other surface of the two or more bodies in the second direction, wherein the first external electrode includes a first inner band portion extending between two adjacent bodies and a first outer band portion disposed on the outermost edge in the first direction; the second external electrode includes a second inner band portion extending between the two adjacent bodies and a second outer band portion disposed on the outermost edge in the first direction; and an insulating joint portion connecting the adjacent bodies can be disposed in a part between the first inner band portion and the second inner band portion facing the second direction. [Effects of the Invention]

[0010] One of the several effects of the present invention is that the bonding strength between adjacent bodies is improved by joining them with an insulating joint.

[0011] One of the several effects of the present invention is that the heat dissipation characteristics are improved by arranging an insulating joint in a part between the first inner band portion and the second inner band portion.

[0012] One of the several effects of the present invention is that the equivalent series resistance (ESR) is reduced by arranging external electrodes that connect multiple main bodies.

[0013] However, the diverse and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood during the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0014] [Figure 1] It schematically shows a perspective view of a composite electronic component according to an embodiment of the present invention. [Figure 2] It schematically shows a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 3] It schematically shows a cross-sectional view taken along the line II-II' of FIG. 1. [Figure 4] It schematically shows a perspective view of the main body. [Figure 5] It is an exploded perspective view showing the main body disassembled. [Figure 6] It shows an enlarged view of the lower part in the X direction of FIG. 2. [Figure 7] It is an enlarged view of the K1 region of FIG. 6. [Figure 8] It is a figure corresponding to FIG. 2 of a composite electronic component according to another embodiment of the present invention. [Figure 9] It is a figure corresponding to FIG. 2 of a composite electronic component according to still another embodiment of the present invention. [Figure 10] It is a figure corresponding to FIG. 2 of a conventional stacked form. [Figure 11] It is an enlarged view of the K2 region of FIG. 10.

Modes for Carrying Out the Invention

[0015] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0016] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, this does not exclude other components unless otherwise stated, but rather means that it may further include other components.

[0017] In drawings, the X direction can be defined as the first direction, the lamination direction, or the thickness T direction; the Y direction as the second direction or the length L direction; and the Z direction as the third direction or the width W direction.

[0018] Composite electronic components Figure 1 schematically shows a perspective view of a composite electronic component according to one embodiment of the present invention; Figure 2 schematically shows a cross-sectional view along the line I-I' in Figure 1; Figure 3 schematically shows a cross-sectional view along the line II-II' in Figure 1; Figure 4 schematically shows a perspective view of the main body; Figure 5 is an exploded perspective view showing the main body in an exploded state; Figure 6 is an enlarged view of the lower part in the X direction of Figure 2; and Figure 7 is an enlarged view of the K1 region of Figure 6.

[0019] The composite electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to Figures 1 to 7. While a multilayer ceramic capacitor (MLCC) will be described as an example of a composite electronic component, the present invention is not limited to this and can be applied to various composite electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0020] A composite electronic component 100 according to one embodiment of the present invention includes an array in which two or more bodies 110, each containing a dielectric layer 111 and internal electrodes 121, 122, are arranged in a first direction; a first external electrode 131 disposed on one face of the two or more bodies in a second direction perpendicular to the first direction; and a second external electrode 132 disposed on the other face of the two or more bodies in the second direction. The first external electrode includes a first inner band portion 131bi extending between two adjacent bodies and a first outer band portion 131bo disposed on the outermost edge in the first direction; the second external electrode includes a second inner band portion 132bi extending between two adjacent bodies and a second outer band portion 132bo disposed on the outermost edge in the first direction; and an insulating joint portion 140 connecting the adjacent bodies can be disposed in a part between the first inner band portion and the second inner band portion facing the second direction.

[0021] For high efficiency and high-density integration, multiple chip-type capacitors are sometimes joined together and used in a stack configuration. Conventionally, epoxy-based adhesives and Cu-Sn alloys were used to join multiple chip-type capacitors. Referring to Figure 10, which shows a conventional stack configuration, the external electrodes of adjacent chips were joined using epoxy-based adhesives or Cu-Sn alloys 41 and 42 to form a stack configuration. However, in the conventional stack configuration, cracks could occur at the joint due to vibrations during use or external shocks. In addition, electrical conductivity may decrease, and the equivalent series resistance (ESR) may increase.

[0022] In contrast, according to one embodiment of the present invention, the bonding force between adjacent bodies 110 can be improved by joining them with an insulating joint 140. Furthermore, according to one embodiment of the present invention, the heat dissipation characteristics can be improved by arranging the insulating joint 140 in a part between the first inner band portion 131bi and the second inner band portion 132bi. Furthermore, according to one embodiment of the present invention, instead of arranging an external electrode on each of the multiple bodies 110, the equivalent series resistance (ESR) can be reduced by connecting the multiple bodies 110 to a single first external electrode 131 and a single second external electrode 132.

[0023] The following describes each component included in the composite electronic component 100 according to one embodiment of the present invention.

[0024] The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122. The main body 110 may have the dielectric layer 111 and internal electrodes 121 and 122 stacked alternately.

[0025] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedron-shaped.

[0026] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0027] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third, fourth, and fifth surfaces and / or the corners connecting the second surface with the third, fourth, and fifth surfaces may have a form that is contracted toward the center of the body 110 in the first direction when viewed with respect to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 may have a form that is contracted toward the center of the body 110 in the first direction when viewed with respect to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third, fourth, fifth, and sixth faces, and / or the corners connecting the second face with the third, fourth, fifth, and sixth faces.

[0028] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth surface 5 and sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces, and the portions connecting the second surface with the fifth and sixth surfaces, do not need to have a contracted form.

[0029] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular limit to the number of dielectric layers stacked, and it can be determined considering the size of the composite electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0030] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, as the ceramic powder, a barium titanate (BaTiO3)-based powder can be used. More specifically, for example, the ceramic powder can be a barium titanate (BaTiO3)-based powder, a CaZrO3-based constant dielectric powder, etc. More specifically, for example, the barium titanate (BaTiO3)-based powder can be BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and one or more of them may be used. The CaZrO3-based constant dielectric powder may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0031] Therefore, the dielectric layer 111 is BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y)It can contain one or more of O3 (0 < x < 1, 0 < y < 1). In one embodiment, the dielectric layer 111 is (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) can be contained mainly.

[0032] On the other hand, when applying a magnetic material instead of the dielectric material to the main body 110, the composite electronic component can function as an inductor. The magnetic material may be, for example, ferrite and / or metal magnetic particles. When the composite electronic component functions as an inductor, the internal electrode may be a coil-type conductor.

[0033] Also, when applying a piezoelectric material instead of the dielectric material to the main body 110, the composite electronic component can function as a piezoelectric element. The piezoelectric material may be, for example, PZT (lead zirconate titanate).

[0034] Also, when applying a ZnO-based or SiC-based material instead of the dielectric material to the main body 110, the composite electronic component can function as a varistor, and when applying a spinel-based material instead of the dielectric material to the main body 110, the composite electronic component can function as a thermistor.

[0035] That is, the composite electronic component 100 according to one embodiment of the present invention can function not only as a multilayer ceramic capacitor but also as an inductor, a piezoelectric element, a varistor, or a thermistor by appropriately changing the material and structure of the main body 110.

[0036] The size of the main body 110 does not need to be particularly limited. For example, the length L of the main body 110 in the second direction may be 3.1 to 3.3 mm, the thickness of the main body 110 in the first direction may be 2.4 to 2.6 mm, and the width of the main body 110 in the third direction may be 2.4 to 2.6 mm. However, it is not limited to this, and it can be appropriately deformed according to the use environment and purpose.

[0037] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged to face each other with a dielectric layer 111 in between, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in a first direction.

[0038] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between.

[0039] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume forming portion Ac in the first direction.

[0040] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers 112-1, 112-2, 113-1, 113-2 on the upper and lower surfaces of the capacitance forming portion Ac in the thickness direction, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0041] The upper cover portion 112 and the lower cover portion 113 do not contain internal electrodes and may contain the same material as the dielectric layer 111.

[0042] In other words, the upper cover portion 112 and the lower cover portion 113 can include ceramic material, for example, barium titanate (BaTiO3) based ceramic material.

[0043] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. For example, the thickness tc of the cover portions 112 and 113 may be 100 μm or less, 30 μm or less, or 20 μm or less. Here, the average thickness of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0044] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the size of the cover portions 112 and 113 in the first direction measured at five equally spaced points in the second direction in the cross-sections of the first and second directions obtained by cutting the main body 110 in the center of the third direction.

[0045] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0046] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 may be located on both end surfaces in the width direction of the ceramic main body 110.

[0047] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0048] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0049] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0050] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0051] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. For example, the average width of the margin portions 114 and 115 may be 100 μm or less, 20 μm or less, or 15 μm or less. Here, the average width of the margin portions 114 and 115 refers to the average thickness of the first margin portion 114 and the second margin portion 115, respectively.

[0052] The average width of the margin portions 114 and 115 can represent the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the average value of the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0053] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0054] The first internal electrode 121 is separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0055] In other words, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Furthermore, the first internal electrode 121 and the second internal electrode 122 may be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0056] However, the invention is not limited to this form, and the first internal electrode and the second internal electrode may be arranged alternately with a dielectric layer in between, and the first internal electrode may include a 1-1 internal electrode connected to the first external electrode and a 1-2 internal electrode connected to the second external electrode, with the second internal electrode having the form of a floating electrode arranged separately from the first and second external electrodes.

[0057] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0058] The average thickness td of the dielectric layer 111 does not need to be particularly limited, but may be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited, but may be, for example, 0.05 μm to 3.0 μm. Furthermore, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to the desired characteristics and application.

[0059] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the sizes of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of the dielectric layer 111 can be measured by taking the average value of the thickness at multiple points on one dielectric layer 111, for example, 30 points that are equally spaced in the second direction. Similarly, the average thickness te of the internal electrodes 121 and 122 can be measured by taking the average value of the thickness at multiple points on one internal electrode 121 or 122, for example, 30 points that are equally spaced in the second direction. The 30 equally spaced points can be specified in the capacitance forming section Ac. On the other hand, if such average values ​​are measured for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average values ​​are measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0060] The insulating joint 140 can serve to connect two adjacent main bodies 110.

[0061] The insulating joint 140 can be positioned in a portion of the area between the first inner band portion 131bi and the second inner band portion 132bi, which are facing each other in the second direction. If the insulating joint 140 is positioned over the entire area between the first inner band portion 131bi and the second inner band portion 132bi, the heat dissipation function may deteriorate.

[0062] The external electrodes 131 and 132 may include a first external electrode 131 positioned on one side in the second direction of two or more bodies, and a second external electrode 132 positioned on the other side in the second direction. The first external electrode 131 may cover one side in the second direction of two or more bodies, and the second external electrode 132 may cover the other side in the second direction of two or more bodies.

[0063] In other words, according to one embodiment of the present invention, instead of arranging external electrodes on each of the multiple main bodies 110, the equivalent series resistance (ESR) can be reduced by connecting the multiple main bodies 110 to one first external electrode 131 and one second external electrode 132.

[0064] The first external electrode 131 includes a first inner band portion 131bi extending between two adjacent bodies from the two or more bodies, and a first outer band portion 131bo positioned on the outermost edge in the first direction. The second external electrode 132 may include a second inner band portion 132bi extending between two adjacent bodies, and a second outer band portion 132bo positioned on the outermost edge in the first direction. This not only improves the bonding force between the external electrodes 131 and 132 and the multiple bodies, but also improves impact resistance against external impacts compared to the case where only an insulating joint portion 140 is positioned in the space between adjacent bodies.

[0065] The method for forming the external electrodes 131 and 132 is not particularly limited. For example, multiple pre-sintered bodies obtained by cutting the laminate in chip units can be joined together with an insulating adhesive, then a body can be obtained through a sintering process, and then the body can be dipped in an external electrode paste and heat-treated to form the external electrodes 131 and 132.

[0066] The external electrodes 131 and 132 may be formed from any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc. Furthermore, they may have a multilayer structure.

[0067] For example, the first external electrode 131 may include an electrode layer 131a placed on the main body 110 and a plating layer 131b formed on the electrode layer, and the second external electrode 132 may similarly include an electrode layer and a plating layer. The following description will focus on the first external electrode 131, but since the configurations of the first external electrode 131 and the second external electrode 132 are similar, with the only difference being that the first external electrode 131 is placed on the third surface and the second external electrode 132 is placed on the fourth surface, this will be considered to include a description of the second external electrode 132 as well.

[0068] To give a more specific example for the electrode layer 131a, the electrode layer may be a firing electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0069] Furthermore, the electrode layer 131a may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0070] The conductive metal included in the electrode layer 131a can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0071] The plating layer 131b plays a role in improving mounting characteristics. The type of plating layer 131b is not particularly limited and may be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0072] In one embodiment, the first inner band portion 131bi and the second inner band portion 132bi can be arranged to contact the two adjacent bodies. According to one embodiment of the present invention, instead of placing an external electrode on each of the multiple bodies 110, the multiple bodies 110 are connected to one first external electrode 131 and one second external electrode 132, so the first inner band portion 131bi and the second inner band portion 132bi can be arranged to contact the two adjacent bodies.

[0073] In one embodiment, the first inner band portion 131bi may be longer in the second direction than the first outer band portion 131bo, and the second inner band portion 132bi may be longer in the second direction than the second outer band portion 132bo. This can improve the bonding force between the external electrode and the main body, and also improve the bonding force between adjacent main bodies.

[0074] On the other hand, it is not necessary to place only one insulating joint 140 between the first inner band portion and the second inner band portion that are facing each other in the second direction.

[0075] Figure 8 is a diagram corresponding to Figure 2 of a composite electronic component 100' according to another embodiment of the present invention. Referring to Figure 8, the insulating joint 140' may include a first insulating joint 140-1 that is in contact with the first inner band portion 131bi, and a second insulating joint 140-2 that is spaced apart from the first insulating joint in the second direction and is in contact with the second inner band portion 132bi.

[0076] By forming an external electrode after forming an insulating joint, the first insulating joint 140-1 can control the length of the first inner band portion 131bi, and the second insulating joint 140-2 can control the length of the second inner band portion 132bi.

[0077] Figure 9 is a diagram corresponding to Figure 2 of a composite electronic component 100'' according to yet another embodiment of the present invention. Referring to Figure 9, two or more insulating joints 140'' may be arranged between the first inner band portion and the second inner band portion which are opposite in the second direction. By arranging multiple insulating joints 140'', as shown in Figure 9, gaps can be formed in multiple locations between adjacent bodies, thereby further improving heat dissipation characteristics.

[0078] Referring to Figure 6, which shows an enlarged view of the lower part in the X direction of Figure 2, in one embodiment, when the length of the main body in the second direction is L, the space between the first inner band portion and the second inner band portion facing the second direction, where the insulating joint portion is not located, is called the separation portion, and the length of the separation portion in the second direction is SL, then SL / L may be 0.03 or more and 0.59 or less. This makes it possible to further improve the heat dissipation characteristics without reducing the joint strength. If SL / L is less than 0.03, the heat dissipation characteristics may deteriorate, and if it exceeds 0.59, the joint strength may decrease.

[0079] In one embodiment, when the length of the main body in the second direction is L and the length of the insulating joint in the second direction is DL, DL / L may be between 0.03 and 0.59. This makes it possible to further improve the joint strength without reducing the heat dissipation characteristics. If DL / L is less than 0.03, the joint strength may decrease, and if it exceeds 0.59, the heat dissipation characteristics may deteriorate.

[0080] In one embodiment, when the length of the main body in the second direction is L, and the sum of the lengths of the first inner band portion and the second inner band portion facing the second direction in the second direction is BLi, BLi / L may be 0.37 or more and 0.5 or less. This ensures bonding force between the external electrode and the main body, and further improves the bonding strength between the main bodies.

[0081] In one embodiment, when the sum of the lengths of the first inner band portion and the second inner band portion facing the second direction is BLi, and the sum of the lengths of the first outer band portion and the second outer band portion facing the second direction is BLo, BLo may be smaller than BLi. That is, the length of the inner band portion may be longer than the length of the outer band portion, which can further improve the bonding force between the external electrode and the main body and further improve moisture resistance reliability. The length of the first inner band portion may be longer than the length of the first outer band portion, and the length of the second inner band portion may be longer than the length of the second outer band portion.

[0082] To give a specific example, BLo / BLi may be between 0.75 and less than 1.

[0083] In one embodiment, the array may include three or more main bodies 110. This makes it easier to achieve high efficiency and high-density integration.

[0084] On the other hand, as shown in Figure 3, the stacking direction of the dielectric layer 111 and internal electrodes 121 and 122 may be the same as the stacking direction of the main body. However, it is not limited to this, and the main body may be stacked in a direction perpendicular to the stacking direction of the dielectric layer 111 and internal electrodes 121 and 122.

[0085] In one embodiment, the first external electrode 131 and the second external electrode 132 may include an electrode layer and a plating layer disposed on the electrode layer.

[0086] Referring to Figure 6, which is an enlarged view of the K1 region in Figure 6, the first external electrode 131 may include an electrode layer 131a and a plating layer 131b placed on the electrode layer 131a, and the second external electrode 132 may also include an electrode layer and a plating layer in the same way as the first external electrode 131.

[0087] In one embodiment, the plating layer does not need to be placed in the central part of the first inner band in the second direction and in the central part of the second inner band in the second direction. In one embodiment, the plating layer may be placed only at the ends of the first inner band and the second inner band that are opposite to each other.

[0088] Since the inner band portions 131bi and 132bi are in contact with the two adjacent main bodies, a plating layer cannot be placed in the central portion of the first inner band portion 131bi in the second direction and in the central portion of the second inner band portion 132bi in the second direction. Therefore, the first inner band portion 131bi and the second inner band portion 132bi can only be placed at their opposing ends.

[0089] However, if insulating joints 140 are provided at the ends of the inner band portions 131bi and 132bi, the first inner band portion 131bi and the second inner band portion 132bi do not need to include a plating layer.

[0090] In contrast, referring to Figure 10, which shows a conventional stack configuration, and Figure 11, which is an enlarged view of the K2 region in Figure 10, external electrodes formed on different bodies are joined by joints 41 and 42 using epoxy-based adhesives or Cu-Sn alloys, thereby separately arranging electrode layers 32a-1 and 32a-2 on each body, and separately arranging plating layers 32b-1 and 32b-2 on each electrode layer 32a-1 and 32a-2. Therefore, it can be confirmed that plating layers 32b-1 and 32b-2 are arranged on the entire outer surface of the band portion arranged between adjacent bodies, and that the two band portions are separated between adjacent bodies by joints 41 and 42.

[0091] The insulating joint 140 can be made of a material that has excellent bonding strength with the dielectric and possesses insulating properties. Specifically, the insulating joint 140 can contain a glass component, and this glass component may include one or more of SiO2, B2O3, BaO, CaO, Na2O, ZnO, Al2O3, and PbO.

[0092] (Examples) Comparative Examples 1-4 and Invention Examples 1-4 were created by varying the length of the inner band portion BLi, the length of the separation portion SL, and the length of the insulating joint portion DL, while producing sample stacks in the form shown in Figure 1.

[0093] Comparative Example 5 is a conventional stack configuration shown in Figure 10, in which the external electrodes of adjacent chips are joined using a Cu-Sn alloy to form a stack configuration.

[0094] The bonding strength, heat generation characteristics, and moisture resistance reliability of Comparative Examples 1-5 and Invention Examples 1-4 were evaluated and are shown in Table 1 below.

[0095] The joint strength was measured using a universal material testing machine in a three-point bending test, with the external force required to cause cracks in the band portion and / or insulating joint of the external electrode placed between the main body and the main body, or to separate the external electrode from the main body, as the baseline. The joint strength of Comparative Example 5 was set as the 100% baseline value, and the relative values ​​for the remaining test numbers are listed.

[0096] For the heat generation characteristics, five sample stacks were prepared for each test number. The sample stacks were placed on a hot plate at 105°C, and the rated voltage was applied to the sample stacks at 200kHz using an amplifier. While observing the sample stacks with a thermal imaging camera, the AC voltage applied to the sample stacks was measured with an IV Analyzer until the hot plate temperature reached 125°C, and the average value for the five sample stacks was calculated. A higher average AC voltage indicated superior heat generation characteristics, and the average AC voltage of test number 2 was used as the 100% reference, with the relative values ​​for the remaining test numbers listed in Table 1 below.

[0097] Humidity resistance reliability is determined by preparing 400 sample stacks per test number, applying a 4V voltage for 12 hours at a temperature of 85°C and a relative humidity of 85%, and recording the number of sample stacks in which the insulation resistance value decreased to 1 / 10 or less of the initial value.

[0098] [Table 1]

[0099] As presented in this invention, in the cases where an insulating joint and a separation portion exist between the inner band portions, Examples 1 to 4 of the invention are confirmed to be superior in both joint strength and heat generation characteristics compared to Comparative Example 5, which is a conventional stack configuration shown in Figure 10.

[0100] Furthermore, among Invention Examples 1 to 4, it was confirmed that Invention Examples 1 and 2, in which the length of the inner band portion BLi is longer than the length of the outer band portion, exhibit superior bonding strength compared to Invention Examples 3 and 4. In particular, Invention Examples 1 and 2, in which the length of the inner band portion BLi is longer, showed superior bonding strength between the external electrode and the main body. In addition, although all Invention Examples 1 to 4 showed 0% failure in moisture resistance reliability, Invention Examples 1 and 2, in which the length of the inner band portion BLi is longer, are expected to have even better moisture resistance reliability.

[0101] On the other hand, in Comparative Examples 1 and 3, where there is no insulating joint between the inner band portions, the heat generation characteristics are excellent, but the joint strength is inferior compared to Invention Examples 1 to 4.

[0102] Furthermore, in Comparative Examples 2 and 4, where there is no separation between the inner band portions, the bonding strength is excellent, but it can be confirmed that the heat generation characteristics are worse than those of the conventional Comparative Example 5.

[0103] Furthermore, in Comparative Examples 3 and 4, where the length of the inner band portion BLi is shorter than the length of the outer band portion, it can be confirmed that the moisture resistance reliability deteriorated.

[0104] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0105] Furthermore, the expression "one embodiment" as used in this invention does not mean that each embodiment is the same as another, but is provided to emphasize and describe the unique and distinct features of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, as long as there is no description in the other embodiment that contradicts or is contrary to that matter.

[0106] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates a different meaning. [Explanation of Symbols]

[0107] 100: Composite electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 132: External electrode 131bi, 132bi: Inner band section 131bo, 132bo: Outer band section 140: Insulating joint

Claims

1. An array in which two or more bodies, including a dielectric layer and internal electrodes, are arranged in a first direction, A first external electrode is disposed on one side of the two or more bodies in a second direction perpendicular to the first direction, Includes a second external electrode disposed on the other side of the two or more bodies in the second direction, The first external electrode includes a first inner band portion extending between two adjacent bodies from among the two or more bodies, and a first outer band portion positioned at the outermost edge in the first direction; the second external electrode includes a second inner band portion extending between two adjacent bodies, and a second outer band portion positioned at the outermost edge in the first direction; A composite electronic component in which an insulating joint is provided in a portion between the first inner band portion and the second inner band portion facing each other in the second direction, for connecting the adjacent main body.

2. The composite electronic component according to claim 1, wherein the first inner band portion and the second inner band portion are arranged to be in contact with the two adjacent bodies.

3. The first inner band portion has a longer length in the second direction than the first outer band portion. The composite electronic component according to claim 1, wherein the second inner band portion has a longer length in the second direction than the second outer band portion.

4. The composite electronic component according to claim 1, wherein the insulating joint includes a first insulating joint in contact with the first inner band, and a second insulating joint disposed at a distance from the first insulating joint in the second direction and in contact with the second inner band.

5. The composite electronic component according to claim 1, wherein two or more insulating joints are arranged between a first inner band portion and a second inner band portion facing each other in the second direction.

6. The length of the main body in the second direction is L, When the space between the first inner band portion and the second inner band portion facing each other in the second direction, the space in which the insulating joint portion is not located is called the separation portion, and the length of the separation portion in the second direction is called SL, The composite electronic component according to claim 1, wherein SL / L is 0.03 or more and 0.59 or less.

7. The length of the main body in the second direction is L, When the length of the insulating joint in the second direction is DL, The composite electronic component according to claim 1, wherein DL / L is 0.03 or more and 0.59 or less.

8. The length of the main body in the second direction is L, When BLi is the sum of the lengths of the first inner band portion and the second inner band portion facing each other in the second direction, The composite electronic component according to claim 1, wherein BLi / L is 0.37 or more and 0.5 or less.

9. The sum of the lengths of the first inner band portion and the second inner band portion facing each other in the second direction is BLi, When BLo is the sum of the lengths of the first outer band portion and the second outer band portion facing each other in the second direction, The composite electronic component according to claim 1, wherein BLo is smaller than BLi.

10. The composite electronic component according to claim 1, wherein the array includes three or more bodies.

11. The composite electronic component according to claim 1, wherein the first external electrode and the second external electrode include an electrode layer and a plating layer disposed on the electrode layer.

12. The composite electronic component according to any one of claims 1 to 11, wherein the first inner band portion and the second inner band portion have a plating layer disposed only at the ends facing each other.

13. The composite electronic component according to any one of claims 1 to 11, wherein no plating layer is disposed in the central portion of the first inner band in the second direction and the central portion of the second inner band in the second direction.

14. The composite electronic component according to any one of claims 1 to 11, wherein the first inner band portion and the second inner band portion do not include a plating layer.

15. The insulating joint is SiO ２ , B ２ O ３ , BaO, CaO, Na ２ O, ZnO, Al ２ O ３ A composite electronic component according to any one of claims 1 to 11, comprising one or more of the following: and PbO.

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