Capacitor module

The capacitor module addresses miniaturization by arranging capacitor elements in a staggered pattern and utilizing unused spaces with Y capacitors, achieving a compact design that reduces noise and enhances stability.

JP7878545B2Active Publication Date: 2026-06-23MURATA MFG CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
MURATA MFG CO LTD
Filing Date
2023-12-07
Publication Date
2026-06-23

Smart Images

  • Figure 0007878545000001
    Figure 0007878545000001
  • Figure 0007878545000002
    Figure 0007878545000002
  • Figure 0007878545000003
    Figure 0007878545000003
Patent Text Reader

Abstract

This capacitor module comprises: a plurality of capacitor elements each having a first electrode and a second electrode; a first busbar electrically connected to the first electrodes; a second busbar electrically connected to the second electrodes; a first Y capacitor having one electrode electrically connected to the first busbar and having another electrode electrically connected to a first ground terminal; a second Y capacitor having one electrode electrically connected to the second busbar and having another electrode electrically connected to a second ground terminal; and a case that accommodates the plurality of capacitor elements, the first busbar, the second busbar, the first Y capacitor, and the second Y capacitor. The plurality of capacitor elements are disposed aligned in a plurality of rows including a first row and a second row within the case. The first row and the second row are disposed so that the plurality of capacitor elements are in a staggered arrangement. The first Y capacitor is disposed in a first space surrounded by the first row, the second row, and the case; and the second Y capacitor is disposed in a second space surrounded by the first row, the second row, and the case.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to a capacitor module.

Background Art

[0002] Patent Document 1 discloses a capacitor device in which a plurality of capacitors are arranged in a plurality of rows on a substrate, and each capacitor is arranged in a staggered pattern and adjacent to each other. In the capacitor device, a hole for inserting a bolt is formed in the space generated on the substrate, and the space and the hole constitute an attachment portion for attaching the capacitor device to an electronic device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The capacitor device described in Patent Document 1 still has room for improvement in terms of miniaturization.

[0005] Therefore, the present invention provides a miniaturized capacitor module.

Means for Solving the Problems

[0006] A capacitor module according to one aspect of the present invention comprises a plurality of capacitor elements having a first electrode disposed on one end face and a second electrode disposed on the other end face; a first busbar electrically connected to the first electrode of each of the plurality of capacitor elements; a second busbar electrically connected to the second electrode of each of the plurality of capacitor elements; a first Y capacitor with one electrode electrically connected to the first busbar and the other electrode electrically connected to a first ground terminal; and a capacitor with one electrode electrically connected to the second busbar and the other electrode electrically connected to the second ground terminal. The device comprises a second Y capacitor connected to a first busbar, a plurality of capacitor elements, a first busbar, a second busbar, a first Y capacitor, a second Y capacitor, and a case housing the latter. The plurality of capacitor elements are arranged in multiple rows within the case, including a first row and a second row, with the first row and the second row having the plurality of capacitors arranged in a staggered pattern. The first Y capacitor is located in a first space enclosed by the first row, the second row and the case, and the second Y capacitor is located in a second space enclosed by the first row, the second row and the case. [Effects of the Invention]

[0007] According to the present invention, a miniaturized capacitor module can be provided. [Brief explanation of the drawing]

[0008] [Figure 1A] Plan view of a capacitor module according to Embodiment 1 of the present invention [Figure 1B] Plan view of the capacitor module in Figure 1A with the busbars omitted. [Figure 2A] Cross-sectional view AA of the capacitor module in Figure 1A [Figure 2B] Cross-sectional view of the capacitor module BB in Figure 1A. [Figure 3] Perspective view showing the capacitor elements built into the capacitor module. [Figure 4A] Perspective view showing the first Y capacitor [Figure 4B] Perspective view showing the second Y capacitor. [Figure 5] Circuit diagram showing the capacitor module in Figure 1A [Figure 6] The circuit diagram in Figure 1A shows a power converter with the capacitor module connected to a power semiconductor. [Modes for carrying out the invention]

[0009] (Background leading to the present invention) In capacitor modules used in power semiconductors and the like, it has been proposed to arrange multiple capacitors within the capacitor module in a staggered pattern in order to reduce size. For example, Patent Document 1 discloses a capacitor device in which cylindrical capacitors are arranged in a staggered pattern, and mounting parts are formed in the space created on the substrate.

[0010] In the capacitor device described in Patent Document 1, the capacitors are arranged in a staggered pattern, creating space on the substrate. Holes are then formed in this space to create mounting sections. The capacitor device is then attached to electronic equipment using these mounting sections.

[0011] However, in the capacitor device described in Patent Document 1, the space created on the substrate is used as a mounting area, meaning that the space cannot be used for purposes other than mounting to electronic equipment. In recent years, in order to further miniaturize capacitor modules, there has been a need to make more effective use of the dead space in capacitor modules.

[0012] Therefore, the inventors considered further miniaturization of the capacitor module and arrived at the following invention.

[0013] (Embodiment 1) [Overall structure] FIG. 1A is a plan view of a capacitor module 1 according to Embodiment 1 of the present invention. FIG. 1B is a plan view of the capacitor module 1 of FIG. 1A with the bus bar omitted. FIG. 2A is a cross-sectional view taken along line A-A of the capacitor module 1 of FIG. 1A. FIG. 2B is a cross-sectional view taken along line B-B of the capacitor module 1 of FIG. 1A. In the figures, the X, Y, and Z directions indicate the depth direction, width direction, and height direction of the capacitor module 1, respectively.

[0014] The capacitor module 1 according to Embodiment 1 is a capacitor module in which a plurality of capacitor elements 10 are incorporated in a case 60, and is, for example, a capacitor module electrically connected to a power semiconductor or the like.

[0015] As shown in FIGS. 1A to 2B, the capacitor module 1 includes a plurality of capacitor elements 10, a first bus bar 20, a second bus bar 30, a first Y capacitor 40, a second Y capacitor 50, and a case 60. The capacitor module 1 is electrically connected to, for example, a power semiconductor or the like via the first bus bar 20 and the second bus bar 30.

[0016] <Case> Inside the case 60 formed of synthetic resin or the like, a plurality of capacitor elements 10, a first bus bar 20, a second bus bar 30, a first Y capacitor 40, and a second Y capacitor 50 are accommodated. The inside of the case 60 is filled with a sealing resin not shown. In the present embodiment, the case 60 has a rectangular parallelepiped appearance, but the shape of the case 60 is not limited to this and can be any shape.

[0017] As shown in FIGS. 1A and 1B, the case 60 is formed in a rectangular shape in a plan view, and the first ground terminal 70 and the second ground terminal 80 are arranged on each of two opposite sides. The first ground terminal 70 and the second ground terminal 80 are metal terminals provided on the outer periphery of the case 60, respectively. Through the first ground terminal 70 and the second ground terminal 80, the capacitor module 1 can be electrically connected to a ground electrode provided on an external device such as a power semiconductor on which the capacitor module 1 is mounted.

[0018] The first ground terminal 70 and the second ground terminal 80 can be arranged in the case 60 by insert molding, for example.

[0019] Mounting holes 71 and 81 for attaching the capacitor module 1 to an external device are formed in each of the first ground terminal 70 and the second ground terminal 80. A connecting member (not shown) may be inserted into the mounting holes 71 and 81 of the first ground terminal 70 and the second ground terminal 80. By inserting the connecting member, the capacitor module 1 can be stably fixed to the external device, and furthermore, the capacitor module 1 can be reliably connected to the ground electrode of the external device.

[0020] <Capacitor element> FIG. 3 is a perspective view showing a capacitor element 10 built in the capacitor module 1. The capacitor element 10 has a first electrode 11 arranged on one end face and a second electrode 12 arranged on the other end face. In the present embodiment, the capacitor element 10 is formed in a columnar shape having an oval end face. The capacitor element 10 functions as an X capacitor, for example.

[0021] The capacitor element 10 is a film capacitor composed of a laminate of dielectric films. More specifically, the capacitor element 10 is formed by stacking dielectric films, each having a metal vapor-deposited film on its surface, and then winding them. In this embodiment, the capacitor element 10 is formed into a columnar shape with an oval cross-section by pressing the wound dielectric film into a flattened shape.

[0022] As the dielectric film, for example, a dielectric film formed from a mixed resin solution containing phenoxy resin and MDI (diphenylmethane diisocyanate) can be used. Alternatively, a dielectric film formed from a mixed resin solution containing polyvinyl acetal (PVAA) and ethyl acetate may be used. By forming a dielectric film with such a mixed resin solution, the glass transition temperature of the dielectric film can be set to 120°C or higher, thereby improving the heat resistance of the capacitor module. As the metal vapor-deposited film formed on the surface of the dielectric film, for example, metals such as Al and Zn can be used.

[0023] A first electrode 11 is formed on one end face of a wound dielectric film, and a second electrode 12 is formed on the other end face. The first electrode 11 and the second electrode 12 can be formed, for example, by thermal spraying Zn or the like.

[0024] The capacitor element 10 is not limited to a film capacitor, but may be other types of capacitors such as ceramic capacitors or electrolytic capacitors.

[0025] In this embodiment, as shown in Figures 1A and 1B, 11 capacitor elements 10 are arranged in three rows inside the case 60. Specifically, as shown in Figure 1B, the 11 capacitor elements are arranged in three rows, including the first row 10a, the second row 10b, and the third row 10c. The first row 10a and the second row 10b, and the second row 10b and the third row 10c are arranged in a staggered pattern. In other words, the capacitor elements 10 in the first row 10a and the capacitor elements 10 in the adjacent second row 10b are positioned at offset positions in the arrangement direction D1 of their respective rows. Similarly, for the second row 10b and the third row 10c, the capacitor elements 10 in the second row 10b and the capacitor elements 10 in the adjacent third row 10c are positioned at offset positions in the arrangement direction D1.

[0026] By arranging multiple capacitor elements 10 in a staggered pattern, the space required to house the capacitor elements 10 can be reduced.

[0027] <First bus bar> The first busbar 20 is a terminal for electrically connecting the first electrode 11 of the capacitor element 10 to the terminal of an external device (not shown), such as a power semiconductor.

[0028] The first busbar 20 is formed from a conductive material, such as a plate-shaped metal. As shown in Figures 1A and 2A to 2B, the first busbar 20 is electrically connected to the first electrode 11 of each capacitor element 10. In this embodiment, the first busbar 20 is arranged along the direction in which the first electrode 11 of each capacitor element 10 extends. The first busbar 20 is electrically connected to the first electrode 11 of the capacitor element 10 via a connection terminal 13.

[0029] In this embodiment, as shown in Figure 1A, the first busbar 20 has one input terminal 20a and three output terminals 20b.

[0030] <Second bus bar> The second busbar 30 is a terminal for electrically connecting the second electrode 12 of the capacitor element 10 to the terminal of an external device (not shown), such as a power semiconductor.

[0031] The second busbar 30 is formed from a conductive material, such as a plate-shaped metal. As shown in Figures 1A and 2A to 2B, the second busbar 30 is electrically connected to the second electrode 12 of each capacitor element 10. In this embodiment, the second busbar 30 is arranged along the direction in which the second electrode 12 of each capacitor element 10 extends. The second busbar 30 is electrically connected to the second electrode 12 of the capacitor element 10 via a connection terminal 14.

[0032] In this embodiment, as shown in Figure 1A, the second busbar 30 has one input terminal 30a and three output terminals 30b. As shown in Figures 2A to 2B, the input terminal 30a of the second busbar 30 is positioned at approximately the same location as the input terminal 20a of the first busbar 20 in the height direction H1 of the capacitor module 1. Furthermore, the output terminals 30b of the second busbar 30 are positioned at approximately the same location as the output terminals 20b of the first busbar 20 in the height direction H1 of the capacitor module 1. For this reason, in this embodiment, the second busbar 30 is formed in a bent shape.

[0033] <Yコンデンサ> The capacitor module 1 includes two Y capacitors 40 and 50. The Y capacitors are capacitors for removing common-mode noise in the capacitor module 1. The Y capacitors 40 and 50 are different types of capacitors from the capacitor element 10.

[0034] Figure 4A is a perspective view showing the first Y capacitor 40. Figure 4B is a perspective view showing the second Y capacitor 50.

[0035] The first Y capacitor 40 has one electrode 41 electrically connected to the first busbar 20 and the other electrode 42 electrically connected to the first ground terminal 70. In this embodiment, as shown in Figure 2A, one electrode 41 of the first Y capacitor 40 is electrically connected to the first busbar 20 via a connection terminal 43. Furthermore, the other electrode 42 of the first Y capacitor 40 is electrically connected to the first ground terminal 70 via a connection terminal 44. The connection terminal 44 can be electrically connected to the first ground terminal 70, which is located on the outer surface of the case 60, for example, by penetrating the side of the case 60. Alternatively, the first ground terminal 70 may extend through the side of the case 60 into the interior of the case 60.

[0036] The second Y capacitor 50 has one electrode 51 electrically connected to the second busbar 30 and the other electrode 52 electrically connected to the second ground terminal 80. In this embodiment, as shown in Figure 2B, one electrode 51 of the second Y capacitor 50 is electrically connected to the second busbar 30 via a connection terminal 53. Furthermore, the other electrode 52 of the second Y capacitor 50 is electrically connected to the second ground terminal 80 via a connection terminal 54. The connection terminal 54 can be electrically connected to the second ground terminal 80, for example, which is located on the outer surface of the case 60, penetrating the side of the case 60. Alternatively, the second ground terminal 80 may extend through the side of the case 60 into the interior of the case 60.

[0037] As shown in Figures 2A to 4B, the Y capacitors 40 and 50 are positioned in a different orientation from the capacitor element 10. Specifically, the Y capacitors 40 and 50 are positioned such that their electrodes 41, 42, 51, and 52 are oriented differently from the electrodes 11 and 12 of the capacitor element 10. While the electrodes 11 and 12 of the capacitor element 10 are oriented in the height direction (Z direction), the electrodes 41, 42, 51, and 52 of the Y capacitors 40 and 50 are oriented in the depth direction (Y direction). This arrangement allows the Y capacitors 40 and 50 to be easily connected to both the busbars 20 and 30 and the ground terminals 70 and 80. Note that the arrangement of the Y capacitors 40 and 50 is not limited to this and can be any arrangement.

[0038] The first Y capacitor 40 is, as shown in Figure 4A, a capacitor formed in the shape of a column with, for example, an oval end face. For the first Y capacitor 40, a capacitor such as a film capacitor or a ceramic capacitor can be used. Note that the first Y capacitor 40 is not limited to a capacitor formed in the shape of a column with an oval end face, but may be a capacitor of other shapes.

[0039] The second Y capacitor 50 has the same configuration as the first Y capacitor 40, as shown in Figure 4B, and is, for example, a capacitor formed in the shape of a column with an oval end face. For the second Y capacitor 50, for example, a film capacitor or a ceramic capacitor can be used. Note that the second Y capacitor 50 is not limited to a capacitor formed in the shape of a column with an oval end face, but may be a capacitor of other shapes.

[0040] The first Y capacitor 40 is placed in the first space S1 inside the case 60 shown in Figure 1B. Space S1 is the portion inside the case 60 enclosed by the first row 10a and the second row 10b of the capacitor elements 10 and the case 60.

[0041] The second Y capacitor 50 is placed in a second space S2 inside the case 60 shown in Figure 1B. Space S2 is the portion inside the case 60 enclosed by the first row 10a and the second row 10b of the capacitor elements 10 and the case 60.

[0042] By arranging the capacitor elements 10 in a staggered pattern inside the case 60, a first space S1 and a second space S2 are created. By placing the first Y capacitor 40 in the first space S1 and the second Y capacitor 50 in the second space S2, it becomes possible to place two Y capacitors without increasing the size of the case 60.

[0043] To be placed in the first space S1 and the second space S2, Y capacitors 40 and 50 are used that are different in size from capacitor elements 10. Specifically, as shown in Figures 1B, 3 to 4B, the width W2 of Y capacitors 40 and 50 is smaller than the width W1 of capacitor element 10, and the depth W4 of Y capacitors 40 and 50 is smaller than the depth W3 of capacitor element 10. Furthermore, as shown in Figures 3 to 4B, the height w6 of Y capacitors 40 and 50 is smaller than the height W5 of capacitor element 10. By making Y capacitors 40 and 50 smaller than capacitor elements 10, the Y capacitors 40 and 50 can be placed in dead space inside the case 60, effectively utilizing space and contributing to the miniaturization of the capacitor module 1.

[0044] In this embodiment, since multiple capacitor elements 10 are arranged in three rows, two spaces S1 and S2 are created. However, by arranging the capacitor elements 10 in four or more rows, even more spaces can be created. In addition to the Y capacitors 40 and 50, components such as coils and thermistors may be placed in these spaces. Since components can be placed in the dead space when arranging the capacitor elements 10, this contributes to miniaturizing the capacitor module 1.

[0045] As shown in Figure 1B, in this embodiment, the first ground terminal 70 is positioned adjacent to the first space S1 outside the case 60, and the second ground terminal 80 is positioned adjacent to the second space S2 outside the case 60. By arranging the first ground terminal 70 and the second ground terminal 80 in this manner, electrical connection with the Y capacitors 40 and 50 can be easily achieved. Furthermore, in this embodiment, the first ground terminal 70 and the second ground terminal 80 are positioned on two opposing sides. With this arrangement, the capacitor module 1 can be stably attached to an external device using the first ground terminal 70 and the second ground terminal 80.

[0046] Figure 5 is a circuit diagram showing the capacitor module 1 of Figure 1A. When the capacitor module 1 is connected to a power semiconductor, conducted noise is generated. Conducted noise includes normal mode noise and common mode noise. The capacitor element 10 can reduce normal mode noise. On the other hand, common mode noise cannot be reduced by the capacitor element 10. For this reason, as in this embodiment, common mode noise can be reduced by using Y capacitors 40 and 50 in the capacitor module 1. In this embodiment, since the capacitor element 10 that can reduce normal mode noise and the Y capacitors 40 and 50 that can reduce common mode noise are built into a single capacitor module 1, the capacitor module 1 can be made smaller.

[0047] Figure 6 is a circuit diagram showing a power conversion device in which the capacitor module 1 of Figure 1A is connected to a power semiconductor 91. The capacitor module 1 is electrically connected to the power semiconductor 91, constituting a power conversion device. The power semiconductor 91 is a semiconductor for controlling or converting power, and includes any power semiconductor such as a diode, transistor, or thyristor. In this embodiment, a motor 92 is connected to the power semiconductor 91. The power semiconductor 91 is prone to conducting noise due to its high frequency and high-speed switching. By using the capacitor module 1 of this embodiment, not only normal mode noise but also common mode noise can be reduced. Furthermore, using a miniaturized capacitor module 1 contributes to the miniaturization of the power conversion device.

[0048] [effect] According to the above-described embodiment, the following effects can be achieved.

[0049] The capacitor module 1 comprises a plurality of capacitor elements 10, a first bus bar 20, a second bus bar 30, a first Y capacitor 40, a second Y capacitor 50, and a case 60. Each of the plurality of capacitor elements 10 has a first electrode 11 on one end face and a second electrode 12 on the other end face. The first bus bar 20 is electrically connected to each of the first electrodes 11 of the plurality of capacitor elements 10. The second bus bar 30 is electrically connected to each of the second electrodes 12 of the plurality of capacitor elements 10. One electrode 41 of the first Y capacitor 40 is electrically connected to the first bus bar 20, and the other electrode 42 is electrically connected to the first ground terminal 70. One electrode 51 of the second Y capacitor 50 is electrically connected to the second bus bar 30, and the other electrode 52 is electrically connected to the second ground terminal 80. Case 60 houses a plurality of capacitor elements 10, a first bus bar 20, a second bus bar 30, a first Y capacitor 40, and a second Y capacitor 50. The plurality of capacitor elements 10 are arranged in multiple rows within case 60, including a first row 10a and a second row 10b, with the plurality of capacitor elements arranged in a staggered pattern within the first row 10a and the second row 10b. The first Y capacitor 40 is placed in a first space S1 enclosed by the first row 10a, the second row 10b, and case 60. The second Y capacitor 50 is placed in a second space S2 enclosed by the first row 10a, the second row 10b, and case 60.

[0050] This configuration makes it possible to provide a miniaturized capacitor module. By arranging multiple capacitor elements 10 in a staggered pattern, spaces S1 and S2 are formed within the case 60. By arranging Y capacitors 40 and 50 in spaces S1 and S2, it is possible to provide a capacitor module that incorporates Y capacitors 40 and 50 while miniaturizing the capacitor module 1.

[0051] The first ground terminal 70 is located outside the case 60, adjacent to the first space S1. The second ground terminal 80 is located outside the case 60, adjacent to the second space S2.

[0052] This configuration allows the Y capacitors 40 and 50 to be easily connected to the ground terminals 70 and 80.

[0053] The case 60 has two opposing sides in a plan view, and the first ground terminal 70 and the second ground terminal 80 are located on the two opposing sides of the case 60 in a plan view.

[0054] This configuration allows the capacitor module 1 to be stably fixed when attached to an external device using the ground terminals 70 and 80.

[0055] The first Y capacitor 40 and the second Y capacitor 50 are arranged in a different orientation from the other capacitor elements 10.

[0056] This configuration improves the design flexibility of the capacitor module 1.

[0057] The multiple capacitor elements 10 are composed of capacitors of different types from the first Y capacitor 40 and the second Y capacitor 50.

[0058] This configuration makes it possible to provide a capacitor module 1 that is miniaturized while incorporating multiple capacitors with different functions.

[0059] Mounting holes 71 and 81 are formed in the first ground terminal 70 and the second ground terminal 80, respectively.

[0060] This configuration allows the capacitor module 1 to be stably fixed to the external device.

[0061] The system further includes conductive connecting members that are inserted into the mounting holes 71 and 81 of the first ground terminal 70 and the second ground terminal 80.

[0062] This configuration ensures that the first ground terminal 70 and the second ground terminal 80 are reliably connected to the ground electrode of an external device, and that the capacitor module 1 can be fixed to the external device.

[0063] [Differentiation] In the embodiment described above, a capacitor module 1 including 11 capacitor elements 10 was described, but the invention is not limited to this. The number of capacitor elements 10 can be multiple, and the configuration can be such that the capacitor elements 10 are arranged in a staggered pattern in two or more rows.

[0064] Furthermore, although the above-described embodiment described an example in which the case 60 is formed in a rectangular shape in a plan view and has a cuboid shape, it is not limited to this. The case 60 may have any shape other than a cuboid.

[0065] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood as being included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0066] Furthermore, by appropriately combining any embodiment or modification from the various embodiments and modifications described above, the effects of each can be achieved.

[0067] (Summary of the embodiment) (1) The capacitor module of the present invention comprises a plurality of capacitor elements having a first electrode disposed on one end face and a second electrode disposed on the other end face; a first busbar electrically connected to the first electrode of each of the plurality of capacitor elements; a second busbar electrically connected to the second electrode of each of the plurality of capacitor elements; a first Y capacitor with one electrode electrically connected to the first busbar and the other electrode electrically connected to a first ground terminal; and a capacitor with one electrode electrically connected to the second busbar and the other electrode electrically connected to a second ground terminal. The device comprises a second Y capacitor, a plurality of capacitor elements, a first busbar, a second busbar, a first Y capacitor, and a case housing the second Y capacitor, wherein the plurality of capacitor elements are arranged in a plurality of rows within the case, including a first row and a second row, and the plurality of capacitor elements in the first row and the second row are arranged in a staggered pattern, the first Y capacitor is located in a first space enclosed by the first row, the second row and the case, and the second Y capacitor is located in a second space enclosed by the first row, the second row and the case.

[0068] (2) In the capacitor module of (1), the first ground terminal may be located outside the case adjacent to the first space, and the second ground terminal may be located outside the case adjacent to the second space.

[0069] (3) In the capacitor module of (1) or (2), the case may have two opposing sides in a plan view, and the first ground terminal and the second ground terminal may be located on the two opposing sides of the case in a plan view.

[0070] (4) In any one of the capacitor modules from (1) to (3), the first Y capacitor and the second Y capacitor may be arranged in a different orientation from the other capacitor elements.

[0071] (5) In any one of the capacitor modules from (1) to (4), the multiple capacitor elements may be composed of capacitors of different types from the first Y capacitor and the second Y capacitor.

[0072] (6) In any one of the capacitor modules from (1) to (5), mounting holes may be formed at the first ground terminal and the second ground terminal, respectively.

[0073] (7)(6) The capacitor module may further include conductive connecting members that are inserted into the mounting holes of the first ground terminal and the second ground terminal. [Industrial applicability]

[0074] This invention is useful for capacitor modules used in various electronic devices, electrical equipment, industrial equipment, vehicle equipment, etc. [Explanation of symbols]

[0075] 1 Capacitor module 10 Capacitor element 10a 1st row 10b 2nd row 10c 3rd row 11 1st electrode 12 2nd electrode 20 First Bus Bar 30 Second Bus Bar 40. First Y Capacitor 41 One electrode 42 The other electrode 50 Second Y Capacitor 51 One electrode 52 The other electrode 60 cases 70 First ground terminal 71 mounting holes 80 Second ground terminal 81 mounting holes

Claims

1. A plurality of capacitor elements having a first electrode disposed on one end face and a second electrode disposed on the other end face, A first busbar electrically connected to the first electrode of each of the plurality of capacitor elements, A second busbar electrically connected to the second electrode of each of the plurality of capacitor elements, A first Y capacitor, in which one electrode is electrically connected to the first busbar and the other electrode is electrically connected to the first ground terminal, A second Y capacitor, in which one electrode is electrically connected to the second busbar and the other electrode is electrically connected to the second ground terminal, A case housing the plurality of capacitor elements, the first busbar, the second busbar, the first Y capacitor, and the second Y capacitor, Equipped with, The plurality of capacitor elements are arranged in a plurality of rows, including a first row and a second row, within the case, and the first row and the second row are arranged such that the plurality of capacitor elements are arranged in a staggered pattern. The first Y capacitor is placed in a first space enclosed by the first row, the second row, and the case, and the second Y capacitor is placed in a second space enclosed by the first row, the second row, and the case. Capacitor module.

2. The first ground terminal is located outside the case, adjacent to the first space. The second ground terminal is located outside the case, adjacent to the second space. The capacitor module according to claim 1.

3. The aforementioned case has two opposing sides in a plan view, The first ground terminal and the second ground terminal are arranged on two opposing sides of the case in a plan view. The capacitor module according to claim 1.

4. The first Y capacitor and the second Y capacitor are arranged in a different orientation from the plurality of capacitor elements. The capacitor module according to claim 1.

5. The plurality of capacitor elements are composed of capacitors of a different type from the first Y capacitor and the second Y capacitor. The capacitor module according to claim 1.

6. Mounting holes are formed in each of the first and second ground terminals. The capacitor module according to claim 1.

7. The system further comprises a conductive connecting member inserted into the mounting holes of the first and second ground terminals. The capacitor module according to claim 6.