Positive-type photosensitive resin composition, organic EL element partition, organic EL element insulating film, and organic EL element

Abstract

To provide a positive-type photosensitive resin composition, an organic EL element partition, an organic EL element insulating film, and an organic EL element that exhibit excellent residue removal properties, low film loss, and enable the formation of fine holes without the use of organofluorine compounds. [Solution] A positive-type photosensitive resin composition is provided, containing a hydrophobic resin (A), a quinone diazide compound (C), and a silicone-based surfactant (D) having silicon atoms in its side chain.

Claims

1. Hydrophobic resin (A), Quinone diazide compound (C) and A silicone-based surfactant (D) having silicon atoms in its side chain and A positive-type photosensitive resin composition containing [the specified substance].

2. The content of component (D) in the total amount of surfactant is 50% by mass or more. The positive-type photosensitive resin composition according to claim 1.

3. It further contains a coloring agent (E) containing a black dye, The positive-type photosensitive resin composition according to claim 1 or 2.

4. The aforementioned component (A) includes a structural unit represented by the following formula (1): The positive-type photosensitive resin composition according to claim 1 or 2. 【Chemistry 1】 (In equation (1), R １ R is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. ２ is SiR ３ R ４ R ５ And R ３ , R ４ and R ５ Each of these is independently an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms, where r is an integer from 0 to 4, and s is an integer from 1 to 5, except that r+s is an integer from 1 to 5.

5. The above component (A) is a resin having a silicon atom-containing group. The positive-type photosensitive resin composition according to claim 1 or 2.

6. The above component (A) includes the following structural unit (1a) and / or structural unit (1b): The positive-type photosensitive resin composition according to claim 1 or 2. 【Chemistry 2】 (In formula (1a), R １ａ is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R ２ａ , R ３ａ , and R ４ａ are each independently an alkyl group having 1 to 7 carbon atoms. In formula (1b), R １ｂ is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. Note that R １ａ and R １ｂ may be the same or different.)

7. In the positive-type photosensitive resin composition, the content of component (A) is 5 to 60% by mass, based on the total mass of the resin components. The positive-type photosensitive resin composition according to claim 1 or 2.

8. The component (D) is a silicone-based surfactant comprising an acrylic copolymer having at least one silicon atom-containing hydrocarbon group selected from the group consisting of silicon atom-containing alkyl groups and silicon atom-containing alkylene groups. The positive-type photosensitive resin composition according to claim 1 or 2.

9. The aforementioned component (E) is present in an amount of 10 to 150 parts by mass per 100 parts by mass of the total resin components. The positive-type photosensitive resin composition according to claim 3.

10. The optical density (OD value) of the cured film of the positive-type photosensitive resin composition is 0.5 or more per 1 μm of film thickness. The positive-type photosensitive resin composition according to claim 1 or 2.

11. An organic EL element partition comprising a cured product of the positive-type photosensitive resin composition according to claim 1 or 2.

12. An insulating film for an organic EL element comprising a cured product of the positive-type photosensitive resin composition according to claim 1 or 2.

13. An organic EL element comprising a cured product of the positive-type photosensitive resin composition according to claim 1 or 2.

Images