electronic machinery

Abstract

To provide robust electronic equipment. Or, to provide reliable electronic equipment. Or , to provide novel electronic devices. [Solution] A first plate, a second plate, a flexible display unit, and a flexible energy storage unit It has a first plate and a second plate, which are arranged facing each other, and a display unit and a storage unit. The electrical device is sandwiched between a first plate and a second plate, and the display unit has a first surface facing the energy storage device. The first surface has a first region that is not fixed to the energy storage device, and the first region has a display unit. It is an electronic device that overlaps with the display area.

Description

[Technical Field]

[0001] Electronic devices, display devices, light-emitting devices, energy storage devices, methods for driving them, or methods for manufacturing them. Regarding the law.

[0002] In this specification, "electronic equipment" refers to all devices that operate by being supplied with electricity. electronic devices having a power source, electronic devices having, for example, a storage battery as a power source, and electro-optical devices. All information terminal devices with batteries are electronic devices. Furthermore, electronic devices are defined as devices that provide information. This refers to all processing equipment. However, one aspect of the present invention is not limited to the above-mentioned technical field. The technical field of one aspect of the invention disclosed in the specification, etc., relates to a product, method, or manufacturing method. Therefore, or, one aspect of the present invention relates to a process, machine, manufacture, or This concerns composition of matter. Therefore, more specifically... The technical fields of one aspect of the present invention disclosed herein include semiconductor devices, display devices, and liquid crystal displays. Display devices, light-emitting devices, illumination devices, energy storage devices, memory devices, imaging devices, methods for driving them, Their manufacturing methods can be cited as an example. [Background technology]

[0003] In recent years, display devices that are worn on the human body, such as display devices worn on the head, have been proposed. These are called head-mounted displays or wearable displays. They are worn on the human body. Electronic devices used in daily life, such as hearing aids, are in need of being lighter and smaller.

[0004] Furthermore, along with the reduction in the weight of electronic devices, the batteries contained within these devices are also being made lighter and smaller. Standardization is needed.

[0005] Furthermore, e-book terminals equipped with flexible display devices are described in Patent Documents 1 and 2. It is shown. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2010-282181 [Patent Document 2] Japanese Patent Publication No. 2010-282183 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] To ensure a comfortable fit for the user, the display device, which is worn on the human body, is designed to be lightweight. Furthermore, there is a demand for miniaturization, and the weight of the entire electronic device, including the drive unit and power supply of the display device, is also important. A transformation is required.

[0008] Furthermore, display devices that are worn on the human body, and electronic devices having such display devices, are not portable. It needs to be easy to clean and durable.

[0009] Furthermore, display devices used by being worn on the human body, and electronic devices having such display devices, Repeated attachment and detachment apply external forces such as bending, resulting in damage to the display and exterior parts. This may also cause damage to the built-in energy storage device, etc.

[0010] One aspect of the present invention aims to provide a robust electronic device. Alternatively, the present invention One aspect of this invention aims to provide highly reliable electronic equipment. One embodiment aims to provide a novel electronic device.

[0011] Alternatively, one aspect of the present invention aims to provide a robust display device. One aspect of the present invention aims to provide a highly reliable display device. One aspect of the present invention aims to provide a novel display device.

[0012] Alternatively, one aspect of the present invention aims to provide an electronic device that is worn on the body. One aspect of the present invention is to provide an electronic device that is worn on the arm. This will be one of the issues to address.

[0013] Alternatively, one aspect of the present invention aims to provide a display device that is worn on the body. One aspect of the present invention is to provide a display device that is worn on the arm. This will be one of the issues to address.

[0014] Alternatively, one aspect of the present invention provides an energy storage device that is attached to a part of the body for use. One of the issues is to provide an energy storage device that is worn on the arm. Alternatively, one aspect of the present invention provides an energy storage device for use on the arm. This will be one of the challenges.

[0015] Furthermore, the description of these problems does not preclude the existence of other problems. One approach does not require that all of these issues be resolved. The title will become clear from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the drawings, claims, etc. [Means for solving the problem]

[0016] One aspect of the present invention comprises a first plate, a second plate, a flexible display portion, and a flexible It has a power storage device, and the first plate and the second plate are arranged facing each other, and a display unit The energy storage device is sandwiched between the first plate and the second plate, and the display unit faces the first plate facing the energy storage device. The first surface has a first region that is not fixed to the energy storage device, and the first region is a display unit. It is an electronic device whose display area overlaps with that of the device.

[0017] Alternatively, one aspect of the present invention comprises a first plate, a second plate, a flexible display section, and a flexible The device has a power storage device, and the first plate and the second plate are arranged facing each other. The display unit and the energy storage device are sandwiched between the first plate and the second plate, between the display unit and the energy storage device. It is an electronic device that has space inside.

[0018] Alternatively, one aspect of the present invention comprises a first plate, a second plate, a flexible display section, and a flexible It has a power storage device having properties and an adhesive layer, and the display unit has a flexible circuit board, The first plate and the second plate are positioned facing each other, and the display unit and the energy storage device are located at the first Sandwiched between the first and second plates, the display unit is fixed to the first plate via an adhesive layer, and the power storage device However, a portion of it is in contact with the second plate, and the energy storage device has an electron region that is floating from the first plate. It is a device.

[0019] Alternatively, one aspect of the present invention comprises a first plate, a second plate, a flexible display section, and a flexible The device has a power storage device, and the first plate and the second plate are arranged facing each other. The display unit and the energy storage device are sandwiched between the first plate and the second plate, between the display unit and the energy storage device. It is an electronic device that has a component to absorb shock.

[0020] In the above configuration, it is preferable that the electronic device is in contact with the second plate and attached to the user's arm. .

[0021] Furthermore, in the above configuration, the display unit has a first end and a second end, and the energy storage device It has a third end and a fourth end, the first end and the third end are fixed, and the second The distance between the end and the fourth end preferably changes as the electronic device deforms.

[0022] Alternatively, one aspect of the present invention comprises a first flexible housing and a second flexible housing. It has a flexible display unit and a flexible energy storage device, and the first housing is light-transmitting The first surface has a first surface and the display unit is located inside the first housing, and the display unit has a first surface and Having a contact area, the energy storage device is an electronic device located inside the second enclosure. In this configuration, it is preferable that the electronic device be attached to the user's arm in contact with the second housing. [Effects of the Invention]

[0023] According to one aspect of the present invention, a robust electronic device can be provided. In this way, highly reliable electronic devices can be provided. Furthermore, according to one aspect of the present invention This allows us to provide novel electronic devices.

[0024] Furthermore, according to one aspect of the present invention, a robust display device can be provided. According to one aspect of the present invention, a highly reliable display device can be provided. This makes it possible to provide a novel display device.

[0025] Furthermore, according to one aspect of the present invention, an electronic device to be worn on a part of the body is provided. This is possible. Furthermore, according to one aspect of the present invention, an electronic device to be worn on the arm is provided. It is possible.

[0026] Furthermore, according to one aspect of the present invention, to provide an energy storage device that is attached to a part of the body for use. This is possible. Furthermore, according to one aspect of the present invention, a power storage device to be worn on the arm is provided. It is possible.

[0027] Alternatively, according to one aspect of the present invention, a display device that is worn on the body can be provided. To be able to. Or, according to one aspect of the present invention, to provide a display device that is worn on the arm for use. can.

[0028] Furthermore, the description of these effects does not preclude the existence of other effects. One embodiment does not necessarily have to possess all of these effects. Furthermore, other effects may be considered. This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings It is possible to extract effects other than those mentioned above from the descriptions in the surfaces, claims, etc. [Brief explanation of the drawing]

[0029] [Figure 1] A perspective view showing an electronic device according to one embodiment of the present invention. [Figure 2] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 3] A perspective view and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 4] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 5] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 6] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 7] A diagram showing an electronic device according to one aspect of the present invention. [Figure 8] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 9] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 10]A diagram showing the external appearance of a slim battery. [Figure 11] A diagram showing a cross-section of a thin-type rechargeable battery. [Figure 12] A perspective view showing an electronic device according to one aspect of the present invention. [Figure 13] A diagram illustrating the method for manufacturing a thin, rechargeable battery. [Figure 14] A diagram illustrating the method for manufacturing a thin, rechargeable battery. [Figure 15] A diagram showing the external appearance of a slim battery. [Figure 16] A diagram illustrating the radius of curvature of a surface. [Figure 17] A diagram illustrating the radius of curvature of film. [Figure 18] A diagram illustrating a coin-type rechargeable battery. [Figure 19] A diagram showing a cross-section of a thin-type rechargeable battery. [Figure 20] A diagram showing the top surface of the display device. [Figure 21] A diagram showing a cross-section of a display device. [Figure 22] A diagram showing a cross-section of a display device. [Figure 23] A diagram showing a cross-section of a display device. [Figure 24] A diagram showing a cross-section of a display device. [Figure 25] A diagram showing a cross-section of a display device. [Figure 26] A figure showing an electronic device according to one aspect of the present invention. [Figure 27] A schematic cross-sectional diagram illustrating the principle of film formation. [Figure 28] A diagram illustrating the configuration of a film deposition apparatus according to an embodiment. [Modes for carrying out the invention]

[0030] The embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention This is not limited to the description below, and its form and details can be changed in various ways, as is the case for those skilled in the art. This will be easily understood. Furthermore, the present invention shall be interpreted as being limited to the contents of the embodiments described below. It is not something that should be done.

[0031] In this specification, a connector, for example, FPC (F) is used for the display panel (display device). (lexible printed circuit) or TCP (Tape Car A module with a rier package attached, and a printed circuit board at the end of the TCP. A module equipped with COG (Chip On) or a substrate on which display elements are formed. Modules in which ICs (integrated circuits) are directly mounted using the glass method are included in the display device. It may occur.

[0032] Furthermore, in this specification, "parallel" means that two lines are at an angle of -10° or more and 10° or less. This refers to a state in which the elements are positioned. Therefore, it also includes cases where the angle is between -5° and 5°. "Approximately parallel" means that two lines are positioned at an angle of -30° or more and 30° or less. Furthermore, "perpendicular" means that two lines are positioned at an angle of 80° to 100°. This refers to a state where the angle is perpendicular. Therefore, it also includes cases where the angle is between 85° and 95°. It also refers to "approximately perpendicular." This refers to a state in which two straight lines are positioned at an angle between 60° and 120°.

[0033] Furthermore, in this specification, if the crystal is trigonal or rhombohedral, it is listed as hexagonal. vinegar.

[0034] An electronic device according to one aspect of the present invention is a semiconductor device, a display device, a liquid crystal display device, a light-emitting device, and a lighting device. It is preferable to have a device, energy storage device, memory device, imaging device, etc.

[0035] (Embodiment 1) This embodiment shows an example of an electronic device 100 that can be attached to a part of the body.

[0036] <Examples of 100 electronic devices> Figure 1 shows an example of a perspective view of the electronic device 100.

[0037] The electronic device 100 shown in Figure 1 includes a display unit 102, a plate 112, and at least one of the plates 112. It has a power storage device 103 that is in contact with the part. The power storage device 103 has a large radius of curvature of the plate 112 It is preferable to arrange them along the region. In the electronic device 100 shown in Figure 1, the energy storage device The base 103 and the display unit 102 are arranged so that at least a portion of them overlap each other. This arrangement allows for greater flexibility in the internal layout.

[0038] Furthermore, it is preferable that the display unit 102 has a circuit board 104. Also, electronic device 10 0 may have a circuit board 107. The circuit board 107 is connected to the energy storage device 103 and the circuit board It is preferable to electrically connect the board 104. Also, the circuit board 107 is, for example, a display unit. It may have a drive circuit for driving 102. Also, the circuit board 107 may have an energy storage device It is preferable that a converter circuit for supplying power from is provided. Here, the display unit 102 The circuit board 107 and the display module together are sometimes referred to as a display module.

[0039] Furthermore, it is preferable that the electronic device 100 has a plate 111. If 1 is present, then plate 111 and plate 112 are fixed to each other by fastener 131. Preferably. Here, the fastener 131 may be in the shape of a band, as shown in Figure 1, or, It may also be screw-shaped. For example, screw holes can be made in plate 111 and plate 112, and a screw-shaped fastener 131 can be used. It can be fixed in place.

[0040] Alternatively, plates 111 and 112 may be fixed by crimping. For example, electronic device 1 00 provides holes in plates 111 and 112, inserts fasteners 131 into the holes, and then fastens The fastener 131 may be deformed (crimped) to secure it. Examples of such fasteners 131 For example, rivets can be used.

[0041] For the fastener 131, materials such as metal, ceramics, or resin can be used. As for the metal, it is preferable to use a material that is resistant to rust by forming a passivation, for example. For example, stainless steel, magnesium, aluminum, titanium, etc., can be used.

[0042] Figure 2(A) shows a cross-sectional view of the electronic device 100 shown in Figure 1. Also, the dashed line shown in Figure 2(A) Figure 2(B) shows a cross-section including AB, which is approximately perpendicular to the cross-section in Figure 2(A). Note that the figure is not suitable for viewing. To reduce the scale, Figure 2(B) is shown at a larger scale than Figure 2(A).

[0043] The display unit 102 preferably has a display element 152 and a circuit unit 153 on the board 151. Here, the circuit section 153 preferably has a drive circuit for driving the display element 152. It is preferable that the circuit board 104 be connected to the circuit section 153, etc. 104 may have a drive circuit for driving the display element 152.

[0044] Here, the display area of ​​the display unit 102 is, for example, the area where the display element 152 is provided. It may also refer to a region. In addition, in electronic device 100, the surface on which images, text information, etc. are displayed. , may also refer to the area where the display element 152 is provided, for example, plate 111 A light-shielding plate is provided on the front or back surface, and a portion of the area where the display element is provided is shielded from light, and the display area The shape can be changed. Also, in the example shown in Figure 1, a display element 152 is provided. The area is roughly rectangular, but the area where the display elements are provided is not limited to a rectangular shape.

[0045] Furthermore, it is preferable that the plate 151 is flexible. For example, the display unit 102 can be flexible.

[0046] Examples of the plate 151 include plastic substrates. Also, flexible substrates may be used. The board may be used by attaching it to a board or the like. By using a flexible board 151, A flexible display device can be made. Because the display device is flexible, curved surfaces can be made. It can be bonded to irregular shapes, enabling a wide variety of applications. For example, By using a flexible plate 151 such as a plastic substrate, the thinning of the display device and Furthermore, weight reduction becomes possible. Also, for example, a flexible plate 151 such as a plastic substrate The display device used is less prone to breakage, and its durability against impacts such as drops can be improved. ru.

[0047] Here, the electronic device 100 can be attached to the arm or other part of the human body. When attaching it to the arm or other part of the human body, the plate 112 comes into contact with the attachment site.

[0048] The plate 112 is preferably shaped to conform to the arm, for example. Also, the electronic device 100 is a robot It can be attached to the arm of a robot, etc. Here, as an example of a robot, it can be attached to a work robot or device. Examples include accompanying robots, humanoid robots, etc.

[0049] Furthermore, it is preferable that the plate 112 has a rounded shape. Alternatively, the plate 112 may be curved. It may have a surface and a flat surface. The plate 112 may have a shape that conforms to a curved surface, for example. This is preferable. Furthermore, it is preferable that the plate 112 has a shape that follows the side surface of the elliptical cylinder, for example. Also, for example, arch shapes, shapes like the letter "C", elliptical shapes, It may have a shape in which part of it is like an ellipse that has been partially cut off. The shape improves the ease of attachment to the body, such as the arm. The electronic device 100 can cover the arm. Also, the plate 112 has a cross-sectional shape along three sides of a rectangle. It may have a form.

[0050] The plate 112 may have a shape that follows the shape of a cylindrical body, for example. Alternatively, the plate 112 may be a cylinder. It may have a shape that follows an elliptical prism or a rectangular prism. Alternatively, the plate 112 may have a shape that follows a cone or pyramid. It may have a certain shape.

[0051] Furthermore, it is preferable that the plate 112 has the function of being attached to a cylindrical body. Here is an example of a cylindrical body. Examples include columnar or conical shapes, or cylinders whose side orientation changes continuously. ru.

[0052] Furthermore, when attaching the electronic device 100 to the arm or other part of the human body, external force is applied to the electronic device 100. It may deform. For example, when attaching it, the plate 11 may deform in the direction of arrow 105 shown in Figure 2(A). The ease of attachment can be improved by deforming the second part. Therefore, plate 112 is flexible. It is preferable that it has properties.

[0053] Furthermore, deformation of the plate 112 may also cause deformation of other parts of the electronic device 100. Therefore, it is preferable that other parts of the electronic device 100 also have flexibility. For example, it is preferable that the display unit 102 be flexible. Also, the plate 111 and the power storage device It is preferable that the plate 103 also has flexibility. Here, if the plate 111 is made of film or the like That's fine.

[0054] As an external force is applied to the electronic device 100, the electronic device 100 deforms. As 00 deforms, the energy storage device 103 also deforms.

[0055] Here, the amount of change in deformation of the energy storage device 103 due to the external force applied to the electronic device 100 is, It is preferable that the force be maintained while force is applied. For example, when the electronic device 100 is attached to the arm, etc. The amount of change in deformation of the energy storage device 103 due to this is preferably maintained while it is installed. The energy storage device 103 maintains a smaller change in deformation. It is suitable for mounting on electronic equipment 100 having a radius of curvature. Also suitable for movable electronic equipment 1 Suitable for 00. Also, by maintaining the change in the energy storage device 103, the electronic device 1 The shape of 00 can conform to the area where it is attached.

[0056] Here, for example, if the elastic force of the energy storage device 103 is large, the deformation of the electronic device 100 will be Consequently, the energy storage device 103 may temporarily deform, but then attempt to return to its original shape. In other words, the amount of change in deformation of the energy storage device 103 from its original shape decreases over time. This can happen. Here, when the energy storage device 103 tries to return to its original shape, for example, electronic Distortion may occur in other parts of the device 100.

[0057] Furthermore, the electronic device 100 may have a sealing portion 121 as shown in Figure 2(C). Figure 2 (C) shows an example in which a sealing portion 121 is provided to the electronic device 100 shown in Figure 2(B). Sealing portion 1 By providing 21, the housing is composed of plate 111, plate 112, and sealing portion 121. In some cases, the airtightness can be further improved. Also, when plate 111 and plate 112 deform due to external force In this case, the sealing portion 121 mitigates deformation due to external force and maintains the overall structure of the electronic device 100. It can be done.

[0058] The sealing portion 121 can be made of, for example, a resin. For example, an elastomer can be used as the resin. — can be used.

[0059] Figure 2(D) also shows another example in which the electronic device 100 has a sealing portion 121. The cross-section of the electronic device 100 shown in D) has a different shape of plate 111 compared to Figure 2(B). The difference is that it has a sealing portion 121. Here, in the cross-section shown in Figure 2(D) The plate 111 has an end face that is bent in an L shape. The electronic device 100 has an end face that is bent in an L shape. The housing is composed of a curved plate 111, a sealing portion 121, and a plate 112.

[0060] The sum of the thickness of the display element 152 of the display unit 102 and the thickness of the plate 151 is preferably 1 μm or less. The thickness is 1 mm or less, more preferably 5 μm to 200 μm. Also, the energy storage device 103 The thickness is, for example, 50 μm or more and 30 mm or less, and is thicker than the thickness of the display element. There is.

[0061] When an external force is applied to objects of different thicknesses, the way each object bends in response to the external force will differ. Specifically, the degree of change in the radius of curvature may differ. Here, the change in the radius of curvature The degree refers to, for example, the amount of change in deformation due to the application of an external force, the change in that amount over time, and This refers to the response speed to changes, etc.

[0062] Therefore, in regions where two objects of different thicknesses are fixed to each other, when an external force is applied... This can cause distortion in one of the objects, potentially leading to cracks or breakage. A defined region is a region that has a state such as the surfaces of two objects touching being bonded together. It refers to.

[0063] Here, when the electronic device 100 is attached to the arm or the like, an external force is applied to the electronic device 100 and it deforms. Let's consider the case where the display unit 102 and the energy storage device 103 are fixed to each other. It is preferable to have an undefined region.

[0064] Therefore, it is preferable to have a space between the energy storage device 103 and the display unit 102. Alternatively, the power storage device 103 and the display unit 102 have a material that can be deformed or flowed between them. It is preferable to have a liquid such as water or a gel-like substance. Alternatively, Part 102 preferably has an area that is not in contact with the energy storage device 103. In particular, the display element It is preferable that the area containing the child is not bonded to the energy storage device 103. Alternatively, the display unit 10 It is preferable that component 2 has a region that is separated from the energy storage device 103. This improves the reliability of the display unit 102 and the energy storage device 103. This configuration suppresses distortion in the display unit 102 and the energy storage device 103. This is possible. Furthermore, with this configuration, the display unit 102 and the energy storage device 10 This can prevent cracks and damage from occurring in part 3.

[0065] Alternatively, the energy storage device 103 and the display unit 102 have surfaces that are in contact with each other, and are in contact with each other. It is preferable that the surfaces to be used together are slippery.

[0066] Alternatively, the display unit 102 has a first surface facing the energy storage device 103, and the first surface is the energy storage device It is preferable that the device 103 has a first region that is not fixed to it. Furthermore, the first region is a table It is preferable that the display element 152 of the display unit 102 overlaps with it.

[0067] The display unit 102 and the energy storage device 103 preferably have a first area that is not fixed. Furthermore, the display unit 102 and the energy storage device 103 are located in a first area that is not fixed, and at one location. It may have two or more fixed areas. For example, the display unit 102 and the energy storage device 10 3 may be fixed at one point on the end, or at one point on the end and at two or more points on other areas. The display unit 102 and the energy storage device 103 may be fixed together using, for example, an adhesive layer. This is possible. Alternatively, the display unit 102 and the energy storage device 103 can be made of a buffer material or a porous material. It may be fixed via a means or other means.

[0068] Alternatively, as shown in Figure 2(A), the display unit 102 has an end 171 and an end 172, The energy storage device 103 has end 173 and end 174, and end 171 and end 173 are circuit base It is preferable that the end 172 and end 174 are not fixed to each other, while being fixed to the plate 107.

[0069] Alternatively, the energy storage device 103 and the display unit 102 are in contact with each other, and the surfaces that are in contact with each other are... It is preferable that it be slippery.

[0070] By making the surfaces of the energy storage device 103 and the display unit 102 that come into contact with each other more slippery, Furthermore, the external force received by either the energy storage device 103 or the display unit 102 is less likely to be transmitted to the other. This can be done. By reducing the influence of external forces on each other, deformation such as distortion can be prevented. It is possible.

[0071] Furthermore, the outer casing of the energy storage device 103 and the film on which the display elements are provided in the display unit 102 The components may be made of different materials. In such cases, the energy storage device 103 and The way the display unit 102 bends in response to external forces, specifically the degree of change in the radius of curvature, etc., differs. This can happen. The way it bends in response to external forces, specifically the degree of change in the radius of curvature, may differ. In addition, distortion occurs in either the outer casing of the energy storage device 103 or the display unit 102, or both. This can happen. In particular, the display unit 102 is thin and therefore more susceptible to distortion.

[0072] Furthermore, if the electronic device 100 falls or collides with an object, the electronic device 100 Impact may be applied to each of its parts.

[0073] Even in such cases, having a space between the energy storage device 103 and the display unit 102 allows Because it can absorb impact, it can weaken the impact applied from the outside. As an example, consider the case where electronic device 100 collides with an object, and plate 111 comes into contact with the object. In such cases, the impact received by the plate 111 is transmitted to the energy storage device 103 and the circuit board 107. It is not transmitted directly, and the impact can be weakened.

[0074] For example, a flexible circuit board can be used as the circuit board 104. As a circuit board having a flexible resin film on which wiring is provided, FPC (flexible printed circuit board) Flexible Printed Circuits It is preferable to have it. By using an FPC as the circuit board 104, the electronic device 100 It can deform in accordance with the deformation when attaching it, and when the electronic device 100 deforms, for example The connection between circuit board 104 and circuit section 153, etc., and between circuit board 104 and circuit board 107. This prevents cracks from forming and causing damage to the circuit board 104, etc., at the connection point.

[0075] Here, in the electronic device 100, at least a part of the display unit 102 is in contact with the plate 111. Alternatively, in the electronic device 100, between the display unit 102 and the board 111, An adhesive layer or a layer having a touch sensor may be provided. An example of a layer having an adhesive layer is, for example Alternatively, an adhesive sheet may be attached to the board 111, and the display unit 102 may be attached to the sheet. The board 111 may also have a touch sensor. At least a part of the display unit 102 is the board 111. When in contact with the inner surface, the display unit 102 is flexible, and the shape of the display unit 102 This makes it easy to match the shape to the shape of the inner surface of the plate 111. Also, the plate 111 changes due to external force. Even when the display unit 102 is being modified, deterioration and damage to the display unit 102 can be prevented.

[0076] The surfaces of plate 111 and plate 112 preferably have curved surfaces. 112 preferably has a circular or arc-shaped cross-section.

[0077] Alternatively, when attaching or detaching the electronic device 100, the cross-sectional shape of plate 111 or plate 112 It is preferable that the region with a large radius of curvature hardly deforms, while the ends bend. For example, an arch shape, a shape like the letter "C", an ellipse, or an ellipse. It is preferable that it has a shape that looks like it is partially cut off. This improves the ease of attachment to the body, such as the arm. For example, when attaching it to the arm, the shape of the arm... The electronic device 100 can cover the arm accordingly. Note that the cross-section of plate 111 and plate 112 It may have a rectangular shape, such as a U-shape.

[0078] Preferably, at least a portion of the plate 111 is translucent. glass, quartz, plastic, flexible sheet, resin-based laminated film, fibrous Examples include paper or base film containing the material. An example of glass is barium broom. Examples include bisulfite glass, aluminoborsilicate glass, or soda-lime glass. Flexible Examples of substrates, laminated films, and base films include the following: For example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) ), polyethersulfone (PES), and polytetrafluoroethylene (PTFE) are used as substitutes. There are plastics that are represented. Or, for example, synthetic resins such as acrylic. Alternatively, as an example, polypropylene, polyester, polyvinyl fluoride, or poly Examples include polyvinyl chloride. Alternatively, one example is polyamide (such as aramid), polyimi Examples include epoxy or inorganic vapor-deposited films.

[0079] Furthermore, the plate 111 has a first region that is light-transmitting and a second region that is semi-transparent or light-shielding. It may have two regions and . In the example of the electronic device 100 shown in Figure 3(A), the board 111 is It has a light-transmitting region 164 and a light-shielding region 165.

[0080] The material shown for plate 111 can be used for plate 112. Stainless steel, stainless steel foil plate, tungsten, tungsten Even when using plates, papers, or semiconductors (e.g., single crystals or silicon) containing 10 foil, good.

[0081] Furthermore, for example, a material with higher rigidity than plate 111 may be used for plate 112. Stainless steel material may be used for plate 112. By using stainless steel material, the display part 1 To prevent 02 and the energy storage device 103 from warping excessively or from undergoing large torsional deformation It serves as a protective material. Furthermore, it is reliable that the deformation when worn on the arm is constant, i.e., it bends in one direction. This will lead to improved reliability.

[0082] Furthermore, as shown in Figures 2(A) and 2(B), the edges of plate 111 and plate 112 are rounded. It may be possible to have a rounded shape, which may improve the fit.

[0083] Figure 3(B) shows an enlarged view of the area C enclosed by the dashed line in Figure 2(A). Here, display unit 1 The end of the plate 151 of 02 and the end of the energy storage device 103 are not fixed to each other. When the device 100 is attached to the arm or the like, the plate 112 deforms in the direction of the arrow 105 shown in Figure 2(A). Consequently, the electronic device 100 also deforms. At this time, the end of the plate 151 and the energy storage device 10 Since the ends of 3 are not fixed to each other, the end of the plate 151 and the end of the energy storage device 103 The distance 163 may change as the electronic device 100 deforms.

[0084] On the other hand, if the display unit 102 and the energy storage device 103 are fixed together, the distance 163 is electronic In some cases, the deformation of the device 100 may not result in any change. For example, the end of the plate 151 and the energy storage device. If the ends of 103 and the other are fixed to each other, damage may occur to the display unit 102 or the power storage device 103. Except in cases where damage occurs or expansion / contraction due to temperature changes occurs, the electronic device 100 will not deform. Even so, the distance of 163 remains unchanged.

[0085] Furthermore, as shown in Figure 4, the electronic device 100 is located between the display unit 102 and the energy storage device 103. It may also have a plate 113. Figure 4 differs from Figure 1 in that it has a plate 113.

[0086] By having a plate 113 between the energy storage device 103 and the display unit 102, the energy storage device 1 It is preferable because it makes it difficult for an external force received by either 03 or the display unit 102 to be transmitted to the other. It seems so.

[0087] The material shown for plate 112 can be used for plate 113. For example, flexible boards, resin-based laminated films, base films, etc., may be used. stomach.

[0088] Figure 4(A) shows a cross-section of the electronic device 100, and Figure 4(B) shows the same point chain as in Figure 4(A). Figure 4(C) shows a cross-section passing through line AB and approximately perpendicular to the cross-section in Figure 4(A). The dashed line shows an enlarged view of area D. As shown in Figure 4(C), the plate 113 is the display unit and It has two opposing first surfaces, the first surfaces having a region 161 that overlaps with the display element 152.

[0089] For example, the plate 113 has a first surface that faces the plate 151 of the display unit 102, The first surface may have a region 161 that faces the display element 152 via the plate 151.

[0090] Now, let's consider the case where region 161 is fixed to the display unit 102. In this case, plate 11 In 3, the area 162 on the back side of area 161 is made up of plate 112, energy storage device 103, etc. Other parts of the electronic device 100, excluding the display unit 102 and the plate 111, are fixed together. It is preferable that it is not fixed. Here, "fixed" means, for example, being glued or fastened with screws or the like. This refers to things being secured by fasteners or other means.

[0091] Alternatively, for example, area 162 may contain electronic equipment 100 such as the energy storage device 103 or the board 112. If it is fixed to other parts, excluding the display unit 102 and the plate 111, then the area It is preferable that 161 is not fixed to the display unit 102.

[0092] Alternatively, the plate 113 does not need to be fixed to either the display unit 102 or the energy storage device 103. stomach.

[0093] Furthermore, the plate 113 has an area that is not fixed to the display unit 102 and one or more fixed areas. It may have a region. Also, for example, the display unit 102 and the energy storage device 103 are connected via a plate 113. It may have a region to which it is fixed.

[0094] In the cross-section shown in Figure 4(C), region 161 is the region facing the center of the display unit 102. As an example, region 161 may be located broadly in an area that overlaps with the display element 152.

[0095] Alternatively, the plate 113 and the energy storage device 103 have surfaces that are in contact with each other, and are in contact with each other It is preferable that the surfaces are slippery to each other. Alternatively, the plate 113 and the display unit 102 are in contact with each other. It is preferable that the surfaces have a sliding surface and that the surfaces in contact with each other are slippery. "Slippery" refers to, for example, a low coefficient of friction. Alternatively, "slippery" refers to, for example, a surface with a low coefficient of friction. This refers to a small convex shape.

[0096] A cushioning material may be used as the plate 113. Here, as the cushioning material, for example, a material having air bubbles. Materials may be used. Figure 5 shows a so-called bubble wrap (air cushion) as the plate 113. An example of its use is shown. Alternatively, a porous material may be used as plate 113.

[0097] Figure 6 also shows an example in which the electronic device 100 has two housings. Figure 6(A) shows the electronic device Figure 6(B) shows a cross-section of container 100, specifically the section indicated by the dashed line AB in Figure 6(A). Figure 6 shows that the electronic device 100 has a first housing consisting of a plate 111, a plate 112, and a sealing part 121 An example is shown in which the enclosure consists of the above components and a second enclosure, the enclosure 126 shown in Figure 6. The electronic device 100 has a display unit 102 and a circuit board 107 inside the first housing. Furthermore, the housing 126 has an energy storage device 103 inside.

[0098] The housing 126 is preferably flexible. The housing 126 is integral as shown in Figure 6. The housing may be formed by fixing two or more parts together with screws or the like. Body 126 can be made of the same material as, for example, the sealing portion 121.

[0099] For example, the housing 126 is fixed to the first housing near its end by fasteners 131. This is preferable. In the example shown in Figure 6, the housing 126 is fastened with fasteners 131 near the end of the plate 112 It is fixed to the side.

[0100] It is preferable that the housing 126 is in contact with at least a portion of one surface of the plate 112. The housing 126 may be bonded to one side of the plate 112.

[0101] Alternatively, the housing 126 may have a first area fixed to the first housing and a second area that is not fixed. It may have a region. The way the plate 112 and the housing 126 bend in response to external forces, specifically If the degree of change in the radius of curvature etc. is different, it will have a second region that is not fixed. This makes it possible to mitigate the effects of external forces in that region.

[0102] Furthermore, the housing 126 may have a space between it and the plate 112 of the first housing.

[0103] <Example of mounting electronic device 100> Figure 7 shows an example of how the electronic device 100 is worn. Figure 7(A) shows the electronic device 100 on the arm (wrist). An example of attachment is shown. Figure 7(B) shows an example of attaching the electronic device 100 to the upper part of the arm. Figure 7(C) shows an example of an electronic device 100, which is an armband-type device.

[0104] Furthermore, the electronic device 100 may be attached to a part of the body other than the arm, such as the leg or fingers. The electronic device 100 may be fixed to the arm, leg, etc., using, for example, a belt. Depending on the size of the part of the body to which it is worn, for example, the circumference of the arm, the electronic device 100 may wrap around the arm more than once. It may cover the outer circumference of the cross-section of the arm. For example, in the cross-section shown in Figure 2(A), the plate 1 If the 12th is long, then in the remaining area, there is a region where the plates 112 overlap twice. In this region, there may be a region where plate 112 is in contact with the surface of plate 111. .

[0105] Furthermore, the electronic device 100 has a display area that is long in the direction along the arm, as shown in Figure 26. This is also acceptable. In Figure 26, the length of the display area of ​​the electronic device 100 in the direction along the arm is By making the width of the cross-section of the arm 1 or more, preferably 1.5 or more, the electronic device The device 100 can have a wider display area. On the other hand, the direction along the arm of the display area If the length is less than 1x the width of the arm's cross-section, then lighter and easier-to-wear electronic devices are preferable. It can be set to 100.

[0106] <Variations of Electronic Device 100> Furthermore, as shown in the example of the electronic device 100 in Figure 8(A), there is a display unit 102 and a power storage device 103 They may be arranged side by side. Figure 8(A) shows that, compared to Figure 2, the energy storage device 103 is located next to the display unit 102. The difference is that they are installed side by side. By installing the energy storage device 103 and the display unit 102 side by side... For example, electronic devices 100 can be made thinner. By making them thinner, the ease of attachment is improved. It may happen.

[0107] Furthermore, as shown in the example of the electronic device 100 in Figure 8(B), the cross-sections of the plate 111 and plate 112 are It may have a ring shape.

[0108] Furthermore, as shown in the example of the electronic device 100 in Figure 9, the electronic device 100 is connected to the energy storage device 103, It may also have a power storage device 106. Here, the power storage device 103 is flexible. Preferred. As the energy storage device 103, for example, a thin storage device using a laminate film for the outer casing. Batteries can be used. Also, the energy storage device 106 does not need to be flexible. The electrical device 106 may have a different shape from the energy storage device 103. For example, the energy storage device 106 and Then, coin-type (or button-type) rechargeable batteries, rectangular rechargeable batteries, cylindrical rechargeable batteries, etc. are used. This is possible. The energy storage device 106 can, for example, when the electronic device 100 has memory, It can be used as a storage battery for data retention. In addition, the energy storage device 106 can be used, for example, to store It can be used as a backup battery for the electrical device 103. For coin-type batteries... Refer to Embodiment 3.

[0109] The electronic device 100 shown in Figures 1 to 9 has, for example, a cross-section of a plate 112 with a radius of curvature of 1 It is preferable to set it to 0 mm or more, more preferably 5 mm or more. Also, the electronics shown in Figures 1 to 9 In order to make the device 100 easy to wear on the arm, for example, in the cross-section of the plate 112, the curvature The radius is preferably 20 mm or more, and more preferably 15 mm or more.

[0110] Furthermore, the electronic device 100 is preferably shaped to enclose more than half of the cross-section of the arm. It's nice.

[0111] <Energy storage device> The energy storage device 103 preferably has a curved shape. This allows the energy storage device 103 to be installed in the region of the plate 111 where the radius of curvature is large. Preferably, the energy storage device 103 is flexible. A flexible energy storage device is enclosed in an outer shell. The body is a thin and flexible film, and the curved surface portion of the plate 111 in the region with a large radius of curvature It can be deformed to follow the movement. Also, when an external force is applied to the electronic device 100, for example For example, when the electronic device 100 is attached to the arm, the plate 112 deforms in accordance with the deformation of the plate 112. It is possible.

[0112] Here, a secondary battery, a capacitor, or the like can be used as the energy storage device 103.

[0113] A lithium-ion secondary battery can be used as the secondary battery. Alternatively, lithium-ion batteries can be used. External alkali metals (for example, sodium and potassium, etc.) and alkaline earth metals (for example, Secondary batteries containing calcium, strontium, barium, beryllium, magnesium, etc. A pond may be used. Alternatively, an air-based secondary battery can be used, which uses oxygen from the air as the active material. You may use [this]. As a secondary air battery, you may use, for example, a lithium-air battery.

[0114] An electric double-layer capacitor can be used as the capacitor. Alternatively, a capacitor A redox capacitor can be used as a capacitor. Alternatively, lithium Hybrid capacitors, such as ion capacitors, may also be used.

[0115] In this embodiment, the flexible energy storage device 103 is provided with an outer casing made of film. An example using the thin secondary battery is shown. Figure 10 shows the external view of the thin secondary battery. The cross-sections cut along the dashed lines A1-A2 and B1-B2 in Figure 10 are shown in Figure 11(A), respectively. And as shown in Figure 11(B).

[0116] The thin rechargeable battery consists of a sheet-shaped positive electrode 203, a sheet-shaped negative electrode 206, and a separator 2 07, electrolyte 208, outer casing 209 made of film, positive lead electrode 510, It has a negative electrode lead electrode 511 and a positive electrode 203 and a negative electrode 20 provided inside the outer casing 209. A separator 207 is installed between 6 and 6. Also, the inside of the outer casing 209 contains electrolyte 208 It is injected. The positive electrode 203 has a positive electrode current collector 201 and a positive electrode active material layer 202. The negative electrode 206 has a negative electrode current collector 204 and a negative electrode active material layer 205.

[0117] In addition, FIG. 19 shows another example of the cross section of the chain line A1 - A2 in FIG. 10. In FIG. 19, an example is shown in which the positive electrode 203 has a positive electrode active material layer 202 only on one side of the positive electrode current collector 201. Similarly, an example is shown in which the negative electrode 206 has a negative electrode active material layer 205 only on one side of the negative electrode current collector 204.

[0118] As materials for the positive electrode current collector 201 and the negative electrode current collector 204, metals such as stainless steel, gold, platinum, lead, iron, nickel, copper, aluminum, titanium, tantalum, etc., and alloys thereof can be used. Materials with high conductivity and that do not alloy with carrier ions such as lithium can be used. In addition, an aluminum alloy added with elements such as silicon, titanium, neodymium, scandium, molybdenum, etc., which improve heat resistance, can be used. Also, it may be formed of a metal element that reacts with silicon to form a silicide. Metal elements that react with silicon to form a silicide include zirconium, titanium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, cobalt, nickel, etc. The positive electrode current collector 201 and the negative electrode current collector 204 can appropriately use shapes such as foil - shaped, plate - shaped (sheet - shaped), net - shaped, cylindrical, coil - shaped, punching metal - shaped, expanded metal - shaped, etc. The positive electrode current collector 201 and the negative electrode current collector 204 are preferably those with a thickness of 10 μm or more and 30 μm or less. The positive electrode active material layer 202 is, for example, a material capable of inserting and desorbing carrier ions.

[0119] It can have. As carrier ions, lithium, other alkali metal ions ( e.g., sodium ions, potassium ions, etc.) or alkaline earth metal ions (e.g., calcium ions, strontium ions, barium ions, beryllium ions, magnes ium ions, etc.) can be used.

[0120] As materials capable of inserting and desorbing lithium ions, for example, olivine-type crystal structures, layered rock salt-type crystal structures, or spinel-type crystal structures of lithium-containing materials such as. As the positive electrode active material, for example, compounds such as LiFeO2, LiCoO2, LiNiO2, L iMn2O4, V2O5, Cr2O5, MnO2, etc. can be used.

[0121] Or lithium-containing composite phosphates (general formula LiMPO4 (M is one or more of Fe(II), Mn( II), Co(II), Ni(II))) can be used. As representative examples of the general formula LiM PO4, there are LiFePO4, LiNiPO4, LiCoPO4, LiMn PO4, LiFe a Ni b PO4, LiFe a Co b PO4, LiFe a Mn b PO4, LiNi a Co b PO4, LiNi a Mn b PO4 (a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiFe c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn ePO4 (where c + d + e ≤ 1, 0 < c < 1, 0 < d < 1, 0 < e < 1), L iFe f Ni g Co h Mn i PO4 (where f + g + h + i ≤ 1, 0 < f < 1 , 0 < g < 1, 0 < h < 1, 0 < i < 1), etc.

[0122] In particular, LiFePO4 preferably satisfies, in a balanced manner, the requirements for a positive electrode active material, such as the presence of lithium ions that can be extracted during initial oxidation (charging), safety, stability, high capacity density, and high potential.

[0123] Examples of lithium-containing materials having a layered rock salt-type crystal structure include lithium cobaltate (LiCoO2), LiNiO2, LiMnO2, and Li2MnO3. Also, NiCo-based materials such as LiNi 0.8 Co 0.2 O2 (general formula: LiNi x Co 1- x O2 (0 < x < 1)), NiMn-based materials such as LiNi 0.5 Mn 0.5 O2 (general formula: L iNi x Mn 1-x O2 (0 < x < 1)), and NiMnCo-based materials such as LiNi 1 / 3 Mn 1 / 3 Co 1 / 3 O2 etc. (also referred to as NMC. General formula: LiNi x Mn y Co 1-x-y O2 ( x > 0, y > 0, x + y < 1)) exist. Furthermore, there are Li(Ni 0.8 Co 0.15 Al .05 )O2, Li2MnO3 - LiMO2 (M = Co, Ni, Mn), etc.

[0124] ​​​Examples of lithium-containing materials having a spinel crystal structure include, for example, LiMn2O4, Li 1+x Mn 2-x O4, LiMn 2-x Al x O4 (0 < x < 2), LiMn 1.5 Ni 0.5 O4, and the like.

[0125] For lithium-containing materials having a spinel crystal structure containing manganese such as LiMn2O4 when a small amount of lithium nickelate (LiNiO2, LiNi 1-x M x O2 (M = Co, Al etc.)) is mixed, there are advantages such as suppressing the elution of manganese and suppressing the decomposition of the electrolytic solution, which is preferable.

[0126] Also, as the positive electrode active material, a lithium-containing material such as the general formula Li (2-j) MSiO4 (M is one or more of Fe(II), M n(II), Co(II), Ni(II), 0 ≦ j ≦ 2) etc. can be used. Representative examples of the general formula Li (2-j) MSiO4 include Li (2- j) FeSiO4, Li (2-j) NiSiO4, Li (2-j) CoSiO4, Li ( 2-j) MnSiO4, Li (2-j) Fe k Ni l SiO4, Li (2-j) Fe k C o l SiO4, Li (2-j) Fe k Mn l SiO4, Li (2-j) Ni k Co l Si O4, Li (2-j) Ni k Mnl SiO4 (where k + l is 1 or less, 0 < k < 1, 0 < l < 1 ), Li (2-j) Fe m Ni n Co q SiO4, Li (2-j) Fe m Ni n Mn q S iO4, Li (2-j) Ni m Co n Mn q SiO4 (where m + n + q is 1 or less, 0 < m < 1 , 0 < n < 1, 0 < q < 1), Li (2-j) Fe r Ni s Co t Mn u SiO4 (where r + s + t + u is 1 or less, 0 < r < 1, 0 < s < 1, 0 < t < 1, 0 < u < 1) and other lithium compounds can be used as materials.

[0127] Also, as the positive electrode active material, A x M2(XO4)3 (A = Li, Na, Mg, M = Fe, Mn, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) represented by the general formula NASICON-type compounds can be used. Examples of NASICON-type compounds include Fe2(MnO4[[ID=5!]] )3, Fe2(SO4)3, Li3Fe2(PO4)3, etc. Also, as the positive electrode active material there are compounds represented by the general formula Li2MPO4F, Li2MP2O7, Li5MO4 (M = Fe, Mn), perovskite-type fluorides such as NaF3, FeF3, metal chalcogenides (sulfides, selenides, tellurides) such as TiS2, MoS 2, etc., materials having a reverse spinel-type crystal structure such as LiMVO4, vanadium oxide-based (V2O5, V6O , LiV 3O8, etc.), manganese oxides, organic sulfur compounds, and other materials can be used. 13 , LiV 3O8, etc.), manganese oxides, organic sulfur compounds, and other materials can be used.

[0128] Furthermore, a sodium-containing material may be used as the positive electrode active material. For example, NaMn2O 4, NaNiO2, NaCoO2, NaFeO2, NaNi 0.5 Mn 0.5 O2, Na Examples include CrO2, NaFeO2, etc. Also, Na2FePO4F, Na2VPO4 Fluorophosphates such as F, Na2MnPO4F, Na2CoPO4F, and Na2NiPO4F It is also possible to use borates such as NaFeBO4 and Na3Fe2(BO4)3. You can use it.

[0129] Furthermore, materials to which rare earth elements have been added may be used as positive electrode active materials. Elements are Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, These are Ho, Er, Tm, Yb, and Lu. One or more of these elements are added. A positive electrode active material can be used.

[0130] Furthermore, the positive electrode active material layer 202 contains, in addition to the positive electrode active material mentioned above, a material to enhance the adhesion of the active material. It includes a binder, a conductive additive to enhance the conductivity of the positive electrode active material layer 202, and other components. That's fine.

[0131] The negative electrode active material layer 205 is a material capable of dissolving and depositing metals that act as carrier ions. Alternatively, a material that allows for the insertion and removal of carrier ions can be used. For example, lithium Metals, carbon-based materials, alloy materials, etc. can be used. Here, the carrier ions As metals, lithium and other alkali metals (e.g., sodium and potassium), Earth metals (e.g., calcium, strontium, barium, beryllium, magnesium) Examples include zinc, etc.

[0132] Lithium metal has a low oxidation-reduction potential (-3.045V compared to a standard hydrogen electrode) and is heavy And they have a high specific capacity per unit volume (3860mAh / g and 2062mAh / cm³, respectively). 3 Therefore, it is preferable.

[0133] Examples of carbon-based materials include graphite, easily graphitizable carbon (soft carbon), and poorly graphitizable carbon (hard carbon). Examples include carbon fiber, carbon nanotubes, graphene, and carbon black.

[0134] Graphite includes mesocarbon microbeads (MCMB), coke-based artificial graphite, and pip There are artificial graphites such as cyanide-based artificial graphite and natural graphites such as spheroidized natural graphite.

[0135] Graphite is formed when lithium ions are inserted into graphite (during the formation of lithium-graphite intercalation compounds). It exhibits a potential as low as lithium metal (below 0.3V vs. Li / Li + ).this This allows lithium-ion secondary batteries to exhibit a high operating voltage. Furthermore, graphite, It has a relatively high capacity per unit volume, low volume expansion, is inexpensive, and is comparable to lithium metal. They are preferable because they have advantages such as high safety.

[0136] Furthermore, alloying materials can also be used as the negative electrode active material. Here, alloying materials refer to ki It is possible to perform charge and discharge reactions through alloying and dealloying reactions with metals that become carrier ions. It refers to the material. When the carrier ion is a lithium ion, an alloy material would be, for example, , Mg, Ca, Al, Si, Ge, Sn, Pb, Sb, As, Bi, Ag, Au, Zn, A material containing at least one of Cd, Hg, and In can be used. Elements like this have a large capacity with respect to carbon. In particular, silicon has a theoretical capacity of 4200 mAh / g which is extremely high. Therefore, it is preferable to use silicon as the negative electrode active material. Also, among compounds using elements like this, materials that can perform charge and discharge reactions by forming bonds with lithium may sometimes be called alloy-based materials. For example, SiO, Mg2Si, Mg2Ge, SnO, SnO2, Mg2Sn, SnS2, V2Sn3, FeSn2, Co Sn2, Ni3Sn2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni2MnSb, Ce Sb3, LaSn3, La3Co2Sn7, CoSb3, InSb, SbSn, etc. can be listed

[0137] Also, as the negative electrode active material, oxides such as titanium dioxide (TiO2), lithium titanate (Li4 Ti5O 12 ), lithium-graphite intercalation compound (Li x C6), niobium pentoxide (Nb2O5 ), tungsten oxide (WO2), molybdenum oxide (MoO2), etc. can be used

[0138] Also, as the negative electrode active material, Li M 3-x N (M = Co, Ni, Cu), which is a complex nitride of lithium and transition metals and has a Li3N-type structure, can be used. For example, Li x 6Co 2. N3 shows a large charge and discharge capacity (900 mAh / g, 1890 mAh / cm 0.4 3 ) and is preferable

[0139] When using a complex nitride of lithium and transition metals, since lithium ions are contained in the negative electrode active material , it can be combined with materials such as V2O5 and Cr3O8 that do not contain lithium ions as the positive electrode active material​​​​​​ It is preferable that this be done. Furthermore, when using a material containing lithium ions as the positive electrode active material, Also, by pre-desorbing the lithium ions contained in the positive electrode active material, the negative electrode active material A lithium-transition metal composite can be used as the composite material.

[0140] Furthermore, materials that undergo a conversion reaction can also be used as the negative electrode active material. For example For example, lithium, such as cobalt oxide (CoO), nickel oxide (NiO), and iron oxide (FeO). Transition metal oxides that do not form alloys with mu may be used as the negative electrode active material. Conversion reaction Materials that produce this include Fe2O3, CuO, Cu2O, RuO2, and Cr2O3. Oxides such as CoS 0.89 , sulfides such as NiS and CuS, Zn3N2, Cu3N, Ge Nitrides such as 3N4, phosphides such as NiP2, FeP2, CoP3, FeF3, BiF3, etc. This also occurs with fluorides. Furthermore, because the potential of the above fluorides is high, they are used as positive electrode active materials. That's good too.

[0141] Furthermore, the negative electrode active material layer 205 contains, in addition to the negative electrode active material mentioned above, a material to enhance the adhesion of the active material. It includes a binder, a conductive additive to enhance the conductivity of the negative electrode active material layer 205, and other components. That's fine.

[0142] As for electrolyte 208, it is possible to move carrier ions as an electrolyte, Furthermore, a material containing lithium ions as carrier ions is used. Typical examples of electrolytes include... are LiPF6, LiClO4, Li(FSO2)2N, LiAsF6, LiBF4, L Lithium such as iCF3SO3, Li(CF3SO2)2N, Li(C2F5SO2)2N, etc. There are salts. These electrolytes may be used individually or in any combination of two or more. It may also be used in the specified ratio. Furthermore, to make the reaction product more stable, vinylene may be added to the electrolyte. Adding a small amount (1 wt%) of carbonate (VC) may further reduce the decomposition of the electrolyte. Also, for example, electrolytes containing sodium ions include NaPF6, NaN(SO2CF6) 3) You may also use 2, NaClO4, NaBF4, CF3SO3Na, NaAsF6, etc. stomach.

[0143] Furthermore, a material that allows for the movement of carrier ions is used as the solvent for the electrolyte 208. A non-protic organic solvent is preferred as the solvent for the solution. Typical examples of non-protic organic solvents are listed below. Examples include ethylene carbonate (EC), propylene carbonate, and dimethyl carbonate. Diethyl carbonate (DEC), γ-butyrolactone, acetonitrile, dimethyl Examples include xyethane and tetrahydrofuran, and one or more of these can be used. Furthermore, by using a polymer material that gels as the solvent for the electrolyte, leakage can be reduced. This increases safety. Furthermore, it enables thinner and lighter batteries. The polymer is gelled. Typical examples of materials include silicone gel, acrylic gel, acrylonitrile gel, and polyethylene. Teylene oxide gels, polypropylene oxide gels, fluorine polymer gels, etc. There are also ionic liquids (room temperature molten salts) that are flame-retardant and non-volatile as solvents for the electrolyte. By using one or more of these devices, the internal temperature of the battery may rise due to internal short circuits or overcharging. Even if the battery is raised, it can prevent it from rupturing or catching fire.

[0144] An insulator can be used as the separator 207. For example, cellulose (paper). Alternatively, a polymer with voids, such as polypropylene or polypropylene, can be used. Polyethylene and the like can be used.

[0145] The rechargeable battery has a thin, flexible film (e.g., laminate film) as its outer casing. It is used as follows. Laminate film is a laminated film made of a base film and an adhesive synthetic resin film. This refers to a film, or a laminated film made of two or more types of films. Examples of base films include PET and PB. Polyesters such as T, polyamides such as nylon 6 and nylon 66, and inorganic vapor-deposited films. Alternatively, paper can be used. Also, adhesive synthetic resin films such as PE and PP can be used. Polyolefins, acrylic synthetic resins, epoxy synthetic resins, etc., can be used. The film is laminated to the object to be processed by heat and pressure using a laminating device. It is preferable to apply an anchor coating agent as a pretreatment before the lamination process. The adhesion between the coating film and the object to be treated can be made stronger. For this purpose, isocyanate-based compounds should be used.

[0146] A method for manufacturing a thin secondary battery using an outer casing made of film is described in Embodiment 4. See below.

[0147] <Method for manufacturing the display unit> The following is an example of a method for manufacturing the display unit 102.

[0148] The display unit 102 is flexible. The display unit 102 has a display element on a flexible plate 151. It has 152 children.

[0149] A method for fabricating a display element 152 on a flexible plate 151 is to use a flexible plate 151 Methods for directly fabricating the display element 152 on the plate 151, or using a rigid substrate such as a glass substrate. After forming a layer containing the display element 152 on top, the substrate was removed by etching, polishing, or the like. Furthermore, a method for bonding the layer containing the display element 152 to the flexible plate 151, and a glass substrate A release layer is provided on a rigid substrate such as a plate, and a layer including the display element 152 is formed thereon. Afterward, the rigid substrate and the layer containing the display element 152 are separated using the delamination layer, and the display One method involves bonding the layer containing the element 152 to the flexible plate 151.

[0150] In this embodiment, the display unit 102 displays an active matrix type table capable of high-resolution display. To enable the use of a display device, it can undergo heating treatment at temperatures above 400°C, thereby increasing the reliability of the display elements. A manufacturing method that allows for the provision of a release layer on a rigid substrate such as a glass substrate. The technology described in Japanese Patent Publication No. 2003-174153 is used.

[0151] According to the technology described in Japanese Patent Publication No. 2003-174153, a transistor using polysilicon as the active layer DISTRAs and transistors using oxide semiconductor layers are mounted on a flexible substrate or film. It becomes possible to install them. Furthermore, these transistors can be used as switching elements. An electroluminescent element (EL element) is provided.

[0152] A typical configuration of an EL element involves a pair of electrodes containing a light-emitting organic or inorganic compound. It consists of a light-emitting layer (hereinafter referred to as the "light-emitting layer") sandwiched between the elements, and by applying a voltage to the element... Electrons and holes are injected and transported from a pair of electrodes to the light-emitting layer, respectively. These carriers (electrons and holes) recombine, resulting in luminescent organic compounds or Inorganic compounds form an excited state, and emit light when that excited state returns to the ground state.

[0153] The types of excited states that organic compounds can form include singlet excited states and triplet excited states. It is possible for it to be in a singlet excited state, and emission from the singlet excited state is fluorescence, and emission from the triplet excited state is phosphorescence. They are being called.

[0154] Such light-emitting elements are usually formed as thin films ranging from submicrons to several microns in thickness. A major advantage is that it can be manufactured in a lightweight form. Also, from the time the carrier is injected until light emission occurs... The time it takes to complete the process is at most a microsecond or less, resulting in an extremely fast response time. This is also one of its features. Furthermore, sufficient light emission can be obtained with a DC voltage of a few volts to several tens of volts. Therefore, it consumes relatively little power.

[0155] EL elements have a superior viewing angle compared to liquid crystal elements, and are suitable for applications where the display area is curved. This is preferable as a display element for the display unit 102. Furthermore, a backlight is provided, similar to a liquid crystal element. Therefore, power consumption is low, and the number of parts can be reduced, resulting in a thinner overall thickness. EL elements are also preferable as display elements for the display unit 102 because they can be made thinner.

[0156] Furthermore, the method for manufacturing the display element 152 on the flexible plate 151 is as described above (Japanese Patent Application Publication No. 20 It is not limited to 03-174153). Furthermore, the method and materials for manufacturing EL elements are Since known manufacturing methods and materials can be used, a detailed explanation will be omitted here.

[0157] Furthermore, the display device used in the display unit 102 may be a simple monochromatic light emitter or a display that only shows numbers. Therefore, a passive matrix type display device is sufficient, in which case Japanese Patent Publication No. 2003-174153 A display element 152 is fabricated on a flexible plate 151 using a manufacturing method other than the technology described above. That's all you need to do.

[0158] The display unit 102 obtained by the above method is attached to the energy storage device 103, and the display unit 102 is attached to the energy storage device 103. To electrically connect to the display unit 102. Furthermore, in order to improve the appearance of the electronic device 100 Even if the parts other than the display unit 102 are covered with a metal cover, a plastic cover, or a rubber cover, good.

[0159] The screen size when a display unit 102 is provided in the electronic device 100 is not particularly limited. If so, the screen size of the display unit 102 should be less than or equal to the size of the board 112. For example, on the wrist When wearing it, the circumference of an adult's wrist is 18cm ± 5cm, so the screen size is as follows: For large sizes, this is 23cm of arm circumference multiplied by the distance from wrist to elbow. Also, the distance from wrist to elbow for adults The distance is less than 1 foot (30.48 cm), for example, the size of a cylindrical plate 112. 23cm x 30.48cm is the maximum screen size of the display area of ​​the arm-worn electronic device 100. Okay. Note that the screen size referred to here is the size when the screen is flat, not when it has a curved surface. This refers to the size when it is considered as a surface. Furthermore, multiple display units may be provided on a single electronic device, for example... For example, the electronic device may have a second display unit that is smaller than the first display unit. It is preferable to use a device with dimensions larger than the screen size of the display unit. If the screen size is such that it can be placed on the support structure, the display panel and FPC The total weight of the ingredients can be between 1g and less than 10g.

[0160] Furthermore, the thinnest part of the electronic device 100 on which the display unit 102 is provided shall be 5 mm or less. This is possible. Also, the thickest part of the electronic device 100 is the connection between the display unit 102 and the FPC. It is a portion, but it can be less than 1 cm.

[0161] Furthermore, the total weight of the electronic device 100 can be less than 100g.

[0162] Furthermore, the electronic device 100, as shown in the cross-sectional view in Figure 2(A), is designed to be worn on the arm. The support structure can be fitted onto the arm by moving in the direction of arrow 105. The total weight of the sub-device 100 is less than 100g, preferably 50g or less, and the thickest part is 1 This allows us to provide electronic devices that are thin (less than 1 cm) and lightweight.

[0163] For example, in this specification, etc., display element, display device having a display element, light emission Light-emitting devices, which are devices having elements and light-emitting elements, can take various forms or various shapes. It may have such elements. For example, a display element, display device, light-emitting element, or light-emitting device may have the following characteristics: EL (Electroluminescent) elements (EL elements including organic and inorganic materials, organic EL elements) Children, inorganic EL elements, LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.) , transistor (a transistor that emits light in response to current), electron emission element, liquid crystal element, electron Ink, electrophoretic elements, grating light bulbs (GLV), plasma displays Display elements using (PDP), MEMS (Micro-Electro-Mechanical Systems) Children, Digital Micromirror Devices (DMDs), DMS (Digital Microshutter) (Terra), MIRASOL (registered trademark), IMOD (Interference Modulation) (element) element, shutter-type MEMS display element, optical interference type MEMS display element, element Using cyclowetting elements, piezoelectric ceramic displays, and carbon nanotubes It has at least one of the following: a display element, etc. In addition to these, it has electrical or magnetic It has a display medium whose contrast, brightness, reflectance, transmittance, etc., change as a result of the action. This is also good. An example of a display device using EL elements is an EL display. An example of a display device using emission elements is a field emission display (FE D) or SED type flat display (SED: Surface-conductivity Examples include (n Electron-emitter Display), which uses liquid crystal elements. Examples of such display devices include liquid crystal displays (transmissive liquid crystal displays, semi-transmissive liquid crystal displays). Display, reflective liquid crystal display, direct-view liquid crystal display, projection liquid crystal display Examples include (Ray). These include electronic ink, electronic powder fluid (registered trademark), or electrophoretic elements. Examples of display devices include electronic paper. Furthermore, semi-transmissive liquid crystal displays and reverse-transmissive displays are also examples. In realizing a light-emitting liquid crystal display, some or all of the pixel electrodes are reflective electrodes. It should be made to have the function of a. For example, part or all of the pixel electrodes are It is sufficient to have luminium, silver, etc. Furthermore, in that case, below the reflecting electrode, It is also possible to incorporate memory circuits such as SRAM. This further reduces power consumption. It can be reduced. Furthermore, when using LEDs, beneath the LED electrodes and nitride semiconductor, Graphene or graphite may be placed. Graphene or graphite can be arranged in multiple layers. They can be layered to form a multilayer film. In this way, by providing graphene or graphite... Furthermore, a nitride semiconductor, such as an n-type GaN semiconductor layer having crystals, can be easily formed on top of it. A film can be formed. Furthermore, a p-type GaN semiconductor layer having crystals can be provided on top of it. LEDs can be constructed using graphene and graphite, and crystalline n An AlN layer may be provided between the GaN semiconductor layer and the LED. The body layer may be deposited by MOCVD. However, by providing graphene, LED The GaN semiconductor layer present in this material can also be deposited using the sputtering method.

[0164] Furthermore, in addition to the display device, the electronic device according to one aspect of the present invention includes other semiconductor circuits, such as overcharge Control circuits to prevent this, as well as sensors such as image sensors, gyro sensors, and accelerometers. It may also be equipped with a touch panel, etc. Furthermore, it may contact a part of the human body to measure pulse and surface temperature. The device may be equipped with sensors to measure temperature, blood oxygen concentration, etc. For example, in addition to a display device. By equipping it with an image sensor, the captured image can be displayed on a display device. By incorporating sensors such as gyroscopic sensors and accelerometers, the arm-worn electronic device It can save power by switching between on and off states depending on the orientation and movement. By incorporating a touch panel, electronic devices can be operated by touching the desired location on the touch panel. It is possible to operate the device and input information. In addition, in the above configuration, in addition to the display device, By incorporating memory and a CPU, it's also possible to create a wearable computer.

[0165] Furthermore, an electronic device according to one aspect of the present invention can be used as a display unit for an arm-worn electronic device, and a conventional portable By using both the display unit of the information terminal and the electronic device according to one aspect of the present invention, a subdisplay It can also function as a tool.

[0166] This embodiment can be freely combined with other embodiments.

[0167] (Embodiment 2) This embodiment provides an example of a display device that can be applied to an electronic device according to one aspect of the present invention. This indicates.

[0168] [Top view of the display device] Figure 20 is a top view showing an example of a display device. The display device 700 shown in Figure 20 is a first A pixel unit 702 provided on the substrate 701 and a source dry provided on the first substrate 701 The circuit section 704 and the gate driver circuit section 706, the pixel section 702, and the source driver circuit A sealing material 712 is arranged to surround section 704 and gate driver circuit section 706, It has a second substrate 705 which is provided opposite to the first substrate 701. The first substrate 701 and the second substrate 705 are sealed together by a sealing material 712. The pixel section 702, the source driver circuit section 704, and the gate driver circuit section 706 are, It is sealed by the first substrate 701, the sealing material 712, and the second substrate 705. Although not shown in Figure 20, a display element is provided between the first substrate 701 and the second substrate 705. It is possible.

[0169] Furthermore, the display device 700 is surrounded by a sealing material 712 on the first substrate 701. In a region different from the region, the pixel section 702, the source driver circuit section 704, and the gate driver are located. FPC terminal section 708 (FPC: Flexi) is electrically connected to circuit section 706. A printed circuit (FPC) is provided. Also, at the FPC terminal section 708 The FPC716 is connected, and the FPC716 controls the pixel unit 702 and the source driver circuit. Various signals are supplied to section 704 and gate driver circuit section 706. Also, pixel section 7 02, Source driver circuit section 704, Gate driver circuit section 706, and FPC terminal section 7 Signal lines 710 are connected to each of the 08 terminals. Various signals are supplied by the FPC716. These are transmitted via the signal line 710 to the pixel unit 702, the source driver circuit unit 704, and the gate driver. This is supplied to the IBA circuit section 706 and the FPC terminal section 708.

[0170] Furthermore, the display device 700 may be provided with multiple gate driver circuit units 706. The device 700 includes a source driver circuit section 704 and a gate driver circuit section 706. Although an example is shown in which the pixel portion 702 is formed on the same first substrate 701, this configuration is not limited to this example. It is not necessary. For example, the gate driver circuit section 706 may be formed on the first substrate 701. Alternatively, only the source driver circuit section 704 may be formed on the first substrate 701. In this case, a substrate on which a source driver circuit or gate driver circuit, etc., is formed (for example, a single-wired board) A drive circuit board (formed from a crystalline semiconductor film or a polycrystalline semiconductor film) is mounted on the first substrate 701. This configuration is also acceptable. Furthermore, the method of connecting the separately formed drive circuit board is not particularly limited. Instead, methods such as COG (Chip On Glass) and wire bonding are used. You can use it.

[0171] Furthermore, the display device 700 includes a pixel section 702, a source driver circuit section 704, and a gate The driver circuit section 706 has a wiring section or a plurality of transistors, and one of the present inventions A semiconductor device of the form can be applied.

[0172] Furthermore, the display device 700 can have various elements. An example of such elements is: Liquid crystal elements, EL (electroluminescent) elements (EL elements including organic and inorganic materials), Organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs) EDs, etc.), transistors (transistors that emit light in response to current), electron-emitting elements, electron Ink, electrophoretic elements, GLV, PDP, display elements using MEMS, DMD, DMS, MIRASOL (registered trademark), IMOD element, shutter-type MEMS display element, light-emitting Interference-type MEMS display elements, electrowetting elements, piezoelectric ceramic displays i. Display elements using carbon nanotubes, etc., which are generated by electrical or magnetic forces. Some display media have properties such as transient response, brightness, reflectance, and transmittance that change over time.

[0173] The display method used in the display device 700 is either progressive or interlaced. These can be used. Also, when displaying in color, the color elements controlled by pixels include R It is not limited to the three colors GB (R stands for red, G for green, and B for blue). For example, if the pixels have R and G It may consist of four pixels: a pixel, a B pixel, and a W (white) pixel. Alternatively, a pentile arrangement. As shown in the column, two of the RGB colors make up one color element, and each color element produces two different colors. You may also select and configure this option. Alternatively, you can add one or more colors to RGB, such as yellow, cyan, magenta, etc. Additional elements may be added. Note that the size of the display area for each color element dot may differ. However, the disclosed invention is not limited to a color display device, but also includes a monochrome display device. It can also be applied to the display device shown.

[0174] Also, white light is used for backlights (organic EL elements, inorganic EL elements, LEDs, fluorescent lamps, etc.) In order to display full color on a display device using W), a color layer (also called a color filter) is used. .) may be used. The colored layer may be, for example, red (R), green (G), and blue (B). Yellow (Y) and other colors can be used in appropriate combinations. By using a colored layer, Compared to not using a colored layer, the color reproduction can be improved. In this case, the colored layer By arranging regions that have a colored layer and regions that do not have a colored layer, the region that does not have a colored layer White light in the area may be used directly for display. A portion of the area may be placed without a colored layer. This reduces the decrease in brightness caused by the colored layer when displaying bright content, and reduces power consumption by 20%. In some cases, this can be reduced by about 30%. However, this is not possible with self-emissive elements such as organic EL elements and inorganic EL elements. When using elements for full-color display, R, G, B, Y, and white (W) are used in each case. It is also acceptable to emit light from an element that has a light-emitting color. By using a self-luminescent element, a colored layer can be used. In some cases, power consumption can be reduced even further than when it was used.

[0175] In this embodiment, regarding the configuration in which liquid crystal elements and EL elements are used as display elements: This will be explained using Figures 21 and 24. Figure 21 is shown in Figure 20, where the dashed line QR is located. Figure 24 is a cross-sectional view of the device, which uses a liquid crystal element as the display element. This is a cross-sectional view of the dashed-dotted line QR shown in 20, and it is a configuration using an EL element as the display element. That is the case.

[0176] First, I will explain the common parts shown in Figures 21 and 24, and then the different parts. I will explain below.

[0177] [Explanation of common parts of display devices] The display device 700 shown in Figures 21 and 24 includes a wiring section 711 and a pixel section 702. It has a source driver circuit section 704 and an FPC terminal section 708. The line section 711 has a signal line 710. The pixel section 702 has a transistor 750 and It has a capacitive element 790 (capacitive element 790a or capacitive element 790b). Also, sourced The driver circuit section 704 has a transistor 752.

[0178] Furthermore, signal line 710 is connected to the source and drain electrodes of transistors 750 and 752. It is formed using the same process as the conductive film that functions as a transistor 75. A conductive film formed in a different process from the source and drain electrodes, for example, a g It may also be a conductive film that functions as an electrode. The signal line 710 may, for example, contain copper elements. When using this material, signal delays caused by wiring resistance are reduced, making it possible to display on a large screen. ru.

[0179] Various transistors can be used as transistors 750 and 752. This is possible. Transistors 750 and 752 have a gate electrode 721 and a semiconductor It has a layer 722 and a pair of electrodes 723 and 724. Furthermore, the semiconductor layer 722 and a gate An insulating film is present between the electrode 721 and the electrode.

[0180] The display device 700 has transistors such as transistor 750 and transistor 752. The structure is not particularly limited. For example, it may be a staggered transistor or an inverse staggered transistor. It may also be a type of transistor. Furthermore, either a top-gate or bottom-gate transistor may be used. A transistor structure may also be used. The semiconductor material used for the transistor is not particularly limited, for example Examples include silicon, germanium, silicon carbide, gallium nitride, etc. Alternatively, I n-Ga-Zn metal oxides, etc., at least one of indium, gallium, and zinc. Oxide semiconductors containing the following may also be used.

[0181] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0182] Here, semiconductors such as transistors used in pixels, driving circuits, and touch sensors are used. It is preferable to use oxide semiconductors for the body device. In particular, it is preferable to use silicon with a band gap. It is preferable to use oxide semiconductors with a large band gap. Furthermore, if a semiconductor material with a low carrier density is used, the transistor's off state This is preferable because it allows for a reduction in current.

[0183] For example, the above oxide semiconductor may contain at least indium (In) or zinc (Zn). Preferably contains ). More preferably In-M-Zn oxide (where M is Al, Ti, Contains oxides represented by metals such as Ga, Ge, Y, Zr, Sn, La, Ce, or Hf. nothing.

[0184] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. , or oriented perpendicular to the upper surface of the semiconductor layer, and without grain boundaries between adjacent crystal portions. It is preferable to use an oxide semiconductor film.

[0185] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for use in flexible, curved display panels and the like. It is possible to be there.

[0186] By using such materials as semiconductor layers, fluctuations in electrical properties are suppressed, and reliability is improved. High-quality transistors can be achieved.

[0187] Furthermore, its low off-current allows the charge stored in the capacitor via the transistor to be released over a long period of time. It is possible to hold it over time. By applying such transistors to pixels, each It also becomes possible to stop the drive circuit while maintaining the gradation of the image displayed in the display area. As a result, it is possible to create electronic devices with extremely reduced power consumption.

[0188] It is preferable to provide an undercoat to stabilize the characteristics of the transistor. Silicon oxide film, silicon nitride film, silicon oxide nitride film, silicon nitride oxide film, etc. It can be fabricated using an insulating film, either as a single layer or in a multilayer configuration. The undercoat is fabricated by sputtering. CVD (Chemical Vapor Deposition) method (Plasma CVD) Methods such as thermal CVD, MOCVD (Metal Organic CVD), and ALD Using methods such as (Atomic Layer Deposition), coating, and printing, the shape is formed. It is possible. Furthermore, a base coat does not need to be applied unless necessary.

[0189] Furthermore, the FPC terminal section 708 includes a connecting electrode 760, an anisotropic conductive film 780, and FPC 71 It has 6. The connecting electrode 760 is the source electrode of transistors 750 and 752 and It is formed using the same process as the conductive film that functions as a rain electrode. Also, the connecting electrode 760 is F The terminals on the PC716 are electrically connected via the anisotropic conductive film 780.

[0190] Furthermore, for example, glass substrates can be used as the first substrate 701 and the second substrate 705. This is possible. A glass substrate with a curved surface may be used as the glass substrate.

[0191] Furthermore, even if flexible substrates are used as the first substrate 701 and the second substrate 705, Good. Examples of such flexible substrates include plastic substrates. Also, A flexible substrate may be used by attaching it to a board or the like.

[0192] By using a flexible substrate, a flexible display device can be manufactured. It is possible. Because the display device is flexible, it can be attached to curved surfaces or irregularly shaped surfaces. It becomes versatile and can be used in a wide variety of applications.

[0193] For example, by using a flexible substrate such as a plastic substrate, the thinness of the display device can be increased. This enables film formation and weight reduction. Furthermore, it is possible to use flexible substrates such as plastic substrates. Display devices using this technology are less prone to breakage, and their durability against impacts such as drops can be improved. Cut.

[0194] Furthermore, the second substrate 705 side has a light-shielding film 738 that functions as a black matrix, A colored film 736 that functions as a color filter, and a light-shielding film 738 and a film in contact with the colored film 736 An insulating film 734 is provided.

[0195] Furthermore, a structure 778 is provided between the first substrate 701 and the second substrate 705. The fabricated body 778 is a columnar spacer obtained by selectively etching an insulating film. It is provided to control the distance (cell gap) between the first substrate 701 and the second substrate 705. It is possible to use a spherical spacer as structure 778. Also, Figure 21 In this example, we have provided an example of a configuration in which the structure 778 is provided on the second substrate 705 side, It is not limited to this. For example, as shown in Figure 24, a structure 778 may be provided on the first substrate 701 side. A configuration in which the structure 778 is provided on both the first substrate 701 and the second substrate 705. That is also acceptable.

[0196] In Figures 21 and 24, transistor 750, transistor 752, and capacitive element Insulating films 764, 766, and 768 are provided on 790.

[0197] Furthermore, the display device 700 may have a protective film 799. The protective film 799 is uniformly formed. It is preferable to do so. As an example of a method for forming the protective film 799, it is preferable to use the ALD method. It seems that the protective film 799 can, for example, protect display elements and transistors. It has a function. And protective films such as protective film 799 may have other functions, for example. Yes, there is. Therefore, protective films such as protective film 799 are sometimes simply called films. For example, Protective films such as protective film 799 are sometimes referred to as the first film, the second film, etc.

[0198] Here, an oxide semiconductor is used as the semiconductor layer for transistors 750 and 752. If present, insulating film 768 is an insulating film having a blocking effect on oxygen, hydrogen, water, etc. By providing this, the semiconductor layer of transistors 750 and 752 is reduced. This prevents oxygen from diffusing to the outside and prevents hydrogen, water, etc. from entering the semiconductor layer from the outside. Preferably, the insulating film 768 may function as a protective film.

[0199] For example, as insulating film 768, aluminum oxide, magnesium oxide, silicon oxide, Silicon oxide nitride, silicon nitride, silicon nitride, gallium oxide, germanium oxide Yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide And an insulating film containing one or more types of tantalum oxide can be used. Also, insulating film 768 is The above materials may be laminated. Furthermore, the insulating film 768 may contain lanthanum (La), nitrogen, and zirconium. It may contain impurities such as conium (Zr).

[0200] [Example configuration of a display device using liquid crystal elements as display elements]

[0201] The display device 700 shown in Figure 21 has a capacitive element 790a. The capacitive element 790a is This structure has a dielectric material between the pair of electrodes.

[0202] Furthermore, the display device 700 shown in Figure 21 has a liquid crystal element 775. The liquid crystal element 775 is It has a conductive film 772, a conductive film 774, and a liquid crystal layer 776. The conductive film 774 is a second substrate It is provided on the 705 side and functions as a counter electrode. The display device 700 shown in Figure 21 is The orientation state of the liquid crystal layer 776 changes depending on the voltage applied to the conductive film 772 and the conductive film 774. By doing so, the transmission and opacity of light are controlled, allowing an image to be displayed.

[0203] Furthermore, the conductive film 772 serves as the source electrode and drain electrode of the transistor 750. It is connected to a conductive film that functions as a pixel electrode. The conductive film 772 is formed on the insulating film 768 and is connected to the pixel electrode. In other words, it functions as one of the electrodes of the display element.

[0204] Examples of conductive films 772 include indium tin oxide and indium tin oxide containing tungsten oxide. Indium oxide, indium zinc oxide containing tungsten oxide, indium zinc oxide containing titanium oxide Oxides, indium tin oxide containing titanium oxide, indium zinc oxide, silicon oxide A translucent conductive material such as added indium tin oxide can be used.

[0205] Note that although not shown in Figure 21, the side of the conductive films 772 and 774 that is in contact with the liquid crystal layer 776. Alternatively, an orientation film may be provided in each of them. Also, although not shown in Figure 21, Optical components (optical substrates) such as optical members, phase difference members, and anti-reflective members may be provided as appropriate. For example, circularly polarized light from a polarizing substrate and a phase difference substrate may be used. Also, as a light source, You may also use Klite, Sidelite, etc.

[0206] When using liquid crystal elements as display elements, thermotropic liquid crystals, low molecular weight liquid crystals, and polymer liquid crystals are used. Crystals, polymer-dispersed liquid crystals, ferroelectric liquid crystals, antiferroelectric liquid crystals, etc. can be used. Depending on the conditions, the liquid crystal material can be classified into cholesteric phase, smectic phase, cubic phase, and chi. It exhibits the ranematic phase, isotropic phase, etc.

[0207] Furthermore, when employing a transverse electric field method, it is also possible to use a liquid crystal that exhibits a blue phase without using an alignment layer. The blue phase is one of the liquid crystal phases, and as the temperature of cholesteric liquid crystal is increased, the cholesteric phase This phase appears just before the transition from the blue phase to the isotropic phase. The blue phase only appears within a narrow temperature range. To improve the temperature range, a liquid crystal assembly containing several weight percent or more of chiral agent was mixed in. The resulting product is used in the liquid crystal layer. The liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent is Because it has a short response speed and is optically isotropic, orientation processing is unnecessary, and it is not dependent on the viewing angle. It is small. Also, since an orientation film does not need to be provided, rubbing treatment is also unnecessary. This can prevent electrostatic discharge damage caused by the process, and the liquid crystal display device during the manufacturing process. This can reduce defects and damage.

[0208] Furthermore, when using liquid crystal elements as display elements, TN (Twisted Nematic) ) mode, IPS (In-Plane-Switching) mode, FFS (Frin (Field Switching) mode, ASM (Axially Symmetry) tric aligned Micro-cell) mode, OCB(Optical Compensated Birefringence mode, FLC (Ferroe) lectric Liquid Crystal) mode, AFLC (AntiFerr Features such as the (electric Liquid Crystal) mode can be used. .

[0209] Furthermore, a normally black type liquid crystal display device, for example, one that employs vertical alignment (VA) mode, It may also be used as a transmissive liquid crystal display device. Several vertical orientation modes can be listed. For example, MVA (Multi-Domain Vertical Alignment) ) Mode, PVA (Patterned Vertical Alignment) Mode You can use modes such as ASV mode.

[0210] Furthermore, the display device 700 may have a protective film 799. Figures 22 and 23 show the display device This shows an example where the part 700 has a protective film 799. In the example shown in Figure 23, the sealing material The ends have indentations. The method for forming the protective film 799 will be explained. First, the transistor etc. The first substrate 701 provided and the second substrate 705 provided with a colored film 736 etc. are provided. Bonding is performed using adhesive material 712. Next, a protective film 799 is formed using the ALD method. Regarding the connection points with the anisotropic conductive film 780, etc., the protective film 799 can be masked. It is possible to prevent its formation.

[0211] The ALD method can form extremely uniform and dense films on the deposition surface. By using the LD method, for example, aluminum oxide, hafnium oxide, zirconium oxide Titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide (ITO) Tantalum oxide, silicon oxide, manganese oxide, nickel oxide, erbium oxide, copper oxide Balsam, tellurium oxide, barium titanate, titanium nitride, tantalum nitride, aluminum nitride , tungsten nitride, cobalt nitride, manganese nitride, hafnium nitride, etc. as protective films It is possible to form a film. Furthermore, the protective film is not limited to an insulating film; a conductive film can also be formed. This is also good. For example, depositing thin films of ruthenium, platinum, nickel, cobalt, manganese, copper, etc. It is possible.

[0212] By forming a protective film 799 on the side surface of the display panel using the ALD method, moisture and other elements are protected. This suppresses the intrusion of external components. As a result, it suppresses fluctuations in transistor characteristics. This allows for a narrower bezel and stabilizes the operation of peripheral circuits. This allows for an expansion of the display area and even higher resolution display devices.

[0213] Furthermore, by using the protective film 799, even if the distance between the edge of the peripheral circuit and the edge of the substrate is narrowed... Because of its high barrier properties, the transistor characteristics are stable, meaning the operation of the surrounding circuits is stable. Therefore, the bezel of the display panel can be narrowed. For example, the distance from the peripheral circuit to the edge of the board (panel) The distance to the processing / cutting section can be set to 300 μm or less, preferably 200 μm or less. Furthermore, the structure at the end can also be made into an uneven shape as shown in Figure 23.

[0214] [Display device that uses light-emitting elements as display elements]

[0215] The display device 700 shown in Figure 24 has a capacitive element 790b. The capacitive element 790b is This structure has a dielectric material between the pair of electrodes. More specifically, one electrode of the capacitive element 790b It is formed in the same process as the conductive film that functions as the gate electrode of transistor 750. Using a conductive film, the other electrode of the capacitive element 790b is the source of the transistor 750. A conductive film is used that functions as both an electrode and a drain electrode. Furthermore, a conductive film is sandwiched between the pair of electrodes. As the dielectric, an insulating film that functions as the gate insulating film of transistor 750 is used.

[0216] Furthermore, in Figure 24, a planar insulating film 770 is provided on the insulating film 768.

[0217] The planarizing insulating film 770 can be polyimide resin, acrylic resin, or polyimideamide resin. , heat-resistant organic materials such as benzocyclobutene resin, polyamide resin, and epoxy resin These can be used. Furthermore, by stacking multiple insulating films formed from these materials... A planarizing insulating film 770 may be formed. Also, as shown in Figure 21, the planarizing insulating film 77 It is also acceptable to have a configuration that does not include zero.

[0218] Furthermore, the display device 700 shown in Figure 24 has a light-emitting element 782. The light-emitting element 782 is The device 700 has a conductive film 784, an EL layer 786, and a conductive film 788. The EL layer 786 of the light-emitting element 782 emits light to display an image. It is possible.

[0219] Furthermore, the conductive film 784 serves as the source electrode and drain electrode of the transistor 750. It is connected to a conductive film that functions as a pixel. The conductive film 784 is formed on the planar insulating film 770 and is connected to the pixel. It functions as an electrode, that is, one of the electrodes of the display element. The conductive film 784 is visible light In this, a transparent conductive film or a conductive film that is reflective in visible light can be used. Examples of conductive films that are transparent in visible light include indium (In) and zinc. It is preferable to use a material containing one element selected from (Zn) and tin (Sn). For example, a reflective conductive film can be made from a material containing aluminum or silver. stomach.

[0220] Furthermore, the display device 700 shown in Figure 24 has an insulating film 770 and a conductive film 784 on which an insulating film is applied. A border film 730 is provided. The insulating film 730 covers a portion of the conductive film 784. 782 is a top emission structure. Therefore, the conductive film 788 is translucent, E It transmits the light emitted by the L layer 786. In this embodiment, top emission The structure is illustrated as an example, but is not limited to this. For example, light is emitted from the conductive film 784 side. The bottom emission structure and the dual emission of light to both conductive film 784 and conductive film 788 It can also be applied to ammonium emission structures.

[0221] Furthermore, a colored film 736 is provided in a position that overlaps with the light-emitting element 782, and overlaps with the insulating film 730. A light-shielding film 738 is provided at the location, the routing wiring section 711, and the source driver circuit section 704. Furthermore, the colored film 736 and the light-shielding film 738 are covered with an insulating film 734. Furthermore, the space between the light-emitting element 782 and the insulating film 734 is filled with a sealing film 732. (See Figure 24) In the display device 700 shown, an example was given of a configuration in which a colored film 736 is provided, It is not limited to this. For example, when the EL layer 786 is formed by coloring, A configuration without the film 736 is also possible.

[0222] Furthermore, as shown in Figure 25, the display device 700 may have a protective film 799. By forming a protective film 799 on the side surface of the tubing using the ALD method, external components such as moisture are prevented from entering. In particular, when an organic EL layer is used as the EL layer 786, water By suppressing the intrusion of particles, the degradation of the EL layer is inhibited, and the lifespan of the light-emitting element is extended. This is preferable because it allows for this.

[0223] The protective film 799 is, for example, on the first substrate 7 on which transistors and light-emitting elements are provided. After bonding 01 to the second substrate 705, the film can be formed.

[0224] This embodiment can be freely combined with other embodiments.

[0225] (Embodiment 3) In this embodiment, an example is shown in which the energy storage device is charged by wireless power transfer. Wireless power transmission can utilize electric fields, magnetic fields, electromagnetic waves, etc. Antennas, coils, etc., can be used as signaling elements.

[0226] An electronic device according to one aspect of the present invention receives electric fields, magnetic fields, electromagnetic waves, etc., from an antenna, coil, etc. It is preferable to have a device. Furthermore, an electronic device according to one aspect of the present invention may have a capacitor for charging. It is preferable to have a sensor.

[0227] By using coupling coils and coupling capacitors, it becomes possible to charge energy storage devices without contact. Furthermore, the coupling coil can be changed into an antenna. Here, a secondary battery is used as an energy storage device. An example of its use is shown. The primary coil of the charger and the secondary coil of the electronic device are magnetically coupled. By using an electromagnetic induction method that generates a voltage in the secondary coil using an alternating magnetic field generated from the first coil, Charging is performed by a mechanism in which power is transmitted to the secondary coil side without contact. (Curved surface of the structure) Since it is preferable to provide the coil in contact with the film, the coil of the electronic device also has a flexible film. It is preferable to install it in the m. Here, a coil installed in an electronic device is used as an antenna. That's fine.

[0228] When an antenna is provided on the secondary battery of an arm-worn electronic device having a display module, It is not limited to charging secondary batteries by touch, but also incorporates memory to send and receive electronic data. It can be used to obtain location information and GPS time, and display location and time. You may also install an antenna that can do things like that.

[0229] For safety reasons, the input and output terminals for charging or discharging the secondary battery are not exposed, as it will come into contact with a part of the human body. It is preferable not to allow it to be exposed. If the input / output terminals are exposed, water such as rain can damage the input / output terminals. There is a risk of short circuits or electric shock if the input / output terminals come into contact with the human body. If such a device is present, the input / output terminals can be configured not to be exposed on the surface of the electronic device.

[0230] Except for the inclusion of an antenna, coil, and wireless power supply converter, the same applies to Embodiment 1. Since it is identical to [the previous explanation], further detailed explanations will be omitted here.

[0231] According to Embodiment 1, an energy storage device, in this case a secondary battery, is fixed on a board, and a surface is placed on the secondary battery. Attach the indicator module. The secondary battery preferably has a curved shape. Also, The secondary battery is preferably flexible. A wireless power supply unit is electrically connected to the secondary battery. Install the converter and antenna. Also, ensure that the wireless power supply converter and part of the display unit overlap. Secure it.

[0232] The wireless power converter and antenna weigh less than 10g, and the total weight is almost the same as in Embodiment 1. It can be made to have almost the same weight.

[0233] Figure 12 shows a schematic diagram of an electronic device 400 having an antenna (not shown) and a charger 401. As shown, if the electronic device 400 is placed on the charger 401, power will be supplied from the antenna of the charger 401. This can be supplied to the electronic device 400 to charge the secondary battery of the electronic device 400.

[0234] Furthermore, information such as the remaining battery level and the time remaining until full charge is displayed on the electronic device 400. It is possible to display it.

[0235] This embodiment can be freely combined with other embodiments.

[0236] (Embodiment 4) In this embodiment, the method for manufacturing a thin storage battery as shown in Embodiment 1 and the coin-type storage battery Let me explain an example of the structure.

[0237] [Method for manufacturing a thin rechargeable battery] The method for manufacturing a thin secondary battery using an outer casing made of film, as shown in Embodiment 1, is described below. Let me explain. Figure 10 shows the external view of a thin secondary battery. Also, the dashed line A1-A in Figure 10. The cross-sections obtained by cutting along line 2 and the dashed line B1-B2 are shown in Figures 11(A) and 11(B), respectively.

[0238] This document describes a method for manufacturing a thin, rechargeable battery.

[0239] The separator 207 is processed into a bag shape and encloses either the positive electrode 203 or the negative electrode 206. It is preferable to arrange them in such a way. For example, as shown in Figure 13(A), the positive electrode 203 is sandwiched between them. The separator 207 is folded in half, and the sealing portion 5 is formed outside the area that overlaps with the positive electrode 203. By sealing with 14, the positive electrode 203 can be securely supported within the separator 207. And, as shown in Figure 13(B), the positive electrode 203 enclosed in the separator 207 and the negative electrode By alternately stacking poles 206 and other elements and arranging them inside the outer casing 209, a thin secondary battery is created. It is good to form it.

[0240] Figure 14(B) shows an example of welding a current collector to a lead electrode. As an example, positive electrode current collector 20 An example of welding part 1 to the positive lead electrode 510 is shown. The positive current collector 201 is subjected to ultrasonic welding, etc. It is used to weld the positive lead electrode 510 in the welding area 512. Also, the positive current collector 201 Furthermore, by having the curved portion 513 shown in Figure 14(B), after the thin secondary battery is manufactured, the outside This can alleviate the stress caused by applied force, thereby improving the reliability of thin secondary batteries. It is possible.

[0241] In the thin secondary battery shown in Figures 13 and 14, the positive lead electrode 510 is positive electrode 20 The positive electrode current collector 201 of 3 and the negative electrode lead electrode 511 are the negative electrode current collector of the negative electrode 206 Each of the 204 components is ultrasonically bonded. The positive electrode also serves as the terminal for obtaining electrical contact with the outside. The current collector 201 and the negative electrode current collector 204 can also serve the same purpose. In that case, the lead electrodes Without using it, a portion of the positive electrode current collector 201 and the negative electrode current collector 204 are exposed to the outside from the outer casing 209. You can also arrange them so that they are exposed.

[0242] Also, in Figure 10, the positive lead electrode 510 and the negative lead electrode 511 are arranged on the same side. However, as shown in Figure 15, the positive lead electrode 510 and the negative lead electrode 511 are on different sides. They may be arranged as follows. Thus, in one aspect of the present invention, the storage battery allows the lead electrodes to be freely arranged. Because it allows for a high degree of design freedom, products using a storage battery according to one embodiment of the present invention This increases the design flexibility. Furthermore, it allows for the production of products using a battery according to one aspect of the present invention. It can enhance sexual performance.

[0243] In a thin battery, the outer casing 209 may be made of, for example, polyethylene, polypropylene, or Aluminum is placed on a film made of materials such as recarbonate, ionomer, and polyamide. A highly flexible metal thin film such as stainless steel, copper, or nickel is provided, and further an outer layer is placed on the metal thin film. An insulating synthetic resin film, such as polyamide resin or polyester resin, is provided on the outer surface of the device. A three-layer film can be used.

[0244] Also, in Figure 11, as an example, the positive electrode active material layer and the negative electrode active material layer facing each other across a separator. Although the number of material layer sets is set to 5, of course, the number of active material layer sets is not limited to 5, and may be more than 5. Good, or even less. If there are many active material layers, then a battery with a larger capacity is needed. This is possible. Furthermore, when the number of active material layers is small, it can be made thinner and has excellent flexibility. It can be used as a battery.

[0245] In the above configuration, the casing 209 of the secondary battery has a radius of curvature of 30 mm or more, preferably curved. It can be deformed within a range of a radius of 10 mm or more. The film that forms the outer casing of the secondary battery is It consists of one or two layers, and in the case of a rechargeable battery with a stacked structure, the curved battery The cross-sectional structure consists of two curved sections of the outer film.

[0246] The radius of curvature of a surface will be explained using Figure 16. In Figure 16(A), the curved surface 170 In the plane 1701 that cuts through 0, a portion of the curve 1702 contained in the curved surface 1700 is a circle Approximating it as an arc, let the radius of the circle be the radius of curvature 1703, and the center of the circle be the center of curvature 1704. Figure 16(B) shows a top view of the curved surface 1700. Figure 16(C) shows the curved surface on plane 1701. The cross-sectional view of 1700 is shown. When a curved surface is cut by a plane, the angle of the plane relative to the curved surface... The radius of curvature of the curve appearing in the cross-section will differ depending on the cutting position, but this specification In such cases, the smallest radius of curvature is taken as the radius of curvature of the surface.

[0247] A curved secondary battery was constructed using two films as an outer casing, sandwiching the electrodes, electrolyte, and other components of the 1805 battery. In this case, the radius of curvature 1802 of the film 1801 on the side closer to the center of curvature 1800 of the secondary battery. This is smaller than the radius of curvature 1804 of film 1803 on the side farther from the center of curvature 1800. Figure 17(A)). When the secondary battery is curved to make the cross-section arc-shaped, the center of curvature is close to 1800. Compressive stress is applied to the surface of the film, and tension is present on the surface of the film far from the center of curvature of 1800. Tension stress is applied (Figure 17(B)). Patterns are formed on the surface of the exterior body by recesses or protrusions. Once formed, even if compressive or tensile stresses are applied, the effects of strain remain. This can be kept within an acceptable range. Therefore, the secondary battery has an outer casing that is closer to the center of curvature. It can be deformed within a range where the radius of curvature is 30 mm or more, preferably 10 mm or more. .

[0248] Furthermore, the cross-sectional shape of a secondary battery is not limited to a simple arc shape, but can also have a shape in which part of it is an arc. It is possible to create shapes such as the one shown in Figure 17(C), or wavy (Figure 17(D)), or S-shaped. It is also possible to do so. If the curved surface of the secondary battery has a shape with multiple centers of curvature, Among the radii of curvature at each of the number of curvature centers, in the surface with the smallest radius of curvature, 2 The radius of curvature of the outer casing closest to the center of curvature of each outer casing is 30 mm or more, preferably 10 mm. The secondary battery can be deformed in the range of m or greater.

[0249] Next, we will explain the aging process after the secondary battery has been manufactured. It is preferable to perform aging. An example of aging conditions is described below. First, charge at a rate of 0.001C to 0.2C. The temperature should be above room temperature, for example. The temperature should be kept below 40°C. If decomposition of the electrolyte occurs at this temperature and gas is generated, When that gas accumulates inside the cell, a region is created where the electrolyte cannot come into contact with the electrode surface. This means that the effective reaction area of ​​the electrode decreases, and the effective current density increases. It is correct.

[0250] When the current density becomes excessively high, a voltage drop occurs depending on the resistance of the electrodes, and lithium is lost from the active material. Simultaneously with lithium insertion, lithium deposition also occurs on the surface of the active material. This can lead to a decrease in capacity. For example, after lithium is deposited, a film or other substance may grow on the surface. If this happens, the lithium deposited on the surface will not be able to dissolve, and the lithium that does not contribute to the capacity will not be able to dissolve. This can occur. Also, if the deposited lithium physically collapses and loses conductivity with the electrode, However, lithium that does not contribute to the capacity is still produced. Therefore, the electrodes are affected by the voltage drop. It is preferable to release the gas before reaching the lithium potential.

[0251] Furthermore, after degassing, the temperature should be higher than room temperature, preferably between 30°C and 60°C. More preferably, at a temperature of 35°C to 60°C, for example, for 1 hour to 100 hours. It may be held in an electrically charged state. During the initial charging, the electrolyte that decomposes on the surface forms a film. Therefore, for example, by holding it at a temperature higher than room temperature after degassing, the formed It is also possible that the coating may become denser.

[0252] In this case, when bending a thin battery, it is preferable to bend it after venting the gas. i. By bending after degassing, for example, in the region where stress is applied by bending This prevents the deposition of lithium and other related issues.

[0253] [Coin-type rechargeable battery] Next, as an example of an energy storage device, an example of a coin-type battery will be explained using Figure 18. Figure 1 Figure 8(A) is an external view of a coin-type (single-layer flat-type) storage battery, and Figure 18(B) is a cross-section thereof. This is a diagram.

[0254] The coin-type rechargeable battery 300 consists of a positive electrode can 301 which also serves as the positive terminal and a negative electrode can which also serves as the negative terminal. 302 is insulated and sealed by a gasket 303 made of polypropylene or the like. The negative electrode 307 consists of a negative electrode current collector 308 and a negative electrode active material layer 309 provided in contact with it. It is formed by the following. The negative electrode active material layer 309 has the negative electrode active material shown in Embodiment 1. Furthermore, it is preferable to use the negative electrode shown in Embodiment 2 for the negative electrode 307.

[0255] The positive electrode 304 consists of a positive electrode current collector 305 and a positive electrode active material layer 30 provided in contact with it. Formed by 6. For the positive electrode active material layer 306, please refer to the description of the positive electrode active material layer 202. Also, for separator 310, refer to the description for separator 207. Furthermore, the electrolyte is... Refer to the description for electrolyte 208.

[0256] Furthermore, the positive electrode 304 and negative electrode 307 used in the coin-type storage battery 300 are each live metal The layer only needs to be formed on one side.

[0257] The positive electrode can 301 and negative electrode can 302 are made of nickel and aluminum, which are corrosion-resistant to the electrolyte. Metals such as um, titanium, or alloys thereof or alloys of these with other metals (for example, stainless steel) Materials such as stainless steel can be used. In addition, nickel and aluminum can be used to prevent corrosion by the electrolyte. It is preferable to coat with aluminum or the like. Positive electrode can 301 is with positive electrode 304, and negative electrode can 302 is with negative Connect each of the poles 307 electrically.

[0258] These negative electrode 307, positive electrode 304, and separator 310 are impregnated with the electrolyte, as shown in Figure 18(B As shown in the image, with the positive electrode can 301 at the bottom, the positive electrode 304, separator 310, and negative electrode 307, The negative electrode cans 302 are stacked in this order, and the positive electrode can 301 and the negative electrode can 302 are connected by a gasket 303. The coin-shaped rechargeable battery 300 is manufactured by crimping the parts together.

[0259] This embodiment can be freely combined with other embodiments.

[0260] (Embodiment 5) In this embodiment, a film-forming method that can be used to manufacture a display device according to one aspect of the present invention is described. I will now explain the film deposition apparatus.

[0261] CVD and ALD film deposition Conventional CVD-based film deposition equipment uses a precursor gas for the reaction during film deposition. One or more types are supplied to the chamber simultaneously. The film deposition apparatus using the ALD method is The precursors for the reaction are sequentially introduced into the chamber, and the sequence of gas introduction is repeated. The film is formed by switching each switching valve (also called a high-speed valve) The system is then modified to supply two or more types of precursors to the chamber in sequence, and multiple types of precursors are mixed. To prevent this, an inert gas (such as argon or nitrogen) is applied after the first precursor. We will introduce a second precursor. Also, instead of introducing an inert gas, we will use vacuum evacuation. Therefore, after the first precursor is discharged, the second precursor can be introduced.

[0262] Figures 27(A), (B), (C), and (D) show the film deposition process of the ALD method. The first precursor SA601 is adsorbed onto the surface of the substrate (see Figure 27(A)), and a first single layer is formed (Figure 27(A)). See 27(B). In this case, metal atoms etc. contained in the precursor are present in the water on the substrate surface. It can bond with acidic groups. Alkyl groups such as methyl and ethyl groups can be bonded to metal atoms. It is permissible. The second precursor 6 is introduced after the first precursor 601 has been exhausted. It reacts with O2 (see Figure 27(C)) to form a second single layer, which is then stacked on top of the first single layer to form a thin film. A second precursor is formed (see Figure 27(D)). If present, the metal atom or alkyl bonded to the metal atom present in the first precursor A chemical reaction occurs between the base and the oxidizing agent, allowing for the formation of an oxide film.

[0263] Furthermore, the ALD method is a film deposition method based on surface chemical reactions, in which the precursor is applied to the surface of the film to be deposited. Adsorption occurs, and a self-stopping mechanism acts to further form it. For example, trimethylaluminium A precursor such as um reacts with hydroxyl groups (OH groups) present on the surface of the film to be deposited. At that time, only a surface reaction due to heat occurs, so the precursor comes into contact with the film surface, and thermal energy Metal atoms and other elements from the precursor can be adsorbed onto the film-forming surface via energy. Furthermore, the precursor has a high vapor pressure, is thermally stable before film formation, and does not self-decompose. It has characteristics such as rapid chemical adsorption to the substrate. Furthermore, the precursor is introduced as a gas. Therefore, there is sufficient time for the first and second precursors, which are introduced alternately, to diffuse properly. If this is possible, even in areas with high aspect ratio irregularities, film formation with good coverage can be achieved. It is possible.

[0264] Furthermore, in the ALD method, the gas introduction sequence is controlled and repeated multiple times until the desired thickness is reached. By repeating the process, a thin film with excellent step coverage can be formed. The thickness of the thin film can be repeated. Because it can be adjusted by the number of times, precise film thickness adjustment is possible. Also, exhaust capacity By increasing the force, the film deposition rate can be increased, and furthermore, the impurity concentration in the film can be reduced. It is possible.

[0265] ALD methods include thermal ALD (thermal ALD) and plasma ALD (plasma ALD). There is the Zuma ALD method. In the thermal ALD method, thermal energy is used to carry out the reaction of the precursor. The plasma ALD method is a method in which the precursor reaction is carried out in a radical state.

[0266] The ALD method allows for the precise deposition of extremely thin films. It can also be used on surfaces with unevenness. It has a high coverage rate and high film density.

[0267] Furthermore, because the thermal ALD method does not cause plasma damage, it suppresses the occurrence of defects in the film. It is possible.

[0268] Plasma ALD Furthermore, by depositing films using the plasma ALD method, it is possible to achieve results that are superior to the thermal ALD method (thermal ALD method). This enables film deposition at even lower temperatures. For example, the plasma ALD method can be used at temperatures below 100 degrees Celsius. It is possible to deposit films without reducing the deposition rate. In addition, in the plasma ALD method, N2 is used Because radicalization can be performed by a rasma, not only oxides but also nitrides can be deposited. It is possible.

[0269] Furthermore, the plasma ALD method can enhance the oxidizing power of the oxidizing agent. When film formation is performed in D, the precursor remains in the film, or the precursor detaches from the precursor. It is possible to reduce the mechanical components, and also reduce carbon, chlorine, hydrogen, etc. in the film. It is possible to have a film with a low concentration of impurities.

[0270] Furthermore, when light-emitting elements (such as organic EL elements) are used as display elements, if the process temperature is high... This could accelerate the degradation of the light-emitting element. However, by using the plasma ALD method, This allows for a reduction in process temperature, thereby suppressing degradation of the light-emitting element.

[0271] Furthermore, when performing plasma ALD, ICP(In) is used to generate radical species. It uses ductively coupled plasma. This can be generated while the film is separated from the substrate, and the substrate or the film is not formed on its surface. Plasma damage to the film can be reduced.

[0272] As described above, by using the plasma ALD method, the process temperature is lower compared to other film deposition methods. It can be lowered and the surface coverage can be increased, and the side surface of the substrate after the display panel has been manufactured A plasma ALD film can be deposited on it. This suppresses the intrusion of water from the outside. This is possible. Therefore, the reliability of the driver operation of peripheral circuits at the edges of the panel is improved. To improve the reliability of transistor characteristics, stable operation is maintained even with a narrow bezel. This makes it possible to create.

[0273] Next, as a film deposition apparatus that can be used to manufacture a display device according to one aspect of the present invention, An example of a placement-based ALD will be explained with reference to Figure 28.

[0274] [Example configuration of the ALD film deposition system] Figure 28 shows an ALD film deposition apparatus that can be used to manufacture a display module according to one embodiment of the present invention. This is a cross-sectional view illustrating the film deposition apparatus ALD described in this embodiment includes a film deposition chamber 180 and It includes a control unit 182 connected to the film deposition chamber 180.

[0275] The control unit 182 is a control device (not shown) that supplies control signals and a control unit that supplies control signals. It is equipped with flow controllers 182a, 182b, and 182c. If high-speed valves are used, they can be used in flow controllers. Specifically, ALD valves, etc. By doing so, the flow rate can be precisely controlled. In addition, the temperature of the flow controller and piping can be controlled. It has a heating mechanism 182h that controls the heating.

[0276] The flow controller 182a is supplied with a control signal, the first raw material, and an inert gas, and controls It has the function of supplying a first raw material or inert gas based on a signal.

[0277] The flow controller 182b is supplied with a control signal, a second raw material, and an inert gas, and controls It has the function of supplying a second raw material or inert gas based on the signal.

[0278] The flow controller 182c is supplied with a control signal and, based on the control signal, connects to the exhaust device 185. It has a continuing function.

[0279] 《Raw material supply department》 Furthermore, the raw material supply unit 181a has the function of supplying the first raw material, and the flow rate controller 182a It is connected.

[0280] The raw material supply unit 181b has the function of supplying a second raw material and is connected to the flow controller 182b. It is being done.

[0281] A vaporizer or heating means can be used in the raw material supply section. This allows for the use of solid raw materials. It is possible to generate gaseous raw materials from liquid raw materials.

[0282] Furthermore, the number of raw material supply units is not limited to two; it can have three or more.

[0283] 《Raw materials》 Various substances can be used as the first raw material.

[0284] For example, volatile organometallic compounds, metal alkoxides, etc., can be used as the first raw material. Cut.

[0285] Various substances that react with the first raw material can be used as the second raw material. For example, Substances that contribute to oxidation reactions, substances that contribute to reduction reactions, substances that contribute to addition reactions, decomposition reactions Substances that contribute to the reaction or substances that contribute to the hydrolysis reaction can be used as the second raw material. ru.

[0286] Furthermore, radicals can be used. For example, raw materials can be supplied to a plasma source, and the plasma These can be used. Specifically, oxygen radicals, nitrogen radicals, etc. can be used. Cut.

[0287] Incidentally, a high-frequency power supply or light source can be used as a plasma source. For example, an inductive connection Combined or capacitively coupled high-frequency power supplies can be used. Alternatively, an excimer laser, An excimer lamp, low-pressure mercury lamp, or synchrotron radiation source can be used as the light source. It is possible. Furthermore, the second raw material is preferably one that reacts with the first raw material at a temperature close to room temperature. Example For example, a raw material whose reaction temperature is between room temperature and 200°C, preferably between 50°C and 150°C. preferable.

[0288] Exhaust system 185 The exhaust device 185 has the function of exhausting and is connected to the flow controller 182c. Even if a trap for capturing the discharged raw material is provided between the discharge port 184 and the flow controller 182c Good. By the way, using a dry pump and / or turbopump etc. in the exhaust system 185 This is possible. By using a turbo pump, the time required for exhaust can be reduced. To remove harmful substances. Exhaust gases and other pollutants are treated using pollution control equipment.

[0289] Control Unit 182 The control device supplies control signals for controlling the flow controller or the heating mechanism, etc. For example, in the first step, the first raw material is supplied to the surface of the processing substrate. Then, in the second step, a second raw material is supplied to react with the first raw material. The first raw material reacts with the second raw material, and the reaction product can be deposited on the surface of the processed member 10. Cut.

[0290] The amount of reaction product deposited on the surface of the processed member 10 is determined by the first step and the second step. By repeating the steps, it can be controlled.

[0291] The amount of the first raw material supplied to the processed member 10 is such that the surface of the processed member 10 is adsorbed by it. The amount that can be produced is limited. For example, the monolayer of the first raw material on the surface of the processed member 10 By selecting the conditions for formation and reacting the second raw material with the monolayer of the first raw material that has been formed, This allows for the formation of a layer containing the reaction product of the first and second raw materials in an extremely uniform manner. can.

[0292] As a result, various materials are formed on the surface of the processed member 10, which has an intricate structure on its surface. A film can be made. For example, a film having a thickness of 3 nm to 200 nm can be made on the processed member 1. It can be formed to 0.

[0293] For example, if small holes called pinholes are formed on the surface of the processed member 10. This allows the material to wrap around to the inside of the pinhole and deposit a thin film, thereby filling the pinhole.

[0294] Furthermore, the surplus first or second raw material is removed from the film deposition chamber 180 using the exhaust device 185. It is then discharged. For example, exhaust can be performed while introducing an inert gas such as argon or nitrogen. stomach.

[0295] 《Deposition chamber 180》 The film deposition chamber 180 has an inlet 183 through which the first raw material, the second raw material, and an inert gas are supplied. It comprises a first raw material, a second raw material, and an outlet 184 for discharging an inert gas.

[0296] The film deposition chamber 180 has a support section 186 that has the function of supporting one or more processed members 10. The heating mechanism 187 has a function to heat the processed material, and the loading and unloading of the processed material 10 It has a door 188 that has the function of opening and closing the area where it is performed.

[0297] For example, a resistance heater or an infrared lamp can be used in the heating mechanism 187.

[0298] The heating mechanism 187 is a machine that heats to, for example, 80°C or higher, 100°C or higher, or 150°C or higher. To possess the ability.

[0299] By the way, the heating mechanism 187 is, for example, set to a temperature of room temperature or higher, preferably 50°C or higher, and 200°C or lower. The workpiece 10 is heated to a temperature of 0°C or lower.

[0300] Furthermore, the film deposition chamber 180 is equipped with a pressure regulator and a pressure sensor.

[0301] 《Support part 186》 The support portion 186 supports one or more processed members 10. This allows for processing in a single cycle. In addition, an insulating film can be formed on one or more processed members 10.

[0302] <Example of a membrane> This section describes the films that can be fabricated using the ALD film deposition apparatus described in this embodiment. I will reveal it.

[0303] For example, oxides, nitrides, fluorides, sulfides, ternaries, metals, or polymers. It can form a film.

[0304] For example, aluminum oxide, hafnium oxide, aluminum silicate, hafnium silicate Licate, lanthanum oxide, silicon dioxide, strontium titanate, tantalum oxide, titanate Zinc oxide, niobium oxide, zirconium oxide, tin oxide, yttrium oxide, cerium oxide Contains um, scandium oxide, erbium oxide, vanadium oxide, or indium oxide, etc. It is possible to form a thin film of this material.

[0305] For example, aluminum nitride, hafnium nitride, silicon nitride, tantalum nitride, titanium nitride, A thin film is formed using a material containing niobium nitride, molybdenum nitride, zirconium nitride, or gallium nitride, etc. It is possible.

[0306] For example, copper, platinum, ruthenium, tungsten, iridium, palladium, iron, cobalt A thin film can be formed using materials containing t or nickel, etc.

[0307] For example, zinc sulfide, strontium sulfide, calcium sulfide, lead sulfide, calcium fluoride It is possible to form films containing materials such as strontium fluoride or zinc fluoride.

[0308] For example, nitrides containing titanium and aluminum, acids containing titanium and aluminum oxides containing aluminum and zinc, sulfides containing manganese and zinc, cerium Sulfides containing erbium and strontium, oxides containing erbium and aluminum, It is possible to form films containing oxides such as ttrium and zirconium.

[0309] 《Aluminum oxide-containing film》 For example, a gas obtained by vaporizing a raw material containing an aluminum precursor compound is used as the first raw material. This can be done. Specifically, trimethylaluminum (TMA, chemical formula Al(CH3)3 ) or tris(dimethylamide)aluminum, triisobutylaluminum, aluminum Using nium tris(2,2,6,6-tetramethyl-3,5-heptanedione), etc. It is possible to be there.

[0310] Water vapor (chemical formula H2O) can be used as a second raw material.

[0311] Using an ALD film deposition apparatus, aluminum oxide is obtained from the first and second raw materials described above. It can form a film containing it.

[0312] Hafnium oxide-containing film For example, using a gas obtained by vaporizing a raw material containing a hafnium precursor compound as the first raw material. This can be done. Specifically, tetrakisdimethylamidehafnium (TDMAH, chemical formula is H) f[N(CH3)2]4) or hafnium such as tetrakis(ethylmethylamide)hafnium Raw materials containing nium amide can be used.

[0313] Ozone can be used as a second raw material.

[0314] 《Tungsten-containing film》 For example, WF6 gas can be used as the first raw material.

[0315] B2H6 gas or SiH4 gas can be used as a second raw material.

[0316] This embodiment can be freely combined with other embodiments.

[0317] (Embodiment 6) This embodiment describes the structure of an oxide semiconductor film.

[0318] Oxide semiconductor films are divided into non-single-crystal oxide semiconductor films and single-crystal oxide semiconductor films. Alternatively, oxide semiconductors can be divided into, for example, crystalline oxide semiconductors and amorphous oxide semiconductors. It can be done.

[0319] Furthermore, as a non-single-crystal oxide semiconductor, CAAC-OS (C Axis Aligne d Crystalline Oxide Semiconductor), polycrystalline oxide These include crystalline semiconductors, microcrystalline oxide semiconductors, and amorphous oxide semiconductors. As conductors, single-crystal oxide semiconductors, CAAC-OS, polycrystalline oxide semiconductors, and microcrystalline oxides are used. Examples include semiconductors.

[0320] First, let's explain the CAAC-OS membrane.

[0321] CAAC-OS film is an oxide semiconductor film having multiple c-axis oriented crystalline regions. .

[0322] Transmission Electron Microscope (TEM) A composite image of the bright-field image and diffraction pattern of the CAAC-OS film was obtained using an optical scope. By observing (also known as high-resolution TEM images), multiple crystalline regions can be identified. On the other hand, high-resolution TEM images also clearly show the boundaries between crystal parts, i.e., grain boundaries. It is not possible to confirm the boundary (also called the boundary). Therefore, the CAAC-OS membrane is This means that a decrease in electron mobility due to grain boundaries is less likely to occur.

[0323] When observing a high-resolution TEM image of the cross-section of the CAAC-OS film from a direction approximately parallel to the sample surface, In the crystalline region, it can be confirmed that the metal atoms are arranged in layers. Each layer of metal atoms is This reflects the unevenness of the surface (also called the surface to be formed) or the upper surface of the CAAC-OS film. It has a specific shape and is arranged parallel to the surface or top surface of the CAAC-OS film to be formed.

[0324] On the other hand, a high-resolution TEM image of the CAAC-OS film plane was observed from a direction approximately perpendicular to the sample surface. Then, it was confirmed that the metal atoms in the crystalline region are arranged in a triangular or hexagonal shape. Yes, it is possible. However, no regularity is observed in the arrangement of metal atoms between different crystalline regions.

[0325] X-ray diffraction (XRD) of CAAC-OS film When structural analysis is performed using the instrument, for example, CAAC-OS having InGaZnO4 crystals is found. Out-of-plane analysis of the film showed a peak at a diffraction angle (2θ) of around 31°. This peak may appear. This peak is attributed to the (009) plane of the InGaZnO4 crystal. Therefore, the crystals of the CAAC-OS film have c-axis orientation, and the c-axis is on the surface to be formed or on the upper surface. It can be confirmed that it is facing in a nearly vertical direction.

[0326] Furthermore, the out-of-plane CAAC-OS film having InGaZnO4 crystals Analysis using this method revealed that in addition to the peak near 2θ = 31°, there is also a peak near 2θ = 36°. In some cases, this may occur. Peaks near 2θ of 36° indicate c-axis orientation in a portion of the CAAC-OS film. This indicates the presence of crystals that do not possess properties. The CAAC-OS film has a 2θ of approximately 31°. It is preferable that a peak is shown and that no peak is shown near 36° for 2θ.

[0327] CAAC-OS films are oxide semiconductor films with low impurity concentrations. The impurities include hydrogen and carbon. These are elements other than the main components of oxide semiconductor films, such as silicon and transition metal elements. In particular, silicon Elements such as condensate, which have a stronger bonding force with oxygen than the metal elements that make up oxide semiconductor films, are acidic. By removing oxygen from the oxide semiconductor film, the atomic arrangement of the oxide semiconductor film is disrupted, reducing its crystallinity. This is a contributing factor. Also, heavy metals such as iron and nickel, argon, and carbon dioxide have a high atomic ratio. Because of its large diameter (or molecular radius), when it is contained within an oxide semiconductor film, the oxide semiconductor film This disrupts the atomic arrangement and reduces crystallinity. Pure substances can act as carrier traps or carrier sources.

[0328] Furthermore, CAAC-OS films are oxide semiconductor films with a low defect level density. For example, oxidation Oxygen vacancies in semiconductor films can act as carrier traps or capture hydrogen. This can sometimes become a source of carrier transmission.

[0329] A low impurity concentration and low defect level density (few oxygen vacancies) are referred to as high-purity intrinsic or This is essentially called high-purity intrinsic. Oxide semiconductors that are high-purity intrinsic or substantially high-purity intrinsic. Because membranes have fewer carrier sources, they can have lower carrier densities. Therefore The transistor using the oxide semiconductor film exhibits electrical characteristics such as a negative threshold voltage. It rarely becomes (also called normally-on). Also, it is of high purity and is essentially high purity. Intrinsically pure oxide semiconductor films have few carrier traps. Therefore, the oxide semiconductor film Transistors using conductive films exhibit less variation in electrical characteristics and are highly reliable. Yes. Furthermore, the charge trapped in the carrier trap of the oxide semiconductor film requires time to be released. This process can last for a long time, sometimes behaving as if it were a fixed charge. Therefore, the impurity concentration... Transistors using oxide semiconductor films with high defect level density have unstable electrical properties. This can sometimes happen.

[0330] When oxide semiconductors contain impurities or defects, their properties may change due to light, heat, etc. Yes. For example, impurities contained in oxide semiconductors can act as carrier traps, or they can cause carriers to be trapped. It can sometimes be a source of rear emissions. Also, oxygen vacancies in oxide semiconductors can trap carriers. In some cases, it may become a carrier source by capturing hydrogen.

[0331] CAAC-OS, with its low impurity and oxygen vacancy rate, is suitable for oxide semiconductors with low carrier density. Yes, there is. Specifically, 8 x 10 11 / cm 3 Less than 1 × 10 11 / cm 3 less than, More preferably 1 × 10 10 / cm3 It is less than 1 × 10 -9 / cm 3 The above career It can be made into an oxide semiconductor with a density of 1.5. Such an oxide semiconductor can be made into a high-purity intrinsic or This is essentially a high-purity intrinsic oxide semiconductor. CAAC-OS has a low impurity concentration and is defective. It has a low depression density. In other words, it can be said to be an oxide semiconductor with stable properties.

[0332] Furthermore, transistors using CAAC-OS films exhibit electrical properties when irradiated with visible light or ultraviolet light. Sexual variation is small.

[0333] Next, we will explain microcrystalline oxide semiconductor films.

[0334] Microcrystalline oxide semiconductor films allow for the confirmation of crystalline regions in high-resolution TEM images. It has regions where a clear crystalline structure cannot be observed, and regions where a clear crystalline structure cannot be identified. Microcrystalline oxide semiconductor The crystalline portion contained in the film is between 1 nm and 100 nm, or between 1 nm and 10 nm. They are often small in size. In particular, between 1 nm and 10 nm, or between 1 nm and 3 nm. An oxide semiconductor film having nanocrystals (nc) which are microcrystalline, c-OS(nanocrystalline oxide semiconductor It is called a film. Furthermore, nc-OS films, for example, clearly show grain boundaries in high-resolution TEM images. It may not be possible to confirm this.

[0335] nc-OS films are used in minute regions (for example, regions between 1 nm and 10 nm, especially regions between 1 nm and 10 nm). The atomic arrangement has periodicity in the region of 3 nm or less. In addition, the nc-OS film is different There is no regularity in the crystal orientation between the crystalline regions. Therefore, no orientation is observed throughout the film. Therefore, depending on the analytical method, nc-OS films may be indistinguishable from amorphous oxide semiconductor films. There are cases where this does not occur. For example, when using X-rays with a diameter larger than that of the crystalline region on an nc-OS film. When structural analysis is performed using an RD instrument, out-of-plane analysis shows that crystals No peaks indicating a plane are detected. Also, for the nc-OS film, a probe larger than the crystalline region is detected. Electron diffraction using an electron beam with a diameter (e.g., 50 nm or more) (also called limited-area electron diffraction). When this is done, a diffraction pattern resembling a halo pattern is observed. On the other hand, when applied to an nc-OS film... Furthermore, nanobeam electron beams with a probe diameter close to or smaller than the size of the crystal region are used. When nanobeam diffraction is performed, spots are observed. Furthermore, nanobeam electron diffraction is used on nc-OS films. When this is done, a region of high brightness may be observed in a circular (ring-shaped) pattern. When nanobeam electron diffraction is performed on an nc-OS film, multiple spots are observed within a ring-shaped region. This can sometimes be observed.

[0336] nc-OS films are oxide semiconductor films with higher orderliness than amorphous oxide semiconductor films. Therefore, nc-OS films have a lower defect level density than amorphous oxide semiconductor films. However, Furthermore, the nc-OS film shows no regularity in crystal orientation between different crystalline regions. Therefore, nc- OS films have a higher defect level density compared to CAAC-OS films.

[0337] Next, we will explain amorphous oxide semiconductor films.

[0338] Amorphous oxide semiconductor films have an irregular atomic arrangement within the film and do not contain crystalline regions. These are oxide semiconductor films. One example is an oxide semiconductor film that has an amorphous state, such as quartz.

[0339] In amorphous oxide semiconductor films, crystalline regions cannot be observed in high-resolution TEM images. .

[0340] When structural analysis of amorphous oxide semiconductor films is performed using an XRD device, out-of- Analysis using the plane method does not detect peaks indicating crystal planes. Furthermore, amorphous oxides are present. When electron diffraction is performed on a semiconductor film, a halo pattern is observed. Also, amorphous oxides... When nanobeam electron diffraction is performed on a semiconductor film, no spots are observed, and a halo pattern is formed. This is observed.

[0341] Furthermore, oxide semiconductor films exhibit physical properties between nc-OS films and amorphous oxide semiconductor films. It may have a structure. Oxide semiconductor films having such a structure are particularly amorphous lycoated. Amorphous-like Oxide Semiconductor (a-like OS) It is called a conductor film.

[0342] a-like OS films exhibit porosity (also called voids) in high-resolution TEM images. In some cases, this may occur. Also, in high-resolution TEM images, the crystalline portion can be clearly identified. The a-like OS film has regions where crystals can be observed and regions where crystals cannot be observed. Crystallization occurs and the growth of the crystal portion is observed by minute electron irradiation, such as that observed by TEM. This can sometimes be the case. On the other hand, with a high-quality nc-OS film, even trace amounts that can be observed by TEM are not visible. Crystallization due to electron irradiation is hardly observed.

[0343] Furthermore, the measurement of the crystal size of a-like OS films and nc-OS films is performed using high resolution. This can be done using TEM imaging. For example, the crystal of InGaZnO4 has a layered structure. It has two Ga-Zn-O layers between the In-O layers. Unit size of InGaZnO4 crystal The child has three In-O layers and six Ga-Zn-O layers, for a total of nine layers arranged in the c-axis direction. It has a layered structure. Therefore, the spacing between these adjacent layers is the (009) plane. It is approximately the same as the lattice plane spacing (also called the d value), and from crystal structure analysis, its value is 0.29n m has been determined. Therefore, we focused on the lattice fringes in the high-resolution TEM image, and between the lattice fringes In areas where the interval is between 0.28 nm and 0.30 nm, each lattice fringe is In This corresponds to the ab-plane of the GaZnO4 crystal.

[0344] Furthermore, oxide semiconductor films may have different densities depending on their structure. For example, a certain oxide semiconductor... If the composition of the conductive film is known, it can be compared with the density of a single crystal with the same composition. This allows us to estimate the structure of the oxide semiconductor film. For example, with respect to the density of a single crystal, a -The density of the OS film is between 78.6% and 92.3%. Also, for example, single-layer The density of the nc-OS film and the CAAC-OS film is 92.3% or higher relative to the density of the crystal. It will be less than 00%. Note that oxide semiconductor films with a density of less than 78% of the density of a single crystal are Furthermore, forming the film itself is difficult.

[0345] The above will be explained using a concrete example. For example, In:Ga:Zn=1:1:1[original In an oxide semiconductor film satisfying the [number of particles ratio], a single crystal InGaZnO having a rhombohedral crystal structure is used. The density of 4 is 6.357 g / cm³ 3 Therefore, for example, In:Ga:Zn=1:1: In an oxide semiconductor film satisfying 1 [atomic ratio], the density of the a-like OS film is 5.0 g / cm 3 More than 5.9g / cm3 It becomes less than. Also, for example, In:Ga:Zn=1:1 In an oxide semiconductor film satisfying :1 [atomic ratio], the density of the nc-OS film and CAAC -The density of the OS film is 5.9 g / cm³ 3 More than 6.3g / cm 3 It will be less than.

[0346] Note that single crystals with the same composition may not exist. In that case, a mixture of crystals with different compositions in any proportion may be used. By combining single crystals, the density corresponding to a single crystal with a desired composition can be calculated. This can be done. The density of a single crystal of the desired composition depends on the ratio of single crystals of different compositions that are combined. Therefore, it should be calculated using a weighted average. However, the density should be calculated using as few types of single crystals as possible. It is preferable to calculate by combining these factors.

[0347] Oxide semiconductor films include, for example, amorphous oxide semiconductor films, a-like OS films, and micro The multilayer film may have two or more types of films, including crystalline oxide semiconductor films and CAAC-OS films. .

[0348] This embodiment can be freely combined with other embodiments. [Explanation of symbols]

[0349] 10 Processed parts 100 Electronic equipment 102 Display section 103 Energy storage device 104 Circuit board 105 Arrow 106 Energy storage device 107 Circuit board 111 board 112 board 113 board 121 Sealing part 126 cabinets 131 Fasteners 151 board 152 display elements 153 Circuit section 161 areas 162 areas 163 distance 164 areas 165 areas 171 End 172 End 173 End 174 End 180 Deposition chamber 181a Raw material supply section 181b Raw material supply department 182 Control Unit 182a Flow controller 182b Flow controller 182c Flow controller 182h heating mechanism 183 Inlet 184 Outlet 185 Exhaust system 186 Support part 187 Heating mechanism 188 Doors 201 Positive electrode current collector 202 Cathode active material layer 203 Positive electrode 204 Negative electrode current collector 205 Negative electrode active material layer 206 Negative electrode 207 Separator 208 Electrolyte 209 Exterior 300 Battery 301 Positive electrode can 302 Negative electrode can 303 Gasket 304 Positive electrode 305 Positive electrode current collector 306 Positive electrode active material layer 307 Negative electrode 308 Negative electrode current collector 309 Negative electrode active material layer 310 Separator 400 Electronic equipment 401 Charger 510 Positive lead electrode 511 Negative lead electrode 512 Welding Area 513 Curved section 514 Sealing part 601 Precasa 602 Precasa 700 Display device 701 circuit board 702 pixel section 704 Source Driver Circuit 705 circuit board 706 Gate Driver Circuit Section 708 FPC terminal section 710 signal line 711 Wiring section 712 Sealant 716 FPC 721 Gate 722 Semiconductor layer 723 Electrode 724 Electrode 730 Insulating Film 732 Encapsulation film 734 Insulating Film 736 Colored film 738 Light-shielding film 750 transistors 752 transistors 760 connecting electrodes 764 Insulating Film 766 Insulating film 768 Insulating film 769 Insulating film 770 Planarizing Insulator 772 Conductive film 774 Conductive film 775 liquid crystal elements 776 Liquid Crystal Layer 778 Structure 780 Anisotropic conductive film 782 Light-emitting element 784 Conductive film 786 EL layer 788 Conductive film 790 Capacitive elements 790a Capacitive element 790b Capacitive element 799 Protective film 1700 curved surface 1701 Plane 1702 Curve 1703 Radius of curvature 1704 Center of curvature 1800 Center of curvature 1801 film 1802 radius of curvature 1803 film 1804 radius of curvature 1805 Electrodes, electrolytes, etc.

Claims

1. It comprises a display unit, a power storage device, a first plate, a second plate, and a housing. The display unit, the energy storage device, the first plate, the second plate, and the housing are each curved. The second plate has a first portion having a first radius of curvature and a second portion having a second radius of curvature smaller than the first radius of curvature. The housing is flexible, The housing has a region in which at least a portion of one surface of the second plate is in contact, The housing is fixed to the vicinity of the first end of the second plate by a first fastener. The housing is fixed to the vicinity of the second end of the second plate by a second fastener. The energy storage device is an electronic device arranged along the first portion and not along the second portion.

2. In claim 1, An electronic device that is attached to the user's arm and in contact with the second plate.

Images