Inspection equipment
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2024-12-05
- Publication Date
- 2026-06-17
AI Technical Summary
【0012】 本発明の検査装置は、測定物の状態を検査する検査装置であって、被測定物を保持しX軸座標及びY軸座標で規定される保持面を備える保持手段と、該保持手段に保持された被測定物の内部に生成した超音波振動に基づいて被測定物の状態を検査する検査手段と、を備え、該検査手段は、被測定物の上面にパルスレーザー光線を照射して被測定物の内部に超音波振動を生成する超音波振動生成手段と、被測定物の上面に現れた超音波振動を捕らえる超音波振動捕獲手段と、該超音波振動捕獲手段が捕らえた情報に基づいて画像を生成する画像生成手段と、を備え、該超音波振動生成手段は、所定の繰り返し周波数のパルスレーザー光線を発振する発振器と、該発振器が発振したパルスレーザー光線を該保持手段に保持された被測定物の上面に集光する集光器と、を含み、該繰り返し周波数は、被測定物の内部に伝播する超音波振動の指向性が高くなる値に設定され、被測定物の内部での拡散を抑制して検査における分解能を向上させたことから、被測定物が接合ウエーハである場合は、接合ウエーハの内部の状態を検査することが可能となり、仮に被測定物の上面に金属の膜が被覆されているような場合においても、被測定物の内部に形成されたボイドを検出することができ、デバイスチップの品質を向上させることができる。また、被測定物が単層のウエーハである場合でも、裏面側から表面側に形成された分割予定ラインを検出することができ、該ウエーハの上面に金属の膜が被覆されているような場合においても、該ウエーハの表面に形成された分割予定ラインを検出することができる。
Smart Images
Figure 2026098254000001_ABST
Abstract
Claims
1. An inspection device for inspecting the condition of an object to be measured, The system comprises a holding means for holding an object to be measured and having a holding surface defined by X-axis and Y-axis coordinates, and an inspection means for inspecting the state of the object to be measured based on ultrasonic vibrations generated inside the object held by the holding means, The inspection means comprises an ultrasonic vibration generating means that irradiates the upper surface of the object to be measured with a pulsed laser beam to generate ultrasonic vibrations inside the object to be measured, an ultrasonic vibration capturing means that captures the ultrasonic vibrations that appear on the upper surface of the object to be measured, and an image generating means that generates an image based on the information captured by the ultrasonic vibration capturing means. The ultrasonic vibration generating means includes an oscillator that emits a pulsed laser beam with a predetermined repetition frequency, and a concentrator that focuses the pulsed laser beam emitted by the oscillator onto the upper surface of the object to be measured held by the holding means. The repetition frequency is set to a value that increases the directivity of ultrasonic vibrations propagating inside the object being measured, thereby suppressing diffusion inside the object and improving the resolution of the inspection.
2. The holding means comprises an X-axis moving part that moves in the X-axis direction and a Y-axis moving part that moves in the Y-axis direction. The ultrasonic vibration generating means includes a beam splitter between the oscillator and the light concentrator, and the pulsed laser beam emitted by the oscillator is guided in a first direction by the beam splitter to reach the light concentrator. The ultrasonic vibration capturing means comprises: a capturing oscillator disposed in the second direction of the beam splitter and emitting a capturing laser beam to capture ultrasonic vibrations; a half mirror disposed between the capturing oscillator and the beam splitter; a return mirror disposed in a position straight ahead of the half mirror and the beam splitter and generating a reference laser beam by reflecting the capturing laser beam back to the half mirror; and a light-receiving element that receives interference light between the return light of the capturing laser beam that has passed through the half mirror, been guided in the first direction by the beam splitter to the light collector and captured ultrasonic vibrations on the upper surface of the object to be measured, and the reference laser beam. The inspection apparatus according to claim 1, wherein the image generation means generates an image showing the state of the object to be measured, using the intensity of the interference light received by the light-receiving element as the information.
3. The ultrasonic vibration generating means comprises a beam splitter disposed between the oscillator and the light concentrator, an X-axis scanner that scans the pulsed laser beam guided in a first direction by the beam splitter in the X-axis direction, and a Y-axis scanner that indexes and feeds the pulsed laser beam in the Y-axis direction. The ultrasonic vibration capturing means comprises: a capturing oscillator disposed in the second direction of the beam splitter and emitting a capturing laser beam to capture ultrasonic vibrations; a half mirror disposed between the capturing oscillator and the beam splitter; a return mirror disposed in a position straight ahead of the beam splitter and generating a reference laser beam by reflecting the capturing laser beam back to the half mirror; and a light-receiving element that receives interference light between the return light of the capturing laser beam, which has passed through the half mirror, been guided in the first direction by the beam splitter, reached the light collector, and captured ultrasonic vibrations on the upper surface of the object to be measured, and the reference laser beam. The inspection apparatus according to claim 1, wherein the image generation means generates an image showing the state of the object to be measured, using the intensity of the interference light received by the light-receiving element as the information.
4. The inspection apparatus according to any one of claims 1 to 3, wherein the object to be measured is a bonded wafer formed by joining two wafers, and the joint surface is inspected.