Inspection equipment

The inspection device uses ultrasonic vibrations from a pulsed laser beam to detect voids in bonded wafers, addressing the limitations of infrared cameras and improving device chip quality by identifying and excluding defective regions.

JP2026098996APending Publication Date: 2026-06-18DISCO CORP
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Patent Information

Authority / Receiving Office
JP Β· JP
Patent Type
Applications
Current Assignee / Owner
DISCO CORP
Filing Date
2024-12-06
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

Existing inspection methods, such as using infrared cameras, struggle to detect voids (gaps) on the bonding surface of bonded wafers due to poor bonding, which affects the quality of device chips produced from these wafers.

Method used

An inspection device that utilizes ultrasonic vibrations generated by a pulsed laser beam to inspect the internal state of bonded wafers, comprising a holding mechanism and an inspection system with ultrasonic vibration generation, capture, and image generation means, allowing for the detection of voids through interference light analysis.

Benefits of technology

Enables the detection of voids within bonded wafers, improving the quality of device chips by identifying and excluding defective regions, thereby enhancing the overall production quality.

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Abstract

To provide an inspection device capable of inspecting the condition of an object being measured. [Solution] The system includes a holding means 3 that holds an object to be measured and has a holding surface defined by X-axis and Y-axis coordinates, and an inspection means 7 that inspects the internal state of the object to be measured based on ultrasonic vibrations generated inside the object to be measured held by the holding means 3. The inspection means 7 includes an ultrasonic vibration generating means 80 that irradiates the upper surface of the object to be measured with a pulsed laser beam LB1 to generate ultrasonic vibrations inside the object to be measured, an ultrasonic vibration capturing means 90 that captures the ultrasonic vibrations that appear on the upper surface of the object to be measured, and an image generating means 100 that generates an image based on the information captured by the ultrasonic vibration capturing means 90. The ultrasonic vibration generating means 80 includes an oscillator 72 that emits a pulsed laser beam LB1 of a wavelength that penetrates the object to be measured, and a concentrator 71 that irradiates the pulsed laser beam LB1 emitted by the oscillator 72 from the upper surface of the object to be measured held by the holding means 3, and the pulsed laser beam focused by the concentrator 71 vibrates the inside of the object to be measured.
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