Method for manufacturing a core substrate and a core substrate included in a packaging substrate

Abstract

This invention provides a method for manufacturing a core substrate with excellent adhesive strength through a simple process, and a packaging substrate to which the core substrate is applied. [Solution] The method includes the steps of: providing a glass core 200 having through holes and cavities; providing an adhesive laminate in which the glass core and adhesive layers are arranged vertically; arranging cavity elements 400 in the cavities of the adhesive laminate; providing an embedded laminate by arranging a dispensing material 100 between the cavity elements and the cavity wall surface; providing an adhesive strength strengthening treatment layer 71a on the surface of the embedded laminate; providing an insulating laminate by forming a first insulating layer on the upper surface of the glass core of the embedded laminate; and providing a core substrate 4000 by removing the adhesive layer from the insulating laminate and forming a second insulating layer on the lower surface of the glass core, wherein a core conductive layer, which is an electrically conductive layer 650, is arranged on at least a portion of the surface of the glass core.

Description

Technical Field

[0001] Embodiments relate to a method for manufacturing a core substrate, a core substrate included in a packaging substrate, a packaging substrate, and the like.

Background Art

[0002] In manufacturing electronic components, forming a circuit on a semiconductor wafer is referred to as a front-end (FE) process, and assembling the wafer into a state where it can be used as an actual product is referred to as a back-end (BE) process. The back-end process includes a packaging process.

[0003] The four core technologies of the semiconductor industry that have enabled the recent rapid development of electronic products are semiconductor technology, semiconductor packaging technology, manufacturing process technology, and software technology. Semiconductor technology has evolved into various forms such as sub-micron nanometer line widths, over ten million cells, high-speed operation, and a large amount of heat dissipation. However, relatively, there is no technology that perfectly supports packaging this. Therefore, the electrical performance of a semiconductor may sometimes be determined by packaging technology and the electrical connections thereby, rather than the performance of the semiconductor technology itself.

[0004] Ceramic or resin is applied as the material of the packaging substrate. Recently, research on applying silicon or glass to high-end packaging substrates has been underway. In particular, a packaging substrate having a cavity structure by applying a glass core has been developed.

[0005] Related prior arts include Korean Patent Publication No. 10-2015-0022560, Korean Registered Patent No. 10-1253514, and the like.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The objective of this embodiment is to provide a method for manufacturing a core substrate with superior adhesive strength through a simpler process, a core substrate, and a packaging substrate to which the same is applied. [Means for solving the problem]

[0007] To achieve the above objective, we present a method for manufacturing the core substrate included in the packaging substrate in the concrete example.

[0008] A method for manufacturing a core substrate includes: step A providing a glass core having through holes and cavities; step B providing an adhesive laminate in which the glass core and the adhesive layer are arranged vertically by placing an adhesive layer on the lower surface of the glass core; step C providing cavity elements in the cavities of the adhesive laminate; step D providing an embedded laminate by placing a dispensing material in the space between the cavity elements and the walls of the cavities; step E providing an adhesive strengthening layer by applying an adhesive strengthening treatment to the surface of the embedded laminate; step F providing an insulating laminate by forming a first insulating layer on the upper surface of the glass core of the embedded laminate; and step G providing the core substrate by removing the adhesive layer from the insulating laminate and forming a second insulating layer on the lower surface of the glass core.

[0009] A core conductive layer, which is an electrically conductive layer, may be placed on at least a portion of the surface of the glass core.

[0010] A process including an adhesive strength strengthening treatment is not substantially applied between step A and step B.

[0011] The adhesive layer in step B may be one in which an adhesive material is placed on a support film.

[0012] The thickness of the adhesive material may be 10 μm or more.

[0013] In step E, the adhesion strengthening treatment may include a process of treating the surface so that the surface roughness Ry of the core conductive layer is in the range of 20 nm to 200 nm.

[0014] In step E, the adhesion strengthening treatment may include a step of applying an adhesion strengthening compound treatment to the surface of the glass core.

[0015] A wiring step for forming an electrically conductive layer may be further arranged after step F.

[0016] In the aforementioned wiring step, the electrically conductive layer on the first surface insulating layer may have an adhesive strength of 350 gf / cm or more on the glass core.

[0017] In step G, the adhesive layer is removed from the core conductive layer on the lower surface of the glass core, and there is virtually no residue of the adhesive layer remaining.

[0018] Step G may further include a step of applying an adhesion strengthening treatment to the insulating laminate after removing the adhesive layer to add an adhesion strengthening treatment layer. After adding the adhesion strengthening treatment layer, a step of forming a second insulating layer on the lower surface of the glass core may be performed. In this case, the core conductive layer placed in the through hole may be formed with an even greater thickness in the adhesion strengthening treatment layer on either the first insulating layer side or the second insulating layer side.

[0019] Step G may involve forming a second insulating layer on the lower surface of the glass core without performing an adhesive strengthening treatment on the insulating laminate after removing the adhesive layer to add an adhesive strengthening treatment layer. In this case, the core conductive layer placed in the through hole may have an adhesive strengthening treatment layer placed only on one of the sides of the first insulating layer and the second insulating layer.

[0020] The manufacturing method may further include a wiring step after step G in which an electrically conductive layer is formed on and / or below the first insulating layer.

[0021] In the wiring step, the electrically conductive layer on the first surface insulating layer can have an adhesive strength of 350 gf / cm or more on the glass core.

[0022] In the wiring step, the electrically conductive layer under the second surface insulating layer can have an adhesive strength of 350 gf / cm or more on the glass core.

[0023] A core substrate according to another embodiment is a core substrate applied to a packaging substrate, including a glass core in which through holes and cavities are arranged, a cavity element that is an element arranged in the cavity, a first surface insulating layer that is an insulating layer arranged on the upper surface of the glass core, and a second surface insulating layer that is an insulating layer arranged on the lower surface of the glass core.

[0024] A core conductive layer, which is an electrically conductive layer, is arranged on at least a part of the surface of the glass core, a dispensing material is arranged in the space between the cavity element and the wall surface of the cavity, and an electrically conductive layer is further arranged on the second surface insulating layer.

[0025] The electrically conductive layer on the second surface insulating layer can have an adhesive strength of 350 gf / cm or more on the glass core.

[0026] On the core conductive layer on the side where the adhesive strength enhancing treatment layer is not arranged, substantially no residue of the adhesive layer remains.

[0027] In the core conductive layer arranged in the through hole, the thickness of the adhesive strength enhancing treatment layer on one side of the first surface insulating layer side and the second surface insulating layer side can be thicker.

[0028] In the core conductive layer arranged in the through hole, an adhesive strength enhancing treatment layer can be arranged on only one side of the first surface insulating layer side and the second surface insulating layer side.

Advantages of the Invention

[0029] The manufacturing method for the core substrate in the concrete example, and the core substrate included in the packaging substrate, allows for the production of a core substrate with excellent inter-plane adhesion using a simpler method. [Brief explanation of the drawing]

[0030] [Figure 1] This is a conceptual diagram illustrating the existing process of manufacturing core substrates in cross-section. [Figure 2] This is a conceptual diagram illustrating the existing process of manufacturing core substrates in cross-section. [Figure 3] This is a conceptual diagram illustrating the existing process of manufacturing core substrates in cross-section. [Figure 4] This is a conceptual diagram illustrating the process of manufacturing a core substrate in a concrete example, shown in cross-section. [Figure 5] This is a conceptual diagram illustrating the process of manufacturing a core substrate in a concrete example, shown in cross-section. [Figure 6] This is a conceptual diagram illustrating the process of manufacturing a core substrate in a concrete example, shown in cross-section. [Figure 7] This is a conceptual diagram illustrating a cross-sectional view of a packaging substrate to which a core substrate relating to a concrete example is applied. [Figure 8] This is a conceptual diagram illustrating a cross-sectional view of a packaging substrate to which a core substrate relating to a concrete example is applied. [Best Mode for Carrying Out the Invention]

[0031] The embodiments are described below in detail with reference to the accompanying drawings, so that they can be easily implemented by a person with ordinary skill in the art to which the embodiments belong. However, the embodiments can be realized in a variety of different forms and are not limited to the embodiments described herein. Similar parts are denoted by the same reference numerals throughout the specification.

[0032] Throughout this specification, the term “these combinations” as used in any expression in Markush form means one or more mixtures or combinations selected from the group of components described in the Markush form, and includes one or more of those components.

[0033] Throughout this specification, terms such as “First,” “Second,” or “A,” “B” are used to distinguish identical terms from one another. Furthermore, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0034] In this specification, "~system" may mean that the compound contains a compound corresponding to "~" or a derivative of "~".

[0035] In this specification, the meaning of B being located on A means either B being in direct contact with A, or B being located on A with other layers located between them, and is not limited to B being in contact with the surface of A.

[0036] In this specification, the meaning of B being connected to A means either that A and B are directly connected, or that A and B are connected through other components between them, and is not limited to the direct connection of A and B unless otherwise specified.

[0037] In this specification, unless otherwise specified, singular expressions are interpreted to include singular or plural, as interpreted in the context.

[0038] In the manufacturing of core substrates using plate-shaped glass as a support, it is necessary to maintain interlayer bonding strength, particularly the adhesion between the electrically conductive metallic layer and other layers, at a certain level or higher in order to suppress delamination. For this reason, treatments to strengthen the adhesive strength are often performed during the manufacturing process, but this can sometimes lead to other drawbacks.

[0039] In the manufacturing of core substrates to which cavities are applied, an adhesive layer is applied to fix the positions of the cavities and the elements inserted into the cavities (cavity elements). After this adhesive layer has served to fix these positions, it is generally removed once these positions are fixed by other components and is not included in the finished core substrate.

[0040] However, adhesive residue may remain in the core substrate during the removal of the adhesive layer, which can cause other defects, so it is necessary to reduce this.

[0041] The inventors identified these problems in the manufacturing process of the core substrate and present the following concrete examples.

[0042] Core substrate manufacturing method Figures 1 to 3 are conceptual diagrams illustrating the existing process of manufacturing a core substrate in cross-section, while Figures 4 to 6 are conceptual diagrams illustrating the process of manufacturing a core substrate in cross-section in a concrete example. The concrete example will be explained in more detail below with reference to Figures 1 to 6. In each figure, (a), (b), etc., are included for explanatory purposes and do not represent the stages or sequence of the process.

[0043] To achieve the above objective, a method for manufacturing a core substrate 4000 according to one embodiment of the concrete example is a method for manufacturing a core substrate 4000 included in a packaging substrate, and includes steps A, B, C, D, E, F, and G.

[0044] Step A is the step of providing a glass core 200 in which through holes 30 or cavities 50 are arranged (see Figure 4(a)).

[0045] The glass core 200 is preferably made of plate glass used in semiconductors, and may, but is not limited to, borosilicate plate glass or alkali-free plate glass. Examples include, but is not limited to, products from Schott, AGC, Corning, etc.

[0046] The glass core 200 may have a thickness of 100 μm or more, 200 μm or more, 250 μm or more, 300 μm or more, 350 μm or more, or 400 μm or more. The thickness may also be 3000 μm or less, 2500 μm or less, 2000 μm or less, 1500 μm or less, or 1000 μm or less. In such cases, it is advantageous for the glass core to have mechanical strength suitable for application to a packaging substrate.

[0047] The glass core 200 may have through holes 30 and / or cavities 50. These may be manufactured by first forming defects in a glass plate at predetermined locations using a laser or the like, and then etching them. Alternatively, they may be formed through laser etching.

[0048] The cavity 50 may be a cavity (full cavity) that penetrates the glass core 200.

[0049] The electrically conductive layer placed on the glass core 200 is referred to as the core conductive layer 71.

[0050] As the electrically conductive layer, an electrically conductive metal layer such as copper or a copper alloy can be used.

[0051] An electrically conductive layer may be formed by methods such as electroplating and placed on the surface of the glass core 200. In this case, the surface refers to all surfaces exposed to the outside, including the inside of through holes and the inner walls of cavities. A sputtered layer, a primer layer, etc., may be placed between the core conductive layer 71 and the glass core 200 as needed. The sputtered layer may, for example, be any one sputtered layer selected from the group consisting of titanium, chromium, nickel, copper, and combinations thereof. The primer layer may be, but is not limited to, a polymer resin layer in which copper seeds or the like are embedded.

[0052] The core conductive layer 71 may be placed in the through-hole 30 (see Figure 4(b)).

[0053] The inner surface of the cavity 50 may be exposed to a glass surface or a metal layer (not shown).

[0054] The thickness of the core conductive layer 71 may be 10 μm or more. The thickness may be 10 μm or more, 15 μm or more, or 20 μm or more. The thickness may be 100 μm or less, 90 μm or less, 80 μm or less, 70 μm or less, 60 μm or less, or 50 μm or less.

[0055] The width of the core conductive layer 71 may be 10 μm or more. The width may be 10 μm or more, 15 μm or more, or 20 μm or more. The thickness may be 100 μm or less, 90 μm or less, 80 μm or less, 70 μm or less, 60 μm or less, or 50 μm or less.

[0056] In the case where the core conductive layer 71 fills the through-holes, the radius of the core conductive layer within the through-holes is treated as the thickness or width.

[0057] In such cases, having a generally thin packaging substrate can help enable efficient wiring arrangement.

[0058] Figure 4 shows (a) and (b) in sequence, presented for the sake of clarity in the explanation.

[0059] A glass substrate 200 on which a core conductive layer 71 is formed can be applied to step A.

[0060] A glass substrate 200 without a core conductive layer 71 may be applied to step A. In this case, a process of forming the core conductive layer can be carried out after step A.

[0061] Step B is the step of placing the adhesive layer 10 on the lower surface of the glass core 200 to form an adhesive laminate 1000 in which the glass core 200 and the adhesive layer 10 are arranged vertically (see Figure 4(c)).

[0062] The adhesive layer 10 may be an adhesive film applied for the purpose of fixing position in a semiconductor process. For example, the adhesive layer 10 may consist of an adhesive material (not shown) placed on a support film (not shown). The adhesive material may have a thickness of 10 μm or more, 15 μm or more, or 20 μm or more. The thickness may also be 120 μm or less, 100 μm or less, 80 μm or less, or 60 μm or less. Such a case is advantageous for obtaining a stable fixing effect.

[0063] The adhesive layer 10 may, for example, have adhesive strength that changes with a specific treatment, such as irradiation with ultraviolet light. After achieving the purpose of position fixing, an adhesive layer may be applied that, when treated with ultraviolet light of a specific wavelength, relatively reduces the adhesive strength of the adhesive material, making it easier to attach and detach.

[0064] Step C is the step of placing the cavity element 400 into the cavity 50 of the adhesive laminate 1000 (see Figure 5(d)).

[0065] Cavity element 400 is a general term for elements placed in the cavity.

[0066] The cavity element 400 may contain one electronic element or multiple electronic elements.

[0067] The cavity element 400 may be an electronic element applied as is, or it may be an electronic element that has been surrounded by an insulating layer or the like and molded.

[0068] The positions of the cavity element 400 and the cavity 50 can be fixed by the adhesive material described above. In this case, "fixed" means that they are fixed to such an extent that their positions do not change in subsequent processes.

[0069] Step D is the step of placing the dispensing material 100 in the space between the cavity element 400 and the wall surface of the cavity 50 to provide the embedded laminate 2000 (see Figure 5(e)).

[0070] An insulating material may be used as the dispensing material 100.

[0071] The insulating material may, for example, be an epoxy resin, an epoxy resin containing a filler, or a polymer resin containing a filler.

[0072] The insulating material may, for example, be ABF (Ajinomoto Build-up Film), EMC (Epoxy Molding Compound), MPI (Modified Polyimide), LCP (liquid crystal polymer), CUF (Capillary Underfill) material, NCF (Non-Conductive Films), NCP (Non-Conductive Pastes), or the like.

[0073] The dispensing material 100 may be prepared in film form, then placed in the space by methods such as heating and depressurizing lamination, and subsequently cured or partially cured.

[0074] Step E is a step of applying an adhesion strengthening treatment to the surface of the embedded laminate 2000 to provide an adhesion strengthening treatment layer 71a (see Figure 5(f)).

[0075] The aforementioned surface refers to a surface exposed to the outside in the embedded laminate 2000, and exemplified by the upper surface of the glass core 200, the surface inside the core, the surface of the core conductive layer, etc.

[0076] The adhesion-enhancing treatment applied to the surface may, for example, be a surface oxidation treatment, a surface etching treatment, a silicon-based compound treatment, or an acrylic compound treatment.

[0077] When an adhesion strengthening treatment is applied, the adhesion between the insulating layer (described later) and the glass core and / or core conductive layer is strengthened.

[0078] In step E, the adhesion strengthening treatment may include a process of treating the surface of the core conductive layer 71 so that its arithmetic mean surface roughness Ra is between 25 nm and 150 nm. The Ra may be 25 nm or more, 30 nm or more, 35 nm or more, 40 nm or more, 45 nm or more, or 50 nm or more. The Ra may also be 150 nm or less, 120 nm or less, 90 nm or less, or 70 nm or less. Within this range, a more stable delamination prevention effect can be obtained. Furthermore, it may be more efficient for application to high-frequency power supplies.

[0079] In step E, the adhesion strengthening treatment may include a process of treating the surface so that the maximum height surface roughness Ry of the core conductive layer 71 is 20 nm or more and 200 nm or less. Ry may be 20 nm or more, 25 nm or more, 30 nm or more, 35 nm or more, 40 nm or more, 45 nm or more, or 50 nm or more. Ry may be 200 nm or less, 180 nm or less, 150 nm or less, 120 nm or less, 90 nm or less, or 70 nm or less. Within this range, a more stable delamination prevention effect can be obtained. Furthermore, it may be more efficient for application of high-frequency power supplies.

[0080] The aforementioned Ra and Ry can be measured by preparing them according to the standard ISO 4287:1997.

[0081] Surface oxidation treatment is a process in which an oxidizing agent is added to the surface of the glass core 200 to induce etching of the surface or the formation of an oxide.

[0082] The surface etching process involves adding an etching solution or etching gas to the surface of the glass core 200 so that at least a portion of the surface is etched.

[0083] The surface roughness of the surface can be controlled by the oxidation or etching treatment.

[0084] The adhesion strengthening treatment may involve applying an adhesion strengthening compound treatment to the surface of the glass core 200.

[0085] Bonding strength-enhancing compounds can include silicon-based compounds, azole-based compounds, amine-based compounds, etc., which can be used to form a thin coating layer on the surface.

[0086] Silicone-based compounds can be used in silicon-based adhesives.

[0087] The silicone adhesive may be a peroxide-curing type silicone adhesive. The silicone adhesive may also be an addition-reaction type silicone adhesive. Peroxide-curing type silicone adhesives and addition-reaction type silicone adhesives are applicable without limitation as long as they are generally applicable in the field of adhesive or bonding technology. For example, peroxide-curing type silicone adhesives may include Dow's DOWSIL SH 4280 and Shin-Etsu's KR-100. For example, addition-reaction type silicone adhesives may include Dow's DOWSIL 4585 and Shin-Etsu's KR-3700.

[0088] Silicon-based compounds may be treated with silane coupling agents.

[0089] The silane coupling agent may, as an example, contain a methoxy group and / or an ethoxy group at one end. The silane compound may also contain an amino group, a vinyl group, an epoxy group, a methacryloxy group, an acryloxy group, a ureido group, a mercapto group, a sulfide group, or an isocyanate group at the other end.

[0090] The azole compound may be imidazole, benzimidazole, triazole, benzotriazole, or a derivative thereof. Specifically, it may include benzotriazole, toltriazole, hydroxybenzotriazole, or benzimidazole.

[0091] The amine compounds may, for example, be aminocarboxylic acids.

[0092] Adhesion-enhancing treatments can be applied using both etching and bonding-enhancing compound treatments.

[0093] For example, Novabond from Atotec, Cz 8401 from Cz, Nanotus from YMT, and GliCAP from MK may be used.

[0094] This process further improves the adhesion between the electrically conductive layer and the insulating layer described later.

[0095] Step F is the step of forming a first insulating layer 92 on the upper surface of the glass core 200 of the embedded laminate 2000 to provide an insulating laminate 3000 (see Figure 6(g)).

[0096] The first insulating layer 92 can be provided by forming an insulating layer on the packaging substrate. Exemplarily, the insulating layer may be an inorganic layer or an organic-inorganic composite layer.

[0097] The inorganic layer may, for example, be a metal oxide sputtered layer.

[0098] The organic-inorganic composite layer may contain insulating particles and a binder.

[0099] As a binder, acrylic resin, epoxy resin, or deformable resins thereof may be used, and materials suitable for molding and other purposes in electronic devices may be applied.

[0100] The organic-inorganic composite layer may be a mixture of acrylic resin and filler, a mixture of acrylic resin and epoxy resin and filler, or a mixture of epoxy resin and filler. The filler may be inorganic particles, and silica particles may be used as an example.

[0101] Commercially available products such as ABF (Ajinomoto Build-up Film), EMC (Epoxy Molding Compound), MPI (Modified Polyimide), CUF (Capillary Underfill) materials, NCF (Non-Conductive Films), and NCP (Non-Conductive Pastes) may be used.

[0102] The distribution material can be transformed into a fluid form, placed within the packaging glass core while filling the space between the inner wall of the cavity and the die block, and then cured. For example, the distribution material can be fluidized by heating, placed in the appropriate position, and then fixed in place within the inner wall of the cavity by means of thermal curing or other methods.

[0103] Step G is the step of removing the adhesive layer 10 from the insulating laminate 3000 and forming a second insulating layer 94 on the lower surface of the glass core 200 to provide the core substrate 4000. If necessary, an adhesive strengthening treatment can be additionally performed after removing the adhesive layer and before forming the second insulating layer 94. In this case, the adhesive strengthening layer is also placed on the lower surface (see Figures 6(h) and (i)). In the drawings, a double layer of adhesive strengthening treatment 71a is shown on some surfaces where the adhesive strengthening treatment has been performed two or more times (see Figures 6(i) and 8). However, depending on the method of adhesive strengthening treatment, the distinction between the double-treated portion and the untreated portion may not be clear.

[0104] The removal of the adhesive layer 10 is carried out taking into consideration the properties of the adhesive layer.

[0105] For example, a method may be applied in which the adhesive layer is irradiated with ultraviolet light, and then the weakened adhesive layer is physically removed.

[0106] A process including an adhesion strengthening treatment is not substantially applied between step A and step B. This is one of the important differences from existing methods, which will be described in detail later.

[0107] The adhesive layer 10 is bonded to the layer that has been detached, and the adhesive strengthening treatment described above is not applied to that layer. In other words, in this example, the adhesive strengthening treatment is performed after the adhesive layer 10 is applied, and the adhesive layer 10 is not attached to the surface that has undergone the adhesive strengthening treatment.

[0108] When a surface has undergone adhesion-enhancing treatment, its surface roughness increases, or sites capable of chemical bonding are activated on the surface. When adhesive layer 10 is applied to this surface, the adhesion between the adhesive material of the adhesive layer and the surface that has undergone adhesion-enhancing treatment becomes very strong, making removal difficult. Furthermore, when removing the surface, residue of the adhesive material (residue of the adhesive layer, reference numeral 71p in Figure 3) tends to remain. Desmearing or other processes are required to remove this residue, which complicates the process. Moreover, even after desmearing, complete removal is not easy.

[0109] The concrete examples can solve these problems and simplify the process.

[0110] In step G, the adhesive layer was removed from the core conductive layer 71 on the lower surface of the glass core 200, and virtually no adhesive residue 71p remains on the core conductive layer 71.

[0111] After removing the adhesive layer 10, a cleaning process can be selectively applied as needed. That is, step G may further include a cleaning step after the removal of the adhesive layer 10 and before the formation of the second surface insulating layer 94.

[0112] The aforementioned cleaning process may, but is not limited to, the application of plasma (for example, O2 plasma).

[0113] A wiring step for forming an electrically conductive layer 650 may be further arranged after step F.

[0114] In the wiring step, the electrically conductive layer on the first surface insulating layer 92 has an adhesive strength of 350 gf / cm or more on the glass core. The adhesive strength may be 350 gf / cm or more, 400 gf / cm or more, 450 gf / cm or more, or 500 gf / cm or more. The adhesive strength may be 1300 gf / cm or less. In such a case, excellent adhesive strength can be maintained over a long period of time even when the packaging substrate is driven.

[0115] In the wiring step, the electrically conductive layer on the second insulating layer 94 has an adhesive strength of 350 gf / cm or more on the glass core. The adhesive strength may be 350 gf / cm or more, 400 gf / cm or more, 450 gf / cm or more, or 500 gf / cm or more. The adhesive strength may be 1300 gf / cm or less. In such a case, excellent adhesive strength can be maintained over a long period even when the packaging substrate is driven.

[0116] This section will explain existing methods that are contrasted with the aforementioned concrete examples.

[0117] A glass core 200 is provided, in which through holes 30 and cavities 50 are arranged (see Figure 1(a)). A core conductive layer 71 may be arranged on the glass core 200, which is the same as that described in the above embodiment (Figure 1(b)).

[0118] The surface of the core conductive layer 71 and / or the glass core 200 is subjected to an adhesion strengthening treatment to provide an adhesion strengthening treatment layer 71a. This is to strengthen the adhesion of insulating layers and other layers that are applied later. In this case, the adhesion strengthening treatment layer 71a is applied not only to the upper surface but also to the entire lower surface of the glass substrate 200 and the core conductive layer 71.

[0119] Subsequently, the adhesive layer 10 is applied to fix the position of the cavity element 400 (see Figure 2(d)). Typically, the adhesive layer 10 is placed below the glass substrate 200 and comes into direct contact with the lower surface of the glass substrate 200 and the lower surface of the core conductive layer 71. In other words, the adhesive layer 10 comes into direct contact with the adhesive strength strengthening treatment layer 71a described above.

[0120] A cavity element 400 is placed in the cavity 50 of the glass core 200 on which the adhesive layer 10 is placed (Figure 2(e)). Subsequently, the first insulating layer 92 is placed on the glass substrate 200 (see Figure 2(f)), and the adhesive layer 10 is removed (see Figure 3(g)).

[0121] The removal of the adhesive layer 10 may, for example, be performed by weakening the adhesive strength through ultraviolet irradiation or other means, followed by physical removal, but is not limited to this method.

[0122] The adhesive layer 10 may be one in which adhesive material is placed on a support film, and some of the adhesive material may remain on the glass substrate 200 below. Such adhesive layer residue (residue of adhesive material) 71p is an adhesive material and has sufficient adhesive strength to fix the position of the glass substrate and the cavity element. When the adhesive strength strengthening treatment described above is applied to this, the adhesive strength between the adhesive layer 10 and the glass substrate 200 is made very strong. Therefore, the force (peel stress) applied to the glass substrate when removing the adhesive layer 10 is very strong. In addition, the strengthened adhesive strength and the stepped surface of the electrically conductive layer 71 make it easier for the adhesive material to remain.

[0123] The residue 71p can affect the adhesion and flatness of subsequent layers. Therefore, after removing the adhesive layer 10, the residue 71p remaining on the glass substrate 200 must be removed (see Figure 3(h)). For this purpose, a residue removal treatment is necessary. The second insulating layer 94 is placed after the residue removal treatment (Figure 3(i)).

[0124] Such processes complicate and make process conditions irrational, for example, by imparting enhanced adhesive strength to the adhesive layer intended for removal, requiring additional steps for its removal. The embodiment solves these problems.

[0125] Core substrate and packaging substrate Figure 6(i) is a conceptual diagram illustrating the core substrate 4000 in cross-section, and Figures 7 and 8 are conceptual diagrams illustrating the packaging substrate to which the core substrate according to the concrete example is applied, in cross-section. The core substrate 4000 and the packaging substrate 1 will be described in detail with reference to Figures 6(i), 7 and 8.

[0126] The core substrate 4000 of the embodiment is a core substrate applied to the packaging substrate 1, and includes: a glass core 200 having through holes 30 and cavities 50; a cavity element 400 which is an element placed in the cavity 50; a first insulating layer 92 which is an insulating layer placed on the upper surface of the glass core 200; and a second insulating layer 94 which is an insulating layer placed on the lower surface of the glass core 200.

[0127] A core conductive layer 71, which is an electrically conductive layer, is placed on at least a portion of the surface of the glass core 200.

[0128] Dispensing material 100 is placed in the space between the cavity element 400 and the wall surface of the cavity 50.

[0129] The core conductive layer 71 on the side where the adhesive strength-enhancing treatment layer 71a is not placed is substantially free of adhesive layer residue 71p.

[0130] The core conductive layer 71 placed in the through hole 30 has an adhesive strength strengthening treatment layer 71a placed only on one of the sides of the first insulating layer 92 and the second insulating layer 94 (see Figure 7).

[0131] The core conductive layer 71 positioned in the through hole 30 may have an even greater thickness in the adhesive strength-enhancing treatment layer 71a on either the first insulating layer 92 side or the second insulating layer 94 side (see Figure 8).

[0132] In this specific example, the adhesive strength-enhancing treatment layer 71a is manufactured without directly contacting the layer on which the adhesive layer was located during the manufacturing process. As a result, virtually no adhesive residue remains in the area where the adhesive layer was attached, enabling the efficient provision of a core substrate of superior quality.

[0133] An electrically conductive layer 650 may be further disposed on the first insulating layer 92.

[0134] The electrically conductive layer on the first insulating layer 92 may have an adhesive strength of 350 gf / cm or more on the glass core.

[0135] The first insulating layer 92 may further include a cover layer (not shown) made of PI film or the like that covers the insulating layer and the electrically conductive layer, and exposes the contact portion with the bump.

[0136] Such a configuration on the first insulating layer 92 is collectively referred to as the upper layer 600.

[0137] An electrically conductive layer may be further disposed on the second insulating layer 94 (not shown).

[0138] The electrically conductive layer on the second insulating layer 94 has an adhesive strength of 350 gf / cm or more on the glass core. The adhesive strength may be 350 gf / cm or more, 400 gf / cm or more, 450 gf / cm or more, or 500 gf / cm or more. The adhesive strength may be 1300 gf / cm or less. In such a case, excellent adhesive strength can be maintained over a long period even when the packaging substrate is in motion.

[0139] A solder resist layer (not shown) may be further disposed on the second insulating layer 94.

[0140] Such a configuration on the second insulating layer 94 is collectively referred to as the lower layer 800.

[0141] When an electrically conductive layer or the like is further arranged on the first insulating layer 92 and / or the second insulating layer 94, it can be used as a packaging substrate 1.

[0142] Electronic components 900 can be arranged on the packaging substrate 1 (see Figure 7).

[0143] A detailed explanation of the composition and materials of each layer would overlap with the explanation above, so a detailed description will be omitted.

[0144] The invention will be explained in more detail below through specific examples. The following examples are merely illustrative to aid in understanding the present invention, and the scope of the invention is not limited thereto.

[0145] Example 1 A glass substrate is provided with through-holes and cavities, and an electrically conductive layer is placed in the through-holes. This glass substrate is placed on PI tape (adhesive material thickness 25 μm), and cavity elements are placed to fix their positions. Subsequently, a dispensing process is performed, in which epoxy resin is injected at a temperature of approximately 80°C and cured. After that, an adhesion strengthening treatment is performed. This is done by applying Novabond, and the adhesion of Novabond is strengthened by oxidation.

[0146] An ABF layer was placed on a Novabond-treated glass substrate, followed by vacuum lamination and curing. The PI tape was then removed. At this point, virtually no adhesive residue remained, or it could be easily removed in the cleaning process. The cleaning process was performed using plasma desmearing, utilizing a gas mixture of O2 and CF4 in an 8:2 volume ratio, at 3000 watts for 4 minutes.

[0147] The underside of the glass substrate without the ABF layer was further treated with Novabond, then the ABF layer was placed on the underside, laminated under reduced pressure, and cured. The curing conditions were 150°C for 60 minutes.

[0148] The results confirmed the following two points: After removing the adhesive layer, the amount of adhesive residue remaining on the exposed surface was checked. Visual evaluation was performed, and in the case of Example 1, no residue was observed visually.

[0149] Subsequently, the bonding strength between the core conductive layer located beneath the glass substrate and the ABF was tested. A peel test was performed, and the bonding strength was confirmed to be approximately 800 gf / cm.

[0150] Example 2 While all other conditions remained the same, the adhesion strengthening treatment was performed using a wet etching method instead of Novabond. CZ-8101 was used for the wet etching.

[0151] In Example 2, no residue was observed visually. Furthermore, the bonding strength was confirmed to be approximately 500 gf / cm.

[0152] Example 3 While all other conditions remained the same, the adhesion strengthening treatment was performed using a silane coupling agent instead of Novabond. The silane coupling agent used was 3-methacryloxypropyl trimethoxysilane.

[0153] In Example 3, no residue was observed visually. Furthermore, the bonding strength was confirmed to be approximately 400 gf / cm.

[0154] Comparative Example 1 A glass substrate is provided with through-holes and cavities, and an electrically conductive layer is placed in the through-holes. This substrate is then subjected to an adhesion strengthening treatment. This treatment is carried out by applying Novabond, and the adhesion of Novabond is strengthened by an oxidation method.

[0155] This glass substrate is placed on PI tape (adhesive material thickness 25 μm), cavity elements are placed on top, and their positions are fixed.

[0156] An ABF layer was placed on this glass substrate, and vacuum lamination and curing were performed. Afterward, an attempt was made to remove the PI tape. A considerable amount of adhesive residue remained after the PI tape was removed. Subsequently, Novabond treatment was applied to the underside of the glass substrate where the ABF layer was not placed. Then, the ABF layer was placed on the underside, vacuum laminated, and cured. The curing conditions applied were 150°C for 60 minutes. However, it was difficult to perform an adhesion strength test between the core conductive layer located at the bottom of the glass substrate and the ABF.

[0157] Comparative Example 2 Although manufactured in the same manner as in Comparative Example 1, a cleaning step was applied after the removal of the PI tape. The cleaning step was carried out under the same conditions as in Example 1.

[0158] After removing the adhesive layer and performing a cleaning process, the amount of adhesive residue remaining on the exposed surface was checked. Visual inspection revealed that in Comparative Example 2, residue was visible on approximately 70% of the surface area.

[0159] Subsequently, the bonding strength between the core conductive layer located beneath the glass substrate and the ABF was tested. A peel test was performed, and the bonding strength was confirmed to be approximately 150 gf / cm.

[0160] Comparative Example 3 Although manufactured in the same manner as Comparative Example 2, the wet etching method used in Example 2 was applied.

[0161] After removing the adhesive layer and performing a cleaning process, the amount of adhesive residue remaining on the exposed surface was checked. Visual inspection revealed that in Comparative Example 3, residue was visible on approximately 30% of the surface area.

[0162] Subsequently, the bonding strength between the core conductive layer located beneath the glass substrate and the ABF was tested. A peel test was performed, and the bonding strength was confirmed to be approximately 250 gf / cm.

[0163] Although preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto. Various modifications and improvements by those skilled in the art, utilizing the basic concepts of the present invention as defined in the appended claims, also fall within the scope of the present invention. [Explanation of symbols]

[0164] 10 Adhesive layer 30 Through holes 50 Cavity 71 Core conductive layer 71a Adhesion-enhancing treatment layer 71p Residue of the adhesive layer 92 First insulating layer 94 Second insulating layer 100 Dispensing Materials 200 glass cores 400 Cavity Elements 1000 adhesive laminate 2000 Embedded Laminate 3000 Insulating Laminate 4000 core board 600 Upper layer 800 Lower layer 900 Electronic Components 650 Electrically conductive layer 1. Packaging substrate

Claims

1. A method for manufacturing a core substrate included in a packaging substrate, Step A involves providing a glass core in which through holes and cavities are arranged, Step B involves placing an adhesive layer on the lower surface of the glass core to form an adhesive laminate in which the glass core and the adhesive layer are arranged vertically. Step C involves arranging a cavity element within the cavity of the adhesive laminate, Step D involves placing a dispensing material in the space between the cavity element and the wall surface of the cavity to form an embedded laminate, Step E involves applying an adhesion strengthening treatment to the surface of the embedded laminate to provide an adhesion strengthening treatment layer, Step F, which involves forming a first insulating layer on the upper surface of the glass core of the embedded laminate to provide an insulating laminate, Step G includes removing the adhesive layer from the insulating laminate and forming a second insulating layer on the lower surface of the glass core to provide the core substrate, A method for manufacturing a core substrate, wherein a core conductive layer, which is an electrically conductive layer, is disposed on at least a portion of the surface of the glass core.

2. The manufacturing method according to claim 1, wherein a step including an adhesion strengthening treatment is not substantially applied between step A and step B.

3. The adhesive layer in step B is formed by placing an adhesive material on a support film. The manufacturing method according to claim 1, wherein the thickness of the adhesive material is 10 μm or more.

4. The manufacturing method according to claim 1, wherein the adhesion strengthening treatment in step E includes a step of treating the surface so that the surface roughness Ry of the core conductive layer is in the range of 20 nm to 200 nm.

5. The manufacturing method according to claim 1, wherein the adhesive strength strengthening treatment in step E includes a step of applying a bonding strength strengthening compound treatment to the surface of the glass core.

6. After step F, a wiring step for forming an electrically conductive layer is further arranged. The manufacturing method according to claim 1, wherein the wiring step is such that the electrically conductive layer on the first surface insulating layer has an adhesive strength of 350 gf / cm or more on the glass core.

7. The manufacturing method according to claim 1, wherein there is substantially no residue of the adhesive layer remaining in the core conductive layer on the lower surface of the glass core from which the adhesive layer was removed in step G.

8. Step G is, The process further includes, after removing the adhesive layer, applying an adhesion strengthening treatment to the insulating laminate to add an adhesion strengthening treatment layer, The manufacturing method according to claim 1, further comprising the step of forming a second insulating layer on the lower surface of the glass core after adding the adhesive strength strengthening treatment layer.

9. A core substrate applied to a packaging substrate, A glass core with through holes and cavities, A cavity element is an element that is placed in the cavity, A first insulating layer, which is an insulating layer disposed on the upper surface of the glass core, It includes a second insulating layer which is an insulating layer disposed on the lower surface of the glass core, A core conductive layer, which is an electrically conductive layer, is disposed on at least a portion of the surface of the glass core. Dispensing material is placed in the space between the cavity element and the wall surface of the cavity. An electrically conductive layer is further disposed on the second insulating layer. The core substrate is such that the electrically conductive layer on the second insulating layer has an adhesive strength of 350 gf / cm or more on the glass core.

10. The core substrate according to claim 9, wherein the core conductive layer on the side where the adhesive strength-enhancing treatment layer is not placed is substantially free of adhesive layer residue.

11. The core substrate according to claim 9, wherein the core conductive layer disposed in the through hole has a further thickness of the adhesive strength-enhancing treatment layer on one of the first insulating layer side and the second insulating layer side.

12. The core substrate according to claim 9, wherein the core conductive layer disposed in the through hole has an adhesion strengthening treatment layer disposed only on one of the first insulating layer side and the second insulating layer side.

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