Metal base substrate

A metal-based substrate with an insulating layer of specific alumina and boron nitride fillers addresses the need for improved thermal conductivity and insulation reliability, achieving enhanced performance in printed wiring boards.

JP2026100975APending Publication Date: 2026-06-22DIC CORP
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Patent Information

Application Number
JP2024215251
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2026-06-22

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Abstract

The objective is to provide a metal-based substrate with excellent thermal conductivity and insulation reliability. [Solution] A metal base substrate having an insulating layer made of a resin composition comprising a thermosetting resin and an inorganic filler, wherein the inorganic filler comprises boron nitride with an average particle size of 10 to 80 μm and alumina with a D95 of less than 30 μm.
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Citation Information

Patent Citations

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  • Insulative sheet, laminate, and semiconductor device

    WO2023190863A1

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    WO2024135832A1

  • Epoxy resin composition, semi-cured epoxy resin composition and cured epoxy resin composition, and resin sheet, prepreg, laminate sheet, metal substrate, wiring board and power semiconductor device, using these

    JP2016155985A