Metal base substrate
A metal-based substrate with an insulating layer of specific alumina and boron nitride fillers addresses the need for improved thermal conductivity and insulation reliability, achieving enhanced performance in printed wiring boards.
JP2026100975APending Publication Date: 2026-06-22DIC CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DIC CORP
- Filing Date
- 2024-12-10
- Publication Date
- 2026-06-22
Smart Images
Figure 2026100975000001 
Figure 2026100975000002
Abstract
The objective is to provide a metal-based substrate with excellent thermal conductivity and insulation reliability. [Solution] A metal base substrate having an insulating layer made of a resin composition comprising a thermosetting resin and an inorganic filler, wherein the inorganic filler comprises boron nitride with an average particle size of 10 to 80 μm and alumina with a D95 of less than 30 μm.
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