Inverter and solar power generation system

Abstract

This invention provides an inverter and a solar power generation system that address the failure risk of circuit board components and the low heat dissipation capacity of inverters. [Solution] An inverter is provided that includes a connection structure and a first circuit board component. Part of the connection structure is located in a first cavity and is configured to connect to a photovoltaic module, power grid, or load, enabling DC input and AC output. The first circuit board component is located in a second cavity and is electrically connected to the other part of the connection structure. By having the first circuit board component and part of the connection structure located in different cavities, the risk of failure of the first circuit board component can be reduced. In addition, the power component is located between the first circuit board and the bottom plate of the housing, and the bottom plate includes a groove toward part of the power component, reducing the volume of the inverter while increasing the heat dissipation capacity of the inverter.

Description

Technical Field

[0001] Embodiments of this application relate to the field of photovoltaic power generation technology, and more specifically, to an inverter and a photovoltaic power generation system.

Background Art

[0002] An inverter includes an external housing, circuit board components, and a connection structure. The external housing surrounds a housing cavity, and the circuit board components are placed in the housing cavity. The circuit board components include a circuit board and power components arranged on the circuit board. One end of the connection structure is connected to the circuit board, and the other end of the connection structure is configured to be connected to a photovoltaic module, a power grid, or a load. Both the connection structure and the circuit board components are arranged in the housing cavity. When a user operates the connection structure, the risk of failure of the circuit board components increases. In addition, most components on the connection structure and the circuit board are arranged on the side of the circuit board that does not face the bottom plate, so the inverter exhibits a relatively large size and poor heat dissipation ability.

Summary of the Invention

[0003] Embodiments of this application provide an inverter and a photovoltaic power generation system for implementing separate cavity management, reducing the risk of failure of circuit board components, and improving the heat dissipation ability of the inverter.

[0004] According to a first aspect, this application provides an inverter including an external housing, a connection structure, and a first circuit board component. The external housing includes a housing and a cover body arranged opposite to each other, and the housing and the cover body surround a housing cavity. The housing cavity includes a first cavity and a second cavity, and the arrangement directions of the first cavity and the second cavity are perpendicular to the thickness direction of the external housing. A part of the connection structure is located in the first cavity and is configured to be connected to a photovoltaic module, a power grid, or a load.

[0005] The first circuit board component is located within the second cavity and is electrically connected to the rest of the connection structure. The first circuit board component includes the first circuit board and power components disposed on the first circuit board. The housing includes a bottom plate, with heat dissipation fins on the side of the bottom plate not facing the power components. The power components are located between the first circuit board and the bottom plate, and the bottom plate further includes a groove recessed toward a portion of the power components. The power components include a power transistor, a bus capacitor, and a magnetic element.

[0006] The inverter includes a connection structure and a first circuit board component. A portion of the connection structure is located within a first cavity and configured to connect to a photovoltaic module, power grid, or load. The connection structure located within the first cavity can enable DC input and AC output. The first circuit board component is located within a second cavity and is electrically connected to the other part of the connection structure. The first circuit board component includes a first circuit board and a power component. The first circuit board component performs power conversion and can convert input DC to AC. Because the first circuit board component and a portion of the connection structure are located within different cavities, isolated cavity management can be implemented, reducing the risk of failure of the first circuit board component, reducing mutual interference between the first circuit board component and the connection structure, and improving the stability and reliability of the inverter.

[0007] Furthermore, the housing includes a bottom plate, and the power components are located between the first circuit board and the bottom plate. The bottom plate also includes grooves recessed toward a portion of the power components, which enhances the inverter's heat dissipation capacity and improves its power density while reducing the inverter's volume.

[0008] In some embodiments, which may include the embodiments described above, the inverter further includes a DC switch, one end of which is connected to the other part of the first connection structure, and the other end of which is connected to the first circuit board.

[0009] One end of the DC switch is configured to be connected to a photovoltaic module, and the other end of the DC switch is connected to a first circuit board, so that the DC switch can control whether the DC from the photovoltaic module can be transmitted to the first circuit board.

[0010] In some embodiments, which may include the embodiments described above, the housing includes a spacer plate configured to separate the housing into a first housing and a second housing, and the cover body includes a first cover body and a second cover body, the first cover body, the spacer plate and the first housing enclose a first cavity, and the second cover body, the spacer plate and the second housing enclose a second cavity.

[0011] The spacer plate separates the housing into a first housing and a second housing. As a result, the first housing, the spacer plate, and the first cover body surround the first cavity, and the second housing, the spacer plate, and the second cover body surround the second cavity. In other words, the spacer plate separates the housing cavity into a first cavity and a second cavity. As a result, the first circuit board component and part of the connection structure are located in different cavities, and when the user operates the connection structure located in the first cavity, the normal operation of the first circuit board component is not affected.

[0012] In some embodiments, which may include the embodiments described above, the connection structure includes a first connection structure that penetrates a spacer plate, a portion of the first connection structure located in a first cavity and electrically connected to a first circuit board, and the other portion of the first connection structure located in a second cavity and connected to a photovoltaic module.

[0013] The first connection structure is connected separately to the first circuit board and the photovoltaic module, and as a result, the DC current generated by the photovoltaic module can be transmitted to the first circuit board and converted to AC on the first circuit board.

[0014] In some embodiments, which may include the embodiments described above, the first housing is detachably connected to the first cover body.

[0015] The first cover body is detachably connected to the first housing. This indicates that the first housing can be used independently, and opening and closing the first cover body does not affect the state of the second cover body. The detachable connection of the first housing to the first cover body facilitates opening the first cover body to inspect the connection structure within the first cavity.

[0016] In some embodiments, which may include the embodiments described above, the connection structure further includes a second connection structure that penetrates a spacer plate, with a portion of the second connection structure located within the first cavity and electrically connected to the first circuit board, and the other portion of the second connection structure located within the second cavity and separately connected to the load and the power grid.

[0017] The second connection structure is connected separately to the first circuit board, load, and power grid. In other words, the alternating current generated by the first circuit board components can be used to supply power to the power grid and load in an on-grid photovoltaic system.

[0018] In some embodiments, which may include the embodiments described above, the inverter further includes a second circuit board component, the second circuit board component located in a second cavity. The second circuit board component includes a second circuit board, a capacitor, and an inductor, the second circuit board being electrically connected to the first circuit board, and both the capacitor and the inductor being located on the second circuit board.

[0019] The inverter further includes a third connection structure, which penetrates a spacer plate, with a portion of the third connection structure located within the first cavity and electrically connected to the second circuit board, and a portion of the third connection structure located within the second cavity and connected to the load.

[0020] The second circuit board is electrically connected to the first circuit board, and the third connection structure is separately connected to the second circuit board and the load. In other words, the alternating current generated by the first circuit board can be transmitted to the second circuit board, and the second circuit board transmits the alternating current to the load via the third connection structure. Capacitors and inductors can form a filter circuit. During the transmission of alternating current, changing electric and magnetic fields are generated, resulting in electromagnetic interference. Therefore, the filter circuit can suppress electromagnetic interference and ensure the quality of the alternating current.

[0021] Furthermore, since the second circuit board component is located within the second cavity, this embodiment reduces the risk of electric shock caused by the possibility of the user touching the second circuit board component when operating the connection structure within the first cavity, compared to an embodiment where the second circuit board component is located within the first cavity. This avoids corrosion phenomena caused by frequent exposure of the second circuit board component and improves the operational reliability of the inverter.

[0022] Furthermore, capacitors can filter out high-frequency interference signals, and inductors can filter out low-frequency interference signals, thereby reducing electromagnetic interference and ensuring the stability and reliability of the circuit.

[0023] In some embodiments, which may include the embodiments described above, the ends of the heat sink fins that are furthest from the housing are aligned.

[0024] The ends of the plurality of heat dissipation fins away from the housing are aligned. This helps to optimize the air flow distribution, ensuring that air can contact each fin evenly when passing through the heat dissipation fins and avoiding excessive or insufficient air flow in some areas.

[0025] In some embodiments that may include the foregoing embodiments, a thermal pad is disposed on the side closer to the housing of the power component, and the power component contacts the housing through the thermal pad.

[0026] The thermal pad can fill the gap between the power component and the housing. As a result, the power component can contact the housing sufficiently, thereby increasing the heat dissipation area and the heat dissipation rate. Also, the thermal pad has a high thermal conductivity and can further increase the heat dissipation rate.

[0027] In some embodiments that may include the foregoing embodiments, the inverter further includes a third circuit board. The third circuit board is located in the first cavity, the third circuit board is electrically connected to the first circuit board, and the third circuit board is configured to be connected to a communication device.

[0028] The third circuit board can implement data transmission between the communication device and the inverter. The communication device can obtain the parameter settings of the inverter through the third circuit board to ensure the stability of the operating state of the inverter, and can monitor parameters such as the output voltage, output current, and output power of the inverter in real time.

[0029] According to a second aspect, one embodiment of this application further provides an inverter including an external housing, a connection structure, and a first circuit board component. The external housing includes a housing and a cover body disposed opposite to each other. The housing includes a first housing and a second housing, and the cover body includes a first cover body and a second cover body. The first housing and the first cover body are disposed opposite to each other and connected to each other, and the second housing and the second cover body are disposed opposite to each other and detachably connected. The first housing and the first cover body surround a first cavity, and the second housing and the second cover body surround a second cavity. The arrangement directions of the first cavity and the second cavity are perpendicular to the thickness direction of the external housing.

[0030] A part of the connection structure is located in the first cavity and configured to be connected to a solar power generation module, a power grid, or a load. The first circuit board component is located in the second cavity and connected to other parts of the connection structure. The first circuit board component includes a first circuit board and power components disposed on the first circuit board. The second housing includes a bottom plate, and heat dissipation fins are disposed on a side of the bottom plate that does not face the power components. The power components are located between the first circuit board and the bottom plate, and the bottom plate further includes a groove recessed toward a part of the power components.

[0031] The inverter includes a connection structure and a first circuit board component. A part of the connection structure is located in the first cavity and configured to be connected to a solar power generation module, a power grid, or a load. The connection structure located in the first cavity can enable DC input and AC output. The first circuit board component is located in the second cavity and electrically connected to other parts of the connection structure. The first circuit board component includes a first circuit board and power components. The first circuit board component can perform power conversion and convert input DC into AC.

[0032] The first cavity is surrounded by the first housing and the first cover body, and the second cavity is surrounded by the second housing and the second cover body. As a result, the first circuit board components and part of the connection structure are placed in separate cavities. This achieves isolated cavity management, reduces the risk of failure of the first circuit board components, reduces mutual interference between the first circuit board components and the connection structure, and improves the stability and reliability of the inverter.

[0033] Furthermore, the second housing includes a bottom plate, and the power components are located between the first circuit board and the bottom plate. The bottom plate also includes a groove recessed toward a portion of the power components, which in turn reduces the volume of the inverter and improves the power density of the inverter.

[0034] According to a third aspect, one embodiment of this application provides a photovoltaic power generation system including an energy storage device and an inverter. The inverter is connected to the energy storage device and is configured to be connected to a photovoltaic module and a load.

[0035] The inverter provided in this embodiment of this application includes a sampling circuit according to any one of the embodiments described above. Thus, the inverter and the sampling circuit can solve the same technical problems and achieve the same technical effects. [Brief explanation of the drawing]

[0036] [Figure 1] This is a diagram illustrating the structure of an inverter in related technologies. [Figure 2] This is a diagram showing the configuration of a solar power generation system according to one embodiment of this application. [Figure 3] This is Figure 1 of the structure of an inverter according to one embodiment of this application. [Figure 4] This is a cross-sectional view in the direction AA in Figure 3. [Figure 5] This is Figure 1 of the structure of an inverter with the cover body removed, according to one embodiment of this application. [Figure 6] Figure 2 shows the structure of an inverter with the cover body removed, according to one embodiment of this application. [Figure 7] Figure 3 is a cross-sectional view in the BB direction. [Figure 8] This is a diagram of the structure of a second cavity according to one embodiment of this application. [Figure 9] Figure 2 shows the structure of an inverter according to one embodiment of this application. [Figure 10] Figure 9 is a cross-sectional view in the CC direction. [Explanation of Symbols]

[0037] 10: Photovoltaic power generation system, 11: Photovoltaic power generation module, 12: Load, 13: Power grid, 14: Energy storage device, 20: Inverter, 21: External housing, 22: First circuit board component, 23: Housing cavity, 23a: First cavity, 23b: Second cavity, 24: Second circuit board component, 30: Connection structure, 31: First connection structure, 32: Second connection structure, 33: Third connection structure, 34: Terminal, 41: First circuit board, 42: Power component, 43: Second circuit board, 44: Electric Sub-components: 45: Inductor, 46: Capacitor, 47: Third circuit board, 51: Housing, 51a: First housing, 51b: Second housing, 511: Bottom plate, 52: Cover body, 52a: First cover body, 52b: Second cover body, 53: Heat sink fin, 54: Groove, 55: Spacer plate, 61: First through hole, 62: Second through hole, 63: Thermal pad, 71: DC switch, 72: Power transistor, 73: Bus capacitor, 74: Magnetic element, 75: DC-DC conversion circuit, 76: DC-AC conversion circuit. [Modes for carrying out the invention]

[0038] To further clarify the purpose, technical solutions, and advantages of the embodiments of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is clear that the embodiments described are not all but a selection of the embodiments of this application. All other embodiments that can be obtained by those skilled in the art without creative effort based on the embodiments of this application fall within the scope of protection of this application.

[0039] Terms such as “First” and “Second” used below are intended solely for illustrative purposes and should not be understood as indicating or implying the relative importance of the technical features being discussed, or their number. Therefore, a feature defined by “First” or “Second” may explicitly or implicitly include one or more features.

[0040] Furthermore, in embodiments of this application, directional terms such as “up,” “down,” “left,” “right,” “horizontal,” and “vertical” are defined in relation to the orientation in which the components are schematically positioned in the accompanying drawings. It should be understood that these directional terms are relative concepts used for relative description and clarification and may change accordingly based on changes in the orientation in which the components are positioned in the accompanying drawings.

[0041] In embodiments of this application, unless otherwise expressly stated or limited, the term “connection” should be understood in a broad sense. For example, “connection” can be a connection by fastening, an electrical connection, a detachable connection, or an integral connection, and may be a direct connection or an indirect connection carried out through an intermediate medium.

[0042] Figure 1 shows an inverter 20 in the related technology. The inverter 20 includes an external housing 21 and a first circuit board component 22. The external housing 21 includes a housing 51 and a cover body 52, which are arranged opposite each other. The first circuit board component 22 includes a first circuit board 41 and a power component 42, the first circuit board 41 being located in a cavity surrounded by the external housing 21. In the thickness direction of the external housing 21, a portion of the power component 42 is higher and located between the first circuit board 41 and the cover body 52, and a portion of the power component 42 is lower and located between the first circuit board 41 and the housing 51.

[0043] It can be understood that the power components 42 are distributed on both sides of the first circuit board 41, and there are large gaps between the power components 42. As a result, the inverter 20 occupies a large space, and the power density of the inverter 20 is low.

[0044] In an embodiment in which the inverter 20 includes a second circuit board component 24, the second circuit board component 24 includes a second circuit board 43 and an electronic component 44. The second circuit board 43 is located between the first circuit board 41 and the cover body 52, and the electronic component 44 is located between the second circuit board 43 and the cover body 52.

[0045] It can be understood that the power component 42 is located between the first circuit board 41 and the second circuit board 43, and the distance between the first circuit board 41 and the second circuit board 43 is long. As a result, the transmission line connecting the first circuit board 41 and the second circuit board 43 is long, and the signal is prone to attenuation during transmission. In addition, a tall support structure is required when positioning the second circuit board 43, which increases costs.

[0046] Please refer to Figure 2. This application provides a photovoltaic power generation system 10 including an inverter 20. Part of the connection structure of the inverter 20 is connected to a photovoltaic power generation module 11, one end of the inverter 20 is connected to the photovoltaic power generation module 11, and the other end of the inverter 20 is connected to a load 12. The inverter 20 can receive DC from the photovoltaic power generation module 11, convert the DC to AC inside the inverter 20, and send the AC to the load 12 to supply power to the load 12.

[0047] It can be understood that the photovoltaic power generation system 10 includes two main types: on-grid photovoltaic power generation systems and off-grid photovoltaic power generation systems. In embodiments in which the photovoltaic power generation system 10 includes an on-grid photovoltaic power generation system, the other end of the inverter 20 is further connected to the power grid 13. When the electrical energy generated by the inverter 20 is greater than the power consumed by the load 12, the surplus AC can be transmitted to the power grid 13 for use. When the power consumed by the load 12 is greater than the electrical energy generated by the inverter 20, electrical energy can be purchased from the power grid 13.

[0048] In embodiments where the photovoltaic power generation system 10 includes an off-grid photovoltaic power generation system, the inverter 20 is not connected to the power grid 13, and the photovoltaic power generation system 10 further includes an energy storage device 14 to which the inverter 20 is connected. When the electrical energy generated by the inverter 20 is greater than the power consumed by the load 12, the surplus AC can be transmitted to the energy storage device 14. When the electrical energy generated by the inverter 20 is less than the power consumed by the load 12, the electrical energy in the energy storage device 14 can be transmitted to the load 12 via the inverter 20.

[0049] It can be understood that there are two types of wiring between the inverter 20 and the load 12: on-grid cables and off-grid cables. A distribution board is located between the inverter 20 and the load 12, with the inverter 20 connected to the distribution board via on-grid and off-grid cables, and the distribution board connected to the load 12. The distribution board can convert the alternating current received by the load 12, and as a result, alternating current generated by the off-grid solar power system or alternating current generated by the on-grid solar power system is transmitted to the load 12.

[0050] It can be understood that the inverter 20 may be further connected to a management system. The inverter 20 can transmit data such as parameter information, input voltage, and output voltage to the management system, which can then control the input and output of the inverter 20 in real time based on this data.

[0051] The inverter 20 may be further connected to a detection device. One end of the detection device is connected to the inverter 20, and the other end of the detection device is connected to the power grid 13. The voltage detection device can detect the amount of power supplied to the power grid 13 by the inverter 20 in order to prevent the amount of power supplied to the power grid 13 by the inverter 20 from exceeding a preset value and affecting the normal operation of the power grid 13.

[0052] Refer to Figures 3 and 4. The inverter 20 provided in this application includes an external housing 21. The external housing 21 includes a housing 51 and a cover body 52 arranged opposite each other. The housing 51 and the cover body 52 enclose a housing cavity 23. The housing cavity 23 includes a first cavity 23a and a second cavity 23b, the orientation of the first cavity 23a and the second cavity 23b being perpendicular to the thickness direction of the external housing 21.

[0053] The inverter 20 further includes a connection structure 30 and a first circuit board component 22. A portion of the connection structure 30 is located within a first cavity 23a and is configured to connect to a photovoltaic module 11, a power grid 13, or a load 12. The first circuit board component 22 is located within a second cavity 23b and is electrically connected to the rest of the connection structure 30. The first circuit board component 22 includes a first circuit board 41 and a power component 42, the power component 42 being located on the first circuit board 41.

[0054] The connection structure 30 enables an electrical connection between the first circuit board component 22 and the photovoltaic module 11 (shown in Figure 2), and can transmit DC to the first circuit board component 22. The first circuit board component 22 includes a power component 42, which can perform AC to DC conversion. The connection structure 30 further enables an electrical connection between the first circuit board component 22 and a power grid 13 (shown in Figure 2) or a load 12 (shown in Figure 2), and can transmit the DC generated by the first circuit board component 22 to the load 12 or the power grid 13.

[0055] The housing 51 includes a bottom plate 511, with heat dissipation fins 53 positioned on the side of the bottom plate 511 that does not face the power component 42. The power component 42 is located between the first circuit board 41 and the bottom plate 511, and the bottom plate 511 further includes a groove 54 recessed toward a portion of the power component 42. It can be understood that a large amount of heat is generated when the power component 42 is operating, and the heat dissipation fins 53 can increase the heat dissipation area of ​​the housing 51 to transfer the heat generated by the power component 42 to the outside air.

[0056] The power component 42 is located between the first circuit board 41 and the bottom plate 511. As a result, the distance between the power component 42 and the heat dissipation fin 53 is shortened, the contact area between the power component 42 and the housing 51 can be increased, and the heat dissipation rate of the power component 42 can be increased. The power component 42 includes at least one of a DC switch, a power transistor, a bus capacitor, a magnetic element, and a capacitor.

[0057] The base plate 511 further includes a groove 54 recessed toward a portion of the power component 42. It can be understood that the power component 42 includes power transistors, capacitors, and inductors, etc. Since the thickness of the power transistors is less than that of the capacitors, the portion of the base plate 511 corresponding to the power transistors is recessed toward the power transistors, thereby forming a groove 54 on the surface of the base plate 511 away from the first circuit board 41.

[0058] The inverter 20 includes a connection structure 30 and a first circuit board component 22. A portion of the connection structure 30 is located within a first cavity 23a and is configured to connect to a photovoltaic module 11, a power grid 13, or a load 12. The connection structure 30 located within the first cavity 23a can enable DC input and AC output.

[0059] The first circuit board component 22 is located within the second cavity 23b and is electrically connected to the rest of the connection structure 30. The first circuit board component 22 includes the first circuit board 41 and the power component 42. The first circuit board component 22 performs power conversion and can convert the input DC to AC. Since the first circuit board component 22 and a part of the connection structure 30 are located in different cavities, separate cavity management can be implemented, reducing the risk of failure of the first circuit board component 22, reducing mutual interference between the first circuit board component 22 and the connection structure 30, and improving the stability and reliability of the inverter 20.

[0060] Furthermore, compared with the related technology in Figure 1, the housing 51 in this application includes a bottom plate 511, the power component 42 is located between the first circuit board 41 and the bottom plate 511, and the bottom plate 511 further includes a groove 54 recessed toward a portion of the power component 42, thereby increasing the heat dissipation capacity of the inverter 20 and reducing the volume of the inverter 20 while improving the power density of the inverter 20.

[0061] In the embodiment described above, the housing 51 includes a spacer plate 55 configured to separate the housing 51 into a first housing 51a and a second housing 51b, and the cover body 52 includes a first cover body 52a and a second cover body 52b, with the first housing 51a, the spacer plate 55 and the first cover body 52a surrounding the first cavity 23a, and the second housing 51b, the spacer plate 55 and the second cover body 52b surrounding the second cavity 23b.

[0062] The spacer plate 55 separates the housing 51 into a first housing 51a and a second housing 51b. As a result, the first housing 51a, the spacer plate 55, and the first cover body 52a surround the first cavity 23a, and the second housing 51b, the spacer plate 55, and the second cover body 52b surround the second cavity 23b. In other words, the spacer plate 55 separates the housing cavity 23 into a first cavity 23a and a second cavity 23b. As a result, the first circuit board component 22 and a part of the connection structure 30 are located in different cavities, and when the user operates the connection structure 30 located in the first cavity 23a, the normal operation of the first circuit board component 22 is not affected.

[0063] Please refer to Figures 5 and 6. In the embodiment described above, the connection structure 30 includes a first connection structure 31 which penetrates the spacer plate 55, a portion of which is located in the first cavity 23a and electrically connected to the first circuit board 41, and the other portion of which is located in the second cavity 23b and connected to the photovoltaic module 11.

[0064] It can be understood that a first through-hole 61 may be provided in the spacer plate 55, and the first connection structure 31 may pass through the first through-hole 61 and be separately connected to the first circuit board 41 and the photovoltaic module 11 (shown in Figure 2).

[0065] Since the first connection structure 31 is connected separately to the first circuit board 41 and the photovoltaic module 11, the DC generated by the photovoltaic module 11 can be transmitted to the first circuit board 41 and converted to AC on the first circuit board 41.

[0066] In some embodiments, a rubber pad may be placed between the spacer plate 55 and the first connecting structure 31. The rubber pad is made of a soft and deformable material. A gap may exist between the spacer plate 55 and the first connecting structure 31, and the rubber pad can fill this gap to improve the airtightness of the first cavity 23a and the second cavity 23b.

[0067] In the embodiments described above, the first housing 51a is detachably connected to the first cover body 52a. The method of connection between the first housing 51a and the first cover body 52a is not limited to this embodiment of the application. For example, the first housing 51a and the first cover body 52a may be connected using a screw bolt structure, or they may be connected using a buckle structure instead.

[0068] The first cover body 52a is detachably connected to the first housing 51a, allowing the first housing 51a to be used independently, and opening and closing the first cover body 52a does not affect the state of the second cover body 52b. The detachable connection of the first housing 51a to the first cover body 52a facilitates opening the first cover body 52a to inspect the connection structure 30 inside the first cavity 23a.

[0069] In the embodiments described above, the first connection structure 31 includes a feedthrough terminal 34. It can be understood that the first connection structure 31 is configured to transmit the DC generated by the photovoltaic module 11. In other words, the first connection structure 31 can be a photovoltaic (PV) feedthrough terminal.

[0070] Please also refer to Figures 5 and 6. In the above-described embodiment, the connection structure 30 further includes a second connection structure 32, the second connection structure 32 passing through the spacer plate 55, with a portion of the second connection structure 32 located in the first cavity 23a and electrically connected to the first circuit board 41, and the other portion of the second connection structure 32 located in the second cavity 23b and separately connected to the load 12 (shown in Figure 2) and the power grid 13 (shown in Figure 2).

[0071] It can be understood that a second through-hole 62 may be provided in the spacer plate 55, and the second connection structure 32 may pass through the second through-hole 62 and be separately connected to the first circuit board 41, the load 12, and the power grid 13.

[0072] The second connection structure 32 is connected separately to the first circuit board 41, the load 12, and the power grid 13. In other words, the alternating current generated by the first circuit board component 22 can be used to supply power to the power grid 13 and the load 12 in an on-grid photovoltaic system.

[0073] Since the second connection structure 32 is configured to transmit the alternating current generated by the inverter 20, in an embodiment where the connection structure 30 is a feedthrough terminal, the second connection structure 32 can be an alternating current (AC) feedthrough terminal.

[0074] In some embodiments, a rubber pad may also be placed between the spacer plate 55 and the second connecting structure 32 to improve the airtightness of the first cavity 23a and the second cavity 23b. This is similar to the rubber pad in the previously described embodiments. Details will not be described again here.

[0075] Please refer to Figures 5, 6, and 7. In the embodiment described above, the inverter 20 further includes a second circuit board component 24, which is located in a second cavity 23b. The second circuit board component 24 includes a second circuit board 43, a capacitor 46, and an inductor 45. The second circuit board 43 is electrically connected to the first circuit board 41, and both the capacitor 46 and the inductor 45 are located on the second circuit board 43.

[0076] The inverter 20 further includes a third connection structure 33, which penetrates the spacer plate 55. A portion of the third connection structure 33 is located within the first cavity 23a and electrically connected to the second circuit board 43, while a portion of the third connection structure 33 is located within the second cavity 23b and connected to the load 12.

[0077] The second circuit board 43 is electrically connected to the first circuit board 41, and the third connection structure 33 is separately connected to the second circuit board 43 and the load 12. In other words, the alternating current generated by the first circuit board 41 can be transmitted to the second circuit board 43, and the second circuit board 43 transmits the alternating current to the load 12 via the third connection structure 33.

[0078] It can be understood that the third connection structure 33 is connected only to the load 12 and can be used in an off-power grid photovoltaic system. The second circuit board 43 is configured to transmit alternating current so that the alternating current generated by the first circuit board 41 can be transmitted to the load 12. The second circuit board 43 may also be referred to as an output board.

[0079] The capacitor 46 and inductor 45 can form a filter circuit. During the transmission of alternating current, changing electric and magnetic fields are generated, resulting in electromagnetic interference. Therefore, the filter circuit can suppress electromagnetic interference and ensure the quality of the output alternating current.

[0080] Furthermore, since the second circuit board component 24 is located within the second cavity 23b, this embodiment reduces the risk of electric shock caused by the possibility of the user touching the second circuit board component 24 when operating the connection structure 30 within the first cavity 23a, compared to an embodiment where the second circuit board component 24 is located within the first cavity 23a. This avoids corrosion phenomena caused by frequent exposure of the second circuit board component 24 and improves the operational reliability of the inverter 20.

[0081] Furthermore, the capacitor 46 can filter out high-frequency interference signals, and the inductor 45 can filter out low-frequency interference signals, thereby reducing electromagnetic interference and ensuring the stability and reliability of the circuit.

[0082] In some embodiments, a third through-hole may be provided in the spacer plate 55, and the third connection structure 33 may pass through the third through-hole and be separately connected to the second circuit board 43 and the load 12.

[0083] In some embodiments, the second connection structure 32 and the third connection structure 33 are integrally constructed. The second connection structure 32, located within the second cavity 23b, can be connected to the first circuit board 41 via a first copper bar, and the third connection structure 33 can be connected to the second circuit board 43 via a second copper bar.

[0084] The fact that the second connection structure 32 and the third connection structure 33 are integrated into a single structure reduces manufacturing costs and processing steps. Furthermore, the second connection structure 32 and the third connection structure 33 need to penetrate the spacer plate 55. The integrated structure of the second connection structure 32 and the third connection structure 33 reduces the number of holes on the spacer plate 55, ensuring airtightness of the first cavity 23a and the second cavity 23b.

[0085] In some embodiments, a rubber pad may also be placed between the spacer plate 55 and the third connecting structure 33 to improve the airtightness of the first cavity 23a and the second cavity 23b. This is similar to the rubber pad in the previously described embodiments. Details will not be described again here.

[0086] Refer to Figure 7. In the embodiment described above, the ends of the multiple heat sinks 53 that are away from the housing 51 are aligned. It can be understood that the bottom plate 511 includes a groove 54 recessed toward a portion of the power component 42. In other words, the length of the heat sinks 53 in the groove 54 is greater than the length of the remaining heat sinks 53 on the housing 51, so that the ends of the multiple heat sinks 53 that are away from the housing 51 can be aligned.

[0087] The ends of the multiple heat dissipation fins 53 that are furthest from the housing 51 are aligned. This helps optimize the airflow distribution, ensuring that air can make even contact with each fin as it passes through the heat dissipation fins 53, thus avoiding excessive or insufficient airflow in certain areas.

[0088] In the embodiment described above, the thermal pad 63 is positioned on the side of the power component 42 closer to the housing 51, and the power component 42 contacts the housing 51 via the thermal pad 63.

[0089] The thermal pad 63 can fill the gap between the power component 42 and the housing 51, allowing the power component 42 to make sufficient contact with the housing 51, thereby increasing the heat dissipation area and increasing the heat dissipation rate. In addition, the thermal pad 63 has high thermal conductivity, which can further increase the heat dissipation rate.

[0090] Please also refer to Figures 6 and 7. In the embodiment described above, the inverter 20 further includes a DC switch 71, one end of which is connected to the other part of the first connection structure 31, and the other end of which is connected to the first circuit board 41.

[0091] One end of the DC switch 71 is connected to the photovoltaic power generation module 11 (shown in Figure 2), and the other end of the DC switch 71 is connected to the first circuit board 41. This configuration allows the DC switch 71 to control whether or not DC current from the photovoltaic power generation module 11 can be transmitted to the first circuit board 41.

[0092] Please refer to Figures 7 and 8. In the embodiment described above, the power component 42 includes a power transistor 72, a bus capacitor 73, and a magnetic element 74.

[0093] It can be understood that the power transistor 72 and the magnetic element 74 can form a DC-DC (Direct Current to Direct Current) conversion circuit 75 and a DC-AC (Direct Current to Alternating Current) conversion circuit 76 to perform DC to DC and DC to AC conversion.

[0094] The bus capacitor 73 can be connected separately to the output terminal of the DC-DC converter circuit 75 and the input terminal of the DC-AC converter circuit 76. The bus capacitor 73 can store energy to suppress DC fluctuations in order to ensure the stability of the output AC. When the output AC voltage changes, the bus capacitor 73 can stabilize the AC output by storing and releasing charge. The bus capacitor 73 can further protect another power component 42 by preventing the voltage and current in the circuit from becoming excessively high.

[0095] Please also refer to Figure 5. In the embodiment described above, the inverter 20 further includes a third circuit board 47, the third circuit board 47 is located in the first cavity 23a, the third circuit board 47 is electrically connected to the first circuit board 41, and the third circuit board 47 is configured to connect to a communication device.

[0096] The third circuit board 47 can perform data transmission between the communication device and the inverter 20. To ensure the stability of the inverter 20's operating state, the communication device can obtain the parameter settings of the inverter 20 via the third circuit board 47 and monitor parameters such as the inverter 20's output voltage, output current, and output power in real time.

[0097] It can be understood that the voltage on the third circuit board 47 is a Safety Extra-Low Voltage Circuit (SELV). When the user opens the first cover body 52a and operates the connection structure 30, there is no risk of electric shock even if the user touches the third circuit board 47.

[0098] In some embodiments, a fourth through-hole can be provided in the spacer plate 55, and the terminal 34 can pass through the fourth through-hole and be connected separately to the third circuit board 47 and the first circuit board 41.

[0099] In some embodiments, a rubber pad may also be placed between the spacer plate 55 and the terminal 34 to improve the airtightness of the first cavity 23a and the second cavity 23b. This is similar to the rubber pad in the previously described embodiments. Details will not be described again here.

[0100] Refer to Figures 9 and 10. One embodiment of this application further provides an inverter 20 including an external housing 21, a connection structure 30, and a first circuit board component. The external housing 21 includes a housing 51 and a cover body 52 arranged opposite each other, the housing 51 includes a first housing 51a and a second housing 51b, and the cover body 52 includes a first cover body 52a and a second cover body 52b, the first housing 51a and the first cover body 52a are arranged opposite each other and connected to each other, and the second housing 51b and the second cover body 52b are arranged opposite each other and detachably connected. The first housing 51a and the first cover body 52a surround the first cavity 23a, and the second housing 51b and the second cover body 52b surround the second cavity 23b, with the orientation of the first cavity 23a and the second cavity 23b being perpendicular to the thickness direction of the outer housing 21.

[0101] A portion of the connection structure 30 is located within the first cavity 23a and is configured to connect to a photovoltaic module 11 (shown in Figure 2), a power grid 13 (shown in Figure 2), or a load 12 (shown in Figure 2). A first circuit board component is located within the second cavity 23b and is connected to the rest of the connection structure 30. The first circuit board component 22 includes a first circuit board 41 and a power component 42, the power component 42 being located on the first circuit board 41.

[0102] The connection structure 30 enables an electrical connection between the first circuit board component 22 and the photovoltaic module 11, and can transmit DC to the first circuit board component 22. The first circuit board component 22 includes a power component 42, which can perform AC to DC conversion. The connection structure 30 further enables an electrical connection between the first circuit board component 22 and the power grid 13 or load 12, and can transmit the DC generated by the first circuit board component 22 to the load 12 or power grid 13.

[0103] The second housing 51b includes a bottom plate 511, with heat dissipation fins 53 positioned on the side of the bottom plate 511 that does not face the power component 42. The power component 42 is located between the first circuit board 41 and the bottom plate 511, and the bottom plate 511 further includes a groove 54 recessed toward a portion of the power component 42. It can be understood that a large amount of heat is generated when the power component 42 is operating, and the heat dissipation fins 53 can increase the heat dissipation area of ​​the housing 51 in order to transfer the heat generated by the power component 42 to the outside air.

[0104] The power component 42 is located between the first circuit board 41 and the bottom plate 511. As a result, the distance between the power component 42 and the heat dissipation fin 53 is shortened, the contact area between the power component 42 and the second housing 51b can be increased, and the heat dissipation rate of the power component 42 can be increased.

[0105] The base plate 511 further includes a groove 54 recessed toward a portion of the power component 42. It can be understood that the power component 42 includes a power transistor 72, a capacitor 46, and an inductor 45, etc. The thickness of the power transistor 72 is less than the thickness of the capacitor 46, and the portion of the base plate 511 corresponding to the power transistor 72 is recessed toward the power transistor 72, so that a groove 54 is formed on the surface of the base plate 511 away from the first circuit board 41.

[0106] The inverter 20 includes a connection structure 30 and a first circuit board component 22. A portion of the connection structure 30 is located within a first cavity 23a and is configured to connect to a photovoltaic module 11, a power grid 13, or a load 12. The connection structure 30 located within the first cavity 23a can enable DC input and AC output.

[0107] The first circuit board component 22 is located within the second cavity 23b and is electrically connected to the rest of the connection structure 30. The first circuit board component 22 includes the first circuit board 41 and the power component 42. The first circuit board component 22 can perform power conversion and convert the input DC to AC.

[0108] The first housing 51a and the first cover body 52a surround the first cavity 23a, and the second housing 51b and the second cover body 52b surround the second cavity 23b. As a result, the first circuit board component 22 and a part of the connection structure 30 are located in different cavities. This achieves isolated cavity management, reduces the risk of failure of the first circuit board component 22, reduces mutual interference between the first circuit board component 22 and the connection structure 30, and improves the stability and reliability of the inverter 20.

[0109] Furthermore, the second housing 51b includes a bottom plate 511, and the power component 42 is located between the first circuit board 41 and the bottom plate 511. The bottom plate 511 also includes a groove 54 recessed toward a portion of the power component 42, which in turn reduces the volume of the inverter 20 and improves the power density of the inverter 20.

[0110] In addition to its application to inverters, this application may also be applied to in-vehicle chargers and uninterruptible power supplies (UPS), among others.

[0111] Finally, it should be noted that the embodiments described above are intended merely to illustrate the technical solutions of the embodiments of this application and are not intended to limit this application. Although this application is described in detail with reference to the embodiments described above, it will be understood by those skilled in the art that further modifications can be made to the technical solutions described in the embodiments described above, or equivalent substitutions can be made for some or all of the technical features thereof, without departing from the scope of the technical solutions of the embodiments of this application.

Claims

1. An external housing having a housing and a cover body arranged opposite each other, wherein the housing and the cover body surround a housing cavity, the housing cavity having a first cavity and a second cavity, and the arrangement direction of the first cavity and the second cavity is perpendicular to the thickness direction of the external housing, A connection structure, wherein a part of the connection structure is located within the first cavity and configured to connect to a solar power generation module, a power grid, or a load, A first circuit board component located within the second cavity and electrically connected to the other parts of the connection structure, the first circuit board component having a first circuit board and a power component disposed on the first circuit board, It has, The housing has a bottom plate, and a plurality of heat dissipation fins are arranged on the side of the bottom plate that does not face the power component, the power component is located between the first circuit board and the bottom plate, and the bottom plate further has a groove recessed toward a part of the power component, The power component comprises a power transistor, a bus capacitor, and a magnetic element. Inverter.

2. The inverter according to claim 1, wherein the housing is configured to separate the housing into a first housing and a second housing and has a spacer plate, the cover body has a first cover body and a second cover body, the first cavity is surrounded by the first cover body, the spacer plate and the first housing, and the second cavity is surrounded by the second cover body, the spacer plate and the second housing.

3. The inverter according to claim 2, wherein the first housing is detachably connected to the first cover body.

4. The inverter according to any one of claims 1 to 3, wherein the connection structure has a first connection structure, the first connection structure penetrates the spacer plate, a part of the first connection structure is located in the first cavity and electrically connected to the first circuit board, and the other part of the first connection structure is located in the second cavity and connected to the photovoltaic module.

5. The inverter according to claim 4, wherein the first connection structure has a feedthrough terminal.

6. The inverter according to claim 4, further comprising a DC switch, one end of which is connected to the other part of the first connection structure, and the other end of which is connected to the first circuit board.

7. The inverter according to any one of claims 1 to 3, wherein the connection structure further comprises a second connection structure, the second connection structure penetrating the spacer plate, a portion of the second connection structure located within the first cavity and electrically connected to the first circuit board, and the other portion of the second connection structure located within the second cavity and separately connected to the load and the power grid.

8. The inverter further has a second circuit board component, the second circuit board component is located within the second cavity, The second circuit board component comprises a second circuit board, a capacitor, and an inductor, wherein the second circuit board is electrically connected to the first circuit board, both the capacitor and the inductor are arranged on the second circuit board, the second circuit board is located between the first circuit board and the top plate of the cover body, and both the capacitor and the inductor are located between the second circuit board and the top plate of the cover body. The inverter further has a third connection structure, the third connection structure penetrates the spacer plate, a part of the third connection structure is located in the first cavity and electrically connected to the second circuit board, and the other part of the third connection structure is located in the second cavity and connected to the load. The inverter according to any one of claims 1 to 3.

9. The inverter according to any one of claims 1 to 3, wherein the ends of the plurality of heat dissipation fins that are furthest from the housing are aligned.

10. The inverter according to any one of claims 1 to 3, wherein a thermal pad is disposed on the side of the power component closest to the housing, and the power component is in contact with the housing via the thermal pad.

11. The inverter according to any one of claims 1 to 3, further comprising a third circuit board, the third circuit board located within a first cavity, the third circuit board being electrically connected to the first circuit board, and the third circuit board being configured to connect to a communication device.

12. An external housing having a housing and a cover body arranged opposite each other, wherein the housing comprises a first housing and a second housing, and the cover body comprises a first cover body and a second cover body, the first housing and the first cover body are arranged opposite each other and connected to each other, and the second housing and the second cover body are arranged opposite each other and detachably connected. The first housing and the first cover body surround the first cavity, the second housing and the second cover body surround the second cavity, and the arrangement direction of the first cavity and the second cavity is perpendicular to the thickness direction of the outer housing, the outer housing and A connection structure, wherein a part of the connection structure is located within the first cavity and configured to connect to a solar power generation module, a power grid, or a load, A first circuit board component located within the second cavity and connected to the other part of the connection structure, the first circuit board component having a first circuit board and a power component disposed on the first circuit board, the second housing having a bottom plate, the bottom plate having heat dissipation fins on the side not facing the power component, the power component being located between the first circuit board and the bottom plate, the bottom plate further having a groove recessed toward a part of the power component, Slit inverter.

13. A photovoltaic power generation system comprising an energy storage device and an inverter according to any one of claims 1, 2, 3, or 12, wherein the inverter is connected to the energy storage device and the inverter is configured to be connected to a photovoltaic power generation module and a load.

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