Heat sealing device
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- KAWAKAMI SANGYO CO LTD
- Filing Date
- 2024-12-12
- Publication Date
- 2026-06-24
Smart Images

Figure 2026103107000001_ABST
Abstract
Claims
1. A heat sealing device for heat sealing a workpiece, It comprises a first unit and a second unit, The first unit is, A first mold section having a pressing projection that is heated and presses against the sealing area, which is the area in which the workpiece is heat-sealed, The first molded portion is elastically supported by a first elastic support portion, The second unit is, A second mold portion is heated and has a flat surface that receives the region corresponding to the pressing projection of the first mold portion, It comprises a second elastic support portion that elastically supports the second mold portion, The pressing projection and the flat surface heat-seal the sealing area while pressing the workpiece with the biasing force of the first and second elastic support portions. A heat sealing device characterized by the following features.
2. A first drive unit moves one of the first unit and the second unit relative to the other unit over a first stroke, The device comprises a second drive unit that moves one unit relative to the other unit over a second stroke shorter than the first stroke, With the first drive unit driven and one unit positioned on the other unit side during the first stroke, the second drive unit is continuously driven to continuously heat seal multiple workpieces. The heat sealing device according to feature 1.
3. The first mold section and the second mold section are rigid molds. A heat sealing device according to feature 1 or 2.
4. The workpiece is a sheet material made by layering paper materials with a sealant layer laminated on top of each other. The heat sealing device according to feature 3.