Thermal management system and method for manufacturing the same

Abstract

This design aims to suppress the complexity of the coolant flow path while also preventing damage to the pump when coolant is supplied. [Solution] In the thermal management system 10, the supply unit 400 is configured to supply coolant to both the first flow path 100 and the second flow path 200 simultaneously. The first flow path 100 includes one or more first devices 110 configured to exchange heat with the coolant as coolant flows through it. The second flow path 200 includes one or more second devices 210 configured to exchange heat with the coolant as coolant flows through it. When the supply unit 400 supplies coolant to both the first flow path 100 and the second flow path 200 simultaneously while coolant is not flowing through them, the pressure loss of the coolant toward the pump 300 due to one or more second devices 210 is greater than the pressure loss of the coolant toward the pump 300 due to one or more first devices 110.

Description

Technical Field

[0001] The present disclosure relates to a thermal management system and a method for manufacturing the same.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2024-081902 (Patent Document 1) discloses a thermal management system. This thermal management system includes a flow path and a pump. A refrigerant flows through the flow path. The pump circulates the refrigerant in a fluid circuit formed by the flow path. In the fluid circuit, a temperature sensor, an inverter, a motor, a metering valve, a heat exchanger, and a radiator are provided in this order from downstream of the pump.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a conventional thermal management system, for example, before shipment from a factory, coolant can be supplied to a flow path in a state where the coolant is not flowing. At this time, in the pump provided in the flow path, the coolant may flow in a reverse flow direction, which is opposite to the liquid feeding direction of the pump. When the coolant flows in the reverse flow direction in the pump, the impeller of the pump rotates in the reverse direction. As a result, a counter electromotive force is generated in the motor circuit of the pump, current flows through the elements inside the pump, and the pump may be damaged. [[ID=3;6]]

[0005] [[ID=3;8]] [[ID=3;9]]

[0006] ​This disclosure has been made in view of the above-mentioned problems, and aims to provide a thermal management system that can suppress damage to the pump when supplying coolant while suppressing the complexity of the coolant flow path. [Means for solving the problem]

[0007] A thermal management system according to a certain aspect of this disclosure comprises a first flow path, a second flow path, a pump, and a supply unit. The first and second flow paths are configured to allow coolant to flow through them. The pump connects the first and second flow paths to each other. The pump is configured to deliver the coolant from the first flow path to the second flow path. The supply unit connects the first and second flow paths to each other. The supply unit is configured to supply coolant to both the first and second flow paths simultaneously. The first flow path includes one or more first devices configured to exchange heat with the coolant by allowing coolant to flow through it. The second flow path includes one or more second devices configured to exchange heat with the coolant by allowing coolant to flow through it. When the supply unit simultaneously supplies coolant to both the first and second flow paths while no coolant is flowing through them, the pressure loss of the coolant toward the pump due to one or more second devices is greater than the pressure loss of the coolant toward the pump due to one or more first devices.

[0008] According to the above configuration, by focusing on the pressure loss value of the coolant in each device and designing the coolant flow path in the thermal management system, it is possible to suppress the complexity of the coolant flow path while preventing the coolant supplied from the supply unit from reaching the pump via the second flow path before it reaches the pump via the first flow path. Furthermore, it is possible to suppress the coolant flowing inside the pump in the opposite direction to the pump's fluid delivery direction. Consequently, it is possible to suppress the generation of back electromotive force due to the backflow of coolant inside the pump, and thus prevent the pump from being damaged by back electromotive force.

[0009] Therefore, it is possible to suppress the complexity of the coolant flow path while also suppressing damage to the pump when coolant is supplied.

[0010] In a thermal management system according to a certain aspect of the present disclosure, preferably, the first flow path further includes a plurality of elastic first pipes. The plurality of first pipes connect each other between a pump, one or more first devices, and a supply unit. The second flow path further includes a plurality of elastic second pipes. The plurality of second pipes connect each other between a pump, one or more second devices, and a supply unit.

[0011] With the above configuration, since the multiple first pipes and multiple second pipes are elastic, even if the volumes of the multiple first pipes and multiple second pipes are unintentionally deformed, for example, due to pre-vacuuming, by designing each flow path based on the pressure loss value of the coolant in each device, it is possible to suppress the complexity of the coolant flow path while suppressing backflow of the coolant in the pump when the coolant is supplied.

[0012] In a thermal management system according to a certain aspect of this disclosure, preferably, the volume of the second channel under atmospheric pressure is greater than the volume of the first channel under atmospheric pressure.

[0013] With the above configuration, it is possible to further suppress the coolant supplied from the supply unit from reaching the pump via the second flow path before it reaches the pump via the first flow path.

[0014] In a thermal management system according to certain aspects of the present disclosure, preferably, the second flow path does not include a flow control valve capable of controlling the flow rate of the coolant flowing through the second flow path.

[0015] Even if the second flow path does not include a flow control valve at a predetermined position as in the above configuration, damage to the pump during coolant supply can be suppressed by designing the coolant flow path in the thermal management system based on the value of the coolant pressure loss in each device. In turn, a thermal management system with a relatively simple flow path can be provided.

[0016] In a thermal management system according to certain aspects of this disclosure, preferably, the first flow path does not include an inlet between the pump and one or more first devices into which coolant can be injected into the first flow path.

[0017] Even if the first flow path does not include an injection port at a predetermined position as in the above configuration, damage to the pump due to coolant backflow during coolant supply can be suppressed by designing the coolant flow path in the thermal management system based on the pressure loss value of the coolant in each device. In other words, a thermal management system with a relatively simple flow path can be provided.

[0018] In a thermal management system according to certain aspects of this disclosure, preferably one or more second devices include a high-pressure-loss device. When coolant is supplied from a supply unit to both the first and second passages simultaneously while no coolant is flowing through the first and second passages, the pressure loss value of the coolant toward the pump in the high-pressure-loss device is the largest among the pressure loss values ​​of the coolant toward the pump in each of the one or more first devices and the one or more second devices.

[0019] According to the above configuration, it is possible to design the flow paths based on the pressure loss values ​​of the coolant in each device, while maintaining a high degree of freedom in the arrangement of each device other than the high-pressure-loss device, and consequently, to provide a thermal management system with relatively simple flow paths.

[0020] In a thermal management system according to certain aspects of this disclosure, more preferably, the high-pressure loss device is a power control unit including an inverter.

[0021] With the above configuration, except for the power control unit, which typically has a relatively complex internal coolant flow path, it is possible to design the flow path based on the coolant pressure loss value in each device while maintaining a high degree of freedom in the placement of each device, and ultimately providing a thermal management system with a relatively simple flow path.

[0022] In a thermal management system according to an aspect of the present disclosure, preferably, the supply unit includes a third flow path and a multi-way valve. The third flow path includes a second pump and a reservoir tank. The second pump is configured to pump the coolant in the third flow path in one direction. The reservoir tank stores the coolant. The multi-way valve is connected to both ends of the first flow path, the second flow path, and the third flow path so that, when the coolant does not flow through the first flow path and the second flow path, the coolant flowing in by being injected into the reservoir tank can be simultaneously discharged to both the first flow path and the second flow path.

[0023] Even in a thermal management system having a relatively complex flow path configuration in which a plurality of circuits are connected via a multi-way valve and two pumps are provided, it is possible to suppress further complication of the flow path and suppress backflow of the coolant in the pump when the coolant is supplied.

[0024] A method for manufacturing a thermal management system according to an aspect of the present disclosure is a method for manufacturing the above-described thermal management system. The manufacturing method includes depressurizing the air inside the first flow path and the second flow path from the supply unit in a state where the coolant does not flow through the first flow path and the second flow path, and injecting the coolant to which a pressure higher than atmospheric pressure is applied into the supply unit so that the supply unit supplies the coolant to both the depressurized first flow path and the second flow path simultaneously.

[0025] As described above, by supplying the coolant to each flow path so that the coolant flows relatively vigorously, even when it is difficult to predict the direction and flow rate of the coolant flow, by designing each flow path based on the value of the pressure loss of the coolant in each device, it is possible to provide a thermal management system that suppresses complication of the coolant flow path and suppresses backflow of the coolant in the pump when the coolant is supplied.

Advantages of the Invention

[0026] According to the present disclosure, it is possible to suppress complication of the coolant flow path and suppress damage to the pump when the coolant is supplied.

Brief Description of the Drawings

[0027] [Figure 1] A perspective view showing an example of a vehicle equipped with a thermal management system according to one embodiment of this disclosure. [Figure 2] This figure shows an example of the configuration of a vehicle equipped with a thermal management system according to one embodiment of the present disclosure. [Figure 3] This figure shows the overall configuration of a thermal management system according to one embodiment of the present disclosure. [Figure 4] This is a flowchart showing the manufacturing method of a thermal management system. [Figure 5] This diagram shows the thermal management system immediately after coolant injection. [Modes for carrying out the invention]

[0028] A thermal management system according to one embodiment of this disclosure will be described below with reference to the drawings. The same or corresponding parts in the drawings are denoted by the same reference numerals, and their descriptions will not be repeated.

[0029] Figure 1 is a perspective view showing an example of a vehicle equipped with a thermal management system according to one embodiment of the present disclosure. Figure 2 is a diagram showing an example of the configuration of a vehicle equipped with a thermal management system according to one embodiment of the present disclosure. Figure 3 is a diagram showing the overall configuration of the thermal management system according to one embodiment of the present disclosure. As shown in Figures 1 to 3, the thermal management system 10 according to one embodiment of the present disclosure is mounted on a vehicle 1. In other words, the vehicle 1 is equipped with the thermal management system 10. The vehicle 1 is an electric vehicle (xEV). Details of the configuration of the vehicle 1 will be described later.

[0030] A thermal management system 10 according to one embodiment of this disclosure will be described. As shown in Figure 3, the thermal management system 10 comprises a first flow path 100, a second flow path 200, a pump 300 (first pump), and a supply unit 400.

[0031] The first channel 100 and the second channel 200 are configured to allow coolant to flow through them. In Figure 3, the flow of coolant is indicated by white arrows. A liquid heat transfer medium (for example, water or a coolant other than water) is used as the coolant. Examples of coolants other than water include insulating oil or antifreeze (for example, LLC (Long Life Coolant)).

[0032] The first flow path 100 includes one or more first devices 110 and a plurality of first pipes 120. In this embodiment, the first flow path 100 includes a plurality of first devices 110. The first flow path 100 may also include a single first device 110.

[0033] Each of the multiple first devices 110 is configured to exchange heat with the coolant by allowing coolant to flow through it. That is, the first device 110 may be cooled by the coolant, or the first device 110 may cool the coolant. Furthermore, the components that constitute the coolant flow path inside the first device 110 are substantially not elastic.

[0034] In this embodiment, the multiple first devices 110 include a radiator 111 and an ESU (Electric Supply Unit) 112. The radiator 111 may cool or heat the coolant flowing through the first flow path 100, for example, by heat exchange with other heat circuits. The ESU 112 includes, for example, an inlet 112A, a charging circuit 112B (onboard charger), and a charging relay 112C (see Figure 2). These may be arranged individually as first devices 110.

[0035] Each of the multiple first pipes 120 is elastic. The multiple first pipes 120 connect each of the pump 300, one or more first devices 110, and the supply unit 400 to one another. In this embodiment, one of the first pipes 120 connects the pump 300 to one first device 110 (specifically, ESU 112). Another first pipe 120 connects the supply unit 400 to another first device 110 (specifically, radiator 111). Yet another first pipe 120 connects two first devices 110 (specifically, radiator 111 and ESU 112) to one another. If the inlet 112A, the charging circuit 112B (onboard charger), and the charging relay 112C are individually first devices 110 in the thermal management system 10, they may be connected to each other by the first pipes 120.

[0036] Furthermore, the first flow path 100 does not include an inlet into which coolant can be injected between the pump 300 and one or more first devices 110. The first flow path 100 as a whole does not include an inlet into which coolant can be injected.

[0037] The second flow path 200 includes one or more second devices 210 and a plurality of second pipes 220. In this embodiment, the second flow path 200 includes a plurality of second devices 210. The second flow path 200 may also include a single second device 210.

[0038] Each of the multiple second devices 210 is configured to exchange heat with the coolant by allowing coolant to flow through it. That is, the second device 210 may be cooled by the coolant, or the second device 210 may cool the coolant. Furthermore, the components constituting the coolant flow path inside the second device 210 are substantially not elastic. One or more second devices 210 include a high-pressure loss device 211. In this embodiment, the high-pressure loss device 211 is a power control unit (PCU) including an inverter. Details of the high-pressure loss device 211 will be described later. In addition, in this embodiment, the multiple second devices 210 further include an oil cooler 212.

[0039] Each of the multiple second pipes 220 is elastic. The multiple second pipes 220 connect each of the pump 300, one or more second devices 210, and the supply unit 400 to one another. In this embodiment, one of the second pipes 220 connects the pump 300 to one second device 210 (specifically, a high-pressure loss device 211). Another second pipe 220 connects the supply unit 400 to another second device 210 (specifically, an oil cooler 212). Yet another second pipe 220 connects two second devices 210 (specifically, a high-pressure loss device 211 and an oil cooler 212) to one another.

[0040] The sum of the lengths of the flow paths of all the second pipes 220 may be shorter than the sum of the lengths of the flow paths of all the first pipes 120. However, the volume of the second flow path 200 under normal pressure is greater than the volume of the first flow path 100 under normal pressure. Furthermore, the second flow path 200 does not include a flow control valve capable of controlling the flow rate of the coolant flowing through the second flow path 200. In other words, the high-pressure loss device 211 is a device different from a flow control valve.

[0041] Pump 300 is specifically a water pump. Pump 300 connects the first flow path 100 and the second flow path 200 to each other. Pump 300 is configured to deliver the coolant in the first flow path 100 to the second flow path 200. That is, pump 300 delivers the coolant in the first pipe 120 connected to pump 300 to the second pipe 220 connected to pump 300. In this embodiment, backflow of the coolant in pump 300 is suppressed when the coolant is supplied (details will be described later). Pump 300 itself does not need to include a diode or fuse to prevent current from flowing when an electromotive force is generated due to backflow of the coolant.

[0042] The supply unit 400 connects the first flow path 100 and the second flow path 200 to each other. The supply unit 400 is configured to allow the coolant flowing in from the first flow path 100 to flow out into the second flow path 200. In addition, the supply unit 400 is configured to supply coolant to both the first flow path 100 and the second flow path 200 simultaneously from outside the first flow path 100 and the second flow path 200.

[0043] In the manufacturing method of the thermal management system 10, which will be described in detail later, the supply unit 400 is instructed to simultaneously supply coolant to both the first flow path 100 and the second flow path 200 while coolant is not flowing through the first flow path 100 and the second flow path 200. At this time, the first flow path 100 and the second flow path 200 are designed such that the pressure loss of the coolant toward the pump 300 due to one or more second devices 210 is greater than the pressure loss of the coolant toward the pump 300 due to one or more first devices 110. The pressure loss value in one first device 110 is the absolute value of the difference between the pressure value on one side of the first device 110 in the first flow path 100 and the pressure value on the other side of the coolant supplied as described above. Furthermore, the pressure loss value in one second device 210 is the absolute difference between the pressure value on one side of the second device 210 and the pressure value on the other side in the second flow path 200 of the coolant supplied as described above.

[0044] Furthermore, the second flow path 200 is designed such that the pressure loss value of the coolant flowing toward the pump 300 in the high-pressure loss device 211 is the largest among the pressure loss values ​​of the coolant flowing toward the pump 300 in each of the one or more first devices 110 and one or more second devices 210. Specifically, the high-pressure loss device 211 is a power control unit (PCU) including an inverter, as described above. Since the structure of the coolant flow path in the PCU is relatively complex, the pressure loss of the coolant flowing inside the PCU is also large.

[0045] The supply unit 400 includes a third flow path 410, a bypass flow path 420, and a multi-way valve 430. The multi-way valve 430 is connected to both ends of the third flow path 410. The third flow path 410 includes a second pump 411, a reservoir tank 412, one or more third devices 413, and a plurality of third pipes 414.

[0046] The second pump 411 is specifically a water pump. The second pump 411 is configured to pump the coolant in the third passage 410 in one direction. The reservoir tank 412 stores the coolant. The reservoir tank 412 is configured to receive coolant. When coolant is injected into the reservoir tank 412, coolant is supplied to the third passage 410. The reservoir tank 412 is located on the side of the third passage 410 that is in the direction of fluid delivery of the second pump 411, but it may also be located on the opposite side from the direction of fluid delivery of the second pump 411.

[0047] In this embodiment, the third flow path 410 includes a plurality of third devices 413. The third flow path 410 may also include a single third device 413. Each of the plurality of third devices 413 is configured to exchange heat with a coolant by having a coolant flow through it. That is, the third device 413 may be cooled by the coolant as the coolant flows through it, or the third device 413 may cool the coolant. Furthermore, the components that constitute the coolant flow path inside the third device 413 are substantially not elastic. In this embodiment, the plurality of third devices 413 include a battery 413A, a chiller 413B, and a heat exchanger 413C. The chiller 413B and the heat exchanger 413C may cool or heat the coolant flowing through the third flow path 410.

[0048] Each of the multiple third pipes 414 is elastic. The multiple third pipes 414 connect each of the second pump 411, the reservoir tank 412, one or more third devices 413, and the multi-way valve 430 to each other. In this embodiment, each of the multiple third pipes 414 connects a port of the multi-way valve 430 to the chiller 413B, the chiller 413B to the heat exchanger 413C, the heat exchanger 413C to the second pump 411, the second pump 411 to the reservoir tank 412, the reservoir tank 412 to the battery 413A, and the battery 413A to the other ports of the multi-way valve 430 to each other.

[0049] The bypass channel 420 branches off from the third channel 410 and connects to yet another port of the multi-way valve 430. In this embodiment, the bypass channel 420 includes elastic piping, and specifically, the bypass channel 420 consists only of elastic piping. That is, the bypass channel 420 does not include any device intended for heat exchange with the coolant flowing through the bypass channel 420. The bypass channel 420 may also branch off from the third piping 414 connecting the reservoir tank 412 and the battery 413A, or it may be directly connected to the reservoir tank 412. Therefore, the coolant injected into the reservoir tank 412 is also supplied to the bypass channel 420.

[0050] The multi-way valve 430 is connected to one end of the first flow path 100, one end of the second flow path 200, both ends of the third flow path 410, and one end of the bypass flow path 420. Specifically, the multi-way valve 430 has five ports (not shown). The five ports are connected to the piping that constitutes the first pipe 120, the second pipe 220, the two third pipes 414, and the bypass flow path 420, respectively.

[0051] The multi-way valve 430 controls the flow rate of coolant flowing in from each of the aforementioned multiple flow paths, or the flow rate of coolant flowing out to each of these flow paths. In this embodiment, when the pump 300 is in operation, the multi-way valve 430 controls the flow rate of coolant flowing in from the second flow path 200 and controls the flow rate of coolant flowing out to the first flow path 100. For this reason, the multi-way valve 430 does not need to be able to close only one of the ports connected to the first flow path 100 and the port connected to the second flow path 200.

[0052] Next, an example of the configuration of vehicle 1 will be described. As shown in Figures 1 and 2, vehicle 1 is configured to be able to run using power output from battery 413A. Specifically, PCU 211 drives MG (Motor Generator) 230 using power supplied from battery 413A via power line PL. MG230 functions as a drive motor and rotates the drive wheels of vehicle 1. Oil cooler 212 cools the lubricating oil in oil circuit C using coolant flowing inside the oil cooler 212 in the second flow path 200 (see Figure 3). Oil circuit C supplies lubricating oil to MG230. The lubricating oil cools MG230. In addition, an SMR (System Main Relay) may be provided in the power line PL.

[0053] Furthermore, Vehicle 1 is configured to perform external charging (charging of the battery 413A using power from outside the vehicle). The ESU 112 (inlet 112A, charging circuit 112B, and charging relay 112C) is installed on the charging line CHL. When the connector of the charging cable leading to the EVSE (Electric Vehicle Supply Equipment) is connected to the inlet 112A of the parked Vehicle 1, Vehicle 1 is electrically connected to the EVSE. The charging circuit 112B charges the battery 413A using the power input from the EVSE to the inlet 112A. The charging relay 112C switches the connection / disconnection of the charging line CHL. Note that the configuration of Vehicle 1 is not limited to the above.

[0054] Next, the manufacturing method of the thermal management system 10 will be described. Figure 4 is a flow chart showing the manufacturing method of the thermal management system. As shown in Figure 4, the manufacturing method of the thermal management system comprises, in this order, depressurizing the flow path of the coolant (step S1) and injecting the coolant into the depressurized flow path (step S2).

[0055] Step S1 includes reducing the air inside the first flow path 100, the second flow path 200, the pump 300, and the supply unit 400 from the reservoir tank 412 of the supply unit 400, while no coolant is flowing through the first flow path 100, the second flow path 200, the pump 300, and the supply unit 400 (see Figure 3). In step S1, the inside of the first flow path 100, the second flow path 200, the pump 300, and the supply unit 400 is specifically evacuated from the reservoir tank 412.

[0056] Figure 5 shows the thermal management system immediately after coolant injection. In Figure 5, the flow of coolant is indicated by thick arrows. As shown in Figure 5, step S2 includes injecting coolant, which has been subjected to a pressure higher than atmospheric pressure, into the reservoir tank 412 of the supply unit 400. The multi-way valve 430, having the configuration already described, simultaneously discharges the coolant that has flowed into the reservoir tank 412 through both the first flow path 100 and the second flow path 200. In this embodiment, the coolant injected into the reservoir tank 412 flows into the third pipe 414 and the bypass flow path 420. The coolant in the bypass flow path 420 then flows into the multi-way valve 430 first. This is because there is no device for heat exchange in the bypass flow path 420. In addition, in the manufacturing method according to this embodiment, all ports of the multi-way valve 430 are open. This allows the coolant to quickly spread to each flow path. Therefore, the coolant that flows from the bypass channel 420 into the multi-way valve 430 flows into the first channel 100, the second channel 200, and the third channel 410. As a result, the supply unit 400 simultaneously supplies coolant to both the depressurized first channel 100 and the second channel 200.

[0057] As described above, the first flow path 100 and the second flow path 200 are designed such that the pressure loss of the coolant flowing towards the pump 300 due to one or more second devices 210 is greater than the pressure loss of the coolant flowing towards the pump 300 due to one or more first devices 110. In other words, the first flow path 100 and the second flow path 200 are designed such that the sum of the pressure losses of the coolant flowing towards the pump 300 from each of the one or more second devices 210 is greater than the sum of the pressure losses of the coolant flowing towards the pump from each of the one or more first devices 110. As a result, the coolant supplied from the supply unit 400 reaches the pump 300 through the first flow path 100 before it reaches the pump 300 through the second flow path 200. Specifically, the first flow path 100 and the second flow path 200 are designed such that the sum of the pressure loss values ​​of the coolant flowing towards the pump 300 from each of the second devices 210 is greater than the sum of the pressure loss values ​​of the coolant flowing towards the pump from each of the first devices 110.

[0058] As described above, the thermal management system 10 is manufactured by injecting the coolant into the thermal management system 10.

[0059] As described above, a thermal management system 10 according to one embodiment of the present disclosure comprises a first flow path 100, a second flow path 200, a pump 300, and a supply unit 400. The first flow path 100 and the second flow path 200 are configured to allow coolant to flow through them. The pump 300 connects the first flow path 100 and the second flow path 200 to each other. The pump 300 is configured to deliver the coolant from the first flow path 100 to the second flow path 200. The supply unit 400 connects the first flow path 100 and the second flow path 200 to each other. The supply unit 400 is configured to supply coolant to both the first flow path 100 and the second flow path 200 simultaneously. The first flow path 100 includes one or more first devices 110 configured to exchange heat with the coolant by allowing coolant to flow through it. The second flow path 200 includes one or more second devices 210 configured to exchange heat with the coolant by allowing coolant to flow through it. When no coolant is flowing through the first passage 100 and the second passage 200, and the supply unit 400 simultaneously supplies coolant to both the first passage 100 and the second passage 200, the pressure loss of the coolant toward the pump 300 due to one or more second devices 210 is greater than the pressure loss of the coolant toward the pump 300 due to one or more first devices 110.

[0060] According to the above configuration, by designing the coolant flow path in the thermal management system 10 with attention to the pressure loss value of the coolant in each device, it is possible to suppress the complexity of the coolant flow path while preventing the coolant supplied from the supply unit 400 from reaching the pump 300 via the second flow path 200 before it reaches the pump 300 via the first flow path 100. Furthermore, it is possible to suppress the coolant flowing inside the pump 300 in the opposite direction to the direction of fluid delivery by the pump 300. Consequently, it is possible to suppress the generation of back electromotive force due to backflow of coolant inside the pump 300, and to prevent the pump 300 from being damaged by back electromotive force.

[0061] Therefore, it is possible to suppress the complexity of the coolant flow path while also suppressing damage to the pump 300 when coolant is supplied.

[0062] In this embodiment, the first flow path 100 further includes a plurality of elastic first pipes 120. The plurality of first pipes 120 connect each other to the pump 300, one or more first devices 110, and the supply unit 400. The second flow path 200 further includes a plurality of elastic second pipes 220. The plurality of second pipes 220 connect each other to the pump 300, one or more second devices 210, and the supply unit 400.

[0063] With the above configuration, even if multiple first pipes 120 deform in a way that unintentionally increases in volume due to their elasticity, or if multiple second pipes 220 deform in a way that unintentionally decreases in volume due to their elasticity, by designing each flow path based on the pressure loss value of the coolant in each device, it is possible to suppress the complexity of the coolant flow path while suppressing backflow of the coolant in the pump 300 when the coolant is supplied.

[0064] Furthermore, in this embodiment, the volume of the second channel 200 under normal pressure is greater than the volume of the first channel 100 under normal pressure.

[0065] With the above configuration, it is possible to further suppress the coolant supplied from the supply unit 400 from reaching the pump 300 via the second flow path 200 before it reaches the pump 300 via the first flow path 100.

[0066] Furthermore, in this embodiment, the second flow path 200 does not include a flow control valve capable of controlling the flow rate of the coolant flowing through the second flow path 200.

[0067] Even if the second flow path 200 does not include a flow control valve at a predetermined position as in the above configuration, damage to the pump 300 during coolant supply can be suppressed by designing the coolant flow path in the thermal management system 10 based on the value of the coolant pressure loss in each device. Consequently, a thermal management system 10 with a relatively simple flow path can be provided.

[0068] Furthermore, in this embodiment, the first flow path 100 does not include an inlet into which coolant can be injected between the pump 300 and one or more first devices 110.

[0069] Even if the first flow path 100 does not include an injection port at a predetermined position as in the above configuration, damage to the pump 300 due to coolant backflow during coolant supply can be suppressed by designing the coolant flow path in the thermal management system 10 based on the value of the coolant pressure loss in each device. Consequently, a thermal management system 10 with a relatively simple flow path can be provided.

[0070] Furthermore, in this embodiment, one or more second devices 210 include a high-pressure-loss device 211. When coolant is supplied simultaneously from the supply unit 400 to both the first flow path 100 and the second flow path 200 while no coolant is flowing through them, the pressure loss value of the coolant toward the pump 300 in the high-pressure-loss device 211 is the largest among the pressure loss values ​​of the coolant toward the pump 300 in each of the one or more first devices 110 and the one or more second devices 210.

[0071] According to the above configuration, it is possible to design the flow path based on the pressure loss value of the coolant in each device while maintaining a high degree of freedom in the arrangement of each device other than the high-pressure-loss device 211, and consequently, to provide a thermal management system 10 with a relatively simple flow path.

[0072] Furthermore, in this embodiment, the high-pressure loss device 211 is a power control unit including an inverter.

[0073] With the above configuration, except for the power control unit, which typically has a relatively complex internal coolant flow path, it is possible to design the flow path based on the coolant pressure loss value in each device while maintaining a high degree of freedom in the arrangement of each device, and consequently, to provide a thermal management system 10 with a relatively simple flow path.

[0074] In this embodiment, the supply unit 400 includes a third flow path 410 and a multi-way valve 430. The third flow path 410 includes a second pump 411 and a reservoir tank 412. The second pump 411 is configured to pump the coolant in the third flow path 410 in one direction. The reservoir tank 412 stores the coolant. The multi-way valve 430 is connected to both ends of the first flow path 100, the second flow path 200, and the third flow path 410 so that when no coolant is flowing through the first flow path 100 and the second flow path 200, the coolant that has flowed into the reservoir tank 412 can be simultaneously discharged into both the first flow path 100 and the second flow path 200.

[0075] Even with a thermal management system 10 having a relatively complex flow path, such as the configuration described above, in which multiple circuits are connected via a multi-way valve 430 and two pumps 300 are provided, it is possible to suppress backflow of coolant in the pumps 300 when coolant is supplied, while suppressing further complexity of the flow path.

[0076] The manufacturing method of the thermal management system 10 according to this embodiment includes: reducing the air inside the first channel 100 and the second channel 200 from the supply unit 400 while no coolant is flowing through the first channel 100 and the second channel 200; and injecting coolant, which has been subjected to a pressure higher than atmospheric pressure, into the supply unit 400 so that the coolant is supplied simultaneously to both the first channel 100 and the second channel 200, which have been reduced in pressure.

[0077] With the above configuration, the coolant flows relatively vigorously through the first flow path 100 and the second flow path 200. This shortens the cycle time of the coolant injection process when manufacturing the thermal management system 10. Furthermore, even when it is difficult to predict the direction and flow rate of the coolant within the flow paths of the thermal management system 10, by designing each flow path based on the pressure loss value of the coolant in each device, it is possible to provide a thermal management system 10 that suppresses backflow of the coolant in the pump 300 when the coolant is supplied, while suppressing the complexity of the coolant flow paths.

[0078] In the above-described embodiment, the combinatable configurations may be combined with each other.

[0079] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this disclosure is indicated by the claims rather than the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended. [Explanation of Symbols]

[0080] 1 Vehicle, 10 Thermal Management System, 100 First Flow Channel, 110 First Device, 111 Radiator, 112 ESU, 112A Inlet, 112B Charging Circuit, 112C Charging Relay, 120 First Piping, 200 Second Flow Channel, 210 Second Device, 211 High Pressure Loss Unit (PCU), 212 Oil Cooler, 220 Second Piping, 230 MG, 300 Pump, 400 Supply Unit, 410 Third Flow Channel, 411 Second Pump, 412 Reservoir Tank, 413 Third Device, 413A Battery, 413B Chiller, 413C Heat Exchanger, 414 Third Piping, 420 Bypass Flow Channel, 430 Multiway Valve, C Oil Circuit, CHL Charging Line, PL Power Line.

Claims

1. It is a thermal management system, The first channel and, The second channel and Pump and Equipped with a supply unit, The first and second flow paths are configured to allow cooling liquid to flow through them, The pump is configured to connect the first flow path and the second flow path to each other, and to be able to deliver the cooling liquid from the first flow path to the second flow path. The supply unit connects the first flow path and the second flow path to each other and is configured to supply the coolant to both the first flow path and the second flow path simultaneously. The first flow path includes one or more first devices configured to allow heat exchange with the coolant by allowing the coolant to flow through it, The second flow path includes one or more second devices configured to allow heat exchange with the coolant by allowing the coolant to flow through it. A thermal management system in which, when the supply unit simultaneously supplies the coolant to both the first and second passages while the coolant is not flowing through the first and second passages, the pressure loss of the coolant toward the pump due to one or more second devices is greater than the pressure loss of the coolant toward the pump due to one or more first devices.

2. The first flow path further includes a plurality of elastic first pipes, The plurality of first pipes connect each of the pump, the one or more first devices, and the supply unit to one another. The second flow path further includes a plurality of elastic second pipes, The thermal management system according to claim 1, wherein the plurality of second pipes connect each other between the pump, the one or more second devices, and the supply unit.

3. The thermal management system according to claim 1, wherein the volume of the second channel under normal pressure is greater than the volume of the first channel under normal pressure.

4. The thermal management system according to claim 1, wherein the second flow path does not include a flow control valve capable of controlling the flow rate of the coolant flowing through the second flow path.

5. The thermal management system according to claim 1, wherein the first flow path between the pump and the one or more first devices does not include an injection port into which the coolant can be injected.

6. The one or more second devices mentioned above include a high-pressure loss device. The thermal management system according to claim 1, wherein when the coolant is supplied simultaneously from the supply unit to both the first and second passages while the coolant is not flowing through the first and second passages, the value of the pressure loss of the coolant toward the pump in the high-pressure-loss device is the largest among the values ​​of the pressure loss of the coolant toward the pump in each of the one or more first devices and the one or more second devices.

7. The thermal management system according to claim 6, wherein the high-pressure loss device is a power control unit including an inverter.

8. The supply unit includes a third flow path and a multi-way valve, The third flow path includes a second pump and a reservoir tank. The second pump is configured to be able to deliver the cooling liquid in the third flow path in one direction. The reservoir tank stores the coolant, The thermal management system according to any one of claims 1 to 7, wherein the multi-way valve is connected to both ends of the first passage, the second passage, and the third passage so that when the coolant is not flowing through the first passage and the second passage, the coolant that has flowed into the reservoir tank by being injected can be simultaneously discharged into both the first passage and the second passage.

9. A method for manufacturing a thermal management system according to claim 1, With the cooling liquid not flowing through the first and second passages, the supply unit reduces the pressure of the air inside the first and second passages. A method for manufacturing a thermal management system, comprising: injecting the coolant, which has been subjected to a pressure higher than atmospheric pressure, into the supply unit so that the supply unit simultaneously supplies the coolant to both the first and second channels, which have been depressurized.

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