Substrate processing apparatus and substrate processing method

Abstract

This disclosure describes a substrate processing apparatus and a substrate processing method capable of suppressing the adhesion of foreign matter (e.g., particles) to a substrate. [Solution] The substrate processing apparatus comprises a rotating holding unit, a supply unit including a nozzle, a valve arranged in the supply line, a filter arranged between the valve and the nozzle in the supply line, a cup unit, a liquid receiving unit, a drive unit, and a control unit. The control unit is configured to perform a first process in which, with the nozzle positioned above the liquid receiving unit, the supply unit and the valve are controlled to discharge processing liquid from the nozzle to the liquid receiving unit, and a second process in which, with the discharge of processing liquid from the nozzle continuing as in the first process, the drive unit is controlled to move the nozzle above the substrate held in the rotating holding unit and supply processing liquid from the nozzle to the substrate.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] Patent Document 1 discloses a substrate liquid processing apparatus that suppresses contamination of particles in a processing liquid supplied to a substrate. The apparatus includes a supply line not provided with an adjustment mechanism for variably restricting a flow path connecting a supply tank and a discharge nozzle, a drain line connected to a branch portion between the supply tank and the discharge nozzle in the supply line, a liquid flow adjustment mechanism provided in the drain line and restricting passage of a processing liquid having a pressure lower than a set pressure, and a control unit for adjusting the set pressure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure describes a substrate processing apparatus and a substrate processing method capable of suppressing adhesion of foreign substances (e.g., particles, etc.) to a substrate. <酬

Means for Solving the Problems

[0005] An example of a substrate processing apparatus includes a rotating holding unit configured to hold and rotate a substrate, a supply unit including a nozzle configured to supply processing liquid to the upper surface of the substrate held by the rotating holding unit through a supply line, a valve arranged in the supply line, a filter arranged in the supply line between the valve and the nozzle, a cup portion arranged to surround the substrate held by the rotating holding unit from the outside and including a cylindrical side wall portion and an annular top wall portion extending inward from the upper end of the side wall portion, a liquid receiving portion provided in the top wall portion and including an opening that opens upward to receive the processing liquid discharged from the nozzle, a drive unit configured to move the nozzle between the upper part of the substrate held by the rotating holding unit and the upper part of the liquid receiving portion, and a control unit. The control unit is configured to perform a first process in which, with the nozzle positioned above the liquid receiving section, it controls the supply unit and the valve to discharge the processing liquid from the nozzle to the liquid receiving section, and a second process in which, while the discharge of the processing liquid from the nozzle by the first process continues, it controls the drive unit to move the nozzle above the substrate held by the rotating holding unit and to supply the processing liquid from the nozzle to the substrate. [Effects of the Invention]

[0006] According to the substrate processing apparatus and substrate processing method described herein, it is possible to suppress the adhesion of foreign matter (e.g., particles) to the substrate. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view showing an example of a substrate processing system. [Figure 2] Figure 2 is a schematic diagram showing an example of a liquid processing unit. [Figure 3] Figure 3 is a schematic diagram showing an example of a processing liquid supply unit. [Figure 4] Figure 4 is a block diagram showing an example of the main components of a substrate processing system. [Figure 5] Figure 5 is a schematic diagram showing an example of the controller's hardware configuration. [Figure 6] Figure 6 is a flowchart illustrating the processing of the substrate. [Figure 7] Figure 7 is a diagram illustrating the processing of the substrate. [Figure 8] Figure 8 is a diagram illustrating the processing of the substrate. [Figure 9] Figure 9 is a diagram illustrating the processing of the substrate. [Figure 10] Figure 10 is a diagram illustrating the processing of the substrate. [Figure 11] Figure 11 is a diagram illustrating the processing of the substrate. [Figure 12] Figure 12 is a diagram illustrating the processing of the substrate. [Modes for carrying out the invention]

[0008] In the following descriptions, the same reference numeral will be used for identical elements or elements with the same function, and redundant explanations will be omitted. Furthermore, in this specification, when referring to the top, bottom, right, and left of a figure, the direction of the reference numeral in the figure will be used as the reference.

[0009] [Circuit board processing system] First, with reference to Figure 1, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 comprises an input / output station 2, a processing station 3, and a controller Ctr (control unit). The input / output station 2 and the processing station 3 may be arranged in a single line horizontally, for example.

[0010] The substrate W may be disc-shaped, or it may be a plate shape other than circular, such as a polygon. The substrate W may have a notch in which a part is cut out. The notch may be, for example, a notch (groove such as U-shaped or V-shaped), or a straight section extending in a straight line (a so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or various other types of substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a mounting section 4, a loading / unloading section 5, and a shelf unit 6. The mounting section 4 includes a plurality of mounting tables (not shown) arranged in the width direction (vertical direction in Figure 1). Each mounting table is configured to accommodate a carrier 7. The carrier 7 is configured to house at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for loading and unloading the substrate W.

[0012] The loading / unloading section 5 is located adjacent to the loading / unloading section 4 in the direction in which the loading / unloading station 2 and processing station 3 are aligned (left-right direction in Figure 1). The loading / unloading section 5 includes an opening / closing door (not shown) provided for the loading / unloading section 4. When the carrier 7 is placed on the loading / unloading section 4, both the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading section 5 are opened, creating communication between the inside of the loading / unloading section 5 and the inside of the carrier 7.

[0013] The loading / unloading unit 5 incorporates a transport arm A1 and a shelf unit 6. Based on signals from the controller Ctr, the transport arm A1 is configured to move horizontally in the width direction of the loading / unloading unit 5, move up and down in the vertical direction, and rotate around the vertical axis. The transport arm A1 is configured to take the substrate W from the carrier 7 and pass it to the shelf unit 6, and to receive the substrate W from the shelf unit 6 and return it to the carrier 7. The shelf unit 6 is located near the processing station 3 and is configured to accommodate the substrate W.

[0014] The processing station 3 includes a transfer unit 8 and a plurality of liquid processing units U. The transfer unit 8 extends horizontally, for example, in the direction (left - right direction in FIG. 1) in which the loading / unloading station 2 and the processing station 3 are arranged side by side. The transfer unit 8 incorporates a transfer arm A2 (transfer unit). The transfer arm A2 is configured to be capable of horizontal movement in the longitudinal direction of the transfer unit 8, vertical movement in the vertical direction, and rotational movement around the vertical axis based on a signal from the controller Ctr. The transfer arm A2 is configured to take out the substrate W from the shelf unit 6 and deliver it to the liquid processing unit U, and also to receive the substrate W from the liquid processing unit U and return it into the shelf unit 6.

[0015] The plurality of liquid processing units U are arranged in a row along the longitudinal direction (left - right direction in FIG. 1) of the transfer unit 8, respectively, on both sides of the transfer unit 8. The configuration of the liquid processing unit U will be described later.

[0016] The controller Ctr, which will be described in detail later, is configured to control the substrate processing system 1 partially or entirely.

[0017] [Liquid Processing Unit] Subsequently, referring to FIG. 2, the liquid processing unit U will be described in detail. The liquid processing unit U is configured to perform a predetermined liquid process (for example, a process for removing dirt and foreign substances, an etching process, etc.) on the substrate W. The liquid processing unit U may be, for example, a single - wafer cleaning device that cleans the substrate W one by one by spin cleaning.

[0018] The liquid processing unit U includes a housing 10, a blowing unit 20, a rotation holding unit 30, a processing liquid supply unit 40 (supply unit), a rinse liquid supply unit 50 (another supply unit), and a cup unit 60.

[0019] The housing 10 houses the rotating holding unit 30 inside. The housing 10 is configured to allow the substrate W to be loaded into and unloaded from its interior. An loading / unloading port (not shown) is formed in the side wall of the housing 10. The substrate W is transported into the housing 10 and unloaded from the housing 10 through this loading / unloading port by the transport arm A2.

[0020] The air blower 20 is mounted on the top wall of the housing 10. The air blower 20 is configured to create a downward flow within the housing 10 based on a signal from the controller Ctr. The downward flow created by the air blower 20 flows toward the upper surface Wa of the substrate W held by the rotating holding unit 30.

[0021] The rotating and holding unit 30 includes a drive unit 31, a shaft 32, and a holding unit 33. The drive unit 31 is configured to operate based on a control signal from the controller Ctr and to rotate the shaft 32. The drive unit 31 may be a power source such as an electric motor.

[0022] The holding portion 33 is provided at the tip of the shaft 32. The holding portion 33 is configured to hold the back surface Wb of the substrate W, for example, by suction. That is, the rotating holding portion 30 may be configured to rotate the substrate W around a rotation center axis Ax perpendicular to the upper surface Wa of the substrate W, while the substrate W is in a substantially horizontal position. Alternatively, the holding portion 33 may be configured to hold the substrate W by a plurality of movable members that grip the peripheral edge of the substrate W, instead of suction.

[0023] The processing liquid supply unit 40 includes a processing liquid supply unit 41, a nozzle N1, and a drive unit 42. The processing liquid supply unit 41 functions as a source of processing liquid L1 (see Figure 3, etc.). That is, the processing liquid supply unit 41 is configured to supply the processing liquid L1 to the nozzle N1. The processing liquid L1 supplied by the processing liquid supply unit 41 is supplied from the nozzle N1 to the upper surface Wa of the substrate W. Details of the processing liquid supply unit 41 will be described later.

[0024] The treatment solution L1 may be, for example, an acidic solution, an alkaline solution, or an organic solution. Acidic solutions may include, for example, SC-2 solution (a mixture of hydrochloric acid, hydrogen peroxide, and pure water), SPM (a mixture of sulfuric acid and hydrogen peroxide solution), HF solution (hydrofluoric acid), DHF solution (dilute hydrofluoric acid), HNO3+HF solution (a mixture of nitric acid and hydrofluoric acid), etc. Alkaline solutions may include, for example, SC-1 solution (a mixture of ammonia, hydrogen peroxide, and pure water), hydrogen peroxide solution, etc. Organic solutions may include, for example, IPA (isopropyl alcohol), etc.

[0025] The drive unit 42 operates based on a control signal from the controller Ctr and is configured to move the nozzle N1 horizontally or vertically. The drive unit 42 may be configured to move the nozzle N1 between, for example, above the substrate W held by the rotating holding unit 30 and above the liquid receiving unit 63, which will be described later.

[0026] The rinse liquid supply unit 50 includes a rinse liquid supply unit 51, a nozzle N2 (another nozzle), and a drive unit 52 (another drive unit). The rinse liquid supply unit 51 functions as a source of rinse liquid L2 (see Figure 10, etc.). That is, the rinse liquid supply unit 51 is configured to deliver the rinse liquid L2 to the nozzle N2. The rinse liquid L2 delivered by the rinse liquid supply unit 51 is supplied from the nozzle N2 to the upper surface Wa of the substrate W. The rinse liquid L2 may include, for example, pure water (DIW), ozonated water, carbonated water (CO2 water), ammonia water, etc.

[0027] The drive unit 52 operates based on a control signal from the controller Ctr and is configured to move the nozzle N2 horizontally or vertically. The drive unit 52 may be configured to move the nozzle N2 between, for example, above the substrate W held by the rotating holding unit 30 and outside the substrate W held by the rotating holding unit 30 (for example, outside the cup portion 60).

[0028] The cup portion 60 is provided so as to surround the periphery of the holding portion 33 and the periphery of the substrate W held by the holding portion 33 from the outside. The cup portion 60 is configured to collect the processing liquid L1 or rinsing liquid L2 that is swept away from the outer edge of the substrate W when the processing liquid L1 or rinsing liquid L2 is supplied to the upper surface of the substrate W while it is rotating by the rotating holding portion 30.

[0029] The cup portion 60 includes a side wall portion 60a, a top wall portion 60b, and a bottom wall portion 60c. The side wall portion 60a is cylindrical in shape as a whole, surrounding the holding portion 33 from the outside. The top wall portion 60b is annular in shape and extends inward from the upper end of the side wall portion 60a. In the example in Figure 2, the top wall portion 60b extends diagonally upward from the upper end of the side wall portion 60a inward. The bottom wall portion 60c is provided at the lower end of the side wall portion 60a so as to close the lower end of the side wall portion 60a.

[0030] The bottom wall portion 60c of the cup portion 60 is provided with a drain port 61 and an exhaust port 62. The drain port 61 is configured to discharge the processing liquid L1 or rinsing liquid L2 collected by the cup portion 60 to the outside of the liquid processing unit U. The exhaust port 62 is configured to discharge the downward flow formed around the substrate W by the blower portion 20 to the outside of the liquid processing unit U. This downward flow is accompanied by gas generated around the substrate W as the substrate W is processed by the processing liquid L1.

[0031] A liquid receiving portion 63 is provided on the top wall portion 60b of the cup portion 60. The liquid receiving portion 63 may be positioned near the inner periphery of the top wall portion 60b, or in close proximity to the inner periphery of the top wall portion 60b, as illustrated in Figure 2. The liquid receiving portion 63 includes an opening 63a that is open upward to receive the processing liquid L1 discharged from the nozzle N1.

[0032] [Processing liquid supply unit] Next, with reference to Figure 3, the processing liquid supply unit 41 will be described in detail. The processing liquid supply unit 41 includes storage tanks T1 and T2, a liquid source 43, a circulation unit 44, a supply unit 45, a liquid delivery unit 46, and a drainage unit 47. The storage tanks T1 and T2 are configured to temporarily store the processing liquid L1.

[0033] The liquid source 43 is the source of the treatment liquid L1. The liquid source 43 is configured to supply the treatment liquid L1 to the storage tank T1 through the piping D1.

[0034] The circulation unit 44 includes piping D2, a pump P1, a heater H, and a filter F1 (another filter). Both the upstream and downstream ends of piping D2 are connected to the storage tank T1. That is, the upstream end of piping D2 is connected to the lower part of the storage tank T1. The downstream end of piping D2 is connected to the upper part of the storage tank T1. Therefore, piping D2 constitutes a circulation line through which the treated liquid L1 discharged from the storage tank T1 returns to the storage tank T1.

[0035] The piping D2 is equipped with, in order from upstream, a pump P1, a heater H, and a filter F1. The pump P1 operates based on a control signal from the controller Ctr and is configured to send the processed liquid L1 drawn from the storage tank T1 to the downstream side. The heater H operates based on a control signal from the controller Ctr and is configured to heat the processed liquid L1 flowing through the piping D2 to a predetermined temperature. The heater H may be, for example, an electric heater. The filter F1 is configured to collect foreign matter (for example, particles, etc.) contained in the processed liquid L1 flowing through the piping D2.

[0036] The supply unit 45 includes piping D3, valve V1, and filter F2. Piping D3 branches off from piping D2 downstream of filter F1. The downstream end of piping D3 is connected to nozzle N1. Therefore, piping D3 constitutes a supply line through which the processed liquid L1 flows to nozzle N1 via piping D2.

[0037] In the piping D3, a valve V1 and a filter F2 are provided in order from the upstream side. In other words, the filter F2 is located between the valve V1 and the nozzle N1 in the piping D3. The valve V1 is configured to open and close based on a control signal from the controller Ctr. When the valve V1 is open, the pump P1 operates, causing the processing liquid L1 in the storage tank T1 to flow through the piping D2 and D3 to the nozzle N1, and the processing liquid L1 is supplied to the upper surface Wa of the substrate W held by the rotating holding unit 30. The filter F2 is configured to collect foreign matter contained in the processing liquid L1 flowing through the piping D3.

[0038] The liquid supply unit 46 includes pipes D4 and D5, a valve V2, a pump P2, and a filter F3. The upstream end of pipe D4 is connected to the lower part of the liquid receiving unit 63. The downstream end of pipe D4 is connected to the upper part of the storage tank T2. Valve V2 is located in pipe D4. Valve V2 is configured to open and close based on a control signal from controller Ctr. When valve V2 is open, the processed liquid L1 in the liquid receiving unit 63 flows through pipe D4 to the storage tank T2.

[0039] The upstream end of pipe D5 is connected to the lower part of storage tank T2. The downstream end of pipe D5 is connected to the upper part of storage tank T1. Pipe D5 is equipped with a pump P2 and a filter F3, in that order from the upstream side. Pump P2 operates based on a control signal from controller Ctr and is configured to send the processed liquid L1 drawn from storage tank T2 to the downstream side (storage tank T1). Filter F3 is configured to collect foreign matter contained in the processed liquid L1 flowing through pipe D5.

[0040] The drainage section 47 includes a pipe D6 and a valve V3. The pipe D6 branches off from the pipe D4 between the liquid receiving section 63 and the valve V2. The downstream end of the pipe D6 extends outside the liquid processing unit U. The pipe D6 is equipped with a valve V3. The valve V3 is configured to open and close based on a control signal from the controller Ctr. When the valve V3 is open, the processed liquid L1 in the liquid receiving section 63 is drained outside the liquid processing unit U through the pipe D6.

[0041] [controller] As shown in Figure 4, the controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, and an instruction unit M4 as functional modules. These functional modules are merely a convenient division of the controller Ctr's functions into multiple modules, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by program execution, but may also be implemented by a dedicated electrical circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates these.

[0042] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores programs for operating each part of the substrate processing system 1 (transport arms A1, A2, blower unit 20, rinse liquid supply unit 51, drive units 31, 42, 52, pumps P1, P2, valves V1~V3, heater H, etc.). The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. The recording medium RM may be built into the substrate processing system 1 or may be separate from the substrate processing system 1.

[0043] The storage unit M2 is configured to store various types of data. For example, the storage unit M2 may store programs read from the recording medium RM by the reading unit M1, setting data input from the operator via an external input device (not shown), and so on.

[0044] The processing unit M3 is configured to process various types of data. For example, the processing unit M3 may be configured to generate operation signals for operating each part of the substrate processing system 1 based on various types of data stored in the storage unit M2.

[0045] The instruction unit M4 is configured to transmit the operation signals generated in the processing unit M3 to each part of the substrate processing system 1.

[0046] The hardware of the controller Ctr may consist of, for example, one or more control computers. The controller Ctr may include, for example, the circuit C1 shown in Figure 5 as a hardware configuration. Circuit C1 may consist of electrical circuit elements. Circuit C1 may include, for example, a processor C2, a memory C3 (storage unit), a storage C4 (storage unit), a driver C5, and an input / output port C6. The processor C2 executes a program in cooperation with at least one of the memory C3 and storage C4, and performs signal input and output via the input / output port C6, thereby configuring each of the above-mentioned functional modules. The memory C3 and storage C4 function as storage unit M2. The driver C5 is a circuit that drives each part of the board processing system 1. The input / output port C6 performs signal input and output between the driver C5 and each part of the board processing system 1.

[0047] The substrate processing system 1 may have one controller Ctr, or it may have a controller group (control unit) composed of multiple controllers Ctr. In the latter case, each of the above functional modules may be implemented by one controller Ctr, or by a combination of two or more controllers Ctr. If the controller Ctr is composed of multiple computers (circuit C1), each of the above functional modules may be implemented by one computer (circuit C1), or by a combination of two or more computers (circuit C1). The controller Ctr may include multiple processors C2. In this case, each of the above functional modules may be implemented by one processor C2, or by a combination of two or more processors C2.

[0048] [Substrate Processing Method] Next, the processing of the substrate W will be explained with reference to Figures 6 to 12. The initial state will be described with valves V1 to V3 closed and nozzle N1 positioned above liquid receiving section 63.

[0049] First, as illustrated in Figure 7, while supplying the treatment liquid L1 from the liquid source 43 to the storage tank T1, the controller Ctr controls the pump P1 and heater H to heat the treatment liquid L1 in the storage tank T1 with the heater H and circulate the treatment liquid L1 through the piping D2 (see the thick line in Figure 7). As a result, the treatment liquid L1 is purified by the filter F1 and its temperature is controlled by the heater H (see step S1 in Figure 6).

[0050] Next, as illustrated in Figure 8, the controller Ctr controls valves V1 and V3 to open them. As a result, the processing liquid L1 flowing through piping D2 is purified by filter F2 and discharged from nozzle N1 to liquid receiving section 63 through piping D3 (see the thick line in Figure 8 and Figure 10(a)). The processing liquid L1 discharged to liquid receiving section 63 is drained through piping D4 and D6 (see step S2 in Figure 6).

[0051] Next, as illustrated in Figure 9, the controller Ctr controls valves V2 and V3, closing valve V3 while opening valve V2. As a result, the treated liquid L1 discharged to the liquid receiving section 63 is supplied to the storage tank T2 through piping D4. The controller Ctr also controls the pump P2 to send the treated liquid L1 in the storage tank T2 downstream through piping D5 (see the thick line in Figure 9). As a result, the treated liquid L1 is purified by the filter F2 and returned to the storage tank T1. In other words, the treated liquid L1 discharged to the liquid receiving section 63 circulates through piping D4, storage tank T2, piping D5, storage tank T1, piping D2 and piping D3 (see step S3 in Figure 6).

[0052] Next, the controller Ctr instructs the transport arm A1 to take one substrate W from the carrier 7 and transport it toward the liquid processing unit U. Next, the controller Ctr instructs the transport arm A2 to load the substrate W into the housing 10 and have the holding unit 33 hold the substrate W (see step S4 in Figure 6 and Figure 10(b)). Next, the controller Ctr instructs the drive unit 31 to rotate the substrate W held by the holding unit 33 at a predetermined rotational speed. During the loading of the substrate W into the housing 10, the discharge of processing liquid L1 from the nozzle N1 to the liquid receiving unit 63 continues.

[0053] Next, the controller Ctr instructs the drive unit 52 to move the nozzle N2 above the substrate W held by the rotating holding unit 30. The drive unit 52 may move the nozzle N2 so that it is positioned above the area including the central part of the substrate W. Next, the controller Ctr instructs the rinse liquid supply unit 51 to supply rinse liquid L2 from the nozzle N2 to the upper surface Wa of the substrate W held by the rotating holding unit 30 (see step S5 in Figure 6). As a result, the rotation of the substrate W causes the rinse liquid L2 to spread toward the outer edge of the substrate W by centrifugal force, and the entire upper surface Wa of the substrate W is covered with rinse liquid L2 (see Figure 10(c)).

[0054] Next, the controller Ctr instructs the drive unit 42 to move the nozzle N1 above the substrate W held by the rotation holding unit 30. At this time, the rotation of the substrate W, the discharge of processing liquid L1 from nozzle N1, and the discharge of rinsing liquid L2 from nozzle N2 are all continuous. Therefore, the processing liquid L1 discharged from nozzle N1 is first supplied to the vicinity of the outer edge of the substrate W and mixes with the rinsing liquid L2 that is already covering the upper surface Wa of the substrate W (see step S6 in Figure 6 and Figure 11(a)).

[0055] Subsequently, the drive unit 42 moves nozzle N1 so that it is positioned above the area including the central part of the substrate W. At the same time, the controller Ctr instructs the drive unit 52 to move nozzle N2 toward the outside of the substrate W. As a result, the liquid covering the upper surface Wa of the substrate W is gradually replaced from the rinsing liquid L2 to the processing liquid L1 (see Figure 11(b)).

[0056] Subsequently, the controller Ctr instructs the drive unit 52 to move the nozzle N2 so that it is positioned outside the substrate W. The controller Ctr also instructs the rinse liquid supply unit 51 to stop supplying the rinse liquid L2 from the nozzle N2. As a result, the entire upper surface Wa of the substrate W is covered with the processing liquid L1 (see Figure 11(c)). Consequently, the upper surface Wa of the substrate W is dried by the processing liquid L1.

[0057] Next, the controller Ctr instructs the drive unit 42 to move the nozzle N1 toward the outside of the substrate W (see Figure 12(a)). Then, the drive unit 42 moves the nozzle N1 so that it is positioned above the liquid receiving unit 63 (see Figure 12(b)). As a result, the processing liquid L1 from the nozzle N1 is discharged into the liquid receiving unit 63 (see step S7 in Figure 6). The processing liquid L1 discharged into the liquid receiving unit 63 is then circulated again through piping D4, storage tank T2, piping D5, storage tank T1, piping D2 and piping D3 (see step S7 in Figure 6).

[0058] Next, the controller Ctr instructs the drive unit 31 to stop the rotation of the substrate W held in the holding unit 33. Next, the controller Ctr instructs the transport arm A2 to grasp the substrate W held in the rotating holding unit 30 and remove it from the housing 10 (see Figure 12(c)). Next, the controller Ctr instructs the transport arm A1 to transport the substrate W to the carrier 7. This completes the processing of one substrate W. Note that the discharge of processing liquid L1 from the nozzle N1 to the liquid receiving unit 63 continues even while the substrate W is being removed from the housing 10. Therefore, when processing subsequent substrates W, steps S4 to S8 in Figure 6 are repeated.

[0059] [Effect] In the above example, the filter F2 is positioned in the piping D3 so as to be located downstream of the valve V1. Therefore, even if foreign matter is mixed into the processing liquid L1 due to dust generation associated with the opening and closing of the valve V1, the foreign matter is removed by the filter F2 downstream of the valve V1. Thus, it is possible to suppress the adhesion of foreign matter to the substrate W. Furthermore, in the above example, while the discharge of the processing liquid L1 from the nozzle N1 to the liquid receiving section 63 located near the substrate W held by the rotating holding section 30 is continued, the nozzle N1 is moved above the substrate W, and the processing liquid L1 is supplied from the nozzle N1 to the substrate W. Therefore, the valve V1 is not opened or closed when the processing liquid L1 is supplied to the substrate W. Consequently, the processing liquid L1 does not remain in the filter F2 when the valve V1 is closed, so the properties of the processing liquid L1 (e.g., temperature) are less likely to change. As a result, it is not necessary to discharge a dummy version of the processing liquid L1 until the processing liquid L1 has properties suitable for processing the substrate W before supplying the processing liquid L1 to the substrate W. As a result, it becomes possible to suppress the adhesion of foreign matter to the substrate W while suppressing the consumption of processing liquid L1 due to dummy discharge.

[0060] In the above example, while the discharge of the processing liquid L1 from the nozzle N1 continues, the nozzle N1 is moved above the region including the center of the substrate W held by the rotating holding unit 30. As a result, the processing liquid L1 spreads more easily from the center of the substrate W to the entire substrate W. Therefore, it becomes possible to process the substrate W more efficiently.

[0061] In the above example, while the discharge of processing liquid L1 from nozzle N1 continues, nozzle N1, which is located above the substrate W held by the rotating holding unit 30, is moved above the liquid receiving unit 63, and processing liquid L1 is supplied from nozzle N1 to the liquid receiving unit 63. Therefore, the valve V1 is not closed, and nozzle N1 moves from above the substrate W to above the liquid receiving unit 63. Consequently, when processing of the substrate W is completed, the processing liquid L1 does not remain in the filter F2. As a result, when processing subsequent substrates W, it is no longer necessary to discharge dummy processing liquid L1, making it possible to further suppress the consumption of processing liquid L1 due to dummy discharge.

[0062] In the above example, the substrate W is loaded into or unloaded from the housing 10 while the processing liquid L1 from the nozzle N1 is continuously discharged. Therefore, even when processing the substrate W sequentially, it is possible to suppress the adhesion of foreign matter to the substrate W while suppressing the consumption of processing liquid L1 due to dummy discharge.

[0063] In the above example, the rinsing solution L2 is supplied to the substrate W before the processing solution L1 is supplied to the substrate W. Therefore, on the upper surface Wa of the substrate W, the rinsing solution L2 is replaced with the processing solution L1, and then the substrate W is dried. Consequently, it is possible to suppress the adhesion of particles to the substrate W that occur due to the generation of watermarks.

[0064] In the above example, while the discharge of processing liquid L1 from nozzle N1 and the discharge of rinsing liquid L2 from nozzle N2 are continued, nozzle N1 is moved above the substrate W held by the rotating holding unit 30, supplying processing liquid L1 to the substrate W, while nozzle N2, which is located above the substrate W held by the rotating holding unit 30, is moved to the outside of the substrate W. As a result, the upper surface Wa of the substrate W is always covered with rinsing liquid L2 or processing liquid L1. Therefore, it is possible to further suppress the occurrence of watermarks.

[0065] In the above example, as the processing liquid L1 circulates through the piping D2, foreign matter in the processing liquid L1 is removed by the filter F1. As a result, the purified processing liquid L1 is discharged from the nozzle N1 through the piping D3. Therefore, it becomes possible to further suppress the adhesion of foreign matter to the substrate W.

[0066] In the above example, the processing liquid L1 discharged to the liquid receiving section 63 is returned to the storage tank T1, and then discharged again from the storage tank T1 through the pipes D2 and D3 to the nozzle N1. Therefore, the processing liquid L1 is utilized effectively, and the consumption of the processing liquid L1 can be further reduced.

[0067] [Differentiation] The disclosures herein should be considered in all respects to be illustrative and not restrictive. Various omissions, substitutions, and modifications may be made to the above examples without departing from the claims and the gist thereof.

[0068] (1) While continuing to discharge the processing liquid L1 from the nozzle N1, the nozzle N1 may be moved above the stationary substrate W which is held by the rotating holding unit 30 and whose rotation has stopped. In this case, a reservoir of processing liquid L1 is formed on the upper surface Wa of the stationary substrate W. Therefore, it becomes possible to process the substrate W with a relatively small amount of processing liquid L1.

[0069] (2) The processing liquid supply unit 41 does not include a storage tank T2, and the pipes D4 and D5 may be directly connected. In this case, the processing liquid L1 discharged from the nozzle N1 to the liquid receiving section 63 is returned directly to the storage tank T1.

[0070] (3) Filter F3 may be placed at any position in the piping D4 and D5.

[0071] (4) The liquid receiving section 63 may be provided at any position on the top wall section 60b.

[0072] [Other examples] Example 1. An example of a substrate processing apparatus comprises a rotating holding unit configured to rotate while holding a substrate, a supply unit including a nozzle configured to supply processing liquid to the upper surface of the substrate held by the rotating holding unit through a supply line, a valve arranged in the supply line, a filter arranged between the valve and the nozzle in the supply line, a cup portion arranged to surround the periphery of the substrate held by the rotating holding unit from the outside and including a cylindrical side wall portion and an annular top wall portion extending inward from the upper end of the side wall portion, a liquid receiving portion provided in the top wall portion and including an opening that is open upward to receive the processing liquid discharged from the nozzle, a drive unit configured to move the nozzle between the upper part of the substrate held by the rotating holding unit and the upper part of the liquid receiving portion, and a control unit. The control unit is configured to perform a first process in which, with the nozzle positioned above the liquid receiving section, it controls the supply unit and the valve to discharge the processing liquid from the nozzle to the liquid receiving section, and a second process in which, while the discharge of the processing liquid from the nozzle due to the first process continues, it controls the drive unit to move the nozzle above the substrate held by the rotating holding unit and supplies the processing liquid from the nozzle to the substrate.

[0073] In Example 1, the filter is positioned in the supply line downstream of the valve. Therefore, even if foreign matter (e.g., particles) is mixed into the processing liquid due to dust generation associated with the opening and closing of the valve, the filter downstream of the valve removes the foreign matter. Thus, it is possible to suppress the adhesion of foreign matter to the substrate. Also, in Example 1, while the processing liquid is continuously discharged from the nozzle to a liquid receiving section located near the substrate held by the rotating holding section, the nozzle is moved above the substrate and the processing liquid is supplied from the nozzle to the substrate. Therefore, the valve is not opened or closed when supplying the processing liquid to the substrate. Consequently, the processing liquid does not accumulate in the filter when the valve is closed, so the properties of the processing liquid (e.g., temperature) are less likely to change. As a result, it is not necessary to discharge dummy processing liquid until the processing liquid has properties suitable for processing the substrate before supplying it to the substrate. Consequently, according to Example 1, it is possible to suppress the adhesion of foreign matter to the substrate while suppressing the consumption of processing liquid due to dummy discharge.

[0074] Example 2. In the apparatus of Example 1, the second process may include moving the nozzle above the region including the center of the substrate held by the rotating holder, while continuing to discharge the processing liquid from the nozzle as in the first process. In this case, the processing liquid spreads more easily from the center of the substrate to the entire substrate. Therefore, it becomes possible to process the substrate more efficiently.

[0075] Example 3. In the apparatus of Example 1 or Example 2, the second process may include moving the nozzle above a stationary substrate that is held by a rotating holding unit and whose rotation has stopped, while continuing to discharge the processing liquid from the nozzle as in the first process. In this case, a reservoir of processing liquid is formed on the upper surface of the stationary substrate. Therefore, it becomes possible to process the substrate with a relatively small amount of processing liquid.

[0076] Example 4. In any of the devices in Examples 1 to 3, the control unit may be configured to perform a third process after the second process, in which, while continuing the discharge of processing liquid from the nozzle due to the first process, the control unit controls the drive unit to move the nozzle, which is located above the substrate held by the rotating holding unit, above the liquid receiving unit, and supplies processing liquid from the nozzle to the liquid receiving unit. In this case, the valve is not closed, and the nozzle moves from above the substrate to above the liquid receiving unit. Therefore, when the processing of the substrate is completed, the processing liquid does not remain in the filter. Consequently, when processing subsequent substrates, there is no need to discharge dummy processing liquid, and the consumption of processing liquid due to dummy discharge can be further suppressed.

[0077] Example 5. The apparatus of any of Examples 1 to 4 further comprises a housing that houses a rotating holding unit and a transport unit configured to load and unload substrates into and out of the housing, and the control unit may be configured to further execute a fourth process in which, after the second process, the transport unit is controlled to load or unload substrates into or out of the housing while the discharge of processing liquid from the nozzle due to the first process continues. When the processing liquid is discharged and stopped when loading or unloading substrates into and out of the housing, there are concerns about the effects of dust generation due to the opening and closing of valves and the effects of stagnation of processing liquid in the filter each time. However, according to Example 5, the discharge of processing liquid from the nozzle continues even when loading or unloading substrates into and out of the housing. Therefore, even when processing substrates sequentially, it is possible to suppress the adhesion of foreign matter to the substrates while suppressing the consumption of processing liquid due to dummy discharge.

[0078] Example 6. The apparatus of any of Examples 1 to 5 further comprises another supply unit including another nozzle configured to supply rinsing fluid to the upper surface of a substrate held by a rotating holder, and another drive unit configured to move the other nozzle between above the substrate held by the rotating holder and outside the substrate held by the rotating holder, wherein the control unit may be configured to perform a fifth process, before the second process, by controlling the other drive unit to move the other nozzle above the substrate held by the rotating holder and supplying rinsing fluid to the substrate. In this case, the rinsing fluid is supplied to the substrate before the processing fluid is supplied to the substrate.

[0079] Incidentally, if the substrate is dried after the rinsing solution is supplied to it, there is a concern that the surface tension of the rinsing solution may damage or collapse the pattern if a pattern has been formed on the substrate. Furthermore, especially when the substrate surface is hydrophobic, the centrifugal force acting on the liquid becomes large near the outer edge of the substrate, making it easier for the liquid film to break down. In this case, there is a concern that watermarks will occur in the areas of the substrate where the liquid film has broken down, and that tiny particles may adhere to the substrate. However, according to Example 6, the processing solution is supplied after the rinsing solution. Therefore, the substrate is dried after the rinsing solution has been replaced with the processing solution on the upper surface of the substrate. Consequently, it is possible to suppress the adhesion of particles to the substrate that would otherwise occur due to the formation of watermarks.

[0080] Example 7. In the apparatus of Example 6, the first process may include, after the fifth process, moving the nozzle above the substrate held by the rotating holder while continuing to discharge the processing liquid from the nozzle due to the first process and continuing to discharge the rinsing liquid from another nozzle due to the fifth process, thereby supplying the processing liquid to the substrate, and moving the other nozzle located above the substrate held by the rotating holder to the outside of the substrate. In this case, the upper surface of the substrate is always covered with the rinsing liquid or processing liquid. Therefore, it is possible to further suppress the occurrence of watermarks.

[0081] Example 8. In any of the apparatuses in Examples 1 to 7, the processing solution may be isopropyl alcohol.

[0082] Example 9. Any apparatus of Examples 1 to 8 further comprises a storage tank configured to store a processing liquid, and a circulation unit configured to return the processing liquid that has come out of the storage tank to the storage tank through a circulation line whose upstream and downstream ends are both connected to the storage tank, wherein the circulation unit includes another filter located in the circulation line, and the supply line may branch off from the downstream side of the other filter in the circulation line and be connected to a nozzle. In this case, foreign matter in the processing liquid is removed by the other filter as the processing liquid circulates in the circulation line. As a result, the purified processing liquid is discharged from the nozzle through the supply line. Therefore, it is possible to further suppress the adhesion of foreign matter to the substrate.

[0083] Example 10. The apparatus of Example 9 may further include a liquid delivery unit configured to return the processed liquid discharged to the liquid receiving unit back to the storage tank. In this case, the processed liquid discharged to the liquid receiving unit is returned to the storage tank and then discharged again from the storage tank through the circulation line and supply line via the nozzle. As a result, the processed liquid is utilized effectively, and the consumption of the processed liquid can be further reduced.

[0084] Example 11. An example of a substrate processing method may include a first step of discharging processing liquid from a nozzle to a liquid receiving section, with the nozzle positioned above a liquid receiving section provided on the top wall of a cup section arranged to surround the substrate held by a rotating holding section, through a supply line in which a valve and a filter are arranged in that order from upstream to downstream; and a second step of continuing the discharge of processing liquid from the nozzle in the first step, moving the nozzle above the substrate held by the rotating holding section, and supplying processing liquid from the nozzle to the substrate. In this case, the same effects and advantages as the apparatus in Example 1 can be obtained.

[0085] Example 12. In the method of Example 11, the second step may include moving the nozzle above the region including the center of the substrate held by the rotating holder, while continuing to discharge the processing liquid from the nozzle as in the first step. In this case, the same effects as the apparatus of Example 2 can be obtained.

[0086] Example 13. In the method of Example 11 or Example 12, the second step may include moving the nozzle above a stationary substrate that is held by a rotating holding unit and whose rotation has stopped, while continuing to discharge the processing liquid from the nozzle by the first step. In this case, the same effects as the apparatus of Example 3 can be obtained.

[0087] Example 14. Any of the methods in Examples 11 to 13 may further include a third step after the second step, in which, while continuing to discharge the processing liquid from the nozzle in the first step, the nozzle located above the substrate held by the rotating holding unit is moved above the liquid receiving unit, and the processing liquid is supplied from the nozzle to the liquid receiving unit. In this case, the same effects and advantages as the apparatus in Example 4 can be obtained.

[0088] Example 15. Any of the methods in Examples 11 to 14 may further include a fourth step after the second step, in which the substrate is loaded into or unloaded from the housing that houses the rotating holding unit, while the discharge of the processing liquid from the nozzle by the first step continues. In this case, the same effects and advantages as the apparatus in Example 5 can be obtained.

[0089] Example 16. Any of the methods in Examples 11 to 15 may further include a fifth step before the second step, in which another nozzle is moved above the substrate held in the rotating holder, and rinsing fluid is supplied to the substrate from the other nozzle. In this case, the same effects as the apparatus in Example 6 can be obtained.

[0090] Example 17. In the method of Example 16, the first step may include, after the fifth step, moving the nozzle above the substrate held by the rotating holder while continuing to discharge the processing liquid from the nozzle in the first step and continuing to discharge the rinsing liquid from another nozzle in the fifth step, thereby supplying the processing liquid to the substrate, and moving the other nozzle located above the substrate held by the rotating holder to the outside of the substrate. In this case, the same effects as the apparatus of Example 7 can be obtained.

[0091] Example 18. In any of the methods in Examples 11 to 17, the processing solution may be isopropyl alcohol. [Explanation of Symbols]

[0092] 1...Substrate processing system (substrate processing device), 10...Housing, 30...Rotating holding unit, 40...Processing liquid supply unit (supply unit), 41...Processing liquid supply unit, 42...Drive unit, 44...Circulation unit, 45...Supply unit, 46...Liquid delivery unit, 50...Rinse liquid supply unit (another supply unit), 52...Drive unit (another drive unit), 60...Cup unit, 60a...Side wall unit, 60b...Top wall unit, 63...Liquid receiving unit, A2...Transport arm (transport unit), Ctr...Controller (control unit), D2...Piping (circulation line), D3...Piping (supply line), F1...Filter (another filter), F2...Filter, L1...Processing liquid, L2...Rinse liquid, N1...Nozzle, N2...Nozzle (another nozzle), T1...Storage tank, U...Liquid processing unit, V1...Valve, W...Substrate, Wa...Top surface.

Claims

1. A rotating holding unit configured to rotate the substrate while holding it, A supply unit including a nozzle configured to supply processing liquid to the upper surface of the substrate held by the rotating holding unit through a supply line, A valve located in the aforementioned supply line, A filter positioned between the valve and the nozzle in the supply line, The cup portion is arranged to surround the periphery of the substrate held by the rotating holding portion from the outside, and includes a cylindrical side wall portion and an annular top wall portion extending inward from the upper end of the side wall portion. A liquid receiving section is provided on the top wall and includes an opening that is open upward to receive the processing liquid discharged from the nozzle, A drive unit configured to move the nozzle between the above the substrate held by the rotating holding unit and the above the liquid receiving unit, It includes a control unit, The control unit, With the nozzle positioned above the liquid receiving section, the first process involves controlling the supply section and the valve to discharge the processing liquid from the nozzle to the liquid receiving section. A substrate processing apparatus configured to perform a second process, in which, while the discharge of the processing liquid from the nozzle due to the first process is continued, the drive unit is controlled to move the nozzle above the substrate held by the rotating holding unit, and the processing liquid is supplied from the nozzle to the substrate.

2. The apparatus according to claim 1, wherein the second process includes moving the nozzle above a region including the central part of the substrate held by the rotating holding unit, while continuing to discharge the processing liquid from the nozzle as a result of the first process.

3. The apparatus according to claim 1, wherein the second process includes moving the nozzle above the stationary substrate, which is held by the rotating holding unit and whose rotation has stopped, while continuing to discharge the processing liquid from the nozzle as a result of the first process.

4. The apparatus according to claim 1, wherein the control unit is configured to, after the second process, while continuing to discharge the processing liquid from the nozzle by the first process, control the drive unit to move the nozzle, which is located above the substrate held by the rotating holding unit, above the liquid receiving unit, and to further perform a third process of supplying the processing liquid from the nozzle to the liquid receiving unit.

5. A housing that houses the aforementioned rotating holding part, The system further comprises a transport unit configured to load and unload the substrate into and out of the housing, The apparatus according to claim 1, wherein the control unit is configured to further perform a fourth process, after the second process, by controlling the transport unit to transport the substrate into or out of the housing, while continuing to discharge the processing liquid from the nozzle as a result of the first process.

6. Another supply unit, which includes another nozzle configured to supply rinsing liquid to the upper surface of the substrate held by the rotating holding unit, The system further comprises another drive unit configured to move the other nozzle between the upper part of the substrate held by the rotating holding unit and the outer part of the substrate held by the rotating holding unit, The apparatus according to claim 1, wherein the control unit is configured to control the other drive unit before the second process to move the other nozzle above the substrate held by the rotating holding unit and to further perform a fifth process of supplying the rinsing liquid to the substrate.

7. The apparatus according to claim 6, wherein the first process, after the fifth process, while continuing to discharge the processing liquid from the nozzle due to the first process and while continuing to discharge the rinsing liquid from the other nozzle due to the fifth process, moves the nozzle above the substrate held by the rotating holding unit, supplies the processing liquid to the substrate, and moves the other nozzle located above the substrate held by the rotating holding unit to the outside of the substrate.

8. The apparatus according to claim 1, wherein the processing solution is isopropyl alcohol.

9. A storage tank configured to store the aforementioned processing liquid, The system further comprises a circulation unit configured to return the processed liquid discharged from the storage tank to the storage tank via a circulation line whose upstream and downstream ends are both connected to the storage tank, The circulation unit includes another filter located in the circulation line, The apparatus according to any one of claims 1 to 8, wherein the supply line branches off from the circulation line downstream of the other filter and is connected to the nozzle.

10. The apparatus according to claim 9, further comprising a liquid supply unit configured to return the processed liquid discharged to the liquid receiving unit back to the storage tank.

11. A first step involves discharging a processed liquid from the nozzle to the liquid receiving portion through a supply line in which a valve and a filter are arranged in that order from upstream to downstream, with the nozzle positioned above the liquid receiving portion on the top wall of the cup portion, which is arranged so as to surround the substrate held by the rotating holding portion from the outside; A substrate processing method comprising: a second step of continuing the discharge of the processing liquid from the nozzle in the first step, moving the nozzle above the substrate held by the rotating holding unit, and supplying the processing liquid from the nozzle to the substrate.

12. The method according to claim 11, wherein the second step includes moving the nozzle above a region including the central part of the substrate held by the rotating holding unit, while continuing to discharge the processing liquid from the nozzle as in the first step.

13. The method according to claim 11, wherein the second step includes moving the nozzle above the stationary substrate, which is held by the rotating holding unit and whose rotation has stopped, while continuing to discharge the processing liquid from the nozzle as performed in the first step.

14. The method according to claim 11, further comprising, after the second step, a third step of continuing the discharge of the processing liquid from the nozzle in the first step, moving the nozzle, which is located above the substrate held by the rotating holding unit, above the liquid receiving unit, and supplying the processing liquid from the nozzle to the liquid receiving unit.

15. The method according to claim 11, further comprising, after the second step, a fourth step of loading or unloading the substrate into or out of the housing that houses the rotating holding unit, while continuing to discharge the processing liquid from the nozzle as performed in the first step.

16. The method according to claim 11, further comprising a fifth step of moving another nozzle above the substrate held by the rotating holding unit and supplying rinsing liquid to the substrate from the other nozzle, prior to the second step.

17. The method according to claim 16, wherein the first step, after the fifth step, while continuing to discharge the processing liquid from the nozzle in the first step and while continuing to discharge the rinsing liquid from the other nozzle in the fifth step, moves the nozzle above the substrate held by the rotating holding unit, and while supplying the processing liquid to the substrate, moves the other nozzle located above the substrate held by the rotating holding unit to the outside of the substrate.

18. The method according to any one of claims 11 to 17, wherein the processing solution is isopropyl alcohol.

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