Composite electronic components and their mounting substrates

Abstract

This invention provides a composite electronic component with improved warp resistance, optimal mounting area, and optimal equivalent series resistance (ESR). [Solution] A composite electronic component according to one embodiment of the present invention includes a stacked electronic component including a body containing a dielectric layer and internal electrodes, and external electrodes disposed on the body, and a metal frame including a connecting portion disposed on the external electrodes and a support portion connected to the connecting portion, wherein when the length of the stacked electronic component is L and the width is W, L ≤ 0.4 mm and W ≤ 0.2 mm are satisfied, and when the area of ​​the support portion is A1 or A2, W 2 ≤A1 and W 2 It is possible to satisfy ≤A2.

Description

[Technical Field]

[0001] This invention relates to a composite electronic component and a mounting substrate for a composite electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] These multilayer ceramic capacitors offer the advantages of being small yet guaranteeing high capacitance and being easy to mount, making them suitable for use as components in various electronic devices. As electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] These multilayer ceramic capacitors have recently been applied to power drive systems in automobiles, and automotive multilayer ceramic capacitors are required to have excellent high-temperature reliability, humidity resistance, and shock resistance. In particular, cracks can occur in the ceramic body due to external shocks, acoustic noise, and warping stress, leading to component failure. To compensate for this, the shock resistance of the component is improved by methods such as attaching a metal frame to the external electrodes to mitigate external shocks.

[0005] However, in the case of ultra-small components, the mounting area of the frame may be insufficient, making it difficult to fix them to the substrate. Current loops may occur at both ends of components to which different voltages are applied, resulting in current burnout or an increase in the equivalent series resistance (ESR). There is a need for a structural design of the frame that has excellent mounting strength for ultra-small components, low ESR, and improved shock resistance.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] One of the several problems to be solved by the present invention is to provide a composite electronic component with improved warping strength.

[0008] One of the several problems to be solved by the present invention is to provide a composite electronic component having an optimal mounting area.

[0009] One of the several problems to be solved by the present invention is to provide a composite electronic component having an optimal equivalent series resistance (ESR).

[0010] One of the several problems to be solved by the present invention is to provide a composite electronic component with reduced acoustic noise.

[0011] However, the various problems to be solved by the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0012] A composite electronic component according to one embodiment of the present invention includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, a body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in a third direction, and a stacked electronic component including first and second external electrodes arranged on the third and fourth surfaces, respectively, and disposed on the first external electrode The multilayer electronic component includes a first metal frame including a first connecting portion and a first support portion connected to the first connecting portion and positioned away from the first surface, and a second metal frame including a second connecting portion positioned on the second external electrode and a second support portion connected to the second connecting portion and positioned away from the first surface, wherein when the average dimension of the multilayer electronic component in the second direction is L and the average dimension in the third direction is W, L ≤ 0.4 mm and W ≤ 0.2 mm are satisfied, and when the area of ​​the first support portion is A1 and the area of ​​the second support portion is A2, W 2 ≤A1 and W 2 It is possible to satisfy ≤A2.

[0013] A composite electronic component according to another embodiment of the present invention includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, a body including first and second faces facing each other in the first direction, third and fourth faces connected to the first and second faces and facing each other in a second direction, fifth and sixth faces connected to the first, second, third and fourth faces and facing each other in a third direction, and a stacked electronic component including first and second external electrodes arranged on the third and fourth faces, respectively, and a first connection portion arranged on the first external electrode, and connected to the first connection portion, The laminated electronic component includes a first metal frame including a first support portion positioned away from the first surface, a second connecting portion positioned on the second external electrode, and a second metal frame connected to the second connecting portion and positioned away from the first surface, wherein when the average dimension of the laminated electronic component in the second direction is L and the average dimension in the third direction is W, L ≤ 0.4 mm and W ≤ 0.2 mm are satisfied, and when the average dimension of the first support portion in the second direction is L1 and the average dimension in the third direction is W1, and when the average dimension of the second support portion in the second direction is L2 and the average dimension in the third direction is W2, W 2 ≤L1 × W1 and W 2 It is possible to satisfy ≤ L2 × W2.

[0014] A mounting substrate for a composite electronic component according to another embodiment of the present invention includes a substrate, a first electrode pad and a second electrode pad disposed on the substrate, and a composite electronic component, wherein the first support portion and the second support portion are mounted on the substrate such that they are in contact with the first electrode pad and the second electrode pad, respectively. [Effects of the Invention]

[0015] One of the several effects of the present invention is to improve the warpage strength of composite electronic components.

[0016] One of the several effects of the present invention is to improve the mounting strength of composite electronic components.

[0017] One of the several effects of the present invention is to improve the equivalent series resistance (ESR) of composite electronic components.

[0018] One of the several effects of the present invention is to reduce the acoustic noise of composite electronic components.

[0019] However, the diverse yet significant advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0020] [Figure 1] This is a schematic perspective view of a composite electronic component according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view along the line I-I' in Figure 1. [Figure 3] This is a schematic representation of the bottom view of Figure 1. [Figure 4] This diagram schematically shows a cross-sectional view along the line I-I' of a composite electronic component according to various embodiments of the present invention. [Figure 5] This diagram schematically shows a cross-sectional view along the line I-I' of a composite electronic component according to various embodiments of the present invention. [Figure 6] This diagram schematically shows a cross-sectional view along the line I-I' of a composite electronic component according to various embodiments of the present invention. [Figure 7] This diagram schematically shows a cross-sectional view along the line I-I' of a composite electronic component according to various embodiments of the present invention. [Figure 8] This is a schematic perspective view of a composite electronic component according to another embodiment of the present invention. [Figure 9] This diagram schematically shows a cross-sectional view along the line I-I' of a composite electronic component according to various embodiments of the present invention. [Figure 10] This diagram schematically shows a cross-sectional view along the line I-I' of a composite electronic component according to various embodiments of the present invention. [Figure 11] Figure 1 shows a schematic perspective view of a circuit board on which the composite electronic components are mounted. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0022] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the description have been omitted, and the size and thickness of each component shown are arbitrarily indicated for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0023] In drawings, the Z direction can be defined as the first direction, the lamination direction, or the thickness (T) direction; the X direction as the second direction or the length (L) direction; and the Y direction as the third direction or the width (W) direction.

[0024] Composite electronic components Figure 1 schematically shows a perspective view of a composite electronic component according to one embodiment of the present invention, Figure 2 schematically shows a cross-sectional view along the line I-I' in Figure 1, Figure 3 schematically shows a bottom view of Figure 1, Figures 4 to 7 schematically show cross-sectional views along the line I-I' of composite electronic components according to various embodiments of the present invention, Figure 8 schematically shows a perspective view of a composite electronic component according to another embodiment of the present invention, Figures 9 and 10 schematically show cross-sectional views along the line I-I' of composite electronic components according to various embodiments of the present invention, and Figure 11 schematically shows a perspective view of a mounting substrate of a composite electronic component on which the composite electronic component of Figure 1 is mounted.

[0025] Hereinafter, with reference to Figures 1 to 11, a composite electronic component and a mounting substrate for the composite electronic component according to one embodiment of the present invention will be described in detail. In this case, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the present invention can also be applied to various electronic products that utilize dielectric compositions, such as inductors, piezoelectric elements, varistors, or thermistors.

[0026] A composite electronic component 10 according to one embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer 111 in a first direction, a body 110 including a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in a third direction, and a stacked electronic component 100 including a first external electrode 131 and a second external electrode 132 arranged on the third surface 3 and the fourth surface 4, respectively, and disposed on the first external electrode 131 A first metal frame 201 includes a first connecting portion 201a and a first support portion 201b connected to the first connecting portion 201a and positioned away from the first surface 1, and a second metal frame 202 includes a second connecting portion 202a positioned on the second external electrode 132 and a second support portion 202b connected to the second connecting portion 202a and positioned away from the first surface 1, wherein when the average dimension of the stacked electronic component 100 in the second direction is L and the average dimension in the third direction is W, L ≤ 0.4 mm and W ≤ 0.2 mm are satisfied, and when the area of ​​the first support portion 201b is A1 and the area of ​​the second support portion 202b is A2, W 2 ≤A1 and W 2 It is possible to satisfy ≤A2.

[0027] Furthermore, when the average dimension of the first support portion 201b in the second direction is L1 and the average dimension of the third direction is W1, and the average dimension of the second support portion 202b in the second direction is L2 and the average dimension of the third direction is W2, W 2 ≤L1 × W1 and W 2 It is possible to satisfy ≤ L2 × W2.

[0028] The stacked electronic component 100 may include a main body 110 and external electrodes 131 and 132 disposed on the main body 110.

[0029] The main body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0030] More specifically, the main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes first internal electrodes 121 and second internal electrodes 122 that are alternately disposed so as to face each other across a dielectric layer 111 to form a capacitance.

[0031] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0032] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0033] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0034] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, a perovskite (ABO3) - based substance can be used. For example, a barium titanate - based substance, a lead - composite perovskite - based substance, or a strontium titanate - based substance can be used. The barium titanate - based substance can include BaTiO3 - based ceramic particles. As examples of the ceramic particles, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid - dissolved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0035] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw materials for forming the dielectric layer 111, such as particles of barium titanate (BaTiO3), according to the purpose of the present invention.

[0036] On the other hand, in order to distinguish from the dielectric layers included in the cover parts 112 and 113 and the side margin part described later, the dielectric layer included in the capacitance forming part Ac can be defined as the first dielectric layer, the dielectric layer included in the cover parts 112 and 113 can be defined as the second dielectric layer, and the dielectric layer included in the side margin part can be defined as the third dielectric layer.

[0037] And since the first to third dielectric layers can be formed using a ceramic or dielectric material such as barium titanate (BaTiO3), they can include a dielectric microstructure after firing. The dielectric microstructure can include a plurality of crystal grains, grain boundaries arranged between adjacent crystal grains, and triple points arranged at points where three or more grain boundaries meet, and can include a plurality of each of crystal grains, grain boundaries, and triple points.

[0038] The dimension td of the dielectric layer 111 in the first direction does not particularly need to be limited.

[0039] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the dimension td of the dielectric layer 111 in the first direction can be 1.0 μm or less, 0.8 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0040] Here, the dimension td of the dielectric layer 111 in the first direction can mean the dimension td of the dielectric layer 111 in the first direction arranged between the first internal electrode 121 and the second internal electrode 122.

[0041] On the other hand, the dimension td of the dielectric layer 111 in the first direction can mean the dimension, distance, size, or length of the dielectric layer 111 in the first direction, or it can mean the thickness of the dielectric layer.

[0042] In this case, the dimension td of the dielectric layer 111 in the first direction may be a concept that includes the dimension td of at least one of the multiple dielectric layers 111 in the first direction, or it may be a concept that includes the dimension td of each of the dielectric layers 111 in the first direction.

[0043] Furthermore, the dimension td of the dielectric layer 111 in the first direction can mean the average dimension td of one dielectric layer 111 in the first direction, the average dimension td of each of multiple dielectric layers 111 in the first direction, or the average dimension td of multiple dielectric layers 111 in the first direction.

[0044] The average dimension td of the dielectric layer 111 in the first direction can be measured by scanning the cross-section of the main body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average dimension td of a single dielectric layer 111 in the first direction can be said to be the average value calculated by measuring the dimension in the first direction at five equally spaced points in the second direction of the single dielectric layer 111 in the scanned image. These five equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to three dielectric layers 111 and measuring the average values, the average dimension td of the first direction of multiple dielectric layers 111 can be further generalized.

[0045] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0046] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, which are arranged alternately facing each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0047] More specifically, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be positioned on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and the second external electrode 132 can be positioned on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0048] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but can be connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but can be connected to the second external electrode 132. In this case, the first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0049] On the other hand, the main body 110 can be formed by alternately stacking a first ceramic green sheet printed with a paste for the first internal electrode, which will become the first internal electrode 121, and a second ceramic green sheet printed with a paste for the second internal electrode, which will become the second internal electrode 122, and then firing them.

[0050] The materials forming the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0051] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following materials onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited thereto.

[0052] Furthermore, the dimension te of the internal electrodes 121 and 122 in the first direction does not need to be particularly limited, and in the following description of the dimension te of the internal electrodes 121 and 122 in the first direction can refer to the dimension te of the first internal electrode 121 and the second internal electrode 122, respectively.

[0053] To achieve miniaturization and high capacitance of the stacked electronic component 100, the dimension te of the internal electrodes 121 and 122 in the first direction may be 1.0 μm or less. To more easily achieve ultra-miniaturization and high capacitance, the dimension te of the internal electrodes 121 and 122 in the first direction may be 0.8 μm or less or 0.6 μm or less, and more preferably 0.4 μm or less.

[0054] In this case, the dimension te of the internal electrodes 121 and 122 in the first direction may be a concept that includes the dimension te of at least one of the multiple internal electrodes 121 and 122 in the first direction, or it may be a concept that includes the dimension te of all internal electrodes 121 and 122 in the first direction.

[0055] Here, the dimension te of the internal electrodes 121 and 122 in the first direction can mean the dimension, distance, size, or length of the internal electrodes 121 and 122 in the first direction, or it can mean the thickness of the internal electrodes 121 and 122.

[0056] In this case, the dimension te of the internal electrodes 121 and 122 in the first direction may be a concept that includes the dimension te of at least one of the multiple internal electrodes 121 and 122 in the first direction, or it may be a concept that includes the dimension te of each of the internal electrodes 121 and 122 in the first direction.

[0057] Furthermore, the dimension te of the internal electrodes 121 and 122 in the first direction can mean the average dimension te of one of the internal electrodes 121 and 122 in the first direction, or the average dimension te of each of the multiple internal electrodes 121 and 122 in the first direction, or the average dimension te of the multiple internal electrodes 121 and 122 in the first direction.

[0058] The average dimension te of the internal electrodes 121 and 122 in the first direction can be measured by scanning the cross-section of the main body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average dimension te of one internal electrode 121 or 122 may be the average value calculated by measuring the dimension in the first direction at five equally spaced points in the second direction of one internal electrode in the scanned image. These five equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to three internal electrodes 121 or 122 and measuring the average values, the average dimension te of multiple internal electrodes 121 or 122 in the first direction can be further generalized.

[0059] On the other hand, the main body 110 may include cover portions 112 and 113 that are positioned on both end surfaces (end-surfaces) of the capacity forming portion Ac in the first direction.

[0060] Specifically, it may include a first cover portion 112 positioned on one side of the volume-forming portion Ac in a first direction and a second cover portion 113 positioned on the other side of the volume-forming portion Ac in a second direction. More specifically, for example, it may include a first cover portion 112 positioned at the bottom of the volume-forming portion Ac in a first direction and a second cover portion 113 positioned at the top of the volume-forming portion Ac in a first direction.

[0061] The first cover portion 112 and the second cover portion 113 can be formed by arranging or stacking a single second dielectric layer or two or more second dielectric layers in a first direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0062] The first cover portion 112 and the second cover portion 113 do not include internal electrodes 121 and 122 and may contain the same dielectric material as the first dielectric layer 111 of the capacitance forming portion Ac. That is, the first cover portion 112 and the second cover portion 113 may contain a dielectric material, for example, a barium titanate (BaTiO3) based dielectric material.

[0063] Furthermore, the dimension tc of the cover portions 112 and 113 in the first direction does not need to be particularly limited, and in the following description of the dimension tc of the cover portions 112 and 113 in the first direction can refer to the dimension tc of the first cover portion 112 and the second cover portion 113, respectively.

[0064] However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component 100, the dimension tc of the cover portion 112, 113 in the first direction is 50 μm or less or 40 μm or less, preferably 30 μm or less, and in ultra-small products, it may more preferably be 20 μm or less, 15 μm or less, or 10 μm or less.

[0065] Here, the dimension tc of the cover portions 112 and 113 in the first direction can mean the dimension of the cover portions 112 and 113 in the first direction.

[0066] Furthermore, the dimension tc of the cover portions 112 and 113 in the first direction may mean the average dimension tc of the first cover portion 112 and the second cover portion 113 in the first direction, or it may mean the average dimension tc of the first cover portion 112 and the second cover portion 113 in the first direction.

[0067] The average dimension tc of the cover portions 112 and 113 in the first direction can be measured by scanning the cross-section of the main body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, it can mean the average value calculated by measuring the dimension in the first direction at five equally spaced points in the second direction in an image scanned from one cover portion 112 or 113.

[0068] Furthermore, the average dimension tc of the cover portions 112 and 113 in the first direction, measured by the method described above, can be substantially the same as the average dimension of the cover portions 112 and 113 in the first direction in the cross-section of the main body 110 in the first and third directions.

[0069] On the other hand, the stacked electronic component 100 may include side margin regions, which are the end regions of the internal electrodes 121 and 122 in a third direction.

[0070] More specifically, the side margin region may include a first side margin region located between the internal electrodes 121, 122 and the fifth surface 5, and a second side margin region located between the internal electrodes 121, 122 and the sixth surface 6.

[0071] As shown in the figure, the side margin region can refer to the area between the interface between the first internal electrode 121 and the second internal electrode 122 in the third direction and the body 110, with reference to the cross-sections of the body 110 in the first and third directions.

[0072] The side margin region can refer to the ceramic green sheet region excluding the internal electrodes 121 and 122 when the paste for the internal electrodes is applied to the ceramic green sheet applied to the volume-forming portion Ac, excluding the area that will become the side margin region.

[0073] The side margin region essentially serves to prevent damage to the internal electrodes due to physical or chemical stress.

[0074] The first and second side margin regions do not include the internal electrodes 121 and 122 and may contain the same material as the first dielectric layer 111, for example, they may correspond to a part of the first dielectric layer 111. That is, the first and second side margin regions may contain dielectric material, for example, barium titanate (BaTiO3) based dielectric material.

[0075] Furthermore, the dimensions of the side margin region in the third direction do not need to be particularly limited, and in the following description of the dimensions of the side margin region in the third direction may refer to the dimensions of the first side margin region and the second side margin region in the third direction, respectively.

[0076] To more easily achieve miniaturization and increased capacitance of the stacked electronic component 100, the dimension of the side margin region in the third direction is 30 μm or less, and in ultra-small products, it is preferably 20 μm or less, 15 μm or less, or 10 μm or less.

[0077] Here, the dimension of the side margin region in the third direction may mean the dimension, distance, size, or length of the side margin region in the third direction, or it may mean the width of the side margin region.

[0078] Furthermore, the dimension of the side margin region in the third direction may mean the average dimension of the first side margin region and the second side margin region in the third direction, or it may mean the average dimension of the first side margin region and the second side margin region in the third direction.

[0079] The average dimension of the side margin region in the third direction can be measured by scanning the cross-section of the main body 110 in the first and third directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, it can mean the average value calculated by measuring the dimension in the third direction at five equally spaced points in the first direction in an image scanned from one side margin region.

[0080] On the other hand, the stacked electronic component 100 may include side margins arranged on both end surfaces (end-surfaces) of the main body 110 in the third direction.

[0081] More specifically, the side margin portion may include a first side margin portion located on the fifth surface 5 of the main body 110 and a second side margin portion located on the sixth surface 6 of the main body 110.

[0082] The side margin portion is formed by applying conductive paste to the ceramic green sheet applied to the capacitance forming portion Ac, except where the side margin portion is formed, to form the internal electrodes 121 and 122. In order to suppress the step caused by the internal electrodes 121 and 122, the laminated internal electrodes 121 and 122 are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body 110, and then a single third dielectric layer or two or more third dielectric layers can be formed by arranging or laminating them in the third direction on both end surfaces (end-surfaces) of the capacitance forming portion Ac in the third direction.

[0083] The side margins essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0084] The first and second side margin portions do not include the internal electrodes 121 and 122 and may contain the same material as the first dielectric layer 111. That is, the first and second side margin portions may contain dielectric material, for example, barium titanate (BaTiO3) based dielectric material.

[0085] Furthermore, the dimensions of the side margin in the third direction do not need to be particularly limited, and in the following description of the dimensions of the side margin in the third direction may refer to the dimensions of the first side margin and the second side margin in the third direction, respectively.

[0086] However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component 100, the dimension of the side margin in the third direction may be 30 μm or less, and in ultra-small products, it may preferably be 20 μm or less, 15 μm or less, or 10 μm or less.

[0087] Here, the dimension of the side margin in the third direction may mean the dimension, distance, size, or length of the side margin in the third direction, or it may mean the width of the side margin.

[0088] Furthermore, the dimension of the side margin in the third direction may mean the average dimension of the first side margin and the second side margin in the third direction, or the average dimension of the first side margin and the second side margin in the third direction.

[0089] The average dimension of the side margin in the third direction can be measured by scanning the cross-section of the main body 110 in the first and third directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, it can mean the average value calculated by measuring the dimension in the third direction at five equally spaced points in the first direction in an image scanned from one side margin.

[0090] One embodiment of the present invention describes a structure in which a stacked electronic component 100 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0091] The external electrodes 131 and 132 are positioned on the main body 110 and can be connected to the internal electrodes 121 and 122.

[0092] More specifically, the external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110, respectively, and connected to a first internal electrode 121 and a second internal electrode 122, respectively. That is, the first external electrode 131 can be arranged on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0093] Furthermore, the external electrodes 131 and 132 may extend and be arranged on parts of the first surface 1 and the second surface 2 of the main body 110, or on parts of the fifth surface 5 and the sixth surface 6 of the main body 110. That is, the first external electrode 131 can be arranged on the third surface 3 of the main body 110 and on parts of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110, and the second external electrode 132 can be arranged on the fourth surface 4 of the main body 110 and on parts of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110.

[0094] The external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0095] For example, the external electrodes 131 and 132 may include first electrode layers 131a and 132a placed on the main body 110, and second electrode layers 131b and 132b placed on the first electrode layers 131a and 132a.

[0096] Here, it is preferable that the first electrode layers 131a, 132a and the second electrode layers 131b, 132b are distinct from each other. However, this is not particularly limited, and they may be separated according to the manufacturing process sequence, and the first electrode layers 131a, 132a and the second electrode layers 131b, 132b may not be distinguished from each other and may be observed as a single layer.

[0097] In this invention, "distinguished" can mean, but is not limited to, two layers being distinguishable by physical differences, chemical differences, and / or simple optical differences, however, the distinction between layers can be made by the presence or absence of an "interface." An interface can mean a surface in which two layers in contact with each other are distinguishable from one another, for example, by differences in components determined by EDS analysis using equipment such as a scanning electron microscope (SEM).

[0098] The first electrode layers 131a and 132a may be formed by transferring a sheet containing a conductive metal onto the main body 110, or by applying a conductive paste for external electrodes containing a conductive metal to the main body 110 and then firing it, or by dipping the main body 110 in a conductive paste for external electrodes containing a conductive metal, but are not particularly limited thereto.

[0099] To give a more specific example for the first electrode layers 131a and 132a, the first electrode layers 131a and 132a may be fired electrode layers containing conductive metal and glass.

[0100] The conductive metal contained in the electrode layers 131a and 132a can be a material with excellent electrical conductivity. For example, the conductive metal may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0101] Furthermore, the glass contained in the electrode layers 131a and 132a can play a role in improving the bonding with the main body 110.

[0102] The second electrode layers 131b and 132b can serve to improve mounting characteristics and may be plated layers formed on the first electrode layers 131a and 132a by a plating method, but are not particularly limited thereto.

[0103] The types of the second electrode layers 131b and 132b are not particularly limited and may include, for example, at least one of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof.

[0104] The second electrode layers 131b and 132b may be a single layer or multiple layers.

[0105] More specifically, for example, the second electrode layers 131b and 132b may be nickel (Ni) electrode layers or tin (Sn) electrode layers, and may be configured such that nickel (Ni) electrode layers and tin (Sn) electrode layers are formed sequentially on the first electrode layers 131a and 132a, or may be configured such that tin (Sn) electrode layers, nickel (Ni) electrode layers, and tin (Sn) electrode layers are formed sequentially. Furthermore, the second electrode layers 131b and 132b may include multiple nickel (Ni) electrode layers and / or multiple tin (Sn) electrode layers.

[0106] The size of the stacked electronic component 100 does not need to be particularly limited.

[0107] However, in order to achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, when the average dimension of the stacked electronic component 100 in the second direction is L and the average dimension of the stacked electronic component 100 in the third direction is W, the following conditions can be met: L ≤ 0.4 mm and W ≤ 0.2 mm. In other words, the effects of the present invention can be more pronounced in stacked electronic components 100 having a size of 0402 (L × W: 0.4 mm × 0.2 mm, where L and W satisfy an error of ±10%) or less.

[0108] A composite electronic component 10 according to one embodiment of the present invention may include metal frames 201 and 202, and the metal frames 201 and 202 may include a first metal frame 201 and a second metal frame 202.

[0109] The metal frames 201 and 202 may include connecting portions 201a and 202a positioned on the external electrodes 131 and 132, and support portions 201b and 202b connected to the connecting portions 201a and 202a and positioned away from the first surface 1.

[0110] Here, the connection between the connecting parts 201a, 202a and the support parts 201b, 202b is not limited to a structure in which they are directly connected, but can also be a concept that includes different configurations between the connecting parts 201a, 202a and the support parts 201b, 202b, for example, a structure in which connecting parts 201c, 202c are located and the connecting parts 201a, 202a and the support parts 201b, 202b are indirectly connected via the connecting parts 201c, 202c.

[0111] More specifically, the first metal frame 201 may include a first connecting portion 201a positioned on the first external electrode 131, and a first support portion 201b connected to the first connecting portion 201a and positioned away from the first surface 1, and may further include a first connecting portion 201c positioned between the first connecting portion 201a and the first connecting portion 201b, connecting the first connecting portion 201a and the first connecting portion 201b.

[0112] The second metal frame 202 may include a second connecting portion 202a on the second external electrode 132, and a second support portion 202b connected to the second connecting portion 202a and positioned away from the first surface 1, and may further include a second connecting portion 202c located between the second connecting portion 202a and the second support portion 202b, connecting the second connecting portion 202a and the second support portion 202b.

[0113] Unless otherwise inconsistent, the descriptions of metal frames 201 and 202 may be descriptions of the first metal frame 201 and the second metal frame 202, respectively; similarly, the descriptions of connecting parts 201a and 202a may be descriptions of the first connecting part 201a and the second connecting part 202a, respectively; the descriptions of support parts 201b and 202b may be descriptions of the first support part 201b and the second support part 202b, respectively; and the descriptions of connecting parts 201c and 202c may be descriptions of the first connecting part 201c and the second connecting part 202c, respectively.

[0114] The connecting portions 201a and 202a may be positioned on the external electrodes 131 and 132.

[0115] Specifically, the connecting parts 201a and 202a may be arranged on the external electrodes 131 and 132 so as to be in direct contact with the external electrodes 131 and 132, but the structure is not limited to this, and conductive adhesives 301 and 302 can be further arranged between the connecting parts 201a and 202a and the external electrodes 131 and 132, and the specific details will be described later.

[0116] More specifically, the connection parts 201a and 202a can be arranged on the third surface 3 and fourth surface 4 of the main body 110, and more specifically, the first connection part 201a and the second connection part 202a can be arranged on the first external electrode 131 and the second external electrode 132, respectively, which are arranged on the third surface 3 and the fourth surface 4. However, it is not limited to this, and they can be arranged on the first surface 1 of the main body, which may correspond to the mounting surface, and more specifically, they can be arranged on the first external electrode 131 and the second external electrode 132 which are extended and spaced apart from each other on a part of the first surface 1.

[0117] The support portions 201b and 202b may be positioned at a distance from the first surface 1, or they may be substantially parallel to the first surface 1, and furthermore, the support portions 201b and 202b may be components mounted on the substrate 20.

[0118] The support parts 201b and 202b are preferably substantially rectangular in shape, but are not particularly limited thereto, and can have various shapes depending on the mounting environment.

[0119] In one embodiment of the present invention, the areas A1 and A2 of the support portions 201b and 202b are equal to the square of the average dimension W in the third direction of the stacked electronic component 100. 2 It is preferable that the above conditions are met.

[0120] In other words, the area A1 of the first support portion 201b is equal to the square of the average dimension W of the stacked electronic component 100 in the third direction. 2 The above can be achieved, and the area A2 of the second support portion 202b is equal to the square of the average dimension W in the third direction of the stacked electronic component 100. 2 It can be the above. In other words, W 2 ≤A1 and W 2 It is possible to satisfy ≤A2.

[0121] More specifically, for example, if the first support portion 201b and the second support portion 202b are substantially rectangular in shape, then when the average dimension of the first support portion 201b in the second direction is L1 and the average dimension in the third direction is W1, and the average dimension of the second support portion 202b in the second direction is L2 and the average dimension in the third direction is W2, then W 2 ≤L1 × W1 and W 2 It is possible to satisfy ≤ L2 × W2.

[0122] In the following, the explanation for the area A1 of the first support portion 201b can be similarly applied to the product of the average dimension L1 in the second direction and the average dimension W1 in the third direction of the first support portion 201b (L1 × W1), and the explanation for the area A2 of the second support portion 202b can be similarly applied to the product of the average dimension L2 in the second direction and the average dimension W2 in the third direction of the second support portion 202b (L2 × W2).

[0123] The area A1 (L1 × W1) of the first support part 201b and the area A2 (L2 × W2) of the second support part 202b are equal to W 2 ≤A1(W 2 ≤L1 × W1) and W 2 ≤A2(W2 By satisfying the condition (≤L2 × W2), the mounting strength of ultra-small stacked electronic components 100, such as stacked electronic components 100 of size 0402 or smaller, can be more effectively improved, ensuring a superior mounting rate.

[0124] A1 <W 2 (L1×W1 <W 2 ) or A2 <W 2 (L2×W2 <W 2 In this case, sufficient mounting strength may not be ensured, potentially leading to a decrease in the mounting rate.

[0125] The upper limits of the area A1 (L1 × W1) of the first support part 201b and the area A2 (L2 × W2) of the second support part 202b are not particularly limited if the goal is to improve mounting strength. However, to avoid making the improvement in mounting strength meaningless and reducing the mounting efficiency between adjacent components, the upper limits of the area A1 (L1 × W1) of the first support part 201b and the area A2 (L2 × W2) of the second support part 202b are set to the square of the average dimension W in the third direction of the stacked electronic component 100. 2 It may be less than twice that. In other words, W 2 ≤A1 ≤2 × W 2 (W 2 ≤L1 × W1 ≤ 2 × W 2 ) and W 2 ≤A² ≤ 2 × W 2 (W 2 ≤L² × W² ≤ 2 × W 2 ) can be satisfied.

[0126] The method for measuring the areas A1 and A2 of the support parts 201b and 202b is not particularly limited and can be determined using any equipment, method, etc. that can measure area. More specifically, for example, when the support parts 201b and 202b are substantially rectangular in shape, the dimensions in the second direction and the third direction can be measured at the center of each support part, the dimensions in the second direction can be measured at a certain distance apart from the center of the support part in both directions of the third direction, and the dimensions in the third direction can be measured at a certain distance apart from the center of the support part in both directions of the second direction. Then, these can be averaged to obtain the average dimensions L1 and L2 in the second direction and the average dimensions W1 and W2 in the third direction. The areas A1 and A2 of each support part 201b and 202b can be determined by multiplying the average dimensions L1 and L2 in the second direction and the average dimensions W1 and W2 in the third direction obtained in this way.

[0127] On the other hand, in one embodiment of the present invention, the first support portion 201b and the second support portion 202b may be separated from each other in a second direction, and the average dimension L3 in the second direction of the distance between the first support portion 201b and the second support portion 202b can be 1 / 2 or more of the average dimension L in the second direction of the stacked electronic component 100. In other words, the condition 0.5 × L ≤ L3 can be satisfied.

[0128] By ensuring that the average dimension L3 in the second direction of the distance between the first support portion 201b and the second support portion 202b is 0.5 × L ≤ L3, it is possible to design the device to have an equivalent series resistance (ESR) value below the target value, thereby improving electrical characteristics and other factors.

[0129] If L3 < 0.5 × L, the equivalent series resistance (ESR) value may increase, potentially degrading the electrical characteristics.

[0130] The upper limit of the average dimension L3 in the second direction of the distance between the first support portion 201b and the second support portion 202b is not particularly limited as long as it can reduce the equivalent series resistance (ESR). However, in order to avoid making the reduction effect on the equivalent series resistance (ESR) meaningless and reducing the mounting strength or mounting efficiency between adjacent components, the upper limit of the average dimension L3 in the second direction of the distance between the first support portion 201b and the second support portion 202b may be less than or equal to the average dimension L in the second direction of the stacked electronic component 100. In other words, the condition 0.5 × L ≤ L3 ≤ L can be satisfied.

[0131] The average dimension L3 in the second direction of the distance between the first support portion 201b and the second support portion 202b from each other can be determined by measuring the dimension in the second direction of the distance between the first support portion 201b and the second support portion 202b from each other with respect to the center of the composite electronic component 10 in the third direction, measuring the dimension in the second direction of the distance between the first support portion 201b and the second support portion 202b from each other at a certain distance apart in both directions of the third direction from the center of the composite electronic component 10 in the third direction, and then averaging these values, but is not particularly limited to this.

[0132] As described above, the metal frames 201 and 202 may further include connecting parts 201c and 202c located between the connecting parts 201a and 202a and the support parts 201b and 202b, connecting the connecting parts 201a and 202a with the support parts 201b and 202b.

[0133] The shape of the connecting parts 201c and 202c is not particularly limited and can have various forms such as straight lines or curves.

[0134] The connecting parts 201c and 202c can disperse external stress transmitted from the support parts 201b and 202b to the connecting parts 201a and 202a, or acoustic noise transmitted to the substrate 20, thereby reducing the transmission of warping stress applied to the stacked electronic component 100 and acoustic noise generated by the stacked electronic component 100 to the substrate 20.

[0135] Furthermore, by including the connecting parts 201c and 202c, if a certain distance is formed between the connecting parts 201a and 202a and the support parts 201b and 202b, it can function as a solder pocket in which the solder SOL is housed.

[0136] As described above, in one embodiment of the present invention, the composite electronic component 10 may further include conductive adhesives 301, 302 which are disposed between the external electrodes 131, 132 and the metal frames 201, 202 to connect the external electrodes 131, 132 and the metal frames 201, 202. More specifically, the conductive adhesives 301, 302 are disposed between the external electrodes 131, 132 and the connecting portions 201a, 202a to connect the external electrodes 131, 132 and the connecting portions 201a, 202a.

[0137] The conductive adhesives 301 and 302 may include a first conductive adhesive 301 and a second conductive adhesive 302, more specifically, the first conductive adhesive 301 may be placed between the first external electrode 131 and the first metal frame 201 to connect the first external electrode 131 and the first metal frame 201, and the second conductive adhesive 302 may be placed between the second external electrode 132 and the second metal frame 202 to connect the second external electrode 132 and the second metal frame 202.

[0138] Unless otherwise inconsistent, the descriptions of conductive adhesives 301 and 302 below may be descriptions of the first conductive adhesive 301 and the second conductive adhesive 302, respectively.

[0139] The conductive adhesives 301 and 302 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc.

[0140] More specifically, for example, the conductive adhesives 301 and 302 may include, but are not limited to, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0141] Mounting board for complex electronic components A mounting substrate 1000 for a composite electronic component according to another embodiment of the present invention includes a substrate 20, a first electrode pad 31 and a second electrode pad 32 disposed on the substrate 20, and the composite electronic component 10 described above, and can be mounted on the substrate 20 such that the first support portion 201b and the second support portion 202b are joined to the first electrode pad 31 and the second electrode pad 32, respectively.

[0142] In this embodiment, the description of the composite electronic component 10 is omitted because it overlaps with the description of the composite electronic component 10 described above.

[0143] The composite electronic component 10 can be connected to the first electrode pad 31 and the second electrode pad 32 by solder SOL placed on the lower surfaces of the first support portion 201b and the second support portion 202b, so that the solder SOL does not rise up to the first connection portion 201a and the second connection portion 202a, thereby reducing acoustic noise or vibration generated in the composite electronic component 10 and transmitted to the substrate 20.

[0144] The mounting substrate 1000 for the composite electronic component of this embodiment has no restrictions on the mounting direction, and the acoustic noise improvement effect can be obtained whether, for example, the internal electrodes 121 and 122 stacked on the main body 110 are stacked horizontally or vertically with respect to the mounting surface.

[0145] The present invention will be described in more detail below through test examples, but these are intended to aid in a concrete understanding of the invention and do not limit the scope of the present invention.

[0146] (Example test) Table 1 below shows the mounting rate evaluated based on the area of ​​the support section. Here, the support section refers to the area of ​​the first support section and the second support section, respectively. The area of ​​the support section was calculated by measuring the average dimensions of the support section in the second direction and the average dimensions in the third direction, and then multiplying these values. The multilayer electronic component corresponding to the sample chip was manufactured in 0402 size (L×W: 0.4mm×0.2mm).

[0147] For each test example, 100 sample chips were manufactured, and the number of sample chips without mounting defects was recorded as a percentage of the total number of sample chips.

[0148] [Table 1]

[0149] The area of ​​the support portion is the square of the average dimension in the third direction of the 0402 size multilayer electronic component W. 2 0.04 mm 2 The mounting rates for Test Examples 1 to 3, which fall below the threshold, were 4.5%, 19.8%, and 26.8%, respectively, indicating poor mounting rates. In contrast, the area of ​​the support portion is the square of the average third-direction dimension W of the 0402 size multilayer electronic component. 2 0.04 mm 2The mounting rates for Test Examples 4 and 5, which fall under the above categories, were 91.4% and 93.5%, respectively, demonstrating excellent mounting rates, and the area of ​​the support portion was the square of the average dimension W in the third direction of the multilayer electronic component. 2 The value is 0.04 mm 2 It can be seen that there has been a sharp improvement relative to the baseline. This confirms that mounting characteristics improve when the area of ​​each support part is greater than or equal to the square of the average dimension in the third direction of the multilayer electronic component.

[0150] Table 2 below shows the minimum and maximum equivalent series resistance (ESR) values ​​measured according to the distance L3 between the first and second support parts in the second direction, and the average value of these values ​​calculated (rounded to three decimal places). The multilayer electronic component corresponding to the sample chip was manufactured in 0402 size (L×W: 0.4mm×0.2mm).

[0151] The equivalent series resistance (ESR) was measured using an LCR meter (equipped with a Keysight E4980A) on a fabricated 0402-size multilayer electronic component, employing the SMD Fixture type probe method. During this process, the Calibration mode was set to FUNC→RX, the cursor was placed on FREQ, and measurements were taken by repeatedly using Probe close→MEAS SHORT and Probe open→MEAS OPEN until the value stabilized from the minimum value.

[0152] [Table 2]

[0153] In Test Examples 6 to 8, where the distance L3 between the first and second support parts in the second direction is less than 0.2 mm (0.5 times the average dimension L in the second direction of the 0402 size multilayer electronic component), the average ESR values ​​are 28.90 Ω, 28.09 Ω, and 17.17 Ω, respectively, exceeding the target ESR value of 10 Ω. However, in Test Examples 9 and 10, where the distance L3 between the first and second support parts in the second direction is 0.2 mm or more (0.5 times the average dimension L in the second direction of the 0402 size multilayer electronic component), the average ESR values ​​are 6.03 Ω and 5.27 Ω, respectively, satisfying the target ESR value of 10 Ω or less. This shows a rapid improvement from the standard of 0.2 mm (0.5 times the average dimension L in the second direction of the multilayer electronic component). This confirms that the ESR characteristics improve when the distance L3 between the first support and the second support in the second direction is 0.5 times or more the average dimension L of the stacked electronic component in the second direction.

[0154] Although embodiments and test examples of the present invention have been described in detail above, the present invention is not limited by the embodiments and accompanying drawings described above, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0155] Furthermore, the term "embodiment" as used in this invention does not mean that each embodiment is identical to the others, but rather is provided to emphasize and describe the unique and distinct characteristics of each embodiment. However, the embodiments presented above do not preclude their implementation in combination with the features of other embodiments. For example, even if a matter described in one particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, as long as there is no description in the other embodiment that contradicts or is contrary to that matter.

[0156] The terms used in this invention are used merely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions may include plural expressions unless they clearly mean something different in context. [Explanation of Symbols]

[0157] 10. Composite Electronic Components 20 circuit boards 31, 32 Electrode pads SOL Solder 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 121, 122 Internal electrode 131, 132 External electrode 201, 202 Metal frame 301, 302 Conductive adhesive 1000 Composite Electronic Component Mounting Boards

Claims

1. A laminated electronic component comprising a body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first and second surface facing each other in the first direction, a third and fourth surface connected to the first and second surfaces and facing each other in a second direction, a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in a third direction, and a first external electrode and a second external electrode arranged on the third and fourth surfaces, respectively, A first metal frame including a first connecting portion disposed on the first external electrode, and a first support portion connected to the first connecting portion and disposed apart from the first surface, The present invention includes a second metal frame comprising a second connecting portion disposed on the second external electrode, and a second support portion connected to the second connecting portion and disposed at a distance from the first surface, When the average dimension of the stacked electronic component in the second direction is L and the average dimension in the third direction is W, the following conditions must be met: L ≤ 0.4 mm, W ≤ 0.2 mm. When the area of ​​the first support part is A1 and the area of ​​the second support part is A2, W ２ ≤ A1 and W ２ A composite electronic component that satisfies ≤ A2.

2. The aforementioned W, A1, and A2 are W ２ ≤A1 ≤2 × W ２ and W ２ ≤A² ≤ 2 × W ２ A composite electronic component according to claim 1, satisfying the requirements.

3. The composite electronic component according to claim 1, wherein the first support portion and the second support portion are separated from each other in the second direction, and when L3 is the average dimension in the second direction of the distance between the first support portion and the second support portion that separates each other, 0.5 × L ≤ L3 is satisfied.

4. The composite electronic component according to claim 3, wherein L and L3 satisfy 0.5 × L ≤ L3 ≤ L.

5. The first metal frame further includes a first connecting portion located between the first connecting portion and the first support portion, which connects the first connecting portion and the first support portion. The composite electronic component according to claim 1, wherein the second metal frame further includes a second connecting portion located between the second connecting portion and the second support portion, and connecting the second connecting portion and the second support portion.

6. The composite electronic component according to claim 1, further comprising a first conductive adhesive disposed between the first external electrode and the first metal frame to connect the first external electrode and the first metal frame, and a second conductive adhesive disposed between the second external electrode and the second metal frame to connect the second external electrode and the second metal frame.

7. A laminated electronic component comprising a body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first and second surface facing each other in the first direction, a third and fourth surface connected to the first and second surfaces and facing each other in a second direction, a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in a third direction, and a first external electrode and a second external electrode arranged on the third and fourth surfaces, respectively, A first metal frame including a first connecting portion disposed on the first external electrode, and a first support portion connected to the first connecting portion and disposed apart from the first surface, The present invention includes a second metal frame comprising a second connecting portion disposed on the second external electrode, and a second support portion connected to the second connecting portion and disposed at a distance from the first surface, When the average dimension of the stacked electronic component in the second direction is L and the average dimension in the third direction is W, the following conditions must be met: L ≤ 0.4 mm, W ≤ 0.2 mm. When the average dimension of the first support portion in the second direction is L1 and the average dimension in the third direction is W1, and the average dimension of the second support portion in the second direction is L2 and the average dimension in the third direction is W2, W ２ ≤ L1 × W1 and W ２ A composite electronic component that satisfies the condition ≤ L² × W².

8. The W, L1, W1, L1, W2, where W ２ ≤ L1 × W1 ≤ 2 × W ２ and W ２ ≤ L2 × W2 ≤ 2 × W ２ The composite electronic component according to claim 7, satisfying the above conditions.

9. The composite electronic component according to claim 7, wherein the first support portion and the second support portion are separated from each other in the second direction, and when L3 is the average dimension in the second direction of the distance between the first support portion and the second support portion that separates each other, 0.5 × L ≤ L3 is satisfied.

10. The composite electronic component according to claim 9, wherein L and L3 satisfy 0.5 × L ≤ L3 ≤ L.

11. The first metal frame further includes a first connecting portion located between the first connecting portion and the first support portion, which connects the first connecting portion and the first support portion. The composite electronic component according to claim 7, wherein the second metal frame further includes a second connecting portion located between the second connecting portion and the second support portion, and connecting the second connecting portion and the second support portion.

12. The composite electronic component according to claim 7, further comprising a first conductive adhesive disposed between the first external electrode and the first metal frame to connect the first external electrode and the first metal frame, and a second conductive adhesive disposed between the second external electrode and the second metal frame to connect the second external electrode and the second metal frame.

13. circuit board and A first electrode pad and a second electrode pad are arranged on the substrate, A composite electronic component according to any one of claims 1 to 12, A mounting substrate for a composite electronic component, wherein the first support portion and the second support portion are mounted on the substrate such that they are in contact with the first electrode pad and the second electrode pad, respectively.

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