Array antenna structure and array antenna unit

Abstract

The present invention provides an array antenna structure and array antenna unit having a heat dissipation structure that can be miniaturized. [Solution] A flexible, sheet-like heat transfer member 10 is placed on the power control board of the array antenna structure. The heat transfer member is in contact with the upper and side surfaces of a heat-generating component 4 whose lower surface is fixed to the power control board, and has a heat dissipation lead-out portion 10a that extends outside the XZ region of the power control board.

Description

Technical Field

[0001] The present invention relates to an array antenna structure and an array antenna unit.

Background Art

[0002] In recent years, commercial services using fifth-generation (5G) mobile communication systems have been started, and as a basic technology supporting industries or society, it is expected to further accelerate the sophistication of multimedia services and provide new values.

[0003] 5G is a mobile communication system that handles high-frequency bands such as millimeter waves exceeding 10 GHz, and for transmission and reception antennas, a patch antenna (microstrip antenna), which is a type of planar antenna composed of a dielectric substrate, radiation elements formed with wiring on both sides thereof, and a ground conductor plate, is generally used.

[0004] In order to obtain a desired radiation directivity (radiation pattern), it is often used as a multi-element array antenna in which a plurality of patch antennas are regularly arranged linearly or in a planar shape or the like.

[0005] Also, by using a multi-element array antenna, large-capacity communication becomes possible.

[0006] Antenna elements such as patch antennas are connected to various signal processing circuits or power supply circuits to constitute an antenna structure (that is, an antenna module).

[0007] And it is housed in a housing such as a case or a cover and is practically used as an antenna unit for communication.

[0008] For example, Patent Document 1 discloses an antenna structure and an antenna unit composed of an antenna element portion and a circuit portion that amplifies an electrical signal converted by the antenna element portion.

[0009] The antenna element and circuitry are separate components, connected to each other by cables, and housed side-by-side within an external case, resulting in an antenna unit structure.

[0010] In recent years, there has been a strong demand for miniaturization of antenna units, as larger sizes limit the places where they can be installed.

[0011] However, in the antenna structure described in Patent Document 1, where the antenna element and circuit section are arranged side by side, it is necessary to secure an area in the planar direction to accommodate both the antenna element and circuit section, making miniaturization difficult.

[0012] Therefore, in order to achieve miniaturization of the antenna unit, for example, Patent Document 2 shows an antenna structure comprising an antenna element section consisting of a ground conductor and an antenna pattern formed on the upper surface of the ground conductor via a first dielectric substrate, and a circuit section consisting of a circuit pattern formed on the lower surface of the ground conductor via a second dielectric substrate and mounted circuit components. [Prior art documents] [Patent Documents]

[0013] [Patent Document 1] Japanese Utility Model Publication No. 06-041220 [Patent Document 2] Japanese Patent Application Publication No. 06-152237 [Patent Document 3] Japanese Patent Application Publication No. 11-68360 [Overview of the project] [Problems that the invention aims to solve]

[0014] In the antenna structure shown in Patent Document 2, even if the antenna element is miniaturized, when dissipating heat from the electronic component, a structure can be considered in which the heat from the electronic component 103 is released to the heat sink 104 via a leaf spring 105 made of metal and standing upright in a roughly V shape on the electronic component, as shown in Patent Document 3 in Figure 8.

[0015] However, when such a structure was applied to an array antenna structure that required heat dissipation measures, miniaturization was difficult because the leaf spring 105 was positioned in roughly a V-shape.

[0016] Therefore, an object of the present invention is to solve the above problem by providing an array antenna structure and an array antenna unit having a heat dissipation structure that can be miniaturized. [Means for solving the problem]

[0017] To achieve the aforementioned objective, the present invention is configured as follows.

[0018] According to one aspect of the present invention, an array antenna structure is formed in which 2 or more m antenna structures are adjacent to each other on the XY plane, the antenna substrate formed in the XY plane and the power control substrate arranged in the XZ plane are connected by a bonding member having bonding electrodes on the surface of an insulating resin with the X direction as the longitudinal direction, the X direction is the longitudinal direction, and the antenna structures are adjacent to each other on the XY plane. A flexible, sheet-like heat transfer member is placed on the power control board of the array antenna structure. The heat transfer member provides an array antenna structure in which the heat transfer member is in contact with the upper and side surfaces of a heat-generating component whose lower surface is fixed to the power control board, and has a heat dissipation extraction portion that extends outside the XZ region of the power control board.

[0019] According to another aspect of the present invention, in the array antenna structure described in the above aspect, The heat transfer member outside the XZ region of the power control board is connected to a heat dissipation unit, providing an array antenna structure.

[0020] According to yet another aspect of the present invention, an array antenna unit is provided in which the heat dissipation section is a housing for housing the array antenna structure described in the other aspect. [Effects of the Invention]

[0021] According to the above aspect of the present invention, a flexible and sheet-like heat transfer member is disposed on the power control substrate. The heat transfer member is in contact with the upper surface and the side surface of the heat generating component whose lower surface is fixed on the power control substrate, and has a heat radiation lead-out portion drawn out to the outside of the XZ region of the power control substrate. Thereby, the heat from the heat generating component of the stacked antenna structure can be drawn out and radiated by the heat radiation lead-out portion outside the array antenna structure through the heat transfer member, so that the heat generating component can be cooled. As a result, it becomes possible to provide an array antenna structure and an array antenna unit having a heat radiation structure that can be miniaturized.

Brief Description of the Drawings

[0022] [Figure 1A] Schematic diagram showing an example of an antenna structure excluding the heat transfer member according to Embodiment 1 [Figure 1B] Schematic diagram of the example of the antenna structure in FIG. 1A as viewed from the front side to the back side in the X direction [Figure 2A] Schematic diagram of the example of the array antenna structure according to Embodiment 1 as viewed from the front side to the back side in the X direction (only the cross section of the heat transfer member is shown for easy understanding of the relationship with the heat generating component.) [Figure 2B] Schematic diagram of the example of the array antenna structure in FIG. 2A as viewed from the upper side to the lower side in the Y direction [Figure 2C] Perspective view of the example of the array antenna structure in FIG. 2A [Figure 3A] Schematic diagram of the example of the array antenna structure according to the modification of Embodiment 1 as viewed from the upper side to the lower side in the Y direction [Figure 3B] Schematic diagram of the example of the array antenna structure according to the modification of Embodiment 1 as viewed from the upper side to the lower side in the Y direction [Figure 3C] Schematic diagram of the example of the array antenna structure according to the modification of Embodiment 1 as viewed from the upper side to the lower side in the Y direction [Figure 3D] Schematic diagram of the example of the array antenna structure according to the modification of Embodiment 1 as viewed from the upper side to the lower side in the Y direction [Figure 3E]A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the top to the bottom in the Y direction. [Figure 3F] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the top to the bottom in the Y direction. [Figure 3G] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the top to the bottom in the Y direction. [Figure 3H] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the top to the bottom in the Y direction. [Figure 4A] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the front to the back in the X direction (only the heat transfer member is shown in cross-section to facilitate understanding of its relationship with the heat-generating components). [Figure 4B] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the front to the back in the X direction (only the heat transfer member is shown in cross-section to facilitate understanding of its relationship with the heat-generating components). [Figure 4C] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 1, viewed from the front to the back in the X direction (only the heat transfer member is shown in cross-section to facilitate understanding of its relationship with the heat-generating components). [Figure 5] A schematic diagram showing an example of an array antenna structure according to Embodiment 2, viewed from the front to the back in the X direction (only the heat transfer member and adhesive layer are shown in cross-section to facilitate understanding of the relationship with the heat-generating components). [Figure 6A] Perspective view of an example of an array antenna structure according to Embodiment 3 [Figure 6B] A schematic diagram of an example of the array antenna structure shown in Figure 6A, viewed from the front to the back in the X direction (only the heat transfer members are shown in cross-section to facilitate understanding of the relationship with heat-generating components). [Figure 7A] A schematic diagram showing an example of an array antenna structure according to Embodiment 4, viewed from the front to the back in the X direction (only the heat transfer member is shown in cross-section to facilitate understanding of its relationship with heat-generating components). [Figure 7B]A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 4, viewed from the front to the back in the X direction (only the heat transfer member is shown in cross-section to facilitate understanding of its relationship with the heat-generating components). [Figure 7C] A schematic diagram showing an example of an array antenna structure related to a modification of Embodiment 4, viewed from the front to the back in the X direction (only the heat transfer member is shown in cross-section to facilitate understanding of its relationship with the heat-generating components). [Figure 8] Longitudinal cross-sectional view of the mounting structure of electronic components in Patent Document 3 [Modes for carrying out the invention]

[0023] Hereinafter, an array antenna structure and an array antenna unit according to embodiments of the present invention will be described with reference to the drawings.

[0024] Furthermore, substantially identical components in the drawings are denoted by the same reference numeral.

[0025] (Embodiment) Figures 1A and 1B are schematic diagrams showing an example of an antenna structure 20 excluding the heat transfer member 10 according to Embodiment 1. The antenna structure 20 is constructed by connecting an antenna substrate 1 and a power control substrate 3 with a connecting member 5. The three directions X, Y, and Z are arranged to be orthogonal to each other.

[0026] In Figures 1A and 1B, the antenna substrate 1 is an elongated plate in the X direction and is arranged parallel to the XY plane. Patch antenna elements 2 are formed on its surface at equal intervals P parallel to the X direction.

[0027] The spacing P between the patch antenna elements 2 is determined by the communication frequency of the equipment and is generally half the wavelength. In this embodiment 1, as an example, since the communication frequency is 39 GHz, the spacing is set to 2.56 mm, which is half the wavelength.

[0028] In this embodiment 1, as an example, the antenna substrate 1 is made using Panasonic Corporation's multilayer substrate material "MEGTRON7" as the base material, with a width of 3 mm, a length of 20 mm, and a thickness of 0.8 mm.

[0029] Furthermore, as an example, five patch antenna elements 2, each measuring 2mm x 2mm and made from 18μm thick copper foil, are formed and arranged at equal intervals P.

[0030] The number of patch antenna elements 2 should be determined by creating an optimal number (n) depending on the antenna's application. However, n is an integer where n > 0.

[0031] Furthermore, the material of the antenna substrate 1 is not limited to "MEGTRON7," but may be other glass epoxy materials or ceramic materials.

[0032] A first bonding electrode 7 is formed on the surface of the antenna substrate 1 opposite to the surface on which the Padthai antenna element 2 is formed.

[0033] The bonding member 5, made of insulating resin, has its longitudinal direction in the X direction and is arranged parallel to the XY plane, and a third bonding electrode 6 is formed on its surface.

[0034] The antenna substrate 1 has its longitudinal direction in the X direction and is connected to the power control board 3 via an elongated bonding member 5 made of insulating resin.

[0035] Figure 1B is a schematic diagram of the cross-section of line AA' of the antenna structure 20 in Figure 1A, viewed from the front to the back in the X direction. As shown in Figure 1B, the bonding member 5, made of insulating resin, has its longitudinal direction in the X direction, and a third bonding electrode 6 is formed on the surface arranged parallel to the XY plane and the surface arranged parallel to the XZ plane for bonding the first bonding electrode 7 of the antenna substrate 1 and the second bonding electrode 8 of the power control substrate 3. In Figure 1B, the third bonding electrode 6 is arranged in an L-shape so as to span the surface arranged parallel to the XY plane and the surface arranged parallel to the XZ plane.

[0036] For example, the width of the connecting member 5 in the Y direction is 1.0 mm, the height in the Z direction is 2.0 mm, and the length in the X direction is 20 mm.

[0037] As an example, the insulating resin material of the bonding member 5 is LCP (liquid crystal polymer) with a dielectric constant of 4.3 and a dielectric loss tangent of 0.015, but it is not limited to this, and may also be PPA, ABS, PEEK, or PC.

[0038] Furthermore, the third bonding electrode 6 is formed by plating, for example, by forming an electrode with a thickness of 10 μm of Cu, 0.2 μm of Ni, and 0.05 μm of Au. However, it may also be formed by printing or dispensing conductive resin, or by other methods. In this embodiment 1, an example of an L-shaped structure in which the third bonding electrodes 6 in the XY plane and the XZ plane are physically connected is shown, but the third bonding electrodes 6 in the XY plane and the XZ plane do not necessarily need to be physically connected.

[0039] The third bonding electrode 6 is metallically bonded to the first bonding electrode 7 of the antenna substrate 1 with a bonding material 9 to form a first joint. In this embodiment 1, as an example, solder with a composition of Sn-3.0Ag-0.5Cu is used as the bonding material 9 for metallic bonding the third bonding electrode 6 and the first bonding electrode 7.

[0040] Furthermore, the bonding material 9 is not limited to solder; other bonding materials such as conductive paste of Ag or Cu may also be used.

[0041] The power control board 3 has a substrate thickness T and is arranged parallel to the XZ plane. The second bonding electrode 8, which serves as a power supply electrode and is formed on the surface of the power control board 3, is metal-bonded to the third bonding electrode 6 of the bonding member 5, forming a second bonding portion.

[0042] In this embodiment 1, Sn-Bi solder is used as an example of the bonding material 9 for joining the power supply electrode 8 and the third bonding electrode 6, but the invention is not limited to this.

[0043] Furthermore, depending on the molten state of the joining material 9, such as solder, the first and second joints may not be in separate shapes, but may be integrated as shown in the figure.

[0044] On the power control board 3, as an example of a heat-generating component 4, the electrode portion on the lower surface of a circuit component constituting a signal circuit or power supply circuit is mounted on the electrode 8a of the power control board 3 with a bonding material 9a such as solder. In this embodiment 1, the dimensions of the power control board 3 are, for example, 50 mm in length in the X direction, 30 mm in length in the Z direction, and 1.6 mm in thickness in the X direction.

[0045] As shown in Figures 2A to 2C, a flexible, rectangular sheet-shaped heat transfer member 10 is arranged on the power control board 3. The heat transfer member 10 is in contact with the top and side surfaces of the heat-generating component 4, whose bottom surface is fixed to the power control board 3, and has a heat dissipation extraction portion 10a that is extended outwards in the X or Z direction to the XZ region of the power control board 3. In Figure 2A, the heat transfer member 10 has a heat dissipation extraction portion 10a that is extended outwards in the Z direction only to the XZ region of the power control board 3. It is preferable that the heat transfer member 10 has a characteristic that allows heat to be easily transferred in the X or Z direction relative to the Y direction. For example, the heat transfer member 10 has a thermal conductivity of 400 to 1500 W / (m·K) in the direction perpendicular to the thickness direction, i.e., the XZ direction, which is much higher than the thermal conductivity of 10 to 50 W / (m·K) in the thickness direction, i.e., the Y direction.

[0046] The thickness of the heat transfer member 10 is, for example, greater than the thickness of the heat-generating component 4. The upper part of the heat-generating component 4 is embedded in the lower surface of the heat transfer member 10, ensuring that the heat transfer member 10 makes secure contact with the entire upper and side surfaces of the heat-generating component 4, thereby enabling efficient heat dissipation.

[0047] An example of a heat transfer member 10 is a graphite sheet, and more specifically, Panasonic Industries, Ltd.'s heat countermeasure sheet, PGS Graphite Sheet (Graphite TIM), can be cited. The graphite sheet is insulating, flexible, and has a thermal conductivity of 700-1000 W / (m·K) in the direction perpendicular to the thickness direction (XZ direction), rather than 10-20 W / (m·K) in the thickness direction (Y direction). The PGS Graphite Sheet is a "highly oriented" graphite with a structure close to a single crystal, made by a novel method of graphitizing a polymer film by thermal decomposition, and is a heat conductive sheet with features such as high thermal conductivity and flexibility. Another example of a material other than graphite is BN (boron nitride).

[0048] Therefore, by ensuring that the heat transfer member 10 is in firm contact with the entire upper surface and the entire side surface of the heat-generating component 4, heat is transferred from the entire upper surface and the entire side surface of the heat-generating component 4 to the heat transfer member 10, enabling efficient heat dissipation at the heat dissipation outlet 10a.

[0049] With the configuration described above, an antenna structure 20 is formed in which an antenna substrate 1 arranged parallel to the XY plane and a power control substrate 3 arranged parallel to the XZ plane are electrically connected via a connecting member 5, and a heat transfer member 10 is placed on the power control substrate 3. An array antenna structure 30 is formed by arranging 2 or more m of these antenna structures 20 adjacently on the XY plane, where m is an integer of 2 or more.

[0050] In this embodiment 1, as an example, the multiple antenna structures 20 are arranged such that the equal spacing Q in the Y direction of the patch antenna elements 2 formed on each structure is half a wavelength of the communication frequency, specifically 2.56 mm, which is half a wavelength of a communication frequency of 39 GHz.

[0051] This results in a small array antenna structure 50 in which n × m patch antenna elements 2 are arranged at equal intervals on a matrix at half wavelengths of the communication frequency.

[0052] It should be noted that the present invention is not limited to the first embodiment described above, and can be implemented in various other forms. For example, there are various ways to form the heat dissipation extraction portion 10a of the heat transfer member 10 that contacts the multiple heat-generating components 4. Figures 3A to 3H below show examples of modified forms.

[0053] In the modified example shown in Figure 3A, the heat dissipation lead-out portion 10a is extended only in the Z direction, but it also covers the connecting member 5. This modified example can be combined with any of the following modified examples.

[0054] In the modified example shown in Figure 3B, the heat dissipation outlet 10a is extended only on one side in the X direction.

[0055] In the modified example shown in Figure 3C, the heat dissipation lead-out portion 10a is similarly extended to only one side in the X direction, but the width dimension of the heat transfer material 10 in the Z direction is significantly smaller than the Z-direction dimension of the power control board 3, so a large portion of the power control board 3 is exposed.

[0056] In the modified example shown in Figure 3D, heat dissipation outlets 10a are formed in both the Z and X directions. Since the outlet area of ​​the heat dissipation outlets 10a is larger than if they were only in one direction, the heat dissipation efficiency is even better.

[0057] In Figure 3E, in addition to the heat transfer member 10 in Figure 3C, another elongated heat transfer member 10 is arranged along the Z direction. This elongated heat transfer member 10 is in contact with the heat transfer member 10 in Figure 3C and is arranged in a roughly T-shape, with heat dissipation outlets 10a formed in both the Z and X directions.

[0058] In the modified example shown in Figure 3F, heat dissipation outlets 10a are formed on both sides in the X direction of the heat transfer member 10 in Figure 3C.

[0059] In the modified example shown in Figure 3G, heat dissipation outlets 10a are formed on both sides in the X direction of the heat transfer member 10 along the X direction in the modified example shown in Figure 3E.

[0060] In the modified example shown in Figure 3H, the heat transfer member 10 is composed of a single rectangle, such as a square, and heat dissipation outlets 10a are formed on both sides in the X direction and in the Z direction, resulting in good heat dissipation efficiency.

[0061] In the modified example shown in Figure 4A, the upper surface of the heat-generating component 4 is in contact with the lower surface of the heat transfer member 10. Even in this state, it is possible to transfer heat from the heat-generating component 4 to the heat transfer member 10, but it may be insufficient.

[0062] Therefore, as shown in the modified example in Figure 4B, an embedded portion 10b is formed on the lower surface of the heat transfer member 10 corresponding to the heat-generating component 4, into which the entire heat-generating component 4 is embedded. The thickness of the embedded portion 10b is greater than the height of the heat-generating component 4, and when viewed from above in the Y direction, the planar shape of the embedded portion 10b is larger than the planar shape of the heat-generating component 4. When the heat-generating component 4 is embedded in the embedded portion 10b, it covers all sides of the heat-generating component 4 and can contact all sides as an all-side contact portion. This allows heat from the heat-generating component 4 to be efficiently transferred to the heat transfer member 10.

[0063] In the modified example shown in Figure 4C, as another example of the embedded portion 10c, the embedded portion 10c may be embedded as a lateral contact portion to a part of the heat-generating component 4, for example, up to half the height of the heat-generating component 4.

[0064] As in Embodiment 2, as shown in Figure 5, the heat transfer member 10 may have an adhesive layer 15 on its lower surface on the power control board side that adheres to the heat-generating component 4 and the power control board 3. By adhering the heat transfer member 10 to the heat-generating component 4 and the power control board 3 with the adhesive layer 15, it is possible to prevent the component from falling off due to vibration, etc., and to reinforce the board.

[0065] In a third embodiment, as shown in Figures 6A and 6B, each heat dissipation outlet 10a is passed through the metal housing 11 that houses the array antenna structure 30 and bent into an L-shape to form a bent portion 10e, which is then brought into contact with the housing 11. This allows heat from the heat-generating components 4 to be dissipated from the heat dissipation outlets 10a through the bent portions 10e to the housing 11. Here, the housing 11 functions as an example of a metal heat dissipation section connected to the heat dissipation outlets 10a for heat dissipation. By transferring heat from the heat-generating components 4 to the housing 11, which has a large heat capacity, it becomes possible to extract more heat from the heat-generating components 4. Examples of materials for the housing 11 include aluminum, copper, or stainless steel.

[0066] As a fourth embodiment, as shown in Figures 7A to 7C, each heat dissipation outlet 10a may be connected to a heat dissipation member 12, for example, a rectangular parallelepiped made of metal, as another example of a heat dissipation member. In Figure 7A, the heat dissipation member 12 is sandwiched between the heat dissipation outlets 10a at both ends, and the intermediate heat dissipation outlet 10a is also in contact with the heat dissipation member 12. Figure 7B shows the structure of Figure 7A housed inside the housing 11. In Figure 7C, the heat dissipation member 12 and each heat dissipation outlet 10a are in contact outside the housing 11 in Figure 7B. By transferring heat from the heat-generating component 4 to the heat dissipation member 11 with a large heat capacity, it becomes possible to extract more heat from the heat-generating component 4. Another example of the heat dissipation member 12 is a heat dissipation fin. Examples of materials for the heat dissipation member 12 include aluminum or copper.

[0067] As described above, according to these embodiments 1 to 4 and their modifications, a flexible, sheet-like heat transfer member 10 is arranged on the power control board 3. The heat transfer member 10 is in contact with the upper and side surfaces of the heat-generating component 4, whose lower surface is fixed to the power control board 3, and has a heat dissipation extraction portion 10a that extends outside the XZ region of the power control board 3. This allows the heat from the heat-generating component 4 of the stacked antenna structure 20 to be drawn out of the array antenna structure 30 via the heat transfer member 10, such as a graphite sheet, and dissipated through the heat dissipation extraction portion 10a, thereby cooling the heat-generating component 4. As a result, it is possible to provide an array antenna structure and array antenna unit having a heat dissipation structure that can be miniaturized.

[0068] Furthermore, by appropriately combining any embodiment or modification from the various embodiments or modifications described above, the effects of each can be achieved. In addition, it is possible to combine embodiments with each other, or embodiments with each other, or embodiments with each other, as well as to combine features from different embodiments or embodiments.

[0069] (Note) Based on the above description of embodiments, the following technologies are disclosed.

[0070] (Technology 1) An array antenna structure in which 2 or more m antenna structures are arranged adjacently on the XY plane, each antenna substrate formed in the XY plane and having 1 to n patch antenna elements formed at equal intervals P in the X direction, and a power control substrate arranged in the XZ plane, are connected by a bonding member having bonding electrodes on the surface of an insulating resin with the X direction as the longitudinal direction, A flexible, sheet-like heat transfer member is placed on the power control board of the array antenna structure. The heat transfer member has a heat dissipation lead that is in contact with the upper and side surfaces of a heat-generating component whose lower surface is fixed to the power control board, and extends outside the XZ region of the power control board. Array antenna structure.

[0071] (Technical 2) The heat transfer member has an adhesive layer on the power control board side that adheres to the heat-generating component and the power control board. The array antenna structure described in Technical 1.

[0072] (Technical 3) The heat transfer member has the characteristic of readily transferring heat in the X or Z direction relative to the Y direction. An array antenna structure as described in Technology 1 or 2.

[0073] (Technical 4) The heat dissipation extraction portion of the heat transfer member is drawn out in the X or Z direction of the power supply control board to outside the XZ region of the power supply control board. An array antenna structure as described in any one of the three technologies.

[0074] (Technical 5) The heat transfer member has a thermal conductivity of 400 to 1500 W / m·K in the planar direction and a thermal transfer coefficient of 10 to 50 W / m·K in the thickness direction. An array antenna structure described in any one of the following technologies 1-4.

[0075] (Technology 6) In the array antenna structure described in any one of Techniques 1 to 5, The heat transfer member outside the XZ region of the power control board is connected to the heat dissipation section. Array antenna structure.

[0076] (Technical 7) The patch antenna elements are arranged at equal intervals Q in the Y direction. An array antenna structure described in any one of the following technologies 1-6.

[0077] (Technical 8) The equally spaced P and equally spaced Q are each half a wavelength of the communication frequency. The array antenna structure described in Technical 7.

[0078] (Technical 9) The heat dissipation section is a housing that houses the array antenna structure described in Technical 6. Array antenna unit.

[0079] With these configurations, a flexible, sheet-like heat transfer member is placed on the power control board. The heat transfer member contacts the top and side surfaces of a heat-generating component whose bottom surface is fixed to the power control board, and has a heat dissipation extraction section that extends outside the XZ region of the power control board. This allows the heat-generating component of the stacked antenna structure to be cooled by drawing heat from the heat-generating component through the heat transfer member and dissipating it outside the array antenna structure at the heat dissipation extraction section. As a result, it becomes possible to provide an array antenna structure or array antenna unit with a heat dissipation structure that can be miniaturized. [Industrial applicability]

[0080] According to the array antenna structure and array antenna unit according to the above-described aspect of the present invention, it is possible to provide a compact array antenna structure and array antenna unit having a heat dissipation structure that can be miniaturized. Therefore, for example, it is possible to provide a high-frequency array antenna structure and array antenna unit in which multiple antenna elements are arranged in close proximity (a distance of half a wavelength of the communication frequency) and have excellent heat dissipation properties. [Explanation of Symbols]

[0081] 1 Antenna board 2 Patch antenna elements 3. Power supply control board 4. Heat-generating components 5. Joining members 6 Third bonding electrode 7 First bonding electrode 8 Power supply electrode (second bonding electrode) 8a electrode 9 Bonding material 9a Bonding material 10 Heat transfer member 10a Heat dissipation outlet 10b Embedded portion (all-side contact portion) 10c Embedded part (side contact part) 10e Bend part 11 cabinets 12 Heat dissipation components 15 Adhesive layer 20 Antenna Structures 30 Array Antenna Structures 40 Antenna Structures

Claims

1. An array antenna structure is formed in which 1 to n patch antenna elements are formed at equal intervals P in the X direction, and an antenna substrate formed in the XY plane and a power control substrate arranged in the XZ plane are connected by a bonding member having bonding electrodes on the surface of an insulating resin with the X direction as the longitudinal direction, and 2 to m such antenna structures are arranged adjacently on the XY plane. A flexible, sheet-like heat transfer member is placed on the power control board of the array antenna structure. The heat transfer member has a heat dissipation lead that is in contact with the upper and side surfaces of a heat-generating component whose lower surface is fixed to the power control board, and extends outside the XZ region of the power control board. Array antenna structure.

2. The heat transfer member has an adhesive layer on the power control board side that adheres to the heat-generating component and the power control board. The array antenna structure according to claim 1.

3. The heat transfer member has the characteristic of readily transferring heat in the X or Z direction relative to the Y direction. The array antenna structure according to claim 1.

4. The heat dissipation extraction portion of the heat transfer member is extended out of the XZ region of the power control board in the X or Z direction of the power control board. The array antenna structure according to claim 1.

5. The heat transfer member has a thermal conductivity of 400 to 1500 W / m·K in the planar direction and a thermal transfer coefficient of 10 to 50 W / m·K in the thickness direction. The array antenna structure according to any one of claims 1 to 4.

6. In the array antenna structure according to any one of claims 1 to 4, The heat transfer member outside the XZ region of the power control board is connected to the heat dissipation section. Array antenna structure.

7. The aforementioned patch antenna elements are arranged at equal intervals Q in the Y direction. The array antenna structure according to any one of claims 1 to 4.

8. The aforementioned equal intervals P and Q are each half a wavelength of the communication frequency. The array antenna structure according to claim 7.

9. The heat dissipation section is a housing for the array antenna structure described in claim 6. Array antenna unit.

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