Photosensitive resin film and its use

Abstract

The present invention provides a photosensitive resin film that can meet requirements such as low light transmittance, anti-glare properties, high pattern accuracy, and high adhesion. [Solution] When characterization is performed by ultraviolet-visible spectroscopy, the obtained spectrum is absorbance A at 355 nm. 355 It has and 0.003 355 / T ≤ 0.03. The spectrum has at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and each of these points is independently A w1 / T value, where w1 represents the corresponding wavelength of the point, A w1 represents the corresponding absorbance, and 0.003 ≤ A w1 The first wavelength range is greater than 450 nm and less than or equal to 780 nm, and the thickness T is in the range of 20 μm to 200 μm.​

Description

[Technical Field]

[0001] This application claims the interests of China Patent Application No. 202411867068.X filed on 18 December 2024, and Taiwan Patent Application No. 113149450 filed on 18 December 2024, the subject matter thereof incorporated herein in its entirety by reference.

[0002] The present invention provides a photosensitive resin film, particularly a photosensitive resin film having specific light absorption properties. The photosensitive resin film of the present invention is used to form a package structure including a semiconductor element. [Background technology]

[0003] Photosensitive resin films are films that undergo a chemical change upon exposure to light. Based on the changes that occur after exposure and development, photosensitive resin films can be classified into positive and negative types. In positive-type photosensitive resin films, the areas exposed to light dissolve during development, leaving the unexposed areas intact. In negative-type photosensitive resin films, the areas not exposed to light dissolve during development, leaving the exposed areas intact. Because photosensitive resin films are easy to pattern, they are widely used in packaging semiconductor components, including CMOS (complementary metal-oxide-semiconductor) image sensors.

[0004] CMOS image sensors are semiconductor devices used to capture digital images. Due to their advantages such as high resolution, high speed, and low-light performance, they are widely used in various fields that require image capture, including smartphones, digital cameras, webcams, in-car surround sound systems, and advanced driver-assistance systems (ADAS).

[0005] Generally, the package structure of a CMOS image sensor is configured to dispose a pattern structure formed after curing a photosensitive resin layer of a glass plate on a sensor chip, and the formed pattern structure surrounds the periphery of the photosensitive region of the sensor chip. However, the light passing through the glass plate may be partially reflected by the pattern structure, affecting the photosensitive region and causing a glare problem. This poses a serious safety risk in applications such as the automotive field including car surround systems and advanced driver assistance systems. Also, with the miniaturization of CMOS image sensors, the package structure must be miniaturized accordingly. Therefore, there is an urgent need for a package material that can achieve a high aspect ratio, high adhesiveness, and high pattern accuracy.

Summary of the Invention

Problems to be Solved by the Invention

[0006] In view of the above technical problems, an object of the present invention is to provide a photosensitive resin film that can meet requirements such as low light transmittance, anti-glare property, and high pattern accuracy. In particular, this photosensitive resin film can have high adhesiveness.

Means for Solving the Problems

[0007] Specifically, the object of the present invention is a photosensitive resin film having a thickness T (μm), when the photosensitive resin film is characterized and evaluated by ultraviolet-visible spectroscopy, the obtained spectrum has an absorbance A at 355 nm 355 and 0.003 ≦ A 355 / T ≦ 0.03, the spectrum has at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and each of the points independently has an A w1 / T value, w1 represents the corresponding wavelength of the point, A w1 represents the corresponding absorbance, and 0.003 ≦ A w1 / T, preferably 0.003 ≦ A w1 / T ≦ 0.08, more preferably 0.003 ≦ A w1 / T ≦ 0.03, and to provide a photosensitive resin film in which the first wavelength range is more than 450 nm and 780 nm or less, more preferably more than 480 nm and 730 nm or less, and the thickness T is in the range of 20 μm to 200 μm.

[0008] In one embodiment of the present invention, the ultraviolet-visible spectroscopy is measured using an ultraviolet-visible spectrophotometer under the following conditions: the photosensitive resin film is arranged perpendicular to the direction of incident light, the diffraction grating is configured as an optical splitter, the test temperature is 25°C, the test pressure is 1 atm, the analysis mode is absorbance, the scanning wavelength range is 190 nm to 1100 nm, the blank sample is air, the scanning speed is 2200 nm / min, the switching wavelength at which the light source switches from a deuterium lamp to a tungsten lamp is 340.8 nm, the sampling interval is 0.2 nm, and the slit width is 2.0 nm.

[0009] In one embodiment of the present invention, the spectrum has an absorbance A 450 at 450 nm, and 0 < A 450 / T ≦ 0.003.

[0010] In one embodiment of the present invention, the absorbance of the spectrum at each wavelength within the second wavelength range is independently represented by A w2 where w2 represents the wavelength of the corresponding absorbance, 0 ≦ A w2 / T ≦ 0.003, and the second wavelength range is 440 nm to 470 nm.

[0011] In one embodiment of the present invention, the photosensitive resin film is a negative dry film.

[0012] In one embodiment of the present invention, the photosensitive resin film contains an epoxy film.

[0013] Another object of the present invention is to provide a composite film comprising the above-described photosensitive resin film and a protective film located on at least one surface of the photosensitive resin film.

[0014] Another object of the present invention is, base material, A semiconductor element electrically connected to the substrate, and Includes a package for encapsulating the aforementioned semiconductor element, The objective is to provide a package structure in which the material of the package includes a cured product of the photosensitive resin film described above.

[0015] In one embodiment of the present invention, the semiconductor element is an image sensor chip, the image sensor chip has a photosensitive region, and the package material includes a first portion formed from a cured product of the above-mentioned photosensitive resin film and a second portion formed from a transparent material, wherein the first portion surrounds the image sensor chip from the side, and the second portion is positioned above the photosensitive region. [Modes for carrying out the invention]

[0016] Several embodiments of the present invention will be described in detail below. However, the present invention can be implemented in various embodiments and is not limited to those described herein.

[0017] Unless otherwise stated, expressions such as "a" and "the" used in this specification and the claims include both singular and plural forms.

[0018] In this specification and in the claims, expressions such as “First,” “Second,” etc., are used solely to distinguish between illustrated elements or components, unless otherwise specified. These expressions are not used to indicate priority.

[0019] The advantages of the present invention over the prior art are, in particular, that by controlling the absorption conditions of the photosensitive resin film for light of a specific wavelength, it is possible to provide a photosensitive resin film with anti-glare properties, low light transmittance, and high pattern accuracy (good cross-sectional shape of the pattern formed after exposure). In particular, the photosensitive resin film can have high adhesive properties. Further details regarding the photosensitive resin film of the present invention and its applications are described below.

[0020] 1. Photosensitive resin film The photosensitive resin film of the present invention refers to a film containing a photosensitive resin composition, and may be a positive-type photosensitive resin film or a negative-type photosensitive resin film. In one embodiment of the present invention, the photosensitive resin film is a negative-type photosensitive resin film. That is, after the photosensitive resin film is exposed, the portion that was not exposed during development dissolves, and the exposed portion remains.

[0021] Before using a photosensitive resin film, it is common practice to apply a protective film having protective and supportive functions to the surface of the photosensitive resin film. This forms a composite film structure, facilitating storage of the photosensitive resin film and protecting it from contamination and damage. The terms “thickness” and “absorbance” as used herein and in the claims refer to the photosensitive resin film itself unless otherwise specified, and do not include other parts such as protective films used in combination with the photosensitive resin film.

[0022] In one embodiment of the present invention, the photosensitive resin film is a dry film, that is, a photosensitive resin film with a low solvent content. Here, a low solvent content means that the amount of solvent relative to the total weight of the photosensitive resin film is 10% by weight or less, particularly 5% by weight or less, and more particularly 0.1% to 4% by weight. Compared to ink-like or liquid wet films, dry films have a low solvent content, making them less prone to flowing or deformation, and they can be attached to a substrate without additional processes such as coating or drying. Therefore, dry films are easy to control and have good operability.

[0023] The thickness of the photosensitive resin film of the present invention can be adjusted as needed. In one embodiment of the present invention, the photosensitive resin film is thick. Specifically, the thickness of the photosensitive resin film can be 20 μm to 200 μm. For example, the thickness of the photosensitive resin film may be 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, or 200 μm, or within the range of any two values ​​described herein.

[0024] The photosensitive resin film of the present invention may be formed from a single photosensitive resin layer, or it may be formed by laminating two or more photosensitive resin layers. For example, the photosensitive resin film of the present invention may be formed by laminating two, three, or four photosensitive resin layers, but the present invention is not limited thereto.

[0025] 1.1. Light absorption characteristics of photosensitive resin films [A 355 / T] The photosensitive resin film of the present invention has specific light absorption characteristics. Specifically, when the photosensitive resin film is characterized by ultraviolet-visible spectroscopy, the obtained spectrum is the absorbance A at 355 nm. 355 It has A 355 The relationship between and thickness T (unit: μm) is 0.003 ≦ A 355 / T ≤ 0.03 is satisfied. For example, A 355The values ​​of / T are 0.0035, 0.004, 0.0045, 0.005, 0.0055, 0.006, 0.0065, 0.007, 0.0075, 0.008, 0.0085, 0.009, 0.0095, 0.01, 0.0105, 0.011, 0.0115, 0.012, 0.0125, 0.013, 0.0135, 0.014, 0.0145, 0.015, 0.0155, 0.016, 0.0165, 0.017, 0.0175 , 0.018, 0.0185, 0.019, 0.0195, 0.02, 0.0205, 0.021, 0.0215, 0.022, 0.0225, 0.023, 0.0235, 0.024, 0.0245, 0.025, 0.0255, 0.026, 0.0265, 0.027, 0.0275, 0.028, 0.0285, 0.029, 0.0295, or 0.03, or within the range of any two values ​​listed herein. 355 If the value of / T is below the above range, the photosensitive resin film does not have sufficient reactivity after exposure, and photocuring will be insufficient. 355 If the value of / T is greater than the above range, the photosensitive resin film will not be able to form a high-precision pattern after exposure and development, and the cross-sectional shape will also be poor.

[0026] [A w1 / T] Furthermore, when the photosensitive resin film was characterized by ultraviolet-visible spectroscopy, the result was 0.003 ≦ A 355 In addition to satisfying the condition / T ≤ 0.03, the resulting spectrum has at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0. That is, the spectrum obtained within the first wavelength range has at least one absorption peak. Each of these points is independently A w1 / T value, where w1 represents the corresponding wavelength of the point, A w1 represents the corresponding absorbance. The first wavelength range described above is the range from 450 nm to 780 nm, and more particularly from 480 nm to 730 nm. In the present invention, A w1 The relationship between and thickness T (unit: μm) is 0.003 ≤ A w1 Satisfying / T, preferably 0.003 ≤ Aw1 / T ≤ 0.08, more preferably 0.003 ≤ A w1 / T ≤ 0.03 is satisfied. For example, A w1 The value of / T may be within the range of 0.003, 0.004, 0.005, 0.006, 0.007, 0.008, 0.009, 0.01, 0.011, 0.012, 0.013, 0.014, 0.015, 0.016, 0.017, 0.018, 0.019, 0.02, 0.021, 0.022, 0.023, 0.024, 0.025, 0.026, 0.027, 0.028, 0.029, or 0.03, or any two values ​​listed herein. w1 If the value of / T is within the above range, the effects of low glare and low light transmittance can be obtained. Furthermore, if it is within the above preferred range, the effects of low glare and low light transmittance can be achieved while reducing the impact on the adhesion and pattern accuracy of the photosensitive resin film.

[0027] [A 450 / T] In one preferred embodiment of the present invention, the photosensitive resin film is characterized by ultraviolet-visible spectroscopy, and has a coefficient of 0.003 ≦ A 355 / T ≤ 0.03 and 0.003 ≤ A w1 In addition to satisfying the / T condition, there is no light absorption at 450 nm, virtually no light absorption, or very little light absorption. Specifically, when a photosensitive resin film is characterized by ultraviolet-visible spectroscopy, the resulting spectrum is the absorbance A at 450 nm. 450 It has A 450 The relationship between and thickness T (unit: μm) is 0 ≤ A 450 / T ≤ 0.003, preferably 0 ≤ A 450 / T ≤ 0.0025 is satisfied. For example, A 450 The value of / T may be within the range of 0, 0.0005, 0.001, 0.0015, 0.002, or 0.0025, or any two values ​​listed herein. Within the above preferred range, the photosensitive resin film can have better pattern accuracy and adhesion.

[0028] [A w2 / T] In one preferred embodiment of the present invention, when the photosensitive resin film is characterized by ultraviolet-visible spectroscopy, the result is 0.003 ≦ A 355 In addition to satisfying the condition / T ≤ 0.03, the spectrum must be within the first wavelength range of over 480 nm and under 730 nm, and 0.003 ≤ A w1 It possesses the aforementioned technical characteristics of / T, and has no light absorption, virtually no light absorption, or very little light absorption in the second wavelength range. The second wavelength range is 440nm to 470nm. Specifically, when a photosensitive resin film is characterized by ultraviolet-visible spectroscopy, the absorbance of the spectrum at each wavelength in the second wavelength range is independently A w2 It can be expressed as, 0≦A w2 The condition / T ≤ 0.003 is satisfied, where w² represents the wavelength corresponding to the absorbance. For example, A w2 / T can independently be in the range of 0, 0.0005, 0.001, 0.0015, 0.002, 0.0025, or 0.003, or any two values ​​listed herein. Within the above preferred range, the photosensitive resin film can have better pattern accuracy and adhesion.

[0029] In the present invention, the above-described ultraviolet-visible spectroscopy is measured using an ultraviolet-visible spectrophotometer under the following conditions: the photosensitive resin film is positioned perpendicular to the incident direction of the light source, the diffraction grating is configured as an optical splitter, the test temperature is 25°C, the test pressure is 1 atmosphere, the analysis mode is absorbance, the scanning wavelength range is 190 nm to 1100 nm, air is used as the blank sample, the scanning speed is 2200 nm / min, the switch wavelength at which the light source switches from a deuterium lamp to a tungsten lamp is 340.8 nm, the sampling interval is 0.2 nm, and the slit width is 2.0 nm. Under the above test conditions, the photosensitive resin film sample used for analysis is obtained by cutting the photosensitive resin film to a size of 5 cm × 3 cm at any position along the transverse (TD) and mechanical (MD) directions, or by cutting a composite film containing a photosensitive resin film and protective films on both sides to a size of 5 cm × 3 cm at any position along the transverse and mechanical directions, and then removing the protective films from both sides of the cut photosensitive resin film. In order to correctly measure the absorbance of the photosensitive resin film, the photosensitive resin film must be positioned perpendicular to the direction of incident light. The wavelength of the tungsten lamp used as the incident light source is 340.8 nm. Furthermore, "sampling interval" means acquiring data points every 0.2 nm in the scanning wavelength range of 190 nm to 1100 nm and recording the obtained values.

[0030] The light absorption properties of the photosensitive resin film of the present invention can be controlled by adjusting the components of the photosensitive resin film or the process conditions of the photosensitive resin film. For example, the components of the photosensitive resin film can be adjusted by the type and amount of additives used. Examples of additives include, but are not limited to, photopolymerization initiators, light absorbers, and dyes. The process conditions of the photosensitive resin film may be, for example, drying conditions. Those skilled in the art can prepare a photosensitive resin film having the above-described light absorption properties by referring to this specification, and particularly by the specific description of the examples.

[0031] 1.2. Other properties of photosensitive resin films A 355 / T and A w1 Assuming that / T satisfies the above range, other properties of the photosensitive resin film of the present invention can be adjusted according to the required application.

[0032] For example, a photosensitive resin film can be adjusted to have an appropriate film tensile strength. Film tensile strength refers to the adhesive force between the photosensitive resin film and the protective film covering it, and is expressed as the force required to vertically tear a predetermined size of protective film from the photosensitive resin film. The protective film may be a PET protective film or a PE protective film. Generally, the lower the film tensile strength of a photosensitive resin film, the harder and more elastic the photosensitive resin film is. On the other hand, the higher the film tensile strength of a photosensitive resin film, the softer and more adhesive the photosensitive resin film is. The tensile strength of the film is measured by the following method: a composite film is formed by attaching a protective film to the surface of a photosensitive resin film; this composite film is cut to a size of 10 cm x 10 cm; the protective film is then cut into 50 mm wide strips in the transverse direction (TD); the composite film is fixed on the stage of a tensile testing machine; the 50 mm wide strips of protective film are peeled off; tape is applied to the inside of the protective film (the side facing the photosensitive resin film); the composite film is fixed to the tensile axis of the tensile testing machine so that the tensile direction is perpendicular to the stage; the stage is moved laterally and toward the inside of the peeled protective film at a speed of 70 mm / min; and the tensile strength is measured when the protective film is torn 2 cm in the transverse direction (TD). The unit of film tensile strength is g / 50 mm.

[0033] In one embodiment of the present invention, the tensile strength of the photosensitive resin film is 2 g / 50 mm or more, and more particularly 2 g / 50 mm to 1000 g / 50 mm, thereby improving adhesion. For example, the tensile strength of the photosensitive resin film may be 2 g / 50 mm, 5 g / 50 mm, 10 g / 50 mm, 50 g / 50 mm, 100 g / 50 mm, 200 g / 50 mm, 300 g / 50 mm, 400 g / 50 mm, 500 g / 50 mm, 600 g / 50 mm, 700 g / 50 mm, 800 g / 50 mm, 900 g / 50 mm, or 1000 g / 50 mm, or in the range between any two values ​​described herein.

[0034] 1.3. Composition of photosensitive resin film A 355 / T and A w1 Assuming that / T satisfies the above range, the composition of the photosensitive resin film can be adjusted according to the required application. In one embodiment of the present invention, the photosensitive resin film is an epoxy resin-based photosensitive resin film comprising an epoxy resin and optionally an ethylenically unsaturated compound, a photopolymerization initiator, and other additives.

[0035] 1.3.1. Epoxy resin Examples of epoxy resins include, but are not limited to, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol A novolac type epoxy resin, novolac type epoxy resin, alkyl novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, naphthalene ring epoxy resin, naphthol epoxy resin, biphenyl aralkyl epoxy resin, fluorene epoxy resin, xanthene epoxy resin, dicyclopentadiene epoxy resin, triglycidyl polyisocyanate, oxygen heterocyclic epoxy resin, etc. The above epoxy resins can be used individually or in combination of two or more. In one embodiment of the present invention, bisphenol A type epoxy resin, bisphenol A novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, aliphatic epoxy resin, or oxetane type epoxy resin is used.

[0036] In the photosensitive resin film of the present invention, the amount of epoxy resin may be 50% to 99% by weight, particularly 55% to 98% by weight, and more particularly 60% to 95% by weight, based on the total weight of the photosensitive resin film. For example, the amount of epoxy resin may be 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64%, 65%, 66%, 67%, 68%, 69%, 70%, 71%, 72%, 73%, 74%, It may be 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81% by weight, 82% by weight, 83% by weight, 84% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, or 99% by weight, or within the range of any two values ​​specified herein.

[0037] 1.3.2. Ethylene-unsaturated compounds Ethylene-unsaturated compounds refer to compounds having at least one reactive ethylene functional group, such as difunctional compounds having two reactive ethylene functional groups. Examples of ethylenically unsaturated compounds include, but are not limited to, ethoxylated trimethylolpropane triacrylate, ethoxylated bisphenol A diacrylate, ethoxylated bisphenol A dimethacrylate, tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, polypropylene glycol diacrylate, tris((meth)acryloxyisocyanate)hexamethylene isocyanurate, ethoxylated urethane di(meth)acrylate, propoxylated urethane di(meth)acrylate, ethoxylated / propoxylated urethane di(meth)acrylate, ethoxylated tris(methacryloxyisocyanate)hexamethylene isocyanurate, acrylated tris(methacryloxyisocyanate)hexamethylene isocyanurate, and ethoxylated / propoxylated tris(methacryloxyisocyanate)hexamethylene isocyanurate. In one embodiment of the present invention, ethoxylated trimethylolpropane triacrylate is used.

[0038] In the photosensitive resin film of the present invention, the amount of ethylenically unsaturated compound may be 0% to 70% by weight, based on the total weight of the photosensitive resin film. For example, the amount of ethylenically unsaturated compound may be 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, or 70%, or within the range of any two values ​​described herein, based on the total weight of the photosensitive resin film.

[0039] 1.3.3. Photopolymerization initiators Examples of photopolymerization initiators include, but are not limited to, imidazole compounds, ketone compounds, quinone compounds, benzoin or benzoin ether compounds, polyhalogenated compounds, triazine compounds, organic peroxide compounds, and onium salt compounds. The above photopolymerization initiators can be used alone or in combination of two or more. In one embodiment of the present invention, an onium salt compound is used. Examples of the onium salt compounds mentioned above include, but are not limited to, diaryliodonium salts and triarylsulfonium salts obtained from combinations of diphenyliodonium, 4,4'-dichlorodiphenyliodonium, 4,4'-dimethoxydiphenyliodonium, 4,4'-di-tert-butyldiphenyliodonium, 4-methyl-4'-isopropyldiphenyliodonium, or 3,3'-dinitrodiphenyliodonium with chlorides, bromides, tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, hexafluoroantimonate, tetrakis(pentafluorophenyl)borate, or trifluoromethanesulfonic acid.

[0040] In a photosensitive resin film, the amount of photopolymerization initiator may be 0.5% to 10% by weight, more particularly 1% to 5% by weight, based on the total weight of the photosensitive resin film. For example, the amount of photopolymerization initiator may be 0.5% by weight, 1% by weight, 1.5% by weight, 2% by weight, 2.5% by weight, 3% by weight, 3.5% by weight, 4% by weight, 4.5% by weight, 5% by weight, 5.5% by weight, 6% by weight, 6.5% by weight, 7% by weight, 7.5% by weight, 8% by weight, 8.5% by weight, 9% by weight, 9.5% by weight, or 10% by weight, or within the range of any two values ​​described herein.

[0041] 1.3.4. Additives A 355 / T and A w1Assuming that / T satisfies the above range, the photosensitive resin film of the present invention may further contain additives to improve the properties of the photosensitive resin film. Examples of additives include, but are not limited to, light absorbers, dyes, pigments, radical inhibitors, surfactants, reinforcing agents, and plasticizers. The above additives can be used individually or in combination of two or more. In one embodiment of the present invention, the photosensitive resin film may further contain a silane coupling agent, a light absorber, and a dye.

[0042] In a photosensitive resin film, the amount of additive is preferably less than 20% by weight, based on the total weight of the photosensitive resin film. For example, the amount of additive may be 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, or 19%, based on the total weight of the photosensitive resin film, or within the range of any two values ​​described herein.

[0043] 1.4. Preparation of photosensitive resin film The method for producing the photosensitive resin film of the present invention is not particularly limited. Those skilled in the art can produce the photosensitive resin film by referring to the description herein. For example, the components of the photosensitive resin film can be uniformly mixed using a stirrer and dissolved or dispersed in a solvent to prepare a resin composition. Then, this resin composition can be coated onto a substrate and dried to obtain a photosensitive resin film.

[0044] The method for coating the resin composition is not particularly limited, and existing coating methods commonly used in the field of the present invention can be used. Examples of existing coating methods include, but are not limited to, gravure coating, reverse roll coating, die coating, air scraper coating, scraper coating, rod coating, scraper rod coating, curtain coating, knife coating, transfer roll coating, extrusion press coating, dip coating, kiss coating, spray coating, calender coating, and extrusion coating.

[0045] A detailed method for producing the photosensitive resin film of the present invention is described in the following examples.

[0046] 2. Composite film Generally, a photosensitive resin film can be fitted with a protective film having protective and supportive functions on both sides of the photosensitive resin film before use. This facilitates the storage of the photosensitive resin film and protects it from contamination and damage. Therefore, the present invention also provides a composite film comprising the above-mentioned photosensitive resin film and a protective film on at least one side of the photosensitive resin film. In a preferred embodiment of the present invention, protective films are provided on both sides of the photosensitive resin film, and the materials of the protective films on the two different sides of the photosensitive resin film may be the same or different.

[0047] The type of protective film is not particularly limited and can be made from any conventional material known in the art. For example, protective films usable in the present invention can be selected from the group consisting of polyethylene terephthalate film (PET film), polyolefin film, and composite materials thereof. Examples of polyolefin films include, but are not limited to, polyethylene film (PE film), polypropylene film (PP film), and stretched polypropylene film. The composite material may be a composite material of polyethylene terephthalate film and polyolefin film, or a composite material of different polyolefin films. In a preferred embodiment of the present invention, the composite film includes a photosensitive resin film with PET film formed on both sides, or the composite film includes a PET film on one side of the photosensitive resin film and a PE film on the other side of the photosensitive resin film.

[0048] The method for producing the composite film of the present invention is not particularly limited, and existing methods commonly used in the field of the present invention can be used. For example, a composite film can be produced by forming a laminate by overlapping protective films on both sides of a photosensitive resin film, and then pressurizing this laminate to obtain a composite film. Alternatively, a composite film can be produced by coating a resin composition for forming a photosensitive resin film onto a first protective film, drying it to form a photosensitive resin film, and then laminating a second protective film onto the side of the photosensitive resin film that is not in contact with the first protective film. Alternatively, a composite film can be produced by extruding a resin composition for forming a photosensitive resin film between two protective films at a certain interval, drying it, and forming a photosensitive resin film between the two protective films.

[0049] 3. Package structure The cured photosensitive resin film of the present invention can be used as a packaging material for fabricating a package structure for semiconductor elements. Accordingly, the present invention further provides a package structure comprising a substrate, a semiconductor element electrically connected to the substrate, and a package for encapsulating the semiconductor element, wherein the packaging material includes the cured photosensitive resin film.

[0050] The type and function of the semiconductor element described above are not particularly limited. In one embodiment of the present invention, the semiconductor element is an image sensor chip, and the image sensor chip may have a photosensitive area. When the semiconductor element is an image sensor chip, the package material may include, for example, a first part formed from a cured product of the photosensitive resin film described above and a second part formed from a transparent material, the first part surrounding the image sensor chip from the side, the second part positioned above the photosensitive area, and the first part may be directly connected to the second part or connected to the second part via an intermediary to form the package. Alternatively, the first part may be directly connected to a substrate or connected to a substrate via an intermediary.

[0051] 4. Examples 4.1. Test Method

[0052] [Thickness of the photosensitive resin film] The composite film containing the fabricated photosensitive resin film is cut to a size of 5 cm x 3 cm, and the protective films on both sides of the photosensitive resin film are peeled off. The resulting photosensitive resin film is placed on the base (MS-11C base) of a film thickness gauge (model: Nikon Digimicro MFC-101 + MS-11C, manufactured by Nikon), and measured under a pressure of 140 gf using the MFC-101 meter. The thickness of 10 different points on the photosensitive resin film is measured, and the average value is calculated.

[0053] [Absorbance of photosensitive resin film] The composite film containing the fabricated photosensitive resin film is cut to a size of 5 cm x 3 cm, and the protective films on both sides of the photosensitive resin film are removed. The absorbance of the obtained photosensitive resin film is measured using a UV-Vis spectrophotometer (model: Shimadzu UV-1601, manufactured by Shimadzu) in the following manner. The photosensitive resin film is positioned perpendicular to the direction of light incidence and analyzed to obtain the absorbance spectrum under the following conditions: the diffraction grating is configured as an optical splitter, the test temperature is 25°C, the test pressure is 1 atm, the analysis mode is absorbance, the scanning wavelength range is 190 nm to 1100 nm, the blank sample is air, the scanning speed is 2200 nm / min, the switch wavelength for switching the light source from a deuterium lamp to a tungsten lamp is 340.8 nm, the sampling interval is 0.2 nm, the slit width is 2.0 nm, and Shimadzu UV Probe V1.11 software is used.

[0054] [Film Tensile Strength] The composite film containing the prepared photosensitive resin film is cut to a size of 10 cm x 10 cm, and the PET protective film is cut transversely (TD) to a width of 50 mm. This composite film is fixed to the stage of a tensile testing machine (model: FM-50N, manufactured by YOTEC) with double-sided tape. The cut 50 mm wide PET protective film is peeled off, tape is applied to the inside of the PET protective film (i.e., the side facing the photosensitive resin film), and it is fixed to the tensile axis of the tensile testing machine so that the tensile direction is perpendicular to the stage. The stage is moved transversely and toward the inside of the peeled PET protective film at a speed of 70 mm / min, and the force required to tear the PET protective film by 2 cm is measured as the film tensile strength. The unit of film tensile strength is g / 50 mm.

[0055] [Cross-sectional shape of photoresist pattern] A 2mm thick low-alkali glass is preheated in a batch oven at 80°C for 10 minutes, and the surface temperature is maintained at 50°C before lamination. The prepared photosensitive resin film is placed on the low-alkali glass and pressurized using a laminating machine (model: CSL-M25E, manufactured by C SUN). The laminating machine temperature and pressure are set to 80°C and 3 kg / cm², respectively.2 The lamination speed is 2.0 m / min. After lamination is complete, remove any excess film and allow the resulting photosensitive resin film to cool to room temperature for 15 minutes.

[0056] Next, the photosensitive resin film is exposed using an exposure device (model: Contact Aligner, manufactured by Deya Optronic). The wavelength of the exposure light source is 365 nm (i-line). The exposure energy is 300 mJ / cm². 2 Continue exposure until the desired result is reached. The aspect ratio of the photoresist pattern to be formed is 2.0, and the ratio of linear space width to photoresist width of the graphic dimensions is 1:1. After exposure is complete, bake the exposed photosensitive resin film at 70°C for 5 minutes.

[0057] Next, the exposed photosensitive resin film is developed under the following conditions to obtain a developed photosensitive resin film. These conditions involve using propylene glycol methyl ether acetate (PGMEA) as the developer, setting the solution temperature to 24°C to 26°C, and immersion time during development to 5 minutes.

[0058] Using a glass cutter, the developed photosensitive resin film is cut along the outer edge of the linear space with low-alkali glass, and the cross-sectional shape of the photoresist pattern is observed using a scanning electron microscope. The test specimen is tilted at 75 degrees, and a magnification of 200x is used. The upper width is obtained as follows: A random section of the photoresist cross-section is selected, and the width of the photoresist is measured from the upper edge (the side away from the low-alkali glass) at positions that represent 1 / 25, 2 / 25, 3 / 25, 4 / 25, and 5 / 25 of the total thickness of the photoresist. The average of these five measurements is obtained as the upper width. Similarly, the lower width is obtained as follows: A random section of the photoresist cross-section is selected, and the width of the photoresist is measured from the lower edge (the side in contact with the low-alkali glass) at positions that represent 1 / 25, 2 / 25, 3 / 25, 4 / 25, and 5 / 25 of the total thickness of the photoresist. The average of these five measurements is obtained as the lower width. If the value of "|(top width - bottom width)| / thickness" is less than 0.04, it is recorded as "rectangular," meaning the cross-sectional shape of the photoresist pattern is good. If the value of "|(top width - bottom width)| / thickness" is 0.04 or greater, it is recorded as "trapezoidal," meaning the cross-sectional shape of the photoresist pattern is poor. In the formula, "|(top width - bottom width)|" is taken as its absolute value.

[0059] [Footing length of photoresist pattern] The developed photosensitive resin film is prepared in the same manner as described in [Cross-sectional shape of photoresist pattern] above. Next, the developed photosensitive resin film is cut along with the low-alkali glass at the outer edge of the linear space using a glass cutter, and the cross-sectional shape of the photoresist pattern is observed using a scanning electron microscope with the test piece tilted at 75 degrees and at a magnification of 5000x. The fitting length is obtained by randomly selecting the cross-section of the photoresist and selecting the side where the bottom protrudes more toward the linear space. Specifically, a reference point is taken at the position of the photoresist sidewall, which is 1 / 5 of the total thickness of the photoresist, from the bottom edge of the photoresist. A reference line perpendicular to the low-alkali glass surface is extended downward from this reference point, and the length from the intersection of this reference line and the low-alkali glass surface to the intersection of the photoresist sidewall and the low-alkali glass surface is calculated as the fitting length.

[0060] [Light transmittance] The composite film containing the fabricated photosensitive resin film is cut to a size of 5 cm x 3 cm, and the protective films on both sides of the photosensitive resin film are removed. The light transmittance of the photosensitive resin film is measured using a UV-Vis spectrophotometer (model: Shimadzu UV-1601, manufactured by Shimadzu) in the following manner: The photosensitive resin film is placed on the analysis stage using a fixture, perpendicular to the direction of the incident light source, and the light transmittance at a wavelength of 550 nm (T) is measured. 550nm The following conditions are used to measure the following: the analysis mode is transmittance, the scanning wavelength range is 190 nm to 1100 nm, the blank sample is air, the scanning speed is 2200 nm / min, the switch wavelength for switching the light source from a deuterium lamp to a tungsten lamp is 340.8 nm, and the sampling interval is 0.2 nm.

[0061] [Silicone adhesion test] A 2mm thick low-alkali glass is preheated in a batch oven at 80°C for 10 minutes, and the surface temperature is maintained at 50°C before lamination. The prepared photosensitive resin film is placed on the low-alkali glass and laminated using a laminating machine (model: CSL-M25E, manufactured by C SUN Corporation) at a temperature of 80°C and a pressure of 3 kg / cm². 2 Then, apply pressure at a lamination speed of 2.0 m / min. After lamination is complete, remove any excess film and allow the resulting photosensitive resin film to cool to room temperature for 15 minutes.

[0062] Next, the photosensitive resin film is exposed using an exposure device (model: Contact Aligner, manufactured by Deya Optronic). The wavelength of the exposure light source is 365 nm (i-line). The exposure energy is 300 mJ / cm². 2 Continue exposure until the desired result is reached. After exposure is complete, bake the exposed photosensitive resin film at 70°C for 5 minutes.

[0063] Next, the exposed photosensitive resin film is developed under the following conditions to obtain a developed photosensitive resin film without a pattern. These conditions involve using propylene glycol methyl ether acetate (PGMEA) as the developer, setting the solution temperature to 24°C to 26°C, and immersion time during development to 5 minutes.

[0064] 3mm 2 Place the bare Si substrate on the side of the photosensitive resin film that is not in contact with the low-alkali glass, and heat at 130°C for 5 minutes at 3 kgf / cm². 2 The adhesive is bonded by applying pressure. Then, a tensile testing machine is used to measure the force required to peel off the bare Si substrate. In the test, the direction of force application is parallel to the interface between the bare Si substrate and the photosensitive resin film. The force acts directly on the bare Si substrate, and the point of application of the specific force is located at the height of the center of the side wall of the bare Si substrate perpendicular to the photosensitive resin film. The unit of adhesive strength is kgf / 3mm 2 That is the case.

[0065] 4.2. Preparation of photosensitive resin film Information regarding the raw materials used in the following examples and comparative examples is shown in Table 1 below.

[0066] [Table 1]

[0067] [Example 1] The following components were mixed and stirred for 5 hours to obtain the resin composition of Example 1. The components were 90 parts by weight of BNE200 epoxy resin, 10 parts by weight of BE507 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of Solvent Blue, and 12 parts by weight of tetrahydrofuran.

[0068] The resin composition of Example 1 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Example 1. The coating and drying conditions were as follows: a coating thickness of 160 μm, a drying temperature of 100°C, a drying time of 20 minutes, and a thickness of 120 μm after drying.

[0069] [Example 2] The following components were mixed and stirred for 5 hours until homogeneous to obtain the resin composition of Example 2. The components were 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of CNE200ELA epoxy resin, 30 parts by weight of acetone, 1.8 parts by weight of triphenylsulfonium tetrakis(pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, 1.2 parts by weight of Oil Blue, and 12 parts by weight of tetrahydrofuran.

[0070] The resin composition of Example 2 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Example 2. The coating and drying conditions were as follows: a coating thickness of 25 μm, a drying temperature of 100°C, a drying time of 15 minutes, and a thickness of 20 μm after drying.

[0071] [Example 3] The following components were mixed and stirred for 5 hours to obtain the resin composition of Example 3. The components were 30 parts by weight of BNE200 epoxy resin, 20 parts by weight of BE507 epoxy resin, 50 parts by weight of PNE177 epoxy resin, 35 parts by weight of acetone, 4 parts by weight of triphenylsulfonium tetrakis(pentafluorophenyl)borate, 5 parts by weight of KBE-403 silane coupling agent, 0.5 parts by weight of Solvent Blue, and 12 parts by weight of tetrahydrofuran.

[0072] The resin composition of Example 3 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Example 3. The coating and drying conditions were as follows: a coating thickness of 85 μm, a drying temperature of 90°C, a drying time of 19 minutes, and a thickness of 60 μm after drying.

[0073] [Example 4] The following components were mixed and stirred for 5 hours to obtain the resin composition of Example 4. The components were 75 parts by weight of BNE200 epoxy resin, 10 parts by weight of BE507 epoxy resin, 5 parts by weight of BNE220 epoxy resin, 10 parts by weight of 3EO TMPTA (ethylenically unsaturated compound), 25 parts by weight of acetone, 4 parts by weight of triarylsulfonium tetrakis(pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, 0.5 parts by weight of Oil Blue, and 15 parts by weight of tetrahydrofuran.

[0074] The resin composition of Example 4 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Example 4. The coating and drying conditions were as follows: a coating thickness of 275 μm, a drying temperature of 95°C, a drying time of 30 minutes, and a thickness of 200 μm after drying.

[0075] [Example 5] The following components were mixed and stirred for 5 hours to obtain the resin composition of Example 5. The components were 20 parts by weight of BNE200 epoxy resin, 20 parts by weight of BE507 epoxy resin, 20 parts by weight of PNE177 epoxy resin, 20 parts by weight of BNE220 epoxy resin, 10 parts by weight of Celloxide 2021P epoxy resin, 10 parts by weight of TCM201 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of Solvent Blue, and 12 parts by weight of tetrahydrofuran.

[0076] The resin composition of Example 5 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Example 5. The coating and drying conditions were as follows: a coating thickness of 130 μm, a drying temperature of 100°C, a drying time of 20 minutes, and a thickness of 100 μm after drying.

[0077] [Example 6] The following components were mixed and stirred for 5 hours to obtain the resin composition of Example 6. The components were 50 parts by weight of BNE200 epoxy resin, 40 parts by weight of BE507 epoxy resin, 10 parts by weight of BNE220 epoxy resin, 25 parts by weight of acetone, 1.5 parts by weight of triphenylsulfonium hexafluoroantimonate, 0.5 parts by weight of triarylsulfonium tetrakis(pentafluorophenyl)borate, 4 parts by weight of KBE-403 silane coupling agent, 0.3 parts by weight of Solvent Blue, 0.05 parts by weight of Solvent Yellow, and 12 parts by weight of tetrahydrofuran.

[0078] The resin composition of Example 6 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Example 6. The coating and drying conditions were as follows: a coating thickness of 130 μm, a drying temperature of 90°C, a drying time of 25 minutes, and a thickness of 100 μm after drying.

[0079] [Comparative Example 1] The following components were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 1. The components were 100 parts by weight of Celloxide 2021P epoxy resin, 25 parts by weight of acetone, 0.3 parts by weight of triphenylsulfonium hexafluoroantimonate, 2 parts by weight of SI-45, 5 parts by weight of KBE-403 silane coupling agent, 0.3 parts by weight of Solvent Blue, and 12 parts by weight of tetrahydrofuran.

[0080] The resin composition of Comparative Example 1 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Comparative Example 1. The coating and drying conditions were as follows: a coating thickness of 130 μm, a drying temperature of 100°C, a drying time of 20 minutes, and a thickness of 100 μm after drying.

[0081] [Comparative Example 2] The following components were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 2. The components were 90 parts by weight of BNE220 epoxy resin, 10 parts by weight of TCM201 epoxy resin, 25 parts by weight of acetone, 1 part by weight of triphenylsulfonium tetrakis(pentafluorophenyl) borate, 4 parts by weight of triarylsulfonium tetrakis(pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, and 12 parts by weight of tetrahydrofuran.

[0082] The resin composition of Comparative Example 2 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Comparative Example 2. The coating and drying conditions were as follows: a coating thickness of 85 μm, a drying temperature of 90°C, a drying time of 19 minutes, and a thickness of 60 μm after drying.

[0083] [Comparative Example 3] The following components were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 3. The components were 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of CNE200ELA epoxy resin, 30 parts by weight of acetone, 4 parts by weight of triphenylsulfonium tetrakis(pentafluorophenyl)borate, 5 parts by weight of KBE-403 silane coupling agent, 0.06 parts by weight of Solvent Black, and 15 parts by weight of tetrahydrofuran.

[0084] The resin composition of Comparative Example 3 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Comparative Example 3. The coating and drying conditions were as follows: a coating thickness of 160 μm, a drying temperature of 100°C, a drying time of 15 minutes, and a thickness of 120 μm after drying.

[0085] [Comparative Example 4] The following components were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 4. The components were 30 parts by weight of BNE200 epoxy resin, 20 parts by weight of BE507 epoxy resin, 50 parts by weight of PNE177 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 0.3 parts by weight of diphenyliodonium tetrakis(pentafluorophenyl)borate, 5 parts by weight of KBE-403 silane coupling agent, 0.05 parts by weight of Solvent Blue, and 12 parts by weight of tetrahydrofuran.

[0086] The resin composition of Comparative Example 4 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was superimposed on the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Comparative Example 4. The coating and drying conditions were as follows: a coating thickness of 160 μm, a drying temperature of 100°C, a drying time of 20 minutes, and a thickness of 120 μm after drying.

[0087] [Comparative Example 5] The following components were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 5. The components were 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of CNE200ELA epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of Reactive Yellow, 0.01 parts by weight of Solvent Black, and 15 parts by weight of tetrahydrofuran.

[0088] The resin composition of Comparative Example 5 was coated onto a PET film, which served as a protective film, using a Kodaira winding rod, and the coated resin composition was dried in an oven. Subsequently, a PE film, which served as a protective film, was placed over the surface of the dried resin composition to obtain a photosensitive resin film (i.e., a composite film) wrapped with the protective film of Comparative Example 5. The coating and drying conditions were as follows: a coating thickness of 140 μm, a drying temperature of 95°C, a drying time of 20 minutes, and a thickness of 100 μm after drying.

[0089] 4.3. Testing of photosensitive resin films Example 1~ 6 (E1~E 6 The properties of the photosensitive resin films of ) and Comparative Examples 1-5 (CE1-CE5) were tested according to the test method described above. The results are shown in Tables 2-1 and 2-2.

[0090] [Table 2-1]

[0091] [Table 2-2]

[0092] As shown in Tables 2-1 and 2-2, Examples 1 to 2 of the present invention 6 The photoresist pattern formed after exposure and development of the photosensitive resin film has an excellent cross-sectional shape (rectangular cross-section, short fitting length) and low light transmittance (wavelength 550 nanometers). Examples 1- 6 Furthermore, it has been shown that if the tensile strength of the photosensitive resin film is greater than 2, the silicone adhesion of the photosensitive resin film can be further improved.

[0093] In contrast, the photoresist patterns formed after exposure and development of the photosensitive resin films of Comparative Examples 1 to 5 cannot simultaneously have a good cross-sectional shape and low light transmittance. Comparative Examples 1 and 3 are A 355 The cross-sectional shape of the photoresist pattern is poor when / T is lower or higher than the specified range of the present invention. Comparative Examples 2 and 4 show that the spectrum does not have at least one point in the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, or in the first wavelength range, A w1 When / T is smaller than the specified range of the present invention, the photoresist pattern has a poor cross-sectional shape, high light transmittance, and a glare problem occurs when applied to the packaging of an image sensor chip. Comparative Example 5 shows that the spectrum does not have at least one point in the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and the absorbance in the second wavelength range is A w2 If the condition / T ≤ 0.003 is not met, the photoresist pattern will have a poor cross-sectional shape, resulting in high light transmittance and causing glare problems when applied to the packaging of an image sensor chip.

[0094] The above embodiments are used to illustrate the principles and effectiveness of the present invention and to demonstrate its features, and do not limit the scope of the invention. Those skilled in the art can make various modifications and substitutions based on the disclosed and suggested aspects of the invention. Therefore, the scope of protection of the present invention is defined in the appended claims.

Claims

1. A photosensitive resin film having a thickness T (μm), when the photosensitive resin film is characterized by ultraviolet-visible spectroscopy, the obtained spectrum is the absorbance A at 355 nm. ３５５ It has and 0.003 < A ３５５ / T ≤ 0.03, The spectrum has at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and each of these points is independently A ｗ１ / T value, where w1 represents the corresponding wavelength of the point, A ｗ１ represents the corresponding absorbance, and 0.003 ≤ A ｗ１ / T and A photosensitive resin film in which the first wavelength range is greater than 450 nm and less than or equal to 780 nm, and the thickness T is in the range of 20 μm to 200 μm.

2. 0.003 ≤ A ｗ１ A photosensitive resin film according to claim 1, wherein / T ≤ 0.

08.

3. The ultraviolet-visible spectroscopy is performed using an ultraviolet-visible spectrophotometer under the following conditions, wherein the photosensitive resin film is positioned perpendicular to the direction of incident light, the diffraction grating is configured as an optical splitter, the test temperature is 25°C, the test pressure is 1 atm, the analysis mode is absorbance, the scanning wavelength range is 190 nm to 1100 nm, the blank sample is air, the scanning speed is 2200 nm / min, the switch wavelength at which the light source switches from a deuterium lamp to a tungsten lamp is 340.8 nm, the sampling interval is 0.2 nm, and the slit width is 2.0 nm, as described in claim 1.

4. The spectrum above is the absorbance A at 450 nm. ４５０ It has 0 < A ４５０ A photosensitive resin film according to claim 1, wherein T ≤ 0.

003.

5. The photosensitive resin film according to claim 1, wherein the first wavelength range is greater than 480 nm and less than or equal to 730 nm.

6. The absorbance of the spectrum at each wavelength within the second wavelength range is independently A ｗ２ and is represented as such, where w2 represents the wavelength of the corresponding absorbance, 0 ≦ A ｗ２ / T ≦ 0.003, and the second wavelength range is 440 nm to 470 nm. The photosensitive resin film according to claim 5

7. A photosensitive resin film according to any one of claims 1 to 6, which is a negative-type dry film.

8. A photosensitive resin film according to any one of claims 1 to 6, comprising an epoxy resin.

9. A composite film comprising a photosensitive resin film according to any one of claims 1 to 6, and a protective film on at least one surface of the photosensitive resin film.

10. base material, A semiconductor element electrically connected to the substrate, and Includes a package for encapsulating the aforementioned semiconductor element, The package structure comprises a cured product of a photosensitive resin film according to any one of claims 1 to 6.

11. The semiconductor element is an image sensor chip, and the image sensor chip has a photosensitive area, and The package structure according to claim 10, wherein the material of the package comprises a first portion formed from a cured photosensitive resin film according to any one of claims 1 to 6, and a second portion formed from a transparent material, wherein the first portion surrounds the image sensor chip from the side, and the second portion is positioned above the photosensitive area.

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