Adhesive sheet for fixing polishing pad, adhesive sheet for fixing polishing pad with release sheet, polishing pad with adhesive layer A, polishing pad with release sheet and adhesive layer A, and method for fixing polishing pad to a surface plate.

Abstract

A double-sided adhesive sheet for fixing a polishing pad for high-precision CMP processing, which has an excellent sticking feeling like adsorption, is easy to adjust the re-sticking position, has excellent air permeability, and also has excellent adhesive physical properties, and provides a double-sided adhesive sheet for fixing a polishing pad to a surface plate. 【Solution means】 Adhesive layer A and adhesive layer B are provided on each surface of the sheet-like base material. With respect to the adhesive layer A, when a predetermined probe is approached and contacted at a speed of 0.01 mm / second and peeled off at the same speed, the probe tack value (1) When a load of 0.5 N is applied, contacted for 1 second, and peeled off, the probe tack value PT(0.5,1) is 0.5 N / cm 2 ~2.5 N / cm 2 and (2) When a load of 3.0 N is applied, contacted for 1 second, and peeled off, the probe tack value PT (3.0,1) is 5 N / cm 2 ~11 N / cm 2 and (3) The value obtained by dividing the PT(3.0,1) by the PT(0.5,1) is 4 or more, and it is a double-sided adhesive sheet for fixing a polishing pad.

Description

[Technical Field]

[0001] The present invention relates to an adhesive sheet for fixing a polishing pad to a surface plate. The present invention also relates to an adhesive sheet with a release sheet, wherein the adhesive layer for fixing the polishing pad to the surface plate is covered with a release sheet. Furthermore, the present invention relates to a polishing pad with an adhesive layer, having a specific adhesive layer and a polishing pad. The present invention also relates to a release sheet and a polishing pad with an adhesive layer, having a release sheet, a specific adhesive layer, and a polishing pad. Finally, the present invention relates to a method for fixing a polishing pad to a surface plate via a specific adhesive layer. [Background technology]

[0002] In recent years, semiconductor development has demanded higher integration and higher quality, and the wafers used as materials also require higher polishing precision. Beyond simple abrasive drilling, there are methods such as CMP (Chemical Mechanical Polishing) that utilize chemical reactions to alter only the surface for polishing. Even within CMP, development is progressing to obtain even smoother polished surfaces than before. When attaching the polishing pad to the surface plate, a double-sided adhesive sheet is used. Specifically, one side of the double-sided adhesive sheet is attached to one side of the polishing pad (the side opposite to the side to be polished), a polishing pad with a single-sided adhesive layer is prepared in advance, and the adhesive layer of the polishing pad with the single-sided adhesive layer is attached to the surface plate.

[0003] Various types of adhesive sheets have been proposed for fixing polishing pads (e.g., Patent Documents 1-3). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2011-122069 [Patent Document 2] Japanese Patent Publication No. 2011-168714 [Patent Document 3] Japanese Patent Publication No. 2012-057135 [Overview of the project] [Problems that the invention aims to solve]

[0005] Polishing pads are required in various forms depending on the polishing stage, and those used for the final finishing stage, in particular, are increasingly complex in structure, with multiple layers of varying hardness and thickness. The more complex the structure of the polishing pad, the more difficult it becomes to attach it to the polishing plate. When attaching a highly multi-layered, thick, single-sided adhesive polishing pad to a surface plate, it is often necessary to temporarily attach it, check the position, peel it off, and reattach it to adjust the position. The polishing pads are attached to the surface plate by hand, not by machine. Ideally, the pads should have moderate tackiness during positioning, a smooth, almost adhesive feel (i.e., minimal gaps between the adhesive layer and the surface plate, and any gaps that do form naturally disappear), and excellent adhesive strength after attachment. From a productivity standpoint, it is desirable that the repositioning of the pad be done as quickly and in as few instances as possible. In terms of ease of repositioning, using an adhesive layer with low tack strength is effective. However, the adhesive layer used to fix the polishing pad to the surface plate requires strong tackiness and cohesive force (holding force) that can withstand polishing sufficiently.

[0006] Furthermore, even if a polishing pad with an adhesive layer on one side could be quickly and temporarily fixed to the target position on the surface plate, there was a problem of air trapped between the surface plate and the adhesive layer when the polishing pad was firmly fixed to the surface plate using rollers or a press. If air trapped between the surface plate and the adhesive layer remained locally, the parallelism between the outermost surface of the polishing pad and the surface plate would be impaired, making it impossible to polish the object to be polished with high precision and smoothness, thus affecting the polishing accuracy. One possible method to suppress air entrapment is to create grooves on the surface of the adhesive layer that contacts the surface plate, which serve as air passages. However, even with air passages, when the polishing pad is firmly fixed to the surface plate, the air passages can be blocked by the soft adhesive layer, making it impossible to completely eliminate the voids. If it takes a long time for the air to escape, it can slow down the semiconductor production speed.

[0007] The adhesive layer of the adhesive sheet that makes up the double-sided adhesive sheet used to fix the polishing pad to the surface plate requires strong adhesive strength, cohesive force (holding force) that can withstand the shear force applied during the polishing process, and chemical resistance such as resistance to strong alkalis and strong acids to the polishing liquid used during polishing.

[0008] The present invention has been made in view of the above background, and aims to provide a double-sided adhesive sheet for fixing polishing pads to a surface plate for high-precision CMP processing, which has excellent adhesive properties such as a sticky feel, is easy to reposition, has excellent air release properties, and has excellent adhesive properties. [Means for solving the problem]

[0009] The present invention solves the above problem by setting the probe tack value of the adhesive layer attached to the surface plate within a predetermined range. That is, the present invention relates to the following [1] to

[14] .

[0010] [1] The present invention provides a sheet-like substrate with adhesive layer A and adhesive layer B on each surface, The present invention relates to an adhesive sheet for fixing a polishing pad, wherein the probe tack value when a 5 mm diameter stainless steel cylindrical probe is brought close to the adhesive layer A at a speed of 0.01 mm / second, made contact with it, and then peeled off at the same speed satisfies the following conditions (1) to (3). (1) Apply a load of 0.5 N, keep in contact for 1 second, and when peeled off, the probe tack value PT(0.5,1) is 0.5 N / cm. 2 ~2.5 N / cm 2 That is the case. (2) Apply a load of 3.0 N, contact for 1 second, and the probe tack value PT when peeling off. (3.0, 1) is 5 N / cm 2 ~11 N / cm 2 It is. (3) The value obtained by dividing the probe tack value PT(3.0, 1) by the probe tack value PT(0.5, 1) is 4 or more.

[0011] [2] In the present invention, with respect to the adhesive layer A, a stainless steel cylindrical probe with a diameter of 5 mm is brought closer at a speed of 0.01 mm / second, a load of 0.5 N is applied, and it is contacted for 10 seconds, 30 seconds, and 60 seconds respectively, and when peeling off at the same speed, the probe tack values are PT(0.5, 10), PT(0.5, 30), and PT(0.5, 60) respectively. The present invention relates to the adhesive sheet for fixing a polishing pad according to [1] above, which satisfies the following conditions (4) and (5). (4) The value obtained by dividing the probe tack value PT(0.5, 30) by the probe tack value PT(0.5, 10) is 1 to 1.4. (5) The value obtained by dividing the probe tack value PT(0.5, 60) by the probe tack value PT(0.5, 10) is 1 to 1.6.

[0012] [3] In the present invention, the surface of the adhesive layer A that is not in contact with the sheet-like base material has irregularities, and the average height Rc of the surface irregularities of the adhesive layer A is 10 to 40 μm. The present invention relates to the adhesive sheet for fixing a polishing pad according to [1 or [2] above.

[0013] [4] In the present invention, the cut-off level difference Rδc of the contour curve of the surface irregularities of the adhesive layer A is 5 to 25 μm, and the kurtosis Rku is less than 3. The present invention relates to the adhesive sheet for fixing a polishing pad according to any one of [1] to [3] above.

[0014] [5] In the present invention, the shape of the convex portion on the surface of the adhesive layer A in plan view is irregular and amorphous. The present invention relates to the adhesive sheet for fixing a polishing pad according to any one of [1] to [4] above.

[0015] [6] The present invention relates to an adhesive sheet for fixing a polishing pad according to any one of [1] to [5] above, characterized in that the adhesive layer A is an acrylic adhesive layer.

[0016] [7] The present invention is an adhesive sheet for fixing a polishing pad with a release sheet FA, comprising an adhesive sheet for fixing a polishing pad as described in any of [1] to [6] above, and a release sheet FA, The surface of adhesive layer A is in contact with the release surface of release sheet FA. This invention relates to an adhesive sheet for fixing a polishing pad with a release sheet FA, characterized in that the material of the release sheet FA is a plastic film that does not contain paper.

[0017] [8] The present invention comprises an adhesive sheet for fixing a polishing pad with a release sheet FA as described in [7] above, and a release sheet FB, The release sheet FB is in contact with the side of the adhesive layer B that is not in contact with the sheet-like substrate. The present invention relates to a release sheet FA and an adhesive sheet for fixing a polishing pad with a release sheet FB, characterized in that the material of the release sheet FB is a plastic film that does not contain paper.

[0018] [9] The present invention relates to an adhesive sheet for fixing a polishing pad with a release sheet FA as described in [7] above, which is wound in a roll shape and has a length in the width direction of the wound body of 1000 mm or less.

[0019]

[10] The present invention relates to an adhesive sheet for fixing a polishing pad, which is wound in a roll shape and has a length in the width direction of the wound body of 1000 mm or less, with a release sheet FA and a release sheet FB as described in [8] above.

[0020]

[11] The present invention relates to an adhesive sheet for fixing a polishing pad with the release sheet FA and release sheet FB described in [8] above, wherein the length of the short side is 1000 mm or less.

[0021]

[12] The present invention relates to an adhesive polishing pad comprising a polishing pad and an adhesive sheet for fixing the polishing pad as described in any of [1] to [6] above, This relates to an abrasive pad with an adhesive layer A, in which the abrasive pad and adhesive layer B are in contact.

[0022]

[13] The present invention relates to an adhesive polishing pad comprising a polishing pad and an adhesive sheet for fixing the polishing pad with the release sheet FA described in [7] above, This invention relates to a polishing pad with a release sheet FA and an adhesive layer A, wherein the polishing pad and the adhesive layer B are in contact.

[0023]

[14] The present invention relates to a method for peeling off the release sheet FA from the polishing pad with the release sheet FA and adhesive layer A described in

[13] above, and fixing the polishing pad to a surface plate via the adhesive layer A. [Effects of the Invention]

[0024] According to the present invention, it is possible to easily reposition the adhesive and achieve a comfortable, adhesive feel, and air We can provide a double-sided adhesive sheet for fixing polishing pads to a surface plate that offers excellent release properties, as well as superior adhesive properties and chemical resistance to strong alkalis and acids. The adhesive sheet for fixing polishing pads of the present invention can improve workability during application and significantly improve polishing accuracy in high-precision CMP processing. Furthermore, even after polishing, when the polishing pad is peeled off the surface plate, the adhesive layer of the adhesive sheet for fixing polishing pads of the present invention is less likely to remain on the surface plate. [Brief explanation of the drawing]

[0025] [Figure 1] An embodiment of an adhesive sheet for fixing a polishing pad, and a schematic cross-sectional view showing its usage. [Figure 2] An illustrative diagram to explain the surface irregularities (cross-section) of adhesive layer A. [Figure 3] An illustrative diagram to explain the surface irregularities (cross-section) of adhesive layer A. [Figure 4] An example image illustrating the surface irregularities of adhesive layer A. [Figure 5] An illustrative diagram to explain the surface irregularities (plan view) of adhesive layer A. [Figure 6] An example of a manufacturing method for an adhesive sheet for fixing polishing pads, and a schematic cross-sectional diagram showing the usage form of the adhesive sheet for fixing polishing pads. [Figure 7] A schematic diagram illustrating a method for evaluating the ease of bonding. [Figure 8] A schematic diagram illustrating the method for evaluating air leakage performance. [Modes for carrying out the invention]

[0026] The following describes an example of an embodiment to which the present invention is applied. In this specification, the numerical values ​​"A to B" refer to values ​​between A and B.

[0027] <Adhesive sheet for fixing polishing pads> The adhesive sheet 1 for fixing polishing pads of the present invention (hereinafter also referred to as the adhesive sheet) has adhesive layers A and B on both sides of a sheet-like substrate F, as shown in Figure 1-1. The surface of adhesive layer A (the side not in contact with the sheet-like substrate F) has a specific probe tack value. To protect the surface of adhesive layer A, the surface of adhesive layer A is covered with the release surface of release sheet FA, and is provided as an adhesive sheet 2 for fixing a polishing pad with release sheet FA. The adhesive sheet 2 for fixing a polishing pad with release sheet FA has two forms: one in which the surface of adhesive layer B (the surface not in contact with the sheet-like substrate F) is covered with release sheet FB, as shown in Figure 1-2, and another in which there is no release sheet FB covering the surface of adhesive layer B, as shown in Figure 1-3. In the form shown in Figure 1-3, as shown in Figure 1-3', the adhesive sheet 2 for fixing a polishing pad with release sheet FA is wrapped around a cylindrical member called a core (also called a core material), and the surface of adhesive layer B is covered with the other surface of release sheet FA (the surface not in contact with adhesive layer A). As shown in Figure 1-4, the adhesive layer B of the adhesive sheet 2 for fixing the polishing pad with a release sheet FA is pre-laminated with the polishing pad PP, forming the polishing pad 4 with the release sheet FA and adhesive layer A. Next, the release sheet FA is peeled off to expose the adhesive layer A, and the polishing pad 3 with adhesive layer A is attached to the surface plate SP. The adhesive layer A of the adhesive sheet 1 for fixing the polishing pad is in contact with the surface plate, and the adhesive layer B is in contact with the polishing pad. In other words, the polishing pad PP is fixed to the surface plate SP via an adhesive sheet 1 having a laminated structure consisting of adhesive layer A / sheet-like substrate F / adhesive layer B.

[0028] When attaching the polishing pad PP to the surface plate via the adhesive sheet 1, in most cases until now, the surface of the polishing pad PP has been slowly rubbed from the edge with a roll or squeegee while slightly bending and flexing the pad PP, pushing out the air from the edge as it is attached. When attaching the adhesive layer A to the surface plate, if the adhesive sheet wrinkles or uneven force is applied to the adhesive sheet, a large localized air pocket will occur between the surface plate SP and the adhesive layer A. By the way, recently, polishing pads made of PP (polypropylene) tend to become thicker, extremely hard, or extremely soft. Polishing pads made of PP that have become thicker or extremely hard. Because P is too rigid, it cannot be bent in the same way as conventional materials, making it impossible to adequately apply the grinding rolls or squeegees to the surface of the polishing pad PP. On the other hand, extremely softened PP polishing pads are prone to bending and flexing, making it difficult to maintain a flexible state when working the surface of the polishing pad with a roll or squeegee. In either case, it is not possible to quickly push out the air at the bonding interface or to smooth the entire interface, resulting in the tendency for large localized air pockets to remain. Furthermore, when the surface of the polishing pad PP is rubbed with a roll or squeegee, localized pressure is applied to the surface of the polishing pad PP. Although the pressure is applied sequentially across the entire surface of the polishing pad, there is a requirement to avoid applying too much force to the surface of the polishing pad PP, as it is the surface that will come into contact with the object to be polished.

[0029] <Probe tack value> The surface of the adhesive layer A in the adhesive sheet of the present invention (the surface to be in contact with the surface plate SP) has a specific probe tack value. The probe tack value is the tack (momentary adhesive force) generated when a cylindrical probe is brought into short-term contact with the test object and peeled off. In the present invention, when measuring the probe tack value, a tack tester T-500 manufactured by UBM is used, and the jig for fixing the adhesive sheet, the probe temperature, and the measurement environment temperature are set to 23°C. The probe is made of stainless steel with a diameter of 5 mm, and the average height Rc of the surface to be in contact with the test object is 0.5 μm or less. Also, when the probe approaches the test object and is peeled off after contact, the probe speed is 0.01 mm / second is set.

[0030] It is important that one adhesive layer A in the adhesive sheet of the present invention satisfies all of the following conditions (1) to (3). (1) A load of 0.5 N is applied, contact is made for 1 second, and the probe tack value PT(0.5,1) when peeled off is 0.5 N / cm 2 ~2.5 N / cm 2 is. (2) A load of 3.0 N is applied, contact is made for 1 second, and the probe tack value PT (3.0,1) is 5 N / cm 2 ~11 N / cm 2 is. (3) The value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1) is 4 or more.

[0031] The probe tack value PT(0.5,1) when a load of 0.5 N is applied is 0.5 to 2.5 N / cm 2 is as important as described above, preferably 0.5 to 2 N / cm 2 is, and more preferably 0.5 to 1.5 N / cm 2 is. When the probe tack value PT(0.5,1) is within the above range, alignment when pasting on the surface plate This makes temporary bonding (also called temporary fixing) easier, and even if air gets trapped at the interface during bonding (final bonding), it can be quickly pushed out, resulting in excellent bonding workability.

[0032] The probe tack value PT(3.0,1) when a load of 3.0N is applied is 5~11N / cm 2 As mentioned above, this is important, and the pressure is 6-10 N / cm². 2 Preferably, it is 8-10 N / cm 2 It is preferable that it be so. When the probe tack value PT(3.0,1) is within the above range, the adhesive sheet is firmly attached to the surface plate. It is fixed in place, preventing the polishing pad from shifting during polishing, improving chemical resistance and polishing accuracy, and can be easily peeled off after polishing is complete without leaving any adhesive residue.

[0033] Furthermore, it is important that the value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1), PT(3.0,1) / PT(0.5,1), is 4 or greater, and preferably 5 or greater. A PT(3.0,1) / PT(0.5,1) of 4 or greater satisfies both the ease of attachment to the polishing device during temporary fixing and the polishing performance.

[0034] Furthermore, when the adhesive layer A on one side of the adhesive sheet of the present invention is subjected to a load of 0.5N and kept in contact for 10 seconds, 30 seconds, and 60 seconds, and then peeled off at the same speed, the probe tack values ​​are PT(0.5,10), PT(0.5,30), and PT(0.5,60), respectively. (4) The value obtained by dividing the probe tack value PT(0.5,30) by the probe tack value PT(0.5,10) is preferably within 1 to 1.4, and more preferably within 1 to 1.2. moreover, (5) The value obtained by dividing the probe tack value PT(0.5,60) by the probe tack value PT(0.5,10) is preferably within 1 to 1.6, and more preferably within 1 to 1.4. The fact that PT(0.5,10), PT(0.5,30), and PT(0.5,60) are within the ranges of (4) and (5) above makes it easier to adjust the position by peeling off and reapplying the adhesive sheet even if some time has passed since the adhesive sheet touched the surface plate, thus broadening the scope of control for position adjustment work and increasing flexibility.

[0035] The adhesive sheet for fixing the polishing pad of the present invention can be attached to the surface plate with a feeling of being sucked on, and it is preferable that the surface of the adhesive layer A has an uneven surface, as this makes it easier to align. The shape of the surface irregularities (cross-section) of adhesive layer A will be described below. From the standpoint of improving alignment, it is preferable that the area near the top of the protrusion has a gentle curve, as shown in Figure 2-1, rather than being flat, as shown in Figure 2-2. Furthermore, in order to achieve a sticky, adhesive feel, Figure 2-1, with its wider recess in the adhesive layer A, is preferable to Figure 2-2. In Figure 2-3, the recess in the adhesive layer A is wider than in Figure 2-2, which ensures an airflow path during application, and thus a slight improvement in the sticky feel can be expected. However, the wider recess in the adhesive layer A may reduce the polishing accuracy.

[0036] Therefore, in order to improve alignment without reducing polishing accuracy and to produce a sticky feeling, the average height Rc (hereinafter abbreviated as average height Rc) of the surface roughness curve elements of the adhesive layer A is preferably 10 to 40 μm, more preferably 15 to 35 μm, and even more preferably 20 to 30 μm. When the average height Rc is 10 μm or more, the recesses become relatively deeper, so the probe tack value under each condition tends to fall within a favorable range in all cases, improving both alignment and the sticky feeling, and also maintaining a constant airflow path makes it easier to peel the polishing pad and adhesive sheet off the surface plate after polishing is complete. When the average height Rc is 40 μm or less, the polishing accuracy on the surface plate is improved.

[0037] In this invention, the shape of the surface irregularities of the adhesive layer A can be more specifically determined from two parameters: the difference in cutting levels of the contour curve: Rδc and the crustosis: Rku, which allows for a more concrete understanding of the shape of the irregularities, such as the roundness and slope of the protrusions and the spacing between the irregularities. Rδc is preferably 5 to 25 μm, more preferably 10 to 20 μm, and even more preferably 12.5 to 19.0 μm. Rδc is the difference in height levels that matches any two load length ratios from the load curve (a curve plotting the ratio of the actual body length to the measured length in order of height), and in this invention, the two load length ratios are defined as 0% and 50%. Because Rδc is 5 μm or more, air pockets are less likely to form in the very initial stages of application, and the tops of the protrusions of adhesive layer A make loose (light) contact with the surface plate. In other words, since the adhesive layer does not adhere very strongly to the surface plate, when peeling adhesive layer A off the surface plate after contact, it can be peeled off with little resistance, making position adjustment easier. Incidentally, because adhesive layer A is adhesive, it is thought that it deforms to some extent when it is attached to the surface plate. In other words, it is microscopically imagined that the convex parts on the surface of adhesive layer A are crushed to a small degree during attachment, and the concave parts become relatively shallower. Since Rδc is 25 μm or less, when adhesive layer A is firmly attached to the surface plate, adhesive layer A is less likely to be crushed, suppressing excessive tack, maintaining the depth of the concave parts, and preserving the airflow path.

[0038] Furthermore, it is preferable that the kurtosis (Rku) of the surface of the adhesive layer A is less than 3. An Rku of less than 3 indicates a rounded convex shape. The rounded top of the convex when applied... By bringing the top of the piece into contact with the surface plate, alignment can be performed with a feeling of suction. It is particularly preferable when the value is in the range of 1.5 to less than 3, as this improves workability during alignment and provides strong adhesion when pressed firmly to fix it in place, thus suppressing problems such as peeling off during polishing.

[0039] Rc, Rδc, and Rku will be explained using schematic diagrams. Figures 2-1, 2-4, and 2-5 show cases where Rc is approximately the same. If Figure 2-1 shows the case where Rδc is 5-25 μm and Rku is less than 3, then in Figure 2-4, where the slope of the convex is steeper than in Figure 2-1, Rδc is larger than in Figure 2-1, and Rku is less than 3. Similarly, in Figure 2-5, where the slope of the convex is steeper than in Figure 2-1, Rδc is larger than in Figure 2-1, and because the top of the convex is pointed, Rku is greater than 3. Furthermore, Figures 2-6 and 2-7 also illustrate the case where Rc is approximately the same as in Figure 2-1, but because the spacing between the bumps and depressions is wider than in Figure 2-1, Rδc becomes smaller than in Figure 2-1, Rku becomes 3 smaller in Figure 2-6, and Rku becomes greater than 3 in Figure 2-7.

[0040] Rc, Rδc, and Rku are values ​​measured according to JIS B 0601 (2013), and can be measured using a digital microscope (Keyence VHX-7000). Specifically, at a magnification of 400x, five consecutive images are taken in both the vertical and horizontal directions (25 images in total) of a field of view of approximately 460 μm vertically and 640 μm horizontally, and the entire observation field is approximately 2300 μm vertically and 3200 μm horizontally. The measurement field is the central area of ​​the entire observation field, approximately 1840 μm vertically and 2560 μm horizontally, and Rc, Rδc, and Rku are measured along the two diagonals of the measurement field, and the average value of each is calculated. The same applies to the measurement of Rc, etc., of the release sheet FA, which will be described later.

[0041] Unlike the uneven surface of a so-called "matte" finish intended for optical non-glossiness, the surface of the adhesive layer A in this invention has large and rough irregularities. Figure 3-1 shows an image of the surface irregularities of the adhesive layer A in this invention, and Figure 3-2 shows an image of the surface irregularities of a so-called "matte" finish. The fact that Rc, Rδc, and Rku are within the ranges described above indicates that the surface has a greater difference in height between the bumps and wider spacing between them than typical "matte" surfaces that excel at optical matting. This represents an ideal shape for initial positioning during application, air release during application, and for fixing the polishing pad to the surface plate in a parallel and smooth manner.

[0042] The surface irregularities (plan view) of adhesive layer A will be described below. The surface irregularities (planar view) of the adhesive layer A in the present invention may be regular patterns such as grid patterns or polka dot patterns, but it is preferable that they be irregular and irregular in shape as shown below. Figure 4 shows an example of an image of the surface of adhesive layer A observed with a laser microscope. In the upper part of Figures 4-1 and 4-2, the black areas are convex, and in plan view they are irregular and irregular in shape. Examples of irregular and irregular patterns and designs in the present invention include those shown in Figures 5(1) to (4). Figure 5(1) is sometimes called a sand texture, leather texture, rock texture, stone texture, or plain surface. Figure 5(2) is a type of ink-like pattern called mottling in the field of inks and paints. Figure 5(3) is also called mottling, but it is a pattern that can be seen on decorative stickers for plastic models. Figure 5(4) is sometimes called a Dalmatian pattern. In the patterns and designs shown in Figures 5(1) to (4), there is no regularity in the position of both the raised parts (black parts) and recessed parts (white parts), and no regularity is observed in their shape either.

[0043] If the probe tack value of the surface of adhesive layer A is within the above range, there is no difference in terms of positioning when attaching it to the surface plate or the feeling of adhesion, regardless of whether the shape of the unevenness in plan view is irregular and irregular or regular and regular. However, if the pattern or design in plan view is irregular and irregular, it becomes easier to mitigate uneven force during attachment and to attach it uniformly. Furthermore, even if unevenness occurs in the adhesive layer A to the extent that it does not affect performance, it is preferable if the pattern or design in plan view is irregular and irregular in shape, as this makes it less noticeable.

[0044] The following methods can be used to obtain an adhesive layer A in which the probe tack value is within a predetermined range. Specifically, a release sheet FA' having a release layer is prepared, and then, as shown in Figure 6-1, the release sheet FA' is passed at high temperature between a metal roll R1 and a rubber roll R2 that have been processed to a desired surface shape, thereby inverting and transferring the surface shape of the metal roll R1 and producing a release sheet FA with irregularities having an average height Rc of 12 to 42 μm. Note that when the surface shape of the release sheet FA is inverted and transferred by the rotation of the metal roll R1, the surface shape will have a certain periodicity, but this periodicity is different from the regularity in the plan view described above.

[0045] and, (1) The adhesive layer A is formed by applying adhesive a onto the release layer of the release sheet FA and drying it as needed. (2) A sheet-like substrate is placed on the surface of the adhesive layer A that is not in contact with the release sheet FA. (3) Apply adhesive b to the peeled surface of the release sheet FB and dry as necessary to form adhesive layer B. (4) The surface of the adhesive layer B that is not in contact with the release sheet FB is placed on top of the surface of the sheet-like substrate that is not in contact with the adhesive layer A. As a result, it is possible to produce an adhesive sheet for fixing polishing pads with a release sheet FA and a release sheet FB, which have a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] as shown in Figure 6-2.

[0046] or, (5) Apply adhesive a to one side of the sheet-like substrate and dry as necessary to form an adhesive layer A. (6) The surface of the release sheet FA, which has an average height Rc of surface irregularities Rc of 12 to 42 μm, is superimposed on the surface of the adhesive layer A that is not in contact with the sheet-like substrate. (7) The adhesive b is applied to the peeled surface of the release sheet FB and dried as necessary to form the adhesive layer B. (8) The surface of the adhesive layer B that is not in contact with the release sheet FB is placed on top of the surface of the sheet-like substrate that is not in contact with the adhesive layer A. Even with this method, it is possible to produce an adhesive sheet for fixing a polishing pad with a release sheet FA and a release sheet FB, which have a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] as shown in Figure 6-2.

[0047] or, (9) The adhesive b is applied to the peeled surface of the release sheet FB and dried as necessary to form the adhesive layer B. (10) A sheet-like substrate is placed on the surface of the adhesive layer B that is not in contact with the release sheet FB. (11) The surface of the release sheet FA, which has an average height Rc of surface irregularities Rc of 12 to 42 μm, is coated with adhesive a and dried as necessary to form an adhesive layer A. (12) The surface of the adhesive layer A that is not in contact with the release sheet FA is placed on top of the surface of the sheet-like substrate that is not in contact with the adhesive layer B. Even with this method, the laminated structure of release sheet FA and release sheet F as shown in Figure 6-2 [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] is obtained. An adhesive sheet for fixing polishing pads with B can be manufactured. In all cases, it is preferable that the surface of the adhesive layer B (the surface that will come into contact with the polishing pad) is smooth, so it is preferable that the release surface of the release sheet FB to which the adhesive b is applied is smooth.

[0048] For coating the adhesive, known methods such as the roll coater method, comma coater method, lip coater method, die coater method, reverse coater method, silkscreen method, and gravure coater method can be used. After coating, it can be dried using a hot air oven, infrared heater, or the like.

[0049] By peeling off the release sheet FB from the adhesive sheet 2 for fixing the polishing pad, which has a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] obtained by various methods, and attaching the polishing pad PP to the exposed adhesive layer B as shown in Figure 6-3, a polishing pad 4 with a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / polishing pad PP] can be obtained, which has a release sheet FA and adhesive layer A. Next, by peeling off the release sheet FA that covered the adhesive layer A from the polishing pad 4 with the obtained release sheet FA and adhesive layer A, the irregularities of the release sheet FA are transferred inversely to the adhesive layer A, and an adhesive layer A with the desired probe tack value and surface irregularities can be obtained. Then, as shown in Figure 6-4, by attaching the exposed adhesive layer A to the surface plate SP, the polishing pad PP can be fixed to the surface plate SP via the adhesive sheet 1.

[0050] In addition to the transfer method described above, another method for forming an adhesive layer A with a desired roughness is to further extrude adhesive onto the surface of a smooth adhesive layer using an inkjet printer to create a pattern with a desired surface shape, and then dry and harden it. Alternatively, it can be obtained by pressing a metal plate with the desired roughness onto a smooth adhesive layer at a high temperature. Alternatively, it can be obtained by laser processing the surface of a smooth adhesive layer to burn away a portion of the adhesive layer. Among the above methods, the method of forming an adhesive layer on a release sheet having the desired unevenness, and transferring the unevenness of the release sheet to the adhesive layer to obtain adhesive layer A, is preferred because it provides stable manufacturing quality and a fast manufacturing speed.

[0051] <Adhesive layer> In the adhesive sheet for fixing polishing pads of the present invention, adhesive layers A and B are located on the outermost surfaces of the adhesive sheet, respectively. The sheet-like substrate may be a single layer or a laminate of various materials, and the number of layers is not particularly limited. The thickness of the adhesive layer A of the adhesive sheet for fixing the polishing pad is preferably 15 to 100 μm, and more preferably 30 to 70 μm. A thickness of 15 μm or more of adhesive layer A makes it easier to exhibit adhesive strength, and a thickness of 100 μm or less makes it easier to create the uneven shape required by the present invention. Being within the more preferable range provides excellent adhesiveness and suppresses the problem of the adhesive layer shifting in the shear direction when the adhesive sheet becomes hot during polishing. The thickness is the average value measured at 5 arbitrary points using a Mitutoyo Lightmatic VL-50B thickness gauge with a Φ7.5 mm probe pressed with a pressure of 0.01 N. The thickness of adhesive layer B is not particularly limited as long as various polishing pads can be fixed to it. However, by making the combined thickness of adhesive layer B (excluding the thickness of the base layer) and adhesive layer A 200 μm or less, the proportion of the adhesive layer, which is a low-elastic material, in the entire adhesive sheet is reduced, improving polishing accuracy.

[0052] To achieve a specific probe tack value, the adhesive layer A preferably has a tensile storage modulus within the following range: Specifically, the tensile storage modulus Er' at 25°C. is 1 x 10 4 ~1 × 10 6 Pa is preferred, 2 × 10 4 ~9×10 5 Pa is more preferred, 3 x 10 4 ~6×10 5 Pa is particularly preferred. ' is 1 × 10 4 A pressure of Pa or higher helps to suppress collapse and makes it easier to secure air passages to eliminate voids. 1 × 10 6 Being below Pa is superior to various types of surface plates. It ensures excellent wettability, provides a sticky feel, and has superior adhesive strength, which helps prevent slippage and peeling during polishing.

[0053] The adhesive layers A and B of the adhesive sheet of the present invention can use acrylic adhesives, elastomer adhesives, urethane adhesives, or silicone adhesives, and two or more may be used in combination. Acrylic adhesives are preferred from the viewpoint of less gel generation, less localized differences in elastic modulus, and easier control of adhesive strength. While elastomer-based and urethane-based adhesives often use metal catalysts during synthesis, and silicone-based adhesives often use metal catalysts during curing, acrylic-based adhesives are preferable because they contain less metal catalyst, thus less affecting CMP processing and offering high chemical resistance. Furthermore, in order to accommodate a wide variety of polishing pad materials, it is preferable to select an acrylic adhesive with a rich variety of monomer species for the adhesive layer B.

[0054] <Acrylic adhesive> The acrylic adhesive contains an acrylic copolymer and a curing agent. It may also contain a tackifying resin. The acrylic copolymer preferably has carboxyl groups or hydroxyl groups, and more preferably is a (meth)acrylate resin having hydroxyl groups.

[0055] <(meth)acrylate resin> The (meth)acrylate resin is obtained by copolymerizing a monomer having a hydroxyl group with another monomer that does not have a hydroxyl group. That is, the (meth)acrylate resin is a copolymer consisting of units derived from a monomer having a hydroxyl group and units derived from another monomer.

[0056] Examples of monomers having a hydroxyl group include hydroxyalkyl (meth)acrylates and compounds obtained by adding ε-caprolactone to the hydroxyalkyl (meth)acrylate, with hydroxyalkyl (meth)acrylates being preferred.

[0057] Specific examples of hydroxyalkyl (meth)acrylates include hydroxyalkyl (meth)acrylates with 1 to 4 carbon atoms in the alkyl group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Specific examples of compounds obtained by adding ε-caprolactone to hydroxyalkyl (meth)acrylates include ε-caprolactone adducts of hydroxyalkyl (meth)acrylates with 1 to 4 carbon atoms, such as a 1-mol ε-caprolactone adduct of 2-hydroxyethyl (meth)acrylate, a 2-mol ε-caprolactone adduct of 2-hydroxyethyl (meth)acrylate, and a 3-mol ε-caprolactone adduct of 2-hydroxyethyl (meth)acrylate. However, the present invention is not limited to these examples. These hydroxyl group-containing monomers may be used individually or in combination. 2-hydroxyethyl (meth)acrylate is particularly preferred because, when crosslinked with an isocyanate curing agent, the intermolecular distances are relatively close, resulting in improved chemical resistance.

[0058] Other monomers that do not have a hydroxyl group include the following various monomers: Examples of alkyl (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, and sec-butyl (meth)acrylate. Examples include alkyl(meth)acrylates such as tert-butyl(meth)acrylate, isoamyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, isononyl(meth)acrylate, isodecyl(meth)acrylate, lauryl(meth)acrylate, stearyl(meth)acrylate, tert-butylhexyl(meth)acrylate, 2-acetoacetoxyethyl(meth)acrylate, and phenoxyethyl(meth)acrylate. It is preferable to copolymerize with ethyl acrylate because it is rich in moderate rigidity and flexibility, and readily exhibits cohesive force and a desirable tackiness. The amount of ethyl acrylate is preferably 10% by mass or less, more preferably 1 to 9% by mass, and even more preferably 3 to 8% by mass, based on 100% by mass of the monomer used for copolymerization.

[0059] The weight-average molecular weight (Mw) of the acrylic copolymer is preferably 200,000 to 1,500,000, and more preferably 500,000 to 1,000,000. A weight-average molecular weight (Mw) of 200,000 or more makes it easier for the adhesive to obtain cohesive force that can withstand strong shear forces, while a weight-average molecular weight (Mw) of 1,500,000 or less provides excellent heat resistance and prevents a decrease in adhesion to abrasive materials, thus improving performance.

[0060] Methods for polymerizing monomers include, for example, solution polymerization, bulk polymerization, suspension polymerization, and emulsion polymerization, but the present invention is not limited to such polymerization methods. Among these polymerization methods, solution polymerization is preferred because the resulting reaction mixture can be used as is.

[0061] <Elastomer-based adhesive> The elastomer-based adhesive preferably contains an elastomer and a tackifying resin. The elastomer preferably contains a styrene-isoprene block copolymer.

[0062] Styrene isoprene block copolymers exist with either a linear or radial structure. However, the linear structure offers greater flexibility, resulting in superior adhesion to various substrates and better tackiness and heat resistance. Therefore, a linear structure consisting of a triblock (SIS) of styrene blocks and a diblock (SI) of styrene-isoprene is preferable. A linear styrene isoprene block copolymer refers to a linear copolymer in which styrene blocks and isoprene blocks are bonded together.

[0063] The styrene-isoprene block copolymer preferably has a styrene content of 20-40% by weight and a diblock content of 15-70% by weight per 100% by weight. Having the styrene and diblock content within these ranges allows for excellent adhesive properties with strong cohesive force, improving retention and chemical resistance after being exposed to high humidity environments.

[0064] Examples of styrene-isoprene block copolymers include, but are not limited to, Kraton D1119 (styrene content 22% by weight, diblock content 66% by weight), Kraton D1126 (styrene content 21% by weight, diblock content 30% by weight), and Kraton D1117 (styrene content 17% by weight, diblock content 33% by weight), all manufactured by Kraton. Two or more copolymers may be used in combination as needed.

[0065] Furthermore, natural rubber may be included, provided that it does not impair the required performance. While there are no particular limitations on the natural rubber, it is preferable to knead it using a kneading roll and achieve a Mooney viscosity of, for example, 10 to 100. Other elastomers and natural rubbers are not limited to these, and one or more types can be used in combination.

[0066] <Silicone-based adhesive> Silicone-based adhesives can use materials known as silicone resins. Specifically, organopolysiloxanes having silanol groups at both ends of the molecular chain, with R3SiO in the molecule. 0.5 (Here R represents a substituted or unsubstituted monovalent hydrocarbon group) An organopolysiloxane having triorganosiloxane units and SiO2 units is obtained by partial dehydration condensation. These are some examples. These are available as silicone adhesives KR-101-10, KR-120, KR-130, and X-40-3068 (all manufactured by Shin-Etsu Chemical Co., Ltd.). There are generally two curing methods for silicone adhesives: one using peroxides such as benzoyl peroxide, and another using a reaction between a platinum catalyst and an organopolysiloxane with Si-H bonds. Either method can be used, and they can also be used in combination.

[0067] <Adhesive-granting resin> Examples of tackifying resins include rosin-based resins such as rosin esters, polymerized rosin, hydrogenated rosin, disproportionated rosin, maleic acid-modified rosin, fumaric acid-modified rosin, and rosinphenol resins; terpene-based resins such as α-pinene resin, β-pinene resin, dipentene resin, aromatically modified terpene resin, hydrogenated terpene resin, terpenephenol resin, acid-modified terpene resin, and styrene-modified terpene resin; alkylphenol resin, coumarone-based resin, styrene-based resin, petroleum-based resin, or copolymers thereof, with terpenephenol resin being particularly preferred. The above tackifying resins can be used individually or in combination of two or more.

[0068] <Hardening agent> A hardening agent can be added to the adhesive as needed. Since the required peeling force when removing the adhesive from the polishing machine platen varies from high to low, a hardening agent can be added to control the adhesive strength. As long as the desired performance is not compromised, isocyanate-based hardening agents, aziridine-based hardening agents, metal chelate-based hardening agents, and epoxy-based hardening agents can be used as needed. In particular, for hardening agents added to acrylic adhesives, isocyanate-based hardening agents are preferred from the viewpoint of cohesive force and heat resistance. These hardening agents may be used individually or in combination of two or more types.

[0069] <Other additives> The various adhesives used to form the adhesive layer in the adhesive sheet of the present invention may include, as necessary, various additives such as antioxidants and other known anti-aging agents, fillers, pigments, dyes, diluents, plasticizers, polymerization inhibitors, UV absorbers, UV stabilizers, coupling agents, etc., and two or more types of additives may be used. Furthermore, the amount of additives added is not particularly limited, as long as it is sufficient to obtain the required physical properties.

[0070] <Release Sheet FA>, <Release Sheet FB> Release sheets FA and FB have a release layer formed by coating a release agent onto a sheet-like substrate such as paper, plastic film, or synthetic paper. In CMP processing, a release film made from a highly clean plastic film as the sheet-like substrate is preferred. For release sheets used in factory automation, polyethylene terephthalate film is preferred because it is inexpensive and easy to process with metal rolls. Furthermore, for the example of processing the release film with metal rolls, a thickness of 25 to 100 μm is preferable because it is easier to transfer the desired shape formed on the metal surface, and a thickness of 45 to 80 μm is even preferable because it is easier to process. From the standpoint of inverting and transferring the irregularities of the release sheet FA onto the surface of the adhesive layer A, the average height Rc of the release sheet FA is preferably 12 to 42 μm, more preferably 17 to 37 μm, and even more preferably 22 to 32 μm. Being within this preferred range allows for high precision transfer to the adhesive layer A. The uneven surface can be reversed and transferred.

[0071] For the release sheet FB, an inexpensive and highly smooth polyethylene terephthalate film is preferred as the plastic film. While there are no particular restrictions on the thickness of the release sheet FB, a thickness of 10-200 μm is preferred as it provides the film with sufficient rigidity and makes it easier to peel off. Examples of release agents include silicone resins, alkyd resins, melamine resins, fluororesins, and acrylic resins, with silicone resins being preferred.

[0072] <Sheet-like substrate> The sheet-like substrate of the present invention is preferably a nonwoven fabric or a plastic film. Examples of plastic films include polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate, PPS (polyphenylene sulfide), nylon, triacetylcellulose, cycloolefin, polyimide, and polyamide. In particular, polyethylene terephthalate films are preferred due to their low manufacturing cost, excellent chemical resistance, and smoothness.

[0073] The thickness of the sheet-like substrate is not particularly limited, but is preferably 5 to 200 μm, more preferably 25 to 75 μm, and especially preferably 50 to 75 μm. Being within this preferred range ensures that the irregularities of adhesive layer A do not affect adhesive layer B or the polishing pad, providing appropriate stiffness and improving workability during application. Being within this particularly preferred range further improves workability.

[0074] The sheet-like substrate in the present invention may be subjected to an easy-adhesion treatment to improve the adhesion between adhesive layer A and adhesive layer B. The easy-adhesion treatment can be performed using known methods such as a dry method involving corona discharge and a wet method involving coating with an anchor coating agent. When using an acrylic adhesive to form the adhesive layer, it is preferable to use one that has been treated for easy adhesion to improve adhesion. On the other hand, in the case of elastomer adhesives, if the material has been treated for easy adhesion by corona discharge, the adhesive layer tends to peel off the sheet-like substrate more easily. Therefore, it is preferable to apply the elastomer adhesive to a surface that has not been treated for easy adhesion.

[0075] The thickness of the adhesive sheet for fixing the polishing pad, which consists of adhesive layer A, a sheet-like substrate, and adhesive layer B, is preferably 80 to 300 μm, and more preferably 100 to 200 μm. A thickness of 80 μm or more allows for uniform processing without uneven force distribution during lamination when integrating with the polishing pad, while a thickness of 300 μm or less allows for the adhesive sheet to be manufactured in a roll shape, increasing productivity. A thickness within the more preferable range ensures that the force from the polishing plate is properly transmitted to the polishing pad during polishing, improving polishing accuracy.

[0076] <Usage form> An example of how the adhesive sheet for fixing polishing pads of the present invention can be used is described below. As shown in Figures 1-2 and 6-2, the adhesive sheet for fixing the polishing pad can be provided with a release sheet FA attached, in which each side of the adhesive sheet for fixing the polishing pad is covered with release sheets FA and FB, respectively. Alternatively, as shown in Figure 1-3, the adhesive sheet for fixing the polishing pad can be provided with only the adhesive layer A side covered with release sheet FA. In the case of the configuration shown in Figure 1-3, as shown in Figure 1-3', the adhesive sheet 2 for fixing the polishing pad with release sheet FA attached is wrapped around a cylindrical member called a core (also called a core material), and the surface of the adhesive layer B is covered with the other side of the release sheet FA (the side not in contact with the adhesive layer A), thereby providing a roll-shaped adhesive sheet for fixing the polishing pad with release sheet FA attached.

[0077] As shown in Figures 1-4 and 6-3, an adhesive sheet for fixing the polishing pad with a release sheet FA. A polishing pad is laminated onto the surface of the adhesive layer B, forming a polishing pad 4 with a release sheet FA and adhesive layer A. Next, as shown in Figures 1-5 and 6-4, the release sheet FA is peeled off, exposing the adhesive layer A. Then, the polishing pad 3 with adhesive layer A is attached to the surface plate SP. Adhesive layer A of the adhesive sheet 1 for fixing the polishing pad is in contact with the surface plate, and adhesive layer B is in contact with the polishing pad.

[0078] A polishing pad, also known as a polishing cloth, polishing pad, or polishing PAD, is a component that comes into contact with the surface of the object to be polished and polishes it. Polishing pads come in two types: single-layer types made of a single material and multi-layer types made of multiple layers. The outermost surface material of a polishing pad can be made of urethane, non-woven fabric, or suede. In the case of multi-layer types, urethane foam, polyethylene foam, or polypropylene foam are used as cushioning materials in the inner layers. [Examples]

[0079] The present invention will be described more specifically below with reference to examples, but the present invention is not limited to the following examples. In the examples, "parts" means "parts by weight" and "%" means "percent by weight".

[0080] [Molecular weight] In the following examples, molecular weight is the weight-average molecular weight in polystyrene equivalent, measured by GPC (gel permeation chromatography). The measurement device used was a GPC-8020 (Tosoh Corporation), with tetrahydrofuran as the eluent, and three TSKgelSuperHM-M columns (Tosoh Corporation). The measurement was performed at a column temperature of 40°C, a flow rate of 0.6 mL / min, a sample concentration of 0.3%, and an injection volume of 10 μL.

[0081] [Non-volatile content] Non-volatile content refers to the value calculated by dividing the mass of the sample after heating by the mass of the sample before heating, when 1 g of the sample is heated at 170°C for 10 minutes. However, in the case of commercially available products, the value calculated according to the method specified by the manufacturer may be used.

[0082] (Adhesive) <Preparation of acrylate resin (A-1) solution> In a four-necked flask equipped with a stirrer, reflux condenser, nitrogen inlet tube, and thermometer, 500 g of ethyl acetate was heated in a water bath while introducing nitrogen gas. Subsequently, a mixture of 360 g of BA (n-butyl acrylate), 120 g of 2-EHA (2-ethylhexyl acrylate), 20 g of EA (ethyl acrylate), 5 g of HEA (hydroxyethyl acrylate), 10 gj of AA (acrylic acid), and an appropriate amount of AIBN (azobisisobutyronitrile) as an initiator was added dropwise to the ethyl acetate and reacted under reflux for 8 hours. After the reaction, 110 g of ethyl acetate was added to obtain a solution of acrylate resin (A-1) with a weight-average molecular weight (Mw) of 700,000 (non-volatile content 45%).

[0083] <Manufacturing of acrylate resins (A-2) to (A-10)> Solutions of acrylate resins (A-2) to (A-10) (with 45% non-volatile content) were obtained in the same manner as for acrylate resin (A-1) according to the compositions shown in Table 1.

[0084] <Manufacturing of acrylic adhesive (PA-1) solution> 100 parts of acrylate resin (A-1) solution and 5 parts of isocyanate-based curing agent (Mitsubishi Chemical Corporation (Mytec GP105A): tolylene diisocyanate, trimethylolpropane adduct) were stirred and mixed, and methyl ethyl ketone was added to prepare an acrylic adhesive (PA-1) solution (45% non-volatile content).

[0085] <Manufacturing of solutions for acrylic adhesives (PA-2) to (PA-10) and (PB-1)> The solutions for acrylic adhesives (PA-2) to (PA-10) and (PB-1) were prepared in the same manner as the solution for acrylic adhesive (PA-1), except that the composition was changed as shown in Table 1. Furthermore, rosin ester (Arakawa Chemical Co., Ltd. (Pensel D-125): softening point 125±5℃, acid value 20 or less) was used as the tackifier.

[0086] [Table 1]

[0087] <Preparation of Elastomer-based Adhesive (PE-1) Solution> Quintac 1119 (manufactured by Zeon Corporation, styrene content 22% by weight, diblock content 66% by weight) was used as the elastomer, and appropriate amounts of methyl ethyl ketone and toluene were added as solvents. Next, the flask was gradually heated and continued heating at an internal temperature of approximately 50°C for 3 hours. After heating was complete, it was cooled and the internal temperature was reduced to below approximately 40°C, and Irganox 1010 (BASF) was added as an antioxidant. Two parts by mass of a Pan Co. anti-aging agent were added and diluted with methyl ethyl ketone and toluene to obtain an elastomer-based adhesive (PE-1) with a non-volatile content of 49.0% and a viscosity of 1500 mPa·s.

[0088] <Preparation of Elastomer-based Adhesive (PE-2) Solution> In a four-necked flask equipped with a stirrer, thermometer, reflux condenser, dropping device, and nitrogen inlet tube, 100 parts by mass of Quintac 1126 (manufactured by Zeon Corporation, styrene content 21% by weight, diblock content 30% by weight) as an elastomer, and appropriate amounts of methyl ethyl ketone and toluene as solvents were charged under a nitrogen atmosphere. Next, the flask was gradually heated and continued heating at an internal temperature of approximately 50°C for 3 hours. After heating was complete, it was cooled to an internal temperature of approximately 40°C or lower, and 30 parts by mass of Pencel D-125 (manufactured by Arakawa Chemical Industries, Ltd., softening point 125±5°C, acid value 20 mg KOH / g or less) was added as a tackifying resin, and 2 parts by mass of Irganox 1010 (manufactured by BASF Japan, antioxidant) was added as an antioxidant. The solution was diluted with methyl ethyl ketone and toluene, and stirring was continued until the tackifying resin dissolved to obtain a solution of elastomer adhesive (PE-2) with a non-volatile content of 49% and a viscosity of 1500 mPa·s.

[0089] Release sheet <fa-1>Manufacturing A PET release sheet "RF2PETCS001-50" (thickness: 50 μm, one side silicone release treatment, Rc: 0.2 μm) manufactured by I'm Co., Ltd., measuring approximately 30 cm x 30 cm, was passed between a metal roll and a rubber roll with a PG7 pattern (sand texture) owned by Godo Resin Industry Co., Ltd., under the conditions of temperature: 220°C, pressure: 5 MPa, and speed: 3 m / min, thereby transferring the sand texture pattern to the release sheet FA-1. The Rc value measured using the method described above with a digital microscope (VHX-7000 manufactured by Keyence Corporation) was 6.1 μm. The thickness of the PET release sheet is the average value obtained by measuring five arbitrary points using a Lightmatic VL-50B thickness gauge (manufactured by Mitutoyo Corporation), with a Φ7.5 mm probe and a pressing pressure of 0.01 N.

[0090] Release sheet <fa-2> ~ <fa-7>Manufacturing Except for using metal rolls with PG16, PG12, PG14, PG18, PG68, and PG27 patterns owned by the same company as for release sheet FA-1, sand-textured release sheets FA-2 to FA-7 were obtained under the same processing conditions as for release sheet FA-1.

[0091] Release sheet <fa-8> ~ <fa-12>Manufacturing After obtaining release sheets FA-3, FA-4, FA-5, and FA-6, release sheets FA-8, FA-9, FA-10, FA-11, and FA-12 were obtained by passing each release sheet between a smooth metal roll and a rubber roll under the conditions of temperature: 110°C, pressure: 3.0 MPa, and speed: 0.5 m / min.

[0092] The Rc values ​​for each of the release sheets FA-1 to FA-12 described in detail are as follows. Transferred FA-1 PG7 (sand pattern). Rc: 6.1μm Transferred FA-2 PG16 (sand pattern). Rc: 8.3μm Transferred FA-3 PG12 (sand pattern). Rc: 11.5μm Transferred FA-4 PG14 (sand pattern). Rc: 21.2μm Transferred FA-5 PG18 (sand texture). Rc: 33.1 μm Transferred FA-6 PG68 (sand pattern). Rc: 38.7μm • Transferred FA-7 PG27 (sand texture). Rc: 48.0 μm • Processed FA-8 release sheet FA-3. Rc: 10.3μm • FA-9 release sheet FA-4 was processed. Rc: 16.2μm • FA-10 processed from FA-5 release sheet. Rc: 27.3μm • FA-11 release sheet FA-6 was processed. Rc: 35.8μm • FA-12 processed from release sheet FA-7. Rc: 43.1 μm

[0093] <Release Sheet FB> • FB-1 RF2PETCS001-50, manufactured by I'm Co., Ltd., PET release sheet (thickness: 50 μm, one side silicone release treatment, Rc: 0.2 μm)

[0094] <Sheet-like substrate F> • F-1 PET75, Unitika Corporation PET film (thickness: 75μm)

[0095] [Example 1] <Manufacturing of adhesive sheets for fixing polishing pads, and adhesive sheets for fixing polishing pads with release sheets> A solution of adhesive (PA-1) was applied to the release layer of release sheet FA-1 to a thickness of 50 μm after drying, and an adhesive layer A (acrylic adhesive layer) was formed by drying at 100°C for 2 minutes. Subsequently, the surface of adhesive layer A was bonded to the corona-treated surface of the sheet-like substrate F. Separately, a solution of adhesive (PB-1) was applied to the release sheet FB-1 to a thickness of 50 μm after drying, and the adhesive layer B (acrylic adhesive layer) was formed by drying at 100°C for 2 minutes. Then, adhesive layer B was attached to the side of the sheet-like substrate F that was not bonded to adhesive layer A (non-corona treated side), and left at 23°C-50% humidity for one week to obtain an adhesive sheet (S-1) for fixing polishing pads with release sheets FA and FB, having a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB]. The properties of the obtained adhesive sheet (probe tack value of the surface of the exposed adhesive layer A, average roughness Rc, cross-section level difference Rδc of the contour curve, and crustosis Rku) were determined according to the method described later. Furthermore, the performance of the obtained adhesive sheets (ease of application, air release properties, adhesive strength, chemical resistance, holding power, polishing accuracy, and adhesive residue) was evaluated according to the method described later.

[0096] <Examples 2-11> Except that the release film to which the adhesive P-1 solution is applied is FA-2, FA-8, FA-3, FA-9, FA-4, FA-10, FA-5, FA-11, FA-6, and FA-1 are used instead of the release sheet FA-1 as shown in Table 1, an adhesive sheet for fixing a polishing pad with release sheet FA and release sheet FB was obtained in the same manner as in Example 1.

[0097] <Comparative Example 1 to Comparative Example 3> In Comparative Example 1, instead of release sheet FA-1, a polyester film (manufactured by Mitsui Chemicals ICT Materia, SPPET-O1-50-Bu6) was used as release sheet FA-13. In Comparative Example 2, a matte grade polyester film (Unitika Corporation, Emblet "PTH-38") was used as the release sheet FA-14, and BYK's silicone treatment agent "BYK30" was applied. "0" is 0.1g / m in coil bar. 2 The film, which has been coated and made into a release surface, In Comparative Example 3, FA-7 was used. Except for the materials used, the procedure was the same as in Example 1 to obtain adhesive sheets for fixing polishing pads with release sheets FA and FB.

[0098] <Examples 12-21>, <Comparative Example 4> Except for using release sheet FA-4 instead of release sheet FA-1, and using solutions of adhesives PA-2 to PA-10, PE-1, and PE-2 instead of the solution of adhesive PA-1 as shown in Table 3, adhesive sheets for fixing polishing pads with release sheet FA and release sheet FB were obtained in the same manner as in Example 1. Table 3 also includes a re-examination of Example 6.

[0099] [Properties of adhesive sheets] <Probe Tack Value> PT (Load, Contact Time) The adhesive sheets for fixing the polishing pads, with the obtained release sheets FA and FB attached, were left in a 40°C oven for one week, then removed and left for 24 hours in an atmosphere of 23°C-50%RH. After 24 hours, the release sheet FB was peeled off the adhesive sheet and attached to a stainless steel jig for measurement. Subsequently, the release sheet FA was peeled off, and the probe tack value of the exposed adhesive layer A was measured under each condition. For the measurements, a UBM T-500 tack tester was used, with a stainless steel cylindrical probe diameter of 5 mmΦ and a probe movement speed of 0.01 mm / second. A new sample was used after each measurement, and the following probe tack values ​​were measured. PT(0.5,1)-Load: 0.5N, Contact time: 1 second PT(3.0,1) - Load: 3.0N, Contact time: 1 second PT(0.5,10)-Load: 0.5N, Contact time: 10 seconds PT(0.5,30)-Load: 0.5N, Contact time: 30 seconds PT(0.5,60)-Load: 0.5N, Contact time: 60 seconds

[0100] <Rc、Rδc、Rku> Measurements were taken using a digital microscope (VHX-7000 manufactured by Keyence Corporation) in accordance with JIS B 0601 (2013).

[0101] [Measurement of the storage modulus Er'] A solution of each adhesive was applied to the release layer of the release sheet FA-13 to a thickness of 50 μm after drying, and an adhesive layer A was formed by drying at 100°C for 2 minutes. Two of the formed coated materials were laminated so that the adhesive layers A overlapped, forming an intermediate laminate in which both sides of the 100 μm thick adhesive layer A were covered with release sheet FA. Two of the aforementioned intermediate laminates were prepared, and the release sheet FA on one side of each laminate was peeled off. The exposed adhesive layers A, each 100 μm thick, were then laminated together to form a laminate in which both sides of the adhesive layer A, each 200 μm thick, were covered with the release sheet FA. The obtained laminate was punched out into test pieces measuring 10 mm in length and 5 mm in width. The release sheets FA on both sides were peeled off, and the change in storage modulus (Er') was measured using a dynamic viscoelasticity measuring device DVA-200 (manufactured by IT Measurement Control Co., Ltd.) under the following conditions (load cell: 600 gf, heating rate: 10 °C / min, frequency: 10 Hz, measurement range: -60 to 100 °C). The storage modulus (Er') at 25 °C was then determined.

[0102] [Evaluation of adhesive sheets] <Pasting workability (position adjustment)> The procedure will be explained according to Figure 7. As shown in Figure 7-1, release sheets FA and F prepared in the examples and comparative examples. The adhesive sheet for fixing the polishing pad with B was cut to a size of 210 mm square, the release sheet FB was peeled off to expose the adhesive layer B, and it was bonded to a smooth glass plate (approximately 300 g) measuring 200 mm square with a thickness of 3 mm in a 23°C-50% RH atmosphere. The adhesive sheet that protruded from all four sides of the glass plate was removed with a cutter to create a sample (hereinafter referred to as the sample) with the configuration of [glass / adhesive sheet / release sheet FA] measuring 200 mm square for evaluating the workability of bonding. Note that in Figure 7, the laminated state of the adhesive sheet and the laminated state of the adhesive sheet and release sheet FA are omitted. As shown in Figure 7-2, approximately 200 mm is located in the center of one side of a 300 mm square glass plate. Two types of border lines, one square and one 150mm square, were drawn with a 1mm thick oil-based marker to create the evaluation substrate (hereinafter referred to as the substrate). As shown in Figure 7-3, peel off the release sheet FA of the sample to expose the adhesive layer A, and the adherend Place the 200mm square sample so that at least 10mm of each side extends beyond two sides of the 200mm square outer frame drawn on the diagram. Note that the surface on which the sample is placed should be the opposite side from the side on which the two types of frames were drawn. Immediately after placement, peel the sample off the substrate and, as shown in Figure 7-4, remove it from the substrate. The time taken to adjust the position to match the frame lines and then reposition it (from overhanging placement to peeling off and repositioning to match the frame lines) was measured. Five people were randomly selected to perform the task, and each was scored as follows. The total score of the five people was then used to evaluate the ease of application. The ease of application was scored as follows: 3 points: I was able to easily align it with the frame lines in under 10 seconds. 2 points: Alignment was completed in over 10 seconds but less than 15 seconds. 1 point: Alignment was completed in over 15 seconds but less than 30 seconds. 0 points: You exceeded the 30-second limit. The evaluation criteria for ease of application are as follows: S:13-15 points A:10-12 points B: 7-9 points C: 4-6 points D: 0-3 points

[0103] <Evaluation of air release properties> As shown in Figure 8-1, immediately after evaluating the bonding workability, a 500g balance weight with a diameter of 41mm and a height of 63mm was placed in the center of each of the five evaluation samples and left undisturbed for 180 seconds. Next, as shown in Figure 8-2, the weight was removed, and points were assigned based on the number of air pockets with a diameter of 5mm or more inside a 150mm square frame on the adherend side (the back surface of the 300mm square glass plate), and the presence or absence of air pockets with a diameter of 10mm or more. Furthermore, the air release ability was evaluated from the total score of the five samples. The scoring criteria for air leakage were determined as follows: 3 points: There are 0 air pockets with a diameter of 5mm or more within the frame. Two points: There are 1-2 air pockets with a diameter of 5mm or more within the frame, and no air pockets with a diameter of 10mm or more. 1. There are 3 to 5 air pockets with a diameter of 5mm or more within the frame, and no air pockets with a diameter of 10mm or more. 0 points: There are more than 5 air pockets with a diameter of 5mm or more within the frame, and there are air pockets with a diameter of 10mm or more. The evaluation criteria for air release performance are as follows: S:13-15 points A:10-12 points B: 7-9 points C: 4-6 points D: 0-3 points

[0104] [Adhesive strength] <Evaluation of initial adhesion of adhesive layer A> Under a 23℃-50%RH atmosphere, the release sheet FB was peeled off from the adhesive sheet used to fix the polishing pad, which had release sheets FA and FB attached. The exposed adhesive layer B was then bonded to a 25μm PET film, cut to a size of 25mm wide x 100mm long, and used as a sample for evaluating adhesive strength. Afterward, the release sheet FA was peeled off, and the exposed adhesive layer A was pressed onto a stainless steel plate with a 2kg roller for one back-and-forth motion. After leaving it for 24 hours, the adhesive strength of adhesive layer A (adhesion strength against SUS) was measured using a tensile testing machine in a 23℃-50%RH atmosphere, in accordance with the measurement method of JIS Z1528. The measurements were taken under conditions of a peeling angle of 180 degrees and a peeling speed of 0.3 m / min. The obtained measurements are shown in Tables 2 and 3.

[0105] <<Chemical resistance (acid resistance, alkali resistance)>> The release sheet FA was peeled off the sample used for adhesion strength evaluation, and the exposed adhesive layer A was placed on a stainless steel plate. A 2kg roller was then passed back and forth once to press the adhesive layer A onto the stainless steel plate. Within 30 minutes, the sample was immersed in a pH 1.5 sulfuric acid aqueous solution and a pH 11.5 sodium hydroxide aqueous solution, respectively, while still attached to the stainless steel plate, and left for 24 hours at 40°C. After that, it was removed from the aqueous solutions, washed with water, and left for 1 hour at 23°C and 50%RH. The adhesive strength of adhesive layer A was measured using the same method as in the <Initial Adhesion Measurement> described above and was defined as the "Adhesion after Immersion". The difference between the initial adhesive strength and the adhesive strength after immersion was calculated. A smaller difference indicates better chemical resistance. A decrease compared to the initial strength may affect polishing performance, while an increase may result in adhesive residue remaining on the surface plate when peeling the polishing pad and adhesive sheet from the surface plate after polishing is complete, potentially contaminating the surface plate. Furthermore, as an evaluation, S means suitable for use, A means usable depending on the polishing fluid used during polishing, and D means unsuitable for practical use. The evaluation criteria are as follows: S: Difference in adhesive strength is less than 1.0N / 25mm A: The difference in adhesive strength is 1.0 N / 25 mm or more, or less than 1.5 N / 25 mm. B: The difference in adhesive strength is 1.5 N / 25 mm or more, or less than 2.0 N / 25 mm. C: The difference in adhesive strength is 2.0 N / 25 mm or more, or less than 2.5 N / 25 mm. D: Difference in adhesive strength is 2.5N / 25mm or more

[0106] <Holding power> The release sheet FB was peeled off the adhesive sheet used to fix the polishing pad, and the exposed adhesive layer B was bonded to a 25 μm PET film. This was then cut to a size of 25 mm wide x 100 mm long, and this was used as the sample. Next, under a 23°C-50%RH atmosphere, the release sheet FA was peeled off in a 25mm x 25mm width, and the exposed adhesive layer A was pressed onto a stainless steel plate with a 2kg roll for one pass-through. The plate was then left for 20 minutes under a 23°C-50%RH atmosphere. After that, a 1kg weight was attached under an 80°C atmosphere so that a force was applied in the 180-degree direction, and the displacement of the sample from the substrate in millimeters was measured after 24 hours. If the sample completely detached from the substrate, the time until it fell was measured. The evaluation criteria are as follows. S: Displacement less than 0.1 mm A: 0.1 mm or more, less than 1.0 mm B: Displacement of 1.0 mm or more, and 5.0 mm or less. C: Falling after 180 minutes D: Falling in less than 180 minutes Furthermore, in terms of holding power, S and A are suitable for use, B and C can be practical depending on the polishing process and polishing time, and D is not suitable for practical use.

[0107] <Polishing precision> The release sheet FB was peeled off from the adhesive sheet used to fix the polishing pad with a release sheet, and the non-polishing surface of the polishing pad (CMP cloth manufactured by Musashino Electronics, Φ200mm, normal type) was placed on the exposed adhesive layer B. The pads were then bonded together under the conditions of roll temperature: 80℃, pressure: 0.1MPa, and speed: 1.0M / min to produce a polishing pad with an adhesive sheet. A Musashino Electronics MA-200 was used as the polishing device. The release sheet FA was peeled off from the prepared adhesive-backed polishing pad, and the exposed adhesive layer A was attached to an aluminum surface plate. Intermediate polishing was then performed under the following conditions. (conditions) Table rotation speed: 100 rpm Head rotation speed: 105 rpm Test piece to be polished: A 200mm wafer (75μm thick) with a polysilicon layer (500nm) deposited on its surface, cut into a 3cm square. Polishing pressure: 10.0 kPa Polishing time: 15 min Polishing solution: Colloidal silica polishing compound #80 manufactured by Musashino Electronics Co., Ltd. After polishing, the test specimens were washed with water and the water droplets were removed with compressed air. Then, the thickness of the polysilicon was measured at three arbitrary points (one at the center and two at points outside the center) using an Otsuka Electronics FE-300 film thickness gauge. The polishing accuracy was evaluated according to the following criteria based on the difference between the maximum and minimum film thicknesses. S: Less than 10nm A: 10nm or more, less than 20nm B: 20nm or more, less than 30nm C: 30nm or more, less than 50nm D: 50nm or more In CMP polishing, where precision is required, S is the best, A is preferred, B is used for general purposes, C has limited applications, and D cannot be used.

[0108] <Adhesive residue test> Similar to the alignment performance evaluation test described above, a sample for evaluating adhesive residue was prepared with the configuration of [glass / adhesive sheet / release sheet FA] measuring 200 mm square. The release sheet FA was peeled off, and the exposed adhesive layer A was placed on a 300 mm square glass plate and immediately peeled off. This "placement-peeling" process was repeated 10 times at approximately the same position on the 300 mm square glass plate, and the number of "placement-peeling" cycles until adhesive residue appeared on the 300 mm square glass plate was used to evaluate the adhesive residue performance. The evaluation criteria are as follows. S: In 10 "placement-removal" cycles, there was no adhesive residue even after the 10th time. A: In the 10 "placement-removal" cycles, adhesive residue occurs on the 9th cycle. B: In the 10 "placement-removal" cycles, adhesive residue occurs on the 8th cycle. D: In 10 "placement-removal" cycles, adhesive residue occurs within the first 7 cycles. In terms of evaluation, S indicates suitable use, while D indicates unsuitable for practical use.

[0109] [Table 2]

[0110] [Table 3] [Explanation of Symbols]

[0111] 1: Adhesive sheet for fixing the polishing pad 2: Adhesive sheet for fixing polishing pad with release sheet FA 3: Polishing pad with adhesive layer A 4: Polishing pad with release sheet FA and adhesive layer A A: Adhesive layer A FA: Release sheet covering the surface of adhesive layer A FA': Precursor of FA B: Adhesive layer B FB: Release sheet covering the surface of adhesive layer B F: Sheet-like substrate PP: Polishing pad R1: Metal roll R2: Rubber Roll SP: Surface plate < / fa-8> < / fa-2>

Claims

1. Each surface of the sheet-like substrate is provided with an adhesive layer A and an adhesive layer B, An adhesive sheet for fixing a polishing pad, wherein the probe tack value when a 5 mm diameter stainless steel cylindrical probe is brought close to the adhesive layer A at a speed of 0.01 mm / second, made contact with it, and then peeled off at the same speed satisfies the following conditions (1) to (3). (1) When a load of 0.5 N is applied, the probe is in contact for 1 second, and when it is pulled away, the probe tack value PT(0.5,1) is 0.5 N / cm. ２ ~2.5 N / cm ２ That is the case. (2) The probe tack value PT when a load of 3.0 N is applied, contact is maintained for 1 second, and then the probe is pulled away. (3.0,1) is 5 N / cm ２ ~11 N / cm ２ That is the case. (3) The value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1) is 4 or greater.

2. The adhesive sheet for fixing a polishing pad according to claim 1, wherein when a stainless steel cylindrical probe with a diameter of 5 mm is brought close to the adhesive layer A at a speed of 0.01 mm / second, a load of 0.5 N is applied, and contact is maintained for 10 seconds, 30 seconds, and 60 seconds, and the probe is peeled off at the same speed, the probe tack values ​​are PT(0.5,10), PT(0.5,30), and PT(0.5,60), respectively, and the following conditions (4) and (5) are satisfied. (4) The value obtained by dividing the probe tack value PT(0.5,30) by the probe tack value PT(0.5,10) is between 1 and 1.

4. (5) The value obtained by dividing the probe tack value PT(0.5,60) by the probe tack value PT(0.5,10) is between 1 and 1.

6.

3. The polishing pad according to claim 2, characterized in that the surface of the adhesive layer A that is not in contact with the sheet-like substrate has irregularities, and the average height Rc of the surface irregularities of the adhesive layer A is 10 to 40 μm. Adhesive sheet for fixing.

4. The adhesive sheet for fixing a polishing pad according to claim 3, characterized in that the cutting level difference Rδc of the contour curve of the surface irregularities of the adhesive layer A is 5 to 25 μm, and the kurtosis Rku is less than 3.

5. The adhesive sheet for fixing a polishing pad according to claim 4, characterized in that the shape of the protrusions on the surface of the adhesive layer A is irregular and irregular in plan view.

6. The adhesive sheet for fixing a polishing pad according to claim 5, characterized in that the adhesive layer A is an acrylic adhesive layer.

7. A polishing pad fixing adhesive sheet with a release sheet FA, comprising the polishing pad fixing adhesive sheet described in claim 1 and a release sheet FA, The surface of adhesive layer A is in contact with the release surface of release sheet FA. An adhesive sheet for fixing polishing pads with a release sheet FA, characterized in that the material of the release sheet FA is a plastic film that does not contain paper.

8. The adhesive sheet for fixing the polishing pad with the release sheet FA as described in claim 7, and the release sheet FB, The release sheet FB is in contact with the side of the adhesive layer B that is not in contact with the sheet-like substrate. The adhesive sheet for fixing a polishing pad, characterized in that the material of the release sheet FB is a plastic film that does not contain paper, and includes a release sheet FA and a release sheet FB.

9. An adhesive sheet for fixing a polishing pad with a release sheet FA according to claim 7, wherein the sheet is wound in a roll shape and the length in the width direction of the wound body is 1000 mm or less.

10. An adhesive sheet for fixing a polishing pad, comprising a release sheet FA and a release sheet FB according to claim 8, wherein the sheet is wound in a roll shape and the length in the width direction of the wound body is 1000 mm or less.

11. An adhesive sheet for fixing a polishing pad, with release sheet FA and release sheet FB according to claim 8, wherein the length of the shorter side is 1000 mm or less.

12. A polishing pad with an adhesive layer comprising a polishing pad and an adhesive sheet for fixing the polishing pad as described in claim 1, A polishing pad with adhesive layer A, in which the polishing pad and adhesive layer B are in contact.

13. A polishing pad with an adhesive layer comprising a polishing pad and an adhesive sheet for fixing the polishing pad with a release sheet FA as described in claim 7, A polishing pad with a release sheet FA and adhesive layer A, in which the polishing pad and adhesive layer B are in contact.

14. A method for peeling the release sheet FA from a polishing pad with an adhesive layer A as described in claim 13, and fixing the polishing pad to a surface plate via the adhesive layer A.

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