Resin compositions, prepregs, laminates, resin films, printed circuit boards, and semiconductor packages

Abstract

The present invention provides a resin composition that can achieve excellent conductor adhesion while maintaining good dielectric properties, and prepregs, laminates, resin films, printed circuit boards, and semiconductor packages using the resin composition. [Solution] A resin composition containing (A) a compound having a functional group containing an ethylenically unsaturated bond, and (B) a silane coupling agent having a polymer chain containing a polar group, a prepreg, a laminate, a resin film, a printed circuit board, and a semiconductor package using the resin composition.

Description

Technical Field

[0001] This embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package.

Background Art

[0002] In mobile communication devices typified by mobile phones, network infrastructure devices such as their base station devices, servers, and routers, and large computers, the speed and capacity of the signals used are increasing year by year. Along with this, printed wiring boards mounted on these electronic devices need to support high frequencies, and a substrate material having excellent dielectric properties (low dielectric constant and low dielectric tangent; hereinafter sometimes referred to as "high-frequency characteristics") in a high-frequency band (for example, 10 GHz or higher) that enables reduction of transmission loss is required.

[0003] Patent Document 1 discloses a curable vinylbenzyl compound that can be a cured product excellent in low dielectric constant, low dielectric tangent, high heat resistance, and low water absorption, and a compound having an indene ring structure into which a vinylbenzyl group is introduced.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] As a method for improving dielectric properties, a method of using a component with low polarity has been studied. However, when the content ratio of the component with low polarity is increased, it becomes difficult to improve the adhesion strength to the conductor layer (hereinafter also referred to as "conductor adhesion"). Therefore, a technique for improving conductor adhesion while maintaining good dielectric properties is desired.

[0006] In view of such a current situation, the present embodiment aims to provide a resin composition capable of realizing excellent conductor adhesion while maintaining good dielectric properties, a prepreg using the resin composition, a laminate, a resin film, a printed wiring board, and a semiconductor package.

Means for Solving the Problems

[0007] As a result of proceeding with studies to solve the above problems, the present inventors have found that the problems can be solved by the following present embodiments [1] to

[13] . [1] A resin composition containing: (A) a compound having a functional group containing an ethylenically unsaturated bond; and (B) a silane coupling agent having a polymer chain containing a polar group. [2] The resin composition according to [1] above, wherein the polymer chain containing a polar group possessed by the component (B) is a polymer chain containing an acid anhydride group. [3] The resin composition according to [1] or [2] above, wherein the polymer chain containing a polar group possessed by the component (B) is a polybutadiene chain containing a polar group. [4] The resin composition according to any one of [1] to [3] above, wherein the functional group containing an ethylenically unsaturated bond possessed by the component (A) is one or more selected from the group consisting of a vinyl group and a (meth)acryloyl group. [5] The resin composition according to any one of [1] to [4] above, wherein the content of the component (A) is 50 to 100% by mass with respect to the total amount (100% by mass) of the resin components in the resin composition. [6] The resin composition according to any one of [1] to [5] above, wherein the content of the component (B) is 0.1 to 20.0 parts by mass with respect to 100 parts by mass of the total amount of the resin components in the resin composition. [7] The resin composition according to any one of [1] to [6] above, further containing (C) an inorganic filler. [8] A prepreg containing the resin composition according to any one of [1] to [7] above or a semi-cured product of the resin composition. [9] A laminate having a cured product of the resin composition according to any one of [1] to [7] above and a metal foil.

[10] A resin film containing the resin composition described in any of [1] to [7] above or a semi-cured product of the resin composition.

[11] A printed circuit board having a cured product of any of the resin compositions described in [1] to [7] above.

[12] A semiconductor package having the printed circuit board described in

[11] above and a semiconductor element.

[13] A semiconductor package comprising a semiconductor element and a cured product of any of the resin compositions described in [1] to [7] above for sealing the semiconductor element. [Effects of the Invention]

[0008] According to this embodiment, it is possible to provide a resin composition that can achieve excellent conductor adhesion while maintaining good dielectric properties, as well as prepregs, laminates, resin films, printed circuit boards, and semiconductor packages using the resin composition. [Modes for carrying out the invention]

[0009] In this specification, numerical ranges indicated using "~" represent a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. For example, the notation "X~Y" (where X and Y are real numbers) means a range of numbers that are greater than or equal to X and less than or equal to Y. In this specification, the phrase "greater than or equal to X" means X and numbers greater than X. In this specification, the phrase "less than or equal to Y" means Y and numbers less than Y. The lower and upper limits of the numerical ranges described herein may be arbitrarily combined with the lower or upper limits of other numerical ranges. In the numerical ranges described herein, the lower or upper limits of those ranges may be replaced with the values ​​shown in the examples.

[0010] Unless otherwise specified, each component and material exemplified herein may be used alone or in combination of two or more. In this specification, the content of each component in a resin composition means the total amount of multiple substances present in the resin composition, unless otherwise specified, if multiple substances corresponding to each component are present in the resin composition.

[0011] In this specification, "solids" refers to components other than the solvent, and components that are liquid at 25°C are also considered to be solids.

[0012] In this specification, weight-average molecular weight (Mw) and number-average molecular weight (Mn) refer to values ​​measured in polystyrene equivalent by gel permeation chromatography (GPC). Specifically, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) in this specification can be measured by the method described in the examples.

[0013] In this specification, "resin component" means resin and compounds that form resin through a curing reaction. In the resin composition of this embodiment, for example, component (A) described later corresponds to the resin component. If the resin composition of this embodiment contains, as an optional component, a resin or a compound that forms a resin by a curing reaction in addition to the above component, these optional components are also included in the resin component. On the other hand, components (B), (C), (D), and (E) described later do not correspond to the resin component.

[0014] In this specification, "semi-cured product" is synonymous with a resin composition in the B-stage state as defined in JIS K 6800 (2006), and "cured product" is synonymous with a resin composition in the C-stage state as defined in JIS K 6800 (2006).

[0015] The mechanism of action described herein is speculative and does not limit the mechanism by which the effects of this embodiment are achieved.

[0016] Embodiments that combine any combination of the information described herein are also included.

[0017] [Resin composition] The resin composition of this embodiment is (A) A compound having a functional group containing an ethylenically unsaturated bond, (B) A silane coupling agent having a polymer chain containing a polar group, It is a resin composition containing [the specified ingredient].

[0018] Hereafter in this specification, each component may be abbreviated as (A) component, etc., and other components may also be abbreviated in the same manner.

[0019] <(A) Compounds having a functional group containing an ethylenically unsaturated bond> (A) Component is not particularly limited as long as it is a compound having a functional group containing an ethylenically unsaturated bond. (A) Component (A) may be used alone or in combination of two or more components.

[0020] Examples of functional groups containing ethylenically unsaturated bonds in component (A) include vinyl groups, allyl groups, 1-methylallyl groups, isopropenyl groups, 2-butenyl groups, 3-butenyl groups, styryl groups, N-substituted maleimide groups, and (meth)acryloyl groups. Among these, from the viewpoint of dielectric properties, one or more selected from the group consisting of vinyl groups and (meth)acryloyl groups are preferred.

[0021] Examples of component (A) include aromatic compounds having a vinyl group (A1), compounds having a vinylbenzyl group (A2), polyarylene ether compounds having a functional group containing an ethylenically unsaturated bond (A3), compounds having an N-substituted maleimide group (A4), triallyl isocyanurate, and the like. Furthermore, component (A) is preferably a compound that does not have an alkoxysilyl group.

[0022] (Aromatic compound containing a vinyl group (A1)) (A1) Examples of aromatic rings in component (A1) include benzene rings, naphthalene rings, and anthracene rings. Among these, benzene rings are preferred. The number of vinyl groups in one molecule of component (A1) is preferably 1 to 5, more preferably 2 to 4, and even more preferably 2 or 3. In component (A1), the number of vinyl groups attached to a single aromatic ring may be one or two or more. When there is one vinyl group bonded to one aromatic ring, from the viewpoint of dielectric properties, heat resistance and moldability, component (A1) is preferably a compound containing two or more aromatic rings having one vinyl group each, more preferably a compound containing two to four aromatic rings having one vinyl group each, and even more preferably a compound containing two or three aromatic rings having one vinyl group each. The aromatic ring of component (A1) may or may not have substituents other than a vinyl group.

[0023] Examples of component (A1) include divinylbenzene, 1,2-bis(4-vinylphenyl)ethane, and compounds represented by the following general formula (A1-1). From the viewpoint of dielectric properties, heat resistance, and moldability, the compound represented by the following general formula (A1-1) is preferred.

[0024] [ka] (In the formula, m is an integer greater than or equal to 1.)

[0025] In the above general formula (A1-1), m is preferably an integer from 1 to 10, more preferably an integer from 1 to 5, and even more preferably an integer from 1 to 3, from the viewpoint of dielectric properties, heat resistance, and formability.

[0026] The number-average molecular weight (Mn) of the compound represented by the above general formula (A1-1) is preferably 100 to 2,000, more preferably 200 to 1,000, even more preferably 300 to 700, and particularly preferably 400 to 500, from the viewpoint of dielectric properties, heat resistance, and moldability.

[0027] The weight-average molecular weight (Mw) of the compound represented by the above general formula (A1-1) is preferably 100 to 2,000, more preferably 200 to 1,000, even more preferably 300 to 700, and particularly preferably 400 to 500, from the viewpoint of dielectric properties, heat resistance, and moldability.

[0028] The compound represented by the above general formula (A1-1) can be synthesized by the method described in the examples.

[0029] (Compound containing a vinylbenzyl group (A2)) The vinylbenzyl group contained in component (A2) is one or more selected from the group consisting of o-vinylbenzyl group, m-vinylbenzyl group, and p-vinylbenzyl group, and from the viewpoint of having excellent dielectric properties of the cured product, the p-vinylbenzyl group is preferred. (A2) The proportion of p-vinylbenzyl groups in the total vinylbenzyl groups of component (A2) may be 10 mol% or more, 20 mol% or more, 30 mol% or more, 100 mol% or less, 80 mol% or less, or 70 mol% or less. If the proportion of p-vinylbenzyl groups is less than 100 mol%, the remaining vinylbenzyl groups may be m-vinylbenzyl groups.

[0030] (A2) The number of vinylbenzyl groups in one molecule of component is preferably 1 to 5, more preferably 2 to 4, and even more preferably 2 or 3.

[0031] Component (A2) is preferably a compound in which the vinylbenzyl group is directly or via an oxygen atom bonded to an aromatic ring, an aliphatic ring, or a fused polycyclic structure containing an aromatic ring and a non-aromatic ring; more preferably a compound in which the vinylbenzyl group is directly or via an oxygen atom bonded to a fused polycyclic structure containing an aromatic ring and a non-aromatic ring; and even more preferably a compound in which the vinylbenzyl group is directly bonded to a fused polycyclic structure containing an aromatic ring and a non-aromatic ring. Examples of fused polycyclic structures containing aromatic and non-aromatic rings include indene rings, fluorene rings, indan rings, phenanthrene rings, and acenaphthylene rings. Among these, indene rings are preferred from the viewpoint of dielectric properties.

[0032] Examples of compounds in which a vinylbenzyl group is directly bonded to an indene ring include those represented by the following general formula (A2-1).

[0033] [ka] (In the formula, R A21 ~R A24 Each of these independently represents a hydrogen atom or a monovalent organic group. A21 , R A22 and R A23 At least one of them is a vinylbenzyl group.

[0034] In the above general formula (A2-1), R A21 ~R A24Examples of the monovalent organic group represented by include halogen atoms such as fluorine atom, chlorine atom, bromine atom, iodine atom; alkyl groups having 1 to 6 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, t-butyl group, n-pentyl group, isopentyl group, neopentyl group, t-pentyl group, n-hexyl group, isohexyl group; alkoxy groups represented by RO-, where R is the aforementioned alkyl group; polymerizable unsaturated bond-containing groups such as vinyl group, vinyloxy group, allyl group, allyloxy group, (meth)acryloyl group, (meth)acryloyloxy group; aryl groups such as phenyl group, tolyl group, xylyl group, mesityl group, naphthyl group; aryloxy groups such as phenyloxy group, tolyloxy group, xylyloxy group, mesityloxy group, naphthyloxy group; arylalkyl groups other than vinylbenzyl groups such as phenylmethyl group, tolylmethyl, etc.; and the like.

[0035] In the above general formula (A2-1), R A21 , R A22 and R A23 At least one of them is a vinylbenzyl group, two of them may be vinylbenzyl groups, or three of them may be vinylbenzyl groups. In the above general formula (A2-1), R A21 , R A22 and R A23 When one or two of them are other than vinylbenzyl groups, R other than vinylbenzyl groups A21 , R A22 or R A23 is preferably a hydrogen atom or an arylalkyl group other than a vinylbenzyl group. All of R A24 in the above general formula (A2-1) may be hydrogen atoms.

[0036] The compound represented by the above general formula (A2-1) can be synthesized by the method described in the examples.

[0037] (Polyarylene ether compound (A3) having a functional group containing an ethylenically unsaturated bond) (A3) The arylene group of component (A3) is not particularly limited and includes, for example, substituted or unsubstituted phenylene groups, substituted or unsubstituted naphthylene groups, etc. Substituents that the arylene group may have include alkyl groups, alkyloxy groups, halogen atoms, etc. Component (A3) preferably has a phenylene ether unit represented by the following general formula (A3-1).

[0038] [ka] (In the formula, R A31 This is a hydrocarbon group or halogen atom having 1 to 5 carbon atoms. A31 (This is an integer between 0 and 4.)

[0039] In the above general formula (A3-1), R A31 Examples of hydrocarbon groups having 1 to 5 carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl groups. The hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. A hydrocarbon group having 1 to 3 carbon atoms is preferred, and a methyl group is more preferred. Examples of halogen atoms include fluorine, chlorine, bromine, and iodine atoms.

[0040] The phenylene ether unit represented by the above general formula (A3-1) is preferably the phenylene ether unit represented by the following general formula (A3-2).

[0041] [ka]

[0042] (A3) Among the functional groups containing ethylenically unsaturated bonds exemplified above, the (meth)acryloyl group is preferred from the viewpoint of dielectric properties, and the methacryloyl group is more preferred. (A3) The number of functional groups containing ethylenically unsaturated bonds in one molecule of component (A3) is preferably 1 to 5, more preferably 2 to 4, even more preferably 2 or 3, and particularly preferably 2, from the viewpoint of heat resistance and moldability. The substitution position of the functional group containing the ethylenically unsaturated bond in component (A3) is not particularly limited, but it is preferable that the functional group containing the ethylenically unsaturated bond be at least one end, and more preferably at both ends. Component (A3) may have functional groups containing ethylenically unsaturated bonds in addition to its terminals, but it is preferable that it has functional groups containing ethylenically unsaturated bonds only at its terminals.

[0043] (A3) Examples of components include compounds represented by the following general formula (A3-3).

[0044] [ka] (In the formula, R A31 and n A31 This is as explained in the general formula (A3-1) above. A33 and R A34 Each of these is independently an aliphatic hydrocarbon group or halogen atom having 1 to 5 carbon atoms. A32 and n A33 Each of these is an integer between 0 and 4, independently of the others. A34 and n A35 Each of these is an integer between 0 and 20, and n A34 and n A35 The sum of X is an integer between 1 and 30. A31 This is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. A31 and Y A32 Each of these is a functional group containing an ethylenically unsaturated bond.

[0045] In the above general formula (A3-3), R A33 and R A34The explanation for the aliphatic hydrocarbon group with 1 to 5 carbon atoms represented by is as follows: R in the general formula (A3-1) above. A31 This is the same explanation as for aliphatic hydrocarbon groups with 1 to 5 carbon atoms represented by [the symbol]. n A32 and n A33 n is an integer between 0 and 4, preferably between 0 and 3, more preferably 2 or 3, and even more preferably 2. A32 or n A33 If is an integer greater than or equal to 2, then multiple R A33 Each or multiple R A34 The individuals may be identical or different. n A34 and n A35 n is an integer between 0 and 20, preferably between 1 and 20, more preferably between 2 and 15, and even more preferably between 3 and 10. A34 or n A35 If n is an integer greater than or equal to 2, then multiple n A31 They may be the same or different. n A34 and n A35 The sum is an integer between 1 and 30, preferably between 2 and 25, more preferably between 5 and 20, and even more preferably between 7 and 15.

[0046] X in the above general formula (A3-3) A31 Examples of alkylene groups with 1 to 5 carbon atoms represented by include the methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group, and 1,5-pentamethylene group. X in the above general formula (A3-3) A31 Examples of alkylidene groups with 2 to 5 carbon atoms represented by include ethylidene, propyridene, isopropylidene, butylidene, isobutylidene, pentylidene, and isopentylidene. The above X A31 Among the bases represented by X A31 From the viewpoint of dielectric properties, alkylene groups having 1 to 5 carbon atoms and alkylidene groups having 2 to 5 carbon atoms are preferred, methylene groups and isopropylidene groups are more preferred, and isopropylidene groups are even more preferred.

[0047] In the above general formula (A3-3), Y A31 and Y A32 The preferred embodiments of the functional group containing an ethylenically unsaturated bond represented by are as described above.

[0048] From the viewpoint of dielectric properties, the compound represented by the above general formula (A3-3) is preferably the compound represented by the following general formula (A3-4).

[0049] [ka] (In the formula, n A34 and n A35 This is as explained in the general formula (A3-3) above. A35 and R A36 Each of these is independently either a hydrogen atom or a methyl group. A32 (This is a methylene group or an isopropylidene group.)

[0050] The weight-average molecular weight (Mw) of component (A3) is preferably 500 to 7,000, more preferably 800 to 5,000, even more preferably 1,000 to 3,000, and particularly preferably 1,200 to 2,500, from the viewpoint of dielectric properties, heat resistance, and moldability.

[0051] (Compound having an N-substituted maleimide group (A4)) (A4) Examples of components include aromatic bismaleimide resins, aromatic polymaleimide resins, and aliphatic maleimide resins, among which aromatic bismaleimide resins are preferred. (A4) Specific examples of components include bis(4-maleimidophenyl)methane, m-phenylenebismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 4-methyl-1,3-phenylenebismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, polyphenylmethanemaleimide, aromatic bismaleimide resins having an indan skeleton, biphenyl aralkyl type maleimide resins, etc.

[0052] Among the above options, component (A) preferably contains one or more selected from the group consisting of components (A1), (A2), and (A3) from the viewpoint of dielectric properties, heat resistance, moldability, and conductor adhesion, and more preferably contains one or more selected from the group consisting of components (A1) and (A2), and component (A3).

[0053] If the resin composition of this embodiment contains an aromatic compound (A1) having a vinyl group, the content of component (A1) is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, even more preferably 20 to 60% by mass, and particularly preferably 30 to 50% by mass, based on the total amount (100% by mass) of the resin components in the resin composition of this embodiment, from the viewpoint of dielectric properties, heat resistance, moldability, and conductive adhesion.

[0054] When the resin composition of this embodiment contains a compound (A2) having a vinylbenzyl group, the content of component (A2) is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, even more preferably 20 to 60% by mass, and particularly preferably 30 to 50% by mass, based on the total amount (100% by mass) of the resin components in the resin composition of this embodiment, from the viewpoint of dielectric properties, heat resistance, moldability, and conductive adhesion.

[0055] When the resin composition of this embodiment contains a polyarylene ether compound (A3) having a functional group containing an ethylenically unsaturated bond, the content of component (A3) is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, even more preferably 40 to 75% by mass, and particularly preferably 50 to 70% by mass, based on the total amount (100% by mass) of the resin components in the resin composition of this embodiment, from the viewpoint of dielectric properties, heat resistance, moldability, and conductive adhesion.

[0056] If the resin composition of this embodiment contains one or more components selected from the group consisting of components (A1) and (A2), and component (A3), the mass ratio of component (A3) to the total of one or more components selected from the group consisting of components (A1) and (A2) [component (A3) / one or more components selected from the group consisting of components (A1) and (A2)] is preferably 0.2 to 10.0, more preferably 0.5 to 5.0, even more preferably 1.0 to 3.0, and particularly preferably 1.2 to 2.0, from the viewpoint of dielectric properties, heat resistance, moldability, and conductive adhesion. Note that the total of one or more components selected from the group consisting of components (A1) and (A2) means the total amount of the two components if two are included, and the amount of the one component if only one is included.

[0057] The total content of one or more components selected from the group consisting of components (A1), (A2), and (A3) in component (A) is preferably 80 to 100% by mass, more preferably 90 to 100% by mass, and even more preferably 95 to 100% by mass, and may be 100% by mass, from the viewpoint of dielectric properties, heat resistance, formability, and conductive adhesion. The total content of one or more components selected from the group consisting of components (A1), (A2), and (A3) means the total content of three components if three are included, the total content of two components if only two are included, and the content of one component if only one is included.

[0058] The content of component (A) in the resin composition of this embodiment is preferably 50 to 100% by mass, more preferably 60 to 100% by mass, even more preferably 80 to 100% by mass, and even more preferably 90 to 100% by mass, relative to the total amount of resin components (100% by mass) in the resin composition of this embodiment, from the viewpoint of dielectric properties, heat resistance, moldability, and conductive adhesion, and may also be 100% by mass.

[0059] <(B) Silane coupling agent having a polymer chain containing a polar group> Component (B) is not particularly limited as long as it is a silane coupling agent having a polymer chain containing a polar group. (B) Component may be used alone or in combination of two or more types.

[0060] The resin composition of this embodiment, by containing component (B), can achieve excellent conductive adhesion while maintaining good dielectric properties. The reason for this is not entirely clear, but it is thought that one reason is that component (B) is a silane coupling agent having polymer chains containing polar groups, which effectively improves the strength of the organic-inorganic interface, and the polymer chains containing polar groups improve the flexibility of the resin portion near the interface.

[0061] Component (B) preferably has an alkoxysilyl group. The number of carbon atoms in the alkyl group constituting one alkoxysilyl group of component (B) is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear or branched. Examples of alkoxysilyl groups include trialkoxysilyl groups, dialkoxysilyl groups, and monoalkoxysilyl groups, and among these, trialkoxysilyl groups are preferred. Examples of trialkoxysilyl groups include trimethoxysilyl, triethoxysilyl, and tripropoxysilyl groups, with trimethoxysilyl being preferred among them.

[0062] The polar group in component (B) is preferably a polar group that includes a heteroatom. "Heteroatom" refers to all atoms other than carbon and hydrogen atoms. Examples of polar groups include imide groups, imino groups, amino groups, ammonium groups, amide groups, nitrile groups, hydroxyl groups, carboxyl groups, and acid anhydride groups. Among these, it is preferable that the group contains an oxygen atom, more preferably a carboxyl group or an acid anhydride group, and even more preferably an acid anhydride group. In other words, it is preferable that component (B) has a polymer chain containing an acid anhydride group. If component (B) has an acid anhydride group, the acid anhydride equivalent of component (B) is preferably 200 to 5,000 g / mol, more preferably 500 to 4,000 g / mol, even more preferably 800 to 3,000 g / mol, even more preferably 1,000 to 2,500 g / mol, and particularly preferably 1,200 to 2,000 g / mol, from the viewpoint of dielectric properties and conductive adhesion. The polymer chains of component (B) may have polar groups at their molecular ends or in their side chains.

[0063] (B) The polymer chain of component (B) is a chain consisting of a polymer of one or more monomers. Examples of polymer chains in component (B) include polyether chains, polyolefin chains, polyester chains, polyamide chains, polycarbonate chains, and polysulfide chains. Among these, polyolefin chains are preferred from the viewpoint of dielectric properties and conductor adhesion. Examples of polyolefin chains include polyethylene chains, polypropylene chains, ethylene-propylene copolymer chains, polyisobutylene chains, polyisoprene chains, isobutylene-isoprene copolymer chains, polychloroprene chains, polybutadiene chains, and skeletal chains obtained by adding hydrogen to polybutadiene chains. Among these, polybutadiene chains are preferred from the viewpoint of dielectric properties and conductor adhesion. That is, component (B) preferably has a polybutadiene chain containing a polar group.

[0064] From a similar viewpoint, the polymer chain of component (B) is preferably a polybutadiene chain containing an acid anhydride group. Examples of silane coupling agents having a polybutadiene chain containing an acid anhydride group include compounds represented by the following general formula (B-1).

[0065] [ka] (In the formula, X is an organic group containing an alkoxysilyl group. a, b, and c are each an integer greater than or equal to 1.)

[0066] In the above general formula (B-1), the structural unit with a number of structural units, the structural unit with a number of structural units, and the structural unit with a number of structural units, may be in any order, such as random or block.

[0067] The number-average molecular weight (Mn) of component (B) is preferably 1,000 to 100,000, more preferably 2,000 to 50,000, even more preferably 3,000 to 30,000, even more preferably 4,000 to 10,000, and particularly preferably 5,000 to 8,000, from the viewpoint of dielectric properties and conductive adhesion.

[0068] The content of component (B) in the resin composition of this embodiment is preferably 0.1 to 20.0 parts by mass, more preferably 0.2 to 15.0 parts by mass, even more preferably 0.3 to 10.0 parts by mass, and particularly preferably 0.5 to 6.0 parts by mass, based on 100 parts by mass of the total amount of resin components in the resin composition of this embodiment, from the viewpoint of dielectric properties and conductive adhesion.

[0069] The total content of component (A) and component (B) in the resin composition of this embodiment is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, even more preferably 20 to 60% by mass, and particularly preferably 30 to 50% by mass, relative to the total solid content (100% by mass) of the resin composition of this embodiment, from the viewpoint of dielectric properties and conductive adhesion.

[0070] <(C) Inorganic filler> The resin composition of this embodiment preferably further contains (C) an inorganic filler. The resin composition of this embodiment tends to have better low thermal expansion and heat resistance by containing (C) an inorganic filler. (C) Inorganic fillers may be used individually or in combination of two or more types.

[0071] (C) Examples of inorganic fillers include silica, alumina, titanium oxide, mica, beryllium, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide, etc. Among these, silica, alumina, mica, and talc are preferred from the viewpoint of low thermal expansion, heat resistance, and flame retardancy, silica and alumina are more preferred, and silica is even more preferred. As for silica, fused silica is preferred from the viewpoint of dispersibility and moldability.

[0072] (C) Average particle size of inorganic filler (D 50 (C) From the viewpoint of dispersibility and fine wiring properties of the inorganic filler, the particle size is preferably 0.1 to 10 μm, more preferably 0.2 to 5.0 μm, even more preferably 0.3 to 1.0 μm, and particularly preferably 0.4 to 0.8 μm. In this specification, (C) average particle size of inorganic filler (D 50 (C) The average particle size of an inorganic filler can be measured, for example, by a particle size distribution analyzer using the laser diffraction scattering method.

[0073] (C) The shape of the inorganic filler can be, for example, spherical or crushed, with spherical being preferred. (C) The inorganic filler may also be solid silica, porous silica, hollow silica, etc. Hollow silica is preferred in that it results in a lower dielectric constant in the cured product. (C) The inorganic filler may be surface-treated with a surface treatment agent such as a silane coupling agent in order to improve its dispersibility and adhesion to organic components.

[0074] If the resin composition of this embodiment contains (C) an inorganic filler, the amount of (C) an inorganic filler is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and even more preferably 40 to 60% by mass, based on the total solid content (100% by mass) of the resin composition of this embodiment. (C) When the inorganic filler content is above the lower limit, the low thermal expansion and heat resistance tend to be better. Also, when the inorganic filler content is below the upper limit, the moldability and conductor adhesion tend to be better.

[0075] <(D) Curing accelerator> The resin composition of this embodiment preferably further contains (D) a curing accelerator. The resin composition of this embodiment tends to have improved curability, better dielectric properties, heat resistance, and conductor adhesion due to the inclusion of (D) a curing accelerator. (D) The curing accelerator may be used alone or in combination of two or more types.

[0076] (D) Examples of curing accelerators include: acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, tributylamine, pyridine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate; isocyanate-masquimidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine and quaternary phosphonium compounds which are the addition reaction products of p-benzoquinone and tri-n-butylphosphine; and dicumyl peroxide. Examples include organic peroxides such as 2,5-dimethyl-2,5-bis(t-butylperoxy)hexine-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-di(t-butylperoxy)diisopropylbenzene; inorganic peroxides such as potassium persulfate, sodium persulfate, and ammonium persulfate; azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile), and 2,2'-azobis(2,4,4-trimethylpentane); carboxylates such as manganese, cobalt, and zinc; and acidic catalysts such as p-toluenesulfonic acid. Among these, organic peroxides are preferred, and α,α'-di(t-butylperoxy)diisopropylbenzene is more preferred.

[0077] If the resin composition of this embodiment contains (D) a curing accelerator, the amount of (D) a curing accelerator is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and even more preferably 0.2 to 5 parts by mass, based on 100 parts by mass of the total amount of resin components in the resin composition of this embodiment. (D) When the content of the curing accelerator is above the lower limit above, a sufficient curing acceleration effect tends to be easily obtained. Also, when the content of the curing accelerator is below the upper limit above, storage stability tends to be better.

[0078] <(E) Flame retardant> The resin composition of this embodiment preferably further contains (E) a flame retardant. The resin composition of this embodiment tends to have better flame retardancy by containing (E) a flame retardant. (E) Flame retardants may be used individually or in combination of two or more types.

[0079] (E) Examples of flame retardants include phosphorus-based flame retardants, metal hydrates, halogen-based flame retardants, etc. The phosphorus-based flame retardant may be an inorganic or organic phosphorus-based flame retardant. Furthermore, from the viewpoint of reducing environmental impact, it is preferable that the phosphorus-based flame retardant does not contain halogen atoms. Examples of inorganic phosphorus-based flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and polyammonium phosphate; inorganic nitrogen-containing phosphorus compounds such as phosphate amides; phosphoric acid; and phosphine oxide. Examples of organic phosphorus-based flame retardants include aromatic phosphate ester compounds, monosubstituted phosphonic acid diester compounds, disubstituted phosphinic acid ester compounds, metal salts of disubstituted phosphinic acids, organic nitrogen-containing phosphorus compounds, cyclic organophosphorus compounds, and phosphine oxide compounds. (E) As for the flame retardant, an organic phosphorus-based flame retardant is preferred, an aromatic phosphate ester compound is more preferred, and 4,4'-biphenylene-bis(di-2,6-dimethylphenyl phosphate) is even more preferred.

[0080] If the resin composition of this embodiment contains (E) a flame retardant, the amount of (E) a flame retardant is preferably 1 to 45 parts by mass, more preferably 10 to 40 parts by mass, and even more preferably 20 to 35 parts by mass, based on 100 parts by mass of the total amount of resin components in the resin composition of this embodiment. (E) When the amount of flame retardant is above the lower limit, flame retardancy tends to be better. Also, (E) when the amount of flame retardant is below the upper limit, dielectric properties, moldability, and conductor adhesion tend to be better.

[0081] <Other optional ingredients> The resin composition of this embodiment may further contain, if necessary, other optional components such as resin materials other than the above-mentioned components, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, lubricants, organic solvents, and other additives. Other optional components may be used individually or in combination of two or more. The content of the above-mentioned optional components in the resin composition of this embodiment is not particularly limited, and they may be used as needed, within a range that does not impair the effects of this embodiment. Furthermore, the resin composition of this embodiment may not contain the above-mentioned optional components, depending on the desired performance.

[0082] The resin composition of this embodiment may contain an organic solvent from the viewpoint of ease of handling. Examples of organic solvents include alcoholic solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether solvents such as tetrahydrofuran; aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester solvents such as γ-butyrolactone. Among these, alcohol-based solvents, ketone-based solvents, nitrogen atom-containing solvents, and aromatic hydrocarbon-based solvents are preferred from the viewpoint of solubility, with toluene being more preferred.

[0083] The total content of the resin components in the resin composition of this embodiment is preferably 10 to 70% by mass, more preferably 20 to 50% by mass, and even more preferably 30 to 40% by mass, relative to the total solid content (100% by mass) of the resin composition of this embodiment, from the viewpoint of low thermal expansion, heat resistance, flame retardancy, and conductive adhesion.

[0084] <Method for producing resin compositions> The resin composition of this embodiment can be manufactured by mixing each component in a known manner. In this case, each component may be dissolved or dispersed while stirring. The mixing order, temperature, time, and other conditions are not particularly limited and can be set arbitrarily according to the type of raw materials, etc.

[0085] [Prepreg] The prepreg of this embodiment is a prepreg containing the resin composition of this embodiment or a semi-cured product of the resin composition.

[0086] As the fibrous base material contained in the prepreg of this embodiment, for example, a known fibrous base material used in various types of laminates for electrical insulating materials can be used. Examples of materials for the fiber base material include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These fiber base materials can take the form of woven fabrics, nonwoven fabrics, rawhide, chopped strand mats, and surfacing mats, for example. The fiber base material is preferably in sheet form.

[0087] The prepreg of this embodiment can be manufactured, for example, by impregnating a fibrous substrate with the resin composition of this embodiment, and then heating and drying it to create a B-stage. The temperature and time for heating and drying can be, for example, 50 to 200°C and 1 to 30 minutes, from the viewpoint of productivity and appropriately B-staging the resin composition of this embodiment.

[0088] The content of the resin composition in the prepreg of this embodiment is preferably 20 to 90% by mass, more preferably 25 to 80% by mass, and even more preferably 30 to 75% by mass, from the viewpoint of easily obtaining good moldability when it is made into a laminate.

[0089] The thickness of the prepreg in this embodiment is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably 0.05 to 0.2 mm, from the viewpoint of moldability and enabling high-density wiring.

[0090] [Resin film] The resin film of this embodiment is a resin film containing the resin composition of this embodiment or a semi-cured product of the resin composition. The resin film of this embodiment can be manufactured, for example, by applying the resin composition of this embodiment, which contains an organic solvent, to a support, and then heating and drying it. Examples of support materials include plastic film, metal foil, and release paper. The temperature and time for heating and drying can be set to 50-200°C and 1-30 minutes, from the viewpoint of productivity and appropriately B-staging the resin composition of this embodiment. The resin film of this embodiment is preferably used to form an insulating layer when manufacturing a printed circuit board.

[0091] [Laminated board] The laminate of this embodiment is a laminate having a cured product of the resin composition of this embodiment and a metal foil. Laminates containing metal foil are sometimes referred to as metal-clad laminates.

[0092] Examples of metals used in metal foils include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metallic elements.

[0093] The laminate of this embodiment can be manufactured, for example, by placing metal foil on one or both sides of the prepreg of this embodiment and then subjecting it to heat and pressure treatment. Typically, this heating and pressurizing process hardens the B-staged prepreg to obtain the laminate of this embodiment. When performing the heat and pressure treatment, one prepreg sheet may be used, or two or more prepreg sheets may be laminated together. For heating and pressurizing, methods such as multi-stage presses, multi-stage vacuum presses, continuous molding machines, and autoclave molding machines can be used. The conditions for the heating and pressurizing treatment can be, for example, a temperature of 100-300°C, a duration of 10-300 minutes, and a pressure of 1.5-5 MPa.

[0094] [Printed wiring board] The printed circuit board of this embodiment is a printed circuit board having a cured product of the resin composition of this embodiment. The printed circuit board of this embodiment can be manufactured by forming conductor circuits on one or more materials selected from the group consisting of, for example, a cured prepreg of this embodiment, a cured resin film of this embodiment, and a laminate of this embodiment, using a known method. Furthermore, a multilayer printed circuit board can be manufactured by performing a multilayer bonding process as needed. Conductor circuits can be formed by, for example, drilling holes, metal plating, etching metal foil, etc. as appropriate.

[0095] [Semiconductor Packages] The semiconductor package according to the first aspect of this embodiment is a semiconductor package having the printed circuit board and semiconductor elements of this embodiment. The semiconductor package according to the first aspect of this embodiment can be manufactured, for example, by mounting semiconductor elements, memory, etc., on the printed circuit board of this embodiment using a known method.

[0096] A semiconductor package according to a second aspect of this embodiment is a semiconductor package comprising a semiconductor element and a cured product of the resin composition of this embodiment that encapsulates the semiconductor element. A semiconductor package according to a second aspect of this embodiment can be manufactured, for example, by covering at least a portion of a semiconductor element mounted on a printed circuit board with the resin composition of this embodiment and curing the resin composition. [Examples]

[0097] The embodiment will be described in detail below with reference to examples. However, this embodiment is not limited to the following examples.

[0098] In each example, the number-average molecular weight (Mn) and weight-average molecular weight (Mw) were measured using the following procedure. The number-average molecular weight (Mn) and weight-average molecular weight (Mw) were calculated from a calibration curve using standard polystyrene by gel permeation chromatography (GPC). The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Type; A-2500, A-5000, F-20, F-80) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. Equipment: High-speed GPC equipment HLC-8320GPC Detector: UV-8320 ultraviolet absorption detector [manufactured by Tosoh Corporation] Columns: Guard column; TSKgel guardcolumn Super(HZ)-M+; Column; TSKgel SuperMultipore HZ-M (2 pieces); Reference column; TSKgel SuperH-RC (2 pieces) (All manufactured by Tosoh Corporation, product names) Column sizes: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column) • Eluent: Tetrahydrofuran • Sample concentration: 10 mg / 1 mL • Injection volume: 20 μL or 2 μL ·Flow rate: 0.35mL / min ·Measurement temperature: 40℃

[0099] [Production of aromatic compounds containing vinyl groups] Manufacturing Example 1 In a reaction vessel equipped with a stirrer, thermometer, reflux tubing, and nitrogen inlet, 236.8 parts by mass of 2-bromoethylbenzene (manufactured by Tokyo Chemical Industry Co., Ltd.) and 56.0 parts by mass of α,α'dichloro-p-xylene (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) were added and stirred. 14.7 parts by mass of methanesulfonic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), which had been melted by standing at 25°C, was added dropwise to the reaction vessel using a pipette. The reaction vessel was immersed in an oil bath and reacted at 130°C for 7 hours while stirring the contents of the vessel. After removing it from the oil bath and allowing it to cool naturally, 106.4 parts by mass of 48% NaOH aqueous solution was added dropwise to neutralize it. 960 parts by mass of toluene was added and stirred to extract the toluene-soluble components. The resulting organic layer was removed and washed five times with water. The organic layer after washing was heated under reduced pressure to remove toluene and unreacted substances by distillation, yielding 112 parts by mass (yield 65%) of an intermediate having a 2-bromoethylbenzene structure.

[0100] In a reaction vessel equipped with a stirrer, thermometer, reflux tubing, and nitrogen inlet, 110 parts by mass of the intermediate obtained earlier, 250 parts by mass of toluene, 750 parts by mass of dimethyl sulfoxide (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) melted by standing at 25°C, 75 parts by mass of water, and 25 parts by mass of solid sodium hydroxide (manufactured by Kanto Chemical Co., Ltd.) were added. The reaction vessel was immersed in an oil bath and reacted at 40°C for 5 hours while stirring the contents of the vessel. After removing it from the oil bath and allowing it to cool naturally, 500 parts by mass of toluene was added and stirred to extract the toluene-soluble components. The obtained organic layer was removed and washed five times with 500 parts by mass of water. The washed organic layer was heated under reduced pressure to remove the solvent and 65 parts by mass (yield 75%) of the compound represented by the above general formula (A1-1) were obtained. The number-average molecular weight (Mn) of the obtained compounds was 443, the weight-average molecular weight (Mw) was 451, and the value of m in the above general formula (A1-1) was between 1 and 2.

[0101] [Production of compounds containing vinylbenzyl groups] Manufacturing Example 2 In a 500 mL reaction vessel equipped with a stirrer, thermometer, reflux tubing, and nitrogen inlet, the amounts shown in Table 1 were charged with indene, chloromethylstyrene (AGC Seimi Chemical Co., Ltd. "CMS-P", a mixture of m-isomer and p-isomer, m-isomer content approximately 50% by mass, p-isomer content approximately 50% by mass), α-chloro-p-xylene, tetra-n-butylammonium bromide as a phase transfer catalyst, phenothiazine as a polymerization inhibitor, and toluene as a solvent. The mixture was heated and stirred at 40°C while blowing nitrogen at a flow rate of 50 mL / min. Next, the amount of sodium hydroxide aqueous solution (48% by mass) listed in Table 1 was added dropwise over 20 minutes, and the mixture was stirred at 60°C for 9 hours. Nitrogen was continuously blown in during the reaction. After cooling to room temperature (25°C) and neutralizing with 10% hydrochloric acid aqueous solution, the mixture was washed twice with pure water. After removing toluene under reduced pressure, the resulting viscous liquid was washed with methanol and vacuum dried to obtain composition (1) containing a compound having a vinylbenzyl group.

[0102] GPC measurements were performed on composition (1) under the following conditions, and the area ratios of the peaks corresponding to the monosubstituted (one vinylbenzyl group or tolylmethyl group substituted on indene), disubstituted (a total of two vinylbenzyl and tolylmethyl groups substituted on indene), and trisubstituted (a total of three vinylbenzyl and tolylmethyl groups substituted on indene) were calculated. The values ​​are shown in Table 1.

[0103] Equipment: High-speed GPC system HLC-8320GPC (Tosoh Corporation, product name) Detector: UV-8320 ultraviolet absorption detector (Tosoh Corporation, product name) Columns: Guard column; TSKgel guardcolumn Super(HZ)-M+, Column; TSKgel SuperMultipore HZ-M (2 pieces), Reference column; TSKgel SuperH-RC (2 pieces) (All products are from Tosoh Corporation) Column sizes: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column) Eluent: Tetrahydrofuran Sample concentration: 10 mg / 1 mL Injection volume: 20 μL or 2 μL Flow rate: 0.35mL / min Measurement temperature: 40℃

[0104] [Table 1]

[0105] [Manufacturing of resin compositions] Examples 1-4 and Comparative Examples 1-7 The resin composition was prepared by blending each component in the proportions shown in Table 2 and adjusting the solid content concentration to 60% by mass with toluene. For components that are solutions, the amounts shown in Table 2 are calculated on a solid content basis.

[0106] [Prepreg preparation] The resin compositions prepared in each example were impregnated and coated onto glass cloth conforming to IPC standard #1078, and then heated and dried at 120-123°C for 10 minutes to obtain prepregs. The resin composition content in the prepregs was 67% by mass.

[0107] [Fabrication of double-sided copper-clad laminated boards] Two layers of the prepreg prepared as described above were stacked together. On both sides of these layers, 18 μm thick electrolytic copper foil ("SI-VSP-18" manufactured by Mitsui Mining & Smelting Co., Ltd.) was placed with the matte side facing the prepreg. This was then subjected to a load of 3 kg / cm². 2 A double-sided copper-clad laminate was obtained by heating and pressurizing at 230°C for 80 minutes under vacuum pressing conditions.

[0108] [Evaluation methods and measurement methods] The double-sided copper-clad laminates prepared in each example were used for the measurements and evaluations described below. The results are shown in Table 2.

[0109] (Method for measuring relative permittivity (Dk) and dielectric loss tangent (Df)) A 100mm x 40mm test specimen was prepared by removing the copper foil from both sides of a double-sided copper-clad laminate (with two layers of prepreg) by immersion in a copper etching solution. The obtained test specimen was dried at 105°C for 1 hour, and then left to stand for 24 hours in an ambient temperature of 24.2°C and humidity of 54%RH. Subsequently, the relative permittivity (Dk) and dielectric loss tangent (Df) were measured at 10GHz in the ambient temperature of 25°C according to the split-post dielectric resonator method. The measurement instrument used was the "PNA Network Analyzer N5222B" manufactured by agilent technologies.

[0110] (Method for measuring copper foil peel strength) Test specimens were prepared by etching the copper foil from the double-sided copper-clad laminates fabricated in each example into 3mm wide straight lines. The formed straight lines of copper foil were mounted on a small benchtop testing machine (manufactured by Shimadzu Corporation, product name "EZ-TEST"), and the copper foil peel strength was measured by peeling it off at a 90° angle at room temperature (25°C). The pulling speed when peeling the copper foil was set to 50mm / min.

[0111] [Table 2] (In the table, "-" indicates that measurement was not taken.)

[0112] The details of each material in Table 1 are as follows: [(A) component] • Polymerizable compound 1: An aromatic compound having a vinyl group obtained in Production Example 1, corresponding to component (A1). • Polymerizable compound 2: A compound having a vinylbenzyl group obtained in Production Example 2, corresponding to component (A2). • Polymerizable compound 3: An aromatic polyether compound having radical polymerizable groups at both ends, corresponding to component (A3). • Polymerizable compound 4: Polyphenylene ether resin having methacryloyl groups at both ends, "SA9000" manufactured by SABIC, number average molecular weight (Mn) 1,700, corresponding to component (A3).

[0113] [(B) Component] • Polymer-type silane coupling agent containing acid anhydride groups: Manufactured by Shin-Etsu Chemical Co., Ltd., product name "X-12-1287A", a silane coupling agent containing a polybutadiene chain with acid anhydride groups and a trimethoxysilyl group, number average molecular weight (Mn) 6,500, acid anhydride equivalent: 1,500 g / mol

[0114] [Ingredients for comparison] • Nonpolymer-type silane coupling agent having an allyl isocyanurate structure: Manufactured by Shin-Etsu Chemical Co., Ltd., product name "X-12-1290" • Nonpolymer-type silane coupling agent containing a styryl group: Manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-1403", p-styryltrimethoxysilane • Non-polar polymer-type silane coupling agent: Manufactured by Shin-Etsu Chemical Co., Ltd., trade name "X-12-1281C", a silane coupling agent having a polybutadiene chain and a trimethoxysilyl group. • Nonpolymer-type silane coupling agent containing a methacrylic group: Manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-503", 3-methacryloxypropyltrimethoxysilane • Nonpolymer-type silane coupling agent containing a vinyl group: Manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-1003", vinyltrimethoxysilane • Nonpolymer-type silane coupling agent having a diaminotriazine structure: Manufactured by Shikoku Chemicals Co., Ltd., product name "VD-5"

[0115] [(C) component] • Inorganic filler 1: Spherical fused silica, average particle size: 0.5 μm

[0116] [(D) component] • Polymerization initiator 1: α,α'-di(t-butylperoxy)diisopropylbenzene

[0117] [(E) component] Flame retardant 1: 4,4'-biphenylene-bis(di-2,6-dimethylphenyl phosphate)

[0118] The results shown in Table 2 indicate that the resin compositions of Examples 1 to 4 of this embodiment exhibit excellent copper foil peel strength while maintaining good dielectric properties.

Claims

1. (A) A compound having a functional group containing an ethylenically unsaturated bond, (B) A silane coupling agent having a polymer chain containing a polar group, A resin composition containing [the specified ingredient].

2. The resin composition according to claim 1, wherein the polymer chain containing the polar group of component (B) is a polymer chain containing an acid anhydride group.

3. The resin composition according to claim 1 or 2, wherein the polymer chain containing the polar group of component (B) is a polybutadiene chain containing the polar group.

4. The resin composition according to claim 1 or 2, wherein the functional group containing an ethylenically unsaturated bond in component (A) is one or more selected from the group consisting of vinyl groups and (meth)acryloyl groups.

5. The resin composition according to claim 1 or 2, wherein the content of component (A) is 50 to 100% by mass with respect to the total amount (100% by mass) of resin components in the resin composition.

6. The resin composition according to claim 1 or 2, wherein the content of component (B) is 0.1 to 20.0 parts by mass with respect to 100 parts by mass of the total amount of resin components in the resin composition.

7. Furthermore, the resin composition according to claim 1 or 2, further comprising (C) an inorganic filler.

8. A prepreg containing the resin composition described in claim 1 or 2, or a semi-cured product of the resin composition.

9. A laminate having a cured product of the resin composition according to claim 1 or 2 and a metal foil.

10. A resin film containing the resin composition described in claim 1 or 2, or a semi-cured product of the resin composition.

11. A printed circuit board having a cured product of the resin composition according to claim 1 or 2.

12. A semiconductor package having a printed circuit board according to claim 11 and a semiconductor element.

13. A semiconductor package comprising a semiconductor element and a cured product of the resin composition according to claim 1 or 2 for sealing the semiconductor element.

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