Panel including packaging substrate

The panel with a glass core and reinforcing structures addresses the issue of warping and breakage in large-area substrates by providing a robust framework for semiconductor components, enhancing processing reliability and efficiency.

JP2026109531APending Publication Date: 2026-07-01ABSOLICS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ABSOLICS INC
Filing Date
2025-09-02
Publication Date
2026-07-01

AI Technical Summary

Technical Problem

Existing semiconductor packaging technologies do not adequately support large-area substrates, leading to glass warping and breakage during processing, which can affect the electrical performance of semiconductor components.

Method used

A panel comprising a glass core with an upper layer and interconnection layer, featuring individual units with separate reinforcing structures that cover die layouts and allow for semiconductor element placement through openings, using materials like aluminum, copper, or ceramic to suppress warping and cracking.

Benefits of technology

The panel effectively reduces glass warping and cracking during processing, enabling reliable handling of large-area substrates and facilitating efficient semiconductor element placement and subsequent singulation.

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Abstract

The present invention provides a panel including individual packaging substrates with improved reliability due to the arrangement of reinforcing parts advantageous for processing large-area substrates, and a panel having a reinforcing structure that suppresses glass breakage and reduces warping during processing of large-area substrates. [Solution] A panel comprising a glass core 100 with a width or height of 10 cm or more and an upper layer 200 disposed thereon, wherein a unit 20 is a portion in which semiconductor elements are separated into individual packaging substrates within a die layout, and a large number of these units are arranged on the panel, and a reinforcing structure 50 is disposed on the upper layer and covers at least a portion of the die layout. A first unit 20a includes a first die layout and a first reinforcing structure 50a disposed in the first die layout, and a second unit 20b includes a second die layout and a second reinforcing structure 50b disposed in the second die layout, and is arranged side by side on one side of the first unit, with the first and second reinforcing structures being disposed separately from each other.
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