Coil components
By designing a coil component with a support member having surface roughness greater than the coil's side surface roughness, the adhesion issue is resolved, enabling miniaturization and maintaining structural integrity through enhanced bonding.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-10-15
- Publication Date
- 2026-07-02
AI Technical Summary
Miniaturization of coil patterns in inductors leads to a decrease in adhesion force between the coil and the substrate, potentially causing the coil to float, which is a challenge in achieving both miniaturization and maintaining structural integrity.
The coil component features a support member with surface roughness greater than the coil's side surface roughness, ensuring adhesion by forming a maximum height roughness of 1 μm to 7.5 μm on the support member and 10 nm to 100 nm on the coil's side surface, utilizing plasma treatment to enhance bonding.
This configuration ensures stable adhesion between the coil and the support member, preventing floating defects while allowing for miniaturization without compromising component characteristics.
Smart Images

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