Multilayer electronic components
JP2026110499APending Publication Date: 2026-07-02SAMSUNG ELECTRO MECHANICS CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-10-28
- Publication Date
- 2026-07-02
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Figure 2026110499000001_ABST
Abstract
To provide a multilayer electronic component that offers excellent reliability and capacity per unit volume, while suppressing crack initiation and propagation. [Solution] A stacked electronic component according to one embodiment of the present invention includes a body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and an external electrode disposed on the body, wherein the internal electrode includes a plurality of electrode portions and a plurality of cut portions, and conductive glass can be disposed in one or more of the plurality of cut portions.
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