Multilayer electronic components

JP2026110499APending Publication Date: 2026-07-02SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Application Number
JP2025181933
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-20
Filing Date
2025-10-28
Publication Date
2026-07-02

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Abstract

To provide a multilayer electronic component that offers excellent reliability and capacity per unit volume, while suppressing crack initiation and propagation. [Solution] A stacked electronic component according to one embodiment of the present invention includes a body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and an external electrode disposed on the body, wherein the internal electrode includes a plurality of electrode portions and a plurality of cut portions, and conductive glass can be disposed in one or more of the plurality of cut portions.
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Citation Information

Patent Citations

  • Multilayered electronic component

    KR1020190116144A